NE203 Assignment-3 Solution 2020
NE203 Assignment-3 Solution 2020
15ppm wafer has oxygen solubility of 15 · 10−6 × 5 · 1022cm−3 = 7.5 · 1017cm−3. Wafer is
super-saturated at 1234oC, as seen from the graph.
2 Denuding
Heating the wafer in Oxygen free atmosphere causes out diffusion of the dissolved Oxygen
from the wafer. Nitrogen ambient (oxygen free) keeps the surface concentration of
Oxygen in Silicon negligible.
= Cberf(
Cb is the concentration in the bulk. In our case, Cb = 15ppma = 7.5 · 1017cm−3. C(x < 10µm)
< 1ppma = 5 · 1016cm−3 to ensure no precipitate formation in the active area.
C(10µm) < 5 · 1016cm−3 = 7.5 · 1017erf(10µm/2LD)cm−3
Minimum time required for denuding can be found by substituting the diffusion constant
in the diffusion length for a given temperature. (tmin(T) = L2D/D(T))
Figure 2: (a) Minimum denuding time for different temperatures (b) Comparison
between 1ppma and 10ppma DNZ Oxygen concentration (without considering out-
diffusion from the back surface)
5 Super-Saturation
For a concentration that is saturated at a given temperature, becomes super saturated, as
the saturation solubility decreases with decreasing temperature.
6 Nucleation
Gibbs Free Energy of a spherical precipitate of radius r is given by:
Maxima occurs at r = r∗ = −2γ/∆GV , and the Gibbs Free Energy barrier G(r∗).
From the figure, we can see that nucleus density n > 1012cm−3 for T < 690oC.
8 Nucleation Rate
Oxygen impingement frequency on critical nucleus (ripening rate): ν = 4π(r∗)2ZnoD/a
Where, Z = 0.001, a = 2.35Ao, D: diffusivity of Oxygen in Silicon. Nucleation Rate:
R(T,Ci) = n(T,Ci)ν(T,Ci)
Nucleation rate is maximum at 728oC. For neq = 1012cm−3, nucleation rate R(690oC) =
3.66 · 106cm−3s−1. It will take 76 hours to form 1012cm−3 nuclei. During this time, DNZ
(Denuded Zone), which has 1ppm concentration is considerably less supersaturated (TE
= 950oC), hence has lower nucleation rate. From the graph, we can see that no nucleus
will form in 10hr in DNZ. This (690oC, 76 hours) does not compare well with the recipe
given in the figure (700oC, 4hr). Note: In that case, DNZ concentration is 10ppm, which
causes a nucleation rate of 2.4·103cm−3/s, or 6.9·107cm−3 nuclei, which are still negligible
compared to 1012cm−3.
Assuming the concentration to be symmetric in θ,φ all the time. (Unnecessary, but
simplifying)
Figure 5: (a) Nucleation Rate and Nucleus Density using TE = 1350oC (b) Nucleation Rate
at 728oC for different initial concentrations, with TE taken from solid solubility curve [2]
∂ 2∂C
(r )=0
∂r ∂r
2∂C
r =A
∂r
C(r) = B − A/r
C(R) = B − A/R = Cs
C(∞) = B = Ci
R
C (r )= C i − (C i − C s )
r
That is a reasonable time. Compared to that, the recipe has 15hr of growth step at the
same temperature.
To remove the impurities from the DNZ, the impurities need to diffuse from the active
area towards the precipitates. Assuming the concentration at the edge of the DNZ: C(L) =
0, and no flux at the surface = 0, the general solution of 1D diffusion equation by
variable separable method:
where, τa = L2/D, on substituting boundary and initial conditions becomes
πx t
C (x,t )= C i cos ( )exp (− 2. 5 )
2L τa
Relative solubilities of different metals in Silicon (extended for 600-1000oC) Diffusivities of different metals in Silicon (extended for 600-1000oC)
Note: n > 1 harmonics are ignored as they decay quickly, leaving only n = 1 after an initial
transient. In t = τa, C/Ci < 10−9, where, L = 120µm. Time required to clean different
impurities from the bulk and the DNZ:
Metal Fe Cu Aus
τo 10ms 0.1ms 100ms
8τa 10min 12s 3.2hr
Table 2: Gettering time for different impurities at 1000oC
References
[1] J. C. Mikkelsen, Jr., ”Oxygen, Carbon, Hydrogen, and Nitrogen in Silicon”, Materials
Research Society, Princeton, NJ, p. 419, 1986.
[2] Patel, Dasharath, ”Precipitation and denuded zone formation in silicon single crystal
during high temperature anneal”. Master’s Theses. Paper 789, 1994.
[3] A. Borghesi et. al. ”Oxygen precipitation in silicon”,Journal of Applied Physics, Vol 77,
1995.