DOIT.AM® Doctors of Intelligence & Technology Co.

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ESP-Mx WiFi Module

ESP-M
Manual Ver V1.1 Mar., 21, 2017 Num.: DM0014CN

Module Interface
Features  2*UART;
 1*En;
 SOC features
 1*ADC;
 Built-in Tensilica L106 ultra-low power  1*wakeup pin;
consumption 32-bit cpu, the main frequency
can be 80MHz and 160MHz, also support  1*HSPI;
RTOS;  1*I2C;
 Built-in TCP/IP protocol stack;  1*I2S;
 Built-in 1 channel 10-bit high precision ADC;  MAX 10* GPIOs;
 Interfaces include HSPI, UART, I2C, I2S, IR  Working temperature: -40℃-105℃
Remote Control, PWM, GPIO;
 Module size:
 20uA deep-sleep current, less than 5uA cut-
off current; 12.3*mm*15mm; (M1 version)
 2ms wake-up time; 12.3*mm*20mm; (M2 version)
 1.0mW consume power (DTIM3 and standby Application
state);
● Serial transparent transmission;
 Built-in 1M SPI flash byte;
● WiFi prober;
 Wi-Fi features
● Smart power plug/Smart LED light;
 Support 802.11 b/g/n/e/i ● Mesh networks;
 Support three modes: Station, SoftAP, and ● Sensor networks;
SoftAP+STA;
● Wireless location recognition;
 Support Wi-Fi Direct(P2P);
● Wireless location system beacon;
 Support hardware acceleration for CCMP
● Industrial wireless control.
(CBC-MAC, computation mode), TKIP (MIC,
RC4), WAPI(SMS4), WEP(RC4), CRC; Module Type
 P2P detection, P2P GO mode/GC mode and
Name Antenna Type
P2P power management;
ESP-M1 IPEX external antenna
 WPA/PA2 PSK and WPS; ESP-M2 PCB antenna on board
 Support 802.11 i security: pre-certification
and TSN; Module Structure
 Support 802.11n (2.4 GHz);
 802.1h/RFC1042 frame encapsulation;
 Support seamless roam;
 Support AT remote upgrade and cloud OTA
upgrade;
 Support SmartConfig function for Android
and iOS device.

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Update Record

Date Version Update

Mar, 14, 2017 V1.0 Initial version
May, 11, 2019 V1.1 Upgrade size information

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Context

1. Introduction .......................................................................................................... 1
2. Interface Definition ................................................................................................ 3
3. Shape and Size ....................................................................................................... 5
4. Electronical Characteristics ................................................................................... 7
5. Power Consumption .............................................................................................. 7
6. Wi-Fi RF Characteristics ....................................................................................... 8
7. The Recommended Sold Temperature Curve ....................................................... 9
8. Minimum User System ........................................................................................ 10
9. The Recommended PCB Design ( An Example) ................................................. 11
10. Peripheral Line Suggestion ................................................................................ 13

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1. Introduction

The WiFi module ESP-Mx is manufactured by using a high-performance chip named ESP8285. This
small chip is encapsulated an enhanced Tensilica’s L106 diamond series 32-bit kennel CPU with a
SRAM. Thus, ESP8285 has the complete function Wi-Fi function; it not only can be applied
independently, but can be used as a slaver working with other host CPU. When ESP8285 is applied as a
slaver, it can start from the onboard Flash. The built-in high-speed buffer is not only benefit to improve
the system performance, but optimize the store system. In addition, ESP8285 can be used as Wi-Fi
adapter by SPI/SDIO or I2C/UART interface, when it is applied to other MCU design.

The ESP-Mx module supports the standard IEEE802.11 b/g/n/e/i protocol and the complete TCP/IP
protocol stack. User can use it to add the WiFi function for the installed devices, and also can be viewed
as a independent network controller. Anyway, ESP-Mx module provides many probabilities with the
best price.

GPIO
PCB Ant. ESP8285
UART
802.11 b/g/n/e/i
RF Transceiver MAC
I2C
U.F.L Digital
Crystal oscillator
connector baseband
SPI
Bias circuit SRAM
I2S
Power
3.3V Interface
management
ADC
1M SPI Flash

Fig. 1.1 ESP-Mx Module Structure

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Technical Parameters for ESP-Mx are listed as follows.

Table 1.1 Parameters for ESP-M
Types Items Parameters
Frequency 2.4G~2.5G(2400M~2483.5M)
802.11b: +20 dBm
Transmit power 802.11g: +17 dBm
802.11n: +14 dBm
Wi-Fi
802.11b: -91 dbm (11Mbps)
Receiver sensitivity 802.11g: -75 dbm（54Mbps）
802.11n: -72 dbm（MCS7）
Antenna PCB antenna / U.F.L antenna
CPU Tensilica L106 32 bit MCU
UART/SDIO/SPI/I2C/I2S/IR control
Interface
GPIO/ADC/PWM/SPI/I2C/I2S
Working voltage 2.5V ~ 3.6V
Hardware Working current Average current: 80 mA
Working temperature -40°C ~105°C
Environment temperature -40°C ~ 105°C
Size of ESP-M1 12.3*15*3mm
Size of ESP-M2 12.3*20*3mm
Wi-Fi working mode Station/SoftAP/SoftAP+Station
Security mode WPA/WPA2
Encryption type WEP/TKIP/AES
Software Update firmware UART Download/OTA
Software develop Non-RTOS/RTOS/Arduino IDE etc.
Network protocol IPv4, TCP/UDP/HTTP/FTP/MQTT
User configuration AT+ command/cloud sever/ Android/iOS APP

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2. Interface Definition
Interface definition of ESP-Mx can be shown below.

Fig. 2.1 ESP-M1 Pin Definition

Fig. 2.2 ESP-M2 Pin Definition

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Working mode and definition of pins:

Table 2.1 Pin Modes
Mode IO0 IO2

UART Download Mode Low level High level

Flash Boot Mode High level High level

Table 2.2 Function Definition of Module Pins

Num Pin Name Type Function Illustration

1 ADC I A/D pin. Voltage Range: 0-1V

2 EN I Effective: High level

3 IO14 I/O GPIO14;HSPI_CLK

4 IO12 I/O GPIO12;HSPI_MISO

5 IO13 I/O GPIO13;HSPI_MOSI; UART0_CTS

6 IO15 I/O GPIO15; MTDO;HSPICS;UART0_RTS;

7 VCC P Power input: 3.3V

8 GND P GND

9 IO2 I/O GPIO2; UART1_TXD;

10 IO0 I/O GPIO0; SPI_CS2;

11 IO4 I/O GPIO4

12 IO5 I/O GPIO5

13 RXD I/O GPIO3; UART0 RX

14 TXD I/O GPIO1; UART0 TX

15 RST I Effective: Low level

16 IO16 I/O GPIO16; Used to wake up

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3. Shape and Size

Shape and size for ESP-Mx can be shown as follows.

Fig. 3.1 Shape for ESP-M1

(a) Vertical View

(b) Side View

Fig. 3.2 Size for ESP-M1

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Fig. 3.3 Shape for ESP-M2

(a) Vertical View

(b) Side View

Fig. 3.4 Size for ESP-M1

Table 3.1 Size for ESP-M1

Length Width Height PAD Size(bottom) Distance between Pins

12.3mm 15mm 3 mm 0.9*1.7mm 1.5mm

Table 3.2 Size for ESP-M2

Length Width Height PAD Size(bottom) Distance between Pins

12.3mm 20mm 3 mm 0.9*1.7mm 1.5mm

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4. Electronical Characteristics
Table 4.1 Electronics
Parameters Condition Min Classical Max Unite
Store Temperature - -40 Normal 125 ℃
IPC/JEDEC
Sold Temperature - - 260 ℃
J-STD-020
Working Voltage - 2.5 3.3 3.6 V
VIL/VIH - -0.3/0.75VIO - 0.25VIO/3.6
V
I/O VOL/VOH - N/0.8VIO - 0.1VIO/N
IMAX - - - 12 mA
Electrostatic release
TAMB=25℃ - - 2 KV
quantity (Human model)
Electrostatic release
TAMB=25℃ - - 0.5 KV
quantity (Human model)

5. Power Consumption
Table 5.1 Power Consumption
Parameters Min Classical Max Unite
Tx802.11b, CCK 11Mbps, POUT=+17dBm - 170 - mA
Tx802.11g, OFDM 54 Mbps, POUT =+15dBm - 140 - mA
Tx802.11n,MCS7,POUT =+13dBm - 120 - mA
Rx 802.11b，1024 Bytes, -80dBm - 50 - mA

Rx 802.11g，1024 Bytes, -70dBm - 56 - mA

Rx 802.11n，1024 Bytes, -65dBm - 56 - mA

Modem-sleep① - 15 - mA
Light-sleep② - 0.9 - mA
Deep-sleep③ - 20 - μA
close - 0.5 - μA

Note
①: Modem-Sleep mode can be used for the case that CPU is always working, e.g., PWM or I2S etc. If
WiFi is connected and no data is to transmitted, in this case, WiFi modem can be closed to save power
energy. For example, if at DTIM3 status, keep asleep at 300ms, Then, the module can wake up to receive
the Beacon package within 3ms and the current being 15mA.

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②: Light-Sleep mode can used for the case that CUP can stop the application temporally, e.g., Wi-Fi
Switch . If Wi-Fi is connected and there is no data packet to transmitted, by the 802.11 standard (e.g., U-
APSD), module can close Wi-Fi Modem and stop CPU to save power. For example, at DTIM3, keep up
sleeping at 300ms, it would receive the Beacon package from AP after each 3ms, then the whole average
current is about 0.9mA.
③ Deep-Sleep mode is applied to the case that Wi-Fi is not necessary to connect all the time, just send
a data packet after a long time (e.g., transmit one temperate data each 100s) . it just need 0.3s-1s to
connect AP after each 300s, and the whole average current is much smaller 1mA.

6. Wi-Fi RF Characteristics
The data in the following Table is gotten when voltage is 3.3V and1.1V in the indoor temperature
environment.
Table 6.1 Wi-Fi RF Characteristics
Parameters Min Classical Max Unite
Input frequencey 2412 - 2484 MHz
Input impedance - 50 - Ω
Input reflection - - -10 dB
At 72.2Mbps, output power consumption for PA 15.5 16.5 17.5 dBm

At 11b mode, output power consumption for PA 19.5 20.5 21.5 dBm

Sensibility - - - -
DSSS, 1Mbps - -98 - dBm
CCK11, Mbps - -91 - dBm
6Mbps(1/2 BPSK) - -93 - dBm
54Mbps(3/4 64-QAM) - -75 - dBm
HT20, MCS7(65 Mbps, 72.2 Mbps) - -72 - dBm
Adjacent Inhibition
OFDM, 6Mbps - 37 - dB
OFDM, 54Mbps - 21 - dB
HT20, MCS0 - 37 - dB
HT20, MCS7 - 20 - dB

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7. The Recommended Sold Temperature Curve

Fig. 7.1 Temperature Curve when Sold

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8. Minimum User System

This module can work just at 3.3V working voltage.

Fig. 8. 1 Minimum System

Note
(1) the working voltage for module is DC 3.3V;
(2) the max current from IO of this module is 12mA;
(3) RST Pin is enabled when it is low level; and EN pin is enabled when it is high level;
(4) WiFi module is at update mode: GPIO0 is low level, then module reset to power; Wi-Fi module
is at working mode: GPIO0 is at high level, and then reset to power;
(5) Wi-Fi module is connected to RXD of the other MCU, and TXD is connected to RXD of the
other MCU.

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9. The Recommended PCB Design ( An Example)

Wi-Fi module can be inserted into the PCB board directly. For the high RF performance for the end
device, please note the placement for the antenna and the module.
Especially, since the antenna is external for ESP-M1, the antenna can be placed by the project
requirements. The connector for external antenna is shown in the following.

Fig. 9. 1 Connector for the external antenna

It is suggested that the module is placed along with PCB side, the antenna is placed outside the board,
or along with the PCB side, and the below board is blank, please refer to the scheme 1 and scheme 2; if

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the PCB antenna must placed on the board, please do not cover the copper at the bottom of PCB antenna,
as can be shown at scheme 3.

Fig. 9.2 scheme1: Antenna is at the outside of the board

Fig. 9.3 Scheme 2: Antenna is placed along with side of the board, and it is blank at the bottom of the
board.

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Fig. 9.4 Scheme 3: Antenna is placed along with the side of the board, and don’t cover copper under the
module

10. Peripheral Line Suggestion

Wi-Fi module is already integrated into high-speed GPIO and Peripheral interface, which may be
generated the switch noise. If there is a high request for the power consumption and EMI characteristics,
it is suggested to connect a serial 10~100 ohm resistance, which can suppress overshoot when switching
power supply, and can smooth signal. At the same time, it also can, to a certain extent, prevent
electrostatic discharge (ESD).

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notice.

Documents are provided by the current version without any guarantee responsibility, including
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licensing, whether express or implied license.

The Wi-Fi alliance marks shall be owned by the Wi-Fi alliance.

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the property of their respective owners, and hereby declare.

Notice
Because of the product update or other reasons, this
manual may change. Doctors of Intelligence &
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contents of this manual in the absence of any notice or
reminders. This manual is used only as a guide,
Doctors of Intelligence & Technology Co., LTD would
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