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BF494

This document provides specifications and characteristics for the BF494 NPN RF transistor. It includes maximum ratings, thermal characteristics, electrical characteristics, and package dimensions for the transistor.

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André Andrade
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0% found this document useful (0 votes)
142 views3 pages

BF494

This document provides specifications and characteristics for the BF494 NPN RF transistor. It includes maximum ratings, thermal characteristics, electrical characteristics, and package dimensions for the transistor.

Uploaded by

André Andrade
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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BF494 NPN RF Transistor

July 2006

BF494 tm

NPN RF Transistor

TO-92

1. Collector 2. Emitter 3. Base


Absolute Maximum Ratings * Ta = 25°C unless otherwise noted

Symbol Parameter Value Unit


VCEO Collector-Emitter Voltage 20 V
VCBO Collector-Base Voltage 30 V
VEBO Emitter-Base Voltage 5.0 V
IC Collector Current - Continuous 30 mA
TJ Junction Temperature 150 °C
TSTG Storage Temperature Range - 55 ~ 150 °C
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations

Thermal Characteristics
Symbol Parameter Value Unit
PD Total Device Dissipation, by RθJA 350 mW
Derate above 25°C 2.8 mW/°C
RθJC Thermal Resistance, Junction to case 125 °C/W
RθJA Thermal Resistance, Junction to Ambient 357 °C/W

Electrical Characteristics* TC = 25°C unless otherwise noted

Symbol Parameter Conditions Min. Max. Units


V(BR)CEO Collector-Emitter Breakdown Voltage IC = 1.0mA, IB = 0 20 V
V(BR)CBO Collector-Base BreakdownVoltage IC = 10µA, IE = 0 30 V
V(BR)EBO Emitter-Base Breakdown Voltage IE = 10µA, IC = 0 5.0 V
ICES Collector-Emitter Sustaining Current VCE = 40V, VEB = 0V 10 nA
hFE DC Current Gain VCE = 10V, IC = 1mA 67 222
VCE(sat) Collector-Emitter Saturation Voltage IC = 10mA, IB = 5mA 0.2 V
VBE(sat) Base-Emitter Saturation Voltage IC = 10mA, IB = 5mA 0.92 V
VBE(ON) Base-Emitter On Voltage VCE = 10V, IC = 10mA 650 740 mV
* DC Item are tested by Pulse Test: Pulse Width≤300us, Duty Cycle≤2%

©2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com


BF494 Rev. A
BF494 NPN RF Transistor
Package Dimensions

TO-92
+0.25
4.58 –0.15

4.58 ±0.20

0.46 ±0.10
14.47 ±0.40

+0.10
1.27TYP 1.27TYP 0.38 –0.05
[1.27 ±0.20] [1.27 ±0.20]

3.60 ±0.20
3.86MAX

(0.25)
+0.10
0.38 –0.05
1.02 ±0.10

(R2.29)

Dimensions in Millimeters

2 www.fairchildsemi.com
BF494 Rev. A
BF494 NPN RF Transistor
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to
be an exhaustive list of all such trademarks.
ACEx™ FACT Quiet Series™ OCX™ SILENT SWITCHER® UltraFET®
ActiveArray™ GlobalOptoisolator™ OCXPro™ SMART START™ UniFET™
Bottomless™ GTO™ OPTOLOGIC® SPM™ VCX™
Build it Now™ HiSeC™ OPTOPLANAR™ Stealth™ Wire™
CoolFET™ I2C™ PACMAN™ SuperFET™
CROSSVOLT™ i-Lo™ POP™ SuperSOT™-3
DOME™ ImpliedDisconnect™ Power247™ SuperSOT™-6
EcoSPARK™ IntelliMAX™ PowerEdge™ SuperSOT™-8
E2CMOS™ ISOPLANAR™ PowerSaver™ SyncFET™
EnSigna™ LittleFET™ PowerTrench® TCM™
FACT™ MICROCOUPLER™ QFET® TinyBoost™
FAST® MicroFET™ QS™ TinyBuck™
FASTr™ MicroPak™ QT Optoelectronics™ TinyPWM™
FPS™ MICROWIRE™ Quiet Series™ TinyPower™
FRFET™ MSX™ RapidConfigure™ TinyLogic®
MSXPro™ RapidConnect™ TINYOPTO™
Across the board. Around the world.™ µSerDes™ TruTranslation™
The Power Franchise® ScalarPump™ UHC™
Programmable Active Droop™

DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO
IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE
OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE
RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPE-
CIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY


FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT
THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are 2. A critical component is any component of a life support device or system
intended for surgical implant into the body, or (b) support or sustain life, or whose failure to perform can be reasonably expected to cause the failure
(c) whose failure to perform when properly used in accordance with of the life support device or system, or to affect its safety or effectiveness.
instructions for use provided in the labeling, can be reasonably expected
to result in significant injury to the user.

PRODUCT STATUS DEFINITIONS


Definition of Terms
Datasheet Identification Product Status Definition

Advance Information Formative or In Design This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.

Preliminary First Production This datasheet contains preliminary data, and


supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

Obsolete Not In Production This datasheet contains specifications on a product


that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.

Rev. I20

3 www.fairchildsemi.com
BF494 Rev. A

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