VN5R003H-E

3 mΩ reverse battery protection switch

Datasheet − production data

Features

Max supply voltage VCC -16 to 41 V

Operating voltage range VCC -16 to 28 V

On-state resistance RON 3 mΩ

GA P GC FT00135

HPak
■ General
– Optimized electromagnetic emissions
Description
– Very low electromagnetic susceptibility
– Compliant with European directive The VN5R003H-E is a device made using
2002/95/EC STMicroelectronics® VIPower® technology. It is
intended for providing reverse battery protection
■ Protections
to an electronic module.
– Automatic switch off in case of negative
input voltage This device has two power pins (Drain and
– Electrostatic discharge protection Source) and a control pin IN. If the IN voltage
versus Drain is negative the device is turned on.

Application A negative voltage of Drain pin versus IN

automatically turns off the device. When IN is left
■ Reverse battery protection of an electronic open, device is in OFF-state and behaves like a
control unit power diode between Source and Drain pins.

Table 1. Device summary

Order codes
Package
Tube Tape and reel

HPAK VN5R003H-E VN5R003HTR-E

September 2013 Doc ID 17602 Rev 6 1/20

This is information on a product in full production. www.st.com 1
Contents VN5R003H-E

Contents

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.1 HPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.2 HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.3 HPAK suggested land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.4 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2/20 Doc ID 17602 Rev 6

VN5R003H-E List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 5. Power section for reverse battery mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 10. HPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 11. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Doc ID 17602 Rev 6 3/20

List of figures VN5R003H-E

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Maximum pulsed drain current (VBATT = 13 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Battery supplied systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Switched systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 9. HPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 10. Thermal fitting model of a single-channel HSD in HPAK . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 11. HPAK package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 12. HPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 13. HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 14. HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4/20 Doc ID 17602 Rev 6

VN5R003H-E Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

SOURCE

IN DRIVER
DRAIN

Table 2. Pin function

Name Function

Drain Power MOS drain

Source Power MOS source

IN Control pin

Doc ID 17602 Rev 6 5/20

Block diagram and pin description VN5R003H-E

Figure 2. Configuration diagram (top view)

1 - SOURCE
2 - SOURCE
3 - IN
4 - DRAIN
5 - NC
6 - SOURCE
7 - SOURCE
TAB - DRAIN
      

*$3*&)7

6/20 Doc ID 17602 Rev 6

VN5R003H-E Electrical specifications

2 Electrical specifications

Figure 3. Current and voltage conventions

IS

SOURCE

ID

DRAIN

IN VCC VD VS

VIN IN

2.1 Absolute maximum ratings

Stressing the device above the rating listed in Table 3 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to the conditions in table below for extended periods may affect device reliability.

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit

VS Source power terminal DC voltage (reverse battery mode) -16 to 41 V

IS, ID Source or Drain current 60 A
-IS, -ID Reverse currents 60 A
Inductive clamp energy
EMAX 0.9 J
L = 2 mH, VD = 0 V, IN open, IS < 0, Tjstart = 25°C
Electrostatic discharge
VESD (Human Body Model: R = 1.5 KΩ; C = 100 pF) 5000 V
- All terminals
VESD Charge device model (CDM-AEC-Q100-011) 1000 V
Tj Junction operating temperature -40 to 150 °C
Tstg Storage temperature -55 to 150 °C

Doc ID 17602 Rev 6 7/20

Electrical specifications VN5R003H-E

2.2 Thermal data

Table 4. Thermal data
Symbol Parameter Max. Unit

Rthj-case Thermal resistance junction-case 0.5 °C/W

Thermal resistance junction-ambient (mounted on FR4
Rthj-amb 42 °C/W
using 6 cm2 copper pad)

2.3 Electrical characteristics

Table 5. Power section for reverse battery mode(1)
Symbol Parameter Test conditions Min. Typ. Max. Unit

VS Operating supply voltage — -16 13 28 V

Drain-Source clamp
VCLPDS VD = 0 V, IN open, IS = -5 A 17 23 V
voltage
Drain input clamp
VCLPDIN VIN = 0 V, ID = 20 mA 41 52 V
voltage
VF Source drain voltage IN = open, IS = 10 A; Tj = 25°C 0.85 V
IS = 10 A; Tj = 25°C;
On state resistance 3
8 V < VCC < 28 V
RON between SOURCE and mΩ
Drain terminals IS = 10 A; Tj = 150°C;
5.5
8 V < VCC < 28 V
IIN Input current VS = 13 V , VIN = 0 V 2 3 mA
IIN(REV) Reverse input current VS = -16 V, VIN = 0 V -2 0 mA
IOUT_rev Output reverse current VS = -16 V, VD = 0 V, IN open -1.5 -0.5 mA
1. Operating conditions: 40°C < Tj < 150°C

8/20 Doc ID 17602 Rev 6

VN5R003H-E Electrical specifications

Table 6. Electrical transient requirements (part 1)

Burst cycle/pulse
ISO 7637-2: Test levels(1) Number of
repetition time Delays and
2004(E) pulses or
Impedance
Test pulse test times
III IV Min. Max.

1(2) -75 V -100 V 5000 pulses 0.5 s 5s 2 ms, 10 Ω

2a +37 V +50 V 5000 pulses 0.2 s 5s 50 µs, 2 Ω
3a -100 V -150 V 1h 90 ms 100 ms 0.1 µs, 50 Ω
3b +75 V +100 V 1h 90 ms 100 ms 0.1 µs, 50 Ω
4 -6 V -7 V 1 pulse — 100 ms, 0.01 Ω
(3)
5b +65 V +87 V 1 pulse — 400 ms, 2 Ω
1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b.
2. The device does not turn Off once the ISO pulse is applied.
3. Valid in case of external load dump clamp: 40 V maximum referred to ground.

Table 7. Electrical transient requirements (part 2)

ISO 7637-2: Test level results(1)
2004(E)
Test pulse III IV

1 C C
2a C C
3a C C
3b C C
4 C C
5b(2) C C
1. Transient pulses have been applied with the INPUT pin grounded with R1>5Ω.
2. Valid in case of external load dump clamp: 40V maximum referred to ground.

Table 8. Electrical transient requirements (part 3)

Class Contents

C All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device are not performed as designed after exposure to
E
disturbance and cannot be returned to proper operation without replacing the device.

Doc ID 17602 Rev 6 9/20

Electrical specifications VN5R003H-E

Figure 4. Maximum pulsed drain current (VBATT = 13 V)

0D[LPXP3XOVHG'UDLQ&XUUHQW


 ƒ&
ƒ&
,PD[$






      
3XOVHVHF *$3*&)7
Note:
PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 35 mm,
Copper areas: minimum pad lay-out and 2 cm2

10/20 Doc ID 17602 Rev 6

VN5R003H-E Application information

3 Application information

Figure 5 shows the solution for systems supplied directly from the battery. If the system
goes into Stand-by mode, the transistor T1 is switched off by the microcontroller with zero
quiescent current. System is still supplied through the PowerMOS body diode.

Figure 5. Battery supplied systems

,*1,7,216:,7&+

7RV\VWHPVXSSO\
6 '

92/7$*(
5(*8/$725
9EDW &+$5*(3803
&+$5*( 3803

—&
,1

5

7

("1($'5

Figure 6 refers to a solution for systems supplied after the ignition switch. Low quiescent
currents are not strictly required, so resistor R1 can be directly connected to ground.

Figure 6. Switched systems

7RV\VWHPVXSSO\
6 '

92/7$*(
5(*8/$725
9EDW &+$5*(3803
&+$5*( 3803

—&
,1

5

("1($'5

Doc ID 17602 Rev 6 11/20

Package and PC board thermal data VN5R003H-E

4 Package and PC board thermal data

4.1 HPAK thermal data

Figure 7. PC board

Note:
Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10%, board double layer, board
dimension 78 mm x 86 mm, board material FR4, Cu thickness = 70 µm (front and back side), thermal vias separation
1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm, footprint dimension 6.4 mm x 7 mm).

Figure 8. Rthj-amb vs PCB copper area in open box free air condition

57+MBDPEƒ&:





 57+MDPE





     
3&%&XKHDWVLQNDUHDFPA
("1($'5

12/20 Doc ID 17602 Rev 6

VN5R003H-E Package and PC board thermal data

Figure 9. HPAK thermal impedance junction ambient single pulse

=7+ƒ&:


&X FP
&X FP
&X IRRWSULQW



      
7LPHV
*$3*&)7

Figure 10. Thermal fitting model of a single-channel HSD in HPAK

GAPGCFT 00133

Note:
The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections
(power limitation or thermal cycling during thermal shutdown) are not triggered.

Doc ID 17602 Rev 6 13/20

Package and PC board thermal data VN5R003H-E

Equation 1: pulse calculation formula

Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )

where δ = tP/T

Table 9. Thermal parameter

Area/island (cm2) Footprint 4 8

R1 (°C/W) 0.01

R2 (°C/W) 0.15

R3 (°C/W) 1

R4 (°C/W) 8

R5 (°C/W) 28 21 12

R6 (°C/W) 31 24 16

C1 (W.s/°C) 0.005

C2 (W.s/°C) 0.05

C3 (W.s/°C) 0.08

C4 (W.s/°C) 0.4

C5 (W.s/°C) 0.8 1.4 3

C6 (W.s/°C) 3 6 9

14/20 Doc ID 17602 Rev 6

VN5R003H-E Package and packing information

5 Package and packing information

5.1 ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

5.2 HPAK mechanical data

Figure 11. HPAK package dimension

GAPGCFT00134

Doc ID 17602 Rev 6 15/20

Package and packing information VN5R003H-E

Table 10. HPAK mechanical data

Data book mm
Ref. dim
Typ Min. Max.

A — 2.20 2.40
A1 — 0.90 1.10
A2 — 0.03 0.23
b — 0.45 0.60
b4 — 5.20 5.40
c — 0.45 0.60
c2 — 0.48 0.60
D — 6.00 6.20
D1 5.10 — —
E — 6.40 6.60
E1 5.20 — —
e 0.85 — —
e1 — 1.60 1.80
e2 — 3.30 3.50
e3 — 5.00 5.20
H — 9.35 10.10
L — 1 —
(L1) 2.80 — —
L2 0.80 — —
L4 — 0.60 1.00
R 0.20 — —
V2 — 0° 8°

16/20 Doc ID 17602 Rev 6

VN5R003H-E Package and packing information

5.3 HPAK suggested land pattern

Figure 12. HPAK suggested pad layout(a)

All dimensions are in mm.

5.4 Packing information

Figure 13. HPAK tube shipment (no suffix)

A Base q.ty 75
C Bulk q.ty 3000
Tube length (± 0.5) 532
A 6
B 21.3
C (± 0.1) 0.6
All dimensions are in mm.
B

a. The land pattern proposed is not intended to over-rule User's PCB design, manufacturing and soldering
process rules

Doc ID 17602 Rev 6 17/20

Package and packing information VN5R003H-E

Figure 14. HPAK tape and reel (suffix “TR”)

REEL DIMENSIONS
All dimensions are in mm.
Base q.ty 2500
Bulk q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4

TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 16
Tape hole spacing P0 (± 0.1) 4
Component spacing P 8
Hole diameter D (± 0.1/-0) 1.5
Hole diameter D1 (min) 1.5
Hole position F (± 0.05) 7.5
Compartment depth K (max) 2.75
Hole spacing P1 (± 0.1) 2

All dimensions are in mm.

End

Start

Top No components Components No components

cover
tape 500mm min
Empty components pockets 500mm min
saled with cover tape.

User direction of feed

18/20 Doc ID 17602 Rev 6

VN5R003H-E Revision history

6 Revision history

Table 11. Document revision history

Date Revision Changes

23-Jun-2010 1 Initial release.

06-Jul-2010 2 Updated Table 4: Thermal data.
06-Oct-2010 3 Added Figure 4: Maximum pulsed drain current (VBATT = 13 V)
Changed document status from target specification to datasheet.
Table 3: Absolute maximum ratings:
– Removed VD row
Table 5: Power section for reverse battery mode
18-Nov-2010 4 – IIN: added maximum value
Table 6: Electrical transient requirements (part 1)
– Added Note 2
Updated Figure 5: Battery supplied systems and Figure 6: Switched
systems
17-Apr-2012 5 Updated Figure 4: Maximum pulsed drain current (VBATT = 13 V)
19-Sep-2013 6 Updated Disclaimer

Doc ID 17602 Rev 6 19/20

 VN5R003H-E

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20/20 Doc ID 17602 Rev 6