UM1606

User manual
STMTouch driver user manual

Introduction
The document covers the following touch sensing library product codes:
• STM8L-TOUCH-LIB
• STM8TL-TOUCH-LIB
• 32L1-TOUCH-LIB
• 32F0-TOUCH-LIB
• 32F3-TOUCH-LIB

The STMTouch driver includes:

• A complete register address mapping with all bits, bitfields and registers declared in C.
This avoids a cumbersome task and more importantly, it brings the benefits of a bug free
reference mapping file, speeding up the early project phase.
• A collection of routines and data structures covering all functions to manage the touch
sensing technology.
The STMTouch driver source code is developed using the ANSI-C standard. It is fully
documented and is MISRA®-C 2004 compliant. Writing the whole library in 'Strict ANSI-C'
makes it independent from the development tools. Only the start-up files depend on the
development tools.
Run-time failure detection is also implemented by checking the input values for all library
functions. Such dynamic checking contributes towards enhancing the robustness of the
firmware. Run-time detection is suitable for user application development and debugging. It
adds an overhead which can be removed from the final application code to minimize code
size and execution speed. For more details refer to Section 1.4: Run-time checking.
Since the STMTouch driver is generic and covers many functionalities and devices, the size
and/or execution speed of the application code may not be optimized. For many
applications, the STMTouch driver may be used as is. However, for applications having
tough constraints in terms of code size and/or execution speed, the STMTouch driver may
need to be fine tuned.
Note: Additional information on the STMTouch driver functions, variables and parameters can be
found in the CHM user manual present in the STMTouch Library installation folder.

September 2018 UM1606 Rev 6 1/124

www.st.com
Contents UM1606

Contents

1 Coding rules and conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.2 Naming conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.3 Coding rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.3.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.3.2 Variable types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.3.3 Peripheral registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.4 Run-time checking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.5 MISRA-C 2004 compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
1.5.1 Generalities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.5.2 Compliance matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2 STMTouch driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1 Supported devices and development tools . . . . . . . . . . . . . . . . . . . . . . . 13
2.1.1 Supported devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1.2 Development tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2 Package description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.4.2 STMTouch driver layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.4.3 Acquisition and processing layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.4.4 Header files inclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5 Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.5.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.5.4 Usage example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.6 Bank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.6.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.6.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.6.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.6.4 Usage example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

2/124 UM1606 Rev 6

UM1606 Contents

2.7 Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.7.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.7.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.7.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.7.4 Usage example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.8 Objects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.8.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.8.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.8.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.8.4 Usage example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2.9 Touchkey sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.9.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.9.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.9.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.9.4 Usage example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.10 Linear and rotary sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.10.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.10.2 Number of channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.10.3 Delta coefficient table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.10.4 Electrodes placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.10.5 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.10.6 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.10.7 Usage example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.11 Main state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2.12 Sensors state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2.12.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2.12.2 States constant table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.12.3 States detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.12.4 Calibration state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2.12.5 RELEASE state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2.12.6 Proximity state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2.12.7 DETECT state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2.12.8 TOUCH state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.12.9 ERROR state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.12.10 OFF state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.12.11 Debounce states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

UM1606 Rev 6 3/124

6
Contents UM1606

2.12.12 Reading the current state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

2.12.13 Accessing a specific state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.13 Environment Change System (ECS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
2.13.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
2.13.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
2.13.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
2.13.4 Usage example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
2.14 Detection Exclusion System (DXS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
2.14.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
2.14.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.14.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2.14.4 Usage example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2.15 Detection Time Out (DTO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2.15.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2.15.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.15.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.15.4 Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.16 Noise filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.16.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.16.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.16.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.16.4 Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.17 Timing management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.17.1 Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.17.2 Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.17.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.17.4 Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
2.18 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
2.19 STM8L1xx devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
2.19.1 Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
2.19.2 Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
2.19.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
2.19.4 Memory footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
2.19.5 MCU resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
2.19.6 STM8L available touch-sensing channels . . . . . . . . . . . . . . . . . . . . . . . 53
2.19.7 Hardware implementation example . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

4/124 UM1606 Rev 6

UM1606 Contents

2.20 STM8TL5x devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

2.20.1 Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
2.20.2 Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
2.20.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
2.20.4 Memory footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
2.20.5 Acquisition timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
2.20.6 MCU resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
2.20.7 STM8TL5x available touch-sensing channels . . . . . . . . . . . . . . . . . . . . 67
2.20.8 Hardware implementation example . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
2.21 STM32F0xx devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
2.21.1 Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
2.21.2 Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
2.21.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
2.21.4 Memory footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
2.21.5 MCU resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
2.21.6 STM32F0xx available touch-sensing channels . . . . . . . . . . . . . . . . . . . 73
2.21.7 Hardware implementation example . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
2.22 STM32F3xx devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.22.1 Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.22.2 Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.22.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.22.4 Memory footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
2.22.5 MCU resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
2.22.6 STM32F3xx available touch-sensing channels . . . . . . . . . . . . . . . . . . . 81
2.22.7 Hardware implementation example . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
2.23 STM32L1xx devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
2.23.1 Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
2.23.2 Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
2.23.3 Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
2.23.4 Memory footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
2.23.5 MCU resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
2.23.6 STM32L1xx available touch-sensing channels . . . . . . . . . . . . . . . . . . . 92
2.23.7 Hardware implementation example . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

3 Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

3.1 Create your application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
3.1.1 Toolchain compiler preprocessor section . . . . . . . . . . . . . . . . . . . . . . . 113

UM1606 Rev 6 5/124

6
Contents UM1606

3.1.2 The tsl_conf file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

3.1.3 The main file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
3.1.4 The tsl_user file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
3.2 Debug with STM Studio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115
3.3 Low-power strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
3.4 Main differences with previous library . . . . . . . . . . . . . . . . . . . . . . . . . . .117
3.4.1 Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
3.4.2 Channels, banks and sensors configuration . . . . . . . . . . . . . . . . . . . . 117
3.4.3 Parameters configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
3.4.4 Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
3.4.5 Variables monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
3.5 Tips and tricks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
3.5.1 Bank definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
3.5.2 Channel assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
3.5.3 IO Default state parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

4 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

6/124 UM1606 Rev 6

UM1606 List of tables

List of tables

Table 1. Terms and Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 2. MISRA-C 2004 rules not followed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 3. Supported linear and rotary sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 4. Detailed sensors states 1/2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 5. Detailed sensors states 2/2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 6. STM8L101 memory footprint with software acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 7. STM8L15x memory footprint with hardware acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 8. STM8L15x memory footprint with software acquisition. . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 9. MCU resources used on STM8L1xx with hardware acquisition . . . . . . . . . . . . . . . . . . . . . 53
Table 10. MCU resources used on STM8L1xx with software acquisition . . . . . . . . . . . . . . . . . . . . . . 53
Table 11. Available touch-sensing channels for STM8L101. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 12. Available touch-sensing channels for STM8L15x / STM8L16x (table 1/2) . . . . . . . . . . . . . 55
Table 13. Available touch-sensing channels for STM8L15x / STM8L16x (table 2/2) . . . . . . . . . . . . . 57
Table 14. STM8TL5x memory footprint without proximity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 15. STM8TL5x memory footprint with proximity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 16. STM8TL5x acquisition timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 17. STM8TL5x MCU resources used . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 18. Available touch-sensing channels for STM8TL5x. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 19. STM32F0xx memory footprint without proximity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 20. STM32F0xx memory footprint with proximity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 21. STM32F0xx MCU resources used . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 22. Available touch sensing channels for STM32F042. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Table 23. Available touch sensing channels for STM32F051 and STM32F072 . . . . . . . . . . . . . . . . . 76
Table 24. STM32F30x memory footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 25. STM32F37x memory footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 26. STM32F3xx MCU resources used . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 27. Available touch sensing channels for STM32F30x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 28. Available touch sensing channels for STM32F37x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Table 29. STM32L1xx_HD memory footprint without proximity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 30. STM32L1xx_HD memory footprint with proximity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 31. STM32L1xx_MDP memory footprint without proximity . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 32. STM32L1xx_MDP memory footprint with proximity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 33. STM32L1xx_MD memory footprint without proximity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 34. STM32L1xx_MD memory footprint with proximity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 35. MCU resources used on STM32L1xx with hardware acquisition . . . . . . . . . . . . . . . . . . . . 92
Table 36. MCU resources used on STM32L1xx with software acquisition . . . . . . . . . . . . . . . . . . . . . 92
Table 37. Available touch sensing channels for STM32L1xx 512K . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Table 38. Available touch sensing channels for STM32L1xx 384K . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Table 39. Available touch sensing channels for STM32L1xx 256K (table 1/2). . . . . . . . . . . . . . . . . 101
Table 40. Available touch sensing channels for STM32L1xx 256K (table 2/2). . . . . . . . . . . . . . . . . 105
Table 41. Available touch sensing channels for STM32L15x 32K to 128K . . . . . . . . . . . . . . . . . . . 108
Table 42. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

UM1606 Rev 6 7/124

7
List of figures UM1606

List of figures

Figure 1. Installation folder 1/2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 2. Installation folder 2/2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 3. STMTouch driver architecture overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 4. STMTouch driver detailed layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 5. Acquisition and processing layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 6. Header files inclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7. Channels arrangement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 8. Electrodes designs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 9. Positions 0 and 255 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 10. Main state machine. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 11. Example of main state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 12. Simplified sensors state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 13. DXS principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 14. DXS example 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 15. DXS example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 16. STM8L101 hardware implementation example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Figure 17. Simplified acquisition sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure 18. STM8TL5x hardware implementation example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Figure 19. STM32F0xx hardware implementation example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Figure 20. STM32F3xx hardware implementation example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure 21. STM32L1xx hardware implementation example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Figure 22. STM Studio snapshot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Figure 23. Low_power strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Figure 24. Debug of TSL_ChannelData_T structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Figure 25. Debug of TSL_TouchKeyData_T structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Figure 26. Debug of TSL_LinRotData_T structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Figure 27. Debug of TSL_TouchKeyParam_T. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Figure 28. Debug of TSL_LinRotParam_T structures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

8/124 UM1606 Rev 6

UM1606 Coding rules and conventions

1 Coding rules and conventions

1.1 Glossary
The table below summarizes all the terms and acronyms used inside this user manual.

Table 1. Terms and Acronyms

Name Definition

Bank A group of channels acquired simultaneously

Channel Elementary acquisition item
Cs Charge-Transfer sampling capacitor or capacitance
Ct Equivalent touch capacitance
CT Charge-Transfer acquisition principle
Cx Equivalent sensor capacitance
Delta Difference between the Measure and the Reference (for PXS acquisition)
DTO Detection Time Out
DXS Detection Exclusion System
ECS Environment Change System
Linear sensor Multi-channels sensor with the electrodes positioned in a linear way
LinRot sensor A linear or rotary touch sensor
Measure or Meas Current signal measured on a channel
PXS ProxSense acquisition peripheral used in STM8TL5x devices
Measure of reference initialized during calibration and then regularly updated by
Reference or Ref
the ECS
Rotary Multi-channels sensor with the electrodes positioned in a circular way
Rs ESD protection serial resistor
Sensor or Object Any touch sensor (touchkey, linear, rotary,...)
Acquisition using two timers and PWM signals. Also called hardware acquisition
Timer acquisition mode.
mode
Available on STM32L1xx devices
Touchkey or TKey
Single channel sensor
sensor
Zone An ordered set of banks

UM1606 Rev 6 9/124

123
Coding rules and conventions UM1606

1.2 Naming conventions

The following naming conventions are used in the STMTouch driver source files:
• Source and header files are in lower-case and preceded by 'tsl' or 'tsl_'.
• The microcontroller family is added at the end of the file name if needed.
• Functions, globals, typedefs and defines are preceded by 'TSL'.
• Constants are written in upper case and preceded by 'TSLPRM_'.
• Constants used in one file are defined within this file only.
• Constants used in more than one file are defined in a header file.
• Typedef names are suffixed with '_T'.
• Enum typedefs are suffixed with '_enum_T'.
• Functions are preceded 'TSL_[module]_[function]'.
– [module]: abbreviation of the file (acq, tim, dxs, etc...)
– [function]: the first letter in each word is in upper case

1.3 Coding rules

This section describes the coding rules used in the STMTouch driver source files.

1.3.1 General
• Source code complies with ANSI C standard.
• No warning after compilation. Any warnings that cannot be eliminated are commented
in the source code.
• ANSI standard data types are used and defined in the ANSI C header file <stdint.h>.
• No blocking code is present and all required waiting loops (polling loops) are controlled
by a timeout.

1.3.2 Variable types

Specific variable types are already defined with a fixed type and size.
• The types that are used by all modules are defined in the tsl_types.h file.
• Other variable types are defined in their corresponding module header file.

1.3.3 Peripheral registers

The peripheral registers are accessed using the pointers described in the standard
peripherals library mapping file.

1.4 Run-time checking

The STMTouch driver implements run-time failure detection by checking the functions input
parameters. The run-time checking is achieved using the assert_param macro defined in
the standard peripherals library configuration file. It is enabled when the preprocessor
constant USE_FULL_ASSERT is defined.

10/124 UM1606 Rev 6

UM1606 Coding rules and conventions

Because of the overhead it introduces, it is recommended to use run-time checking during

application code development and debugging, and to remove it from the final application to
improve code size and speed.
However if you want to keep this functionality in your final application, reuse the
assert_param macro defined in the standard peripherals library to test the parameter values
before calling the STMTouch driver functions.
Please see the standard peripherals library user manual for more informations.

1.5 MISRA-C 2004 compliance

1.5.1 Generalities
The C programming language is growing in importance for embedded systems. However,
when it comes to developing code for safety-critical applications, this language has many
drawbacks. There are several unspecified, implementation-defined, and undefined aspects
of the C language that make it unsuited for developing safety-critical systems.
The motor industry software reliability association's guidelines for the use of the C language
in critical systems (MISRA-C 2004 [1]) describe a subset of the C language well suited for
developing safety-critical systems.
The STMTouch driver has been developed to be MISRA-C 2004 compliant.
The following section describes how the STMTouch driver complies with MISRA-C 2004 (as
described in section 4.4 Claiming compliance of the standard [1]):
• A compliance matrix has been completed which shows how compliance has been
enforced.
• The whole STMTouch driver source code is compliant with MISRA-C 2004 rules.
• Deviations are documented. A list of all instances of rules not being followed is being
maintained, and for each instance there is an appropriately signed-off deviation.
• All the issues listed in section 4.2 “The programming language and coding context of
the standard” [1], that need to be checked during the firmware development phase,
have been addressed during the development of the STMTouch driver and appropriate
measures have been taken.

1.5.2 Compliance matrix

The compliance of the STMTouch driver with MISRA-C 2004 has been checked in two
ways:
• using PC-lint tool for C/C++ (NT) vers. 8.00v, copyright gimpel software 1985-2006
• performing regular code reviews.
The following table lists the MISRA-C 2004 rules that are frequently violated in the code:

UM1606 Rev 6 11/124

123
Coding rules and conventions UM1606

Table 2. MISRA-C 2004 rules not followed

MISRA-C 2004 Required/
Summary Reason of deviance
rule number advisory

1.1 Compilers extensions are enabled.

All code shall conform to ISO 9899:1990
Required Comments starting with “//” symbol
1.2 standard C, with no extensions permitted.
for code readability.
Due to the usage of objects
5.4 Required A tag name shall be a unique identifier.
methods.
No prototype seen. Functions shall always
This rule is violated as there is no
have prototype declarations and the
8.1 Required functions prototypes for the objects
prototype shall be visible at both the
methods.
function definition.
The value of an expression of
10.1
Required integer/floating type shall not be implicitly Code complexity
10.2 converted to a different underlying type.
The value of a complex expression of
integer type may only be cast to a type that
10.3 Required Code complexity
is narrower and of the same signedness as
the underlying type of the expression.
If the bitwise operators are applied to an
operand of underlying type unsigned char
Use shift on signed quantity for the
10.5 Required or unsigned short, the result shall be
linear/rotary position
immediately cast to the underlying type of
the operand.
A cast should not be performed between a Needed when addressing memory
11.3 Advisory
pointer type and an integral type. mapped registers.
Bitwise operators shall not be applied to
12.7 Required Shift of signed value needed
operands whose underlying type is signed.
Before preprocessing, a null statement shall Usage of macros to simplify the
14.3 Required
only occur on a line by itself. code
Used to optimize the code speed
14.5 Required The continue statement shall not be used.
execution.
All macro identifiers in preprocessor
directives shall be defined before use, All parameters are checked in the
19.11 Required
except in ifdef and ifndef preprocessor check_config files
directives and the defined() operator.

12/124 UM1606 Rev 6

UM1606 STMTouch driver

2 STMTouch driver

2.1 Supported devices and development tools

2.1.1 Supported devices

This STMTouch driver version supports the following devices and acquisition modes:
• Support of STM8L1xx devices
– Surface charge-transfer acquisition principle managed by:
– Two timers + routing interface (hardware acquisition mode, supported only by
STM8L15x low-density devices)
– GPIOs + routing interface (software acquisition mode, supported by all STM8L
devices)
– Up to 6 channels with up to 2 channels acquired simultaneously for the STM8L101
devices (see Table 11 for more details)
– Up to 20 channels with up to 8 channels acquired simultaneously for the
STM8L15x/16x devices (see Table 12 and Table 13 for more details)
• STM8TL5x devices using the embedded ProxSense™ patented acquisition
technology.
– Projected ProxSense™ acquisition principle
– Up to 300 channels
– Up to 10 channels can be acquired simultaneously (see Table 18 for more details)
– Integrated sampling capacitor
– Electrode parasitic capacitance compensation (EPCC)
– On-chip integrated voltage regulator
• Support of STM32L1xx devices
– Surface charge-transfer acquisition principle managed by:
– Two timers + routing interface (hardware acquisition mode). This mode is not
supported on Medium-density devices.
– GPIOs + routing interface (software acquisition mode). This mode is supported by
all devices.
– Up to 34 channels
– Up to 11 channels can be acquired simultaneously (see Table 37, Table 38,
Table 39, Table 40 and Table 41 for more details)
• STM32F0xx and STM32F3xx devices using the embedded touch sensing controller IP
(TSC).
– Surface charge-transfer acquisition principle managed by the touch sensing
controller
– Up to 24 channels
– Up to 8 channels can be acquired simultaneously (see Table 22, Table 23,
Table 27 and Table 28 for more details)
– Spread spectrum feature
– Programmable charge transfer frequency and max count value

UM1606 Rev 6 13/124

123
STMTouch driver UM1606

2.1.2 Development tools

The STM8 and STM32 microcontrollers are supported by a full range of development
solutions from lead suppliers that deliver start-to-finish control of application development
from a single integrated development environment. The STM8 are based on proprietary
code and STM32 microcontrollers are based on Arm®(a) code.
The STMTouch driver has been developed with the following toolchains and compilers:
• STVD (STMicroelectronics) + Raisonance and Cosmic compilers
• EWSTM8 and EWArm (IAR™)
• MDK-Arm (Keil®)
• Tasking (Altium®)
• TrueSTUDIO®-C (Atollic®)
• Ride7 / RKit-Arm (Raisonance)
For more details about the compilers versions used, please see the STMTouch driver
release note (present in the STMTouch Library installation folder).

2.2 Package description

The STMTouch driver is not supplied by itself. It is delivered instead inside each device
STMTouch library (STMTouch_Driver folder present in the Libraries folder).
The following snapshots show an example of installation.

Figure 1. Installation folder 1/2

a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere

14/124 UM1606 Rev 6

UM1606 STMTouch driver

Figure 2. Installation folder 2/2

2.3 Main features

• Environment Change System (ECS)
• Detection Time Out (DTO)
• Detection Exclusion System (DXS)
• Noise filter
• Supports proximity, touchkeys and linear touch sensors
• Unlimited number of sensors
• Modular architecture allowing easy addition of new acquisitions or sensors
• Each sensor can have its own state machine
• Simplified timing management
• Run-time checking of functions parameters
• Management of error during acquisition

UM1606 Rev 6 15/124

123
STMTouch driver UM1606

2.4 Architecture

2.4.1 Overview
The following figure shows the interactions between the STMTouch driver and the other
firmware layers.

Figure 3. STMTouch driver architecture overview

$SSOLFDWLRQ 8VHUDSSOLFDWLRQVH[DPSOHV
OD\HU

6707RXFKGULYHU
+DUGZDUH
DEVWUDFWLRQOD\HU
+$/

6WDQGDUGSHULSKHUDOVOLEUDU\

+DUGZDUH
0&8
OD\HU
06Y9

The HAL is the hardware abstraction layer (HAL) which controls the device itself through
hardware registers.
It is composed of different components:
• The STMTouch driver
• The standard peripherals library
• The CMSIS firmware (for STM32 devices only)
• Utilities and third-parties firmwares
Note: The STMTouch driver can access directly to the MCU hardware registers using the map file
provided by the standard peripherals library.

2.4.2 STMTouch driver layers

The following figure shows a more detailed view of the different STMTouch driver layers.
0

16/124 UM1606 Rev 6

UM1606 STMTouch driver

Figure 4. STMTouch driver detailed layers

$SSOLFDWLRQ 6707RXFKGULYHU
OD\HU 8VHUDSSOLFDWLRQ
FRQILJXUDWLRQ

'72 ';6 7LPLQJ

3URFHVVLQJ
OD\HU
(&6 )LOWHUV 

6707RXFK
GULYHU
7RXFKNH\ /LQHDUDQG

VHQVRU URWDU\VHQVRUV

$FTXLVLWLRQ $F
$FTXLVLWLRQ
FT$FTXLVLWLRQ
XLVLWLRQ $FTXLVLWLRQ

OD\HU 0&8
0
0&80&8
 0&8

6WDQGDUGSHULSKHUDOV
OLEUDU\
06Y9

The STMTouch driver is composed of three main layers:

• The acquisition layer
• The processing layer
• The configuration layer
The configuration layer corresponds to what the user needs to write in its application code in
order to use correctly the STMTouch driver. This includes all the channels and sensors
declaration, the parameters, etc...
The acquisition and processing layers are described more in detail below.

2.4.3 Acquisition and processing layers

The following figure details the acquisition and processing layers and the different elements
used in each layer.

UM1606 Rev 6 17/124

123
STMTouch driver UM1606

Figure 5. Acquisition and processing layers

$FTXLVLWLRQ FKDQQHO EDQN ]RQH

OD\HU

&KDQQHO
GDWDOD\HU

VHQVRUV
(&6
';6
3URFHVVLQJ WRXFKNH\ OLQHDUURWDU\ '72
OD\HU )LOWHUV
7LPLQJ


06Y9

The acquisition layer role is to perform the acquisition of the different channels. The result
of the acquisition (measure and flags) is stored inside the channel data layer. These
informations will be accessed by the processing layer.
The acquisition layer has only access to the channel, bank and zone elements. It does not
have access to the sensor elements.

The channel data layer role is to share information between the acquisition and processing
layers. It stores the result of the acquisition (measure) for each channel and store different
informations coming from the processing layer (reference, delta, flags, etc...).
Located in RAM, the ChannelData structure is the only interface between the acquisition
and processing layers.

This processing layer consists in executing each sensors state machine, executing the
different data processing like ECS, DXS, DTO and storing any useful information for the
acquisition layer inside the channel data area.
The processing layer does not have direct access to the channels, banks and zones. This
access is made through the sensors.

18/124 UM1606 Rev 6

UM1606 STMTouch driver

2.4.4 Header files inclusion

The figure below provides a global view of the STMTouch driver usage and the interaction
between the different header files.
Note: To simplify the drawing, only the most important links are shown. For example the
tsl_globals.h file is also included in different files.

Figure 6. Header files inclusion

$SSOLFDWLRQ
PDLQK WVOBFRQIBPFX!K
OD\HU

WVOBILOWHUK

WVOBHFVK

WVOBG[VK WVOBFKHFNBFRQILJK WVOBFKHFNBFRQILJBPFX!K

WVOBREMHFWK

6707RXFK
WVOK WVOBWRXFKNH\K
GULYHU

WVOBOLQURWK

WVOBDFTK WVOBDFTBPFX!K
WVOBW\SHVK
WVOBWLPHK WVOBWLPHBPFX!K

WVOBJOREDOVK

6WDQGDUG
SHULSKHUDO PFX!KPDSSLQJILOH
OLEUDU\
06Y9

2.5 Channel

2.5.1 Principle
A channel is the basic element that is used to store several information like:
• where the source measurement can be found after the acquisition is performed (i.e. RX
registers for STM8TL5x devices or TSC_IOGxCR registers for
STM32F0xx/STM32F3xx devices)
• where are stored the measure, the reference, the delta, flags etc...

UM1606 Rev 6 19/124

123
STMTouch driver UM1606

2.5.2 Resources
A channel is defined by 3 data structures:
• TSL_ChannelSrc_T: contains all information about the source measurement (index of
the register containing the measurement, masks,...)
• TSL_ChannelDest_T: contains all information about the measurement destination
(index in the channel data array).
• TSL_ChannelData_T: contains all data for the channel (measure, delta, reference, ...)
The channel depends on the acquisition technology. This is why the contents of this
structures are not common for all acquisitions. They are declared in each acquisition header
files (tsl_acq_<mcu>.h):
• tsl_acq_stm8l_hw.h for STM8L devices using hardware acquisition mode
• tsl_acq_stm8l_sw.h for STM8L devices using software acquisition mode
• tsl_acq_stm8tl5x.h for STM8TL5x devices
• tsl_acq_stm32l1xx_hw.h for STM32L1xx devices using the hardware acquisition
mode
• tsl_acq_stm32l1xx_sw.h for STM32L1xx devices using the software acquisition mode
• tsl_acq_stm32f0xx.h for STM32F0xx devices
• tsl_acq_stm32f3xx.h for STM32F3xx devices
The maximum number of channels is only limited by the device (memory size and channels
supported).
The user must declare all the channels array in its application code. It can be done directly
in the main.c file or in any other file.

2.5.3 Parameters
• TSLPRM_TOTAL_CHANNELS

2.5.4 Usage example

The 3 channels structures must be declared in the application code.
Example of channel source array declaration for STM32F0xx devices. This structure must
always be placed in ROM.
const TSL_ChannelSrc_T MyChannels_Src[TSLPRM_TOTAL_CHANNELS] =
{ { CHANNEL_0_SRC },
{ CHANNEL_1_SRC },
{ CHANNEL_2_SRC }};

Example of channel destination array declaration for STM32F0xx devices. This structure
must always be placed in ROM.
const TSL_ChannelDest_T MyChannels_Dest[TSLPRM_TOTAL_CHANNELS] =
{ { CHANNEL_0_DEST },
{ CHANNEL_1_DEST },
{ CHANNEL_2_DEST }};

20/124 UM1606 Rev 6

UM1606 STMTouch driver

Note: The "CHANNEL_x_SRC" and "CHANNEL_x_DEST" are "#define" constants and are used
for readability. The values are acquisition dependant.

Example of channel data array declaration (i.e. channel data layer). This structure must
always be placed in RAM.
TSL_ChannelData_T MyChannels_Data[TSLPRM_TOTAL_CHANNELS];

Warning: When several banks are present, it is mandatory to declare all

channels of each bank consecutively in the source and
destination structures.

Example:

Figure 7. Channels arrangement

%DQN %DQN

&KDQQHO
GDWDOD\HU &+ &+ &+ &+ &+ &+ &+

06Y9

Example of channel source array declaration for STM32F0xx devices.

CONST TSL_ChannelSrc_T MyChannels_Src[TSLPRM_TOTAL_CHANNELS] =
{
// Bank 1
{ CHANNEL_0_SRC, CHANNEL_0_IO_MSK, CHANNEL_0_GRP_MSK },
{ CHANNEL_1_SRC, CHANNEL_1_IO_MSK, CHANNEL_1_GRP_MSK },
{ CHANNEL_2_SRC, CHANNEL_2_IO_MSK, CHANNEL_2_GRP_MSK },
{ CHANNEL_3_SRC, CHANNEL_3_IO_MSK, CHANNEL_3_GRP_MSK },
// Bank 2
{ CHANNEL_4_SRC, CHANNEL_4_IO_MSK, CHANNEL_4_GRP_MSK },
{ CHANNEL_5_SRC, CHANNEL_5_IO_MSK, CHANNEL_5_GRP_MSK },
{ CHANNEL_6_SRC, CHANNEL_6_IO_MSK, CHANNEL_6_GRP_MSK }
};

2.6 Bank

2.6.1 Principle
A bank is a group of channels that are acquired simultaneously. The number of channels in
the bank is variable.

UM1606 Rev 6 21/124

123
STMTouch driver UM1606

2.6.2 Resources
The bank data are held by only one structure:
• TSL_Bank_T
• The bank depends also on the acquisition technology. These structures are declared in
each acquisition header files (tsl_acq_<mcu>.h):
The maximum number of banks is only limited by the device.
The user must declare all the banks array in its application code. It can be done directly in
the main.c file or in any other file.
The banks are used mainly by the functions described below. Some functions are common
whatever the device and acquisition technology. Some others are dependent on the device.
Common functions:
• TSL_acq_BankGetResult()
• TSL_acq_BankCalibrate()
Device dependent functions:
• TSL_acq_BankConfig()
• TSL_acq_BankStartAcq()
• TSL_acq_BankWaitEOC()

2.6.3 Parameters
• TSLPRM_TOTAL_BANKS

2.6.4 Usage example

Example of 2 banks declaration for STM8TL5x devices:
// Always placed in ROM
const TSL_Bank_T MyBanks[TSLPRM_TOTAL_BANKS] =
{
// Bank 0
&MyChannels_Src[0],
&MyChannels_Dest[0],
MyChannels_Data,
BANK_0_NBCHANNELS,
// For STM8TL5x acquisition only
BANK_0_MSK_CHANNELS,
BIT_MASK_TX(BANK_0_TX),
BANK_0_GROUP,
#if (BANK_0_MSK_TX < 0x8000) // a TX pin is used as transmitter
BANK_0_MSK_CHANNELS,
#else // a RX pin is used as transmitter
(BIT_MASK_RX(BANK_0_TX)| BANK_0_MSK_CHANNELS),
#endif

// Bank 1

22/124 UM1606 Rev 6

UM1606 STMTouch driver

&MyChannels_Src[4],
&MyChannels_Dest[4],
MyChannels_Data,
BANK_1_NBCHANNELS,
// For STM8TL5x acquisition only
BANK_1_MSK_CHANNELS,
BIT_MASK_TX(BANK_1_TX),
BANK_1_GROUP,
#if (BANK_1_MSK_TX < 0x8000) // a TX pin is used as transmitter
BANK_1_MSK_CHANNELS,
#else // a RX pin is used as transmitter
(BIT_MASK_RX(BANK_1_TX)| BANK_1_MSK_CHANNELS),
#endif
};
The "BANK_x_NBCHANNELS", "BANK_x_MSK_CHANNELS", "BIT_x_MASK_TX", etc...
are defines and are used for readability. These values are for STM8TL5x devices acquisition
only.

Example of 3 banks declaration for STM32F0xx devices:

CONST TSL_Bank_T MyBanks[TSLPRM_TOTAL_BANKS] = {
{&MyChannels_Src[0], &MyChannels_Dest[0], MyChannels_Data,
BANK_0_NBCHANNELS, BANK_0_MSK_CHANNELS, BANK_0_MSK_GROUPS},
{&MyChannels_Src[1], &MyChannels_Dest[1], MyChannels_Data,
BANK_1_NBCHANNELS, BANK_1_MSK_CHANNELS, BANK_1_MSK_GROUPS},
{&MyChannels_Src[2], &MyChannels_Dest[2], MyChannels_Data,
BANK_2_NBCHANNELS, BANK_2_MSK_CHANNELS, BANK_2_MSK_GROUPS}
};

2.7 Zone

2.7.1 Principle
A zone is an ordered group of banks. It is used to easily cascade the acquisition of many
banks. The acquisition of the next bank in a zone is launched directly in the interrupt routine
managing the acquisition result of the current acquired bank.

2.7.2 Resources
This feature is optional and is enabled/disabled using the TSLPRM_USE_ZONE parameter.
The zone data are held by only one structure:
• TSL_Zone_T
The zones are used mainly by the function:
• TSL_acq_ZoneConfig()

UM1606 Rev 6 23/124

123
STMTouch driver UM1606

2.7.3 Parameters
• TSLPRM_USE_ZONE

2.7.4 Usage example

Example of a zone declaration containing 3 banks:
TSL_tIndex_T MyBankSorting[TSLPRM_TOTAL_BANKS] = {2, 0, 1, 3, 4, 5};
TSL_Zone_T MyZone = {
MyBankSorting,
0,
3 // Number of Banks in the Zone
};
In this example the "MyBankSorting" array contains the list of the banks indexes to acquire.
And only the 3 first Banks will be acquired (indexes 2, 0 and 1).

2.8 Objects

2.8.1 Principle
The term “object” or “sensor” stands for any sensors type (touchkeys, linear and rotary
touch sensors, etc...) supported by the STMTouch driver.

2.8.2 Resources
All processing that affect the sensors in general are defined in:
• tsl_object.c
• tsl_object.h
The functions are:
• TSL_obj_GroupInit()
• TSL_obj_GroupProcess()
• TSL_obj_SetGlobalObj()
A sensor is described by the structures:
• TSL_Object_T
• TSL_ObjectGroup_T

2.8.3 Parameters
• TSLPRM_TOTAL_OBJECTS

2.8.4 Usage example

First, all touchkeys, linear and rotary touch sensors (described after) used in the application
must be described first as 'generic' sensor or object.
Example:
// Mix of touchkeys and Linear touch sensors

24/124 UM1606 Rev 6

UM1606 STMTouch driver

const TSL_Object_T MyObjects[TSLPRM_TOTAL_OBJECTS] =

{
// TKeys
{ TSL_OBJ_TOUCHKEYB, (TSL_TouchKeyB_T *)&MyTKeys[0] },
{ TSL_OBJ_TOUCHKEYB, (TSL_TouchKeyB_T *)&MyTKeys[1] },
// Linear touch sensors
{ TSL_OBJ_LINEARB, (TSL_LinRotB_T *)&MyLinRots[0] }
};
These objects must be placed in ROM memory.
Once this done, it is necessary to create at least one group of sensors. These groups will be
used by the different processing routines (ECS, DXS, etc...).
These groups of objects must placed in RAM.
Example:
TSL_ObjectGroup_T MyObjGroup_All = {
MyObjects,
3,
0,
TSL_STATE_NOT_CHANGED
};
Then, all the sensors must be initialized and “processed”. This is done in the main function
of the application:
int main(void) {
...
TSL_obj_GroupInit(&MyObjGroup_All);
...
while (1) {
...
TSL_obj_GroupProcess(&MyObjGroup_All);
...
}
}

2.9 Touchkey sensor

2.9.1 Principle
The touchkey sensor is composed of only one channel. It acts as a simple “button” with two
states RELEASE and DETECT (or TOUCH if DXS is enabled).

2.9.2 Resources
All the functions related to this sensor are described in the files:
• tsl_touchkey.c
• tsl_touchkey.h

UM1606 Rev 6 25/124

123
STMTouch driver UM1606

Two types of touchkey sensor are available:

• Basic: defined by the TSL_TouchKeyB_T structure
• Extended: defined by the TSL_TouchKey_T structure
Two functions (called methods) are used to initialized the sensor parameters and to run the
sensor state machine:
• TSL_tkey_Init()
• TSL_tkey_Process()
The difference between the “basic” and “extended” concerns the usage of the methods and
sensor state machine.
For the “basic” sensor, the methods and state machine are those used in the TSL_Params
structure.
For the “extended” sensor, the methods and state machine are those declared in their own
structure.

2.9.3 Parameters
• TSLPRM_TOTAL_TKEYS

2.9.4 Usage example

The user must declared these methods in the application code.
Note: One can also use its own initialization and process functions instead:
const TSL_TouchKeyMethods_T MyTKeys_Methods =
{
TSL_tkey_Init,
TSL_tkey_Process
};
The declaration of the touchkey sensor is done by the user in the application code:
Example with “basic” sensor:
// "Basic" touchkeys: Always placed in ROM
const TSL_TouchKeyB_T MyTKeys[TSLPRM_TOTAL_TKEYS] =
{
{ &MyTKeys_Data[0], &MyTKeys_Param[0], &MyChannels_Data[0] },
{ &MyTKeys_Data[1], &MyTKeys_Param[1], &MyChannels_Data[1] },
{ &MyTKeys_Data[2], &MyTKeys_Param[2], &MyChannels_Data[2] }
};
Example with “extended” sensor:
// "Extended" TouchKeys: Always placed in ROM
const TSL_TouchKey_T MyTKeys[TSLPRM_TOTAL_TKEYS] =
{
{ &MyTKeys_Data[0], &MyTKeys_Param[0], &MyChannels_Data[0],
MyTKeys_StateMachine, &MyTKeys_Methods },
{ &MyTKeys_Data[1], &MyTKeys_Param[1], &MyChannels_Data[1],
MyTKeys_StateMachine, &MyTKeys_Methods },

26/124 UM1606 Rev 6

UM1606 STMTouch driver

{ &MyTKeys_Data[2], &MyTKeys_Param[2], &MyChannels_Data[2],

MyTKeys_StateMachine, &MyTKeys_Methods }
};

2.10 Linear and rotary sensors

2.10.1 Principle
The linear and rotary sensors are like a touchkey sensor except that they are composed of a
variable number of channels. The difference between the linear and rotary touch sensors is
how the electrodes are organized together.
The linear and rotary sensors have additional fields in their structure compared to touchkey
sensors:
• Number of channels
• Delta coefficient table
• Position offset table
• Sector computation parameter
• Position correction parameter for linear sensor
The last 3 fields are used to calculate the position.

2.10.2 Number of channels

Only 1, 3, 4, 5 and 6 channels are supported today by the STMTouch driver. Additional
number of channels can be added by the end-user. See the Position offset table bullet
below for more detail.
Note: A Linear sensor with 1 channel is equivalent to one touchkey sensor. When an application
uses both touchkey sensor and linear and rotary sensor, it is better to use touchkeys with a
1-channel linear touch sensor. In this case the gain in memory size is important as the
touchkey sensor state machine is not used.
For optimum performance of a linear or rotary sensor, all channels of such a sensor must be
acquired simultaneously.Therefore all channels must belong to the same bank, which
means the I/Os must be selected from different analog I/O groups. Please refer to datasheet
for more information regarding I/O groups and available capacitive sensing GPIOs.

2.10.3 Delta coefficient table

The delta coefficient table is used to adjust each channel of the linear and rotary sensors.
Each value is a 16-bit integer. The MSB is the integer part, the LSB is the real part.
Examples:
To apply a factor of 1.10:
• MSB equal 0x01
• LSB equal 0x1A (0.10 x 256 = 25.6 -> rounded to 26 = 0x1A)
To apply a factor 1.00:
• MSB equal 0x01
• LSB equal 0x00

UM1606 Rev 6 27/124

123
STMTouch driver UM1606

To apply a factor 0.90:

• MSB equal 0x00
• LSB equal 0xE6 (0.90 x 256 = 230.4 -> rounded to 230 = 0xE6)
This results in the following delta coefficient table:
CONST uint16_t MyLinRot0_DeltaCoeff[3] = {0x011A, 0x0100, 0x00E6};
The number of delta coefficient table is not limited. The same delta coefficient table can be
shared by several linear and rotary sensors.

2.10.4 Electrodes placement

The placement (design) of the electrodes can be done in three different manners:
1. Mono electrode design
The number of electrodes is equivalent to the number of channels. This design is used
for linear and rotary sensors.
Abbreviations: LIN_M1, LIN_M2 and ROT_M
Examples:
– CH1 CH2 CH3
– CH1 CH2 CH3 CH4
– CH1 CH2 CH3 CH4 CH5
2. Dual electrode design
All the electrodes are duplicated and interlaced together in order to increase the touch
area.
This design is used for linear and rotary sensors composed with at least 5 channels.
Abbreviation: ROT_D
Examples with 5 channels:
– CH1 CH2 CH3 CH4 CH5 CH1 CH3 CH5 CH2 CH4
– CH1 CH2 CH3 CH4 CH5 CH2 CH4 CH1 CH3 CH5
– CH1 CH2 CH3 CH4 CH5 CH3 CH1 CH4 CH2 CH5
3. Half-ended electrode design
The first electrode is duplicated and the replica is placed at the end. The size of the first
and last electrode is half the size of the other electrodes. This design is used for linear
sensors only. The 0 and 255 positions are obtained more easily compared to the
Mono electrodes design.
Abbreviation: LIN_H
Examples:
– ch1 CH2 CH3 ch1
– ch1 CH2 CH3 CH4 ch1
– ch1 CH2 CH3 CH4 CH5 ch1
The following figure summarizes the different electrodes designs we can have on linear and
rotary sensors:

28/124 UM1606 Rev 6

UM1606 STMTouch driver

Figure 8. Electrodes designs

>ŝŶĞĂƌ ZŽƚĂƌLJ

DŽŶŽ >/EͺDϭ ZKdͺD

ĞůĞĐƚƌŽĚĞƐ >/EͺDϮ ,ϭ ,Ϯ ,ϯ
ĚĞƐŝŐŶ

,ĂůĨͲĞŶĚĞĚ >/Eͺ,
ĞůĞĐƚƌŽĚĞƐ
ĚĞƐŝŐŶ ĐŚϭ ,Ϯ ,ϯ ĐŚϭ

ZKdͺ
ƵĂů
ĞůĞĐƚƌŽĚĞƐ Ͳ
ĚĞƐŝŐŶ

06Y9

Positions 0 and 255

Special care must be taken for the 0 and 255 positions on linear sensors. These positions
are placed differently depending on the electrodes design used:
• LIN_M1: the 0 and 255 positions are placed completely at the sensor's extremities.
These positions can be obtain with difficulty if the electrodes are too big or if they are
separated by an important space.
• LIN_M2, LIN_H: the 0 position is placed between the first and second electrodes.
The 255 position is placed between the last two electrodes.
• ROT_M and ROT_D: the 0 and 255 positions are always placed between the first and
the last electrodes.
The following figures summarizes the different placements of the 0 and 255 positions with 4
channels sensors:

UM1606 Rev 6 29/124

123
STMTouch driver UM1606

Figure 9. Positions 0 and 255

   

&+ &+ &+ &+ &+ &+ &+ &+

/,1B0 /,1B0

  

&+ &+
FK &+ &+ &+ FK

&+ &+

/,1B+
/,1B' 527B0
527B' 06Y9

The following table summarizes the different linear and rotary sensors electrodes designs
supported by the STMTouch driver:

Table 3. Supported linear and rotary sensors

Number
LIN_M1 LIN_M2 LIN_H ROT_M ROT_D
of Channels

3 Yes Yes Yes Yes No

4 Yes Yes Yes Yes No
5 Yes Yes Yes Yes Yes
6 Yes Yes Yes Yes No

Each supported electrode design is described by 3 fields in the TSL_LinRot_T or

TSL_LinRotB_T structures:
• Position offset table
• Sector computation parameter
• Position correction parameter for linear sensor
These 3 fields are defined in the tsl_linrot.c and tsl_linrot.h files and follow the naming
convention:
Position offset table: TSL_POSOFF_nCH_[LIN|ROT]_[M1|M2|H|D]

30/124 UM1606 Rev 6

UM1606 STMTouch driver

Sector computation parameter: TSL_SCTCOMP_nCH_[LIN|ROT]_[M1|M2|H|D]

Position correction parameter for linear sensor: TSL_POSCORR_nCH_LIN_[M1|M2|H|D]
With:
• n = number of channels
• LIN = linear sensor
• ROT = rotary sensor
• M1 = mono electrodes design with 0/255 position at extremities
• M2 = mono electrodes design
• H = half-ended electrodes design
• D = dual electrodes design
In order to gain memory space, each table is only compiled if its corresponding parameter is
set in the configuration file:
TSLPRM_USE_nCH_[LIN|ROT]_[M1|M2|H|D]

2.10.5 Resources
All the functions related to this sensor are described in the files:
• tsl_linrot.c
• tsl_linrot.h
Two types of linear and rotary sensor are available:
• basic: defined by the TSL_LinRotB_T structure
• extended: defined by the TSL_LinRot_T structure
The difference between “basic” and “extended” is the same as for the touchkey sensor.
Three functions (called methods) are used to initialized the sensor parameters, run the
sensor state machine and calculate the position.
• TSL_linrot_Init()
• TSL_linrot_Process()
• TSL_linrot_CalcPos()

2.10.6 Parameters
• TSLPRM_TOTAL_LINROTS

2.10.7 Usage example

The user must declared these methods in the application code.
Note: One can also use its own initialization and process functions instead:
CONST TSL_LinRotMethods_T MyLinRots_Methods =
{
TSL_linrot_Init,
TSL_linrot_Process,
TSL_linrot_CalcPos
};

UM1606 Rev 6 31/124

123
STMTouch driver UM1606

The declaration of the linear and rotary sensor is done by the user in the application code in
the same manner as for touchkey sensor.
Example with 2 “basic” linear touch sensors, one with 3 channels half-ended and the other
with 5 channels mono electrodes design:
CONST TSL_LinRotB_T MyLinRots[2] =
{
// LinRot sensor 0
&MyLinRots_Data[0],
&MyLinRots_Param[0],
&MyChannels_Data[CHANNEL_9_DEST],
3, // Number of channels
MyLinRot0_DeltaCoeff, // Delta coefficient table
(TSL_tsignPosition_T *)TSL_POSOFF_3CH_LIN_H, // Position table
TSL_SCTCOMP_3CH_LIN_H, // Sector compensation
TSL_POSCORR_3CH_LIN_H, // Position correction
// LinRot sensor 1
&MyLinRots_Data[1],
&MyLinRots_Param[1],
&MyChannels_Data[CHANNEL_12_DEST],
5, // Number of channels
MyLinRot1_DeltaCoeff, // Delta coefficient table
(TSL_tsignPosition_T *)TSL_POSOFF_5CH_LIN_M2, // Position table
TSL_SCTCOMP_5CH_LIN_M2, // Sector compensation
TSL_POSCORR_5CH_LIN_M2 // Position correction
};
Example of one “extended” (i.e. having its own state machine and methods) linear touch
sensor with 3 channels half-ended:
CONST TSL_LinRot_T MyLinRots[1] =
{
// LinRot sensor 0
&MyLinRots_Data[0],
&MyLinRots_Param[0],
&MyChannels_Data[CHANNEL_0_DEST],
3, // Number of channels
MyLinRot0_DeltaCoeff,
(TSL_tsignPosition_T *)TSL_POSOFF_3CH_LIN_H,
TSL_SCTCOMP_3CH_LIN_H,
TSL_POSCORR_3CH_LIN_H,
MyLinRots_StateMachine, // Specific state machine
&MyLinRots_Methods // Specific methods
};
Example of one “extended” rotary touch sensor with 3 channels mono electrode design:
CONST TSL_LinRot_T MyLinRots[0] =
{

32/124 UM1606 Rev 6

UM1606 STMTouch driver

// LinRot sensor 0
&MyLinRots_Data[0],
&MyLinRots_Param[0],
&MyChannels_Data[CHANNEL_0_DEST],
3, // Number of channels
MyLinRot0_DeltaCoeff,
(TSL_tsignPosition_T *)TSL_POSOFF_3CH_ROT_M,
TSL_SCTCOMP_3CH_ROT_M,
0, // No position correction needed on a Rotary sensor
MyLinRots_StateMachine, // Specific state machine
&MyLinRots_Methods // Specific methods
};

2.11 Main state machine

The main state machine is managed by the user in the application layer. A set of functions
are available to accomplish this task. The main state machine can be defined with polling or
with interrupt modes, using one or several banks. The modularity of the STMTouch driver
allows also the application code to be inserted between acquisition and processing tasks.
Several examples are given below.
The functions to use for the acquisition are:
• TSL_acq_BankConfig()
• TSL_acq_BankStartAcq()
• TSL_acq_BankWaitEOC()
• TSL_acq_BankGetResult()
These functions are device dependent and are described in the tsl_acq_<mcu>.c files.
The functions to use for the processing are:
• TSL_obj_GroupProcess()
• TSL_ecs_Process()
• TSL_dxs_FirstObj()
Other functions that can be used during the processing:
• TSL_tim_CheckDelay_ms()
• TSL_obj_SetGlobalObj()
• TSL_tkey_GetStateId()
• TSL_tkey_GetStateMask()
• TSL_linrot_SetStateOff()
• TSL_linrot_SetStateCalibration()
The main state machine principle is illustrated by the figure below:

UM1606 Rev 6 33/124

123
STMTouch driver UM1606

Figure 10. Main state machine

&KDQQHOVEDQNV]RQHVVHQVRUV
FRQILJXUDWLRQ

%DQNFRQILJXUDWLRQ
%DQNVDQGVHQVRUVLQLWLDOL]DWLRQ

%DQN
VWDUWDFTXLVLWLRQ

%DQNDFTXLVLWLRQ
%DQNZDLWHQG
DFTXLVLWLRQ

6HQVRUVSURFHVVLQJ %DQNJHWUHVXOW

(&6';6

8VHUDSSOLFDWLRQ
06Y9

The main state machine steps are:

1. The channels, banks, zones and sensors configuration step are used to declare all
the different elements. This is done in the global declaration section in the main
application file. See the section associated to each element for more details.
2. The banks and sensors initialization step is used to initialize the STMTouch driver
modules. The sensors parameters are initialized with their default value defined in the
configuration files.
3. The banks acquisition step is used to perform the acquisition of the banks. It is
composed of 4 sub-steps:
– configuration: used to configure all channels of the bank
– start acquisition: used to launch the measurement on all channels of the bank
– wait end acquisition: used to wait the end of acquisition of all channels of the
bank
– get result: used to read all the channels measurements and to store them in the
channel data layer.
4. The sensors processing step is used to execute the state machine of the sensors.

34/124 UM1606 Rev 6

UM1606 STMTouch driver

Note: The debouncing, Detection Time Out and re-calibration are automatically performed inside
this step.
5. The ECS, DXS step is used to execute other algorithms that are not performed in the
sensor state machine like the ECS, DXS, other filters, etc... This step is optional and it
can be executed at certain time intervals (mainly for ECS).
6. The user application step is used to execute the application layer (read the sensors
state, decide which actions to perform, manage ERROR states, etc...). The user
application can also be placed between other steps, for example it can be done
between the “sensors processing” step and the "ECS/DXS".
There are multiple manners to perform the main state machine. The following figures show
some examples with two banks.

Figure 11. Example of main state machine

%DQN

%DQN
%DQN

%DQN

(&6 (&6

';6 ';6

06Y9

2.12 Sensors state machine

2.12.1 Overview
The state machine is managed in the files:
• tsl_touchkey.c and tsl_touchkey.h for the touchkey sensors
• tsl_linrot.c and tsl_linrot.h for the linear and rotary sensors

UM1606 Rev 6 35/124

123
STMTouch driver UM1606

There is a total of 20 states defined in the TSL_StateId_enum_T structure.

The following figure shows the simplified state machine used by any sensor (for clarity not
all the connections between states are shown).

Figure 12. Simplified sensors state machine

GHE
5(/($6(7

GHE
5(/($6('

GHE
5(/($6(3

,QLW

GHE
'(7(&7 ';6
GHE GHE
&$/,% 5(/($6( 352; '(7(&7 728&+
&$/,% 352;

GHE
352;
'(7(&7 GHE
352;
728&+

GHE
(5525 8VHU
GHFLVLRQ

(5525 2))

06Y9

2.12.2 States constant table

Each state ID is associated to a mask and a function. The association STATE_ID-mask-
function is made in the user application code using a constant table of the TSL_State_T
type. The name of this table is free and user can give any name he wants. If no function is
needed simply put a zero instead of the function name.
Here below an example of touchkey sensors state machine:
// Touchkeys state machine
const TSL_State_T MyTKeys_StateMachine[] =
{
//----------------------------------------------------------------------
// ID MASK FUNCTION
//----------------------------------------------------------------------
// Calibration states
/* 0 */ { TSL_STATEMASK_CALIB, TSL_tkey_CalibrationStateProcess },
/* 1 */ { TSL_STATEMASK_DEB_CALIB, TSL_tkey_DebCalibrationStateProcess },
// RELEASE states
/* 2 */ { TSL_STATEMASK_RELEASE, TSL_tkey_ReleaseStateProcess },
#if TSLPRM_USE_PROX > 0

36/124 UM1606 Rev 6

UM1606 STMTouch driver

/* 3 */ { TSL_STATEMASK_DEB_RELEASE_PROX,
TSL_tkey_DebReleaseProxStateProcess },
#else
/* 3 */ { TSL_STATEMASK_DEB_RELEASE_PROX, 0 },
#endif
/* 4 */ { TSL_STATEMASK_DEB_RELEASE_DETECT,
TSL_tkey_DebReleaseDetectStateProcess },
/* 5 */ { TSL_STATEMASK_DEB_RELEASE_TOUCH,
TSL_tkey_DebReleaseTouchStateProcess },
#if TSLPRM_USE_PROX > 0
// Proximity states
/* 6 */ { TSL_STATEMASK_PROX, TSL_tkey_ProxStateProcess },
/* 7 */ { TSL_STATEMASK_DEB_PROX, TSL_tkey_DebProxStateProcess },
/* 8 */ { TSL_STATEMASK_DEB_PROX_DETECT,
TSL_tkey_DebProxDetectStateProcess },
/* 9 */ { TSL_STATEMASK_DEB_PROX_TOUCH,
TSL_tkey_DebProxTouchStateProcess },
#else
/* 6 */ { TSL_STATEMASK_PROX, 0 },
/* 7 */ { TSL_STATEMASK_DEB_PROX, 0 },
/* 8 */ { TSL_STATEMASK_DEB_PROX_DETECT, 0 },
/* 9 */ { TSL_STATEMASK_DEB_PROX_TOUCH, 0 },
#endif
// DETECT states
/* 10 */ { TSL_STATEMASK_DETECT, TSL_tkey_DetectStateProcess },
/* 11 */ { TSL_STATEMASK_DEB_DETECT, TSL_tkey_DebDetectStateProcess
},
// TOUCH state
/* 12 */ { TSL_STATEMASK_TOUCH, TSL_tkey_TouchStateProcess },
// ERROR states
/* 13 */ { TSL_STATEMASK_ERROR, MyTKeys_ErrorStateProcess },
/* 14 */ { TSL_STATEMASK_DEB_ERROR_CALIB, TSL_tkey_DebErrorStateProcess
},
/* 15 */ { TSL_STATEMASK_DEB_ERROR_RELEASE, TSL_tkey_DebErrorStateProcess
},
/* 16 */ { TSL_STATEMASK_DEB_ERROR_PROX, TSL_tkey_DebErrorStateProcess
},
/* 17 */ { TSL_STATEMASK_DEB_ERROR_DETECT, TSL_tkey_DebErrorStateProcess
},
/* 18 */ { TSL_STATEMASK_DEB_ERROR_TOUCH, TSL_tkey_DebErrorStateProcess
},
// Other states
/* 19 */ { TSL_STATEMASK_OFF, MyTKeys_OffStateProcess }
};
The STMTouch driver contains all the functions needed to manage each state. However the
user can copy and adapt one or several functions to fit its application requirements.
Example:

UM1606 Rev 6 37/124

123
STMTouch driver UM1606

/* 0 */ { TSL_STATEMASK_CALIB, MyTkeys_CalibrationStateProcess },
Note: The two functions used to manage the ERROR and OFF states are not part of the
STMTouch driver. These functions are managed by the application.
For linear and rotary sensor state machine, it is the same principle. The functions used to
manage each state start with the prefix “TSL_linrot_”:
CONST TSL_State_T MyLinRots_StateMachine[] =
{
// Calibration states
/* 0 */ { TSL_STATEMASK_CALIB, TSL_linrot_CalibrationStateProcess },

38/124 UM1606 Rev 6

 2.12.3 States detail

UM1606
The two tables below show the detail of how each state is entered following the thresholds measured.

Table 4. Detailed sensors states 1/2

all excepted all excepted 2p,10p,12p,3, 2p,6,4p,7,8, 2,2p,6,10,
Previous state 2,4,11 DXS,5 DXS,5p,9 2,2p,1
13 13 4p,5p,7,8,9,11p 11p 10p,12,12p,0,14..18

state nb 2 2p 6 10 10p 12 12p 0 13

RELEASE DETECT TOUCH

Current state RELEASE PROX DETECT TOUCH CALIB ERROR
with PROX with PROX with PROX

Delta

deb DETECT deb DETECT deb DETECT

or or or
DETECT+DTO DETECT+DTO DETECT+DTO
DETECT IN Th same same same same
or or or or
CALIB if DTO CALIB if DTO CALIB if DTO CALIB if DTO
UM1606 Rev 6

deb PROX
or
DETECT OUT Th PROX+DTO
same
or
CALIB if DTO deb PROX- deb PROX-
PROX IN Th RELEASE
DETECT TOUCH
same or same
or or
ERROR
PROX+DTO PROX+DTO
deb deb
RELEASE- RELEASE-
same DETECT TOUCH
PROX OUT Th or or
RELEASE RELEASE
deb RELEASE- deb RELEASE- deb RELEASE-
PROX DETECT TOUCH
or or or
CALIB Th
deb CALIB deb CALIB RELEASE RELEASE RELEASE
or or
CALIB CALIB

STMTouch driver
deb ERROR deb ERROR deb ERROR deb ERROR deb ERROR deb ERROR deb ERROR deb ERROR
if
or or or or or or or or same
ACQ ERROR
ERROR ERROR ERROR ERROR ERROR ERROR ERROR ERROR
39/10
 Table 5. Detailed sensors states 2/2
40/10

STMTouch driver
2,2p,6,10,
Previous state 6 10 10p,8 12 12p,9 2p,11p 10p 12p 2 2p,6,7 2,2p 10p,12,12p
,0

state nb 3 4 4p 5 5p 7 8 9 11 11p 1 14..18

deb deb deb

deb deb deb deb deb
RELEASE- RELEASE- deb DETECT deb
Current state RELEASE- RELEASE- RELEASE- deb PROX PROX- PROX- deb CALIB
DETECT TOUCH DETECT ERROR
PROX DETECT TOUCH DETECT TOUCH
with PROX with PROX with PROX

Delta

deb DETECT same same

or or or
DETECT+ DETECT+ DETECT+
DETECT IN Th DTO DTO DTO
DETECT DETECT TOUCH TOUCH DETECT TOUCH
UM1606 Rev 6

same deb PROX

or or
PROX
PROX+ PROX+
DETECT OUT Th DTO DTO
RELEASE RELEASE
PROX IN Th same same
PROX
or or
PROX PROX DETECT
PROX+ PROX+
TOUCH
DTO DTO
RELEASE CALIB

same same
PROX OUT Th or or
RELEASE RELEASE
RELEASE RELEASE
deb deb
same same same RELEASE- RELEASE-
or or or DETECT TOUCH
CALIB Th RELEASE RELEASE RELEASE or or
same
RELEASE RELEASE
or
CALIB

if
PROX DETECT DETECT TOUCH TOUCH RELEASE DETECT TOUCH RELEASE RELEASE RELEASE ERROR
ACQ ERROR

UM1606
UM1606 STMTouch driver

2.12.4 Calibration state

It consists in calculating the reference for all the channels of a sensor. An average of a
certain number of measurements is done.
The number of measurement samples to use for the calibration is defined by the
TSLPRM_CALIB_SAMPLES parameter.
After reset the initialization method of each object is called. This method initializes the
sensor parameters and then goes in the calibration state. After the calibration is done, the
sensor goes in the RELEASE state or ERROR state except if an error occurred.
Related functions:
• TSL_tkey_CalibrationStateProcess()
• TSL_linrot_CalibrationStateProcess()
• TSL_tkey_SetStateCalibration()
• TSL_linrot_SetStateCalibration()

Calibration delay
If a noise filter is used it should be necessary to wait a certain amount of measurement
samples before to start the reference calculation. This number of samples to wait is defined
by the TSLPRM_CALIB_DELAY parameter.

Re-calibration
If the calibration threshold is reached while in RELEASE state, a new calibration is
performed. This “re-calibration” prevents the application to get stuck if something touches
permanently the sensor like a drop of water for example.

2.12.5 RELEASE state

Corresponds to the “idle” state of the sensor when no presence is detected.
Related functions:
• TSL_tkey_ReleaseStateProcess()
• TSL_linrot_ReleaseStateProcess()

2.12.6 Proximity state

This state is optional and is enabled or disabled using the TSLPRM_USE_PROX
parameter.
Related functions:
• TSL_tkey_ProxStateProcess()
• TSL_linrot_ProxStateProcess()

2.12.7 DETECT state

It is the “normal” state when the sensor is touched.
Related functions:
• TSL_tkey_DetectStateProcess()
• TSL_linrot_DetectStateProcess()

UM1606 Rev 6 41/124

123
STMTouch driver UM1606

2.12.8 TOUCH state

Same as DETECT state excepted that it is entered only by the DXS processing. If the DXS
is not used this state is never entered.
Related functions:
• TSL_tkey_TouchStateProcess()
• TSL_linrot_TouchStateProcess()

2.12.9 ERROR state

It is used to catch all acquisition errors detected in the other states.
The management of this state must be performed at application level.

2.12.10 OFF state

It is used to inform the acquisition module to stop the burst and/or acquisition on the
sensor's channels.
The management of this state must be performed at application level.

2.12.11 Debounce states

The debounce is optional and is enabled/disabled using the different debounce counters
parameters: TSLPRM_DEBOUNCE_PROX, TSLPRM_DEBOUNCE_DETECT,
TSLPRM_DEBOUNCE_RELEASE, TSLPRM_DEBOUNCE_CALIB,
TSLPRM_DEBOUNCE_ERROR
The debounce is off if the corresponding parameter is equal to zero.

2.12.12 Reading the current state

The current state can be obtained by using the functions:
For touchkey sensor:
• TSL_tkey_GetStateId()
• TSL_tkey_GetStateMask()
For linear and rotary sensor:
• TSL_linrot_GetStateId()
• TSL_linrot_GetStateMask()
The functions TSL_tkey_IsChanged() or TSL_linrot_IsChanged() allows to check if a
sensor state has changed.
You can also directly read the state inside the sensor data structure:
if MyTKeys[0].p_Data->StateId == TSL_STATEID_DETECT)

2.12.13 Accessing a specific state

It is possible to enter directly in the calibration, OFF and “burst only” states. The “burst only”
state consists in only bursting the electrode without performing acquisition on it. It can be
used in specific cases to improve the robustness against noise.
Note: This feature is not available for STM8TL5x devices.

42/124 UM1606 Rev 6

UM1606 STMTouch driver

This is done by using the following functions:

For touchkey sensor:
• TSL_tkey_SetStateCalibration()
• TSL_tkey_SetStateOff()
• TSL_tkey_SetStateBurstOnly()
For linear and rotary sensor:
• TSL_linrot_SetStateCalibration()
• TSL_linrot_SetStateOff()
• TSL_linrot_SetStateBurstOnly()

2.13 Environment Change System (ECS)

2.13.1 Principle
Power supply voltage, temperature and air humidity, may induce a slow variation of the
measured signal. The Environment Change System (ECS) is used to adapt the reference to
these environment changes.
The ECS processing is based on an infinite response digital low pass filter of the first order
(IIR filter):
Y(n ) = K × X( n) + (1 – K ) × Y(n – 1 )
with:
Y = reference
X = acquisition value (last measurement)
K = coefficient.
The higher value is K, the faster is the response time. Two default K coefficients are
available to obtain fast and slow responses.
The sampling frequency is programmable using a timing utility routine (see example below).
If the sensor is in PROX, DETECT or TOUCH states, the ECS is disabled for the duration of
the detection timeout or for the duration of the touch (whichever ends first).
When the ECS is disabled, Yn=Yn-1
As soon as the recalibration times out or the detection ends, the filter is set active again.

2.13.2 Resources
The ECS functions are provided in the files:
• tsl_ecs.c
• tsl_ecs.h
The functions are:
• TSL_ecs_Process(): main function to be used by the user
• TSL_ecs_CalcK(): additional function
• TSL_ecs_ProcessK(): additional function

UM1606 Rev 6 43/124

123
STMTouch driver UM1606

2.13.3 Parameters
• TSLPRM_ECS_K_FAST
• TSLPRM_ECS_K_SLOW
• TSLPRM_ECS_DELAY

2.13.4 Usage example

The ECS processing is usually performed in the main state machine at regular time intervals
defined by the user. But it can be done also in interrupt routines. It must be performed after
the sensors state machine is processed.
The ECS is activated only when all the sensors are in RELEASE, ERROR or OFF states,
with at least one sensor in RELEASE state. It can also be delayed from milli-seconds to few
seconds.
The ECS processing is performed on a group of sensors defined by the user. Different
groups can be created and ECS applied on these groups with different K coefficients.
It's up to the user to decide the best thing to do for its application.
The simplest way is to call the TSL_ecs_Process() function in the main application loop
using the default K coefficients defined in the configuration file:
TSL_ecs_Process(&MyObjGroup);
To call this functions at regular time intervals you can use the provide timing routine
TSL_tim_CheckDelay_ms().
Example with ECS executed every 100ms:
TSL_tTick_ms_T time_ECS_tick;
int main(void) {
while (1) {
...
// ECS every 100 ms
if (TSL_tim_CheckDelay_ms(100, &time_ECS_tick) == TSL_STATUS_OK)
{
TSL_ecs_Process(&MyObjGroup);
}
...
}
}
The TSL_ecs_ProcessK() function allows to use a K coefficient different than the default
value:
if (TSL_tim_CheckDelay_ms(100, &time_ECS_tick) == TSL_STATUS_OK)
{
if ((MyObjGroup->StateMask & TSL_STATE_RELEASE_BIT_MASK) &&
!(MyObjGroup->StateMask & TSL_STATEMASK_ACTIVE))
{
TSL_ecs_ProcessK(&MyObjGroup, 120);
}
}

44/124 UM1606 Rev 6

UM1606 STMTouch driver

2.14 Detection Exclusion System (DXS)

2.14.1 Principle
The DXS processing is used to prevent several sensors to be in the DETECT state at the
same time. This could happen if the sensors are closed to each other or if their sensitivity is
too high. This can be useful also in some applications to prevent the user to touch at the
same time several sensors with "opposite" meaning (volume up and volume down for
example).
The first sensor in the group of sensors has the priority and enters in the DETECT state
(with the DxSLock flag set). The other sensors are “blocked” and enter instead in the
TOUCH state.
Note: A particular care must be taken when designing sensors that are shared between multiple
DXS groups. The sensor that will be assigned in the DETECT state depends on the sensors
position in the DXS groups and also on the order of the DXS groups processing. See the
examples 1 and 2 for more detail.
The figure below illustrates the difference in behavior for a group of 3 sensors (touchkeys)
when the DXS is OFF and ON. The three touchkeys are part of the same DXS group.
Note: The touchkeys can be replaced by a linear or a rotary sensor.

Figure 13. DXS principle

7.DQG7. 7.DQG7. $OO7NH\V 7.DQG7.

DUHWRXFKHGWRJHWKHU 7.LVUHOHDVHG DUHWRXFKHGWRJHWKHU DUHWRXFKHG DUHUHOHDVHG

7NH\ 5(/($6( '(7(&7 5(/($6( 5(/($6( '(7(&7 5(/($6(

';6 7NH\ 5(/($6( '(7(&7 '(7(&7 '(7(&7 '(7(&7 5(/($6(

2))
7NH\ 5(/($6( 5(/($6( 5(/($6( '(7(&7 '(7(&7 '(7(&7

WLPH

7NH\ 5(/($6( '(7(&7 5(/($6( 5(/($6( 728&+ 5(/($6(

';621
VDPH 7NH\ 5(/($6( 728&+ '(7(&7 '(7(&7 '(7(&7 5(/($6(
JURXS
7NH\ 5(/($6( 5(/($6( 5(/($6( 728&+ 728&+ '(7(&7

WLPH
7.H\KDVWKHSULRULW\ 7.H\WDNHV 7.H\LVDOVR 7.H\WDNHV
7.H\LV³EORFNHG´
7NH\LV³EORFNHG´ WKHSULRULW\ ³EORFNHG´ WKHSULRULW\

06Y9

Example 1: 3 sensors with one shared between two groups.

In this example the group1 is composed of the two sensors s1 and s2 in this order and the
group2 of the two sensors s2 and s3 in this order.
The DXS groups are processed in this order: group1 first and then group2.

UM1606 Rev 6 45/124

123
STMTouch driver UM1606

We can see in the step DXS5 that the sensor 2 (s2) goes in DETECT state instead of the
sensor 3 (s3). This is simply because s2 is placed first in the group2.

Figure 14. DXS example 1

JURXS JURXS JURXS JURXS JURXS
6 6 6 6 6
5(/($6( '(7(&7 '(7(&7 '(7(&7 5(/($6(

6
6 6 6 6 6
5(/($6( 5(/($6( 728&+ 728&+ '(7(&7
6 6 6 6 6
5(/($6( 5(/($6( 5(/($6( '(7(&7 728&+

JURXS JURXS JURXS JURXS JURXS

';6 ';6 ';6 ';6 ';6

WLPH
06Y9

Example 2: 4 sensors with one share between three groups.

In this example the group1 is composed of the two sensors s1 and s2 in this order, the
group2 of the two sensors s2 and s3 in this order and the group3 of the two sensors s2 and
s4 in this order.
The DXS groups are processed in this order: group1 first, then group2 and finally group3.
We can see in the step DXS2 that the sensor 2 takes the priority over the sensors 3 and 4.
To summarize, the decision to be in DETECT state depends on the sensors placement
inside the group and also on the order of the groups processing.

Figure 15. DXS example 2

JURXS JURXS

6 6
'(7(&7 5(/($6(
JURXS JURXS
6 6 6 6
728&+ '(7(&7 '(7(&7 728&+

6 6
'(7(&7 728&+

JURXS JURXS JURXS

';6 ';6

WLPH
06Y9

2.14.2 Resources
The DXS functions are provided in the files:
• tsl_dxs.c
• tsl_dxs.h
The functions to use are:
• TSL_dxs_FirstObj()

46/124 UM1606 Rev 6

UM1606 STMTouch driver

2.14.3 Parameters
• TSLPRM_USE_DXS

2.14.4 Usage example

The DXS processing is performed usually in the main state machine but it can also be done
in interrupt routines.

Warning: The DXS must be absolutely performed after the sensors

state machine is processed, that is after the call to the
TSL_obj_GroupProcess() function (see the main state
machine for more details).

The DXS processing is performed on a group of sensors defined by the user. Different
groups of DXS can be created.
It's up to the user to decide the best partitioning for his application.
Example:
int main(void) {
while (1) {
...
TSL_obj_GroupProcess(&MyObjGroup1);
TSL_obj_GroupProcess(&MyObjGroup2);
TSL_dxs_FirstObj(&MyObjGroup1);
TSL_dxs_FirstObj(&MyObjGroup2);
...
}
}

2.15 Detection Time Out (DTO)

2.15.1 Principle
The Detection Time Out (DTO) introduces a simple way to cope with water film and any
obstacle that may come in contact with a sensor. It introduces a maximum duration for the
'detected' state of any sensor called the Detection Time Out (DTO).
After this period of time, the sensor is automatically recalibrated. This allows to make the
sensor touch sensitive again, even if the obstacle or the liquid film is still present on the
board.
This feature is application dependent and the time out must be tuned according to the user
interface specifications.
The DTO is applied on the PROX, DETECT and TOUCH states and can be disabled.

UM1606 Rev 6 47/124

123
STMTouch driver UM1606

2.15.2 Resources
The DTO functions are provided in the files:
• tsl_touchkey.c
• tsl_touchkey.h
• tsl_linrot.c
• tsl_linrot.h
The functions used by the DTO are:
• TSL_tkey_DTOGetTime()
• TSL_linrot_DTOGetTime()
• TSL_tim_CheckDelay_sec()
Note: The user doesn't need to call these functions to perform the DTO.

2.15.3 Parameters
• TSLPRM_DTO

2.15.4 Usage
The DTO is automatically performed inside the sensor state machine. The user doesn't
need to call any function in the application code.
The DTO is disabled by writing zero in the TSLPRM_DTO parameter.

2.16 Noise filters

2.16.1 Principle
The STMTouch driver has been designed to facilitate the implementation of different noise
filters. These filters can be used for many purpose and can range from very simple design to
very complicated.

2.16.2 Resources
The filters are defined in the files:
• tsl_filter.c
• tsl_filter.h
Each filter is described by a function:
• TSL_filt_MeasFilter(): filter on measurement values
• TSL_filt_DeltaFilter(): filter on delta values

2.16.3 Parameters
There is no parameter for the filter module.

48/124 UM1606 Rev 6

UM1606 STMTouch driver

2.16.4 Usage
The filter functions can be called at anytime in the main application. In order to speed-up the
execution time and to gain RAM space, the measure and delta filters are called by the
TSL_acq_BankGetResult() function.
Examples:
// Apply a filter on the measures only
TSL_acq_BankGetResult(0, TSL_filt_MeasFilter, 0);
// Get the measures without applying any filter
TSL_acq_BankGetResult(0, 0, 0);
Note: The user can also create its own filter functions.

2.17 Timing management

2.17.1 Principle
The STMTouch driver needs an internal clock (“timing”), in particular for the ECS and DTO
processings. This timing can be also used by the application layer for any purpose (LEDs
blinking for example).
The timing process consists in incrementing a global variable at a regular interval. Different
functions are then used to compare the current “time” and to check if a certain delay has
elapsed.

2.17.2 Resources
The common timing routines are described in the files:
• tsl_time.c
• tsl_time.h
The initialization of the timing is made using hardware timer, systick, etc... and is
implemented differently on each device. This is described in the files:
• tsl_time_<mcu>.c
• tsl_time_<mcu>.h
Functions:
• TSL_tim_ProcessIT()
• TSL_tim_CheckDelay_ms()
• TSL_tim_CheckDelay_sec()

2.17.3 Parameters
• TSLPRM_TICK_FREQ

2.17.4 Usage
The timing is started when the function TSL_Init() is called.
The function TSL_tim_CheckDelay_ms() can be used in the main application code to
execute some code (for example the ECS) at a regular interval.

UM1606 Rev 6 49/124

123
STMTouch driver UM1606

Example:
TSL_tTick_ms_T time_ECS_tick;
TSL_tTick_ms_T time_LED_tick;
int main(void) {
TSL_Init(MyBanks); // The timing starts...
while (1) {
...
// Launch the ECS every 100 ms
if (TSL_tim_CheckDelay_ms(100, &time_ECS_tick) == TSL_STATUS_OK)
{
TSL_ecs_Process(&MyObjGroup);
}
// Toggle LED every 500 ms
if (TSL_tim_CheckDelay_ms(500, &time_LED_tick) == TSL_STATUS_OK)
{
ToggleLED();
}
...
}
}

2.18 Parameters
All the parameters are described in the tsl_conf_<mcu>.h file.
Note: The tsl_conf_<mcu>.h_TOADAPT file present in the STMTouch_Driver/inc folder must be
copied in the application project (inc folder) and adapted to your application.
The structure TSL_Params_T is used to hold certain parameters that are common to all
sensors. These parameters can be changed by the user while the application is running.

Parameters checking
All common parameters are verified (presence and value range) in the file:
• tsl_check_config.h
All device specific parameters are verified in the tsl_check_config_<mcu>.h file.

2.19 STM8L1xx devices

2.19.1 Acquisition
The STM8L1xx devices hardware acquisition mode (using two timers) is done in the files:
• tsl_acq_stm8l_hw.c
• tsl_acq_stm8l_hw.h

50/124 UM1606 Rev 6

UM1606 STMTouch driver

Warning: This acquisition mode is available for the STM8L15x Low-

density devices only.

The STM8L1xx devices software acquisition mode is done in the files:

• tsl_acq_stm8l_sw.c
• tsl_acq_stm8l_sw.h
This acquisition is available for all STM8L1xx devices.
Note: The hardware acquisition mode is selected per default for the STM8L15x Low-density and
devices. If you want to use the software acquisition mode you must add the following
constant in the toolchain compiler preprocessor:
• TSLPRM_STM8L1XX_SW_ACQ
Functions used by the application layer and that are device dependent:
• TSL_acq_BankConfig()
• TSL_acq_BankStartAcq()
• TSL_acq_BankWaitEOC()
• TSL_acq_GetMeas()
The other functions in this file are for internal use and the user doesn't need to call them
directly.

2.19.2 Timings
The STM8L1xx devices timing management is done in the files:
• tsl_time_stm8l.c
• tsl_time_stm8l.h
The TIM4 is used to generate a timebase for the ECS and DTO modules.

Warning: The auto reload counter is calculated for a FCPU equal to

16 MHz. If you use another FCPU value in your application you
must change the ARR value inside the TSL_tim_Init()
function.

Functions used:
• TSL_tim_Init()

2.19.3 Parameters
The parameters specific to the STM8L1xx devices are described in the file:
• tsl_conf_stm8l.h
and are checked in the file:
• tsl_check_config_stm8l.h

UM1606 Rev 6 51/124

123
STMTouch driver UM1606

2.19.4 Memory footprint

Conditions
• Cosmic STM8 C compiler 32K version v4.3.6
• Compiler options: +modsl0 -pxp +compact +split -pp
• Cosmic library not counted
• STMTouch driver default options: ECS=ON, DTO=OFF, PROX=OFF
• Each sensor has its own parameters, all parameters placed in RAM
The following tables summarize the memory footprint taken by the STMTouch driver with
different STM8L devices, acquisition mode and sensors:

Table 6. STM8L101 memory footprint with software acquisition(1)

ROM RAM Specific
Channels Banks Sensors
(Kbytes) (bytes) options

ZONE=OFF
3 2 3 TKeys ~5.3 ~160
DXS=ON
1. The content of this table is provided for information purposes only.

Table 7. STM8L15x memory footprint with hardware acquisition(1)

ROM RAM Specific
Channels Banks Sensors
(Kbytes) (bytes) options

ZONE=OFF
1 1 1 TKey ~5.2 ~140
DXS=OFF
ZONE=ON
10 2 10 TKeys ~5.4 ~300
DXS=ON
10 TKeys
ZONE=ON
16 2 1 Linear-3ch ~7.4 ~450
DXS=ON
1 Rotary-3ch
1. The content of this table is provided for information purposes only.

Table 8. STM8L15x memory footprint with software acquisition(1)

ROM RAM Specific
Channels Banks Sensors
(Kbytes) (bytes) options

ZONE=OFF
1 1 1 TKey ~4.6 ~130
DXS=OFF
ZONE=OFF
10 2 10 TKeys ~4.8 ~280
DXS=ON
10 TKeys
ZONE=OFF
16 2 1 Linear-3ch ~6.9 ~430
DXS=ON
1 Rotary-3ch
1. The content of this table is provided for information purposes only.

52/124 UM1606 Rev 6

UM1606 STMTouch driver

2.19.5 MCU resources

The tables below show the peripherals that are used by the STMTouch driver on STM8L1xx
devices. Care must be taken when using them to avoid any unwanted behavior.

Table 9. MCU resources used on STM8L1xx with hardware acquisition

Peripheral Function

GPIOs Acquisition
TIM4 Time base for ECS and DTO
TIM2, TIM3 Acquisition
Routing interface Acquisition

Table 10. MCU resources used on STM8L1xx with software acquisition

Peripheral Function

GPIOs Acquisition
TIM4 Time base for ECS and DTO
Routing interface Acquisition

2.19.6 STM8L available touch-sensing channels

The tables below provide an overview of the available touch sensing channels for the
STM8L1xx devices.
Note: The following tables are not restrictive in term of part numbers supported by the STMTouch
driver. The STMTouch driver can be used on any new device that may become available as
part of ST microcontrollers portfolio. Please contact your ST representative for support.
Note: For n available pins in an I/O group, one pin is used as sampling capacitor and n-1 pins are
used as channels.
The I/O group cannot be used if the number of available pins in less or equal to one.

UM1606 Rev 6 53/124

123
54/10

STMTouch driver
Table 11. Available touch-sensing channels for STM8L101
Subfamily STM8L101

Packages TSSOP20 / UFQFPN20 UFQFPN28 UFQFPN32 / LQFP32

STM8L101F[23]U
Part numbers STM8L101G[23]U STM8L101K3[UT]
STM8L101F[23]P

Analog Pin Number of Number of Number of

Pin
I/O Gx_IOy GPIO available Usage Pin available Usage Pin available Usage
TSSOP UFQFPN
group pins pins pins

G1_IO1 PB0 10 7 12 13
2 channels 3 channels 3 channels
G1_IO2 PB1 11 8 with 1 13 with 1 14 with 1
Group1 3 4 4
G1_IO3 PD0 9 6 sampling 8 sampling 9 sampling
capacitor capacitor capacitor
UM1606 Rev 6

G1_IO4 PD1 - - 9 10
G2_IO1 PB2 12 9 14 15
1 channel 3 channels 3 channels
G2_IO2 PB3 13 10 with 1 15 with 1 16 with 1
Group2 2 4 4
G2_IO3 PD2 - - sampling 10 sampling 11 sampling
capacitor capacitor capacitor
G2_IO4 PD3 - - 11 12
Maximum number of channels 3 with 2 sampling capacitors 6 with 2 sampling capacitors 6 with 2 sampling capacitors

UM1606
 UM1606
Table 12. Available touch-sensing channels for STM8L15x / STM8L16x (table 1/2)
Subfamily STM8L151F STM8L151G STM8L151K

Packages UFQFPN20 / TSSOP20 UFQFPN28 / WLCSP28 UFQFPN32 / LQFP32

STM8L151F[23]U(1) STM8L151G[346]U(1)
(UFQFPN) (UFQFPN)
Part numbers STM8L152K[46][UT]
STM8L151F[23]P(1) STM8L151G[46]Y
(TSSOP) (WLCSP)

Number Number Number

Analog of of of
Gx_IOy GPIO Pin Pin Usage Pin Pin Usage Pin Usage
I/O group available available available
pins pins pins

G1_IO1 PA6 - - - - 6
UM1606 Rev 6

G1_IO2 PA5 - - cannot be used 5 D4 1 channel with 5 2 channels with

Group 1 0 for 2 1 sampling 3 1 sampling
G1_IO3 PA4 - - touch sensing 4 D3 capacitor 4 capacitor
G1_IO4 PA7 - - - - -
G2_IO1 PC7 - - - - -
G2_IO2 PC4 17 20 cannot be used 25 C2 1 channel with 29 1 channel with
Group 2 1 for 2 1 sampling 2 1 sampling
G2_IO3 PC3 - - touch sensing 24 A2 capacitor 28 capacitor
G2_IO4 PE7 - - - - -
G3_IO1 PC2 - - 23 B2 27
cannot be used cannot be used 2 channels with
Group 3 G3_IO2 PD7 - - 0 for - - 1 for 24 3 1 sampling
touch sensing touch sensing capacitor
G3_IO3 PD6 - - - - 23
G4_IO1 PD5 - - - - 22

STMTouch driver
cannot be used 1 channel with 2 channels with
Group 4 G4_IO2 PD4 - - 1 for 20 C1 2 1 sampling 21 3 1 sampling
touch sensing capacitor capacitor
G4_IO3 PB7 14 17 19 E1 20
55/10
 Table 12. Available touch-sensing channels for STM8L15x / STM8L16x (table 1/2) (continued)
56/10

STMTouch driver
Subfamily STM8L151F STM8L151G STM8L151K

Packages UFQFPN20 / TSSOP20 UFQFPN28 / WLCSP28 UFQFPN32 / LQFP32

STM8L151F[23]U(1) STM8L151G[346]U(1)
(UFQFPN) (UFQFPN)
Part numbers STM8L152K[46][UT]
STM8L151F[23]P(1) STM8L151G[46]Y
(TSSOP) (WLCSP)

Number Number Number

Analog of of of
Gx_IOy GPIO Pin Pin Usage Pin Pin Usage Pin Usage
I/O group available available available
pins pins pins

G5_IO1 PB6 13 16 18 F1 19
2 channels 2 channels with 2 channels with
Group 5 G5_IO2 PB5 12 15 3 with1 sampling 17 D1 3 1 sampling 18 3 1 sampling
UM1606 Rev 6

capacitor capacitor capacitor

G5_IO3 PB4 11 14 16 D2 17
G6_IO1 PB3 10 13 15 E2 16
2 channels with 2 channels with 2 channels with
Group 6 G6_IO2 PB2 9 12 3 1 sampling 14 F2 3 1 sampling 15 3 1 sampling
capacitor capacitor capacitor
G6_IO3 PB1 8 11 13 G1 14
G7_IO1 PB0 7 10 12 E3 13
G7_IO2 PD3 - - cannot be used 11 F3 2 channels with 12 2 channels with
Group 7 1 for 3 1 sampling 3 1 sampling
G7_IO3 PD2 - - touch sensing 10 E4 capacitor 11 capacitor
G7_IO4 PE3 - - - - -
G8_IO1 PD1 - - 9 G2 10
G8_IO2 PD0 6 9 cannot be used 8 G3 1 channel with - cannot be used
Group 8 1 for 2 1 sampling 1 for
G8_IO3 PE5 - - touch sensing - - capacitor - touch sensing
G8_IO4 PE4 - - - - -
4 channels with 10 channels with 13 channels with
Maximum number of channels

UM1606
2 sampling capacitors 7 sampling capacitors 7 sampling capacitors
1. The product has an hardware acceleration cell for touch sensing.
 UM1606
Table 13. Available touch-sensing channels for STM8L15x / STM8L16x (table 2/2)
STM8L151C medium/medium+/high density
STM8L151R/M
Subfamily STM8L151K STM8L151C low density
STM8L152C/R/M
STM8L162R/M

Packages UFQFPN32 / LQFP32 UFQFPN48 / LQFP48 / LQFP64 / LQFP80 LQFP48

STM8L151C[468][UT]
STM8L152C[468][UT]
(48 pins)

STM8L151R[68]T
(1) STM8L152R[68]T
STM8L151K3U
Part numbers STM8L162R8T STM8L151C3T(1)
STM8L151K[46][UT]
(64 pins)
UM1606 Rev 6

STM8L151M8T
STM8L152M8T
STM8L162M8T
(80 pins)

Number Number Number

Analog
of of of
I/O Gx_IOy GPIO Pin Usage Pin Pin Pin Usage Pin Usage
available available available
group
pins pins pins

G1_IO1 PA6 6 7 7 11 7
G1_IO2 PA5 5 2 channels with 6 6 10 2 channels with 6 3 channels with
Group 1 3 1 sampling 3 1 sampling 4 1 sampling
G1_IO3 PA4 4 capacitor 5 5 9 capacitor 5 capacitor
(2) (2) (2)
G1_IO4 PA7 - 8

STMTouch driver
G2_IO1 PC7 - 46 62 74 46
G2_IO2 PC4 29 1 channel with 43 59 71 2 channels with 43 3 channels with
Group 2 2 1 sampling 3 1 sampling 4 1 sampling
G2_IO3 PC3 28 capacitor 42 58 70 capacitor 42 capacitor
(2) (2) (2)
G2_IO4 PE7 - 48
57/10
 Table 13. Available touch-sensing channels for STM8L15x / STM8L16x (table 2/2) (continued)
58/10

STMTouch driver
STM8L151C medium/medium+/high density
STM8L151R/M
Subfamily STM8L151K STM8L151C low density
STM8L152C/R/M
STM8L162R/M

Packages UFQFPN32 / LQFP32 UFQFPN48 / LQFP48 / LQFP64 / LQFP80 LQFP48

STM8L151C[468][UT]
STM8L152C[468][UT]
(48 pins)

STM8L151R[68]T
(1) STM8L152R[68]T
STM8L151K3U
Part numbers STM8L162R8T STM8L151C3T(1)
STM8L151K[46][UT]
(64 pins)

STM8L151M8T
UM1606 Rev 6

STM8L152M8T
STM8L162M8T
(80 pins)

Number Number Number

Analog
of of of
I/O Gx_IOy GPIO Pin Usage Pin Pin Pin Usage Pin Usage
available available available
group
pins pins pins

G3_IO1 PC2 27 41 57 69 41
2 channels with 2 channels with 1 channel with
Group 3 G3_IO2 PD7 24 3 1 sampling 36 48 60 3 1 sampling 36 3 1 sampling
capacitor capacitor capacitor
G3_IO3 PD6 23 35 47 59 35
G4_IO1 PD5 22 34 46 58 34
2 channels with 2 channels with 2 channels with
Group 4 G4_IO2 PD4 21 3 1 sampling 33 45 57 3 1 sampling 33 3 1 sampling
capacitor capacitor capacitor
G4_IO3 PB7 20 31 38 46 31
G5_IO1 PB6 19 30 37 45 30
2 channels with 2 channels with 2 channels with
Group 5 G5_IO2 PB5 18 3 1 sampling 29 36 44 3 1 sampling 29 3 1 sampling

UM1606
capacitor capacitor capacitor
G5_IO3 PB4 17 28 35 43 28
 Table 13. Available touch-sensing channels for STM8L15x / STM8L16x (table 2/2) (continued)

UM1606
STM8L151C medium/medium+/high density
STM8L151R/M
Subfamily STM8L151K STM8L151C low density
STM8L152C/R/M
STM8L162R/M

Packages UFQFPN32 / LQFP32 UFQFPN48 / LQFP48 / LQFP64 / LQFP80 LQFP48

STM8L151C[468][UT]
STM8L152C[468][UT]
(48 pins)

STM8L151R[68]T
(1) STM8L152R[68]T
STM8L151K3U
Part numbers STM8L162R8T STM8L151C3T(1)
STM8L151K[46][UT]
(64 pins)

STM8L151M8T
UM1606 Rev 6

STM8L152M8T
STM8L162M8T
(80 pins)

Number Number Number

Analog
of of of
I/O Gx_IOy GPIO Pin Usage Pin Pin Pin Usage Pin Usage
available available available
group
pins pins pins

G6_IO1 PB3 16 27 34 42 27
2 channels with 2 channels with 2 channels with
Group 6 G6_IO2 PB2 15 3 1 sampling 26 33 41 3 1 sampling 26 3 1 sampling
capacitor capacitor capacitor
G6_IO3 PB1 14 25 32 40 25
G7_IO1 PB0 13 24 31 39 24
G7_IO2 PD3 12 2 channels with 23 28 32 2 channels with 23 3 channels with

STMTouch driver
Group 7 3 1 sampling 3 1 sampling 4 1 sampling
G7_IO3 PD2 11 capacitor 22 27 31 capacitor 22 capacitor
(2) (2) (2)
G7_IO4 PE3 - 17
59/10
 Table 13. Available touch-sensing channels for STM8L15x / STM8L16x (table 2/2) (continued)
60/10

STMTouch driver
STM8L151C medium/medium+/high density
STM8L151R/M
Subfamily STM8L151K STM8L151C low density
STM8L152C/R/M
STM8L162R/M

Packages UFQFPN32 / LQFP32 UFQFPN48 / LQFP48 / LQFP64 / LQFP80 LQFP48

STM8L151C[468][UT]
STM8L152C[468][UT]
(48 pins)

STM8L151R[68]T
(1) STM8L152R[68]T
STM8L151K3U
Part numbers STM8L162R8T STM8L151C3T(1)
STM8L151K[46][UT]
(64 pins)

STM8L151M8T
UM1606 Rev 6

STM8L152M8T
STM8L162M8T
(80 pins)

Number Number Number

Analog
of of of
I/O Gx_IOy GPIO Pin Usage Pin Pin Pin Usage Pin Usage
available available available
group
pins pins pins

G8_IO1 PD1 10 21 26 30 21
G8_IO2 PD0 9 1 channel with 20 25 29 2 channels with 20 3 channels with
Group 8 2 1 sampling 3 1 sampling 4 1 sampling
G8_IO3 PE5 - capacitor 19 24 28 capacitor 19 capacitor
G8_IO4 PE4 - (2) (2) (2)
18
Maximum number of 14 channels with 16 channels with 20 channels with
channels 8 sampling capacitors 8 sampling capacitors 8 sampling capacitors
1. The product has an hardware acceleration cell for touch sensing.
2. This IO does not belong to the analog IO group.

UM1606
UM1606 STMTouch driver

2.19.7 Hardware implementation example

Figure 16 shows an example of hardware implementation on STM8L1xx devices.

Recommendations to increase the noise immunity on the PCB

To ensure a correct operation in noisy environment, the floating nets must be avoided
(tracks, copper elements, conductive frames, etc...).
As a consequence:
• All unused touch controller I/Os must be either configured to output push-pull low or
externally tied to GND.
• The parameter TSLPRM_IODEF should also be configured to the output push-pull low
state.
• We recommend to drive the sampling capacitor common node using a standard I/O of
the touch controller configured in output push-pull low mode.

UM1606 Rev 6 61/124

123
 Figure 16. STM8L101 hardware implementation example
62/10

STMTouch driver
1 2 3 4

R17
MCU_VDD 0R_0603/DNF
U2 W1 VDD C1
1 5 CN1

100nF_X7R_0603
Vin Vout
MCU_VDD PC3

1µF_X5R_0603

GND
1 2
3 4 JUMPER 4.7µF_X5R_0603 PC2 PC1
CE NC 3 4
C6 C7 C2 PC0
A R1 5 6 A
LP2980ABM3.3-TR
7 8

2
10K_1%_0603
9 10
100nF_X7R_0603 PA1 R2
11 12
820R_1%_0603 13 14
C3 PD7
100nF_X7R_0603 15 16
M5V PD5 PD6
17 18

7
CN2 PD4
19 20
G2 PB7 MCU_VDD

VDD

VSS
GND 21 22
4 PA0 32 24 PD7
RST PA0-SWIM-BEEP-IR_TIMER PD7 23 24
3 PB6 PB5
GND 25 26
2 PA1 1 23 PD6 PB4
SWIM PA1-NRST PD6 27 28
1
VDD MCU_VDD 29 30
G1 PA2 2 22 PD5
GND PA2 PD5 31 32
33 34
SWIM PA3 3 21 PD4 GND
PA3 PD4 35 36
PA4 4 12 Header 18X2 on the right
PA4-TIM1_BKIN PD3-CMP2_CH4
C4
PA5 5 11
B PA5-TIM2_BKIN PD2-CMP2_CH3 B
PB0 R3
0R_1%_0603 PA6 6 10 4.7nF_COG_1206
PA6-CMP_VREF PD1-TIM2_TRIG-CMP1_CH4
PB1 R4 C5 CN4
0R_1%_0603 9 PC4
PD0-TIM2_CH2-TIM_IR-CMP1_CH3 1 2
PC5 PC6
3 4
R5 13
UM1606 Rev 6

47nF_COG_1206
PB0-TIM1_CH1-CMP1_CH1 5 6
10K_1%_0603 7 8
R6 14 31 PC6 PA0
PB1-TIM2_CH1-CMP1_CH2 PC6 9 10
10K_1%_0603 R7 PD0 PA1 PA2
11 12
15 30 PC5 0R_1%_0603 PA3
PB2-TIM1_CH2-CMP2_CH1 PC5 13 14
R16 PD2
15 16
1

16 29 PC4 0R_1%_0603 PA4

PB3-TIM1_TRIG-CMP2_CH2 PC4-USART_CK-CCO 17 18
PA5
C

19 20
PB4 17 28 PC3 PA6
PB4-SPI_NSS PC3-USART_TX 21 22
0 Position
23 24
PB5 18 27 PC2 PD0
PB5-SPI_SCK PC2-USART_RX 25 26
PD2 PD1
27 28
4 PB6 19 26 PC1 PD3
K PB6-SPI_MOSI PC1-I2C SCL 29 30
C 31 32 C
PB7 20 25 PC0 PB0 PB1
PB7-SPI_MISO PC0-I2C SDA 33 34
3 2 PB2 PB3
B A 35 36
U1 Header 18X2 on the left
PD1 R10 STM8L103K
ROT1 0R_1%_0603
WHEEL ELECTRODE
R9
10K_1%_0603

K1
1 R11 R12 PB2
K2 10K_1%_0603 0R_1%_0603
1 R13 R14 PB3
K3 10K_1%_0603 0R_1%_0603
1 R15 R8 PD3
10K_1%_0603 0R_1%_0603

D D

STMicroelectronics
Title: STM8L101K-TS1 Daughter Board
6
5
4
3
2
1

190, avenue Célestin COQ

Size: A4 Reference: MB782 Revision: A-00 13106 ROUSSET Cedex
CN3 FRANCE
Header 6 Date: 11/Sep/09 Sheet: 1 of 1 £
1 2 3 4

UM1606
UM1606 STMTouch driver

2.20 STM8TL5x devices

2.20.1 Acquisition
The STM8TL5x devices acquisition is done in the files:
• tsl_acq_stm8tl5x.c
• tsl_acq_stm8tl5x.h
Functions used by the application layer and that are device dependent:
• TSL_acq_BankConfig()
• TSL_acq_BankStartAcq()
• TSL_acq_BankWaitEOC()
• TSL_acq_GetMeas()
The other functions in this file are for internal use and the user doesn't need to call them
directly.

2.20.2 Timings
The STM8TL5x devices timing management is done in the files:
• tsl_time_stm8tl5x.c
• tsl_time_stm8tl5x.h
The TIM4 is used to generate a timebase for the ECS and DTO modules.

Warning: The auto reload counter is calculated for a FCPU equal to

16 MHz. If you use another FCPU value in your application you
must change the ARR value inside the TSL_tim_Init()
function.

Functions used
• TSL_tim_Init()
• TSL_Timer_ISR()

2.20.3 Parameters
The parameters specific to the STM8TL5x devices are described in the file:
• tsl_conf_stm8tl5x.h
and are checked in the file:
• tsl_check_config_stm8tl5x.h

UM1606 Rev 6 63/124

123
STMTouch driver UM1606

2.20.4 Memory footprint

Conditions
• Cosmic STM8 C compiler 32K version v4.3.6
• Compiler options: +modsl0 -pxp +compact +split -pp
• Cosmic library not counted
• STMTouch driver default options: ECS=ON, DTO=ON, ZONE=OFF, DXS=ON
(excepted if only one sensor is used)
• Each sensor has its own parameters, all parameters placed in RAM
The following tables summarize the memory footprint with different configurations:

Table 14. STM8TL5x memory footprint without proximity(1)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

1 1 1 TKey ~4.3 ~70

3 1 3 TKeys ~4.4 ~110
19 4 19 TKeys ~4.7 ~440
16 Linears-1ch
26 6 ~6.2 ~680
2 Linears-5ch
16 TKeys
26 6 ~7.8 ~570
2 Linears-5ch
1. The content of this table is provided for information purposes only.

Table 15. STM8TL5x memory footprint with proximity(1)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

1 1 1 TKey ~5.2 ~70

3 1 3 TKeys ~5.4 ~110
19 4 19 TKeys ~5.6 ~490
16 Linears-1ch
26 6 ~7.0 ~730
2 Linears-5ch
16 TKeys
26 6 ~9.5 ~620
2 Linears-5ch
1. The content of this table is provided for information purposes only.

64/124 UM1606 Rev 6

UM1606 STMTouch driver

2.20.5 Acquisition timings

The following figure shows the simplified sequencing for a 2 bank acquisition.

Figure 17. Simplified acquisition sequencing

+DUGZDUH
DFT
(&6SURF
0HDVVWRULQJ
$FTLQLW )XOOSURF
6HQVRUSURF

W
5XQ $FWLYHKDOW 5XQ $FWLYHKDOW

,QLWLDOL]DWLRQRIDEDQNDFTXLVLWLRQ

+DUGZDUHDFTXLVLWLRQWKH&38FDQHQWHULQORZSRZHUPRGH:),:)(DFWLYHKDOW

0HDVXUHPHQWVWRULQJIRUHDFKHQDEOHGUHFHLYHUVRIWKHEDQNMXVWDFTXLUHG

6HQVRUSURFHVVLQJFDQEHVSOLWLQGLIIHUHQWIXQFWLRQVWRXFKNH\VOLQHDURUURWDU\VHQVRUV«

(&6SURFHVVLQJQRWSHUIRUPHGDIWHUHDFKVHWRIDFTXLVLWLRQVEXWH[HFXWHGVHTXHQWLDOO\DIWHUDGHOD\HODSVHG
06Y9

Conditions
• Cosmic STM8 C compiler 32K version v4.3.6
• Compiler options: +modsl0 -pxp +split -pp
• STMTouch driver default options: ECS=ON, DTO=ON, DXS=ON (excepted if one
channel is used)
• Each sensor has its own parameters, all parameters placed in RAM
The following table summarizes the timings measured for the different acquisition
sequences:

Table 16. STM8TL5x acquisition timings(1)

Duration
Process Function Conditions Comment
(us)

Startup before main() Any ~60000 Compiler dependent

3 touchkeys /
~7500 Time before the driver is ready to
TSL_obj_GroupInit() 1bank
TSL initialization report a touch including the
TSL_Init() 19 touchkeys /
~30000 calibration
4banks
TSL_acq_BankConf This must be repeated for each
Acquisition Initialization Any 66
ig() bank

UM1606 Rev 6 65/124

123
STMTouch driver UM1606

Table 16. STM8TL5x acquisition timings(1) (continued)

Duration
Process Function Conditions Comment
(us)

UP = 1, PASS = 1 ~125 Reference target set to 500

UP = 1, PASS = 2 ~187 whatever the number of enabled
Hardware acquisition None receivers
UP = 2, PASS = 2 ~250 PXS_CKCR1 = 0x70 (i.e. HSI_PXS
UP = 3, PASS = 3 ~350 = 16 MHz)

3 receivers 81
TSL_acq_BankGet 5 receivers 135
Measurement storing
Result()
by enabled
~27
receiver

TSL_obj_GroupProc 3 touchkeys 63 One object group

Touchkey processing
ess() 19 touchkeys 460 Two object groups
3 touchkeys 302 Including hardware acquisition but
Full processing TSL_action() without the ECS which is executed
19 touchkeys 1680 each 100 ms
3 touchkeys 220
Not performed after each acquisition
ECS processing TSL_ecs_Process() 19 touchkeys 1400
but on scheduling
by touchkey ~75
1. The content of this table is provided for information purposes only.

2.20.6 MCU resources

The table below shows the peripherals that are used by the STMTouch driver on STM8TL5x
devices. Care must be taken when using them to avoid any unwanted behavior.

Table 17. STM8TL5x MCU resources used

Peripheral Function

GPIOs Acquisition
8-bit timer (TIM 4) Time base for ECS and DTO
ProxSense (PXS) Acquisition

66/124 UM1606 Rev 6

UM1606 STMTouch driver

2.20.7 STM8TL5x available touch-sensing channels

The table below provides an overview of the available touch sensing channels for the
STM8TL5x devices.
Note: The following table is not restrictive in term of part numbers supported by the STMTouch
driver. The STMTouch driver can be used on any new device that may become available as
part of ST microcontrollers portfolio. Please contact your ST representative for support.

UM1606 Rev 6 67/124

123
STMTouch driver UM1606

Table 18. Available touch-sensing channels for STM8TL5x

Subfamily STM8TL5x

Packages TSSOP20 UFQFPN28 UFQFPN48

STM8TL52F4P STM8TL52G4U
Part numbers STM8TL53C4U
STM8TL53F4P STM8TL53G4U

PXS function GPIO Pin Pin Usage Pin Pin Usage Pin Usage

RX0a - 11 11 10 10 13
RX1a - 12 12 11 11 15
RX2a - 13 13 12 12 17
RX3a - - - 13 13 19

Receiver RX4a - - - 5 Receivers / 14 14 8 Receivers / 21 10 Receivers /

A(1) RX5a - - - Transmitters 15 15 Transmitters 23 Transmitters

RX6a - 14 14 16 16 25
RX7a - 15 15 17 17 27
RX8a - - - - - 29
RX9a - - - - - 31
RX0b - - - - - 14
RX1b - - - - - 16
RX2b - - - - - 18
RX3b - - - - - 20

Receiver RX4b - - - 0 Receivers / - - 0 Receivers / 22 10 Receivers /

B(1) RX5b - - - Transmitters - - Transmitters 24 Transmitters

RX6b - - - - - 26
RX7b - - - - - 28
RX8b - - - - - 30
RX9b - - - - - 32

68/124 UM1606 Rev 6

UM1606 STMTouch driver

Table 18. Available touch-sensing channels for STM8TL5x (continued)

Subfamily STM8TL5x

Packages TSSOP20 UFQFPN28 UFQFPN48

STM8TL52F4P STM8TL52G4U
Part numbers STM8TL53C4U
STM8TL53F4P STM8TL53G4U

PXS function GPIO Pin Pin Usage Pin Pin Usage Pin Usage

TX0 PD0 16 16 18 18 33
TX1 PD1 17 17 19 19 34
(2)
TX2 PD2 - - 20 20 35
(2)
TX3 PD3 - - 21 21 36
TX4 PD4 18(2) 18 22(2) 22 39
TX5 PD5 19(2) 19 23(2) 23 40
STM8TL52F4P: STM8TL52G4U:
TX6 PD6 20(2) 20 2 Transmitters 24(2) 24 2 Transmitters 41
(2)
Transmitter TX7 PD7 - - 27 27 42 15 Transmitters
STM8TL53F4P: (2) STM8TL53G4U:
TX8 PB0 - - 28 28 43
5 Transmitters 9 Transmitters
TX9 PB1 - - - - 44
TX10 PB2 - - - - 45
TX11 PB3 - - - - 46
TX12 PB4 - - - - 47
TX13 PB5 - - - - 48
TX14 PB6 - - - - 1
STM8TL52F4P: 12 channels STM8TL52G4U: 25 channels
with a 4RX*3TX matrix with a 5RX*5TX matrix
Maximum number 300 channels with a
of channels 20RX*15TX matrix
STM8TL53F4P: 25 channels STM8TL53G4U: 72 channels
with a 5RX*5TX matrix with a 8RX*9TX matrix
1. The receivers can also be used as transmitters. This is used to define the square matrix to address the maximum number of
channels (please refer to product datasheet for further information).
2. On STM8TL52 devices, this GPIO is present but does not support the PXS alternate function.

UM1606 Rev 6 69/124

123
STMTouch driver UM1606

2.20.8 Hardware implementation example

Figure 18. shows an example of hardware implementation on STM8TL5x devices.

Recommendations to increase the noise immunity on the PCB:

To ensure a correct operation in noisy environment, the floating nets must be avoided
(tracks, copper elements, conductive frames, etc...).
As a consequence:
All unused touch controller I/Os must be either configured to output push-pull low or
externally tied to GND.
The parameters TSLPRM_PXS_INACTIVE_TX and TSLPRM_PXS_INACTIVE_RX should
also be configured to the Grounded state.

70/124 UM1606 Rev 6

 Figure 18. STM8TL5x hardware implementation example

UM1606
1 2 3 4

VDD
A
CN1 Touchkeys A

1
VDD K1 K2 K3 K4 K5
2 SWIM U1
SWIM
3 2 13 R1 1K KEY_Row1 1 2 1 2 1 2 1 2 1 2
GND PA0/SWIM PXS_RX0a
4 RESET 10 15 R2 1K KEY_Row2
RST PA5/NRST PXS_RX1a
17 R3 1K KEY_Row3
C1 PXS_RX2a Sensor Sensor Sensor Sensor Sensor
SPI_NSS 3 19 R4 1K KEY_Row4
10nF_X7R PA1/SPI_NSS PXS_RX3a
TSM-104-01-L-SH-A SPI_SCK 4 21 R5 1K KEY_Row5
PA2/SPI_SCK PXS_RX4a K6 K7 K8 K9 K10
SPI_MISO 5 23
SWIM connector SPI_MOSI 6
PA3/SPI_MISO/I2C_SDA
PA4/SPI_MOSI/I2C_SCL
PXS_RX5a
PXS_RX6a
25 1 2 1 2 1 2 1 2 1 2
27
PXS_RX7a
11 29
PA6/PXS_TRIG PXS_RX8a Sensor Sensor Sensor Sensor Sensor
12 31
PA7/PXS_RFIN PXS_RX9a
VDD VDD
K11 K12 K13 K14 K15
14
PXS_RX0b
7 16 1 2 1 2 1 2 1 2 1 2
VDD PXS_RX1b
38 18
B VDDIO PXS_RX2b B
9 20
PXS_VREG PXS_RX3b Sensor Sensor Sensor Sensor Sensor
22
PXS_RX4b
24
C2 C3 C4 C5 PXS_RX5b K16 K17 K18 K19 K20
26
100nF_X7R 100nF_X7R 1uF_X5R PXS_RX6b
100pF_X7R 28 1 2 1 2 1 2 1 2 1 2
PXS_RX7b
8 30
UM1606 Rev 6

VSS PXS_RX8b
37 32
VSSIO PXS_RX9b Sensor Sensor Sensor Sensor Sensor

PB6/PXS_TX14
PB5/PXS_TX13
PB4/PXS_TX12
PB3/PXS_TX11
PB2/PXS_TX10
K21 K22 K23 K24 K25

PD7/PXS_TX7
PD6/PXS_TX6
PD5/PXS_TX5
PD4/PXS_TX4
PD3/PXS_TX3
PD2/PXS_TX2
PD1/PXS_TX1
PD0/PXS_TX0
PB1/PXS_TX9
PB0/PXS_TX8
1 2 1 2 1 2 1 2 1 2

Sensor Sensor Sensor Sensor Sensor

1
48
47
46
45
44
43

42
41
40
39
36
35
34
33
STM8TL53C4U6
C C
R6 1K KEY_Col1
R7 1K KEY_Col2
R8 1K KEY_Col3
R9 1K KEY_Col4
R10 1K KEY_Col5

NOTES:
1. ESD serial resistors (R1 to R10) must be placed closed to U1.
2. C4 equivalent serial resistor must be equal or lower than 0.2 Ohms at 1 MHz.

D D

STMTouch driver
STMicroelectronics
Title: STM8TL53 Reference Schematic
Microcontrollers Division
Size: A4 Reference: * Revision: B-00 190, avenue Célestin COQ
13106 ROUSSET Cedex
Date: 20-FEB-12 Sheet: 1 of 1 FRANCE £
1 2 3 4
71/10
STMTouch driver UM1606

2.21 STM32F0xx devices

2.21.1 Acquisition
The STM32F0xx devices acquisition is done in the files:
• tsl_acq_stm32f0xx.c
• tsl_acq_stm32f0xx.h
Functions used by the application layer and that are device dependent:
• TSL_acq_BankConfig()
• TSL_acq_BankStartAcq()
• TSL_acq_BankWaitEOC()
• TSL_acq_GetMeas()
The other functions in this file are for internal use and the user doesn't need to call them
directly.

2.21.2 Timings
The STM32F0xx devices timing management is done in the files:
• tsl_time_stm32f0xx.c
• tsl_time_stm32f0xx.h
The systick is used to generate a timebase for the ECS and DTO modules.
Functions used:
• TSL_tim_Init()

2.21.3 Parameters
The parameters specific to the STM32F0xx devices are described in the file:
• tsl_conf_stm32f0xx.h
and are checked in the file:
• tsl_check_config_stm32f0xx.h

2.21.4 Memory footprint

Conditions
• IAR ANSI C/C++ Compiler V6.40.1 for Arm®
• Compiler options: optimization high-balanced
• IAR library not counted
• STMTouch driver default options: ECS=ON, DTO=ON, ZONE=OFF, DXS=ON
(excepted if only one sensor is used)
• Each sensor has its own parameters, all parameters placed in RAM
The following tables summarize the memory footprint with different configurations:

72/124 UM1606 Rev 6

UM1606 STMTouch driver

Table 19. STM32F0xx memory footprint without proximity(1)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

3 3 3 TKeys ~3.9 ~130

3 3 1 Linear-3ch ~4.9 ~120
9 TKeys
15 6 1 Linear-3ch ~7.7 ~350
1 Rotary-3ch
1. The content of this table is provided for information purposes only.

Table 20. STM32F0xx memory footprint with proximity(1)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

3 3 3 TKeys ~4.7 ~140

3 3 1 Linear-3ch ~5.8 ~130
9 TKeys
15 6 1 Linear-3ch ~9.5 ~390
1 Rotary-3ch
1. The content of this table is provided for information purposes only.

2.21.5 MCU resources

The table below shows the peripherals that are used by the STMTouch driver on
STM32F0xx devices. Care must be taken when using them to avoid any unwanted
behavior.

Table 21. STM32F0xx MCU resources used

Peripheral Function

GPIOs Acquisition
Systick Time base for ECS and DTO
Touch sense controller (TSC) Acquisition

2.21.6 STM32F0xx available touch-sensing channels

The tables below provide an overview of the available touch sensing channels for the
STM32F0xx devices.
Note: The following tables are not restrictive in term of part numbers supported by the STMTouch
driver. The STMTouch driver can be used on any new device that may become available as
part of ST microcontrollers portfolio. Please contact your ST representative for support.
Note: For n available pins in an I/O group, one pin is used as sampling capacitor and n-1 pins are
used as channels.
The I/O group cannot be used if the number of available pins in less or equal to one.

UM1606 Rev 6 73/124

123
74/10

STMTouch driver
Table 22. Available touch sensing channels for STM32F042
Subfamily STM32F042

Packages TSSOP20 UFQFPN28 LQFP32 / UFQFPN32 WLCSP36 LQFP48 / UFQFPN48

Flash memory size 4=16K, 6=32K

Part numbers STM32F042F[46] STM32F042G[46] STM32F042K[46] STM32F042T[46] STM32F042C[46]

Number Number Number Number Number

Analo
Gx_ GPI of of Pin Pin of of of
g I/O Pin Usage Pin Usage Usage Pin Usage Pin Usage
IOy O availabl availabl LQFP UFQFPN availabl availabl availabl
group
e pins e pins e pins e pins e pins

G1_IO1 PA0 6 6 6 6 F6 10 4 3
3 3 channels
3 channels 3 channels
G1_IO2 PA1 7 channels 7 7 7 D4 channels 11 with 1
with 1 with 1
Group 1 4 with 1 4 4 4 with 1 sampling
sampling sampling 12
G1_IO3 PA2 8 sampling 8 8 8 E4 sampling capacitor
capacitor capacitor
capacitor capacitor
UM1606 Rev 6

G1_IO4 PA3 9 9 9 9 F5 13

G2_IO1 PA4(1) 10 10 10 10 C3 14 4 3
3 3 channels
3 channels 3 channels
G2_IO2 PA5(1) 11 channels 11 11 11 D3 channels 15 with 1
with 1 with 1
Group 2 4 with 1 4 4 4 with 1 sampling
sampling sampling
G2_IO3 PA6 12 sampling 12 12 12 E3 sampling 16 capacitor
capacitor capacitor
capacitor capacitor
G2_IO4 PA7 13 13 13 13 F4 17

G3_IO1 - - - - - - - 3 2
1/2 channels
Cannot be 1 channel 2channel
G3_IO2 PB0 - 14 14 14 channels F3 18 with 1
used for with 1 s with 1
Group 3 1 2 2/3 with 1 3 sampling
touch sampling sampling
G3_IO3 PB1 14 15 15 15 sampling F2 19 capacitor
sensing capacitor capacitor
capacitor
G3_IO4 PB2 - - - 16 C2 20

G4_IO1 PA9 17(2) 19(2) 19 19 D1 30 4 3

3 channels
(2) 1 channel (2) 1 channel 3 channels
G4_IO2 PA10 18 20 20 20 D2 channels 31 with 1
with 1 with 1 with 1
Group 4 2 2 4 4 with 1 sampling
(2) sampling (2) sampling sampling 32
G4_IO3 PA11 17 19 21 21 C1 sampling capacitor
capacitor capacitor capacitor
(2) (2) capacitor
G4_IO4 PA12 18 20 22 22 A1 33

UM1606
 Table 22. Available touch sensing channels for STM32F042 (continued)

UM1606
Subfamily STM32F042

Packages TSSOP20 UFQFPN28 LQFP32 / UFQFPN32 WLCSP36 LQFP48 / UFQFPN48

Flash memory size 4=16K, 6=32K

Part numbers STM32F042F[46] STM32F042G[46] STM32F042K[46] STM32F042T[46] STM32F042C[46]

Number Number Number Number Number

Analo
Gx_ GPI of of Pin Pin of of of
g I/O Pin Usage Pin Usage Usage Pin Usage Pin Usage
IOy O availabl availabl LQFP UFQFPN availabl availabl availabl
group
e pins e pins e pins e pins e pins

G5_IO1 PB3 - 24 26 26 B3 39 4 3
3 channels
Cannot be 3 channels 3 channels
G5_IO2 PB4 - 25 27 27 A3 channels 40 with 1
used for with 1 with 1
Group 5 0 4 4 4 with 1 sampling
touch sampling sampling 42
G5_IO3 PB6 - 27 29 29 C4 sampling capacitor
sensing capacitor capacitor
capacitor
G5_IO4 PB7 - 28 30 30 A4 43
UM1606 Rev 6

- - - - - -
Cannot be Cannot be Cannot be Cannot be Cannot be
- - - - - -
used for used for used for used for used for
Group 6 0 0 0 0 0
touch Touch Touch Touch Touch
- - - - - -
sensing sensing sensing sensing sensing
- - - - - -

- - - - - -
Cannot be Cannot be Cannot be Cannot be Cannot be
- - - - - -
used for used for used for used for used for
Group 7 not available 0 0 0 0 0
- Touch - Touch - - Touch - Touch - Touch
sensing sensing sensing sensing sensing
- - - - - -

- - - - - -
Cannot be Cannot be Cannot be Cannot be Cannot be
- - - - - -
used for used for used for used for used for
Group 8 0 0 0 0 0
Touch Touch Touch Touch Touch
- - - - - -
sensing sensing sensing sensing sensing
- - - - - -

STMTouch driver
Maximum number of 14 with 5 sampling
7 with 3 sampling capacitors 11 with 5 sampling capacitors 13/14 with 5 sampling capacitors 14 with 5 sampling capacitors
channels capacitors

1. This GPIO offers a reduced touch sensing sensitivity. It is thus recommended to use it as sampling capacitor I/O.
2. Pin pair PA11/PA12 can be remapped instead of pin pair PA9/PA10 using SYS_CTRL register.
75/10
76/10

STMTouch driver
Table 23. Available touch sensing channels for STM32F051 and STM32F072
Subfamily STM32F051/STM32F072

Packages LQFP32/UFQFPN32 LQFP48 LQFP64 LQFP100

Flash memory size 4=16K, 6=32K, 8=64K, B=128K, C=256K

STM32F051C[468B] STM32F051R[468B] STM32F051VB

Part numbers STM32F051K[468]
STM32F072C[8B] STM32F072R[8B] STM32F052V[8B]

Number of Number of Number of Number of

Analog Pin Pin
Gx_IOy GPIO available Usage Pin available Usage Pin available Usage Pin available Usage
I/O group LQFP UFQFPN
pins pins pins pins

G1_IO1 PA0 6 6 10 14 23
3 channels 3 channels 3 channels 3 channels
G1_IO2 PA1 7 7 11 15 24
with 1 with 1 with 1 with 1
Group 1 4 4 4 4
sampling sampling sampling sampling
G1_IO3 PA2 8 8 12 16 25
capacitor capacitor capacitor capacitor
G1_IO4 PA3 9 9 13 17 26
UM1606 Rev 6

G2_IO1 PA4(1) 10 10 14 20 29
3 channels 3 channels 3 channels 3 channels
G2_IO2 PA5(1) 11 11 15 21 30
with 1 with 1 with 1 with 1
Group 2 4 4 4 4
G2_IO3 PA6 12 12 sampling 16 sampling 22 sampling 31 sampling
capacitor capacitor capacitor capacitor
G2_IO4 PA7 13 13 17 23 32

G3_IO1 PC5 - - - 25 34
1/2 channels 2 channels 3 channels 3 channels
G3_IO2 PB0 14 14 18 26 35
with 1 with 1 with 1 with 1
Group 3 2/3 3 4 4
sampling sampling sampling sampling
G3_IO3 PB1 15 15 19 27 36
capacitor capacitor capacitor capacitor
G3_IO4 PB2 - 16 20 28 37

G4_IO1 PA9 19 19 30 42 68
3 channels 3 channels 3 channels 3 channels
G4_IO2 PA10 20 20 31 43 69
with 1 with 1 with 1 with 1
Group 4 4 4 4 4
sampling sampling sampling sampling
G4_IO3 PA11 21 21 32 44 70
capacitor capacitor capacitor capacitor
G4_IO4 PA12 22 22 33 45 71

G5_IO1 PB3 26 26 39 55 89
3 channels 3 channels 3 channels 3 channels
G5_IO2 PB4 27 27 40 56 90
with 1 with 1 with 1 with 1
Group 5 4 4 4 4
sampling sampling sampling sampling
G5_IO3 PB6 29 29 42 58 92
capacitor capacitor capacitor capacitor

UM1606
G5_IO4 PB7 30 30 43 59 93
 Table 23. Available touch sensing channels for STM32F051 and STM32F072 (continued)

UM1606
Subfamily STM32F051/STM32F072

Packages LQFP32/UFQFPN32 LQFP48 LQFP64 LQFP100

Flash memory size 4=16K, 6=32K, 8=64K, B=128K, C=256K

STM32F051C[468B] STM32F051R[468B] STM32F051VB

Part numbers STM32F051K[468]
STM32F072C[8B] STM32F072R[8B] STM32F052V[8B]

Number of Number of Number of Number of

Analog Pin Pin
Gx_IOy GPIO available Usage Pin available Usage Pin available Usage Pin available Usage
I/O group LQFP UFQFPN
pins pins pins pins

G6_IO1 PB11 - - 22 30 48
Cannot be 3 channels 3 channels 3 channels
G6_IO2 PB12 - - used for 25 with 1 33 with 1 51 with 1
Group 6 0 4 4 4
touch sampling sampling sampling
G6_IO3 PB13 - - 26 34 52
sensing capacitor capacitor capacitor
G6_IO4 PB14 - - 27 35 53

G7_IO1 PE2 - - - - 1
UM1606 Rev 6

Cannot be Cannot be 3 channels

G7_IO2 PE3 - - - - Cannot be 2
used for used for with 1
Group 7 0 0 0 used for 4
Touch Touch sampling
G7_IO3 PE4 - - - - Touch sensing 3
sensing sensing capacitor
G7_IO4 PE5 - - - - 4

G8_IO1 PD12 - - - - 59
Cannot be Cannot be 3 channels
G8_IO2 PD13 - - - - Cannot be 60
used for used for with 1
Group 8 0 0 0 used for 4
Touch Touch sampling
G8_IO3 PD14 - - - - Touch sensing 61
sensing sensing capacitor
G8_IO4 PD15 - - - - 62

Maximum number of channels 13/14 with 5 sampling capacitors 17 with 6 sampling capacitors 18 with 6 sampling capacitors 24 with 8 sampling capacitors

1. This GPIO offers a reduced touch sensing sensitivity. It is thus recommended to use it as sampling capacitor I/O.

STMTouch driver
77/10
STMTouch driver UM1606

2.21.7 Hardware implementation example

Figure 19 shows an example of hardware implementation on STM32F0xx devices.

Recommendations to increase the noise immunity on the PCB

To ensure a correct operation in noisy environment, the floating nets must be avoided
(tracks, copper elements, conductive frames, etc...).
As a consequence:
• All unused touch controller I/Os must be either configured to output push-pull low or
externally tied to GND.
• The parameter TSLPRM_TSC_IODEF should also be configured to the output push-
pull low state.
• We recommend to drive the sampling capacitor common node using a standard I/O of
the touch controller configured in output push-pull low mode.
• It may also be required to add a capacitor-input filter (pi filter) on each channel line.

78/124 UM1606 Rev 6

 Figure 19. STM32F0xx hardware implementation example

UM1606
1 2 3 4

+5V U1 VDD Notes:

LD3985M33R 1. ESD serial resistors and sampling capacitors must be placed as close as possible to MCU device.
1 Vin Vout 5 2. Sampling capacitors must be COG type or better.
3. A dedicated low drop voltage regulator powering the touch controller is recommended.

100nF_X7R_0603

100nF_X7R_0603
1µF_X5R_0603

1µF_X5R_0603
C1 C2 3 INH
C3 C4
GND BYPASS G1_IO4 1
A A

4
K1

G4_IO4
G4_IO3
G4_IO2
G4_IO1

G6_IO4
G6_IO3
G6_IO2
C5

G2_IO4 1
10nF_X7R_0603

10K_5%_0603
K2
VDD

R1
R2
R3

R4
R5
R6
SWDIO
G3_IO4 1

C6 C7 C8 C9
K3
100nF_X7R_0603
U2 G4_IO2 1

48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
STM32F051R8
VDD
K4

PF7
PF6

PA9
PA8
PC9
PC8
PC7
PC6
PA13
PA12
PA11
PA10

PB15
PB14
PB13
PB12
SWCLK 49 32
PA14 VDD_2
50 31 G4_IO3 1
B PA15 VSS_2 B
51 30 G6_IO1
PC10 PB11
52 29
PC11 PB10 K5
53 28 R7 G3_IO4
PC12 PB2
54 27 R8 G3_IO3
PD2 PB1
G5_IO1 55 26 R9 G3_IO2 G4_IO4 1
PB3 PB0
G5_IO2 R10 56 25 G3_IO1
UM1606 Rev 6

PB4 PC5
57 24
PB5 PC4 K6
58 23 R11 G2_IO4
PB6 PA7
59 22 R12 G2_IO3
PB7 PA6
60 21 R13 G2_IO2 G6_IO2 1
BOOT0 PA5
61 20 G2_IO1

PF1/OSC_OUT
PB8 PA4
62 19

PF0/OSC_IN
PB9 PF5 K7
63 18
VSS_1 PF4
64 17 R14 G1_IO4
VDD VDD_1 PA3

VDDA
VBAT

NRST

VSSA
G6_IO3 1

PC13
PC14
PC15
10K_5%_0603

PA0
PA1
PA2
PC0
PC1
PC2
PC3
SHIELD
K8

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
G5_IO2 Shield R15
C 10K_5%_0603 C
G6_IO4 1

R16
R17
10K_5%_0603
K9
VDD VDD

SAMPLING CAPACITOR

G1_IO1
G1_IO2
G1_IO3
G1_IO1
G2_IO1
G3_IO1 RTS1
G4_IO1
G5_IO1 VDD LTS1
G6_IO1 G1_IO2 1 G1_IO3 2
1 A
Y1 G2_IO3 3
R18 B
1 2 G2_IO2 2 G3_IO3 1
NC 10K_5%_0603 2 C
4
47nF_COG_1206

47nF_COG_1206

47nF_COG_1206

15nF_COG_1206

15nF_COG_1206

K
1µF_X5R_0603

4 3 G3_IO2 3
NC 3
22pF_COG_0603 C10
C11 C12 C13 C14 C15 C16 Quartz 8MHz 10nF_X7R_0603 Linear touch sensor Rotary touch sensor
D D

STMTouch driver
C17 C18
22pF_COG_0603
STMicroelectronics
Title: STM32F0xx CT Reference Design
Microcontrollers Division
Size: A4 Reference: Revision: A-00 190, avenue Célestin COQ
13106 ROUSSET Cedex
Date: 01 APR 2012 Sheet: 1 of 1 FRANCE £
1 2 3 4
79/10
STMTouch driver UM1606

2.22 STM32F3xx devices

2.22.1 Acquisition
The STM32F3xx devices acquisition is done in the files:
• tsl_acq_stm32f3xx.c
• tsl_acq_stm32f3xx.h
Functions used by the application layer and that are device dependent:
• TSL_acq_BankConfig()
• TSL_acq_BankStartAcq()
• TSL_acq_BankWaitEOC()
• TSL_acq_GetMeas()
The other functions in this file are for internal use and the user doesn't need to call them
directly.

2.22.2 Timings
The STM32F3xx devices timing management is done in the files:
• tsl_time_stm32f3xx.c
• tsl_time_stm32f3xx.h
The systick is used to generate a timebase for the ECS and DTO modules.
Functions used:
• TSL_tim_Init()

2.22.3 Parameters
The parameters specific to the STM32F3xx devices are described in the file:
• tsl_conf_stm32f3xx.h
and are checked in the file:
• tsl_check_config_stm32f3xx.h

2.22.4 Memory footprint

Conditions
• IAR ANSI C/C++ Compiler V6.40.1 for Arm®
• Compiler options: optimization high-balanced
• IAR library not counted
• STMTouch driver default options: ECS=ON, DTO=ON, PROX=OFF, ZONE=OFF,
DXS=OFF
• Each sensor has its own parameters, all parameters placed in RAM
The following tables summarize the memory footprint with different configurations:

80/124 UM1606 Rev 6

UM1606 STMTouch driver

Table 24. STM32F30x memory footprint(1)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

2 2 2 TKeys ~3.2 ~120

1. The content of this table is provided for information purposes only.

Table 25. STM32F37x memory footprint(1)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

3 3 3 TKeys ~3.3 ~140

3 3 1 Linear-3ch ~4.3 ~130
1. The content of this table is provided for information purposes only.

2.22.5 MCU resources

The table below shows the peripherals that are used by the STMTouch driver on
STM32F3xx devices. Care must be taken when using them to avoid any unwanted
behavior.

Table 26. STM32F3xx MCU resources used

Peripheral Function

GPIOs Acquisition
Systick Time base for ECS and DTO
Touch sense controller (TSC) Acquisition

2.22.6 STM32F3xx available touch-sensing channels

The tables below provide an overview of the available touch sensing channels for the
STM32F30x and STM32F37x devices.
Note: The following tables are not restrictive in term of part numbers supported by the STMTouch
driver. The STMTouch driver can be used on any new device that may become available as
part of ST microcontrollers portfolio. Please contact your ST representative for support.
Note: For n available pins in an I/O group, one pin is used as sampling capacitor and n-1 pins are
used as channels.
The I/O group cannot be used if the number of available pins in less or equal to one.

UM1606 Rev 6 81/124

123
82/10

STMTouch driver
Table 27. Available touch sensing channels for STM32F30x
Subfamily STM32F30x

Packages LQFP32 LQFP48 LQFP64 LQFP100

STM32F301K[468] STM32F301C[468] STM32F301R[468]

STM32F302K[468] STM32F302C[468BC] STM32F302R[468BC] STM32F302V[BC]
Part numbers
STM32F303K[468] STM32F303C[468BC] STM32F303R[468BC] STM32F303V[BC]
STM32F333K[468] STM32F333C[468] STM32F333R[468]

Number Number Number

Analog Number of
of of of
Gx_IOy GPIO Pin Usage Pin Usage Pin available Usage Pin Usage
I/O group available availabl availabl
pins
pins e pins e pins

G1_IO1 PA0 7 10 14 23

G1_IO2 PA1 8 11 15 24
3 channels with 3 channels with 3 channels with 3 channels with
UM1606 Rev 6

Group 1 4 4 4 4
1 sampling capacitor 1 sampling capacitor 1 sampling capacitor 1 sampling capacitor
G1_IO3 PA2 9 12 16 25

G1_IO4 PA3 10 13 17 26

G2_IO1 PA4(1) 11 14 20 29

G2_IO2 PA5(1) 12 15 21 30
3 channels with 3 channels with 3 channels with 3 channels with
Group 2 4 4 4 4
G2_IO3 PA6 13 1 sampling capacitor 16 1 sampling capacitor 22 1 sampling capacitor 31 1 sampling capacitor

G2_IO4 PA7 14 17 23 32

G3_IO1 PC5 - - 25 34

G3_IO2 PB0 15 Cannot be used for 18 26 35

2 channels with 3 channels with 3 channels with
Group 3 1 3 4 4
touch sensing 1 sampling capacitor 1 sampling capacitor 1 sampling capacitor
G3_IO3 PB1 - 19 27 36

G3_IO4 PB2 - 20 28 37

G4_IO1 PA9 19 30 42 68

G4_IO2 PA10 20 31 43 69
3 channels with 3 channels with 3 channels with 3 channels with
Group 4 4 4 4 4
1 sampling capacitor 1 sampling capacitor 1 sampling capacitor 1 sampling capacitor
G4_IO3 PA13 23 34 46 72

G4_IO4 PA14 24 37 49 76

UM1606
 Table 27. Available touch sensing channels for STM32F30x (continued)

UM1606
Subfamily STM32F30x

Packages LQFP32 LQFP48 LQFP64 LQFP100

STM32F301K[468] STM32F301C[468] STM32F301R[468]

STM32F302K[468] STM32F302C[468BC] STM32F302R[468BC] STM32F302V[BC]
Part numbers
STM32F303K[468] STM32F303C[468BC] STM32F303R[468BC] STM32F303V[BC]
STM32F333K[468] STM32F333C[468] STM32F333R[468]

Number Number Number

Analog Number of
of of of
Gx_IOy GPIO Pin Usage Pin Usage Pin available Usage Pin Usage
I/O group available availabl availabl
pins
pins e pins e pins

G5_IO1 PB3 26 39 55 89

G5_IO2 PB4 27 3 channels with 40 3 channels with 56 3 channels with 90 3 channels with
Group 5 4 4 4 4
1 sampling capacitor 1 sampling capacitor 1 sampling capacitor 1 sampling capacitor
G5_IO3 PB6 29 42 58 92
UM1606 Rev 6

G5_IO4 PB7 30 43 59 93

G6_IO1 PB11 - 22 30 48

G6_IO2 PB12 - Cannot be used for 25 3 channels with 33 3 channels with 51

3 channels with
Group 6 0 4 4 4
touch sensing 1 sampling capacitor 1 sampling capacitor 1 sampling capacitor
G6_IO3 PB13 - 26 34 52

G6_IO4 PB14 - 27 35 53

G7_IO1 PE2 - - - 1

G7_IO2 PE3 - Cannot be used for - Cannot be used for - Cannot be used for 2
3 channels with
Group 7 0 0 0 4
touch sensing touch sensing touch sensing 1 sampling capacitor
G7_IO3 PE4 - - - 3

G7_IO4 PE5 - - - 4

G8_IO1 PD12 - - - 59

G8_IO2 PD13 - Cannot be used for - Cannot be used for - Cannot be used for 60
3 channels with
Group 8 0 0 0 4
touch sensing touch sensing touch sensing 1 sampling capacitor

STMTouch driver
G8_IO3 PD14 - - - 61

G8_IO4 PD15 - - - 62

Maximum number
12 with 4 sampling capacitors 17 with 6 sampling capacitors 18 with 6 sampling capacitors 24 with 8 sampling capacitors
of channels

1. This GPIO offers a reduced touch sensing sensitivity. It is thus recommended to use it as sampling capacitor I/O.
83/10
 .

Table 28. Available touch sensing channels for STM32F37x

84/10

STMTouch driver
Subfamily STM32F37x

Packages LQFP48 LQFP64 LQFP100 / UFBGA100

Flash memory size 8=64K, B=128K, C=256K

Part numbers STM32F373C[8BC] STM32F373R[8BC] STM32F373V[8BC]

Analog Number of Number of LQFP BGA Number of

Gx_IOy GPIO Pin available Usage Pin available Usage available Usage
I/O group pins pins Pin Pin pins
UM1606 Rev 6

G1_IO1 PA0 10 14 23 L2

G1_IO2 PA1 11 3 channels with 15 3 channels with 24 M2 3 channels with

Group 1 4 4 4
G1_IO3 PA2 12 1 sampling capacitor 16 1 sampling capacitor 25 K3 1 sampling capacitor

G1_IO4 PA3 13 18 26 L3
(1)
G2_IO1 PA4 14 20 29 M3

G2_IO2 PA5(1) 15 2 channels with 21 3 channels with 30 K4 3 channels with

Group 2 3 4 4
G2_IO3 PA6(1)
16 1 sampling capacitor 22 1 sampling capacitor 31 L4 1 sampling capacitor

G2_IO4 PA7 - 23 32 M4

G3_IO1 PC4 - 24 33 K5

G3_IO2 PC5 - 1 channel with 25 3 channels with 34 L5 3 channels with

Group 3 2 4 4
G3_IO3 PB0 18 1 sampling capacitor 26 1 sampling capacitor 35 M5 1 sampling capacitor

G3_IO4 PB1 19 27 36 M6

G4_IO1 PA9 30 42 68 D10

G4_IO2 PA10 31 3 channels with 43 3 channels with 69 C12 3 channels with

Group 4 4 4 4

UM1606
G4_IO3 PA13 34 1 sampling capacitor 46 1 sampling capacitor 72 A11 1 sampling capacitor

G4_IO4 PA14 37 49 76 A10

 Table 28. Available touch sensing channels for STM32F37x (continued)

UM1606
Subfamily STM32F37x

Packages LQFP48 LQFP64 LQFP100 / UFBGA100

Flash memory size 8=64K, B=128K, C=256K

Part numbers STM32F373C[8BC] STM32F373R[8BC] STM32F373V[8BC]

Analog Number of Number of LQFP BGA Number of

Gx_IOy GPIO Pin available Usage Pin available Usage available Usage
I/O group pins pins Pin Pin pins
UM1606 Rev 6

G5_IO1 PB3 39 55 89 A8

G5_IO2 PB4 40 3 channels with 56 3 channels with 90 A7 3 channels with

Group 5 4 4 4
G5_IO3 PB6 42 1 sampling capacitor 58 1 sampling capacitor 92 B5 1 sampling capacitor

G5_IO4 PB7 43 59 93 B4

G6_IO1 PB14 26 34 53 K11

G6_IO2 PB15 27 2 channels with 35 2 channels with 54 K10 3 channels with

Group 6 3 3 4
G6_IO3 PD8 28 1 sampling capacitor 36 1 sampling capacitor 55 K9 1 sampling capacitor

G6_IO4 PD9 - - 56 K8

G7_IO1 PE2 - - 1 B2

G7_IO2 PE3 - Cannot be used for - Cannot be used for 2 A1 3 channels with
Group 7 0 0 4
G7_IO3 PE4 - touch sensing - touch sensing 3 B1 1 sampling capacitor

STMTouch driver
G7_IO4 PE5 - - 4 C2
85/10
 Table 28. Available touch sensing channels for STM32F37x (continued)
86/10

STMTouch driver
Subfamily STM32F37x

Packages LQFP48 LQFP64 LQFP100 / UFBGA100

Flash memory size 8=64K, B=128K, C=256K

Part numbers STM32F373C[8BC] STM32F373R[8BC] STM32F373V[8BC]

Analog Number of Number of LQFP BGA Number of

Gx_IOy GPIO Pin available Usage Pin available Usage available Usage
I/O group pins pins Pin Pin pins
UM1606 Rev 6

G8_IO1 PD12 - - 59 J10

G8_IO2 PD13 - Cannot be used for - Cannot be used for 60 H12 3 channels with
Group 8 0 0 4
G8_IO3 PD14 - touch sensing - touch sensing 61 H11 1 sampling capacitor

G8_IO4 PD15 - - 62 H10

Maximum number
14 with 6 sampling capacitors 17 with 6 sampling capacitors 24 with 8 sampling capacitors
of channels

1. This GPIO offers a reduced touch sensing sensitivity. It is thus recommended to use it as sampling capacitor I/O.

UM1606
UM1606 STMTouch driver

2.22.7 Hardware implementation example

Figure 20 shows an example of hardware implementation on STM32F3xx devices.

Recommendations to increase the noise immunity on the PCB

To ensure a correct operation in noisy environment, the floating nets must be avoided
(tracks, copper elements, conductive frames, etc...).
As a consequence:
• All unused touch controller I/Os must be either configured to output push-pull low or
externally tied to GND.
• The parameter TSLPRM_TSC_IODEF should also be configured to the output push-
pull low state.
• We recommend to drive the sampling capacitor common node using a standard I/O of
the touch controller configured in output push-pull low mode.
• It may also be required to add a capacitor-input filter (pi filter) on each channel line.

UM1606 Rev 6 87/124

123
 Figure 20. STM32F3xx hardware implementation example
88/10

STMTouch driver
1 2 3 4

+5V U1 VDD Notes:

LD3985M33R 1. ESD serial resistors and sampling capacitors must be placed as close as possible to MCU device.
1 Vin Vout 5 2. Sampling capacitors must be COG type or better.
3. A dedicated low drop voltage regulator powering the touch controller is recommended.

100nF_X7R_0603

100nF_X7R_0603
1µF_X5R_0603

1µF_X5R_0603
C1 C2 3 INH
C3 C4
GND BYPASS G1_IO4 1
A A

4
K1

G4_IO2
G4_IO1

G6_IO3
G6_IO2
G6_IO1
C5

G2_IO4 1
10nF_X7R_0603

10K_5%_0603
K2
VDD

R1

R2
R3
SWDIO
VDD
G3_IO4 1

C6 C7 C8 C9 C10 C11 C12

K3
100nF_X7R_0603
U2 G4_IO2 1

48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
STM32F372RxT6
K4

PF7
PF6

PA9
PA8
PC9
PC8
PC7
PC6
PD8
PA13
PA12
PA11
PA10

PB15
PB14
VREFSD+
SWCLK 49 32
PA14 VDDSD
50 31 G5_IO2 1
B PA15 VSSSD B
51 30
PC10 PE9
52 29
PC11 PE8 K5
53 28
PC12 PB2
54 27 R4 G3_IO4
PD2 PB1
G5_IO1 55 26 R5 G3_IO3 G6_IO2 1
PB3 PB0
UM1606 Rev 6

G5_IO2 R6 56 25 R7 G3_IO2
PB4 PC5
57 24 G3_IO1
PB5 PC4 K6
G5_IO3 R8 58 23 R9 G2_IO4
PB6 PA7
G5_IO4 R10 59 22 R11 G2_IO3
PB7 PA6
60 21 R12 G2_IO2 G5_IO3 1
BOOT0 PA5
61 20 G2_IO1

PF1/OSC_OUT
PB8 PA4
62 19

PF0/OSC_IN
PB9 VDD_2 K7
63 18 R13 G1_IO4
VSS_1 PA3
64 17 10K_5%_0603
VDD VDD_1 VREF+

VDDA
VBAT

NRST

VSSA
G6_IO3 1

PC13
PC14
PC15

PA0
PA1
PA2
PC0
PC1
PC2
PC3
K8

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
R14
C 10K_5%_0603 C
G5_IO4 1

R15
R16
10K_5%_0603
K9
VDD VDD

SAMPLING CAPACITOR

G1_IO1
G1_IO2
G1_IO3
G1_IO1
G2_IO1
G3_IO1 RTS1
G4_IO1
G5_IO1 VDD LTS1
G6_IO1 G1_IO2 1 G1_IO3 2
1 A
Y1 G2_IO3 3
R17 B
1 2 G2_IO2 2 G3_IO3 1
NC 10K_5%_0603 2 C
4
47nF_COG_1206

47nF_COG_1206

47nF_COG_1206

15nF_COG_1206

15nF_COG_1206

15nF_COG_1206

K
4 3 22pF_COG_0603 G3_IO2 3
NC 3
C13 C14 C15 C16 C17 C18 Quartz 8MHz Linear touch sensor Rotary touch sensor
D C19 D
C20 C21
22pF_COG_0603 100nF_X7R_0603
STMicroelectronics
Title: STM32F3xx CT Reference Design
Microcontrollers Division
Size: A4 Reference: Revision: A-00 190, avenue Célestin COQ
13106 ROUSSET Cedex
Date: 01 FEB 2013 Sheet: 1 of 1 FRANCE £

UM1606
1 2 3 4
UM1606 STMTouch driver

2.23 STM32L1xx devices

2.23.1 Acquisition
The STM32L1xx devices hardware acquisition mode (using two timers) is done in the
files:
• tsl_acq_stm32l1xx_hw.c
• tsl_acq_stm32l1xx_hw.h

Warning: This acquisition mode is available for the STM32L1xx High-

density and STM32L1xx Medium-density Plus devices only.

The STM32L1xx devices software acquisition mode is done in the files:

• tsl_acq_stm32l1xx_sw.c
• tsl_acq_stm32l1xx_sw.h
This acquisition is available for all STM32L1xx devices.
Note: The hardware acquisition mode is selected per default for the STM32L1xx High-density and
Medium-density Plus devices. If you want to use the software acquisition mode you must
add the following constant in the toolchain compiler preprocessor:
• TSLPRM_STM32L1XX_SW_ACQ
Functions used by the application layer and that are device dependent:
• TSL_acq_BankConfig()
• TSL_acq_BankStartAcq()
• TSL_acq_BankWaitEOC()
• TSL_acq_GetMeas()
The other functions in this file are for internal use and the user doesn't need to call them
directly.

2.23.2 Timings
The STM32L1xx devices timing management is done in the files:
• tsl_time_stm32l1xx.c
• tsl_time_stm32l1xx.h
The systick is used to generate a timebase for the ECS and DTO modules.
Functions used:
• TSL_tim_Init()

2.23.3 Parameters
The parameters specific to the STM32L1xx devices are described in the file:
• tsl_conf_stm32l1xx.h
and are checked in the file:
• tsl_check_config_stm32l1xx.h

UM1606 Rev 6 89/124

123
STMTouch driver UM1606

2.23.4 Memory footprint

Conditions
• IAR ANSI C/C++ Compiler V6.30.1 for Arm®
• Compiler options: optimization high-balanced
• IAR library not counted
• STMTouch driver default options: ECS=ON, DTO=ON, ZONE=OFF, DXS=ON
(excepted if only one sensor is used)
• Each sensor has its own parameters, all parameters placed in RAM
The following tables summarize the memory footprint taken by the STMTouch driver using
the hardware acquisition mode (using Timers) on STM32L1xx High-density devices:

Table 29. STM32L1xx_HD(1) memory footprint without proximity(2)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

3 3 3 TKeys ~6.2 ~370

3 3 1 Linear-3ch ~7.2 ~360
10 TKeys
16 3 1 Linear-3ch ~9.1 ~630
1 Rotary-3ch
1. See Section 3.1.1: Toolchain compiler preprocessor section for definition of STM32L1xx_HD.
2. The content of this table is provided for information purposes only.

Table 30. STM32L1xx_HD(1) memory footprint with proximity(2)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

3 3 3 TKeys ~7.0 ~380

3 3 1 Linear-3ch ~8.1 ~370
10 TKeys
16 3 1 Linear-3ch ~10.9 ~680
1 Rotary-3ch
1. See Section 3.1.1: Toolchain compiler preprocessor section for definition of STM32L1xx_HD.
2. The content of this table is provided for information purposes only.

The following tables summarize the memory footprint taken by the STMTouch driver using
the software acquisition mode on STM32L1xx Medium-density Plus devices:

Table 31. STM32L1xx_MDP(1) memory footprint without proximity(2)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

2 2 2 TKeys ~5.9 ~350

1. See Section 3.1.1: Toolchain compiler preprocessor section for definition of STM32L1xx_MDP.

90/124 UM1606 Rev 6

UM1606 STMTouch driver

2. The content of this table is provided for information purposes only

Table 32. STM32L1xx_MDP(1) memory footprint with proximity(2)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

2 2 2 TKeys ~6.7 ~360

1. See Section 3.1.1: Toolchain compiler preprocessor section for definition of STM32L1xx_MDP.
2. The content of this table is provided for information purposes only.

The following tables summarize the memory footprint taken by the STMTouch driver using
the software acquisition mode on STM32L1xx Medium-density devices:

Table 33. STM32L1xx_MD(1) memory footprint without proximity(2)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

2 2 2 TKeys ~5.2 ~400

3 3 1 Linear-3ch ~6.2 ~420
10 TKeys
16 3 1 Linear-3ch ~8.7 ~690
1 Rotary-3ch
1. See Section 3.1.1: Toolchain compiler preprocessor section for definition of STM32L1xx_MD.
2. The content of this table is provided for information purposes only.

Table 34. STM32L1xx_MD(1) memory footprint with proximity(2)

ROM RAM
Channels Banks Sensors
(Kbytes) (bytes)

2 2 2 TKeys ~6.0 ~400

3 3 1 Linear-3ch ~7.2 ~420
10 TKeys
16 3 1 Linear-3ch ~10.4 ~730
1 Rotary-3ch
1. See Section 3.1.1: Toolchain compiler preprocessor section for definition of STM32L1xx_MD.
2. The content of this table is provided for information purposes only.

UM1606 Rev 6 91/124

123
STMTouch driver UM1606

2.23.5 MCU resources

The tables below show the peripherals that are used by the STMTouch driver on
STM32L1xx devices. Care must be taken when using them to avoid any unwanted behavior.

Table 35. MCU resources used on STM32L1xx with hardware acquisition

Peripheral Function

GPIOs Acquisition
Systick Time base for ECS and DTO
2 Timers (TIM9, TIM11) Acquisition
Routing interface Acquisition

Table 36. MCU resources used on STM32L1xx with software acquisition

Peripheral Function

GPIOs Acquisition
Systick Time base for ECS and DTO
Routing interface Acquisition

2.23.6 STM32L1xx available touch-sensing channels

The tables below provide an overview of the available touch sensing channels for the
STM32L1xx devices.
Note: The following tables are not restrictive in term of part numbers supported by the STMTouch
driver. The STMTouch driver can be used on any new device that may become available as
part of ST microcontrollers portfolio. Please contact your ST representative for support.
Note: For n available pins in an I/O group, one pin is used as sampling capacitor and n-1 pins are
used as channels. The I/O group cannot be used if the number of available pins in less or
equal to one.

92/124 UM1606 Rev 6

 UM1606
Table 37. Available touch sensing channels for STM32L1xx 512K
Subfamily STM32L1xx 512K

Packages LQFP64 LQFP100 / WLCSP104 UFBGA132 LQFP144

STM32L151RE STM32L151VE STM32L151QE STM32L151ZE

Part numbers STM32L152RE STM32L152VE STM32L152QE STM32L152ZE
STM32L162RE STM32L162VE STM32L162QE STM32L162ZE

Number Number Number Number

Analog
LQFP of LQFP WLCSP of BGA of LQFP of
I/O Gx_IOy GPIO Usage Usage Usage Usage
pin available Pin ball available ball available pin available
group
pins pins pins pins

G1_IO1 PA0 14 3 23 K9 3 L2 3 34 3
channels channels channels channels
G1_IO2 PA1 15 24 L9 M2 35
with with with with
Group 1 4 4 4 4
G1_IO3 PA2 16 1 25 J8 1 K3 1 36 1
UM1606 Rev 6

sampling sampling sampling sampling

G1_IO4 PA3(1) 17 capacitor 26 H7 capacitor L3 capacitor 37 capacitor
G2_IO1 PA6 22 31 H6 L4 42
1 1 3 3
G2_IO2 PA7 23 channel 32 K7 channel J5 channels 43 channels
with with with with
Group 2 G2_IO3 PF15 - 2 - - 2 J9 4(2) 55 4(2)
1 1 1 1
G2_IO4 PG0(3) - sampling - - sampling H9 sampling 56 sampling
(3) capacitor capacitor capacitor capacitor
G2_IO5 PG1 - - - G9 57
G3_IO1 PB0(1) 26 35 J6 M5 46
2 2 4 4
G3_IO2 PB1 27 channels 36 K6 channels M6 channels 47 channels
with with with with
Group 3 G3_IO3 PB2 28 3 37 M6 3 L6 5 48 5
1 1 1 1
G3_IO4 PF11 - sampling - - sampling K6 sampling 49 sampling

STMTouch driver
capacitor capacitor capacitor capacitor
G3_IO5 PF12 - - - J7 50
93/10
 Table 37. Available touch sensing channels for STM32L1xx 512K (continued)
94/10

STMTouch driver
Subfamily STM32L1xx 512K

Packages LQFP64 LQFP100 / WLCSP104 UFBGA132 LQFP144

STM32L151RE STM32L151VE STM32L151QE STM32L151ZE

Part numbers STM32L152RE STM32L152VE STM32L152QE STM32L152ZE
STM32L162RE STM32L162VE STM32L162QE STM32L162ZE

Number Number Number Number

Analog
LQFP of LQFP WLCSP of BGA of LQFP of
I/O Gx_IOy GPIO Usage Usage Usage Usage
pin available Pin ball available ball available pin available
group
pins pins pins pins

G4_IO1 PA8 41 2 67 F3 2 D11 2 100 2

channels channels channels channels
G4_IO2 PA9 42 with 68 F1 with D10 with 101 with
Group 4 3 3 3 3
1 1 1 1
G4_IO3 PA10 43 sampling 69 F2 sampling C12 sampling 102 sampling
UM1606 Rev 6

capacitor capacitor capacitor capacitor

G5_IO1 PA13 46 2 72 E3 2 A11 2 105 2
channels channels channels channels
G5_IO2 PA14 49 with 76 D3 with A10 with 109 with
Group 5 3 3 3 3
1 1 1 1
G5_IO3 PA15 50 sampling 77 B1 sampling A9 sampling 110 sampling
capacitor capacitor capacitor capacitor
G6_IO1 PB4 56 3 90 A5 3 A7 3 134 3
channels channels channels channels
G6_IO2 PB5 57 with 91 A6 with C5 with 135 with
Group 6 4 4 4 4
G6_IO3 PB6 58 1 92 C5 1 B5 1 136 1
sampling sampling sampling sampling
G6_IO4 PB7 59 capacitor 93 C7 capacitor B4 capacitor 137 capacitor

UM1606
 Table 37. Available touch sensing channels for STM32L1xx 512K (continued)

UM1606
Subfamily STM32L1xx 512K

Packages LQFP64 LQFP100 / WLCSP104 UFBGA132 LQFP144

STM32L151RE STM32L151VE STM32L151QE STM32L151ZE

Part numbers STM32L152RE STM32L152VE STM32L152QE STM32L152ZE
STM32L162RE STM32L162VE STM32L162QE STM32L162ZE

Number Number Number Number

Analog
LQFP of LQFP WLCSP of BGA of LQFP of
I/O Gx_IOy GPIO Usage Usage Usage Usage
pin available Pin ball available ball available pin available
group
pins pins pins pins

G7_IO1 PB12 33 51 J4 L12 73

G7_IO2 PB13 34 52 J3 K12 74
3 3 4 4
G7_IO3 PB14 35 channels 53 L1 channels K11 channels 75 channels
with with with with
UM1606 Rev 6

Group 7 G7_IO4 PB15 36 4 54 K2 4 K10 5(2) 76 5(2)

1 1 1 1
G7_IO5 PG2(3) - sampling - - sampling G10 sampling 87 sampling
capacitor capacitor capacitor capacitor
G7_IO6 PG3(3) - - - F9 88
G7_IO7 PG4(3) - - - F10 89
G8_IO1 PC0 8 3 15 F6 3 H1 3 26 3
channels channels channels channels
G8_IO2 PC1 9 with 16 H9 with J2 with 27 with
Group 8 4 4 4 4
G8_IO3 PC2 10 1 17 G9 1 J3 1 28 1
sampling sampling sampling sampling
G8_IO4 PC3 11 capacitor 18 G8 capacitor K2 capacitor 29 capacitor
G9_IO1 PC4 24 1 33 L7 1 K5 3 44 3
channel channel channels channels
G9_IO2 PC5 25 with 34 M7 with L5 with 45 with
Group 9 2 2 4 4

STMTouch driver
G9_IO3 PF13 - 1 - - 1 K7 1 53 1
sampling sampling sampling sampling
G9_IO4 PF14 - capacitor - - capacitor J8 capacitor 54 capacitor
95/10
 Table 37. Available touch sensing channels for STM32L1xx 512K (continued)
96/10

STMTouch driver
Subfamily STM32L1xx 512K

Packages LQFP64 LQFP100 / WLCSP104 UFBGA132 LQFP144

STM32L151RE STM32L151VE STM32L151QE STM32L151ZE

Part numbers STM32L152RE STM32L152VE STM32L152QE STM32L152ZE
STM32L162RE STM32L162VE STM32L162QE STM32L162ZE

Number Number Number Number

Analog
LQFP of LQFP WLCSP of BGA of LQFP of
I/O Gx_IOy GPIO Usage Usage Usage Usage
pin available Pin ball available ball available pin available
group
pins pins pins pins

G10_IO1 PC6 37 3 63 H1 3 E12 3 96 3

channels channels channels channels
G10_IO2 PC7 38 with 64 G1 with E11 with 97 with
Group 10 4 4 4 4
G10_IO3 PC8 39 1 65 G2 1 E10 1 98 1
sampling sampling sampling sampling
UM1606 Rev 6

G10_IO4 PC9 40 capacitor 66 F4 capacitor D12 capacitor 99 capacitor

G11_IO1 PF6 - - - G3 18
3 4
Cannot Cannot
G11_IO2 PF7 - - - G4 channels 19 channels
be used be used
with with
Group 11 G11_IO3 PF8 - 0 for - - 0 for H4 4 20 5
1 1
touch touch
G11_IO4 PF9 - - - J6 sampling 21 sampling
sensing sensing
capacitor capacitor
G11_IO5 PF10 - - - - 22
Maximum number of 23 channels with 10 23 channels with 10 33 channels with 11 34 channels with 11
channels sampling capacitors sampling capacitors sampling capacitors sampling capacitors
1. This GPIO offers a reduced touch sensing sensitivity. It is thus recommended to use it as sampling capacitor I/O.
2. Not all the pins are available simultaneously on this group.
3. This GPIO can only be configured as sampling capacitor I/O when using HW acquisition mode and as channel I/O when using SW acquisition mode.

UM1606
 Table 38. Available touch sensing channels for STM32L1xx 384K

UM1606
Subfamily STM32L1xx 384K

Packages LQFP64 / WLCSP64 LQFP100 UFBGA132 LQFP144

STM32L151RD STM32L151VD STM32L151QD STM32L151ZD

Part numbers STM32L152RD STM32L152VD STM32L152QD STM32L152ZD
STM32L162RD STM32L162VD STM32L162QD STM32L162ZD

Number Number Number Number

Analog
LQFP WLCSP of LQFP of BGA of LQFP of
I/O Gx_IOy GPIO Usage Usage Usage Usage
pin ball available Pin available ball available pin available
group
pins pins pins pins

G1_IO1 PA0 14 F6 3 23 3 L2 3 34 3
channels channels channels channels
G1_IO2 PA1 15 E6 24 M2 35
with with with with
Group 1 4 4 4 4
G1_IO3 PA2 16 H8 1 25 1 K3 1 36 1
sampling sampling sampling sampling
UM1606 Rev 6

G1_IO4 PA3(1) 17 G7 capacitor 26 capacitor L3 capacitor 37 capacitor

G2_IO1 PA6 22 G5 31 L4 42
1 1 3 3
G2_IO2 PA7 23 G4 channel 32 channel J5 channels 43 channels
with with with with
Group 2 G2_IO3 PF15 - - 2 - 2 J9 4(2) 55 4(2)
1 1 1 1
G2_IO4 PG0(3) - - sampling - sampling H9 sampling 56 sampling
(3) capacitor capacitor capacitor capacitor
G2_IO5 PG1 - - - G9 57
G3_IO1 PB0(1) 26 H4 35 M5 46
2 2 4 4
G3_IO2 PB1 27 F4 channels 36 channels M6 channels 47 channels
with with with with
Group 3 G3_IO3 PB2 28 H3 3 37 3 L6 5 48 5
1 1 1 1
G3_IO4 PF11 - - sampling - sampling K6 sampling 49 sampling
capacitor capacitor capacitor capacitor

STMTouch driver
G3_IO5 PF12 - - - J7 50
97/10
 Table 38. Available touch sensing channels for STM32L1xx 384K (continued)
98/10

STMTouch driver
Subfamily STM32L1xx 384K

Packages LQFP64 / WLCSP64 LQFP100 UFBGA132 LQFP144

STM32L151RD STM32L151VD STM32L151QD STM32L151ZD

Part numbers STM32L152RD STM32L152VD STM32L152QD STM32L152ZD
STM32L162RD STM32L162VD STM32L162QD STM32L162ZD

Number Number Number Number

Analog
LQFP WLCSP of LQFP of BGA of LQFP of
I/O Gx_IOy GPIO Usage Usage Usage Usage
pin ball available Pin available ball available pin available
group
pins pins pins pins

G4_IO1 PA8 41 E4 2 67 2 D11 2 100 2

channels channels channels channels
G4_IO2 PA9 42 D2 68 D10 101
with with with with
Group 4 3 3 3 3
1 1 1 1
G4_IO3 PA10 43 D3 sampling 69 sampling C12 sampling 102 sampling
UM1606 Rev 6

capacitor capacitor capacitor capacitor

G5_IO1 PA13 46 D4 2 72 2 A11 2 105 2
channels channels channels channels
G5_IO2 PA14 49 B2 76 A10 109
with with with with
Group 5 3 3 3 3
1 1 1 1
G5_IO3 PA15 50 C3 sampling 77 sampling A9 sampling 110 sampling
capacitor capacitor capacitor capacitor
G6_IO1 PB4 56 B4 3 90 3 A7 3 134 3
channels channels channels channels
G6_IO2 PB5 57 A5 91 C5 135
with with with with
Group 6 4 4 4 4
G6_IO3 PB6 58 B5 1 92 1 B5 1 136 1
sampling sampling sampling sampling
G6_IO4 PB7 59 C5 capacitor 93 capacitor B4 capacitor 137 capacitor

UM1606
 Table 38. Available touch sensing channels for STM32L1xx 384K (continued)

UM1606
Subfamily STM32L1xx 384K

Packages LQFP64 / WLCSP64 LQFP100 UFBGA132 LQFP144

STM32L151RD STM32L151VD STM32L151QD STM32L151ZD

Part numbers STM32L152RD STM32L152VD STM32L152QD STM32L152ZD
STM32L162RD STM32L162VD STM32L162QD STM32L162ZD

Number Number Number Number

Analog
LQFP WLCSP of LQFP of BGA of LQFP of
I/O Gx_IOy GPIO Usage Usage Usage Usage
pin ball available Pin available ball available pin available
group
pins pins pins pins

G7_IO1 PB12 33 G2 51 L12 73

G7_IO2 PB13 34 G1 52 K12 74
3 3 4 4
G7_IO3 PB14 35 F2 channels 53 channels K11 channels 75 channels
with with with with
UM1606 Rev 6

Group 7 G7_IO4 PB15 36 F1 4 54 4 K10 5(2) 76 5(2)

1 1 1 1
G7_IO5 PG2(3) - - sampling - sampling G10 sampling 87 sampling
(3) capacitor capacitor capacitor capacitor
G7_IO6 PG3 - - - F9 88
G7_IO7 PG4(3) - - - F10 89
G8_IO1 PC0 8 E8 3 15 3 H1 3 26 3
channels channels channels channels
G8_IO2 PC1 9 F8 16 J2 27
with with with with
Group 8 4 4 4 4
G8_IO3 PC2 10 D6 1 17 1 J3 1 28 1
sampling sampling sampling sampling
G8_IO4 PC3(1) 11 F7 capacitor 18 capacitor K2 capacitor 29 capacitor
G9_IO1 PC4 24 H6 1 33 1 K5 3 44 3
channel channel channels channels
G9_IO2 PC5 25 H5 34 L5 45
with with with with
Group 9 2 2 4 4
G9_IO3 PF13 - - 1 - 1 K7 1 53 1

STMTouch driver
sampling sampling sampling sampling
G9_IO4 PF14 - - capacitor - capacitor J8 capacitor 54 capacitor
99/10
 Table 38. Available touch sensing channels for STM32L1xx 384K (continued)
100/10

STMTouch driver
Subfamily STM32L1xx 384K

Packages LQFP64 / WLCSP64 LQFP100 UFBGA132 LQFP144

STM32L151RD STM32L151VD STM32L151QD STM32L151ZD

Part numbers STM32L152RD STM32L152VD STM32L152QD STM32L152ZD
STM32L162RD STM32L162VD STM32L162QD STM32L162ZD

Number Number Number Number

Analog
LQFP WLCSP of LQFP of BGA of LQFP of
I/O Gx_IOy GPIO Usage Usage Usage Usage
pin ball available Pin available ball available pin available
group
pins pins pins pins

G10_IO1 PC6 37 E1 3 63 3 E12 3 96 3

channels channels channels channels
G10_IO2 PC7 38 E2 64 E11 97
with with with with
Group 10 4 4 4 4
G10_IO3 PC8 39 E3 1 65 1 E10 1 98 1
sampling sampling sampling sampling
UM1606 Rev 6

G10_IO4 PC9 40 D1 capacitor 66 capacitor D12 capacitor 99 capacitor

G11_IO1 PF6 - - - G3 18
3 4
Cannot Cannot
G11_IO2 PF7 - - - G4 channels 19 channels
be used be used
with with
Group 11 G11_IO3 PF8 - - 0 for - 0 for H4 4 20 5
1 1
touch touch
G11_IO4 PF9 - - - J6 sampling 21 sampling
sensing sensing
capacitor capacitor
G11_IO5 PF10 - - - - 22
Maximum number of 23 channels with 10 23 channels with 10 33 channels with 11 34 channels with 11
channels sampling capacitors sampling capacitors sampling capacitors sampling capacitors
1. This GPIO offers a reduced touch sensing sensitivity. It is thus recommended to use it as sampling capacitor I/O.
2. Not all the pins are available simultaneously on this group.
3. This GPIO can only be configured as sampling capacitor I/O when using HW acquisition mode and as channel I/O when using SW acquisition mode.

UM1606
 Table 39. Available touch sensing channels for STM32L1xx 256K (table 1/2)

UM1606
Subfamily STM32L1xx 256K

Packages LQFP48 or UFQFPN48 WLCSP63 LQFP64 / WLCSP64

STM32L151RC
Part numbers STM32L152CC STM32L151UC STM32L152RC
STM32L162RC

Number Number Number

Analog
of WLCSP of LQFP WLCSP of
I/O Gx_IOy GPIO Pin Usage Usage Usage
available ball available pin ball available
group
pins pins pins

G1_IO1 PA0 10 E4 14 F6
G1_IO2 PA1 11 3 channels with G5 3 channels with 15 E6 3 channels with
Group 1 4 1 sampling 4 1 sampling 4 1 sampling
G1_IO3 PA2 12 capacitor H6 capacitor 16 H8 capacitor
UM1606 Rev 6

(1)
G1_IO4 PA3 13 J7 17 G7
G2_IO1 PA6 16 G4 22 G5
G2_IO2 PA7 17 J5 23 G4
1 channel with 1 channel with 1 channel with
Group 2 G2_IO3 PF15 - 2 1 sampling - 2 1 sampling - - 2 1 sampling
capacitor capacitor capacitor
G2_IO4 PG0(2) - - - -
G2_IO5 PG1(2) - - - -
(1)
G3_IO1 PB0 18 J3 26 H4
G3_IO2 PB1 19 H3 27 F4
2 channels with 2 channels with 2 channels with
Group 3 G3_IO3 PB2 20 3 1 sampling G3 3 1 sampling 28 H3 3 1 sampling
capacitor capacitor capacitor
G3_IO4 PF11 - - - -
G3_IO5 PF12 - - - -

STMTouch driver
G4_IO1 PA8 29 E3 41 E4
2 channels with 2 channels with 2 channels with
Group 4 G4_IO2 PA9 30 3 1 sampling C1 3 1 sampling 42 D2 3 1 sampling
capacitor capacitor capacitor
G4_IO3 PA10 31 D2 43 D3
101/10
 Table 39. Available touch sensing channels for STM32L1xx 256K (table 1/2) (continued)
102/10

STMTouch driver
Subfamily STM32L1xx 256K

Packages LQFP48 or UFQFPN48 WLCSP63 LQFP64 / WLCSP64

STM32L151RC
Part numbers STM32L152CC STM32L151UC STM32L152RC
STM32L162RC

Number Number Number

Analog
of WLCSP of LQFP WLCSP of
I/O Gx_IOy GPIO Pin Usage Usage Usage
available ball available pin ball available
group
pins pins pins

G5_IO1 PA13 34 C2 46 D4
2 channels with 2 channels with 2 channels with
Group 5 G5_IO2 PA14 37 3 1 sampling C3 3 1 sampling 49 B2 3 1 sampling
capacitor capacitor capacitor
G5_IO3 PA15 38 A2 50 C3
UM1606 Rev 6

G6_IO1 PB4 40 D4 56 B4
G6_IO2 PB5 41 3 channels with A5 3 channels with 57 A5 3 channels with
Group 6 4 1 sampling 4 1 sampling 4 1 sampling
G6_IO3 PB6 42 capacitor B5 capacitor 58 B5 capacitor
G6_IO4 PB7 43 C5 59 C5
G7_IO1 PB12 25 G2 33 G2
G7_IO2 PB13 26 G1 34 G1
G7_IO3 PB14 27 F3 35 F2
3 channels with 3 channels with 3 channels with
Group 7 G7_IO4 PB15 28 4 1 sampling F2 4 1 sampling 36 F1 4 1 sampling
capacitor capacitor capacitor
G7_IO5 PG2(2) - - - -
G7_IO6 PG3(2) - - - -
(2)
G7_IO7 PG4 - - - -

UM1606
 Table 39. Available touch sensing channels for STM32L1xx 256K (table 1/2) (continued)

UM1606
Subfamily STM32L1xx 256K

Packages LQFP48 or UFQFPN48 WLCSP63 LQFP64 / WLCSP64

STM32L151RC
Part numbers STM32L152CC STM32L151UC STM32L152RC
STM32L162RC

Number Number Number

Analog
of WLCSP of LQFP WLCSP of
I/O Gx_IOy GPIO Pin Usage Usage Usage
available ball available pin ball available
group
pins pins pins

G8_IO1 PC0 - E6 8 E8
G8_IO2 PC1 - E5 3 channels with 9 F8 3 channels with
Group 8 0 4 1 sampling 4 1 sampling
G8_IO3 PC2 - G7 capacitor 10 D6 capacitor
UM1606 Rev 6

G8_IO4 PC3 - G6 11 F7
G9_IO1 PC4 - F4 24 H6
G9_IO2 PC5 - J4 1 channel with 25 H5 1 channel with
Group 9 0 2 1 sampling 2 1 sampling
G9_IO3 PF13 - - capacitor - - capacitor
G9_IO4 PF14 - - - -
Cannot be used for
G10_IO1 PC6 - F1 37 E1
touch sensing
G10_IO2 PC7 - E1 3 channels with 38 E2 3 channels with
Group 10 0 4 1 sampling 4 1 sampling
G10_IO3 PC8 - D1 capacitor 39 E3 capacitor
G10_IO4 PC9 - E2 40 D1
G11_IO1 PF6 - - - -
G11_IO2 PF7 - - - -

STMTouch driver
Cannot be used Cannot be used
Group11 G11_IO3 PF8 - 0 - 0 for - - 0 for
touch sensing touch sensing
G11_IO4 PF9 - - - -
G11_IO5 PF10 - - - -
103/10
 Table 39. Available touch sensing channels for STM32L1xx 256K (table 1/2) (continued)
104/10

STMTouch driver
Subfamily STM32L1xx 256K

Packages LQFP48 or UFQFPN48 WLCSP63 LQFP64 / WLCSP64

STM32L151RC
Part numbers STM32L152CC STM32L151UC STM32L152RC
STM32L162RC

Number Number Number

Analog
of WLCSP of LQFP WLCSP of
I/O Gx_IOy GPIO Pin Usage Usage Usage
available ball available pin ball available
group
pins pins pins

16 channels with 7 23 channels with 10 23 channels with 10

Maximum number of channels
sampling capacitors sampling capacitors sampling capacitors
1. This GPIO offers a reduced touch sensing sensitivity. It is thus recommended to use it as sampling capacitor I/O.
2. This GPIO can only be configured as sampling capacitor I/O when using HW acquisition mode and as channel I/O when using SW acquisition mode.
UM1606 Rev 6

UM1606
 Table 40. Available touch sensing channels for STM32L1xx 256K (table 2/2)

UM1606
Subfamily STM32L1xx 256K

Packages LQFP100 / UFBGA100 UFBGA132 LQFP144

STM32L151VC STM32L151QC STM32L151ZC

Part numbers STM32L152VC STM32L152QC STM32L152ZC
STM32L162VC STM32L162QC STM32L162ZC

Number Number
Number of
Analog LQFP BGA of BGA LQFP of
Gx_IOy GPIO Usage available Usage Usage
I/O group pin ball available ball pin available
pins
pins pins

G1_IO1 PA0 23 L2 L2 34
G1_IO2 PA1 24 M2 3 channels with M2 3 channels with 35 3 channels with
Group 1 4 1 sampling 4 1 sampling 4 1 sampling
G1_IO3 PA2 25 K3 capacitor K3 capacitor 36 capacitor
UM1606 Rev 6

G1_IO4 PA3(1) 26 L3 L3 37
G2_IO1 PA6 31 L4 L4 42
G2_IO2 PA7 32 M4 J5 43
1 channel with 3 channels with 3 channels with
Group 2 G2_IO3 PF15 - - 2 1 sampling J9 4(2) 1 sampling 55 4(2) 1 sampling
capacitor capacitor capacitor
G2_IO4 PG0(3) - - H9 56
G2_IO5 PG1(3) - - G9 57
(1)
G3_IO1 PB0 35 M5 M5 46
G3_IO2 PB1 36 M6 M6 47
2 channels with 4 channels with 4 channels with
Group 3 G3_IO3 PB2 37 L6 3 1 sampling L6 5 1 sampling 48 5 1 sampling
capacitor capacitor capacitor
G3_IO4 PF11 - - K6 49
G3_IO5 PF12 - - J7 50

STMTouch driver
G4_IO1 PA8 67 D11 D11 100
2 channels with 2 channels with 2 channels with
Group 4 G4_IO2 PA9 68 D10 3 1 sampling D10 3 1 sampling 101 3 1 sampling
capacitor capacitor capacitor
G4_IO3 PA10 69 C12 C12 102
105/10
 Table 40. Available touch sensing channels for STM32L1xx 256K (table 2/2) (continued)
106/10

STMTouch driver
Subfamily STM32L1xx 256K

Packages LQFP100 / UFBGA100 UFBGA132 LQFP144

STM32L151VC STM32L151QC STM32L151ZC

Part numbers STM32L152VC STM32L152QC STM32L152ZC
STM32L162VC STM32L162QC STM32L162ZC

Number Number
Number of
Analog LQFP BGA of BGA LQFP of
Gx_IOy GPIO Usage available Usage Usage
I/O group pin ball available ball pin available
pins
pins pins

G5_IO1 PA13 72 A11 A11 105

2 channels with 2 channels with 2 channels with
Group 5 G5_IO2 PA14 76 A10 3 1 sampling A10 3 1 sampling 109 3 1 sampling
capacitor capacitor capacitor
G5_IO3 PA15 77 A9 A9 110
UM1606 Rev 6

G6_IO1 PB4 90 A7 A7 134

G6_IO2 PB5 91 C5 3 channels with C5 3 channels with 135 3 channels with
Group 6 4 1 sampling 4 1 sampling 4 1 sampling
G6_IO3 PB6 92 B5 capacitor B5 capacitor 136 capacitor
G6_IO4 PB7 93 B4 B4 137
G7_IO1 PB12 51 L12 L12 73
G7_IO2 PB13 52 K12 K12 74
G7_IO3 PB14 53 K11 K11 75
3 channels with 4 channels with 4 channels with
Group 7 G7_IO4 PB15 54 K10 4 1 sampling K10 5(2) 1 sampling 76 5(2) 1 sampling
capacitor capacitor capacitor
G7_IO5 PG2(3) - - G10 87
G7_IO6 PG3(3) - - F9 88
(3)
G7_IO7 PG4 - - F10 89
G8_IO1 PC0 15 H1 H1 26
G8_IO2 PC1 16 J2 3 channels with J2 3 channels with 27 3 channels with
Group 8 4 1 sampling 4 1 sampling 4 1 sampling

UM1606
G8_IO3 PC2 17 J3 capacitor J3 capacitor 28 capacitor
G8_IO4 PC3 18 K2 K2(3) 29(3)
 Table 40. Available touch sensing channels for STM32L1xx 256K (table 2/2) (continued)

UM1606
Subfamily STM32L1xx 256K

Packages LQFP100 / UFBGA100 UFBGA132 LQFP144

STM32L151VC STM32L151QC STM32L151ZC

Part numbers STM32L152VC STM32L152QC STM32L152ZC
STM32L162VC STM32L162QC STM32L162ZC

Number Number
Number of
Analog LQFP BGA of BGA LQFP of
Gx_IOy GPIO Usage available Usage Usage
I/O group pin ball available ball pin available
pins
pins pins

G9_IO1 PC4 33 K5 K5 44
G9_IO2 PC5 34 L5 1 channel with L5 3 channels with 45 3 channels with
Group 9 2 1 sampling 4 1 sampling 4 1 sampling
G9_IO3 PF13 - - capacitor K7 capacitor 53 capacitor
UM1606 Rev 6

G9_IO4 PF14 - - J8 54
G10_IO1 PC6 63 E12 E12 96
G10_IO2 PC7 64 E11 3 channels with E11 3 channels with 97 3 channels with
Group 10 4 1 sampling 4 1 sampling 4 1 sampling
G10_IO3 PC8 65 E10 capacitor E10 capacitor 98 capacitor
G10_IO4 PC9 66 D12 D12 99
G11_IO1 PF6 - - G3 18
G11_IO2 PF7 - - G4 19
Cannot be used 3 channels with 4 channels with
Group11 G11_IO3 PF8 - - 0 for H4 4 1 sampling 20 5 1 sampling
touch sensing capacitor capacitor
G11_IO4 PF9 - - J6 21
G11_IO5 PF10 - - - 22
23 channels with 10 33 channels with 11 34 channels with 11

STMTouch driver
Maximum number of channels
sampling capacitors sampling capacitors sampling capacitors
1. This GPIO offers a reduced touch sensing sensitivity. It is thus recommended to use it as sampling capacitor I/O.
2. Not all the pins are available simultaneously on this group.
3. This GPIO can only be configured as sampling capacitor I/O when using HW acquisition mode and as channel I/O when using SW acquisition mode.
107/10
 Table 41. Available touch sensing channels for STM32L15x 32K to 128K
108/10

STMTouch driver
Subfamily STM32L15x 32K to 128K

Packages LQFP48 / VFQFPN48 LQFP64 / BGA64 LQFP100 / BGA100

STM32L151C6 STM32L151R6
STM32L151C8 STM32L151R8 STM32L151V8
STM32L151CB STM32L151RB STM32L151VB
Part numbers
STM32L152C6 STM32L152R6 STM32L152V8
STM32L152C8 STM32L152R8 STM32L152VB
STM32L152CB STM32L152RB

Number Number Number

Analog
of LQFP BGA of LQFP BGA of
I/O Gx_IOy GPIO Pin Usage Usage Usage
available pin ball available pin ball available
group
pins pins pins

G1_IO1 PA0 10 14 G2 23 L2
UM1606 Rev 6

G1_IO2 PA1 11 3 channels with 15 H2 3 channels with 24 M2 3 channels with

Group 1 4 1 sampling 4 1 sampling 4 1 sampling
G1_IO3 PA2 12 capacitor 16 F3 capacitor 25 K3 capacitor
G1_IO4 PA3 13 17 G3 26 L3
G2_IO1 PA6 16 1 channel with 22 G4 1 channel with 31 L4 1 channel with
Group 2 2 1 sampling 2 1 sampling 2 1 sampling
G2_IO2 PA7 17 capacitor 23 H4 capacitor 32 M4 capacitor
G3_IO1 PB0 18 1 channel with 26 F5 1 channel with 35 M5 1 channel with
Group 3 2 1 sampling 2 1 sampling 2 1 sampling
G3_IO2 PB1 19 capacitor 27 G5 capacitor 36 M6 capacitor
G4_IO1 PA8 29 41 D7 67 D11
2 channels with 2 channels with 2 channels with
Group 4 G4_IO2 PA9 30 3 1 sampling 42 C7 3 1 sampling 68 D10 3 1 sampling
capacitor capacitor capacitor
G4_IO3 PA10 31 43 C6 69 C12
G5_IO1 PA13 34 46 A8 72 A11
2 channels with 2 channels with 2 channels with
Group 5 G5_IO2 PA14 37 3 1 sampling 49 A7 3 1 sampling 76 A10 3 1 sampling
capacitor capacitor capacitor

UM1606
G5_IO3 PA15 38 50 A6 77 A9
 Table 41. Available touch sensing channels for STM32L15x 32K to 128K (continued)

UM1606
Subfamily STM32L15x 32K to 128K

Packages LQFP48 / VFQFPN48 LQFP64 / BGA64 LQFP100 / BGA100

STM32L151C6 STM32L151R6
STM32L151C8 STM32L151R8 STM32L151V8
STM32L151CB STM32L151RB STM32L151VB
Part numbers
STM32L152C6 STM32L152R6 STM32L152V8
STM32L152C8 STM32L152R8 STM32L152VB
STM32L152CB STM32L152RB

Number Number Number

Analog
of LQFP BGA of LQFP BGA of
I/O Gx_IOy GPIO Pin Usage Usage Usage
available pin ball available pin ball available
group
pins pins pins

G6_IO1 PB4 40 1 channel with 56 A4 1 channel with 90 A7 1 channel with

UM1606 Rev 6

Group 6 2 1 sampling 2 1 sampling 2 1 sampling

G6_IO2 PB5 41 capacitor 57 C4 capacitor 91 C5 capacitor
G7_IO1 PB12 25 33 H8 51 L12
G7_IO2 PB13 26 3 channels with 34 G8 3 channels with 52 K12 3 channels with
Group 7 4 1 sampling 4 1 sampling 4 1 sampling
G7_IO3 PB14 27 capacitor 35 F8 capacitor 53 K11 capacitor
G7_IO4 PB15 28 36 F7 54 K10

STMTouch driver
109/10
 Table 41. Available touch sensing channels for STM32L15x 32K to 128K (continued)
110/10

STMTouch driver
Subfamily STM32L15x 32K to 128K

Packages LQFP48 / VFQFPN48 LQFP64 / BGA64 LQFP100 / BGA100

STM32L151C6 STM32L151R6
STM32L151C8 STM32L151R8 STM32L151V8
STM32L151CB STM32L151RB STM32L151VB
Part numbers
STM32L152C6 STM32L152R6 STM32L152V8
STM32L152C8 STM32L152R8 STM32L152VB
STM32L152CB STM32L152RB

Number Number Number

Analog
of LQFP BGA of LQFP BGA of
I/O Gx_IOy GPIO Pin Usage Usage Usage
available pin ball available pin ball available
group
pins pins pins

G8_IO1 PC0 - 8 E3 15 H1
UM1606 Rev 6

G8_IO2 PC1 - 9 E2 3/2 channels with 16 J2 3 channels with

Group 8 0 4/3 1 sampling 4 1 sampling
G8_IO3 PC2 - 10 F2 capacitor 17 J3 capacitor
G8_IO4 PC3 - 11 - 18 K2
G9_IO1 PC4 - Cannot be used 24 H5 1 channel with 33 K5 1 channel with
Group 9 0 for 2 1 sampling 2 1 sampling
G9_IO2 PC5 - touch sensing 25 H6 capacitor 34 L5 capacitor
G10_IO1 PC6 - 37 F6 63 E12
G10_IO2 PC7 - 38 E7 3 channels with 64 E11 3 channels with
Group 10 0 4 1 sampling 4 1 sampling
G10_IO3 PC8 - 39 E8 capacitor 65 E10 capacitor
G10_IO4 PC9 - 40 D8 66 D12
Maximum number of 13 channels with 7 20/19 channels with 10 20 channels with 10
channels sampling capacitors sampling capacitors sampling capacitors

UM1606
UM1606 STMTouch driver

2.23.7 Hardware implementation example

Figure 21 shows an example of hardware implementation on STM32L1xx devices.

Recommendations to increase the noise immunity on the PCB

To ensure a correct operation in noisy environment, the floating nets must be avoided
(tracks, copper elements, conductive frames, etc...).
As a consequence:
• All unused touch controller I/Os must be either configured to output push-pull low or
externally tied to GND.
• The parameter TSLPRM_IODEF should also be configured to the output push-pull low
state.
• We recommend to drive the sampling capacitor common node using a standard I/O of
the touch controller configured in output push-pull low mode.
• It may also be required to add a capacitor-input filter (pi filter) on each channel line.

UM1606 Rev 6 111/124

123
 Figure 21. STM32L1xx hardware implementation example
112/10

STMTouch driver
1 2 3 4

+5V U1 VDD
LD3985M33R
1 Vin Vout 5 Notes:
1. ESD serial resistors and sampling capacitors must be placed as close as possible to MCU device.

100nF_X7R_0603

100nF_X7R_0603
2. Sampling capacitors must be COG type or better.

1µF_X5R_0603

1µF_X5R_0603
C1 C2 3 INH
C3 C4 G1_IO4 1
GND BYPASS 3. A dedicated low drop voltage regulator powering the touch controller is recommended.
4. Sampling capacitors must be connected to the same IO number of each analog IO group.
A K1 A

4
C5 G3_IO2 1

K2
10nF_X7R_0603
G6_IO2 G6_IO2 1

59 10K_5%_0603

56 10K_5%_0603
K3
VDD
VDD G6_IO1 G7_IO4 1

60 R1

57 R2
C6 C7 C8 C9 C10 K4
U2

64
63
62
61

58

55
54
53
52
51
50
49
STM32L15x G9_IO2 1
100nF_X7R_0603 VDD

PB9
PB8

PB7
PB6
PB5
PB4
PB3
PD2
PC12
PC11
PC10
PA15
PA14
VDD_3
VSS_3

BOOT0
C11 K5
VDD
1 48 G10_IO2 1
VLCD VDD_2

2
VDD 22pF_COG_0603 2 47
B Y1 PC13 VSS_2 B
3 46
XTAL/8Mhz PC14 PA13 K6
C12 4 45
PC15 PA12

1
R3 5 44 G10_IO3 1
10K_5%_0603 PH0 PA11
6 43 R4 G4_IO3
PH1 PA10
22pF_COG_0603 7 42 R5 G4_IO2
NRST PA9 K7
G8_IO1 8 41 10K_5%_0603 G4_IO1
UM1606 Rev 6

PC0 PA8
G8_IO2 R6 9 40 R7 G10_IO4 G10_IO4 1
C13 PC1 PC9
10 39 R9 G10_IO3
10nF_X7R_0603 PC2 PC8
11 38 R11 G10_IO2
PC3 PC7 K8
12 37 10K_5%_0603 G10_IO1
VSSA PC6
13 36 R12 G7_IO4
VDD VDDA PB15
G1_IO1 14 35 R13 G7_IO3
PA0 PB14
G1_IO2 R14 15 34 R15 G7_IO2
PA1 PB13
G1_IO3 R16 16 33 10K_5%_0603 G7_IO1
PA2 PB12
10K_5%_0603 SHIELD

VDD_4

VDD_1
VSS_4

VSS_1
PB10
PB11
PA3

PA4
PA5
PA6
PA7
PC4
PC5
PB0
PB1
PB2
G8_IO2 Shield
C C

17
18
19
20
21
22
23
24
25
10K_5%_0603 26
27
10K_5%_0603 28
29
30
31
32
G1_IO4 R17
10K_5%_0603
VDD VDD

R18

R19
SAMP_CAP_CH
G1_IO1

G9_IO1
G9_IO2
G3_IO1
G3_IO2
G3_IO1
G4_IO1 RTS1 LTS1
G6_IO1 G1_IO3 1
1
G7_IO1
G8_IO1 G1_IO2 2 G4_IO3 2
A 2
G9_IO1 G4_IO2 3
B
G10_IO1 G7_IO2 1 G7_IO3 3
C 3
4
47nF_COG_1206

15nF_COG_1206

47nF_COG_1206

15nF_COG_1206

47nF_COG_1206

15nF_COG_1206

15nF_COG_1206

K
1µF_X5R_0603

Linear touch sensor

C14 C15 C16 C17 C18 C19 C20 C21 Rotary touch sensor
D D

STMicroelectronics
Title: STM32L CT Reference Design
Microcontrollers Division
Size: A4 Reference: Revision: C-00 190, avenue Célestin COQ
13106 ROUSSET Cedex
Date: 01 MAY 2012 Sheet: 1 of 1 FRANCE £
1 2 3 4

UM1606
UM1606 Getting started

3 Getting started

3.1 Create your application

Start with an example present in the STMTouch library of the device you intend to use. Take
an example that is close in term of number of channels/sensors with your target application.
Copy and paste the example in the same parent folder and rename it according your target
application. Then modify the files as described below.
The following sections describe the necessary steps to create a new application project.

3.1.1 Toolchain compiler preprocessor section

The device that you intend to use must be written in the toolchain compiler preprocessor
section of your project.
These defines are the same as those for the standard peripherals library. Please see the
stm<xxx>.h map file to have the list of the devices definition.
Note: The hardware acquisition mode is selected per default for the STM8L15x Low-density
devices, and STM32L1xx (excepted Medium-density) devices. If you want to use the
software acquisition mode you must add the following constant in the toolchain compiler
preprocessor:
• TSLPRM_STM8L1XX_SW_ACQ
• TSLPRM_STM32L1XX_SW_ACQ

3.1.2 The tsl_conf file

The tsl_conf_<mcu>.h file contains all the STMTouch driver parameters. The following
edits must be done:
1. Change the number of channels, banks, sensors according your application.
2. Change the common parameters: thresholds, debounce, ECS, DTO, etc...
3. Change the parameters specific to the device.

3.1.3 The main file

The main.c and main.h files contain the application code itself (LEDs and LCD
management, etc...) and the call to the STMTouch driver initialization and action functions.

3.1.4 The tsl_user file

The tsl_user.c and tsl_user.h files contain the STMTouch driver configuration (definition of
channels, banks, zones, sensors, etc...) and the STMTouch driver initialization
(TSL_user_Init) and action (TSL_user_Action) functions.
Create the channels variables using the structures (mandatory):
• TSL_ChannelSrc_T
• TSL_ChannelDest_T
• TSL_ChannelData_T
Create the Banks variables using the structures (mandatory):
• TSL_Bank_T

UM1606 Rev 6 113/124

123
Getting started UM1606

Create the Zone variables using the structure (optional):

• TSL_Zone_T
Create the touchkeys variables using the structures (optional):
• TSL_TouchKeyData_T
• TSL_TouchKeyParam_T
• TSL_State_T
• TSL_TouchKeyMethods_T
• TSL_TouchKeyB_T
• TSL_TouchKey_T
Create the Linear and Rotary touch sensors variables using the structures (optional):
• TSL_LinRotData_T
• TSL_LinRotParam_T
• TSL_State_T
• TSL_LinRotMethods_T
• TSL_LinRotB_T
• TSL_LinRot_T
Create the generic sensors (objects) variables using the structures (mandatory):
• TSL_Object_T
• TSL_ObjectGroup_T
The TSL_user_Init() function contains the initialization of the STMTouch driver. Modify this
function to take into account your bank array name and object groups names.
The TSL_user_Action() function contains the main state machine. Modify it also if you have
several object groups to process or to change the ECS period, etc...

114/124 UM1606 Rev 6

UM1606 Getting started

3.2 Debug with STM Studio

The STM Studio software is very useful to observe variables of the STMTouch driver.
Thanks to its powerful features you will be able to better understand how the sensors
behave and to find the better parameters to apply.
This section does not intend to explain how to use this tool, but give some advice to better
understand and debug your application.
This is a non-exhaustive list of the STMTouch driver variables to observe:
• The channels measure, reference and delta. These variables are present inside the
TSL_ChannelData_T structure. This is useful to adjust the thresholds parameters.
• The sensors state present in the TSL_TouchKeyData_T and TSL_LinRotData_T
structures. This is useful to adjust the Debounce, ECS and DTO parameters.
• The linear and rotary touch sensors position in the TSL_LinRotData_T structure.
The following snapshot is an example of data visualization on STM Studio:

Figure 22. STM Studio snapshot

UM1606 Rev 6 115/124

123
Getting started UM1606

3.3 Low-power strategy

The following figure shows the acquisition sequencing for a single bank acquisition in low-
power mode.
To reduce the power consumption, the acquisitions are sequenced with a long delay in
between. During this delay, the CPU can be in low-power mode (active-halt for STM8 or
STOP for STM32). This delay can be shortened or even removed between two consecutive
acquisitions when the delta becomes greater than a detection threshold (proximity or touch).
The long delay is restored if all the sensors return in RELEASE state.

Figure 23. Low_power strategy

3UHGHWHFWLRQ
6HQVRUSURF 'HERXQFH!
1RGHWHFWLRQ 3UHGHWHFWLRQ
$FT  'HOWDWKUHVKROG 'HWHFWLRQ
UHSRUWHG

W
5XQ

/RQJ$:8SHULRG 6KRUW$:8SHULRG

$FWLYHKDOWSHULRGH[LWHGE\$:8 %DQNDFTXLVLWLRQ

6HQVRUSURFHVVLQJ )XOODFTXLVLWLRQSURFHVVLQJ
7RXFKHYHQW

8VHUDSSOLFDWLRQ
06Y9

This approach allows to save power consumption without increasing the response time. The
maximum response time is obtained when a touch occurs during the sensor processing. It
can be expressed as followed:
Max Response Time = long AWU period + (n) x short AWU period + (n+2) x full
acquisition processing - bank acquisition
with n being the debounce value.

116/124 UM1606 Rev 6

UM1606 Getting started

3.4 Main differences with previous library

This section describes the main differences between the previous touch sensing library
(named STMxxx_TouchSensing_Lib) and this new STMTouch Library (named
STMxxx_STMTouch_Lib).

3.4.1 Files

Previous Library
• Files are prefixed with “stm8_tsl_” or “stm32_tsl_” or “<mcu>_tsl_”.
• Copy <mcu>_tsl_conf_CT_TOADAPT.h or <mcu>_tsl_conf_RC_TOADAPT.h in your
project and rename it in <mcu>_tsl_conf.h
• Include <mcu>_tsl_api.h in main.h

STMTouch Library
• All files are prefixed with “tsl” or “tsl_”. There is no more “stm8” nor “stm32” prefix.
• Copy tsl_conf_<mcu>.h_TOADAPT in your project and rename it in
tsl_conf_<mcu>.h
• Include tsl.h in tsl_user.h

3.4.2 Channels, banks and sensors configuration

Previous Library
• Done in stm8_tsl_conf.h
• Limited number of channels, banks and sensors.
• SCKeys (= single channel keys) and MCKeys (multi-channels keys) sensors.

STMTouch library
• Done in the application (tsl_user.c and tsl_user.h).
• No limitation in the number of Cchannels, banks and sensors.
• Touchkey and LinRot sensors with extended and basic types.

3.4.3 Parameters configuration

Previous library
• Done in stm8_tsl_conf.h
• No common prefix for the parameters.
• Thresholds are on 7 bits (signed).
• No thresholds for proximity.
• Fixed calibration samples.
• Debounce counters common to all sensors and states.
• Fixed timer tick frequency.

UM1606 Rev 6 117/124

123
Getting started UM1606

STMTouch Library
• Done in tsl_conf_<mcu>.h
• All parameters are prefixed with “TSLPRM_”.
• Thresholds are on 8 bits (unsigned) and multiplier coefficient can be applied on them.
• Thresholds for proximity.
• Programmable calibration samples and delay.
• Debounce counters different for each sensor and each state.
• Programmable timer tick frequency.

3.4.4 Usage

Previous Library
• Initialization by calling TSL_Init() function.
• Execution by calling TSL_Action() continuously.
• Main state machine and sensors state machine are in the TS driver layer.
• ECS and DXS process are called by the TS driver layer.
• Test of the main state machine value using TSLState variable:
if (TSLState == TSL_IDLE_STATE) {
...
}
if ((TSLState == TSL_SCKEY_P1_ACQ_STATE) ||
(TSLState == TSL_SCKEY_P2_ACQ_STATE) ||
(TSLState == TSL_MCKEY1_ACQ_STATE) ||
(TSLState == TSL_MCKEY2_ACQ_STATE)) {
...
}
– Test of sensor state using TSL_GlobalSetting, sSCKeyInfo and sMCKeyInfo
variables:
if (TSL_GlobalSetting.b.CHANGED) {
TSL_GlobalSetting.b.CHANGED = 0;
if (sSCKeyInfo[0].Setting.b.DETECTED) {...}

STMTouch library
• Initialization by calling TSL_obj_GroupInit() and TSL_Init() functions.
• Execution by calling TSL_Action() continuously.
• Main state machine and sensors state machine are in the application layer and so can
be changed easily.
• ECS and DXS process are called by the application layer.
• The test of the main state machine value is not needed as the main state machine is
managed by the application layer.
• Test of sensor state using StateId variable:
if ((MyTKeys[0].p_Data->StateId == TSL_STATEID_DETECT)||
(MyTKeys[0].p_Data->StateId == TSL_STATEID_DEB_RELEASE_DETECT)) {...}

118/124 UM1606 Rev 6

UM1606 Getting started

3.4.5 Variables monitoring

Many variables can be monitored in order to debug your application. The list below is not
exhaustive but shows only the most important variables used in both libraries:

Previous library
• The sSCKeyInfo, sMCKeyInfo and sAcqBankInfo structures contain all informations
related to touchkey and linear/rotary sensors: reference, last measure, thresholds,
state, position, EPCC, ..

STMTouch library
• The array of TSL_ChannelData_T structure contains the reference, measure and delta
values of ALL channels used by the application:

Figure 24. Debug of TSL_ChannelData_T structure

• The array of TSL_TouchKeyData_T contains mainly the touchkey sensors state:

UM1606 Rev 6 119/124

123
Getting started UM1606

Figure 25. Debug of TSL_TouchKeyData_T structure

• The array of TSL_LinRotData_T contains the linear and rotary sensors state and
position:

Figure 26. Debug of TSL_LinRotData_T structure

• The arrays of TSL_TouchKeyParam_T and TSL_LinRotParam_T contain the

touchkeys, linear and rotary sensors parameters (mainly thresholds and debounce
counters):

Figure 27. Debug of TSL_TouchKeyParam_T

120/124 UM1606 Rev 6

UM1606 Getting started

Figure 28. Debug of TSL_LinRotParam_T structures

UM1606 Rev 6 121/124

123
Getting started UM1606

3.5 Tips and tricks

3.5.1 Bank definition

For optimum sensitivity and position reporting, all the channels composing a linear or a
rotary touch sensor must be acquired simultaneously. This means that all the channels
must belong to the same bank.

Note: The library allows to define a linear or a rotary touch sensor with channels belonging to
different banks. A such configuration induces a loss of sensitivity and a higher noise level.
Moreover, depending on the acquisition time, it is also possible to observe a position change
when removing the finger from the sensor.
For optimum performance of a linear or rotary sensor, all channels of such a sensor must be
acquired simultaneously.Therefore all channels must belong to the same bank, which
means the I/Os must be selected from different analog I/O groups. Please refer to datasheet
for more information regarding I/O groups and available capacitive sensing GPIOs.

3.5.2 Channel assignment

It is recommended to assign GPIOs offering the same sensitivity level to all the channels
composing a linear or a rotary touch sensor. Moreover, it is not recommended to use GPIOs
offering a reduced sensitivity.

3.5.3 IO Default state parameter

For optimum acquisition noise level, it is recommended to set the TSLPRM_TSC_IODEF
or TSLPRM_IODEF parameter to output push-pull low.
However, if your application is using a linear or a rotary touch sensor with channels
belonging to different banks, this parameter must be set to input floating. This will ensure
optimum sensitivity.

122/124 UM1606 Rev 6

UM1606 Revision history

4 Revision history

Table 42. Document revision history

Date Revision Changes

19-Mar-2013 1 Initial release.

Updated document title.
Updated Section : Introduction.
Updated Section 1.2: Naming conventions
Updated Section 2.1.1: Supported devices.
Updated Section 2.3: Main features.
Updated Section 2.5.2: Resources.
Updated Section 2.5.4: Usage example.
03-Sep-2013 2
Updated Section 2.6.2: Resources.
Added Section 2.19: STM8L1xx devices.
Updated Table 22: Available touch sensing channels for STM32F0xx
Updated Section 3.1.1: Toolchain compiler preprocessor section.
Updated Table 28: Available touch sensing channels for STM32F37x.
Updated Table 35: MCU resources used on STM32L1xx with hardware acquisition.
Updated Table 36: MCU resources used on STM32L1xx with software acquisition.
- Updated all channel tables of STM8L, STM32L and STM32F0 products.
- Added STM32L1xx 512K channel table Table 22: Available touch sensing channels
for STM32F042
- Added STM32L1xx 512K channel table Table 37: Available touch sensing channels
for STM32L1xx 512K:

17-Mar-2014 3 - Added Chapter 3.5: Tips and tricks

- Updated Section 2.1.1;
- Updated Table 22
- Updated Section 3.1.1
- Removed Table 42: STM8L1xx acquisition selection
- Removed Table 43: STM32L1xx acquisition selection
22-Apr-2014 4 - Added note 1 on Pa4 of Table 28
Removed UN_D
Updated:
14-Mar-2018 5 – Section 2.10.4: Electrodes placement
– Figure 8: Electrodes designs
– Table 3: Supported linear and rotary sensors
Updated:
17-Sep-2018 6 – Section 2.10.2: Number of channels
– Section 3.5.1: Bank definition

UM1606 Rev 6 123/124

123
 UM1606

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2018 STMicroelectronics – All rights reserved

124/124 UM1606 Rev 6