


default search action
"Report on power, thermal and reliability prediction for 3D Networks-on-Chip."
Khanh N. Dang et al. (2020)
- Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
Report on power, thermal and reliability prediction for 3D Networks-on-Chip. CoRR abs/2003.08648 (2020)

manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.