High Luminous Efficacy

RGBW LED Emitter

LZ4-00MD00
Key Features
 High Luminous Efficacy 10W RGBW LED
 Individually addressable Red, Green, Blue and Daylight White die
 Electrically neutral thermal path
 Ultra-small foot print – 7.0mm x 7.0mm
 Surface mount ceramic package with integrated glass lens
 Very low Thermal Resistance (1.1°C/W)
 Very high Luminous Flux density
 JEDEC Level 1 for Moisture Sensitivity Level
 Autoclave compliant (JEDEC JESD22-A102-C)
 Lead (Pb) free and RoHS compliant
 Reflow solderable (up to 6 cycles)
 Emitter available on Standard MCPCB (optional)

Typical Applications
 Architectural Lighting
 Retail Spot and Display Lighting
 Stage and Studio Lighting
 Hospitality Lighting
 Museum Lighting
 Video Walls and Full Color Displays

Description
The LZ4-00MD00 RGBW LED emitter contains one red, green, blue and daylight white LED die which provides 10W
power in an extremely small package. With a 7.0mm x 7.0mm ultra-small footprint, this package provides
exceptional luminous flux density. LED Engin’s RGBW LED offers ultimate design flexibility with individually
addressable die. The LZ4-00MD00 is capable of producing a continuous spectrum of white light plus millions of
colors. The patented design has unparalleled thermal and optical performance. The high quality materials used in
the package are chosen to optimize light output and minimize stresses which results in monumental reliability and
lumen maintenance. The robust product design thrives in outdoor applications with high ambient temperatures
and high humidity.

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 Part number options

Base part number

Part number Description
LZ4-00MD00-xxxx LZ4 emitter
LZ4-20MD00-xxxx LZ4 emitter on Standard Star 4 channel MCPCB

Bin kit option codes

MD, Red-Green-Blue-White (5000K – 6500K)
Min
Kit number
flux Color Bin Ranges Description
suffix
Bin
Red, full distribution flux; full distribution
0000 09R R2 – R2
wavelength
Green, full distribution flux; full
12G G2 – G3
distribution wavelength
Blue, full distribution flux; full
01B B01 – B02
distribution wavelength

01W 0bd, 0uy, 1bd, 1uy, 2vx, 2bd White full distribution flux and CCT

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 Daylight White Chromaticity Groups

0.38

0.36 2VX

0.34 2BD
CIEy

Planckian Locus

1BD
0.32

0BD 1UY
0.30
0UY

0.28
0.28 0.30 0.32 0.34
CIEx

Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2°) x-y Chromaticity Diagram.
Coordinates are listed below in Table 5.

Cool White Bin Coordinates

Bin Code CIEx CIEy Bin Code CIEx CIEy Bin Code CIEx CIEy
0.295 0.297 0.3068 0.3113 0.3207 0.3462
0.2895 0.3135 0.3028 0.3304 0.3196 0.3602
0BD 0.3028 0.3304 1BD 0.3205 0.3481 2VX 0.3381 0.3762
0.3068 0.3113 0.3221 0.3261 0.3376 0.3616
0.295 0.297 0.3068 0.3113 0.3207 0.3462
0.298 0.288 0.3093 0.2993 0.3222 0.3243
0.295 0.297 0.3068 0.3113 0.3207 0.3462
0UY 0.3068 0.3113 1UY 0.3221 0.3261 2BD 0.3376 0.3616
0.3093 0.2993 0.3231 0.312 0.3366 0.3369
0.298 0.288 0.3093 0.2993 0.3222 0.3243

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 Luminous Flux Bins
Table 1:

Minimum Maximum
Luminous Flux (ΦV) Luminous Flux (ΦV)
Bin Code @ IF = 700mA [1,2] @ IF = 700mA [1,2]
(lm) (lm)
Red Green Blue White Red Green Blue White
09R 90 140
12G 125 195
01B 17 27
02B 27 43
01W 155 225
Notes for Table 1:
1. Luminous flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ±10% on flux measurements.
2. Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.

Dominant Wavelength Bins

Table 2:

Minimum Maximum
Dominant Wavelength (λD) Dominant Wavelength (λD)
Bin Code @ IF = 700mA [1] @ IF = 700mA [1]
(nm) (nm)
Red Green Blue Red Green Blue
R2 618 630
G2 520 525
G3 525 530
B01 452 457
B02 457 462
Notes for Table 2:
1. LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements.

Forward Voltage Bin

Table 3:

Minimum Maximum
Forward Voltage (VF) Forward Voltage (VF)
Bin Code @ IF = 700mA [1] @ IF = 700mA [1]
(V) (V)
Red Green Blue White Red Green Blue White
0 2.10 3.20 3.20 3.20 3.20 4.20 4.00 4.00
Notes for Table 3:
1. LED Engin maintains a tolerance of ± 0.04V on forward voltage measurements.

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 Absolute Maximum Ratings
Table 4:

Parameter Symbol Value Unit

DC Forward Current Ti = 150C IF 1000 mA
DC Forward Current [1] Ti = 130C IF 1200 mA
Peak Pulsed Forward Current [2] IFP 1500 mA
Reverse Voltage VR See Note 3 V
Storage Temperature Tstd -40 ~ +150 °C
Junction Temperature TJ 150 °C
Soldering Temperature [4] Tsol 260 °C
Allowable Reflow Cycles 6
121°C at 2 ATM,
Autoclave Conditions [5]
100% RH for 168 hours
> 8,000 V HBM
ESD Sensitivity [6]
Class 3B JESD22-A114-D
Notes for Table 4:
1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 12 for current derating. Max current for continues operation is 1.0A
2: Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3. LEDs are not designed to be reversing biased.
4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 4.
5. Autoclave Conditions per JEDEC JESD22-A102-C.
6. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the emitter in an electrostatic protected area (EPA). An
EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.

Optical Characteristics @TC = 25°C

Table 5:

Typical
Parameter Symbol Unit
Red Green Blue [1] White
Luminous Flux (@ IF = 700mA) ΦV 115 155 30 170 lm
Luminous Flux (@ IF = 1000mA) ΦV 160 200 40 222 lm
Dominant Wavelength 623 523 460
Correlated Color Temperature CCT 6500 K
Color Rendering Index (CRI) Ra 75
Viewing Angle [2] 2Θ½ 95
Total Included Angle [3] Θ0.9 115 Degrees
Notes for Table 5:
1. When operating the Blue LED, observe IEC 60825-1 class 2 rating. Do not stare into the beam.
2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
3. Total Included Angle is the total angle that includes 90% of the total luminous flux.

Electrical Characteristics @TC = 25°C

Table 6:

Typical
Parameter Symbol Unit
Red Green Blue White
Forward Voltage (@ IF = 700mA) VF 2.2 3.35 3.2 3.2 V
Temperature Coefficient
ΔVF/ΔTJ -1.9 -2.9 -3.0 -3.0 mV/°C
of Forward Voltage
Thermal Resistance
RΘJ-C 1.1 °C/W
(Junction to Case)

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification:

Soak Requirements
Floor Life Standard Accelerated
Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions
≤ 30°C/ 168 85°C/
1 Unlimited n/a n/a
85% RH +5/-0 85% RH
Notes for Table 7:
1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and
includes the maximum time allowed out of the bag at the distributor’s facility.

Average Lumen Maintenance Projections

Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.

Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen
Maintenance at 65,000 hours of operation at a forward current of 700 mA. This projection is based on constant
current operation with junction temperature maintained at or below 125°C.

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 Mechanical Dimensions (mm)
Pin Out
Pad Die Color Function
1 A White Anode
2 A White Cathode
3 B Red Anode
4 B Red Cathode
5 C Green Anode
6 C Green Cathode
7 D Blue Anode
8 D Blue Cathode
9 [2] n/a n/a Thermal

1 2 3

8
4

7 6 5

Figure 1: Package Outline Drawing.

Notes for Figure 1:
1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Thermal contact, Pad 9, is electrically neutral.

Recommended Solder Pad Layout (mm)

Non-pedestal MCPCB Design Pedestal MCPCB Design

Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad for
non-pedestal and pedestal design

Note for Figure 2a:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.
2. Pedestal MCPCB allows the emitter thermal slug to be soldered directly to the metal core of the MCPCB. Such MCPCB eliminate t he high thermal resistance
dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system
thermal resistance.
3. LED Engin recommends x-ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less
than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure
rates due to thermal over stress.

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 Recommended Solder Mask Layout (mm)
Non-pedestal MCPCB Design Pedestal MCPCB Design

Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad for non-pedestal and pedestal design

Note for Figure 2b:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

Recommended 8 mil Stencil Apertures Layout (mm)

Non-pedestal MCPCB Design Pedestal MCPCB Design

Figure 2c: Recommended 8mil stencil apertures for anode, cathode, and
thermal pad for non-pedestal and pedestal design

Note for Figure 2c:

1. Unless otherwise noted, the tolerance = ± 0.20 mm.

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 Reflow Soldering Profile

Figure 3: Reflow soldering profile for lead free soldering.

Typical Radiation Pattern

100
90
80
Relative Intensity (%)

70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)

Figure 4: Typical representative spatial radiation pattern.

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 Typical Relative Spectral Power Distribution
1
0.9
0.8
Relative Spectral Power

0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400 450 500 550 600 650 700 750 800
Wavelength (nm)
Figure 5: Typical relative spectral power vs. wavelength @ TC = 25°C.

Typical Dominant Wavelength Shift

4
Relative Dominant Wavlength (nm)

3 Red
Green
Blue
2

-1

-2
300 400 500 600 700 800 900 1000 1100
IF - Forward Current (mA)
Figure 6: Typical dominant wavelength shift vs. forward current @ T C = 25°C.

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 Dominant Wavelength Shift over Temperature

Dominant Wavelength Shift (nm) 3.5

2.5

1.5 Red
Green
1 Blue

0.5

0
0 20 40 60 80 100 120
Case Temperature (ºC)
Figure 7: Typical dominant wavelength shift vs. case temperature.

Typical Relative Light Output

200
180
160
Relative Light Output (%)

140
120
100
80
60 Red
Green
40 Blue
White
20
0
0 200 400 600 800 1000 1200 1400 1600
IF - Forward Current (mA)

Figure 8: Typical relative light output vs. forward current @ TC = 25°C.

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 Typical Relative Light Output over Temperature
120

Relative Light Output (%) 100

80

60

40
Red
Green
20 Blue
White

0
0 20 40 60 80 100 120
Case Temperature (ºC)
Figure 9: Typical relative light output vs. case temperature.

Typical Forward Current Characteristics

1200

1000
IF - Forward Current (mA)

800

600

400

Red
200 Green
Blue/White

0
1.5 2 2.5 3 3.5 4 4.5 5
VF - Forward Voltage (V)

Figure 10: Typical forward current vs. forward voltage @ TC = 25°C.

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 Current De-rating
1600

IF - Maximum Current (mA) 1400

1200

1000

800
700
(Rated)
600

400
RΘJ-A = 4.0°C/W
200 RΘJ-A = 4.5°C/W
RΘJ-A = 5.0°C/W
0
0 25 50 75 100 125 150
Maximum Ambient Temperature (°C)
Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 150°C.
Notes for Figure 11:
1. Maximum current assumes that all four LED dice are operating concurrently at the same current.
2. RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00MD00 is typically 1.1°C/W.
3. RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].

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 Emitter Tape and Reel Specifications (mm)

Figure 12: Emitter carrier tape specifications (mm).

Figure 13: Emitter reel specifications (mm).

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 LZ4 MCPCB Family
Emitter + MCPCB
Diameter Typical Vf Typical If
Part number Type of MCPCB Thermal Resistance
(mm) (V) (mA)
(oC/W)
LZ4-2xxxxx 4-channel 19.9 1.1 + 1.1 = 2.2 2.2 – 3.4 700

Mechanical Mounting of MCPCB

 MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
 To avoid MCPCB bending:
o Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
o Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o It is recommended to always use plastics washers in combinations with the three screws.
o If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.

Thermal interface material

 To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
 There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
 It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.

Wire soldering
 To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
 It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin
 LZ4-2xxxxx
4 channel, Standard Star MCPCB (4x1) Dimensions (mm)

Notes:
 Unless otherwise noted, the tolerance = ± 0.2 mm.
 Slots in MCPCB are for M3 or #4-40 mounting screws.
 LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
 LED Engin recommends using thermal interface material when attaching the MCPCB to a heatsink.
 The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W

Components used
MCPCB: HT04503 (Bergquist)
ESD chips: BZT52C5-C10 (NPX, for 1 LED die)

Pad layout
MCPCB
Ch. String/die Function
Pad
1 Anode +
1 1/A
8 Cathode -
7 Anode +
2 2/B
6 Cathode -
5 Anode +
3 3/C
4 Cathode -
3 Anode +
4 4/D
2 Cathode -

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 About LED Engin
LED Engin, an OSRAM business based in California’s Silicon Valley, develops, manufactures, and sells advanced LED
emitters, optics and light engines to create uncompromised lighting experiences for a wide range of
TM
entertainment, architectural, general lighting and specialty applications. LuxiGen multi-die emitter and
secondary lens combinations reliably deliver industry-leading flux density, upwards of 5000 quality lumens to a
target, in a wide spectrum of colors including whites, tunable whites, multi-color and UV LEDs in a unique patented
TM
compact ceramic package. Our LuxiTune series of tunable white lighting modules leverage our LuxiGen emitters
and lenses to deliver quality, control, freedom and high density tunable white light solutions for a broad range of
new recessed and downlighting applications. The small size, yet remarkably powerful beam output and superior in-
source color mixing, allows for a previously unobtainable freedom of design wherever high-flux density, directional
light is required. LED Engin is committed to providing products that conserve natural resources and reduce
greenhouse emissions; and reserves the right to make changes to improve performance without notice.

For more information, please contact LEDE-Sales@osram.com or +1 408 922-7200.

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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | em LEDE-Sales@osram.com | www.osram.us/ledengin