LT8609/LT8609A/LT8609B

42V, 3A Synchronous Step-Down

Regulator with 2.5µA Quiescent Current
FEATURES DESCRIPTION
n Wide Input Voltage Range: 3.0V to 42V The LT®8609/LT8609A/LT8609B is a compact, high effi-
n Ultralow Quiescent Current Burst Mode® Operation: ciency, high speed synchronous monolithic step-down
n <2.5µA I Regulating 12V to 3.3V switching regulator that consumes only 1.7µA of non-
Q IN OUT
n Output Ripple <10mV switching quiescent current. The LT8609/LT8609A/
P-P
n High Efficiency 2MHz Synchronous Operation: LT8609B can deliver 3A of continuous current. Burst Mode
n >93% Efficiency at 1A, 5V
OUT from 12VIN operation enables high efficiency down to very low output
n 3A Maximum Continuous Output currents while keeping the output ripple below 10mVP-P.
n Fast Minimum Switch-On Time: 45ns A SYNC pin allows synchronization to an external clock, or
n LT8609A Available in Fixed 3.3V and 5V Output spread spectrum modulation for low EMI operation. Internal
n Adjustable and Synchronizable: 200kHz to 2.2MHz compensation with peak current mode topology allows the
n Spread Spectrum Frequency Modulation for Low EMI use of small inductors and results in fast transient response
n Allows Use of Small Inductors and good loop stability. The EN/UV pin has an accurate
n Low Dropout 1V threshold and can be used to program VIN UVLO or to
n Peak Current Mode Operation shut down the part. A capacitor on the TR/SS pin programs
n Accurate 1V Enable Pin Threshold the output voltage ramp rate during start-up while the PG
n Internal Compensation flag signals when VOUT is within ±8.5% on the adjustable
n Output Soft-Start and Tracking output parts or ±7.5% on the fixed output parts of the
n Small 10-Lead MSOP Package, 16-Lead MSOP Pack- programmed output voltage as well as fault conditions.
age, or 10-Lead 3mm × 3mm DFN Package with Side The LT8609A has slower switch edges for lower EMI emis-
Wettable Flanks sions. The LT8609B operates in pulse-skipping mode only.
n AEC-Q100 Qualified for Automotive Applications
PULSE-SKIPPING MODE,

APPLICATIONS LT8609
Burst Mode OPERATION
Both
SWITCH EDGE SPEED
Fast
n GSM Transceivers LT8609A Both Medium
n General Purpose Step-Down
LT8609B Pulse-Skipping Fast
n Low EMI Step-Down

All registered trademarks and trademarks are the property of their respective owners.

TYPICAL APPLICATION 12VIN to 5VOUT Efficiency

100
5V, 2MHz Step-Down L = 2.2µH
95 fSW = 2MHz
VIN 90
VIN BST
6V TO 40V
4.7µF ON OFF EN/UV 0.1µF 2.2µH 85
VOUT
EFFICIENCY (%)

SYNC SW 5V 80
10pF 3A
LT8609A
75
INTVCC
TR/SS PG 70
1M
RT FB 65
1µF 18.2k GND 187k 22µF 60

8609 TA01a 55
50
0.00 0.50 1.00 1.50 2.00 2.50 3
IOUT (A)
8609 TA01b

Rev. J

Document Feedback For more information www.analog.com 1

LT8609/LT8609A/LT8609B
ABSOLUTE MAXIMUM RATINGS (Note 1)

VIN, EN/UV, PG...........................................................42V Operating Junction Temperature Range (Note 2)

FB, TR/SS....................................................................4V LT8609E/LT8609AE/LT8609BE.......... –40°C to 125°C
SYNC, VOUT..................................................................6V LT8609I/LT8609AI/LT8609BI............. –40°C to 125°C
LT8609H/LT8609AH........................... –40°C to 150°C
LT8609AJ........................................... –40°C to 150°C
Storage Temperature Range................... –65°C to 150°C

PIN CONFIGURATION
LT8609A
LT8609/LT8609A LT8609B TOP VIEW
TOP VIEW TOP VIEW BST 1 16 EN/UV
BST 1 10 EN/UV BST 1 10 EN/UV NC 2 15 NC
9 VIN 9 VIN SW 3 14 VIN
SW 2 SW 2 17
11 11 NC 4 13 NC
INTVCC 3 8 PG INTVCC 3 8 PG GND
GND GND INTVCC 5 12 PG
RT 4 7 TR/SS RT 4 7 TR/SS RT 6 11 TR/SS
SYNC 5 6 FB NC 5 6 FB SYNC 7 10 FB
GND 8 9 FB
MSE PACKAGE MSE PACKAGE
10-LEAD PLASTIC MSOP 10-LEAD PLASTIC MSOP MS PACKAGE
θJA = 40°C/W θJA = 40°C/W 16-LEAD PLASTIC MSOP
EXPOSED PAD (PIN 11) IS GND, EXPOSED PAD (PIN 11) IS GND, θJA = 40°C/W, θJC(PAD) = 10°C/W
MUST BE SOLDERED TO PCB MUST BE SOLDERED TO PCB EXPOSED PAD (PIN 17) IS GND,
MUST BE SOLDERED TO PCB

LT8609/LT8609A LT8609-3.3/LT8609-5
TOP VIEW TOP VIEW

BST 1 10 EN/UV BST 1 10 EN/UV

SW 2 9 VIN SW 2 9 VIN
11 11
INTVCC 3 8 PG INTVCC 3 8 PG
GND GND
RT 4 7 TR/SS RT 4 7 TR/SS
SYNC 5 6 FB SYNC 5 6 VOUT

DDM PACKAGE DDM PACKAGE

10-LEAD (3mm × 3mm) PLASTIC SIDE WETTABLE DFN 10-LEAD (3mm × 3mm) PLASTIC SIDE WETTABLE DFN
θJA = 45°C/W, θJC = 10°C/W θJA = 45°C/W, θJC = 10°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB

ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT8609EMSE#PBF LT8609EMSE#TRPBF LTGRW 10-Lead Plastic MSOP –40°C to 125°C
LT8609IMSE#PBF LT8609IMSE#TRPBF LTGRW 10-Lead Plastic MSOP –40°C to 125°C
LT8609HMSE#PBF LT8609HMSE#TRPBF LTGRW 10-Lead Plastic MSOP –40°C to 150°C
LT8609AEMSE#PBF LT8609AEMSE#TRPBF LTGVR 10-Lead Plastic MSOP –40°C to 125°C
LT8609AIMSE#PBF LT8609AIMSE#TRPBF LTGVR 10-Lead Plastic MSOP –40°C to 125°C
LT8609AJMSE#PBF LT8609AJMSE#TRPBF LTGVR 10-Lead Plastic MSOP –40°C to 150°C
LT8609AHMSE#PBF LT8609AHMSE#TRPBF LTGVR 10-Lead Plastic MSOP –40°C to 150°C
LT8609BEMSE#PBF LT8609BEMSE#TRPBF LTGZY 10-Lead Plastic MSOP –40°C to 125°C

Rev. J

2 For more information www.analog.com

 LT8609/LT8609A/LT8609B
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT8609BIMSE#PBF LT8609BIMSE#TRPBF LTGZY 10-Lead Plastic MSOP –40°C to 125°C
LT8609AEMSE16#PBF LT8609AEMSE16#TRPBF 8609A 16-Lead Plastic MSOP –40°C to 125°C
LT8609AIMSE16#PBF LT8609AIMSE16#TRPBF 8609A 16-Lead Plastic MSOP –40°C to 125°C
LT8609AJMSE16#PBF LT8609AJMSE16#TRPBF 8609A 16-Lead Plastic MSOP –40°C to 150°C
LT8609AHMSE16#PBF LT8609AHMSE16#TRPBF 8609A 16-Lead Plastic MSOP –40°C to 150°C
LT8609AEDDM#PBF LT8609AEDDM#TRPBF LHJZ 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 125°C
LT8609AJDDM#PBF LT8609AJDDM#TRPBF LHJZ 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
LT8609AHDDM#PBF LT8609AHDDM#TRPBF LHJZ 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
LT8609AEDDM-3.3#PBF LT8609AEDDM-3.3#TRPBF LHKB 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 125°C
LT8609AJDDM-3.3#PBF LT8609AJDDM-3.3#TRPBF LHKB 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
LT8609AEDDM-5#PBF LT8609AEDDM-5#TRPBF LHKC 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 125°C
LT8609AJDDM-5#PBF LT8609AJDDM-5#TRPBF LHKC 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
LT8609AHDDM-5#PBF LT8609AHDDM-5#TRPBF LHKC 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
AUTOMOTIVE PRODUCTS**
LT8609EMSE#WPBF LT8609EMSE#WTRPBF LTGRW 10-Lead Plastic MSOP –40°C to 125°C
LT8609IMSE#WPBF LT8609IMSE#WTRPBF LTGRW 10-Lead Plastic MSOP –40°C to 125°C
LT8609HMSE#WPBF LT8609HMSE#WTRPBF LTGRW 10-Lead Plastic MSOP –40°C to 150°C
LT8609AEMSE#WPBF LT8609AEMSE#WTRPBF LTGVR 10-Lead Plastic MSOP –40°C to 125°C
LT8609AIMSE#WPBF LT8609AIMSE#WTRPBF LTGVR 10-Lead Plastic MSOP –40°C to 125°C
LT8609AJMSE#WPBF LT8609AJMSE#WTRPBF LTGVR 10-Lead Plastic MSOP –40°C to 150°C
LT8609AHMSE#WPBF LT8609AHMSE#WTRPBF LTGVR 10-Lead Plastic MSOP –40°C to 150°C
LT8609AEMSE16#WPBF LT8609AEMSE16#WTRPBF 8609A 16-Lead Plastic MSOP –40°C to 125°C
LT8609AIMSE16#WPBF LT8609AIMSE16#WTRPBF 8609A 16-Lead Plastic MSOP –40°C to 125°C
LT8609AJMSE16#WPBF LT8609AJMSE16#WTRPBF 8609A 16-Lead Plastic MSOP –40°C to 150°C
LT8609AHMSE16#WPBF LT8609AHMSE16#WTRPBF 8609A 16-Lead Plastic MSOP –40°C to 150°C
LT8609AEDDM#WPBF LT8609AEDDM#WTRPBF LHJZ 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 125°C
LT8609AJDDM#WPBF LT8609AJDDM#WTRPBF LHJZ 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
LT8609AHDDM#WPBF LT8609AHDDM#WTRPBF LHJZ 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
LT8609AEDDM-3.3#WPBF LT8609AEDDM-3.3#WTRPBF LHKB 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 125°C
LT8609AJDDM-3.3#WPBF LT8609AJDDM-3.3#WTRPBF LHKB 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
LT8609AEDDM-5#WPBF LT8609AEDDM-5#WTRPBF LHKC 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 125°C
LT8609AJDDM-5#WPBF LT8609AJDDM-5#WTRPBF LHKC 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
LT8609AHDDM-5#WPBF LT8609AHDDM-5#WTRPBF LHKC 10-Lead (3mm × 3mm) Plastic Side Wettable DFN –40°C to 150°C
Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
**Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These
models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your
local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for
these models.

Rev. J

For more information www.analog.com 3

LT8609/LT8609A/LT8609B
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Input Voltage 3.0 V
l 2.7 3.2
VIN Quiescent Current LT8609/LT8609A:
VEN/UV = 0V, VSYNC = 0V 1 4 µA
VEN/UV = 2V, Not Switching, VSYNC = 0V l 1.7 12 µA
LT8609B:
VEN/UV = 0V 1 4 µA
VEN/UV = 2V, Not Switching 350 µA
VIN Current in Regulation LT8609/LT8609A:
VIN = 6V, VOUT = 2.7V, Output Load = 100μA l 46 90 μA
VIN = 6V, VOUT = 2.7V, Output Load = 1mA l 480 700 μA
LT8609A-3.3:
VIN = 8V, VOUT = 3.3V ILOAD = 100μA l 46 90 μA
VIN = 8V, VOUT = 3.3V ILOAD = 1mA l 480 700 μA
LT8609A-5:
VIN = 12V, VOUT = 5V ILOAD = 100μA l 46 90 μA
VIN = 12V, VOUT = 5V ILOAD = 1mA l 480 700 μA
Feedback Reference Voltage LT8609/LT8609A: (E-, I-, H-Grade)
VIN = 6V, ILOAD = 100mA 0.778 0.782 0.786 V
VIN = 6V, ILOAD = 100mA l 0.770 0.782 0.794 V
LT8609/LT8609A: (J-Grade)
VIN = 6V, ILOAD = 100mA 0.778 0.782 0.786 V
VIN = 6V, ILOAD = 100mA l 0.766 0.782 0.798 V
LT8609B:
VIN = 6V, ILOAD = 100mA 0.772 0.782 0.792 V
VIN = 6V, ILOAD = 100mA l 0.759 0.782 0.805 V
Output Reference Voltage LT8609A-3.3:
VIN = 8V, ILOAD = 100mA 3.291 3.3 3.309 V
VIN = 8V, ILOAD = 100mA l 3.25 3.3 3.35 V
LT8609A-5:
VIN = 12V, ILOAD = 100mA 4.97 5 5.03 V
VIN = 12V, ILOAD = 100mA l 4.89 5 5.11 V
Feedback Voltage Line Regulation LT8609/LT8609A:
VIN = 4.0V to 40V l 0.004 0.02 %/V
Feedback Voltage Line Regulation LT8609B:
VIN = 4.0V to 40V l 0.004 0.04 %/V
Output Voltage Line Regulation LT8609A-3.3:
VIN = 4.0V to 40V l 0.004 0.02 %/V
Output Voltage Line Regulation LT8609A-5:
VIN = 6.0V to 40V l 0.004 0.02 %/V
Feedback Pin Input Current LT8609/LT8609A/LT8609B:
VFB = 1.0V l ±20 nA
Output Pin Input Current LT8609A-3.3:
VOUT = 4.0V l 620 nA
Output Pin Input Current LT8609A-5:
VOUT = 6.0V l 425 nA
Minimum On-Time ILOAD = 1.5A, SYNC = 0V l 45 75 ns
ILOAD = 1.5A, SYNC = 1.9V l 45 60 ns
Minimum Off Time 90 130 ns

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 LT8609/LT8609A/LT8609B
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Oscillator Frequency LT8609/LT8609A:
RT = 221k, ILOAD = 0.5A l 155 200 245 kHz
RT = 60.4k, ILOAD = 0.5A l 640 700 760 kHz
RT = 18.2k, ILOAD = 0.5A l 1.925 2.00 2.075 MHz
LT8609B:
RT = 18.2k, ILOAD = 0.5A l 1.875 2.00 2.125 MHz
Top Power NMOS On-Resistance ILOAD = 1A 185 mΩ
Top Power NMOS Current Limit l 3.4 4.5 5.7 A
Bottom Power NMOS On-Resistance 115 mΩ
SW Leakage Current VIN = 42V, VSW = 40V l 15 µA
EN/UV Pin Threshold EN/UV Rising l 0.99 1.05 1.11 V
EN/UV Pin Hysteresis 50 mV
EN/UV Pin Current LT8609/LT8609A:
VEN/UV = 2V l ±20 nA
LT8609B:
VEN/UV = 2V l ±30 nA
PG Upper Threshold Offset from VFB LT8609/LT8609A:
VFB Rising l 5 8.5 13 %
LT8609B:
VFB Rising l 4 8.5 14 %
PG Upper Threshold Offset from VOUT LT8609A-3.3/LT8609A-5
VOUT Rising l 5 7.5 11 %
PG Lower Threshold Offset from VFB LT8609/LT8609A:
VFB Falling l 5 8.5 13 %
LT8609B:
VFB Falling l 4 8.5 14 %
PG Lower Threshold Offset from VOUT LT8609A-3.3/LT8609A-5
VOUT Falling l 5 7.5 11 %
PG Hysteresis 0.5 %
PG Leakage VPG = 42V l ±200 nA
PG Pull-Down Resistance VPG = 0.1V 550 1200 Ω
Sync Low Input Voltage LT8609/LT8609A l 0.4 0.9 V
Sync High Input Voltage LT8609/LT8609A: l 2.7 3.2 V
INTVCC = 3.5V
TR/SS Source Current l 1 2 3 µA
TR/SS Pull-Down Resistance Fault Condition, TR/SS = 0.1V 300 900 Ω
Spread Spectrum Modulation Frequency LT8609/LT8609A:
VSYNC = 3.3V 1 3 6 kHz

Note 1: Stresses beyond those listed under Absolute Maximum Ratings guaranteed over the full –40°C to 125°C operating junction temperature
may cause permanent damage to the device. Exposure to any Absolute range. The LT8609H/LT8609AH/LT8609AJ is guaranteed over the full
Maximum Rating condition for extended periods may affect device –40°C to 150°C operating junction temperature range. High junction
reliability and lifetime. Absolute Maximum Ratings are those values temperatures degrade operating lifetimes. Operating lifetime is derated at
beyond which the life of a device may be impaired. junction temperatures greater than 125°C.
Note 2: The LT8609E/LT8609AE/LT8609BE is guaranteed to meet Note 3: This IC includes overtemperature protection that is intended to
performance specifications from 0°C to 125°C junction temperature. protect the device during overload conditions. Junction temperature will
Specifications over the –40°C to 125°C operating junction temperature exceed 150°C when overtemperature protection is active. Continuous
range are assured by design, characterization, and correlation with operation above the specified maximum operating junction temperature
statistical process controls. The LT8609I/LT8609AI/LT8609BI is will reduce lifetime.
Rev. J

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LT8609/LT8609A/LT8609B
TYPICAL PERFORMANCE CHARACTERISTICS
LT8609 Efficiency (3.3V Output, LT8609 Efficiency (3.3V Output, LT8609 Efficiency (5V Output,
Burst Mode Operation) Burst Mode Operation) Burst Mode Operation)
100 100 100
L = 8.2µH L = 8.2µH L = 8.2µH
95 fSW = 700kHz 90 fSW = 700kHz 95 fSW = 700kHz
90 80 90
85 70 85
EFFICIENCY (%)

EFFICIENCY (%)

EFFICIENCY (%)
80 60 80
75 50 75
70 40 70
65 30 65
60 20 60
55 VIN = 12V 10 VIN = 12V 55 VIN = 12V
VIN = 24V VIN = 24V VIN = 24V
50 0 50
0 0.5 1 1.5 2 2.5 3 0.001 0.01 0.1 1 10 100 1k 10k 0 0.5 1 1.5 2 2.5 3
IOUT (A) IOUT (mA) IOUT (A)
8609 G01 8609 G02 8609 G03

LT8609 Efficiency (5V Output, LT8609 Efficiency (3.3V Output, LT8609 Efficiency (3.3V Output,
Burst Mode Operation) 2MHz, Burst Mode Operation) 2MHz, Burst Mode Operation)
100 100 100
L = 8.2µH L = 2.2µH L = 2.2µH
90 fSW = 700kHz 95 fSW = 2MHz 90 fSW = 2MHz
80 90 80
70 85 70
EFFICIENCY (%)

EFFICIENCY (%)

60 80 EFFICIENCY (%) 60
50 75 50
40 70 40
30 65 30
20 60 20
10 VIN = 12V 55 VIN = 12V 10 VIN = 12V
VIN = 24V VIN = 24V VIN = 24V
0 50 0
0.001 0.01 0.1 1 10 100 1k 10k 0 0.5 1 1.5 2 2.5 3 0.001 0.01 0.1 1 10 100 1k 10k
IOUT (mA) IOUT (A) IOUT (mA)
8609 G04 8609 G05 8609 G06

LT8609 Efficiency (5V Output, LT8609 Efficiency (5V Output,

2MHz, Burst Mode Operation) 2MHz, Burst Mode Operation) FB Voltage
100 100 785
L = 2.2µH L = 2.2µH
95 fSW = 2MHz 90 fSW = 2MHz 784
FB REGULATION VOLTAGE (mV)

90 80 783
85 70 782
EFFICIENCY (%)

EFFICIENCY (%)

80 60 781
75 50 780
70 40 779
65 30 778
60 20 777
55 VIN = 12V 10 VIN = 12V 776
VIN = 24V VIN = 24V
50 0 775
0 0.5 1 1.5 2 2.5 3 0.001 0.01 0.1 1 10 100 1k 10k –50 –10 30 70 110 150
IOUT (A) IOUT (mA) TEMPERATURE (°C)
8609 G07 8609 G08 8609 G09

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 LT8609/LT8609A/LT8609B
TYPICAL PERFORMANCE CHARACTERISTICS

LT8609A-3.3 VOUT Voltage LT8609A-5 VOUT Voltage Load Regulation

3.310 5.02 0.500

3.305 0.400
5.01
VOUT REGULATION VOLTAGE (V)

VOUT REGULATION VOLTAGE (V)

0.300
3.300
0.200

CHANGE IN VOUT (%)

5.00
3.295 0.100
3.290 4.99 0.000

3.285 –0.100
4.98
–0.200
3.280
–0.300
4.97
3.275 –0.400
3.270 4.96 –0.500
–50 –10 30 70 110 150 –50 –10 30 70 110 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0
TEMPERATURE (°C) TEMPERATURE (°C) OUTPUT CURRENT (A)
8609 G40 8609 G41 8609 G10

No-Load Supply Current Tested in No-Load Supply Current

Line Regulation Regulation vs Temperature (N ot Switching)
0.20 5.00 3.3
ILOAD = 1A L = 2.2µH VIN = 12V
0.15 3.1
4.50
2.9
0.10
4.00 2.7

INPUT CURRENT (µA)

CHANGE IN VOUT (%)

0.05
2.5
3.50
IIN (µA)

0.00 LT8609 (VOUT = 3.3V) 2.3

3.00 LT8609A-3.3
–0.05 2.1
LT8609A-5
2.50 1.9
–0.10
1.7
–0.15 2.00
1.5
–0.20 1.50 1.3
4.0 11.6 19.2 26.8 34.4 42.0 2 10 18 26 34 42 –50 –10 30 70 110 150
INPUT VOLTAGE (V) INPUT VOLTAGE (V) TEMPERATURE (°C)
8609 G11 8609 G12 8609 G13

Top FET Current Limit Top FET Current Limit

vs
TopDuty
Fet Cycle
Current Limit vs Duty Cycle vs Temperature
5.50 5.0

5.25 4.9
TOP FET CURRENT LIMIT (A)

5.00 4.8

4.75 4.7
ISW (A)

4.50 4.6

4.25 4.5

4.00 4.4

3.75 4.3

3.50 4.2
0 20 40 60 80 100 –50 –10 30 70 110 150
DUTY CYCLE (%) TEMPERATURE (°C)
8609 G14 8609 G15

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LT8609/LT8609A/LT8609B
TYPICAL PERFORMANCE CHARACTERISTICS

Switch Drop vs Temperature Switch Drop vs Switch Current

350 800
SWITCH CURRENT = 1A
300 700

600
250
SWITCH DROP (mV)

SWITCH DROP (mV)

500
200
400
150
300
100
200

50 100
TOP SW BOT SW TOP SW BOT SW
0 0
–50 –30 –10 10 30 50 70 90 110 130 150 0 0.5 1 1.5 2 2.5 3
TEMPERATURE (°C) SWITCH CURRENT (A)
8609 G16 8609 G17

Minimum On-Time Minimum Off-Time

vs Temperature
Minimum On-Time Vs Temperature vs Temperature
Minimum Off–Time Vs Temperature
70 150
VIN = 6V
140 ILOAD = 1A
60
130
MINIMUM OFF–TIME (ns)
MINIMUM ON-TIME (ns)

50 120
110
40
100
30
90

20 80
70
10
SYNC = 2V, 1.5A OUT 60
SYNC = 0V, 1.5A OUT
0 50
–50 –30 –10 10 30 50 70 90 110 130 150 –50 –30 –10 10 30 50 70 90 110 130 150
TEMPERATURE (°C) TEMPERATURE (°C)
8609 G18 8609 G19

Switching Frequency
Dropout Voltage vs Load Current vs Temperature
Switching Frequency Vs Temperature
1000 2.005
L = XFL4020–222MEC

2.000
SWITHCING FREQUENCY (MHz)

800
DROPOUT VOLTAGE (mV)

1.995
600
1.990

400
1.985

200 1.980

RT = 18.2kΩ
0 1.975
0 0.5 1 1.5 2 2.5 3 –50 –30 –10 10 30 50 70 90 110 130 150
LOAD CURRENT (A) TEMPERATURE (°C)
8609 G20 8609 G21

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 LT8609/LT8609A/LT8609B
TYPICAL PERFORMANCE CHARACTERISTICS
Minimum Load to Full Frequency
Burst Frequency vs Load Current (SYNC Float to 1.9V) Frequency Foldback
2500 100 2500
L = 2.2µH VOUT = 5V VIN = 12V
VOUT = 3.3V 90 fSW = 700kHz VOUT = 3.3V
VIN = 12V SYNC = FLOAT RT = 18.2k
2000 80 2000
SYNC = 0V
70

LOAD CURRENT (mA)

FREQUENCY (kHz)

FREQUENCY (kHz)
1500 60 1500
50
1000 40 1000
30
500 20 500
10
0 0 0
0 200 400 600 0 10 20 30 40 50 0 0.2 0.4 0.6 0.8 1
LOAD CURRENT (mA) INPUT VOLTAGE (V) FB VOLTAGE (V)
8609 G22 8609 G23 8609 G24

Soft-Start Tracking Soft-Start

Soft Current Vs
Start Current vs Temperature VIN UVLO
1.0 2.5 3.5
VSS = 0.1V
0.9 2.4
3
0.8 2.3
SOFT START CURRENT (µA)

0.7 2.2 2.5

FB VOLTAGE (V)

0.6 2.1 VIN UVLO (V)

2
0.5 2.0
1.5
0.4 1.9
0.3 1.8 1
0.2 1.7
0.5
0.1 1.6
0 1.5 0
0 0.1 0.2 0.4 0.5 0.6 0.7 0.8 1.0 1.1 1.2 –50 –30 –10 10 30 50 70 90 110 130 150 –55 –25 5 35 65 95 125 155
SS VOLTAGE (V) TEMPERATURE (°C) TEMPERATURE (°C)
8609 G25 8609 G26 8609 G30

Case Temperature vs Case Temperature vs

Load Current 3A Pulsed
Case Load vs 3A Pulsed Load
Temperature
60 50
VOUT = 5V VIN = 12V
fSW = 2MHz 45 VIN = 24V
50 STANDBY LOAD = 50mA
CASE TEMPERATURE RISE (°C)
CASE TEMPERATURE RISE (°C)

40
PULSED LOAD = 3A
35 VOUT = 5V
40
30 fSW = 2MHz

30 25
20
20
15
10
10
VIN = 12V 5
VIN = 24V
0 0
0 0.5 1 1.5 2 2.5 3 0 10 20 30 40 50 60 70 80 90 100
LOAD CURRENT (A) DUTY CYCLE (%)
8609 G31 8609 G32

Rev. J

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LT8609/LT8609A/LT8609B
TYPICAL PERFORMANCE CHARACTERISTICS

Switching Waveforms Switching Waveforms Switching Waveforms

1A/DIV 200mA/DIV 1A/DIV

5V/DIV 5V/DIV 10V/DIV

8609 G33 8609 G34 8609 G35

500ns/DIV 10µs/DIV 500ns/DIV
12VIN TO 5VOUT AT 1A 12VIN TO 5VOUT AT 10mA 36VIN TO 5VOUT AT 1A
SYNC = 0

Transient Response Transient Response

500mA/DIV 500mA/DIV

100mV/DIV 100mV/DIV

8609 G36 8609 G37

50µs/DIV 20µs/DIV
50mA TO 1A TRANSIENT 0.5A TO 1.5A TRANSIENT
12VIN TO 5VOUT 12VIN TO 5VOUT
COUT = 47µF COUT = 47µF

Start-Up Dropout Start-Up

Start-Up Dropout
Droupout
7 7 7 7
RLOAD = 25Ω RLOAD = 2.5Ω

6 6 6 6

5 5 5 5
OUTPUT VOLTAGE (V)

OUTPUT VOLTAGE (V)

INPUT VOLTAGE (V)

INPUT VOLTAGE (V)

4 VOUT 4 4 VOUT 4

3 3 3 3

2 2 2 2
VIN VIN
1 1 1 1

0 0 0 0
0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7
INPUT VOLTAGE (V) INPUT VOLTAGE (V)
8609 G38 8609 G39

Rev. J

10 For more information www.analog.com

 LT8609/LT8609A/LT8609B
PIN FUNCTIONS
BST: This pin is used to provide a drive voltage, higher LT8609B to regulate the FB pin to equal the TR/SS pin
than the input voltage, to the topside power switch. Place voltage. In the LT8609A-3.3 and LT8609A-5 fixed output
a 0.1µF boost capacitor as close as possible to the IC. Do voltage options the output voltage will track the TR/SS
not place a resistor in series with this pin. pin voltage based on a factor set by the internal feedback
resistor divider. The 3.3V output options will track to a
SW: The SW pin is the output of the internal power
voltage 4.2 times that of the TR/SS pin, while the 5V
switches. Connect this pin to the inductor and boost
output options will track to a voltage 6.39 times that of
capacitor. This node should be kept small on the PCB for
the TR/SS pin. When TR/SS is above 0.782V, the tracking
good performance.
function is disabled and the internal reference resumes
INTVCC: Internal 3.5V Regulator Bypass Pin. The inter- control of the error amplifier. An internal 2μA pull-up
nal power drivers and control circuits are powered from current from INTVCC on this pin allows a capacitor to
this voltage. INTVCC max output current is 20mA. Voltage program output voltage slew rate. This pin is pulled to
on INTVCC will vary between 2.8V and 3.5V. Decouple ground with a 300Ω MOSFET during shutdown and fault
this pin to power ground with at least a 1μF low ESR conditions; use a series resistor if driving from a low
ceramic capacitor. Do not load the INTVCC pin with exter- impedance output.
nal circuitry.
PG: The PG pin is the open-drain output of an internal
RT: A resistor is tied between RT and ground to set the comparator. On the LT8609/LT8609A/LT8609B adjust-
switching frequency. able output parts, PG remains low until the FB pin is
SYNC: External Clock Synchronization Input. Ground within ±8.5% of the final regulation voltage, and there
this pin for low ripple Burst Mode operation at low out- are no fault conditions. On the LT8609A-3.3/LT8609A-5
put loads. Tie to a clock source for synchronization to fixed output parts, PG remains low until the VOUT pin is
an external frequency. Leave floating for pulse-skipping within ±7.5% of the final regulation voltage, and there are
mode with no spread spectrum modulation. Tie to INTVCC no fault conditions. PG is valid when VIN is above 3.2V,
or tie to a voltage between 3.2V and 5.0V for pulse-skip- regardless of EN/UV pin state.
ping mode with spread spectrum modulation. When in VIN: The VIN pin supplies current to the LT8609/LT8609A/
pulse-skipping mode, the IQ will increase to several mA. In LT8609B internal circuitry and to the internal topside
the LT8609B, the SYNC pin is replaced with a no connect; power switch. This pin must be locally bypassed. Be sure
the LT8609B operates in pulse-skipping mode without to place the positive terminal of the input capacitor as
spread spectrum. close as possible to the VIN pins, and the negative capaci-
FB (LT8609/LT8609A/LT8609B ONLY): The LT8609/ tor terminal as close as possible to the GND pins.
LT8609A/LT8609B adjustable output parts regulate the EN/UV: The LT8609/LT8609A/LT8609B is shut down
FB pin to 0.782V. Connect the feedback resistor divider when this pin is low and active when this pin is high. The
tap to this pin. hysteretic threshold voltage is 1.05V going up and 1.00V
VOUT (LT8609A-3.3/LT8609-5 ONLY): The LT 8609A-3.3 going down. Tie to VIN if the shutdown feature is not used.
regulates to VOUT pin to 3.3V. This pin connects a 5.9MΩ An external resistor divider from VIN can be used to pro-
internal feedback divider that programs the fixed output. gram a VIN threshold below which the LT8609/LT8609A/
The LT8609A-5 regulates to VOUT pin to 5V. This pin con- LT8609B will shut down.
nects a 8.95MΩ internal feedback divider that programs GND: Exposed Pad Pin. The exposed pad must be con-
the fixed output. nected to the negative terminal of the input capacitor
TR/SS: Output Tracking and Soft-Start Pin. This pin allows and soldered to the PCB in order to lower the thermal
user control of output voltage ramp rate during start-up. A resistance.
TR/SS voltage below 0.782V forces the LT8609/LT8609A/
Rev. J

For more information www.analog.com 11

LT8609/LT8609A/LT8609B
BLOCK DIAGRAM
VIN
VIN
CIN –
INTERNAL 0.782V REF
+ 3.5V
R3 1V + REG
OPT EN/UV
– SHDN
SLOPE COMP
R4 INTVCC
OPT ±8.5%
(±7.5% FOR CVCC
OSCILLATOR
FIXED OUTPUT) ERROR BST
PG 200kHz TO 2.2MHz
VOUT AMP
RPG
+ VC
BURST SWITCH M1
CBST
+ DETECT LOGIC L
VOUT – AND
SW
VOUT
ANTI-
SHOOT COUT
CFF R1 SHDN
TSD THROUGH M2
INTVCC UVLO 2µA
R2 FB VIN UVLO
GND
SHDN
TSD
LT8609/LT8609A/ VIN UVLO
LT8609AB ONLY

VOUT CFF
VOUT
R1
R2
LT8609A-3.3/LT8609A-5
ONLY
TR/SS RT SYNC
8609 BD

CSS RT
OPT

Rev. J

12 For more information www.analog.com

 LT8609/LT8609A/LT8609B
OPERATION
The LT8609/LT8609A/LT8609B is a monolithic constant load. The SYNC pin is tied low to use Burst Mode opera-
frequency current mode step-down DC/DC converter. An tion and can be floated to use pulse-skipping mode. If a
oscillator with frequency set using a resistor on the RT pin clock is applied to the SYNC pin the part will synchronize
turns on the internal top power switch at the beginning of to an external clock frequency and operate in pulse-skip-
each clock cycle. Current in the inductor then increases ping mode. While in pulse-skipping mode the oscillator
until the top switch current comparator trips and turns off operates continuously and positive SW transitions are
the top power switch. The peak inductor current at which aligned to the clock. During light loads, switch pulses
the top switch turns off is controlled by the voltage on the are skipped to regulate the output and the quiescent cur-
internal VC node. The error amplifier servos the VC node rent will be several mA. The SYNC pin may be tied high
by comparing the voltage on the VFB pin with an internal for spread spectrum modulation mode, and the LT8609/
0.782V reference. The LT8609A-5 and LT8609A-3.3 Fixed LT8609A will operate similar to pulse-skipping mode but
output parts use the VOUT pin and an internal resistor vary the clock frequency to reduce EMI.
divider to generate an internal FB node. When the load
Comparators on the LT8609/LT8609A/LT8609B adjustable
current increases it causes a reduction in the feedback
output parts monitoring the FB pin voltage will pull the
voltage relative to the reference leading the error amplifier
PG pin low if the output voltage varies more than ±8.5%
to raise the VC voltage until the average inductor current
(typical) from the set point, or if a fault condition is pres-
matches the new load current. When the top power switch
ent. Comparators on the LT8609A-3.3/LT8609A-5 fixed
turns off the synchronous power switch turns on until the
output parts monitoring the VOUT pin voltage will pull the
next clock cycle begins or inductor current falls to zero.
PG pin low if the output voltage varies more than ±7.5%
If overload conditions result in excess current flowing
(typical) from the set point, or if a fault condition is present.
through the bottom switch, the next clock cycle will be
delayed until switch current returns to a safe level. The oscillator reduces the LT8609/LT8609A’s operating
frequency when the voltage at the FB pin is low, or the
If the EN/UV pin is low, the LT8609/LT8609A/LT8609B is voltage at the VOUT pin is low on the LT8609A-3.3 or
shut down and draws 1µA from the input. When the EN/UV LT8609A-5 fixed voltage options. This frequency foldback
pin is above 1V, the switching regulator becomes active. helps to control the inductor current when the output volt-
To optimize efficiency at light loads, the LT8609/LT8609A age is lower than the programmed value which occurs
enters Burst Mode operation during light load situations. during start-up. When a clock is applied to the SYNC pin
Between bursts, all circuitry associated with controlling the frequency foldback is disabled.
the output switch is shut down, reducing the input supply The LT8609B has no SYNC pin and only operates in pulse-
current to 1.7μA. In a typical application, 2.5μA will be skipping mode.
consumed from the input supply when regulating with no

Rev. J

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LT8609/LT8609A/LT8609B
APPLICATIONS INFORMATION
Achieving Ultralow Quiescent Current
To enhance efficiency at light loads, the LT8609/LT8609A
enters into low ripple Burst Mode operation, which keeps
the output capacitor charged to the desired output voltage 200mA/DIV

while minimizing the input quiescent current and minimiz-

ing output voltage ripple. In Burst Mode operation the
10mV/DIV
LT8609/LT8609A delivers single small pulses of current
to the output capacitor followed by sleep periods where 8609 F02
2.00µs/DIV
the output power is supplied by the output capacitor. While
in sleep mode the LT8609/LT8609A consumes 1.7μA. Figure 2. Burst Mode Operation

As the output load decreases, the frequency of single cur- the converter quiescent current approaches 2.5µA for a
rent pulses decreases (see Figure 1) and the percentage typical application when there is no output load. Therefore,
of time the LT8609/LT8609A is in sleep mode increases, to optimize the quiescent current performance at light
resulting in much higher light load efficiency than for typi- loads, the current in the feedback resistor divider must
cal converters. By maximizing the time between pulses, be minimized as it appears to the output as load current.
2500 While in Burst Mode operation the current limit of the
L = 2.2µH
VOUT = 3.3V top switch is approximately 600mA resulting in output
2000
VIN = 12V
SYNC = 0V
voltage ripple shown in Figure 2. Increasing the output
capacitance will decrease the output ripple proportionally.
FREQUENCY (kHz)

1500 As load ramps upward from zero the switching frequency

will increase but only up to the switching frequency pro-
1000 grammed by the resistor at the RT pin as shown in Table 1.
The output load at which the LT8609/LT8609A reaches
500
the programmed frequency varies based on input voltage,
output voltage, and inductor choice.
0
0 200 400 600
LOAD CURRENT (mA)
For some applications, it is desirable for the LT8609/
8609 G22
LT8609A to operate in pulse-skipping mode, which is the
Figure 1a. SW Burst Mode Frequency vs Load only mode available to the LT8609B. Pulse-skipping mode
100
offers two major differences from Burst Mode operation.
90
VOUT = 5V
fSW = 700kHz
First is the clock stays awake at all times and all switch-
80 SYNC = FLOAT ing cycles are aligned to the clock. In this mode much
70 of the internal circuitry is awake at all times, increasing
LOAD CURRENT (mA)

60 quiescent current to several hundred µA. Second is that

50 full switching frequency is reached at lower output load
40 than in Burst Mode operation as shown in Figure 1b. To
30 enable pulse-skipping mode the SYNC pin is floated. To
20 achieve spread spectrum modulation with pulse-skipping
10 mode, the SYNC pin is tied high. While a clock is applied
0
0 10 20 30 40 50 to the SYNC pin the LT8609/LT8609A will also operate in
INPUT VOLTAGE (V)
8609 G23
pulse-skipping mode.

Figure 1b. Full Switching Frequency Minimum Load

vs VIN in Pulse Skipping Mode
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14 For more information www.analog.com

 LT8609/LT8609A/LT8609B
APPLICATIONS INFORMATION
FB Resistor Network Table 1. SW Frequency vs RT Value
The output voltage is programmed with a resistor divider fSW (MHz) RT (kΩ)
between the output and the FB pin. Choose the resistor 0.2 221

values according to: 0.300 143

0.400 110
⎛ V ⎞
R1= R2 ⎜ OUT – 1⎟ 0.500 86.6
⎝ 0.782V ⎠ 0.600 71.5

0.700 60.4
1% resistors are recommended to maintain output volt- 0.800 52.3
age accuracy. 0.900 46.4
The total resistance of the FB resistor divider should be 1.000 40.2
selected to be as large as possible when good low load 1.200 33.2
efficiency is desired: The resistor divider generates a 1.400 27.4
small load on the output, which should be minimized to 1.600 23.7
optimize the quiescent current at low loads. 1.800 20.5
2.000 18.2
When using large FB resistors, a 10pF phase lead capaci- 2.200 16.2
tor should be connected from VOUT to FB.
Operating Frequency Selection and Trade-Offs
The fixed output versions of the LT8609A have the feedback
resistor network and phase lead capacitor integrated within Selection of the operating frequency is a trade-off
the part. The FB pin is replaced with a VOUT pin for these between efficiency, component size, and input voltage
regulators. The VOUT pin can be connected directly to the range. The advantage of high frequency operation is that
inductor and output capacitor. The LT8609A-3.3 regulates smaller inductor and capacitor values may be used. The
to 3.3V and has a total of 5.9M of internal feedback divider disadvantages are lower efficiency and a smaller input
resistance from the VOUT pin to ground. The LT8609A-5 voltage range.
regulates to 5V and has a total of 8.95M of internal feedback The highest switching frequency (fSW(MAX)) for a given
divider resistance from the VOUT pin to ground. application can be calculated as follows:
Setting the Switching Frequency VOUT + VSW(BOT)
fSW(MAX) =
The LT8609/LT8609A/LT8609B uses a constant frequency (
tON(MIN) VIN – VSW(TOP) + VSW(BOT) )
PWM architecture that can be programmed to switch from
200kHz to 2.2MHz by using a resistor tied from the RT pin where VIN is the typical input voltage, VOUT is the output
to ground. A table showing the necessary RT value for a voltage, VSW(TOP) and VSW(BOT) are the internal switch drops
desired switching frequency is in Table 1. When in spread (~0.4V, ~0.25V, respectively at max load) and tON(MIN) is
spectrum modulation mode, the frequency is modulated the minimum top switch on-time (see Typical Applications).
upwards of the frequency set by RT. This equation shows that slower switching frequency is
necessary to accommodate a high VIN/VOUT ratio.
For transient operation VIN may go as high as the Abs Max
rating regardless of the RT value, however the LT8609/

Rev. J

For more information www.analog.com 15

LT8609/LT8609A/LT8609B
APPLICATIONS INFORMATION
LT8609A/LT8609B will reduce switching frequency as nec- than the maximum expected output load of the applica-
essary to maintain control of inductor current to assure tion. In addition, the saturation current (typically labeled
safe operation. ISAT) rating of the inductor must be higher than the load
current plus 1/2 of in inductor ripple current:
The LT8609/LT8609A/LT8609B is capable of maximum
duty cycle approaching 100%, and the VIN to VOUT 1
IL(PEAK) =ILOAD(MAX) + ΔL
dropout is limited by the RDS(ON) of the top switch. In 2
this mode the LT8609/LT8609A /LT8609B skips switch
cycles, resulting in a lower switching frequency than pro- where ∆IL is the inductor ripple current as calculated sev-
grammed by RT. eral paragraphs below and ILOAD(MAX) is the maximum
output load for a given application.
For applications that cannot allow deviation from the pro-
grammed switching frequency at low VIN/VOUT ratios use As a quick example, an application requiring 1A output
the following formula to set switching frequency: should use an inductor with an RMS rating of greater
than 1A and an ISAT of greater than 1.3A. To keep the
VOUT + VSW(BOT) efficiency high, the series resistance (DCR) should be less
VIN(MIN) = – VSW(BOT) + VSW(TOP)
1– fSW • tOFF(MIN) than 0.04Ω, and the core material should be intended for
high frequency applications.
where VIN(MIN) is the minimum input voltage without
skipped cycles, VOUT is the output voltage, VSW(TOP) and The LT8609/LT8609A/LT8609B limits the peak switch current
VSW(BOT) are the internal switch drops (~0.4V, ~0.25V, in order to protect the switches and the system from overload
respectively at max load), fSW is the switching frequency faults. The top switch current limit (ILIM) is typically 4.75A at
(set by RT), and tOFF(MIN) is the minimum switch off- low duty cycles and decreases linearly to 4.0A at D = 0.8. The
time. Note that higher switching frequency will increase inductor value must then be sufficient to supply the desired
the minimum input voltage below which cycles will be maximum output current (IOUT(MAX)), which is a function of
dropped to achieve higher duty cycle. the switch current limit (ILIM) and the ripple current:
ΔIL
Inductor Selection and Maximum Output Current IOUT(MAX) =ILIM –
2
The LT8609/LT8609A/LT8609B is designed to minimize solu- The peak-to-peak ripple current in the inductor can be
tion size by allowing the inductor to be chosen based on the calculated as follows:
output load requirements of the application. During overload
or short circuit conditions the LT8609/LT8609A/LT8609B VOUT ⎛ V ⎞
safely tolerates operation with a saturated inductor through ΔIL = ⎜ 1– OUT ⎟
L • fSW ⎝ VIN(MAX) ⎠
the use of a high speed peak-current mode architecture.
A good first choice for the inductor value is: where fSW is the switching frequency of the LT8609/
LT8609A/LT8609B, and L is the value of the inductor.
VOUT + VSW(BOT) Therefore, the maximum output current that the LT8609/
L=
fSW LT8609A/LT8609B will deliver depends on minimum the
switch current limit, the inductor value, and the input
where fSW is the switching frequency in MHz, VOUT is
and output voltages. The inductor value may have to be
the output voltage, VSW(BOT) is the bottom switch drop
increased if the inductor ripple current does not allow
(~0.25V) and L is the inductor value in μH.
sufficient maximum output current (IOUT(MAX)) given the
To avoid overheating and poor efficiency, an inductor switching frequency, and maximum input voltage used in
must be chosen with an RMS current rating that is greater the desired application.

Rev. J

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 LT8609/LT8609A/LT8609B
APPLICATIONS INFORMATION
The optimum inductor for a given application may differ twice its nominal value, possibly exceeding the LT8609/
from the one indicated by this design guide. A larger value LT8609A/LT8609B’s voltage rating. This situation is easily
inductor provides a higher maximum load current and avoided (see Analog Devices Application Note 88).
reduces the output voltage ripple. For applications requir-
ing smaller load currents, the value of the inductor may Output Capacitor and Output Ripple
be lower and the LT8609/LT8609A/LT8609B may operate The output capacitor has two essential functions. Along
with higher ripple current. This allows use of a physically with the inductor, it filters the square wave generated by the
smaller inductor, or one with a lower DCR resulting in LT8609/LT8609A/LT8609B to produce the DC output. In this
higher efficiency. Be aware that low inductance may result role it determines the output ripple, thus low impedance at
in discontinuous mode operation, which further reduces the switching frequency is important. The second function is
maximum load current. to store energy in order to satisfy transient loads and stabi-
For more information about maximum output current and lize the LT8609/LT8609A/LT8609B’s control loop. Ceramic
discontinuous operation, see Application Note 44. capacitors have very low equivalent series resistance (ESR)
and provide the best ripple performance. A good starting
Finally, for duty cycles greater than 50% (VOUT/VIN > 0.5), value is:
a minimum inductance is required to avoid sub-harmonic
oscillation. See Application Note 19. 100
COUT =
VOUT • fSW
Input Capacitor
Bypass the input of the LT8609/LT8609A/LT8609B circuit where fSW is in MHz, and COUT is the recommended
with a ceramic capacitor of X7R or X5R type. Y5V types have output capacitance in μF. Use X5R or X7R types. This
poor performance over temperature and applied voltage, choice will provide low output ripple and good transient
and should not be used. A 4.7μF to 10μF ceramic capacitor response. Transient performance of adjustable output
is adequate to bypass the LT8609/LT8609A/LT8609B and parts can be improved with a higher value output capaci-
will easily handle the ripple current. Note that larger input tor and the addition of a feedforward capacitor placed
capacitance is required when a lower switching frequency between VOUT and FB. Increasing the output capacitance
is used. If the input power source has high impedance, or will also decrease the output voltage ripple. A lower value
there is significant inductance due to long wires or cables, of output capacitor can be used to save space and cost
additional bulk capacitance may be necessary. This can but transient performance will suffer and may cause loop
be provided with a low performance electrolytic capacitor. instability. See the Typical Applications in this data sheet
for suggested capacitor values.
Step-down regulators draw current from the input sup-
ply in pulses with very fast rise and fall times. The input When choosing a capacitor, special attention should be
capacitor is required to reduce the resulting voltage ripple given to the data sheet to calculate the effective capaci-
at the LT8609/LT8609A/LT8609B and to force this very tance under the relevant operating conditions of voltage
high frequency switching current into a tight local loop, bias and temperature. A physically larger capacitor or one
minimizing EMI. A 4.7μF capacitor is capable of this task, with a higher voltage rating may be required.
but only if it is placed close to the LT8609/LT8609A/
Ceramic Capacitors
LT8609B (see the PCB Layout section). A second precau-
tion regarding the ceramic input capacitor concerns the Ceramic capacitors are small, robust and have very
maximum input voltage rating of the LT8609/LT8609A/ low ESR. However, ceramic capacitors can cause prob-
LT8609B. A ceramic input capacitor combined with trace lems when used with the LT8609/LT8609A/LT8609B
or cable inductance forms a high quality (under damped) due to their piezoelectric nature. When in Burst Mode
tank circuit. If the LT8609/LT8609A/LT8609B circuit is operation, the LT8609/LT8609A/LT8609B’s switch-
plugged into a live supply, the input voltage can ring to ing frequency depends on the load current, and at very
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LT8609/LT8609A/LT8609B
APPLICATIONS INFORMATION
light loads the LT8609/LT8609A/LT8609B can excite where the LT8609/LT8609A/LT8609B will remain off until VIN
the ceramic capacitor at audio frequencies, generat- is above VIN(EN). Due to the comparator’s hysteresis, switch-
ing audible noise. Since the LT8609/LT8609A/LT8609B ing will not stop until the input falls slightly below VIN(EN).
operates at a lower current limit during Burst Mode When in Burst Mode operation for light-load currents,
operation, the noise is typically very quiet to a casual ear. the current through the VIN(EN) resistor network can eas-
If this is unacceptable, use a high performance tantalum ily be greater than the supply current consumed by the
or electrolytic capacitor at the output. LT8609/LT8609A/LT8609B. Therefore, the VIN(EN) resis-
A final precaution regarding ceramic capacitors concerns tors should be large to minimize their effect on efficiency
the maximum input voltage rating of the LT8609/LT8609A/ at low loads.
LT8609B. As previously mentioned, a ceramic input
capacitor combined with trace or cable inductance forms INTVCC Regulator
a high quality (under damped) tank circuit. If the LT8609/ An internal low dropout (LDO) regulator produces the
LT8609A/LT8609B circuit is plugged into a live supply, the 3.5V supply from VIN that powers the drivers and the
input voltage can ring to twice its nominal value, possibly internal bias circuitry. The INTVCC can supply enough
exceeding the LT8609/LT8609A/LT8609B’s rating. This current for the LT8609/LT8609A/LT8609B’s circuitry
situation is easily avoided (see Application Note 88). and must be bypassed to ground with a minimum of
1μF ceramic capacitor. Good bypassing is necessary to
Enable Pin supply the high transient currents required by the power
The LT8609/LT8609A/LT8609B is in shutdown when the MOSFET gate drivers. Applications with high input voltage
EN pin is low and active when the pin is high. The rising and high switching frequency will increase die tempera-
threshold of the EN comparator is 1.05V, with 50mV of ture because of the higher power dissipation across the
hysteresis. The EN pin can be tied to VIN if the shutdown LDO. Do not connect an external load to the INTVCC pin.
feature is not used, or tied to a logic level if shutdown
control is required. Output Voltage Tracking and Soft-Start
Adding a resistor divider from VIN to EN programs the The LT8609/LT8609A/LT8609B allows the user to
LT8609/LT8609A/LT8609B to regulate the output only program its output voltage ramp rate by means of
when VIN is above a desired voltage (see Block Diagram). the TR/SS pin. An internal 2μA pulls up the TR/SS
Typically, this threshold, VIN(EN), is used in situations pin to INTVCC. Putting an external capacitor on TR/
where the input supply is current limited, or has a rel- SS enables soft-starting the output to prevent cur-
atively high source resistance. A switching regulator rent surge on the input supply. During the soft-start
draws constant power from the source, so source cur- ramp the output voltage will proportionally track the
rent increases as source voltage drops. This looks like TR/SS pin voltage. For output tracking applications, TR/
a negative resistance load to the source and can cause SS can be externally driven by another voltage source.
the source to current limit or latch low under low source From 0V to 0.782V, the TR/SS voltage will override the
voltage conditions. The VIN(EN) threshold prevents the internal 0.782V reference input to the error amplifier, thus
regulator from operating at source voltages where the regulating the FB pin voltage to that of TR/SS pin. In the
problems might occur. This threshold can be adjusted by LT8609A-3.3 and LT8609A-5 fixed output voltage options
setting the values R3 and R4 such that they satisfy the the output voltage will track the TR/SS pin voltage based
following equation: on a factor set by the internal feedback resistor divider.
The 3.3V output options will track to a voltage 4.2 times
⎛ R3 ⎞ that of the TR/SS pin, while the 5V output options will
VIN(EN) = ⎜ +1⎟ •1V
⎝ R4 ⎠ track to a voltage 6.39 times that of the TR/SS pin. When

Rev. J

18 For more information www.analog.com

 LT8609/LT8609A/LT8609B
APPLICATIONS INFORMATION
TR/SS is above 0.782V, tracking is disabled and the feed- example, if the synchronization signal will be 500kHz and
back voltage will regulate to the internal reference voltage. higher, the RT should be selected for 500kHz. The slope
An active pull-down circuit is connected to the TR/SS pin compensation is set by the RT value, while the minimum
slope compensation required to avoid subharmonic oscil-
which will discharge the external soft-start capacitor in
lations is established by the inductor size, input voltage,
the case of fault conditions and restart the ramp when the
faults are cleared. Fault conditions that clear the soft-start and output voltage. Since the synchronization frequency
capacitor are the EN/UV pin transitioning low, VIN voltage will not change the slopes of the inductor current wave-
form, if the inductor is large enough to avoid subharmonic
falling too low, or thermal shutdown.
oscillations at the frequency set by RT, then the slope
Output Power Good compensation will be sufficient for all synchronization
frequencies.
When the LT8609/LT8609A/LT8609B’s adjustable out-
put voltage is within the ±8.5% window of the regulation For some applications, it is desirable for the LT8609/
point, which is a VFB voltage in the range of 0.716V to LT8609A to operate in pulse-skipping mode, which is the
0.849V (typical), the output voltage is considered good only mode available to the LT8609B. Pulse-skipping mode
and the open-drain PG pin goes high impedance and is offers two major differences from Burst Mode operation.
typically pulled high with an external resistor. Otherwise, First is the clock stays awake at all times and all switch-
the internal drain pull-down device will pull the PG pin ing cycles are aligned to the clock. Second is that full
low. To prevent glitching both the upper and lower thresh- switching frequency is reached at lower output load than
olds include 0.5% of hysteresis. The LT8609A-3.3 and in Burst Mode operation as shown in Figure 1b in an ear-
LT8609A-5 use a ±7.5% power good window around the lier section. These two differences come at the expense
regulation point, which for the 3.3V output version cor- of increased quiescent current. To enable pulse-skipping
responds to a 3.0525V to 3.5475V range (typical) and for mode the SYNC pin is floated.
the 5V output version corresponds to a 4.625V to 5.375V For some applications, reduced EMI operation may be
range (typical). desirable, which can be achieved through spread spec-
The PG pin is also actively pulled low during several fault trum modulation. This mode operates similar to pulse
conditions: EN/UV pin is below 1V, INTVCC has fallen too skipping mode operation, with the key difference that the
low, VIN is too low, or thermal shutdown. switching frequency is modulated up and down by a 3kHz
triangle wave. The modulation has the frequency set by RT
Synchronization as the low frequency, and modulates up to approximately
20% higher than the frequency set by RT. To enable spread
To select low ripple Burst Mode operation, tie the SYNC spectrum mode, tie SYNC to INTVCC or drive to a voltage
pin below 0.4V (this can be ground or a logic low out- between 3.2V and 5V.
put). To synchronize the LT8609/LT8609A oscillator to
an external frequency connect a square wave (with 20% The LT8609/LT8609A/LT8609B does not operate in forced
to 80% duty cycle) to the SYNC pin. The square wave continuous mode regardless of SYNC signal.
amplitude should have valleys that are below 0.9V and
peaks above 2.7V (up to 5V). Shorted and Reversed Input Protection
The LT8609/LT8609A will not enter Burst Mode opera- The LT8609/LT8609A/LT8609B will tolerate a shorted
tion at low output loads while synchronized to an exter- output. Several features are used for protection during
nal clock, but instead will pulse skip to maintain regu- output short-circuit and brownout conditions. The first
lation. The LT8609/LT8609A may be synchronized over is the switching frequency will be folded back while the
a 200kHz to 2.2MHz range. The RT resistor should be output is lower than the set point to maintain inductor cur-
chosen to set the LT8609/LT8609A switching frequency rent control. Second, the bottom switch current is moni-
equal to or below the lowest synchronization input. For tored such that if inductor current is beyond safe levels
Rev. J

For more information www.analog.com 19

LT8609/LT8609A/LT8609B
APPLICATIONS INFORMATION
switching of the top switch will be delayed until such time PCB Layout
as the inductor current falls to safe levels. This allows For proper operation and minimum EMI, care must be
for tailoring the LT8609/LT8609A/LT8609B to individual taken during printed circuit board layout. Figure 4 shows
applications and limiting thermal dissipation during short the recommended component placement with trace,
circuit conditions. ground plane and via locations. Note that large, switched
Frequency foldback behavior depends on the state of the currents flow in the LT8609/LT8609A/LT8609B’s VIN
SYNC pin: If the SYNC pin is low or high, or floated the pins, GND pins, and the input capacitor (CIN). The loop
switching frequency will slow while the output voltage is formed by the input capacitor should be as small as
lower than the programmed level. If the SYNC pin is con- possible by placing the capacitor adjacent to the VIN and
nected to a clock source, the LT8609/LT8609A/LT8609B GND pins. When using a physically large input capacitor
will stay at the programmed frequency without foldback the resulting loop may become too large in which case
and only slow switching if the inductor current exceeds using a small case/value capacitor placed close to the
safe levels. VIN and GND pins plus a larger capacitor further away
is preferred. These components, along with the induc-
There is another situation to consider in systems where
tor and output capacitor, should be placed on the same
the output will be held high when the input to the LT8609/
side of the circuit board, and their connections should
LT8609A/LT8609B is absent. This may occur in battery
be made on that layer. Place a local, unbroken ground
charging applications or in battery backup systems where
plane under the application circuit on the layer closest
a battery or some other supply is diode ORed with the
to the surface layer. The SW and BOOST nodes should
LT8609/LT8609A/LT8609B’s output. If the VIN pin is
be as small as possible. Finally, keep the FB and RT
allowed to float and the EN pin is held high (either by a
nodes small so that the ground traces will shield them
logic signal or because it is tied to VIN), then the LT8609/
from the SW and BOOST nodes. The exposed pad on the
LT8609A/LT8609B’s internal circuitry will pull its quies-
bottom of the package must be soldered to ground so
cent current through its SW pin. This is acceptable if the
that the pad is connected to ground electrically and also
system can tolerate several μA in this state. If the EN pin
acts as a heat sink thermally. To keep thermal resistance
is grounded the SW pin current will drop to near 0.7µA.
low, extend the ground plane as much as possible, and
However, if the VIN pin is grounded while the output is
add thermal vias under and near the LT8609/LT8609A/
held high, regardless of EN, parasitic body diodes inside
LT8609B to additional ground planes within the circuit
the LT8609/LT8609A/LT8609B can pull current from the
board and on the bottom side.
output through the SW pin and the VIN pin. Figure 3 shows
a connection of the VIN and EN/UV pins that will allow the Thermal Considerations and Peak Current Output
LT8609/LT8609A/LT8609B to run only when the input
voltage is present and that protects against a shorted or For higher ambient temperatures, care should be taken
reversed input. in the layout of the PCB to ensure good heat sinking of
the LT8609/LT8609A/LT8609B. The exposed pad on the
D1
bottom of the package must be soldered to a ground
VIN VIN
LT8609
plane. This ground should be tied to large copper layers
EN/UV
below with thermal vias; these layers will spread heat
GND dissipated by the LT8609/LT8609A/LT8609B. Placing
8609 F03
additional vias can reduce thermal resistance further. The
maximum load current should be derated as the ambient
Figure 3. Reverse VIN Protection temperature approaches the maximum junction rating.

Rev. J

20 For more information www.analog.com

 LT8609/LT8609A/LT8609B
APPLICATIONS INFORMATION

GROUND PLANE ON LAYER 2

COUT

CBST CIN
1
CVCC
CIN(OPT)

RT
RPG R4
R3

R1

CFF R2 CSS

GND VIA VIN VIA VOUT VIA EN/UV VIA OTHER SIGNAL VIA 8609 F04

Figure 4. PCB Layout

Power dissipation within the LT8609/LT8609A/LT8609B switching frequency. If the case temperature is too high
can be estimated by calculating the total power loss from for a given application, then either VIN, switching fre-
an efficiency measurement and subtracting the induc- quency or load current can be decreased to reduce the
tor loss. The die temperature is calculated by multiplying temperature to an acceptable level. Figure 5 shows how
the LT8609/LT8609A/LT8609B power dissipation by the case temperature rise can be managed by reducing VIN.
thermal resistance from junction to ambient. The LT8609/ Figure  6 shows an example of how case temperature
LT8609A/LT8609B will stop switching and indicate a fault
rise changes with the duty cycle of a 10Hz pulsed 3A
condition if safe junction temperature is exceeded.
load. Junction temperature will be higher than case
Temperature rise of the LT8609/LT8609A/LT8609B is temperature.
worst when operating at high load, high VIN, and high

Rev. J

For more information www.analog.com 21

LT8609/LT8609A/LT8609B
APPLICATIONS INFORMATION
60 60
VIN=12V VIN=12V
VIN=24V VIN=24V
50 STANDBY LOAD = 50mA 50 STANDBY LOAD = 50mA
CASE TEMPERATURE RISE (°C)

CASE TEMPERATURE RISE (°C)

PULSED LOAD = 3A PULSED LOAD = 3A
VOUT = 5V VOUT = 5V
40 f = 2MHz 40 f = 2MHz
SW SW

30 30

20 20

10 10

0 0
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
DUTY CYCLE (%) DUTY CYCLE (%)
8609 F06 8609 F06

Figure 5. Case Temperature Rise vs Load Current Figure 6. Case Temperature Rise vs 3A Pulsed Load

TYPICAL APPLICATIONS
3.3V Step-Down
VIN C1
4.3V VIN 0.1µF
TO 42V C2 L1
EN/UV BST
4.7µF 2.2µH VOUT
SYNC SW 3.3V
R4 3A
LT8609A 100k
POWER
INTVCC PG
C3 C5 GOOD
1µF 10pF
TR/SS
C6
10nF
RT FB R2
R1 GND R3 C4
1M
18.2k 309k 22µF
1206
fSW = 2MHz L1 = COILCRAFT XFL4020-222ME 8609 TA02

5V Step-Down
VIN C1
6V VIN 0.1µF
TO 42V C2 L1
EN/UV BST
4.7µF 2.2µH VOUT
SYNC SW 5V
R4 3A
LT8609A 100k
POWER
INTVCC PG
C3 C5 GOOD
1µF 10pF
TR/SS
C6
10nF
RT FB R2
R1 GND R3 C4
1M
18.2k 187k 22µF
1206
fSW = 2MHz L1 = COILCRAFT XFL4020-222ME 8609 TA03

Rev. J

22 For more information www.analog.com

 LT8609/LT8609A/LT8609B
TYPICAL APPLICATIONS
12V Step-Down
VIN C1
13V VIN 0.1µF
TO 42V C2 L1
EN/UV BST
4.7µF 10µH VOUT
SYNC SW 12V
R4 3A
LT8609 100k
POWER
INTVCC PG
C3 C5 GOOD
1µF 10pF
TR/SS
C6
10nF
RT FB R2
R1 GND R3 C4
1M
40.2k 69.8k 22µF
1210
FSW = 1MHz L1 = COILCRAFT XAL4040-103ME 8609 TA04

1.8V 2MHz Step-Down Converter

VIN C1
2.8V VIN 0.1µF
TO 20V C2 L1
EN/UV BST
(42V TRANSIENT) 4.7µF 2.2µH VOUT
SW 1.8V
R4 3A
SYNC LT8609 100k
POWER
INTVCC PG
C3 C5 GOOD
1µF 10pF
TR/SS
PSKIP C6
M1 10nF
NFET RT FB R2
R1 GND R3 C4
1M
18.2k 768k 47µF
1210
fSW = 2MHz L1 = COILCRAFT XFL4020-222ME 8609 TA05

3.3V 2MHz Step-Down Converter

VIN C1
4.3V VIN 0.1µF
TO 42V C2 L1
EN/UV BST
4.7µF 2.2µH VOUT
LT8609A-3.3 SW 3.3V
R4 3A
SYNC
100k
POWER
INTVCC PG
C3 GOOD
1µF
TR/SS
C6
10nF
RT VOUT
GND C4
R1
47µF
18.2k
1206
fSW = 2MHz L1 = COILCRAFT XFL4020-222ME 8609 TA08

Rev. J

For more information www.analog.com 23

LT8609/LT8609A/LT8609B
TYPICAL APPLICATIONS
5V 2MHz Step-Down Converter

VIN C1
6V VIN 0.1µF
TO 42V C2 L1
EN/UV BST
4.7µF 2.2µH VOUT
LT8609A-5 SW 5V
R4 3A
SYNC
100k
POWER
INTVCC PG
C3 GOOD
1µF
TR/SS
C6
10nF
RT VOUT
GND C4
R1
47µF
18.2k
1206
fSW = 2MHz L1 = COILCRAFT XFL4020-222ME 8609 TA09

Ultralow EMI 5V 2A Step-Down Converter

C9
FB1 L3 33μF
BEAD 4.7µH
VIN
VIN BST
6V TO 40V C1 L1
C8 C7 EN/UV 0.1µF 8.2µH VOUT
C2
4.7µF 4.7µF SYNC SW 3.3V
4.7µF
R4 3A
LT8609A 100K
PG POWER GOOD
INTVCC C5
10pF
TR/SS

C3 C6 RT FB
1µF 10nF R1 R2 C4
GND R3 1M 47µF
110k 301k 1210

fSW = 400kHz L1 = COILCRAFT XAL4040-822 8609 TA06

FB1 = TDK MPZ2012S221AT000

C9 = OS-CON 63SXV33M

Rev. J

24 For more information www.analog.com

 LT8609/LT8609A/LT8609B
PACKAGE DESCRIPTION
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I)

BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88
1.88 ±0.102
(.074 ±.004) 0.889 ±0.127 1 (.074) 0.29
(.035 ±.005) 1.68 REF
(.066)

5.10 0.05 REF

(.201) 1.68 ±0.102 3.20 – 3.45
(.066 ±.004) DETAIL “B”
MIN (.126 – .136)
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
10
NO MEASUREMENT PURPOSE
0.50
0.305 ± 0.038 (.0197) 3.00 ±0.102
(.0120 ±.0015) BSC (.118 ±.004) 0.497 ±0.076
TYP (NOTE 3) (.0196 ±.003)
RECOMMENDED SOLDER PAD LAYOUT 10 9 8 7 6
REF

4.90 ±0.152 3.00 ±0.102

(.193 ±.006) (.118 ±.004)
(NOTE 4)
DETAIL “A”
0.254
(.010)
0° – 6° TYP
GAUGE PLANE 1 2 3 4 5

0.53 ±0.152 1.10 0.86

(.021 ±.006) (.043) (.034)
MAX REF
DETAIL “A”
0.18
(.007)
SEATING
PLANE 0.17 – 0.27 0.1016 ±0.0508
(.007 – .011) (.004 ±.002)
0.50
TYP MSOP (MSE) 0213 REV I
NOTE: (.0197)
1. DIMENSIONS IN MILLIMETER/(INCH) BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.

Rev. J

For more information www.analog.com 25

LT8609/LT8609A/LT8609B
PACKAGE DESCRIPTION
MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev F)

BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ±0.102 2.845 ±0.102
(.112 ±.004) 0.889 ±0.127 (.112 ±.004)
(.035 ±.005)
1 8 0.35
REF

5.10 1.651 ±0.102

1.651 ±0.102 3.20 – 3.45
(.201) 0.12 REF
(.065 ±.004) (.126 – .136) (.065 ±.004)
MIN
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
16 9 FOR REFERENCE ONLY
0.305 ±0.038 0.50 NO MEASUREMENT PURPOSE
(.0120 ±.0015) (.0197) 4.039 ±0.102
TYP BSC (.159 ±.004)
(NOTE 3) 0.280 ±0.076
RECOMMENDED SOLDER PAD LAYOUT
16151413121110 9 (.011 ±.003)
REF
DETAIL “A”
0.254
(.010) 3.00 ±0.102
0° – 6° TYP 4.90 ±0.152
(.118 ±.004)
(.193 ±.006)
GAUGE PLANE (NOTE 4)

0.53 ±0.152
(.021 ±.006)
1234567 8
DETAIL “A” 1.10 0.86
0.18 (.043) (.034)
(.007) MAX REF

SEATING
PLANE 0.17 – 0.27 0.1016 ±0.0508
(.007 – .011) (.004 ±.002)
TYP 0.50
NOTE: (.0197)
MSOP (MSE16) 0213 REV F

1. DIMENSIONS IN MILLIMETER/(INCH) BSC

2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.

Rev. J

26 For more information www.analog.com

 LT8609/LT8609A/LT8609B
PACKAGE DESCRIPTION
DDM Package
10-Lead Plastic Side Wettable DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1647 Rev Ø)

R = 0.125 0.40 ±0.10

TYP
6 10

3.00 ±0.10 1.65 ±0.10

(4 SIDES) (2 SIDES) PIN 1 NOTCH
PIN 1 R = 0.20 OR
TOP MARK 0.35 × 45°
(SEE NOTE 5) CHAMFER
(DDM) DFN REV Ø 0518

5 1
0.200 REF 0.75 ±0.05 0.25 ±0.05
0.50 BSC
DETAIL A
2.40 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD

DETAIL A
NOTE:
1. DRAWING NOT TO SCALE TERMINAL LENGTH
2. ALL DIMENSIONS ARE IN MILLIMETERS 0.40 ± 0.10
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
0.203 REF
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 0.10 REF TERMINAL THICKNESS
4. EXPOSED PAD SHALL BE SOLDER PLATED 0.05 REF
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE PLATED AREA

0.70 ±0.05

3.55 ±0.05 1.65 ±0.05

2.15 ±0.05 (2 SIDES)

PACKAGE
OUTLINE

0.25 ±0.05
0.50
BSC
2.40 ±0.05
(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

Rev. J

For more information www.analog.com 27

LT8609/LT8609A/LT8609B
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 01/16 Added the LT8609A Version to Header All
Added the LT8609A Version to Description 1
Clarified Description 1
Clarified Electrical Specifications 3
Clarified Load Regulation, Line Regulation, No-Load Supply Current vs Temperature, Minimum On-Time vs 5, 6, 7, 8
Temperature Graphs, Frequency Foldback and Soft-Start vs Temperature Graphs
Clarified Block Diagram with Optional Input Resistors 10
Replaced Figure 1 with Table 1 in text 12
Clarified CIN Capacitor in Text and PCB Layout 18
Clarified Typical Application 24
B 06/16 Clarified Switch Drop vs Switch Current Graph axis units 6
Clarified Switching Waveforms conditions 8
C 10/16 Added LT8609B Option All
Added LT8609B Option to Absolute Maximum Ratings, Added LT8609B Package Drawing and Ordering Information 2
Clarified Electrical Parameters and Notes for LT8609B Option 3
Clarified Top FET Current Limit vs Temperature Graph 6
Clarified Pin Functions to Include LT8609B 10
Clarified Operation Section to Include LT8609B 12
Clarified Applications Information Section to Include LT8609B 13 – 20
Clarified Graphs in Figure 5 and 6 20
Clarified Typical Applications Schematics 21, 22, 23, 24
D 01/17 Clarified Graphs 6, 7, 20
Clarified Schematics 23, 26
E 06/17 Add H-grade to the A version 2, 4
Modified application circuits 21, 22, 23
F 11/17 Clarified Oscillator Frequency RT Conditions 3
Clarified Minimum Off Time 3
Clarified Efficiency Graph 5
Clarified Frequency Foldback Graph 8
Clarified Block Diagram 11
Clarified Maximum Duty Cycle 14
Clarified Figure 4 19
G 01/18 Added MSOP-16E Package option 1, 2, 24
Clarified the Pin Functions 10

Rev. J

28 For more information www.analog.com

 LT8609/LT8609A/LT8609B
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
H 02/19 Changed 2A/3A to 3A. 1
Replaced all graphs with IOUT to 3A. 1, 5, 6, 7, 8
Added LT8609AJMSE16 and LT8609AJMSE options. 2
Eliminated “The internal circuitry…” paragraph. 15
Clarified Figure 4 PCB Layout. 19
Clarified Figure 5. 20
Eliminated “The LT8609/LT8609A/LT8609B’s…” paragraph. 20
Updated Typical Applications. 21, 22
I 01/20 Added DFN version parts and J Grades. 1, 2, 3
Clarified parametric table. 4, 5
Added fixed output graphs. 6, 7 ,8
Clarified Pin Functions. 11
Clarified Block Diagram. 12
Clarified Operation to include fixed output options. 13
Added text for fixed output options. 15
Added text in Output Capacitor and Output Ripple for fixed output options. 17
Added text in Output Voltage Tracking section for fixed output options. 18
Added text in Output Power Good section for fixed output options. 19
Clarified Typical Applications. 22-25
J 08/21 Clarified Output Reference Voltage for LT8609A-3.3 and Line Regulations under Electrical Characteristics table. 4

Rev. J

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For moreby
is granted information www.analog.com
implication or otherwise under any patent or patent rights of Analog Devices. 29
LT8609/LT8609A/LT8609B
TYPICAL APPLICATION
Tracking 3.3V and 1.8V 2MHz Converters
VIN C1
4.3V VIN 0.1µF
TO 20V C2 L1 VOUT
EN/UV BST
(42V TRANSIENT) 4.7µF 2.2µH 3.3V, 3A
SW
R4
SYNC LT8609 100k
POWER
INTVCC PG
C3 C5 GOOD
1µF 10pF
TR/SS
C6
10nF
RT FB R2
R1 GND R3 C4
1M
18.2k 309k 47µF
1210
fSW = 2MHz

C7
VIN 0.1µF
C8 L2
EN/UV BST
4.7µF 2.2µH VOUT
SW 1.8V
R9 3A
10k SYNC R8
LT8609 100k
INTVCC POWER
PG
C11 GOOD
10pF
TR/SS
C12
1µF
R10 RT FB R6
31.6k R5 GND R7 C10
1M
18.2k 768k 47µF
1210
fSW = 2MHz 8609 TA07

RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LT8610A/ 42V, 3.5A, 96% Efficiency, 2.2MHz Synchronous MicroPower Step-Down VIN = 3.4V to 42V, VOUT(MIN) = 0.97V, IQ = 2.5µA, ISD < 1µA,
LT8610AB DC/DC Converter with IQ = 2.5µA MSOP-16E Package
LT8610AC 42V, 3.5A, 96% Efficiency, 2.2MHz Synchronous MicroPower Step-Down VIN = 3V to 42V, VOUT(MIN) = 0.8V, IQ = 2.5µA, ISD < 1µA,
DC/DC Converter with IQ = 2.5µA MSOP-16E Package
LT8610 42V, 2.5A, 96% Efficiency, 2.2MHz Synchronous MicroPower Step-Down VIN = 3.4V to 42V, VOUT(MIN) = 0.97V, IQ = 2.5µA, ISD < 1µA,
DC/DC Converter with IQ = 2.5µA MSOP-16E Package
LT8611 42V, 2.5A, 96% Efficiency, 2.2MHz Synchronous MicroPower Step-Down VIN = 3.4V to 42V, VOUT(MIN) = 0.97V, IQ = 2.5µA, ISD < 1µA,
DC/DC Converter with IQ = 2.5µA and Input/Output Current Limit/Monitor 3mm × 5mm QFN-24 Package
LT8616 42V, Dual 2.5A + 1.5A, 95% Efficiency, 2.2MHz Synchronous VIN = 3.4V to 42V, VOUT(MIN) = 0.8V, IQ = 5µA, ISD < 1µA,
MicroPower Step-Down DC/DC Converter with IQ = 5µA TSSOP-28E, 3mm × 6mm QFN-28 Packages
LT8620 65V, 2.5A, 96% Efficiency, 2.2MHz Synchronous MicroPower Step-Down VIN = 3.4V to 65V, VOUT(MIN) = 0.97V, IQ = 2.5µA, ISD < 1µA,
DC/DC Converter with IQ = 2.5µA MSOP-16E, 3mm × 5mm QFN-24 Packages
LT8614 42V, 4A, 96% Efficiency, 2.2MHz Synchronous MicroPower Step-Down VIN = 3.4V to 42V, VOUT(MIN) = 0.97V, IQ = 2.5µA, ISD < 1µA,
DC/DC Converter with IQ = 2.5µA 3mm × 4mm QFN-18 Package
LT8612 42V, 6A, 96% Efficiency, 2.2MHz Synchronous MicroPower Step-Down VIN = 3.4V to 42V, VOUT(MIN) = 0.97V, IQ = 3.0µA, ISD < 1µA,
DC/DC Converter with IQ = 2.5µA 3mm × 6mm QFN-28 Package
LT8640 42V, 5A/7A Peak, 96% Efficiency, 3MHz Synchronous MicroPower Step- VIN = 3.4V to 42V, VOUT(MIN) = 0.97V, IQ = 2.5µA, ISD < 1µA,
Down DC/DC Converter with IQ = 2.5µA 3mm × 4mm QFN-18 Package
LT8602 42V, Quad Output (2.5A+1.5A+1.5A+1.5A) 95% Efficiency, 2.2MHz VIN = 3V to 42V, VOUT(MIN)= 0.8V, IQ = 25µA, ISD < 1µA,
Synchronous MicroPower Step-Down DC/DC Converter with IQ = 25µA 6mm × 6mm QFN-40 Package
Rev. J

30
08/21
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