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Proteus 814 Flyer

Proteus V8.14 introduces several new features focused on testpoints, including allowing testpoints to be placed on schematics and layouts and using a live coverage monitor to check compliance. It also adds a differential pair configurator and support for specifying resin filled vias. Other additions include distributing components, applying track tapers, support for new PIC18 variants, and a manufacturing rule for minimum solder dams. Future releases will focus on manual routing improvements and Proteus 9.

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86 views2 pages

Proteus 814 Flyer

Proteus V8.14 introduces several new features focused on testpoints, including allowing testpoints to be placed on schematics and layouts and using a live coverage monitor to check compliance. It also adds a differential pair configurator and support for specifying resin filled vias. Other additions include distributing components, applying track tapers, support for new PIC18 variants, and a manufacturing rule for minimum solder dams. Future releases will focus on manual routing improvements and Proteus 9.

Uploaded by

vali29
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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PROTEUS V8.

14

Out Now

Introduction
The main focus of the 8.14 release is Main Features
on supporting testpoints throughout
the software suite. Testpoints
This means that testpoints can be Set minimum requirements
both placed on the schematic and and clearances, then use live
the layout or simply designated as coverage monitor to achieve
an existing pad/via on the layout. compliance.
Testpoint strategies and clearances
can be created and a live coverage
monitor shows progress and Differential Pair
compliance.
Configurator
Separately, we’ve added a differential
Easily define the signal paths for
pair configurator on the schematic to your diff pairs, including pass
simplify the setup and make it easy to through components.
specify pass through components on
the diff pair signal lines.
Resin Filled Via
Support
Specify vias as resin filled to
prevent solder wick when used
as via in pad.

Labcenter Electronics Ltd.


21 Hardy Grange
Skipton, UK
BD23 5AJ
PROTEUS
DESIGN
SUITE

Testpoint support
Dedicated support for testpoints:
• Set minimum numbers on a net class basis.
• Define clearances, board sides and other rules.

Align and Distribute • Either place and wire or designate existing pads/
vias.

Components • Use the live coverage monitor to work towards


compliance.
We’ve added a distribute command on a selection • Dedicated testpoint report and output plot.
of components. Together with the Align command a
series of parts can be quickly placed and then neatly
spaced out. New PIC18 Family
Major new variant set including PIC18F24Q10,
Track Tapers PIC18F25Q10, PIC18F26Q10, PIC18F27Q10,
PIC18F45Q10, PIC18F46Q10,PIC18F47Q10,
Avoid sudden changed in track widths by applying PIC18F26K40, PIC18F45K40, PIC18F46K40,
tapers when switching between full and neck styles. PIC18F24K40, PIC18F25K40, PIC18F27K40,
Apply globally based on width of track. PIC18F47K40.

New Manufacturing Coming Up


Rule We are now actively working on a series of manual
routing improvements, notably push and shove
We’ve added a new manufacturing rule (defaulted manual routing. These will be the likely focus of the
off) for minimum solder dam. Also called the next couple of point releases. In tandem with this
minimum solder mask sliver this lets you set a work is underway on the Proteus 9 release which we
minimum feature width for the solder dam between aim to launch sometime in 2023.
pads.

Version 8.14 Feature videos:


• Differential Pair Configuration • Teardrops and Track Tapers
• Test Points • Filled Vias

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