Internal Use Only

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Asia/Oceania http://biz.lgservice.com

LCD MONITOR TV
SERVICE MANUAL
CHASSIS : LD93H

MODEL : M2241A M2241A-PTP

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL62477328(1201-REV00) Printed in Korea

 CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................12

TROUBLE SHOOTING ............................................................................17

BLOCK DIAGRAM...................................................................................28

EXPLODED VIEW .................................................................................. 29

SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
 PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING

• There are some special components used in LCD BE CAREFUL ELECTRIC SHOCK !
monitor that are important for safety. These parts are
• If you want to replace with the new backlight (CCFL) or
marked on the schematic diagram and the
inverter circuit, must disconnect the AC adapter
Exploded View It is essential that these critical parts
because high voltage appears at inverter circuit about
should be replaced with the manufacturer’s specified
650Vrms.
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written • Handle with care wires or connectors of the inverter
permission from manufacturer or you will void the circuit. If the wires are pressed cause short and may
original parts and labor guarantee. burn or take fire.

TAKE CARE DURING HANDLING THE LCD MODULE Leakage Current Hot Check Circuit
WITH BACKLIGHT UNIT. AC Volt-meter

• Must mount the module using mounting holes arranged

in four corners.
Good Earth Ground
such as WATER PIPE,
• Do not press on the panel, edge of the frame strongly To Instrument's CONDUIT etc.

or electric shock as this will result in damage to the exposed

METALLIC PARTS
0.15uF
screen.
1.5 Kohm/10W
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
When 25A is impressed between Earth and 2nd Ground
damage to the panel.
for 1 second, Resistance must be less than 0.1 Ω
• Protect the module from the ESD as it may damage the *Base on Adjustment standard

electronic circuit (C-MOS).

• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a soft material. (Cleaning with a dirty or rough cloth
may damage the panel.)

CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.

Copyright LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or re-connecting any receiver electrical plug package until immediately before you are ready to install it.
or other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) is opropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500ºF to 600ºF.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500ºF to 600ºF)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500ºF to 600ºF)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

Copyright LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.

Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Copyright LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
 SPECIFICATION
1. Application Range. 3. Test method
This spec sheet is applied to the 58 cm(23 inch) LCD Monitor
TV used LH92H chassis. 3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
2. Specification Safety : CE, IEC specification
EMC : CE, IEC
Each part is tested as below without special appointment
Safety : IEC/EN60065
2.1 Temperature : 25 °C ± 5 °C (77 °F ± 9 °F), EMI : EN55013
CST : 40 °C ± 5° C EMS : EN55020
2.2 Relative Humidity : 65 % ±10 %
2.3 Power Voltage : Standard input voltage
(100 V - 240 V ~, 50 / 60 Hz)
• Standard Voltage of each products is marked by models
2.4 Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM .
2.5 The receiver must be operated for about 5 minutes prior to
the adjustment.

4. Module Specification
LGD, LM215WF1-TLE1 (P/N: EAJ61327601)
No Item Specification Unit Remark
1 Type TFT Color LCD Module
2 Diagonal Size 546.86mm (21.53 inch) diagonal
3 Active Display area 476.64(H) x 268.11(V) mm
4 Outline Dimension 495.6(H) x 292.2(V) x 14.5(D) mm Typ.
5 Aspect Ratio 16:9
6 Pixel Number 1920 x RGB x 1080 pixel pixel
7 Pixel Pitch 0.248(H) x 0.248(V) mm
8 Color arrangement RGB vertical Stripe
9 Color Depth 16.7M color (6bit with A-FRC)
10 Electrical Interface LVDS
11 Surface Treatment Hard coating(3H) & Anti-glare
12 Operating Mode Normally White
13 Backlight Unit 2 CCFLs (2 lamps)
14 Response Time Rising Time : 1.3 + Falling Time : 3.7 ms Typ.
15 Color Gamut Normal 72% Panel(CIE1931)

Copyright LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. General Specification
5.1 RGB - PC
No Item Specification Remarks
1 Supported Sync. Type Separate Sync.(RGB),S G
2 Operating Frequency Analog Horizontal 30 ~ 69kHz
Vertical 56 ~ 61 Hz
Digital Horizontal -
Vertical -
3 Resolution Analog Max. 1920x1080 @ 60Hz
Recommend 1920x1080 @ 60Hz
Digital Max. -
Recommend -
4 Input Voltage Voltage :100 – 240 Vac, 50 or 60Hz
5 Inrush Current Cold Start : 50 A Hot : 120 A
6 Operating Condition Sync (H/V) Video LED Wattage
Power S/W On On Max. On/On Active Blue 50W
mode Typ. On/On Active Blue 30W M2241A
Max. On/On Active Blue 70W
Typ. On/On Active Blue 35W M2341
Sleep mode Off/On
Off Blanking 1W RGB
On/Off
Power S/W Off Off mode - Off Off 0.5W Just operate power key

and remote controller power button

7 MTBF 50,000 HRS with 90% Confidence level Lamp Life: 50,000 Hours(min)

8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)

9 Operating Environment Temp : 10°C ~ 35°C
Humidity : 20 % ~ 80 %
10 Storage Environment Temp : -10°C~60°C non condensing
Humidity : 5 % ~ 90 % non condensing

Copyright LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
 5.2 TV - Non EU
No Item Specification Remarks
1 Market Non-EU
2 Broadcasting system PAL B/G/DK, I/
NTSC - M
BAND PAL NTSC China(DK) Australia(BG)
3 Receiving system VHF/UHF C1 ~ C69 2 ~ 78 C1~C62 C1~C75
CATV S1 ~ S41 14 ~ 69 S1~S41 S2~S44

4 Receiving system Upper Heterodyne

5 CVBS Input (1EA) PAL, SECAM, NTSC 4 System(Rear) :PAL50, SECAM, NTSC, PAL60
6 RGB Input RGB-PC Analog(D-SUB 15Pin)
7 HDMI Input (1EA) HDMI1-DTV HDMI version 1.3 , Support HDCP
8 Audio Input (1EA) CVBS L/R Input

5.3 TV - Central and South America

No Item Specification Remarks
1 Market Central and South America
2 Broadcasting system NTSC, PAL-M/N

BAND NTSC
3 Receiving system VHF 2 ~ 13
UHF 14 ~ 69
CATV 1 ~ 125
4 Receiving system Upper Heterodyne
5 CVBS Input (1EA) NTSC, PAL- M, PAL- N 3 System(Rear) : NTSC, PAL-M, PAL-N
6 RGB Input RGB-PC Analog(D-SUB 15Pin)
7 HDMI Input (1EA) HDMI1-DTV HDMI version 1.3 , Support HDCP
8 Audio Input (1EA) CVBS L/R Input

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Only for training and service purposes
6. Chroma & Brightness
No. Item Specification Min. Typ. Max. Remark
1 Viewing Angle[CR>10] Right/Left 70/70 85/85 - CR >10
Up/Down 60/70 75/85
2 Luminance Luminance (cd/m2) 200 250 - RGB
Vivid, 6500K
Full white(100IRE)
Variation(%) 75 Min/ Max
3 Contrst Ratio CR 700 1000 Full white/Full black
4 Color Coordinates [CIE1931] White WX 0.313
WY Typ. 0.329 Typ.
RED Xr -0.03 0.646 +0.03 RGB
Yr 0.334 Vivid, 6500K
Green Xg 0.303 Full white(100IRE)
Yg 0.616
Blue Xb 0.147
Yb 0.067

0 * Optical Test Condition

- Surrounding Brightness Level : dark
- Surrounding Temperature : 25 °C ± 5 °C
- warm-up Time : 30 min
- Contrast, Brightness : Outgoing condition
- *Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.

* Active area
1. Active area of LCD PANEL is in bezel of cabinet.
2. Interval between active area and bezel
|A-B|<1.0 mm , |C-D|<1.0 mm
A: Interval between left of active area and bezel
B: Interval between right of active area and bezel
C: Interval between top of active area and bezel
D: Interval between bottom of active area and bezel

Active Area
A B

D Bezel

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7. SET Optical Feature
7.1 PC Mode (Measurement Condition: Full white/ Standard/6500k) --> Measure the black luminance after 30 seconds.)
Luminance (cd/m2) C/R
No Item module Remark
Min Typ Max Min Typ

1 22 inch LGD 150 180 500:1 700:1

2 23 inch LGD 200 230 500:1 700:1

7.2 AV Mode
(Measurement Condition: Full white(100IRE)/ Vivid) ? Measure the black luminance after 30 seconds.

Luminance (cd/m2) C/R(min)

No Item module Remark
Min Typ Max RF,AV, HDMI

1 22 inch LGD 120 150 500 : 1 RF,AV, HDMI

2 23 inch LGD 170 200 500 : 1

7.3 Special feature(DFC)

-DFC Working Condition : Full Black Pattern(All Black, No pattern(MSPG Pattern#2)) signal in D-sub

No Item Min Typ Max Remark

1 M2241A 40000:1 50000:1 PC Mode(D-sub) For Checking Black Luminance,
2 ........M2341A 40000:1 50000:1 wait for over 1 minute.

8. RGB Input ( PC )
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 640*480 31.469 59.94 25.175
2 800*600 37.879 60.317 40.0
3 1024*768 48.363 60.0 65.0
4 1152*864 54.34 60.05 80
5 1280*960 60 60 108.0
6 1280*1024 63.981 60.02 108.0
7 1680*1050 64.674 59.883 119.0
8 1680*1050 65.290 59.954 146.25
9 1920*1080 67.5 60 148.5

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9. HDMI Input (DTV)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
2 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 7Z20*480 31.47 59.94 27.000 SDTV 480P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45.00 60.00 74.250 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920*1080 33.72 59.94 74.176 HDTV 1080I
11 1920*1080 33.75 60.00 74.250 HDTV 1080I
12 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz
13 1920*1080 67.432 59.94 148.350 HDTV 1080P
14 1920*1080 67.5 60 148.5 HDTV 1080P
15 1920*1080 56.250 50 148.5 HDTV 1080P 50Hz

10. Mechanical specification

No. Item Content Unit Remark
1. Product Width(W) Length(D) Height(H) mm With Stand
Dimension Before Packing 520.8 166.4 422.7 mm
After Packing 592 140 472 mm
2. Product Only SET 3.6 Kg
Weight With BOX 5.4 Kg
3. Container Individual or 20ft 40ft
Loading Palletizing Indi. Wooden Indi. Wooden
Quantity 720 600 1520 1320
Type Detachable, No Tilt
Size(W x D x H) 226.4 x 99.9 x 166.5
4. Stand Tilt Degree -
Assy Tilt force -
S Degree
-1~+2

5. Appearance General Refer to Standard of LG(56)G2-1011

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Only for training and service purposes
 ADJUSTMENT INSTRUCTION
1. Application Range
This document is applied to LD93H chassis LCD Monitor TV
which is manufactured in TV (or Monitor) Factory or is
produced on the basis of this data.

2. Specification
1) The adjustment is according to the order which is
designated and which must be followed, according to the 1) Push the IN-START key in the Adjust R/C.
plan which can be changed only on agreeing. 2) Input the Option Number that was specified in the BOM, into
2) Power Adjustment: Free Voltage the Shipping area.
3) Magnetic Field Condition: Nil. 3) Select “Tool Option/ Area Option” by using E/D(CH+/-) key
4) Input signal Unit: Product Specification Standard , and press the number key(0~9) consecutively
5) Reserve after operation: Above 5 Minutes (Heat Run) ex) If the value of Tool Option1 is 7, input the data using
Temperature : at 25 °C ± 5 °C number key “7”
Relative humidity : 65% ±10 % (If not changed the option, the input menu can differ from the
Input voltage : 100V - 240V, 50 Hz/ 60 Hz model spec.)
6) Adjustment equipment: Color Analyzer (CA-210 or CA- * Refer to Job Expression of each main chassis ass’y
110), Pattern Generator (MSPG-925L or Equivalent), DDC (EBTxxxxxxxx) for Option value
Adjustment Jig equipment, SVC remote controller
* Before PCB check, you have to change the Tool option,
Areaoption and have to AC off/on (Plug out and in)
3. Adjustment items (If missing this process, set can operate abnormally)
* Never push the IN-STOP KEY after completing the function
PCB assembly adjustment items inspection.
1) Download the MSTAR main software (IC603, Mstar ISP
Utility) 4.2 S/W program download
2) Auto Color Balance(ADC) - RGB
3) Auto Color Balance(ADC) – Component Profile : This is for downloading the s/w to the flash memory of
4) Input Tool-Option/Area option. IC603
5) Check SW Version. Equipment
1) PC
SET assembly adjustment items 2) MTK_tool program
1) DDC Data input. 3) Download jig
2) HDCP data input 4) USB
3) Adjustment of White Balance. Connection structure
4) Preset CH information
5) Factoring Option Data input.

4. PCB assembly adjustment method

4.1 Input Tool-Option, Area Option

Option adjustment following BOM (Tool Option 1, Area Option)
Connection condition
* Required Equipments
1) IC name and circuit number : Flash Memory and IC603
- Remote controller for adjustment
2) Tact time : about 2min
* Profile : Must be changed the option value because being
different with some setting value depend on module
maker, inch and market.

Adjustment method
The input methods are same as other chassis.(Use IN-START
Key on the Adjust Remocon.)

Copyright LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
4.2.1 Download method 1 (3) Click the connect button and confirm
- Preliminary steps (PCB Ass’y)

1) Connect the download jig to D-sub jack

(4) Read and write bin file
Click ”(1)Read” tab, and then load download file(XXXX.bin)
by clicking “Read”.

2) Connect the PC to USB jack

Download Steps
(1) Execute ‘ISP Tool’ program in PC, then a main window will
be opened

(5) Click “Auto(2)” tab and set as below

(2) Click the Config and Change speed

(MT8223, Using Port, 115200, 4ms).

(6) After downloading, AC Power OFF and ON.

4.2.2 Download method 2

1) Connection USB memory for upgrade.( File name : mtk.bin )
2) Press the IN START button.
3) Select the “Upg Fw” menu
4) Press the Gbutton and wait
5) If the progressive bar 100% will be completed
- Notice: Do not plug out USB during upgrading.

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4.3. ADC Process
4.3.1 ADC calibration
* MSPG-925
- RGB: Model : 60(1024X768@60Hz)

4.3.2 PC input ADC

4.3.2.1 Auto RGB Gain/Offset Adjustment
- Convert to PC in Input-source
- Signal equipment displays
Output Voltage: 700 m Vp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 SERIES)

Adjustment pattern (RGB PC )

- Adjust by commanding AUTO_COLOR_ADJUST (0xF1)

0x00 0x02 instruction.

4.3.2.2 Confirmation
- We confirm to address “0xF1” in page “0x0E” of EEPROM
the value is “0xAA’ or not.
- If the value is not “0xAA”, we adjust once more.
- We can write the ADC values from “0x00~0x05” addresses
in a page “0x0E”.0

*Manual ADC process using Service Remocon. After enter

Service Mode by pushing "ADJ" key, execute "Auto-RGB" by
pushing " " key at "Auto-RGB".

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5. Check EDID and Write HDCP key ***: year ex) when year 2008 : input “12”
**** : CHECK SUM (deferent along week, year)

5.1 This model is no need to write. EDID

data is in Program source

5.2 EDID data

No. Item content 16bit Data

1 Manufacturer ID GSM 1E6D
2 ProductID 22578(Analog) 5831
22579(HDMI) 5832
3 Year 2010 14
4 Version Analog : 1
Digital : 1 1
5 Revision Analog : 3
Digital : 3 3
6 Model Name M2341A

5.2.1. RGB EDID Data

5.2.2. HDMI EDID Data

- All data are HEXA

- Adjustable Data :
**: week

Copyright LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
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6.Write HDCP key *When doing Adjustment, Please make circumstance as below.

1) Connect D-sub Signal Cable to D-Sub Jack

2) Input HDCP key with HDCP-key- in-program
3) HDCP Key value is stored on Main MTK IC (MTK8223)
which is 0x80~0xA0 Addresses of 0x00~0x01 page
(EEPROM MAP PAGE0~PAGE1 / START Addr: A0 80)
4) AC off/on and on HDCP button of MSPG925 and
confirm whether picture is displayed. Or not of using
MSPG925
5) HDCP Key value is different among the sets

7.Adjustment of White Balance

RGB_Gains are fixed data for each model.
Insert D-sub jack (I2C) which is connected with PC for White 8.Function Check
Balance or equivalent device.
-->Total Assembly line should be check whether the color
coordinate(x, y) data 8.1 Check display and sound
Refer to below table were meet or not.
* Check Input and Signal items. (cf. work instructions)
7.1 Required Equipment 1. TV
- Remote controller for adjustment 2. AV (CVBS)
- Color Analyzer : CA-210 3. COMPONENT (1080i)
- CH : 09 (LCD MNT, Normal) 4. RGB (PC : 1920 x 1080 @ 60hz)
- PC (for communication through RGB) 5. HDMI
- Pattern Generator (MSPG-925FS series. ) 6. PC Audio In
* Display and Sound check is executed by Remote controller.
7.2 Connecting diagram of equipment for
measuring (For Automatic Adjustment)
(Method 1, using IIC, You connect RGB
9. Preset CH write condition
1. AC on time on only one after assembled automatically
Cable) 2. CH recover on SVC OSD manually

( Standard color coordinate and temperature when using the

CA210 equipment)

RGB_Gains are fixed data for each model

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 TROUBLESHOOTING

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 BLOCK DIAGRAM

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 EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

900
910
400
LV1

A2

540
530
200

120
302
301

500
300

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