Creare un’applicazione Linux sulla piattaforma i.

MX 8M
passo dopo passo
Date: September 29, 2021
Presenters:
▪ Massimo Incerti – NXP
▪ Pietro Gabba – Arrow
▪ Emilio Brivio - Arrow

• G O T O WE B IN AR C O N T R OL P AN E L AT U P P E R R IG H T

• T H IS WE B IN AR WIL L B E R E C O R D ED.

• AS K YO U R Q U E ST IO N U S IN G T H E Q U E ST IO N B O X O F
T H E C O N T ROL P AN E L

• D O WN L O AD T H E P R E S E NT AT IO N U S IN G T H E
H AN D O U T S E C T ION O F T H E C O N T ROL P AN E L

EXTERNAL 0
EXTERNAL 1
I.MX8 PRODUCT FAMILY
AND ROADMAP UPDATE

Massimo Incerti
EMEA – Distribution Technical Manager
SEPTEMBER 2021

EXTERNAL
NXP, T HE NXP LOGO AND NXP SECURE CONNECTIONS FO R A SMARTER W ORLD ARE T RADEMARKS O F NXP B.V.
ALL OT HER PRODUCT OR SERVICE NAMES ARE T HE PRO PERTY O F T HEIR RES PECTIVE OW NERS. © 2021 NXP B.V.
SECURE CONNECTIONS FOR THE SMARTER WORLD

PUBLIC USE 3
EXTERNAL 3
 U N I Q U E LY P O S I T I O N E D T O D E L I V E R F U L L S Y S T E M S O L U T I O N S

COMPREHENSIVE SCALABLE PROVEN TRUSTED ECOSYSTEM

CONNECTIVITY MCU & MPU PORTFOLIO SECURITY SOLUTIONS PARTNERS
PORTFOLIO

i.MX 6, 7, 8, 9 Series IoT Secure

High-performance, multimedia Elements
MPUs

LayerscapeTM Secure Processors

High-speed TSN/networking for IoT
processors

i.MX RT Crossover Authentication

Highest performing MCUs

KinetisTM and LPC Secure Automotive

Low cost to high integration Products

EXTERNAL 4
AM PL I F Y M AR K ET D EPL O YMENT WI T H N XP’ S SC AL AB L E ED G E PR O C ESSI NG C O N T I NUUM

Scalable/reusable software,
tools and solutions
Performance

Based on Arm® technology

Consolidated Linux BSP

for Arm Cortex-A devices

MCUXpresso Tools & With Industrial-grade

FreeRTOS for Arm reliability, security, longevity
Cortex-M devices

Functional Integration
EXTERNAL 5
 i.MX Processor Values
• Trusted Supply
− Product longevity: Minimum 10 to 15 years
− Security and safety: Hardware acceleration, software
− Reliability: Zero-defect methodology, ULA, low SER FIT
− Quality: Automotive AEC-Q100, Industrial/Consumer JEDEC
Trust Crypto
• Scalability for Maximum Platform Reuse
− Pin compatibility and software portability
Anti-
Tamper − Integration: CPU (single/dual/quad, asymmetric), GPU, IO

− Manufacturability: 0.65 to 0.8mm pitch, fewer PCB layers

• Support and Enablement

− Software: Linux, Android, Windows-embedded, RTOS
− Industry-leading partners and support community
− System solutions: Voice, Video, Vision, Machine Learning, Sensors,
Power Management, Connectivity
EXTERNAL 6
N X P S U P P LY L O N G E V I T Y

Industrial applications require product longevity

• Long product lifecycles
• Special product certification

NXP Industrial Processors

• NXP formally offers many devices for a minimum of
10 or 15 years from the time of launch
• Participating NXP products and program terms are
listed at www.nxp.com/productlongevity

EXTERNAL 7
N X P Q U A L I F I C AT I O N S P E C I F I C AT I O N S

Qualification Level Characteristics

Commercial or Consumer 5-year life*, 50% on

Highest MHz** Typically: 0C to +85C Tj

Industrial 10-year life*, 100% always on

Longest operating life** Typically: -40C to +105C Tj

Automotive 15-year life*, 10% on

Widest temperature range** Typically: -40C to +125C Tj

*Product Lifetime Usage application notes should be used to estimate expected power-on hours (PoH) for
each use case scenario, e.g. AN12468
**These descriptions represent the typical result for each qualification level in each product family

EXTERNAL 8
 NXP Scalable Processing Continuum
Newest Cost-optimized and
Power-optimized Performance
for Linux-based Applications
Networked
Performance

Performance

Performance

Best power
i.MX RT

Purpose-built, dedicated SoC platforms

Functional Integration
EXTERNAL 9
Industrial Targets for i.MX and Layerscape Processors

Human machine interface Machine vision & learning Industrial control & network
Industrial HMI, Building control panel, Scanner, Service robot, Factory Robot, Motion control,
Kiosk, Two-way radio Room monitor, Industrial printer, Building control, Gateway,
Avionics display, Fitness equipment, Machine vision Process manager, Avionics control,
Health care, Industrial vehicle display Solar inverter boost, Battery charger,
Test & Measurement

Extreme Operating
Longevity Security Safety and Reliability Scalable Solutions
Conditions

EXTERNAL 10
 I.M X 6 SER IES: SU PR EME SC AL AB IL IT Y AN D F L EXIB ILITY
L E V E R A G E O N E D E S I G N I N TO D I V E R S E P R O D U C T P O R T F O L I O

Scalable series of Twelve Arm-based SoC Families

Single Cortex-A Core M4 Dual Core Quad Core

A7 A9 A9 A9

i.MX i.MX i.MX i.MX i.MX i.MX i.MX i.MX i.MX i.MX i.MX i.MX
6ULZ 6ULL 6UltraLite 6SLL 6SoloLite 6SoloX 6Solo 6DualLite 6Dual 6DualPlus 6Quad 6QuadPlus
i.MX 6UltraLite i.MX 6UltraLite i.MX 6UltraLite i.MX 6SoloLite i.MX 6SoloLite i.MX 6SoloX i.MX 6Solo i.MX 6DualLite i.MX 6Dual i.MX 6DualPlus i.MX 6Quad

Pin-to-pin
Pin-to-pin Compatible
Compatible Pin-to-pin Compatible

Software Compatible

Expanded series for performance, power efficiency and lower BOM

EXTERNAL 11
 I.MX ULP FAMILY
(ULTRA LOW POWER)

EXTERNAL 12
i.MX ULP Family Target Applications
Low Power DEVICES i.MX 7ULP

• Home Control
• Wearables
• Portable Healthcare
• Portable Printing
• Gaming Accessories
• General Embedded
Control
• IoT Edge
• SOM Board Solutions

EXTERNAL 13
EXTERNAL 14
M AIN C PU U PGR AD E F R OM I.M X 7U L P TO I.M X 8U L P

EXTERNAL 15
R EAL T IM E C PU U PGR AD E F R OM I.M X 7U L P TO I.M X 8U L P

EXTERNAL 16
I.MX 8 SERIES FOR CONSUMER, INDUSTRIAL & AUTOMOTIVE
APPLICATIONS
i.MX 8M Family i.MX 8X Family i.MX 8 Family
Advanced Computing, Safety Certifiable & Advanced Graphics, Vision &
Audio/Video & Voice Efficient Performance Performance

M4/ A35 M4 GPU DSP A72 A53 M4 GPU DSP

A53 GPU DSP NPU
M7

Advanced graphics, video, image processing, vision, audio and voice

EXTERNAL 17
I . M X 8 S E R I E S : TA R G E T A P P L I C AT I O N S

Advanced graphics, video, image processing, vision, audio and voice

A53 A35 A72
M4/M7 M4 A53
i.MX 8M Family GPU i.MX 8X Family GPU i.MX 8 Family GPU M4
DSP
Advanced Computing, DSP Safety Certifiable & Advanced Graphics, DSP

Audio/Video & Voice NPU Vision & Performance

Efficient Performance

• Multimedia and HMI • Automotive eCockpit • Automotive eCockpit

− Basic to advanced for • Multimedia and HMI
• Multimedia and HMI
home, building, factory, − Advanced for factory,
− Mid-range for factory,
health, fitness, appliance, building, health, avionics
avionic infotainment building, health,
fitness, appliance • Machine Vision & learning
• Computing Performance − Autonomous Robots and
− Battery operated and • Industrial control
Vehicles
fanless − Factory and robotics

EXTERNAL 18
I . M X 8 SER I ES: SC AL AB L E SO L U T I O NS

Scalable series of THREE Arm V8 64-bit (/32-bit) based SoC Families

A53 A35 A72
M4 A53
i.MX 8M Family GPU
M4
M7
i.MX 8X Family GPU i.MX 8 Family GPU M4
DSP
Advanced Computing, DSP Safety Certifiable & Advanced Graphics, DSP

Audio/Video & Voice NPU Efficient Performance Vision & Performance

i.MX 8M
i.MX 8M Quad, Dual
QuadLite
.
Pin Compatible i.MX
i.MX i.MX 8QuadMax,
8QuadXPlus, 8QuadPlus
8DualX
8DualXPlus
i
i.MX 8M Mini QuadLite, i.MX 8M Mini
DualLite, SoloLite Quad, Dual, Solo Pin Compatible Pin Compatible
Pin Compatible

New i.MX 8M Nano

i.MX 8M Nano
70% Hardware and Software Reuse
QuadLite, DualLite,
Quad, Dual, Solo
SoloLite
Pin Compatible
Software Compatible (including GPU Tools)
EXTERNAL 19
I . M X 8 M FA M I LY O F A P P L I C AT I O N S P R O C E S S O R S

A72
A53
i.MX 6QuadPlus i.MX 8 family M4
Production
A9 Advanced Graphics, Vision & Performance i.MX 8M Plus
Pin-to-pin Compatible

i.MX 6Quad • 8M Plus Quad/QuadLite

• 8M Plus Dual

i.MX 6DualPlus Production

A53 i.MX 8M
i.MX 6Dual
i.MX 8M family M4/M7 •
•
8M Quad/QuadLite
8M Dual
Software Compatible

Advanced Computing, Audio/Video & Voice

Software Compatible
i.MX 6DualLite i.MX 8M Mini
Production

Pin-to-pin Compatible
• 8M Mini Quad/QuadLite
i.MX 6Solo A9
• 8M Mini Dual/DualLite
i.MX 8ULP family A35 M33
• 8M Mini Solo/SoloLite
M4 Ultra Low Power with Graphics
i.MX 6SoloX
Production
i.MX 8X family A35 M4 i.MX 8M Nano
i.MX 6SoloLite • 8M Nano Quad/QuadLite
Safety Certifiable & Efficient Performance • 8M Nano Dual/DualLite
i.MX 6SLL • 8M Nano Solo/SoloLite
Arm® v8-A (32-bit/ 64-bit) • 8M Nano Quad UltraLite*
i.MX 6UltraLite • 8M Nano Dual UltraLite*
A7
i.MX 7 family A7
M4
• 8M Nano Solo UltraLite*
i.MX 6ULL Flexible Efficient Connectivity
*11x11 package not pin-compatible
with 14x14 package i.MX 8M Mini or
i.MX 6ULZ Nano

Arm® v7-A
i.MX 7ULP family
Ultra Low Power with Graphics
EXTERNAL 20
Arm® v7-A (32-bit)
 I . M X 8 M FA M I LY: E X T E N D S A C R O S S M U LT I P L E A P P L I C AT I O N S

i.MX 8M Plus
i.MX 8M family 1-4x A53

M4/M7 • 8M Plus Quad/QuadLite

• 8M Plus Dual
General Purpose Edge Processing
i.MX 8M
• 8M Quad/QuadLite
• High Performance Computing w/ up to • 8M Dual
4x Cortex-A53 cores
i.MX 8M Mini

Software Compatible
• Up to 2+ TOPS ML acceleration

Pin-to-pin Compatible
• 8M Mini Quad/QuadLite
• Cortex-M co-processor for HMP • 8M Mini Dual/DualLite
• Video Encode/Decode • 8M Mini Solo/SoloLite
• 3D GPU
i.MX 8M Nano
• Display/Camera
• 8M Nano Quad/QuadLite
• High Speed Interfaces • 8M Nano Dual/DualLite
• High-end Audio Support • 8M Nano Solo/SoloLite
• Hardware Scalability i.MX 8M Nano UltraLite
• Software Scalability • 8M Nano Quad UltraLite*
• Industrial and Consumer • 8M Nano Dual UltraLite*
• 8M Nano Solo UltraLite*
Similar ‘look and feel’ to the popular i.MX 6 series, *11x11 package not pin-compatible
with 14x14 package i.MX 8M Mini or
but with upgraded performance and features Nano

EXTERNAL 21
I . M X 8 M FA M I LY F O R E M B E D D E D C & I A P P L I C AT I O N S
Product i.MX 8M Quad / QuadLite i.MX 8M Mini / Mini Lite i.MX 8M Nano / Nano Lite i.MX 8M Nano UltraLite i.MX 8M Plus
Sample / Production Production Production Production Production
Production Website – www.nxp.com/imx8m Website – www.nxp.com/imx8mmini Website – www.nxp.com/imx8mnano www.nxp.com/imx8mnano Website – www.nxp.com/imx8mplus
Main CPU 2x or 4x A53 1.5GHz, 1MB L2 1x, 2x or 4x A53 1.8GHz, 512KB L2 1x, 2x or 4x A53 1.5GHz, 512KB L2 1x, 2x or 4x A53 1.4GHz, 512KB L2 2x or 4x A53 1.8-2GHz, 512KB L2

MCU/DSP M4 266MHz M4 400MHz M7 up to 750MHz M7 up to 750MHz M7 800MHz, HiFi4 800 MHz

x16 or x32 LPDDR4/DDR4/DDR3L

DDR x16 or x32 LPDDR4/DDR4/DDR3L x16 or x32 LPDDR4/DDR4/DDR3L x16 LPDDR4/DDR4/DDR3L x16 LPDDR4/DDR4/DDR3L
Inline ECC
2D - GC520L
3D – GC7000Lite (4 shaders) 2D – GC320 GC7000UL
3D – GC7000UltraLite
GPU (OpenGL® ES 2.1/3.0/3.1, 3D – GC NanoULTRA (OpenGL® ES 2.1/3.0/3.1, -
(OpenGL® ES 2.1/3.0/3.1,
OpenCL™ 1.2, Vulkan) (OpenGL® ES 2.1) OpenCL™ 1.2, Vulkan)
OpenCL™ 1.2, Vulkan)
Security CAAM, RDC, TrustZone CAAM, RDC, TrustZone CAAM, RDC, TrustZone CAAM, RDC, TrustZone CAAM, RDC, TrustZone

AI/ML A53, GPU (OpenCL) A53 A53, GPU (OpenCL) A53 ML Accel 2+ TOPS
SRAM 128KiB + 32KiB 256KiB + 32KiB 512KiB + 32KiB 512KiB + 32KiB 768KiB + 32KiB
Camera 2x MIPI CSI (4-lane) 1x MIPI CSI (4-lane) 1x MIPI CSI (4-lane) 1x MIPI CSI (4-lane) 2x MIPI CSI (4-lane), ISP 2 camera
HDMI 2.0a Tx (eARC),
Display HDMI 2.0a Tx, MIPI DSI (4-lane), eDP 1x MIPI DSI (4-lane) 1x MIPI DSI (4-lane) -
MIPI DSI (4-lane), 1x LVDS (8-lane)
OSD Overlay 4Kp60 1080p60 1080p60 - 1080p60
HDR HDR10, HLG, Dolby Vision None None None None
4Kp60 HEVC, VP9, 4Kp30 H.264,
Video Decode 1080p60 HEVC, H.264, VP9, VP8 None None 1080p60 H.265, H.264, VP9, VP8
legacy codecs
Video Encode No HW acceleration 1080p60 H.264, VP8 No HW acceleration No HW acceleration 1080p60 H.265, H.264

Connectivity PCIe, SDIO, USB PCIe, SDIO, USB SDIO, USB SDIO, USB PCIe, SDIO, USB

20x I2S TDM (32b @384KHz), S/PDIF 20x I2S TDM (32b @384KHz), 8ch 12x I2S TDM (32b @384KHz), ASRC, 12x I2S TDM (32b @384KHz), ASRC, 18x I2S TDM (32b @384KHz), ASRC, 8ch
Audio
Tx+Rx PDM DMIC input), S/PDIF Tx+Rx 8ch PDM DMIC input), S/PDIF Tx+Rx 8ch PDM DMIC input), S/PDIF Tx+Rx PDM DMIC input), S/PDIF Tx+Rx
2x USB 3.0 Type C,
Expansion I/O 2x USB3.0, 2x PCIe Gen 2 2x USB2.0, 1x PCIe Gen 2 1x USB2.0 1x USB2.0
1x PCIe Gen 3
Network, 1x Enet, 2x SD/eMMC, 1x Enet, 3x SD/eMMC, 1x Enet, 3x SD/eMMC, 1x Enet, 3x SD/eMMC, 1x Enet, 1x TSN Enet, 2x CAN-FD, 3x
Storage MLC/SLC NAND MLC/SLC NAND MLC/SLC NAND MLC/SLC NAND SD/eMMC, MLC/SLC NAND
Process 28nm 14nm FinFET 14nm FinFET 14nm FinFET 14nm FinFET
Package 17x17mm, 0.65p (no microvias) 14x14mm, 0.5p (no microvias) 14x14mm, 0.5p (no microvias) 11x11mm, 0.5p (no microvias) 15x15mm, 0.5p (no microvias)
EXTERNAL 23
In Production In Progress
 I . M X 8 M FA M I LY - N E W E VA L U AT I O N K I T S I N 2 0 2 1
MORE NXP CONTENTS & MORE MEMORY SET-UP CHOICES

WIRELESS MEMORY
PROCESSOR PMIC OTHER NXP COMPONENTS
CONNECTIVITY TYPE

USB Type-C
MCIMX8M-EVKB i.MX 8M Quad PF4210 Cypress LPDDR4
PTN5110
-
NEW
i.MX 8M Plus NXP 2x2 WiFi5 / BT USB Type-C CAN Transceiver
8MPLUSLPD4-EVK PCA9450C LPDDR4
Quad 88W8997 PTN5110 TJA1048T
i.MX 8M Mini USB Type-C IOs Expander
8MMINID4-EVK Rohm Cypress DDR4
Quad PTN5110 PCA6416APW
NEW
i.MX 8M Mini NXP 1x1 WiFi5 / BT USB Type-C IOs Expander
8MMINILPD4-EVKB PCA9450AA LPDDR4
Quad 88W8987 PTN5110 PCA6416APW
i.MX 8M Nano USB Type-C IOs Expander
8MNANOD4-EVK Rohm Cypress DDR4
Quad PTN5110 PCA6416APW
NEW i.MX 8M Nano NXP 1x1 WiFi5 / BT USB Type-C IOs Expander
8MNANOLPD4-EVK PCA9450B LPDDR4
Quad 88W8987 PTN5110 PCA6416APW
NEW i.MX 8M NanoUL NXP 1x1 WiFi5 / BT USB Type-C IOs Expander
8MNANOD3L-EVK PCA9450B DDR3L
Quad 88W8987 PTN5110 PCA6416APW

EXTERNAL 24
T H E I . M X 8 M FA M I LY I S A G A M E C H A N G E R !

• Industry-Leading Video and Audio

− Video quality with full 4K UltraHD resolution and HDR
▪ Dolby Vision, HDR10, and HLG
− Highest levels of pro audio fidelity, up to 20 channels

• Performance and Versatility

− 1x-4x Cortex-A53 processors at speeds of up to 1.8
GHz per core, 1x Cortex-M for task offload
− Flexible memory options (speed, power, cost)
− Newest high-speed interfaces for flexible connectivity
− Configurations less than 2 to 3 Watts

• Basic to Advanced HMI Solutions

− Industrial and consumer HMI
− Dual displays and camera inputs
− Immersive Audio and Video processing
− Voice Solutions (local and cloud connected)
− Interconnected Devices (smarter edge devices)

EXTERNAL 25
I . M X 8 M FA M I LY TA R G E T A P P L I C AT I O N S

Consumer Audio and Smart Home, Industrial HMI, Machine Enterprise, Commercial
Video Systems Building and Cities Learning and Automation and Healthcare
• Surround sound and sound • Safety, security and • Barcode or image scanner • IP phones
bars surveillance system • Industrial printer • Audio and video conferencing
• Audio/video receiver • Smart lighting control • Ruggedized HMI systems
• Immersive audio products • Climate and building access • Machine visual inspection and • Digital kiosk and signage
control (e.g. video doorbell) robotic controller • Vision payment systems
• Wireless or networked smart
speakers • Wi-Fi enabled IoT gateway • Factory automation • Mobile patient care, e.g.
• Voice-assisted products • Smart connected appliances • Test and measurement infusion pump, respirator,
• Service robot, e.g. vacuum, home monitoring systems
• Media OTT box • Mobility and logistics
mower, cleaner • Blood pressure monitor
• Two-way video calling • Industrial gateways
• Elevator control panel • Activity/wellness monitor
• Fleet analytics and driver • Exercise equipment
monitoring

EXTERNAL 26
I . M X 8 M M I N I K E Y F E AT U R E S

Secure, Connected, Intelligent Edge Processing

Power Efficient Media-rich: Video, Size- and Cost- Industrial and

and Scalable Graphics, Audio, optimized System Commercial,
Performance User Interface Design Longevity of Supply
• Built in performance-efficient • Cost-effective machine- • Full-featured packages with • -40C to 105C (junction) and
14LPC FinFET learning & inference using cost-effective PCB design Industrial-tier qualification
• Single-, dual- or quad-core Cortex-A53 references (6-8 layer board (10yrs, continuous ON)
Cortex-A53 cores up to 1.8 • Up to 1080p60 video design and no microvias) • Minimum 10 year supply
GHz per core decoding and encoding • LPDDR4 for highest longevity on commercial and
• Cortex-M4 up to 400MHz for • Integrated GPUs for 1080p performance and lowest industrial devices
task offload, power media UI power, or DDR3L and DDR4 • Gigabit Ethernet with
optimizations, security • MIPI 1080p60 display and for lowest system cost IEEE1588 and AVB support
• Pin-compatible with i.MX 8M camera interfaces • Direct connection of PDM • Fanless design for reduced
Nano applications processor • 20+ channels of audio with microphones (no CODEC) cost in high temperature
certified Dolby ATMOS and • Linux/Android/FreeRTOS environments
DTS codec implementations BSP and solutions software

EXTERNAL 27
I . M X 8 M M I N I TA R G E T A P P L I C AT I O N S

Consumer Audio, Home & Building Industrial & Machine Consumer &
Video & Voice Automation Vision Healthcare
• Portable audio devices • Smart appliances • Barcode or image scanner • IP phones
• Networked speakers • Video doorbell • Industrial printer • Conferencing systems
• Wireless speakers • Smart lighting control • Ruggedized HMI • Mobile patient care, e.g.
• Voice assistance • HVAC climate control • Machine visual inspection infusion pump, respirator

• Soundbars • IoT gateway • Factory automation • Blood pressure monitor

• Audio/video receiver • Two-way video calling • Test and measurement • Activity/wellness monitor

• Public address systems • Service robot, e.g. vacuum, • Mobility and logistics • Exercise equipment w/
mower, cleaner display and video

• Elevator control panel

EXTERNAL 28
i.MX 8M MINI EVALUATION KITS
Part Numbers:
AVAILABLE 1. Config 1: 8MMINILPD4-EVK 8M Mini / LPDDR4 / eMMC / Type1PJ (QCA9377)
2. Config 2: 8MMINID4-EVK 8M Mini / DDR4 / NAND/SD / Type1MW (CYW43455)

EVK: Compute Module EVK: Base Board

• NXP i.MX 8M Mini Quad • Same base board for i.MX 8M Mini
• Wi-Fi/BT module: and i.MX 8M Nano. • Linux 4.14, 4.19, 5.4
• Murata Type 1PJ • Display Connector: 1x mini-SAS • Android 9, Android 10
(QCA9377) MIPI-DSI • FreeRTOS (Cortex-M)
• Dual band 2.4G/5G • Camera connector:1x mini-SAS • Others: 3rd parties
• 802.11a/b/g/n/ac MIPI-CSI
(1x1) • Audio DAC (WM8524)
• BT/BLE 4.1 • Microphone/headphone jacks
• Murata Type 1MW • 1x full-size SD/MMC card slot
Kit Contents (CYW43455) • 10/100/1000 Ethernet port OV5640 5Mpix
• i.MX 8M Mini board. • Dual band 2.4G/5G (AR8031 Gigabit PHY) MIPI CSI camera
• MIPI-DSI to HDMI adapter board • 802.11a/b/g/n/ac • 1x USB 3.0 Type C miniSAS based
with 8” mini-SAS cable. (1x1) • Connectivity expansion connector: MINISASTOCSI
• USB Micro-B cable. • BT/BLE 5.0 • M.2 connector (PCIe)
• USB Type-C cable. • PMIC: Rohm • Audio expansion connector: OLED
• USB Type-C to A adapter. BD71847AMWV • FPC 0.5mm pitch 60pin ZIF MIPI DSI panel
• USB Type C power supply. • 2GB LPDDR4 or DDR4 • UART, I2S miniSAS based
• Android BSP image pre- • 16GB eMMC 5.1 or NAND • General purpose expansion 5.5”, 1920 x 1080
programmed. (socket) connector (RPI-like): MX8-DSI-OLED1
• 64MB QSPI Flash • UART, I2S
• 8-layer PCB, No HDI • NXP PN7150RPI board
Blue text = Differences • Size 2”x2” supported via this interface
• Not sold separately. • Size 4.2”x4.2” EXTERNAL 29
I . M X 8 M N A N O K E Y F E AT U R E S

Secure, Connected, Intelligent Edge Processing

Power Efficient Media-rich: Video, Size- and Cost- Industrial and

and Scalable Graphics, Audio, optimized System Commercial,
Performance User Interface Design Longevity of Supply
• Built in performance-efficient • Cost-effective machine- • Full-featured packages with • -40C to 105C (junction) and
14LPC FinFET learning & inference using cost-effective PCB design Industrial-tier qualification
• Single-, dual- or quad-core Cortex-A53 or GPU references (6-8 layer board (10yrs, continuous ON)
Cortex-A53 cores up to 1.5 • Integrated GPU* for 1080p design and no microvias) • Minimum 15 year supply
GHz per core media UI • LPDDR4 for highest longevity on commercial and
• Cortex-M7 up to 750MHz for • MIPI 1080p60 display and performance and lowest industrial devices
task offload, power camera* interfaces power, or DDR3L and DDR4 • Gigabit Ethernet with
optimizations, security • 20+ channels of audio with for lowest system cost IEEE1588 and AVB support
• Pin-compatible with i.MX 8M certified Dolby ATMOS and • Direct connection of PDM • Fanless design for reduced
Mini applications processor DTS codec implementations microphones (no CODEC) cost in high temperature
• Hardware ASRC for audio • Linux/Android/FreeRTOS environments
BSP and solutions software

*Not available on all product versions

EXTERNAL 30
I . M X 8 M N A N O TA R G E T A P P L I C AT I O N S

Consumer Audio, Home & Building Industrial & Machine Consumer &
Video & Voice Automation Vision Healthcare
• Portable audio devices • Smart appliances • Barcode or image scanner • Mobile patient care, e.g.
• Networked speakers • Video doorbell • Industrial printer infusion pump, respirator

• Wireless speakers • Smart lighting control • Ruggedized HMI • Blood pressure monitor

• Voice assistance • HVAC climate control • Machine visual inspection • Activity/wellness monitor

• Soundbars • IoT gateway • Factory automation • Exercise equipment w/

display and video
• Audio/video receiver • Service robot, e.g. vacuum, • Test and measurement
• Public address systems mower, cleaner • Mobility and logistics
• Elevator control panel

EXTERNAL 31
I . M X 8 M N A N O E VA L U AT I O N K I T
Part Number:
8MNANOLPD4-EVK i.MX 8M Nano / LPDDR4 / eMMC / NXP 88W8987 Wi-Fi/BT module

EVK: Compute Module EVK: Base Board

• NXP i.MX 8M Nano Quad • Same base board for i.MX 8M Mini
• NXP Wi-Fi/BT module: and i.MX 8M Nano. • Linux 5.4
• Azurewave (AW- • Display Connector: 1x mini-SAS • Android Q
CM358SM) module based MIPI-DSI • FreeRTOS (Cortex-M)
on NXP 88W8987 Wi- • Camera connector:1x mini-SAS • Others: 3rd parties
Fi/BT solution MIPI-CSI
• 2.4/5 GHz Dual-Band • Audio DAC (WM8524)
1x1 Wi-Fi® 5 • Microphone/headphone jacks
(802.11ac) • 1x full-size SD/MMC card slot
Kit Contents • BT/BLE 5.0 • 10/100/1000 Ethernet port OV5640 5Mpix
• i.MX 8M Nano board. • NXP PMIC PCA9450B (AR8031 Gigabit PHY) MIPI CSI camera
• MIPI-DSI to HDMI adapter board • NXP PMIC reference • 1x USB 3.0 Type C miniSAS based
with 8” mini-SAS cable. schematics posted on • Connectivity expansion connector: MINISASTOCSI
• USB Micro-B cable. nxp.com • Audio expansion connector:
• USB Type-C cable. • FPC 0.5mm pitch 60pin ZIF OLED
• USB Type-C to A adapter. • 2GB LPDDR4 • UART, I2S MIPI DSI panel
• USB Type C power supply. • 32GB eMMC 5.1 • General purpose expansion miniSAS based
• Android BSP image pre- • 64MB QSPI Flash connector (RPI-like): 5.5”, 1920 x 1080
programmed. • 6-layer PCB, No HDI • UART, I2S MX8-DSI-OLED1
• Size 2”x2.7” • NXP PN7150RPI board
• Not sold separately. supported via this interface
• Size 4.2”x4.2”
EXTERNAL 32
 Differences to i.MX 8M Mini

i.MX 8M NANO ULTRALITE

Security Main CPU Platform Connectivity & I/O
Feature Highlights: S/PDIF Rx & Tx,
− Arm Cortex-A53 platform: 5x SAI (10Tx + 10Rx I2S lanes)
TrustZone
− Quad/Dual/Solo 1.2-1.4GHz Quad/Dual Corte-A53 Up to 49.152MHz BCLK
Quad/Dual ortex-A53
Quad Cortex-A53 TDM, DSD512
− 32KB/32KB I/D cache, 512KB L2 cache with ECC DRM Ciphers 32KB I-cache 32KB D-cache
32KB I-cache 32KB D-cache
− Media Processing Engine (MPE) with NEON 32KB I-cache 32KB D-cache 8ch PDM Input
32KB I-cache 32KB D-cache
Secure Clock NEON FPU
− Floating Point Unit (FPU) supports VFPv4-D16 architecture NEON FPU
NEON FPU 1Gb Ethernet
− 64-bit Armv8-A architecture NEON FPU
eFuse Key Storage (IEEE 1588, EEE & AVB)
− Arm Cortex-M7 platform:
− Up to 750 MHz Random Number 512KB L2 Cache 1x USB2.0 OTG + PHY
− 256KB TCM
Low Power, Security CPU
− On-Chip RAM: 512KB OCRAM 32KB Secure RAM 4x UART 5Mbps

− External Memory Interface:

− 16-bit DRAM interfaces (LPDDR4-3200, DDR4-2400, DDR3L-1600) Cortex-M7 4x I2C
− 8-bit NAND Flash supports raw MLC/SLC (BCH62, ONFi3.2)
System Control

− eMMC 5.0/5.1 Flash, SPI NOR Flash, FlexSPI with support for XIP 256KB TCM (SRAM) 3x SPI
Smart DMA x3
− Multimedia:
− Camera: 1x MIPI CSI (4-lane each) with PHY MIPI-CSI 4-lane with PHY
XTAL On-Chip RAM (OCRAM)
− Audio: Supports over 20 channels of audio. 5x SAI (10Tx + 10Rx external I2S lanes); up
to 49.152MHz BCLK for 768KHz audio (32-bit, 2-ch 768KHz, up to 32-ch TDM); DSD512 512KB OCRAM
PLLs
− ASRC: 32 channels of very high quality, asynchronous audio sample rate conversion
− Security: External Memory
Watchdog x3 Multimedia
− DRM support for RSA, AES, 3DES, DES
x16 LPDDR4-3200
− Connectivity: DDR4-2400, DDR3L-1600
PWM x4
− 1x USB 2.0 OTG with PHY
− 1x Gb Ethernet (MAC): AVB & IEEE 1588 for sync, and EEE for low power Timer x6 3x SDIO3.0/eMMC5.0/5.1/SD3.0
− 4x UART, 4x I2C, 3x SPI
− 3x SDIO3.0 / eMMC5.1 / SD3.0
Secure JTAG Dual-ch QuadSPI (XIP)

Temperature Sensor ASRC NAND Controller (BCH62)

Target Timeline: Q4’2020 (samples)

Package: FCBGA 11x11mm, 0.5mm pitch de-pop array
Operating Systems: Linux OS, FreeRTOS (M7)
Qualification: for consumer (0 to +85C) and industrial (-40C to +105C, 10yr 24/7) applications
Longevity: 15yr longevity program EXTERNAL 33
I . M X 8 M N A N O U LT R A L I T E E VA L U AT I O N K I T

Part Number:
8MNANOD3L-EVK i.MX 8M Nano / DDR3L / eMMC / NXP 88W8987 Wi-Fi/BT module

EVK: Compute Module EVK: Base Board

• NXP i.MX 8M Nano UL • Same base board for i.MX 8M Mini
Quad and i.MX 8M Nano. • Linux 5.4
• NXP 88W8987 Wi-Fi/BT • Camera connector:1x mini-SAS • FreeRTOS (Cortex-M)
module: MIPI-CSI • Others: 3rd parties
• Wi-Fi 5 (802.11ac) • Audio DAC (WM8524)
1x1 DB (2.5/5 GHz) • Microphone/headphone jacks
• Bluetooth 5.0 • 1x full-size SD/MMC card slot
• NXP PMIC PCA9450B • 10/100/1000 Ethernet port
(AR8031 Gigabit PHY)
Kit Contents • 1GB DDR3L • 1x USB 3.0 Type C OV5640 5Mpix
• i.MX 8M Nano UltraLite (UL) board • 32GB eMMC 5.1 • Connectivity expansion connector: MIPI CSI camera
• USB Micro-B cable • 32MB QSPI NOR • Audio expansion connector: miniSAS based
• USB Type-C cable • 6-layer PCB, No HDI • FPC 0.5mm pitch 60pin ZIF MINISASTOCSI
• USB Type-C to A adapter • Size 2”x2.7”, 6 layer • UART, I2S
• USB Type C power supply • Not sold separately • General purpose expansion
• Linux BSP image pre-programmed connector (RPI-like):
• UART, I2S
• NXP PN7150RPI board
supported via this interface
• Size 4.2”x4.2”, 8 layer

EXTERNAL 34
I . M X 8 M P L U S K E Y F E AT U R E S

High-Performance Machine Learning, Advanced Connectivity

Power-Efficient Vision & Voice Multimedia & Interfaces

High-Performance Machine Learning Video: Display Interfaces

• Dual/Quad-core Cortex-A53 • Neural Network Accelerator up • 1080p60 video decoding • 1x MIPI-DSI
cores up to 1.8 GHz; to 2.3TOPS (H.265, H.264, VP9, VP8) • 1x HDMI 2.0b Tx (+eARC)
• Cortex-M7 up to 800MHz (task Vision System • 1080p60 video encoding • LVDS (4/8-lane) Tx
offload, power optimizations) • Camera (up to 2 cameras): (H.265, H.264)
• Up to 3 display simultaneously
• 3D GPU and VPU enables • 2x MIPI-CSI (4 lanes each, • 2D and 3D GPU High Speed Interfaces
efficient video and display 1080p) Audio: • 3x SDIO 3.0 for boot / storage /
• DDR3L, DDR4, LPDDR4 • Camera ISP: 2x187MPix or • 18x I2S TDM (32-bit @ Wi-Fi (max flexibility)
(Inline ECC) 1x375MPix scale, de-warp 768KHz),
• 1x PCIe 3.0 to connect to high-
Power-Efficiency Low-Power Voice • DSD512, performing Wi-Fi solutions and
• Dynamic Voltage Frequency • Low Power Voice Accelerator • SP/DIF Tx + Rx other systems
Scaling (DVFS), power gating,
• 8-ch PDM Mic input • 2x Gigabit Ethernet with IEEE
clock gating.
• HDMI 2.0b Tx + eARC 1588, AVB (one with TSN, one
• Built in 14nm FinFET LPC with IEEE)
technology for low-power & high- • ASRC
• 2x USB 3.0/2.0 OTG with PHY
performance • 8ch PDM DMIC input for
voice capture • 2x CAN-FD

Public EXTERNAL 35
 I . M X 8 M P L U S TA R G E T A P P L I C AT I O N S

Machine Learning & Industrial Smart Home, Building, Consumer & Pro Audio Voice
Automation and City Systems
• Machine Vision and Robot Controller • Safety, Security and Surveillance • Surround sound and sound bars
• Industrial Computer, Gateways, HMI • Fleet Analytics and Driver Monitor • Audio/video receiver
• Printers and Scanners • Traffic Monitor and Flow Optimization • Immersive Audio Products
• Machine Visual Inspection • Vision Payment Systems • Wireless or networked smart speakers
• Factory Automation • Targeted Advertisement • Personal Assistant
• Service Drones • Voice-assisted products
• Alarm and AI Server Hubs
• Home Patient and Elderly Monitor

EXTERNAL 36
E N A B L I N G A W O R L D T H AT A N T I C I PAT E S A N D A U T O M AT E S

GREENER SAFER & SECURE PRODUCTIVE

Comprehensive edge processing portfolio with security built in

EXTERNAL 37
 STREAMING RICH 2D & 3D ADVANCED VOICE TOUCH VISION
MEDIA GRAPHICS AUDIO PROCESSING SENSING

HIGH PERFORMANCE – FROM SINGLE TO MANY CORE CONFIGURATIONS

*Compared to Predecessor
EXTERNAL 38
 Learn more at: www.NXP.com/prosupport

PROFESSIONAL SUPPORT Accelerated Time to Market

• Fast answers: Prioritized response in 1 business day
NXP experts answer your • Direct access to Expert Knowledge: Secure and
questions confidential support portal, managed and staffed by
experienced, knowledgeable resources
• Hot Fixes: Direct resolution
Private and timely responses
to accelerate your time to Supported platforms
market • Android and Linux OS
• FreeRTOS and MQX RTOS
• i.MX, Kinetis & LPC product families
A Few Case Examples:
•Add hooks / features to BT stack on a Kinetis Annual subscriptions
KW30/40z • 50, 100 and 200-hour options
•CPU Performance improvement on the LPC4370 • Flexibility to customize support packages to meet
when processing data from its high speed ADC your platform needs
•Port the (automotive) S12Z ultrasonic reference
design over to a KL27Z. Benefits of Professional Support
•Multiple Board bring-up projects • Extends to the customer environment
•STM to LPC code migration • Available for current and previous SW/HW products
• Accelerates design win with pre-sales engagement
•… And many others!
• Bridges gaps between Standard Enablement and
Customer Specific Needs
EXTERNAL 39
 PROFESSIONAL SERVICES
Software Services
GFX Services − Custom SW development / Support on Client
− 2D/3D Graphics system architecture setup
consultancy (performance, benchmark, − BSP, drivers/stacks:
prototyping) on different OSes (ex: Linux, − Development / Porting / Migration/
Android, Integrity, MQX, FreeRTOS) or on Integration
bare-metal. − Customization / Optimization
− Algorithm acceleration with OpenCL, − Feature dvpt & Acceleration
OpenMP (multicore), OpenCV and Neon. FreeRTOS
− Testing / Validation
− OpenGL ES, WebGL and OpenVG MQX − Frozen branch services
application optimization (Shader GLSL, − Application migration / Specific hardening
Texture, Geometry). − Security: boot, OTA, certification. Cloud services
− OpenGL ES custom extension and Feature
development.
− 2D/3D/VG Graphics and Video
application/middleware/driver support and
debug. Workshop/ Consulting Services
− Windowing/Compositing/GUI system porting − Issue analysis, Debug & Fix
and acceleration (X11/ Wayland/ − Custom Workshop (GFX, Power
SurfaceFlinger) Management, Security, etc..)
− GPU driver porting to OS (i.e. not standard − Customer debug/ optimization camp
NXP BSP release).
− Custom GPU driver hardening (Apps,
platform and use case specific) Dedicated Project Management Focused on Entire Project
• Reducing project risk Experienced Engineers Simplify the Complex & Transfer Knowledge
• Increasing team efficiency Fill Technical Competency Skills Gaps
• Securing time to market Enable Customers to Focus on Their Core Differentiation
EXTERNAL 40
PRO-SUPPORT AND SERVICES – PLATFORM CUSTOMIZATION

Experts in Providing Customer Specific Platforms

• Support on Customer Specific Boards

• Extend NXP Software Offerings to Meet Customer Application Needs
• Optimize Drivers and Subsystems Based on Product Use Cases
• Integrate NXP and Partner Software Solutions
• Application Specific Testing & Debugging of Low Level Drivers
• Backporting Fixes and Features
• Long-term Maintenance and Support
• Demos and Proof of Concept Projects

Learn more at: www.NXP.com/proservices

EXTERNAL 41
HARDWARE DESIGN AND SUPPORT

Save Time and Resources with our Hardware Expertise

• Options range from review of your design to complete board development

• Review can include schematic, PCB layout and simulation services
• Layout review includes best practices and NXP specific requirements
• Simulation can include power, signal integrity, thermal and high-speed interfaces
• Our board designers are proficient in high-speed, multi layer, NXP designs
− Cost optimized, delivered on-time and meet quality requirements.
− Design: CAD, Schematics, Layout, Component Library (NCL)
− Package-Board Co-Design: Ball maps, routing efficiencies
− Compliance: FCC, CE, RoHS, Import/Export, PSE
− Learn more at: www.NXP.com/prosupport

EXTERNAL 42
 NXP Scalable Processing Continuum
Unified NXP Long Term Linux, RTOS,
Graphics and Security Software Support
Performance

Partner support for Commercial

i.MX RT
+ Linux OS, RTOS and other solutions

Functional Integration
EXTERNAL 43
STRONGEST OPERATING SYSTEMS FOR NXP PROCESSORS
Supplier Arm Cortex-A cores Arm Cortex-A cores Arm Cortex-M cores
Layerscape processors i.MX 6, 7 & 8 series LPC & Kinetis MCUs;
i.MX RT, 6SoloX, 7 & 8 series
NXP Semiconductor Yocto Linux® OS; Ubuntu; Linux Long Term Support (LTS) FreeRTOS (complementary);
Open Industrial Linux OS, supported in the Yocto MQX RTOS (commercial);
(OpenIL); OpenWRT Project; Android OS Zephyr (i.MX RT now, i.MX 8 future)
Mentor Embedded Linux OS; Nucleus RTOS Linux OS; Nucleus RTOS Nucleus RTOS
QNX Neutrino® RTOS Neutrino RTOS -
Green Hills INTEGRITY® RTOS INTEGRITY RTOS u-VelOSity RTOS
Wind River Linux OS; VxWorks® RTOS Linux OS; VxWorks RTOS VxWorks RTOS
Microsoft Windows Embedded WindowsCE; Win10 IoT; Azure RTOS (formerly ThreadX)
(Express Logic) Azure RTOS (formerly ThreadX)
Micrium (Silicon Labs) - uC/OS II / III RTOS, Micrium OS uC/OS II / III RTOS, Micrium OS
Timesys, Canonical… Commercial Linux Commercial Linux -
DDCI, Sysgo… Commercial RTOS DEOS RTOS, Pike OS… -

EXTERNAL 44
i.MX Yocto Project Enablement
Commitment: 10 versions released over the past 8 years, with 16 LTS kernel versions supported
Community Acceptance: Align NXP releases with community release support
Continued support: Upgrade of Yocto version on a bi-annual cadence
IVI Foundation: Demos to support integration of Automotive Grade Linux (AGL) and GENIVI meta-layers
Entertainment: Demos to support integration of Kodi/XBMC meta-layers
Connectivity: Demos to support Modular IoT Gateway
Cloud: Demos to support AWS Greengrass, Azure IoT Edge, EdgeScale and Over-the-air (OTA) updates
Machine Learning : Demos to support Machine Learning

EXTERNAL 45
I . M X L I N U X R O AD M AP

Yocto Project 3.2– “Gatesgarth”

L5.10-X.X-2.1.0 L5.10.X-2.2.0 L5.10.X-2.3.0

LF5.10.X-1.0.0
8ULP Beta 8ULP Beta2 8ULP GA

L5.10.X-2.0.0
8ULP Alpha

Yocto Project 3.0– “Zeus”

L5.4.3-2.0.0 L5.4.24-2.1.0 L5.4.47-2.2.0 L5.4.70-2.3.0 L5.4.70-2.3.1

8M Plus Beta1
8M Plus and 8DXL Alpha 8M Plus Beta2 8M Plus GA
8DXL Alpha 8DXL Beta 8DXL GA
LF 5.4.3-1.0.0
8QXP B0 8QXP C0 Beta

J F M A M J J A S O N D J F M A M J J A S O N D
1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q
2020 2021
GA Linux 5.4.X Supported i.MX 8M Nano i.MX 8DualXLite
Release Planning
Production Kernel Platforms i.MX 8QuadMax, i.MX 8QuadPlus i.MX 8M Plus
Execution 5.10.X
Schedule Alpha i.MX 8QuadXPlus, i.MX 8DualX i.MX 8ULP

Shipping (i.MX 8M Quad,and i.MX 8M Mini)

Shipping i.MX 6 and i.MX 7 EXTERNAL 46

I.MX PMIC SOLUTIONS

EXTERNAL 48
P M I C F E AT U R E S A N D B E N E F I T S

• Proven Robustness, lower risk & shorter time to market

− Co-developed with MCU team
− Support i.MX scalability
− BSP available
• Reduce functional safety development effort
− System level functional safety
− Scalable Functional safety
• Reduce system cost
− Scalable Architectures
− OTP Try before buy
− Optimize BOM size
• Minimize EMC radiations
− Multiple frequency tuning optimization (Spread Spectrum, freq sync, Manual
tuning)
Find more details on Power Management solution at :
• PMIC Golden presentation

EXTERNAL 49
 I . M X & P M I C M AT C H

i.MX 6UL i.MX 6SL i.MX 6SX i.MX i.MX 7SD i.MX 7ULP i.MX 8M i.MX 8M i.MX 8M i.MX 8X i.MX 8XL i.MX i.MX
i.MX 6ULL i.MX 6SLL 6S/D/Q Mini Nano 8QM RT500/600
i.MX 6LZ i.MX 6DL Plus 107x
i.MX D/QP

PF0100 BSP BSP

P2P

PF0200 BSP

PF3000/01 Patch Patch Patch BSP

P2P

PF1550/10 Patch BSP RD

PF4210 BSP

PF8200 BSP BSP

PF8121 BSP

PF7100 BSP

PCA9420 RD

PCA9450 Patch BSP

B = BSP Available aligned with MCU

P = Patch Available from apps support
RD: Reference Design from NXP or 3rd party

EXTERNAL 50
EXTERNAL 51