Silergy Corp SY8009BABC - C79314
Silergy Corp SY8009BABC - C79314
Temperature Code
Package Code Applications
Optional Spec Code
• LCD TV
Temperature Range: -40°C to 85°C
• Set Top Box
• Net PC
Ordering Number Package type Note①
• Mini-Notebook PC
SY8009AAAC SOT23-5 1.5A
• Access Point Router
SY8009BABC SOT23-6 2A
SY8009BEBC SSOT23-6 2A
Typical Applications
96
VOUT=1.8V
94
ON/ OFF
92
EN
Efficiency (%)
L
VIN 90
VOUT
IN LX
88
CIN R1
C1(opt.) 86
FB COUT VIN=3.3V
GND 84
VIN=4.2V
R2 82
VIN=5.5V
80
0 0.4 0.8 1.2 1.6 2
Load Current (A)
Figure 1.Schematic diagram Figure 2. Efficiency vs Load Current
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EN 1 6 FB
GND 2 5 NC
LX 3 4 IN
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Electrical Characteristics
(VIN = 5V, VOUT = 2.5V, L = 2.2uH, COUT = 10uF, TA = 25°C, unless otherwise specified)
Note 1: Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device.
These are for stress ratings. Functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may remain possibility to affect device reliability.
Note 2: θ JA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity
test board of JEDEC 51-3 thermal measurement standard. Pin 2 of SOT23-5/SOT23-6/SSOT23-5 packages is the
case position for θ JC measurement.
Note 3: The device is not guaranteed to function outside its operating conditions.
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Startup Shutdown
(Vin=5.0V, Vout=1.8V,Iload=2A) (Vin=5.0V, Vout=1.8V,Iload=2A)
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TC(°C)
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Operation
SY8009 is a synchronous buck regulator IC that integrates the PWM control, top and bottom switches on the same die to
minimize the switching transition loss and conduction loss. With ultra low RDS(ON) power switches and proprietary PWM control,
this regulator IC can achieve the highest efficiency and the highest switch frequency simultaneously to minimize the external
inductor and capacitor size, and thus achieving the minimum solution footprint.
Applications Information
Because of the high integration in the SY8009 IC, the application circuit based on this regulator IC is rather simple. Only input
capacitor CIN, output capacitor COUT, output inductor L and feedback resistors (R1 and R2) need to be selected for the targeted
applications specifications.
Output inductor L:
There are several considerations in choosing this inductor.
1) Choose the inductance to provide the desired ripple current. It is suggested to choose the ripple current to be
about 40% of the maximum output current. The inductance is calculated as:
V (1 − VOUT /VIN, MAX )
L = OUT
FSW × IOUT, MAX × 40%
where Fsw is the switching frequency and IOUT,MAX is the maximum load current.
The SY8009 regulator IC is quite tolerant of different ripple current amplitude. Consequently, the final choice of
inductance can be slightly off the calculation value without significantly impacting the performance.
2) The saturation current rating of the inductor must be selected to be greater than the peak inductor current under
full load conditions.
VOUT(1-VOUT/VIN,MAX)
ISAT, MIN > IOUT, MAX +
2 ⋅ FSW ⋅ L
3) The DCR of the inductor and the core loss at the switching frequency must be low enough to achieve the desired
efficiency requirement. It is desirable to choose an inductor with DCR<50mΩ to achieve a good overall efficiency.
Layout Design:
The layout design of SY8009 regulator is relatively simple. For the best efficiency and minimum noise problems, we
should place the following components close to the IC: CIN, L, R1 and R2.
1) It is desirable to maximize the PCB copper area connecting to GND pin to achieve the best thermal and noise
performance. If the board space allowed, a ground plane is highly desirable.
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2) CIN must be close to Pins IN and GND. The loop area formed by CIN and GND must be minimized.
3) The PCB copper area associated with LX pin must be minimized to avoid the potential noise problem.
4) The components R1 and R2, and the trace connecting to the FB pin must NOT be adjacent to the LX net on the
PCB layout to avoid the noise problem.
5) If the system chip interfacing with the EN pin has a high impedance state at shutdown mode and the IN pin is
connected directly to a power source such as a LiIon battery, it is desirable to add a pull down 1MΩ resistor between
the EN and GND pins to prevent the noise from falsely turning on the regulator at shutdown mode.
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0.55
2.80 - 3.10
2.40
1.50 - 1.70
2.70 - 3.00
0.80
0.01 - 0.1
0.25 REF
1.0 - 1.3
0.1 - 0.15
0.95 TYP
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1.90
2.50 - 3.00
2.30 - 2.50
2.40
1.00
2.95 - 3.10
0.01 - 0.10
0.90 - 1.00
0.10 - 0.20
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