Overview
- Includes supplementary material: sn.pub/extras
Part of the book series: IFIP Advances in Information and Communication Technology (IFIPAICT, volume 483)
Included in the following conference series:
Conference proceedings info: VLSI-SoC 2015.
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About this book
This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
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Keywords
Table of contents (10 papers)
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Front Matter
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Back Matter
Other volumes
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VLSI-SoC: Design for Reliability, Security, and Low Power
Editors and Affiliations
Bibliographic Information
Book Title: VLSI-SoC: Design for Reliability, Security, and Low Power
Book Subtitle: 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers
Editors: Youngsoo Shin, Chi Ying Tsui, Jae-Joon Kim, Kiyoung Choi, Ricardo Reis
Series Title: IFIP Advances in Information and Communication Technology
DOI: https://doi.org/10.1007/978-3-319-46097-0
Publisher: Springer Cham
eBook Packages: Computer Science, Computer Science (R0)
Copyright Information: IFIP International Federation for Information Processing 2016
Hardcover ISBN: 978-3-319-46096-3Published: 13 September 2016
Softcover ISBN: 978-3-319-83440-5Published: 22 April 2018
eBook ISBN: 978-3-319-46097-0Published: 12 September 2016
Series ISSN: 1868-4238
Series E-ISSN: 1868-422X
Edition Number: 1
Number of Pages: XIII, 223
Number of Illustrations: 121 b/w illustrations
Topics: Computer Systems Organization and Communication Networks, Computer Hardware, Computer-Aided Engineering (CAD, CAE) and Design, Circuits and Systems