Features of AX300

1. Wave Type
• CELLULAR : G7W
• PCS : G7W

2. Frequency Scope

Transmit Frequency (MHz) Receive Frequency (MHz)

CELLULAR PCS CELLULAR PCS GPS
824.82 ~ 848.19 1850~1910 869.82~893.19 1930~1990 1575.42

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3. Rated Output Power : CELLULAR = 0.251W
PCS = 0.240W

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4. Output Conversion Method : This is possible by correcting the key board channel.
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5. Voltage and Current Value of Termination Part Amplifier (Catalogue included)
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MODE Part Name Voltage Current Power
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CELLULAR AWT6321R 4.2V 600mA 0.251W

PCS AWT6321R 4.2V 600mA 0.240W
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6. Functions of Major Semi-Conductors

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Classification Function

QSC6055 Terminal operation control and digital signal processing

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Converts RF signal to baseband signal

Converts baseband signal to RF signal
MCP (K5E1H12ACM-D075) NAND (1Gbit) + DDR (512Mbit)
Storing of terminal operation program

7. Frequency Stability
• CELLULAR : ±0.5PPM
• PCS : ±0.1PPM

LG Electronics Inc.
AX300

CDMA Mobile Subscriber Unit

A X 300

SERVICE MANUAL

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TRIPLE BAND, TRIPLE MODE
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[PCS/GPS/CELLULAR]
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CDMA MOBILE PHONE
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Table of Contents
General Introduction ............................................................................................................ 6

Chapter 1. System Introduction ........................................................................................... 7

1. System Introduction .........................................................................................................7

1.1 CDMA Abstract ....................................................................................................................... 7
2. Features and Advantages of CDMA Mobile Phone ......................................................... 9
2.1 Various Types of Diversities ................................................................................................... 9
2.2 Power Control ......................................................................................................................... 9
2.3 Voice Encoder and Variable Data Speed ............................................................................. 10
2.4 Protecting Call Confidentiality ............................................................................................... 10
2.5 Soft Handoff .......................................................................................................................... 10

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2.6 Frequency Re-Use and Sector Segmentation ...................................................................... 11
2.7 Soft Capacity ......................................................................................................................... 11

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3. Structure and Functions of tri-band CDMA Mobile Phone............................................. 12
4. Specification .................................................................................................................. 13
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4.1 General Specification ............................................................................................................ 13
4.1.1 Transmit/Receive Frequency Interval ..........................................................................................13
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4.1.2 Number of Channels (Channel Bandwidth) .................................................................................13
4.1.3 Operating Voltage ........................................................................................................................13
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4.1.4 Battery Power Consumption ........................................................................................................13

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4.1.5 Operating Temperature ................................................................................................................13

4.1.6 Frequency Stability ......................................................................................................................13
4.1.7 Antenna ........................................................................................................................................13
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4.1.8 Size and Weight ...........................................................................................................................13

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4.1.9 Channel Spacing ..........................................................................................................................13

4.1.10 Battery Type, Capacity and Orerating Time ..............................................................................14
4.2 Receive Specification............................................................................................................ 14
4.2.1 Frequency Range..........................................................................................................................14
4.2.2 Local Oscillating Frequency Range .............................................................................................14
4.2.3 Sensitivity.....................................................................................................................................14
4.2.4 Selectivity.....................................................................................................................................14
4.2.5 Interference Rejection ..................................................................................................................14
4.2.6 Spurious Wave Suppression.........................................................................................................14
4.2.7 CDMA Input Signal Range..........................................................................................................15
4.3 Transmit Specification........................................................................................................... 15
4.3.1 Frequency Range..........................................................................................................................15
4.3.2 Local Oscillating Frequency Range .............................................................................................15

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4.3.3 Intermediate Frequency................................................................................................................15

4.3.4 Output Power ...............................................................................................................................15
4.3.5 CDMA TX Frequency Deviation.................................................................................................15
4.3.6 CDMA TX Conducted Spurious Emissions.................................................................................15
4.3.7 CDMA Minimum TX Power Control ..........................................................................................15
4.4 MS (Mobile Station) Transmitter Frequency ......................................................................... 16
4.4.1 CELLULAR mode .......................................................................................................................16
4.4.2 PCS mode.....................................................................................................................................16
4.5 MS (Mobile Station) Receiver Frequency ............................................................................. 17
4.5.1 CELLULAR mode .......................................................................................................................17
4.5.2 PCS mode.....................................................................................................................................17
4.5.3 GPS mode : 1575.42MHz ............................................................................................................17
4.6 AC Adaptor............................................................................................................................ 18
4.7 Cigar Lighter Charger............................................................................................................ 18

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4.8 Hands-Free Kit ...................................................................................................................... 18
5. Installation ..................................................................................................................... 18

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5.1 Installing a Battery Pack........................................................................................................ 18
5.2 For Adapter Use.................................................................................................................... 18
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5.3 For Mobile Mount .................................................................................................................. 18
5.3.1 Installation Position......................................................................................................................18
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5.3.2 Cradle Installation ........................................................................................................................18
5.3.3 Interface Box................................................................................................................................19
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5.3.4. Microphone Installation ..............................................................................................................19

5.3.5 Cable Connections .......................................................................................................................19
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Chapter 2. NAM Input Method ........................................................................................... 20

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NAM Programming Method and Telephone Number Input Method .................................. 20

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PREPARATION........................................................................................................................... 20
PROGRAMMING STEPS ........................................................................................................... 20

Chapter 3. Circuit Description............................................................................................ 22

1. RF Transmit/Receive Part ............................................................................................. 22

1.1 Overview ............................................................................................................................... 22
1.2 Description of Rx Part Circuit................................................................................................ 22
1.2.1 Quintplexer (DP100)....................................................................................................................22
1.2.2 LNAs (U200) ...............................................................................................................................25
1.2.3 GPS LNA (U101) ........................................................................................................................26
1.2.4 Down-converter Mixers ...............................................................................................................27
1.2.5 Rx RF SAW Filters (F100/F104).................................................................................................27

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1.2.6 RF Receiver(U200) ......................................................................................................................27

1.3 Description of Transmit Part Circuit ...................................................................................... 28
1.3.1 RF Transmitter (U200).................................................................................................................28
1.3.2 Dual Power Amplifier (U105) .....................................................................................................30
1.4 Description of Frequency Synthesizer Circuit....................................................................... 31
1.4.1 Voltage Control Temperature Compensation Crystal Oscillator .................................................31
2. Digital/Voice Processing Part ........................................................................................ 31
2.1 Overview ............................................................................................................................... 31
2.2 Configuration ......................................................................................................................... 31
2.2.1 Keypad/LED and Receptacle Part................................................................................................31
2.2.2 Voice Processing Part ..................................................................................................................31
2.2.3 QSC6055 Part ..............................................................................................................................31
2.2.4 Memory Part ................................................................................................................................31
2.2.5 Power Supply Part........................................................................................................................32

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2.3 Circuit Description ................................................................................................................. 32
2.3.1 Keypad/LCD and Receptacle Part................................................................................................32

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2.3.2 Audio Processing Part..................................................................................................................32
2.3.3 MODEM Part...............................................................................................................................32
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2.3.4 Memory Part ................................................................................................................................33
2.3.5 Power Supply Part........................................................................................................................33
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2.3.6 Logic Part.....................................................................................................................................33
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Chapter 4. Trouble Shooting.............................................................................................. 35

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1. Rx Part Trouble.............................................................................................................. 35
1.1 DCN & PCS Rx Trouble ........................................................................................................ 35
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1.1.1 Checking DC Power Supply Circuit ............................................................................................36

1.1.2 Checking Rx Signal Path .............................................................................................................37
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1.1.3 Checking VCTCXO Circuit.........................................................................................................40

2. Tx Part Trouble .............................................................................................................. 42
2.1 DCN & PCS Tx Trouble ........................................................................................................ 42
2.1.2 Checking VCTCXO Circuit.........................................................................................................44
2.1.3 Checking Tx SAW Filter IN/OUT...............................................................................................46
2.1.4 Checking Tx Dual PAM ..............................................................................................................47
2.1.5 Checking Quintplexer and Mobile Switch ...................................................................................49
3. Power............................................................................................................................. 50
3.1 Power On Trouble ................................................................................................................. 50
3.2 Charging Trouble .................................................................................................................. 52
4. Logic Part Trouble ......................................................................................................... 54
4.1 LCD Trouble .......................................................................................................................... 54
4.2. Camera Trouble ................................................................................................................... 57

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4.3 Audio Trouble ........................................................................................................................ 60

4.3.1 Speaker Trouble ...........................................................................................................................60
4.3.2 Receiver Trouble..........................................................................................................................62
4.3.3 MIC Trouble ................................................................................................................................64
4.3.4 Ear-Jack Trouble ..........................................................................................................................66
4.4 Vibrator Trouble .................................................................................................................... 68
4.5 USB Trouble.......................................................................................................................... 70

Chapter 5. Drawing & Part Lists ........................................................................................ 72

1. Block Diagram ...............................................................................................................72

2. Circuit Drawing .............................................................................................................. 73
2.1 Main PCB .............................................................................................................................. 73
2.2 F-PCB.................................................................................................................................... 78

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3. PCB Layout.................................................................................................................... 79
3.1 Main PCB .............................................................................................................................. 79

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3.1.1 Top Side .......................................................................................................................................79
3.1.2 Bottom Side..................................................................................................................................80
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3.2 F-PCB.................................................................................................................................... 81
4. Part Lists........................................................................................................................ 82
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4.1 Main PCB Top ....................................................................................................................... 82
4.2 Main PCB Bottom.................................................................................................................. 82
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4.3 Full BOM List......................................................................................................................... 88

5. Assembly Diagram....................................................................................................... 100
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Chapter 6. Safety............................................................................................................. 102

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Chapter 7. Glossary......................................................................................................... 105

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General Introduction
General Introduction
The AX300 phone has been designed to operate on the latest digital mobile communication technology, Code
Division Multiple Access (CDMA). This CDMA digital technology has greatly enhanced voice clarity and can
provide a variety of advanced features. Currently, CDMA mobile communication technology has been
commercially used in Cellular and Personal Communication Service (PCS). The difference between them is the
operating frequency spectrum. Cellular uses 800MHz and PCS uses 1.9GHz. The LG300 support GPS Mode,
we usually call it tri-band phone. We call it tri-mode phone. If one of the Cellular and PCS base stations is
located nearby, Call fail rate of triple-mode phone is less than dual-mode phone or single-mode phone.
The CDMA technology adopts DSSS (Direct Sequence Spread Spectrum). This feature of DSSS enables the
phone to keep communication from being crossed and to use one frequency channel by multiple users in the

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same specific area, resulting that it increases the capacity 10 times more compared with that in the analog mode
currently used. Soft/Softer Handoff, Hard Handoff, and Dynamic RF power Control technologies are combined
into this phone to reduce the call being interrupted in a middle of talking over the phone.

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Cellular and PCS CDMA network consists of MSO (Mobile Switching Office), BSC (Base Station Controller),
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BTS (Base station Transmission System), and MS (Mobile Station). The following table lists some major
CDMA Standards.
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CDMA Standard Designator Description
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Basic air interface TIA/EIA/IS-95-A/B/C Protocol between MS and BTS for Cellular & AMPS
ANSI J-STD-008 Protocol between MS and BTS for PCS
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Network TIA/EIA/IS-634 MAS-BS

TIA/EIA/IS/651 PCSC-RS
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TIA/EIA/IS-41-C Intersystem operations

TIA/EIA/IS-124 Nom-signaling data comm.
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Service TIA/EIA/IS-96-B Speech CODEC

TIA/EIA/IS-99 Assign data and fax
TIA/EIA/IS-637 Short message service
TIA/EIA/IS-657 Packet data
Performance TIA/EIA/IS-97 Cellular base station
TIA/EIA/IS-98 Cellular mobile station
ANSI J-STD-018 PCS personal station
ANSI J-STD-019 PCS base station
TIA/EIA/IS-125 Speech CODEC
* TSB –74: Protocol between an IS-95A system and ANSI J-STD-008

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Chapter 1. System Introduction

Chapter 1. System Introduction

1. System Introduction
1.1 CDMA Abstract
The CDMA mobile communication system has a channel hand-off function that is used for collecting the
information on the locations and movements of mobile telephones from the cell site by automatically controlling
several cell site through the setup of data transmission routes, and then enabling one switching system to carry
out the automatic remote adjustment. This is to maintain continuously the call state through the automatic
location confirmation and automatic radio channel conversion when the busy subscriber moves from the service
area of one cell site to that of another by using automatic location confirmation and automatic radio channel

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conversion functions. The call state can be maintained continuously by the information exchange between
switching systems when the busy subscriber moves from one cellular system area to the other cellular system

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area. .C
In the cellular system, the cell site is a small-sized low output type and utilizes a frequency allocation system
that considers mutual interference, in an effort to enable the re-use of corresponding frequency from a cell site
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separated more than a certain distance. The analog cellular systems are classified further into an AMPS system,
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E-AMPS System, NMT system, ETACS system, and JTACS system depending on technologies used.
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Unlike the time division multiple access (TDMA) or frequency division multiple access (FDMA) used in the
band limited environment, the Code Division Multiple Access (CDMA) system which is one of digital cellular
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systems is a multi-access technology under the interference limited environment. It can process more number of
subscribers compared to other systems (TDMA system has the processing capacity three times greater than the
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existing FDMA system whereas CDMA system, about 12~15 times of that of the existing system).

CDMA system can be explained as follows; TDMA or CDMA can be used to enable each person to talk
alternately or provide a separate room for each person when two persons desire to talk with each other at the
same time, whereas FDMA can be used to enable one person to talk in soprano, whereas the other in bass (one
of the two talkers can carry out synchronization for hearing in case there is a bandpass filter function in the area
of the hearer). Another available method is to make two persons to sing in different languages at the same time,
space, and frequency when wishing to let the audience hear the singing without being confused. This is the
characteristic of CDMA.

On the other hand, when employing the CDMA technology, each signal has a different pseudo-random binary
sequence used to spread the spectrum of carrier. A great number of CDMA signals share the same frequency
spectrum. In the perspective of frequency area or time area, several CDMA signals are overlapped. Among these

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types of signals, only desired signal energy is selected and received through the use of pre-determined binary
sequence; desired signals can be separated, and then received with the correlator used for recovering the
spectrum into its original state. At this time, the spectrums of other signals that have different codes are not
recovered into its original state, and appears as the self-interference of the system.

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2. Features and Advantages of CDMA Mobile Phone

2.1 Various Types of Diversities
When employing the narrow band modulation (30kHz band) that is the same as the analog FM modulation
system used in the existing cellular system, the multi-paths of radio waves create a serious fading. However, in
the CDMA broadband modulation (1.25MHz band), three types of diversities (time, frequency, and space) are
used to reduce serious fading problems generated from radio channels in order to obtain high-quality calls.
Time diversity can be obtained through the use of code interleaving and error correction code whereas frequency
diversity can be obtained by spreading signal energy to wider frequency band. The fading related to normal
frequency can affect the normal 200~300kHz among signal bands and accordingly, serious effect can be avoided.
Moreover, space diversity (also called path diversity) can be realized with the following three types of methods.
First, it can be obtained by the duplication of cell site receive antenna. Second, it can be obtained through the

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use of multi-signal processing device that receives a transmit signal having each different transmission delay
time and then, combines them. Third, it can be obtained through the multiple cell site connection (Soft Handoff)

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that connects the mobile station with more than two cell sites at the same time.

2.2 Power Control

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The CDMA system utilizes the forward (from a base station to mobile stations) and backward (from the mobile
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station to the base station) power control in order to increase the call processing capacity and obtain high-quality
calls. In case the originating signals of mobile stations are received by the cell site in the minimum call quality
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level (signal to interference) through the use of transmit power control on all the mobile stations, the system
capacity can be maximized.If the signal power of mobile station is received too strong, the performance of that
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mobile station is improved. However, because of this, the interference on other mobile stations using the same
channel is increased and accordingly, the call quality of other subscribers is reduced unless the maximum
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accommodation capacity is reduced.

In the CDMA system, forward power control, backward open loop power control, and closed loop power control
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methods are used. The forward power control is carried out in the cell site to reduce the transmit power on
mobile stations less affected by the multi-path fading and shadow phenomenon and the interference of other cell
sites when the mobile station is not engaged in the call or is relatively nearer to the corresponding cell site. This
is also used to provide additional power to mobile stations having high call error rates, located in bad reception
areas or far away from the cell site.
The backward open loop power control is carried out in a corresponding mobile station; the mobile station
measures power received from the cell site and then, reversely increases/decreases transmit power in order to
compensate channel changes caused by the forward link path loss and terrain characteristics in relation to the
mobile station in the cell site. By doing so, all the mobile transmit signals received by the base station have same
strength.
Moreover, the backward closed loop power control used by the mobile station is performed to control power
using the commands issued out by the cell site. The cell site receives the signal of each corresponding mobile

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station and compares this with the pre-set threshold value and then, issues out power increase/decrease
commands to the corresponding mobile station every 1.25msec (800 times per second). By doing so, the gain
tolerance and the different radio propagation loss on the forward/backward link are complemented.

2.3 Voice Encoder and Variable Data Speed

The bi-directional voice service having variable data speed provides voice communication which employs
voice encoder algorithm having power variable data rate between the base station and the mobile station. On the
other hand, the transmit voice encoder performs voice sampling and then, creates encoded voice packets to be
sent out to the receive voice encoder, whereas the receive voice encoder demodulates the received voice packets
into voice samples.
One of the two voice encoders described in the above is selected for use depending on inputted automatic
conditions and message/data; both of them utilize four-stage frames of 9600, 4800, 2400, and 1200 bits per

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second for cellular and 14400,7200,3600,1800 bits per second for PCS, so PCS provide relatively better voice
quality (almost twice better than the existing celluar system). In addition, this type of variable voice encoder

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utilizes adaptive threshold values on selecting required data rate. It is adjusted in accordance with the size of
background noise and the data rate is increased to high rate only when the voice of caller is inputted.
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Therefore, background noise is suppressed and high-quality voice transmission is possible under the
environment experiencing serious noise. In addition, in case the caller does not talk, data transmission rate is
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reduced so that the transmission is carried out in low energy. This will reduce the interference on other CDMA
signals and as a result, improve system performance (capacity increased by about two times).
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2.4 Protecting Call Confidentiality

Voice privercy is provided in the CDMA system by means of the private long code mask used for PN spreading.
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Voice privacy can ve applied on the traffic channels only. All calls are initiated using the public long code mask
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for PN spreading. The mobile station user may request voice privacy during call setup using the origination
message or page response message, and during traffic channel operation using the long code transition request
order.
The Transition to private long code mask will not be performed if authentication is not performed. To initiate a
transition to the private or public long code mask, either the base station or the mobile station sends a long code
transition request order on the traffic channel.

2.5 Soft Handoff

A handoff in which the mobile station commences communications with a new base station without interrupting
communications with the old base station. Soft handoff can only be used between CDMA channels having
identical freqeuncy assignments.

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2.6 Frequency Re-Use and Sector Segmentation

Unlike the existing analog cellular system, the CDMA system can reuse the same frequency at the adjacent cell.
there is no need to prepare a separate frequency plan. Total interference generated on mobile station signals
received from the cell site is the sum of interference generated from other mobile stations in the same cell site
and interference generated from the mobile station of adjacent cell site. That is, each mobile station signal
generates interference in relation to the signals of all the other mobile stations.
Total interference from all the adjacent cell sites is the ratio of interference from all the cell sites versus total
interference from other mobile stations in the same cell site (about 65%). In the case of directional cell site, one
cell normally uses a 120°sector antenna in order to divide the sector into three. In this case, each antenna is used
only for 1/3 of mobile stations in the cell site and accordingly, interference is reduced by 1/3 on the average and
the capacity that can be supported by the entire system is increased by three times.

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2.7 Soft Capacity .C
The subscriber capacity of the CDMA system is flexible depending on the relation between the number of
users and service classes. For example, the system operator can increase the number of channels available for
use during the busy hour despite the drop in call quality. This type of function requires 40% of normal call
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channels in the standby mode during the handoff, in an effort to avoid call disconnection resulting from the lack
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of channels.
In addition, in the CDMA system, services and service charges are classified further into different classes so that
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more transmit power can be allocated to high class service users for easier call set-up; they can also be given
higher priority of using hand-off function than the general users.
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3. Structure and Functions of tri-band CDMA Mobile

Phone
The hardware structure of CDMA mobile phone is made up of radio frequency (RF) part and logic part. The
RF part is composed of Receiver part (Rx), Transmitter part (Tx) and Local part (LO). For the purpose of
operating on tri-band, It is necessary dual Tx path, tri Rx path, dual PLL and switching system for band
selection. The mobile phone antenna is connected with quintplexer which divides antenna input/output signals
between cellular frequency band (824~894 MHz) and PCS frequency band (1850~1990MHz). Quintplexer
carrys out seperating Rx band and Tx band. The Rx signals from the antenna are directly converted into
baseband signal by the frequency synthesizer and frequency down converter. And then, are converted into
digital signals via Analog-to-Digital Converter (ADC). In front of the ADC, switching system is required to
choose which band path should be open. The digital signals send to 5 correlators in each CDMA de-modulator.

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Of these, one is called a searcher whereas the remaining 4 are called data receivers (fingers). Digitalized signals
include a great number of call signals that have been sent out by the adjacent cells. These signals are detected

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with pseudo-noise sequence (PN Sequence). Signal to interference ratio (C/I) on signals that match the desired
PN sequence are increased through this type of correlation detection process, but other signals obtain processing
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gain by not increasing the ratio. The carrier wave of pilot channel from the cell site most adjacently located is
demodulated in order to obtain the sequence of encoded data symbols. During the operation with one cell site,
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the searcher searches out multi-paths in accordance with terrain and building reflections. On three data receivers,
the most powerful 3 paths are allocated for the parallel tracing and receiving. Fading resistance can be improved
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a great deal by obtaining the diversity combined output for de-modulation. Moreover, the searcher can be used
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to determine the most powerful path from the cell sites even during the soft handoff between the two cell sites.
Moreover, 3 data receivers are allocated in order to carry out the de-modulation of these paths. Output data that
has been demodulated changes the data string in the combined data row as in the case of original
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signals(deinterleaving), and then, are demodulated by the forward error correction decoder which uses the
Viterbi algorithm.
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Mobile station user information send out from the mobile station to the cell site pass through the digital voice
encoder via a mike. Then, they are encoded and forward errors are corrected through the use of convolution
encoder. Then, the order of code rows is changed in accordance with a certain regulation in order to remove any
errors in the interleaver. Symbols made through the above process are spread after being loaded onto PN carrier
waves. At this time, PN sequence is selected by each address designated in each call.
Signals that have been code spread as above are digital modulated (QPSK) and then, power controlled at the
automatic gain control amplifier (AGC Amp). Then, they are converted into RF band by the frequency
synthesizer synchronizing these signals to proper output frequencies.
Transmit signals obtained pass through the quintplexer filter and then, are sent out to the cell site via the
antenna.

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4. Specification
4.1 General Specification

4.1.1 Transmit/Receive Frequency Interval

1) CELLULAR : 45 MHz
2) PCS : 80 MHz

4.1.2 Number of Channels (Channel Bandwidth)

1) CELLULAR : 20 Channels
2) PCS : 48 Channels

4.1.3 Operating Voltage

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DC 3.3~4.2V

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4.1.4 Battery Power Consumption
DC 3.7V
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SLEEP IDLE MAX POWER
CELLULAR 1.0 mA 90~120mA 650 mA (24.0 dBm)
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PCS 1.5 mA 90~120 mA 650 mA (23.8 dBm)
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4.1.5 Operating Temperature

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-30°C ~ +60°C

4.1.6 Frequency Stability

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1) CDMA : ±0.5PPM
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2) PCS : ±0.1PPM

4.1.7 Antenna
Fixed Type (External Antenna), 50 Ω

4.1.8 Size and Weight

1) Size : W x H x D : 91.5 x 47.5 x 18.2 mm (1.87 x 3.60 x 0.72 inch)
2) Weight : 81.2g

4.1.9 Channel Spacing

1) CELLULAR : 1.25MHz
2) PCS: 1.25 MHz

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4.1.10 Battery Type, Capacity and Orerating Time

Unit = Hours, Minutes
Standard (800mAh)
PCS(Slot Cycle 1) About 150 Hrs (SCI=1)
Stand-by Time
Celluar (Slot Cycle 1) About 160 Hrs (SCI=1)

PCS(Slot Cycle 1) About 180 Min.(typical quintplexer, -92dBm Input)

Talk Time
Celluar (Slot Cycle 1) About 180 Min.(typical quintplexer, -92dBm Input)

4.2 Receive Specification

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4.2.1 Frequency Range

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1) CELLULAR : 869.820 MHz ~ 893.190 MHz
2) PCS : 1930 MHz ~ 1990 MHz
3) GPS : 1575.42 MHz
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4.2.2 Local Oscillating Frequency Range
1) CELLULAR : 1738.08MHz ~ 1787.94MHz
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2) PCS : 1715.56MHz ∼ 1768.89MHz

3) GPS : 3150.84MHz
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4.2.3 Sensitivity
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1) CELLULAR : -104dBm (C/N 12dB or more)

2) PCS : -104dBm (C/N 12dB or more)
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3) GPS : -148.5dBm

4.2.4 Selectivity
1) CELLULAR : 3dB C/N Degration (With Fch±1.25 kHz : -30dBm)
2) PCS : 3dB C/N Degration (With Fch±1.25 kHz : -30dBm)

4.2.5 Interference Rejection

1) Single Tone : -30dBm at 900 kHz (CELLULAR), -30dBm at 1.25MHz(PCS)
2) Two Tone : -43dBm at 900 kHz & 1700kHz(CELLULAR), -43dBm at 1.25 MHz & 2.05 MHz

4.2.6 Spurious Wave Suppression

Maximum of -80dB

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4.2.7 CDMA Input Signal Range

z Dynamic area of more than -104~ -25 dB: 79dB at the 1.23MHz band.

4.3 Transmit Specification

4.3.1 Frequency Range

1) CELLULAR : 824.820MHz ~ 848.190MHz
2) PCS : 1850 MHz ~ 1910 MHz

4.3.2 Local Oscillating Frequency Range

1) CELLULAR : 1738.08MHz ~ 1787.94MHz

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2) PCS : 1715.56MHz ∼ 1768.89MHz

4.3.3 Intermediate Frequency

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Direct Conversion
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4.3.4 Output Power
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1) CELLULAR : 0.251W
2) PCS: 0.240W
O

4.3.5 CDMA TX Frequency Deviation

-B

1) CELLULAR: +300Hz or less

2) PCS: ± 150Hz
X

4.3.6 CDMA TX Conducted Spurious Emissions

Z3

1) CELLULAR : 900kHz : - 42 dBc/30kHz below

1.98MHz : - 54 dBc/30kHz below
2) PCS : -42 dBc / 30KHz below

4.3.7 CDMA Minimum TX Power Control

1) CELLULAR : - 50dBm below
2) PCS: -50dBm below

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4.4 MS (Mobile Station) Transmitter Frequency

4.4.1 CELLULAR mode

Ch # Center Freq. (MHz) Ch # Center Freq. (MHz)

1011 824.640 404 837.120

29 825.870 445 838.350
70 827.100 486 839.580
111 828.330 527 840.810
152 829.560 568 842.040
193 830.790 609 843.270
234 832.020 650 844.500

M
275 833.250 697 845.910
316 834.480 738 847.140

O
363 835.890 .C 779 848.370

4.4.2 PCS mode

X
Ch # Center Freq (MHz) Ch # Center Freq (MHz) Ch # Center Freq (MHz)
O

25 1851.25 425 1871.25 825 1891.25

50 1852.50 450 1872.50 850 1892.50
-B

75 1853.75 475 1873.75 875 1893.75

100 1855.00 500 1875.00 900 1895.00
X

125 1856.25 525 1876.25 925 1896.25

150 1857.50 550 1877.50 950 1897.50
Z3

175 1858.75 575 1878.75 975 1898.75

200 1860.00 600 1880.00 1000 1900.00
225 1861.25 625 1881.25 1025 1901.25
250 1862.50 650 1882.50 1050 1902.50
275 1863.75 675 1883.75 1075 1903.75
300 1865.00 700 1885.00 1100 1905.00
325 1866.25 725 1886.25 1125 1906.25
350 1867.50 750 1887.50 1150 1907.50
375 1868.75 775 1888.75 1175 1908.75

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4.5 MS (Mobile Station) Receiver Frequency

4.5.1 CELLULAR mode

Ch. # Center Freq. (MHz) Ch. # Center Freq. (MHz)

1011 869.640 404 882.120

29 870.870 445 883.350
70 872.100 486 884.580
111 873.330 527 885.810
152 874.560 568 887.040
193 875.790 609 888.270

M
234 877.020 650 889.500
275 878.250 697 890.910

O
316 879.480 .C738 892.140
363 880.890 779 893.370

4.5.2 PCS mode

X
O

Ch # Center Freq (MHz) Ch # Center Freq (MHz) Ch # Center Freq (MHz)

25 1931.25 425 1951.25 825 1971.25
-B

50 1932.50 450 1952.50 850 1972.50

75 1933.75 475 1953.75 875 1973.75
X

100 1935.00 500 1955.00 900 1975.00

125 1936.25 525 1956.25 925 1976.25
Z3

150 1937.50 550 1957.50 950 1977.50

175 1938.75 575 1958.75 975 1978.75
200 1940.00 600 1960.00 1000 1980.00
225 1941.25 625 1961.25 1025 1981.25
250 1942.50 650 1962.50 1050 1982.50
275 1943.75 675 1963.75 1075 1983.75
300 1945.00 700 1965.00 1100 1985.00
325 1946.25 725 1966.25 1125 1986.25
350 1947.50 750 1967.50 1150 1987.50
375 1948.75 775 1968.75 1175 1988.75

4.5.3 GPS mode : 1575.42MHz

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4.6 AC Adaptor
See Appendix

4.7 Cigar Lighter Charger

See Appendix

4.8 Hands-Free Kit

See Appendix

M
5. Installation
5.1 Installing a Battery Pack
O
.C
1) The Battery pack is keyed so it can only fit one way. Align the groove in the battery pack with the rail
on the back of the phone until the battery pack rests flush with the back of the phone.
X
2) Slide the battery pack forward until you hear a “click”, which locks the battery in place.
O

5.2 For Adapter Use

-B

1) Plug the adapter into a wall outlet. The adapter can be operated from a 110V source.
When AC power is connected to the adapter.
X

2) Insert the adapter jack into the phone with the installed battery pack.
Z3

Red light indicates battery is being charged.. Green light indicates battry is fully charged.

5.3 For Mobile Mount

5.3.1 Installation Position

In order to reduce echo sound when using the Hands-Free Kit, make sure that the speaker and microphone are
not facing each other and keep microphone a generous distance from the speaker.

5.3.2 Cradle Installation

Choose an appropriate flat surface where the unit will not interface with driver’s movement or passenger’s
comfort. The driver/user should be able to access the phone with ease. Using the four self-tapping screws

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provided, mount the supplied braket on the selected area. Then with the four machine screws provided, mount
the counterpart on the reverse side of the reverse side of the cradle. Secure the two brackets firmly together by
using the two bracket joint screws provide.
The distance between the cradle and the interface box must not exceed the length of the main cable.

5.3.3 Interface Box

Choose an appropriate flat surface ( somewhere under the dash on the passenger side is preferred ) and mount
the IB bracket with the four self-tapping screws provided. Clip the IB into the IB bracket.

5.3.4. Microphone Installation

Install the microphone either by cliiping I onto the sunvisor (driver’s side) or by attaching it to door post

M
(driver’s side), using a velcno adhesive tape (not included).

5.3.5 Cable Connections

O
.C
5.3.5.1 Power and Ignition Cables
X
Connect the red wire to the car battery positive terminal and the black wire to the car ground. Connect the green
wire to the car ignition sensor terminal. ( In order to operate HFK please make sure to connect green wire to
O

ignition sensor terminal.) Connect the kit’s power cable connector to the interface box power receptacle.
-B

5.3.5.2 Antenna Cable Connection

Connect the antenna coupler cable connector from the cradle to the external antenna connector. ( Antenna is not
X

included.)
Z3

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Chapter 2. NAM Input Method

(Inputting of telephone numbers included)
Chapter 2. NAM Input Method

NAM Programming Method and Telephone Number

Input Method
PREPARATION
STEP ACTION
1 Press OK key – Press 0 key – Input 000000 for Service Code.
2 Press 1 for Service Programming (Service Prg.)

M
PROGRAMMING STEPS

O
ITEM Default
.C Action

1 ESN xxxxxxxxxxxxxx ESN Information (Read Only)

/ 80xxxxxx
X
2 Phone 000000xxxx Enter the Phone Number(Mobile Directory Number) [OK]
O

Number(MDN)

3 Phone 000000xxxx Enter the Phone Number(Mobile Identification Number) [OK]

-B

Number(MIN)

4 Home SID 0 Enter Home SID

X

5 Name NAM1 Edit NAM Name

6 Completed Press [More]

Z3

7 Service Code 000000 Service Programming code

8 MCC 310 Enter the 3 digits Mobile Country Code [OK]

9 NMSID 00000000xxxx Enter 00 + the 10 digits Mobile Phone Number (National Mobile

Station Identity) [OK]

10 True IMSI MCC 000 Enter the True IMSI Mobile Country Code (International Mobile

Station Identity) [OK]

11 True IMSI NMSID 00000000xxxx Enter 00 + the 10 digits Mobile Phone Number [OK]

12 PRL Enabled Enabled PRL enabled (preset)

13 CDMA Home 0/65535 Enter CDMA Home SID/NID.

SID/NID

14 CDMA Pri. CH A 283 Enter CDMA Primary CH A (preset)

15 CDMA Sec. CH A 691 Enter CDMA Secondary CH A (preset)

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16 CDMA Pri. CH B 384 Enter CDMA Primary CH B (preset)

17 CDMA Sec. CH B 777 Enter CDMA Secondary CH B (preset)

18 Lockout SID/NID 0/65535 Enter Lockout SID/NID.[OK]

19 Home Sys Reg Yes Enter Yes or No to enable/disable Home System Registration

[OK]

20 Forn SID Reg Yes Enter Yes or No to enable/disable Foreign System ID Registration

[OK]

21 Forn NID Reg Yes Enter Yes or No to enable/disable Foreign Network ID

Registration [OK]

22 Acc Ovld Class x Enter ACCOLC[OK]

23 Slot Cycle Index 2 Enter the Slot Cycle Index (x = 0 ~ 7, commonly 1 or 2) [OK]

M
O
.C
X
O
-B
X
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Chapter 3. Circuit Description

Chapter 3. Circuit Description

1. RF Transmit/Receive Part
1.1 Overview

The Tx and Rx part employs the Direct Conversion system. The Tx and Rx frequencies are respectively
824.04~848.97MHz and 869.04~893.97MHz for cellular and 1850~1910MHz and 1930~1990MHz for PCS.
The block diagram is shown in Page 71. RF signals received through the antenna are seperated by quintplexer.
RF Signal fed into the low noise amplifier (in QSC6055) through the quintplexer. Then, they are combined with

M
the signals of local oscillator (VCO) at the down conversion mixer(in QSC6055) in order to create Base-band
frequency. Then, this signal is changed into digital signal by the analog to digital converter (ADC, A/D

O
Converter), and the digital circuit part of the QSC(Qualcomm Single Chip)6055 processes the data from ADC.
The digital processing part is a demodulator.
.C
In the case of transmission, RF Transmitter(in QSC6055) receives QPSK-modulated anlog signal from the
QSC6055. In QSC6055, the baseband quadrature signals are upconverted to the Cellular or PCS frequency
X
bands and amplified to provide signal drive capability to the power amp.
O

After that, the RF signal is amplified by the Power Amp in order to have enough power for radiation.
Finally, the RF signal is sent out to the cell site via the antenna after going through the coupler and quintplexer.
-B

1.2 Description of Rx Part Circuit

X
Z3

1.2.1 Quintplexer (DP100)

The ACFM-7102 is a quintplexer that combines a US PCS duplexer, a cellular band duplexer and a S-GPS band
filter into a single, miniature package with a single antenna port.
The main function of quintplexer is to prohibit the other band signals from flowing into the one band circuit
and vice versa. RF designer can use common tri-band antenna regardless of frequency band (800, 1575 and
1900 MHz). The specification of LG300 quintplexer is described below:

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O
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X
O
-B
X
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O
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X
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-B
X
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1.2.2 LNAs (U200)

The QSC6055 has cellular and PCS LNAs, respectively. The characteristics of Low Noise Amplifier (LNA)
are low noise figure, high gain, high intercept point and high reverse isolation.
The frequency selectivity characteristic of mobile phone is mostly determined by LNA.
The specification of LG300 LNAs are described below:

1.2.2.1 Cellular CDMA LNA performance specifications

M
O
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X
O
-B
X
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1.2.2.2 PCS CDMA LNA performance specifications

M
O
.C
X
1.2.3 GPS LNA (U101)
The characteristics of Low Noise Amplifier (LNA) are low noise figure, high gain, high intercept point and high
O

reverse isolation. The frequency selectivity characteristic of mobile phone is mostly determined by LNA.
-B

The specification of LG300 GPS LNA is described below

X
Z3

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1.2.4 Down-converter Mixers

The QSC6055 device performs signal down-conversion for Cellular, PCS and GPS tri-band applications. It
contains all the circuitry (with the exception of external filters) needed to support conversion of received RF
signals to baseband signals. The three downconverting Mixers (Cellular, PCS and GPS), and an LO Buffer
Amplifier to buffer the RF VCO to the RF Transmit Upconverter. The GPS LNA & mixers offer the most
advanced and integrated CDMA Rx solution designed to meet cascaded Noise Figure (NF) and Third-order
Intercept Point (IIP3) requirements of IS-98C and J-STD-018 specifications for Sensitivity, Two-Tone
Intermodulation, and Single-tone Desense.
Operation modes and band selection are specially controlled from the Qualcomm Single Chip QSC6055.

1.2.5 Rx RF SAW Filters (F100/F104)

The main function of Rx RF SAW filter is to attenuate mobile phone spurious frequency, attenuate direct RF

M
frequency pick up, attenuate noise at the image frequency originating in or amplified by the LNA and suppress
second harmonic originating in the LNA. The Rx RF SAW filter usually called image filter.

O
1.2.6 RF Receiver (U200)
.C
The circuit functions of the RF Receiver(in QSC6055) include Rx Automatic Gain Controller (AGC) with 90
X
dB dynamic range, quadrature RF mixers, down-conversion mixer from RF to base-band, low pass filters and
Analog to Digital Converters (ADC) for converting to digital base-band. The RFR includes clock generators that
O

drive the digital processor and a VCO which generates the LO frequency for base-band down-conversion.
-B

Switching system is located in front of the RFR RX_IN_C_LB and RX_IN_C_HB terminal and is for band
selection between cellular and PCS. The Rx AGC either amplifies or attenuates the received CDMA RF signal
to provide a constant-amplitude signal to the I/Q down-converter. The RF output of the Rx AGC amplifier
X

separate into I-channel and Q-channel base-band components and down-converted by mixer with quadrature LO.
LO signals are generated by a Voltage Controlled Oscillator (VCO) and frequency stabilized by external
Z3

varactor-tuned resonant tank circuit. The I/Q down converter outputs the CDMA signals at baseband frequency.
Low-pass filtering enables the receiver to select the desired baseband signals from the effects of unwanted noise
or adjacent-channel interference. I/Q base band components are converted to digital signals by two identical
4-bit ADCs.

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1.3 Description of Transmit Part Circuit

1.3.1 RF Transmitter (U200)

The RF Transmitter(in QSC6055, base-band-to-RF Transmit Processor) performs all Tx signal-processing
functions required between digital base-band and the Power Amplifier Module (PAM). The base-band
quadrature signals are up-converted to the Cellular or PCS frequency bands and amplified to provide signal
drive capability to the PAM. The RFT includes an RF mixer for upconverting analog baseband to RF, a
programmable PLL for generating Tx LO frequency, two cellular and two PCS driver amplifiers and Tx power
control through an 85 dB VGA. As added benefit, the single sideband upconversion eliminates the need for a
band pass filter normally required between the upconverter and driver amplifier.
I, I/, Q and Q/ signals proceed from the QSC6055 are analog signal. In CDMA mode, These signals are
modulated by Quadrature Phase Shift King (QPSK). I and Q are 90 deg. out of phase, and I and I/ are 180 deg.
Tx IF signal can be obtained by mixing analog signal with 228.6MHz(Cellular)/263.6(PCS) 1st local osillator

M
frequency which is generated by Tx VCO. The Tx IF signal is amplified by AGC controlled by QSC6055. The
second mixer on RFT converts IF signals into RF signals. After passing through the upconverter , RF signal is

O
inputted into the Power Amplifier Module. .C
1.3.1.1 Cellular CDMA transmit signal path performance specifications
X
O
-B
X
Z3

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X
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-B
X
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1.3.1.2 PCS CDMA transmit signal path performance specifications

M
O
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X
O
-B
X
Z3

1.3.2 Dual Power Amplifier (U105)

The power amplifier that can be used in the PCS and CDMA mode has linear amplification capability and high
efficiency. For higher efficiency, it is made up of one MMIC (Monolithic Microwave Integrated Circuit) for
which RF input terminal and internal interface circuit are integrated onto one IC after going through the
AlGaAs/GaAs HBT (heterojunction bipolar transistor) process. The module of power amplifier is made up of an
output end interface circuit including this MMIC. The maximum power that can be inputted through the input
terminal is +10dBm and conversion gain is about 28dB. RF transmit signals that have been amplified through
the power amplifier are sent to the quintplexer.

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1.4 Description of Frequency Synthesizer Circuit

1.4.1 Voltage Control Temperature Compensation Crystal Oscillator

(VCTCXO, U106)
The temperature variation of mobile phone can be compensated by TCXO. The reference frequency of a mobile
phone is -30~+85 °C. The receives frequency tuning signals called TRK_LO_ADJ from QSC6055 as
0.5V~2.5V DC via R and C filter in order to generate the reference frequency of 19.2MHz and input it into the
frequency synthesizer of UHF band. Frequency stability depending on temperature is ±2.0 ppm.

2. Digital/Voice Processing Part

M
2.1 Overview

O
The digital/voice processing part processes the user's commands and processes all the digital and voice signal
processing in order to operate in the phone. The digital/voice processing part is made up of a keypad/LCD,
.C
receptacle part, voice processing part, modem part, memory part, and power supply part.
X
2.2 Configuration
O
-B

2.2.1 Keypad/LED and Receptacle Part

This is used to transmit keypad signals to QSC6055. It is made up of a keypad backlight part that illuminates the
keypad, LCD part that displays the operation status onto the screen, and a receptacle that receives and sends out
X

voice and data with external sources.

Z3

2.2.2 Voice Processing Part

The voice processing part is made up of an audio codec used to convert MIC signals into digital voice signals
and digital voice signals into analog voice signals, amplifying part for amplifying the voice signals and sending
them to the ear piece, amplifying part that amplifies ringer signals coming out from QSC6055, and amplifying
part that amplifies signals coming out from MIC and transferring them to the audio processor.

2.2.3 QSC6055 Part

QSC6055 (Qualcomm Single Chip) is the core elements of CDMA terminal and carries out the functions of
CPU, encoder, interleaver, deinterleaver, Viterbi decoder, Mod/Demod, and vocoder.

2.2.4 Memory Part

The memory part is made up of a DDR/NAND memory.

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2.2.5 Power Supply Part

The power supply part is made up of circuits for generating various types of power, used for the digital/voice
processing part.

2.3 Circuit Description

2.3.1 Keypad/LCD and Receptacle Part

Once the keypad is pressed, the key signals are sent out to QSC6055 for processing. In addition, when the key is
pressed, the keypad lights up through the use of 10 LEDs. The terminal status and operation are displayed on the
screen for the user with the characters and icons on the LCD.

M
Moreover, it exchanges audio signals and data with external sources through the receptacle, and then receives
power from the battery or external batteries.

2.3.2 Audio Processing Part

O
.C
MIC signals are inputted into the audio codec(included in QSC6055) and converted into digital signals.
Oppositely, digital audio signals are converted into analog signals after going through the audio codec. These
X
signals are amplified at the audio amplifier and transmitted to the ear-piece. The signals from QSC6055 activate
the ringer by using signals generated in the timer in QSC6055.
O

2.3.3 MODEM Part

-B

QSC6055 is the core element of CDMA system terminal that includes ARM926 EJS microprocessor core. It
supports both CDMA and GPS, operating in both the cellular and PCS spectrums. The subsystems within the
X

QSC6055 include a CDMA processor, a multi-standard Vocoder, an integrated CODEC with earpiece and
Z3

microphone amplifiers, general-purpose ADC for subsytem monitoring, an ARM926 EJS microprocessor, and
both Universal Serial Bus(USB) and an RS-232 serial interfaces supporting forward and reverse link data
communications of 307.2 Kbps simultaneously. And it also contains complete digital modulation and
demodulation systems for CDMA standards, as specified in IS-95-A/B/C.
In QSC, coded symbols are interleaved in order to cope with multi-path fading. Each data channel is scrambled
by the long code PN sequence of the user in order to ensure the confidentiality of calls. Moreover, binary
quadrature codes are used based on walsh functions in order to discern each channel. Data created thus are
4-phase modulated by one pair of Pilot PN code and they are used to create I and Q data.
When received, I and Q data are demodulated into symbols by the demodulator, and then de-interleaved in
reverse to the case of transmission. Then, the errors of data received from viterbi decoder are detected and
corrected. They are voice-decoded at the vocoder in order to output digital voice data..

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QSC6055

MIC1 Mic

MIC2 Ear-Mic

EAR1 Receiver

SPKR OUT Speaker

[Figure 2-2] Block Diagram of Digital/Voice Processing Part

M
2.3.4 Memory Part
MCP contents 1 Gbits NAND flash memory and 512 Mbits DDR SRAM. In the Flash Memory part of MCP are

O
programs used for terminal operation. The programs can be changed through down loading after the assembling
of terminals. On the SDRAM data generated during the terminal operation are stored temporarily.
.C
2.3.5 Power Supply Part
X
When the battery voltage (+4.0V) is fed and the PWR key of keypad is pressed, the power-up circuitry in PM
(power management) circuit(in QSC6055) is activated by the PWR_ON_SW/ signal, and then the LDO
O

regulators embedded in PM circuit are operated and +1.3V_MSMC, +2.6V_MSMP, +1.8V_MSME and
-B

+2.1V_MSMA are generated.

The Rx part (+2.1V_RFRX) and Tx part voltage (+2.1V_RFTX) are regulated by QSC6055
X

2.3.6 Logic Part

Z3

The logic part consists of internal CPU of QSC, RAM, MCP. The QSC6055 receives TCXO (=19.2MHz) from
U106 and controls the phone in both CDMA and GPS modes. The major components are as follows:

z CPU
The ARM926 EJS microprocessor includes a 3 stage pipelined RISC architecture, both 32-bit ARM and 16-bit
THUMB instruction sets, a 32-bit address bus, and a 32-bit internal data bus. It has a high performance and
low power consumption.

z MCP
Flash ROM is used to store the terminal’s program. Using the down-loading program, the program can be
changed even after the terminal is fully assembled.
SDRAM is used to store the internal flag information, call processing data, and timer data.

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z KEYPAD
For key recognition, key matrix is setup using KYPD[0][1][2][3][4][9][11][13][15][17][19] signal from QSC.
10 LEDs and backlight circuitry are included in the keypad for easy operation in the dark.

z LCD MODULE
LCD module contains a controller which will display the information onto the LCD by 16-bit data from the
QSC6055.

M
O
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X
O
-B
X
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Chapter 4. Trouble Shooting

Chapter 4. Trouble Shooting
1. Rx Part Trouble
1.1 DCN & PCS Rx Trouble

Test Point

M
O
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X
[Figure 4-1-1] DCN & PCS Rx Part
O

Checking Flow
-B

START
X

Check
DC Power Supply
Z3

PCS Circuit
DCN or PCS?

DCN
Rx TEST SETUP(HHP) Rx TEST SETUP(HHP) Check
- Test Channel : DCN 384 - Test Channel : PCS 600 RX Signal Path
- Test Band : US Cellular - Test Band : US PCS
- SID :1482 - SID :1482

Check
Rx TEST SETUP(HHP) VCTCXO
- Sector Power : -30 dBm
Spectrum Analyzer Settiing
Oscilloscope Setting

Redownload SW, CAL

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1.1.1 Checking DC Power Supply Circuit

Test Point Checking Flow

START
QSC6055

No
+2.1V_RFRX1
Check PM Part
Is OK

Yes
No

M
R211
R203 +2.1V_RFRX2
Check PM Part
Is OK

O
Yes

RF Power Supply Circuit is OK.

.C
See next page to check RF path

[Figure 4-1-1-1]
+2.1V_RFRX2
X
+2.1V_RFRX1

Circuit Diagram
O
-B

QSC6055
X
Z3

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1.1.2 Checking Rx Signal Path

Test Point
QSC6055

L113, L114

L116, L117
L130, L131
F104

F100

DP100
U100

M
L100, Pin #6 of DP100
C109, C110

O
[Figure 4-1-1-2]
.C
Checking Flow
X
START
O

1. Check L100
If there is any major difference
Detected No
-B

with Graph 1-1-2-1 Change U100

Signal?

2. Check L130, L131 Yes

X

If there is any major difference No

with Graph 1-1-2-2 Detected
Change DP100
Signal?
Z3

3. Check C109, C110 Yes

If there is any major difference No
Detected
with Graph 1-1-2-3 Change Main Board
Signal?

4. Check L113, L114 or L116, L117 Yes

If there is any major difference No
Detected
With Graph 1-1-2-3 Change F104 or F100
Signal?

Yes

RX Signal Path is OK.

See next page to check VCO&TCXO

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Circuit Diagram

1. Check Pin #2 of U100

If there is any major difference
with Graph 1-1-2-1

2. Check Pin #3 (DCN Path)

M
and #4 (PCS Path) of DP100
If there is any major difference
with Graph 1-1-2-2

O
.C
X
O

Waveform
-B
X
Z3

Graph 1-1-2-1 Graph 1-1-2-2

Graph 1-1-2-3 (a) Graph 1-1-2-3 (a)

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Circuit Diagram

DCN RX
PCS RX

M
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X
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1.1.3 Checking VCTCXO Circuit

Test Point

C156
(VCTCXO : 19.2Mhz)

M
U106 R108 (+2.8V_TCXO)
MIC

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[Figure 4-1-1-3]
.C
X
O

Checking Flow
-B
X

START
Z3

No
+2.8V_TCXO
1. Check R108 of U106 Check PM Part
is OK

Yes
No
TCXO Output
2. Check C156 of U106 Pin #3 is 19.2Mhz
Change U106
Refer to Graph 1-1-3

Yes

VCTCXO Circuit is OK.

Check Logic Part

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Circuit Diagram

R108 (+2.8V_TCXO)

M
U106
C156

O
(VCTCXO : 19.2Mhz)
.C
X
Waveform
O
-B
X
Z3

Graph 1-1-3

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2. Tx Part Trouble
2.1 DCN & PCS Tx Trouble

Test Point

M
O
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[Figure 4-2-1] DCN & PCS Tx Part

Checking Flow
X
O

START
Check
VCTCXO
-B

PCS
DCN or PCS?
X

DCN Check
Tx SAW Filter
Z3

Rx TEST SETUP(HHP) Rx TEST SETUP(HHP)

- Test Channel : DCN 384 - Test Channel : PCS 600
- Test Band : US Cellular - Test Band : US PCS
- SID :1482 - SID :1482

Check
PAM
Rx TEST SETUP(HHP)
- Sector Power : -90 dBm
- Call Access Attempt
Spectrum Analyzer Settiing
Oscilloscope Setting
Check
Quintplexer
Check
DC Power Supply
Circuit

Redownload SW, CAL

◆ Refer to “1-1-3 Checking
VCTCXO Circuit”

42 LG Electronics Inc.
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AX300

Test Point Checking Flow

START

QSC6055
Rx TEST SETUP(HHP)
- Sector Power : -90 dBm
- Call Access Attempt
Oscilloscope Setting
R206

R208

No

M
+2.1V_RFTX
Check PM Part
is OK

Yes

O
RF Power Supply Circuit is OK.
.C
See next page to check TX path

[Figure 4-2-1-1]
+2.1V_RFTX
X
Circuit Diagram
O
-B

QSC6055
X
Z3

43 LG Electronics Inc.
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AX300

2.1.2 Checking VCTCXO Circuit

Test Point

M
C156
(VCTCXO : 19.2Mhz)

O
U106 R108 (+2.8V_TCXO)
MIC .C
[Figure 4-2-1-2]
X
O
-B

Checking Flow
X

START
Z3

No
+2.8V_TCXO
1. Check R108 of U106 Check PM Part
iIs OK

Yes
No
TCXO Output
2. Check C156 of U106 Pin #3 is 19.2Mhz
Change U106
Refer to Graph 2-1-2

Yes

VCTCXO Circuit is OK.

Check Tx Saw Filter

44 LG Electronics Inc.
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AX300

Circuit Diagram

R108 (+2.8V_TCXO)

M
O
U106
C156
(VCTCXO : 19.2Mhz)
.C
X
O

Waveform
-B
X
Z3

Graph 2-1-2

45 LG Electronics Inc.
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AX300

2.1.3 Checking Tx SAW Filter IN/OUT

Test Point
C167
C168
QSC6055
Tx Filter IN (PCS)

Tx Filter IN (DCN)

M
F105
(Tx SAW Filter)

O
R127
DP100
(Quintplexer)
U105
Tx Filter OUT (DCN)
.C
(PAM)
C143
Tx Filter OUT (PCS)
X
[Figure 4-2-1-3]

Checking Flow
O
-B

START

Check Tx Saw Filter IN

X

(C167, C168)
Refer to Graph 2-1-3 (a) [Graph 2-1-3 (a)]
Z3

Similar No
Change Main Board
Waveform?
Yes

Check Tx Saw Filter OUT

(C143, R127)
Refer to Graph 2-1-3 (b)

Similar No
Change F105
Waveform?
[Graph 2-1-3 (b)]
Yes

Tx Saw Filter is OK
Check Tx PAM

46 LG Electronics Inc.
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AX300

2.1.4 Checking Tx Dual PAM

Test Point Checking Flow

DCN_Ref START
DCN_PAM OUT

Check PAM VCC (C127)

C136 QSC6055
No
C124 VCC>3.4? Check PM Part
PAM_VCC U105
(PAM) Yes
C127

M
C126 Check PAM Ref
C138

No

O
PCS_Ref PCS_PAM OUT Is DCN/PCS Ref High? Check QSC6055

[Figure 4-2-1-4]
Yes
.C
Check Tx PAM OUT

No
X
Similar Waveform? Change U105

Yes
O

PAM Circuit is OK
Check Quint
-B

Waveform
X
Z3

[Graph 2-1-4 (a)] [Graph 2-1-4 (b)]

Tx PAM IN Tx PAM OUT

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AX300

Circuit Diagram

DCN TX
PCS TX

M
O
.C
X
O
-B
X
Z3

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AX300

2.1.5 Checking Quintplexer and Mobile Switch

Test Point Checking Flow

START
PCS_PAM OUT DCN_PAM OUT

Check Quint IN/OUT

(#1, #2 Pin / L100)
Refer to Graph 2-1-5 (a)

#2 PCS Tx #1 DCN Tx
No
DP100 Similar Waveform? Change DP100

M
(Quint) U100
(SW)
Yes
L100 Check Mobil Switch

O
(U100 #1pin)
Refer to Graph 2-1-5 (b)

[Figure 4-2-1-5]
.C
No
Similar Waveform? Change U100
X
Yes
Waveform
O

Tx Signal is OK
-B

Circuit Diagram
X

[Graph 2-1-5 (a)]

Z3

[Graph 2-1-5 (b)]

49 LG Electronics Inc.
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3. Power
3.1 Power On Trouble

Test Point C416

R214
+2.6V_MSMP

R215
+VPWR
R414
+1.8V_MSME
PWR_ON_SW/
(Low Active)
R216

+1.3V_MSMC

M
+2.1V_MSMA

VCTCXO

O
C235 +2.8V_TCXO
.C
[Figure 4-3-1] PM part
Circuit
X
O
-B
X

QSC6055
Z3

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Checking Flow

START

No
+VPWR> 3.2V ? Change Battery

Yes

No
PWR_ON_SW
Check Dome Key
is Working

M
Yes

O
Check Voltage of the
Following LDOs
+1.3V_MSMC
.C
+2.6V_MSMP
+2.1V_MSMA
+1.8V_MSME1
X
+2.8V_TCXO
O

No Check the
-B

Is it Good? peripheral
Circuit of PM Part

Yes
X
Z3

No No
TCXO Frequency
Replace the
is OK Is it Good?
component
Replace the
Yes VCTCXO
Yes

PS_HOLD Level
No Change the Main
is High B’d

Yes

The Power On Procedure

is completed.
Check the other parts.

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3.2 Charging Trouble

Test Point

Check 4.0V
(C416)

Check 5.0V
(R433)

Check 5.0V
(C425)

M
O
U402
.C CON403

[Figure 4-3-2] Charging part

Circuit
X
Check 5.0V
O

Check 5.0V
(C425)
(R433)
-B
X

Check 5.0V
Z3

Check 5.0V (C425)

(R433)

Check 4.0V
(C416)

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Checking Flow

START

The Battery No
Change Battery
is 3.2~4.1V

Yes Re-solder
CON403
No No
Voltage at Pin #1, #8 CON403
of U402 =5.0V ? Well-soldered?

Yes The Charger(TA) is

M
Yes
out of order.
Chage the charger
No
Voltage at Pin #4, #9

O
of U402 =5.0V ?
Check U402 (OVP)
Yes Re-solder or Replace
.C
No
Voltage at Pin #5
X
Check Q400, U401
Of U401 =4.0V ?

Yes
O

Check the No
-B

peripheral Replace Q400

Is it Good?
Circuit of PM Part or U401

Yes
X

No
Is it Good?
Z3

Yes

Connect the Battery

to the Phone

Is Battery No Change the Main

Charging?? B’d

Yes

Charging will operate

properly

53 LG Electronics Inc.
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AX300

4. Logic Part Trouble

4.1 LCD Trouble

Test Point

R502
R501

LCD_DATA [12]~[15]

F504
LCD_RS/ C511

F505
+2.8V_LCD
CON600

M
SLCD_CS/
R500
MLCD_CS/ F506

O
F500

LCD_DATA [4]~[7] .C
LCD_DATA [0]~[3] LCD_DATA [8]~[11]
F501

Pin #1 LCD_RESET/
X
O

[Figure 4-4-1 (a) ] LCD part

-B
X
Z3

LCD_BACK_CAMLDO_EN

R329

U302

C322
LED_VOUT

[Figure 4-4-1 (b) ] Charge Pump

for LCD Backlight & Camera

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AX300

Circuit

M
O
.C
X
O
-B
X
Z3

55 LG Electronics Inc.
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AX300

Checking Flow

START Recombine
FPCB Connector or
Check CON600

Main FPCB No
Connector
is OK
No
LCD_BACK_CAMLDO_EN
Yes Change the Main B’d
at R329 is High

Yes

M
LED_VOUT at C322 No
is OK

O
Yes
Check and Replace
: C511, R205
.C Replace
the Charge Pump
(U302)
X
+2.8V_LCD No
is OK
O

Yes
-B

Check and Replace No

Components
Display is OK?
: LCD_RESET/, LCD_RS/,
No MLCD_CS/, SLCD_CS/
Control Signals
X

are OK Yes

Yes Good
Z3

Go to the next
No Check and Replace EMI Procedure
Data Signals are
Filter (F500, F501, F504,
OK
F505, F506)

Yes

Is the LCD No
Change the Main B’d
Working?
Change LCD
Module Yes
End

56 LG Electronics Inc.
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4.2. Camera Trouble

Test Point

F502
CAM_DATA [4]~[7]

F503
CAM_DATA [0]~[3] [Fig 4-4-2-2]
Camera FPCB Connector

CON600

F506

M
Pin #2, 8 : CAM_RESET/
Pin #3, 7 : CAM_HSYNC
+2.6V_CAM_VDD Pin #4, 6 : CAM_VSYNC

O
R506

+1.8V_CAM_IOVDD
.C
R511
CAM_PCLK
CAM_MCLK
C515

X
C512
[Figure 4-4-2-1 (a)] Camera part
O

CAM_I2C_SCL CAM_I2C_SDA
-B
X

LCD_BACK_CAMLDO_EN
Z3

R329
+2.8V_CAM_AVDD C314 U302

+1.8V_CAM_IOVDD C313

[Figure 4-4-2-1 (b) ] Charge Pump

for LCD Backlight & Camera

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AX300

Circuit
CON600

M
O
.C
X
O

Camera
-B

Connector
X
Z3

Charge Pump

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AX300

Checking Flow

START

Set Camera Preview On

LCD_BACK_CAMLDO_EN
Change the Main B’d
at R329 is High

Charge Pump No
outputs are OK
(1.8V & 2.8V)
Yes Replace or Change
the Charge Pump

M
No
I2C Signals
are OK

O
Yes Change the Main B’d

MCLK Frequency
No
.C Is the Camera
No
is 24.5±0.5MHz • Check Points
Working?
- Main FPCB Connector
- Main FPCB Crack or not
Yes
X
- Camera Connector & Yes
Camera Module in the
No Upper Folder (Fig 4-4-2-2)
Good
O

PCLK Frequency
is 24.5±0.5MHz
-B

Yes Check and Replace EMI Go to the next

Filter (F506) Procedure
No Pin #2, 8 : CAM_RESET/
Control Signals Pin #3, 7 : CAM_HSYNC
X

are OK Pin #4, 6 : CAM_VSYNC

Yes
Z3

No
Is the Camera
No Working?
Data Signals Check and Replace EMI
are OK Filter (F502, F503) Yes
Yes
Good
No
Is the Camera
Working?

Yes
Change the Main B’d

End

59 LG Electronics Inc.
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AX300

4.3 Audio Trouble

4.3.1 Speaker Trouble

Test Point

Pin#1 : SPK-
Pin#2 : SPK+
1
Receiver
2
Speaker Vibrator
CON600

[Fig 4-4-3-1 (b)] Upper Folder

M
O
L204
L203

.C
X
[Figure 4-4-3-1 (a)] Audio part [Fig 4-4-3-1 (c)]
L203 : MSM_SPK_OUT-
L204 : MSM_SPK_OUT+
O
-B

Circuit
X
Z3

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Checking Flow

START

Set Sound On

Check Wire state and

Soldering of

M
The Speaker

No

O
.CChange the Speaker or
Is it OK?
Re-solder
X
Yes
O

No
Signal wave appears
Change the Main B’d
-B

At the L203, L204?

Yes
X

Signal wave appears No • Check Points

Z3

At the Speaker - Main FPCB Connector

Soldering pad? - Main FPCB Crack or not

Yes

Resistance between No
2 terminal of RCV Change the Speaker
is 8ohm ?

Yes

Change the Main B’d

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4.3.2 Receiver Trouble

Test Point
R432

R431 Pin#64 : RCV+

Pin#63 : RCV-
64
Receiver
R431 : RCV+ 63
R432 : RCV- Speaker Vibrator
CON600

M
O
.C [Fig 4-4-3-2 (b)] Upper Folder
X
[Figure 4-4-3-2 (a)] Audio part
O

Circuit
-B
X
Z3

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Checking Flow

START

Check Wire state and

Soldering of
The Receiver

M
No
Change the Receiver or
Is it OK?

O
Re-solder

Yes
.C
X
No
Signal wave appears
Change the Main B’d
at the R431, 432
O

Yes
-B

Signal wave appears No • Check Points

X

at the Receiver - Main FPCB Connector

Soldering pad - Main FPCB Crack or not
Z3

Yes

Resistance between No
2 terminal of RCV Change the Speaker
is 32ohm
Yes

Change the Main B’d

63 LG Electronics Inc.
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4.3.3 MIC Trouble

Test Point
R432

MIC1+

M
R437
MIC_BIAS
MIC
C429

O
.C
X
O

[Figure 4-4-3-3] Mic part

-B

Circuit
X
Z3

64 LG Electronics Inc.
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Checking Flow

START

MIC_BIAS
No
Voltage at R437 is Change the Main B’d
1.8~1.85V ?

M
Yes

O
No
.C
MIC1+ output appears
Change Mic Module
at the pin #1 of MIC
X
Yes
O
-B

No
The EAR_SENSE/
Change the Main B’d
Level is Low
X

Yes
Z3

The Ear-Jack No
Refer to the Ear-Jack Part
is OK

Yes

Change the Main B’d

65 LG Electronics Inc.
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4.3.4 Ear-Jack Trouble

Test Point
R432

HPH_OUT_R

C432
EAR_MIC CON400
EAR-JACK

R417
R415

C431

M
EAR_SENSE/

HPH_OUT_L

O
.C
[Figure 4-4-3-4] Mic part
X
O

Circuit
-B
X
Z3

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Checking Flow

START

Insert an Ear-Mic into

the Ear-Jack

M
EAR_MIC No
Level at R437 is Check the PMIC Part
2.6V ?

O
Yes .C
X
No Check the soldering state of
EAR_SENSE/
the Ear-Jack or
Level is Low
Change the Ear-MIC
O

Yes
-B

Check the output No

X

at C431 & C432. Change the Main B’d

Is it OK?
Z3

Yes

Check Ear-MIC by No
Another Phone. Change the Ear-MIC
Is it OK?

Yes

Change the Main B’d

67 LG Electronics Inc.
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AX300

4.4 Vibrator Trouble

Test Point

Receiver
Q301 Speaker Vibrator

Pin #3

Q300

M
[Fig 4-4-4 (b)] Upper Folder

O
Pin #2
.C
MOTOR_EN
(Pin #2)
[Figure 4-4-4 (a)] Vibrator part
X
Circuit
O
-B
X

Pin #2
Z3

Pin #3

MOTOR_EN
(Pin #2)

68 LG Electronics Inc.
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AX300

Checking Flow

START

Check Wire state and

Soldering of
The Vibrator

M
No Change the Vibratorr or
Is it OK?
Re-solder

O
Yes .C
Set up Manner Mode
(Vibrator Activate)
X
O

Voltage at Pin #2 of No
-B

Change the Main B’d

Q300 is High?

Yes
X
Z3

No
Voltage at Pin #2 of
Change Q301
Q301 is 3.1~4.1V?

Yes

No
Voltage at Pin #3 of
Change Q301
Q301 is 2.4~3.4V

Yes

Change the Vibrator

69 LG Electronics Inc.
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4.5 USB Trouble

Test Point

USB_D+

USB_D-

R439
R442
R433

M
CON403
(Micro USB Con.)

O
U402
USB_POWER .C +5V

[Figure 4-4-5] USB part

X
Circuit
O
-B
X
Z3

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Checking Flow

START

No • Check the connection of USB Cable

The USB POWER at R433
• Check Input & Output Voltage of the
is 5V
OVP (U402)

Yes

M
No

O
The output appears
Change The Main B’d
at R439, R442 .C
Yes
X
• Change the USB Cable
• Check USB Port
• Check Soldering of the Micro USB
O

Connector (CON403)
-B
X
Z3

71 LG Electronics Inc.
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 U105 F105 U105
PAM K5E1H12ACM-D075
U103/U104 AWT6321RTx RF SAW
Coupler B9314
512Mb DDR
Dual Mode Ant. 1Gb NAND
U100

Tx
Rx
GPS Ant.
DP100
Quintplexer

M
Mobile S/W
KMS-518
ACFM-7102
U115 U101
Mobile S/W ALM-1412

O Charge U302
KMS-518
.C Pump SC624
Chapter 5. Drawing & Part Lists

X
Chapter 5. Drawing & Part Lists

72
VGA
-B CMOS
X
1. Block Diagram
Z3

LG Electronics Inc.
AX300

72
AX300

2. Circuit Drawing
2.1 Main PCB

M
O
.C
X
O
-B
X
Z3

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AX300

M
O
.C
X
O
-B
X
Z3

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AX300

M
O
.C
X
O
-B
X
Z3

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AX300

M
O
.C
X
O
-B
X
Z3

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AX300

M
O
.C
X
O
-B
X
Z3

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AX300

2.2 F-PCB

M
O
.C
X
O
-B
X
Z3

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3. PCB Layout
3.1 Main PCB

3.1.1 Top Side

M
O
.C
X
O
-B
X
Z3

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AX300

3.1.2 Bottom Side

M
O
.C
X
O
-B
X
Z3

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3.2 F-PCB

M
O
.C
X
O
-B
X
Z3

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4. Part Lists
4.1 Main PCB Top
No Maker P/N Ref No Q'ty Part Name Part Number Spec
100
C1005C0G1H1 C312, C402, C404, C405,
1 7 CAP,CHIP,MAKER ECZH0000813 pF,50V ,J ,NP0 ,TC ,1005 ,R/T
01JT C406, C407, C408
P
QFN ,4 PIN,R/TP ,1.8X1.2X0.5
2 EM-0781-T5 U301 1 IC EUSY0313401 size wide input voltage Hall
Switch

5.5 V,+-30 ,SMD ,1005, 100

3 EVLC5S02100 R306 1 VARISTOR SEVY0005202
pF, Pb free
0.1
GRM36X7R10
4 C309, C521 2 CAP,CHIP,MAKER ECZH0003103 uF,10V ,K ,X7R ,HD ,1005 ,R/T
4K10PT
P
ICVS0518150F R416, R420, R421, R422,
5 5 VARISTOR SEVY0005401 18 V, ,SMD ,15pF,1005
R R423

M
LED300, LED301, LED306,
LED307, LED308, LED309,
LED310, LED311,
6 LEBB-S14E LED312 ,LED313, LED314, 18 DIODE,LED,CHIP EDLH0004501 BLUE ,1608 ,R/TP ,
LED315, LED316, LED317,

O
LED318, LED319, LED320,
LED321 .C
R402, R403, R404, R405,
MCR01MZSJ1
7 R406, R408, R410, R411, 10 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
01
R412, R453
X
R305, R307, R313, R315,
R318, R319, R320, R321,
MCR01MZSJ4
8 R322, R323, R324, R325, 18 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
71
R326, R330, R331, R332,
O

R333, R334
-B

4.2 Main PCB Bottom

X

No Maker P/N Ref No Q'ty Part Name Part Number Spec

MCH155A080 CAP,CERAMIC,CHI
1 C147 1 ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP
DK P
Z3

MCH155A100 CAP,CERAMIC,CHI 10
2 C106, C145 2 ECCH0000110
D P pF,50V,D,NP0,TC,1005,R/TP
MCH155C150 C501, C502, C503, C519, CAP,CERAMIC,CHI 15
3 5 ECCH0000112
J C520 P pF,50V,J,NP0,TC,1005,R/TP
MCH155A180 CAP,CERAMIC,CHI 18
4 C166 1 ECCH0000113
J P pF,50V,J,NP0,TC,1005,R/TP
MCH155C270 C293, C294, C430, C516, CAP,CERAMIC,CHI 27
5 5 ECCH0000117
J C517 P pF,50V,J,NP0,TC,1005,R/TP
MCH155A390 CAP,CERAMIC,CHI 39
6 C105 1 ECCH0000120
J P pF,50V,J,NP0,TC,1005,R/TP
MCH155A470 CAP,CERAMIC,CHI 47
7 C133, C143, C144, C427 4 ECCH0000122
JK P pF,50V,J,NP0,TC,1005,R/TP
MCH155A820 CAP,CERAMIC,CHI 82
8 C115, C116 2 ECCH0000127
J P pF,50V,J,NP0,TC,1005,R/TP
C128, C140, C154, C156,
MCH155CN10 CAP,CERAMIC,CHI
9 C226, C232, C285, C325, 10 ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
2KK P
C420, C423

MCH155CN33 CAP,CERAMIC,CHI 3.3

10 C213 1 ECCH0000149
2KK P nF,50V,K,X7R,HD,1005,R/TP

MCH152CN47 CAP,CERAMIC,CHI 4.7

11 C200, C207 2 ECCH0000151
2KK P nF,25V,K,X7R,HD,1005,R/TP

MCH153CN10 C134, C136, C138, C323, CAP,CERAMIC,CHI 10

12 5 ECCH0000155
3KK C425 P nF,16V,K,X7R,HD,1005,R/TP

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MCH153CN33 CAP,CERAMIC,CHI 33
13 C130, C308, C311 3 ECCH0000161
3KK P nF,16V,K,X7R,HD,1005,R/TP

C1005X5R473 CAP,CERAMIC,CHI 47
14 C155 1 ECCH0000163
KDT P nF,10V,K,X5R,HD,1005,R/TP
2.7
1005,50V,2.7P CAP,CERAMIC,CHI
15 C111 1 ECCH0000175 pF,50V ,B ,NP0 ,TC ,1005 ,R/T
F,B P
P
22
GRM36X5R22 CAP,CERAMIC,CHI
16 C317 1 ECCH0000179 nF,16V ,K ,X5R ,HD ,1005 ,R/T
3K16PT P
P
C204, C211, C271, C277, 2.2
CL05A225MQ CAP,CERAMIC,CHI
17 C278, C282, C283, C284, 9 ECCH0000198 uF,6.3V ,M ,X5R ,TC ,1005 ,R/T
5NNNC P
C286 P
6.8
C1005COG1H CAP,CERAMIC,CHI
18 C103, C126 2 ECCH0001001 pF,50V ,C ,NP0 ,TC ,1005 ,R/T
6R8DT P
P

C212, C216, C218, C230,

C234, C237, C238, C240,
C243, C246, C250, C252,
1
GRM155R60J C256, C258, C260, C261, CAP,CERAMIC,CHI
19 29 ECCH0004904 uF,6.3V ,K ,X5R ,TC ,1005 ,R/T
105KE19D C262, C265, C268, C270, P
P
C287, C288, C289, C313,
C314, C315, C318, C319,
C320

M
2.2
GRM39X5R22 C148, C150, C153, C316, CAP,CERAMIC,CHI
20 7 ECCH0005603 uF,10V ,K ,X5R ,TC ,1608 ,R/T
5K10 C322, C421, C422 P
P

O
10
GRM188R60J CAP,CERAMIC,CHI
21 C247C276C291 3 ECCH0005604 uF,6.3V ,M ,X5R ,TC ,1608 ,R/T
106ME47D P
P

22
C1608X5R0J4
75KT
C127, C209, C229, C236,
C279, C280, C281, C290
8
.C
CAP,CERAMIC,CHI
P
ECCH0006201
4.7
uF,6.3V ,K ,X5R ,TC ,1608 ,R/T
P
251M1002336 33
23 C426 1 CAP,TANTAL,CHIP ECTH0005704
MR3S uF,10V ,M ,L_ESR ,2012 ,R/TP
X
251M1002106 10
24 C401 1 CAP,TANTAL,CHIP ECTH0005707
MRM uF,10V ,M ,L_ESR ,1608 ,R/TP
O

278M6301226 22
25 C416, C431, C432 3 CAP,TANTAL,CHIP ECTH0005801
MR uF,6.3V ,M ,L_ESR ,2012 ,R/TP
220
C1005C0G1C
-B

26 C224 1 CAP,CHIP,MAKER ECZH0000801 pF,16V ,J ,NP0 ,TC ,1005 ,R/T

221JT
P
1
C1005C0G1H
27 C100, C157 2 CAP,CHIP,MAKER ECZH0000802 pF,50V ,C ,NP0 ,TC ,1005 ,R/T
010CT
P
X

C107, C110, C121, C137, 100

C1005C0G1H
28 C141, C146, C162, C167, 11 CAP,CHIP,MAKER ECZH0000813 pF,50V ,J ,NP0 ,TC ,1005 ,R/T
101JT
C168, C169, C428 P
Z3

12
C1005C0G1H
29 C124 1 CAP,CHIP,MAKER ECZH0000816 pF,50V ,J ,NP0 ,TC ,1005 ,R/T
120JT
P
1.5
C1005C0G1H
30 C123, C160 2 CAP,CHIP,MAKER ECZH0000822 pF,50V ,C ,NP0 ,TC ,1005 ,R/T
1R5CT
P
20
C1005C0G1H
31 C163 1 CAP,CHIP,MAKER ECZH0000824 pF,50V ,J ,NP0 ,TC ,1005 ,R/T
200JT
P
C104, C109, C113, C114, 33
C1005C0G1H
32 C125, C227, C321, C500, 11 CAP,CHIP,MAKER ECZH0000830 pF,50V ,J ,NP0 ,TC ,1005 ,R/T
330JT
C504, C510, C523 P
56
C1005C0G1H
33 C142 1 CAP,CHIP,MAKER ECZH0000841 pF,50V ,J ,NP0 ,TC ,1005 ,R/T
560JT
P
68
C1005C0G1H
34 C132 1 CAP,CHIP,MAKER ECZH0000844 pF,50V ,J ,NP0 ,TC ,1005 ,R/T
680JT
P
200
C1005C0G1H
35 C120 1 CAP,CHIP,MAKER ECZH0000849 pF,50V ,J ,NP0 ,TC ,1005 ,R/T
201JT
P
0.5
C1005CH1H0
36 C108, C122 2 CAP,CHIP,MAKER ECZH0001002 pF,50V ,B ,NP0 ,TC ,1005 ,R/T
R5BB
P
470
C1005X7R1H
37 C152 1 CAP,CHIP,MAKER ECZH0001121 pF,50V ,K ,X7R ,HD ,1005 ,R/T
471KT
P

83 LG Electronics Inc.
83
AX300

1
C1608X5R1A1
38 C424 1 CAP,CHIP,MAKER ECZH0001420 uF,10V ,K ,X5R ,HD ,1608 ,R/T
05KT
P

C119, C129, C149, C151,

C202, C205, C206, C208,
C215, C217, C220, C221,
C222, C223, C225, C228,
C233, C235, C239, C241,
0.1
GRM36X7R10 C242, C244, C245, C248,
39 45 CAP,CHIP,MAKER ECZH0003103 uF,10V ,K ,X7R ,HD ,1005 ,R/T
4K10PT C249, C251, C254, C255,
P
C259, C263, C266, C273,
C274, C275, C296, C297,
C300, C400, C429, C511,
C512, C513, C514, C515,
C518

68
GRM36X7R68
40 C203, C310 2 CAP,CHIP,MAKER ECZH0003124 nF,16V ,K ,X7R ,HD ,1005 ,R/T
3K16PT
P
82000
GRM36X7R82
41 C201 1 CAP,CHIP,MAKER ECZH0003125 pF,16V ,K ,X7R ,HD ,1005 ,R/T
3K16
P
ESC ,30 V,100
42 KDS114E D300 1 DIODE,SWITCHING EDSY0010501
mA,R/TP ,SWITCH DIODE

M
SOD-123 ,40 V,1
43 SDB1040 D200 1 DIODE,SWITCHING EDSY0017701 A,R/TP , ,; , , , , , , ,[empty] ,[em
pty] ,2P ,1
44 SD12T1G D401 1 DIODE,TVS EDTY0007401 SMD ,12 V,350 W,R/TP ,

O
LQG18HN4N7 4.7 nH,S ,1608 ,R/TP ,COIL
45 L122 1 INDUCTOR,CHIP ELCH0003812
S00 TYPE
1005GC2T12
46
NJ00
L130 1
.C
INDUCTOR,CHIP ELCH0004701 12 nH,J ,1005 ,R/TP ,

1005GC2T4N C131, L113, L114, L123,

47 6 INDUCTOR,CHIP ELCH0004704 4.7 nH,S ,1005 ,R/TP ,
7S00 L129, L136
1005GC2T8N
X
48 L102 1 INDUCTOR,CHIP ELCH0004705 8.2 nH,J ,1005 ,R/TP ,
2J00
1005GC2T2N
49 L103 1 INDUCTOR,CHIP ELCH0004708 2.7 nH,S ,1005 ,R/TP ,
7S00
O

1005GC2T3N
50 L131 1 INDUCTOR,CHIP ELCH0004709 3.3 nH,S ,1005 ,R/TP ,
3S00
1005GC2T15
51 L105 1 INDUCTOR,CHIP ELCH0004710 15 nH,J ,1005 ,R/TP ,
NJ00
-B

1005GC2T3N
52 L112 1 INDUCTOR,CHIP ELCH0004712 3.9 nH,S ,1005 ,R/TP ,
9S00
1005GC2T6N
53 L108 1 INDUCTOR,CHIP ELCH0004713 6.8 nH,J ,1005 ,R/TP ,
8J00
1005GC2T39
54 C101, L104 2 INDUCTOR,CHIP ELCH0004716 39 nH,J ,1005 ,R/TP ,
X

NJ00
1005GC2T82
55 L125 1 INDUCTOR,CHIP ELCH0004717 82 nH,J ,1005 ,R/TP ,
NJ00
Z3

1005GC2T1N
56 C117 1 INDUCTOR,CHIP ELCH0004720 1.2 nH,S ,1005 ,R/TP ,
2S00
1005GC2T2N
57 L115 1 INDUCTOR,CHIP ELCH0004721 2.2 nH,S ,1005 ,R/TP ,
2S00
1005GC2T47
58 L135 1 INDUCTOR,CHIP ELCH0004722 47 nH,J ,1005 ,R/TP ,
NJ00
1005GC2T1N
59 L100, L116, L117, L134 4 INDUCTOR,CHIP ELCH0004723 1.8 nH,S ,1005 ,R/TP ,
8S00
1005GC2T1N
60 C164 1 INDUCTOR,CHIP ELCH0004726 1.5 nH,J ,1005 ,R/TP ,
5S00
1005GC2TR1
61 L101 1 INDUCTOR,CHIP ELCH0004727 100 nH,J ,1005 ,R/TP ,
0J00
MIP2520D4R7 INDUCTOR,SMD,P
62 L201, L202 2 ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
M OWER
MIP2520D2R2 INDUCTOR,SMD,P
63 L200 1 ELCP0008002 2.2 uH,M ,2.5*2.0*1.0 ,R/TP ,
M OWER
64 PIN,
CONNECTOR,BOA mm,STRAIGHT , , ,; , ,0.40MM ,
64 AXT664124 CON600 1 ENBY0042201
RD TO BOARD STRAIGHT ,MALE ,SMD ,P/TR
,,
7000-2.5G-SB CONN,JACK/PLUG,
65 CON400 1 ENJE0003101 4 , PIN,
1 EARPHONE
5 PIN,0.4
mm,STRAIGHT , , ,; , ,0.30MM ,
66 AXJ53314 CON403 1 CONNECTOR,I/O ENRY0007201
STRAIGHT ,[empty] ,[empty] ,[e
mpty] ,

84 LG Electronics Inc.
84
 AX300

,SMD ,
dB,H=1.85 ,; ,3.00MM ,STRAIG
67 KMS-518 U100, U115 2 CONN,RF SWITCH ENWY0005301
HT ,RF
ADAPTER ,SMD ,R/TP ,AU , ,
ESM ,100 mW,R/TP ,NPN
68 KRC402E Q300 1 TR,BJT,NPN EQBN0012401
TRANSISTOR
69 KTN2907AU Q301 1 TR,BJT,PNP EQBP0004102 USM ,100 mW,R/TP ,
TSMT6 ,0.5
70 QST4 Q400 1 TR,BJT,PNP EQBP0009901 W,R/TP ,Vceo=-12V, Ic=-3A,
hFE=270~680
NTHS5441T1 TR,FET,P-CHANNE chipFET ,1.3 W,-20 V,3.9
71 U401 1 EQFP0006301
G L A,R/TP ,8 PIN (Pb-free)

MCR01MZSF1 1000
72 R106 1 RES,CHIP ERHY0003201
001 ohm,1/16W ,F ,1005 ,R/TP
MCR01MZSJ1
73 R110, R123, R409, R506 4 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
01
MCR01MZSF1
74 R206 1 RES,CHIP,MAKER ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP
0R0
MCR01MZSF1
75 R209 1 RES,CHIP,MAKER ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP
202
MCR01MZSF1 120
76 R314 1 RES,CHIP,MAKER ERHZ0000213
203 Kohm,1/16W ,F ,1005 ,R/TP

MCR01MZSF1 150
77 R113, R449 2 RES,CHIP,MAKER ERHZ0000222
503 Kohm,1/16W ,F ,1005 ,R/TP

M
MCR01MZSF2 2000
78 R109 1 RES,CHIP,MAKER ERHZ0000236
001 ohm,1/16W ,F ,1005 ,R/TP

MCR01MZSF2 200

O
79 R435 1 RES,CHIP,MAKER ERHZ0000238
003 Kohm,1/16W ,F ,1005 ,R/TP

MCR01MZSF3 39.2
80 R312, R450 2 RES,CHIP,MAKER ERHZ0000281
922 Kohm,1/16W ,F ,1005 ,R/TP
.C
MCR01MZSF4 470
81 R316 1 RES,CHIP,MAKER ERHZ0000288
703 Kohm,1/16W ,F ,1005 ,R/TP
MCR01MZSF4
82 R107, R128 2 RES,CHIP,MAKER ERHZ0000291 49.9 ohm,1/16W ,F ,1005 ,R/TP
X
9R9
MCR01MZSF5
83 R202 1 RES,CHIP,MAKER ERHZ0000293 510 ohm,1/16W ,F ,1005 ,R/TP
100
O

MCR01MZSF5 5100
84 R204, R210 2 RES,CHIP,MAKER ERHZ0000294
101 ohm,1/16W ,F ,1005 ,R/TP
MCR01MZSF5
85 R200 1 RES,CHIP,MAKER ERHZ0000298 560 ohm,1/16W ,F ,1005 ,R/TP
600
-B

MCR01MZSF5 560
86 R311 1 RES,CHIP,MAKER ERHZ0000301
603 Kohm,1/16W ,F ,1005 ,R/TP
MCR01MZSJ1
87 R103, R228 2 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
00
X

MCR01MZSJ1
88 R401 1 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
02
MCR01MZSJ1
89 R236, R301 2 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
03
Z3

MCR01MZSJ1 100
90 R119, R303, R329, R443 4 RES,CHIP,MAKER ERHZ0000406
04 Kohm,1/16W ,J ,1005 ,R/TP
MCR01MZSJ1
91 R104 1 RES,CHIP,MAKER ERHZ0000410 12 ohm,1/16W ,J ,1005 ,R/TP
20
MCR01MZSJ1 R500, R501, R502, R503,
92 7 RES,CHIP,MAKER ERHZ0000411 120 ohm,1/16W ,J ,1005 ,R/TP
21 R504, R507, R508
MCR01MZSJ1
93 R127 1 RES,CHIP,MAKER ERHZ0000428 18 ohm,1/16W ,J ,1005 ,R/TP
80
MCR01MZSJ2 R232, R233, R327, R407, 2200
94 5 RES,CHIP,MAKER ERHZ0000443
22 R437 ohm,1/16W ,J ,1005 ,R/TP
MCR01MZSJ2
95 R213 1 RES,CHIP,MAKER ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP
R2
MCR01MZSJ3
96 R125, R126 2 RES,CHIP,MAKER ERHZ0000458 300 ohm,1/16W ,J ,1005 ,R/TP
01
MCR01MZSJ3
97 R304 1 RES,CHIP,MAKER ERHZ0000472 36 Kohm,1/16W ,J ,1005 ,R/TP
63
MCR01MZSJ4 4700
98 R223 1 RES,CHIP,MAKER ERHZ0000485
72 ohm,1/16W ,J ,1005 ,R/TP
MCR01MZSJ4
99 R308 1 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
73
MCR01MZSJ4
100 R207, R328 2 RES,CHIP,MAKER ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP
R7
MCR01MZSJ5
101 R108, R120 2 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
10
102 MCR01MZSJ5 R430 1 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

85 LG Electronics Inc.
85
 AX300

13
MCR01MZSJ5 5600
103 R445 1 RES,CHIP,MAKER ERHZ0000499
62 ohm,1/16W ,J ,1005 ,R/TP
MCR01MZSJ8
104 R122, R124 2 RES,CHIP,MAKER ERHZ0000512 82 ohm,1/16W ,J ,1005 ,R/TP
20
MCR03EZHJ0
105 R424 1 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP
00
0.1
MCR10EZHFL
106 R425 1 RES,CHIP,MAKER ERHZ0003901 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1
R100
,1% ,1/4W ,2012 ,R/TP
MCR01MZSF1 121000
107 R220 1 RES,CHIP,MAKER ERHZ0004201
213 ohm,1/16W ,F ,1005 ,R/TP

SSOP5-P-0.65A ,5
108 TC7SH04FU Q100 1 IC EUSY0073401
PIN,R/TP ,INVERTER, Pb Free

SSOP ,5
109 TC7SZ04FU U400 1 IC EUSY0140902
PIN,R/TP ,Inverter(2x2.1)

HVSOF5 ,5 PIN,R/TP ,150mA

BH28FB1WHF
110 U303 1 IC EUSY0223002 CMOS LDO WITH OUTPUT
V
CONTROL / 2.8V

QFN ,20
111 SC624ULTRT U302 1 IC EUSY0263105 PIN,R/TP ,SUB-PMIC4Ch+2LD
O ,; ,IC,Charge Pump

M
BCM2045SB2 FBGA ,65 PIN,R/TP ,Bluetooth
112 U108 1 IC EUSY0300201
KFBG Single chip(5x5x1.2)

Micropak ,6 PIN,R/TP ,OR

113 NC7SZ32L6X U304 1 IC EUSY0300601
Gate, Pb Free

O
NUS3065MUT
114 U402 1 IC EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP
AG

FBGA ,107 PIN,ETC ,FULLY

115
K5E1H12ACM
U305 1
.C
IC EUSY0335803
1.8V 1G(LB/64Mx16)
-D075 NAND+512M(DDR/8Mx4x16)
SDRAM ,; ,IC,MCP
X
CSP ,424 PIN,R/TP ,CDMA 1X
116 QSC6055 U200 1 IC EUSY0336201
Onechip BB, BB/RF/PM

19.2 MHz,1.5 PPM,10

O

pF,SMD ,3.2*2.5*1.2 , ,; ,19.2

117 ERF3003E U106 1 VCTCXO EXSK0004802
Mhz ,1.5PPM ,2.8V ,3.2 ,2.5 ,1.
2 , ,SMD ,P/TP
-B

.032768 MHz,20 PPM,7

MC-146(7PF,+
118 U201 1 X-TAL EXXY0004601 pF,65000
/-20PPM)
ohm,SMD ,6.9*1.4*1.3 ,
X

-22 dB,-0.2 dB,-37

CP0402A0836 COUPLER,RF
119 U103 1 SCDY0003401 dB,1.0*0.58*0.35 ,SMD ,824M
BNTR DIRECTIONAL
~ 849M, 4pin, Pb Free
Z3

-20 dB,-0.25 dB,-35

CP0402A1880 COUPLER,RF
120 U104 1 SCDY0003402 dB,1.0*0.58*0.35 ,SMD ,1850M
ENTR DIRECTIONAL
~ 1910M, 4pin, Pb Free

NCP18WD683
121 R317 1 THERMISTOR SETY0001401 NTC ,68 Kohm,SMD ,
E03RB
ICVL0505600
122 R505 1 VARISTOR SEVY0003602 5.6 V, ,SMD ,1005, 60pF
V150FR
EVLC18S0201
123 R438, R439, R442 3 VARISTOR SEVY0003801 18 V, ,SMD ,
5
124 EVL5M02200 R415, R417, R451, R452 4 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005
5.5 V,+-30 ,SMD ,1005, 100 pF,
125 EVLC5S02100 R414, R444, R448 3 VARISTOR SEVY0005202
Pb free
HB-1M1005-6
126 L124 1 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,
01JT
MPZ1608S221
127 L203, L204 2 FILTER,BEAD,CHIP SFBH0009201 220 ohm,1608 ,
A
2450
LFB212G45S
128 F101 1 FILTER,CERAMIC SFCY0000901 MHz,2.00*1.25*0.95 ,SMD ,Blu
G8A166
etooth Band Pass Filter
EVRC14S03Q F500, F501, F502, F503, FILTER,EMI/POWE SMD ,1608 ,EMI-ESD Filter,
129 7 SFEY0013201
030100R F504, F505, F506 R 4ch, 14V, 15pF, 100ohm

NFM18PC104 FILTER,EMI/POWE SMD ,Pb-free_Bais ,; ,Filter,LC

130 L400 1 SFEY0015301
R1C3 R R

86 LG Electronics Inc.
86
 AX300

836.5 MHz,25 MHz,2.2 dB,40

dB,1880 MHz,58.75 MHz,4
dB,30
dB,2.0*1.6*0.68 ,SMD ,824M~8
131 B9314 F105 1 FILTER,SAW,DUAL SFSB0001601
49M,1850.625M~1909.375M,10
p,B,50,50,DCN+USPCS
Tx,BIDIR ,; ,836.5,
1880 ,2.0*1.6*0.68 ,SMD ,R/TP

1575.42
MHz,2.0*1.4*0.68 ,SMD ,1574.4
2M~1576.42M, IL 1.1, 5pin,
132 B7839 F106 1 FILTER,SAW SFSY0028801
U-U, 50-50, GPS
BPF , ,1575.42 ,2.0*1.4*0.68 ,S
MD ,R/TP
881.5
MHz,1.4*1.1*0.4 ,SMD ,869M~
894M, IL 2.5, 5pin, U-B,
133 B9432 F104 1 FILTER,SAW SFSY0034801
50-100, DCN
Rx ,; ,881.5 ,1.4*1.1*0.4 ,SMD ,
R/TP
1960
MHz,1.4*1.1*0.45 ,SMD ,1930.6
M~1989.4M, IL 3.5, 5pin, U-B,
134 B9419 F100 1 FILTER,SAW SFSY0034901
50-100_30, USPCS
Rx ,; ,1960 ,1.4*1.1*0.45 ,SMD

M
,R/TP
28 dBm,39 %, A, dBc,
dB,3x5x1 ,SMD ,HELP3 Dual
135 AWT6321R U105 1 PAM SMPY0015801
PAM ,; , , , , , , , ,R/TP ,R/TP ,1

O
4

CDMA+US-PCS+S-GPS,
136 ACFM-7102 DP100 1 MODULE,ETC SMZY0014701
8.0*5.0*1.3
.C
LNA Module(GPS LNA+B/P
137 ALM-1412 U101 1 MODULE,ETC SMZY0016501
Filter) ,: ,RF Module
X
UNIT ,-38 dB,4.72*3.76 ,1.25T
SPM0204LE5-
138 M402 1 MICROPHONE SUMY0010604 Bottom Silicon
QB
O

type ,; , , ,UNI ,1.5V , ,SMD

-B
X
Z3

87 LG Electronics Inc.
87
AX300

4.3 Full BOM List

NO Lv Ref No Part Name Part Number QTY Spec Maker P/N

1 1 PRODUCT(FOLDER) TPFA0087901 1
2 2 AAAY00 ADDITION AAAY0248401 1
MANUAL
3 3 AMBA AMBA0110501 1 LG300 Manual Assy AMBA0110501
ASSY,OPERATION
4 4 MMBB00 MANUAL,OPERATION MMBB0272301 1 PRINTING, (empty), , , , , MMBB0272301
5 4 MSAB00 SHEET,OPERATING MSAB0022401 1 PRINTING, (empty), , , , , MSAB0022401
6 4 MSAB01 SHEET,OPERATING MSAB0022501 1 PRINTING, (empty), , , , , MSAB0022501

7 3 MCJA00 COVER,BATTERY MCJA0051202 1 MOLD, PC LUPOY SC-1004A, , , , , MCJA0051201

8 4 MTAB00 TAPE,PROTECTION MTAB0237501 1 COMPLEX, (empty), , , , , MTAB0237501

3.7 V,850 mAh,1

CELL,PRISMATIC ,ABCD PJT
(AX275) Batt, IP, Whitout ID Chip,
9 3 SBPL00 BATTERY PACK,LI-ION SBPL0086301 1 TCD-AX275
Pb-Free ,; ,3.7 ,850 ,0.2C ,PRISMAT
IC ,46x34x46 , ,ALLTEL
SILVER ,Innerpack ,America Label

100-240V ,5060 Hz,5.1 V,.7

11 3 SSAD00 ADAPTOR,AC-DC SSAD0027601 1 A,UL ,Micro USB B STA-U32WD

M
type ,; , , , , , ,WALL 2P ,USB ,
14 2 APAY00 PACKAGE APAY0062513 1 LG300_TR1
15 3 APLY00 PALLET ASSY APLY0001404 1 TR1 BPT North American STD.
16 4 MCJZ00 COVER MCJZ0030601 .004 1150*1000*105_TDR_VZW

O
17 4 MPBZ00 PAD MPBZ0036802 .008 Angle_TDR_VZW
18 4 MPCY00 PALLET MPCY0005201 .002 1000x1200x120 Verizon Export
19 4 MSCY00 SLEEVE MSCY0001001 .002 Deadspace Keeping Off_TDR_RLC
20 3 MBAD00 BAG,VINYL(PE) MBAD0005201
.C1 COMPLEX, (empty), , , , , MBAD0005201
21 3 MBEE00 BOX,MASTER MBEE0051801 .1 BOX, TW, , , , ,
BOX, SW, 1.6, 131, 160, 65, 5
22 3 MBEF00 BOX,UNIT MBEF0096945 1
X
COLOR
UNIT BOX BARCODE
23 3 MLAC00 LABEL,BARCODE MLAC0004502 1
LABEL(105*45)
O

24 3 MLAC001 LABEL,BARCODE MLAC0002010 .008 Reliance New Pallet Label

25 3 MLAJ002 LABEL,MASTER BOX MLAJ0004304 .1 GSM/CDMA ALL 180*95 MLAJ0004304
26 3 MLAJ004 LABEL,MASTER BOX MLAJ0004201 .004 New_TDR_Shipping Label
-B

27 3 MPAD00 PACKING,SHELL MPAD0005804 1 PRINTING, (empty), , , , ,

28 2 APEY00 PHONE APEY0462701 1
29 3 ACGG00 COVER ASSY,FOLDER ACGG0085402 1 ACGG0085401
COVER
30 4 ACGH00 ACGH0050602 1 ACGH0050601
ASSY,FOLDER(LOWER)
X

31 5 MBFF00 BRACKET,LCD MBFF0015501 1 COMPLEX, (empty), , , , , MBFF0015501

32 5 MCIB00 MCIB CONTACT,HINGE MCIB0000701 1 PRESS, BeCu, 0.15, , , , MCIB0000701
33 5 MCJH00 COVER,FOLDER(LOWER) MCJH0040902 1 MCJH0040901
Z3

34 5 MFBB00 FILTER,RECEIVER MFBB0023801 1 COMPLEX, (empty), 0.7, , , , MFBB0023801

35 5 MMAA00 MAGNET,SWITCH MMAA0008201 1 COMPLEX, (empty), , , , , MMAA0008201
36 5 MPBJ00 PAD,MOTOR MPBJ0047901 1 COMPLEX, (empty), , , , , MPBJ0047901
37 5 MPBN00 PAD,SPEAKER MPBN0052201 1 COMPLEX, (empty), , , , , MPBN0052201
38 5 MTAB00 TAPE,PROTECTION MTAB0232401 1 COMPLEX, (empty), , , , , MTAB0232401
39 5 MTAK00 TAPE,CAMERA MTAK0004101 1 COMPLEX, (empty), , , , , MTAK0004101
COVER
40 4 ACGJ00 ACGJ0066402 1 ACGJ0066401
ASSY,FOLDER(UPPER)

41 5 MCJJ00 COVER,FOLDER(UPPER) MCJJ0050102 1 MOLD, PC LUPOY SC-1004A, , , , , MCJJ0050101

42 6 MICA00 INSERT,FRONT MICA0023401 4 EXTRUSION, LDPE, , , , , MICA0023401

43 5 MFBC00 FILTER,SPEAKER MFBC0034901 1 COMPLEX, (empty), , , , , MFBC0034901
44 5 MPBG00 PAD,LCD MPBG0068301 1 COMPLEX, (empty), , , , , MPBG0068301
45 5 MPBG01 PAD,LCD MPBG0074101 1 COMPLEX, (empty), , , , , MPBG0074101
46 5 MPBJ00 PAD,MOTOR MPBJ0050601 1 COMPLEX, (empty), , , , , MPBJ0050601
47 5 MPBM00 PAD,RECEIVER MPBM0020201 1 COMPLEX, (empty), , , , , MPBM0020201
48 5 MPBT00 PAD,CAMERA MPBT0049001 1 COMPLEX, (empty), , , , , MPBT0049001
49 5 MPBU00 PAD,CONNECTOR MPBU0012401 1 COMPLEX, (empty), , , , , MPBU0012401
50 5 MPBU01 PAD,CONNECTOR MPBU0012501 1 COMPLEX, (empty), , , , , MPBU0012501
51 5 MTAB00 TAPE,PROTECTION MTAB0196701 1 COMPLEX, (empty), , , , , MTAB0196701
52 5 MTAB01 TAPE,PROTECTION MTAB0214901 1 COMPLEX, (empty), , , , , MTAB0214901
53 5 MTAE00 TAPE,WINDOW(SUB) MTAE0032601 1 COMPLEX, (empty), , , , , MTAE0032601
54 5 MWAE00 WINDOW,CAMERA MWAE0029301 1 CUTTING, PMMA MR 200, , , , , MWAE0029301

88 LG Electronics Inc.
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AX300

55 5 MWAF00 WINDOW,LCD(SUB) MWAF0038901 1 COMPLEX, (empty), , , , , MWAF0038901

56 6 BFAA00 FILM,INMOLD BFAA0077301 1.1 ;,,, BFAA0077301
57 4 ACGK00 COVER ASSY,FRONT ACGK0097002 1 ACGK0097001
58 5 MCIB00 MCIB CONTACT,HINGE MCIB0000801 1 PRESS, BeCu, 0.15, , , , MCIB0000801

59 5 MCJK00 COVER,FRONT MCJK0078602 1 MOLD, PC LUPOY SC-1004A, , , , , MCJK0078601

60 6 MICA00 INSERT,FRONT MICA0023401 4 EXTRUSION, LDPE, , , , , MICA0023401

MOLD, Urethane Rubber
61 5 MSGB00 STOPPER,HINGE MSGB0022702 1 MSGB0022701
S190A, , , , ,
MOLD, Urethane Rubber
62 5 MSGC00 STOPPER,FOLDER MSGC0001702 1 MSGC0001701
S190A, , , , ,
63 4 AWAB00 WINDOW ASSY,LCD AWAB0030902 1 AWAB0030901
64 5 MPBG00 PAD,LCD MPBG0068201 1 COMPLEX, (empty), , , , , MPBG0068201
65 5 MTAD00 TAPE,WINDOW MTAD0076001 1 COMPLEX, (empty), , , , , MTAD0076001
66 5 MWAC00 WINDOW,LCD MWAC0086402 1 CUTTING, PMMA MR 200, , , , , MWAC0086401
1.4 mm,3
67 4 GMEY00 SCREW MACHINE,BIND GMEY0002001 4 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, GMEY0002001
HEAD d2.7
68 4 MCCH00 CAP,SCREW MCCH0114802 4 COMPLEX, (empty), , , , , MCCH0114801
69 4 MHFD00 HINGE,FOLDER MHFD0016301 1 COMPLEX, (empty), , , , , MHFD0016301
70 4 MKAG00 KEYPAD,MAIN MKAG0002802 1 COMPLEX, (empty), , , , , MKAG0002801
71 4 MLAZ00 LABEL MLAZ0038303 .1 PRINTING, (empty), , , , , MLAZ0038303
72 4 MSGB00 STOPPER,HINGE MSGB0022801 1 COMPLEX, (empty), , , , , MSGB0022801

M
73 4 MTAB00 TAPE,PROTECTION MTAB0196801 1 COMPLEX, (empty), , , , , MTAB0196801
74 4 MTAB01 TAPE,PROTECTION MTAB0216301 1 COMPLEX, (empty), , , , , MTAB0216301
75 4 MTAB02 TAPE,PROTECTION MTAB0232501 1 COMPLEX, (empty), , , , , MTAB0232501
76 4 MTAC00 TAPE,SHIELD MTAC0062701 1 COMPLEX, (empty), , , , , MTAC0062701

O
77 4 MTAC01 TAPE,SHIELD MTAC0062801 1 COMPLEX, (empty), , , , , MTAC0062801
78 4 SACY00 PCB ASSY,FLEXIBLE SACY0072001 1
PCB
79 5 SACB00 SACB0044301 1
ASSY,FLEXIBLE,INSERT
.C
80 6 MPBF00 PAD,FLEXIBLE PCB MPBF0030801 1 COMPLEX, (empty), , , , , MPBF0030801
81 5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0067001 1 SACE0050701
PCB ASSY,FLEXIBLE,SMT
82 6 SACC00 SACC0044401 1
X
BOTTOM
C1005C0G1H33
83 7 C602 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
O

64 PIN,
CONNECTOR,BOARD TO
84 7 CON600 ENBY0042101 1 mm,STRAIGHT , , ,; , ,0.40MM ,STR AXT564124
BOARD
AIGHT ,FEMALE ,SMD ,P/TR , ,
-B

CONNECTOR,BOARD TO 40 PIN,0.4 mm,ETC , ,H=0.9,

85 7 CON601 ENBY0020201 1 AXK8L40125G
BOARD Header
CONNECTOR,BOARD TO
86 7 CON602 ENBY0019501 1 20 PIN,.4 mm,ETC , ,H=1.5, Socket AXK720147G
BOARD
HB-1M1005-601J
X

87 7 L601 FILTER,BEAD,CHIP SFBH0000903 1 600 ohm,1005 ,

T
88 7 R601 RES,CHIP,MAKER ERHZ0000404 1 1 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ102
POLYI ,0.5
89 6 SPCY00 PCB,FLEXIBLE SPCY0112002 1 SPCY0112002
Z3

mm,MULTI-5 ,F-MAIN ,; , , , , , , , , ,
3 V,.08
90 4 SJMY00 VIBRATOR,MOTOR SJMY0006510 1 A,10*3.45 ,12mm ,; ,3V , , ,12500 , , WHVM-1034A10
,,
ASSY ,103 dB,32
91 4 SURY00 RECEIVER SURY0011302 1 ohm,11*3.2 ,15mm KR-1107H-02WP
HAC ,; , , , , , ,WIRE ,
ASSY ,8 ohm,90 dB,17
92 4 SUSY00 SPEAKER SUSY0023501 1 17-8D-02W1P
mm, ,; , , , , , , ,WIRE
93 4 SVCY00 CAMERA SVCY0013401 1 CMOS ,VGA ,Magna 1/7.4" CVFC-H131A
MAIN ,176*20(1.76") +
96*64(1.04") ,33.6*46.2*3.05(t) ,262
94 4 SVLM00 LCD MODULE SVLM0027701 1 LQ018B3UT03
k ,TFT ,TM ,M:S6D0164,S:S6D0151
,
95 3 ACGM00 COVER ASSY,REAR ACGM0098702 1 ACGM0098701
96 4 ENZY00 CONNECTOR,ETC ENZY0019901 1 3 PIN,3 mm,STRAIGHT , , HSBC-3P-58
97 4 MBJL00 BUTTON,SIDE MBJL0046802 1 MBJL0046801
98 4 MCCC00 CAP,EARPHONE JACK MCCC0050502 1 MCCC0050501
99 4 MCCE00 CAP,RECEPTACLE MCCE0040702 1 MCCE0040701
100 4 MCJN00 COVER,REAR MCJN0074302 1 MCJN0074301
101 4 MLAB00 LABEL,A/S MLAB0000601 1 PRINTING, (empty), , , , , MLAB0000601
102 4 MLAN00 LABEL,QUALCOMM MLAN0000603 1 White,95C
103 4 MPBU00 PAD,CONNECTOR MPBU0019901 1 COMPLEX, (empty), , , , , MPBU0019901
104 4 MTAB00 TAPE,PROTECTION MTAB0196601 1 COMPLEX, (empty), , , , , MTAB0196601

89 LG Electronics Inc.
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AX300

5 ,-6 dB,Internal,
105 4 SNMF00 ANTENNA,MOBILE,FIXED SNMF0038001 1 Dual(DCN+US_PCS), Pb ACC-00061
Free ,; ,DUAL , , ,
5 ,-5 dB,Internal,
106 4 SNMF01 ANTENNA,MOBILE,FIXED SNMF0037901 1 Dual(Bluetooth+GPS), Pb ACB-00014
Free ,; ,DUAL , , ,
1.4 mm,3
107 3 GMEY00 SCREW MACHINE,BIND GMEY0011201 4 GMEY0011201
mm,MSWR3(BK) ,N ,+ ,NYLOK
108 3 MCCH00 CAP,SCREW MCCH0118502 2 MOLD, Silicone Rubber K-770, , , , , MCCH0118501
109 3 MLAA00 LABEL,APPROVAL MLAA0002502 1 English
110 3 SAFY00 PCB ASSY,MAIN SAFY0234501 1
111 4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0077901 1
112 5 ACKA00 CAN ASSY,SHIELD ACKA0006101 1 ACKA0006101
113 6 MCBA00 CAN,SHIELD MCBA0023701 1 PRESS, STS, 0.3, , , , MCBA0023701
114 6 MPBL00 PAD,MSM MPBL0006601 1 COMPLEX, (empty), , , , , MPBL0006601
115 5 ADCA00 DOME ASSY,METAL ADCA0072501 1 ADCA0072501
116 6 MFBD00 FILTER,MIKE MFBD0026801 1 COMPLEX, (empty), , , , , MFBD0026801
117 6 MTAB00 TAPE,PROTECTION MTAB0234301 1 COMPLEX, (empty), , , , , MTAB0234301
118 5 MIDZ00 INSULATOR MIDZ0156601 1 COMPLEX, (empty), , , , , MIDZ0156601
POLYI ,0.65
119 5 SPKY00 PCB,SIDEKEY SPKY0054402 1 SPKY0054402
mm,DOUBLE ,F-SK ,; , , , , , , , , ,
120 4 SAFF00 PCB ASSY,MAIN,SMT SAFF0153401 1
121 5 MLAZ00 LABEL MLAZ0038301 1 PID Label 4 Array LG-VX6000

M
PCB ASSY,MAIN,SMT
122 5 SAFC00 SAFC0099601 1
BOTTOM
C1005C0G1H01
123 6 C100 CAP,CHIP,MAKER ECZH0000802 1 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
0CT

O
1005GC2T39NJ0
124 6 C101 INDUCTOR,CHIP ELCH0004716 1 39 nH,J ,1005 ,R/TP ,
0
C1005COG1H6R
125 6 C103 CAP,CERAMIC,CHIP ECCH0001001 1 6.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
8DT

126 6 C104 CAP,CHIP,MAKER ECZH0000830

.C
1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C1005C0G1H33
0JT
127 6 C105 CAP,CERAMIC,CHIP ECCH0000120 1 39 pF,50V,J,NP0,TC,1005,R/TP MCH155A390J
128 6 C106 CAP,CERAMIC,CHIP ECCH0000110 1 10 pF,50V,D,NP0,TC,1005,R/TP MCH155A100D
X
C1005C0G1H10
129 6 C107 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005CH1H0R5
O

130 6 C108 CAP,CHIP,MAKER ECZH0001002 1 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
BB
C1005C0G1H33
131 6 C109 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
-B

C1005C0G1H10
132 6 C110 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
1005,50V,2.7PF,
133 6 C111 CAP,CERAMIC,CHIP ECCH0000175 1 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
B
C1005C0G1H33
X

134 6 C113 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

0JT
C1005C0G1H33
135 6 C114 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
Z3

136 6 C115 CAP,CERAMIC,CHIP ECCH0000127 1 82 pF,50V,J,NP0,TC,1005,R/TP MCH155A820J

137 6 C116 CAP,CERAMIC,CHIP ECCH0000127 1 82 pF,50V,J,NP0,TC,1005,R/TP MCH155A820J
1005GC2T1N2S
138 6 C117 INDUCTOR,CHIP ELCH0004720 1 1.2 nH,S ,1005 ,R/TP ,
00
GRM36X7R104K
139 6 C119 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
C1005C0G1H20
140 6 C120 CAP,CHIP,MAKER ECZH0000849 1 200 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H10
141 6 C121 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005CH1H0R5
142 6 C122 CAP,CHIP,MAKER ECZH0001002 1 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
BB
C1005C0G1H1R
143 6 C123 CAP,CHIP,MAKER ECZH0000822 1 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
5CT
C1005C0G1H12
144 6 C124 CAP,CHIP,MAKER ECZH0000816 1 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
C1005C0G1H33
145 6 C125 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
C1005COG1H6R
146 6 C126 CAP,CERAMIC,CHIP ECCH0001001 1 6.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
8DT
4.7 C1608X5R0J475
147 6 C127 CAP,CERAMIC,CHIP ECCH0006201 1
uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP KT
MCH155CN102K
148 6 C128 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
K

90 LG Electronics Inc.
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AX300

GRM36X7R104K
149 6 C129 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
MCH153CN333K
150 6 C130 CAP,CERAMIC,CHIP ECCH0000161 1 33 nF,16V,K,X7R,HD,1005,R/TP
K
1005GC2T4N7S
151 6 C131 INDUCTOR,CHIP ELCH0004704 1 4.7 nH,S ,1005 ,R/TP ,
00
C1005C0G1H68
152 6 C132 CAP,CHIP,MAKER ECZH0000844 1 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
153 6 C133 CAP,CERAMIC,CHIP ECCH0000122 1 47 pF,50V,J,NP0,TC,1005,R/TP MCH155A470JK
MCH153CN103K
154 6 C134 CAP,CERAMIC,CHIP ECCH0000155 1 10 nF,16V,K,X7R,HD,1005,R/TP
K
MCH153CN103K
155 6 C136 CAP,CERAMIC,CHIP ECCH0000155 1 10 nF,16V,K,X7R,HD,1005,R/TP
K
C1005C0G1H10
156 6 C137 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
MCH153CN103K
157 6 C138 CAP,CERAMIC,CHIP ECCH0000155 1 10 nF,16V,K,X7R,HD,1005,R/TP
K
MCH155CN102K
158 6 C140 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
K
C1005C0G1H10
159 6 C141 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H56
160 6 C142 CAP,CHIP,MAKER ECZH0000841 1 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
161 6 C143 CAP,CERAMIC,CHIP ECCH0000122 1 47 pF,50V,J,NP0,TC,1005,R/TP MCH155A470JK
162 6 C144 CAP,CERAMIC,CHIP ECCH0000122 1 47 pF,50V,J,NP0,TC,1005,R/TP MCH155A470JK
163 6 C145 CAP,CERAMIC,CHIP ECCH0000110 1 10 pF,50V,D,NP0,TC,1005,R/TP MCH155A100D

M
C1005C0G1H10
164 6 C146 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
165 6 C147 CAP,CERAMIC,CHIP ECCH0000109 1 8 pF,50V,D,NP0,TC,1005,R/TP MCH155A080DK

O
GRM39X5R225K
166 6 C148 CAP,CERAMIC,CHIP ECCH0005603 1 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
10
GRM36X7R104K
167 6 C149 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
.C 10PT
GRM39X5R225K
168 6 C150 CAP,CERAMIC,CHIP ECCH0005603 1 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
10
GRM36X7R104K
169 6 C151 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
X
10PT
470 C1005X7R1H471
170 6 C152 CAP,CHIP,MAKER ECZH0001121 1
pF,50V ,K ,X7R ,HD ,1005 ,R/TP KT
O

GRM39X5R225K
171 6 C153 CAP,CERAMIC,CHIP ECCH0005603 1 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
10
MCH155CN102K
172 6 C154 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
K
-B

C1005X5R473K
173 6 C155 CAP,CERAMIC,CHIP ECCH0000163 1 47 nF,10V,K,X5R,HD,1005,R/TP
DT
MCH155CN102K
174 6 C156 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
K
C1005C0G1H01
X

175 6 C157 CAP,CHIP,MAKER ECZH0000802 1 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

0CT
C1005C0G1H1R
176 6 C160 CAP,CHIP,MAKER ECZH0000822 1 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
5CT
Z3

C1005C0G1H10
177 6 C162 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H20
178 6 C163 CAP,CHIP,MAKER ECZH0000824 1 20 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
1005GC2T1N5S
179 6 C164 INDUCTOR,CHIP ELCH0004726 1 1.5 nH,J ,1005 ,R/TP ,
00
180 6 C166 CAP,CERAMIC,CHIP ECCH0000113 1 18 pF,50V,J,NP0,TC,1005,R/TP MCH155A180J
C1005C0G1H10
181 6 C167 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H10
182 6 C168 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H10
183 6 C169 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
MCH152CN472K
184 6 C200 CAP,CERAMIC,CHIP ECCH0000151 1 4.7 nF,25V,K,X7R,HD,1005,R/TP
K
82000 GRM36X7R823K
185 6 C201 CAP,CHIP,MAKER ECZH0003125 1
pF,16V ,K ,X7R ,HD ,1005 ,R/TP 16
GRM36X7R104K
186 6 C202 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R683K
187 6 C203 CAP,CHIP,MAKER ECZH0003124 1 68 nF,16V ,K ,X7R ,HD ,1005 ,R/TP
16PT
2.2 CL05A225MQ5N
188 6 C204 CAP,CERAMIC,CHIP ECCH0000198 1
uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP NNC

91 LG Electronics Inc.
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AX300

GRM36X7R104K
189 6 C205 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
190 6 C206 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
MCH152CN472K
191 6 C207 CAP,CERAMIC,CHIP ECCH0000151 1 4.7 nF,25V,K,X7R,HD,1005,R/TP
K
GRM36X7R104K
192 6 C208 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
4.7 C1608X5R0J475
193 6 C209 CAP,CERAMIC,CHIP ECCH0006201 1
uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP KT
2.2 CL05A225MQ5N
194 6 C211 CAP,CERAMIC,CHIP ECCH0000198 1
uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP NNC
GRM155R60J10
195 6 C212 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
MCH155CN332K
196 6 C213 CAP,CERAMIC,CHIP ECCH0000149 1 3.3 nF,50V,K,X7R,HD,1005,R/TP
K
GRM36X7R104K
197 6 C215 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
198 6 C216 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM36X7R104K
199 6 C217 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
200 6 C218 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D

M
GRM36X7R104K
201 6 C220 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
202 6 C221 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT

O
GRM36X7R104K
203 6 C222 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT

204 6 C223 CAP,CHIP,MAKER ECZH0003103

.C
1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
GRM36X7R104K
10PT
C1005C0G1C22
205 6 C224 CAP,CHIP,MAKER ECZH0000801 1 220 pF,16V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
X
GRM36X7R104K
206 6 C225 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
MCH155CN102K
207 6 C226 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
K
O

C1005C0G1H33
208 6 C227 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
GRM36X7R104K
209 6 C228 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
-B

10PT
4.7 C1608X5R0J475
210 6 C229 CAP,CERAMIC,CHIP ECCH0006201 1
uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP KT
GRM155R60J10
211 6 C230 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
X

MCH155CN102K
212 6 C232 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
K
GRM36X7R104K
Z3

213 6 C233 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
214 6 C234 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM36X7R104K
215 6 C235 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
4.7 C1608X5R0J475
216 6 C236 CAP,CERAMIC,CHIP ECCH0006201 1
uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP KT
GRM155R60J10
217 6 C237 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM155R60J10
218 6 C238 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM36X7R104K
219 6 C239 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
220 6 C240 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM36X7R104K
221 6 C241 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
222 6 C242 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
223 6 C243 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM36X7R104K
224 6 C244 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT

92 LG Electronics Inc.
92
AX300

GRM36X7R104K
225 6 C245 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
226 6 C246 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM188R60J10
227 6 C247 CAP,CERAMIC,CHIP ECCH0005604 1 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6ME47D
GRM36X7R104K
228 6 C248 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
229 6 C249 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
230 6 C250 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM36X7R104K
231 6 C251 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
232 6 C252 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM36X7R104K
233 6 C254 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
234 6 C255 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
235 6 C256 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM155R60J10
236 6 C258 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

M
5KE19D
GRM36X7R104K
237 6 C259 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10

O
238 6 C260 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM155R60J10
239 6 C261 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D

240 6 C262 CAP,CERAMIC,CHIP ECCH0004904

.C
1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
GRM155R60J10
5KE19D
GRM36X7R104K
241 6 C263 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
X
GRM155R60J10
242 6 C265 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM36X7R104K
O

243 6 C266 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM155R60J10
244 6 C268 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
-B

GRM155R60J10
245 6 C270 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
2.2 CL05A225MQ5N
246 6 C271 CAP,CERAMIC,CHIP ECCH0000198 1
uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP NNC
X

GRM36X7R104K
247 6 C273 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
248 6 C274 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
Z3

10PT
GRM36X7R104K
249 6 C275 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM188R60J10
250 6 C276 CAP,CERAMIC,CHIP ECCH0005604 1 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6ME47D
2.2 CL05A225MQ5N
251 6 C277 CAP,CERAMIC,CHIP ECCH0000198 1
uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP NNC
2.2 CL05A225MQ5N
252 6 C278 CAP,CERAMIC,CHIP ECCH0000198 1
uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP NNC
4.7 C1608X5R0J475
253 6 C279 CAP,CERAMIC,CHIP ECCH0006201 1
uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP KT
4.7 C1608X5R0J475
254 6 C280 CAP,CERAMIC,CHIP ECCH0006201 1
uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP KT
4.7 C1608X5R0J475
255 6 C281 CAP,CERAMIC,CHIP ECCH0006201 1
uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP KT
2.2 CL05A225MQ5N
256 6 C282 CAP,CERAMIC,CHIP ECCH0000198 1
uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP NNC
2.2 CL05A225MQ5N
257 6 C283 CAP,CERAMIC,CHIP ECCH0000198 1
uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP NNC
2.2 CL05A225MQ5N
258 6 C284 CAP,CERAMIC,CHIP ECCH0000198 1
uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP NNC
MCH155CN102K
259 6 C285 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
K

93 LG Electronics Inc.
93
AX300

2.2 CL05A225MQ5N
260 6 C286 CAP,CERAMIC,CHIP ECCH0000198 1
uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP NNC
GRM155R60J10
261 6 C287 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM155R60J10
262 6 C288 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM155R60J10
263 6 C289 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
4.7 C1608X5R0J475
264 6 C290 CAP,CERAMIC,CHIP ECCH0006201 1
uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP KT
GRM188R60J10
265 6 C291 CAP,CERAMIC,CHIP ECCH0005604 1 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6ME47D
266 6 C293 CAP,CERAMIC,CHIP ECCH0000117 1 27 pF,50V,J,NP0,TC,1005,R/TP MCH155C270J
267 6 C294 CAP,CERAMIC,CHIP ECCH0000117 1 27 pF,50V,J,NP0,TC,1005,R/TP MCH155C270J
GRM36X7R104K
268 6 C296 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
269 6 C297 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
270 6 C300 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
MCH153CN333K
271 6 C308 CAP,CERAMIC,CHIP ECCH0000161 1 33 nF,16V,K,X7R,HD,1005,R/TP
K
GRM36X7R683K
272 6 C310 CAP,CHIP,MAKER ECZH0003124 1 68 nF,16V ,K ,X7R ,HD ,1005 ,R/TP
16PT

M
MCH153CN333K
273 6 C311 CAP,CERAMIC,CHIP ECCH0000161 1 33 nF,16V,K,X7R,HD,1005,R/TP
K
GRM155R60J10
274 6 C313 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D

O
GRM155R60J10
275 6 C314 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM155R60J10
276 6 C315 CAP,CERAMIC,CHIP ECCH0004904
.C
1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM39X5R225K
277 6 C316 CAP,CERAMIC,CHIP ECCH0005603 1 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
10
GRM36X5R223K
X
278 6 C317 CAP,CERAMIC,CHIP ECCH0000179 1 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
16PT
GRM155R60J10
279 6 C318 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
O

GRM155R60J10
280 6 C319 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
5KE19D
GRM155R60J10
281 6 C320 CAP,CERAMIC,CHIP ECCH0004904 1 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
-B

5KE19D
C1005C0G1H33
282 6 C321 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
GRM39X5R225K
283 6 C322 CAP,CERAMIC,CHIP ECCH0005603 1 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
10
X

MCH153CN103K
284 6 C323 CAP,CERAMIC,CHIP ECCH0000155 1 10 nF,16V,K,X7R,HD,1005,R/TP
K
MCH155CN102K
285 6 C325 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
Z3

K
GRM36X7R104K
286 6 C400 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
10
251M1002106M
287 6 C401 CAP,TANTAL,CHIP ECTH0005707 1 uF,10V ,M ,L_ESR ,1608 ,R/TP ,; , ,
RM
,,
22
278M6301226M
288 6 C416 CAP,TANTAL,CHIP ECTH0005801 1 uF,6.3V ,M ,L_ESR ,2012 ,R/TP ,; , ,
R
,,
MCH155CN102K
289 6 C420 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
K
GRM39X5R225K
290 6 C421 CAP,CERAMIC,CHIP ECCH0005603 1 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
10
GRM39X5R225K
291 6 C422 CAP,CERAMIC,CHIP ECCH0005603 1 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
10
MCH155CN102K
292 6 C423 CAP,CERAMIC,CHIP ECCH0000143 1 1 nF,50V,K,X7R,HD,1005,R/TP
K
C1608X5R1A105
293 6 C424 CAP,CHIP,MAKER ECZH0001420 1 1 uF,10V ,K ,X5R ,HD ,1608 ,R/TP
KT
MCH153CN103K
294 6 C425 CAP,CERAMIC,CHIP ECCH0000155 1 10 nF,16V,K,X7R,HD,1005,R/TP
K
33
251M1002336M
295 6 C426 CAP,TANTAL,CHIP ECTH0005704 1 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,
R3S
,,
296 6 C427 CAP,CERAMIC,CHIP ECCH0000122 1 47 pF,50V,J,NP0,TC,1005,R/TP MCH155A470JK

94 LG Electronics Inc.
94
AX300

GRM36X7R104K
297 6 C429 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
298 6 C430 CAP,CERAMIC,CHIP ECCH0000117 1 27 pF,50V,J,NP0,TC,1005,R/TP MCH155C270J
22
278M6301226M
299 6 C431 CAP,TANTAL,CHIP ECTH0005801 1 uF,6.3V ,M ,L_ESR ,2012 ,R/TP ,; , ,
R
,,
22
278M6301226M
300 6 C432 CAP,TANTAL,CHIP ECTH0005801 1 uF,6.3V ,M ,L_ESR ,2012 ,R/TP ,; , ,
R
,,
C1005C0G1H33
301 6 C500 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
302 6 C501 CAP,CERAMIC,CHIP ECCH0000112 1 15 pF,50V,J,NP0,TC,1005,R/TP MCH155C150J
303 6 C502 CAP,CERAMIC,CHIP ECCH0000112 1 15 pF,50V,J,NP0,TC,1005,R/TP MCH155C150J
304 6 C503 CAP,CERAMIC,CHIP ECCH0000112 1 15 pF,50V,J,NP0,TC,1005,R/TP MCH155C150J
C1005C0G1H33
305 6 C504 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
C1005C0G1H33
306 6 C510 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
GRM36X7R104K
307 6 C511 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
308 6 C512 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
309 6 C513 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K

M
310 6 C514 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
GRM36X7R104K
311 6 C515 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
312 6 C516 CAP,CERAMIC,CHIP ECCH0000117 1 27 pF,50V,J,NP0,TC,1005,R/TP MCH155C270J

O
313 6 C517 CAP,CERAMIC,CHIP ECCH0000117 1 27 pF,50V,J,NP0,TC,1005,R/TP MCH155C270J
GRM36X7R104K
314 6 C518 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
315 6 C519 CAP,CERAMIC,CHIP ECCH0000112
.C
1 15 pF,50V,J,NP0,TC,1005,R/TP MCH155C150J
316 6 C520 CAP,CERAMIC,CHIP ECCH0000112 1 15 pF,50V,J,NP0,TC,1005,R/TP MCH155C150J
C1005C0G1H33
317 6 C523 CAP,CHIP,MAKER ECZH0000830 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
0JT
X
CONN,JACK/PLUG,EARPH
318 6 CON400 ENJE0003101 1 4 , PIN, 7000-2.5G-SB1
ONE
5 ,0.65
319 6 CON403 CONNECTOR,I/O ENRY0007201 1 mm,ANGLE , , ,; , ,0.64MM ,ANGLE AXJ53314
O

,
64 PIN,
CONNECTOR,BOARD TO
320 6 CON600 ENBY0042201 1 mm,STRAIGHT , , ,; , ,0.40MM ,STR AXT664124
BOARD
-B

AIGHT ,MALE ,SMD ,P/TR , ,

SOD-123 ,40 V,1
321 6 D200 DIODE,SWITCHING EDSY0017701 1 SDB1040
A,R/TP , ,; , , , , , , ,2P ,1
ESC ,30 V,100 mA,R/TP ,SWITCH
322 6 D300 DIODE,SWITCHING EDSY0010501 1 KDS114E
X

DIODE
323 6 D401 DIODE,TVS EDTY0007401 1 SMD ,12 V,350 W,R/TP , SD12T1G
CDMA+US-PCS+S-GPS,
324 6 DP100 MODULE,ETC SMZY0014701 1 ACFM-7102
Z3

8.0*5.0*1.3
1960
MHz,1.4*1.1*0.45 ,SMD ,1930.6M~1
989.4M, IL 3.5, 5pin, U-B,
325 6 F100 FILTER,SAW SFSY0034901 1 B9419
50-100_30, USPCS
Rx ,; ,1960 ,1.4*1.1*0.45 ,SMD ,R/T
P
2450
LFB212G45SG8
326 6 F101 FILTER,CERAMIC SFCY0000901 1 MHz,2.00*1.25*0.95 ,SMD ,Bluetoot
A166
h Band Pass Filter
881.5
MHz,1.4*1.1*0.4 ,SMD ,869M~894M
327 6 F104 FILTER,SAW SFSY0034801 1 B9432
, IL 2.5, 5pin, U-B, 50-100, DCN
Rx ,; ,881.5 ,1.4*1.1*0.4 ,SMD ,R/TP

836.5 MHz,25 MHz,2.2 dB,40

dB,1880 MHz,58.75 MHz,4 dB,30
dB,2.0*1.6*0.68 ,SMD ,824M~849M,
328 6 F105 FILTER,SAW,DUAL SFSB0001601 1 B9314
1850.625M~1909.375M,10p,B,50,50
,DCN+USPCS Tx,BIDIR ,; ,836.5,
1880 ,2.0*1.6*0.68 ,SMD ,R/TP

1575.42
MHz,2.0*1.4*0.68 ,SMD ,1574.42M~
329 6 F106 FILTER,SAW SFSY0028801 1 1576.42M, IL 1.1, 5pin, U-U, 50-50, B7839
GPS
BPF , ,1575.42 ,2.0*1.4*0.68 ,SMD ,

95 LG Electronics Inc.
95
AX300

R/TP

SMD ,1608 ,EMI-ESD Filter, 4ch, EVRC14S03Q03

330 6 F500 FILTER,EMI/POWER SFEY0013201 1
14V, 15pF, 100ohm 0100R
SMD ,1608 ,EMI-ESD Filter, 4ch, EVRC14S03Q03
331 6 F501 FILTER,EMI/POWER SFEY0013201 1
14V, 15pF, 100ohm 0100R
SMD ,1608 ,EMI-ESD Filter, 4ch, EVRC14S03Q03
332 6 F502 FILTER,EMI/POWER SFEY0013201 1
14V, 15pF, 100ohm 0100R
SMD ,1608 ,EMI-ESD Filter, 4ch, EVRC14S03Q03
333 6 F503 FILTER,EMI/POWER SFEY0013201 1
14V, 15pF, 100ohm 0100R
SMD ,1608 ,EMI-ESD Filter, 4ch, EVRC14S03Q03
334 6 F504 FILTER,EMI/POWER SFEY0013201 1
14V, 15pF, 100ohm 0100R
SMD ,1608 ,EMI-ESD Filter, 4ch, EVRC14S03Q03
335 6 F505 FILTER,EMI/POWER SFEY0013201 1
14V, 15pF, 100ohm 0100R
SMD ,1608 ,EMI-ESD Filter, 4ch, EVRC14S03Q03
336 6 F506 FILTER,EMI/POWER SFEY0013201 1
14V, 15pF, 100ohm 0100R
1005GC2T1N8S
337 6 L100 INDUCTOR,CHIP ELCH0004723 1 1.8 nH,S ,1005 ,R/TP ,
00
1005GC2TR10J0
338 6 L101 INDUCTOR,CHIP ELCH0004727 1 100 nH,J ,1005 ,R/TP ,
0
1005GC2T8N2J0
339 6 L102 INDUCTOR,CHIP ELCH0004705 1 8.2 nH,J ,1005 ,R/TP ,
0

M
1005GC2T2N7S
340 6 L103 INDUCTOR,CHIP ELCH0004708 1 2.7 nH,S ,1005 ,R/TP ,
00
1005GC2T39NJ0
341 6 L104 INDUCTOR,CHIP ELCH0004716 1 39 nH,J ,1005 ,R/TP ,
0
1005GC2T15NJ0

O
342 6 L105 INDUCTOR,CHIP ELCH0004710 1 15 nH,J ,1005 ,R/TP ,
0
1005GC2T6N8J0
343 6 L108 INDUCTOR,CHIP ELCH0004713 1 6.8 nH,J ,1005 ,R/TP ,
0
344 6 L112 INDUCTOR,CHIP ELCH0004712
.C
1 3.9 nH,S ,1005 ,R/TP ,
1005GC2T3N9S
00
1005GC2T4N7S
345 6 L113 INDUCTOR,CHIP ELCH0004704 1 4.7 nH,S ,1005 ,R/TP ,
00
1005GC2T4N7S
X
346 6 L114 INDUCTOR,CHIP ELCH0004704 1 4.7 nH,S ,1005 ,R/TP ,
00
1005GC2T2N2S
347 6 L115 INDUCTOR,CHIP ELCH0004721 1 2.2 nH,S ,1005 ,R/TP ,
00
1005GC2T1N8S
O

348 6 L116 INDUCTOR,CHIP ELCH0004723 1 1.8 nH,S ,1005 ,R/TP ,

00
1005GC2T1N8S
349 6 L117 INDUCTOR,CHIP ELCH0004723 1 1.8 nH,S ,1005 ,R/TP ,
00
-B

LQG18HN4N7S0
350 6 L122 INDUCTOR,CHIP ELCH0003812 1 4.7 nH,S ,1608 ,R/TP ,COIL TYPE
0
1005GC2T4N7S
351 6 L123 INDUCTOR,CHIP ELCH0004704 1 4.7 nH,S ,1005 ,R/TP ,
00
HB-1M1005-601J
352 6 L124 FILTER,BEAD,CHIP SFBH0000903 1 600 ohm,1005 ,
X

T
1005GC2T82NJ0
353 6 L125 INDUCTOR,CHIP ELCH0004717 1 82 nH,J ,1005 ,R/TP ,
0
1005GC2T4N7S
354 6 L129 INDUCTOR,CHIP ELCH0004704 1 4.7 nH,S ,1005 ,R/TP ,
Z3

00
1005GC2T12NJ0
355 6 L130 INDUCTOR,CHIP ELCH0004701 1 12 nH,J ,1005 ,R/TP ,
0
1005GC2T3N3S
356 6 L131 INDUCTOR,CHIP ELCH0004709 1 3.3 nH,S ,1005 ,R/TP ,
00
1005GC2T1N8S
357 6 L134 INDUCTOR,CHIP ELCH0004723 1 1.8 nH,S ,1005 ,R/TP ,
00
1005GC2T47NJ0
358 6 L135 INDUCTOR,CHIP ELCH0004722 1 47 nH,J ,1005 ,R/TP ,
0
1005GC2T4N7S
359 6 L136 INDUCTOR,CHIP ELCH0004704 1 4.7 nH,S ,1005 ,R/TP ,
00
360 6 L200 INDUCTOR,SMD,POWER ELCP0008002 1 2.2 uH,M ,2.5*2.0*1.0 ,R/TP , MIP2520D2R2M
361 6 L201 INDUCTOR,SMD,POWER ELCP0008001 1 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , MIP2520D4R7M
362 6 L202 INDUCTOR,SMD,POWER ELCP0008001 1 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , MIP2520D4R7M
363 6 L203 FILTER,BEAD,CHIP SFBH0009201 1 220 ohm,1608 , MPZ1608S221A
364 6 L204 FILTER,BEAD,CHIP SFBH0009201 1 220 ohm,1608 , MPZ1608S221A
NFM18PC104R1
365 6 L400 FILTER,EMI/POWER SFEY0015301 1 SMD ,Pb-free_Bais ,; ,Filter,LCR
C3
UNIT ,-38 dB,4.72*3.76 ,1.25T
SPM0204LE5-Q
366 6 M402 MICROPHONE SUMY0010604 1 Bottom Silicon
B
type ,; , , ,UNI ,1.5V , ,SMD
SSOP5-P-0.65A ,5
367 6 Q100 IC EUSY0073401 1 TC7SH04FU
PIN,R/TP ,INVERTER, Pb Free
ESM ,100 mW,R/TP ,NPN
368 6 Q300 TR,BJT,NPN EQBN0012401 1 KRC402E
TRANSISTOR

96 LG Electronics Inc.
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AX300

369 6 Q301 TR,BJT,PNP EQBP0004102 1 USM ,100 mW,R/TP , KTN2907AU

TSMT6 ,0.5 W,R/TP ,Vceo=-12V,
370 6 Q400 TR,BJT,PNP EQBP0009901 1 QST4
Ic=-3A, hFE=270~680
371 6 R103 RES,CHIP,MAKER ERHZ0000402 1 10 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ100
372 6 R104 RES,CHIP,MAKER ERHZ0000410 1 12 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ120
MCR01MZSF100
373 6 R106 RES,CHIP ERHY0003201 1 1000 ohm,1/16W ,F ,1005 ,R/TP
1
MCR01MZSF49
374 6 R107 RES,CHIP,MAKER ERHZ0000291 1 49.9 ohm,1/16W ,F ,1005 ,R/TP
R9
375 6 R108 RES,CHIP,MAKER ERHZ0000490 1 51 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ510
MCR01MZSF200
376 6 R109 RES,CHIP,MAKER ERHZ0000236 1 2000 ohm,1/16W ,F ,1005 ,R/TP
1
377 6 R110 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
MCR01MZSF150
378 6 R113 RES,CHIP,MAKER ERHZ0000222 1 150 Kohm,1/16W ,F ,1005 ,R/TP
3
379 6 R119 RES,CHIP,MAKER ERHZ0000406 1 100 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ104
380 6 R120 RES,CHIP,MAKER ERHZ0000490 1 51 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ510
381 6 R122 RES,CHIP,MAKER ERHZ0000512 1 82 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ820
382 6 R123 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
383 6 R124 RES,CHIP,MAKER ERHZ0000512 1 82 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ820
384 6 R125 RES,CHIP,MAKER ERHZ0000458 1 300 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ301
385 6 R126 RES,CHIP,MAKER ERHZ0000458 1 300 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ301
386 6 R127 RES,CHIP,MAKER ERHZ0000428 1 18 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ180
MCR01MZSF49
387 6 R128 RES,CHIP,MAKER ERHZ0000291 1 49.9 ohm,1/16W ,F ,1005 ,R/TP

M
R9
MCR01MZSF560
388 6 R200 RES,CHIP,MAKER ERHZ0000298 1 560 ohm,1/16W ,F ,1005 ,R/TP
0
MCR01MZSF510
389 6 R202 RES,CHIP,MAKER ERHZ0000293 1 510 ohm,1/16W ,F ,1005 ,R/TP
0

O
MCR01MZSF510
390 6 R204 RES,CHIP,MAKER ERHZ0000294 1 5100 ohm,1/16W ,F ,1005 ,R/TP
1
MCR01MZSF10
391 6 R206 RES,CHIP,MAKER ERHZ0000206 1 10 ohm,1/16W ,F ,1005 ,R/TP
392 6 R207 RES,CHIP,MAKER ERHZ0000488
.C
1 4.7 ohm,1/16W ,J ,1005 ,R/TP
R0
MCR01MZSJ4R7
MCR01MZSF120
393 6 R209 RES,CHIP,MAKER ERHZ0000212 1 12 Kohm,1/16W ,F ,1005 ,R/TP
2
MCR01MZSF510
X
394 6 R210 RES,CHIP,MAKER ERHZ0000294 1 5100 ohm,1/16W ,F ,1005 ,R/TP
1
395 6 R213 RES,CHIP,MAKER ERHZ0000456 1 2.2 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ2R2
MCR01MZSF121
396 6 R220 RES,CHIP,MAKER ERHZ0004201 1 121000 ohm,1/16W ,F ,1005 ,R/TP
O

3
397 6 R223 RES,CHIP,MAKER ERHZ0000485 1 4700 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ472
398 6 R228 RES,CHIP,MAKER ERHZ0000402 1 10 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ100
-B

399 6 R232 RES,CHIP,MAKER ERHZ0000443 1 2200 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ222

400 6 R233 RES,CHIP,MAKER ERHZ0000443 1 2200 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ222
401 6 R236 RES,CHIP,MAKER ERHZ0000405 1 10 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ103
402 6 R301 RES,CHIP,MAKER ERHZ0000405 1 10 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ103
403 6 R303 RES,CHIP,MAKER ERHZ0000406 1 100 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ104
X

404 6 R304 RES,CHIP,MAKER ERHZ0000472 1 36 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ363

405 6 R308 RES,CHIP,MAKER ERHZ0000486 1 47 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ473
MCR01MZSF560
Z3

406 6 R311 RES,CHIP,MAKER ERHZ0000301 1 560 Kohm,1/16W ,F ,1005 ,R/TP

3
MCR01MZSF392
407 6 R312 RES,CHIP,MAKER ERHZ0000281 1 39.2 Kohm,1/16W ,F ,1005 ,R/TP
2
MCR01MZSF120
408 6 R314 RES,CHIP,MAKER ERHZ0000213 1 120 Kohm,1/16W ,F ,1005 ,R/TP
3
MCR01MZSF470
409 6 R316 RES,CHIP,MAKER ERHZ0000288 1 470 Kohm,1/16W ,F ,1005 ,R/TP
3
NCP18WD683E0
410 6 R317 THERMISTOR SETY0001401 1 NTC ,68 Kohm,SMD ,
3RB
411 6 R327 RES,CHIP,MAKER ERHZ0000443 1 2200 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ222
412 6 R328 RES,CHIP,MAKER ERHZ0000488 1 4.7 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ4R7
413 6 R329 RES,CHIP,MAKER ERHZ0000406 1 100 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ104
414 6 R401 RES,CHIP,MAKER ERHZ0000404 1 1 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ102
415 6 R407 RES,CHIP,MAKER ERHZ0000443 1 2200 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ222
416 6 R409 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
5.5 V,+-30 ,SMD ,1005, 100 pF, Pb
417 6 R414 VARISTOR SEVY0005202 1 EVLC5S02100
free
418 6 R415 VARISTOR SEVY0003901 1 5.5 V, ,SMD ,480pF, 1005 EVL5M02200
419 6 R417 VARISTOR SEVY0003901 1 5.5 V, ,SMD ,480pF, 1005 EVL5M02200
420 6 R424 RES,CHIP,MAKER ERHZ0000701 1 0 ohm,1/10W ,J ,1608 ,R/TP MCR03EZHJ000
0.1
MCR10EZHFLR1
421 6 R425 RES,CHIP,MAKER ERHZ0003901 1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1%
00
,1/4W ,2012 ,R/TP
422 6 R430 RES,CHIP,MAKER ERHZ0000493 1 51 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ513

97 LG Electronics Inc.
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MCR01MZSF200
423 6 R435 RES,CHIP,MAKER ERHZ0000238 1 200 Kohm,1/16W ,F ,1005 ,R/TP
3
424 6 R437 RES,CHIP,MAKER ERHZ0000443 1 2200 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ222
425 6 R438 VARISTOR SEVY0003801 1 18 V, ,SMD , EVLC18S02015
426 6 R439 VARISTOR SEVY0003801 1 18 V, ,SMD , EVLC18S02015
427 6 R442 VARISTOR SEVY0003801 1 18 V, ,SMD , EVLC18S02015
428 6 R443 RES,CHIP,MAKER ERHZ0000406 1 100 Kohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ104
5.5 V,+-30 ,SMD ,1005, 100 pF, Pb
429 6 R444 VARISTOR SEVY0005202 1 EVLC5S02100
free
430 6 R445 RES,CHIP,MAKER ERHZ0000499 1 5600 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ562
5.5 V,+-30 ,SMD ,1005, 100 pF, Pb
431 6 R448 VARISTOR SEVY0005202 1 EVLC5S02100
free
MCR01MZSF150
432 6 R449 RES,CHIP,MAKER ERHZ0000222 1 150 Kohm,1/16W ,F ,1005 ,R/TP
3
MCR01MZSF392
433 6 R450 RES,CHIP,MAKER ERHZ0000281 1 39.2 Kohm,1/16W ,F ,1005 ,R/TP
2
434 6 R451 VARISTOR SEVY0003901 1 5.5 V, ,SMD ,480pF, 1005 EVL5M02200
435 6 R452 VARISTOR SEVY0003901 1 5.5 V, ,SMD ,480pF, 1005 EVL5M02200
436 6 R500 RES,CHIP,MAKER ERHZ0000411 1 120 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ121
437 6 R501 RES,CHIP,MAKER ERHZ0000411 1 120 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ121
438 6 R502 RES,CHIP,MAKER ERHZ0000411 1 120 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ121
439 6 R503 RES,CHIP,MAKER ERHZ0000411 1 120 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ121
440 6 R504 RES,CHIP,MAKER ERHZ0000411 1 120 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ121
ICVL0505600V1

M
441 6 R505 VARISTOR SEVY0003602 1 5.6 V, ,SMD ,1005, 60pF
50FR
442 6 R506 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
443 6 R507 RES,CHIP,MAKER ERHZ0000411 1 120 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ121
444 6 R508 RES,CHIP,MAKER ERHZ0000411 1 120 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ121

O
,SMD ,
445 6 U100 CONN,RF SWITCH ENWY0005301 1 dB,H=1.85 ,; ,3.00MM ,STRAIGHT , KMS-518
RF ADAPTER ,SMD ,R/TP ,AU , ,

446 6 U101 MODULE,ETC SMZY0016501

.C
1
LNA Module(GPS LNA+B/P
ALM-1412
Filter) ,: ,RF Module
-22 dB,-0.2 dB,-37
COUPLER,RF CP0402A0836B
447 6 U103 SCDY0003401 1 dB,1.0*0.58*0.35 ,SMD ,824M ~
DIRECTIONAL NTR
X
849M, 4pin, Pb Free
-20 dB,-0.25 dB,-35
COUPLER,RF CP0402A1880E
448 6 U104 SCDY0003402 1 dB,1.0*0.58*0.35 ,SMD ,1850M ~
DIRECTIONAL NTR
O

1910M, 4pin, Pb Free

28 dBm,39 %, A, dBc,
449 6 U105 PAM SMPY0015801 1 dB,3x5x1 ,SMD ,HELP3 Dual AWT6321R
PAM ,; , , , , , , , ,R/TP ,R/TP ,14
-B

19.2 MHz,1.5 PPM,10

pF,SMD ,3.2*2.5*1.2 , ,; ,19.2
450 6 U106 VCTCXO EXSK0004802 1 ERF3003E
Mhz ,1.5PPM ,2.8V ,3.2 ,2.5 ,1.2 , ,S
MD ,P/TP
X

FBGA ,65 PIN,R/TP ,Bluetooth BCM2045SB2KF

451 6 U108 IC EUSY0300201 1
Single chip(5x5x1.2) BG
,SMD ,
Z3

452 6 U115 CONN,RF SWITCH ENWY0005301 1 dB,H=1.85 ,; ,3.00MM ,STRAIGHT , KMS-518

RF ADAPTER ,SMD ,R/TP ,AU , ,
CSP ,424 PIN,R/TP ,CDMA 1X
453 6 U200 IC EUSY0336201 1 QSC6055
Onechip BB, BB/RF/PM
.032768 MHz,20 PPM,7 pF,65000 MC-146(7PF,+/-2
454 6 U201 X-TAL EXXY0004601 1
ohm,SMD ,6.9*1.4*1.3 , 0PPM)
QFN ,20
455 6 U302 IC EUSY0263105 1 PIN,R/TP ,SUB-PMIC4Ch+2LDO ,; ,I SC624ULTRT
C,Charge Pump
HVSOF5 ,5 PIN,R/TP ,150mA
456 6 U303 IC EUSY0223002 1 CMOS LDO WITH OUTPUT BH28FB1WHFV
CONTROL / 2.8V
Micropak ,6 PIN,R/TP ,OR Gate, Pb
457 6 U304 IC EUSY0300601 1 NC7SZ32L6X
Free
FBGA ,107 PIN,ETC ,FULLY 1.8V
1G(LB/64Mx16) K5E1H12ACM-D
458 6 U305 IC EUSY0335803 1
NAND+512M(DDR/8Mx4x16) 075
SDRAM ,; ,IC,MCP
459 6 U400 IC EUSY0140902 1 SSOP ,5 PIN,R/TP ,Inverter(2x2.1) TC7SZ04FU
chipFET ,1.3 W,-20 V,3.9 A,R/TP ,8
460 6 U401 TR,FET,P-CHANNEL EQFP0006301 1 NTHS5441T1G
PIN (Pb-free)
NUS3065MUTA
461 6 U402 IC EUSY0333701 1 TLLGA ,8 PIN,R/TP ,OVP
G
462 5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0098801 1

98 LG Electronics Inc.
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GRM36X7R104K
463 6 C309 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
C1005C0G1H10
464 6 C312 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H10
465 6 C402 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H10
466 6 C404 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H10
467 6 C405 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H10
468 6 C406 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H10
469 6 C407 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
C1005C0G1H10
470 6 C408 CAP,CHIP,MAKER ECZH0000813 1 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
1JT
GRM36X7R104K
471 6 C521 CAP,CHIP,MAKER ECZH0003103 1 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
10PT
472 6 LED300 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
473 6 LED301 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
474 6 LED306 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
475 6 LED307 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
476 6 LED308 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E

M
477 6 LED309 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
478 6 LED310 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
479 6 LED311 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
480 6 LED312 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E

O
481 6 LED313 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
482 6 LED314 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
483 6 LED315 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
484 6 LED316 DIODE,LED,CHIP EDLH0004501
.C
1 BLUE ,1608 ,R/TP , LEBB-S14E
485 6 LED317 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
486 6 LED318 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
X
487 6 LED319 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
488 6 LED320 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
489 6 LED321 DIODE,LED,CHIP EDLH0004501 1 BLUE ,1608 ,R/TP , LEBB-S14E
O

490 6 R305 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471

5.5 V,+-30 ,SMD ,1005, 100 pF, Pb
491 6 R306 VARISTOR SEVY0005202 1 EVLC5S02100
free
-B

492 6 R307 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471

493 6 R313 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
494 6 R315 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
495 6 R318 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
496 6 R319 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
X

497 6 R320 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471

498 6 R321 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
499 6 R322 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
Z3

500 6 R323 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471

501 6 R324 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
502 6 R325 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
503 6 R326 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
504 6 R330 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
505 6 R331 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
506 6 R332 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
507 6 R333 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
508 6 R334 RES,CHIP,MAKER ERHZ0000484 1 470 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ471
509 6 R402 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
510 6 R403 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
511 6 R404 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
512 6 R405 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
513 6 R406 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
514 6 R408 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
515 6 R410 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
516 6 R411 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
517 6 R412 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
518 6 R416 VARISTOR SEVY0005401 1 18 V, ,SMD ,15pF,1005 ICVS0518150FR
519 6 R420 VARISTOR SEVY0005401 1 18 V, ,SMD ,15pF,1005 ICVS0518150FR
520 6 R421 VARISTOR SEVY0005401 1 18 V, ,SMD ,15pF,1005 ICVS0518150FR
521 6 R422 VARISTOR SEVY0005401 1 18 V, ,SMD ,15pF,1005 ICVS0518150FR

99 LG Electronics Inc.
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AX300

522 6 R423 VARISTOR SEVY0005401 1 18 V, ,SMD ,15pF,1005 ICVS0518150FR

523 6 R453 RES,CHIP ERHY0003301 1 100 ohm,1/16W ,J ,1005 ,R/TP MCR01MZSJ101
FR-4 ,0.8
524 6 SPFY00 PCB,MAIN SPFY0161302 1 mm,STAGGERED-8 ,MAIN ,; , , , , , , SPFY0161302
,,,
QFN ,4 PIN,R/TP ,1.8X1.2X0.5 size
525 6 U301 IC EUSY0313401 1 EM-0781-T5
wide input voltage Hall Switch

5. Assembly Diagram

M
NO DESCRIPTION DRAWING No. QTY NO DESCRIPTION DRAWING No. QTY
MWAC008640
1 TAPE,PROTECTION MTAB0216301 1 38 WINDOW,LCD 1
2

O
2 TAPE,PROTECTION MTAB0196701 1 39 TAPE,PROTECTION MTAB0196801 1
MWAE002930
3 WINDOW,CAMERA 1 40 TAPE,PROTECTION MTAB0232501 1
1
4 WINDOW,LCD(SUB) MWAF0038901 1 41 STOPPER,FOLDER MSGC0001702 1
5 TAPE,WINDOW(SUB) MTAE0032601 1 42
.C COVER,FRONT MCJK0078602 1
6 COVER, UPPER MCJJ0050102 1 43 STOPPER,HINGE MSGB0022702 1
7 PAD,CAMERA MPBT0049001 1 44 HINGE,FOLDER MHFD0016301 1
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8 PAD,CONNECTOR MPBU0012401 1 45 MCIB CONTACT,HINGE MCIB0000801 1
9 PAD,CONNECTOR MPBU0012501 1 46 INSERT,FRONT MICA0023401 4
10 PAD,LCD MPBG0068301 1 47 STOPPER,HINGE MSGB0022801 1
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11 PAD,MOTOR MPBJ0050601 1 48 KEYPAD,MAIN MKAG0002802 1

12 PAD,RECEIVER MPBM0020201 1 49 TAPE,PROTECTION MTAB0234301 1
13 FILTER,SPEAKER MFBC0034901 1 50 FILTER,MIKE MFBD0026801 1
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14 TAPE,PROTECTION MTAB0214901 1 51 DOME ASSY,METAL ADCA0072501 1

15 INSERT,FRONT MICA0023401 4 52 INSULATOR MIDZ0156601 1
16 TAPE,SHIELD MTAC0062701 1 53 FPCB SIDEKEY SAKY0006901 1
17 TAPE,SHIELD MTAC0062801 1 54 TAPE SHIELD MTAC0064101 1
18 PAD,FLEXIBLE PCB MPBF0030801 1 55 PCB,MAIN SPFY0161302 1
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19 FPCB, LCD SACY0072001 1 56 PAD,MSM MPBL0006601 1

20 LCD MODULE SVLM0027701 1 57 CAN,SHIELD MCBA0023701 1
21 CAMERA SVCY0013401 1 58 TAPE,PROTECTION MTAB0196601 1
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22 VIBRATOR,MOTOR SJMY0006510 1 59 CAP,EARPHONE JACK MCCC0050502 1

23 RECEIVER SURY0011302 1 60 PAD,CONNECTOR MPBU0019901 1
24 SPEAKER SUSY0023501 1 61 CAP,RECEPTACLE MCCE0040702 1
25 PAD,MOTOR MPBJ0047901 1 62 BUTTON,SIDE MBJL0046802 1
ANTENNA,MOBILE,FIXE
26 FILTER,RECEIVER MFBB0023801 1 63 SNMF0037901 1
D
27 PAD,SPEAKER MPBN0052201 1 64 CONNECTOR,ETC ENZY0019901 1
28 TAPE,CAMERA MTAK0004101 1 65 ANTENNA,MAIN SNMF0038001 1
29 MAGNET,SWITCH MMAA0008201 1 66 COVER,REAR MCJN0074302 1
30 BRACKET,LCD MBFF0015501 1 67 LABEL,QUALCOMM MLAN0000603 1
31 MCIB CONTACT,HINGE MCIB0000701 1 68 LABEL,A/S MLAB0000601 1
COVER,FOLDER(LOWER
32 MCJH0040902 1 68 CAP,SCREW MCCH0118502 2
)
33 TAPE,PROTECTION MTAB0232401 1 69 BATTERY PACK,LI-ION SBPL0086301 1
34 SCREW MACHINE,BIND GMEY0002001 4 70 COVER,BATTERY MCJA0051202 1
35 CAP,SCREW MCCH0114802 4 73 PAD,LCD MPBG0074101 1
36 TAPE,WINDOW MTAD0076001 1 74 TAPE,PROTECTION MTAB0237501 1

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Chapter 6. Safety
Chapter 6. Safety
▣ IMPORTANT

Read This Information Before Using Your Hand-Held Portable

Cellular Telephone
First introduction in 1984, the hand-held portable cellular telephone is one of the most
exciting and innovative electronic products ever developed.
With it you can stay in contact with your office, your home, emergency service, and others. For the safe and
efficient operation of your phone, observe these guidelines.

Your cellular phone is a radio transmitter and receiver. When it is ON, it receives and also sends out radio

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frequency (RF) energy. The phone operates in the frequency range of 824 MHz to 894 MHz and employs
commonly used frequency modulation (FM) techniques. When you use your phone, the cellular system handling

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your calls controls the power level at which your phone transmits. The power level can range from 0.006 of a
watt to .6 of a watt.
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▣ Exposure to Radio Frequency Energy
In 1991 the Institute of Electrical and Electronics Engineers (IEEE), and in 1992 the American National
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Standards Institute (ANSI) updates the 1982 ANSI Standard for safety levels with respect to human exposure to
RF energy. Over 120 scientists, engineers, and physicians from universities, government health agencies, and
industry, after reviewing the available boy of research, developed this updated Standard. In March, 1993, the US
-B

Federal Communications Commission (FCC) proposed the adoption of this updated Standard.

The design of your phone complies with this updated Standard. Of course, if you want to limit RF exposure even
X

further than the updated ANSI Standard, you may choose to control the duration of your calls and opration your
phone in the most power efficient manner.
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▣ Efficient Phone Operation

For your phone to operate at the lowest power level, consistent with satisfactory call quality, please observe the
following guidelines:

If your phone has an extendable antenna, extend it fully. Some models allow you to place a call with the antenna
retracted. However, your phone operates more efficiently with the antenna fully extended.

Hold the phone as you would any other telephone. While speaking directly into the mouthpiece, position the
antenna up and over your shoulder.

Do not hold the antenna when the phone is “IN USE”. Holding the antenna affects call quality and may cause
the phone to operated at a higher power level than needed.

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▣ Antenna Care and Replacement

Do not use the phone with a damaged antenna. If a damaged antenna comes into contact with skin, a minor bum
may result. Replace a damaged antenna immediately. Consult your manual to see if you may change your
antenna yourself. If so, use only a manufacture approves antenna. Otherwise, take your phone to a qualifies
service center for repair.

Use only the supplied or approved antenna. Non-approved antennas, modifications, or attachments, could impair
call quality, damage the phone, and violate FCC egulations.

▣ Driving
Check the laws and regulations on the use of cellular telephones in the areas where you drive. Always obey
them. Also, when using your phone while driving, please:
Give full attention to the driving. Use hands-free operation, if available, and pull off the road and park before

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making or answering a call if driving conditions require.

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▣ Electronic Devices
Most modem electronic equipment is shielded from RF energy. However, RF energy from cellular telephones
may affect inadequately shielded electronic equipment.
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RF energy may effect improperly installed or inadequately shielded electronic operating and entertainment
system in motor vehicles. Check with the manufacturer or its representative to determine if these systems are
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adequately shielded from external RF energy. You should check with the manufacturer of any equipment that
has been added to your vehicle.
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Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc.) to determine
if they are adequately shielded from external RF energy.
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Turn your phone OFF in health care facilities. When any regulations posted in the areas instruct you to do so.
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Hospitals or health care facilities may be using equipment that could be sensitive to external RF energy.

▣ Aircraft
Turn your phone OFF before boarding any aircraft.
Use it on the ground only with crew permission. Do not use it in the air.
To prevent possible interference with aircraft systems, US Federal Aviation Administration (FAA) regulations
require you to have permission from a crew member to use your phone while the plane is on the ground. Using
your phone while the plane is in the air.

▣ Children
Do not allow children to play with your phone. It is not a toy. Children could hurt themselves or others (by
poking themselves or others in the eye with the antenna, for example). Children also could damage the phone, or
make calls that increase your telephone bills.

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▣ Blasting Areas
To avoid interfering with blasting operations, turn you unit OFF when in a “blasting area” or in areas posted
“Turn off two-way radio”. Construction crews often use remote control RF devices to set off explosives.

▣ Potentially Explosive Atmospheres

Turn your phone OFF when in any area with a potentially explosive atmosphere. It is rare, but your phone or
accessories could generate sparks. Sparks in such area could cause an explosion or fire resulting in bodily injury
or even death.

Areas with a potentially explosive atmosphere are often, but not always, clearly marked. They include fueling
areas such as gas station; below deck on boats; fuel or chemical transfer or storage facilities; areas where the air
contains chemical or particles, such as grain, dust, or metal powders; and any other area where you would
normally be advised to turn off your vehicle engine.
Do not transport or store flammable gas, liquid, or explosives in the compartment of your vehicle which contains

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your phone or accessories.

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Vehicles using liquefied petroleum gas (such as propane or butane) must compl7y with the National Fire
Protection Standard (NFPA-58). For a copy of this standard, contact the National Fire Protection Association,
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One Battery march Park, Quincy, MA 02269, Attn: Publication Sales Division.
Rule of Thumb: Using common sense at all times when handling, installing or using the
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phone. Any questions should be directed to you nearest Service Center or authorized
service technician or electrician.
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Chapter 7. Glossary
Chapter 7. Glossary
General Terms
Abbreviated Alert. An abbreviated alert is used to remind the mobile station user that previously selected
alternative routing features are still active.

AC. See Authentication Center.

Access Attempt. A sequence of one or more access probe sequences on the Access Channel containing the
same message. See also Access Probe and Access Probe Sequence.
Access Channel. A Reserve CDMA Channel used by mobile stations for communicating to the base station.
The Access Channel is used for short signaling message exchanges such as call origination’s, responses to pages,

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and registrations. The Access Channel is a slotted random access channel.
Access Channel Message. The information part of an access probe consisting of the message body, length field,

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and CRC.
Access Channel Message Capsule. An Access Channel message plus the padding.
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Access Channel Preamble. The preamble of an access probe consisting of a sequence of all-zero frames that is
sent at the 4800bps rate.
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Access Channel Request Message. An Access Channel message that is autonomously generated by the mobile
station. See also Access Channel Response Message.
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Access Channel Response Message. A message on the Access Channel generated to reply to a message
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received from the base station.

Access Channel Slot. The assigned time interval for an access probe. An Access Channel slot consists of an
integer number of frames. The transmission of an access probe is performed within the boundaries of an Access
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Channel slot.
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Access Probe. One Access Channel transmission consisting of a preamble and a message. The transmission is
an integer number of frames in length and transmits one Access Channel message. See also Access Probe
Sequence and Access Attempt.
Access Probe Sequence. A sequence of one or more access probes on the Access Channel. The same Access
Channel message is transmitted in every access probe of an access attempt. See also Access Probe and Access
Attempt.
Acknowledgement. A Layer 2 response by the mobile station or the base station confirming that a signaling
message was received correctly.

Action Time. The time at which the action implied by a message should take effect.
Active Set. The set of pilots associated with the CDMA Channels containing Forward Traffic Channels assigned
to a particular mobile station.
Aging. A mechanism through which the mobile station maintains in its Neighbor Set the pilots that have been

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recently sent to it from the base station and the pilots whose handoff drop timers have recently expired.
A-key. A secret, 64-bit pattern stored in the mobile station. It is used to generate update the mobile station’s
Shared Secret Data. The A-key is used in the mobile station authentication process.
Analog Access Channel. An analog control channel used by a mobile station to access a system to obtain
service.

Analog Color-Code. An analog signal (see Supervisory Audio Tone) transmitted by a base station on an analog
voice channel and used to detect capture of a mobile station by an interfering base station or the capture of a
base station by an interfering mobile station.
Analog Control Channel. An analog channel used for the transmission of digital control information from a
base station to a mobile station or from a mobile station to a base station.
Analog Paging Channel. A forward analog control channel that is used to page mobile stations and send orders.
Analog Voice Channel. An analog channel on which a voice conversation occurs and on which brief digital

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messages may be sent from a base station to a mobile station or from a mobile station to a base station.
Authentication. A procedure used by a base station to validate a mobile station’s identity.

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Authentication Center (AC). An entity that manages the authentication information related to the mobile
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station.
Authentication Response (AUTHR). An 18-bit output of the authentication algorithm. It is used, for example,
to validate mobile station registrations, origination and terminations. A method of registration in which the
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mobile station registers without an explicit command from the base station.
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AWGN. Additive White Gaussian Noise.

Bad Frames. Frames classified as erasures (frame category 10) or9600bps frames, primary traffic only with bit
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errors (frame category 9). See also Good Frames.

Base Station. A station in the Domestic Public Cellular Radio Telecommunications Service, other than a mobile
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station, used for communicating with mobile stations. Depending upon the context, the term base station may
refer to a cell, a sector within a cell, an MSC, or other part of the cellular system. See also MSC.
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Base Station Authentication Response (AUTHBS). An 18-bit pattern generated by the authentication
algorithm. AUTHBS is used to confirm the validity of base station orders to update the Shared Secret Data.
Base Station Random Variable (RANDBS). A 32-bit random number generated by the mobile station for
authenticating base station orders to update the Shared Secret Data.
BCH Code. See Bose-Chaudhuri-Hocquenghem Code.
Busy-Idle Bits. The portion of the data stream transmitted by a base station on a forward analog control channel
that is used to indicate the current busy-idle status of the corresponding reverse analog control channel.
Call Disconnect. The process that releases the resources handling a particular call. The disconnect process
beings either when the mobile station user indicates the end of the call by generating an on-hook condition or
other call release mechanism, or when the base station initiates a release.
Call History Parameter(COUNT). A modulo-64 event counter maintained by the mobile station and
Authentication Center that us used for clone detection.
Candidate Set. The set of pilots that have been received with sufficient strength by the mobile station to be

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successfully demodulated, but have not been placed in the Active Set by the base station. See also Active Set.
Neighbor Set, and Remaining Set.

. See Code Division Multiple Access

CDMA Channel. The set of channels transmitted between the base station within a given CDMA frequency
assignment. See also Forward CDMA Channel and Reverse CDMA Channel.
CDMA Channel Number. An 11-bit number corresponding to the center of the CDMA frequency assignment.
CDMA Frequency Assignment. A 1.23MHz segment of spectrum centered on one of the 30KHz channels of
the existing analog system.
Code Channel. A subchannel of a Forward CDMA Channels. A Forward CDMA Channel contains 64 code
channels. Code channel zero is assigned to the Pilot Channel. Code channels 1 through 7 may be assigned to the
either Paging Channels or the Traffic Channels. Code Channel 32 may be assigned to either a Sync Channel or a
Traffic Channel. The remaining code channels may be assigned to Traffic Channels.

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Code Division Multiple Access (CDMA). A technique for spread-spectrum multiple-access digital
communications that creates channels through the use of unique code sequences.

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Code Symbol. The output of an error-correcting encoder. Information bits are input to the encoder and code
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symbols are output from the encoder. See Convolutional Code.
Continuous Transmission. A mode of operation in which Discontinuous Transmission is not permitted.
Control Mobile Attenuation Code(CMAC). A 3-bit field in the Control-Filler Message that specifies the
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maximum authorized power level for a mobile transmitting on an analog reverse control channels.
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Convolution Code. A type of error-correcting code. A code symbol can be considered as the convolution of
the input data sequence with the impulse response of a generator function.
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CRC. See Cyclic Redundancy Code.

Cyclic Redundancy Code (CRC). A class of linear error detecting codes which generate parity check bits by
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finding the remainder of a polynomial division.

Data Burst Randomizer. The function that determines which power control groups within a frame are
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transmitted on the Reverse Traffic Channel when the data rate is lower than 9600 bps. The data burst randomizer
determines, for each mobile station, the pseudo random position of the transmitted power control groups in the
frame while guaranteeing that every modulation symbol is transmitted exactly once.
DBc. The ratio(in dB) of the sideband power of a signal, measured in a given bandwidth at a given frequency
offset from the center frequency of the same signal, to the total inband power of the signal. For CDMA, the total
inband power of the signal is measured in a 1.23MHz bandwidth around the center frequency of the CDMA
signal.
DBm. A measure of power expressed in terms of its ration (in dB) to one milliwatt.
DBm/Hz. A measure of power spectral density. DBm/Hz is the power in one Hertz of bandwidth. Where
power is expressed in units of dBm.
DBW. A measure of power expressed in terns of its ration (in dB) to one Watt.
Dedicated Control Channel. An analog conrtol channel used for the transmisson of digital control information
from either a base station or a mobile station.

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Deinterleaving. The process of unpermuting the symbols that were permuted by the interleaver..
Deinterleavering is performed on reveived symbols prior to decoding.
Digital Color Code(DCC). A digital signal transmitted by a base station on a forward analog control channel
that is used to detect capture of a base station by an interfering mobile station.
Dim-and-Burst. A frame in which primary traffic is multiplexed with either secondary traffic or signaling
traffic.

Discontinuous Transmission (DTX). A mode of operation in which a mobile station transmitter

autonomously switches between two transmitter power levels while the mobile station is in the conversation
state on an analog voice channel.
Distance-Based Registration. An autonomous registration method in which the mobile station registers
whenever it enters a cell whose distance from the cell in which the mobile station last registered exceeds a given
threshold.

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DTMF. See Dual Tone Multifrequency.
Dual-Tone Multifrequency(DTMF). Signaling by the simultaneous transmission of two tones, one from a

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group of low frequencies and another from a group of high frequencies. Each group of frequecies consists of
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four frequencies.
Eb. The energy of an information bit.
Ec/I0. The ratio in (dB) between the pilot energy accumulated over one PN chip period(Ec) to the power
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spectral density in the received bandwidth(Io).
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Effective Radiated Power (ERP). The transmitted power multiplied by the antenna gain referenced to a half
wave dipole.
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Electronic Serial Number(ESN). A 32-bit number assigned by the mobile station manufacturer, uniquely
identifying the mobile station equipment.
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Encoder Tail Bits. A fixed sequence of bits added to the end of a block of data to reset the convolutional
encoder to a known state.
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ERP. See Effective Radiated Power.

ESN. See Electronic Serial Number.
Extended Protocol. An optional expansion of the signaling message between the base station and mobile
station to allow for the addition of new system features and operational capabilities.
Fade Timer. A timer kept by the mobile station as a measure of Forward Traffic Channel continuity. If the Fade
timer expires, the mobile station drops the call.
Flash. An indication sent on an analog voice channel or CDMA Traffic Channel indicating that the user
Directed the mobile station to invoke special processing.
Foreign NID Roamer. A mobile station operating in the same system (SID) but a different network (NID)Form
the one in which service was subscribed. See also Foreign SID Roamer and Roamer.
Foreign SID Roamer. A mobile station operating in a system (SID) other than the one from which service was
subscribed. See also Foreign NID Roamer and Roamer.

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Forward Analog Control Channel (FOCC). An analog voice channel used from a base station to a mobile
station.
Forward Analog Voice Channel (FVC). An analog voice channel used from a base station to a mobile
station.
Forward CDMA Channel. A CDMA Channel form a base station to mobile stations. The Forward CDMA
Channel contains one or more code channels that are transmitted on a CDMA frequency assignment using a
Particular pilot PN offset. The code channels are associated with the Pilot Channel, Sync Channel, Paging
Channels, and Traffic Channels. The Forward CDMA Channel always carries a Pilot Channel and may carry up
to one Sync Channel, up to seven Paging Channels, and up to 63 Traffic Channels, as long as the total number of
channels, including the Pilot Channel, is no greater than 64.

Forward Traffic Channel. A code channel used to transport user and signaling traffic from the base station to
the mobile station.

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A basic timing interval in the system. For the Access Channel, Paging Channel, and Traffic Channel, a frame is
20 ms long. For the Sync Channel, a frame is 26.666…ms long.

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Frame Category. A classification of a received Traffic Channel frame based upon transmission data rate, the
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Frame contents (primary traffic, secondary traffic, or signaling traffic), and whether there are detected error in
the frame.
Frame Offset. A time skewing of Traffic Channel frames from System Time in integer multiples of 1.25 ms.
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The maximum frame offset is 18..75 ms..
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Frame Quality Indicator. The CRC check applied to 9600 bps and 4800 bps Traffic Channel frames.
Global Positioning System (GPS). A US government satellite system that provides location and time
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Information to users. See Navstar GPS Space segment / Navigation User interfaces ICD-GPS-200 for
Specifications.
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Half Frame. A 10 ms interval on the paging Channel. Two half frames comprise a frame, the first half frame
begins at the same time as the frame.
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Handoff. The of transferring communication whth a station mobile station from one base station to another.
Hard Handoff. A handoff characterized by a temporary disconnection of the Traffic Channel. Hard handoffs
Occur when the mobile station is transferred between disjoint Active Sets, the CDMA frequency assignment
changes, the frame offset changes, or the mobile station is directed from a CDMA Traffic Channel to an analog
voice channel, See also Soft Handoff.

Hash Function. A function used by the mobile station to select one out of N available resource. The hash
function distributes the available resources uniformly among a random sample of mobile stations.

HLR. See Home Location Register.

Home Location Register (HLR). The location register to which a MIN is assigned for record purposes such as
subscriber information.

Home System. The cellular system in which the mobile station subscribes for service.

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Idle Handoff. The act of transferring reception of the Paging Channel from one bass station to another, when
the mobile station is in the Mobile Station Idle State.

Implicit Registration. A registrationachieved by a successful transmission of an origination or page response

on the Access Channel.

Interleaving. The process of permuting a sequence of symbols.

kHz. Kilohertz (103 Hertz).

ksps. Kilo-symbols per second (103 symbols per second).

Layer 1. See Physical Layer.

Layer 2. Layer 2 provides for the correct transmission and reception of signaling messages, including partial
duplicate detection. See also Layering and Layer 3.

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Layer 3. Layer 3 provides the control of the cellular telephone systems. Signaling messages originate and

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terminate at layer 3. See also Layering and Layer 2.
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Local Control. An optional mobile station feature used to perform manufacturer-specific functions.
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A PN sequence with period 242-1 that is used for scrambling on the Forward CDMA Channel and spreading on
the Reverse CDMA Channel. The long code uniquely identifies a mobile station on both the Reverse Traffic
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Channel and the Forward Traffic Channel. The long code provides limited privacy. The long code also
separates multiple Access Channels on the same CDMA channel. See also Public Long Code and Private Long
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Code.
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Long Code Mask. A 42-bit binary number that creates the unique identity of the long code. See also Public
Long Code, Private Long Code, Public Long Code Mask, and Private Long Code Mask.

LSB. Least significant bit.

Maximal Length Sequence (m-Sequence). A binary sequence of period 2n-1, n a positive integer, with no
internal periodicities. A maximal length sequence can be generated by a tapped n-bit shift register with linear
feedback.

Mcps. Megachips per second (106 chips per second).

Mean Input Power. The total received calorimetric power measured in a specified bandwidth at the antenna
connector, including all internal and external signal and noise sources.

Mean Output Power. The total transmitted calorimetric power measured in a specified bandwidth at the

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antenna connector when the transmitter is active.

Message. A data structure that conveys control information or application information. A message consists of a
length field (MSG_LENGTH), a message body (the part conveying the information), and a CRC.
Message Body. The part of the message contained between the length field (MSG_LENGTH) and the CRC
field.
Message Capsule. A sequence of bits comprising a single message and padding. The padding always follows
the message and may be of zero length.
Message CRC. The CRC associated with a message. See also Cyclic Redundancy Check.
Message Field. A basic named element in a message. A message field may consist of zero or more bits.
Message Record. An entry in a message consisting of one or more field that repeats in the message.
MHz. Megahertz.(106 Herz)
MIN. See Mobile Station Identification Number.
Mobile Protocol Capability Indicator (MPCI). A 2-bit field used to indicate 속 mobile station’s capabilities.

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Mobile Station. A station in the Domestic Public Cellular Radio Telecommunications Service intended to be
used while in motion or during halts at unspecified points. Mobile station include portable units (e.g., handheld

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personal units) and units installed in vehicles. .C
Mobile Station Class. Mobile station classes define mobile station characteristics such as slotted operation and
transmission power.
Mobile Station Identification Number (MIN). The 34-bit number that is a digital representation of the 10-digit
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directory telephone number assigned to a mobile station.
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Mobile Station Originated Call. A call originating from a mobile station.

Mobile Station Terminated Call. A call received by a mobile station (not to be confused with a disconnect or
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call release).
Mobile Switching Center (MSC). A configuration of equipment that provides cellular radiotelephone service.
X

Also called the Mobile Telephone Switching Office (MTSO)

Modulation Symbol. The output of the data modulator before spreading. On the Reverse Traffic Channel,
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64-ary orthogonal modulation is used and six code symbol (when the data rate is 9600bps) or each repeated code
symbol (when the data rate is less than 9600bps) is one modulation symbol.
Ms. Millisecond.
MSB. Most significant bit.
MSC. See Mobile Switching Center.
Multiplex Option. The ability of the multiplex sublayer and lower layer to be tailored to provide special
capabilities. A multiplex option defines such characteristics as the frame format and the rate decision rules. See
also Multiplex Sublayer.
Multiplex Sublayer. One of the conceptual layers of the system that multiplexes and demultiplexes primary
traffic, secondary traffic, and signaling traffic.
NAM. See Number Assignment Module.
Narrow Analog. A type of voice channel that uses 10kHz channel spacing and subaudible signaling.
Neighbor Set. The set of pilots associated with the CDMA Channel that are probable candidates for handoff.

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Normally, the Neighbor Set consists of the pilots associated with CDMA Channel that cover geographical areas
near the mobile station. See also Active Set, Candidate Set, and Remaining Set.
- A network is a subset of a cellular system, such as an area-wide cellular network, a private group of base
stations, or a group of base stations set up to handle a special requirement. A network can be as small or as
large as needed, as long as it is fully contained within a system. See also System.
Network Identification (NID). A number that uniquely identifies a network within a cellular system. See also
System Identification.
NID. See Network Identification.
Non-Autonomous Registration. A registration method in which the base station initiates registration. See also
Autonomous Registration.
Non-Slotted Mode. An operation mode of the mobile station in which the mobile station continuously monitors
the Paging Channel when in the Mobile Station Idle State.
Ns. Nanosecond.

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NULL. Not having any value.
Null Traffic Channel Data. One or more frames of 16 ‘1’s followed by eight ‘0’s sent at the 1200bps rate. Null

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Traffic Channel data is sent when no service option is active and no signaling message is being sent. Null
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Traffic Channel data serves to maintain the connectivity between the mobile station and the base station.
Number Assignment Module (NAM). A set of MIN-related parameters stored in the mobile station.
Numeric Information. Numeric information consists of parameters that appear as numeric fields in message
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exchanged by the base station and the mobile station and information used to describe the operation of the
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mobile station.
OLC. See Overload Class (CDMA) or Overload Control (analog).
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Optional Field. A field defined within a message structure that is optionally to the message recipient.
Order. A type of message that contains control codes for either the mobile station or the base station.
X

Ordered Registration. A registration method in which the base station orders the mobile station to send
registration related parameters.
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Overhead Message. A message sent by the base station on the Paging Channel to communicate
base-station-specific and system-wide information to mobile station.
Overload Class. The means used to control system access by mobile stations, typically in emergency or other
overload conditions. Mobile station are assigned one (or more) of sixteen overload classed, Access to the
CDMA system can then be controlled on a per class basis by persistence values transmitted by the base station.
Overload Control (OLC). A means reverse analog control channel accesses by mobile stations. Mobile station
are assigned one(or more) of sixteen control levels. Access is selectively restricted by a base station setting one
or more OLC bits in the Overload Control Global Action Message.
Packet. The unit of information exchanged between the service option applications of the base station and the
mobile station.
Padding. A sequence of bits used to fill from the end of a message to the end of a message capsule, typically to
the end of the frame or half frame. All bits in the padding are '0'.
Paging. The act of seeking a mobile station when a call has been placed to that mobile station.

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Paging Channel (Analog). See Analog Paging Channel.

Paging Channel (CDMA). A code channel in a Forward CDMA Channel used for transmission of control
information and pages from a base station to a mobile station.
Paging Channel Slot. An 80ms interval on the Paging Channel. Mobile station operating in the slotted mode are
assigned specific slots in which day monitor messages from the base station.
Parameter-Change Registration. A registration method in which the mobile station registers when certain of
its stored parameters change.
Parity Check Bits. Bits added to a sequence of information bits to provide error detection, correction, or both.
Persistence. A probability measure used by the mobile station to determine if it should transmit in a given
Access Channel Slot.
Physical Layer. The part of the communication protocol between the mobile station and the base station that is
responsible for the transmission and reception of data. The physical layer in the transmitting station is presented
a frame by the multiplex sublayer and transforms it into an over-the-air waveform. The physical layer in the

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receiving station transforms the waveform back into a frame and presents it to the multiplex sublayer above it.
Pilot Channel. An unmodulated, direct-sequence spread spectrum signal transmitted continuously by each

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CDMA base station. The Pilot Channel allows a mobile station to acquire the timing of the Forward CDMA
.C
Channel, provides a phase reference for coherent demodulation, and provides a means for signal strength
comparisons between base station for determining when to handoff.
Pilot PN Sequence. A pair of modified maximal length PN sequences with period 215 used to spread the
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Foward CDMA Channel and the Reserve CDMA Channel. Different base station are identified by different pilot
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PN sequence offsets.
Pilot PN Sequence Offset Index. The PN offset in units of 64 PN chips of a pilot, relative to the zero offset
-B

pilot PN sequence.
PN Chip. One bit in the PN sequence.
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PN Sequence. Pseudonoise sequence. A periodic binary sequence.

Power Control Bit. A bit sent in every 1.25ms interval on the Forward Traffic Channel to signal the mobile
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station to increase or decrease its transmit power.

Power Control Group. A 1.25ms interval on the Forward Traffic Channel and the Reverse Traffic Channel.
See also Power Control Bit.
Power-Down Registration. Au autonomous registration method in which the mobile station registers on power
up.
PPM. Parts per million.
Preamble. See Access Channel Preamble and Traffic Channel Preamble.
Primary CDMA Channel. A CDMA Channel at a pre-assigned frequency assignment used by the mobile
station for initial acquisition. See also Secondary CDMA Channel.
Primary Paging Channel (CDMA). The default code channel (code channel 1) assigned for paging on a
CDMA Channel.
Primary Traffic. The main traffic stream carried between the mobile station and the base station, supporting the
active promaty service option, on the Traffic Channel. See also Secondary Traffic, Signaling Traffic, and

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Servic3e Option.
Private Long Code. The long code characterized by the private long code mask. See also Long Code.
Private Long Code Mask. The long code mask used to form the private long code. See also Public Long Code
Mask and Long Code.
Public Long Code. The long code characterized by the public long code mask.
Public Long Code Mask. The long code mask used to form the private long code. The mask contains the ESN
of the mobile station. See also Private Long Code Mask and Long Code.
Punctured Code. An error-correcting code generated from another error-correcting code by deleting (i.e.,
puncturing) code symbols from the code output.
Quick Repeats. Additional transmissions of identical copies of a message within a short interval to increase the
probability that the message is received correctly.
Receive Objective Loudness Rating (ROLR). A perceptually weighted transducer gain of telephone receivers
relating electrical excitation from a reference generator to sound pressure at the earphone. The receive objective

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loudness tating is normally specified in dB relative to one Pascal per millivolt. See IEEE Standard 269-1992,
IEEE Standard 661-1979, CCITT Recommendation P.76, and CCITT Recommendation P.79.

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Registration. The process by which a mobile station identifies its location and parameters to a base station.
.C
Registration Zone. A collection of one or more base stations treated as a unit when determining whether a
mobile station should perform zone-based registration.
Release. A process that the mobile station and base station use to inform each other of call disconnect.
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The set of all allowable pilot offsets as determined by PILOT_INC, excluding the pilot offsets of the pilots in
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the Active Set, Candidate Set, and Neighbor Set. See also Active Set, Candidate Set, and Neighbor Set.
Request. A layer 3 message generated by either the mobile station or the base station to retrieve information, ask
-B

for service, or command an action.

Response. A layer 3 message generated as a result of another message, typically a request.
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Reverse Analog Control (RECC). The analog control channel used from a mobile station to a base station.
Reverse Analog Voice Channel (RVC). The analog voice channel used from a mobile station to a base station.
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Reverse CDMA Channel. The CDMA Channel from the mobile station to the base station. From the base
station’s perspective, the Reverse CDMA Channel is the sum of all mobile station transmissions on a CDMA
frequency assignment.
Reverse Traffic Channel. A Reverse CDMA Channel used to transport user and signaling traffic from a single
mobile station to one or more base stations.
Roamer. A mobile station operating in a cellular system (or network) other than the one from which service was
subscribed. See also Foreign NID Roamer and Foreign SID Roamer.
ROLR. See Receive Objective Loudness Rating.
SAT. See Supervisory Audio Tone.
Scan of Channels. The procedure by which a mobile station examines the signal strength of each forward
analog control channel.
SCI. Synchronized Capsule Indicator bit.
Search Window. The range of PN sequence offsets that a mobile station searches for a pilot.

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Secondary CDMA Channel. A CDMA Channel at a preassigned frequency assignment used by the mobile
station for initial acquisition. See also Primary CDMA Channel.
Secondary Traffic. An additional traffic stream that can be carried between the mobile station and the base
station on the Traffic Channel. See also Primary Traffic and Signaling Traffic.
Seizure Precursor. The initial digital sequence transmitted by a mobile station to a base station on a reverse
analog control channel.
Seizure Option. A service capability of the system. Service options may be applications such as voice, data, or
facsimile.
Shard Secret Data (SSD). A 128-bit pattern stored in the mobile station (in semi-permanent memory) and
known by the base station. SSD is a concatenation of two 64-bit subsets: SSD_A, which is used to support the
authentication procedures and SSD_B, which serves as one of the inputs to the process generating the
encryption mask and private long code.
Short Message Services (SMS). A suite of services which include SMS Text Delivery, Digital Paging (i.e., Call

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Back Number – CBN), and Voice Mail Notification (VMN).
SID. See System Identification.

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Signaling Tone. A 10kHz tone transmitted by a mobile station on an analog voice channel to: 1) confirm orders,
.C
2)signal flash requests, and 3) signal release requests.
Signal Traffic. Control message that are carried between the mobile station and base station on the Traffic
Channel. See also Primary Traffic and Secondary Traffic.
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Slot Cycle. A periodic interval at which a mobile station operating in the slotted monitors the Paging Channel.
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Slotted Mode. An operation mode of the mobile station in which the mobile station monitors only selected slots
on the Paging Channel when in the Mobile Station Idle State.
-B

Soft Handoff. A handoff occurring while the mobile station is in the Mobile Station Control on the Traffic
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Channel State. This handoff is characterized by commencing communications with a new base station on the
same CDMA frequency assignment before terminating communications with the old base station. See also Hard
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Handoff.
SOM. Start-of-Message Bit.
SPS. Symbols per second.
- An identification of certain characteristics of a mobile station. Classes are defined in Table 2.3.3-1.
Status Information. The following status information is used to describe mobile station operation when using the
analog system.
z Serving-System Status. Indicates whether a mobile station is turned to channels associated with System A
or System B.
z First Registration ID Status. A status variable used by the mobile station in association with its processing
of received Registration ID messages.
z First Location Area ID Status. A status variable used by the mobile station in association with its
processing of received Location Area ID messages.
z Location Registration ID Status. A status variable used by the mobile station in association with its

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processing of power-up registration and location-based registration.

z First Idle ID Status. A status variable used by the mobile station in association with its processing of the
Idle Task.
z Local Control Status. Indicates whether a mobile station must respond to local control messages.
z Roam Status. Indicates whether a mobile station is in its home system.
z Termination Status. Indicates whether a mobile station must terminate the call when it is on an analog
voice channel.

Supervisory Audio Tone (SAT). One of three tones in the 6 kHz region that is transmitted on the forward
analog voice channel by a base station and transponder on the reverse analog voice channel by as mobile station.
Supplementary Digital Color Code (SDCC1, SDCC2). Additional bits assigned to increase the number of
color codes from four to sixty four, transmitted on the forward analog control channel.
Symbol. See Code Symbol and Modulation Symbol.

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Sync Channel. Code channel 32 in the Forward CDMA Channel which transports the synchronization message
to the mobile station.

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Sync Channel Superframe. An 80ms interval consisting of three Sync Channel frames (each 26.666…ms in
.C
length).
System. A system is a cellular telephone service that covers a geographic area such as a city. Metropolitan
region, country, or group of countries. See also Network.
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System Time. The time reference used by the system. System Time is synchronous to UTC time(except for
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leap seconds) and used the same time origin as GPS time. Offset by the propagation delay from the base station
to the mobile station. See also Universal coordinated Time.
-B

Timer-Based Registration. A registration method in which the mobile station registers whenever a counter
reaches a predetermined value. The counter is incremented an average of once per 80 ms period.
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Time Reference. A reference established by the mobile station that is synchronous with the earliest arriving
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multipath component used for demodulation.

TOLR. See Transmit Objective Loudness Rating.
Traffic Channel. A communication path between a mobile station and base station used for user and signaling
traffic. The term Traffic Channel implies a Forward Traffic Channel and Reverse Traffic Channel pair. See also
Forward Traffic Channel and Reverse Traffic Channel.
Traffic Channel Preamble. A sequence of all-zero frames that is sent at the 9600 bps rate by the mobile
station on the Reverse Traffic Channel. The Traffic Channel preamble is sent during initialization of the Traffic
Channel.
Transmit Objective Loudness Rating(TOLR). A perceptually weighted transducer gain of telephone
transmitters relation sound pressure at the microphone to voltage at a reference electrical termination. It is
normally specified in dB relative to one millivolt per Pascal. See IEEE Standard 269-1992, IEEE Standard
661-1979, CCITT Recommendation P.76 , and CCITT Recommendation. P.79
Unique Challenge-Response Procedure. An exchange of information between a mobile station and a base

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station for the purpose of confirming the mobile station’s identity. The procedure is initiated by the base station
and is characterized by the use of a challenge-specific random number(i.e., RANDU) instead of the random
variable broadcast globally(RAND).
Unique Random Variable(RANDU). A 24-bit random number generated by the base station in support of the
Unique Challenge-Response procedure.
Universal Coordinated Time(UTC). An internationally agreed-upon time scale maintained by the Bureau
International de l’Heure(BIH) used as the time reference by nearly all commonly available time and frequency
distribution systems i.e., WWW, WWVH, LORAN-C, Transit, Omega, and GPS.
UTC. Universal Temps Coordine. See Universal Coordinated Time.
Voice Channel. See Analog Voice Channel.
Voice Mobile Attenuation Code(VMAC). A 3-bit field in the Extended Address Word commanding the initial
mobile power level when assigning a mobile station to an analog voice channel.
Voice Privacy. The process by which user voice transmitted over a CDMA Traffic Channel is a afforded a

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modest degree of protection against eavesdropping over the air.

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Walsh Chip. The shortest identifiable component of a Walsh function.
.C There are 2N Walsh chips in one
Walsh function where N is the order of the Walsh function. On the Forward CDMA channel one Walsh chip
equals 1/1.2288MHz, or 813.802…ns. On the Reverse CDMA Channel, one Walsh chip equals 4/1.2288MHz,
or 3.255…㎲.
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Walsh Function. One of 2N time orthogonal binary functions (note that the functions are orthogonal after
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mapping ‘0’ to 1 and ‘1’ to –1).

Zone-Based Registration. An autonomous registration method in which the mobile station registers whenever it
-B

enters a zone that is not in the mobile station’s zone list.

㎲. Microsecond
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