EC20 R2.

1 Mini PCIe
Hardware Design

LTE Standard Module Series

Rev. EC20_R2.1_Mini_PCIe_Hardware_Design_V1.1

Date: 2019-09-10

Status: Released

www.quectel.com
 LTE Standard Module Series
EC20 R2.1 Mini PCIe Hardware Design

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Quectel Wireless Solutions Co., Ltd.

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About the Document

History

Revision Date Author Description

Woody WU/
1.0 2017-12-22 Initial
Niko WU
1. Added LTE-TDD band B34 (Table 1, 19, 20, 23, 24
and 26).
2. Updated key features of EC20 R2.1 Mini PCIe
module (Table 2).
3. Updated names of pin 3 and 5 from RESERVED to
COEX_UART_RX and COEX_UART_TX
respectively (Figure 2).
4. Updated pin definition and description of
COEX_UART_RX and COEX_UART_TX (Table 4).
Lorry XU/
1.1 2019-09-10 5. Updated reference circuit of USB interface (Figure 5).
Niko WU
6. Added description of COEX UART interface (Chapter
3.6.2).
7. Updated reference circuit of (U)SIM interface with an
8-pin (U)SIM card connector (Figure 7).
8. Updated description of PCM interface (Chapter 3.9).
9. Updated description of W_DISABLE# (Chapter
3.10.3).
10. Added note for antenna requirements (Chapter 5.2).
11. Updated thermal consideration (Chapter 6.6).

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Contents

About the Document ................................................................................................................................... 2

Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 5
Figure Index ................................................................................................................................................. 6

1 Introduction .......................................................................................................................................... 7
1.1. Safety Information...................................................................................................................... 8

2 Product Concept .................................................................................................................................. 9

2.1. General Description ................................................................................................................... 9
2.2. Key Features ........................................................................................................................... 10
2.3. Functional Diagram ................................................................................................................. 13

3 Application Interfaces ....................................................................................................................... 14

3.1. Pin Assignment ........................................................................................................................ 14
3.2. Pin Description......................................................................................................................... 15
3.3. Operating Modes ..................................................................................................................... 18
3.4. Power Saving........................................................................................................................... 18
3.4.1. Sleep Mode .................................................................................................................... 18
3.4.2. Airplane Mode ................................................................................................................ 19
3.5. Power Supply........................................................................................................................... 19
3.6. UART Interfaces ...................................................................................................................... 20
3.6.1. Main UART Interface ...................................................................................................... 20
3.6.2. COEX UART Interface* .................................................................................................. 21
3.7. USB Interface .......................................................................................................................... 21
3.8. (U)SIM Interface ...................................................................................................................... 22
3.9. PCM and I2C Interfaces .......................................................................................................... 24
3.10. Control and Indication Signals ................................................................................................. 27
3.10.1. RI Signal ......................................................................................................................... 27
3.10.2. DTR Signal ..................................................................................................................... 28
3.10.3. W_DISABLE# Signal...................................................................................................... 28
3.10.4. PERST# Signal .............................................................................................................. 28
3.10.5. LED_WWAN# Signal ..................................................................................................... 29
3.10.6. WAKE# Signal ................................................................................................................ 30

4 GNSS Receiver ................................................................................................................................... 31

4.1. General Description ................................................................................................................. 31
4.2. GNSS Performance ................................................................................................................. 31
4.3. GNSS Frequency..................................................................................................................... 32

5 Antenna Connection .......................................................................................................................... 33

5.1. Antenna Connectors ................................................................................................................ 33
5.1.1. Operating Frequency ..................................................................................................... 33
5.2. Antenna Requirements ............................................................................................................ 34

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5.3. Recommended Mating Plugs for Antenna Connection ........................................................... 35

6 Electrical, Reliability and Radio Characteristics ......................................................................... 37

6.1. General Description ................................................................................................................. 37
6.2. Power Supply Requirements ................................................................................................... 37
6.3. I/O Requirements..................................................................................................................... 38
6.4. RF Characteristics ................................................................................................................... 38
6.5. ESD Characteristics ................................................................................................................ 40
6.6. Thermal Consideration ............................................................................................................ 40
6.7. Current Consumption .............................................................................................................. 42

7 Dimensions and Packaging .............................................................................................................. 46

7.1. General Description ................................................................................................................. 46
7.2. Mechanical Dimensions of EC20 R2.1 Mini PCIe ................................................................... 46
7.3. Standard Dimensions of Mini PCI Express ............................................................................. 47
7.4. Packaging Specifications ......................................................................................................... 48

8 Appendix A References..................................................................................................................... 49

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Table Index

TABLE 1: SUPPORTED BANDS OF EC20 R2.1 MINI PCIE .............................................................................. 9

TABLE 2: KEY FEATURES OF EC20 R2.1 MINI PCIE ..................................................................................... 10
TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 15
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 18
TABLE 6: DEFINITION OF POWER SUPPLY INTERFACE ............................................................................. 19
TABLE 7: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................... 20
TABLE 8: PIN DEFINITION OF COEX UART INTERFACE .............................................................................. 21
TABLE 9: PIN DEFINITION OF USB INTERFACE ........................................................................................... 21
TABLE 10: PIN DEFINITION OF (U)SIM INTERFACE ..................................................................................... 22
TABLE 11: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 25
TABLE 12: PIN DEFINITION OF CONTROL AND INDICATION SIGNALS ...................................................... 27
TABLE 13: AIRPLANE MODE CONTROLLED BY HARDWARE METHOD ..................................................... 28
TABLE 14: AIRPLANE MODE CONTROLLED BY SOFTWARE METHOD ..................................................... 28
TABLE 15: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",0, DEFAULT SETTING)......... 29
TABLE 16: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",2) ........................................... 30
TABLE 17: GNSS PERFORMANCE ................................................................................................................. 31
TABLE 18: GNSS FREQUENCY ....................................................................................................................... 32
TABLE 19: OPERATING FREQUENCIES ........................................................................................................ 33
TABLE 20: ANTENNA REQUIREMENTS.......................................................................................................... 34
TABLE 21: POWER SUPPLY REQUIREMENTS .............................................................................................. 37
TABLE 22: I/O REQUIREMENTS ...................................................................................................................... 38
TABLE 23: EC20 R2.1 MINI PCIE CONDUCTED RF OUTPUT POWER ........................................................ 38
TABLE 24: EC20 R2.1 MINI PCIE CONDUCTED RF RECEIVING SENSITIVITY ........................................... 39
TABLE 25: ESD CHARACTERISTICS OF EC20 R2.1 MINI PCIE ................................................................... 40
TABLE 26: CURRENT CONSUMPTION OF EC20 R2.1 MINI PCIE ................................................................ 42
TABLE 27: GNSS CURRENT CONSUMPTION OF EC20 R2.1 MINI PCIE ..................................................... 45
TABLE 28: RELATED DOCUMENTS ................................................................................................................ 49
TABLE 29: TERMS AND ABBREVIATIONS ...................................................................................................... 49

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13

FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 14
FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 19
FIGURE 4: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 20
FIGURE 5: REFERENCE CIRCUIT OF USB INTERFACE .............................................................................. 22
FIGURE 6: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR 23
FIGURE 7: R REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 24
FIGURE 8: TIMING IN PRIMARY MODE .......................................................................................................... 25
FIGURE 9: TIMING IN AUXILIARY MODE........................................................................................................ 26
FIGURE 10: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 26
FIGURE 11: RI BEHAVIORS ............................................................................................................................. 27
FIGURE 12: TIMING OF RESETTING MODULE ............................................................................................. 29
FIGURE 13: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................ 29
FIGURE 14: WAKE# BEHAVIOR ...................................................................................................................... 30
FIGURE 15: DIMENSIONS OF THE RECEPTACLE RF CONNECTORS (UNIT: MM) .................................... 35
FIGURE 16: MECHANICALS OF U.FL-LP MATING PLUGS ........................................................................... 35
FIGURE 17: SPACE FACTOR OF MATING PLUGS (UNIT: MM) ..................................................................... 36
FIGURE 18: REFERENCED HEATSINK DESIGN ........................................................................................... 41
FIGURE 19: MECHANICAL DIMENSIONS OF EC20 R2.1 MINI PCIE ............................................................ 46
FIGURE 20: STANDARD DIMENSIONS OF MINI PCI EXPRESS ................................................................... 47
FIGURE 21: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679100002) .................... 48

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1 Introduction
This document defines EC20 R2.1 Mini PCIe module, and describes its air interfaces and hardware
interfaces which are connected with customers’ applications.

This document helps customers quickly understand module interface specifications, electrical
characteristics, mechanical specifications and other related information of the module. To facilitate
application designs, it also includes some reference designs for customers’ reference. The document,
coupled with application notes and user guides, makes it easy to design and set up wireless applications
with EC20 R2.1 Mini PCIe.

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1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating EC20 R2.1 Mini PCIe module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for customers’ failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.

Wireless devices may cause interference on sensitive medical equipment, so

please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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2Product Concept
2.1. General Description

EC20 R2.1 Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+,
HSDPA, HSUPA, WCDMA, TD-SCDMA, EVDO, CDMA, EDGE and GPRS networks with PCI Express
Mini Card 1.2 standard interface. It supports embedded operating systems such as Linux, Android, etc.,
and also provides audio, high-speed data transmission and GNSS functionalities for customers’
applications.

EC20 R2.1 Mini PCIe module can be applied in the following fields:

 PDA and Laptop Computer

 Remote Monitor System
 Vehicle System
 Wireless POS System
 Intelligent Meter Reading System
 Wireless Router and Switch
 Other Wireless Terminal Devices

Table 1: Supported Bands of EC20 R2.1 Mini PCIe

Module Description

LTE-FDD (with receive diversity) 1): B1/B3/B5/B8

LTE-TDD (with receive diversity) 1): B34/B38/B39/B40/B41
WCDMA (with receive diversity) 1): B1/B8
TD-SCDMA: B34/B39
EC20 R2.1 Mini PCIe
EVDO/CDMA: BC0
GSM: 900/1800MHz
GNSS: GPS, GLONASS, BeiDou/Compass, Galileo, QZSS 2)
Support digital audio 3)

NOTES
SS
1. EC20 R2.1 Mini PCIe contains Telematics version and Data-only version. Telematics version
supports voice and data functions, while Data-only version only supports data function.

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1)
2. Rx-diversity function is optional.
2)
3. GNSS function is optional.
3)
4. Digital audio (PCM) function is only supported on Telematics version.

2.2. Key Features

The following table describes the detailed features of EC20 R2.1 Mini PCIe module.

Table 2: Key Features of EC20 R2.1 Mini PCIe

Features Description

Function Interface PCI Express Mini Card 1.2 Standard Interface

Supply voltage: 3.0V~3.6V

Power Supply
Typical supply voltage: 3.3V
Class 4 (33dBm±2dB) for EGSM900MHz
Class 1 (30dBm±2dB) for DCS1800MHz
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Transmitting Power Class 3 (24dBm+2/-1dB) for EVDO/CDMA BC0
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 2 (24dBm+1/-3dB) for TD-SCDMA bands
Class 3 (23dBm±2dB) for LTE FDD bands
Class 3 (23dBm±2dB) for LTE TDD bands
Support up to 3GPP R8 non-CA Cat 4 FDD and TDD
Support 1.4/3/5/10/15/20MHz RF bandwidth
LTE Features Support MIMO in DL direction
LTE-FDD: Max 150Mbps (DL)/Max 50Mbps (UL)
LTE-TDD: Max 130Mbps (DL)/Max 30Mbps (UL)
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK,16-QAM and 64-QAM modulation
UMTS Features DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (UL), 384Kbps (DL)
Support CCSA Release 3 TD-SCDMA
TD-SCDMA Features
Max 4.2Mbps (DL)/Max 2.2Mbps (UL)
Support 3GPP2 CDMA2000 1X Advanced and 1xEV-DO Rev.A
CDMA2000 Features EVDO: Max 3.1Mbps (DL)/Max 1.8Mbps (UL)
1X Advanced: Max 307.2Kbps (DL)/Max 307.2Kbps (UL)
GPRS:
GSM Features
Support GPRS multi-slot class 33 (33 by default)

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Coding scheme: CS-1, CS-2, CS-3 and CS-4

Max 107Kbps (DL)/Max 85.6Kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL)/Max 236.8Kbps (UL)
Support protocols TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/
CMUX*/HTTPS*/SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols
Internet Protocol Features Support protocols PAP (Password Authentication Protocol) and CHAP
(Challenge Handshake Authentication Protocol) which are usually used for
PPP connection
Text and PDU modes
Point-to-point MO and MT
SMS
SMS cell broadcast
SMS storage: ME by default

(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V

Main UART:
Support RTS and CTS hardware flow control
Baud rate can reach up to 230400bps; 115200bps by default
UART Interfaces
Used for AT command communication and data transmission
COEX UART*:
LTE/WLAN&BT coexistence UART
Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
Audio Features WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
PCM Interface
Support master and slave modes, but must be the master in long frame
synchronization
Compliant with USB 2.0 specification (slave only); the data transfer rate
can reach up to 480Mbps
Used for AT command communication, data transmission, firmware
USB Interface
upgrade, software debugging, GNSS NMEA output and voice over USB
Support USB serial driver for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15,
Android 4.x/5.x/6.x/7.x/8.x/9.x, etc.
Include main antenna, diversity antenna and GNSS antenna receptacle
Antenna Connectors
connectors

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Rx-diversity Support LTE/WCDMA Rx-diversity (Optional)

Gen8C Lite of Qualcomm

GNSS Features Protocol: NMEA 0183
Data update rate: 10Hz by default
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
AT Commands
commands
Size: (51.0±0.15)mm × (30.0±0.15)mm × (4.9±0.2)mm
Physical Characteristics
Weight: approx. 10.6g
Operation temperature range: -35°C ~ +75°C 1)
Temperature Range Extended temperature range: -40°C ~ +80°C 2)
Storage temperature range: -40°C ~ +90°C

Firmware Upgrade Upgrade via USB interface or DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive

NOTES
1) Within
1. operation temperature range, the module is 3GPP compliant.
2)
2. Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like Pout might reduce in their value and exceed the specified tolerances. When the temperature
returns to normal operation temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.

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2.3. Functional Diagram

The following figure shows the block diagram of EC20 R2.1 Mini PCIe.

VCC Boost VBAT

Circuit
Main
Main
USB Antenna
Antenna
Connector
Mini PCI Express

PCM&I2C GNSS
GNSS
EC20 R2.1 Antenna
Antenna
UART
Interface

Module Connector

(U)SIM Diversity
Diversity
Antenna Antenna
Connector
W_DISABLE#
PERST#
DTR
WAKE#
RI
LED_WWAN#

Figure 1: Functional Diagram

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3Application Interfaces
The physical connections and signal levels of EC20 R2.1 Mini PCIe comply with PCI Express Mini Card
Electromechanical Specification. This chapter mainly describes the definition and application of the
following interfaces for EC20 R2.1 Mini PCIe:

 Power supply
 UART interfaces
 USB interface
 (U)SIM interfaces
 PCM and I2C interfaces
 Control and Indication signals

3.1. Pin Assignment

The following figure shows the pin assignment of EC20 R2.1 Mini PCIe module. The top side contains
EC20 R2.1 module and antenna connectors.

Pin Name Pin No. Pin No. Pin Name

WAKE# 1 2 VCC_3V3
COEX_UART_RX 3 4 GND
COEX_UART_TX 5 6 NC
RESERVED 7 8 USIM_VDD
GND 9 PIN1 PIN2 10 USIM_DATA
UART_RX 11 12 USIM_CLK
UART_TX 13 14 USIM_RST
GND 15 16 RESERVED

RI 17 18 GND
RESERVED 19 TOP BOT 20 W_DISABLE#
GND 21 22 PERST#
UART_CTS 23 24 RESERVED
UART_RTS 25 26 GND
GND 27 28 NC
GND 29 PIN51 PIN52 30 I2C_SCL
DTR 31 32 I2C_SDA
RESERVED 33 34 GND
GND 35 36 USB_DM
GND 37 38 USB_DP
VCC_3V3 39 40 GND
VCC_3V3 41 42 LED_WWAN#
GND 43 44 USIM_PRESENCE
PCM_CLK 45 46 RESERVED
PCM_DOUT 47 48 NC
PCM_DIN 49 50 GND
PCM_SYNC 51 52 VCC_3V3

Figure 2: Pin Assignment

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3.2. Pin Description

The following tables show the pin definition and description of the 52 pins on EC20 R2.1 Mini PCIe.

Table 3: I/O Parameters Definition

Type Description

DI Digital Input

DO Digital Output

IO Bidirectional

OC Open Collector

PI Power Input

PO Power Output

Table 4: Pin Description

Mini PCI Express EC20 R2.1 Mini

Pin No. I/O Description Comment
Standard Name PCIe Pin Name
Output signal used to
1 WAKE# WAKE# OC
wake up the host.
3.0V~3.6V, typically 3.3V
2 3.3Vaux VCC_3V3 PI
DC supply
It is prohibited
LTE/WLAN&BT to be pulled up
3 RESERVED COEX_UART_RX 1) DI
coexistence signal to high level
before startup.

4 GND GND Mini card ground

It is prohibited
LTE/WLAN&BT to be pulled up
5 RESERVED COEX_UART_TX 1) DO
coexistence signal to high level
before startup.

6 1.5V NC Not connected

7 CLKREQ# RESERVED Reserved

8 UIM_PWR USIM_VDD PO Power supply for the

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(U)SIM card

9 GND GND Mini card ground

Data signal of (U)SIM

10 UIM_DATA USIM_DATA IO
card
Connect to
11 REFCLK- UART_RX DI UART receive data
DTE’s TX.
Clock signal of (U)SIM
12 UIM_CLK USIM_CLK DO
card
Connect to
13 REFCLK+ UART_TX DO UART transmit data
DTE’s RX.
Reset signal of (U)SIM
14 UIM_RESET USIM_RST DO
card

15 GND GND Mini card ground

16 UIM_VPP RESERVED Reserved

17 RESERVED RI DO Ring indication

18 GND GND Mini card ground

19 RESERVED RESERVED Reserved

20 W_DISABLE# W_DISABLE# DI Airplane mode control Active low.

21 GND GND Mini card ground

Fundamental reset
22 PERST# PERST# DI Active low.
signal
Connect to
23 PERn0 UART_CTS DI UART clear to send
DTE’s RTS.

24 3.3Vaux RESERVED Reserved

Connect to
25 PERp0 UART_RTS DO UART request to send
DTE’s CTS.

26 GND GND Mini card ground

27 GND GND Mini card ground

28 1.5V NC Not connected

29 GND GND Mini card ground

Require
30 SMB_CLK I2C_SCL DO I2C serial clock external
pull-up to 1.8V.

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31 PETn0 DTR DI Sleep mode control

Require
32 SMB_DATA I2C_SDA IO I2C serial data external
pull-up to 1.8V.

33 PETp0 RESERVED Reserved

34 GND GND Mini card ground

35 GND GND Mini card ground

Require
differential
36 USB_D- USB_DM IO USB differential data (-)
impedance of
90Ω.

37 GND GND Mini card ground

Require
differential
38 USB_D+ USB_DP IO USB differential data (+)
impedance of
90Ω.
3.0V~3.6V, typically 3.3V
39 3.3Vaux VCC_3V3 PI
DC supply

40 GND GND Mini card ground

3.0V~3.6V, typically 3.3V

41 3.3Vaux VCC_3V3 PI
DC supply
LED signal for indicating
42 LED_WWAN# LED_WWAN# OC the network status of the
module

43 GND GND Mini card ground

(U)SIM card insertion

44 LED_WLAN# USIM_PRESENCE DI
detection

45 RESERVED PCM_CLK 2) IO PCM clock

46 LED_WPAN# RESERVED Reserved

47 RESERVED PCM_DOUT 2) DO PCM data output

48 1.5V NC Not connected

49 RESERVED PCM_DIN 2) DI PCM data input

50 GND GND Mini card ground

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PCM frame
51 RESERVED PCM_SYNC 2) IO
synchronization
3.0V~3.6V, typically 3.3V
52 3.3Vaux VCC_3V3 PI
DC supply

NOTES
1)
1. LTE/WLAN&BT coexistence UART function is under development.
2)
2. The digital audio (PCM) function is only supported on Telematics version.
3. Keep all NC, reserved and unused pins unconnected.

3.3. Operating Modes

The following table briefly outlines the operating modes to be mentioned in the following chapters.

Table 5: Overview of Operating Modes

Mode Details

Software is active. The module has registered on the network, and it is

Idle
Normal ready to send and receive data.
Operation Network connection is ongoing. In this mode, the power consumption is
Talk/Data
decided by network setting and data transfer rate.
Minimum AT+CFUN command can set the module to a minimum functionality mode without
Functionality removing the power supply. In this case, both RF function and (U)SIM card will be
Mode invalid.
AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In
Airplane Mode
this case, RF function will be invalid.
In this mode, the current consumption of the module will be reduced to the minimal
Sleep Mode level. In this mode, the module can still receive paging message, SMS, voice call and
TCP/UDP data from the network normally.

3.4. Power Saving

3.4.1. Sleep Mode

EC20 R2.1 Mini PCIe is able to reduce its current consumption to a minimum value in sleep mode. There
are three preconditions must be met to make the module enter sleep mode.

 Execute AT+QSCLK=1 to enable sleep mode.

 Ensure the DTR is kept at high level or be kept open.

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 The host’s USB bus, which is connected with the module’s USB interface, enters suspend state.

3.4.2. Airplane Mode

When the module enters airplane mode, the RF function will be disabled, and all AT commands related to
it will be inaccessible. For more details, please refer to Chapter 3.10.3.

3.5. Power Supply

The following table shows pin definition of power supply interface.

Table 6: Definition of Power Supply Interface

Pin Name Pin No. I/O Power Domain Description

VCC_3V3 2, 39, 41, 52 PI 3.0V~3.6V Typically 3.3V DC supply

4, 9, 15, 18, 21,

GND 26, 27, 29, 34, Mini card ground
35, 37, 40, 43, 50

The typical supply voltage of EC20 R2.1 Mini PCIe is 3.3V. In the 2G network, the input peak current may
reach 2.7A during the transmitting time. Therefore, the power supply must be able to provide a rated
output current of 2.7A at least, and a bypass capacitor of no less than 470µF with low-ESR should be
used to prevent the voltage from dropping.

The following figure shows a reference design of power supply where R2 and R3 are 1% tolerance
resistors and C3 is a low-ESR capacitor.

MIC29302WU U1

LDO_IN VCC_3V3
2 IN OUT 4
GND

ADJ
EN

D1 R1 R2
C1 C2
82K 1% R4
1

TVS 470uF 100nF 51K C3 C4 C5 C6

R3 470R 470uF 100nF 33pF 10pF

R5 47K 1%
4.7K

MCU_POWER R6
_ON/OFF 47K

Figure 3: Reference Circuit of Power Supply

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3.6. UART Interfaces

EC20 R2.1 Mini PCIe provides one main UART interface and one COEX UART interface.

3.6.1. Main UART Interface

The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps and
230400bps baud rates, and the default is 115200bps. This interface supports RTS and CTS hardware
flow control, and can be used for AT command communication and data transmission.

The following table shows the pin definition of the main UART interface.

Table 7: Pin Definition of Main UART Interface

Pin Name Pin No. I/O Power Domain Description

UART_RX 11 DI 3.3V UART receive data

UART_TX 13 DO 3.3V UART transmit data

UART_CTS 23 DI 3.3V UART clear to send

UART_RTS 25 DO 3.3V UART request to send

The signal level of main UART interface is 3.3V. When connecting to the peripheral MCU/RAM,
customers need to pay attention to the signal direction. The reference circuit is as follows:

MCU/ARM Module

TXD UART_TXD
RXD UART_RXD

RTS UART_RTS

CTS UART_CTS

GND GND

Voltage level: 3.3V Voltage level: 3.3V

Figure 4: Reference Circuit of Power Supply

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3.6.2. COEX UART Interface*

The following table shows the pin definition of the COEX UART interface.

Table 8: Pin Definition of COEX UART Interface

Pin Name Pin No. I/O Power Domain Description

LTE/WLAN&BT coexistence signal.

COEX_UART_RX 3 DI 1.8V It is prohibited to be pulled up to
high level before startup.
LTE/WLAN&BT coexistence signal.
COEX_UART_TX 5 DO 1.8V It is prohibited to be pulled up to
high level before startup.

NOTES

1. AT+IPR command can be used to set the baud rate of the main UART, and AT+IFC command can be
used to set the hardware flow control (hardware flow control is disabled by default). Please refer to
document [2] for details.
2. “*” means under development.

3.7. USB Interface

EC20 R2.1 Mini PCIe provides one integrated Universal Serial Bus (USB) interface which complies with
USB 2.0 specification. It can only be used as a slave device. Meanwhile, it supports high speed (480Mbps)
mode and full speed (12Mbps) mode. The USB interface is used for AT command communication, data
transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB.

The following table shows the pin definition of USB interface.

Table 9: Pin Definition of USB Interface

Pin Name Pin No. I/O Description Comment

USB_DM 36 IO USB differential data (-) Require differential impedance of 90Ω

USB_DP 38 IO USB differential data (+) Require differential impedance of 90Ω

The following figure shows a reference circuit of USB interface.

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Test Points
Minimize these stubs

Module MCU
R3 NM_0R
R4 NM_0R

L1 USB_DM
USB_DM
USB_DP USB_DP

ESD Array Close to Module

GND GND

Figure 5: Reference Circuit of USB Interface

A common mode choke L1 is recommended to be added in series between the module and customer’s
MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be
added in series between the module and the test points so as to facilitate debugging, and the resistors are
not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components
must be placed close to the module, and also R3 and R4 should be placed close to each other. The extra
stubs of trace must be as short as possible.

Please follow the requirements below during USB interface design so as to meet USB 2.0 specification.

 It is important to route the USB signal traces as differential pairs with total grounding. The impedance
of USB differential trace is 90Ω.
 Do not route signal traces under crystals, oscillators, magnetic devices or RF signal traces. It is
important to route the USB differential traces in inner-layer with ground shielding on not only upper
and lower layers but also right and left sides.
 Special attention should be paid to the selection of ESD device on the USB data line. Its parasitic
capacitance should not exceed 2pF and should be placed as close as possible to the USB interface.

3.8. (U)SIM Interface

EC20 R2.1 Mini PCIe’s (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and
3.0V (U)SIM cards are supported. The following table shows the pin definition of the (U)SIM interface.

Table 10: Pin Definition of (U)SIM Interface

Pin Name Pin No. I/O Power Domain Description

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USIM_VDD 8 PO 1.8V/3.0V Power supply for (U)SIM card

USIM_DATA 10 IO 1.8V/3.0V Data signal of (U)SIM card

USIM_CLK 12 DO 1.8V/3.0V Clock signal of (U)SIM card

USIM_RST 14 DO 1.8V/3.0V Reset signal of (U)SIM card

USIM_PRESENCE 44 DI 1.8V (U)SIM card insertion detection

EC20 R2.1 Mini PCIe supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function
supports low level and high level detections. By default, It is disabled, and can be configured via
AT+QSIMDET command. Please refer to document [2] for details about the command.

The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector.

USIM_VDD
100nF

Module
15K
(U)SIM Card Connector
GND
USIM_VDD VCC GND
USIM_RST 0R RST VPP
USIM_CLK 0R IO
CLK
USIM_PRESENCE
0R
USIM_DATA

GND
33pF 33pF 33pF

GND GND

Figure 6: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector

If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A
reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following
figure.

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USIM_VDD 100nF
Module
15K
GND (U)SIM Card Connector

USIM_VDD VCC GND

USIM_RST 0R RST VPP
USIM_CLK 0R CLK IO

USIM_DATA 0R

33pF 33pF 33pF

GND GND

Figure 7: R Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector

In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please
follow the criteria below in (U)SIM circuit design:

 Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length
as less than 200mm as possible.
 Keep (U)SIM card signals away from RF and power supply traces.
 To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
 In order to offer good ESD protection, it is recommended to add a TVS diode with parasitic
capacitance not exceeding 15pF.
 The 0Ω resistors should be added in series between the module and the (U)SIM card connector so
as to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900.
Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector.
 The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace
and sensitive occasion are applied and should be placed close to the (U)SIM card connector.

3.9. PCM and I2C Interfaces

EC20 R2.1 Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface.

The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec
design.

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Table 11: Pin Definition of PCM and I2C Interfaces

Pin Name Pin No. I/O Power Domain Description

PCM_CLK 45 IO 1.8V PCM clock

PCM_DOUT 47 DO 1.8V PCM data output

PCM_DIN 49 DI 1.8V PCM data input

PCM_SYNC 51 IO 1.8V PCM frame synchronization

I2C serial clock.

I2C_SCL 30 DO 1.8V
Require external pull-up to 1.8V.
I2C serial data.
I2C_SDA 32 IO 1.8V
Require external pull-up to 1.8V.

EC20 R2.1 Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the
following modes:

 Primary mode (short frame synchronization, works as either master or slave)

 Auxiliary mode (long frame synchronization, works as master only)

In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports
256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz
PCM_CLK at 16kHz PCM_SYNC. The following figure shows the timing relationship in primary mode with
8kHz PCM_SYNC and 2048kHz PCM_CLK.

125us

PCM_CLK 1 2 255 256

PCM_SYNC

MSB LSB MSB

PCM_DOUT

MSB LSB MSB

PCM_DIN

Figure 8: Timing in Primary Mode

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In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising
edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a
256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC. The
following figure shows the timing relationship in auxiliary mode with 8kHz PCM_SYNC and 256kHz
PCM_CLK.

125us

PCM_CLK 1 2 31 32

PCM_SYNC

MSB LSB
PCM_DOUT

MSB LSB

PCM_DIN

Figure 9: Timing in Auxiliary Mode

Clock and mode can be configured by AT command, and the default configuration is master mode using
short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. In addition, EC20
R2.1 Mini PCIe’s firmware has integrated the configuration on some PCM codec’s application with I2C
interface. Please refer to document [2] for details about AT+QDAI command.

The following figure shows a reference design of PCM interface with an external codec IC.

MIC_BIAS
PCM_CLK BCLK
PCM_SYNC FS MIC+
BIAS

PCM_DOUT DACIN MIC-

PCM_DIN ADCOUT

SPKOUT+
I2C_SCL SCLK
I2C_SDA SDIN SPKOUT-

Module Codec
2.2K

2.2K

1.8V

Figure 10: Reference Circuit of PCM Application with Audio Codec

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NOTE

Digital audio (PCM) function is only supported on Telematics version.

3.10. Control and Indication Signals

The following table shows the pin definition of control and indication signals.

Table 12: Pin Definition of Control and Indication Signals

Pin Name Pin No. I/O Power Domain Description

RI 17 DO 3.3V Output signal used to wake up the host.

DTR 31 DI 3.3V Sleep mode control.

Airplane mode control.

W_DISABLE# 20 DI 3.3V Pulled up by default.
Active low.
Fundamental reset signal.
PERST# 22 DI 3.3V
Active low.
LED signal for indicating the network
LED_WWAN# 42 OC
status of the module.

WAKE# 1 OC Output signal used to wake up the host.

3.10.1. RI Signal

The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors
on the RI pin after executing AT+QCFG="risignaltype","physical".

120ms
High

Low
URC return

Figure 11: RI Behaviors

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3.10.2. DTR Signal

The DTR signal is used for sleep mode control. It is pulled up by default. When module is in sleep mode,
driving it to low level can wake up the module. For more details about the preconditions for module to
enter sleep mode, please refer to Chapter 3.4.1.

3.10.3. W_DISABLE# Signal

EC20 R2.1 Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (GNSS not
included). The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled
by default, and AT+QCFG=“airplanecontrol”,1 can be used to enable the function. Driving it to low level
can make the module enter airplane mode.

Table 13: Airplane Mode Controlled by Hardware Method

W_DISABLE# RF Function Status Module Operation Mode

High level RF enabled Normal mode

Low level RF disabled Airplane mode

Software method can be controlled by AT+CFUN, and has the same effect with W_DISABLE# signal
function, the details are as follows.

Table 14: Airplane Mode Controlled by Software Method

AT+CFUN=? RF Function Status Module Operation Mode

0 RF and (U)SIM disabled Minimum functionality mode

1 RF enabled Normal mode

4 RF disabled Airplane mode

3.10.4. PERST# Signal

The PERST# signal can be used to force a hardware reset on the card. Customers can reset the module
by driving PERST# signal low for 150ms~460 and then releasing it. The reset scenario is illustrated in the
following figure.

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VCC_3V3
≤460ms

≥150ms
PERST# VIH≥2.3V
VIL≤0.5V

Module Running Resetting Restart

Status

Figure 12: Timing of Resetting Module

3.10.5. LED_WWAN# Signal

The LED_WWAN# signal of EC20 R2.1 Mini PCIe is used to indicate the network status of the module,
and can absorb a current up to 40mA. According to the following circuit, in order to reduce the current of
the LED, a resistor must be placed in series with the LED. The LED is emitting light when the
LED_WWAN# output signal is low.

LED_WWAN# R
VCC

Figure 13: LED_WWAN# Signal Reference Circuit Diagram

There are two indication modes for LED_WWAN# signal to indicate network status, which can be
switched through following AT commands:

 AT+QCFG="ledmode",0 (Default setting)

 AT+QCFG="ledmode",2

The following tables show the detailed network status indications of the LED_WWAN# signal.

Table 15: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting)

Pin Status Description

Flicker slowly (200ms Low/1800ms High) Network searching

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Flicker slowly (1800ms Low/200ms High) Idle

Flicker quickly (125ms Low/125ms High) Data transfer is ongoing

Always Low Voice calling

Table 16: Indications of Network Status (AT+QCFG="ledmode",2)

Pin Status Description

Low Level (Light ON) Registered on network successfully

 No network coverage or not registered

High Impedance (Light OFF)  W_DISABLE# signal is at low level. (Disable RF)
 AT+CFUN=0, AT+CFUN=4

3.10.6. WAKE# Signal

The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and
AT+QCFG="risignaltype","physical" command are required. When a URC returns, a 120ms low level
pulse will be outputted. The state of WAKE# signal is shown as below.

120ms
High
(external
pull-up)

Low
URC return

Figure 14: WAKE# Behavior

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4 GNSS Receiver
4.1. General Description

EC20 R2.1 Mini PCIe includes a fully integrated global navigation satellite system solution that supports
Qualcomm Gen8C Lite (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS). Additionally, it supports
standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface
by default.

By default, EC20 R2.1 Mini PCIe GNSS engine is switched off. It has to be switched on via AT command.
For more details about GNSS engine technology and configurations, please refer to document [3].

4.2. GNSS Performance

Table 17: GNSS Performance

Parameter Description Conditions Typ. Unit

Cold start Autonomous -146 dBm

Sensitivity
Reacquisition Autonomous -157 dBm
(GNSS)
Tracking Autonomous -157 dBm

Autonomous 35 s
Cold start
@open sky
XTRA enabled 18 s

Autonomous 26 s
TTFF Warm start
(GNSS) @open sky
XTRA enabled 2.2 s

Autonomous 2.5 s
Hot start
@open sky
XTRA enabled 1.8 s

Accuracy Autonomous
CEP-50 <2.5 m
(GNSS) @open sky

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NOTES

1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep
positioning for at least 3 minutes continuously).
2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock
within 3 minutes after loss of lock.
3. Cold start sensitivity: the minimum GNSS signal power at which the module can fix position
successfully within 3 minutes after executing cold start command.

4.3. GNSS Frequency

Table 18: GNSS Frequency

Type Frequency Unit

GPS 1575.42±1.023 MHz

GLONASS 1597.5~1605.8 MHz

Galileo 1575.42±2.046 MHz

BeiDou/Compass 1561.098±2.046 MHz

QZSS 1575.42 MHz

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5 Antenna Connection
5.1. Antenna Connectors

EC20 R2.1 Mini PCIe is mounted with three antenna connectors for external antenna connection: a main
antenna connector, an Rx-diversity antenna connector, and a GNSS antenna connector. And Rx-diversity
function is enabled by default. The impedance of the antenna connectors is 50Ω.

5.1.1. Operating Frequency

Table 19: Operating Frequencies

3GPP Band Transmit Receive Unit

EGSM900 880~915 925~960 MHz

DCS1800 1710~1785 1805~1880 MHz

EVDO/CDMA BC0 824~849 869~894 MHz

WCDMA B1 1920~1980 2110~2170 MHz

WCDMA B8 880~915 925~960 MHz

TD-SCDMA B34 2010~2025 2010~2025 MHz

TD-SCDMA B39 1880~1920 1880~1920 MHz

LTE-FDD B1 1920~1980 2110~2170 MHz

LTE-FDD B3 1710~1785 1805~1880 MHz

LTE-FDD B5 824~849 869~894 MHz

LTE-FDD B8 880~915 925~960 MHz

LTE-TDD B34 2010~2025 2010~2025 MHz

LTE-TDD B38 2570~2620 2570~2620 MHz

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LTE-TDD B39 1880~1920 1880~1920 MHz

LTE-TDD B40 2300~2400 2300~2400 MHz

LTE-TDD B41 2555~2655 2555~2655 MHz

5.2. Antenna Requirements

The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.

Table 20: Antenna Requirements

Type Requirements

Frequency range: 1559MHz~1609MHz

Polarization: RHCP or linear
VSWR: < 2 (Typ.)
GNSS Passive antenna gain: > 0dBi
Active antenna noise figure: < 1.5dB
Active antenna gain: > 0dBi
Active antenna embedded LNA gain: < 17dB
VSWR: ≤ 2
Efficiency: > 30%
Max input power: 50W
Input impedance: 50Ω
Cable insertion loss: < 1dB
GSM/EVDO/CDMA/UMTS/
(EGSM900, WCDMA B8, LTE-FDD B5/B8, EVDO/CDMA BC0)
TD-SCDMA/LTE
Cable insertion loss: < 1.5dB
(DCS1800, WCDMA B1, LTE-FDD B1/B3, LTE-TDD B34/B39,
TD-SCDMA B34/B39)
Cable insertion loss: < 2dB
( LTE-TDD B38/B40/B41)

NOTE

Since the GNSS port has a 2.85V voltage output, a passive antenna that causes shorting to GND, such
as PIFA antenna is not recommended.

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5.3. Recommended Mating Plugs for Antenna Connection

EC20 R2.1 Mini PCIe is mounted with RF connectors (receptacles) for convenient antenna connection.
The dimensions of the antenna connectors are shown as below.

Figure 15: Dimensions of the Receptacle RF Connectors (Unit: mm)

U.FL-LP mating plugs listed in the following figure can be used to match the receptacles.

Figure 16: Mechanicals of U.FL-LP Mating Plugs

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The following figure describes the space factor of mating plugs.

Figure 17: Space Factor of Mating Plugs (Unit: mm)

For more details of the recommended mating plugs, please visit http://www.hirose.com.

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6 Electrical, Reliability and Radio

Characteristics

6.1. General Description

This chapter mainly describes the following electrical and radio characteristics of EC20 R2.1 Mini PCIe:

 Power supply requirements

 I/O requirements
 RF characteristics
 ESD characteristics
 Thermal consideration
 Current consumption

6.2. Power Supply Requirements

The input voltage of EC20 R2.1 Mini PCIe is 3.0V~3.6V. The following table shows the power supply
requirements of EC20 R2.1 Mini PCIe.

Table 21: Power Supply Requirements

Parameter Description Min. Typ. Max. Unit

VCC_3V3 Power Supply 3.0 3.3 3.6 V

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6.3. I/O Requirements

The following table shows the I/O requirements of EC20 R2.1 Mini PCIe.

Table 22: I/O Requirements

Parameter Description Min. Max. Unit

VIH Input High Voltage 0.7 × VCC_3V3 VCC_3V3 + 0.3 V

VIL Input Low Voltage -0.3 0.3 × VCC_3V3 V

VOH Output High Voltage VCC_3V3 - 0.5 VCC_3V3 V

VOL Output Low Voltage 0 0.4 V

NOTES
S
1. The PCM and I2C interfaces belong to 1.8V power domain and other I/O interfaces belong to
VCC_3V3 power domain.
2. The maximum voltage value of VIL for PERST# signal and W_DISABLE# signal is 0.5V.

6.4. RF Characteristics

The following tables show the conducted RF output power and receiving sensitivity of EC20 R2.1 Mini
PCIe module.

Table 23: EC20 R2.1 Mini PCIe Conducted RF Output Power

Frequency Max. Min.

EGSM900 33dBm±2dB 5dBm±5dB

DCS1800 30dBm±2dB 0dBm±5dB

EGSM900 (8-PSK) 27dBm±3dB 5dBm±5dB

DCS1800 (8-PSK) 26dBm±3dB 0dBm±5dB

WCDMA B1/B8 24dBm+1/-3dB < -49dBm

TD-SCDMA B34/B39 24dBm+1/-3dB < -49dBm

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CDMA BC0 24dBm+2/-1dB < -49dBm

LTE-FDD B1/B3/B5/B8 23dBm±2dB < -39dBm

LTE-TDD B38/B39/B40/B41 23dBm±2dB < -39dBm

Table 24: EC20 R2.1 Mini PCIe Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP (SIMO)

EGSM900 -109dBm NA NA -102dBm

DCS1800 -109dBm NA NA -102dBm

CDMA BC0 -108dBm NA NA -104dBm

TD-SCDMA B34 -110dBm NA NA -108dBm

TD-SCDMA B39 -110dBm NA NA -108dBm

WCDMA B1 -110dBm -109.5dBm -112dBm -106.7dBm

WCDMA B8 -110dBm -109.5dBm -112dBm -103.7dBm

LTE-FDD B1 (10MHz) -99dBm -99.3dBm -101.6dBm -96.3dBm

LTE-FDD B3 (10MHz) -98dBm -98.9dBm -101.9dBm -93.3dBm

LTE-FDD B5 (10MHz) -98dBm -99.8dBm -102dBm -94.3dBm

LTE-FDD B8 (10MHz) -99dBm -99.6dBm -102.1dBm -93.3dBm

LTE-TDD B38 (10MHz) -99dBm -98.5dBm -101.3dBm -96.3dBm

LTE-TDD B39 (10MHz) -98dBm -99.5dBm -101.2dBm -96.3dBm

LTE-TDD B40 (10MHz) -99dBm -99.0dBm -101.4dBm -96.3dBm

LTE-TDD B41 (10MHz) -98dBm -98.1dBm -101.4dBm -94.3dBm

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6.5. ESD Characteristics

The following table shows the ESD characteristics of EC20 R2.1 Mini PCIe.

Table 25: ESD Characteristics of EC20 R2.1 Mini PCIe

Tested Interfaces Contact Discharge Air Discharge Unit

Power Supply and GND +/-5 +/-10 kV

Antenna Interfaces +/-4 +/-8 kV

USB Interface +/-4 +/-8 kV

(U)SIM Interface +/-4 +/-8 kV

Others +/-0.5 +/-1 kV

6.6. Thermal Consideration

In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:

 On customers’ PCB design, please keep placement of the PCI Express Mini Card away from heating
sources.
 Do not place components on the PCB area where the module is mounted, in order to facilitate adding
of heatsink.
 Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat
dissipation performance.
 The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
 Add a heatsink on the top of the module and the heatsink should be designed with as many fins as
possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity
should be used between the heatsink and module.
 Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to
PCB.

The following figure shows the referenced heatsink design.

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Thermal Pad Thermal Pad

EC20 R2.1 Mini PCIe
Heatsink
EC20 R2.1 Module Heatsink

Shielding Cover
Thermal Pad
PCI Express Mini Card Connector
Application Board
Application Board

Figure 18: Referenced Heatsink Design

NOTES

1. The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115°C. Therefore, the
thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105°C. Customers can execute AT+QTEMP command and get the
maximum BB chip temperature from the first returned value.
2. For more detailed guidelines on thermal design, please refer to document [4].

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6.7. Current Consumption

Table 26: Current Consumption of EC20 R2.1 Mini PCIe

Parameter Description Conditions Typ. Unit

AT+CFUN=0 (USB disconnected) 3.38 mA

EGSM @DRX=2 (USB disconnected) 4.84 mA

EGSM @DRX=5 (USB disconnected) 4.18 mA

EGSM @DRX=5 (USB suspend) 3.76 mA

EGSM @DRX=9 (USB disconnected) 3.98 mA

DCS @DRX=2 (USB disconnected) 4.64 mA

DCS @DRX=5 (USB disconnected) 3.80 mA

DCS @DRX=5 (USB suspend) 3.57 mA

DCS @DRX=9 (USB disconnected) 3.67 mA

TD-SCDMA Band A @PF=64

3.98 mA
(USB disconnected)
IVBAT Sleep state TD-SCDMA Band A @PF=128
3.78 mA
(USB disconnected)
TD-SCDMA Band A @PF=256
3.40 mA
(USB disconnected)
TD-SCDMA Band A @PF=512
3.29 mA
(USB disconnected)

BC0 @SCI=1 (USB disconnected) 6.45 mA

BC0 @SCI=1 (USB suspend) 6.11 mA

WCDMA @PF=64 (USB suspend) 4.05 mA

WCDMA @PF=128 (USB disconnected) 3.98 mA

WCDMA @PF=256 (USB disconnected) 3.87 mA

WCDMA @ PF=512 (USB disconnected) 3.69 mA

LTE-FDD @PF=32 (USB disconnected) 6.23 mA

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LTE-FDD @PF=64 (USB disconnected) 4.66 mA

LTE-FDD @PF=64 (USB suspend) 4.58 mA

LTE-FDD @PF=128 (USB disconnected) 4.02 mA

LTE-FDD @PF=256 (USB disconnected) 3.65 mA

LTE-TDD @PF=32 (USB disconnected) 6.36 mA

LTE-TDD @PF=64 (USB disconnected) 5.12 mA

LTE-TDD @PF=64 (USB suspend) 4.73 mA

LTE-TDD @PF=128 (USB disconnected) 4.20 mA

LTE-TDD @PF=256
3.85 mA
(USB disconnected)

EGSM DRX=5 (USB disconnected) 25.67 mA

EGSM DRX=5 (USB connected) 36.88 mA

BC0 @SCI=1 (USB disconnected) 27.14 mA

BC0 @SCI=1 (USB connected) 38.66 mA

TD-SCDMA Band A @PF=64

25.07 mA
(USB disconnected)
TD-SCDMA Band A @PF=64
37.92 mA
Idle state (USB connected)

WCDMA @PF=64 (USB disconnected) 26.20 mA

WCDMA @PF=64 (USB connected) 36.97 mA

LTE-FDD @PF=64 (USB disconnected) 25.64 mA

LTE-FDD @PF=64 (USB connected) 36.98 mA

LTE-TDD @ PF=64 (USB disconnected) 25.92 mA

LTE-TDD @PF=64 (USB connected) 37.61 mA

EGSM900 4DL/1UL @32.71dBm 344.0 mA

EGSM900 3DL/2UL @32.50dBm 583.5 mA

GPRS data transfer
(GNSS OFF)
EGSM900 2DL/3UL @30.83dBm 685.8 mA

EGSM900 1DL/4UL @29.68dBm 784.5 mA

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DCS1800 4DL/1UL @29.60dBm 223.4 mA

DCS1800 3DL/2UL @29.48dBm 355.1 mA

DCS1800 2DL/3UL @29.81dBm 489.8 mA

DCS1800 1DL/4UL @29.73dBm 649.5 mA

EGSM900 4DL/1UL @27.50dBm 212.5 mA

EGSM900 3DL/2UL @27.50dBm 356.8 mA

EGSM900 2DL/3UL @27.60dBm 490.9 mA

EGSM900 1DL/4UL @27.42dBm 622.7 mA

EDGE data transfer
(GNSS OFF)
DCS1800 4DL/1UL @26.20dBm 186.1 mA

DCS1800 3DL/2UL @26.10dBm 296.7 mA

DCS1800 2DL/3UL @27.67dBm 445.4 mA

DCS1800 1DL/4UL @27.55dBm 574.0 mA

BC0 @23.55dBm 764.1 mA

CDMA/TD-SCDMA
data transfer TD-SCDMA Band A @23.18dBm 161.3 mA
(GNSS OFF)
TD-SCDMA Band F @23.42dBm 164.8 mA

WCDMA B1 HSDPA @22.03dBm 710.4 mA

WCDMA WCDMA B1 HSUPA @22.02dBm 747.8 mA

data transfer
(GNSS OFF) WCDMA B8 HSDPA @21.68dBm 607.7 mA

WCDMA B8 HSUPA @21.75dBm 661.5 mA

LTE-FDD B1 @23.08dBm 1014 mA

LTE-FDD B3 @22.6dBm 926.6 mA

LTE-FDD B5 @22.67dBm 848.0 mA

LTE data transfer
(GNSS OFF)
LTE-FDD B8 @22.81dBm 784.2 mA

LTE-TDD B34 @23.8dBm 457.1 mA

LTE-TDD B38 @23.28dBm 622.4 mA

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LTE-TDD B39 @23.8dBm 457.1 mA

LTE-TDD B40 @23.1dBm 470.5 mA

LTE-TDD B41 @23.47dBm 534.6 mA

EGSM900 PCL=5 @32.47dBm 326.2 mA

EGSM900 PCL=12 @19.40dBm 141.1 mA

EGSM900 PCL=19 @5.58dBm 103.8 mA

GSM
voice call
DCS1800 PCL=0 @29.49dBm 212.2 mA

DCS1800 PCL=7 @16.47dBm 155.7 mA

DCS1800 PCL=15 @0.24dBm 129.4 mA

BC0 @23.87dBm 822.5 mA

CDMA
voice call
BC0 @-60.67dBm 146.1 mA

WCDMA B1 @23.05dBm 865.8 mA

WCDMA
voice call
WCDMA B8 @23.1dBm 718.5 mA

Table 27: GNSS Current Consumption of EC20 R2.1 Mini PCIe

Parameter Description Conditions Typ. Unit

Searching Cold start @Passive Antenna 63.3 mA

(AT+CFUN=0) Lost state @Passive Antenna 64.1 mA
IVBAT
Instrument Environment 36.3 mA
(GNSS)
Tracking
Open Sky @Passive Antenna 36.9 mA
(AT+CFUN=0)
Open Sky @Active Antenna 41.5 mA

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7 Dimensions and Packaging

7.1. General Description

This chapter mainly describes mechanical dimensions as well as packaging specification of EC20 R2.1
Mini PCIe module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are
±0.05mm unless otherwise specified.

7.2. Mechanical Dimensions of EC20 R2.1 Mini PCIe

30.00±0.15
24.20±0.20
8.25±0.10
3x3.00±0.10 5.98±0.10
5.45±0.10
6.38±0.10 2xΦ2.60±0.1
0.61±0.05
6.35±0.10 2.35±0.10

34.30±0.20 50.95±0.15
48.05±0.20
1.40±0.10

4.90±0.20
9.90±0.10

10.35±0.10 7.26±0.10
4.00±0.10
1.00±0.10
Pin1 Pin51
Top View Side View

Figure 19: Mechanical Dimensions of EC20 R2.1 Mini PCIe

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7.3. Standard Dimensions of Mini PCI Express

The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1]
for Detail A and Detail B.

Figure 20: Standard Dimensions of Mini PCI Express

EC20 R2.1 Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives
and standards listed in document [1]. The following figure takes the Molex 679100002 as an example.

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Figure 21: Dimensions of the Mini PCI Express Connector (Molex 679100002)

7.4. Packaging Specifications

EC20 R2.1 Mini PCIe modules are packaged in a tray. Each tray contains 10 modules. The smallest
package of EC20 R2.1 Mini PCIe contains 100 modules.

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8Appendix A References
Table 28: Related Documents

SN Document Name Remark

PCI Express Mini Card Electromechanical PCI Express Mini Card Electromechanical
[1]
Specification Revision 1.2 Specification

[2] Quectel_EC20_R2.1_AT_Commands_Manual EC20 R2.1 AT commands manual

Quectel_LTE_Standard_GNSS_AT_ GNSS AT commands manual for LTE

[3]
Commands_Manual Standard modules
Thermal design guide for LTE standard,
[4] Quectel_LTE_Module_Thermal_Design_Guide
LTE-A and Automotive modules

Table 29: Terms and Abbreviations

Abbreviation Description

AMR Adaptive Multi-rate

bps Bits Per Second

CS Coding Scheme

CTS Clear to Send

DC-HSPA+ Dual-carrier High Speed Packet Access

DFOTA Delta Firmware Upgrade Over The Air

DL Down Link

DTE Data Terminal Equipment

DTR Data Terminal Ready

EFR Enhanced Full Rate

EMI Electro Magnetic Interference

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ESD Electrostatic Discharge

ESR Equivalent Series Resistance

FDD Frequency Division Duplexing

FR Full Rate

GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global

GLONASS
Navigation Satellite System

GMSK Gaussian Minimum Shift Keying

GNSS Global Navigation Satellite System

GPS Global Positioning System

GSM Global System for Mobile Communications

HR Half Rate

kbps Kilo Bits Per Second

LED Light Emitting Diode

LTE Long-Term Evolution

Mbps Million Bits Per Second

MCU Micro Control Unit

ME Mobile Equipment

MIMO Multiple-Input Multiple-Output

MMS Multimedia Messaging Service

MO Mobile Originated

MT Mobile Terminated

NMEA National Marine Electronics Association

PCM Pulse Code Modulation

PDA Personal Digital Assistant

PDU Protocol Data Unit

POS Point of Sale

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PPP Point-to-Point Protocol

RF Radio Frequency

RTS Ready To Send

Rx Receive Direction

SIMO Single Input Multiple Output

SMS Short Message Service

TX Transmitting Direction

TVS Transient Voltage Suppressor

UART Universal Asynchronous Receiver & Transmitter

UL Up Link

URC Unsolicited Result Code

USB Universal Serial Bus

(U)SIM (Universal) Subscriber Identification Module

WCDMA Wideband Code Division Multiple Access

WLAN Wireless Local Area Networks

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