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Kaiser
Service Manual

HTC Proprietary
U

Confidential Treatment Requested

Rev. A02

HTC Corp.
Engineering Mobility

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REVISION CONTROL TABLE

REV DATE CONTENTS DEPT REVISED STAGE

AX01 2007/06/07 Fist Draft PSE Justin_Hsu CVT
1. Modify product overview
A01 2007/08/31 2. include warranty and LDI label to label plan PSE Justin_Hsu MV
3. Add RF spec
1. Add 2.3 Assembly Tips
2. Correct Screw P/N to 72H02293-00M in 9.1
A02 2007/11/26 PSE Steven_Liu MV
SPL for repair
3. Add 5.1 Main board leakage current test procedure
1. Add repair notice for Qwerty keypad assembly
procedure in page 33
A03 2008/2/1 2. Add TOPPOLY LCD into assembly tips in page 38 PSE Steven_Liu MV
3. Modify SPL note and photo for adding
Refurbishment item

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Table of Contents
1. INTRODUCTION ....................................................................................................................................................................4

1.1 PRODUCT FEATURES .......................................................................................................................................................5

1.2 PRODUCT OVERVIEW .....................................................................................................................................................11

2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ................................................................................18

2.1 DISASSEMBLING PROCEDURE ........................................................................................................................................18

2.2 ASSEMBLING PROCEDURE .............................................................................................................................................27
2.3 ASSEMBLY TIPS ..............................................................................................................................................................38

3. ROM RE-FLASH PROCEDURE ........................................................................................................................................40

3.1 ROM UPGRADE THRU RUU (RE-FLASH UPGRADE UTILITY) ........................................................................................40

3.2 ROM IMAGE UPGRADE THRU SD CARD..........................................................................................................................43

4. DIAGNOSTIC PROGRAM ..................................................................................................................................................45

4.1 LIST OF DIAGNOSTIC / WINCE TEST ITEMS ..................................................................................................................45

5. POWER MEASUREMENT TEST ......................................................................................................................................55

5.1 MAIN BOARD LEAKAGE CURRENT TEST PROCEDURE ...................................................................................................55

5.2 BATTERY RUNDOWN TEST PROCEDURE .........................................................................................................................59

6. COSMETIC INSPECTION CRITERIA...............................................................................................................................64

6.1 CLASSES DEFINITION OF INSPECTIVE AREA ...................................................................................................................64

6.2 DISPLAY INSPECTION .....................................................................................................................................................65
6.3 MAIN UNIT INSPECTION ..................................................................................................................................................65

7. GENERIC TROUBLESHOOTING .....................................................................................................................................66

8. GENERIC LABELING PLAN..............................................................................................................................................71

9. GENERIC SPARE PART LIST AND PHOTOS................................................................................................................82

9.1 SPL FOR REPAIR ...........................................................................................................................................................82

9.2 BOARD LEVEL 2.5 REPAIRS ...........................................................................................................................................88

10. RF ANTENNA SPECIFICATION ...................................................................................................................................93

10.1 EU ANTENNA .................................................................................................................................................................93

10.2 US ANTENNA .................................................................................................................................................................94

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1. Introduction
ƒ This manual provides the technical information to support the service activities of Kaiser.
ƒ This document contains highly confidential information, so any or all of this document should not be revealed to
any third party.
z Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After
reading this chapter, you will know what feature the product has and basic hardware
operation. Also you will know how to perform soft-rest and hard-rest in this chapter.
z Chapter 2: Device Dissembling and Assembling Procedure- After reading this chapter, you will
learn how to disassemble and assemble the product. Also, you will know what tools to
use and the torque. Please follow the instruction to dissemble the unit to prevent from
damaging the unit.
z Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform
the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of
enter the boot loader mode.
z Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
z How to use the diagnostic program to perform unit function test
z How to test some functions in Windows Mobile mode (ex. WLAN, Bluetooth, and
USB etc…)
z Chapter 5: Power measurement test- After reading this chapter, you will learn how to use MB
leakage test procedure and battery run-down test (Battery Capacity Measurement).
z Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the appearance
quality inspection criteria, ex. Display, bezel, and housing etc…
z Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do generic
trouble-shooting.
z Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex.
Regulation label, and battery label etc…
z Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference
list and photos for repairing, including unit and Board level.
z Chapter 10: RF Antenna Specification- Reference Spec for RF test.

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1.1 Product Features

Platform 800/1700/2100Mhz for Japan) and

z PDA form factor integrated dual modes GSM/GPRS/EDGE quad band
WCDMA/HSDPA and quad-band GSM/EDGE, (850/900/1800/1900)
Bluetooth, WiFi, mega-pixel camera, and one z HSDPA / UMTS
stop sliding QWERTY keyboard with 45 degree ‹ 3GPP Release 5 compliant
flip up display ‹ UE category 6, QPSK, 3.6Mbps peak rate
z Microsoft Windows 6 Professional ‹ Concurrent: DL up to 1.8Mbps and UL up
to 384Kbps
Dimension z Global roaming
z 112 mm(L) x 59 mm(W) x 18.65 / 19.55mm z Auto band switching
around antenna (T) z Handover and cell selection between
z 190 g with battery pack GSM/EDGE and WCDMA
z DTM
Processor/Chipset z SAIC(Circuit-Switch only)
z Qualcomm MSM 7200, 400Mhz z Equalizer (HSDPA channels only)
z Audio codec: AMR, EFR, FR, HR
Memory z SMS (MO, MT), concatenated SMS (640
z ROM: 256 MB (for programs and users’ characters)
storage) z Supplement services:
z RAM: 64 or 128 MB DDR RAM ‹ Call holding/waiting/forwarding
‹ Call barring
LCD Module ‹ CLI (Calling Line Identity)
z 2.8" QVGA (or VGA[TBD]) dots resolution ‹ Display own number
z 65K-color TFT LCD with LED back light ‹ Network selection
z Sensitive Touch Screen ‹ Cell broadcast
‹ Multi-party conference call
WCDMA/HSDPA (available when ‹ Spool icon
ready)/GSM/EDGE Function ‹ Phase 2+ unstructured supplementary
z Internal antenna service data
z Dual-mode, HSDPA/UMTS (2100MHz for ‹ Network Lock
Europe, 850/1900/2100MHz for Cingular and ‹ CPHS (partial support)

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z EGPRS Functionality ‹ SUPL-RRLP

‹ EGPRS class B ‹ SUPL-RRC (TBD) [QCT not supported]
‹ Multi-slot class 10 ‹ SMS initiated SUPL (TBD] [QCT not
‹ PBCCH supported]
‹ Link Adaptation and Incremental ‹ WAP push over SUPL
Redundancy z Standard 3GPP A-GPS compliance
z USIM/SIM ‹ 3GPP TS 44.031 (RRLP 5.12)
‹ 1.8/3V of UICC ‹ 3GPP TS 25.305 (GSM & UMTS)
‹ USIM Application at least according to z JSR 179 (Location API) support
3GPP TS31.102 z Emergency priority override existing A-GPS
‹ SIM Application Tool Kit release 96 service
complete, 98 class 3, and 99 partial z Performance requirement
‹ Mega-SIM [MFG. Option] ‹ TTFF (95% successful rate): < 20 seconds
‹ EAP-SIM ‹ 2D Location Error (95% successful rate): <
‹ Over the Air (OTA) programming 100 m
‹ FDN ‹ 3GPP TS 25.171 compliance
‹ ADN (Requirement for support of Assisted
‹ Security Pin 1 & 2 control Global Positioning System)
‹ 3GPP 34.171 (Terminal conformance
Standalone GPS / A-GPS specification, Assisted Global Positioning
Standalone GPS System)
z Internal GPS antenna ‹ 3GPP TS 34.108 (Common test
z Support both standalone & assisted modes environments for User Equipment
z Sensitivity : better than -150dBm for indoor & conformance testing)
outdoor z Fallback to Standalone mode when no network
z Support NMEA 0183 version 3.0 or above connection
z Dynamically allocated parallel channel GPS z Performance requirement (Standalone mode)
receiver [China Mobile Requirement]
z Update rate: once/1sec (default) ‹ 8 parallel channel GPS receiver [QCT
A-GPS limitation]
z E911 Location Information (for device shipped ‹ Data update frequency: > 1Khz
to US) ‹ Sensitivity requirement
z Support UE-Based & UE-Assisted A-GPS 9 GPS for one satellite: up to -142dBm
z OMA SUPL v1.0 compliance (v2.0 if available) 9 GPS for remaining satellite: up to

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-147dBm z Reset

Camera (manufacture option) Notification

z Main camera: z One bi-color LED for UMTS/GSM standby,
‹ 3M Color CMOS with AF UMTS/GSM message, UMTS/GSM network
z 2nd camera: [MFG. Option] status, notification, and charging status
‹ color CMOS VGA camera z Tri-color respective (blue, amber, and green)
LEDs for bluetooth/ GPS/ WiFi notification
Keyboard/Button/Switch z Vibration for notification
z Power button (Upper Side) z Notification by sound and message on the
‹ Short Press: system on/off display
‹ Long Press: Turn off power totally
z Start Button Audio
z OK button z Built-in Microphone
z One navigation pad (5-way) z Receiver
‹ Key orientation shall be adjusted after z Loud speaker for Hands-Free supported
view changed z Full duplex
z Send/Hands-free button z Audio sampling rate
‹ Long Press during the call: Hands-free ‹ 16-bits with 8KHz, 11KHz, 22KHz,
On/Off 44.1KHz
z End button z AMR/AAC/WAV/WMA/MP3 codec
z Jog Wheel (including 2 portions) z Audio Path Routing for VoIP over WLAN
‹ Scrolling area – up/down scrolling and
action functions Connectivity & Interface
‹ Bottom key – function as OK key z Bluetooth TI6300
z Voice dial & Voice record Or PoC (Left upper ‹ Compliant with v2.0 with EDR
position) ‹ Class 2 transmit power
z Camera capture button ‹ Supported profiles:
‹ Two step camera button for 3M AF lens 9 Generic Access profile
z soft keys (Contact and Calendar) 9 Serial Port profile
z 2 AP buttons (Messaging and Portal or PIE) 9 Headset profile
z QWERTY keyboard with 2 additional soft keys 9 Object Push profile
z Two LEDs for Cap Lock & FN Lock on 9 PAN
QWERTY keyboard 9 Hands-free profile

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9 Generic Object Exchange profile z 1.8/3V USIM/SIM card slot

9 A2DP profile
9 AVRCP profile Power
9 SIM Access profile (carrier z Battery
dependent) ‹ Charging time: 2.5~3 hours
9 Service Discovery profile z AC adaptor
9 HID profile ‹ AC input: 100 ~ 240V AC, 50/60 Hz
9 FTP z DC output: 5V and 1A
9 BPP z Ambient Light Sensor
‹ Co-exist with WiFi
z WiFi (manufacture option) Liquid Indicator
‹ IEEE 802.11b/g compliant Stylus
‹ Internal WLAN antenna z Retractable stylus with lock type mechanism
‹ Data rate auto fallback for extended range
‹ ELP mode Hanger hole
‹ Security 802.11i and AES z Stylish hanger to wear phone with neck strap as
9 WPA authentication – WEP, WPA, pendant or to attach various phone hangers
PSK, EAPTLS, PEAP, LEAP
9 Signaling interfaces between the Accessories
terminal device and the servers: z User manual, Quick start guide & Sync.
mutually authenticated and Software CD
encrypted utilizing TLS (RFC 2246) z Screen Protector
with RC4 encryption with SGA1 used z Stylus
as the message integrity check z 3-in-1 stylus
‹ QoS z Travel Charger (AC adaptor)
9 802.11 WME QoS z Pouch (Carrying Case)
9 802.11e z USB Sync Cable (mini-USB/USB)
9 Fast AP to AP handover z Battery
‹ or no WiFi SKU z Wired Stereo Headset
z HTC ExtUSB 11-pin mini-USB z 3.5 mm Audio Adaptor
‹ USB 2.0 Client with Full Speed (12Mbps) z 3.5 mm Audio Adaptor with microphone
‹ H2W (For Sync, Power charge, Audio and z Wired Remote Controller
Wired Remote Controller…etc) z Mono Bluetooth headset, M100
z Micro SD with lid z Mono Bluetooth headset, M200

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z Stereo Bluetooth headset, S100 160x120

z Bluetooth keyboard 9 Night Mode
z Bluetooth Handsfree 9 Digital Zooming: at least 8X
z Y Cable 11-pin to 5 pin + 6 pin ‹ Camcorder Mode
z Y Cable 11-pin to 5 pin + 3.5 mm audio jack 9 15 fps encoding for QVGA resolution
z Car Charger 9 Encoding format
z Generic Car Holder 9 H.263 + AMR-NB
9 MPEG4 + AMR-NB
Microsoft Windows Mobile Crossbow 6 z Ringtone
Professional Applications ‹ MIDI
z Outlook Mobile 9 40 polyphonic & Standard MIDI
‹ Messaging, Calendar, Contacts, Tasks, & format 0 and 1 (SMF) / SP MIDI
Voice Notes ‹ MP3, AAC, AAC+, WMA, WAV and
z Internet Explorer Mobile AMR-NB
z Office Mobile z DirectShow Filters for WMP – Audio
‹ Word, Excel, & PowerPoint Mobile ‹ Audio Playback format: AAC, AAC+,
z Windows Media Player 10 Mobile eAAC+, MP3, WMA, WAV, AMR-NB/WB
z Pictures & Videos z DirectShow Filters for WMP – Video
z ActiveSync Client ‹ Video Playback format: H.263, MPEG4,
z Internet Sharing WMV, Motion JPEG (AVI) & H.264
z Windows Live & Messenger ‹ Min. 30 fps decoding for H.263 & MPEG4
z Device Management @ QVGA resolution
z OTA Provisioning ‹ Combined Bit Rate: 64Kbps (playback)
z RDM z Picture Enhancement for Pictures & Videos
z Calculator ‹ Graphics: JPEG, GIF87a, GIF89a, PNG,
z Games WBMP
‹ Video Thumbnail Preview: H.263, & MPEG4
Value Added Applications z 3G-324M Video Telephony
z Camera / Camcorder z ZIP
‹ Camera Mode z Smart Dialing
9 Encoding format: JPEG ‹ Support of QWERTY Keyboard Input
9 Resolution: 2048x1536,UXGA z MMS Client
1600x 1200, SXGA 1280x960, VGA ‹ Partial Compliant to MMS 1.2
640x480, QVGA 320x240, QQVGA z Java virtual machine (J2ME, CLDC 1.1, MIDP 2.0)

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‹ JSR 185 JTWI z Ringtone Trimmer

‹ JSR 75 PIM access z GPS Navigation SW (if GPS or A-GPS is
‹ JSR 120 Wireless Messaging API available)
‹ JSR 135 Mobile Media API z RSS / Podcast Reader
‹ JSR 179 (Location API) z Voice Recorder
‹ JSR 184 Mobile 3D Graphics API z Task Manager
z Voice Dial & Command z Backup Tool
‹ Speaker Dependent or Independent z Document Printing
z Document Viewer - PDF
z OMA DRM Engine: For all types of files (Pictures, Regulatory & Certificate
audio, application etc.), and also all types of z GCF certification [Operator dependent]
delivery method (MMS, email etc.) z R&TTE: EMC / EMI, Safety SAR
‹ OMA 1.0 / 2.0 when available z WiFi Certification
‹ Multi-DRM support : MSFT & OMA DRM z FCC Approval
z SIM Manager z FCC Hearing Aid Compatibility
z Comm. Manager z PTCRB Approval
z STK z BQB (Bluetooth Qualification Body) certification
z TTY/TDD for US Market z Windows Mobile Logo (NTSL)
z Sound Effect of Sliding z USB certification
‹ System sound effect when sliding out and z JATE (Japan Market only)
closing up the qwerty keyboard z TELEC (Japan Market only)
‹ User customizable sounds z CB certificate / report
z Auto Power On when KB is slide out z UAELAB
z Audio Manager z ICASA
‹ Music Player

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1.2 Product overview

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No. Item Function

1 AC adapter Recharges the battery.

2 USB Sync cable Connects your device to a PC and synchronizes data.

Provides a volume control slider and a Send/End button. Press the

3 Stereo headset Send/End button to pick up a call or put a call on hold; press and hold
the button to end the call.

4 Pouch Acts as a protective carrying case for your device.

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2. Device Disassembling and Assembling Procedure

2.1 Disassembling procedure

TOOLS NEEDED FOR ASSEMBLING

AND DISASSEMBLING PROCESS.

1. LENS CLEANING CLOTH.

2. TORX SCREW DRIVER T5X50.
3. TORX SCREW DRIVER T6X50.
4. PHILIPS SCREW DRIVER 00X40.
5. FLAT PLASTIC STICK.
6. PLASTIC TWEEZERS.

HOLD THE THUMBS ON THE TOP LEFT

AND BOTTOM RIGHT OF THE BATTERY
COVER AND SLIDE IT UPWARDS

SLIDE DOWN THE STYLUS

REMOVE THE BATTERY

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UNFASTEN THE SCREW(S) AT THE

LOCATION INDICATED

FLIP THE FLAT PLASTIC STICK TO

RELEASE THE LOCKS AT THE
FOLLOWING LOCATIONS

REMOVE THE SPEAKER

CAUTION: AVOID DAMAGE THE
SPEAKER

UNFASTEN THE SCREW(S) AT THE

LOCATION INDICATED

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REMOVE THE SPEAKER RUBBER

UNFASTEN THE SCREW(S) AT THE

LOCATION INDICATED

RELEASE THE PCBA SUB BOARD

CONENCTOR FROM THE MAIN BOARD

HOLD THE FLAT PLASTIC STICK

VERTICALLY A ND SLIDE THROUGH
THE GAP BETWEEN HOUSING AND
COVER PRE-ASSY (C COVER)

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REMOVE THE MICROPHONE

UNFASTEN THE SCREW(S) AT THE

LOCATION INDICATED

RELEASE THE KEYBOARD

CONNECTOR AND REMOVE THE FPC

FLIP THE FLAT PLASTIC STICK AND

DISASSEMBLE THE CONNECTOR

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USE FLAT PLAASTIC STICK TO HOLD

OPEN THE METAL BLADE AND REMOVE
THE CAMERA SHIELDING

RELEASE THE CAMERA CONNECTOR

UNFASTEN THE SCREW(S) AT THE

LOCATION INDICATED

SLIDE FLAT PLASTIC STICK OVER THE

SUPPORT PRE-ASSY, ON-C-COVER

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CAREFULLY REMOVE THE LCM

BEZEL FROM THE KEYBOARD

¾ BEWARE WHEN REMOVING THE

FPC, RIGID-FLEX-BOARD

UNFASTEN THE SCREW(S) AT THE

LOCATION INDICATED

REMOVE THE COVER PRE-ASSY,

HINGE-PLASTIC-COVER,LEFT

HOLD THE FLAT PLASTIC STICK

VERTICALLY A ND SLIDE THROUGH
THE GAP TO DISASSEMBLE

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RELEASE THE SIM CARD FPC

CONNECTOR

DISASSEMBLE THE FPC PRE-ASSY,

SIM, GLOBAL FLEX

UNFASTEN THE SCREW(S) AT THE

LOCATION INDICATED

SLIDE THE HINGE DOWNWARDS AND

UNFASTEN THE SCREW(S) AT THE
LOCATION INDICATED

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UNFASTEN THE SCREW(S) AT THE

LOCATION INDICATED

RELEASE THE LCM CONNECTOR

APPLY FORCE OUTWARDS TO THE

LOCATION INDICATED AND REMOVE
THE FPC BOARD

REMOVE THE KEYPAD, THE LCM

MODULE AND THE RECEIVER

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DISASSEMBLY COMPLETED!

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2.2 Assembling procedure

TOOLS NEEDED FOR ASSEMBLING

AND DISASSEMBLING PROCESS.

1. LENS CLEANING CLOTH.

2. TORX SCREW DRIVER T5X50.
3. TORX SCREW DRIVER T6X50.
4. PHILIPS SCREW DRIVER 00X40.
5. FLAT PLASTIC STICK.
6. PLASTIC TWEEZERS.

INSERT THE RECEIVER ON THE TOP

OF THE BEZEL

PLACE THE KEYPAD ON THE BEZEL

PLACE LCM MODULE ON THE BEZEL

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PLACE THE FPC, RIGID-FLEX-BOARD

ON THE BEZEL AND LOCK THE PCBA
ON THE BEZEL

INSERT THE LCM FPC CONNECTOR

TO THE FPC, RIGID-FLEX-BOARD

FASTEN THE SCREW(S) AT THE

LOCATION INDICATED

TORQUE: 0.6 ± 0.1KGF-CM

PLEASE ENSURE THAT THE SWITCH IS

FIXED AT THE LOWER POSITION

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STICK THE FPC PRE-ASSY,SIM,

GLOBAL FLEX ON THE COVER
PRE-ASSY, B-COVER

LOCK THE SEMI-AUTO-PUMP-UP,

PRE ASSY SLIDE-HINGE ONTO THE
COVER PRE-ASSY, B-COVER

SLIDE THE HINGE UPWARDS AND

LOCK INTO THE POSITION INDICATED

FASTEN THE SCREW(S) AT THE

LOCATION INDICATED IN THE ORDER
OF THE NUMBERS

1
TORQUE: 0.8 ± 0.1KGF-CM
2 e

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f g 1. SLIDE THE HINGE DOWNWARDS

h 2. FASTEN THE SCREW(S) AT THE
LOCATION INDICATED IN THE ORDER
OF THE NUMBERS

TORQUE: 0.8 ± 0.1KGF-CM

1 2 ASSEMBLE THE PART 1 AND 2,

CLEARFULLY INSERT THE PFC
CONNECTOR THROUGH THE HOLE

ATTACH THE FPC PRE-ASSY,SIM

CONNECTOR TO RIGID-FLEX BOARD
ASSY

APPLY FORCE THROUGH OUT THE

EDGE OF THIS PART AND MAKE SURE
THE PART IS ASSEMBLED PROPERLY

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1 4
FASTEN THE SCREW(S) AT THE
LOCATION INDICATED IN THE ORDER
OF THE NUMBERS

TORQUE: 1.0 ± 0.2KGF-CM

3 2

1 2
ASSEMBLE THE PART 1 AND 2,
CLEARFULLY INSERT THE PFC
CONNECTOR THROUGH THE HOLE

fd ec FASTEN THE SCREW(S) AT THE

LOCATION INDICATED IN THE ORDER
OF THE NUMBERS

TORQUE: 1.0 ± 0.2KGF-CM

STICK THE PART TO THE LOCATION

INDICATED

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STICK THE PART TO THE LOCATION

INDICATED

SLIDE THE CAMERA FPC THROUGH

THE HOLE OF THE MAIN BOARD

INSERT THE CAMERA CONNECTOR TO

MAIN BOARD

PLACE THE CAMERA COVER ON THE

TOP OF THE CAMERA AND LOCK ON TO
THE MAIN BOARD

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PLACE THE MAIN BOARD ON THE TOP

ATTACH THE CONNECTOR OF THE

FPC, RIGID-FLEX-BOARD TO THE
MAIN BOARD

1. To bend the FPC cable as

indicated picture and let FPC
cable parallel with connector
then it’s easy to do assembly
2. ASSEMBLE THE KEYBOARD FPC
TO THE MAIN BOARD

FASTEN THE SCREW(S) AT THE

LOCATION INDICATED

TORQUE: 0.5 ± 0.1KGF-CM

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INSERT THE MICROPHONE TO THE

MICROPHONE SLOT OF THE HOUSING

PLACE THE HOUSING ON THE TOP OF

THE MAIN BOARD AND LOCK ONTO
THE COVER PRE-ASSY, C-COVER

APPLY FORCE DOWN THE EDGES AND

MAKE SURE THE HOUSING AND
KEYBOARD ARE PROPERLY
ASSEMBLED

FASTEN THE SCREW(S) AT THE

LOCATION INDICATED

TORQUE: 1.2 ± 0.2KGF-CM

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ATTACH THE PCBA, SUB BOARD ON

THE MAIN BOARD

FASTEN THE SCREW(S) AT THE

LOCATION INDICATED

TORQUE: 0.4 ± 0.1KGF-CM

PLACE THE SPEAKER RUBBER ON

THE HOUSING

STICK THE SPEAKER ON THE

ANTENNA COVER

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ASSEMBLE THE ANTENNA COVER ON

THE TOP OF THE HOUSING

3
FASTEN THE SCREW(S) AT THE
LOCATION INDICATED IN THE ORDER
OF THE NUMBERS

TORQUE: 1.2 ± 0.2KGF-CM

1 2

INSERT THE BATTERY

HOLD THE THUMBS ON THE TOP LEFT

AND BOTTOM RIGHT OF THE BATTERY
COVER AND SLIDE IT DOWNWARDS

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INSERT THE STYLUS

ASSEMBLY COMPLETED!

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2.3 Assembly Tips

STICK THE MYLAR (P/N:

76H02287-00M) ALONG THE LOW
EDGE OF TOPPOLY LCM (P/N:
60H00091-00M)

Do not cover up the Gasket

BOTH OF RIGHT AND LEFT SIDE OF

TOPPOLY LCM MUST BE FIRMLY
AND FLATLY ATTACHED

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Attaching Mylar to SONY LCM (60H00092-00M)

STICK THE MYLAR (P/N:

76H02287-00M) ALONG THE LOW
EDGE OF SONY LCM (P/N:
60H00092-00M)
Do not cover up the Gasket

BOTH OF RIGHT AND LEFT SIDE OF

SONY LCM MUST BE FIRMLY AND
FLATLY ATTACHED

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3. ROM Re-flash Procedure

3.1 ROM upgrade thru RUU (Re-flash Upgrade Utility)

Connect device to PC

I. Setting and allow USB connections

in Microsoft ActiveSync.
II. Connect your device and desktop/ or
laptop via USB cable.
III. Check the pop-up message from
Microsoft ActiveSync when device is
synchronized with PC.

Download OS Image from SDO

I. Download OS image from SDO.

http://htcscm10.htc.com.tw/SDO
II. Un-zip the file and execute RUU
program.

RUU – 1

III. Read the pop-up message form

ROM update utility and select the “I
understand…” checkbox.
IV. Click “Next” to proceed.

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RUU - 2

V. Read the pop-up message form

ROM update utility to follow and
perform the instructions and select
the “I completed…” checkbox.
VI. Click “Next” to proceed.

RUU - 3

VII. Current image version confirmation.

VIII. Click “Update” to proceed.

RUU - 4

IX. Double verify the ROM revision

which you want to update before
re-flash procedure.
X. Click “Next” to proceed.

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RUU - 5

XI. Read the information from pop-up

message and the OS update
procedure will takes 10 minutes
long.
XII. Click “Next” to proceed.

RUU - 6

XIII. You can see the update progress

from your PC and in your device.

RUU - 7

XIV. The OS upgrade is finished, click

“Finish” to close the utility.

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3.2 Rom Image upgrade thru SD card

Download OS Image from SDO

I. Download OS image from SDO.

http://htcscm10.htc.com.tw/SDO
II. Un-zip the image file.

Format SD card and copy image file to SD card

III. Select file system and format the SD

card to FAT32 mode.
IV. Copy image file XXX.nbh to the
micro SD card and rename to
KAISIMG.NBH.

SD Upgrade - 1

V. Turn the device power off and insert

Diagnostic SD card.
VI. Press and hold Camera button, and
Reset button to entry Boot loader
mode.
VII. Press Power button to start upgrade
procedure.

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SD Upgrade - 2

VIII. Reading source code from SD card.

[Note]: This process will takes 10 mins,
please don’t power off the device.

IX. After finish, press Reset button to

reboot.

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4. DIAGNOSTIC PROGRAM

4.1 List of Diagnostic / WinCE Test Items

Mode No Item Description Remark

Function Test
1 Auto Auto Regular Tests (Display, B.L, Vibrator, etc…)
2 MegaSIM Mega SIM Test
3 ROMChecksum Test Rom size
4 SDRAM Test RAM memory test.
5 Display Test Color bar/R/G/B/Black/White/Gray pattern.
6 B. L Test Front light test (On/Dim/Off).
7 LED Test Red, Green, BT, WL, Key Led
8 Vibrator Test Vibrator on test.
9 SD Card Test SD card Read/Write test.
10 Record, Capture, App1(Send), App2(IE),
Diagnostic

Volume up, Volume down, Key up, Key down,

Button Test
Key left, Key right, Key action, Soft1, Soft2,
Send, End, Start, OK
11 Speaker Test Speaker out test.
12 Receiver Play Test Receiver out test.
13 IntMic Test Internal MIC record and play to Speaker test.
14 ExtMic Test Internal MIC record and play to Headset test.
Run-in Test
1 1 Hour 1 Hour Run-in Test/Press Soft1 key. Option
2 2 Hours 2 Hours Run-in Test/Press Soft 2 key. Option
3 4 Hours 4 Hours Run-in Test/Press Start key. Option
4 8 Hours 8 Hours Run-in Test/Press OK key. Option
Format Storage (Personal information, talk times)
Device Info
1 USB Test USB link test (Microsoft ActiveSync).
Win CE

2 Camera Test Camera test.

3 Bluetooth Test Bluetooth test.
4 WLAN Test WLAN test.

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Test Procedure
How to select test item: Using navigation button -"Up" or "Down" to select the test items
How to execute the test program: Press “Action” button to start each of test items.
Diagnostic
Main Menu/Function Test Menu

I. Turn the device power off and insert

Diagnostic SD card.
II. Press and hold Capture button,
including Reset button, and then
enter Diagnostic mode.
III. Using to select the test item and
move to next page as well.
IV. Select item “Function Test” to find
the Function test menu.

Auto Test

I. Press the Action key to start the

Auto-test.
II. It will perform the regular tests,
please follow the system instruction
to do the test.

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MegaSIM Test

III. Press the Action key to start the

MegaSIM Test.
Note. If your unit doesn’t support
Mega SIM, you don’t have to perform
the test.

ROM Checksum Test

IV. Press Action key to select

V. The Rom Checksum will be displayed
on the screen

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Display Test (and RED/ GREEN pattern)

I. Press Action key to select Display

Test on Function test menu.
II. After the test pattern is show up,
please check the pattern if any
un-uniform color or chromatist.
III. Press Action key to continue the
next test pattern.

Display Test (BLUE/ BLACK pattern)

V. Press Action key to continue the

next test pattern.

Display Test (WHITE/Color bar pattern)

VI. Press Action key to continue the

next test pattern.

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LCD Back Light Test

I. Press Action key to select B.L Test

on Function test menu.
II. Press Action key to switch the LCD
backlight level from Level 1,Level2,
Level3, Level4, Level5 Press
Action key to exit and return to
Function test menu.

Vibrator Test

I. Press Action key to select Vibrator

Test on Function test menu.
II. Press Action key to exit and return to
Function test menu.

SD Card Test

I. Press Action key to select SD Card

Test
II. If success, press Action key to exit
and return to Function test menu.

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Button Test
I. Press Action key to select Button
Test on Function test menu.
II. Follow the instruction on screen to
perform the Key/Button test
(Record, Capture, App1(Send),
App2(IE), Volume up, Volume down,
Key up, Key down, Key left, Key right,
Key action, Soft1, Soft2, Send, End,
Start, OK.).
III. The screen will return to Function
test menu after the test is finished.
Speaker Test

I. Press Action key to select Speaker

Test on Function test menu.

Receiver Play Test

I. Press Action key to select

Receiver Play Test on Function
test menu
II. The screen will return to Function
test menu after the test is finished

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IntMic Test

I. Press Action key to select IntMic

Test on Function test menu.
II. After recording and playing , The
screen will return to Function test
menu

ExtMic Test

I. Press Action key to select ExtMic

Test on Function test menu.
II. Please make sure headset is
ready then press action.
III. The screen will return to Function
test menu after the test is
finished.

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WinCE Test

USB Test

I. Start up the Microsoft®

ActiveSync®program in the PC.
II. Insert USB cable and connect unit to
desktop/ or laptop.
III. The USB to PC icon -> is
appears on the Today screen when
your device is connected to your
desktop/ or laptop.

Camera Test

I. Tap Start->Program->Camera or
Press Camera button to turn on the
Camera.
II. Make sure the device will present
and enter the preview display.
III. Check camera pre-view and image
quality.

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Bluetooth Test - 1

I. Tap icon Comm Manager on the

Today screen and turn on Bluetooth.
II. Tap the icon “Settings” down-right
the corner of the screen and select
the “Make this device….” Checkbox.
III. Press Action key (Jog-ball) to go
next test pattern.

Bluetooth Test - 2

I. Tap Start->Settings->Connections->
Beam and select “Receive all….”
Checkbox.
II. To create a file, tap Start->Programs
->Notes->New.
III. Tap and select the “Beam file…”

Bluetooth Test - 3

IV. Once device is searched, tap the

device to send the file.
V. Return to Today screen and tap
Start->Program->Comm Manager
->Bluetooth to turn off Bluetooth.

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WLAN Test

I. Tap icon Comm Manager on the

Today screen and turn on WLAN.
II. Select the hot-spot/ or access point
which searchable and appears on
screen.
III. Once the hot-spot (access point) is
connected, press the IE button and
logon Internet.

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5. Power measurement test

5.1 Main board leakage current Test Procedure

This is a quick method to measure if any abnormal leakage current on main board
which caused high power consumption compare to GOOD main board.
(1) Requirement：
- Control box
Equipment list
1. Control box

2. 4 colors cable
Cable A: Red
Cable B: Yellow
Cable C: Green
Cable D: Black

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C. 4 types Jig
Jig - A (4 pins-Short)
Jig - B (6 pins-Long)
Jig - C (4 pins-Short)
Jig - D (6 pins-Long)

Jig-A Jig-B Jig-C Jig-D

Equipment set up
1. Connect control box and jig through
4 colors cable

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2. Set up each button by row A~D

according to product specification
A Following is an example for Hermes
Button set up matrix
MADEL JIG TYPE
A B C D
B Kaiser C 0 8 2 0

It means, press button A0,B8,C2,D0

C

3. Install jig to device

(the photo is for reference only)

Start testing
1. Turn on control box power button

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2. Press Power button to turn on the

Device

3. In “main page”, Check phone status,

Click “Turn on flight mode”
Set the unit to :
* Flight mode
* Make sure all RF function is off (phone,
BT, Wifi..)

4. Measure Idle mode current. Idle current

value must under 66mA (refer to each
Idle current test product Service Manual), if over the
criteria, it means M/B failed, please
replace M/B for repair.

5. After idle current checked, Switch OFF

the unit. Unit is turn off and no display.
Sleep current test sleep current value must under 6mA (refer
to each product Service Manual), if over
the criteria, it means M/B failed, please
replace M/B for repair.

Conclusion:
If current consumption is passed at both of idle and sleep mode, it means M/B is GOOD. If
there is any item FAILED at idle or sleep mode, it means M/B is failed, please replace M/B
for repair.

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Battery rundown test procedure

Test Requirement:
-Windows 2000/XP
-USB Cable
-ActiveSync 4.2 above (WINCE 6.0 should use ActiveSync 4.5)
-Master Unit
-Battery in Warranty

Caution: Please charge your unit to full capacity for battery (until the green light
is displayed) before doing the test.
TEST PROCEDURE
Connect device to PC

I. Setting and allow USB

connections in Microsoft
ActiveSync.
II. Connect your device and desktop/
or laptop via USB cable.
III. Check the pop-up message from
Microsoft ActiveSync when
device is synchronized with PC.

Copy the Battery Rundown tool into the device

IV. Make a folder in the device.

V. Copy PowerDetect.exe into the
folder.

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Battery Rundown-1

VI. Adjust the Backlight brightness

into the maximum level on battery
power.

Battery Rundown-2

VII. Disable Turn off backlight if device

is not used for in Battery power.

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Battery Rundown-3

VIII. Execute PowerDetect.exe under

WinCE

Battery Rundown-3

IX. Set the Sleep as 1hour

X. Set the Record as 2Mins

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Battery Rundown-4

XI. After running 1 hour, the test will be

finished.
XII. Press the Power Button to turn on the
power.
XIII. Click ok to quit the program.

Battery Rundown-5

XIV. Test result is generated into the log

file as PowerCap(x).

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Battery Rundown-6

XV. Tag the log file to check the capacity.

Caution: If the capacity is under 70%,

Please replace a new battery.

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6. Cosmetic Inspection Criteria

6.1 Classes definition of inspective area
z Class A area => The front side of main unit involve all buttons and LED lens except LCD.
z Class B area => View of QWERTY keyboard. (Involved stylus).
z Class C area => 4 sides and back views of main unit.
z Class D area => The socket of battery, inner side of battery cover.

Photo of inspection areas

Class A area Class B area Class C area Class D area

IT IS GENERIC COSMETIC INSPECTION CRITERIA FOR ALL PRODUCTS IF THERE HAVE ANY CONFLICT
WITH THESE GENERIC CRITERIONS; PLEASE FOLLOW THE PRODUCT INSPECTION CRITERIA
RESPECTIVELY.

Description
¾ D: Diameter / L: Length / W: Width / N: Number of defects/ S: Distance from dot to dot
¾ Inspecting distance: 30 ± 5cm / Mechanical inspection angle: 90 degrees /
¾ LCM inspection angle: 90 ± 15 degrees / Inspection time: 5 secs per surface.
¾ Ambient illumination is to be 500-1100 lux
¾ The inspection condition of Newton ring:
a. Inspection distance: 30cm / Inspection time: 5 sec
b. Ambient illumination is to be 500-1000 Lux (Incandescent lamp)
c. Inspection should be performed under the condition that LCD screen could reflect the mirror image of lamp.
d. The criteria of Newton ring's tinges and measure of area must follow up the worst-case sample.

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6.2 Display inspection

Inspection Defects Accept Level Level

Single Red+ Green+ Blue ≦ 3, S > 5mm. Minor
Bright Dots 2 adjacent 0 Minor
3 or more adjacent 0 Minor
Electrical Single Total Number ≦ 2, S > 5mm. Minor
Dark Dots
Characteristic 2 adjacent 0 Minor
Defects Dark or Bright lines 0 Minor
All Allowable Dots Defects Total Number ≦ 3, S > 5mm. Minor
The black edge around display area must be
Shift and tilt of screen viewed area Minor
detected by front view.
0.03 < W ≦ 0.1 (mm)
Scratch Minor
L ≦ 5 (mm), N ≦ 2 (mm)
0.03 < W ≦ 0.1 (mm)
Foreign Scratch, Lint (linear foreign objects) 0.3 < L ≦ 3.0 (mm) Minor
Objects or Lint N≦5
on power off
status Spots 0.1 < D ≦ 0.3 (mm), N ≦ 4 Minor
Fish eye on film 0.1 < D ≦ 0.4 (mm), N ≦ 4 Minor
Breakage on film surface Not acceptable Minor
Total acceptable defect quantity ≦ 10 Minor

6.3 Main unit inspection

Gap & Step inspection

Description Accept criteria Level
1 Gap between bezel and BTM cover < 0.15 mm Minor
2 Gap between LCM bezel and touch panel < 0.7 mm Minor
3 Gap between bezel and antenna cover < 0.25 mm Minor
4 Gap between mating parts on K/B < 0.25 mm Minor
5 Gap between key and keyboard opening < 0.3 mm Minor
6 Step between bezel and antenna cover in A area < 0.25 mm Minor
7 Step between bezel and antenna cover in C area < 0.4 mm Minor

It is generic cosmetic inspection criteria for all products if there have any conflict with these generic criterions; please
follow the product inspection criteria respectively.

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7. Generic Troubleshooting

1．Main Unit Does Not Respond to Power Button

(1) Connect the AC adapter, maybe the battery pack is exhaust and wait few minutes for battery recharging.
(2) Check if battery installed well.
(3) Check the Power Button whether it’s damaged.
(4) Replace another battery pack.
(5) Try to start boot-loader mode [refer to section 4.2]. Re-flash ROM if boot loader mode is enabled.
(6) Check all connectors including LCD FPC to Main Board.
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

2．Touch Panel Does Not Respond to Screen Tap

(1) Check the connection of LCM FPC cable whether is properly connected.
(2) Try to cold boot the unit then perform screen tap again.
(3) Try with another LCM.
(4) Try with another Main Board.
(5) Replace LCM if necessary
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

3．Buttons Do Not Respond

(1) Try to cold boot the unit then tries again.

(2) Dismantle the unit; check the status of switches on the Main Board and the plastic parts of the Button not
responding.
(3) Try with another Main Board or Front Bezel.
(4) Replace Main Board or Front Bezel if necessary.
(5) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

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4．Unusual Vertical / Horizontal lines or partial display

(1) Check the connection of LCM FPC whether is properly connected.

(2) Try to cold boot the unit then tries again.
(3) Try to re-flash the ROM code.
(4) Try with another LCM.
(5) Try with another Main Board.
(6) Replace LCM if necessary
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

5．Back Light Does Not Turn ON/OFF

(1) Check the connection of LCM FPC whether is properly connected.

(2) Try to re-flash the ROM code.
(3) Try with another LCM.
(4) Try with another Main Board.
(5) Replace LCM if necessary
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

6．CF/SD Card cannot be used

(1) Check whether CF/SD Card is fully inserted to the slot until you hear a click.
(2) Try to re-flash the ROM code.
(3) Try with another CF/SD Card.
(4) Try with another Main Board.
(5) Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

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7．PC Connection not possible

(1) If test result is NFF, it is possible caused by user connect cradle to computer before ActiveSync is
installed.
(2) Check whether “Connection Settings” in the MS ActiveSync is properly set.
(3) Check whether it connects with other cables or cradle, customer’s cable might be damaged.
(4) Check the external appearance of the connector on the unit whether it is physically damaged.
(5) Try to re-flash the ROM code.
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

8．Battery Pack does not start

(1) Make sure the battery cover is closed properly.

(2) Connect to the AC Adapter and see if it takes charge. Also check AC Adapter condition.
(3) Check whether AC Adapter is functioning properly.
(4) Check whether the condition of Battery Charging status is correct.
(5) Check the appearance of Battery Pack if any abnormal..
(6) Try with another Battery Pack or Replace Battery Pack if necessary
(7) Try with another Main Board or Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

9．Battery discharges quickly even after fully charged

(1) Make sure the Battery Pack takes fully charge with AC Adapter.
(2) Check whether the condition of Battery Charging status is correct.
(3) Dismantle the unit and check the appearance of Battery Pack.
(4) Try with another Battery Pack or Replace Battery Pack if necessary
(5) Try with another Main Board or Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

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10．Battery Pack does not recharge

(1) Make sure the Battery Pack takes fully charge with AC Adapter.
(2) Check whether the condition of Battery Charging status is correct. Charge should be done no more than 4
hours.
(3) Dismantle the unit and check the appearance of Battery Pack.
(4) Try with another Battery Pack or Replace Battery Pack if necessary
(5) Try with another Main Board or Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

11．No Sound from Speaker or Distorted sound

(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling.
(2) Make sure it’s not MUTED.
(3) Try to re-flash the ROM code.
(4) Clean up the speaker connection side on MB if there is any contamination.
(5) Dismantle and Check whether the Speaker is properly installed (Orientation)
(6) Replace Speaker if necessary.
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.

12．No Recorded Sound or Distorted sound

(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling.
(2) Make sure it’s not MUTED.
(3) Try to re-flash the ROM code.
(4) Dismantle and Check whether the Microphone is properly installed.
(5) Replace Microphone if necessary.
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

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13．Wireless connection (WLAN/BT) not functioning

(1) Make sure the wireless environment is OK before connecting to WLAN.

(2) Make sure the wireless connection setting has properly set.
(3) Make a life connection with Internet or another device.
(4) Try to re-flash the ROM code.
(5) Try with another main board if necessary
(6) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.

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8. Generic Labeling Plan

<Kaiser Model ID>
Model ID VT Camera Antenna
KAIS100 N Y US
KAIS110 N N US
KAIS120 Y Y US
KAIS130 Y Y EU

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Agency label
Agency label-KAIS100
Regulatory label
HTC P/N: 77H00471-00M
Size: 43.04 X 63.7mm

Barcode label
HTC P/N: 77H00470-00M
Size: 23.0 X 15.0mm

HTC P/N Description

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Agency label-KAIS110
Regulatory label
HTC P/N: 77H00471-01M
Size: 43.04 X 63.7mm

Barcode label
HTC P/N: 77H00470-00M
Size: 23.0 X 15.0mm

HTC P/N Description

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Agency label-KAIS120
Regulatory label
HTC P/N: 77H00471-02M
Size: 43.04 X 63.7mm

Barcode label
HTC P/N: 77H00470-00M
Size: 23.0 X 15.0mm

HTC P/N Description

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Agency label-KAIS130
Regulatory label
HTC P/N: 77H00471-03M
Size: 43.04 X 63.7mm

Barcode label
HTC P/N: 77H00470-00M Running change to the one with “CE0678!” on agency
Size: 23.0 X 15.0mm

HTC P/N Description

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Unit label location explanation

Water sensitive label Tamper evident label
HTC P/N: 77H00203-00M HTC P/N: 77H00460-01M
Size: 4.0X2.5mm Size: D=3

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Screen Protector
HTC P/N: 76H02140-00M
Size: 48.65 x 57.5mm

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SIM card indicate sticker

HTC P/N: 77H00527-00M
Size: 21.0 x 16.0mm

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Battery cover indicate sticker

HTC P/N: 77H00528-00M
Size: 54.6 x 61.0mm

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Battery label
Battery label-SAMSUNG
HTC P/N: 35H00086-00M

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Battery label-Dynapack
HTC P/N: 35H00088-00M

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9. Generic Spare Part List and Photos

9.1 SPL for Repair

Item P/N Description Qty Substitute
1 36H00542-00M Speaker 1
2 36H00548-00M Microphone 1
3 36H00550-00M Receiver 1
4 36H00556-00M Antenna Pre-Assy 1
5 51H00394-02M PCBA-MAIN BOARD,Kaiser 1
6 51H00396-00M PCBA,Sub board,Kaiser 1
7 51H10051-00M Rigid-Flex Board ASSY,Kaiser 1
8 54H00225-00M 2nd Camera Module 1
9 54H00227-00P Main Camera Module 1
10 60H00091-00M TFT-LCD Module,TOPPOLY 1
11 72H00658-00M Screw,PH,FD,M1.4x2.5,YELLOW 1 V
12 72H01706-00M Screw,M1-6,L2-8,T5,Herald 10 V
13 72H01715-00M Screw,HAMA NAKA SHOUKIN,T1.6,DELTA TP 1 V
14 72H01981-00M Screw,M1.4,L2.3,(D3.5*H0.2),Kaiser 4 V
15 72H02002-00M Screw,TORX,KH-M1.6*2.6,Black,Kaiser 1 V
16 72H02064-00M EMI Gasket,R-F PCB,SPG,3.5X10mm,0.5t,Kaiser 2
17 72H02293-00M Screw,Black Ni,M1.6*6,Kaiser 4
18 73H20092-41M FPC Pre-Assy,Qwerty,GLOBAL FLEX,Kaiser 1
19 73H20094-41M FPC Pre-Assy,SIM,GLOBAL FLEX,Kaiser 1
20 74H00871-00M Pre Assy Semi-Auto-Pump-Up,Slide-Hinge,Kaiser 1
21 74H00873-00M Shielding Pre-Assy,Camera-3M,Kaiser 1
22 76H01838-00M ME Gasket,Support-LCD,Woven,Kaiser 2
23 76H01859-00M Mylar,logic,mylar,Kaiser 1
24 76H01897-00M Rubber,speaker,TPU,Kaiser 1
25 76H01901-00M Mylar,For-B-cover-Hinge,Black,Kaiser 1
26 76H01931-00M Rubber,2nd Camera,silicon,Kaiser 1
27 77H00471-03M Regulation Label,KAIS130,43.04*63.7mm,CHENG MAY,Kaiser 1
28 74H00780-01M Housing Pre-Assy,D cover,voice command,Kaiser 1
29 74H00859-00M Support Pre-Assy,On-c-cover-center,POM,Kaiser 1
30 74H00860-00M Cover Pre-Assy,B-cover,KAISER 1

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NOTE:
THE PHOTO OF SPL IS GENERIC AND ONLY FOR REFERENCE, THE COLOR AND
APPEARANCE MAY BE DIFFERENT FROM THE SHIPPED PARTS, IF YOU WANT TO APPLY
THOSE PARTS, PLEASE CONTACT YOUR SERVICE ACCOUNT MANAGER FOR MORE
INFORMATION.
AS FOR PICTURE, PLEASE REFER TO THE TABLE AS BELOW.

FOR REFURBISHMENT PARTS, THE TABLE IS FOR YOUR REFERENCE. YOU CAN DO THE
REFURBISHMENT ONLY WHEN YOUR SERVICE MODEL IS ALLOWED TO DO IT.

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9.2 Board Level 2.5 Repairs

„ Basic Repair Instructions for Component Replacement:
Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.
Warning：DO NOT overheat the tape and components to avoid the tape melted and the components damaged

Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the
components.
Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components
being removed
Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder
and flux residues.
Notice:
A. Checking the polarity of CON8, and the position can't be shifted.
B. Checking the polarity of SW8、SW7, and it can't be reversed.
C. All the parts of the PCB should be checked if it is missing or not.
D. The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.
E. When you solder and repair that the soldering iron, temperature must be setup 415℃. (The
temperature range is 415℃±5℃), and the solder wire's diameter is 0.4/0.5/0.6mm (SAC 305 (1.1%)
F. Please be noticed to follow below steps for main board repair which is equipped with Golden
Capacitor:
1. When replacing level 2.5 components located around the golden capacitor:
I. The temperature of the hot air blower must be under 400°c
II. When apply the hot air to the part / component, the heating time must be under 20
seconds (including the time of removing and soldering)
III. The temperature of the soldering iron must be under 350°c
IV. When apply the solder tip to the part / component, the heating time must be under 5
seconds
V. The solder tip must not contact with the golden capacitor
2. For BGA replacement: The golden capacitor must be removed before perform pre-heating,
heating, soldering and de-soldering process, and then it must be replaced with a new one
(please refer to 1.c. and 1.d. steps)
3. For main board which failed to pass the function test, the golden capacitor must be replaced
with a new one and must follow below soldering criteria: The temperature of the soldering iron
must be under 350°c When apply the solder tip to the part / component, the heating time must
be under 5 seconds The solder tip must not have a contact with the body of golden capacitor

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51HXXXXXXXX PCBA-MAIN BOARD (Side A)

Location P/N Description Remark

PTC1 36H00058-00M Fuse,1A,6V,0.055ohm ~ 0.21ohm,SMD1206P100TF,PTC Fuse
SW1 36H00230-00M SWITCH,SOH-213HST,MITSUMI,70/-20degC PTT Button
SW4 36H00230-00M SWITCH,SOH-213HST,MITSUMI,70/-20degC Power Button
SW6 36H00230-00M SWITCH,SOH-213HST,MITSUMI,70/-20degC Ok Button
SW3 36H00308-00M Switch, Reset switch,SOH-213HNT,MITSUMI Reset Button
SW7 36H00508-00M Switch,TSW-20,SHINMEI Camera Button
Rigid-Flex Board
CON3 75H00649-00M Connector B to B,100mohm,80P,0.4mmPitch,0.3A,30V
Connector
CON11 75H00654-00M Connector B to B,90mohm,26P,0.4Pitch,0.5A,60V,AXK7L26217G,NAIS Camera Connector

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¾ Side A Photo and Component Location

SW1

SW4

SW6

CON11

CON3

SW7

PTC1 SW3

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51HXXXXXXXXX PCBA-MAIN BOARD (Side B)

Location P/N Description Remark

PCG1 16H00012-00M Gold Cap,0.07F,70ohm Golden Cap
WCON1 75H00514-00P Connector RF,Female,4P,MS-162,HIROSE,3.5*3.1*2.5mm RF connector
GPS extension
WCON2 75H00276-00P Connector RF,5.8*5.4*3.9,Female,MS-147(06),4pin,HRS
antenna connector
ME8 36H00355-00M Vibrator,SSR-2881,SMT type, SANYO Vibrator
PCBA, Sub board
CON8 75H00655-00P Connector B to B,70mohm,14P,0.4mmPitch,0.3A,60V,AXK714137G
Connector
CON5 75H00465-00M Connector I/O,Reverse,11P,0.4Pitch,MJE21-11K7P20,ACON USB Connector
PCON1 75H00554-00M Connector,4Pin,2.5mm,250037MB004G511ZL-C,SUYIN,40mohm Battery Connector
CON2 75H00579-00M Connector FPC,23P,0.3Pitch,FH26-23S-0.3SHW(05),HIROSE Keyboard Connector
WCON_SW1 75H00248-00M COAXIAL CONNECTOR,RF,WITH SWITCH,SMD RF connector

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¾ Side A Photo and Component Location

WCON2
WCON1

CON8

PCON1

CON2

ME8

PCG1

CON5

WCON_SW1

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10. RF Antenna Specification

10.1 EU Antenna

1st Downlink
Items Test Name Tx Level TCH Note
Cell Power
1 Camp @ DCS Band 0 512 -65 BCCH=600
2 BS Originate Call 0 512 -65
E-GSM 900 Receiver Test
3 Fast Bit Error Rate 5 975 -104
E-GSM 900 Transmitter Test
4 TX Phase RMS Error 5 975 -104
5 TX Phase Peak Error 5 975 -104
6 TX Frequency Error 5 975 -104
7 Check TX Power 5 975 -104

1st Downlink
Items Test Name Tx Level TCH Note
Cell Power
1 Camp @ W-CDMA Band I (2100) 3 9613 -65
2 BS Originate Call 3 9613 -65
E-GSM 2100 Receiver Test
3 Bit Error Rate 3 9613 -104
E-GSM 2100 Transmitter Test
4 Check TX_Max Power 3 9613 -60

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10.2 US Antenna

1st Downlink
Items Test Name Tx Level TCH Note
Cell Power
1 Camp @ DCS Band 0 512 -75 BCCH=600
2 BS Originate Call 0 512 -75
GSM 850 Receiver Test
3 Fast Bit Error Rate 5 128 -104
GSM 850 Transmitter Test
4 TX Phase RMS Error 5 128 -104
5 TX Phase Peak Error 5 128 -104
6 TX Frequency Error 5 128 -104
7 Check TX Power 5 128 -104

1st Downlink
Items Test Name Tx Level TCH Note
Cell Power
1 Camp @ W-CDMA Band II (1900) 3 9400 -65
2 BS Originate Call 3 9400 -65
Receiver Test
3 Bit Error Rate 3 9400 -104
Transmitter Test
4 Check TX_Max Power 3 9400 -60

1st Downlink
Items Test Name Tx Level TCH Note
Cell Power
1 Camp @ W-CDMA Band II (850) 3 4175 -60
2 BS Originate Call 3 4175 -60
Receiver Test
3 Bit Error Rate 3 4175 -104
Transmitter Test
4 Check TX_Max Power 3 4175 -60

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