default search action

combined dblp search
author search
venue search
publication search

ask others

"Fine-grain thermal profiling and sensor insertion for FPGAs."

Somsubhra Mondal, Rajarshi Mukherjee, Seda Ogrenci Memik (2006)

> Home

Details and statistics

DOI: 10.1109/ISCAS.2006.1693601

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/iscas/MondalMM06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iscas/MondalMM06
Somsubhra Mondal, Rajarshi Mukherjee, Seda Ogrenci Memik:
Fine-grain thermal profiling and sensor insertion for FPGAs. ISCAS 2006

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.

Note: This service is not intended for secure transactions such as banking, social media, email, or purchasing. Use at your own risk. We assume no liability whatsoever for broken pages.

Pfad - The Proxy pFad of © 2024 Garber Painting. All rights reserved.