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"Reliability challenges for barrier/liner system in high aspect ratio ..."

Yunlong Li et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.077

access: closed

type: Journal Article

metadata version: 2021-10-14

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  - https://dblp.org/rec/journals/mr/LiHBSWSBBWC14
Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes:
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. Microelectron. Reliab. 54(9-10): 1949-1952 (2014)

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