"Report on power, thermal and reliability prediction for 3D Networks-on-Chip."

Khanh N. Dang et al. (2020)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2020-03-24

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  - electronic edition @ arxiv.org (open access)
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  dblp key:
  - journals/corr/abs-2003-08648
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  - https://dblp.org/rec/journals/corr/abs-2003-08648
Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
Report on power, thermal and reliability prediction for 3D Networks-on-Chip. CoRR abs/2003.08648 (2020)

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