Datasheet
Datasheet
OUTLINE
The R1172x Series are CMOS-based positive voltage regulator ICs. The R1172x Series have features of super
low dropout, 1A output current capability. Even the output voltage is set at 1.5V, on resistance of internal FET is
typically 0.32Ω. Therefore, applications that require a large current at small dropout are suitable for the R1172x
series. Low input voltage is acceptable and low output voltage can be set. The minimum input voltage is 1.4V,
and the lowest set output voltage is 0.8V. Each of these ICs consists of a voltage reference unit, an error
amplifier, resistor net for setting output voltage, a current limit circuit at over-current, a chip enable circuit, a
thermal-shutdown circuit, and so on. A stand-by mode with ultra low consumption current can be realized with
the chip enable pin. The output voltage of R1172 is fixed in the IC.
Since the packages for these ICs are SOT-23-5, SOT-89-5, HSON-6, and HSOP-6J with high power
dissipation, high density mounting of the ICs on boards is possible.
FEATURES
• Output Current ............................................................ 1A
• Supply Current ............................................................. Typ. 60µA
• Standby Current .......................................................... Typ. 0.1µA
• Input Voltage Range ................................................... 1.4V to 6.0V
• Output Voltage.............................................................. Stepwise setting with a step of 0.1V in the range of
0.8V to 5.0V (Exceptions: HSOP-6J = 0.8V to 3.5V)
• Dropout Voltage............................................................ Typ. 0.32V (VOUT=1.5V, IOUT=1A)
Typ. 0.18V (VOUT=2.8V, IOUT=1A)
• Ripple Rejection ........................................................... Typ. 70dB (VOUT=2.8V)
• Output Voltage Accuracy.............................................. ±2.0%
• Temperature-Drift Coefficient of Output Voltage .......... Typ. ±100ppm/°C
• Line Regulation ............................................................ Typ. 0.05%/V
• Load Regulation ......................................................... Typ. 15mV at IOUT=300mA, Typ. 50mV at IOUT=1A
• Packages .................................................................... SOT-23-5, SOT-89-5, HSON-6, HSOP-6J
• Built-in Inrush current limit circuit ............................... Typ. 500 mA
• Built-in Fold-Back Protection Circuit ........................... Typ. 250mA (Current at short mode)
• Built-in Thermal Shutdown Circuit .............................. Thermal Shutdown Temperature ; Typ. 150°C
Released Temperature ; Typ. 120°C
• Built-in Auto Discharge Function ................................ D version
• Output capacitors ....................................................... CIN=COUT=Tantalum 4.7µF (VOUT < 1.0V)
CIN=COUT=Ceramic 4.7µF (VOUT > = 1.0V)
APPLICATIONS
• Local Power source for Notebook PC.
• Local Power source for portable communication equipments, cameras, and VCRs.
• Local Power source for home appliances.
1
R1172x
BLOCK DIAGRAMS
R1172xxx1A
VDD VOUT
Vref
Current Limit
Thermal Shutdown
CE GND
R1172xxx1B R1172xxx1D
Vref Vref
SELECTION GUIDE
The output voltage, auto discharge function*, and the package type for the ICs can be selected at the user’s
request. The selection can be made with designating the part number as shown below;
Code Contents
Designation of Package Type;
a
N: SOT-23-5, H: SOT-89-5, D: HSON-6, S: HSOP-6J
Setting Output Voltage (VOUT);
Stepwise setting with a step of 0.1V in the range of 0.8V to 5.0V (HSOP-6J : 0.8V to 3.5V)
b
is possible.
Exceptions; 1.85V output: R1172x181x5-xx-x, 2.85V output: R1172x281x5-xx-x
Designation of option;
A: active low, without auto discharge function*
c
B: active high, without auto discharge function*
D: active high, with auto discharge function*
Designation of Taping Type;
d
T1 (SOT-89-5), TR (SOT-23-5, HSON-6), E2 (HSOP-6J) Refer to Taping Specifications.
2
R1172x
PIN CONFIGURATIONS
SOT-23-5 SOT-89-5
5 4 5 4
(mark side)
1 2 3
1 2 3
HSON-6 HSOP-6J
Top View Bottom View 6 5 4
6 5 4 4 5 6
∗
∗ ∗
1 2 3 3 2 1 1 2 3
PIN DESCRIPTIONS
• SOT-23-5 • SOT-89-5
Pin No. Symbol Description Pin No. Symbol Description
1 VOUT Voltage Regulator Output Pin 1 CE or CE Chip Enable Pin
2 GND Ground Pin 2 GND Ground Pin
3 VDD Input Pin 3 NC No Connection
4 NC No Connection 4 VDD Input Pin
5 CE or CE Chip Enable Pin 5 VOUT Voltage Regulator Output Pin
• HSON-6*1 • HSOP-6J
Pin No. Symbol Description Pin No. Symbol Description
1 VOUT*2 Voltage Regulator Output Pin 1 VOUT Voltage Regulator Output Pin
2
2 VOUT* Voltage Regulator Output Pin 2 GND Ground Pin
3 CE or CE Chip Enable Pin 3 CE or CE Chip Enable Pin
4 GND Ground Pin 4 NC No Connection
5 VDD Input Pin 5 GND Ground Pin
6 VDD Input Pin 6 VDD Input Pin
*1) Tab in the parts have GND level. (They are connected to the reverse side of this IC.)
Do not connect to other wires or land patterns.
*2) Connect Pin1 and Pin2 as short as possible.
3
R1172x
4
R1172x
ELECTRICAL CHARACTERISTICS
• R1172xxx1A Topt=25°C
5
R1172x
• R1172xxx1B/D Topt=25°C
6
R1172x
7
R1172x
R1172x
C1 C2
Series
CE GND
TECHNICAL NOTES
When using these ICs, consider the following points:
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, use a capacitor C2 with good frequency characteristics and ESR (Equivalent Series Resistance).
The recommendation value is as follows.
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor C1 with a capacitance value as much as 4.7µF or more between VDD and GND pin, and as
close as possible to the pins.
Set external components, especially the output capacitor C2, as close as possible to the ICs, and make wiring
as short as possible.
8
R1172x
TYPICAL CHARACTERISTICS
1) Output Voltage vs. Output Current (Topt=25°C)
R1172x081x R1172x151x
0.9 1.6
0.8 1.4
Output Voltage VOUT(V)
R1172x301x R1172x401x
3.2 4.5
2.8 4.0
Output Voltage VOUT(V)
2.4 3.5
2.0 3.0
2.5
1.6
2.0
1.2 VDD=3.3V VDD=4.3V
VDD=4.0V 1.5
0.8 VDD=5.0V
VDD=5.0V 1.0 VDD=6.0V
0.4 0.5
0.0 0.0
0 500 1000 1500 2000 0 500 1000 1500 2000
Output Current IOUT(mA) Output Current IOUT(mA)
R1172x501x
6.0
Output Voltage VOUT(V)
5.0
4.0
3.0
VDD=5.3V
2.0 VDD=6.0V
1.0
0.0
0 500 1000 1500 2000
Output Current IOUT(mA)
9
R1172x
R1172x301x R1172x401x
3.2 4.5
2.8 4.0
Output Voltage VOUT(V)
2.4 3.5
3.0
2.0
2.5
1.6
2.0
1.2 IOUT=1mA IOUT=1mA
IOUT=50mA 1.5 IOUT=50mA
0.8 1.0
IOUT=99mA IOUT=99mA
0.4 IOUT=300mA 0.5 IOUT=300mA
0.0 0.0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
Input Voltage VIN(V) Input Voltage VIN(V)
R1172x501x
5.5
5.0
Output Voltage VOUT(V)
4.5
4.0
3.5
3.0
2.5
2.0 IOUT=1mA
1.5 IOUT=50mA
1.0 IOUT=99mA
IOUT=300mA
0.5
0.0
0 1 2 3 4 5 6
Input Voltage VIN(V)
10
R1172x
60 60
Supply Current ISS(µA)
40 40
30 30
20 20
10 10
0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
Input Voltage VIN(V) Input Voltage VIN(V)
R1172x301x R1172x401x
70 70
60 60
Supply Current ISS(µA)
50 50
40 40
30 30
20 20
10 10
0 0
0 1 2 3 4 5 6 0 1 2 3 4 5 6
Input Voltage VIN(V) Input Voltage VIN(V)
R1172x501x
70
60
Supply Current ISS(µA)
50
40
30
20
10
0
0 1 2 3 4 5 6
Input Voltage VIN(V)
11
R1172x
0.82 1.52
Output Voltage VOUT(V)
0.80 1.50
0.79 1.49
0.78 1.48
0.77 1.47
0.76 1.46
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Temperature Topt(°C) Temperature Topt(°C)
R1172x301x R1172x501x
VIN=4.0V VIN=6.0V
3.06 5.02
3.04 5.00
Output Voltage VOUT(V)
3.02 4.98
3.00 4.96
2.98 4.94
2.96 4.92
2.94 4.90
2.92 4.88
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Temperature Topt(°C) Temperature Topt(°C)
60 60
50 50
40 40
30 30
20 20
10 10
0 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Temperature Topt(°C) Temperature Topt(°C)
12
R1172x
R1172x301x R1172x501x
VIN=4.0V VIN=6.0V
80 80
70 70
Supply Current ISS(µA)
600
500
500
400
400
300
300 85°C 85°C
25°C 200 25°C
200
-40°C -40°C
100 100
0 0
0 200 400 600 800 1000 0 200 400 600 800 1000
Output Current IOUT(mA) Output Current IOUT(mA)
R1172x101x R1172x151x
600 400
Dropout Voltage VDIF(mV)
350
Dropout Voltage VDIF(mV)
500
300
400
250
300 200
85°C 150
200
25°C 85°C
-40°C 100 25°C
100
50 -40°C
0 0
0 200 400 600 800 1000 0 200 400 600 800 1000
Output Current IOUT(mA) Output Current IOUT(mA)
13
R1172x
R1172x301x R1172x501x
250 200
180
200 160
140
150 120
100
100 80
85°C 60
25°C 85°C
50 40
-40°C 25°C
20 -40°C
0 0
0 200 400 600 800 1000 0 200 400 600 800 1000
Output Current IOUT(mA) Output Current IOUT(mA)
7) Dropout Voltage vs. Set Output Voltage 8) 0.8V Output type, Operating Input Voltage Range
R1172xxx1x R1172x081x
800 1.8
700 100mA
Dropout Voltage VDIF(mV)
600 400mA
600mA
500 800mA 1.4
1000mA
400
300 1.2
200
1.0
100
0 0.8
0 1 2 3 4 5 0 200 400 600 800 1000
Set Output Voltage VREG(V) Output Current IOUT(mA)
70 70
60 60
50 50
40 40
200Hz 30 200Hz
30
1kHz 1kHz
20 10kHz 20 10kHz
1000kHz 1000kHz
10 10
0 0
3.0 3.1 3.2 3.3 3.4 3.5 3.0 3.1 3.2 3.3 3.4 3.5
Input Voltage VIN(V) Input Voltage VIN(V)
14
R1172x
R1172x301x R1172x301x
VIN=4.0VDC+0.2Vp-p,IOUT=10mA VIN=4.0VDC+0.5Vp-p,IOUT=10mA
90 90
80 80
Ripple Rejection RR(dB)
R1172x301x R1172x301x
VIN=4.0VDC+0.2Vp-p,IOUT=100mA VIN=4.0VDC+0.5Vp-p,IOUT=100mA
90 90
80 80 200Hz
Ripple Rejection RR(dB)
1kHz
70 70 10kHz
60 60 1000kHz
50 50
40 40
30 200Hz 30
1kHz
20 10kHz 20
1000kHz
10 10
0 0
3.0 3.1 3.2 3.3 3.4 3.5 3.0 3.1 3.2 3.3 3.4 3.5
Input Voltage VIN(V) Input Voltage VIN(V)
60 70
60
50
50
40
40
30
30
20 IOUT=1mA 20 IOUT=1mA
IOUT=30mA IOUT=30mA
10 IOUT=100mA 10 IOUT=100mA
0 0
0.1 1 10 100 0.1 1 10 100
Frequency f(kHz) Frequency f(kHz)
15
R1172x
R1172x301x R1172x401x
VIN=4.0VDC+0.5Vp-p, VIN=5.0VDC+0.5Vp-p,
COUT=Ceramic 0.47µF COUT=Ceramic 0.47µF
90 90
80 80
Ripple Rejection RR(dB)
R1172x451x R1172x501x
VIN=5.5VDC+0.5Vp-p, VIN=6.0VDC+0.5Vp-p,
COUT=Ceramic 0.47µF COUT=Ceramic 0.47µF
80 80
70 70
Ripple Rejection RR(dB)
60 60
50 50
40 40
30 30
20 IOUT=1mA 20 IOUT=1mA
IOUT=30mA IOUT=30mA
10 IOUT=100mA 10 IOUT=100mA
0 0
0.1 1 10 100 0.1 1 10 100
Frequency f(kHz) Frequency f(kHz)
0.84 1 1.04 1
0.82 0 1.02 0
Output Voltage
0.80 1.00
16
R1172x
R1172x301x R1172x501x
COUT=Ceramic 4.7µF COUT=Ceramic 4.7µF
3.15 6 5.15 7
3.12 5 5.12 6
Output Voltage VOUT(V)
3.06 3 5.06 4
3.03 2 5.03 3
3.00 1 5.00 2
0.86 0 0.88 0
0.80 0.84
Output Voltage
0.74 Output Voltage 0.80
0.68 0.76
0 10 20 30 40 50 60 70 80 90 100 0 2 4 6 8 10 12 14 16 18 20
Time t(µs) Time t(µs)
R1172x081x R1172x081x
VIN=1.8V,CIN=Tantalum 4.7µF,
VIN=1.8V,CIN=COUT= Tantalum 4.7µF COUT=Tantalum 10µF
1.00 40 1.00 40
Output Current IOUT(mA)
Output Current IOUT(mA)
0.96 20 0.96 20
Output Current Output Current
0.92 0 0.92 0
0.88 0.88
0.84 0.84
0.80 0.80
Output Voltage Output Voltage
0.76 0.76
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
Time t(µs) Time t(µs)
17
R1172x
R1172x101x R1172x101x
VIN=2.0V,CIN=Ceramic 4.7µF,
VIN=2.0V,CIN=COUT= Ceramic 4.7µF COUT=Ceramic 10µF
1.4 600 1.4 600
1.1 0 1.1 0
1.0 1.0
0.8 0.8
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
Time t(µs) Time t(µs)
R1172x101x R1172x101x
VIN=2.0V,CIN=Ceramic 4.7µF,
VIN=2.0V,CIN=COUT= Ceramic 4.7µF COUT=Ceramic 10µF
1.20 150 1.20 150
1.08 0 1.08 0
0.96 0.96
0 4 8 12 16 20 24 28 32 36 40 0 2 4 6 8 10 12 14 16 18 20
Time t(µs) Time t(µs)
R1172x101x R1172x101x
VIN=2.0V,CIN=Ceramic 4.7µF,
VIN=2.0V,CIN=COUT= Ceramic 4.7µF COUT=Ceramic 10µF
1.20 40 1.20 40
Output Current IOUT(mA)
Output Current IOUT(mA)
1.15 20 1.15 20
Output Current Output Current
1.10 0 1.10 0
1.05 1.05
Output Voltage Output Voltage
1.00 1.00
0.95 0.95
0.90 0.90
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
Time t(µs) Time t(µs)
18
R1172x
R1172x301x R1172x301x
VIN=4.0V,CIN=Ceramic 4.7µF,
VIN=4.0V,CIN=COUT= Ceramic 4.7µF
3.8 600 COUT=Ceramic 10µF
3.8 600
3.6 400
R1172x301x R1172x301x
VIN=4.0V,CIN=Ceramic 4.7µF,
VIN=4.0V,CIN=COUT= Ceramic 4.7µF COUT=Ceramic 10µF
3.20 150 3.20 150
3.08 0 3.08 0
2.96 2.96
0 4 8 12 16 20 24 28 32 36 40 0 2 4 6 8 10 12 14 16 18 20
Time t(µs) Time t(µs)
R1172x301x R1172x301x
VIN=4.0V,CIN=Ceramic 4.7µF,
VIN=4.0V,CIN=COUT= Ceramic 4.7µF COUT=Ceramic 10µF
3.20 40 3.20 40
Output Current IOUT(mA)
Output Current IOUT(mA)
3.15 20 3.15 20
Output Current Output Current
3.10 0 3.10 0
3.05 3.05
3.00 3.00
2.90 2.90
0 40 80 120 160 200 240 280 320 360 400 0 40 80 120 160 200 240 280 320 360 400
Time t(µs) Time t(µs)
19
R1172x
R1172x501x R1172x501x
VIN=6.0V,CIN=COUT= Ceramic 4.7µF VIN=6.0V,CIN=COUT= Ceramic 4.7µF
6.00 600 5.20 150
5.25 0 5.08 0
5.00 5.04
Output Voltage
4.75 Output Voltage 5.00
4.50 4.96
0 40 80 120 160 200 240 280 320 360 400 0 2 4 6 8 10 12 14 16 18 20
Time t(µs) Time t(µs)
R1172x501x
VIN=6.0V,CIN=COUT= Ceramic 4.7µF
5.20 40
Output Current IOUT(mA)
Output Voltage VOUT(V)
5.15 20
Output Current
5.10 0
5.05
5.00
4.90
0 40 80 120 160 200 240 280 320 360 400
Time t(µs)
8 6
Output Voltage VOUT(V)
1.4 1.2
1.2 0.8 6 4
1.0 0.4
0.8 0.0 4 2
0.6
IOUT=0mA 2 IOUT=0mA 0
0.4
IOUT=100mA IOUT=100mA
0.2 0
IOUT=300mA IOUT=300mA
0.0 VCE VIN(V)
-20 0 20 40 60 80 100 120 140 160 180 -40 0 60 160 260 360
Time t(µs) Time t(µs)
20
R1172x
-0.4 0 0.6 1.6 2.8 3.6 -0.2 0 0.2 0.6 1.0 1.4 1.8
Time t(ms) Time t(ms)
2.4 2.4
0.8 0.8
600 600
400 400
200 200
0 0
Inrush Current Inrush Current
21
R1172x
R1172x301x R1172x301x
VIN=4.0V,COUT= Ceramic 4.7µF VIN=4.0V,COUT= Ceramic 10µF
5 5
4 4
CE Input Voltage CE Input Voltage
3 3
1 1
0 0
400 400
Inrush Current
Inrush Current 200 200
0 0
R1172x501x R1172x501x
VIN=6.0V,COUT= Ceramic 4.7µF VIN=6.0V,COUT= Ceramic 10µF
CE Input VoltageVCE ,Output Voltage VOUT(V)
8 8
CE Input Voltage CE Input Voltage
6 6
4 4
Output Voltage Output Voltage
2 2
0 0
Inrush Current IVDD(mA)
Inrush Current IVDD(mA)
600 600
0 0
22
R1172x
CE VOUT
R1172xxx1B COUT
S.A Spectrum
Analyzer
VIN
GND ESR
CIN
VIN
IOUT
As an output capacitor for this IC, Ceramic capacitor is recommendable. However, other low ESR type
capacitor can be used with this IC.
For your reference, noise level is tested, and if the noise level is 40µV or less than 40µV, the ESR values are
plotted as stable area. Upper limit is described in the next five graphs, or ESR vs. Output Current. (Hatched area
is the stable area.)
Measurement conditions
⋅ VIN=VOUT+1V
⋅ Frequency Band: 10Hz to 1MHz
⋅ Temperature : 25°C
R1172x081x R1172x081x
VIN=1.4V to 6.0V, VIN=1.4V to 6.0V, CIN=Ceramic 4.7µF,
CIN=COUT=Ceramic 4.7µF COUT=Ceramic 10µF
100 100
Topt=85°C Topt=85°C
10 10
ESR(Ω)
ESR(Ω)
Topt=-40°C Topt=-40°C
1.0 1.0
0.1 0.1
0.01 0.01
0 200 400 600 800 1000 0 200 400 600 800 1000
Load Current IOUT(mA) Load Current IOUT(mA)
23
R1172x
R1172x101x R1172x301x
VIN=1.4V to 6.0V, VIN=3.1V to 6.0V,
CIN=COUT=Ceramic 4.7µF CIN=COUT=Ceramic 4.7µF
100 100
Topt=85°C Topt=85°C
10 10
ESR(Ω)
ESR(Ω)
Topt=-40°C Topt=-40°C
1.0 1.0
0.1 0.1
0.01 0.01
0 200 400 600 800 1000 0 200 400 600 800 1000
Load Current IOUT(mA) Load Current IOUT(mA)
R1172x501x
VIN=5.3V to 6.0V,
CIN=COUT=Ceramic 4.7µF
100
Topt=85°C
10
Topt=-40°C
ESR(Ω)
1.0
0.1
0.01
0 200 400 600 800 1000
Load Current IOUT(mA)
24
PACKAGE INFORMATION PE-SOT-23-5-0610
PACKAGE DIMENSIONS
2.9±0.2
+0.2
1.9±0.2 1.1 −0.1
(0.95) (0.95)
0.8±0.1
5 4
1.6 −0.1
+0.2
2.8–0.3
0 to 0.1
1 2 3
+0.1
0.15 −0.05
0.2 Min.
0.4±0.1
TAPING SPECIFICATION
1.75–0.1
+0.1 4.0–0.1
φ1.5 0 2.0–0.05
0.3–0.1
3.5–0.05
8.0–0.3
3.2
3.3
2.0Max. 4.0–0.1
∅1.1±0.1
TR
User Direction of Feed
2±0.5
−1.5
∅60 +1
0
∅180 0
21±0.8
PACKAGE INFORMATION PE-SOT-23-5-0610
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided)
Board Dimensions 40mm × 40mm × 1.6mm
Copper Ratio Top side : Approx. 50% , Back side : Approx. 50%
Through-hole φ0.5mm × 44pcs
600
40
500 On Board
Power Dissipation PD(mW)
420
400
Free Air
300
250
40
200
100
0
0 25 50 75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation Measurement Board Pattern
IC Mount Area Unit : mm
1.0
2.4
0.95 0.95
1.9
(Unit: mm)
PACKAGE INFORMATION PE-SOT-89-5-0611
• SOT-89-5 Unit: mm
PACKAGE DIMENSIONS
4.5±0.1
1.6±0.2 1.5±0.1
0.42±0.1
0.4±0.1
0.4
5 4
2.5±0.1
+0.5
−0.3
∅1.0
4.5
Min.
0.9
1 2 3
0.4±0.1
0.47
±0.1
0.42±0.1 0.42±0.1
1.5±0.1 1.5±0.1
+0.1 4.0±0.1
∅1.5 0
0.3±0.1 2.0±0.05
5.65±0.05
5.0
12±0.3
4.7
8.0±0.1
2.5Max.
∅1.6±0.1
T1
User Direction of Feed
2±0.5
∅ 180 –1.5
∅ 60 +1
0
0
21±0.8
PACKAGE INFORMATION PE-SOT-89-5-0611
Measurement Conditions
High Wattage Land Pattern Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s) Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided) Glass cloth epoxy plactic (Double sided)
Board
30mm × 30mm × 1.6mm 50mm × 50mm × 1.6mm
Dimensions
Top side : Approx. 20% , Top side : Approx. 10% ,
Copper Ratio
Back side : Approx. 100% Back side : Approx. 100%
Through-hole φ0.85mm × 10pcs -
1500
1400 On Board 30
1300 (High Wattage Land Pattern)
7.5 15
Power Dissipation PD(mW)
1200 50
1100 On Board
1000 (Standard Land Pattern)
900
800
700 Free Air
600
50
30
15
500
400
300
200
7.5
100
0
0 25 50 75 85 100 125 150
Ambient Temperature (°C) High Wattage Standard
Power Dissipation Measurement Board Pattern
IC Mount Area (Unit : mm)
45°
1.5
2.0
1.5 1.5
(Unit : mm)
PACKAGE INFORMATION PE-HSON-6-0611
• HSON-6 Unit: mm
PACKAGE DIMENSIONS
2.9±0.2
(1.5)
(0.2)
0.5Typ.
6 4
(0.15)
2.8±0.2
3.0±0.2
(1.6)
(0.65)
1 3
(0.2)
0.15±0.05
Bottom View
TAPING SPECIFICATION
1.75±0.1
4.0±0.1
+0.1
∅1.5 0
0.2±0.1 2.0±0.05 3.5±0.05
8.0±0.3
3.2
3.3
2.0Max. 4.0±0.1
∅1.1±0.1
TR
User Direction of Feed
2±0.5
180 −1.5
+1
60 0
0
21±0.8
PACKAGE INFORMATION PE-HSON-6-0611
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided)
Board Dimensions 40mm × 40mm × 1.6mm
Copper Ratio Top side : Approx. 50% , Back side : Approx. 50%
Through-hole φ0.5mm × 44pcs
1200
1100
On Board 40
1000
Power Dissipation PD(mW)
900
800
700
Free Air
600
500
400
40
300
200
100
0
0 25 50 75 85 100 125 150
Ambient Temperature (°C)
1.6
1.15
1.7
(Unit: mm)
PACKAGES INFORMATION PE-HSOP-6J-0701
• HSOP-6J Unit: mm
PACKAGE DIMENSIONS
5.02±0.3
6 5 4
6.0±0.3
3.9±0.2
0.60±0.2
1 2 3
3.81 0.2 +0.10
−0.05
0.605Typ.
1.5±0.1
1.67±0.1
0.15±0.1
0.10
0.4±0.1
0.12 M
4.0±0.1
0.3±0.1 1.5 +0.1
0
2.0±0.05
5.5
5.5±0.05
12±0.3
6.7
2.7Max.
8.0±0.1 2.05±0.1
E2
User Direction of Feed
21±0.8
∅ 180 −1.5
∅ 60 +1
0
0
2±0.5
PACKAGES INFORMATION PE-HSOP-6J-0701
Measurement Conditions
High Wattage Land Pattern Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s) Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided) Glass cloth epoxy plactic (Double sided)
Board Dimensions 50mm × 50mm × 1.6mm 50mm × 50mm × 1.6mm
Copper Ratio 90% 50%
Through-hole φ0.5mm × 44pcs φ0.5mm × 44pcs
2600
2400
2200 On Boad (High Wattage Land Pattern)
Power Dissipation PD(mW)
2000
1800 1700
On Boad (Standerd Land Pattern) 50 50
1600
18 20
1400
1200 Free Air
1000
800
600 540
400
49
10
40
20
200
0
0 25 50 75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation High Wattage Standard
Measurement Board Pattern
IC Mount Area Unit : mm
1.905 1.905
5.35
0.6 1.87
(Unit: mm)
POWER MANAGEMENT ICs MARK INFORMATIONS ME-R1172N-0505
1 2 3 4 5
4 5 6