LTM8067

3VIN to 40VIN Isolated

µModule DC/DC Converter

FEATURES DESCRIPTION
n 2kVAC Isolated µModule Converter The LTM®8067 is a 2kVAC isolated flyback µModule®
n UL60950 Recognized File 464570 (power module) DC/DC converter. Included in the pack-
n Wide Input Voltage Range: 3V to 40V age are the switching controller, power switches, trans-
n Up to 450mA Output Current (V = 24V V
IN , OUT = 5V) former, and all support components. Operating over an
Output Adjustable from 2.5V to 24V input voltage range of 3V to 40V, the LTM8067 supports
n Current Mode Control an output voltage range of 2.5V to 24V, set by a single
n User Configurable Undervoltage Lockout resistor. Only output and input capacitors are needed to
n Low Profile (9mm × 11.25mm × 4.92mm) finish the design.
BGA Package
The LTM8067 is packaged in a thermally enhanced, com-
pact (9mm × 11.25mm × 4.92mm) overmolded ball grid
APPLICATIONS array (BGA) package suitable for automated assembly
n Isolated IGBT Gate Drive by standard surface mount equipment. The LTM8067 is
n Industrial Sensors available with SnPb or RoHS compliant terminal finish.
n Industrial Switches All registered trademarks and trademarks are the property of their respective owners.
n Test and Measurement Equipment

TYPICAL APPLICATION
2kVAC Isolated µModule Regulator Maximum Output Current vs VIN
Max Load Current vs VIN
VIN VIN VOUT VOUT 600
3V TO 5V
40V RUN
22µF
2.2µF VOUTN
LOAD CURRENT (mA)

FB 400

LTM8067
8.25k
GND
8067 TA01a
200

0
0 10 20 30 40
VIN (V)
8067 TA01b

Rev. D

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LTM8067
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION
(Note 1)

VIN, RUN, BIAS .........................................................42V TOP VIEW

VOUT Relative to VOUTN..............................................25V
VIN + VOUT (Note 2)....................................................48V A

GND to VOUT– Isolation (Note 3)............................2kVAC B

Maximum Internal Temperature (Note 4)............... 125°C C BANK 2

VOUTN
BANK 1
VOUT
Peak Solder Reflow Body Temperature.................. 245°C D
Storage Temperature.............................. –55°C to 125°C E
BANK 4
BANK 5 GND
F VIN
RUN
G FB

1 2 3 4 5 6 7
BGA PACKAGE
38-LEAD (11.25mm × 9mm × 4.92mm)

TJMAX = 125°C, θJA = 20.8°C/W, θJCbottom = 5.1°C/W, θJCtop = 18.4°C/W, θJB = 5.3°C/W
WEIGHT = 1.1g, θ VALUES DETERMINED PER JESD 51-9, 51-12

ORDER INFORMATION
PART MARKING PACKAGE MSL
PART NUMBER PAD OR BALL FINISH DEVICE CODE TYPE RATING TEMPERATURE RANGE (SEE NOTE 4)
LTM8067EY#PBF SAC305 (RoHS) LTM8067Y e1 BGA 3 –40°C to 125°C
LTM8067IY#PBF SAC305 (RoHS) LTM8067Y e1 BGA 3 –40°C to 125°C
LTM8067IY SnPb (63/37) LTM8067Y e0 BGA 3 –40°C to 125°C
• Contact the factory for parts specified with wider operating temperature ranges. • Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures
• Device temperature grade is indicated by a label on the shipping container.
• Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings

Rev. D

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 LTM8067
ELECTRICAL
The CHARACTERISTICS l denotes the specifications which apply over the full internal
operating temperature range, otherwise specifications are at TA = 25°C, RUN = 2V (Note 4).
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Input DC Voltage RUN = 2V l 3 V
VOUT DC Voltage RADJ = 15.4k 2.5 V
RADJ = 8.25k l 4.75 5 5.25 V
RADJ = 1.78k 24 V
VIN Quiescent Current VRUN = 0V 3 µA
Not Switching 7 mA
VOUT Line Regulation 3V ≤ VIN ≤ 40V, IOUT = 0.1A, RUN = 2V 1 %
VOUT Load Regulation 0.05A ≤ IOUT ≤ 0.3A, RUN = 2V 1 %
VOUT Ripple (RMS) IOUT = 0.1A, 1MHz BW 30 mV
Isolation Voltage (Note 3) 2 kV
Input Short-Circuit Current VOUT Shorted 80 mA
RUN Pin Input Threshold RUN Pin Falling 1.18 1.214 1.25 V
RUN Pin Current VRUN = 1V 2.5 µA
VRUN = 1.3V 0.1 µA

Note 1: Stresses beyond those listed under Absolute Maximum Ratings with statistical process controls. LTM8067I is guaranteed to meet
may cause permanent damage to the device. Exposure to any Absolute specifications over the full –40°C to 125°C internal operating temperature
Maximum Rating condition for extended periods may affect device range. Note that the maximum internal temperature is determined by
reliability and lifetime. specific operating conditions in conjunction with board layout, the rated
Note 2: VIN + VOUT is defined as the sum of (VIN – GND) + (VOUT – VOUTN). package thermal resistance and other environmental factors.
Note 3: The LTM8067 isolation test voltage of either 2kVAC or its
equivalent of 2.83kVDC is applied for one second.
Note 4: The LTM8067E is guaranteed to meet performance specifications
from 0°C to 125°C. Specifications over the –40°C to 125°C internal
temperature range are assured by design, characterization and correlation

Rev. D

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 LTM8067
TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise noted, operating conditions are
as in Table 1 (TA = 25°C).

Efficiency vs Load Current, Efficiency vs Load Current, Efficiency vs Load Current,

VOUT = 2.5VV
Efficiency, VOUT = 3.3V VOUT = 5V
OUT = 2.5V OUT OUT
80 80 90

70 80
70

EFFICIENCY (%)

EFFICIENCY (%)
EFFICIENCY (%)

60 70
60
50 60

VIN = 5V 50 VIN = 5V VIN = 5V

40 VIN = 12V VIN = 12V 50 VIN = 12V
VIN = 24V VIN = 24V VIN = 24V
VIN = 36V VIN = 36V VIN = 36V
30 40 40
0 50 100 150 200 250 300 350 0 50 100 150 200 250 300 350 400 0 100 200 300 400 500 600
LOAD CURRENT (mA) LOAD CURRENT (mA) LOAD CURRENT (mA)
8067 G01 8067 G02 8067 G03

Efficiency vs Load Current, Efficiency vs Load Current, Efficiency vs Load Current,

VOUT = 8V OUT VOUT = 12VV OUT = 12V
Efficiency, VOUT = 15V OUT
85 85 85

75 75
75
EFFICIENCY (%)

EFFICIENCY (%)
EFFICIENCY (%)

65 65

65
55 VIN = 5V 55 VIN = 5V
VIN = 12V VIN = 12V VIN = 5V
VIN = 24V VIN = 24V VIN = 12V
VIN = 36V VIN = 36V VIN = 24V
45 45 55
0 100 200 300 400 500 0 50 100 150 200 250 300 0 50 100 150 200 250
LOAD CURRENT (mA) LOAD CURRENT (mA) LOAD CURRENT (mA)
8067 G04 8067 G05 8067 G06

Efficiency vs Load Current, Input Current vs Load Current Input Current vs Load Current
VOUT = 24V OUT VOUT = 2.5V VOUT = 3.3V
85 100 125

100
75
INPUT CURRENT (mA)
INPUT CURRENT (mA)

75
EFFICIENCY (%)

75

50
50
65
25 VIN = 5V VIN = 5V
VIN = 5V 25 VIN = 12V
VIN = 12V
VIN = 12V VIN = 24V VIN = 24V
VIN = 24V VIN = 36V VIN = 36V
55 0 0
0 25 50 75 100 125 0 50 100 150 200 250 300 350 0 100 200 300 400
LOAD CURRENT (mA) LOAD CURRENT (mA) LOAD CURRENT (mA)
8067 G07 8067 G08 8067 G09

Rev. D

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 LTM8067
TYPICAL
PERFORMANCE CHARACTERISTICS Unless otherwise noted, operating conditions are
as in Table 1 (TA = 25°C).

Input Current vs Load Current Input Current vs Load Current Input Current vs Load Current
VOUT
OUT = 5V VOUT
OUT
= 8V VOUT = 12V
300 400 400
VIN = 5V VIN = 5V VIN = 5V
VIN = 12V VIN = 12V VIN = 12V
VIN = 24V VIN = 24V VIN = 24V
240
VIN = 36V 300 VIN = 36V VIN = 36V
300
INPUT CURRENT (mA)

INPUT CURRENT (mA)

INPUT CURRENT (mA)

180
200 200
120

100 100
60

0 0 0
0 100 200 300 400 500 600 0 100 200 300 400 500 0 100 200 300
LOAD CURRENT (mA) LOAD CURRENT (mA) LOAD CURRENT (mA)
8067 G10 8067 G11 8067 G12

Input Current vs Load Current Input Current vs Load Current Input Current vs VIN, VOUT
VOUT = 15V VOUT
OUT
= 24V Shorted
Input Current vs VIN, VOUT Shorted
400 400 250
VIN = 5V VIN = 5V
VIN = 12V VIN = 12V
VIN = 24V VIN = 24V 200
300 300
INPUT CURRENT (mA)

INPUT CURRENT (mA)

INPUT CURRENT (mA)

150
200 200
100

100 100
50

0 0 0
0 100 200 300 0 50 100 150 0 10 20 30 40
LOAD CURRENT (mA) LOAD CURRENT (mA) VIN (V)
8067 G13 8067 G14 8067 G15

Maximum
Maximum Load
Load Current
Current vs
vs VVOUT
OUT Maximum Load CurrentINvs VIN Maximum
Max Load Load Current
Current vs VINvs VIN
500 400 600
VIN = 5V 2.5VOUT 5VOUT
VIN = 12V 3.3VOUT 8VOUT
VIN = 24V 12VOUT
MAXIMUM LOAD CURRENT (mA)

MAXIMUM LOAD CURRENT (mA)

MAXIMUM LOAD CURRENT (mA)

375
300 400

250

200 200
125

0 100 0
0 5 10 15 20 25 0 10 20 30 40 0 10 20 30 40
VOUT (V) VIN (V) VIN (V)
8067 G16 8067 G17 8067 G18

Rev. D

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 LTM8067
TYPICAL
PERFORMANCE CHARACTERISTICS Unless otherwise noted, operating conditions are
as in Table 1 (TA = 25°C).

Minimum Load Current vs VOUT Output Noise and Ripple

Maximum Load Current
Max Load Current vs VINvs VIN Over Full Output Voltage Range DC2357A, 200mA Load Current
300 25

MINIMUM LOAD CURRENT (mA)

MAXIMUM LOAD CURRENT (mA)

20
10mV/DIV
200
15

10
C5 = 470pF
100
HP461 150MHz AMPLIFIER AT 40dB GAIN
5 8067 G21
2µs/DIV
24VOUT
15VOUT DATA0
0 0
0 10 20 30 40 0 6 12 18 24
VIN (V) VOUT1 (V)
8067 G19 8067 G20

Frequency vs VOUT Load Current

Stock DC2357A Demo Board Derating, 2.5VOUT Derating,
Derating, 3.3V
3.3VOUT
OUT
450 400 400
0LFM AIRFLOW 0LFM AIRFLOW
MAXIMUM LOAD CURRENT (mA)

MAXIMUM LOAD CURRENT (mA)

SWITCHING FREQUENCY (kHz)

300 300
350

200 200

250
100 VIN = 5V 100 VIN = 5V
5VIN VIN = 12V VIN = 12V
12VIN VIN = 24V VIN = 24V
24VIN VIN = 36V VIN = 36V
150 0 0
0 100 200 300 400 500 25 50 75 100 125 25 50 75 100 125
LOAD CURRENT (mA) AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C)
8067 G22 8067 G23 8067 G24

Rev. D

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 LTM8067
TYPICAL
PERFORMANCE CHARACTERISTICS Unless otherwise noted, operating conditions are
as in Table 1 (TA = 25°C).

Derating, 5V
Derating, 5VOUT
OUT Derating, 8VOUT OUT Derating, 12VOUT
Derating, 12VOUT
600 450 300
0LFM AIRFLOW 0LFM AIRFLOW 0LFM AIRFLOW

MAXIMUM LOAD CURRENT (mA)

MAXIMUM LOAD CURRENT (mA)

MAXIMUM LOAD CURRENT (mA)

450 225
300

300 150

150
150 VIN = 5V VIN = 5V 75
VIN = 12V VIN = 12V VIN = 5V
VIN = 24V VIN = 24V VIN = 12V
VIN = 36V VIN = 36V VIN = 24V, 36V
0 0 0
25 50 75 100 125 25 50 75 100 125 25 50 75 100 125
AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C)
8067 G25 8067 G26 8067 G27

Derating, 15VOUT Derating, 24VOUT

OUT
300 150
0LFM AIRFLOW 0LFM AIRFLOW
MAXIMUM LOAD CURRENT (mA)

MAXIMUM LOAD CURRENT (mA)

120
225

90
150
60

75 VIN = 5V
VIN = 12V 30
VIN = 24V VIN = 5V
VIN = 36V VIN = 12V, 24V
0 0
25 50 75 100 125 25 50 75 100 125
AMBIENT TEMPERATURE (°C) AMBIENT TEMPERATURE (°C)
8067 G28 8067 G29

Rev. D

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LTM8067
PIN FUNCTIONS
PACKAGE ROW AND COLUMN LABELING MAY VARY These pins must be locally bypassed with an external,
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE low ESR capacitor.
LAYOUT CAREFULLY.
RUN (Pin F3): A resistive divider connected to VIN and this
VOUT (Bank 1): VOUT and VOUTN comprise the isolated pin programs the minimum voltage at which the LTM8067
output of the LTM8067 flyback stage. Apply an external will operate. Below 1.214V, the LTM8067 does not deliver
capacitor between VOUT and VOUTN. Do not allow VOUTN power to the secondary. When RUN is less than 1.214V,
to exceed VOUT. the pin draws 2.5µA, allowing for a programmable hys-
VOUTN (Bank 2): VOUTN is the return for VOUT. VOUT and teresis. Do not allow a negative voltage (relative to GND)
VOUTN comprise the isolated output of the LTM8067. In on this pin. Tie this pin to VIN if it is not used.
most applications, the bulk of the heat flow out of the FB (Pins G7): Apply a resistor from this pin to GND to
LTM8067 is through the GND and VOUTN pads, so the set the output voltage VOUTN relative to VOUTN, using the
printed circuit design has a large impact on the thermal recommended value given in Table 1. If Table 1 does not
performance of the part. See the PCB Layout and Thermal list the desired VOUT value, the equation:
Considerations sections for more details. Apply an exter-
nal capacitor between VOUT and VOUTN.

( )
RFB = 37.415 VOUT –0.955 kΩ
GND (Bank 4): This is the primary side local ground of
the LTM8067 primary. In most applications, the bulk of may be used to approximate the value. To the seasoned
the heat flow out of the LTM8067 is through the GND designer, this exponential equation may seem unusual. The
and VOUTN pads, so the printed circuit design has a large equation is exponential due to nonlinear current sources
impact on the thermal performance of the part. See the that are used to temperature compensate the regulation.
PCB Layout and Thermal Considerations sections for Do not drive this pin with an external power source.
more details.
VIN (Bank 5): VIN supplies current to the LTM8067’s
internal regulator and to the integrated power switch.

Rev. D

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 LTM8067
BLOCK DIAGRAM

VIN VOUT

•
0.1µF • 1µF

RUN
VOUTN
CURRENT
MODE
CONTROLLER

FB

GND
8067 BD

Rev. D

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LTM8067
OPERATION
The LTM8067 is a stand-alone isolated flyback switching The LTM8067 has a galvanic primary to secondary iso-
DC/DC power supply that can deliver up to 450mA of lation rating of 2kVAC. For details please refer to the
output current at 5VOUT, 24VIN. This module provides a Isolation, Working Voltage and Safely Compliance sec-
regulated output voltage programmable via one external tion. The LTM8067 is a UL 60950 recognized component.
resistor from 2.5V to 24V. The input voltage range of the The RUN pin is used to turn on or off the LTM8067, dis-
LTM8067 is 3V to 40V. Given that the LTM8067 is a fly- connecting the output and reducing the input current to
back converter, the output current depends upon the input 1μA or less.
and output voltages, so make sure that the input voltage
is high enough to support the desired output voltage and The LTM8067 is a variable frequency device. For a given
load current. The Typical Performance Characteristics input and output voltage, the frequency increases from
section gives several graphs of the maximum load versus light load through moderate load, then begins to decrease
VIN for several output voltages. until full load is reached. An example of this is shown in
the Typical Performance Characteristics section. For light
A simplified block diagram is given. The LTM8067 con-
loads, the current through the internal transformer may
tains a current mode controller, power switching element,
be discontinuous.
power transformer, power Schottky diode and a modest
amount of input and output capacitance.

Rev. D

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 LTM8067
APPLICATIONS INFORMATION
For most applications, the design process is straight for- acceptable, and can yield improved dynamic response,
ward, summarized as follows: if it is necessary. Again, it is incumbent upon the user to
verify proper operation over the intended system’s line,
1. Look at Table 1 and find the row that has the desired
load and environmental conditions.
input range and output voltage.
Ceramic capacitors are small, robust and have very low
2. Apply the recommended CIN, COUT and RFB.
ESR. However, not all ceramic capacitors are suitable. X5R
While these component combinations have been tested and X7R types are stable over temperature and applied
for proper operation, it is incumbent upon the user to voltage and give dependable service. Other types, includ-
verify proper operation over the intended system’s line, ing Y5V and Z5U have very large temperature and voltage
load and environmental conditions. Bear in mind that coefficients of capacitance. In an application circuit they
the maximum output current may be limited by junc- may have only a small fraction of their nominal capaci-
tion temperature, the relationship between the input and tance resulting in much higher output voltage ripple than
output voltage magnitude and polarity and other factors. expected.
Please refer to the graphs in the Typical Performance
A final precaution regarding ceramic capacitors concerns
Characteristics section for guidance.
the maximum input voltage rating of the LTM8067. A
Capacitor Selection Considerations ceramic input capacitor combined with trace or cable
inductance forms a high-Q (underdamped) tank circuit.
The CIN and COUT capacitor values in Table 1 are the mini- If the LTM8067 circuit is plugged into a live supply, the
mum recommended values for the associated operating input voltage can ring to much higher than its nominal
conditions. Applying capacitor values below those indi- value, possibly exceeding the device’s rating. This situa-
cated in Table 1 is not recommended, and may result in tion is easily avoided; see the Hot-Plugging Safely section.
undesirable operation. Using larger values is generally

Table 1. Recommended Component Values for Specific VOUT Values (TA = 25°C)
VIN VOUT CIN COUT RFB
3V to 40V 2.5V 2.2µF, 50V, 1206 100µF, 6.3V, 1210 15.4k
3V to 40V 3.3V 2.2µF, 50V, 1206 47µF, 6.3V, 1210 11.8k
3V to 40V 5V 2.2µF, 50V, 1206 22µF, 16V, 1210 8.25k
3V to 37V 8V 2.2µF, 50V, 1206 22µF, 16V, 1210 5.23k
3V to 33V 12V 4.7µF, 50V, 1206 10µF, 50V, 1210 3.48k
3V to 30V 15V 4.7µF, 50V, 1206 4.7µF, 25V, 1210 2.8k
3V to 27V 18V 4.7µF, 50V, 1206 4.7µF, 25V, 1210 2.37k
3V to 21V 24V 4.7µF, 50V, 1206 4.7µF, 25V, 1210 1.78k
Note: An input bulk capacitor is required.

Rev. D

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LTM8067
APPLICATIONS INFORMATION
Isolation, Working Voltage and Safety Compliance LTM8067 may be operated with up to 250V working
voltage in a pollution degree 2 environment. The actual
The LTM8067 isolation is 100% hi-pot tested by tying
working voltage, insulation category, pollution degree and
all of the primary pins together, all of the secondary pins
other critical parameters for the specific end application
together and subjecting the two resultant circuits to a
depend upon the actual environmental, application and
high voltage differential for one second. This establishes
safety compliance requirements. It is therefore up to the
the isolation voltage rating of the LTM8067 component.
user to perform a safety and compliance review to ensure
The isolation rating of the LTM8067 is not the same as that the LTM8067 is suitable for the intended application.
the working or operational voltage that the application
will experience. This is subject to the application’s power Safety Rated Capacitors
source, operating conditions, the industry where the end Some applications require safety rated capacitors, which
product is used and other factors that dictate design are high voltage capacitors that are specifically designed
requirements such as the gap between copper planes, and rated for AC operation and high voltage surges. These
traces and component pins on the printed circuit board, as capacitors are often certified to safety standards such
well as the type of connector that may be used. To maxi- as UL 60950, IEC 60950 and others. In the case of the
mize the allowable working voltage, the LTM8067 has two LTM8067, a common application of a safety rated capaci-
columns of solder balls removed to facilitate the printed tor would be to connect it from GND to VOUTN. To provide
circuit board design. The ball to ball pitch is 1.27mm, and maximum flexibility, the LTM8067 does not include any
the typical ball diameter is 0.75mm. Accounting for the components between GND and VOUTN. Any safety capaci-
missing columns and the ball diameter, the printed circuit tors must be added externally.
board may be designed for a metal-to-metal separation of
up to 3.06mm. This may have to be reduced somewhat to The specific capacitor and circuit configuration for any
allow for tolerances in solder mask or other printed circuit application depends upon the safety requirements of
board design rules. For those situations where informa- the system into which the LTM8067 is being designed.
tion about the spacing of LTM8067 internal circuitry is Table 2 provides a list of possible capacitors and their
required, the minimum metal to metal separation of the manufacturers. The application of a capacitor from GND
primary and secondary is 1mm. to VOUTN may also reduce the high frequency output noise
on the output.
To reiterate, the manufacturer’s isolation voltage rating
and the required working or operational voltage are often Table 2. Safety Rated Capacitors
different numbers. In the case of the LTM8067, the iso- MANUFACTURER PART NUMBER DESCRIPTION
lation voltage rating is established by 100% hi-pot test- Murata GA343DR7GD472KW01L 4700pF, 250V AC, X7R,
ing. The working or operational voltage is a function of Electronics 4.5mm × 3.2mm
Capacitor
the end product and its system level specifications. The
Johanson 302R29W471KV3E-****-SC 470pF, 250V AC, X7R,
actual required operational voltage is often smaller than Dielectrics 4.5mm × 2mm
the manufacturer’s isolation rating. Capacitor
Syfer Technology 1808JA250102JCTSP 100pF, 250V AC, C0G,
The LTM8067 is a UL recognized component under 1808 Capacitor
UL 60950, file number 464570. The UL 60950 insula-
tion category of the LTM8067 transformer is Functional.
Considering UL 60950 Table 2N and the gap distances
stated above, 3.06mm external and 1mm internal, the

Rev. D

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 LTM8067
APPLICATIONS INFORMATION
PCB Layout 4. Place the CIN and COUT capacitors such that their
ground current flow directly adjacent to or underneath
Most of the headaches associated with PCB layout have
the LTM8067.
been alleviated or even eliminated by the high level of
integration of the LTM8067. The LTM8067 is neverthe- 5. Connect all of the GND connections to as large a copper
less a switching power supply, and care must be taken to pour or plane area as possible on the top layer. Avoid
minimize electrical noise to ensure proper operation. Even breaking the ground connection between the external
with the high level of integration, you may fail to achieve components and the LTM8067.
specified operation with a haphazard or poor layout. See 6. Use vias to connect the GND copper area to the board’s
Figure 1 for a suggested layout. Ensure that the grounding internal ground planes. Liberally distribute these GND
and heat sinking are acceptable. vias to provide both a good ground connection and
A few rules to keep in mind are: thermal path to the internal planes of the printed cir-
cuit board. Pay attention to the location and density of
1. Place the RFB resistor as close as possible to its respec-
the thermal vias in Figure 1. The LTM8067 can benefit
tive pin.
from the heat sinking afforded by vias that connect to
2. Place the CIN capacitor as close as possible to the VIN internal GND planes at these locations, due to their
and GND connections of the LTM8067. proximity to internal power handling components.
3. Place the COUT capacitor as close as possible to VOUT The optimum number of thermal vias depends upon
and VOUTN the printed circuit board design. For example, a board
might use very small via holes. It should employ more
thermal vias than a board that uses larger holes.

FB
VOUT
LTM8067

COUT1

VOUTN

RUN

CIN VIN

THERMAL/INTERCONNECT VIAS
8067 F01

Figure 1. Layout Showing Suggested External Components, Planes and Thermal Vias

Rev. D

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LTM8067
APPLICATIONS INFORMATION
Minimum Load voltage at the VIN pin of the LTM8067 can ring to more
than twice the nominal input voltage, possibly exceeding
Due to the nature of the flyback regulator in general, and
the LTM8067’s rating and damaging the part. If the input
the LTM8067 control scheme specifically, the LTM8067
supply is poorly controlled or the user will be plugging
requires a minimum load for proper operation. Otherwise,
the LTM8067 into an energized supply, the input network
the output may go out of regulation if the load is too
should be designed to prevent this overshoot. This can be
light. The most common way to address this is to place
accomplished by installing a small resistor in series to VIN,
a resistor across the output. The Minimum Load Current
but the most popular method of controlling input voltage
vs VOUT Over Full Output Voltage Range graph in the
overshoot is adding an electrolytic bulk capacitor to the
Typical Performance Characteristics section may be
VIN net. This capacitor’s relatively high equivalent series
used as a guide in selecting the resistor. Note that this
resistance damps the circuit and eliminates the voltage
graph describes room temperature operation. If the end
overshoot. The extra capacitor improves low frequency
application operates at a colder temperature, the mini-
ripple filtering and can slightly improve the efficiency of the
mum load requirement may be higher and the minimum
circuit, though it can be a large component in the circuit.
load condition must be characterized for the lowest
operating temperature. Thermal Considerations
If it is impractical to place a resistive load permanently The LTM8067 output current may need to be derated if
across the output, a resistor and Zener diode may be used it is required to operate in a high ambient temperature.
instead, as shown in Figure 2. While the minimum load The amount of current derating is dependent upon the
resistor mentioned in the prior paragraph will always draw input voltage, output power and ambient temperature. The
current while the LTM8067 output is powered, the series temperature rise curves given in the Typical Performance
resistor-Zener diode combination will only draw current if Characteristics section can be used as a guide. These
the output is too high. When using this circuit, take care to curves were generated by the LTM8067 mounted to
ensure that the characteristics of the Zener diode are appro- a 58cm2 4-layer FR4 printed circuit board. Boards of
priate for the intended application’s temperature range. other sizes and layer count can exhibit different thermal
behavior, so it is incumbent upon the user to verify proper
VOUTP operation over the intended system’s line, load and envi-
ronmental operating conditions.
LTM8067
For increased accuracy and fidelity to the actual applica-
VOUTN tion, many designers use FEA to predict thermal perfor-
8067 F02 mance. To that end, the Pin Configuration section of the
Figure 2. Use a Resistor and Zener Diode to Meet the data sheet typically gives four thermal coefficients:
Minimum Load Requirement
θJA: Thermal resistance from junction to ambient
Hot-Plugging Safely θJCbottom: Thermal resistance from junction to the bot-
The small size, robustness and low impedance of ceramic tom of the product case
capacitors make them an attractive option for the input θJCtop: Thermal resistance from junction to top of the
bypass capacitor of the LTM8067. However, these capaci- product case
tors can cause problems if the LTM8067 is plugged into
a live supply (see Analog Devices Application Note 88 for θJCboard: Thermal resistance from junction to the
a complete discussion). The low loss ceramic capacitor printed circuit board.
combined with stray inductance in series with the power While the meaning of each of these coefficients may
source forms an underdamped tank circuit, and the seem to be intuitive, JEDEC has defined each to avoid
Rev. D

14 For more information www.analog.com

 LTM8067
APPLICATIONS INFORMATION
confusion and inconsistency. These definitions are given in sum of the θJCbottom and the thermal resistance of the
JESD 51-12, and are quoted or paraphrased as follows: bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
θJA is the natural convection junction-to-ambient air
a specified distance from the package, using a two-sided,
thermal resistance measured in a one cubic foot sealed
two-layer board. This board is described in JESD 51-9.
enclosure. This environment is sometimes referred to
as still air although natural convection causes the air to Given these definitions, it should now be apparent that none
move. This value is determined with the part mounted to a of these thermal coefficients reflects an actual physical oper-
JESD 51-9 defined test board, which does not reflect an ating condition of a µModule converter. Thus, none of them
actual application or viable operating condition. can be individually used to accurately predict the thermal
performance of the product. Likewise, it would be inappro-
θJCbottom is the junction-to-board thermal resistance with
priate to attempt to use any one coefficient to correlate to the
all of the component power dissipation flowing through
junction temperature vs load graphs given in the product’s
the bottom of the package. In the typical µModule con-
data sheet. The only appropriate way to use the coefficients
verter, the bulk of the heat flows out the bottom of the
is when running a detailed thermal analysis, such as FEA,
package, but there is always heat flow out into the ambient
which considers all of the thermal resistances simultaneously.
environment. As a result, this thermal resistance value
may be useful for comparing packages but the test condi- A graphical representation of these thermal resistances
tions don’t generally match the user’s application. is given in Figure 3.
θJCtop is determined with nearly all of the component power The blue resistances are contained within the µModule
dissipation flowing through the top of the package. As the converter, and the green are outside.
electrical connections of the typical µModule converter are The die temperature of the LTM8067 must be lower than
on the bottom of the package, it is rare for an application the maximum rating of 125°C, so care should be taken in
to operate such that most of the heat flows from the junc- the layout of the circuit to ensure good heat sinking of the
tion to the top of the part. As in the case of θJCbottom, this LTM8067. The bulk of the heat flow out of the LTM8067 is
value may be useful for comparing packages but the test through the bottom of the module and the BGA pads into
conditions don’t generally match the user’s application. the printed circuit board. Consequently a poor printed cir-
θJCboard is the junction-to-board thermal resistance where cuit board design can cause excessive heating, resulting in
almost all of the heat flows through the bottom of the impaired performance or reliability. Please refer to the PCB
µModule converter and into the board, and is really the Layout section for printed circuit board design suggestions.

JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)

JUNCTION-TO-CASE (TOP) CASE (TOP)-TO-AMBIENT

RESISTANCE RESISTANCE

JUNCTION-TO-BOARD RESISTANCE
JUNCTION AMBIENT

JUNCTION-TO-CASE CASE (BOTTOM)-TO-BOARD BOARD-TO-AMBIENT

(BOTTOM) RESISTANCE RESISTANCE RESISTANCE

8067 F03

µMODULE DEVICE

Figure 3. Approximate Thermal Model of LTM8067

Rev. D

For more information www.analog.com 15

LTM8067
APPLICATIONS INFORMATION
12V Flyback Converter Maximum Load Current vs VIN
OUT
300
VIN VIN VOUT VOUT
12V 12V
RUN
10µF

MAXIMUM LOAD CURRENT (mA)

4.7µF VOUTN
200
FB

LTM8067
3.48k
GND
8067 TA03a 100

0
0 10 20 30 40
VIN (V)
8067 TA03b

–15V Inverting Regulator Maximum Load Current vs VIN

OUT
300
VIN VIN VOUT
5V TO 31V
RUN
4.7µF MAXIMUM LOAD CURRENT (mA)
4.7µF VOUTN VOUT
–15V 200
FB

LTM8067
2.8k
GND
8067 TA04a
100

0
0 10 20 30 40
VIN (V)
8067 TA04b

Rev. D

16 For more information www.analog.com

 LTM8067
PACKAGE DESCRIPTION
Pin Assignment Table
(Arranged by Pin Number)
PIN FUNCTION PIN FUNCTION PIN FUNCTION PIN FUNCTION PIN FUNCTION PIN FUNCTION PIN FUNCTION PIN FUNCTION
A1 VOUTN B1 VOUTN C1 – D1 – E1 GND F1 – G1 VIN H1 VIN
A2 VOUTN B2 VOUTN C2 – D2 – E2 GND F2 – G2 VIN H2 VIN
A3 VOUTN B3 VOUTN C3 – D3 – E3 GND F3 RUN G3 – H3 –
A4 VOUTN B4 VOUTN C4 – D4 – E4 GND F4 GND G4 GND H4 GND
A5 VOUTN B5 VOUTN C5 – D5 – E5 GND F5 GND G5 GND H5 GND
A6 VOUT B6 VOUT C6 – D6 – E6 GND F6 GND G6 GND H6 GND
A7 VOUT B7 VOUT C7 – D7 – E7 GND F7 GND G7 FB H7 GND

PACKAGE PHOTO

Rev. D

For more information www.analog.com 17

 BGA Package
38-Lead (11.25mm × 9.00mm × 4.92mm)

18
(Reference LTC DWG # 05-08-1925 Rev B)

Z
A SEE NOTES
DETAIL A
aaa Z 6
E Y

Z
X A2 SEE NOTES G
A1 PIN 1
LTM8067

ccc Z A

PIN “A1” b B
CORNER
4 C
b1
MOLD D
D CAP F
SUBSTRATE E

H1
H2 F
e
PACKAGE DESCRIPTION

G
DETAIL B

// bbb Z
H
aaa Z
7 6 5 4 3 2 1
PACKAGE TOP VIEW Øb (38 PLACES)
ddd M Z X Y PACKAGE BOTTOM VIEW
DETAIL B
eee M Z
PACKAGE SIDE VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994

0.000
2. ALL DIMENSIONS ARE IN MILLIMETERS
3 BALL DESIGNATION PER JESD MS-028 AND JEP95

3.810
2.540
1.270
0.3175
0.3175
1.270
2.540
3.810
DETAIL A 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
4.445 BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
3.175 DIMENSIONS MARKED FEATURE

For more information www.analog.com

1.905
SYMBOL MIN NOM MAX NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
A 4.72 4.92 5.12
0.635 A1 0.50 0.60 0.70 BALL HT 6 PACKAGE ROW AND COLUMN LABELING MAY VARY
0.000 ! AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
0.635
A2 4.22 4.32 4.42 LAYOUT CAREFULLY
b 0.60 0.75 0.90 BALL DIMENSION
1.905
b1 0.60 0.63 0.66 PAD DIMENSION
3.175 D 11.25
4.1275 E 9.0
4.445
4.7625 e 1.27
F 8.89
SUGGESTED PCB LAYOUT G 7.62
TOP VIEW LTMXXXXXX
H1 0.27 0.320.37 SUBSTRATE THK
µModule
H2 3.95 4.004.05 MOLD CAP HT
COMPONENT
aaa 0.15 PIN “A1”
bbb 0.10
ccc 0.20
TRAY PIN 1
ddd 0.30 BEVEL
eee 0.15 PACKAGE IN TRAY LOADING ORIENTATION
BGA 38 0517 REV B
TOTAL NUMBER OF BALLS: 38

Rev. D
 LTM8067
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 05/16 Corrected symbol of internal switch in block diagram from NPN transistor to N-channel MOSFET 9
B 11/16 Corrected VOUT on Maximum Load Current vs VIN from 12VOUT to 24VOUT and from 15VOUT to 12VOUT 6
Corrected minimum metal to metal space from 0.75mm to 1mm 12
Updated the Related Parts Table 20
C 07/17 Added Minimum Load section 14
D 11/20 Minimum VIN changed from 2.8V to 3V 1, 3, 10, 11
Updated Derating graph 6, 7
Updated text about operating frequency 10

Rev. D

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For more by
is granted information www.analog.com
implication or otherwise under any patent or patent rights of Analog Devices. 19
LTM8067
TYPICAL APPLICATION
15V Floating 1GBT Gate Drive
100VDC
15V MOTOR POWER
VIN VIN VOUT 200mA
12V
RUN
4.7µF
4.7µF
VOUTN
FB

LTM8067
2.8k
GND
8067 TA02a

DESIGN RESOURCES
SUBJECT DESCRIPTION
µModule Design and Manufacturing Resources Design: Manufacturing:
• Selector Guides • Quick Start Guide
• Demo Boards and Gerber Files • PCB Design, Assembly and Manufacturing Guidelines
• Free Simulation Tools • Package and Board Level Reliability
µModule Regulator Products Search 1. Sort table of products by parameters and download the result as a spread sheet.
2. Search using the Quick Power Search parametric table.

Digital Power System Management Analog Devices’ family of digital power supply management ICs are highly integrated solutions that
offer essential functions, including power supply monitoring, supervision, margining and sequencing,
and feature EEPROM for storing user configurations and fault logging.

RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LTM8068 2kVAC Isolated µModule Converter with LDO Post Regulator 3V ≤ VIN ≤40V, 1.2V ≤ VOUT ≤ 18V; 20µVRMS Output Ripple.
UL60950 Recognized.
LTM8047 725VDC, 1.5W Isolated µModule Converter 3.1V ≤ VIN ≤32V, 2.5V ≤ VOUT ≤ 12V
LTM8048 725VDC, 1.5W Isolated µModule Converter with LDO Post Regulator 3.1V ≤ VIN ≤32V, 1.2V ≤ VOUT ≤ 12V; 20µVRMS Output Ripple
LTM8045 Inverting or SEPIC µModule DC/DC Convertor 2.8V ≤ VIN ≤18V, 2.5V ≤ VOUT ≤ 15V or -2.5V ≤ VOUT ≤ –15V, Up
to 700mA
LT®8300 Isolated Flyback Convertor with 100VIN, 150V/260mA Power Switch 6V ≤ VIN ≤ 100V, No Opt-Isolator Required
LT8301 Isolated Flyback Convertor with 65V/1.2A Power Switch 2.7V ≤ VIN ≤ 42V, No Opt-Isolator Required
LT8302 Isolated Flyback Convertor with 65V/3.6A Power Switch 3V ≤ VIN ≤ 42V, No Opt-Isolator Required
LTM8049 Dual Outputs, SEPIC and/or Inverting µModule Regulator 2.6V ≤ VIN ≤ 20V, ±2.5V ≤ VOUT ≤ ±25V,
9mm × 15mm × 2.42mm BGA

Rev. D

20
11/20
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