IO-LINK HANDBOOK

Second Edition

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Table of Contents
Introduction........................................................................................3 Thermal Performance..........................................................................................29

Section 1: Introduction to IO-Link..................................................4 Discrete Solution..........................................................................................31

Old School Sensor............................................................................................. 4 Integrated Solution.......................................................................................32

Tiny Binary Sensor Drivers............................................................................... 4 Selecting a TVS.....................................................................................................33

IO-Link: An Open, Low-Cost Sensor Interface..............................................5 IO-Link Protection..........................................................................................33

IO-Link Nodes......................................................................................................5 How 65V (Abs Max) Helps with Protection (vs. 40V).........................33

IO-Link System................................................................................................... 6 Advantages of 65V Abs Max for Protection............................................33

IO-Link Interface Standardized as SDCI in IEC-61131-9............................. 6 Summary..........................................................................................................33

Physical Layer IO-Link Standardized Connectors........................................7 How Does IO-Link Signal Slew Rate Affect Emissions from the IO-Link

Physical Layer Electrical Specifications......................................................... 8 Cable?..............................................................................................................34

IO-Link in the Automation Hierarchy............................................................. 9 Electromagnetic Compatibility (EMC) Requirements...........................35

IO-Link – Enabling Intelligent Sensors..........................................................10 EMC Test Levels..............................................................................................35

Industrial Sensor Ecosystem...........................................................................10 Physical Layer: EMC Requirements Standardized..................................36

Section 2: IO-Link Environment....................................................11 Section 6: IO-Link Solutions...........................................................37

Data Link Layer...................................................................................................11 Why Choose Maxim IO-Link Transceivers?..................................................37

Data Types...........................................................................................................11 Product Selector Guide......................................................................................38

Master-Device Communication..................................................................... 12 100mA Tiny Binary Sensor Drivers:

MAX14838/MAX14839...................................................................................39
UART Data on the C/Q Line........................................................................... 12
OTP Programmable Sensor Interface MAX22520.....................................40
Wake-Up Request............................................................................................. 13
Dual 250mA IO-Link Transceiver: MAX14827A.........................................41
IO-Link Data Rate Selection............................................................................ 13
Pin-Control, Low-Power, Dual-Channel IO-Link Device Transceiver:
The IO-Link IODD.............................................................................................14 MAX14829......................................................................................................................42
Surge-Protected Dual-Channel IO-Link Device Transceiver with DC-DC:
Section 3: Designing an IO-Link Sensor..................................... 15 MAX22513......................................................................................................................43
Sensor Design Considerations....................................................................... 15
Surge Testing .................................................................................................................43
IO-Link Smart Sensor Design Features......................................................... 15
IO-Link Transceiver with Integrated Protection: MAX22515...........................44
IO-Link Temperature Sensor: MAXREFDES164/173.................................16
Dual-Channel IO-Link Master Transceiver: MAX14819....................................45
Description of Software............................................................................ 17
Evaluating an IO-Link Device...........................................................................46
IO-Link Distance Sensor: MAXREFDES171/174..........................................18
Evaluating an IO-Link Master...........................................................................46
Description of Software...........................................................................20
Industrial IO-Link Reference Designs.............................................................47
Section 4: Designing an IO-Link Master....................................21 Digital Input Concentrator: MAXREFDES176..............................................48
IO-Link Master Design Objectives................................................................ 21
Appendix of Technical Resources................................................49
8-Port IO-Link Master: MAXREFDES145.................................................... 21
Software Stack Vendors...................................................................................49
Description of Hardware......................................................................... 22
TMG Technologie und Engineering ...............................................................51
Description of Software........................................................................... 23
TEConcept Tools................................................................................................56
4-Port IO-Link Master MAXREFDES165..................................................... 24
IQ2 Development Tools.....................................................................................63
Description of Hardware......................................................................... 24
IO-Link Glossary.................................................................................................65
Description of Software............................................... ...........................26
IO-Link FAQs.......................................................................................................66
IO-Link Master Test Reports...................................................................27
Additional IO-Link Resources.......................................................68
Section 5: Improving System Performance............................... 28 IO-Link Webpages.............................................................................................68
Heat Dissipation...............................................................................................28
IO-Link Application Notes and Articles........................................................68
Test A............................................................................................................. 28
Videos...................................................................................................................68
Test B............................................................................................................. 28
Trademarks..........................................................................................................68
Test C............................................................................................................. 29

Front cover image: Reprinted with permission by Sick (UK) Ltd.

IO-Link Handbook www.maximintegrated.com

Introduction
Today’s fanless programmable logic controller (PLC) and IO-Link® gateway systems
must dissipate large amounts of power depending on the I/O configuration
(IO-Link, digital input/output, analog input/outputs). As these PLCs evolve into
new Industry 4.0 smart factories, special attention must be considered to achieve
smarter, faster, and lower power solutions. At the heart of this revolution is an
exciting new technology called IO-Link, which enables flexible manufacturing
to improve factory throughput and operational efficiency. This exciting new
technology enables traditional sensors to become intelligent sensors.
At Maxim, we provide a portfolio of advanced factory automation solutions
that create pathways toward achieving Industry 4.0, enhanced by our IO-Link
technology portfolio. A recent addition to this portfolio is the MAX22513, a tiny
dual-channel IO-Link transceiver with integrated surge protection and DC-DC
converter, to reduce heat dissipation and increase the robustness of sensors on the
factory floor.
To help our customers reduce their time-to-market, we have partnered with
software stack vendors from the IO-Link consortium to develop a range of
fully verified and tested reference designs, which are described in detail in this
handbook.
IO-Link is a powerful technology that will play a pivotal role over time in factory
process automation as well as other industries. It will not only save manufacturers
billions every year but will expand new markets for more customization of products.
If you are involved in factory process automation, watch IO-Link technology as it
continues to unleash the true power of Industry 4.0 and changes the way we think
of manufacturing.

Jeff DeAngelis,
Managing Director
Industrial & Healthcare Business Unit
Maxim Integrated

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Section 1: Introduction to IO-Link Tiny Binary Sensor Drivers

Old School Sensor Binary sensors have only two states: On or Off. Examples of
binary sensors are pressure switches, temperature switches,
Historically, a sensor included a sensing element and a way to
through-beam photoelectric sensors, proximity sensors,
get the sensing data to a controller. Data was often transferred
and pushbuttons. Binary sensor output drivers, such as the
in analog format (Figure 1) and was unidirectional (sensor to
MAX14838/MAX14839 (Figure 2), are 24V/100mA drivers
master only). This added extra steps to the process (such as
optimized for use in industrial sensors. These devices integrate
digital-to-analog and analog-to-digital conversion) which, in
the high-voltage (24V) circuitry commonly found in industrial
turn, added extra cost, larger footprints and susceptibility to
sensors, such as a configurable or pin-selectable PNP/NPN/
noise. Binary (or digital) sensors were used to simply indicate
push-pull driver and an integrated linear regulator that meets
the status of a switch e.g... a thermostat to provide a high (24V)
common sensor power requirements. The output driver
or low (0V) signal to indicate if the measured temperature is
interfaces between the sensor or sensor microcontroller unit
above or below a preset threshold. These “old school” sensors
(MCU) and the digital input (DI) module of the PLC.
worked, but as technology advanced, sensor manufacturers
integrated more functionality into sensors, eliminating some of To provide flexibility in supporting a broad range of physical
these problems with these early sensors. sensor types, logic inputs allow the output driver to be
configured for high-side (PNP), low-side (NPN), or push-
However, data was still limited to unidirectional
pull operation. An additional input allows the user to select
communication from the sensor to the master, limiting error
between normally open and normally closed logic. The
control and requiring a technician on the factory floor for
MAX14838/MAX14839 are highly integrated products,
updates or recalibration.
making them ideal for robust sensor solutions in a tiny
Manufacturers needed a better solution to meet the demands footprint due to integrated reverse-polarity protection,
of Industry 4.0, smart sensors, and reconfigurable factory an on-board LDO, and LED drivers.
floors. The solution that emerged is IO-Link.

ANALOG SENSOR PLC

SENSING
A/D µP D/A A/D µP LEDS LED2
ELEMENT LDO
VCC 24V
100nF
100nF
FAULT
BINARY SENSOR INDUCED
NOISE SENSOR LED2IN DO OUT
MAX14838
AFE
DIN MAX14839
24V
NPN
SENSING DO GND
COMPARATOR DI µP GND
ELEMENT PP
0V
NO

Figure 1. "Old School" Sensors - Analog and Binary Figure 2. 24V Pin-Configurable Industrial Sensor Output Driver

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IO-Link: An Open, Low-Cost Sensor Interface IO-Link is a point-to-point communication link with
standardized connectors, cables, and protocols. The IO-Link
IO-Link is a standardized technology (IEC 61131-9) regulating
system is designed to work within the industry-standard
how sensors and actuators in industrial systems interact with
3-wire sensor and actuator infrastructure and is comprised of
a controller. The IO-Link Company Community
“IO-Link master” and “IO-Link device” products (Figure 3).
(www.io-link.com) was formed in 2008 by a group of 41
sensor and actuator manufacturers who started the IO-Link
IO-Link Nodes
consortium with the goal to standardize the hardware (PHY
layer) interface and the communication (data) protocol for The number of installed IO-Link nodes continues to rapidly
IO-Link products. Currently, there are over 100 companies in grow as sensor companies move from older analog sensors
the consortium including semiconductor vendors and software to ”smart” IO-Link-based sensors, enabling the promise of
vendors. Maxim has been a member of the IO-Link consortium reconfigurable manufacturing as outlined by Industry 4.0
since 2009. (Figure 4).

Fieldbus
I/O device

1 1

2 4 4 2 7 8

3 3
IO-Link Device #2 5 6

POINT-TO-POINT LINK
3 4
1 1

2 4 4 2
1 2

3 3
IO-Link Device #1
IO-Link Master
<20m Multi-Port IO-Link Master
STANDARD SENSOR/
ACTUATOR CABLING

Figure 3. IO-Link Master/Device Interface

Figure 4. Projected Growth in Number of IO-Link Nodes

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IO-Link System IO-Link Interface Standardized as SDCI in

The point-to-point connection between the IO-Link master IEC-61131-9
(multi-port controller or gateway) and the IO-Link device IO-Link is a standard for Single-Drop Communication Interface
(sensor or actuator) uses standard connectors (usually M12) (SDCI), which was standardized as IEC-61131-9, while also
and a 3- or 4-wire cable up to 20 meters in length. The master providing backwards-compatibility with binary sensors IEC
can have multiple ports (commonly four or eight). Each port 60974-5-2 (Figure 6 and Table 1). IO-Link sensors have the
of the master connects to a unique IO-Link device, which can best features of binary sensors while adding bidirectional
operate in either SIO mode or bidirectional communication data capability. IO-Link masters can interface with both
mode. IO-Link is designed to work with existing industrial binary and IO-Link sensors, allowing IO-Link to be easily
architectures such as fieldbus or industrial Ethernet and added to an existing system. The IO-Link standard states that
connects to existing PLCs or human-machine interfaces communications must be within 20 meters with unshielded
(HMIs), enabling rapid adoption of this technology (Figure 5). cables using standard connectors common to industrial
For full details of IO-Link, refer to the IO-Link Interface and systems. M8 and M12 connectors are the most predominant.
System Specification Version 1.1.3 dated June 2019 at Communication is point-to-point and requires a 3-wire
www.io-link.com. interface (L+, C/Q, and L-). Communication between master
and slave devices is half-duplex with 3 transmission rates:
COM1 4800 baud, COM2 38.4k baud, COM3 230.4k baud.
The supply range in an IO-Link system is 20V to 30V for the
master, and 18V to 30V for the device (sensor or actuator).
The IO-Link device must function within 300ms after L+
exceeds the 18V threshold.
The two communication modes are standard I/O (SIO) and
SDCI. In SIO mode, backward compatibility is ensured with
existing sensors in the field, using 0V or 24V to signal OFF or
ON to the IO-Link master. In IO-Link mode, communication
is bidirectional at one of three data rates. The IO-Link device
only supports one data rate while the IO-Link master must
support all three data rates. Communication is with 24V
pulses using a nonreturn-to-zero (NRZ) on the C/Q line
where a logic 0 is 24V between CQ and L- and a logic 1 is
0V between CQ and L-. In IO-Link mode, pin 2 can be in DI
mode as a digital input, or DO mode as a digital output, or not
connected (NC).

Figure 5. IO-Link Compatibility with Existing Industry Protocols

Table 1. IO-Link Pin Definitions

L+
Pin Signal Designation Standard
1 L+ 24V IEC 61131-2
SIO
1
2 4
C/Q 2 I/Q Not connected, DI, or DO IEC 61131-2
3 COMx 4.8 / 38.4 / 230.4 kbit/s 3 L- 0V IEC 61131-2
Q "Switching signal" (SIO) IEC 61131-2
L-
4 "Coded switching"
IEC 60947-5-2 C IEC 61131-9
(COM1, COM2, COM3)
Figure 6. IO-Link Pin Definitions

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Physical Layer IO-Link Standardized Connectors (L+, L-, C/Q) with a fourth wire that can be used as an
additional signal line (DI or DO). Port Class B connectors have
Standardized connectors and cables are used as defined by
5-wire connections for devices that require extra power from
IEC 61131-9. Port Class A connectors have 4-wire connections
an independent 24V supply (Figure 7 and Table 2).
(maximum) to support the 3-wire connection system

Table 2. Alternative IO-Link Pin Definitions

Pin Signal Designation Remark

1 L+ Power supply (+) See Table 7*
Option 1: NC (not connected)
I/Q NC/DI/DO (port class A) Option 2: DI
2
P24 P24 (port class B) Option 3: DI, then configured DO
Option 4: Extra power supply for power devices (port class B)
3 L- Power supply (-) See Table 7*
4 C/Q SIO/SDCI Standard I/O mode or SDCI
NC NC (port class A) Option 1: Shall not be connected on the master side (port class A)
5
N24 N24 (port class B) Option 2: Reference to the extra power supply (port class B)
Note: M12 is always a 5 pin version on the Master side (female)

*In the IO-Link Interface and System Specification Version 1.1.3, June 2019.

Class A Class A Class A Class B

2 2
4 3 2 4

Male 1 1
(Device) 3 3
1 2 1 3 5
M12 connectors
4 4
are A-coded
M5 M8 M12 -4 M12 -5 according to IEC
2 2 61076-2-101
3 4 4 2

Female 1 1
3 3
(Master)
2 1 3 1 5 5
4 4
M5 M8 M12 -5 M12 -5

Figure 7. Alternative IO-Link Connectors

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Physical Layer Electrical Specifications Table 3. IO-Link Signal Electrical Specifications

The supply range in an IO-Link system is 20V to 30V for the Property Designation Min Typ Max Unit Remark
master, or 18V to 30V for the device (sensor or actuator). VTHHD,M Input threshold 10.5 N/A 13 V See Note 1
Important related specifications (Table 3) include: ‘H’
• A rising IO-Link signal must be above 13V to be registered VTHLD,M Input threshold 8 N/A 11.5 V See Note 1
‘L’
as a “logic high.”
VHYSD,M Hysteresis 0 N/A N/A V Shall not be
• A falling IO-Link signal must be below 8V to be registered between input negative.
as a “logic low.” thresholds ‘H’ See Note 2
and ‘L’
Note that the high and low detection time (tH and tL in the VILD,M Permissible V0D,M N/A N/A V With reference
timing diagram) are 1/16 of a bit (minimum). tND is the noise voltage range - 1.0 to relevant
suppression duration (tND must be less than 1/16 of a bit) ‘L’ negative
supply voltage.
(Figures 8a and 8b).
VIHD,M Permissible N/A N/A V+D,M V With reference
Communication uses a UART frame consisting of 11 bits = voltage range + 1.0 to relevant
1 start bit + 8 data bits + 1 parity bit + 1 STOP bit. Durations ‘H’ positive supply
voltage.
are defined by the transmission rate which depends upon the
device. Note 1: Thresholds are compatible with the definitions of type 1 digital
inputs in IEC 61131-2.
Note 2: Hysteresis voltage VHYS = VTHH - VTHL.

tH tND tL tND

VIHD,M MAX
VID,M
V+D,M
VRQHD,M MAX
V+
VTHHMAX Detection 'H' 2)
Voltage range VTHHMIN
'H'
VTHHMAX VTHLMAX VTHLMIN
VTHLMAX 1) Detection 'L'
Threshold 'H' VTHHMIN VRQLD,M MAX
Threshold 'L' VTHLMIN V0D,M
VILD,M MIN

Voltage range
tDR tDF
'L'
V0 TBIT TBIT

NOTE In the figure, 1) = no detection 'L'; and 2) = no detection 'H'

Figure 8a. IO-Link Signal Electrical Thresholds Figure 8b. IO-Link Signal Electrical Characteristics

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IO-Link in the Automation Hierarchy controller to set up (or reconfigure) a device. This means a
technician is no longer needed on the shop floor to do initial
An IO-Link device is connected as a point-to-point link to a
setup and machine downtime is reduced when it is required to
port in an IO-Link master. If implemented as a PLC plug-in
reconfigure devices.
module, it does not have gateway functionality and as such,
is not a fieldbus. The IO-Link master is essentially a gateway, IO-Link allows for continuous diagnostics and improved data
with responsibility for establishing communication using logging and error detection to further reduce operating costs.
fieldbuses or some other type of backplane, enabling the Commonly used connectors and cables enable standardized
IO-Link devices to become fieldbus I/O nodes (Figure 9). installation with direct binary sensor upgrades. Since IO-Link
sensors have configurable settings (for example PNP, NPN, or
IO-Link functionality in a system reduces maintenance,
push-pull outputs that can be changed while in progress), the
increases uptime, and transforms a manual sensor installation
number of product units the sensor vendor needs to support is
into one which allows a user to "plug-and-play and walk
also reduced.
away." The parameter settings can be downloaded from the

PLC / Host
Parameter
Fieldbus controller server

Fieldbus
integration

Fieldbus interface Engineering:

configuration,
parameterization,
Gateway application
diagnosis,
Data identification and
Master maintenance
storage
Port 1 Port 2 Port n
SDCI

Device Device Device

Application Application Application

Device
description

Figure 9. IO-Link Fieldbus Interconnection

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IO-Link – Enabling Intelligent Sensors As mentioned, IO-Link is backwards-compatible with

SIO binary signals. With IO-Link-capable sensors, users
To summarize, IO-Link is a point-to-point connection that
communicate with existing PLCs through a standard digital
may be layered over any given network. As an integral part of
input communication. As PLC modules are upgraded with
the I/O module, the IO-Link master is installed either in the
an IO-Link master, bidirectional communication is enabled
control cabinet or directly in the field as a remote I/O with an
through the C/Q line on an IO-Link channel.
IP 65/67 enclosure rating. The IO-Link device is coupled with
the master using a standard sensor/actuator cable measuring Industrial Sensor Ecosystem
up to 20 meters in length. The device—which may be any
Figure 10 shows an example of our industrial sensor
sensor, any actuator, or a combination of the two, transmits
ecosystem which includes products for all key functions,
and receives data (binary switching, analog, input, output) that
including binary sensor output drivers, IO-Link devices, and
are transmitted directly via IO-Link in a digital format.
IO-Link masters.
IO-Link is very powerful and flexible, allowing some of the
intelligence to be moved from the PLC closer to the sensors on
the factory floor. For example, by using pin 2 (I/Q) as a DI/DO,
in addition to the C/Q line, the user can take in digital input
signals from a binary sensor and then drive a lamp with the
DO (to signify, for instance, if a threshold has been surpassed).
This can be done from the sensor itself.

DIGITAL I/O MODULE

BINARY
DI SENSOR
MAX14914 USER-DEFINED
CONFIGURABLE DI OR DO
DO ACTUATOR
DIO DEVICE

SPI MAX22190 DO MAX14838 DI BINARY

DI
DIGITAL BINARY SENSOR
PLC COMMUNICATIONS BUS

INPUT DEVICE DRIVER

SPI MAX14912
DO RELAY ACTUATOR
DIGITAL
OUTPUT DEVICE

IO-LINK MODULE LOW-POWER, THERMALLY EFFICIENT SMART SENSOR

L+ (24V) L+ (24V) M12 CONNECTOR

UP TO 20M CABLE

SPI
1 DI/DO DI/DO 1 MAX14827A
4 2 2 4 SENSOR
IO-LINK MCU AFE
3 3 UART
L- (0V) L- (0V) TRANSCIEVER

C/Q C/Q

SPI DIGITAL OUTPUT

MAX14819
DIGITAL INPUT
DUAL-
UART CHANNEL
IO-LINK SURGE-PROTECTED INTEGRATED DC-DC SMART SENSOR
MASTER
L+ (24V) L+ (24V) M12 CONNECTOR
UP TO 20M CABLE

SPI
1 DI/DO DI/DO 1 MAX22513
2 2 4 SENSOR
4 MCU
3 3 IO-LINK UART AFE
L- (0V) L- (0V) TRANSCIEVER

C/Q C/Q

DIGITAL OUTPUT
DIGITAL INPUT

Figure 10. Industrial Sensor Ecosystem

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Section 2: IO-Link Environment Data Types

Data Link Layer IO-Link data communication is either cyclic or acyclic (Figure
11). Cyclic communication occurs during normal operation. For
All IO-Link data exchange is master-slave based, with the
example, the master requests sensing data from the sensor.
IO-Link master sending a request and the device required
Acyclic data is on-request and can contain:
to answer. The data link layer manages the exchange of
messages between the IO-Link master and device. Messages 1. Configuration or maintenance information. For example,
are called M-sequences which are frames that have a length the master may configure the device after power-up or
between 1 and 66 UART words. The messages can contain request the device configuration right before power-down
process data, on-request data, and system management 2. Event triggered, which is reported with three levels of
commands/requests. A special DL handler in the master severity:
manages operating modes (SIO, wake-up, COM rates) and
• Notifications
handles errors and wake-up requests.
• Warnings
The process data handler ensures the cyclical process data
exchange while the on-request handler manages the acyclic • Errors
exchange of event, control, parameter and ISDU data. 3. Service data for large data structures.
4. Page data for direct reading of device parameters.

Nature of Data Data Categories Communication Transmission

Channel Type
Input,
Input, Output
Output
Operation
Operation Process
Process Cyclic
Cyclic (default)
(default)
Valid,
Valid, Invalid
Invalid

Direct
DirectParameter
Parameter Page
Page
(Page
(Page11 or
or2)
2)
Configuration/
Configuration/
maintenance
maintenance

Parameter
Parameter ISDU
ISDU
(Index
(Index>1)
>1)
On-request
On-request (acyclic)
(acyclic)

Errors
Errors

Events
Events Warnings Diagnosis
Diagnosis
Warnings

Notifications
Notifications

Figure 11. IO-Link Transmission Types

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Master-Device Communication UART Data on the C/Q Line

All communication between the master and a device (sensor All data is UART framed. The master initiates communication
or actuator) begins with a request from the master and follows and the device must answer within tA < 11-bit intervals
a fixed schedule (Figure 12). A device must answer all master (Figure 13).
requests. The sum of this back-and-forth communication is
called an M-sequence (message sequence). An M-sequence
can take many different forms and varies in total length.
Although M-sequence communication may vary, all
communication between a master and device takes place on
this fixed schedule.

M-sequence ("Message sequence")

Master message

UART UART UART Device message

...
frame frame frame

UART UART
M-sequence type ...
frame frame

Figure 12. IO-Link Master-Device Communication Sequence

Port UART UART UART

CHARACTER CHARACTER CHARACTER
(Master)

t1 t1
UART UART UART
Device CHARACTER CHARACTER CHARACTER

t2 t2
tA

tF-sequence

Figure 13. UART Framing

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Wake-Up Request IO-Link Data Rate Selection

When a master wants to configure a device (sensor or Once the master has sent a wake-up request to the device (to
actuator) or communicate with it for the first time, it will send set it to receive mode), the master then learns more about it
a wake-up request. A wake-up request starts by shorting the by establishing the data rate for communication (Figure 15):
C/Q line for 80µs with a current pulse of at least 500mA • The master sends multiple messages at the COM3,
(Figure 14). The device must be ready for communication COM2, and COM1 data rates (fastest to slowest), and
within 500µs (TREN). waits for the device to respond after each send:
• A wake-up period is typically 80µs (75µs, min or 85µs, - Any given device is required to support only one of
max). the COM1, COM2, or COM3 data rates.
• The master sources (or sinks) the current to generate the • The device will respond at its rated data rate:
wake-up pulse. If the line is low, the master will source
current to pull it high. If the line is high, the master will - When the device responds, the master is then able to
sink current to pull it low. communicate with the device.

• The wake-up pulse is detected by the IO-link device - The master can then read out the minimum cycle
(which either monitors the current on the line or detects a time capability of the IO-Link device.
voltage change of low-to-high or high-to-low). • The master can retry the wake-up sequence a maximum
• When the wake-up request is received, the IO-Link device of two times to establish IO-Link communication.
must configure itself to receive mode. This must occur - If the wake-up request fails, and then fails a second
within 500µs of receiving the request, or an error will be time (max retries = 2), the device must set the C/Q
generated by the master. line to SIO (DI/DO binary sensor) mode.

WAKE-UP SEQUENCE
SIO MODE
MASTER TRANSMIT WAKE-UP PULSE

C/Q LEVEL

T(WU) = 80µs

T(REN) = 500µs T(DMT)

Figure 14. Wake-Up Sequence

TREN

WURQ 1 2 3
MASTER
STARTUP
MASTER

TDMT TDMT TDMT

COM3 COM2 COM1 4

DEVICE
SIO STARTUP
DEVICE

Figure 15. Data Rate Selection

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The IO-Link IODD • IODD files are XML files

All IO-Link devices (sensors or actuators) must have an • The structure of the IODD is outlined in a separate
associated IO-Link Device Description (IODD) file available document from the IEC 61131-9 standard.
(Figure 16). This is used by the IO-Link master for purposes of • The IO-Link Consortium maintains a centralized, multi-
identification, data interpretation, and configuration. vendor database for IODD files on the IO-Link website
• The IODD contains:
- All necessary properties to establish communication
- Device parameters
- Identification information
- Process and diagnostic information
- An image of the device and the manufacturer’s logo

IO-LINK DEVICE

IO-LINK DEVICE COMMUNICATION

IODD
DEVICE .XML
DEVICE DEVICE
IDENTIFICATION
VARIABLE PROCESS DATA
AVAILABLE

DEVICE APPLICATION

PROCESS
PROCESS

Figure 16. IODD File

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Section 3: Designing an IO-Link Sensor IO-Link Smart Sensor Design Features

In this section, we will look at reference design examples that Figure 18 shows the MAXREFDES164 temperature sensor and
demonstrate how to design a smart sensor system as well as the MAXREFDES171 distance sensor. The MAXREFDES173
a system to support legacy binary sensors that interface to an temperature sensor and the MAXREFDES174 distance sensor
IO-Link port. are also discussed in this section. These designs are compliant
with IO-Link version 1.1 and 1.0 and include transient voltage
Sensor Design Considerations suppression as well as reverse-polarity and short-circuit
The basic structure of an IO-Link sensor includes some protection. For MAXREFDES164, the IO-Link transceiver
fundamental building blocks (Figure 17a and Figure 17b) which is the single-channel MAX14828, which is very low power
the system designer must consider: but requires external varistors for surge protection. The
microcontroller used is the MAX32660 running a TMG or
• Sensor type (optical, temperature, etc.,)
TEConcept stack. For MAXREFDES173, the IO-Link transceiver
• MCU that interfaces with the sensor and runs the IO-Link is the dual-channel MAX14827A and the microcontroller is a
device stack Renesas RL78 running an IQ2 stack.
• IO-Link transceiver (or physical layer/PHY) The MAXREFDES171 and MAXREFDES174 use the MAX22513
• Power supply and the various voltage and current ratings IO-Link transceiver, which features integrated surge protection
required (no external TVS required) as well as an integrated DC-DC
buck converter, making it more efficient for ‘higher powered’
• Connector type
sensors (such as distance sensors) that require a larger load
• External protection (TVS for surge, EFT/burst, ESD, etc.) current. The use of the DC-DC buck compared to a linear
regulator greatly improves the thermal performance of such
a sensor. For MAXREFDES171, the microcontroller is the
POWER
MAX32660 running a TMG stack while the MAXREFDES174’s
POWER 5V 24V
LDO
DC-DC microcontroller is a Renesas RL78 running an IQ2 stack.
BUCK

I/Q (DI/DO)

SPI M12
I2C L+ (24V) 2 CONNECTOR
IO-LINK
SENSOR MCU 1 3
UART PHY
4
C/Q

L-(0V)

Figure 17a. Building Blocks of an IO-Link Sensor

MAX22513

POLARITY
POWER
POWER 5V CORRECTED
DC-DC
LDO 24V
BUCK

I/Q (DI/DO)
SPI M12
I2C L + (24V) 2 CONNECTOR
IO-LINK
SENSOR MCU 1 3
UART PHY
4
C/Q

L - (OV)

Figure 17b. Building Blocks of a Highly Integrated IO-Link Sensor Figure 18. MAXREFDES164 Temperature Sensor and MAXREFDES171
Distance Sensor

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IO-Link Temperature Sensor: MAXREFDES164 and The MAX14828 features a flexible control interface. A SPI
MAXREFDES173 interface is available with extensive diagnostics, and for IO-
Link operation, a three-wire UART interface is provided. The
We have collaborated with Technologie Management Gruppe
MAXREFDES164 takes advantage of the multiplexed UART/
Technologie und Engineering (TMG TE) and TEConcept in
SPI option which allows using one serial microcontroller
designing the MAXREFDES164 as a temperature sensor
interface for shared SPI and UART interfaces. The MAX14828
reference design that is compliant with the IO-Link version
includes integrated 3.3V and 5V linear regulators which
1.1.3/1.0 standard. The MAXREFDES164 design consists
provide the low-noise supply rails for the other components on
of an industry-standard Maxim IO-Link device transceiver
the board.
(MAX14828), a MAX32660 ultra-low-power 32-bit
microcontroller utilizing TMG TE's or TEConcept’s IO- The MAX32660 is an ultra-low-power, cost-effective highly
Link device stack, and a Maxim local temperature sensor integrated microcontroller which combines a flexible and
(MAX31875). Figure 19 shows the system block diagram. versatile power management unit with the powerful ARM®
Cortex®-M4 with floating point unit (FPU). The device
The MAXREFDES164 IO-Link local temperature sensor
integrates up to 256KB of flash memory and 96KB of RAM
consumes minimal power, space, and cost, making it an all-
to accommodate application and sensor code. It supports
around solution for many industrial control and automation
SPI, UART, and I2C communication in a tiny 1.6mm x 1.6mm
local temperature sensing applications.
16-WLP.
The MAX14828 IO-Link device transceiver is IO-Link version
The MAX31875 is a ±1°C-accurate local temperature sensor
1.1.3/1.0 physical layer-compliant and integrates the high-
with I2C/SMBus interface. The combination of a tiny package
voltage functions commonly found in industrial sensors,
and excellent temperature measurement accuracy makes
including drivers and regulators, all in a tiny 2.5mm x 2.5mm
this product ideal for a variety of equipment. The MAX31875
WLP package. The MAX14828 features two ultra-low-power
temperature sensor measures temperature and converts
drivers with active reverse-polarity protection. Operation is
the data into digital form. An I2C-compatible two-wire serial
specified for normal 24V supply voltages up to 60V. Transient
interface allows access to conversion results. Standard I2C
protection is simplified due to high voltage tolerance (65V
commands allow reading the data and configuring other
absolute maximum rating) allowing the use of varistors or
operating characteristics. The MAX31875 is available in
micro TVS.
a 4-bump WLP and operates over the -50°C to +150°C
temperature range.

LDO OUTPUT = 5V LDO OUTPUT = 3.3V

IRQ
+24V
CS
SCLK MAX31875
MAX14828 MAX32660 I2C_SCL
SPI/UART

2 1 SPI_MOSI_UART_TX
IO-LINK SPI_MISO_UART_RX LOW POWER TEMPERATURE
3 4 TRANCEIVER MICROCONTROLLER I2C_SDA
SENSOR
C/Q WU
LI
DI
LED2

LED1

GND LO

Figure 19. MAXREFDES164 IO-Link Temperature Sensor Block Diagram

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For protection, the MAXREFDES164 uses varistors (MOV) at To demonstrate the performance of our IO-Link transceivers
the IO-Link interface. The VC060330A650DP varistors have with different microcontrollers and stack software, the
a working voltage of 30V and a breakdown voltage of 41V. MAXREFDES173 implements a similar sensor but uses the
With these varistors, this reference design meets both IEC MAX14827A IO-Link transceiver and Renesas RL78 with IQ2
61000-4-2 (ESD) and IEC 61000-4-4 (EFT). It is designed stack.
to meet surge capability (±1kV/500Ω at t = 1.2/50µs) and Description of Software
a low clamping voltage of < 70V. The MAX14828 absolute
maximum (Abs Max) voltage rating of 65V on the IO-Link The MAXREFDES164 was verified using TMG TE's IO-
pins allows the use of these tiny and simple varistors where Link Device Tool V5 and our MAXREFDES165 4-port
other vendors' transceiver ICs (with lower Abs Max ratings) IO-Link master reference design. Download the IODD file
require much larger sized TVS diodes. (*.xml) located under the Design Resources section of the
MAXREFDES164 product page and go to the Quick Start
The MAXREFDES164 uses an industry-standard M12 section for step-by-step instructions on how to use the
connector that allows the use of a 4-wire cable. The software (Figure 20). Note: The MAXREFDES164 also works
MAXREFDES164 consumes less than 6mA (typ) including seamlessly with the MAXREFDES145 8-port IO-Link master
the green LED “alive signal,” which pulses rather than remains and the TEConcept IO-Link Control Tool.
constantly on to reduce power consumption. Note the red
LED, if illuminated, indicates a FAULT condition.

Figure 20. MAXREFDES164 IO-Link Device Software Interface

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IO-Link Handbook www.maximintegrated.com

IO-Link Distance Sensor: MAXREFDES171 and It integrates the high-voltage functions commonly found in
MAXREFDES174 industrial sensors, including drivers, a high-efficiency DC-DC
buck regulator, and two linear regulators, all contained in a
We have collaborated with Technologie Management Gruppe
tiny 4.1mm x 2.1mm WLP. The MAX22513 features extensive
Technologie und Engineering (TMG TE) in designing the
integrated protection to ensure robust communication in harsh
MAXREFDES171 (Figure 21) as a reference design that is
industrial environments. All four I/O pins (V24, C/Q, DO/
compliant with the IO-Link version 1.1.3/1.0 standard. The
DI, and GND) are reverse-voltage and short-circuit protected,
MAXREFDES171 design consists of an industry-standard
and feature an integrated ±1kV/500Ω surge protection.
MAX22513 IO-Link device transceiver, a MAX32660 ultra-low-
This enables a very small PCB area with no required external
power 32-bit microcontroller that utilizes the TMG TE IO-Link
components (such as TVS diodes). The low on-resistance
device stack, and a commercially available time-of-flight (ToF)
drivers (C/Q and DO/DI) further reduce power dissipation,
laser-ranging sensor.
allowing the reference design to consume minimal power and
The MAXREFDES171 IO-Link distance sensor consumes have very low thermal dissipation. Operation is specified for
minimal power, space, and cost, making it a complete solution the typical 24V supply and operates with voltages up to 36V.
for distance and proximity sensing in many industrial control Transient protection is simplified due to high-voltage tolerance
and automation applications. (65V absolute maximum rating) in addition to the integrated
The MAX22513 IO-Link device transceiver is compliant surge protection.
with the IO-Link version 1.1/1.0 physical layer specification.

LDO OUTPUT = 5V LDO OUTPUT = 3.3V

IRQ

+24V
DC-DC SCL
SDA
SPI/I2C AND UART

2 1 VL53L1
MAX22513 UART0_TX MAX32660 SCL DISTANCE SENSOR
3 4
IO-LINK UART0_RX
C/Q TRANSCEIVER LOW-POWER
SDA
WU MICROCONTROLLER
DO/DI
GND LI/LO

Figure 21. MAXREFDES171 IO-Link Device Distance Sensor

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IO-Link Handbook www.maximintegrated.com

The integrated DC-DC buck regulator significantly reduces The VL53L1X is a ToF, laser-ranging sensor that provides
system power dissipation by dropping the available 24V to a accurate distance that ranges up to 400cm. The ranging
lower voltage more efficiently than a linear regulator. The two sensor is programmed with firmware and is controlled by
integrated LDO regulators within MAX22513 generate 3.3V a simple I2C interface that only requires SCL and SDA. The
and 5V, saving external components and space. The DC-DC module does not have a cover for the receiving lens, so care
regulator can provide 300mA at low voltages much more needs to be taken to keep the lens clean, otherwise distance
efficiently than an LDO, making this transceiver ideal to power measurement performance will be impacted. The VL53L1X is
high current sensors. in a small, 4.9mm x 2.5mm x 1.6mm module and operates
The MAX22513 features a flexible control interface, allowing over the -20°C to +85°C temperature range. This is the
control through either an SPI or I2C interface. In this design, limiting item for the reference design operating temperature
we use I2C to reduce the number of pins required by the range, as the MAX22513 IO-Link transceiver operates over
microcontroller. I2C allows both the MAX22513 and the sensor the -40°C to +125°C temperature range.
IC to be on the same bus. The I2C (or SPI) interface provides The MAXREFDES171 does NOT require external devices such
extensive diagnostics (from MAX22513), and a 3-wire UART as varistors or TVS diodes for protection due to the integrated
interface is provided for IO-Link communication. surge protection within MAX22513 at the IO-Link interface.
The MAX32660 is an ultra-low-power, cost-effective, highly This reference design meets both IEC 61000-4-2 (ESD) and
integrated microcontroller that combines a flexible and versatile IEC 61000-4-4 (EFT) standards. It is also designed to meet
power management unit with the powerful Arm Cortex-M4 surge capability (up to ±1kV/500Ω at t = 1.2/50µs) and has
with FPU. The device integrates up to 256KB of flash memory a low clamping voltage of < 70V.
and 96KB of RAM to accommodate application and sensor The MAXREFDES171 uses an industry-standard M12
code. It supports SPI, UART, and I2C communication in a tiny, connector, allowing a 4-wire cable to be used.
1.6mm x 1.6mm, 16 WLP. To demonstrate the performance of Maxim’s IO-Link
transceivers with different microcontrollers and stack
software , the MAXREFDES174 implements a similar sensor
but uses a Renesas RL78 microcontroller with IQ2 stack.

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IO-Link Handbook www.maximintegrated.com

Description of Software section for step-by-step instructions on how to use the

software. Figure 22 shows a screenshot of the TMG TE IO-Link
The MAXREFDES171 was verified using TMG TE's IO-Link
Device Tool.
Device Tool V5 and our MAXREFDES165 4-port IO-Link
master. Download the IODD file (*.xml) located in the
Download All Design Files section of the MAXREFDES171
product page's Design Resources tab. Go to the Quick Start

Figure 22. MAXREFDES171 IO-Link Device Software Interface

For complete details of each reference design, including full design files please visit www.maximintegrated.com.

20 www.maximintegrated.com/io-link
IO-Link Handbook www.maximintegrated.com

Section 4: Designing an IO-Link Master 8-Port IO-Link Master: MAXREFDES145

In this section, we will look at reference design examples that The MAXREFDES145 is a fully IO-Link-compliant, eight-port
demonstrate how to design a multi-port master for a smart IO-Link master reference design (Figure 23). This design
sensor system using IO-Link. uses TEConcept’s IO-Link master stack and is both an IO-
Link master reference design as well as an IO-Link sensor/
IO-Link Master Design Objectives actuator development and test system. Eight IO-Link ports
When designing an IO-Link master solution, there are allow for simultaneous testing of up to eight different sensors
common system design questions that must be considered: (or actuators). The reference design has eight robust female
M12 connectors, the most common connector used for
Hardware Design:
IO-Link, and ships with two black IO-Link cables to quickly
• How many IO-Link ports should the system have? connect to IO-Link-compatible sensors and actuators. An AC-
• Should the ports be Class A or Class B? to-DC (24VDC/3A) power supply provides at least 125mA
simultaneously to each port (more when fewer ports are
• Should the connectors in a Class A port support pin 2?
used). A micro-USB connector allows for quick connectivity to
• What miswiring cases should be accommodated for over- a Windows® PC.
voltages or reverse polarity?
The easy-to-use TEConcept Control Tool (CT) GUI software,
• Should the PCB design be modular and able to with IODD file import capability, makes the MAXREFDES145
accommodate different port counts? a must-have for any company or engineer serious about
• How much current should the L+ supply provide? developing IO-Link products.

• What is the form-factor?

EMC Compliance:
• Who will perform the compliance testing?
As an example, our design team for the MAXREFDES145
eight-port IO-Link master reference design chose to create an
8-port master due to the popularity of the configuration and
to provide an alternative to their existing 4-port master. They
used the MAX14819 dual-channel IO-Link master transceiver
and the STM 32F4 Arm Cortex-M4 microcontroller,
implementing isolation between the USB interface and the IO-
Link channels. The reference design fits on a single 5in. x 3in.
PCB. For software, the design team partnered with TEConcept,
who supplied the IO-Link-compliant software stack and Figure 23. MAXREFDES145 8-Port IO-Link Master Reference Design
performed the compliance testing. The design includes a
TVS diode at each of the IO-Link ports, and is tested to IEC
610004-2 and IEC 610004-5 for transient immunity to ESD
and surge immunity.

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IO-Link Handbook www.maximintegrated.com

Description of Hardware supply. Two digital isolators, the four-channel MAX14931 and
the two-channel MAX12931, protect the USB interface from
The MAXREFDES145 IO-Link master consists of four main
high voltage and large ground differentials that may occur
blocks: four dual-channel MAX14819 IO-Link master
when the MAX14819 master transceivers are connected to IO-
transceivers, two digital isolators for the SPI interface, a
Link peripherals. All communication between the USB port/
microcontroller, and a USB connection as shown in Figure
PC and the SMT32F4 microcontroller passes through these
24. The MAX14819 IO-Link master transceivers are IO-Link
isolators. A stand-alone SPI header (J3) is available on the
version 1.1.2 physical layer-compliant. These transceivers
MAXREFDES145 to allow the user to bypass the USB interface
feature integrated 5V linear regulators, configurable C/Q
or directly communicates with the STM32F4 using an external
outputs (push-pull, high side, or low side) with configurable
SPI master.
output drive capability, auxiliary digital inputs, and reverse-
polarity/overvoltage or short-circuit protection. High-level protection TVS diodes at each of the eight IO-
Link interface ports and at the power-supply inputs provide
An STM32F4 Arm Cortex-M4 microcontroller provides
1kV/42Ω surge and reverse-polarity protection for each
system control. A USB port is implemented using the FTDI
master transceiver on the MAXREFDES145. Additionally,
FT2232 USB-to-SPI transceiver and driver. An on-board
power and status LEDs (for each channel) provide quick visual
MAX15062 high voltage, synchronous step-down converter
confirmation that the board is working and communicating.
provides power to the STM32F4 microcontroller from the 24V

CH1
MAX14819
DUAL-CHANNEL
IO-LINK MASTER
TRANSCEIVER CH2

CH3
SPI1 MAX14819
DUAL-CHANNEL
IO-LINK MASTER
TRANSCEIVER CH4

USB FTDI MAX14931

CONNECTOR STM32F405
USB TO SPI MAX12931
DIGITAL
CH5
ISOLATORS MAX14819
SPI2
DUAL-CHANNEL
IO-LINK MASTER
TRANSCEIVER CH6

CH7
MAX14819
DUAL-CHANNEL
IO-LINK MASTER
TRANSCEIVER CH8

24V 3.3V FOR MCU, ETC.

MAX15062
POWER FUSE STEP DOWN
SUPPLY DC-DC

24V FOR MAX14819

NOTE: NO REVERSE PROTECTION REQUIRED

Figure 24. MAXREFDES145 8-Port IO-Link Master Block Diagram

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Description of Software MAXREFDES145 to be used for development and testing

purposes. Users wishing to design their own products can
The TEConcept CT Windows-compatible GUI software
purchase firmware for the IO-Link master from TE-Concept.
features IODD file import capability, connects to a PC via
Appendix of Technical Resources.
USB, and is available for download from the Design Resources
tab of the MAXREFDES145 product page. The TEConcept CT
software is shown in the Details tab of the MAXREFDES145's
product page and a complete step-by-step Quick Start guide
is also downloadable from the MAXREDES145’s Design
Resources tab.
The TEConcept IO-Link master stack ships preprogrammed
inside the MAXREFDES145 hardware with a perpetual time
license displayed by the TEConcept CT software. This allows

Figure 25. TE Concept IO-Link Software

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IO-Link Handbook www.maximintegrated.com

4-Port IO-Link Master: MAXREFDES165 Description of Hardware

The MAXREFDES165 (Figure 26) is a fully IO-Link-compliant, The MAXREFDES165 IO-Link master comprises of four
4-port IO-Link master reference design. This design uses main blocks: two dual-channel MAX14819 IO-Link master
the TMG TE IO-Link master stack and is both an IO-Link transceivers, a MAX14931 digital isolator for the SPI interface,
master reference design and a development and test system a microcontroller, and a USB connection (shown in Figure 1).
for IO-Link sensors/actuators. Four IO-Link ports allow
The MAX14819 IO-Link master transceivers are IO-Link
for simultaneous testing of up to four different sensors (or
version 1.1.2 physical-layer compliant. These transceivers
actuators). The reference design has four robust female
feature integrated 5V linear regulators, configurable C/Q
M12 connectors—the most common connector used for
outputs (push-pull, high-side, or low-side) with configurable
IO-Link—and ships with an IO-Link cable for connecting
output drive capability, auxiliary digital inputs, and reverse-
quickly to IO-Link-compatible sensors and actuators. An
polarity/short-circuit protection.
AC-to-DC (24VDC/3A) power supply can provide at least
250mA to each port simultaneously, and more when fewer An STM32F4 Arm Cortex-M4 microcontroller in a 10mm
ports are used. A USB 2.0 Type B connector allows for quick x 10mm, 64-pin LQFP package provides system control. A
connectivity to a Windows® PC. USB port is implemented using the FTDI FT2232 USB-to-SPI
transceiver and driver. An on-board MAX15062A high-volt-
age, synchronous step-down converter provides power to the
STM32F4 microcontroller from the 24V supply.
A digital isolator, the four-channel MAX14931F, protects the
USB interface from high-voltage and large ground differentials
that can occur when the MAX14819 master transceivers are
connected to IO-Link peripherals. All communication between
the USB port/PC and the SMT32F4 microcontroller passes
through this isolator.
A stand-alone SPI header (J3) is available on the MAXREF-
DES165 to allow the user to bypass the USB interface and
communicate directly with the STM32F4 using an external
SPI master. J3 is connected to the isolated side of the board
and all digital communication from the external master to
the STM32F4 goes through the isolators. An external 3.3V
logic supply is required to power the isolators when using
J3. High-level protection transient voltage suppressor (TVS)
diodes at each of the four IO-Link interface ports and at the
power supply inputs provide surge and reverse-polarity pro-
tection for each master transceiver on the MAXREFDES165.
Additionally, power and status LEDs (for each channel) pro-
vide quick visual confirmation that the board is working and
communicating. The complete system block diagram is shown
in Figure 27.
Note: The MAX14819 can be configured to operate with a
UART interface (within the microcontroller) or by using the
integrated framers on the IC. The advantage of the framer
Figure 26. MAXREFDES165 4-Port IO-Link Master Reference Design mode includes enabling support from smaller and lower cost
microcontrollers with a limited number of integrated UARTs.
The default stack that ships with the MAXREFDES165 is
the UART version. If you require the Framer version, please
contact the factory.

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24V
MAX14819
DUAL CHANNEL
IO-LINK® MASTER
24V TRANSCEIVER

FTDI
MAX14931 STM32
USB USB-TO-
MICROCONTROLLER
UART DIGITAL ISOLATOR
24V
MAX14819
DUAL CHANNEL
24V IO-LINK MASTER
TRANSCEIVER
MAX1506
2A DC-DC

Figure 27. MAXREFDES165 Reference Design Block Diagram

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IO-Link Handbook www.maximintegrated.com

Description of Software The TMG TE IO-Link master stack ships preprogrammed

inside the MAXREFDES165 hardware with a perpetual
TMG's IO-Link Device Tool Windows-compatible
license. Contact information for TMG TE GmbH is found
software features IODD file import capability, connects
in the list of Software Stack Vendors in the IO-Link
to a PC through USB, and is available on request from
Handbook's Appendix of Technical Resources.
TMG. The TMG IO-Link Device Tool software is shown
in Figure 28, and a complete step-by-step Quick Start
guide is also downloadable from the Design Resources
tab.
Note: The MAX14819 can be configured to operate with
a UART interface (within the microcontroller) or by using
the integrated framers on the IC. The default stack that
ships with the MAXREFDES165 is the UART version.
If you require the Framer version, please contact the
factory.

Figure 28. MAXREFDES165 TMG IO-Link Device Tool

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IO-Link Master Test Reports

The MAXREFDES145 is a fully compliant IO-Link version 1.1.3 master. See the detailed test report (Figure 29) on our website at
MAXREFDES145 8-Port IO-Link Master Test Report.

Figure 29. Details of MAXREFDES145 IO-Link Master Test Report

The MAXREFDES165# is a fully compliant IO-Link version 1.1.3 master, according to the following test report. It was tested with
golden device GD000010. See the detailed test report (Figure 30) for MAXREFDES165# Four-Channel IO-Link Master Test
Report.

Figure 30. Details of MAXREFDES165# IO-Link Master Test Report

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Section 5: Improving System Performance

In IO-Link applications, the transceiver acts as the physical MAX14828
layer interface to a microcontroller running the data link
layer protocol while supporting up to 24V digital inputs and
outputs. Our transceivers have long supported all IO-Link COMPETITOR
specifications and feature the lowest power dissipation.
Our first IO-Link device transceiver, the MAX14820,
dissipated just under 900mW with the drivers under full load MAX14827A
conditions. The second-generation MAX14826 reduced the
already low power dissipation of its predecessor by over 50%,
dissipating only 400mW under full load conditions. MAX22513
The third-generation MAX14828 single-channel transceiver,
and the MAX14827A dual-channel transceiver, dissipate Figure 31. Test A – 200mA per Device
a remarkably low 70mW when driving a 100mA load—
Test B
achieving more than 80% lower power dissipation than the
closest competitive device. For even lower dissipation while In Figure 32, a 200mA load on each channel means that
driving, the C/Q and DO drivers on our transceivers can also dual-channel parts (MAX14827A and MAX22513) have twice
be paralleled. the load of MAX14828 and the competitor part. The thermal
camera clearly shows that the MAX14827A dual-channel
The most recent IO-Link transceiver, the MAX22513, features
device generates less heat or comparable to the competitor’s
a selectable control interface, internal high-efficiency
single-channel device.
DC-DC buck regulator, two internal linear regulators, and
integrated surge protection for robust communication. The
device features low on-resistance drivers (C/Q and DO/DI), MAX14828
selectable driver current limits, and overcurrent protection to
reduce power dissipation in small sensor applications.
Heat Dissipation COMPETITOR
The results of the following tests highlight the evolution of
power dissipation by our device transceivers under different
load conditions compared to our competitors. MAX14827A
Test A
In Figure 31, each IC has a 200mA load on C/Q, meaning dual- MAX22513
channel parts have only one channel loaded. The image (taken
with a thermal camera) clearly shows that the MAX14828
and MAX14827A dissipate significantly less power than the Figure 32. Test B – 200mA per Channel
competitor's single-channel device.

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Test C Apart from a transducer (pressure/temperature/proximity),

In Figure 33, each IC has a 30mA load on the 5V LDO output an IO-Link industrial sensor will also typically include an
(from the integrated linear regulator). For MAX14828, analog front-end (AFE), a microcontroller, status LEDs, and
MAX14827A, and the competitor’s device, the internal LDO possibly an output stage to drive an actuator in response
must dissipate approximately (24V to 5V) x 30mA of power. to sensor readings. Industrial sensors use a 24VDC signal
The thermal camera clearly shows that the MAX22513 voltage, but in a harsh factory environment, this can be up
dissipates significantly less power than the devices without to 50% higher. While these voltage levels can be safely
integrated DC-DC buck converters. This clearly demonstrates used to power the output driver stage, the AFE, LEDs, and
the benefit of the integrated DC-DC and its efficiency microcontroller require much lower voltages (3V to 5V) for
for sensors with an AFE that need more current from the operation. Many IO-Link transceivers provide these voltage
integrated LDOs. The only heat signature for the MAX22513 levels as linear regulated outputs. However, the decision to use
is in fact an external resistor – the IC runs very cool due to the them can have negative implications for overall sensor power
integrated buck converter. consumption (and consequently, heat dissipation). This is
especially true if an onboard LDO circuit is used to provide the
current for these outputs. For example, consider the following
MAX14828 power budget for a small sensor that draws just 15mA of
current through an LDO, powered from a 24V (typ) DC rail,
shown in Figure 34.
COMPETITOR

MAX14827A

MAX22513

Figure 33. Test C – 30mA Load on 5V LDO

Thermal Performance
Most industrial sensors use either an M8 or a larger M12
cable connector. The type of connector used will impact the
enclosure size of the sensor and therefore the amount of heat
that can be dissipated. In the following example, we design
an IO-Link sensor with a total power dissipation that does not
exceed 400mW if an M8 connector is used, or 600mW for a
sensor using an M12 connector.

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1200

1000
100

90 OUTPUT STAGE
800
LED
POWER (mW)

AFE + MICRO
600

M8 TARGET
100 (400mW)

400 90 M12 TARGET

(600mW)
810

200 360

0
15mA SENSOR 30mA SENSOR

Figure 34. Power Budget for a Typical LDO-Powered IO-Link Sensor

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Due to the high losses inside the LDO, this relatively low- For example, a DC-DC buck converter supplying a 30mA
power sensor has exceeded the ~400mW power-budget sensor with a 3V output voltage will dissipate just 90mW.
that can be dissipated in a typical M8-connected sensor, Assuming the converter is 90% efficient (i.e. just 9mW
and therefore, a larger M12-connected enclosure would be power loss), the overall power consumption is just 90 + 9 =
required. Figure 34 also shows that a sensor drawing just 99mW. Clearly, power dissipation is reduced by approximately
30mA of current will dissipate 900mW, exceeding even the a factor of 9 when compared to using the LDO (900mW).
target figure for an M12 connector sensor. Including the power consumed by the output stage (100mW),
Discrete Solution the overall power reduction would be 1000mW/199mW, or
approximately a factor of 5, as shown in Figure 35.
To reduce overall power consumption (and heat dissipation),
the most common solution is to use an external DC-DC buck
converter to power the AFE and the microcontroller.

1000
100
900
90
800

DC-DC LOSS
700
OUTPUT DRIVER
POWER (mA)

600
LED
500
AFE + MICRO
810
400
M8 TARGET
(400mW)
300
M12 TARGET
200 (600mW)
9

100
100 9
81
0
LDO DC-DC

Figure 35. Power Reduction Using a Buck Converter vs. LDO for a 30mA Sensor

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Clearly, the overall power consumption of the sensor (for high-current sensor applications) with a 2.5V to 12V
(~200mW) is now well below the target figure for sensors programmable output voltage. Secondly, unlike most other IO-
using either type of connector. However, this power reduction Link transceivers, the IC also includes a second (auxiliary) IO-
is only achieved at the expense of extra external circuitry (i.e., Link channel which can be used for DI/DO sensor switching
the DC-DC converter and bulky discrete items such as an while data is being transferred on the C/Q channel. Despite
inductor, diodes, and capacitors), which increases the overall the inclusion of these extra features, the overall package size is
size of the sensor. only 2.1 × 4.1 = 8.6mm2 in a wafer-level package (WLP). WLP
Integrated Solution packaging is visually similar to a BGA package with bumps
or balls for soldering to the PCB, but the assembly process
The MAX22513 IO-Link transceiver has several advantages is different as explained in Application Note 1891: Wafer
when compared to the conventional approach. First, a reverse Level Packaging (WLP) and its Applications. This represents
polarity-protected buck DC-DC converter has been fully an almost 50% reduction in component area. Additionally,
integrated into the IC package, meaning there is no need for a robust sensor performance in harsh industrial environments
separate DC-DC converter or additional external components. is provided by integrated surge protection (up to ±1kV/500Ω)
The converter can supply an output current of up to 300mA circuitry that negates the need for external TVS diodes.

9V

5V
1µF
3.3V
1µF 665kΩ 33µH

73.2kΩ 3.3µF

VCC VL V33 V5 FB LIN LX 1µF

2
SPI/I C PV24

GPO CS/A0
SCLK SCLK V24

MISO SDO/SDA
10nF
MOSI L+

MICROCONTROLLER RX RX
MAX22513 DO/DI 1
TX TX DO/DI 2

RTS TXEN 4
3
C/Q
VCCB
DGND L-
1µF

RESET C/Q
GND FREQ
SDI/A1
SGND GND

Figure 36. MAX22513 IO-Link Transceiver with Integrated DC-DC

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The MAXREFDES171 is a distance sensor based on the Advantages of 65V Abs Max for Protection
MAX22513. This board has been tested to pass up to
The MAX14827A and MAX14828 have a guaranteed 65V Abs
±1kV/500Ω between the different pairs of pins. External TVS
Max rating, allowing for flexible protection of the IO-Link pins
diodes may be used in systems that require higher levels of
for surge conditions. While competitor parts require bigger,
protection.
more expensive TVSs, these high Abs Max Maxim ICs only
Selecting a TVS Diode require small, low-cost TVSs/varistors as follows
This section is a subset of the material covered by Application • Smallest TVS diode/standard surge (±1kV/500Ω): Semtech®
Note 6965: How to Select a TVS Diode for Maxim's IO-Link µ Clamp®603; PCB area = 1.7mm2
Devices.
• Lowest cost TVS diode/standard surge (±1kV/500Ω):
IO-Link Protection varistor; cost is ~50% of regular TVS diode
IO-Link devices (sensor transceiver or master transceiver) • High-level surge (±1kV/24A): SMAJ33 TVS diode (vs.
have 4 pins (L+, C/Q, L-, and DI/DO) that need to be competitor SMCJ33 TVS diode); 5x smaller PCB area
protected. When testing for surge protection, for example,
Summary
these pins need to survive surge pulses between any 2 pins
(referred to as line-to-line testing), with both negative and TVS diodes are included on a circuit to protect sensitive
positive polarity surges. It is important to understand the devices. During normal operation, the TVS diode must have
impact that the Abs Max Ratings for these pins have on TVS no significant impact on circuit performance. However, when
diode selection. The following examples demonstrate that the a high-voltage transient occurs, the TVS diode must activate
higher Abs Max values of Maxim IO-Link transceivers enable and limit the voltage across the circuit. Large transient events
the use of significantly smaller TVS products, saving board (such as high voltage and current pulses) typically require
space and cost. large diodes for satisfactory protection. We offer the most
robust IO-Link transceivers with high-voltage tolerances and
How 65V (Abs Max) Helps with Protection (vs. 40V)
abs max ratings of up to 65V to provide greater flexibility
Let's consider a test case and see how the Abs Max Ratings when selecting TVS protection diodes. Additionally, devices
can affect the final footprint of the circuit. Figure 37 shows the such as the MAX22513 integrate surge protection and remove
current flow and voltages across the protection scheme when the need for external TVS devices in many applications.
a transient surge pulse is applied to the C/Q pin (referenced to
L-) on the MAX14827A. Using the standard 42Ω impedance
between the surge pulse (±1kV) and the device, the maximum
current flow is ±24A.

5V

3.3V 1µF

1µF THIS TVS IS BOARD BASED

VOLTAGE DROP -1V

VL V33 V5 REG THIS TVS WILL CLAMP TO

V24 CLAMPING
SP/PIN
0.1µF VOLTAGE RATING (61.7V)
IRQ/OC
LED1IN
L+

WU
MAX14827A DO
DI/DO
2
1

4
RX DI 3
C/Q
TX
GND
L-
TXEN -62.7V
UARTSEL C/Q SURGE CURRENT
FLOW

Figure 37. C/Q to L+ Surge

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IO-Link Handbook www.maximintegrated.com

How Does the IO-Link Signal Slew Rate Affect Emissions IO-Link cables aren’t shielded and the signal-level is quite
From the IO-Link Cable? high (24VP-P). So the cable can act as an antenna. To reduce
emissions from the cable it’s important to limit the maximum
Most Maxim IO-Link transceiver drivers have a controlled
frequency available on the cable to the minimum necessary.
slew rate or even adjustable slew rate for the CQ pin, i.e.
MAX14819, MAX14827A, MAX14828 have slew-rate limiting. The rise and fall-time of the IO-Link as specified for
MAX22513 has selectable slew rate. MAX22513 are specified as follows in Table 4.

Table 4. Rise and Fall Time of MAX22513

0.1, 0.2, 0.325

0.40

Push-Pull or PNP mode,

Driver Rise Time tRISE µS
V24(max) = 30V
1.22

4.7

0.2, 0.34, 0.475

0.66
Push-Pull or NPN mode,
Driver Fall Time tFALL µS
V24(max) = 30V
1.64

7.1

While the steepest rise and fall times (typ 0.2µs fall-time / typ 0.34µs rise-time) have strong transmit frequency components up
to 1.8MHz, Max-Frequency = 1/T, while T= tRISE + tFALL. This also means the frequency content of the signal on the cable is 1.8MHz.
However, the IO-Link Signaling fundamental frequency for highest IO-Link data rate of COM3 = 230.4kbps is 115.2kHz.
To reduce emissions from the cable it’s better to use the slowest rise- and fall-times that still allow communication. Therefore it is
recommended to reduce the slew rate when the COM rate is lower.
tRISE + tFALL = 0.2µs + 0.34µs result in a maximum frequency of about 1.8MHz.
tRISE + tFALL = 0.4µs + 0.66µs result in a maximum frequency of about 934kHz.
tRISE + tFALL = 1.22µs + 1.64µs result in a maximum frequency of about 349kHz.
tRISE + tFALL = 4.7µs + 7.1µs result in a maximum frequency of about 84.74kHz.

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Electromagnetic Compatibility (EMC) Requirements EMC Test Levels

Industrial environments are harsh and system designers must Table 5 shows the various system-level EMC test levels from
meet minimum EMC requirements to ensure IO-Link devices Table G.2 of the IO-Link Interface and System Specification.
can survive some common transients. We start by designing
robust IO-Link ICs which typically meet these levels:
• ESD: ±8kV for air discharge
• ESD: ±4kV for contact discharge (based on the IEC
61000-4-2 standard).
Note: The IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment, but does not specifically
refer to integrated circuits.

Table 5. IO-Link EMC Test Levels

Performance
Phenomena Test Level Constraints
Criterion
Electrostatic discharges (ESD) Air discharge: ±8kV
B See G.1.4. a)
IEC 61000-4-2 Contact discharge: ±4kV
80MHz to 1000MHz
10V/m
Radio-frequency electromagnetic
field. Amplitude modulated. 1400MHz to 2000MHz
A See G.1.4. a) and G.1.4, b)
3V/m
IEC 61000-4-3
2000MHz to 2700MHz
1V/m
5kHz only. The number of
±1kV A M-sequencers in Table G.1 shall be
Fast transients (Burst)
increased by a factor of 20 due to the
IEC 61000-4-4 burst/cycle ratio 15ms/300ms.
±2kV B
See G.1.4,c)
Surge Not required for an SDCI link
—
IEC 61000-4-5 (SDCI link is limited to 20 m)
Radio-frequency common mode 0.15MHz to 80MHz
A See G.1.4. b) and G.1.4, d)
IEC 61000-4-6 10V EMF
Voltage dips and interruptions
Not required for an SDCI link —
IEC 61000-4-11

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Physical Layer: EMC Requirements Standardized

Note that the IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment, but does not specifically
refer to integrated circuits. Typically, our transceivers can
withstand around 1.5kV ESD transients on their own (based
on the military standard used in the reliability reports) but
will generally need external TVS diodes for added protection. Generator
Capacitive
Clamp
20m Cable

However, we have reduced the size and requirements of these

IO-Link Master CDN
external diodes and reduced the BOM to save space and IO-Link Sensor

Ground plane
external component cost. Industrial environments are typically
harsh requiring additional protection for circuits!
The IO-Link specification requires for equipment to be Figure 38. EFT Burst and Surge Testing Bench
appropriately protected for robust operation:
• ESD: ±8kV for air discharge
• ESD: ±4kV for contact discharge (based on the IEC
61000-4-2 standard)
• Surge: Not required when the cable length is limited to
20m. Otherwise, protection levels range from ±500V to
±2kV
• Burst: ±1kV or ±2kV
While transceivers are increasingly robust, external protection
is necessary for:
• ESD protection for the end product
• Surge and burst protection (TVS diodes)
• Optimized layout

Immunity Testing
Figures 38 and 39 demonstrate EFT, Surge, and ESD testing
of the MAX14819 in the MAXREFDES145 8-port master or
a device like the MAX22513 in the MAXREFDES171 sensor.
The setup in Figure 38 is only for surge testing. Board-level
transient immunity standards include:
• IEC 61000-4-2 Electrostatic Discharge (ESD)
• IEC 61000-4-4 Electrical Fast Transient/Burst (EFT)
• IEC 61000-4-5 Surge Immunity
Figure 39. ESD Testing of MAX14819

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Section 6: IO-Link Solutions Our solutions are small and only getting smaller! Our IO-
Link transceivers (Figure 40) are currently available in
Why Choose Maxim IO-Link Transceivers? compact TQFN and WLP packages. The latest transceiver,
We joined the IO-Link consortium in 2009. We have a proven the MAX22513, is offered in a WLP package and reduces
track record of long-term dedication and commitment to the solution footprint by up to 50% compared to competitor
the industrial market and to our customers by having the parts. As our transceivers increase in robustness, less external
industry’s most complete IO-Link and binary sensor portfolios. protection is required. With higher absolute maximum ratings,
These include the MAX14828, MAX14827A, and MAX22513 external protection components such as external protective
device transceivers and the MAX14824 and MAX14819 diodes, can be smaller. Our transceivers include integrated
master transceivers. Note that IO-Link transceivers can also 3.3V and 5V LDOs that can power external circuitry, reducing
be used in binary sensor applications. the need for external LDOs and keeping the overall solution
We have developed a complete ecosystem to make design- small. Additionally, the MAX22513 has an integrated DC-
in fast and easy. The evaluation kits for all our transceivers DC converter to reduce power dissipation for higher current
include software (for configuration and reading/writing to sensors.
the transceiver). Our IO-Link reference designs include both
sensors and masters. Our dedicated team of designers,
product definers, and applications engineers are readily
available to provide customer support.

Non-Maxim Solution Older Maxim Solution MAX14827A Solution MAX22513 Solution

• Single Channel • Dual Channel • Dual Channel • Dual Channel

• 3 External Diodes Required • 2 External Diodes Required • WLP Lowers Footprint By 60% • WLP Lowers Footprint By 50%
• Dissipates 80% Less Power • Dissipates 50% Less Power
• Integrated DC-DC

Figure 40. IO-Link Transceiver Solution Comparison

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IO-Link Handbook www.maximintegrated.com

Product Selector Guide

Our long and committed history with IO-Link technology has resulted in the development of multi-generation transceivers on both
the master and device side that focus on low power dissipation, small solution size, and robust communications (Table 6). With a
full ecosystem of IO-Link device and master reference designs and evaluation kits, we are focused on providing quick evaluation of
IO-Link technology.

Table 6. IO-Link Transceivers

Part Number Interface Description

IO-Link Master Transceivers
MAX14819 IO-Link Low-power dual-channel IO-Link master transceiver + supply controllers + UART/Framer + DI
MAX14824 IO-Link Single-channel IO-Link transceiver
IO-Link Device Transceivers

MAX14828 IO-Link Tiny low-power single-channel IO-Link device transceiver

MAX14827A IO-Link Tiny low-power dual IO-Link device transceiver
MAX14829 IO-Link Pin-driven, low-power dual IO-Link device transceiver
MAX22513 IO-Link Surge-protected dual-channel IO-Link device transceiver with DC-DC
MAX22515 IO-Link Pin or I2C mode, dual-channel IO-Link device transceiver with surge protection
IO-Link Sensor Drivers

MAX14838 Binary 24V/100mA pin-configurable industrial sensor output driver + protection

MAX14839 Binary 24V/100mA pin-configurable industrial sensor output driver + protection, 5V LDO
MAX14832 Binary 24V/100mA one-time-programmable (OTP) industrial sensor output driver + protection
MAX14836 Binary 24V dual-output sensor transceiver
MAX22520 Binary 24V one-time-programmable (OTP) industrial sensor with analog signal sensing circuitry

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100mA Tiny Binary Sensor Drivers:

MAX14838/MAX14839
The MAX14838/MAX14839 24V/100mA drivers are
LEDS LED2
optimized for use in industrial sensors. These devices integrate 100nF
LDO
VCC 24V
100nF
the high-voltage (24V) circuitry commonly found in industrial
FAULT
sensors, including a configurable PNP/NPN/push-pull driver SENSOR LED2IN DO OUT
MAX14838
and an integrated linear regulator that meets common sensor AFE
DIN MAX14839
power requirements. NPN
GND GND
PP
• Pin-Selectable High-Side (PNP), Low-Side (NPN),
NO
or Push-Pull Driver
• On-Chip 5V Linear Regulator (MAX14838)/3.3V Linear
Regulator (MAX14839) (Figure 41)
• Dual Integrated 2mA LED Drivers
• Integrated Protection Provides Robust Sensor Solutions
– Reverse-Polarity Protection on DO, VCC, and GND
– 4.75V to 34V Supply Range (MAX14839)
– VCC Hot-Plug Protection
WLP (2.1mm x 1.6mm)
– Thermal Shutdown Protection
– ±8kV IEC 61000-4-2 Air Gap ESD Protection Figure 41. MAX14838/MAX14839 Binary Sensor Driver
– -40°C to +105°C Temperature Range
– ±1kV/500Ω Surge Protection

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IO-Link Handbook www.maximintegrated.com

OTP Programmable Sensor Interface: MAX22520 - Programmable Driver Current Limit: 100mA or 200mA
The MAX22520 (Figure 42) industrial sensor output driver is Linear Regulator with Programmable Output: 3.3V or 5V
configurable using Maxim's 1-Wire protocol and OTP interface - Comparator with Programmable Threshold
to permanently operate in either normally-open or normally-
- Digital Potentiometer with Programmable 6-Bit Tap
closed configuration in PNP (high-side), NPN (low-side), or
push-pull modes. The maximum load current is One-Time - Oscillator with Programmable PWM Duty Cycle
Programmable (OTP) to either 100mA or 200mA. • Robust Design
The device also features an OTP programmable comparator, - Fast Demagnetization of Inductive Loads
PWM oscillator, and digital potentiometer. These blocks
- Reverse Polarity Protection on DO, VCC, GND
support calibration of sensors via signal generation and signal
conditioning of analog sensing circuitry. An integrated LED - Short Circuit Protection on DO
driver provides visual feedback of the binary sensor’s logic - Overtemperature Protection
state.
- ±8kV IEC61000-4-2 Air-Gap ESD Protection
• High Configurability
- ±6kV IEC61000-4-2 Contact Discharge ESD Protection
- 4.75V/8V (min) to +36V Supply Voltage
- ±1kV/500Ω IEC61000-4-5 Surge Protection
- Programmable Driver Configuration:
- -40°C to +105°C Operating Temperature Range
0 PNP/NPN/Push-Pull
• Small Form Factor for Compact Designs
- Ultra-Small (2mm x 2.5mm) 20-Bump WLP
- Integrated LED Driver for Visual Feedback

LED VLDO REGEN

RT

WP LINEAR INTEGRATED
LED DRIVER VCC
REGULAOR PROTECTION
RB

POR

CMPO
INTEGRATED
DRIVER DO
AIN PROTECTION
STRETCH

LO3 DAC
OTP
OSC PWM

LO2

MAX22520
LO1

GND PGND

Figure 42. MAX22520 OTP Industrial Sensor Output Driver

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Dual 250mA IO-Link Transceiver: MAX14827A The device includes on-board 3.3V and 5V linear regulators
for low-noise analog/logic supply rails. The MAX14827A is
The MAX14827A integrates the high-voltage functions
available in a 24-pin TQFN package and a 25-pin WLP and
commonly found in industrial sensors, including drivers and
is specified over the extended -40°C to +125°C temperature
regulators. The MAX14827A features two ultra-low-power
range.
drivers with active reverse-polarity protection (Figure 43).
Operation is specified for normal 24V supply voltages up to • Lowest Power and Smallest IO-Link Transceiver
60V. Transient protection is simplified due to high-voltage – WLP Package (2.5mm x 2.5mm)
tolerance allowing the use of micro TVS.
– TQFN Package (4mm x 4mm)
The device features a flexible control interface. Pin control
• Low 2.3Ω (typ) RON Reduces Power Consumption
logic inputs allow for operation with switching sensors
that do not use a microcontroller. For sensors that use • Robust Protection: 65V Absolute Maximum for Smaller
a microcontroller, an SPI interface is available with External Protection and Reverse-Polarity/Short-Circuit
extensive diagnostics. For IO-Link operation, a three-wire Protection
UART interface is provided, allowing interfacing to the • A single-channel version, the MAX14828 is also available
microcontroller UART. Finally, a multiplexed UART/SPI option and this device has an even lower RON of 1.2Ω.
allows using one serial microcontroller interface for shared SPI
and UART interfaces.

LED1 LED2* VL V33 V5 REG V24

3.3V
5V REG
LED1IN LED DRIVER LDO

MAX14827A
REV POL
SPI/PIN UVLO PROTECTION

VDRV
IRQ/QC
CS/PP CONTROL
SDI/TX/NPN AND
CLK/TXEN/200MA MONITOR
SDO/RX/THSH
PROTECTION C/Q
TRANSCEIVER
RX
TX
TXEN
UARTSEL
WU WAKE-UP DETECT

LI DI
VDRV

LO DRIVER PROTECTION DO

GND

* WLP PACKAGE ONLY

Figure 43. MAX14827A Dual-Channel IO-Link Transceiver

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Pin-Control, Low-Power, Dual-Channel IO-Link • Low Power Dissipation Reduces the Thermal Footprint for
Device Transceiver: MAX14829 Small Sensors
The MAX14829 dual-channel low-power IO-Link device • 2.3Ω/2.7Ω (typ) Driver On-Resistance
(Figure 44) features a pin-based interface for control, • 70mW (typ) Power Dissipation at 100mA When Both
configuration, and monitoring. Pin-control logic inputs C/Q and DO Drivers Are Driving
allow for operation with switching sensors that do not use
• High Configurability and Integration Reduce SKUs
a microcontroller. For IO-Link operation, a three-wire UART
interface is provided, allowing interfacing to the UART. The • Auxiliary 24V Digital Output (DO) and Input (DI)
MAX14829 has selectable driver current from 100mA to • Selectable Driver Integrated Protection Enables Robust
330mA. Communication
• 65V Absolute Maximum Ratings on Interface and Supply
Pins Allows for Flexible TVS Protection
• Reverse Polarity Protection of All Sensor Interface Inputs/
Outputs

VL V33 V5 REG LOW24 UV24 V24

3.3V 5V UV
LDO LDO DETECT
AR
INTEGRATED
CL0 DRIVER
CURRENT MAX14829 PROTECTION
CL1 LIMITING VDRIVER

CQEN

TRANSCEIVER
TXEN
INTEGRATED
TX C/Q
PROTECTION
CQEN

RX
CQOL

WU WAKE-UP DETECT

LI DI

DRIVER VDRIVER

DOEN

LO INTEGRATED
DO
PROTECTION

DOOL

GND

Figure 44. MAX14829 Pin-Control, Dual-Channel IO-Link Transceiver

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Surge-Protected Dual-Channel IO-Link Device surge with a total source impedance of 500Ω. Surge testing
Transceiver with DC-DC: MAX22513 was performed using the MAXREFDES145 IO-Link master, and
The MAX22513 dual-channel low-power IO-Link device 10 surge pulses were applied for each test as shown in Table 7.
transceiver (Figure 45) features a selectable control interface, The MAXREFDES171 was not damaged by the tests.
internal high-efficiency DC-DC buck regulator, two internal • L+ to GND: Communicating with the master, the module
linear regulators, and integrated surge protection for robust continued to execute code and transfer data, and the
communication. The device features low on-resistance MAX22513 registers were not corrupted.
drivers (C/Q and DO/DI), selectable driver current limits, and • C/Q to GND: Communicating with the master, the
overcurrent protection to reduce power dissipation in small module continued to execute code and transfer data, and
sensor applications. the MAX22513 registers were not corrupted.
The MAX22513 features extensive integrated protection • L+ to C/Q: Communicating with the master, the module
to ensure robust communication in harsh industrial continued to execute code and transfer data, and the
environments. All four IO pins (V24, C/Q, DO/DI, and GND), MAX22513 registers were not corrupted.
are reverse-voltage-protected, short-circuit-protected, and
feature an integrated ±1kV/500Ω surge protection. Table 7. Surge Testing Results
Surge Testing Test Condition L+ to GND CQ to GND L+ to CQ
+1kV Pass Pass Pass
The MAXREFDES171 (with the MAX22513) module was
tested to withstand up to ±1kV of 1.2/50µs IEC 61000-4-5 -1kV Pass Pass Pass

VL V33 V5 LIN VCCB LX FB FREQ PV24

3.3V 5V INTEGRATED
DC-DC V24
RESET REGULATOR REGULATOR PROTECTION

GND
REGULATOR 5V LDO
MCLK DIVIDER
SPI/I2C V5
V5
IRQ 3V
CS/ 14.74MHz
A0 OSCILLATOR
SPI/I2C
SCLK REGISTERS MAX22513
SDI/A1
SDO/SDA

C/Q INTEGRATED
TXEN TRANSCEIVER C/Q
PROTECTION
TX
RX DGND

WAKE-UP
WU
DETECT

DO_EN
INTEGRATED
LO/LI DO/DI
PROTECTION

DO_EN

SGND GND

Figure 45. MAX22513 Dual-Channel IO-Link Transceiver with DC-DC Converter

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IO-Link Transceiver with Integrated Protection: The MAX22515 features extensive integrated protection
MAX22515 to ensure robust communication in harsh industrial
environments. All IO-Link line interface pins (V24, C/Q,
The MAX22515 low-power industrial transceiver (Figure
DI, and GND) are reverse-voltage-protected, short-circuit-
46) operates as either an IO-Link device or a non-IO-Link
protected, hot-plug-protected, and feature integrated
sensor transceiver in industrial applications. The MAX22515
±1.2kV/500Ω surge protection.
features a selectable control interface (pin-mode or I2C), two
integrated linear regulators, and integrated surge protection The MAX22515 is available in a tiny WLP package (2.5mm
for robust communication. The transceiver includes one C/Q x 2.0mm) or a 24-pin TQFN-EP package (4mm x 4mm) and
input-output channel and one digital input (DI) channel. operates over the -40°C to +125°C temperature range.
The device features a flexible control interface. Pin-control
logic inputs allow for operation with switching sensors
that do not use a microcontroller. For sensors that use a
microcontroller, an I2C interface is available to provide
extensive configuration and diagnostics. Additionally, an
integrated oscillator simplifies the clock generation for IO-Link
devices.

VL V33 V5 LIN

LOGIC
SUPPLY 3.3V LINEAR 5V LINEAR INTEGRATED
PROTECTION V24
REGULATOR REGULATOR
A0/CLKEN

MCLK DIVIDER 29.49MHz

OSCILLATOR MAX22515
EN/POK

SCL/100MA
CONTROL C/Q INTEGRATED
SDA/WU WAKE-UP PROTECTION C/Q
INTERFACE TRANSCEIVER
WU/IRQ DETECTION

I2C/PIN
TX
TXEN
RX
INTEGRATED
LI PROTECTION DI

SGND GND

Figure 46. MAX22515 Block Diagram

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Dual-Channel IO-Link Master Transceiver: The MAX14819 integrates two low-power sensor supply
MAX14819 controllers with advanced current limiting, reverse-current
blocking on L+, and reverse-polarity protection capability to
The MAX14819 low-power, dual-channel, IO-Link master
enable low-power robust solutions.
transceiver with sensor/actuator power-supply controllers
(Figure 47) is fully compliant with the latest IO-Link and The MAX14819 is available in a 48-pin (7mm x 7mm) TQFN
binary input standards and test specifications, IEC 61131-2, package and is specified over the extended -40°C to +125°C
IEC 61131-9 SDCI, and IO-Link 1.1.3. This master transceiver temperature range.
also includes two auxiliary Type 1/Type 3 digital input (DI) • Low-Power Architecture
channels. The MAX14819 is configurable to operate either
– 1Ω (typ) Driver On-Resistance
with external UARTs or using the integrated framers on
the IC. To ease selection of a microcontroller, the master – 1.9mA (typ) Total Supply Current for 2 Channels
transceiver features frame handlers with UARTs and FIFOs. • Integrated Protection Enables Robust Systems
These are designed to simplify time-critical control of all IO-
Link M-sequence frame types. The MAX14819 also features
autonomous cycle timers, reducing the need for accurate
controller timing. Integrated communication sequencers also
simplify wake-up management.

VL V5 REGEN VCC G1A G1B SN1A SN1B SN2A SN2B G2A G2B

REG
MAX14819

XI
XO XTAL L+ SUPPLY CONTROLLER L+A
OSCILLATOR ESTABLISH
CLKI L+B
COMM
CLKO

RXA
RXB CQA
TXENA
TXENB
CQB
TXA DRIVER
TXB
RXERRA/LD2A
RXERRB/LD2B
FRAME HANDLER
RXRDYA/LD1A
RXRDYB/LD1B DIA

DIB
IRQ
SDI SYNC CYCLE TIMER
SDO SPI CHANNEL A
SCLK REGISTERS
CHANNEL B
CS

A1 A0 GND LIB LIA

Figure 47. MAX14819 Dual IO-Link Master Transceiver

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Evaluating an IO-Link Device Evaluating an IO-Link Master

The MAX22513 evaluation kit (EV kit) consists of a The MAX14819 evaluation kit (EV kit) consists of the
MAX22513 evaluation board that is a fully assembled and evaluation board and software. The EV kit (Figure 49) is a
tested circuit board that evaluates the MAX22513 IO-Link fully assembled and tested circuit board that evaluates the
device transceiver. The MAX22513 EV kit (Figure 48) is MAX14819 IO-Link dual-channel master transceiver. The
designed to operate as a stand-alone board or with an MAX14819 EV kit includes Windows-compatible software
Arduino®-compatible board (not supplied) for easy software that provides a GUI for exercising the features of the device.
evaluation. The EV kit provides the user with an IO-Link- The EV kit is connected to a PC through a USB A-to-micro B
compliant device transceiver with a proven PCB layout. The cable. The EV kit does NOT include an IO-Link master stack.
EV kit is fully assembled and tested with a free GUI to make
it easy to use for product evaluation and testing. The EV kit
does NOT include an IO-Link device stack.

Figure 49. MAX14819 Evaluation Kit

Figure 48. MAX22513 Evaluation Kit

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Industrial IO-Link Reference Designs Maxim Reference Design Use Restrictions and
To help our customers reduce their product development Warnings
time, we have developed (in collaboration with IO-Link stack Our reference designs have been verified and tested to meet
software vendors) a range of IO-Link reference designs (Table IO-Link specifications while operating in harsh industrial
8). Each reference design includes high-performance products environments, as required by IEC 61000-4-x standards for
in tested circuits . transient immunity.
All reference designs are provided with an IO-Link stack for Our reference design boards and associated software are
use while evaluating this design. designed to evaluate the performance of our IO-Link ICs but
are not intended to be deployed as-is into an end-product
in a factory automation system, nor should they be used in
functional safety and/or safety critical systems.
All reference designs are provided with an IO-Link stack for
use while evaluating this design.

Table 8. IO-Link Reference Designs

Reference Design Maxim IO-Link Transceiver Maxim Sensor/IO ICs Description
IO-Link Sensor
MAXREFDES23 MAX14821 MAX44008 IO-Link Optical Light Sensor (TMG)
MAXREFDES27 MAX14821 MAX44000 IO-Link Optical Proximity Sensor (TMG)
MAXREFDES36 MAX14821 MAX31913 IO-Link 16-Channel Digital Input Hub (TMG)
MAXREFDES37 MAX14821 MAX14821 IO-Link Quad Servo Driver (TMG)
MAXREFDES42 MAX14821 MAX31865 IO-Link RTD Temp Sensor (IQ2)
MAXREFDES163 MAX14839 MAX14839 Binary Industrial Magnetic Sensor
MAXREFDES164 MAX14828 MAX31875 IO-Link Local Temp Sensor (TMG and TEConcept)
MAXREFDES171 MAX22513 MAX22513 IO-Link Distance Sensor (TMG)
MAXREFDES173 MAX14827A MAX31875 IO-Link Local Temp Sensor (IQ2)
MAXREFDES174 MAX22513 MAX22513 IO-Link Distance Sensor (IQ2)
MAX22190,
MAXREFDES176 MAX22515 IO-Link Digital Input Hub (TMG)
MAX22192
IO-Link Master
MAXREFDES79 MAX14824 MAX14824 4-Port IO-Link Master (TEConcept)
MAXREFDES145 MAX14819 MAX14819 8-Port IO-Link Master (TEConcept)
MAXREFDES165 MAX14819 MAX14819 4-Port IO-Link Master (TMG)
MAXREFDES212 MAX14819 MAX14819 Go-IO with 4-Port IO-Link Master (TMG)

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Digital Input Hub: MAXREFDES176 By default, Type 1 and Type 3 sensors are supported but Type
2 sensors and can also be supported by modifying a resistor
The MAXREFDES176 (Figure 50) consists of a MAX22515
value which controls the value of the current source within the
IO-Link transceiver with integrated protection, and
devices. The MAXREFDES176 uses an industry-standard M12
demonstrates an isolated digital input hub using the
connector, allowing a 4-wire cable to be used. Digital inputs
MAX22192 isolated octal digital input device which is daisy-
use industry-standard PCB terminal blocks.
chained with the MAX22190 octal digital input device to
provide a total of 16 input channels. The stack is available from
TMG or TEConcept.

IO-LINK SIDE FIELD SIDE

LDO OUTPUT
3V3 VDD1 VDD24

CS
IRQ DI_IN9
+24V SCL MISO
MAX22192
I2C AND UART

SDA MOSI
2 1
MAX22515 Atmel ATSAM DI_IN16
UART0_TX
_ SCLK ISOLATED OCTAL
LOW-POWER
3 4 IO-LINK TRANCEIVER DI_9
UART0_RX MICROCONTROLER FAULT DIGITAL INPUT
C/Q
WU LATCH
DO/DI AFS
GND LI/LO DI_16

DAISY-
CHAINED
SPI
VDD24 VL2

DI_IN1

MAX22190
DI_IN8
OCTAL
DI_1
DIGITAL INPUT

DI_8

V24_EXT VDD24
EARTH IN OUT

MAX17612

CURRENT LIMITER
WITH OV,UV AND
REVERSE PROTECTION

Figure 50. MAXREFDES176 Digital Input Concentrator

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Appendix of Technical Resources

Software Stack Vendors
Typically, IO-Link master and sensor manufacturers require a third party to generate the software stack. We have collaborated
with key software vendors to support our IO-Link transceivers for sensor and master designs. Please contact our software partners
directly for specific details of their products.

TEConcept GmbH
Wentzingerstraße 21
79106 Freiburg
Germany
Phone: +49 761 214436 40
Email: otto.witte@teconcept.de
Web: www.teconcept.de

Technologie Management Gruppe

Technologie und Engineering GmbH
Zur Gießerei 10
76227 Karlsruhe
Germany
Phone: +49 721 8280 60
Email: willems@tmgte.de
Web: www.tmgte.com

IQ² Development GmbH & Co. KG

Carl-Benz-Straße 3
72585 Riederich
Germany
Phone: +49 7127 5706100
Fax: +49 7127 5706102
E-Mail: info@iq2-development.de
Web: www.iq2-development.de

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TMG Technologie und Engineering

Note: The following information is provided by TMG Technologie und Engineering as an example of the types of products and
services each software vendor provides. Please contact the software partner for further details..

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TMG Technologie und Engineering

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TMG Technologie und Engineering

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TMG Technologie und Engineering

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TMG Technologie und Engineering

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TMG Technologie und Engineering

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TEConcept Tools
Note: The following information is provided by TEConcept as an example of the types of products and services each software
vendor provides. Please contact the software partner for further details.

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TEConcept Tools

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TEConcept Tools

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TEConcept Tools

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TEConcept Tools

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TEConcept Tools

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TEConcept Tools

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IQ2 Development Tools

Note: The following information is provided by IQ2 as an example of the types of products and services it provides. Please contact
them for further details.

Complete Hardware and Software example for Complete Hardware and Software example for
DEVICE STACK integration DEVICE STACK integration
To simplify IQ2 Device stack integration into Customers device, a complete example To simplify IQ2 Device stack integration into Customers device, a complete example
(hardware and software) is available: (hardware and software) is available:
1. Hardware 1. Hardware
a. Hardware is based on “MAXIM IO-LINK TEMPERATURE SENSOR a. Hardware is based on “MAXIM IO-LINK LASER DISTANCE SENSOR
(MAXREFDES173)” Device. See more: www.maximintegrated.com (MAXREFDES174)” Device. See more: www.maximintegrated.com

b. IO-Link device transceiver: MAX14827A (Low-Power, Ultra-Small, Dual Driver, IO-Link b. IO-Link device transceiver: MAX22513 (Surge Protected Dual Driver IO-Link Device
Device Transceiver) Transceiver with DC-DC)
c. Sensor: MAX31875 (Low-Power I2C Temperature Sensor) c. Sensor: VL53L1X (long distance ranging Time-of-Flight sensor)
d. Main microcontroller: Renesas RL78/G1A d. Main microcontroller: Renesas RL78/G1A
2. Software 2. Software
a. IO-Link Device stack: IQ2 Development, https://www.iq2-development.com/products/iqstacks.html a. IO-Link Device stack: IQ2 Development, https://www.iq2-development.com/products/iqstacks.html
b. IO-Link Device application: IQ2 Development. b. IO-Link Device application: IQ2 Development.

The MAXREFDES173 is an IO-Link® temperature sensor reference design uses a ±2°C-accurate local temperature The MAXREFDES174 is an IO-Link® distance sensor reference design uses a long distance ranging Time-of-Flight
sensor with I2C/SMBus interface (MAX31875) and Low-Power, Ultra-Small, Dual Driver, IO-Link Device Transceiver sensor (VL53L1X) and Surge Protected Dual Driver IO-Link Device Transceiver with DC-DC (MAX22513).
(MAX14827A). The sensor uses IQ2 Development’s IO-Link device stack to communicate to any IO-Link version 1.1-compliant
The sensor uses IQ2 Development’s IO-Link device stack to communicate to any IO-Link version 1.1-compliant master (for example: iqLink (https://www.iq2-development.com/products/iqlink.html).
master (for example: iqLink (https://www.iq2-development.com/products/iqlink.html). The board also contains a male M12 connector for connection to a compliant IO-Link master using a
The board also contains a male M12 connector for connection to a compliant IO-Link master using a standard M12 standard M12 cable.
cable.

www.iq2-development.com www.iq2-development.com

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IQ2 Development Tools

DATA SHEET iqLink USB IO-LINK MASTER DATA SHEET iqLink USB IO-LINK MASTER

Registrations / Checks
DIN EN 61000-6-2:2005
EMV Guideline 2014/30/EU DIN EN 61000-6-4:2007+A1:2011
DIN EN 61131-9:2013

24 RoHs Guideline 2011/65/EU fulfilled

Mechanical data
1
Weight, kg 0,066 kg (net) / 0,106 kg (gross)
1: mini USB
2: LED operating condition/ 2 Material Aluminium anodized
error message
3: 24 V DC Ø5,5/2,1mm
Display / Diagnose
4: M12x1 Type A female Display Operation condition:
3 4 LED green light permanently on = iqLink ready,
no IO-Link Communication
LED green light, active IO-Link communication flashes
at 900 msec and 100 msec off = iqLink ready
Diagnose error indication:
LED red light permanently on (LED green light out) =
please send iqLink to the manufacturer
Product features Electrical connection
USB IO-Link Master Connection Assignment::
Parameterize devices and monitoring of process data
1: +24 V 1: +5 V
Supported communication protocols: IO-Link, 2: not occupied 2: D-
1 2
3: GND 3: D+
COM 1 (4.8 kBit/s) / COM 2 (38.4 kBit/s) / COM 3 (230 kBit/s) 4: IO-LINK: CH1 (C/Q)
5
4: not occupied
4 3
For operation with iqPDCT (Port and Device Configuration Tool) 5: not occupied 5: GND

Electrical data Remarks

Output voltage in USB mode, V 24 V DC ± 10% IO-Link Master Transceiver: Maxim MAX14819ATM+
Output voltage with external power supply, V 24 V DC ± 6V (max. input voltage) Main Microcontroller Renesas RL78/G13 (R5F100)
Output current in USB mode, mA 80 mA Packaging unit, pieces 1 Piece
Output current with external power supply, A max. input current <2,5 A Country of origin DE

Input voltage on USB mode, V 5 V DC HS-Code 85437090

Input voltage with external power supply, V 24 V DC ± 6V (according to DIN EN60950)

Recycling remarks
Input current in USB mode, mA max. 600 mA This product is to be supplied after his use according to the topical disposal regulations of your administrative district,
country and state as an electronic industry waste of a separate disposal.
Input current with external power supply, A max. 2,5 A
Outputs The information contained in this data sheet was compiled with the greatest possible care.
For correctness, completeness and actuality the liability is limited to coarse fault.
Short-circuit protection yes
Interfaces
IO-Link-Master transmission type COM 1 / COM 2 / COM 3
IO-Link revision V1.0 and V1.1
Number of ports 1
Port class M12x1 / Type A / female
Environmental conditions
Ambient temperature, °C 0 to +55 °C
IP protection class IP 20
Version v.1.4.1 (dated 03/19)
2
IQ Development GmbH & Co. KG, Carl-Benz-Str. 3, 72585 Riederich
www.iq2-development.de, info@iq2-development.de

2
IQ Development GmbH & Co. KG, Carl-Benz-Str. 3, 72585 Riederich
www.iq2-development.de, info@iq2-development.de

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IO-Link Glossary
(Reprinted with permission from www.io-link.com.)

Acyclic data Data transmitted from the controller only after a request (e.g., parameter data, diagnostic data).

COM1-3 IO-Link data transmission rates.

Cyclic data Data that is transmitted by the controller automatically and at regular intervals (process data, value status).

DI Digital input.

DQ Digital output.

GSD file The properties of a PROFINET device are described in a GSD file (generic Station Description), which
contains all information required for configuring.

HMI Human machine interface of an automatic system.

IEC 61131-9 International standard that deals with the basics of programmable controllers. Part 9 describes IO-Link
under the designation Single-drop digital communication interface for small sensors and actuators (SDCI).

IODD Electronic device description of devices (IO Device Description).

IO-Link device Field device that is monitored and controlled by an IO-Link master.

IO-Link master Represents the connection between a higher-level fieldbus and the IO-Link devices. The IO-Link master
monitors and controls the IO-Link devices.

Parameter An IO-Link master according to IO-Link Specification 1.1 can act as a parameter assignment server for the
Assignment server IO-Link device.

Port A port is an IO-Link communication channel.

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IO-Link FAQs Q: Why does IO-Link support three different data rates?
A: Many industrial systems have existed for many
Q: What components are recommended for protection
years. While data rates in communication systems
during burst events?
have increased significantly, many of those original
A: We generally recommend that customers place pads for sensors (often still operating in their original systems)
two capacitors (~220pF) on the C/Q line (one to GND were designed with slower software/communication
and one to VCC) for burst testing (IEC 61000-4-4). These capabilities. The IO-Link specification incorporates
capacitors should be placed as close to the IC as possible. communication at three data rates that include most
Depending on the board, these capacitors may not be sensor capabilities to allow upgrades and improvements
needed to pass burst testing, so we recommend testing to industrial systems already in place, without requiring
without the capacitors first and then adding them, if complete (and very expensive) overhauls.
needed.
Q: Do IO-Link masters and devices have to be surge
TVS diodes with a clamp voltage lower than the absolute
protected?
maximum ratings for the transceiver are required for
protection during a surge event. Place TVS diodes as close A: Since IO-Link cables are specified for a maximum length
to the IC as possible. of 20m, and the IEC 61000-4-5 surge standard mandates
surge for cables longer than 30m, the IO-Link standard
Q: Some IO-Link designs appear to have isolated ground does not require surge protection.
planes. What is the isolation for?
Q: What is the maximum input capacitance pin that an
A: While there is no requirement for isolation in the IO-
IO-Link master may have on the C/Q pin?
Link specification, all IO-Link systems have isolation at
some point in the signal chain. Isolation ensures that A: An IO-Link master’s input capacitance must be ≤ 1nF in
the controller/backplane is protected from any transient receive mode in the frequency range up to 4MHz.
events that occur on the local 24V field supply. The
isolation is usually placed in a location where the cost Q: What is the maximum capacitance that an IO-Link device
is minimized, for example, between the backplane and may have?
the controller or between the controller and the IO-Link A: The IO-Link device input capacitance should be ≤ 1nF. An
transceiver. exception is made in cases of COM1 or COM2 data rates
in combination with push-pull driver operation, in which
Q: What is SIO and how does it relate to IO-Link? case, the maximum input capacitance may be up to 10nF.
A: Per the IO-Link specification, every IO-Link master
port can be configured to operate in SIO (single input/ Q: What is an IO-Link cable?
output) mode or IO-Link (SDCI) communication mode. A: An IO-Link cable has at least 3 wires (C/Q, L+, and L-).
In SIO mode, the port can be configured to operate as a The cable is not shielded.
digital input or a digital output. See IEC 61121-2 for more
information. Q: What is the maximum length of IO-Link cable?
A: The maximum cable length is 20m.
Q: Some IO-Link master transceivers have a DI input and
some do not. What is DI?
Q: What is the cable’s worst-case resistance and
A: DI is a digital input. Digital inputs are the most common capacitance allowed to be?
inputs in industrial systems. DI is used to connect to
A: The loop wire resistance is 6.0Ω (max) while the maximum
binary sensors.
cable capacitance (C/Q to L+/L-) is 3.0nF (to 1MHz).

Q: Is the IO-Link cable terminated?

A: There is no specification for the termination of IO-Link
cables. Hence, the voltage waveform on an IO-Link cable
can exhibit overshoots.
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Q: What is meant by IO-Link Cycle Time? Q: At what load current must an IO-Link master be able to
A: The IO-Link Cycle Time is the repetition rate at which the provide to an IO-Link device?
IO-Link master sends out its master message to the IO- A: The IO-Link master must supply 200mA continuously.
Link device in Operate mode. This is the rate at which the
device is provided with or requested for process data i.e., Q: What is the supply range of an IO-Link device?
the rate at which a sensor is asked for in its measurement A: An IO-Link device must operate with a 24V nominal
data or an actuator is given new data. supply with a voltage range of 18V (min) and 30V (max).

Q: What is the minimum IO-Link cycle time possible by the Q: How much load current can an IO-Link device drive?
IO-Link standard?
A: An IO-Link device is specified to drive at least 50mA. It is
A: The minimum cycle time is 400µs. Such small cycle times common for IO-Link devices to drive at least 100mA.
are only feasible with COM3 data rates.
Q: Why are some IO-Link device transceivers able to drive
Q: Can every IO-Link master support 400µs cycle times? 200mA or more load current?
A: The IO-Link standard does not require that an IO-Link A: While such high currents are not needed for IO-Link
master support the 400µs minimum cycle time. Every operation, they may be needed if an IO-Link device (such
IO-Link master specifies its own minimum cycle time as a switching sensor) is specified to drive large loads, as
capability. in valves or relays, in standard binary output mode.

Q: What is IO-Link communication based on? Q: Can an IO-Link device driver operate in PNP or NPN
A: IO-Link is based on a master-slave dialogue in which mode during IO-Link communication?
the IO-Link master polls the IO-Link device, which must A: IO-Link communication supports both push-pull and PNP
answer the master message. modes. Push-pull is preferred, since the two logic states,
defined when the device drives the C/Q line, are then
Q: How fast must an IO-Link device respond to an IO-Link defined by a low-impedance driver. PNP mode is possible
master message? for the lower COM rates, in which case, the C/Q low is
A: An IO-Link device must send out its first bit within 10 bit defined by the 5mA pulldown in the IO-Link master.
times after the last bit of the master message. Hence, the
response time depends on the data rate (COM rate). Q: Can an IO-Link device operate in NPN mode?
A: An IO-Link device can only operate in NPN driver mode
Q: What topology does IO-Link employ? during SIO operation, if the IO-Link master supports NPN
A: IO-Link is a point-to-point connection in which an IO-Link sensors. The IO-Link standard does not support NPN
master is connected to only one IO-Link device. driver operation.

Q: What is the current drive capability of an IO-Link master Q: I want to make my new IO-Link sensor compatible with
C/Q port? older binary switching sensors that have PNP drivers.
A: The C/Q pin of an IO-Link master can drive at least Can I operate the sensor in PNP mode?
100mA (min) continuously and 500mA (min) for a short A: When the sensor is operating in SIO mode, it can be
time (for the IO-Link wake-up). operated in PNP mode so that it is compatible to the older
sensors. When the sensor gets an IO-Link wake-up from
Q: What is the supply voltage range that an IO-Link master the IO-Link master, it is suggested to switch its driver to
must provide for powering IO-Link devices? push-pull mode.
A: An IO-Link master must provide a 24V power supply with
a tolerance range of 20V (min) to 30V (max) to power
IO-Link devices.

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Additional IO-Link Resources

IO-Link Webpages
IO-Link Transceivers and Binary Drivers
IO-Link Master Transceivers
IO-Link Device Transceivers
Binary Drivers
IO-Link Reference Designs

IO-Link Application Notes and Articles

Application Note 6427: Calculating the Power Dissipation of the MAX14819 Dual-Channel IO-Link Master Transceiver
Application Note 5151: Special Considerations for Mode Changes During Active Operation of MAX14820/MAX14821 Sensor/
Actuator Transceivers
Application Note 6965: How to Select a TVS Diode for Maxim's IO-Link Devices
Maxim Blog: To IO-Link And Beyond!
Maxim Blog: Vision Realized In Advancing Industry 4.0 Solutions

Videos
What is IO-Link?
Heat Map Comparison of IO-Link Device Transceivers
In the Lab: IO-Link Smart Sensor System Demo

Trademarks

Arm is a registered trademark and registered service mark, Cortex is a registered trademark, and Mbed is a trademark of Arm Limited.
IO-Link is a registered trademark of Profibus User Organization (PNO).
Renesas is a registered trademark and registered service mark of Renesas Electronics Corporation.
Windows is a registered trademark and registered service mark of Microsoft Corporation.

Learn more
For more information, visit:
www.maximintegrated.com/io-link
Rev 2; April 2020

© 2020 Maxim Integrated Products, Inc. All rights reserved. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc., in the United States and
other jurisdictions throughout the world. All other company names may be trade names or trademarks of their respective owners.