E01-ML01S User Manual

nRF24L01P 2.4GHz SMD Wireless Module

 Chengdu Ebyte Electronic Technology Co., Ltd. E01-ML01S User Manual

1.Overview

1.1 Brief introduction

E01-ML01S is a small size SMD module based on original
imported nRF24L01P form Nordic in Norway, operates at 2.4Ghz with
PCB antenna.
The RF performance of E01-ML01S and components selection
during R&D are all in accordance with industrial grade standards,
using industrial-grade high-precision 16MHz crystal oscillator, also it
obtained FCC, CE and RoHS certification.
The user needs to use the MCU driver or use a dedicated SPI
debugging tool to develop E01-ML01S.

1.2 Features
 Communication distance tested is up to 100m;
 Maximum transmission power of 1mW, software multi-level adjustable;
 Support air date rate of 2Mbps, 1Mbps, 250kbps;
 125 communication channels to meet the needs of multi-point communication, grouping, frequency hopping, etc.
 Connect to the MCU through the SPI interface at a rate of 0 to 10 Mbps.
 Support 2.0V~3.6V power supply, power supply over 3.3V can guarantee the best performance；
 Industrial grade standard design, support -40 ~ 85 °C for working over a long time；
 PCB antenna;
 Enhanced ShockBurst, fully compatible with NORDIC all nRF24L, nRF24E, nRF24U series.

1.3 Application
 Wearable device；
 Smart home and industrial sensors；
 Security system, positioning system；
 Wireless remote control, drone；
 Wireless game remote control；
 Healthcare products；
 Wireless voice, wireless headset；
 Automotive industry applications.

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 Chengdu Ebyte Electronic Technology Co., Ltd. E01-ML01S User Manual

2. Specification and parameter

2.1 Limit parameter

Performance
Main parameter Remark
Min. Max.
Voltage over 3.6V will cause permanent
Power supply（V） 0 3.6
damage to module
Chances of burn is slim when modules
Blocking power（dBm） - 10
are used in short distance
Operating temperature（℃） -40 85

2.2 Operating parameter

Performance
Main parameter Remark
Min. Typ. Max.
Operating voltage（V） 2.0 3.3 3.6 ≥3.3V ensures output power
For 5V TTL, it may be at risk of
Communication level（V） 3.3
burning down
Operating temperature（℃） -40 - +85 Industrial design
Operating frequency（MHz） 2.4 - 2.525 Support ISM band
TX current（mA） 13 Instant power consumption
Power
RX current（mA） 12
consumption
Sleep current （μA） 1.0 Software is shut down
Max Tx power（dBm） -0.2 0 0.3
Receiving sensitivity（dBm） -92 -93 -94 Air data rate is 250kbps
Air data rate（bps） 250k - 2M Controlled via user’s programming

Main parameter Description Remark

Test condition：clear and open area, antenna gain: 5dBi，antenna
Distance for reference 100m
height: 2.5m，air data rate: 250kbps
FIFO 32Byte Max length transmitted each time
Crystal frequency 16MHz
Modulation GFSK
Package SMD
Connector 1.27mm
Communication interface SPI 0-10Mbps
Size 12 * 19mm Without SMA
Antenna PCB antenna 50ohm impedance

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 Chengdu Ebyte Electronic Technology Co., Ltd. E01-ML01S User Manual

3. Size and pin definition

Pin No. Pin item Pin direction Pin application

1 VCC Power supply must be 20. ~ 3.6V

2 CE Input Chip Enable
3 CSN Input SPI Chip select
4 SCK Input SPI clock
5 MOSI Input SPI master output slave input
6 MISO Output SPI master input slave output
7 IRQ Output Interrupt request.
8 GND Ground

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 Chengdu Ebyte Electronic Technology Co., Ltd. E01-ML01S User Manual

4.Basic operation

4.1 Hardware design

 It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded；
 Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module；
 Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged;
 Please check the stability of the power supply, the voltage can not be fluctuated frequently；
 When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;
 The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
 High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer；
 Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；
 It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done；
 Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding
can be done.
 If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage)；
 Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；
 The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside；
 The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
 Conductors or other sources of interference should be avoided around the onboard PCB antenna.

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 Chengdu Ebyte Electronic Technology Co., Ltd. E01-ML01S User Manual

4.2 Software editing

 Insert the module into the user circuit board, use the microcontroller to communicate with the module by SPI or
serial port, and operate the control register and the transceiver buffer through the SPI command to complete the
wireless data transmit and receive function. For the timing operation of the module register read and write
operations, please refer to the latest nRF24L01P data sheet.
 As interrupt pin for IRQ, it can be used to wake-up MCU and achieve fast response; But the user can get the
interrupt status through SPI (not recommended, it is not conducive to the overall power consumption, and with low
efficiency）；
 CE pin can be high level for long-term, but it needs to set as POWER DOWN mode when the module writes
registers, and it is recommended that CE is controlled by MCU pin；

5. Basic application

5.1 Basic circuit diagram

6.FAQ

6.1 Communication range is too short

 The communication distance will be affected when obstacle exists.

 Data lose rate will be affected by temperature, humidity and co-channel interference.
 The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
 Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
 The signal will be affected when the antenna is near metal object or put in a metal case.
 Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).

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 Chengdu Ebyte Electronic Technology Co., Ltd. E01-ML01S User Manual

 The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
 Due to antenna quality or poor matching between antenna and module.

6.2 Module is easy to damage

 Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
 Please check the stability of power source, the voltage cannot fluctuate too much.
 Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
 Please ensure the humidity is within limited range, some parts are sensitive to humidity.
 Please avoid using modules under too high or too low temperature.

6.3 BER(Bit Error Rate) is high

 There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
 Poor power supply may cause messy code. Make sure that the power supply is reliable.
 The extension line and feeder quality are poor or too long, so the bit error rate is high;

7.Soldering guidance

7.1 Reflow soldering temperature

Sn-Pb
Profile Feature Curve characteristics Pb-Free Assembly
Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5

Preheat Temperature min （Tsmin） Min preheating temp. 100℃ 150℃

Preheat temperature max (Tsmax) Mx preheating temp. 150℃ 200℃

Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec

Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3℃/second max 3℃/second max

Liquidous Temperature (TL) Liquid phase temp. 183℃ 217℃

Time（tL）Maintained Above（TL） Time below liquid phase line 60-90 sec 30-90 sec

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 Chengdu Ebyte Electronic Technology Co., Ltd. E01-ML01S User Manual

Peak temperature（Tp） Peak temp. 220-235℃ 230-250℃

Aveage ramp-down rate（Tp to Tsmax） Average ramp-down rate 6℃/second max 6℃/second max

Time to peak temperature for

Time 25℃ to peak temperature 6 minutes max 8 minutes max
25℃

7.2 Reflow soldering curve

8. E01 Series

Test
Frequency Tx power
Model No. IC distance Package Antenna
Hz dBm km
E01-ML01S nRF24L01P 2.4G 0 0.1 SMD PCB

E01-ML01D nRF24L01P 2.4G 0 0.1 DIP PCB

E01-ML01IPX nRF24L01P 2.4G 0 0.2 SMD IPEX

E01-ML01DP4 nRF24L01P 2.4G 20 1.8 DIP PCB

E01-ML01DP5 nRF24L01P 2.4G 20 2.5 DIP SMA-K

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 Chengdu Ebyte Electronic Technology Co., Ltd. E01-ML01S User Manual

E01-ML01SP2 nRF24L01P 2.4G 20 1.8 SMD PCB/IPEX

E01-ML01SP4 nRF24L01P 2.4G 20 2 SMD IPEX

E01-2G4M27D nRF24L01P 2.4G 27 5 DIP SMA-K

9.Packing

9.1 Anti-statistic pallet

Revision history

Version Date Description Issued by

1.0 2017/11/15 Original version huaa

1.1 2018/05/22 Content updated huaa

1.2 2018/09/06 Model No. split huaa

1.3 2019/10/11 ren

1.4 2019/10/25 ren

1.5 2020/04/22 Modify the basic circuit diagram of page 5 Ken

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 Chengdu Ebyte Electronic Technology Co., Ltd. E01-ML01S User Manual

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