Intel® Solid State Drive 540s Series (M.

2)
Product Specification
Capacities: 120, 180, 240, 360, 480, 1000 GB Temperature

Form Factors:  Operating4: 0° C to 70° C

 80mm (single-sided) 2280-S3-B-M  Non-Operating: -55° C to 95° C
(120, 180, 240, 360, 480 GB) Reliability
 80mm (double-sided) 2280-D3-B-M (1000 GB)  Uncorrectable Bit Error Rate (UBER):
Thickness: S3 – up to 2.38 mm; D3 – up to 3.73mm <1 sector per 1016 bits read
Weight: <7 grams  Mean Time Between Failure (MTBF):
1,2
1.6 million hours
SATA 6Gb/s Bandwidth Performance  Shock (non-operating):
(IOMeter* Queue Depth 32) 1,000 G/0.5 ms
 Sequential Read: up to 560MB/s Vibration
 Sequential Write: up to 480MB/s  Operating: 2.17 GRMS (5-700Hz)
1,2
Read and Write IOPS  Non-operating: 3.13 GRMS (5-800Hz)
(IOMeter Queue Depth 32) Certifications and Declarations:
 Random 4KB Reads: up to 78,000 IOPS  UL*
 Random 4KB Writes: up to 85,000 IOPS  CE*
Additional Compatibility  RCM*
 Intel® SSD Toolbox with Intel® SSD Optimizer  BSMI*
 Intel® Data Migration Software  KCC*
 Intel® Rapid Storage Technology  Microsoft* WHCK/WHLK
 SATA Revision 3.2  VCCI*
 ACS-3 (ATA/ATAPI Command Set 3)  SATA-IO*
 SSD Enhanced SMART ATA feature set Product Ecological Compliance
AES 256-bit Encryption  RoHS*
Power Management
 3.3 V SATA Supply Rail
 SATA Link Power Management (LPM)
 Device Sleep (DevSleep)
 Advanced Power Management (APM)
Power
 Active (BAPCo MobileMark* 2012 Workload):
80 mW
 Idle3: 40 mW
 DevSleep: 3 mW

NOTES:
1. IOMeter Test and System Configurations: Intel® Core™ i7-4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard,
Intel® HD Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB)
Kingston DDR3-1555,
Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.
2. Performance values vary by capacity.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper
device operating temperatures on heavier workloads.

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Ordering Information
Contact your local Intel sales representative for ordering information.

Revision History
Revision Number Description Revision Date

001  Initial release March 2016

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will
affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.
For more complete information about performance and benchmark results, visit http://www.intel.com/performance.
IOMeter Test and System Configurations: Intel® Core™ i7-4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard, Intel® HD
Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB) Kingston DDR3-1555,
Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.
All documented test results are obtained by Intel in compliance with JESD218 Standards; refer to individual sub-sections within this document
for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well
as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements.
The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular
purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document
contains information on products in the design phase of development.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling
1-800-548-4725, or go to: http://www.intel.com/design/literature.htm
Intel, Intel Core i7-4790, Intel HD Graphics 4600 Driver, Intel INF, Intel RST and the Intel logo are trademarks of Intel Corporation in the U.S.
and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2016 Intel Corporation. All rights reserved.

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Contents
1 Introduction .......................................................................................................................................................................................................... 5
1.1 Terminology ............................................................................................................................................................................................... 5
1.2 Reference Documents ........................................................................................................................................................................... 6

2 Product Specifications..................................................................................................................................................................................... 7
2.1 Capacity ........................................................................................................................................................................................................ 7
2.2 Performance ............................................................................................................................................................................................... 7
2.3 Electrical Characteristics ...................................................................................................................................................................... 8
2.4 Environmental Conditions ................................................................................................................................................................... 9
2.4.1 Temperature, Shock, Vibration ......................................................................................................................................... 9
2.4.2 Altitude ......................................................................................................................................................................................... 9
2.5 Product Regulatory Compliance ....................................................................................................................................................... 9
2.6 Reliability ................................................................................................................................................................................................... 10

3 Mechanical Information ................................................................................................................................................................................ 11

4 Pin and Signal Descriptions ........................................................................................................................................................................ 13

4.1 Pin Locations............................................................................................................................................................................................ 13
4.2 Signal Descriptions ............................................................................................................................................................................... 14

5 Supported Command and Feature Sets ............................................................................................................................................... 16

5.1 Supported ATA General Feature Command Set ..................................................................................................................... 16
5.2 Security Features ................................................................................................................................................................................... 18
5.2.1 Sanitization Methods ........................................................................................................................................................ 18
5.3 DevSleep .................................................................................................................................................................................................... 18
5.4 SMART Attributes .................................................................................................................................................................................. 19

6 Certifications and Declarations................................................................................................................................................................. 22

7 Appendix ............................................................................................................................................................................................................... 23
7.1 Identify Device ......................................................................................................................................................................................... 23
7.2 Models......................................................................................................................................................................................................... 26

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Tables
Table 1: Terminology ............................................................................................................................................................................................. 5
Table 2: Standard References ............................................................................................................................................................................ 6
Table 3: User Addressable Sectors ................................................................................................................................................................. 7
Table 4: Burst Performance ................................................................................................................................................................................ 7
Table 5: Sustained Performance ...................................................................................................................................................................... 7
Table 6: Latency ....................................................................................................................................................................................................... 8
Table 7: Operating Voltage and Power Consumption............................................................................................................................ 8
Table 8: Temperature, Shock, Vibration ....................................................................................................................................................... 9
Table 9: Reliability Specifications .................................................................................................................................................................. 10
Table 10: M.2 Serial ATA Power Pin Definitions ........................................................................................................................................ 14
Table 11: Supported ATA Commands and Feature Sets ....................................................................................................................... 16
Table 12: Supported Secure Erase Modes and Definitions .................................................................................................................. 18
Table 13: Supported Sanitize Device Modes and Definitions ............................................................................................................. 18
Table 15: DevSleep Control Parameters ....................................................................................................................................................... 19
Table 16: SMART Attributes ................................................................................................................................................................................ 19
Table 17: SMART Attribute Status Flags ....................................................................................................................................................... 21
Table 18: Device Certifications and Declarations ...................................................................................................................................... 22
Table 19: Identify Device Returned Sector Data ........................................................................................................................................ 23
Table 20: Available Models .................................................................................................................................................................................. 26

Figures
Figure 1: Dimensions for 80 mm single-sided M.2 Form Factor Drives (2280-S3-B-M) ....................................................... 11
Figure 2: Dimensions for 80 mm double-sided M.2 Form Factor Drives (2280-D3-B-M) .................................................... 12
Figure 3: Layout of Signal and Power Segment Pins .............................................................................................................................. 13

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1 Introduction
This document describes the specifications and capabilities of the Intel® Solid State Drive 540s Series
(Intel® SSD 540s Series).

1.1 Terminology
Table 1: Terminology

Term Description

AHCI* Advanced Host Controller Interface

ATA Advanced Technology Attachment

DAS Device Activity Signal

DevSleep Device Sleep

DIPM Device Initiated Power Management

DMA Direct Memory Access

DPTF Dynamic Platform Thermal Framework

EXT Extended

FPDMA First Party Direct Memory Access

Gigabyte (1,000,000,000 bytes)

GB Note: The total usable capacity of the SSD may be less than the total physical capacity because a small
portion of the capacity is used for NAND flash management and maintenance purposes.

HDD Hard Disk Drive

HIPM Host Initiated Power Management

I/O Input/Output

IOPS Input/Output Operations Per Second

KB Kilobyte (1,024 bytes)

LBA Logical Block Address

LPM Link Power Management

MB Megabyte (1,000,000 bytes)

MLC Multi-level Cell

MTBF Mean Time Between Failures

NCQ Native Command Queuing

NOP No Operation

PIO Programmed Input/Output

RDT Reliability Demonstration Test

RMS Root Mean Squared

SLC Single-level Cell

SATA Serial Advanced Technology Attachment

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Term Description

SMART Self-Monitoring, Analysis and Reporting Technology

SSD Solid State Drive

TYP Typical

UBER Uncorrectable Bit Error Rate

1.2 Reference Documents

Table 2: Standard References

Date or Rev. # Title Location

IEC 55022 Information Technology Equipment —

Sept 2008 Radio disturbance Characteristics— Limits and http://www.iec.ch/
methods of measurement CISPR22:2008 (Modified)

Dec 2008 VCCI http://www.vcci.jp/vcci_e/

http://qdms.intel.com/
June 2009 RoHS Click Search MDDS Database and search
for material description datasheet

IEC 55024 Information Technology Equipment —

August 2010 Immunity characteristics— Limits and methods of http://www.iec.ch/
measurement CISPR24:2010

Solid State Drive (SSD) Requirements and http://www.jedec.org/standards-

Sept 2010
Endurance Test Method (JESD218) documents/docs/jesd218/

August 2013 Serial ATA Revision 3.2 http://www.sata-io.org/

October 2013 ACS-3 Specification http://www.t13.org/

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2 Product Specifications
2.1 Capacity
Table 3: User Addressable Sectors

Capacity Unformatted Capacity (Total User Addressable Sectors in LBA mode)

120GB 234,441,648
180GB 351,651,888
240GB 468,862,128
360GB 703,282,608
480GB 937,703,088
1000GB 1,953,525,168

2.2 Performance
Table 4: Burst Performance
Random Random
Sequential Sequential
4KB Read 4KB Write
Capacity 128KB Read1 128KB Write1
(up to)1 (up to)1
IOPS IOPS MB/s MB/s
120GB 60,000 50,000 560 400
180GB 71,000 85,000 560 475
240GB 74,000 85,000 560 480
360GB 74,000 85,000 560 480
480GB 78,000 85,000 560 480
1000GB 78,000 85,000 560 480

Note:
1. Performance measured within the SLC cache buffer using IOMeter* with Queue Depth 32.

Table 5: Sustained Performance

Specification
Random Random
Sequential Sequential
Capacity 4KB Read 4KB Write 1
128KB Read 128KB Write1
(up to)1 (up to)1
IOPS IOPS MB/s MB/s
120GB 55,000 13,500 560 70
180GB 65,000 22,000 560 90
240GB 70,000 29,000 560 100
360GB 70,000 29,000 560 100
480GB 72,000 36,000 560 125
1000GB 72,000 36,000 560 125

Note:
1. Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on 8GB of Logical
Block Address (LBA) range on a full SSD.

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Table 6: Latency

Specification Intel® SSD 540s Series Type 2280

Read1 50 µs (TYP)
Write1 60 µs (TYP)
Power On To Ready2 500 ms (TYP)
Max Power On To Ready3 < 10 sec

NOTES:
1. Based on sequential 4KB using IOMeter with Queue Depth 1 workload. Write Cache enabled.
2. Power On To Ready time assumes safe shutdown
3. Max Power On To Ready time assumes unsafe shutdown. Based on statistical measurement of 95% quality of
service.

2.3 Electrical Characteristics

Table 7: Operating Voltage and Power Consumption

Intel® SSD 540s Series Type 2280

Electrical Characteristics
120GB 180GB 240GB 360GB 480GB 1000GB

Operating Voltage for 3.3 V (±5%)

Min 3.14 V
Max 3.47 V
Rise Time (Max/Min) 100 ms / 0.1 ms
Fall Time (Max/Min) 5 s / 1 ms
Noise Tolerance 70 mV pp (10 Hz – 30 MHz)
Min Off Time1 1s
Power Consumption (TYP)
Active2 80 mW
Idle3 40 mW
DevSleep4 3 mW
5
Thermal Power
Regulator Power6

NOTES:
1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.
2. Active power measured during execution of MobileMark* 2012 with SATA Link Power Management (LPM) enabled.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. Power consumption during DevSleep state.
5. Power measured during 128kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This
represents power that would be thermal load on system during heavy workloads.
6. Power measured during 128kB sequential writes with Queue Depth 32 workload using 500 us sample period. This
represents power that system power supply would have to regulate for proper device operation.

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2.4 Environmental Conditions

2.4.1 Temperature, Shock, Vibration

Table 8: Temperature, Shock, Vibration

Electrical Characteristics Range

Module Temperature
Operating1 0° C – 70° C
2
Non-operating -55° C – 95° C
Temperature Gradient3
Operating 30 (TYP)° C/hr
Non-operating 30 (TYP)° C/hr
Humidity
Operating 5 – 95 %
Non-operating 5 – 95 %

Shock and Vibration Range

4
Shock
1,000 G (Max) at 0.5 msec
Non-operating
Vibration5
Operating 2.17 GRMS (5-700 Hz) Max
Non-operating 3.13 GRMS (5-800 Hz) Max

NOTES:
1. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for
maintaining proper device operating temperature on heavier workloads.
2. Please contact your Intel representative for details on the non-operating temperature range.
3. Temperature gradient measured without condensation.
1. Shock specifications assume SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using peak acceleration and
pulse width value.
2. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using G Root Mean
Squared (GRMS) value.

2.4.2 Altitude
The drive is not sensitive to changes in atmospheric pressure because it has no moving parts. Drive tested under
non-operational conditions to pressures representative of -1 K and +40 K feet.

2.5 Product Regulatory Compliance

The Intel SSD 540s Series meets or exceeds the regulatory or certification requirements as specified in the Intel
SSD 540s Series Declaration of Conformity at http://www.intel.com/content/www/us/en/library/tech-
docs.results.html?mTag=rresourcetype:technicaldocument/declarationofconformity

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2.6 Reliability
The Intel SSD 540s Series meets or exceeds SSD endurance and data retention requirements as specified in the
JESD218 specification.

Table 9: Reliability Specifications

Parameter Value

Uncorrectable Bit Error Rate (UBER)

Uncorrectable bit error rate will not exceed one sector in the specified number of bits
read. In the unlikely event of a non-recoverable read error, the SSD will report it as a < 1 sector per 1016 bits read
read failure to the host; the sector in error is considered corrupt and is not returned to
the host.

Mean Time Between Failures (MTBF)

Mean Time Between Failures is estimated based on Telcordia* methodology and ≥ 1.6 million hours
demonstrated through Reliability Demonstration Test (RDT).

Minimum Useful Life/Endurance Rating

The SSD will have a minimum of five years of useful life under typical client workloads 5 years
with up to 40 GB† of host writes per day.

Insertion Cycles
250 insertion/removal cycles
Maximum insertion/removal cycles on M.2 port
†
120GB SSD qualified to 20 GB of host writes per day.

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3 Mechanical Information
The following figures show the mechanical information for the single-sided, 80 mm height, M.2 Intel SSD
540s Series. All dimensions are in millimeters.

Figure 1: Dimensions for 80 mm single-sided M.2 Form Factor Drives (2280-S3-B-M)

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Figure 2: Dimensions for 80 mm double-sided M.2 Form Factor Drives (2280-D3-B-M)

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4 Pin and Signal Descriptions

4.1 Pin Locations

Figure 3: Layout of Signal and Power Segment Pins

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4.2 Signal Descriptions

Table 10: M.2 Serial ATA Power Pin Definitions

Pin Function Definition

P1 CONFIG_3 Ground
P2 +3.3 V 3.3 V Source
P3 GND Ground
P4 +3.3 V 3.3 V Source
P5 Reserved No Connect
P6 Reserved No Connect
P7 Reserved No Connect
P8 Reserved No Connect
P9 Reserved No Connect
P10 DAS/DSS# Device Activity Signal / Disable Staggered Spin-up
P11 Reserved No Connect
P12 Notch No Connect
P13 Notch No Connect
P14 Notch No Connect
P15 Notch No Connect
P16 Notch No Connect
P17 Notch No Connect
P18 Notch No Connect
P19 Notch No Connect
P20 Reserved No Connect
P21 CONFIG_0 Ground
P22 Reserved No Connect
P23 Reserved No Connect
P24 Reserved No Connect
P25 Reserved No Connect
P26 Reserved No Connect
P27 GND Ground
P28 Reserved No Connect
P29 Reserved No Connect
P30 Reserved No Connect
P31 Reserved No Connect
P32 Reserved No Connect
P33 GND Ground
P34 Reserved No Connect
P35 Reserved No Connect
P36 Reserved No Connect
P37 Reserved No Connect
P38 DEVSLP DevSleep Pin
P39 GND Ground
P40 Reserved No Connect
P41 +B Host Receiver Differential Signal Pair (This is an output of the SSD)
P42 Reserved No Connect
P43 -B Host Receiver Differential Signal Pair (This is an output of the SSD)

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Pin Function Definition

P44 Reserved No Connect

P45 GND Ground
P46 Reserved No Connect
P47 -A Host Transmitter Differential Signal Pair (This is an input of the SSD)
P48 Reserved No Connect
P49 +A Host Transmitter Differential Signal Pair (This is an input of the SSD)
P50 Reserved No Connect
P51 GND Ground
P52 Reserved No Connect
P53 Reserved No Connect
P54 Reserved No Connect
P55 Reserved No Connect
P56 Two Wire Interface Two Wire Interface Clock
P57 GND Ground
P58 Two Wire Interface Two Wire Interface Data
P59 Notch No Connect
P60 Notch No Connect
P61 Notch No Connect
P62 Notch No Connect
P63 Notch No Connect
P64 Notch No Connect
P65 Notch No Connect
P66 Notch No Connect
P67 Reserved No Connect
P68 Reserved No Connect
P69 CONFIG_1 Ground
P70 +3.3 V 3.3 V Source
P71 GND Ground
P72 +3.3 V 3.3 V Source
P73 GND Ground
P74 +3.3 V 3.3 V Source
P75 CONFIG_2 Ground

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5 Supported Command and Feature Sets

The Intel SSD 540s Series supports all mandatory Advanced Technology Attachment (ATA) and Serial ATA (SATA)
commands defined in the ACS-3 and SATA Revision 3.2 specifications. The mandatory and optional commands are
defined in this section.

5.1 Supported ATA General Feature Command Set

Below are mandatory and optional ATA feature sets supported by Intel SSD 540s Series.

 48-Bit Address
 General
 General Purpose Logging (GPL)
 Native Command Queuing (NCQ)
 Power Management
 Sanitize Device
 Security
 SMART
 Software Settings Preservation (SSP)

Below are mandatory and optional ATA commands supported by Intel SSD 540s Series.

Table 11: Supported ATA Commands and Feature Sets

Commands Feature Set

BLOCK ERASE EXT Sanitize Device

CHECK POWER MODE Power Management
CRYPTO SCRAMBLE EXT Sanitize Device
DATA SET MANAGEMENT ATA General Feature
DOWNLOAD MICROCODE ATA General Feature
EXECUTE DEVICE DIAGNOSTIC ATA General Feature
FLUSH CACHE ATA General Feature
FLUSH CACHE EXT 48-Bit Address
1
IDENTIFY DEVICE ATA General Feature
IDLE Power Management
IDLE IMMEDIATE Power Management
NOP ATA General Feature
READ BUFFER ATA General Feature
READ DMA ATA General Feature
READ DMA EXT 48-Bit Address
READ FPDMA QUEUED Native Command Queuing
READ LOG DMA EXT General Purpose Logging
READ LOG EXT General Purpose Logging

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Commands Feature Set

READ MULTIPLE ATA General Feature

READ MULTIPLE EXT 48-Bit Address
READ NATIVE MAX ADDRESS 48-Bit Address
READ NATIVE MAX ADDRESS EXT 48-Bit Address
READ SECTOR(S) ATA General Feature
READ SECTOR(S) EXT 48-Bit Address
READ VERIFY SECTOR(S) ATA General Feature
READ VERIFY SECTOR(S) EXT 48-Bit Address
SANITIZE FREEZE LOCK EXT Sanitize Device
SANITIZE STATUS EXT Sanitize Device
SECURITY DISABLE PASSWORD ATA Security
SECURITY ERASE PREPARE ATA Security
SECURITY ERASE UNIT ATA Security
SECURITY FREEZE LOCK ATA Security
SECURITY SET PASSWORD ATA Security
SECURITY UNLOCK ATA Security
SEEK ATA General Feature
SET FEATURES ATA General Feature
SET MAX ADDRESS EXT 48-Bit Address
SET MULTIPLE MODE ATA General Feature
SLEEP Power Management
SMART DISABLE OPERATIONS SMART
SMART ENABLE OPERATIONS SMART
SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE SMART
SMART EXECUTE OFF-LINE IMMEDIATE SMART
SMART READ DATA SMART
SMART READ ATTRIBUTE THRESHOLDS SMART
SMART READ LOG SMART
SMART READ LOG SECTOR SMART
SMART RETURN STATUS SMART
SMART SAVE ATTRIBUTE VALUES SMART
SMART WRITE LOG SECTOR SMART
STANDBY Power Management
STANDBY IMMEDIATE Power Management
WRITE BUFFER ATA General Feature
WRITE DMA ATA General Feature
WRITE DMA EXT 48-Bit Address

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Commands Feature Set

WRITE DMA FUA EXT 48-Bit Address

WRITE FPDMA QUEUED Native Command Queuing
WRITE LOG DMA EXT General Purpose Logging
WRITE LOG EXT General Purpose Logging
WRITE MULTIPLE ATA General Feature
WRITE MULTIPLE EXT 48-Bit Address
WRITE MULTIPLE FUA EXT 48-Bit Address
WRITE SECTOR(S) ATA General Feature
WRITE SECTOR(S) EXT 48-Bit Address
WRITE UNCORRECTABLE EXT ATA General Feature

NOTES:
1. See the Appendix for details on the sector data returned after issuing an IDENTIFY DEVICE command.

5.2 Security Features

5.2.1 Sanitization Methods
Sanitization refers to a process that renders data inaccessible. Various sanitization methods are listed below.

5.2.1.1 Secure Erase

Secure Erase runs the SECURITY ERASE UNIT command

Table 12: Supported Secure Erase Modes and Definitions

Secure Erase Mode Definition

Normal Mode Full NAND erase of user available space and spare area
Enhanced Mode Cryptographically erase data

5.2.1.2 Sanitize Device

Table 13: Supported Sanitize Device Modes and Definitions

Mode Definition

Block erase method, all user data areas including user data not currently
Block Erase
allocated, irretrievable
Crypto Scramble Ext Changes the internal encryption keys

5.3 DevSleep
Intel® SSD 540s Series supports the DevSleep feature. DevSleep must be enabled on the device by the
host system through the SET FEATURES command. If DevSleep is enabled by the host, the host must drive
the DevSleep signal to proper assert/de-assert voltage levels according to the SATA specification. Entry into
DevSleep must be preceded by LPM slumber entry by host and device. The Intel SSD 540s Series also supports

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DevSleep_to_ReducedPwrState which allows the host to wake the drive using normal LPM COMWAKE
out-of-band signaling.

For the Intel SSD 540s Series, the recommended total time to DevSleep for system active state is 6 sec.
The AHCI* controller has 4 parameters used to define proper DevSleep operation between the host and drive.
The following table provides those recommended values for the Intel SSD 540s Series.

Table 14: DevSleep Control Parameters

Recommended
Parameter Definition Control
Settings
DevSleep Idle Time Out – number of
DITO milliseconds prior to host asserting Set by Host Active (lid-up): 375
DevSleep
DM DITO Multiplier – set once at boot-up Set by Host 15
Minimum DevSleep Assertion Time –
MDAT minimum time in milliseconds for Reported by Drive 10
host to assert DevSleep
DevSleep Exit Time Out – max time in
milliseconds from when DevSleep is
DETO Reported by Drive 20
negated to when device ready to
detect OOB

Total time to DevSleep entry = DITO * (DM+1)

5.4 SMART Attributes

The following two tables list the SMART attributes supported by the Intel SSD 540s Series, and the corresponding
status flags and threshold settings.

Table 15: SMART Attributes

Status Flags
ID Attribute Threshold
SP EC ER PE OC PW

Re-allocated Sector Count

The raw value of this attribute shows the
05h 1 1 0 0 1 0 0 (none)
number of retired blocks since leaving the
factory (grown defect count).
Power-On Hours Count
The raw value reports the cumulative number of
power-on hours over the life of the device,

09h The On/Off status of the Device Initiated 1 1 0 0 1 0 0 (none)

Power Management (DIPM) and Devsleep features will
affect the number of hours reported. If DIPM and/or
Devsleep are turned On, the recorded value for power-
on hours does not include the time
that the device is in those states.
Power Cycle Count
The raw value of this attribute reports the
0Ch 1 1 0 0 1 0 0 (none)
cumulative number of power cycle events
over the life of the device.

AAh Available Reserved Space (See E8h Attribute) 1 1 0 0 1 1 10

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 Intel® Solid State Drive 540s Series (M.2)

Status Flags
ID Attribute Threshold
SP EC ER PE OC PW

Program Fail Count

The raw value of this attribute shows total
ABh count of program fails and the normalized 1 1 0 0 1 0 0 (none)
value, beginning at 100, shows the percent
remaining of allowable program fails.
Erase Fail Count
The raw value of this attribute shows total
ACh count of erase fails and the normalized 1 1 0 0 1 0 0 (none)
value, beginning at 100, shows the percent
remaining of allowable erase fails.
Unexpected Power Loss
The raw value of this attribute reports the
cumulative number of unsafe (unclean)
AEh shutdown events over the life of the device. 1 1 0 0 1 0 0 (none)
An unsafe shutdown occurs whenever the
device is powered off without STANDBY
IMMEDIATE being the last command
SATA Downshift Count
The raw value counts of the number of times SATA
B7h 1 1 0 0 1 0 0
interface selected lower signaling rate due
to error.

End-to-End Error Detection Count

B8h Reports number of errors encountered during end-to- 1 1 0 0 1 1 90
end error detection within the SSD data path.
Uncorrectable Error Count
BBh The raw value shows the count of errors that 1 1 0 0 1 0 0 (none)
could not be recovered using Error
Correction Code (ECC) and XOR
Temperature
Reports real-time temperature of drive as measured
by temperature sensor on drive PCB. The normalized
BEh value reports the current temperature value. The raw 1 1 0 0 1 0 0 (none)
value shows current, lifetime highest and lifetime
lowest temperatures. Byte 1:0 = current temp Celsius;
Byte 3:2 = lifetime highest temp Celsius; Byte 5:4 =
lifetime lowest temp Celsius.
Power-Off Retract Count (Unsafe Shutdown Count)
The raw value of this attribute reports the cumulative
C0h number of unsafe (unclean) shutdown events over the 1 1 0 0 1 0 0 (none)
life of the device. An unsafe shutdown occurs
whenever the device is powered off without STANDBY
IMMEDIATE being the last command.
CRC Error Count
C7h The total number of encountered SATA interface 1 1 0 0 1 0 0 (none)
cyclic redundancy check (CRC) errors.
Host Writes
The raw value of this attribute reports the total
E1h number of sectors written by the host system. The raw 1 1 0 0 1 0 0 (none)
value is increased by 1 for every 65,536 sectors
(32MB) written by the host.
Timed Workload Media Wear
Measures the wear seen by the SSD (since reset of the
E2h workload timer, attribute E4h), as a percentage of the 1 1 0 0 1 0 0 (none)
maximum rated cycles. Divide raw value by 1024 to
get percentage of wear – accurate to 3 decimal places.

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Status Flags
ID Attribute Threshold
SP EC ER PE OC PW

Timed Workload Host Read/Write Ratio

E3h The raw value shows the percentage of I/O operations 1 1 0 0 1 0 0 (none)
that are read operations (since reset of the workload
timer, attribute E4h).
Timed Workload Timer
E4h The raw value measures the elapsed time (number of 1 1 0 0 1 0 0 (none)
minutes since starting this workload timer).
Available Reserved Space
This attribute reports the number of reserve blocks
E8h remaining. The normalized value begins at 100 (64h), 1 1 0 0 1 1 10
which corresponds to 100 percent availability of the
reserved space. The threshold value for this attribute
is 10 percent availability.
Media Wearout Indicator
This attribute reports the number of cycles the NAND
media has undergone. The normalized value declines
E9h linearly from 100 to 1 as the average erase cycle 1 1 0 0 1 0 0 (none)
count increases from 0 to the maximum rated cycles.
Once the normalized value reaches 1, the number will
not decrease, although it is likely that significant
additional wear can be put on the device
Total LBAs Written
The raw value of this attribute reports the total
F1h number of sectors written by the host system. The raw 1 1 0 0 1 0 0 (none)
value is increased by 1 for every 65,536 sectors
(32MB) written by the host.
Total LBAs Read
The raw value of this attribute reports the total
F2h number of sectors read by the host system. The raw 1 1 0 0 1 0 0 (none)
value is increased by 1 for every 65,536 sectors
(32MB) read by the host.
Total NAND Writes
F9h Raw value reports the number of writes to NAND in 1 1 1 0 0 1 0 0 (none)
GB increments.

Table 16: SMART Attribute Status Flags

Status Flag Description Value = 0 Value = 1

SP Self-preserving attribute Not a self-preserving attribute Self-preserving attribute

EC Event count attribute Not an event count attribute Event count attribute
ER Error rate attribute Not an error rate attribute Error rate attribute
PE Performance attribute Not a performance attribute Performance attribute
Collected only during offline Collected during both offline
OC Online collection attribute
activity and online activity
PW Pre-fail warranty attribute Advisory Pre-fail

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 Intel® Solid State Drive 540s Series (M.2)

6 Certifications and Declarations

The following table describes the Device Certifications supported by the Intel SSD 540s Series.

Table 17: Device Certifications and Declarations

Certification Description

European Economic Area (EEA): Compliance with the essential requirements of EC Council
CE* Compliant Directives Low Voltage Directive (LVD) 2006/95/EC, EMC Directive 2004/108/EC and Directive
2011/65/EU.

Certified Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd

Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General
UL* Certified Requirements)
CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information Technology Equipment - Safety -
Part 1: General Requirements)

Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic

RCM* Compliant
Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).

Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio
BSMI* Compliant disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006,
is harmonized with CISPR 22: 2005.04.

Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control

KCC* Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the
Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.

Microsoft* WHCK/WHLK Microsoft Windows Hardware Certification

RoHS* Compliant Restriction of Hazardous Substance Directive

Voluntary Control Council for Interface to cope with disturbance problems caused by personal
VCCI*
computers or facsimile.

SATA-IO* Indicates certified logo program from Serial ATA International Organization.

Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final
product. Intel components as well as purchased components on the finished assembly meet JS-
Low Halogen
709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement
of halogenated flame retardants and/or PVC may not be better for the environment.

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7 Appendix

7.1 Identify Device

The following table describes the sector data returned from an identify device command.
Table 18: Identify Device Returned Sector Data
F = Fixed
Word V = Variable Default Value Description
X = Both
0 F 0040h General configuration bit-significant information

1 X 3FFFh Obsolete - Number of logical cylinders (16,383)

2 V C837h Specific configuration

3 X 0010h Obsolete - Number of logical heads (16)

4-5 X 0h Retired

6 X 003Fh Obsolete - Number of logical sectors per logical track (63)

7-8 V 0h Reserved for assignment by the CompactFlash* Association (CFA)

9 X 0h Retired

10-19 F varies Serial number (20 ASCII characters)

20-21 X 0h Retired

22 X 0h Obsolete

23-26 F varies Firmware revision (8 ASCII characters)

27-46 F varies Model number (Intel® Solid State Drive)

7:0—Maximum number of sectors transferred per interrupt on
47 F 8010h
multiple commands
48 F 4000h Reserved

49 F 2F00h Capabilities

50 F 4000h Capabilities

51-52 X 0h Obsolete

53 F 0007h Words 88 and 70:64 valid

54 X 3FFFh Obsolete - Number of logical cylinders (16,383)

55 X 0010h Obsolete - Number of logical heads (16)

56 X 003Fh Obsolete - Number of logical sectors per logical track (63)

57-58 X 00FBFC10h Obsolete

59 V B110h Sanitize/Multiple Sector settings

60-61 F varies Total number of user-addressable sectors

62 X 0h Obsolete

63 F 0007h Multi-word DMA modes supported/selected

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 Intel® Solid State Drive 540s Series (M.2)

F = Fixed
Word V = Variable Default Value Description
X = Both
64 F 0003h PIO modes supported

65 F 0078h Minimum multiword DMA transfer cycle time per word

66 F 0078h Manufacturer’s recommended multiword DMA transfer cycle time

67 F 0078h Minimum PIO transfer cycle time without flow control

68 F 0078h Minimum PIO transfer cycle time with IORDY flow control

69 F 4D10h Additional Supported

70 F 0h Reserved

71-74 F 0h Reserved for IDENTIFY PACKET DEVICE command

75 F 001Fh Queue depth

76 F 070Eh Serial ATA capabilities

77 F 0086h Reserved for future Serial ATA definition

78 F 014Ch Serial ATA features supported

79 V 0040h Serial ATA features enabled

80 F 07FCh Major version number

81 F FFFFh Minor version number

82 F 746Bh Command set supported

83 F 7409h Command sets supported

84 F 6163h Command set/feature supported extension

85 V 7469h Command set/feature enabled

86 V B409h Command set/feature enabled

87 V 6163h Command set/feature default

88 V 407Fh Ultra DMA Modes

89 F 0002h Time required for security erase unit completion

90 F 0001h Time required for enhanced security erase completion

91 V 00FEh Current advanced power management value

92 V FFFEh Master Password Revision Code

Hardware reset result: the contents of bits (12:0) of this word shall
93 F 0h
change only during the execution of a hardware reset
94 V 0h Vendor’s recommended and actual acoustic management value

95 F 0h Stream minimum request size

96 V 0h Streaming transfer time - DMA

97 V 0h Streaming access latency - DMA and PIO

98-99 F 0h Streaming performance granularity

100-103 V varies Maximum user LBA for 48-bit address feature set

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F = Fixed
Word V = Variable Default Value Description
X = Both
104 V 0h Streaming transfer time - PIO

105 F 0008h Reserved

106 F 4000h Physical sector size / logical sector size

107 F 0h Inter-seek delay for ISO-7779 acoustic testing in microseconds

108-111 F varies Unique ID

112-115 F 0h Reserved for world wide name extension to 128 bits

116 V 0h Reserved for technical report

117-118 F 0h Words per logical sector

119 F 401Ch Supported settings

120 F 401Ch Command set/feature enabled/supported

121-126 F 0h Reserved

127 F 0h Removable Media Status Notification feature set support

128 V 0021h Security status

129-159 X varies Vendor-specific

160 F 0h CompactFlash Association (CFA) power mode 1

161-167 X 0h Reserved for assignment by the CFA

168 F 0007h (M.2) Nominal Form Factor

169 X 0001h Data set management Trim attribute support

170-173 F 0h Additional Product Identifier

174-175 F 0h Reserved

176-205 V 0h Current media serial number

206 X 0039h SCT Command Transport

207-208 X 0h Reserved

209 X 4000h Alignment of logical blocks within a physical block

210-211 X 0h Write-Read-Verify Sector Count Mode 3 (DWord)

212-213 X 0h Write-Read-Verify Sector Count Mode 2 (DWord)

214 X 0h NV Cache Capabilities

215-216 X 0h NV Cache Size in Logical Blocks (DWord)

217 X 0001h Nominal media rotation rate

218 X 0h Reserved

219 X 0h NV Cache Options

220 X 0h Write-Read-Verify feature set

221 X 0h Reserved

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 Intel® Solid State Drive 540s Series (M.2)

F = Fixed
Word V = Variable Default Value Description
X = Both
222 X 10FFh Transport major version number

223 X 0h Transport minor version number

224-229 X 0h Reserved

230-233 X 0h Extended Number of User Addressable Sectors (QWord)

Minimum number of 512-byte data blocks per DOWNLOAD
234 X 0002h
MICROCODE command for mode 03h
Maximum number of 512-byte data blocks per DOWNLOAD
235 X 0080h
MICROCODE command for mode 03h
236-254 X 0h Reserved

255 X varies Integrity word

NOTES:
F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change
when media is removed or changed.
V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the
commands executed by the device.
X = F or V. The content of the word may be fixed or variable.

7.2 Models
The following table lists the available M.2 single-sided models of the Intel® SSD 540s Series.

Table 19: Available Models

Model String Capacity

SSDSCKKW120H6 120GB

SSDSCKKW180H6 180GB

SSDSCKKW240H6 240GB

SSDSCKKW360H6 360GB

SSDSCKKW480H6 480GB

SSDSCKKW010X6 1000GB

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