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Application of A Layout/Material Handling Design Method To A Furnace Area in A 300 MM Wafer Fab

The document discusses a layout/material handling design method applied to a furnace area in a 300 mm wafer fab. It proposes a routine and efficient two-step iterative design method to overcome complexity and reduce time for material handling design. The first step is layout design, which aims to minimize material handling by optimally arranging manufacturing activities. The second step is material handling design. The method is applied to a furnace area case study. It aims to improve ergonomics and safety in 300 mm wafer production where material handling has become increasingly important.

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50 views1 page

Application of A Layout/Material Handling Design Method To A Furnace Area in A 300 MM Wafer Fab

The document discusses a layout/material handling design method applied to a furnace area in a 300 mm wafer fab. It proposes a routine and efficient two-step iterative design method to overcome complexity and reduce time for material handling design. The first step is layout design, which aims to minimize material handling by optimally arranging manufacturing activities. The second step is material handling design. The method is applied to a furnace area case study. It aims to improve ergonomics and safety in 300 mm wafer production where material handling has become increasingly important.

Uploaded by

iknithin
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Int J Adv Manuf Technol (2001) 17:216220

2001 Springer-Verlag London Limited

Application of a Layout/Material Handling Design Method to a


Furnace Area in a 300 mm Wafer Fab
P. M. C. Hesen, P. J. J. Renders and J. E. Rooda
Department of Mechanical Engineering, Eindhoven University of Technology, Eindhoven, The Netherlands

For many years, material handling within the semiconductor


industry has become increasingly important. With the introduction of 300 mm wafer production, ergonomics and product
safety become more critical. Therefore, the manufacturers of
semiconductor wafer fabs are considering the automation of
intrabay material handling.
In this paper, a routine and efficient design method consisting of two parallel iterative procedures is proposed to
overcome the complexity and the amount of time required for
material handling design. Since material handling is a nonproductive item supporting the value-adding manufacturing
activities, it should be minimised. This is realised by the
rearrangement of the manufacturing activities, referred to as
layout design. Both the layout and material handling design
methods are applied to a case study concerning the furnace
area of a semiconductor wafer fab.

Minimal material handling implies an optimal arrangement


of the manufacturing activities, referred to as layout design.
Layout design comprises the magnitude and complexity of the
material flow and the distance between the manufacturing
activities.
A methodical design method for both layout design and
material handling design is proposed, based on Hesen [1]. The
design method is applied to a case study concerning the furnace
area of a semiconductor wafer fab. A similar study is performed
by Haagh et al. [2] for the dielectrics decomposition area.
After a short overview of the literature on layout design
and material handling design, the design method of an industrial
system [3] is described in Section 3. The method for layout
design and material handling design are described in Sections
4 and 5, respectively. The application of both design methods
to the furnace area is described in Section 6. Finally, conclusions are drawn in Section 7.

Keywords: Automation; Layout design method; Material handling; Semiconductor

2. Literature
1.

Introduction

The semiconductor industry operates in a fast growing and


cyclic market. To compete in this high technology market, the
throughput of the fab must be sufficiently high with an acceptable cycle time. In the design process, these variables are
determined by an efficient product flow which is realised by
both the layout of the manufacturing system and the material
handling system. Since material handling is a non-productive
component of a production system, it should be minimised.
Material handling supports the value-adding manufacturing
activities in a production system, although an increase in
material handling time increases work-in-process, lead time,
and production costs.

Correspondence and offprint requests to: Mr P. Hesen, Department


of Mechanical Engineering, Eindhoven University of Technology, PO
Box 513, 5600 MB Eindhoven, The Netherlands. E-mail:
p.m.c.hesentue.nl

For manufacturing systems, the three main types of layout are


product layout, process layout, and group layout (which is
further categorised into flow line, cell, and centre) [4,5]. A
distinction between these types of layout is made based on
system characteristics such as production volume and product
variety. Product layout (flow shop) is associated with highvolume production and low product variety; process layout
(job shop) is associated with low-volume production and high
product variety (Fig. 1).
Group layout has a wide field of application from low to
high production volume and from low to high product variety.
Product and process layout comprise the peripheral area of
group layout. Group layout has some of the benefits of product
and process layout; it enables small batch production to obtain
economic advantages similar to flow shop production while
retaining the flexibility of a job shop.
Two main approaches for layout design are described in the
literature: systematic layout planning [6] and group technology
[7]. A combination of these two approaches is used to design
the overall layout of the manufacturing system. The global
layout is designed by group technology considering the hier-

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