SPECIFICATION

IEEE 802.11 b/g/n 2.4GHz 1T1R WiFi with Bluetooth2.1

/3.0/4.0,with SDIO INTERFACE, and HS-UART MIXED INTERFACE

RL-SM02BD (Realtek RTL8723BS)

Combo Module

Version 1.3

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Revisio Date Contents of Revision Change Remark

1.3 2014/06/24 首次发布产品规格书 2014/06/24

1.3 2014/09/09 更改规格书的模块图片 2014/09/09

1.3 2014/12/17 添加3.3V的功耗 2014/12/17

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1.PRODUCT DESCRIPTION
SM02BD is a small size and low profile of WiFi+BT combo module with LGA (Land-Grid
Array) footprint, board size is 12mm*12mm with module height of 1.6mm. It can be
easily manufactured on SMT process and highly suitable for tablet PC, ultra book,
mobile device and consumer products. It provides GSPI/SDIO interface for WiFi to
connect with host processor and high speed UART interface for BT. It also has a PCM
interface for audio data transmission with direct link to external audio codec via BT
controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n
b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.

SM02BD uses Realtek RTL8723BS, a highly integrated WiFi/BT single MODULE based on
advanced COMS process. RTL8723BS integrates whole WiFi/BT function blocks into
a chip, such as SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except
fewer passive components remained on
PCB.

2.PRODUCT FEATURES

Operate at ISM frequency bands (2.4GHz)

GSPI/SDIO for WiFi and UART for Bluetooth
IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE
802.11e, IEEE 802.11h, IEEE 802.11i
Fully Qualified for Bluetooth 2.1 + EDR specification including both 2Mbps and
3Mbps modulation mode
Fully qualified for Bluetooth 3.0
Fully qualified for Bluetooth 4.0 Dual mode
Full –speed Bluetooth operation with Piconet and Scatternet support.
Enterprise level security which can apply WPA/WPA2 certification for WiFi.
WiFi 1 transmitter and 1 receiver allow data rates supporting up to
150 Mbps downstream and 150 Mbps upstream PHY rates
For WiFi/BT, it uses fixed path for WiFi and BT, which means one antenna assigned
for WiFi and the other is assigned for BT.
Support Bluetooth adaptive power management mechanism
Full-featured software utility for easy configuration and management
RoHS compliance
Low Halogen compliance

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3.Diagram
Support 26Mhz

4.Temperature Limit Ratings

Parameter Minimum Maximum Units

Storage Temperature -20 70 ℃
Ambient Operating Temperature 0 60 ℃
Junction Temperature 0 125 ℃

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5.PRODUCT SPECIFICATIONS

Main chipset :WiFi/BT Single Chip: Realtek RTL8723BS

Functional Specifications
WiFi: EEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE
Standards 802.11e, IEEE 802.11h, IEEE 802.11i

BT: V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0

Bus Interface WiFi: GSPI/SDIO BT: UART

802.11b: 11, 5.5, 2, 1 Mbps

802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps
Data Rate 802.11n: MCS 0 to 7 for HT20MHz ;MCS 0 to 7 for HT40MHz
BT:
1 Mbps for Basic Rate
2,3 Mbps for Enhanced Data Rate
6,9,12,18,24,36,48,54 Mbps for High Speed

WiFi: CSMA/CA with ACK

Media Access Control
BT: AFH, Time Division

802.11b: CCK, DQPSK, DBPSK

Modulation Techniques 802.11g: 64 QAM, 16 QAM, QPSK, BPSK
802.11n: 64 QAM, 16 QAM, QPSK, BPSK
BT: 8DPSK, π/4 DQPSK, GFSK
WiFi:
Ad-hoc mode (Peer-to-Peer )
Infrastructure mode
Network Architecture Software AP
WiFi Direct
BT:
Pico Net
Scatter Net
WiFi 2.4GHz:
11: (Ch. 1-11) – United States
Operating Channel 13: (Ch. 1-13) – Europe
14: (Ch. 1-14) – Japan
BT 2.4GHz:
Ch. 0 ~78
Frequency Range 2.400GHz ~ 2.4835 GHz

Transmit Output Power – 1x1 BT: Max +10dBm

Receiver Sensitivity BT: -89dBm@1Mbps, -85dBm@2Mbps, -83dBm@3Mbps

WiFi :
Security WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit, IEEE
802.11x, IEEE 802.11i
BT: Simple Paring
OS supported Linux/Android

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6.Power Supply DC Characteristics
Symbol Parameter Minimum Typical Maximum Units
VA33, VD33IO,SW_HV3, 3.3V Supply Voltage 3.0 3.3 3.6 V
FM_VDD_HV
VDD_IO,VIO_FM,VDIO_SDIO Digital IO Supply Voltage 1.62 1.8~3.3 3.6 V
VA12, VA12_BT,VA12_WLG, 1.2V Core Supply Voltage 1.08 1.2 1.32 V
VD12D
IDD33 3.3V Rating Current - - 600 mA

DC Characteristics
Module Voltage Current Consumption (linking)

RL-SM02BD-8723BS-V1.3 3.3V 150mA（上网或者看电影的功耗）

7. Electrical Specifications
1) RF Characteristics for IEEE802.11b ( 11Mbps mode unless otherwise specified)

Items Contents
Specification IEEE802.11b
Mode CCK 11 Mbps
Channel frequency 2412 ~ 2484 MHz
RX (per≤85 dBm@8%) -85 dBm
Freq.Error(±13ppm) ±13 ppm
TX Characteristics Min. Typ. Max. Unit
Power Level (17±2 dBm) 17 dBm
EVM (≤-18) -18 dB

2) RF Characteristics for IEEE802.11g ( 54Mbps mode unless otherwise specified)

Items Contents
Specification IEEE802.11g
Mode OFDM 54 Mbps
Channel frequency 2412 ~ 2484 MHz
RX (per≤70 dBm@10%) -70 dBm
Freq.Error(±13ppm) ±13 ppm
TX Characteristics Min. Typ. Max. Unit
Power Level (14±2dBm) 14 dBm
EVM (≤-27) -27 dB

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3) RF Characteristics for IEEE802.11n (HT20_MCS7)

Items Contents

Specification IEEE802.11n (HT20_MCS7)

Mode 65 Mbps

Channel frequency 2412 ~ 2484 MHz

RX (per≤65 dBm@10%) -65 dBm

Freq.Error(±13ppm) ±13 ppm

TX Characteristics Min. Typ. Max. Unit

Power Level (13±2 dBm) 13 dBm

EVM (≤-28) -28 dB

4) RF Characteristics for IEEE802.11n (HT40_MCS7)

Items Contents

Specification IEEE802.11n (HT40_MCS7)

Mode 135 Mbps

Channel frequency 2412 ~ 2484 MHz

RX (per≤65 dBm@10%) -65 dBm

Freq.Error(±13ppm) ±13 ppm

TX Characteristics Min. Typ. Max. Unit

Power Level (13±2 dBm) 13 dBm

EVM (≤-28) -28 dB

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8.Mechanical
Length Width Height
Dimensions (mm)
12 12 1.6
(Tolerance:±0.2mm) (Tolerance:±0.2mm) (Tolerance:±0.2mm)

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9.MODULE PIN ASSIGNMENT

PIN Function Description

1 GND Grond
2 WIFI/BT_ANT WIFI/BT_ANT
3 NC NC
4 NC NC
5 NC NC
6 BT_WAKE HOST wake-up Bluetooth device
7 BT_HOST_WAKE Bluetooth device to wake-up HOST
8 NC NC
9 VD33 3.3V
10 NC NC
11 NC NC
Shared with GPIO9 This Pin Can Externally Shutdown the RTL8723BS
12 WL_DSI# WLAN function when BT_DISn is Pulled Low. When this pin deasserted,
SDIO interface will be disabled. This pin can also support the WLAN Ra
dio-off function with host interface remaining connected.
13 WL_HOST_WAKE WLAN to wake-up HOST
14 SD_D2 SDIO data line 2
15 SD_D3 SDIO data line 3

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16 SD_CMD SDIO command line
17 SD_CLK SDIO CLK line
18 SD_D0 SDIO data line 0
19 SD_D1 SDIO data line 1
20 GND Grond
21 NC NC
22 VDD_IO 1.8V / 3.3V
23 NC NC
24 SUSCLK_IN Shared with GPIO6. External 32K or RTC clock input with 1.8V ~ 3.3V
swing. This clock source is configured by BT and WL FW, respectively.
25 PCM_DOUT PCM Data output
26 PCM_CLK PCM Clock
27 PCM_DIN PCM data input
28 PCM_SYNC PCM sync signal
29 NC NC
30 NC NC
31 GND Grond
32 NC NC
33 GND Grond
34 BT_DIS# General Purpose Input/Output Pin
35 NC NC
36 GND Grond
37 NC NC
38 NC NC
39 NC NC
40 NC NC
41 GND Grond
42 UART_OUT HOST Data output
43 UART_IN HOST Data input
44 UART_CTS HOST_CTS

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10.WIFI\BT RF Circuit reference pictures

注:1.以上虚线框的部分需要进行天线匹配，以实际天线匹配的电子元器件参数为准.
2.以上为 RF 走线要做 50 欧姆阻抗，走线不能走 90 度，走线长度不能超过 15mm.

Note: The RF part layout must do 50 Ωimpedance.，can't get the line go 90°，can't get the line longer than 15
mm.

11.SDIO interface Circuit reference pictures

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12.Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times

ENVIRONMENTAL
Operating
Operating Temperature: 0°C to +70 °C
Relative Humidity: 5-90% (non-condensing)

Storage
Temperature: -40°C to +80°C (non-operating)
Relevant Humidity: 5-95% (non-condensing)

MTBF caculation
Over 150,000hours

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13.Wireless module before the SMT note: 13.Wifi 模块贴片装机前注意事项：

1.When customers Open stencil must be sure the hole bigger to the
Wireless module plate, please press 1 to 1 and 0.7 mm is widened 1.客户在开钢网时一定要将 wifi 模块焊盘的孔开大，请按 1 比 1 再向
外扩大 0.7mm 比例开钢网，厚度按 0.12mm.
to open outward, the thickness of 0.12 mm.
2.有需要拿 wifi 模块时不可以光手去拿，一定要戴上手套以及静电环.
2.Can't get the wifi module bare hands when needs,must we wear
3.过炉温度要根据客户主板的大小而定，一般像平板电脑上的标准温
the gloves and static ring.
度为250+-5°，也可以做到260+-5°
3.The furnace temperature according to the size of the customer the

mainboard ,generally like to stick on a tablet standard temperature

of 250 + - 5,can do 260 + - 5. Wifi 模块储存及使用管制应注意事项如下：

Storage and use Wifi module control should pay attention to

the following matters: 1.模块的真空包装之储存期限：

1.Module of the storage life of vacuum packaging： 1-1.保存期限：12个月，储存环境条件：温度在：<40℃，相对湿度：

1-1.Storage life： 12 months. Storage conditions:<40℃. Relative <90%R.H.

humidity:<90%R.H. 1-2.模块包装被拆后，SMT 组装之时限：
1-2.After this bag is opened , devices that will be subjected to 1-3.检查湿度卡：显示值应小于30%（蓝色），如：30%~40%(粉红色）
infrared reflow, vapor-phase reflow, or equivalent processing must
或者大于40%（红色）表示模块已吸湿气.
be :
① 工厂环境温度湿度管制：≦30%℃，≦60%R.H。
1-3.Check the humidity card :stored at ② 拆封后，车间的保存寿命为 168 小时.
1-4.如在拆封后的 168 个小时内未使用完，需要烘烤，烘烤条件如下：
≦20%RH.If :30%~40%(pink)or greater than 40%(red).Labeling ① 模块须重新烘烤，以除去模块吸湿问题.
module has moisture absorption. ② 烘烤温度条件：125℃，8 小时.
③ 烘烤后，放入适量的干燥剂再密封包装.
① Mounthed within 168 hours at factory conditions of:
1-5. 模块真空包装数量以客户要求的实际包装数量为准，真空包装图
t≦30%℃，≦60%R.H.
片<1>
② Once opened, the workshop the preservation of life for
168 hours.
1-4.If baking is required,devices may be baked for:
① Modules must be to remove module moisture problem. 2.模块卷盘包装事项如下：
② Baking temperature: 125 ℃, 8 hours. 2-1.保存期限：12个月，储存环境条件：温度在：<40℃，相对湿度：
③ After baking, put proper amount of desiccant to seal
<90%R.H.
packages.
2-2.模块拆开包装168小时后，如要上线贴片需要重新烘烤，以除去模
1-5. The actual number of module vacuum packing which is based
块吸湿问题，烘烤温度条件：125℃，8小时。
on the actual number of packages to the customer requirements , 2-3. 模块卷盘包装以客户要求的实际包装数量为准,卷盘包装图片
vacuum packing of picture<1> <2>
2.Module reel packaging items as follows.
2-1.Storage life： 12 months. Storage conditions:<40℃. Relative
3.模块托盘包装事项如下：
humidity:<90%R.H.
3-1.保存期限：3个月，储存环境条件：温度在：<40℃，相对湿度：
2-2.Module apart packing after 168 hours，To launch patch need to
<90%R.H.
bake, to remove the module hygroscopic, baking temperature
conditions：125℃，8hours. 3-2.模块如在 48 小时内未使用，在上线之前需要进行烘烤，烘烤温度

2-3. The actual number of module reel packing which is based on 条件：125℃，8 小时。

the actual number of packages to the customer requirements , Reel 3-3. 托盘包装每盘为 100pcs，模块托盘包装以客户要求的实际包装
packing of picture<2> 数量为准.

3.Module pallet packaging items as follows：

3-1.Storage life ： 3 months. Storage conditions:<40℃. Relative 注：以上包装方式根据客户要求而定，包装以实际出货为准。
humidity:<90%R.H.
3-2.Module if not used within 48 hours, before launch the need for

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baking, baking temperature: 125 ℃, 8 hours.
3-3. Pallet packaging each plate is 100 PCS.The actual number of
module pallet packing which is based on the actual number of
packages to the customer requirements.

Picture<1> Picture<2>

Picture<2>

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