1.

How do you control and monitor the developer activity is

Ans; replishent
2. Which will give good definition? If the unhappiness is
A. 0.5 B.0.25 C. 0.75 D. 1.0
3. Intensity of the X ray is mainly depend on
Ans; tube current
4. Unlikely defect occurs in SAW weld
1. Slag inclusion 2. Tungsten inclusion. 3. Lack of penetration
5. Likely defect in Tig welding
Lack of penetration, tungsten inclusion
6. Gas entrapment defect?
Ans; porosity
7. KVselection finally depend on what factor
1. Film type 2.film type &FFd Distance increase 3. Material thickness
8. Image formation of the radiographic film (after development)
1. Silver bromide 2. Metallic silver 3. Black silver
9. Intensifying screen action main purpose
1. To absorb long wave length and absorb back scatter
2. To absorb short wave length and back scatter
10. Radiographic film characteristic curve refers to
A. Contrast and density B.Film and density c. exposure and density
11. Reduction in developer strength cause main
A. expose to air B.No of film developing C. both A and B D. none of the Air
12. Instead of X ray same strength source used for exposure affect which factor mainly
A.density B.contrast C. definition D. SFD
13.If source is higher to compensate this what action required?
A.Increase exposure time B. Increase SFD C. Increase film to object distance
14. A fine irregular high density on weld cap across the weld
A.Hair placed b/w film & sheen B. Transverse crack
15. Artificates on film emulsion can be identified verify easily
A. high intensity viewer
Ans; Reflected light placing film at an angle
16.Lead screens were used for
Ans; to reduce the back scatter

18.A typical indication connected with Tig weld

Ans;tunges inclusion
20.Crater pipe due to
Ans; Sudden take off heat at weld finish
21. All film base shall have most common property
Ans; transparency
22. The chemical compound on un developing film grain
Ans; Ag Br
23.The range of thickness of specimen can be Viwed more easily on radiograph due
Ans; Cathode
24. the developed shall be free of
A. finger mark B.pressure mark C.static mark D. All of the above
25. The penetrability of x ray beam controlled by
Ans; Kilo voltage
26.The geometry of an image is connected with
Ans; Unsharpness
27.Maximum unsharpness permissible
Ans;0.50
28. The slow film has good definitions constant due to
Ans; finer grains
29.The grain at the film forms visual impression called
Ans; graininess
30.Gas entrapment in welding caused
a. porosity b. Undercut
31.Folding of the film before processing will give
a. Light folding mark B.Dark folding mark C.Grey fold mark
32. penetrating ability of x ray depends on
A. milli ampere B.curie C. Killo voltage applied
35.Compare to x ray x ray has
1. low contrast 2. high contrast 3. low definition 4. high sensitivity
36.Large source size compensated by
1. SFD B. source strength
37.Characeristic curve
ans; Density Vs exposure time

38.T x ray machine mille amp X Time =?

1. density 2. Intensity 3.Exposure
40.Developer strength solution reduced by due to
1. number of film processed 2.contact with atmospheric air 3. contamination
4. all of the above
41.before development film should not involve
1. pressure on it
2.expose to chemicals
3.from dust
4. all of the above.
42.why film to object distance closer, what factor will affect?
a. unsharpness
b. contrast
c. density
43. light crescent mark found in the film due to
a. pressure mark after exposure
b. nail mark before exposure
c. nail mark after developer
44.RT film will get affected by
a. safe light
b. chemical vapour
c. x or gamma rays
d. all of the above
45. slow speed film density range varies between
a. 1.82.5
b.2.2--- 3.2
c.2.8---3.5
d.1.0---1.8
46. x- ray tube filter for the function of
a. heat dissipate
b. to absorb short wave length or primary radiation
c. absorbing secondary radiation
53.purpose filter in x ray machine
a. filter long wave length( lower energy)
54. X RAY HAS BETTER THAN GAMMA RAY
ans. better definition
55. to comp step the large source size
a. increase the distance between source object
b. increase the object to film
c.degrese the sfd
d. increase the sfd

56.What chemical in radiograph?

a. Black solver
57. gap mark how if look after developing
ans . white mark
58. contrast and definition will affect which of the following
a. density b. sensitivity
59. lead foil screens were used with film for intensification due to following property
a. emit electrons with film side
60.wire penetrameter will be placed on the radiograph
ans; across the weld on the source side
61.IQI sensitivity is to check
a. a small defect can be deducted
b. IQI=eliminating the specimen x100
wire
c.
d. all the above.
ans; to access the radiographic technic
67.RT density range---------------------22.5
68. film image will produce due to ----silver boromide
70.when compared is X ray , gamma will produce------High contrast
SENSITIVITY CALCULATION
sensitivity=thickness of the thinnest visible wire X100
thickness of the specimen
sws, panoramic ,( dwsi( 3 on wards) -------one wall thickness onlyfor calculation
purpose
dwdi-(superimpose less than 2 )------two wall thicknessfor calculation purpose
dwdi ( ellipse less than 2 )----------two wall thickness---For calculation purpose
RT sensitometry
Rt strip calculation difference to write
followed 5 question
to calculate sensitivity
to calculate thickness of wire(penetrameter, etc.)
tabular column available for standard
densitometer meter strip reading

for example; 1 to 14 steps each step 0 .3density difference

0.3, 0.6,0.9, 1.2, 1.5, 1.8, 2.1, 2.4, 2.7,3.0, 3.3, 3.6,3.9, 4.2, 4.5
for example
actual strip density value
0.9
1.5
2.7
3.3
3.9
(it is printed on
strip)
actual density measurement 0.905 1.495 2.704 3.303
3. 904 with densitometer
difference
+0.005 -0.005 +0.004 + 0.003 +0.004
Interpretation six film
measure the defect in the film and scale the same in the answer sheet
for six film we have 6 main pages
consist of the welding process plate/ pipe thick , sensitivity, density
missing points we have to write
WELD SYMBOLS
12 symbols joints(n structural)
sketch and explain----type of joint
---------------------------which standard(BSEN, BS or AWS)
weld leg length etc.
Scrutinizing repot
Rt/mt/ut/pt
Practical fracture Analysis
@ specimen only
Explain what kind of fracture and sketches
RT reference
1. off set/ mismatch-------50 percent weld more density , 50 percent less dense
2. lack of penetration----centre of weld straight line noted
3. external cavity--- look like dark area at weld location
( insufficient fill top side)
4. excess penetration-----more bright
5. external undercut--6. internal under cut (root)--7. internal concavity (Suck back)---8. burn through
9. incomplete lack of penetration--10. slag inclusion
11. elongated slag ( wagon drog)
12. lack of side wall fusion
13. inter pass cold lap
14. scattered porosity
15. clustered porosity
16. root pass aligned porosity( hollow bead)

17. transverse crack

18. longitudinal crack
19. tungsten inclusion
ARTIFICTS
1. STRAY FRAGMENT----light area theory multi front of cassette)
2. Mottle; -------------------- long storage/ fumes / heat/ dampness
3. Light fog-(one side)------------------------excess exposure of safe light
4. fog near edge--------------cassette not closed
5. light crescent----------crimping buckling/pressure before exposure
6. dark crescent-------crimping buckling/pressure after exposure
7. small spot less density-----dust on surface screen
8. light streaks---------poor handling + screen
9. dark spot(one side)---developer splashes
10. light spot(one side)-------------fixer splashes
11. flow mark----------lack of agitation
12. reticulation----temp difference
13. red in colour ------contamination of developer
14. drying mark-------drops of water run down on film
15. buckled------------sticking together
16. Frilling or loosening-(emulsion)-- warm water and contaminating fixer
17. scratches-------------------poor handling
18. static mark----------------(black tree) poor handling

RT film sensitometry
Situation question
1. signing off product ( compulsory)
2. 2.vessel crack, how we will make sure, what type of crack & repair attend
3. sudden loud noise notice load with propan liquid
4. faked radiography /how you will make sure i.e. faked and act
5. explain briefly
A. fatigue crack B. brittle crack C. ductile Crack explain and sketch
6.Explain terms A. major defect B. Minor defect C. Critical defect D. inspection
specification E . certificate of conformance
7.Electrode classification etc. , BS std -3 nos