Tda 8944
Tda 8944
Product specification
1. General description
The TDA8944J is a dual-channel audio power amplifier with an output power of
2 7 W at an 8 load and a 12 V supply. The circuit contains two Bridge Tied Load
(BTL) amplifiers with an all-NPN output stage and standby/mute logic. The TDA8944J
comes in a 17-pin DIL-bent-SIL (DBS) power package. The TDA8944J is
printed-circuit board (PCB) compatible with all other types in the TDA894x family.
One PCB footprint accommodates both the mono and the stereo products.
2. Features
c
c
3. Applications
Mains fed applications (e.g. TV sound)
PC audio
Portable audio.
Symbol Parameter
VCC
supply voltage
Iq
Istb
Conditions
VCC = 12 V; RL =
Min
Typ
Max
Unit
12
18
24
36
mA
10
TDA8944J
Philips Semiconductors
Table 1:
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Po
output power
THD = 10%; RL = 8 ;
VCC = 12 V
THD
Po = 1 W
0.03
0.1
Gv
voltage gain
31
32
33
dB
SVRR
50
65
dB
5. Ordering information
Table 2:
Ordering information
Type number
Package
Name
Description
Version
TDA8944J
DBS17P
SOT243-1
6. Block diagram
idth
VCC1
VCC2
16
1
IN1
IN1+
OUT1
8
6
4
OUT1+
TDA8944J
14
IN2
IN2+
OUT2
9
12
17
OUT2+
VCC
MODE
SVR
10
STANDBY/
MUTE LOGIC
20
k
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
11
20
k
2
15
MBK933
GND1
GND2
Product specification
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TDA8944J
Philips Semiconductors
7. Pinning information
7.1 Pinning
handbook, halfpage
OUT1 1
GND1 2
VCC1 3
OUT1+ 4
n.c. 5
IN1+ 6
n.c. 7
IN1 8
IN2 9
TDA8944J
MODE 10
SVR 11
IN2+ 12
n.c. 13
OUT2 14
GND2 15
VCC2 16
OUT2+ 17
MBK936
Pin description
Symbol
Pin
Description
OUT1
GND1
ground channel 1
VCC1
OUT1+
n.c.
not connected
IN1+
positive input 1
n.c.
not connected
IN1
negative input 1
IN2
negative input 2
MODE
10
SVR
11
IN2+
12
positive input 2
Philips Electronics N.V. 2000. All rights reserved.
Product specification
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TDA8944J
Philips Semiconductors
Table 3:
Pin descriptioncontinued
Symbol
Pin
Description
n.c.
13
not connected
OUT2
14
GND2
15
ground channel 2
VCC2
16
OUT2+
17
8. Functional description
The TDA8944J is a stereo BTL audio power amplifier capable of delivering 2 7 W
output power to an 8 load at THD = 10%, using a 12 V power supply and an
external heatsink. The voltage gain is fixed at 32 dB.
With the three-level MODE input the device can be switched from standby to mute
and to operating mode.
The TDA8944J outputs are protected by an internal thermal shutdown protection
mechanism and a short-circuit protection.
(1)
(2)
As shown in Equation 1 and 2, large capacitor values for the inputs are not
necessary; so the switch-on delay during charging of the input capacitors, can be
minimized. This results in a good low frequency response and good switch-on
behaviour.
Remark: To prevent HF oscillations do not leave the inputs open, connect a capacitor
of at least 1.5 nF across the input pins close to the device.
Product specification
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TDA8944J
Philips Semiconductors
8.2.1
8.2.2
Headroom
Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom
compared to the average power output for transferring the loudest parts without
distortion. At VCC = 12 V, RL = 8 and Po = 4 W at THD = 0.1% (see Figure 6), the
Average Listening Level (ALL) music power without any distortion yields:
Po(ALL) = 4 W/15.85 = 252 mW.
The power dissipation can be derived from Figure 11 on page 10 for 0 dB
respectively 12 dB headroom.
Table 4:
Headroom
0 dB
Po = 4 W
8W
12 dB
Po(ALL) = 252 mW
4W
For the average listening level a power dissipation of 4 W can be used for a heatsink
calculation.
Product specification
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TDA8944J
Philips Semiconductors
Mute In this mode the amplifier is DC-biased but not operational (no audio output);
the DC level of the input and output pins remain on half the supply voltage. This
allows the input coupling and Supply Voltage Ripple Rejection (SVRR) capacitors to
be charged to avoid pop-noise. The device is in mute mode when
3 V < VMODE < (VCC 1.5 V).
Operating In this mode the amplifier is operating normally. The operating mode is
activated at VMODE < 0.5 V.
8.3.1
Short-circuit protection
Short-circuit to ground or supply line This is detected by a so-called missing
current detection circuit which measures the current in the positive supply line and
the current in the ground line. A difference between both currents larger than 0.4 A,
switches the power stage to standby mode (high impedance).
Short-circuit across the load This is detected by an absolute-current
measurement. An absolute-current larger than 2 A, switches the power stage to
standby mode (high impedance).
8.5.2
Product specification
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TDA8944J
Philips Semiconductors
9. Limiting values
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
no signal
0.3
+25
operating
0.3
+18
VI
input voltage
0.3
VCC + 0.3
IORM
Tstg
storage temperature
55
+150
Tamb
40
+85
Ptot
18
VCC(sc)
15
non-operating
Thermal characteristics
Symbol
Parameter
Conditions
Value
Unit
Rth(j-a)
in free air
40
K/W
Rth(j-mb)
6.9
K/W
Parameter
Conditions
VCC
supply voltage
operating
Iq
RL =
Istb
VMODE = VCC
VO
DC output voltage
VOUT
[3]
VMODE
IMODE
[1]
[2]
[3]
[2]
[1]
operating mode
Min
Typ
Max
Unit
12
18
24
36
mA
10
200
mV
0.5
mute mode
VCC 1.5
standby mode
VCC 0.5
VCC
20
With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential
output voltage offset (VOUT) divided by the load resistance (RL).
The DC output voltage with respect to ground is approximately 0.5VCC.
VOUT = VOUT+ VOUT
Product specification
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TDA8944J
Philips Semiconductors
MGL954
50
Iq
(mA)
(mA)
40
40
30
30
20
20
10
10
0
0
MGL955
50
Iq
handbook, halfpage
handbook, halfpage
VCC = 12 V
12
0
0
20
16
VCC (V)
12
20
16
VMODE (V)
Parameter
Conditions
Min
Typ
Max
Unit
Po
output power
THD = 10%
THD = 0.5%
Po = 1 W
0.03
0.1
THD
Gv
voltage gain
31
32
33
dB
Zi(dif)
70
90
110
Vn(o)
[1]
90
120
fripple = 1 kHz
[2]
50
65
dB
fripple = 100 Hz
to 20 kHz
[2]
60
dB
[3]
50
50
75
dB
SVRR
Vo(mute)
output voltage
mute mode
cs
channel separation
Rs = 0
[1]
[2]
[3]
The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance
Rs = 0 at the input.
Supply voltage ripple rejection is measured at the output, with a source impedance Rs = 0 at the input. The ripple voltage is a sine
wave with a frequency fripple and an amplitude of 707 mV (RMS), which is applied to the positive supply rail.
Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.
Product specification
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TDA8944J
Philips Semiconductors
MGL957
10
Vo
(V)
101
102
103
104
VCC = 12 V
105
12
16
20
VMODE (V)
102
handbook, halfpage
MGL953
10
handbook, halfpage
THD
(%)
THD
(%)
10
VCC = 12 V
1
Po = 0.1 W
1
1W
101
101
102
102
101
10
Po (W)
102
102
10
102
103
104
f (Hz)
105
Product specification
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TDA8944J
Philips Semiconductors
MGL959
20
handbook, halfpage
MGL960
20
handbook, halfpage
Po
(W)
16
Ptot
(W)
16
12
12
RL = 8
RL = 8
8
16
16
0
0
12
16
20
VCC (V)
12
16
20
VCC (V)
THD = 10%.
MGL962
100
10
handbook, halfpage
handbook, halfpage
(%)
(W)
8
80
RL = 8
RL = 16
6
60
8
40
20
0
0
10
0
0
16
10
Po (W)
Po (W)
VCC = 12 V.
Product specification
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TDA8944J
Philips Semiconductors
MGL958
handbook, halfpage
cs
(dB)
20
40
60
80
100
10
102
103
104
f (Hz)
105
SVRR
(dB)
20
40
B
CH2
60
CH1
A
80
10
102
103
104
f (Hz)
105
Product specification
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TDA8944J
Philips Semiconductors
Internal circuitry
Pin
Symbol
6 and 8
12 and 9
Equivalent circuit
VCC
VCC
1.5 k
1.5 k
45 k
45 k
VCC
8, 9
6, 12
1/2 VCC
1:1
1 and 4
14 and 17
1:1
(SVR)
MGL946
100
1, 4, 14, 17
40
1/2 VCC
MGL947
10
MODE
VCC
VCC
1 k
10 k
VCC
1 k
10 k
10
MUTE
HIGH
OFF
HIGH
MGL949
11
SVR
VCC
Standby
20 k
11
20 k
MGL948
Product specification
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TDA8944J
Philips Semiconductors
+VCC
100 nF
3
Rs
220 nF
Symmetrical
input
Ci
16
IN1 8
Ri
45 k
1.5
nF
1/2 VCC
220 nF
Ri
45 k
220 nF
Rs
1000 F
1 OUT1
RL
8
1/2 VCC
+
4 OUT1+
IN1+
Asymmetrical
Ci
input
TDA8944J
IN2 9
220 nF
Ri
45 k
signal
GND
1.5
nF
1/2 VCC
VCC
12
Ri
45 k
signal
GND
C2
MODE
C1
C2
Standby
Mute
On
0
0
1
0
1
0
17 OUT2+
VCC
STANDBY/
MUTE LOGIC
20 k
MICROCONTROLLER
RL
8
1/2 VCC
IN2+
C1
R
MODE 10
14 OUT2
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
1/2 VCC
SVR 11
10
F
20 k
2
15
GND
full pagewidth
MGL950
Product specification
13 of 21
TDA8944J
Philips Semiconductors
54 mm
idth
56 mm
OUT2
ON
MUTE
OUT2+ +
10 F
17
220 nF
IN2
IN2+
1.5 nF
220 nF
IN1
IN1+
VCC
1
OUT1
100 nF
1000 F
GND
OUT1+
MGL951
14.1.2
Product specification
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TDA8944J
Philips Semiconductors
Product specification
15 of 21
TDA8944J
Philips Semiconductors
SOT243-1
non-concave
Dh
Eh
A2
B
j
E
A
L3
Q
c
v M
17
e1
bp
e2
w M
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
bp
D (1)
Dh
E (1)
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
2.54
e1
e2
1.27 5.08
Eh
L3
Z (1)
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.4
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-12-16
99-12-17
SOT243-1
Product specification
16 of 21
TDA8944J
Philips Semiconductors
17. Soldering
17.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
Soldering method
Dipping
Wave
suitable
suitable [1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Product specification
17 of 21
TDA8944J
Philips Semiconductors
000214 -
Table 6 on page 7:
Rth(j-a) value added 40 K/W
Rth(j-c) value 10 changed to 6.9 K/W; condition in free air changed to both channels
driven
01
990414 -
Product specification
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TDA8944J
Philips Semiconductors
Product status
Definition [1]
Objective specification
Development
This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
20. Definitions
21. Disclaimers
Life support These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Product specification
19 of 21
TDA8944J
Philips Semiconductors
Internet: http://www.semiconductors.philips.com
(SCA69)
Product specification
20 of 21
TDA8944J
Philips Semiconductors
Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
8.2.2
8.3
8.3.1
8.4
8.5
8.5.1
8.5.2
9
10
11
12
13
14
14.1
14.1.1
14.1.2
14.2
15
15.1
15.2
16
17
17.1
17.2
17.3
17.4
18
19
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Input configuration . . . . . . . . . . . . . . . . . . . . . . 4
Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5
Output power measurement . . . . . . . . . . . . . . . 5
Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5
Switch-on and switch-off. . . . . . . . . . . . . . . . . . 6
Supply Voltage Ripple Rejection (SVRR) . . . . . 6
Built-in protection circuits . . . . . . . . . . . . . . . . . 6
Short-circuit protection . . . . . . . . . . . . . . . . . . . 6
Thermal shutdown protection . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 13
Printed-circuit board (PCB). . . . . . . . . . . . . . . 13
Layout and grounding . . . . . . . . . . . . . . . . . . . 13
Power supply decoupling . . . . . . . . . . . . . . . . 14
Thermal behaviour and heatsink calculation . 15
Test information. . . . . . . . . . . . . . . . . . . . . . . . 15
Quality information . . . . . . . . . . . . . . . . . . . . . 15
Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Soldering by dipping or by solder wave . . . . . 17
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 February 2000