SC 16 Is 750
SC 16 Is 750
1. General description
The SC16IS740/750/760 is a slave I2C-bus/SPI interface to a single-channel high
performance UART. It offers data rates up to 5 Mbit/s and guarantees low operating and
sleeping current. The SC16IS750 and SC16IS760 also provide the application with 8
additional programmable I/O pins. The device comes in very small HVQFN24, TSSOP24
(SC16IS750/760) and TSSOP16 (SC16IS740) packages, which makes it ideally suitable
for hand-held, battery operated applications. This family of products enables seamless
protocol conversion from I2C-bus or SPI to and RS-232/RS-485 and are fully bidirectional.
The SC16IS760 differs from the SC16IS750 in that it supports SPI clock speeds up to
15 Mbit/s instead of the 4 Mbit/s supported by the SC16IS750, and in that it supports
IrDA SIR up to 1.152 Mbit/s. In all other aspects, the SC16IS760 is functionally and
electrically the same as the SC16IS750. The SC16IS740 is functionally and electrically
identical to the SC16IS750, with the exception of the programmable I/O pins which are
only present on the SC16IS750.
2. Features
3. Applications
■ Factory automation and process control
■ Portable and battery operated devices
■ Cellular data devices
1. Please note that IrDA SIR at 1.152 Mbit/s is not compatible with IrDA MIR at that speed. Please refer to application notes for usage
of IrDA SIR at 1.152 Mbit/s.
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4. Ordering information
Table 1: Ordering information
Type number Package
Name Description Version
SC16IS740IPW TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
SC16IS750IBS HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; SOT616-3
24 terminals; body 4 × 4 × 0.85 mm
SC16IS750IPW TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1
SC16IS760IBS HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; SOT616-3
24 terminals; body 4 × 4 × 0.85 mm
SC16IS760IPW TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1
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5. Block diagram
VDD
SC16IS750/760
RESET
SCL TX
16C450
SDA COMPATIBLE RX
A0 REGISTER RTS
I2C-BUS SETS
A1 CTS
IRQ
1 kΩ (3.3 V)
1.5 kΩ (2.5 V)
4
VDD GPIO[3:0]
VDD
SC16IS740
RESET
SCL TX
16C450
SDA COMPATIBLE RX
A0 REGISTER RTS
I2C-BUS SETS
A1 CTS
IRQ
1 kΩ (3.3 V)
1.5 kΩ (2.5 V)
VDD
VDD
I2C/SPI
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VDD
SC16IS750/760
RESET
SCLK TX
16C450
CS COMPATIBLE RX
SO REGISTER RTS
SPI SETS
SI CTS
IRQ
1 kΩ (3.3 V)
1.5 kΩ (2.5 V)
4
VDD GPIO[3:0]
GPIO GPIO4/DSR
I2C/SPI REGISTER GPIO5/DTR
GPIO6/CD
GPIO7/RI
002aab396
XTAL1 XTAL2 VSS
VDD
SC16IS740
RESET
SCLK TX
16C450
CS COMPATIBLE RX
SO REGISTER RTS
SPI SETS
SI CTS
IRQ
1 kΩ (3.3 V)
1.5 kΩ (2.5 V)
VDD
I2C/SPI
002aab972
XTAL1 XTAL2 VSS
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6. Pinning information
6.1 Pinning
002aab973 002aab974
002aab016 002aab399
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19 GPIO6/CD
19 GPIO6/CD
20 GPIO7/RI
20 GPIO7/RI
22 CTS
21 RTS
22 CTS
21 RTS
24 RX
24 RX
terminal 1 terminal 1
23 TX
23 TX
index area index area
VDD 10
IRQ 11
GPIO0 12
7
8
9
7
8
9
A1
n.c.
SCL
SI
SO
SCLK
002aab015 002aab401
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7. Functional description
The UART will perform serial-to-I2C conversion on data characters received from
peripheral devices or modems, and I2C-to-serial conversion on data characters
transmitted by the host. The complete status the SC16IS740/750/760 UART can be read
at any time during functional operation by the host.
The SC16IS740/750/760 can be placed in an alternate mode (FIFO mode) relieving the
host of excessive software overhead by buffering received/transmitted characters. Both
the receiver and transmitter FIFOs can store up to 64 characters (including three
additional bits of error status per character for the receiver FIFO) and have selectable or
programmable trigger levels.
The SC16IS740/750/760 has selectable hardware flow control and software flow control.
Hardware flow control significantly reduces software overhead and increases system
efficiency by automatically controlling serial data flow using the RTS output and CTS input
signals. Software flow control automatically controls data flow by using programmable
Xon/Xoff characters.
The UART includes a programmable baud rate generator that can divide the timing
reference clock input by a divisor between 1 and (216 – 1).
With auto-CTS, CTS must be active before the UART can transmit data.
Auto-RTS only activates the RTS output when there is enough room in the FIFO to receive
data and de-activates the RTS output when the RX FIFO is sufficiently full. The halt and
resume trigger levels in the TCR determine the levels at which RTS is
activated/deactivated. If TCR bits are cleared then selectable trigger levels in FCR are
used in place of TCR.
If both auto-CTS and auto-RTS are enabled, when RTS is connected to CTS, data
transmission does not occur unless the receiver FIFO has empty space. Thus, overrun
errors are eliminated during hardware flow control. If not enabled, overrun errors occur if
the transmit data rate exceeds the receive FIFO servicing latency.
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UART 1 UART 2
SERIAL TO RX TX PARALLEL
PARALLEL TO SERIAL
RX TX
FIFO FIFO
FLOW RTS CTS FLOW
CONTROL CONTROL
PARALLEL TX RX SERIAL TO
TO SERIAL PARALLEL
TX RX
FIFO FIFO
FLOW CTS RTS FLOW
CONTROL CONTROL
002aab656
7.2.1 Auto-RTS
Figure 9 shows RTS functional timing. The receiver FIFO trigger levels used in auto-RTS
are stored in the TCR or FCR. RTS is active if the RX FIFO level is below the halt trigger
level in TCR[3:0]. When the receiver FIFO halt trigger level is reached, RTS is deasserted.
The sending device (for example, another UART) may send an additional character after
the trigger level is reached (assuming the sending UART has another character to send)
because it may not recognize the deassertion of RTS until it has begun sending the
additional character. RTS is automatically reasserted once the receiver FIFO reaches the
resume trigger level programmed via TCR[7:4]. This reassertion allows the sending
device to resume transmission.
RTS
receive
1 2 N N+1
FIFO
read
002aab040
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7.2.2 Auto-CTS
Figure 10 shows CTS functional timing. The transmitter circuitry checks CTS before
sending the next data byte. When CTS is active, the transmitter sends the next byte. To
stop the transmitter from sending the following byte, CTS must be deasserted before the
middle of the last stop bit that is currently being sent. The auto-CTS function reduces
interrupts to the host system. When flow control is enabled, CTS level changes do not
trigger host interrupts because the device automatically controls its own transmitter.
Without auto-CTS, the transmitter sends any data present in the transmit FIFO and a
receiver overrun error may result.
CTS
002aab041
(1) When CTS is LOW, the transmitter keeps sending serial data out.
(2) When CTS goes HIGH before the middle of the last stop bit of the current character, the transmitter finishes sending the
current character, but it does not send the next character.
(3) When CTS goes from HIGH to LOW, the transmitter begins sending data again.
Fig 10. CTS functional timing
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There are two other enhanced features relating to software flow control:
• Xon Any function (MCR[5]): Receiving any character will resume operation after
recognizing the Xoff character. It is possible that an Xon1 character is recognized as
an Xon Any character, which could cause an Xon2 character to be written to the RX
FIFO.
• Special character (EFR[5]): Incoming data is compared to Xoff2. Detection of the
special character sets the Xoff interrupt (IIR[4]) but does not halt transmission. The
Xoff interrupt is cleared by a read of the IIR. The special character is transferred to the
RX FIFO.
7.3.1 RX
When software flow control operation is enabled, the SC16IS740/750/760 will compare
incoming data with Xoff1/Xoff2 programmed characters (in certain cases, Xoff1 and Xoff2
must be received sequentially). When the correct Xoff characters are received,
transmission is halted after completing transmission of the current character. Xoff
detection also sets IIR[4] (if enabled via IER[5]) and causes IRQ to go LOW.
7.3.2 TX
Xoff1/Xoff2 character is transmitted when the RX FIFO has passed the HALT trigger level
programmed in TCR[3:0] or the selectable trigger level in FCR[7:6]
Xon1/Xoff2 character is transmitted when the RX FIFO reaches the RESUME trigger level
programmed in TCR[7:4] or RX FIFO falls below the lower selectable trigger level in
FCR[7:6].
It is assumed that software flow control and hardware flow control will never be enabled
simultaneously. Figure 11 shows an example of software flow control.
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UART1 UART2
data
PARALLEL-TO-SERIAL SERIAL-TO-PARALLEL
Xoff–Xon–Xoff
SERIAL-TO-PARALLEL PARALLEL-TO-SERIAL
compare
Xoff2 WORD Xoff2 WORD
programmed
Xon-Xoff
characters 002aaa229
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[1] Registers DLL, DLH, SPR, XON1, XON2, XOFF1, XOFF2 are not reset by the top-level reset signal
RESET, POR or Software Reset, that is, they hold their initialization values during reset.
[2] This register is not supported in SC16IS740.
[3] Only UART Software Reset bit is supported in this register.
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7.5 Interrupts
The SC16IS740/750/760 has interrupt generation and prioritization (seven prioritized
levels of interrupts) capability. The interrupt enable registers (IER and IOIntEna) enable
each of the seven types of interrupts and the IRQ signal in response to an interrupt
generation. When an interrupt is generated, the IIR indicates that an interrupt is pending
and provides the type of interrupt through IIR[5:0]. Table 6 summarizes the interrupt
control functions.
It is important to note that for the framing error, parity error, and break conditions, LSR[7]
generates the interrupt. LSR[7] is set when there is an error anywhere in the RX FIFO,
and is cleared only when there are no more errors remaining in the FIFO. LSR[4:2] always
represent the error status for the received character at the top of the RX FIFO. Reading
the RX FIFO updates LSR[4:2] to the appropriate status for the new character at the top of
the FIFO. If the RX FIFO is empty, then LSR[4:2] are all zeros.
For the Xoff interrupt, if an Xoff flow character detection caused the interrupt, the interrupt
is cleared by an Xon flow character detection. If a special character detection caused the
interrupt, the interrupt is cleared by a read of the IIR.
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IIR
read IIR
IRQ
HOST
IER
1 1 1 1
THR RHR
002aab042
HOST
IER
0 0 0 0
THR RHR
002aab043
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• The serial data input line, RX, is idle (see Section 7.7 “Break and time-out
conditions”).
• The TX FIFO and TX shift register are empty.
• There are no interrupts pending except THR.
Remark: Sleep mode will not be entered if there is data in the RX FIFO.
In Sleep mode, the clock to the UART is stopped. Since most registers are clocked using
these clocks, the power consumption is greatly reduced. The UART will wake up when any
change is detected on the RX line, when there is any change in the state of the modem
input pins, or if data is written to the TX FIFO.
Remark: Writing to the divisor latches, DLL and DLH, to set the baud clock, must not be
done during Sleep mode. Therefore, it is advisable to disable Sleep mode using IER[4]
before writing to DLL or DLH.
A break condition is detected when the RX pin is pulled LOW for a duration longer than
the time it takes to send a complete character plus Start, Stop and Parity bits. A break
condition can be sent by setting LCR[6]. When this happens the TX pin will be pulled LOW
until LSR[6] is cleared by the software.
where:
prescaler = 1, when MCR[7] is set to ‘0’ after reset (divide-by-1 clock selected)
prescaler = 4, when MCR[7] is set to ‘1’ after reset (divide-by-4 clock selected).
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Figure 14 shows the internal prescaler and baud rate generator circuitry.
PRESCALER MCR[7] = 0
LOGIC
(DIVIDE-BY-1)
internal
XTAL1 INTERNAL BAUD RATE baud rate
OSCILLATOR input clock GENERATOR clock for
XTAL2 LOGIC LOGIC transmitter
reference and receiver
PRESCALER clock
LOGIC
(DIVIDE-BY-4) MCR[7] = 1
002aaa233
DLL and DLH must be written to in order to program the baud rate. DLL and DLH are the
least significant and most significant byte of the baud rate divisor. If DLL and DLH are both
zero, the UART is effectively disabled, as no baud clock will be generated.
Remark: The programmable baud rate generator is provided to select both the transmit
and receive clock rates.
Table 7 and Table 8 show the baud rate and divisor correlation for crystal with frequency
1.8432 MHz and 3.072 MHz, respectively.
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XTAL1 XTAL2
1.8432 MHz
C1 C2
22 pF 33 pF
002aab402
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8. Register descriptions
The programming combinations for register selection are shown in Table 9.
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0x0C IOIntEna bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 R/W
[4]
0x0D reserved reserved reserved reserved reserved reserved reserved reserved reserved
[3] [3] [3] [3] [3] [3] [3] [3] [3]
0x0E IOControl reserved reserved reserved reserved UART reserved I/O[7:4] or latch R/W
[4] [3] [3] [3] [3] software [3] RI, CD,
reset DTR, DSR
0x0F EFCR IrDA reserved auto auto reserved transmitter receiver 9-bit mode R/W
mode [3] RS-485 RS-485 [3] disable disable enable
(slow/ RTS RTS
fast) [8] output direction
inversion control
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[1] FIFO reset requires at least two XTAL1 clocks, therefore, they cannot be reset without the presence of the
XTAL1 clock.
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When the LSR is read, LSR[4:2] reflect the error bits (BI, FE, PE) of the character at the
top of the RX FIFO (next character to be read). Therefore, errors in a character are
identified by reading the LSR and then reading the RHR.
LSR[7] is set when there is an error anywhere in the RX FIFO, and is cleared only when
there are no more errors remaining in the FIFO.
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[1] MCR[7:5] and MCR[2] can only be modified when EFR[4] is set, that is, EFR[4] is a write enable.
[2] Only available on SC16IS750/SC16IS760.
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Remark: The primary inputs RI, CD, CTS, DSR are all active LOW.
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[1] IER[7:4] can only be modified if EFR[4] is set, that is, EFR[4] is a write enable. Re-enabling IER[1] will not
cause a new interrupt if the THR is below the threshold.
[2] Only available on the SC16IS750/SC16IS760.
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[1] Modem interrupt status must be read via MSR register and GPIO interrupt status must be read via IOState
register.
[2] Only available on SC16IS750/SC16IS760.
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Note that DLL and DLH can only be written to before Sleep mode is enabled, that is,
before IER[4] is set.
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TCR trigger levels are available from 0 to 60 characters with a granularity of four.
Remark: TCR can only be written to when EFR[4] = 1 and MCR[2] = 1. The programmer
must program the TCR such that TCR[3:0] > TCR[7:4]. There is no built-in hardware
check to make sure this condition is met. Also, the TCR must be programmed with this
condition before Auto-RTS or software flow control is enabled to avoid spurious operation
of the device.
Remark: TLR can only be written to when EFR[4] = 1 and MCR[2] = 1. If TLR[3:0] or
TLR[7:4] are logical 0, the selectable trigger levels via the FIFO Control Register (FCR)
are used for the transmit and receive FIFO trigger levels. Trigger levels from 4 characters
to 60 characters are available with a granularity of four. The TLR should be programmed
for N⁄4, where N is the desired trigger level.
When the trigger level setting in TLR is zero, the SC16IS740/750/760 uses the trigger
level setting defined in FCR. If TLR has non-zero trigger level value, the trigger level
defined in FCR is discarded. This applies to both transmit FIFO and receive FIFO trigger
level setting.
When TLR is used for RX trigger level control, FCR[7:6] should be left at the default state,
that is, ‘00’.
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Remark: If there is a pending input (GPIO) interrupt and IODir is written, this pending
interrupt will be cleared, that is, the interrupt signal will be negated.
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Remark: As I/O pins, the direction, state, and interrupt of GPIO4 to GPIO7 are controlled
by the following registers: IODir, IOState, IOIntEna, and IOControl. The state of CD, RI,
DSR pins will not be reflected in MSR[7:5] or MSR[3:1], and any change of state on these
three pins will not trigger a modem status interrupt (even if enabled via IER[3]), and the
state of the DTR pin cannot be controlled by MCR[0].
As modem CD, RI, DSR pins, the status at the input of these three pins can be read from
MSR[7:5] and MSR[3:1], and the state of DTR pin can be controlled by MCR[0]. Also, if
modem status interrupt bit is enabled, IER[3], a change of state of RI, CD, DSR pins will
trigger a modem interrupt. Bit[7:4] of the IODir, IOState, and IOIntEna registers will not
have any effect on these three pins.
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9. RS-485 features
To use the auto RS-485 RTS mode the software would have to disable the hardware flow
control function.
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To use the auto RS-485 mode the software would have to disable the hardware and
software flow control functions.
With the receiver initially disabled, it ignores all the data bytes (parity bit = 0) until an
address byte is received (parity bit = 1). This address byte will cause the UART to set the
parity error. The UART will generate a line status interrupt (IER bit 2 must be set to ‘1’ at
this time), and at the same time puts this address byte in the RX FIFO. After the controller
examines the byte it must make a decision whether or not to enable the receiver; it should
enable the receiver if the address byte addresses its ID address, and must not enable the
receiver if the address byte does not address its ID address.
If the controller enables the receiver, the receiver will receive the subsequent data until
being disabled by the controller after the controller has received a complete message from
the ‘master’ station. If the controller does not disable the receiver after receiving a
message from the ‘master’ station, the receiver will generate a parity error upon receiving
another address byte. The controller then determines if the address byte addresses its ID
address, if it is not, the controller then can disable the receiver. If the address byte
addresses the ‘slave’ ID address, the controller take no further action, the receiver will
receive the subsequent data.
If another address byte is received and this address byte does not match Xoff2 character,
the receiver will be automatically disabled and the address byte is ignored. If the address
byte matches Xoff2 character, the receiver will put this byte in the RX FIFO along with the
parity bit in the parity error bit (LSR bit 2).
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SDA
SCL
SDA SDA
SCL SCL
S P
The number of data bytes transferred between the START and STOP condition from
transmitter to receiver is not limited. Each byte, which must be eight bits long, is
transferred serially with the most significant bit first, and is followed by an acknowledge bit.
(see Figure 18). The clock pulse related to the acknowledge bit is generated by the
master. The device that acknowledges has to pull down the SDA line during the
acknowledge clock pulse, while the transmitting device releases this pulse (see
Figure 19).
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acknowledgement signal
from receiver
SDA
MSB
SCL S 0 1 6 7 8 0 1 2 to 7 8 P
ACK ACK
START STOP
condition byte complete, clock line held LOW condition
interrupt within receiver while interrupt is serviced
002aab012
A slave receiver must generate an acknowledge after the reception of each byte, and a
master must generate one after the reception of each byte clocked out of the slave
transmitter.
There are two exceptions to the ‘acknowledge after every byte’ rule. The first occurs when
a master is a receiver: it must signal an end of data to the transmitter by not signalling an
acknowledge on the last byte that has been clocked out of the slave. The acknowledge
related clock, generated by the master should still take place, but the SDA line will not be
pulled down. In order to indicate that this is an active and intentional lack of
acknowledgement, we shall term this special condition as a ‘negative acknowledge’.
The second exception is that a slave will send a negative acknowledge when it can no
longer accept additional data bytes. This occurs after an attempted transfer that cannot be
accepted.
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An address on the network is seven bits long, appearing as the most significant bits of the
address byte. The last bit is a direction (R/W) bit. A ‘0’ indicates that the master is
transmitting (write) and a ‘1’ indicates that the master requests data (read). A complete
data transfer, comprised of an address byte indicating a ‘write’ and two data bytes is
shown in Figure 20.
SDA
SCL S 0 to 6 7 8 0 to 6 7 8 0 to 6 7 8 P
002aab046
When an address is sent, each device in the system compares the first seven bits after the
START with its own address. If there is a match, the device will consider itself addressed
by the master, and will send an acknowledge. The device could also determine if in this
transaction it is assigned the role of a slave receiver or slave transmitter, depending on the
R/W bit.
Each node of the I2C-bus network has a unique seven-bit address. The address of a
microcontroller is of course fully programmable, while peripheral devices usually have
fixed and programmable address portions.
When the master is communicating with one device only, data transfers follow the format
of Figure 20, where the R/W bit could indicate either direction. After completing the
transfer and issuing a STOP condition, if a master would like to address some other
device on the network, it could start another transaction by issuing a new START.
Another way for a master to communicate with several different devices would be by using
a ‘repeated START’. After the last byte of the transaction was transferred, including its
acknowledge (or negative acknowledge), the master issues another START, followed by
address byte and data—without effecting a STOP. The master may communicate with a
number of different devices, combining ‘reads’ and ‘writes’. After the last transfer takes
place, the master issues a STOP and releases the bus. Possible data formats are
demonstrated in Figure 21. Note that the repeated START allows for both change of a
slave and a change of direction, without releasing the bus. We shall see later on that the
change of direction feature can come in handy even when dealing with a single device.
In a single master system, the repeated START mechanism may be more efficient than
terminating each transfer with a STOP and starting again. In a multimaster environment,
the determination of which format is more efficient could be more complicated, as when a
master is using repeated STARTs it occupies the bus for a long time and thus preventing
other devices from initiating transfers.
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data transferred
(n bytes + acknowledge)
data transferred
(n bytes + acknowledge)
combined
S SLAVE ADDRESS R/W A DATA A Sr SLAVE ADDRESS R/W A DATA A P
formats:
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10.3 Addressing
Before any data is transmitted or received, the master must send the address of the
receiver via the SDA line. The first byte after the START condition carries the address of
the slave device and the read/write bit. Table 32 shows how the SC16IS740/750/760’s
address can be selected by using A1 and A0 pins. For example, if these 2 pins are
connected to VDD, then the SC16IS740/750/760’s address is set to 0x90, and the master
communicates with it through this address.
A register write cycle is shown in Figure 22. The START is followed by a slave address
byte with the direction bit set to ‘write’, a sub-address byte, a number of data bytes, and a
STOP signal. The sub-address indicates which register the master wants to access. and
the data bytes which follow will be written one after the other to the sub-address location.
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002aab047
The register read cycle (see Figure 23) commences in a similar manner, with the master
sending a slave address with the direction bit set to ‘write’ with a following sub-address.
Then, in order to reverse the direction of the transfer, the master issues a repeated START
followed again by the device address, but this time with the direction bit set to ‘read’. The
data bytes starting at the internal sub-address will be clocked out of the device, each
followed by a master-generated acknowledge. The last byte of the read cycle will be
followed by a negative acknowledge, signalling the end of transfer. The cycle is terminated
by a STOP signal.
002aab048
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Philips Semiconductors
SCLK
SCLK
SI D7 D6 D5 D4 D3 D2 D1 D0
002aab434
SCLK
SC16IS740/750/760
SCLK
SO D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
[1] 5.5 V steady state voltage tolerance on inputs and outputs is valid only when the supply voltage is present.
4.6 V steady state voltage tolerance on inputs and outputs when no supply voltage is present.
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
[1] 5.5 V steady state voltage tolerance on inputs and outputs is valid only when the supply voltage is present. 3.8 V steady state voltage
tolerance on inputs and outputs when no supply voltage is present.
[2] XTAL2 should be left open when XTAL1 is driven by an external clock.
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
[1] A detailed description of the I2C-bus specification, with applications, is given in brochure “The I2C-bus and how to use it”. This brochure
may be ordered using the code 9398 393 40011.
[2] Minimum SCL clock frequency is limited by the bus time-out feature, which resets the serial bus interface if SDA is held LOW for a
minimum of 25 ms.
[3] Only applicable to the SC16IS750 and SC16IS760.
[4] 2 X1 clocks or 3 µs, whichever is less.
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
RESET
td15
SCL
002aab437
SCL
tBUF tf
tr tSP
SDA
002aab489
td1
GPIOn
002aab255
ACK to master
IRQ
td2 td3
MODEM pin
002aab256
Fig 28. Modem input pin interrupt (SC16IS750 and SC16IS760 only)
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
IRQ
td4 td5
GPIOn
002aab257
next
start stop start
bit bit bit
RX D0 D1 D2 D3 D4 D5 D6 D7
td6
IRQ
002aab258
IRQ
td7 002aab259
IRQ
td8
002aab260
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
1
[2] f XTAL = -------
t w3
tw2 tw1
EXTERNAL
CLOCK
tw3 002aaa112
1
f XTAL = -------
t 3w
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
CS
SCLK
tDH
tDS
SI
tDO tTR
SO
002aab066
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
CS
SCLK
CS
SCLK
CS
SCLK
SO
td11
IRQ
002aab440
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
CS
SCLK
SO D7 D6 D5 D4 D3 D2 D1 D0
td12
IRQ
002aab441
CS
SCLK
SO D7 D6 D5 D4 D3 D2 D1 D0
td13
IRQ
002aab442
CS
SCLK
SO D7 D6 D5 D4 D3 D2 D1 D0
td14
IRQ
002aab443
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
D E A
X
y HE v M A
16 9
Q
A2 (A 3)
A
A1
pin 1 index
θ
Lp
L
1 8
detail X
w M
e bp
0 2.5 5 mm
scale
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT403-1 MO-153
03-02-18
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm SOT616-3
D B A
terminal 1
index area
A
A1
E c
detail X
e1 C
1/2 e
y1 C y
e b v M C A B
7 12 w M C
L
13
6
e
Eh e2
1/2 e
1
18
terminal 1
index area 24 19
Dh X
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
A(1)
UNIT A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1
max.
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
04-11-19
SOT616-3 --- MO-220 ---
05-03-10
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1
D E A
X
y HE v M A
24 13
Q
A2 (A 3) A
A1
pin 1 index
θ
Lp
L
1 12
detail X
w M
e bp
0 2.5 5 mm
scale
mm
0.15 0.95 0.30 0.2 7.9 4.5 6.6 0.75 0.4 0.5 8o
1.1 0.25 0.65 1 0.2 0.13 0.1
0.05 0.80 0.19 0.1 7.7 4.3 6.2 0.50 0.3 0.2 0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT355-1 MO-153
03-02-19
17. Soldering
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
If wave soldering is used the following conditions must be observed for optimal results:
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
18. Abbreviations
Table 42: Abbreviations
Acronym Description
CPU Central Processing Unit
FIFO First In, First Out
GPIO General Purpose Input/Output
I2C-bus Inter IC bus
IrDA Infrared Data Association
LCD Liquid Crystal Display
POR Power-On Reset
SIR Serial InfraRed
SPI Serial Peripheral Interface
UART Universal Asynchronous Receiver/Transmitter
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Level Data sheet status [1] Product status [2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
21. Definitions customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is Right to make changes — Philips Semiconductors reserves the right to
extracted from a full data sheet with the same type number and title. For make changes in the products - including circuits, standard cells, and/or
detailed information see the relevant data sheet or data handbook. software - described or contained herein in order to improve design and/or
Limiting values definition — Limiting values given are in accordance with performance. When the product is in full production (status ‘Production’),
the Absolute Maximum Rating System (IEC 60134). Stress above one or relevant changes will be communicated via a Customer Product/Process
more of the limiting values may cause permanent damage to the device. Change Notification (CPCN). Philips Semiconductors assumes no
These are stress ratings only and operation of the device at these or at any responsibility or liability for the use of any of these products, conveys no
other conditions above those given in the Characteristics sections of the license or title under any patent, copyright, or mask work right to these
specification is not implied. Exposure to limiting values for extended periods products, and makes no representations or warranties that these products are
may affect device reliability. free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
23. Trademarks
Notice — All referenced brands, product names, service names and
22. Disclaimers trademarks are the property of their respective owners.
I2C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
9397 750 14832 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
25. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1 8.17 Programmable I/O pins State Register
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 (IOState). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2.1 General features . . . . . . . . . . . . . . . . . . . . . . . . 1 8.18 I/O Interrupt Enable Register (IOIntEna) . . . . 33
2.2 I2C-bus features . . . . . . . . . . . . . . . . . . . . . . . . 2 8.19 I/O Control register (IOControl) . . . . . . . . . . . 34
2.3 SPI features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 8.20 Extra Features Control Register (EFCR) . . . . 35
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 9 RS-485 features . . . . . . . . . . . . . . . . . . . . . . . . 35
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 9.1 Auto RS-485 RTS control. . . . . . . . . . . . . . . . 35
9.2 RS-485 RTS output inversion. . . . . . . . . . . . . 36
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
9.3 Auto RS-485. . . . . . . . . . . . . . . . . . . . . . . . . . 36
6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 6 9.3.1 Normal multidrop mode . . . . . . . . . . . . . . . . . 36
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9.3.2 Auto address detection. . . . . . . . . . . . . . . . . . 36
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 2
I C-bus operation . . . . . . . . . . . . . . . . . . . . . . 37
7 Functional description . . . . . . . . . . . . . . . . . . . 9 10.1 Data transfers. . . . . . . . . . . . . . . . . . . . . . . . . 37
7.1 Trigger levels. . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10.2 Addressing and transfer formats . . . . . . . . . . 38
7.2 Hardware flow control . . . . . . . . . . . . . . . . . . . . 9 10.3 Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
7.2.1 Auto-RTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10.4 Use of sub-addresses . . . . . . . . . . . . . . . . . . 41
7.2.2 Auto-CTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 SPI operation . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.3 Software flow control . . . . . . . . . . . . . . . . . . . 11
12 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 44
7.3.1 RX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.3.2 TX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Static characteristics . . . . . . . . . . . . . . . . . . . 45
7.4 Hardware reset, Power-On Reset (POR) and 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 47
software reset . . . . . . . . . . . . . . . . . . . . . . . . . 14 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 54
7.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16 Handling information . . . . . . . . . . . . . . . . . . . 57
7.5.1 Interrupt mode operation . . . . . . . . . . . . . . . . 16
17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.5.2 Polled mode operation . . . . . . . . . . . . . . . . . . 16
17.1 Introduction to soldering surface mount
7.6 Sleep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.7 Break and time-out conditions . . . . . . . . . . . . 17
17.2 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 57
7.8 Programmable baud rate generator . . . . . . . . 17
17.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 57
8 Register descriptions . . . . . . . . . . . . . . . . . . . 20 17.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 58
8.1 Receive Holding Register (RHR) . . . . . . . . . . 22 17.5 Package related soldering information . . . . . . 58
8.2 Transmit Holding Register (THR) . . . . . . . . . . 22
18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 59
8.3 FIFO Control Register (FCR) . . . . . . . . . . . . . 23
8.4 Line Control Register (LCR) . . . . . . . . . . . . . . 24 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . 59
8.5 Line Status Register (LSR) . . . . . . . . . . . . . . . 26 20 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 60
8.6 Modem Control Register (MCR) . . . . . . . . . . . 27 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
8.7 Modem Status Register (MSR). . . . . . . . . . . . 28 22 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
8.8 Interrupt Enable Register (IER) . . . . . . . . . . . 29 23 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
8.9 Interrupt Identification Register (IIR). . . . . . . . 30
24 Contact information . . . . . . . . . . . . . . . . . . . . 60
8.10 Enhanced Features Register (EFR) . . . . . . . . 31
8.11 Division registers (DLL, DLH) . . . . . . . . . . . . . 31
8.12 Transmission Control Register (TCR) . . . . . . . 32
8.13 Trigger Level Register (TLR). . . . . . . . . . . . . . 32
8.14 Transmitter FIFO Level register (TXLVL) . . . . 32
8.15 Receiver FIFO Level register (RXLVL) . . . . . . 33
8.16 Programmable I/O pins Direction register
(IODir) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33