Cellular Subscriber Sector StarTAC 160 (GSM)

The World’s Leading Cellular

Telephone Manufacturer

Service Manual
Issue 1.0

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 PREFACE
Cellular Subscriber Sector StarTAC 160 (GSM)

Preface

Specifications
Table 1: General

Function Specification

Frequency Range 890-915 MHz TX

935-960 MHz RX
Channel Spacing 200 kHz
Channels 124 carriers with 8 channels per carrier

Modulation GMSK at BT = 0.3

Transmitter Phase Accuracy 5 Degrees RMS, 20 Degrees peak

Duplex Spacing 45 MHz

Frequency Stability + 0.10 ppm of the downlink frequency (Rx)
Operating Voltage +3.0V dc to +5.1V dc (battery)
+4.4V dc to +6.5V dc (external connector)

Transmit Current <200 mA average, 1.0 A peak

Stand-by Current Average 10mA (DRX 2)

Dimensions 98.3 mm (L) x 57.3 mm(W) x 22.5 mm(D)

Size (Volume) 100 cubic cm
Weight Approximately 99.5 g; Includes Slim LiIon battery pack and
antenna

Temperature Range -20°C to +55°C

Table 2: Transmitter

Function Specification

RF Power Output 33 dBm + 2dBm

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 StarTAC 160 (GSM)

Table 2: Transmitter

Function Specification

Output Impedance 50 ohms (nominal)

Spurious Emissions -36 dBm up to 1 GHz, (<-30 dBm > 1 GHz)

Table 3: Receiver

Function Specification

RF Level -102 dBm

RX bit error rate (100 k bits) < 2%

Channel Hop Time 500 microseconds

Time to Camp Approximately 10 seconds

Table 4: Speech Coding

Function Specification

Speech Coding Type Regular Pulse Excitation / Linear Predictive Coding with
Long Term Prediction. (RPE LPC with LTP).
Bit Rate 13.0 k bps

Frame Duration 20 ms
Block Length 260 bits

Classes Class 1 bits = 182 bits. Class 2 bits = 78 bits

Bit Rate with FEC Encoding 22.8 k bps

Specifications subject to change without notice.

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 Preface

Foreword

Scope of Manual Service

This manual is intended for use by experi- Motorola’s regional Cellular Subscriber
enced technicians familiar with similar Support Centers offer some of the finest
types of equipment. It is intended primarily repair capabilities available to Motorola
to support electrical and mechanical repairs. Subscriber equipment users. The Cellular
Repairs not covered in the scope of this Subscriber Support Centers are able to
manual should be forwarded to Motorola’s perform computerized adjustments and
regional Cellular Subscriber Support repair most defective transceivers and
Centers. boards. Contact your regional Customer
Support Manager for more information
Authorized distributors may opt to receive about Motorola’s repair capabilities and
additional training to become authorized to policy for in-warranty and out-of-warranty
perform limited component repairs. Contact repairs in your region.
your regional Customer Support Manager
for details.

Model and Kit Identification

Motorola products are specifically identified

by an overall model number on the FCC
label. In most cases, assemblies and kits
which make up the equipment also have kit
model numbers stamped on them.

Replacement Parts Ordering

Motorola maintains a parts office staffed to process parts orders, identify part
numbers, and otherwise assist in the maintenance and repair of Motorola Cellular
products. Orders for all parts should be sent to the Motorola International Logis-
tics Department at the following address:

Attn: Global Spare Parts Department

Motorola Cellular Subscriber Group
2001 N, Division St.
Harvard, IL 60033-3674
U. S. A.
FAX: 1-815-884-8354

When ordering replacement parts or equipment information, the complete identi-

fication number should be included. This applies to all components, kits, and
chassis. If the component part number is not known, the order should include the
number of the chassis or kit of which it is a part, and sufficient description of the
desired component to identify it.

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 StarTAC 160 (GSM)

General Safety Information

Portable Operation

DO NOT hold the radio so that the antenna DO NOT operate this equipment near elec-
is very close to, or touching, exposed parts trical blasting caps or in an explosive atmo-
of the body, especially the face or eyes, while sphere. Mobile telephones are under certain
transmitting. The radio will perform best if conditions capable of interfering with
it is held in the same manner as you would blasting operations. When in the vicinity of
hold a telephone handset, with the antenna construction work, look for and observe
angled up and over your shoulder. Speak signs cautioning against mobile radio trans-
directly into the mouthpiece. mission. If transmission is prohibited, the
cellular telephone must be turned off to
DO NOT operate the telephone in an prevent any transmission. In standby mode,
airplane. the mobile telephone will automatically transmit
to acknowledge a call if it is not turned off.
DO NOT allow children to play with any
radio equipment containing a transmitter. All equipment must be properly grounded
according to installation instructions for safe
operation.
Mobile Operation (Vehicle Adaptor)

As with other mobile radio transmitting Portable/Mobile Telephone Use

equipment, users are advised that for satis- and Driving
factory operation of the equipment and for
the safety of personnel, it is recommended Safety is every driver’s business. The
that no part of the human body shall be portable telephone should only be used in
allowed to come within 20 centimeters of the situations in which the driver considers it
antenna during operation of the equipment. safe to do so. Use of a cellular portable while
driving may be illegal in some areas.
DO NOT jump start vehicle or use an auto-
motive battery charger while the vehicle Refer to the appropriate section of the
adapter option and the portable radiotele- product service manual for additional perti-
phone are connected to the vehicle electrical nent safety information.
system as this may cause serious damage to
the radio. Disconnect the radio by removing
the cable kit fuses.

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 CONTENTS
Cellular Subscriber Sector StarTAC 160 (GSM)

Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Disassembly . . . . . . . . . . . . . . . . . . . . . . . .19

Specifications . . . . . . . . . . . . . . . . . . . . . . . . . .iii Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Foreword . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Recommended Tools . . . . . . . . . . . . . . . . . . . 19

Transceiver Disassembly . . . . . . . . . . . . . . . . 19
Replacement Parts Ordering . . . . . . . . . . . . . . . v

General Safety Information . . . . . . . . . . . . . . . vi

Troubleshooting . . . . . . . . . . . . . . . . . . . .27

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Description . . . . . . . . . . . . . . . . . . . . . . . . . 1
Troubleshooting And Repair . . . . . . . . . . . . . . 27
Product Description . . . . . . . . . . . . . . . . . . . . . . 1
Testing After Repair . . . . . . . . . . . . . . . . . . . . 27

Theory of Operation . . . . . . . . . . . . . . . . . . 3 Troubleshooting Supplements . . . . . . . . . . . . 33

Electrical Diagrams . . . . . . . . . . . . . . . . . . . . . 43
GSM System Overview . . . . . . . . . . . . . . . . . . . 3

General Cellular Concept . . . . . . . . . . . . . . . . . 3

Replacement Parts . . . . . . . . . . . . . . . . . .45
GSM Description . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Service Tools for StarTAC . . . . . . . . . . . . . . . 59

Identity and Security . . . . . . . . . . . . . . . . . 7

Transceiver Labelling . . . . . . . . . . . . . . . . . . . . 7 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . .61

Mini SIM CARDS . . . . . . . . . . . . . . . . . . . . . . . . 8

Service Manual Feedback Form . . . . . . . .67

Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Manual Test Mode . . . . . . . . . . . . . . . . . . . . . . 12

Personality Transfer . . . . . . . . . . . . . . . . . 15

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Normal Transfer . . . . . . . . . . . . . . . . . . . . . . . 15

Master Transfer . . . . . . . . . . . . . . . . . . . . . . . . 16

Master SIM Card Creation . . . . . . . . . . . . . . . . 17

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 StarTAC 160 (GSM)

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 DESCRIPTION
Cellular Subscriber Sector StarTAC 160 (GSM)

Description The RF/Logic board houses the RF and

Audio/Logic circuitry on separate sides in
addition to SIM contacts, the alert, a 16 posi-
tion ZIF connector, the microphone, and an
Product Description external connector.

The keyboard assembly houses the display,

General reed switch, and keyboard LEDs. Electrical
connections between the two boards are
This personal cellular telephone is a micro- provided by connectors at the lower portion
processor controlled, full duplex, synthe- of each board.
sized FM radiotelephone using digital
modulation techniques, for use in compat- The silent alert and speaker are located
ible 900 MHz cellular radiotelephone inside the top portion of the housing and is
systems. When operated properly, the connected to the RF/Logic board via a flex
equipment will provide the user with land- strip that connects to the 16 position ZIF.
linked telephone service through individual
cell site base stations, all linked to a central Operating power for the personal telephone
control office. The phone has a 3.0 Watt can be obtained from any one of the main or
maximum power capability. auxiliary batteries, or an external supply
such as a cigarette lighter adapter (CLA).

Physical Packaging

The transceiver circuitry is contained in a NOTE

water resistant polycarbonate plastic
housing that is less than 100 cc at a weight of The phone may have various battery
less than 100 grams with the lightest battery. options as standard depending on the
particular market requirements.
The transceiver circuitry is contained on two
multi-layer boards, the RF/Logic board, and
the keyboard assembly.

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 StarTAC 160 (GSM)

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 THEORY OF OPERATION
Cellular Subscriber Sector StarTAC 160 (GSM)

Theory of Operation

GSM System Overview Using this technique, radiation on a given

channel is virtually contained in the cell
operating on that channel and, to some
extent, those cells directly adjacent to that
NOTE cell.

The following description is intended only Since the coverage area of a cell on a given
as a preliminary general introduction to channel is limited to a small area (relative to
the Global System for Mobile communi- the total system coverage area), a channel
cations (GSM) cellular network. This may be reused in another cell outside the
description is greatly simplified and does coverage area of the first. By this means,
not illustrate the full operating capabili-
several subscribers may operate within the
ties, techniques, or technology incorpo-
rated in the system.
same geographic area, without interference
with each other, on a single channel.

General Cellular Concept GSM Description

Unlike previous cellular systems, GSM uses

The cellular systems are used to provide digital radio techniques. The GSM system
radiotelephone service in the frequency has the following advantages over previous
range 890-960 MHz. A cellular system analogue systems:-
provides higher call handling capacity and
system availability than would be possible • International Roaming - Due to
with conventional radiotelephone systems international harmonization and
(those which require total system area standardization, it will be possible to make
coverage on every operating channel) by and receive calls in any country which
dividing the system coverage area into supports a GSM system.
several adjoining sub-areas or cells.
• Digital Air Interface - The GSM phone
will provide an entirely digital link
Each cell contains a base station (cell site) between the telephone and the base
which provides transmitting and receiving station, which is, in turn, digitally linked
facilities, for an allocated set of duplex into the switching subsystems and on into
frequency pairs (channels). Since each cell is the PSTN.
a relatively small area, both the cell site and
the radiotelephone that it supports can • ISDN Compatibility - ISDN is a digital
operate at lower power levels than would be communications standard that many
used in conventional systems. countries are committed to implementing.

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 StarTAC 160 (GSM)

It is designed to carry digital voice and The radiotelephones themselves are capable
data over existing copper telephone of operation on any channel in the system,
cables. The GSM phone will be able to allowing them to operate in any cell. Due to
offer similar features to the ISDN the low power requirements for communi-
telephone. cations between radiotelephones in a partic-
ular cell and the cell site, operating channels
• Security and Confidentiality - Telephone may be repeated in cells which are outside
calls on analogue systems can very easily the coverage area of each other.
be overheard by the use of a suitable radio
receiver. GSM offers vastly improved For example, presume that cell A operates
confidentiality because of the way in
on channels arbitrarily numbered 1 through
which data is digitally encrypted and
8, cell B operates on channels 9 through 16,
transmitted.
cell C operates on channels 17 through 24
and cell D operates on channels 1 through 8
• Better Call Quality - Co-channel (repeating the usage of those channels used
interference, handover breaks, and fading by cell A). In this system, subscribers in cell
will be dealt with more effectively in the A and subscribers in cell D could simulta-
digital system. The call quality is also neously operate on channels 1 through 8.
enhanced by error correction, which
reconstructs lost information.
The implementation of frequency re-use
increases the call handling capability of the
• Efficiency - The GSM system will be able to
system, without increasing the number of
use spectral resources in a much more
available channels. When re-using identical
efficient way than previous analogue
systems. frequencies in a small area, co-channel inter-
ference can be a problem. The GSM system
can tolerate higher levels of co-channel
In the figure below, the area bounded by interference than analogue systems, by
bold lines represents the total coverage area
incorporating digital modulation, forward
of a hypothetical system. This area is
error correction and equalization. This
divided into several cells, each containing a
means that cells using identical frequencies
cell site (base station) operating on a given
set of channels which interfaces radiotele- can be physically closer, than similar cells in
phone subscribers to the telephone analogue systems. Therefore the advantage
switching system. of frequency re-use can be further enhanced
in a GSM system, allowing greater traffic
handling in high use areas.
Figure 1: Hypothetical Cell System

By incorporating Time Division Multiple

• •
Access (TDMA) several calls can share the
CELL B CELL E same carrier. The carrier is divided into a
•
CHANNELS
• continuous stream of TDMA frames, each
CHANNELS
CELL A 9-16 CELL D 9-16 frame is split into eight time slots. When a
• •
CHANNELS CELL C
CHANNELS connection is required the system allocates
1-8 CELL F
1-8
• • the subscriber a dedicated time slot within
CHANNELS
• CHANNELS
•
17-24 17-24 each TDMA frame. User data (speech/data)
for transmission is digitized and sectioned
• •
into blocks. The user data blocks are sent as
• •
information bursts in the allocated time slot
of each TDMA frame, see Figure 2: “TDMA
Transmission” on page 5.

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 Theory of Operation

The data blocks are modulated onto the Signal information provides an indication of
carrier using Gaussian Minimum Shift the subscriber’s distance from the base
Keying (GMSK), a very efficient method of station. As the radiotelephone moves from
phase modulation. cell to cell, its control is handed from one
base station to another in the new cell.
Figure 2: TDMA Transmission
This change is handled by the radiotele-
User Data Sectioned Into Blocks phone and base stations, and is completely
transparent to the user.

Information Bursts Sent In Allocated Time Slots

Service Area

0123 4 5 670123 4 5 670123 4 5 670123 4 5 67

The area within which calls can be placed
Frame 0 Frame 1 Frame 2 Frame 3
and received is defined by the system opera-
tors. (Because this is a radio system, there is
no exact boundary that can be drawn on a
map.) If the telephone is outside a coverage
Each time an information burst is trans- area, the (no service) indicator will illumi-
mitted, it may be transmitted on a different nate and calls will be unable to be placed or
frequency. This process is known as received. If this happens during a conversa-
frequency hopping. Frequency hopping tion, the call will be lost. There may also be
reduces the effects of fading, and enhances small areas within a particular service area
the security and confidentiality of the link. A where communications may be lost.
GSM radiotelephone is only required to
transmit for one burst in each frame, and not The radiotelephone’s identity information
continually, thus enabling the unit to be is held by its local GSM system in its Home
more power efficient. Location Register (HLR) and Visitor Loca-
tion Register (VLR). The VLR contains iden-
Each radiotelephone must be able to move tity information on all local active
from one cell to another, with minimal radiotelephones. Should you roam to
inconvenience to the user. The mobile itself another area, system or country the radio-
carries out signal strength measurements on telephones identity information is sent to
adjacent cells, and the quality of the traffic the VLR in the new system. The new system
channel is measured by both the mobile and will then check the radiotelephones details
the base station. The handover criteria can with your home system for authenticity. If
thus be much more accurately determined, everything is in order it will be possible to
and the handover made before the channel initiate and receive calls whilst in the new
quality deteriorates to the point that the area.
subscriber notices.

When a radiotelephone is well within a cell,

the signal strength measured will be high.
As the radiotelephone moves towards the
edge of the cell, the signal strength and
quality measurement decreases.

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 StarTAC 160 (GSM)

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 IDENTITY AND SECURITY
Cellular Subscriber Sector StarTAC 160 (GSM)

Identity and Security If the main board is replaced then the units
IMEI will change, therefore the units label-
ling should be updated with the new IMEI.
An IMEI uniquely identifies a mobile station
Transceiver Labelling equipment to the system, and is divided into
the sections shown below.
Introduction
Figure 4: IMEI Configuration
Each Motorola GSM transceiver will be
labelled with various number configura- IMEI 15 digits
tions. The following information shows and 6 digits 2 digits 6 digits 1 digit
explains the common labelling titles. TAC FAC SNR SP
Type Final Serial Spare
Approval Assembly Number
Title Explanations Code Code

MSN

The Mechanical Serial Number (MSN) is an REV S/H

individual number, uniquely identifying the
unit. The MSN will remain the same
throughout the units life, even if the main This configuration consists of two blocks of
board is replaced. Because the MSN is two digits, and denotes the software and
unique to the unit, it is often used for hardware versions within the unit. The first
logging and tracking purposes by Motorola two digits correspond to the software
National Service Centres on EPPRS. The version, and the last two digits correspond
MSN is divided into the sections shown to the hardware version. If a version update
below. is carried out on the unit, the corresponding
change information should be made
Figure 3: MSN Configuration apparent on the labelling.

MSN 10 digits
Model
3 digits 1 digit 2 digits 4 digits
MC OC DC SNR The model number defines the type of
Model Origin Date Serial
Code Code Code Number product. Each product type is issued a
common model number.

Package
CEPT GSM
The package number is used to determine
This is the International Mobile Station the type of equipment, the mode in which it
Equipment Identity (IMEI) number. The was sold, and the language with which it
IMEI is held in the logic circuitry. was shipped.

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 StarTAC 160 (GSM)

Mini SIM CARDS The Mini SIM card is placed in the tray and
the tray slid into the side of the phone.
Introduction Ensure that the Mini SIM card sits correctly
in the tray before trying to insert the tray
The Motorola GSM StarTAC 160 is designed into the phone. The tray should be
to work with the mini size Subscriber Iden- competely and securely seated in the slot on
tity Module (SIM). The Mini SIM card slides the side of the phone.
into the phone sideways. The Mini SIM card
contains all the personal data required to To remove the Mini SIM tray from the unit,
access GSM services. Data held by the Mini
pull the sliding Mini SIM tray sideways
SIM card includes:
away fron the phone. The User Guide
contains full information about inserting
• International Mobile Subscriber Identity
and removing the Mini SIM card.
• Temporary Mobile Subscriber Identity
• Home system Security Information
• Services subscribed to
• PIN and unblocking codes To stop unauthorized personnel using your
• Call barring codes Mini SIM card, the option of using a
Personal Identity Number (PIN) is available.
The Mini SIM card may also be capable of When enabled the option requires (on
storing phone numbers and names. power up) a verification number to be
entered via the unit’s keypad, before the
Mini SIM Card Insertion/Removal card can be used. Three attempts to enter the
correct PIN may be made. If after the three
The Mini SIM card must be inserted into the entries the correct PIN has not been entered,
unit correctly so that the card can be read, the card becomes blocked. To unblock the
and the data checked for validity, before card an unblocking/super PIN code must be
operation on the system will be enabled. The entered. Ten attempts to enter the correct
card contains all of the user’s personal iden- unblocking code are permitted, if after ten
tification numbers and details of the system attempts the correct code has not been
the phone operates on. entered, the Mini SIM card is corrupted and
becomes useless.
Figure 5: Inserting Mini SIM Card
Another option available for the Mini SIM
card is call barring. If subscribed to, the call
barring of incoming and/or outgoing calls
may be accomplished by entering a special
key sequence. The key sequence includes a
“barring code”, which determines the type
of restriction incorporated, and a password
to validate the request. The initial password
is provided when you subscribe to the
service. The password can be changed by
entering a set key sequence.
Card Slot
Back of Mini SIM
(Interface contacts on A valid standard sized Mini SIM card can be
Mini SIM facing away used in any working GSM transceiver,
Mini SIM Tray
from tray.) regardless of the manufacturer, which is
compatible with the standard size Mini SIM
card.

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 Identity and Security

To protect the actual unit from unauthorized

use, a lock function on the hardware is avail-
able. When enabled, this function requires
that a three or four digit unlock code be
entered, via the units keypad, before normal
operation of the transceiver can take place.
The lock code can be changed by entering a
set key sequence.

Further information on set key sequences

can be derived from the unit’s User Guide.

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 StarTAC 160 (GSM)

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 TESTING
Cellular Subscriber Sector StarTAC 160 (GSM)

Testing

Verification Equipment Configuration

Testing
Introduction Initially insert the test Mini SIM card into
the slot at the side of the personal cellular
To test the StarTAC cellular telephone for telephone. If required, further information
functional verification, the following equip- on Mini SIM card insertion is available on
ment will be required: page 8. The telephone’s antenna should now
be removed, see “Disassembly” on page 19
• GSM compatible communications for further details. When the antenna has
analyzer. been removed, attach the antenna adaptor to
the unit. Slide a charged battery on to the
• Antenna test adaptor (Part No back of the personal telephone, so that the
5880348B33), and appropriate cable/ telephone can be powered up. Finally,
connectors. connect a cable from the antenna connector
to the RF in/out port of the communications
• Test Mini SIM card. analyzer, and power both the analyzer and
personal telephone on. The equipment set
• Charged battery pack. up shown in Figure 6: “Testing Configura-
tion” should now be in place.

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 StarTAC 160 (GSM)

Figure 6: Testing Configuration

GSM Compatible
Communications Analyzer

Unit To
Be Tested

RF In/out
Port

Test Adaptor
(SKN4683A or
SKN4665A)
Plugs into accessory
connector of phone.

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 Testing

Accessing The Manual Test Mode indicating that the unit is now in the Manual
Test Mode. Table 1: “GSM Test Commands”
When the Test Mini SIM card is in place, on page 13 shows the available Manual Test
power up the telephone. Once the initial commands and their corresponding
automatic ‘wake up’ sequence has taken results.If a customer should forget the secu-
rity code in their unit, it can only be read or
place correctly, depress the # key (on the
changed by using a Test Mini SIM card.
units keypad) for three seconds. After three
seconds ‘TEST’ should appear in the display,

Testing
Table 1: GSM Test Commands

Key Sequence Test Function/Name

#(hold down for 2 seconds) Enter manual test mode
01# Exit manual test mode
02xxyyy# Display/modify TX power level DAC & load PA calibration table
03x# DAI
05x# Initiate Exec Error Handler Test
07x# Mute RX audio path
08# Unmute RX audio path
09# Mute TX audio path
10# Unmute TX audio path
11xxx# Program main LO to channel
12xx# Set TX power level to fixed value
13x# Display memory block usage
14x# Initiate Out of Memory condition
15x# Generate tone
16# Mute tone generator
19# Display S/W version number of Call Processor
20# Display S/W version number of Modem
22# Display S/W version number of Speech Coder
24x# Set step AGC
25xxx# Set continuous AGC
26xxxx# Set continuous AFC
31x# Initiate Pseudo-Random Sequence- with Midamble
32# Initiate RACH Burst Sequence
33xxx# Synchronize to BCH carrier
34xxxyy# Configuration to TCH/FS & Enable TCH loopback w/o Frame Ensure
Indication
36# Initiate acoustic loopback
37# Stop test
38# Activate Mini SIM

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 StarTAC 160 (GSM)

Table 1: GSM Test Commands

Key Sequence Test Function/Name

39# Deactivate Mini SIM
40# Initiate sending all 1’s
41# Initiate sending all 0’s
42# Disable echo processing
43x# Change audio path
45xxx# Serving cell power level
46# Display current value of AFC DAC
47x# Set audio volume
51# Enable sidetone
52# Disable sidetone
57# Initialize non-volatile memory
58# Display security code
58xxxxxx# Modify security code
59# Display lock code
59xxx# Modify lock code
60# Display IMEI
61# Display MCC portion of the LAI
61xxx# Modify MCC portion of the LAI
62# Display MNC portion of the LAI
62xx# Modify MNC portion of the LAI
63# Display LAC portion of the LAI
63xxxxx# Modify LAC portion of the LAI
64# Display Location Update Status
64x# Modify Location Update Status
65# Display IMSI
66xyyy# Display/modify TMSI
67# Zero PLMN Selector
68# Zero forbidden PLMN list
69x# Display/modify Cipher Key Sequence Number
70xxyyy# Display/modify BCCH allocation table
71xx# Display internal information
72xx# Display Passive Fail codes
73xyyy# Display/modify Logger Control Block
7536778# Initiate transfer to Flash Memory

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 PERSONALITY TRANSFER
Cellular Subscriber Sector StarTAC 160 (GSM)

Personality Transfer Step 2. The donor unit is now in the

cloning mode, and ready to transfer
the first block of data.

Introduction Step 3. Enter 021# via the units keypad.

This command will cause the first
Due to the different variations (OEM looks) block of information to be
of the GSM StarTAC™ personal cellular tele- uploaded into the Transfer card.
phones, each main board must be config-
ured correctly to ensure that the unit takes
Step 4. While data transfer is taking place
on the correct personality required. There-
between the unit and the card,
fore, when a main board is replaced its
‘Please Wait’ will be displayed.
personality must be transferred into the new
After a short period of time, if the
board, so that it functions correctly in the
data transfer has been completed
customers unit. There are two possible
correctly, ‘Clone’ will re-appear in
methods of transfer:
the donor units display.
• Normal Transfer, and;
Step 5. When the first data block has been
• Master Transfer. successfully uploaded, remove the
card from the donor.
If the defective unit powers up, then the
Normal Transfer method should be
followed. If the faulty unit will not power Step 6. Insert the Transfer card into the slot
up, then a Master transfer will be required to located on the back of the recipient
configure the replacement board, once unit. Turn the recipient unit on, the
installed. display should show ‘Clone’.

Step 7. The recipient unit is now in the

cloning mode, and ready to receive
Normal Transfer the first block of data.

This method allows the personality, selected

features and stored phone numbers of a Step 8. Enter 03# via the units keypad. This
defective radio, to be transferred into a command will cause the recipient
repaired radio. Data is transferred from the unit to download the first data
donor unit into the recipient unit using a block from the Transfer card.
Transfer card (Part No 5104025D01). The
instruction steps should be followed in Step 9. While data transfer is taking place
order. between the card and the unit,
‘Please Wait’ will be displayed.
Step 1. Insert the Transfer card into the slot After a short period of time, if the
located on the back of the donor data transfer has been completed
unit. Turn the donor unit on, the correctly, ‘Clone’ will re-appear in
display should show ‘Clone’. the recipient units display.

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 StarTAC 160 (GSM)

Step 10. The second data block must now be Step 1. Select the required Master SIM
transferred. Repeat steps 1 to 9, but card.
enter 022# to program the second
data block into the Transfer card. Step 2. Insert the Master Transfer card into
the slot located on the back of the
Step 11. The third data block (known as repaired unit. Turn the unit on, the
table 5# ) must now be transferred. display should show ‘Clone’.
Repeat steps 1 to 9, but enter 025#
to program the third data block into Step 3. Enter 03# via the units keypad. This
the Transfer card. command will cause the
configuration data to be
Step 12. When the third block of data has downloaded from the Master
been transferred successfully, Transfer card.
remove the Transfer card and check
the repaired radio functions Step 4. While data transfer is taking place
correctly. See “Testing” on page 11. between the card and the unit
‘Please Wait’ will be displayed.
After a short period of time, if the
data transfer has been completed
Master Transfer correctly, ‘Clone’ will re-appear in
the recipient units display.
This method of transfer should only be
followed when the defective unit will not Step 5. When the data block has been
power up, or complete a Normal Transfer. transferred successfully, remove
As mentioned earlier, there are different the Master Transfer card and check
variations (OEM looks) of the Motorola the repaired radio functions
GSM StarTAC™ cellular telephones, each correctly. See “Testing” on page 11.
model requiring the main board to be
configured differently for correct operation. At no point should either 021# or 022# be
When carrying out a Master Transfer it is not entered while a Master Transfer card is in
possible to transfer the customers selected the radio. If either of the stated commands
features or stored phone numbers, only the are entered, the master information on the
personality can be programmed into the card will be erased. To prevent the above
repaired unit. happening the card can be locked by
entering 06# via the units keypad, with the
Each different version of the GSM card inserted. Unlock the card by entering
StarTAC™ cellular telephone, has its own 07# .
Master Transfer card which contains essen-
tial set up information. Master SIM cards • If during either transfer process a problem
may be ordered pre-programmed, or created arises, an error message will be displayed.
from a Normal Transfer card. The instruc- If the Transfer card is removed before the
tion steps should be followed in order. data transfer is completed ‘Bad Data on
Card’ will appear in the display. If either
situation arises, the process should be
repeated.

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 Personality Transfer

Master SIM Card Creation

When required a Master SIM card can be

created by:

Step 1. Insert a Transfer card into a unit

which is already configured in the
desired way. Turn the unit on, the
display should show ‘Clone’.

Step 2. Enter 024# via the units keypad.

This command copies the
personality information in the unit
onto the Transfer card to create a
Master Transfer card.

Step 3. While data transfer is taking place

between the unit and the card
‘Please Wait’ will be displayed.
After a short period of time, if the
data transfer has been completed
correctly, ‘Clone’ will re-appear in
the recipient units display.

Step 4. A Master Transfer card has now

been created. Lock the card to
prevent accidental information
erasure (the card can be locked by
entering 06# via the units keypad,
with the card inserted). Remove the
card from the unit, and store until
required.

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 StarTAC 160 (GSM)

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 DISASSEMBLY
Cellular Subscriber Sector StarTAC 160 (GSM)

Disassembly

Introduction Recommended Tools

To perform most repairs, the unit must be The following tools are recommended for
disassembled in order to gain access to the use during the disassembly and reassembly
various internal components. Reasonable of the StarTAC.
care should be taken in order to avoid
damaging or stressing the housing and • Anti-Static Mat Kit (RPX-4307A); includes:
internal components. Motorola recommends — Anti-Static Mat 66-80387A959
the use of a properly grounded high imped-
— Ground Cord 66-80387A989
ance conductive wrist strap while
performing any of these procedures. — Wrist Band 42-80385A59
• Plastic Prying Tool SLN7223A
• Antenna Tool SYN5233A
• Dental Pick
CAUTION
• Tweezers
• Housing prying tool SYN5367A
Many of the integrated circuit devices • Adjustable torque driver. Tohnichi
used in this equipment are vulnerable to RTD24Z or equivalent
damage from static charges. An anti-
static wrist band, connected to an anti-
static (conductive) work surface, must be
worn during all phases of disassembly, Transceiver Disassembly
repair, and reassembly.
Refer to the disassembly instructions and
photo sequence on the following pages.

NOTE
Service personnel should be familiar with
all of the following information before
attempting unit disassembly.

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 StarTAC 160 (GSM)

Antenna Removal

Step 1. Turn off the telephone.

Step 2. Press down on the battery’s

tab and remove the battery
from the housing.

Step 3. Use the antenna tool to

remove the antenna.

Place the wide tip of the

antenna in the large
opening of the antenna tool.

Put the bottom of the tool

on the grooves in the base of
the antenna.

Turn counterclockwise until

the antenna is free from the
phone housing.

When re-assembling,
recommended torque is
10 inch-pounds.

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 Disassembly

Opening Housing

Step 1. With flat surface of tool

facing up, insert housing
opener at a 45º angle. Make
sure you can see top of tool
in seam.

Step 2. Press and push corner

outwards with left thumb
while right hand twists
phone like a rag.

Step 3. After phone has started to

open, lift antenna well to
release entire side.

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 StarTAC 160 (GSM)

Step 4. Using a small blade

screwdriver, slide under
housing all the way to
corner and lift housing off
corner.

Step 5. With flat surface of tool

facing up, insert housing
opener at a 45º angle. Make
sure you can see top of tool
in seam.

Step 6. Using index finger, pull

housing off going straight
across phone.

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 Disassembly

Board Removal

Step 1. Open the flex connector and

pull out the flex.

Step 2. With your thumbs, pry the

side tabs away from the
board assembly to allow it
to be easily removed.
Starting at the top of the
board, lift the board
assembly out of the front
housing.

Step 3. Pull the tape off of the

microphone connector and
pull the connector out.

Remove antenna tube.

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 StarTAC 160 (GSM)

Step 4. Lift the white display clip

off the transceiver board.

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 Disassembly

Flip Removal

Step 1. Using a dental pick, remove

the adhesive strip off the
base of the flip.

Step 2. Using tweezers, press the

hinge pin button in and over
toward the middle of the
flip.

Also, move the hinge pin

section above the button
toward the middle of the
flip.

Note: When reassembling

the flip, the button will click
back into place.

Remove the flip by pulling

up on the hinge pin side and
out on the other side.

The hinge shaft may come

loose from the flip.

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 StarTAC 160 (GSM)

Speaker/Vibrator Removal

Step 1. Rest flip housing on a flat

surface. Slip a dental pick
between front housing and
battery contacts.

Pry up to unsnap front

housing and battery
contacts.

The speaker, vibrator, and

flex should be exposed.

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 TROUBLESHOOTING
Cellular Subscriber Sector StarTAC 160 (GSM)

Troubleshooting

Introduction If the Logic/RF assembly is replaced a

personality transfer will be necessary. See
Assembly replacement level trouble- “Personality Transfer” on page 15.
shooting and repair of the StarTAC personal
NOTE
telephone is limited to those components
listed in the Replacement Parts List. See Defective Logic/RF assemblies must be
“Replacement Parts” on page 45. replaced with pre-tested, pre-phased
assemblies.
It is recommended that known good
replacement parts and assemblies be avail-
able to be used for troubleshooting by
substitution, and for replacement of parts/
assemblies found to be defective. Testing After Repair

After any repair work has been carried out,

the unit should be thoroughly tested to
Troubleshooting And Repair ensure that its operates correctly. This is
especially important if the Logic/RF
The troubleshooting information in Table 7, assembly is replaced.
Table 8, and Table 9 shows some typical
malfunction symptoms and the corre- For general repairs which do not include
sponding verification and repair proce- replacing the Logic/RF assembly, simply
dures. Additionally, the “Troubleshooting placing a call and checking signal strength,
Supplements” are offered to assist in correc- and transmit and receive audio quality is
tive action of more detailed symptoms. normally sufficient.
Refer to the disassembly instructions located
in “Disassembly” on page 19 for instructions When the Logic/RF assembly is replaced,
on removing and replacing parts/assem- the unit must have a comprehensive test on
blies from the personal telephone. a GSM compatible communications
analyzers. See “Testing” on page 11 for
further details. Placing a call on air is
usually carried out at this stage to complete
the testing procedure.

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 StarTAC 160 (GSM)

Table 7: Receiver Troubleshooting and Repair Chart

RX Symptom Probable Cause Verification and Remedy

1. Portable tele- a) Antenna assembly is 1. Check to make sure that the antenna pins
phone exhibits defective. are properly connected to the Logic/RF
poor reception assembly. If OK, substitute a known good
and/or erratic antenna assembly.
operation
2. If the fault is still present, proceed to b.
(such as calls
frequently b) Defective or mis-phased 1. Check for appropriate frequencies and
dropping, RF/Audio-Logic Board. power level gains/losses in the RX path.
weak and/or Reference RF Block Diagram.
distorted
audio, etc.). 2. Replace malfunctioning components if
listed on parts list. Likely fail components
are: FL451, FL452, Q418, Q420, Q421,
U201, U500.
3. If parts replacement doesn’t correct the
fault, replace transceiver.

c) Defective keypad board. 1. Substitute keypad board with a known good

(i.e. SEND key won’t work) keypad and logic board.
2. If known good board works, place the
keypad from the defective unit onto it and
attempt to function.
3. If unit functions properly, replace the mylar
barrier on the defective unit and then
attempt to function defective unit with orig-
inal keypad.
4. If fault persists, replace the logic board.
2. Receive audio a) Earpiece speaker defec- 1. Gain access to earpiece speaker as
is weak and/or tive. described in “Disassembly” on page 19.
distorted.
2. Substitute a known good earpiece speaker.
Place a call and verify improvement in
earpiece audio. If good, re-assemble
portable with new earpiece speaker.
3. If earpiece speaker not at fault, re-install
original earpiece speaker and proceed to c.
b) Antenna assembly is 1. Check to make sure antenna pin is properly
defective. connected to the Logic/RF Board
Assembly. If OK, substitute a known good
antenna assembly.
2. If antenna assembly is not at fault, re-install
original antenna assembly and proceed
to d.

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 Troubleshooting

Table 7: Receiver Troubleshooting and Repair Chart

RX Symptom Probable Cause Verification and Remedy

2. Receive audio c) Logic/RF Board Assembly 1. Replace Logic/RF Board Assembly.

is weak and/or defective.
2. If substitute Logic/RF Board Assembly
distorted.
works, the original is faulty and should be
examined for improper solder and/or
connections. Likely fail components: J601,
U500, U900.

Table 8: Transmitter Troubleshooting and Repair Chart

TX Symptom Probable Cause Verification and Remedy

1. Transmit a) Microphone connections to 1. Gain access to the Microphone as

audio is weak, Logic/RF board defective. described in “Disassembly” on page 19.
(usually indi-
2. Check connections (including checking for
cated by called
polarity) and if OK, proceed to b.
parties
complaining of b) Microphone defective. 1. Gain access to microphone.
difficulty in
hearing voice 2. Disconnect and substitute a known good
from portable Microphone.
phone). 3. Place a call and verify improvement in
portable transmit signal as heard by called
party. If good, re-assemble portable with
new Microphone.
4. If Microphone is not at fault, re-install orig-
inal Microphone and proceed to c.

c) Logic/RF Board Assembly 1. Replace Logic/RF Board Assembly.

defective.
2. If Logic/RF Board Assembly is at fault,
examine it for improper solder and connec-
tions. Likely fail components: Q300, Q303,
U201, U300, U301.

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 StarTAC 160 (GSM)

Table 9: Logic/Processing Troubleshooting and Repair Chart

Logic/Processing
Probable Cause Verification and Remedy
Symptom

1. Unit Doesn’t a) Battery either discharged or 1. Measure battery voltage across a 50 ohm
Turn On or defective. (>1 Watt) load.
Stay On
2. If the battery voltage is <3.6 V DC, recharge
the battery using the appropriate battery
charger.
3. If the battery will not recharge, replace the
battery.
4. If battery is not at fault, proceed to b.

b) Battery connector open or 1. Visually inspect the battery connectors on

misaligned. both the battery pack and the transceiver,
including the solder connections from the
battery connector to the main PC board.
2. Realign the contacts or, if necessary,
replace either the battery or battery
connector. Removing the battery connector
assembly has to be done with extreme care
to avoid damaging the PCB.
3. If battery connectors are not at fault,
proceed to c.
c) Defective RF/Audio-Logic 1. Gain access to Keypad/Display / main
Board assembly. board as described in “Disassembly” on
page 19.
2. Remove the Logic/RF Assembly. Substitute
a known good assembly.
3. Temporarily connect a 4.4 V dc supply to
J600.
4. Depress the PWR button; if unit turns on
and stays on, disconnect the dc power
source and reassemble the telephone with
the new Logic/RF Board assembly and
refer to “Testing After Repair” on page 27.
5. If Logic/RF Board Assembly is not at fault,
re-install original Logic/RF Board Assembly
and proceed to d.
d) Keypad/Display circuit 1. Replace the Keypad/Display board.
board failure.
2. Temporarily connect a 4.4 V dc supply to
J600.
3. Depress the PWR button; if unit turns on
and stays on, disconnect the dc power
source and reassemble the telephone with
the new Keypad/Display board.

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 Troubleshooting

Table 9: Logic/Processing Troubleshooting and Repair Chart

Logic/Processing
Probable Cause Verification and Remedy
Symptom

2. Display is a) Mating connections to/from 1. Replace Keypad / Display board.

erratic, or Display board faulty.
provides
partial or no b) Display board defective. 1. Replace Keypad / Display board.
display. c) Logic/RF Board Assembly 1. Substitute a known good Logic/RF
defective. Assembly.
2. If known assembly works, the original is
faulty and should be examined for improper
solder and/or connections. Likely fail
components: J101, keyboard.
3. Incoming call a) Alert transducer defective. 1. Gain access to alert speaker as described
alert trans- in “Disassembly” on page 19.
ducer audio
2. Disconnect the alert speaker.
distorted or
volume is too 3. Connect a known good alert speaker.
low.
4. Place call to portable telephone from land-
line or other mobile/portable telephone and
verify alert signal volume and clarity. If
good, re-assemble portable with new alert
speaker.
5. If alert speaker not at fault, re-install original
alert speaker and proceed to c.
b) Logic/RF Board Assembly 1. Replace Logic/RF Board Assembly.
defective.
2. If Logic/RF Board Assembly is at fault,
examine it for improper solder and/or
connections. Likely fail components: U500,
and U900.
4. Phone will not a) SIM card defective 1. Initially check that the contacts on the card
recognize/ are not dirty; clean if necessary, and check
accept SIM if fault has been eliminated.
card
2. If the contacts are clean, insert a known
good SIM card into the portable telephone.
Power up the unit and confirm whether or
not the card has been accepted. If the fault
no longer exists, the defective SIM card
should be replaced.
3. If the SIM card is not at fault, proceed to b.

b) Logic/RF Board Assembly 1. Replace Logic/RF Board Assembly with a

defective. known good board. If good board works,
original is faulty.
2. Examine the original Logic/RF Board
Assembly for improper solder and/or
connection. Likely fail components: J101.

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 StarTAC 160 (GSM)

Table 9: Logic/Processing Troubleshooting and Repair Chart

Logic/Processing
Probable Cause Verification and Remedy
Symptom

5. Hinged mouth- a) Reed switch defective. 1. Gain access to Key board as described in
piece does “Disassembly” on page 19.
not go on/off
2. Unsolder the reed switch and replace with a
hook correctly
known good one.
(usually indi-
cated by 3. Reassemble unit.
inability to
4. Place call to portable phone and verify
answer
ability to answer by opening flip.
incoming calls
by flipping the 5. If fault still present, replace original reed
mouthpiece switch and proceed to b.
down, or
inability to
make
outgoing
calls).

5. Hinged mouth- b) Magnet in flip defective. 1. Replace flip assembly with known good
piece does one.
not go on/off
2. Place call to portable phone and verify
hook correctly.
ability to answer by opening flip.
3. If fault still present, replace original flip
assembly and proceed to c.
c) Key board defective. 1. Replace the Key board with a known good
one.
2. Place call to portable phone and verify that
the fault has been eliminated.
3. If original Key board is at fault, examine it
for improper solder and/or connections.

d) Logic/RF Board Assembly 1. Replace the Logic/RF board with a known

defective. good one.
2. Place call to phone and verify that the fault
has been eliminated.
3. If original Logic/RF Board Assembly is at
fault, examine it for improper solder and/or
connections. Likely fail component: J101.

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 Troubleshooting

Troubleshooting Supplements
Logic/Processing Supplement 1 - Unit Doesn’t Power Up (NPU)

START

Apply power to the radio.

Is 3.36V dc
present at NO Proceed to “#1 NPU Repair Procedure” on page 36.
U900 pin 40?

YES

Press the power key to

initiate PCB power up
process. You will have to
press the power key each
time you wish to take a
reading, unless you tie the
watchdog circuitry high
adding a 10k resistor to the
pads at R904.

Are U900
pins 22 and
NO Proceed to “#2 NPU Repair Procedure” on page 36.
28 at
+2.75V?

YES

Is 13MHz clk
present at NO Proceed to “#3 NPU Repair Procedure” on page 37.
U201 pin 57?

YES

Is 13MHz clk
NO Proceed to “#4 NPU Repair Procedure” on page 37.
present at
U703 pin 17?

YES

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 StarTAC 160 (GSM)

Is +2.75V present
at U701 pins 33, NO Proceed to “#5 NPU Repair Procedure” on page 38.
34, 42, 124?

YES

Does U900 pin 30 NO Proceed to “#6 NPU Repair Procedure” on page 38.
reset line go high?

YES

Remove any short on the

watchdog pull up
pads R904.

Does U900 pin

31 watchdog line NO Proceed to “#7 NPU Repair Procedure” on page 38.
go high?

YES

Tie the watchdog line

high by shorting the
watchdog pull up
pads R904.

Is CE signalling
present for U702 at NO
U804 -5&4 and U705 Proceed to “#8 NPU Repair Procedure” on page 39.
at 27 respectively?

YES

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 Troubleshooting

Is CS signalling
present for U704 NO Proceed to “#9 NPU Repair Procedure” on page 39.
at pins 70 and 75
of U701?

YES

Is OE+ signalling NO
present at U705 Proceed to “#10 NPU Repair Procedure” on page 39.
pin 1?

YES

Radio is resetting -
Proceed to “#11 NPU Repair
Procedure” on page 40.

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 StarTAC 160 (GSM)

#1 NPU Repair Procedure

No +3.36V dc battery supply voltage present at pin 40 of U900.

• Check the PCB battery contact assembly for dry joints to the PCB, or broken
contacts. Resolder any dry joints, or replace the battery contact assembly if any of
the contacts are broken.
• Check the PCB external connector J600 socket on or around pin 14 for dry joints to
the PCB or broken contacts.
• Check for +3.36Vdc at pin 40, U900 with both batteries and external power. If no
B+ with main battery check Q1008. If no B+ with auxiliary battery, check Q999. If
no B+ with external power, check CR903 and Q1007.
If replacing the above components does not eliminate the fault, return the PCB to a
Motorola Hi Tech Center.

#2 NPU Repair Procedure

No regulated +2.75V dc voltage present at U900 pins 22 and 28.

The components that will most likely affect the regulated +2.75V supply are the B+
supply, and U900. Check that B+ related components are not physically damaged,
have no dry joints, and are positioned correctly.
If none of the above mentioned problems are apparent, you can either take measure-
ments on the defective PCB to decipher which component(s) you feel should be
replaced, or replace the following components in the order shown:
1st - Replace T902
2nd - Replace U900
• Check the PCB after each component change to verify fault elimination.
If replacing the above components does not eliminate the fault, return the PCB to a
Motorola Hi Tech Center.

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 Troubleshooting

#3 NPU Repair Procedure

No 13MHz reference clock signal at pin 57 of U201.

The components that will most likely affect the 13MHz reference clock are C201,
C203, CR201, U201, and Y201. Check that the mentioned components are not physi-
cally damaged, have no dry joints, and are positioned correctly.

If none of the mentioned problems are apparent, take measurements on the defective
PCB to decipher which component(s) you feel should be replaced, or replace the
following components in the order shown:

1st - Replace Y201

2nd - Replace C203

3rd - Replace CR201

4th - Replace C201
• Check the PCB after each component change to verify fault elimination.

If replacing the above components does not eliminate the fault, return the PCB to a
Motorola Hi Tech Center.

#4 NPU Repair Procedure

No 13MHz reference clock signal at pin 17 of U703.

• Review the audio logic block diagram which shows the path of the 13MHz clock.
• Confirm 13MHz clock signal presence at U703, pin 37.
• Confirm 13MHz clock signal presence at U500, pin 40.

• Confirm 13MHz clock signal presence at U701 pin 38.

If the 13MHz clock enters U703 but does not appear at the output (pin 37), inspect
the chip for physical damage, dry joints and correct position. If none of the
mentioned problems are apparent, ensure that the supply voltage to the chip is
present (see appropriate chip diagram). If present, replace the chip.

If the clock signal is present at U703 pin 37, but not present at any of the other afore-
mentioned chips, ohm the path from that chip back to U703 pin 37. If the trace is
functional, check the chip in question for supply voltage.

If no supply voltage to the chip, trace its B+ path and/or replace the chip. If after
replacing all of the above components the fault is not eliminated, return the PCB to
a Motorola Hi Tech Center.

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 StarTAC 160 (GSM)

#5 NPU Repair Procedure

The +2.75V dc supply is missing at one or more of pins 33, 34, 42 and 124 of U701.

Pins 33, 34, 42, and 124 are each fed via pull up resistors R702, R706, R701, and R702
respectively.

• Check that all the pull up resistors are present, not physically damaged and that
there are no dry joints on either the resistors or U701.

If after replacing the above components the fault is not eliminated, return the PCB to
a Motorola Hi Tech Center.

#6 NPU Repair Procedure

The reset line at pin 30 of U900 does not go high to +2.75V dc.

• Check that U900 is not physically damaged, has no dry joints, and is positioned
correctly. If none of the mentioned problems are apparent replace U900.

If replacing U900 the fault is still apparent return PCB to a Motorola Hi Tech Center.

#7 NPU Repair Procedure

The watchdog line at pin 31 of U900 does not go high to +2.75V dc.

The watchdog line is pulled high by U701 when it receives and executes the initial
blocks of software from the PROM’s U702 and U705. If there is a problem with either
U701, U702, U704, or U705 the watchdog will not be pulled high. This will cause
U900 to power down the +2.75V regulator’s and halt the power up process.

• Check the CE lines at U701, U804, U702, and U705 for activity.
• If there is no activity, proceed to NPU repair procedure 8.
• If above activity is present, check for activity at pin 42 and 43 of U704.
• If there is no activity, proceed to NPU repair procedure 9.
• If above activity is present, check the OE+ line at pin 1 of U705 for activity.
• If there is no activity, proceed to NPU repair procedure 10.

If the above procedures don’t eliminate the fault, return the PCB to a Motorola Hi
Tech Center.

38 Issue 1.0 2/6/98

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 Troubleshooting

#8 NPU Repair Procedure

No CE signalling present at pin 26 and 27 of U702 and U705 respectively.

If there are no CE (chip enable) pulses being sent from U701 to the software chips
U702 and U705 it means that U701 is not trying to communicate with the EPROMs.

• Check that U701, U702 and U705 are not physically damaged, have no dry joints
and are positioned correctly. If none of the mentioned problems are apparent,
replace U702 and U705.

If replacing the above components does not eliminate the fault, return the PCB to a
Motorola Hi Tech Center.

#9 NPU Repair Procedure

No signals present for pins 42 and 43 of U704.

If there are no RAM1CS or RAM2CS (1&2 chip select) pulses being sent from U701
to the SRAM chip U704, it means that there is a problem in communication between
U701 and the RAM.

• Check that U701, and U704 are not physically damaged, have no dry joints and are
positioned correctly. If none of the mentioned problems are apparent, replace
U704.

If after replacing all the above components the fault is still apparent, return PCB to a
Motorola Hi Tech Center.

#10 NPU Repair Procedure

No OE+ signalling present at pin 1 U705.

If there are no ROM2OE pulses being sent to the EEPROM U705, it means that there
is a problem in communication between U701 and the EEPROM.

• Check that U701 and U705 are not physically damaged, have no dry joints, and are
positioned correctly. If none of the mentioned problems are apparent, replace
U705.

If after replacing the mentioned chips the fault is still apparent return the PCB to a
Motorola Hi Tech Center.

2/6/98 Issue 1.0 39

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 StarTAC 160 (GSM)

#11 NPU Repair Procedure

Radio is resetting.
If the radio executes external device communication and then powers itself down
very shortly after attempting power up, it is resetting. A reset can be caused by a
fault on either U703, U701 or U500.
• Check that U103, U701 and U500 are not physically damaged, have no dry joints,
and are positioned correctly. If none of the mentioned problems are apparent.
• Ensure that the watchdog pull up pads R904 are shorted together, and monitor
U703, U701 and U500 to see if any become warmer than the other components
(U703 and U500 are the most likely). Should any of the mentioned components
become warmer— replace it.
If the above information does not pin point a specific component, replace the
following components in the order shown:
1st - Replace U500
2nd - Replace U701
• Check the PCB after each component change, to verify whether or not the fault has
been eliminated.
If after replacing the two components the fault is still apparent return PCB to a
Motorola Hi Tech Center.

40 Issue 1.0 2/6/98

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 Troubleshooting

Logic/Processing Supplement 3 - Phone Failure “See Supplier”

Display shows phone

failure, see supplier

Apply power to the unit and

enter Test Mode.
Press 7100#
Read the return code.

INFO 00 05 INFO 00 03 INFO 00 07

- Replace Speech Replace Modem IC Perform a master cloning.

Coder U500 If problem persists, U705
U500 should be replaced.
- 57# Master Clear

If problem still exists, replace the RF / Logic Board.

2/6/98 Issue 1.0 41

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 StarTAC 160 (GSM)

Logic/Processing Supplement 4 - Unit Powers Down When Twisted

This indicates possibilities of a dry/cold solder joint that normally makes contact.
However, when the PCB is twisted or flexed the contact is broken causing power
down. Inspect the following components for dry joints:
• J101 connector to Display board
• Battery contact assembly
• External device connector assembly (J600)
• Flex strip
• J601 flex connector
If the above analysis does not identify the fault, return the PCB to a Motorola Hi Tech
Center.

Logic/Processing Supplement 5 - PCB Draws Current When Off

• Ensure that the 4.4 V DC power supply is being applied to the PCB, and that the
PCB is switched off.
• Spray the top RF/Logic circuitry with freezer spray until the PCB is frosted white.
If the frost melts on a specific component(s) before the normal defrost process
occurs, replace the component(s).
• If the above process does not eliminate the fault, spray the bottom RF/Logic
circuitry with freezer spray until the PCB is frosted white. Once again, if the frost
melts on a specific component(s) before the normal defrost process occurs, replace
the component(s).
• If steps 2 and 3 fail to eliminate the fault, or the defective component(s) are not
covered by this level of repair, return the PCB to a Motorola Hi Tech Center.

42 Issue 1.0 2/6/98

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 Electrical Diagrams
Figure 7: Audio/Logic Block Diagram
L275
L500 L275 DSC_EN
RWW Flash SRAM BIC 4.1
L275 Mode1 L275 L275
8M (512kX16) 1M (512kX16) (64 TQFP) B Comp
Call Processor 68338 DWNLNK
48 CSP 48 CSP
Pollux SIM RxDn DSC bus UPLNK
ROM_CS(2)
(DCA) ROM_CS RxDp drive
BIC_CS BIC_CS TxD L275
R/W R/W

CPU 32 DP_EN Addr. (20)/Data (16) buses SIM_RST

L500 SIM_DATA_OUT
ON/OFF_SENSE SIM_DATA_IN Buffer
Smart Display/Keypad
Assembly SIM_CLK
RS232_EN Buttons PWR_SNS
DP_ON_OFF -5V REG SIM_PD
KEYPAD (11) SIM_VCC RS232_RX
Port BIC_IRQ 13_DCLK
MF_IRQ 13 MHz SIM
E/F RS232_TX
SIM_INT card
WDOG_CP LOC reader
*RESET DSC_EN_B
13_DCLK
AUD_EN1 217 Hz
AUD_EN2 UPLINK
CTM6

DACOUT
RXAUD
TXAUD
QSM

SCK
BL_CNTL

SFS
CHRGR_EN DWNLINK
SCI

QSPI RTC RAM Timer *RESET

Audio_IN
Buffer
TX_ON_OFF
MSTR_FRM
Green_LED

RF_START

Main B/Aux
MDM_WR

MDM_INT
MDM_RD

Red_LED

CH_FRM
TX_Key

VIB_EN
DM_CS

RXACQ

TR_SW
RX_EN
RF_CS

217 Hz
MOSI
MISO
SCK

B+
MAN_TEST
VRTC
Silent EXT_B+
Ringer
BATT_FDBK

TX_EN Audio_OUT/On_Off
Bi-color LED

SMOC CONTROL (10) EXT Conn

1.3 MHz_REF

13_DCLK
MAIN_THERM

BAT+_SENSE
To RF Section
PNP BATT_FDBK BATT_SENSE SMOC
Pass 100TQFP 1.3 MHz_REF
DACOUT

Logic Osc R475 B+

RF CONTROL (5) Rxl
*DM_CS

B+ Boost TXKEY
+5.4V RXACQ Txl
Regulator
Smart VRef Bias, Ref MDM INT
Battery *RESET TxQ
(3.6V Lithium) MISO
R475 MOSI
Ext._B+ RxQ
Circuitry SCK
BAT_SER_DATA

AUX+ EXT_B+ BATT+ RF_CS

Charger RF_SPI
AUX_THERM MDM_WR
Control L500 MDM_RD
RF_SCK
Auxillary AUX_BATT
B+ Circuit *DM_CS
Battery
(3.6V Lithium) Ear Piece AFC
L275

Alert AGC
VAG
IQRef
R275 B+ Step_AGC
MIC
GCAP AOC_Out
AOC In
48TQFP
AUX MIC
Boom MIC MIC Sat_Det
SPKR
AUX AUD Det_Sw
EXT_AUD

Figure 8:
43

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 44

Figure 9: RF Block Diagram

RX: 935-960 MHz

TX: 890-915 MHz
RX SENS: -102 dBm
TX Power: +33 dBM Dual Ant. Match
215 MHz
SAW Filter RXI 0.8Vp-p
BipolarMIXER BW(2dB) Isolation Amplifer
T/R & RF Switch BipolarLNR G=12 dB 1.38 Vdc
G=13 dB =200kHz G=7 dB
I=5.0 mA G=-6dB I=3.0 mA IQ REF
I=5.5 mA
TX RX
MA/ACON RXQ 0.8Vp-p
NF=17 dB 1.38 Vdc
IP3=-27 dB
SAW RX Filter
925-960 MHz SW_VCC=2.55 Loop Filter
SW_RF RX2.75
Stripline A B
IL=1.2dB Injection Filter 430 MHz
720-745 MHz Tank
T/R & RF SW PLL_VCC Crt.
-5V Cont. Circuit
SFOUT=2.55
Main VCO
TX_EN & Buffer Amp
720-745 MHz
RX_EN
I=13 mA GIFSYN_IC
Loop Filter

-10V V_REF=2.75
Pout=-3dBm
20 dB coupler SBM=-140 dBc/Hz @ 800kHz offset RF_Start
720-745 MHz
IL=0.2dB @-24 dBm
890-915 MHz DCLK
TX_KEY
@-24 dBm Trans. IC 170 MHz 13 MHz
DET_SW @-24 dBm Loop Filter
PACIC AFCDAC
Phase 0.55 - 2.475
SAT_DET Loop Filter
Det.
EXC
Charge Pump
Tank SPI RF CLK
AOCDrive CKT SPI RF Data
0-1.9 8 dB
ENABLE PAD
ENABLE

LIM 330 mVp

R2.75 OUT 1.38 Vdc
PA_B+ TXIP
-5 to -15v Ng. Lev. Sftr
TXIM
Harmonic Filter for PA Contrl
TXQP
IL=0.2 dB TXQM

MMBR571
2 Stage GaAsIPA TX VCO
Driver 890-915 MHz
G=21 dB Po=12 dB =12 dBm
I=40 mA
ENABLE IQ Filter DMCS
nDMCS
+4.80V
TX_E

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 REPLACEMENT PARTS
Cellular Subscriber Sector StarTAC 160 (GSM)

Replacement Parts Table 10: Level 1 Xcvr/Keyboard

ITEM # DESCRIPTION
3709068T01 TUBE ANTENNA
3809326D13 ACTR KEYPAD KRUNCH
Mechanical
3909101E01 CNTCT ANT UPPER RAE
The replacement parts listed in this section 3909156T01 CNTCT BASE SIM
are applicable to the following StarTAC: 3909578M01 CONTACT BATT SMT
4003745K01 SW ARRAY KYPD MTL DOMES
4009060E01 SW TACTILE SMD
4009379M01 8600 KYPD SNAP DOMES
4009497D02 SW REED SMD ENCAPSULATED
NOTE 4209038E01 CLIP GRND/SIGNAL

Replacement transceivers are NOT 4209110T01 CLIP ANTENNA TUBE

normally available to distributors. 4209480E01 CLIP ANTENNA
4709050R01 SHAFT GSM RIGHT
5009135L07 MIC ELECT 6MM PINS
The mechanical parts are pictured in the 5009473S01 ALERT EM 5V SMD
diagram in Figure 27: “StarTAC Parts Illus- 5509242E01 HINGE GSM
tration” on page 58. 7209257T01 LCD DSPL MOD 96X32 PIX
KRUNCH
The Level 3 parts lists are for: 8509098E01 ANT DIRECT CONN 900MHZ

Transciever : SWF2953A
Schematic: 8409253M01
Table 11: Level 3 Keyboard

Keyboard: SYN6812A REF DES ITEM # DESCRIPTION

Schematic: 8409024T01 C00604 2113743E20 CAP CHIP .10 UF 10%
C00605 2113743E20 CAP CHIP .10 UF 10%
C00608 2113743E20 CAP CHIP .10 UF 10%
Table 10: Level 1 Xcvr/Keyboard CR1000 4809606E02 DIODE DUAL ARRAY
DAN222
ITEM # DESCRIPTION
DS0970 4809496B04 LED CHIP CL 190YG
0509440M01 GROMMET MIC KRUNCH 1608
0509441M01 GROMMET ALERT KRUNCH DS0971 4809496B04 LED CHIP CL 190YG
0709301R01 2MM SPACER SUPPORT .5MM 1608
0909059E01 RECPT ZIF 16 POS SMD DS0972 4809496B04 LED CHIP CL 190YG
0909195E01 SKT BOT ENTRY 2 POS 1608

0909449B04 RECEPT MOD 15PIN INSMLD DS0973 4809496B04 LED CHIP CL 190YG
1608
0909453C02 RECPT LO PROFILE SMD 32 POS
DS0974 4809496B04 LED CHIP CL 190YG
0909564M07 RECEPT SMD ZIF 19PIN .5MM BOT 1608
1109155J01 ADHESIVE DCA COVER DS0975 4809496B04 LED CHIP CL 190YG
1509237S01 HSNG FLEX COVER 1608
2809454C02 PLUG LO PROFILE SMD 32 POS

© 1998 Motorola, Inc. Issue 1.0 45

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 StarTAC 160 (GSM)

Table 11: Level 3 Keyboard

REF DES ITEM # DESCRIPTION Table 12: Level 3 Xcvr
J00101 0909453C02 RECPT LO PROFILE REF
SMD 32 POS ITEM # DESCRIPTION
DES
J00970 0909564M07 RECEPT SMD ZIF 19PIN
A00001 3909101E01 CNTCT ANT UPPER RAE
.5MM BOT
A00002 4209480E01 CLIP ANTENNA
Q00103 5109781E41 IC 2.7V REG
TC55RP2702EMB A00003 4209110T01 CLIP ANTENNA TUBE
Q00604 4809607E04 TSTR SIG PNP 2SB1132 A00004 4209038E01 CLIP GRND/SIGNAL
SOT89 AL0800 5009473S01 ALERT EM 5V SMD
Q00605 4809605E02 TSTR SIG NPN C00201 2113743N46 CAP CHIP 68.0 PF 5%
2SC4617 COG
Q00606 4813824A17 XSTR PNP40V .2A C00202 2113743N46 CAP CHIP 68.0 PF 5%
GENP B=100-300 COG
R00110 0611079A74 RES FIXED CHIP 1000 5 C00203 2113743L41 CAP CHIP 10000 PF 10%
1/10 A/P X7R
R00606 0662057A97 CHIP RES 100K OHMS C00204 2113743L41 CAP CHIP 10000 PF 10%
5% X7R
R00607 0662057A85 CHIP RES 33K OHMS C00205 2311049A56 CAP TAN CHIP A/P 4.7 20
5% 10
R00608 0660076N75 RES CHIP 12 K OHM 1/ C00206 2113743N34 CAP CHIP 22.0 PF 5%
16 W COG
R00970 0660076N13 RES CHIP 33 OHM 5 1/ C00208 2109622N16 CAP CER CHIP NPO
16 CLASS I
R00971 0660076N13 RES CHIP 33 OHM 5 1/ C00209 2113740A79 CAP CHIP REEL CL1 +/-
16 30 1000
R00972 0660076N13 RES CHIP 33 OHM 5 1/ C00210 2113743N18 CAP CHIP 4.7 PF +-.25PF
16 COG
R00973 0660076N13 RES CHIP 33 OHM 5 1/ C00211 2113743L41 CAP CHIP 10000 PF 10%
16 X7R
R00974 0660076N13 RES CHIP 33 OHM 5 1/ C00212 2113743G26 CAP CHIP 4.7 UF 16V
16 +80-20%
R00975 0660076N13 RES CHIP 33 OHM 5 1/ C00213 2113743L41 CAP CHIP 10000 PF 10%
16 X7R
R00976 0662057A55 CHIP RES 1800 OHMS C00214 2113743G26 CAP CHIP 4.7 UF 16V
5% +80-20%
R00977 0662057B47 CHIP RES 0 OHMS +- C00216 2113743N34 CAP CHIP 22.0 PF 5%
.050 OHMS COG
S00970 4009497D02 SW REED SMD ENCAP- C00220 2113743L41 CAP CHIP 10000 PF 10%
SULATED X7R
SPC002 0709301R01 2MM SPACER C00221 2113743N24 CAP CHIP 8.2 PF + -.5PF
SUPPORT .5MM COG
SPC003 0709301R01 2MM SPACER C00222 2113743N34 CAP CHIP 22.0 PF 5%
SUPPORT .5MM COG
U00600 5109522E23 IC SNGL INV GATE C00223 2311049A56 CAP TAN CHIP A/P 4.7 20
TC7SH04FU 10
U00601 5109920D22 IC DC-DC CONV C00224 2113743N50 CAP CHIP 100 PF 5%
TCM828 SOT23A5 COG
C00227 2113743N30 CAP CHIP 15.0 PF 5%
COG

46 Issue 1.0 2/6/98

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 Replacement Parts

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
C00228 2113743N30 CAP CHIP 15.0 PF 5% C00261 2113743N22 CAP CHIP 6.8 PF + -.5PF
COG COG
C00229 2113743N48 CAP CHIP 82.0 PF 5% C00262 2113740A67 CAP CHIP REEL CL1 +/-
COG 30 330
C00230 2113740B81 CAP CHIP REEL CL1 +/- C00263 2113743N34 CAP CHIP 22.0 PF 5%
30 2400 COG
C00231 2113740F61 CAP CHIP REEL CL1 +/ C00264 2113743N21 CAP CHIP 6.2 PF + -.5PF
130 270 COG
C00232 2113743L17 CAP CHIP 1000 PF 10% C00265 2113743N24 CAP CHIP 8.2 PF + -.5PF
X7R COG
C00234 2113743L41 CAP CHIP 10000 PF 10% C00266 2113743N10 CAP CHIP 2.2 PF +-.25PF
X7R COG
C00236 2113743N42 CAP CHIP 47.0 PF 5% C00270 2113743N26 CAP CHIP 10.0 PF 5%
COG COG
C00237 2109622N16 CAP CER CHIP NPO C00289 2113743N34 CAP CHIP 22.0 PF 5%
CLASS I COG
C00242 2113743L17 CAP CHIP 1000 PF 10% C00290 2113743N42 CAP CHIP 47.0 PF 5%
X7R COG
C00243 2113743L17 CAP CHIP 1000 PF 10% C00300 2113743N50 CAP CHIP 100 PF 5%
X7R COG
C00244 2113743L17 CAP CHIP 1000 PF 10% C00301 2113743L41 CAP CHIP 10000 PF 10%
X7R X7R
C00246 2113743L17 CAP CHIP 1000 PF 10% C00302 2113743N50 CAP CHIP 100 PF 5%
X7R COG
C00247 2113743N03 CAP CHIP 1.0 PF +-.25PF C00303 2113743N24 CAP CHIP 8.2 PF + -.5PF
COG COG
C00250 2113743N34 CAP CHIP 22.0 PF 5% C00304 2113743N30 CAP CHIP 15.0 PF 5%
COG COG
C00251 2113743N50 CAP CHIP 100 PF 5% C00305 2113743N22 CAP CHIP 6.8 PF + -.5PF
COG COG
C00252 2113743L17 CAP CHIP 1000 PF 10% C00306 2113743N07 CAP CHIP 1.5 PF +-.25PF
X7R COG
C00253 2113743N36 CAP CHIP 27.0 PF 5% C00307 2113743L41 CAP CHIP 10000 PF 10%
COG X7R
C00254 2113743N24 CAP CHIP 8.2 PF + -.5PF C00309 2113741A37 CAP CHIP CL2 X7R REEL
COG 4700
C00255 2113743N24 CAP CHIP 8.2 PF + -.5PF C00310 2113743L17 CAP CHIP 1000 PF 10%
COG X7R
C00256 2113743N26 CAP CHIP 10.0 PF 5% C00311 2113743N34 CAP CHIP 22.0 PF 5%
COG COG
C00257 2113743N50 CAP CHIP 100 PF 5% C00312 2113743L41 CAP CHIP 10000 PF 10%
COG X7R
C00258 2113743N10 CAP CHIP 2.2 PF +-.25PF C00313 2113743N26 CAP CHIP 10.0 PF 5%
COG COG
C00259 2113743N20 CAP CHIP 5.6 PF + -.5PF C00314 2113743N18 CAP CHIP 4.7 PF +-.25PF
COG COG
C00260 2113743N18 CAP CHIP 4.7 PF +-.25PF C00315 2113740F55 CAP CHIP REEL CL1 +/-
COG 30 150

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 StarTAC 160 (GSM)

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
C00316 2113743N14 CAP CHIP 3.3 PF +-.25PF C00365 2113743L17 CAP CHIP 1000 PF 10%
COG X7R
C00317 2113743N30 CAP CHIP 15.0 PF 5% C00366 2113740A55 CAP CHIP REEL CL1 +/-
COG 30 100
C00318 2113743N50 CAP CHIP 100 PF 5% C00368 2113741F17 CAP CHIP CL2 X7R REEL
COG 470
C00320 2113740F19 CAP CHIP REEL CL1 +/- C00383 2113743L05 CAP CHIP 330 PF 10%
30 4.7 X7R
C00324 2113743N26 CAP CHIP 10.0 PF 5% C00384 2113740F24 CAP CHIP REEL CL1 +/-
COG 30 7.5
C00325 2113743L41 CAP CHIP 10000 PF 10% C00385 2113743N18 CAP CHIP 4.7 PF +-.25PF
X7R COG
C00326 2113743N42 CAP CHIP 47.0 PF 5% C00387 2113743N42 CAP CHIP 47.0 PF 5%
COG COG
C00327 2113740F15 CAP CHIP REEL CL1 +/- C00388 2113743L41 CAP CHIP 10000 PF 10%
30 3.3 X7R
C00328 2113743N50 CAP CHIP 100 PF 5% C00392 2113743N26 CAP CHIP 10.0 PF 5%
COG COG
C00329 2113740F21 CAP CHIP REEL CL1 +/- C00401 2113743L05 CAP CHIP 330 PF 10%
30 5.6 X7R
C00330 2113743N50 CAP CHIP 100 PF 5% C00403 2113743L17 CAP CHIP 1000 PF 10%
COG X7R
C00331 2113743L17 CAP CHIP 1000 PF 10% C00406 2113743L17 CAP CHIP 1000 PF 10%
X7R X7R
C00335 2113743L41 CAP CHIP 10000 PF 10% C00407 2113743N50 CAP CHIP 100 PF 5%
X7R COG
C00338 2113743L17 CAP CHIP 1000 PF 10% C00408 2113743N69 CAP CHIP 1.8PF 16V +/-
X7R .25PF
C00339 2113743L17 CAP CHIP 1000 PF 10% C00411 2113743N10 CAP CHIP 2.2 PF +-.25PF
X7R COG
C00343 2113743N23 CAP CHIP 7.5 PF + -.5PF C00412 2113743L11 CAP CHIP 560 PF 10%
COG X7R
C00351 2113743L41 CAP CHIP 10000 PF 10% C00414 2113743N36 CAP CHIP 27.0 PF 5%
X7R COG
C00352 2113743N18 CAP CHIP 4.7 PF +-.25PF C00415 2113743N54 CAP CHIP 150 PF 5%
COG COG
C00353 2113743N69 CAP CHIP 1.8PF 16V +/- C00417 2113743L41 CAP CHIP 10000 PF 10%
.25PF X7R
C00357 2113743L09 CAP CHIP 470 PF 10% C00418 2113743N16 CAP CHIP 3.9 PF +-.25PF
X7R COG
C00358 2113743N50 CAP CHIP 100 PF 5% C00419 2113743L41 CAP CHIP 10000 PF 10%
COG X7R
C00360 2113743N50 CAP CHIP 100 PF 5% C00420 2113743L17 CAP CHIP 1000 PF 10%
COG X7R
C00361 2113741F13 CAP CHIP CL2 X7R REEL C00421 2113743N24 CAP CHIP 8.2 PF + -.5PF
330 COG
C00362 2113743N34 CAP CHIP 22.0 PF 5% C00422 2113743L17 CAP CHIP 1000 PF 10%
COG X7R

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 Replacement Parts

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
C00423 2113743N18 CAP CHIP 4.7 PF +-.25PF C00455 2113743N36 CAP CHIP 27.0 PF 5%
COG COG
C00424 2113743L17 CAP CHIP 1000 PF 10% C00501 2113743N54 CAP CHIP 150 PF 5%
X7R COG
C00426 2113743N22 CAP CHIP 6.8 PF + -.5PF C00502 2113743N54 CAP CHIP 150 PF 5%
COG COG
C00427 2113743L41 CAP CHIP 10000 PF 10% C00507 2113743L17 CAP CHIP 1000 PF 10%
X7R X7R
C00432 2113743L17 CAP CHIP 1000 PF 10% C00508 2113743L05 CAP CHIP 330 PF 10%
X7R X7R
C00433 2113743L41 CAP CHIP 10000 PF 10% C00509 2113741F25 CAP CHIP CL2 X7R REEL
X7R 1000
C00434 2113743N34 CAP CHIP 22.0 PF 5% C00510 2113743L05 CAP CHIP 330 PF 10%
COG X7R
C00435 2113743N30 CAP CHIP 15.0 PF 5% C00512 2113741F49 CAP CHIP CL2 X7R REEL
COG 10000
C00436 2113743N26 CAP CHIP 10.0 PF 5% C00550 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00437 2113740F57 CAP CHIP REEL CL1 +/- C00551 2113743M24 CAP CHIP 100000 PF +80-
30 180 20% Y5V
C00438 2113740B78 CAP CHIP REEL CL1 +/- C00552 2113743M24 CAP CHIP 100000 PF +80-
30 1800 20% Y5V
C00440 2113743N50 CAP CHIP 100 PF 5% C00553 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00441 2113743L41 CAP CHIP 10000 PF 10% C00554 2113743M24 CAP CHIP 100000 PF +80-
X7R 20% Y5V
C00442 2113743N50 CAP CHIP 100 PF 5% C00555 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00443 2113743L17 CAP CHIP 1000 PF 10% C00556 2113743M24 CAP CHIP 100000 PF +80-
X7R 20% Y5V
C00444 2113743N26 CAP CHIP 10.0 PF 5% C00557 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00445 2113743N69 CAP CHIP 1.8PF 16V +/- C00558 2113743M24 CAP CHIP 100000 PF +80-
.25PF 20% Y5V
C00446 2113743N14 CAP CHIP 3.3 PF +-.25PF C00559 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00448 2113743N37 CAP CHIP 30.0 PF 5% C00560 2311049A62 CAP TAN CHIP A/P 4.7 10
COG 10
C00449 2113743N50 CAP CHIP 100 PF 5% C00561 2311049A62 CAP TAN CHIP A/P 4.7 10
COG 10
C00450 2113743N50 CAP CHIP 100 PF 5% C00562 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00451 2113743N07 CAP CHIP 1.5 PF +-.25PF C00563 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00453 2113743N26 CAP CHIP 10.0 PF 5% C00564 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00454 2113743N26 CAP CHIP 10.0 PF 5% C00600 2113743N34 CAP CHIP 22.0 PF 5%
COG COG

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 StarTAC 160 (GSM)

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
C00601 2113743N38 CAP CHIP 33.0 PF 5% C00759 2113743E12 CAP CHIP .047 UF 10%
COG X7R
C00602 2113743N38 CAP CHIP 33.0 PF 5% C00760 2113743E12 CAP CHIP .047 UF 10%
COG X7R
C00603 2113743N38 CAP CHIP 33.0 PF 5% C00761 2113743E12 CAP CHIP .047 UF 10%
COG X7R
C00604 2113743N38 CAP CHIP 33.0 PF 5% C00762 2113743L41 CAP CHIP 10000 PF 10%
COG X7R
C00606 2113743N50 CAP CHIP 100 PF 5% C00791 2113743N12 CAP CHIP 2.7 PF +-.25PF
COG COG
C00607 2113743N38 CAP CHIP 33.0 PF 5% C00792 2113743N14 CAP CHIP 3.3 PF +-.25PF
COG COG
C00608 2113743N38 CAP CHIP 33.0 PF 5% C00801 2113743N38 CAP CHIP 33.0 PF 5%
COG COG
C00610 2113743N38 CAP CHIP 33.0 PF 5% C00802 2113743N38 CAP CHIP 33.0 PF 5%
COG COG
C00611 2113743N38 CAP CHIP 33.0 PF 5% C00803 2113743E20 CAP CHIP .10 UF 10%
COG C00804 2113743E07 CER CHIP CAP .022UF
C00612 2113743N38 CAP CHIP 33.0 PF 5% C00806 2113743N38 CAP CHIP 33.0 PF 5%
COG COG
C00613 2113743N38 CAP CHIP 33.0 PF 5% C00808 2113743N38 CAP CHIP 33.0 PF 5%
COG COG
C00614 2113743N38 CAP CHIP 33.0 PF 5% C00809 2113743N38 CAP CHIP 33.0 PF 5%
COG COG
C00620 2113743L21 CAP CHIP 1500 PF 10% C00810 2113743A27 CAP CHIP .470 UF 10%
X7R 16V
C00701 2113743N26 CAP CHIP 10.0 PF 5% C00811 2113743N38 CAP CHIP 33.0 PF 5%
COG COG
C00704 2113743E12 CAP CHIP .047 UF 10% C00812 2311049A65 CAP TANT CHIP A/P 22 10
X7R 6
C00705 2113743E12 CAP CHIP .047 UF 10% C00813 2113743N38 CAP CHIP 33.0 PF 5%
X7R COG
C00709 2113743M08 CAP CHIP 22000 PF +80- C00814 2113743N38 CAP CHIP 33.0 PF 5%
20% Y5V COG
C00710 2113743N54 CAP CHIP 150 PF 5% C00815 2109622N06 CAP CER CHIP NPO
COG CLASS I
C00711 2113743E12 CAP CHIP .047 UF 10% C00816 2113743E20 CAP CHIP .10 UF 10%
X7R
C00820 2113743N34 CAP CHIP 22.0 PF 5%
C00712 2113743M08 CAP CHIP 22000 PF +80- COG
20% Y5V
C00825 2113743M24 CAP CHIP 100000 PF +80-
C00751 2113743E12 CAP CHIP .047 UF 10% 20% Y5V
X7R
C00833 2113743N38 CAP CHIP 33.0 PF 5%
C00753 2113743E12 CAP CHIP .047 UF 10% COG
X7R
C00850 2113743N38 CAP CHIP 33.0 PF 5%
C00754 2113743E12 CAP CHIP .047 UF 10% COG
X7R
C00858 2113743N38 CAP CHIP 33.0 PF 5%
C00755 2113743E12 CAP CHIP .047 UF 10% COG
X7R

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 Replacement Parts

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
C00859 2113743N38 CAP CHIP 33.0 PF 5% C00922 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00860 2113743N38 CAP CHIP 33.0 PF 5% C00923 2113743N12 CAP CHIP 2.7 PF +-.25PF
COG COG
C00861 2113743N38 CAP CHIP 33.0 PF 5% C00924 2113928J06 CAP CER CHIP 4.7 UF
COG 10% 10V
C00862 2113743N38 CAP CHIP 33.0 PF 5% C00933 2113743M24 CAP CHIP 100000 PF +80-
COG 20% Y5V
C00863 2113743N38 CAP CHIP 33.0 PF 5% C00960 2113741F49 CAP CHIP CL2 X7R REEL
COG 10000
C00901 2309121D19 CAP CHIP TANT 10 UF C00962 2113743N54 CAP CHIP 150 PF 5%
10% 10 V COG
C00902 2113743H14 CAP CHIP 10.0 UF 16V C00963 2113743A23 CAP CHIP .220 UF 10%
+80-20% X7R
C00903 2113743H14 CAP CHIP 10.0 UF 16V C00966 2113743N36 CAP CHIP 27.0 PF 5%
+80-20% COG
C00904 2113743N26 CAP CHIP 10.0 PF 5% C01002 2113743L05 CAP CHIP 330 PF 10%
COG X7R
C00906 2309121D19 CAP CHIP TANT 10 UF C01020 2113743M24 CAP CHIP 100000 PF +80-
10% 10 V 20% Y5V
C00907 2113928J06 CAP CER CHIP 4.7 UF C01021 2113743L17 CAP CHIP 1000 PF 10%
10% 10V X7R
C00908 2113743H14 CAP CHIP 10.0 UF 16V C01022 2113743A27 CAP CHIP .470 UF 10%
+80-20% 16V
C00909 2113743E20 CAP CHIP .10 UF 10% C01023 2113743L41 CAP CHIP 10000 PF 10%
C00910 2113928J06 CAP CER CHIP 4.7 UF X7R
10% 10V C01025 2113743E20 CAP CHIP .10 UF 10%
C00911 2311049A56 CAP TAN CHIP A/P 4.7 20 C01026 2113743M24 CAP CHIP 100000 PF +80-
10 20% Y5V
C00912 2113743L41 CAP CHIP 10000 PF 10% C01027 2113743M24 CAP CHIP 100000 PF +80-
X7R 20% Y5V
C00913 2113928J06 CAP CER CHIP 4.7 UF CR0201 4809641F04 DIODE VCTR SMV1204-
10% 10V 70 SOT23
C00914 2113928J06 CAP CER CHIP 4.7 UF CR0604 4809788E06 DIODE ZENER 6.8V
10% 10V UDZ6.8B
C00915 2309121D23 CAP CHIP TANT 68 UF CR0605 4809653F03 DIODE SCHOTTKY 1A
10% 10 V 10BQ040 SMD
C00916 2113743N38 CAP CHIP 33.0 PF 5% CR0606 4809606E02 DIODE DUAL ARRAY
COG DAN222
C00917 2113743N12 CAP CHIP 2.7 PF +-.25PF CR0607 4809606E08 DIODE DUAL SCHOT-
COG TKEY RB715F
C00918 2113743N12 CAP CHIP 2.7 PF +-.25PF CR0608 4809606E08 DIODE DUAL SCHOT-
COG TKEY RB715F
C00919 2113743N12 CAP CHIP 2.7 PF +-.25PF CR0711 4809606E07 DIODE DUAL ARRAY
COG DA221
C00920 2311049A54 CAP TAN CHIP A/P 3.3 20 CR0901 4809924D06 DIODE SCHTTKY DUAL
16 BAT54S
C00921 2311049A54 CAP TAN CHIP A/P 3.3 20 CR0902 4809606E02 DIODE DUAL ARRAY
16 DAN222

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 StarTAC 160 (GSM)

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
CR0903 4809653F03 DIODE SCHOTTKY 1A L00412 2409646M07 IND CER MULTILYR 12NH
10BQ040 SMD 1608
CR0904 4809788E06 DIODE ZENER 6.8V L00413 2409646M83 IN CER MULTILYR 15 NH
UDZ6.8B 1608
CR0908 4809118D01 LED BICOLOR L00414 2409704K10 IND CHIP MULTILYR 47NH
LNJ107W5PRA1 2012
CR0910 4809653F02 RECT SCHOTTKY 1.0A L00421 2409646M19 IN CER MULTILYR
UPS5817 L00422 2409350L20 IND CER LZRETCH 56 NH
CR0999 4809788E06 DIODE ZENER 6.8V 2 1608
UDZ6.8B L00431 2462587Q36 IND CHIP 120 NH 10%
CR1001 4809788E06 DIODE ZENER 6.8V L00433 2409646M84 IN CER MULTILYR 18 NH
UDZ6.8B 1608
FL0420 9109035M01 FLTR SAW BP 215MHZ L00440 2462587Q38 IND CHIP 180 NH 10%
SMD
L00442 2409646M13 IND CER MULTILYR 39NH
FL0452 9109247M01 FLTR SAW BP 947MHZ 1608
3X3MM SMD
L00445 2409646M88 IN CER MULTILYR 39 NH
J00060 3909578M01 CONTACT BATT SMT 1608
J00061 3909578M01 CONTACT BATT SMT L00450 2409646M01 IND CER MULTILYR 3.9NH
J00062 3909578M01 CONTACT BATT SMT 1608
J00063 3909578M01 CONTACT BATT SMT L00501 2462587P36 CHIP IND 100000 NH
J00101 2809454C02 PLUG LO PROFILE SMD L00502 2409646M83 IN CER MULTILYR 15 NH
32 POS 1608
J00601 0909059E01 RECPT ZIF 16 POS SMD Q00102 4809579E09 TSTR MOSFET P-CHAN
J00802 0909195E01 SKT BOT ENTRY 2 POS 2SJ346

J00900 3909156T01 CNTCT BASE SIM Q00104 4809579E02 TSTR MOSFET N-CHAN
25K1830
L00203 2409646M95 IN CER MULTILYR
Q00202 4809579E18 TSTR MOSFET P-CHAN
L00210 2409646M08 IND CER MULTILYR 15NH TP0101T
1608
Q00203 4809579E18 TSTR MOSFET P-CHAN
L00211 2409646M07 IND CER MULTILYR 12NH TP0101T
1608
Q00250 4809527E24 TSTR NPN RF
L00258 2409646M76 IN CER MULTILYR 3.9NH MRF949LT1 SC-90
1608
Q00251 4809527E24 TSTR NPN RF
L00263 2409646M76 IN CER MULTILYR 3.9NH MRF949LT1 SC-90
1608
Q00252 4809527E24 TSTR NPN RF
L00267 2409646M84 IN CER MULTILYR 18 NH MRF949LT1 SC-90
1608
Q00300 4809527E24 TSTR NPN RF
L00300 2409646M56 IN CER MULTILYR 10 NH MRF949LT1 SC-90
1608
Q00301 4809579E17 TSTR MOSFET P-CHAN
L00301 2409646M56 IN CER MULTILYR 10 NH SI9424
1608
Q00303 4809527E24 TSTR NPN RF
L00302 2409646M62 IN CER MULTILYR 33 NH MRF949LT1 SC-90
1608
Q00305 4809605E02 TSTR SIG NPN 2SC4617
L00350 2409646M77 IN CER MULTILYR 4.7NH
1608 Q00330 4809605E02 TSTR SIG NPN 2SC4617

L00401 2462587Q36 IND CHIP 120 NH 10% Q00331 4809607E02 TSTR SIG PNP 25A1774

L00410 2409646M28 IND CER MULTILYR 5.6NH Q00332 4809605E02 TSTR SIG NPN 2SC4617
1608

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 Replacement Parts

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
Q00418 4809527E20 TSTR NPN RF 2SC4784 Q01010 4809939C05 TSTR DUAL NPN/PNP
SC70 UMH 5
Q00420 4809527E20 TSTR NPN RF 2SC4784 Q01011 4809579E18 TSTR MOSFET P-CHAN
SC70 TP0101T
Q00421 4809527E24 TSTR NPN RF Q01012 4809579E16 TSTR MOSFET N-CHAN
MRF949LT1 SC-90 TN0200T
Q00440 4809605E02 TSTR SIG NPN 2SC4617 Q01013 4809579E18 TSTR MOSFET P-CHAN
Q00441 4809607E02 TSTR SIG PNP 25A1774 TP0101T

Q00442 4809939C08 TSTR DUAL PNP/PNP Q01014 4809579E16 TSTR MOSFET N-CHAN
UMA6NTL TN0200T

Q00443 4809939C08 TSTR DUAL PNP/PNP Q01015 4809607E02 TSTR SIG PNP 25A1774
UMA6NTL Q01016 4809608E03 TSTR DIG PNP DTA114YE
Q00446 4809608E03 TSTR DIG PNP DTA114YE R00103 0662057N39 RES CHIP 470K 5% 20X40
Q00501 4809607E05 TSTR PNP DTA143EE R00104 0662057N23 RES. CHIP 100K 5%
Q00502 4809607E05 TSTR PNP DTA143EE 20X40

Q00601 4809579E17 TSTR MOSFET P-CHAN R00201 0662057N13 RES. CHIP 39K 5%
SI9424 20X40

Q00602 4809939C04 TSTR DUAL PNP/NPN R00202 0662057N29 RES CHIP 180K 5% 20X40
UMC3 R00203 0662057M38 RES CHIP 33 5% 20X40
Q00606 4809605E02 TSTR SIG NPN 2SC4617 R00204 0662057M84 RES. CHIP 2700 5%
Q00607 5109522E13 IC BILAT SW TC7S66FU 20X40

Q00608 5109522E13 IC BILAT SW TC7S66FU R00205 0662057M98 RES. CHIP 10K 5%

20X40
Q00609 5109522E13 IC BILAT SW TC7S66FU
R00206 0662057M50 RES. CHIP 100 5% 20X40
Q00610 5109522E13 IC BILAT SW TC7S66FU
R00210 0662057M36 RES. CHIP 27 5% 20X40
Q00613 4809940E03 TSTR DIG NPN
DTC114TE R00214 0662057M01 RES. CHIP 0 5% 20X40

Q00703 4813824A21 XSTR PNP 60V .6A GENP R00215 0662057N13 RES. CHIP 39K 5%
B=100 20X40

Q00803 4809608E03 TSTR DIG PNP DTA114YE R00221 0662057M54 RES. CHIP 150 5% 20X40

Q00903 4809607E02 TSTR SIG PNP 25A1774 R00226 0662057N03 RES. CHIP 15K 5%
20X40
Q00904 4809607E02 TSTR SIG PNP 25A1774
R00228 0662057M38 RES CHIP 33 5% 20X40
Q00922 4809579E11 TSTR MOSFET P-CHAN
NDS0601 R00229 0662057M38 RES CHIP 33 5% 20X40

Q00999 4809807C24 TSTR FET P-CHAN 2.5W R00250 0662057M60 RES. CHIP 270 5% 20X40
SI4463DY R00251 0662057M78 RES. CHIP 1500 5%
Q01001 4809939C04 TSTR DUAL PNP/NPN 20X40
UMC3 R00252 0662057M80 RES. CHIP 1800 5%
Q01002 4809579E08 TSTR FET DUAL P-CHAN 20X40
IRF7504 R00253 0662057M74 RES. CHIP 1000 5%
Q01005 4809579E08 TSTR FET DUAL P-CHAN 20X40
IRF7504 R00255 0662057M58 RES. CHIP 220 5% 20X40
Q01007 4809807C24 TSTR FET P-CHAN 2.5W R00257 0662057M43 RES. CHIP 51 5% 20X40
SI4463DY R00258 0662057M34 RES. CHIP 22 5% 20X40
Q01008 4809807C24 TSTR FET P-CHAN 2.5W R00259 0662057M50 RES. CHIP 100 5% 20X40
SI4463DY
R00260 0662057M82 RES. CHIP 2200 5%
Q01009 4809579E02 TSTR MOSFET N-CHAN 20X40
25K1830

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 StarTAC 160 (GSM)

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
R00261 0662057M86 RES. CHIP 3300 5% R00412 0662057M90 RES. CHIP 4700 5%
20X40 20X40
R00262 0662057M01 RES. CHIP 0 5% 20X40 R00413 0662057M92 RES. CHIP 5600 5%
R00264 0662057M54 RES. CHIP 150 5% 20X40 20X40

R00266 0662057N10 RES. CHIP 30K 5% R00415 0662057M50 RES. CHIP 100 5% 20X40
20X40 R00417 0662057M84 RES. CHIP 2700 5%
R00300 0662057M74 RES. CHIP 1000 5% 20X40
20X40 R00419 0662057M84 RES. CHIP 2700 5%
R00301 0662057M82 RES. CHIP 2200 5% 20X40
20X40 R00421 0662057M82 RES. CHIP 2200 5%
R00302 0662057M26 RES. CHIP 10 5% 20X40 20X40

R00303 0662057M68 RES. CHIP 560 5% 20X40 R00422 0662057M76 RES. CHIP 1200 5%
20X40
R00304 0662057M56 RES. CHIP 180 5% 20X40
R00423 0662057M60 RES. CHIP 270 5% 20X40
R00305 0662057M58 RES. CHIP 220 5% 20X40
R00424 0662057M50 RES. CHIP 100 5% 20X40
R00307 0662057M74 RES. CHIP 1000 5%
20X40 R00432 0662057M30 RES. CHIP 15 5% 20X40

R00325 0662057M98 RES. CHIP 10K 5% R00433 0662057M98 RES. CHIP 10K 5%
20X40 20X40

R00326 0662057B47 CHIP RES 0 OHMS +-.050 R00434 0662057N06 RES. CHIP 20K 5%
OHMS 20X40

R00328 0662057M74 RES. CHIP 1000 5% R00435 0662057M82 RES. CHIP 2200 5%
20X40 20X40

R00330 0662057M78 RES. CHIP 1500 5% R00436 0662057M56 RES. CHIP 180 5% 20X40
20X40 R00439 0662057M81 RES. CHIP 2000 5%
R00331 0662057M74 RES. CHIP 1000 5% 20X40
20X40 R00440 0609591M37 RES CHIP DUAL 10K 5%
R00332 0662057M86 RES. CHIP 3300 5% 0.63W
20X40 R00441 0609591M37 RES CHIP DUAL 10K 5%
R00333 0662057M98 RES. CHIP 10K 5% 0.63W
20X40 R00442 0662057N15 RES. CHIP 47K 5%
R00334 0662057M98 RES. CHIP 10K 5% 20X40
20X40 R00445 0662057N15 RES. CHIP 47K 5%
R00350 0662057M43 RES. CHIP 51 5% 20X40 20X40

R00354 0662057M98 RES. CHIP 10K 5% R00446 0662057M82 RES. CHIP 2200 5%
20X40 20X40

R00357 0662057N19 RES. CHIP 68K 5% R00447 0662057N29 RES CHIP 180K 5% 20X40
20X40 R00501 0662057M60 RES. CHIP 270 5% 20X40
R00358 0662057M50 RES. CHIP 100 5% 20X40 R00502 0662057M74 RES. CHIP 1000 5%
R00361 0662057M98 RES. CHIP 10K 5% 20X40
20X40 R00503 0662057N03 RES. CHIP 15K 5%
R00380 0662057M74 RES. CHIP 1000 5% 20X40
20X40 R00505 0662057N03 RES. CHIP 15K 5%
R00390 0662057M74 RES. CHIP 1000 5% 20X40
20X40 R00508 0662057M74 RES. CHIP 1000 5%
R00393 0662057M32 RES. CHIP 18 5% 20X40 20X40

R00395 0662057M50 RES. CHIP 100 5% 20X40 R00513 0662057N15 RES. CHIP 47K 5%
20X40
R00398 0662057M26 RES. CHIP 10 5% 20X40

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 Replacement Parts

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
R00514 0662057M74 RES. CHIP 1000 5% R00717 0662057M78 RES. CHIP 1500 5%
20X40 20X40
R00516 0660076N89 RES CHIP 47 K OHM 1/16 R00718 0662057M74 RES. CHIP 1000 5%
W 20X40
R00555 0660076N89 RES CHIP 47 K OHM 1/16 R00719 0662057M50 RES. CHIP 100 5% 20X40
W R00720 0662057N07 RES. CHIP 22K 5%
R00602 0680195M64 RES 0.24 OHM 1/2W 20X40
R00603 0662057N15 RES. CHIP 47K 5% R00721 0662057M58 RES. CHIP 220 5% 20X40
20X40 R00722 0662057M98 RES. CHIP 10K 5%
R00609 0662057M98 RES. CHIP 10K 5% 20X40
20X40 R00723 0662057M74 RES. CHIP 1000 5%
R00611 0662057M98 RES. CHIP 10K 5% 20X40
20X40 R00724 0662057M50 RES. CHIP 100 5% 20X40
R00612 0662057N29 RES CHIP 180K 5% 20X40 R00725 0662057M90 RES. CHIP 4700 5%
R00613 0662057M98 RES. CHIP 10K 5% 20X40
20X40 R00726 0609591M45 RES CHIP DUAL 47K 5%
R00614 0662057M98 RES. CHIP 10K 5% 0.63W
20X40 R00727 0609591M45 RES CHIP DUAL 47K 5%
R00615 0662057N39 RES CHIP 470K 5% 20X40 0.63W
R00617 0662057N39 RES CHIP 470K 5% 20X40 R00728 0609591M45 RES CHIP DUAL 47K 5%
R00650 0662057M90 RES. CHIP 4700 5% 0.63W
20X40 R00729 0609591M45 RES CHIP DUAL 47K 5%
R00701 0662057N03 RES. CHIP 15K 5% 0.63W
20X40 R00730 0662057M50 RES. CHIP 100 5% 20X40
R00702 0609591M39 RES CHIP DUAL 15K 5% R00734 0609591M45 RES CHIP DUAL 47K 5%
0.63W 0.63W
R00703 0609591M39 RES CHIP DUAL 15K 5% R00736 0662057N03 RES. CHIP 15K 5%
0.63W 20X40
R00705 0609591M39 RES CHIP DUAL 15K 5% R00737 0662057N03 RES. CHIP 15K 5%
0.63W 20X40
R00706 0662057N03 RES. CHIP 15K 5% R00740 0662057M98 RES. CHIP 10K 5%
20X40 20X40
R00708 0609591M39 RES CHIP DUAL 15K 5% R00741 0662057M74 RES. CHIP 1000 5%
0.63W 20X40
R00710 0662057N03 RES. CHIP 15K 5% R00742 0662057N03 RES. CHIP 15K 5%
20X40 20X40
R00711 0662057N03 RES. CHIP 15K 5% R00743 0662057N03 RES. CHIP 15K 5%
20X40 20X40
R00712 0662057N03 RES. CHIP 15K 5% R00747 0662057N23 RES. CHIP 100K 5%
20X40 20X40
R00713 0662057N03 RES. CHIP 15K 5% R00748 0662057N23 RES. CHIP 100K 5%
20X40 20X40
R00714 0662057M50 RES. CHIP 100 5% 20X40 R00749 0662057N23 RES. CHIP 100K 5%
R00715 0662057N03 RES. CHIP 15K 5% 20X40
20X40 R00750 0662057N03 RES. CHIP 15K 5%
R00716 0662057M74 RES. CHIP 1000 5% 20X40
20X40 R00752 0662057N23 RES. CHIP 100K 5%
20X40

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 StarTAC 160 (GSM)

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
R00761 0662057N15 RES. CHIP 47K 5% R00910 0662057M98 RES. CHIP 10K 5%
20X40 20X40
R00763 0662057N15 RES. CHIP 47K 5% R00911 0662057N33 RES. CHIP 270K 5%
20X40 20X40
R00781 0662057M98 RES. CHIP 10K 5% R00912 0662057N39 RES CHIP 470K 5% 20X40
20X40 R00920 0662057M74 RES. CHIP 1000 5%
R00791 0662057N15 RES. CHIP 47K 5% 20X40
20X40 R00989 0662057N06 RES. CHIP 20K 5%
R00798 0662057M50 RES. CHIP 100 5% 20X40 20X40
R00799 0662057M50 RES. CHIP 100 5% 20X40 R01010 0662057N23 RES. CHIP 100K 5%
R00800 0662057N09 RES. CHIP 27K 5% 20X40
20X40 R01011 0662057M98 RES. CHIP 10K 5%
R00801 0662057N05 RES. CHIP 18K 5% 20X40
20X40 R01013 0662057M98 RES. CHIP 10K 5%
R00802 0662057N05 RES. CHIP 18K 5% 20X40
20X40 R01014 0662057N23 RES. CHIP 100K 5%
R00803 0662057N05 RES. CHIP 18K 5% 20X40
20X40 R01015 0662057M90 RES. CHIP 4700 5%
R00804 0662057N15 RES. CHIP 47K 5% 20X40
20X40 R01016 0662057N33 RES. CHIP 270K 5%
R00805 0662057N15 RES. CHIP 47K 5% 20X40
20X40 R01017 0662057N33 RES. CHIP 270K 5%
R00806 0662057M68 RES. CHIP 560 5% 20X40 20X40

R00807 0662057M68 RES. CHIP 560 5% 20X40 R01018 0662057N39 RES CHIP 470K 5% 20X40

R00808 0662057M90 RES. CHIP 4700 5% R01019 0662057N29 RES CHIP 180K 5% 20X40
20X40 R01020 0662057N15 RES. CHIP 47K 5%
R00809 0662057M68 RES. CHIP 560 5% 20X40 20X40

R00810 0662057N05 RES. CHIP 18K 5% R01021 0662057N23 RES. CHIP 100K 5%
20X40 20X40

R00846 0662057M98 RES. CHIP 10K 5% R01022 0662057N31 RES CHIP 220K 5% 20X40
20X40 R01023 0662057M90 RES. CHIP 4700 5%
R00847 0662057M74 RES. CHIP 1000 5% 20X40
20X40 R01024 0662057N33 RES. CHIP 270K 5%
R00850 0662057M26 RES. CHIP 10 5% 20X40 20X40

R00851 0662057M26 RES. CHIP 10 5% 20X40 R01027 0662057M92 RES. CHIP 5600 5%
20X40
R00852 0660076N01 RES CHIP 10 OHM 5 1/
16W R01028 0662057M92 RES. CHIP 5600 5%
20X40
R00853 0660076N01 RES CHIP 10 OHM 5 1/
16W R01100 0609591M45 RES CHIP DUAL 47K 5%
0.63W
R00901 0662057M90 RES. CHIP 4700 5%
20X40 R01103 0662057M26 RES. CHIP 10 5% 20X40

R00902 0662057M90 RES. CHIP 4700 5% R01105 0662057M26 RES. CHIP 10 5% 20X40
20X40 R01107 0662057M74 RES. CHIP 1000 5%
R00907 0662057N06 RES. CHIP 20K 5% 20X40
20X40 R01108 0662057N23 RES. CHIP 100K 5%
R00908 0662057M61 RES CHIP 300 5% 20X40 20X40

R00909 0662057M50 RES. CHIP 100 5% 20X40 R01109 0662057N07 RES. CHIP 22K 5%
20X40

56 Issue 1.0 2/6/98

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 Replacement Parts

Table 12: Level 3 Xcvr Table 12: Level 3 Xcvr

REF REF
ITEM # DESCRIPTION ITEM # DESCRIPTION
DES DES
R01110 0662057M98 RES. CHIP 10K 5% U00705 5199301A01 IC EEPROM SPCL 8KX8
20X40 28BV64
R01111 0662057M74 RES. CHIP 1000 5% U00804 5109522E10 IC 3-INV LMOS
20X40 TC7W04FU
R01112 0662057N23 RES. CHIP 100K 5% U00900 5109632D75 IC CUST BICMOS GCAP
20X40 LT 48QFP
R01113 0662057N23 RES. CHIP 100K 5% U00902 5109781E50 IC LIN 5V REG LM2980
20X40 SOT23
R01114 0662057M74 RES. CHIP 1000 5% U00903 5109781E57 IC LIN VOLT DECT 3V
20X40 PST995MNR
S00001 4009060E01 SW TACTILE SMD U00904 5109522E25 IC SNGL NOR GATE
S00002 4009060E01 SW TACTILE SMD TC7SH02FU

S00003 4009060E01 SW TACTILE SMD U00905 5109781E77 IC VOLT DECT 3.6V

PST995NNR
SH0101 2609827G03 SHIELD SPACER
U00907 5109522E23 IC SNGL INV GATE
SH0102 2609827G03 SHIELD SPACER TC7SH04FU
SH0103 2609827G03 SHIELD SPACER U00908 5109522E25 IC SNGL NOR GATE
SH0104 2609827G03 SHIELD SPACER TC7SH02FU
SH0105 2609827G03 SHIELD SPACER U00909 5109522E25 IC SNGL NOR GATE
TC7SH02FU
SH0201 2609053T01 SHIELD MAIN VCO
U00910 5109522E22 IC SNGL AND GATE
SH0202 2609058T01 SHIELD GIFSYN
TC7S08FU
SH0203 2609059T01 SHIELD CRYSTAL
U00911 5109512F02 IC VOLT REG 2.7V LP2981
SH0301 2609054T01 SHIELD TIC 5SOT
SH0302 2609055T01 SHIELD PA VR0602 4809788E06 DIODE ZENER 6.8V
SH0401 2609056T01 SHIELD IF UDZ6.8B
SH0402 2609060T01 SHIELD RF VR0603 4809788E06 DIODE ZENER 6.8V
UDZ6.8B
SH0501 2609057T01 SHIELD SMOC
VR0604 4809788E06 DIODE ZENER 6.8V
T00902 2509306J01 CHOKE 15 UH SMD
UDZ6.8B
U00201 5109632D73 IC CUST GIFSYN
VR0605 4809788E06 DIODE ZENER 6.8V
SILXC7786FB
UDZ6.8B
U00300 5109632D90 IC CUST TIC BIPOLAR
VR0606 4809788E06 DIODE ZENER 6.8V
SC79989DTB
UDZ6.8B
U00301 5109908K25 IC RF PA GAAS 3.5W
VR0607 4809788E06 DIODE ZENER 6.8V
PFP-16
UDZ6.8B
U00310 5109632D91 IC CUST PAC
VR0609 4809788E06 DIODE ZENER 6.8V
SC79948DTB 14TSSOP
UDZ6.8B
U00401 5109572E04 IC GAAS RF SW DPDT
VR0901 4809788E08 DIODE ZENER 8.2V
MS098
UDZTE178.2B
U00500 5199332C04 IC MASK SMOC 2.7V
VR0902 4809788E08 DIODE ZENER 8.2V
390236B
UDZTE178.2B
U00701 5109841C30 IC MCU SCSF416776
Y00201 4809612J20 XTAL 13MHZ 20PPM SMD
U00702 5199333A01 IC FLASH ROM 1MX8 5X7 MM
29LV800BGA
U00703 5109743E13 IC ASIC BIC 4.01
S38138EC10
U00704 5109509A16 IC SRAM 64KX16
KM616FS1000 BGA

2/6/98 Issue 1.o 57

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 StarTAC 160 (GSM)

Figure 27: StarTAC Parts Illustration

58 Issue 1.0 2/6/98

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 Replacement Parts

Service Tools for StarTAC

Part No. Description Source

SLN6625 MCEL200 Test Interface Intl. Parts Dept., USA
66-80343A25 Pocket Scriber WSAPD, Singapore
SKN4800A DB15 Test Cable with Coax Intl. Parts Dept., USA
SYN5233A Antenna Tool Intl. Parts Dept., USA
SYN5367A Housing Opener Intl. Parts Dept., USA
SKN4856A Rigid extender board Intl. Parts Dept., USA
SLN3586 3 to -5V converter box for WinNAM, Win MSR Intl. Parts Dept., USA
SKN4808A Cable that connects 3 to -5V box to MCEL200 Intl. Parts Dept., USA
and WinNAM interface.
SKN4809A Cable that connects 3 to -5V box to StarTAC™ Intl. Parts Dept., USA
SLN3587A Express Exchange transfer box Intl. Parts Dept., USA
SKN4780A Express Exchange cable (2 required) Intl. Parts Dept., USA
Tohnichi RTD24Z Adjustable torque driver Local
or equivalent
Leica SZ4 Microscope Local
or equivalent

2/6/98 Issue 1.o 59

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 StarTAC 160 (GSM)

60 Issue 1.0 2/6/98

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 GLOSSARY
Cellular Subscriber Sector StarTAC 160 (GSM)

Glossary

Those marked ** are Motorola specific

abbreviations.

A B

A Interface Interface between MSC and BA BCCH Allocation

BSS BAIC Barring of All Incoming Calls
A3 Authentication algorithm BAOC Barring of all Outgoing Calls
BCC Base Transceiver Station (BTS)
A5 Stream cipher algorithm
Color Code
A8 Ciphering key generating BCCH Broadcast Control CHannel
algorithm
BCD Binary Coded Decimal
AB Access Burst
BCU BTS Control Unit **
A-bis Interface between BSC and BTS Bm Full-rate traffic channel
ACCH Associated Control CHannel BN Bit Number

ACSE Association Control Service BS Base Station

Element BSC Base Station Controller

AGCH Access Grant CHannel BSIC Base Transceiver Station

Identity Code
AOC Advice of charge
BSS Base Station System
ARFCN Absolute Radio Frequency BSSAP BSS Application Part (DTAP
Channel Number and BSSMAP)
ARQ Automatic Request for BSSC Base Station System Control
retransmission Cabinet **

ASIC Application Specific BSSMAP Base Station Systems

Integrated Circuit Management Application Part
BSSOMAP BSS Operation and
AUC Authentication Center Maintenance Application Part
AUT(H) Authentication BSU Base Site Controller Unit **

© 1998 Motorola, Inc. Issue 1.0 61

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 StarTAC 160 (GSM)

BTS Base Transceiver Station DISC DISConnect

DL Data Link (layer)

C Dm Control Channel (ISDN
terminology applied to mobile
CA Call Allocation service)
CBCH Call Broadcast CHannel
Dm Signalling channel
cc Call Control
Dp Dialled Pulse
cc Country Code
CCBS Completion of Calls to Busy DRCU Diversity Radio Channel
Subscribers Unit**
CCH Control CHannel DRX Discontinuous Reception
CCCH Common Control CHannel
DTAP Direct Transfer Application
CFS Call Forwarding on mobile Part
Subscriber busy
CFU Call Forwarding DTE Data Terminal Equipment
Unconditional
DTMF Dual Tone Multi-Frequency
CLIP Calling Line Identification (tone signalling type)
Presentation
CLIR Calling Line Identification DTX Discontinuous Transmission
Restriction
CM Connection Management
COLP Connected Line identification E
Presentation
COLR Connected Line identification E erlang
Restriction
CONF Conference Call add on Eb/No Energy per Bit/Noise floor

CSPDN Circuit Switched Public Data EC Echo Canceller

Network
Ec/No Ratio of energy per
CUG Closed User Group
modulating bit to the noise
CW Call Waiting spectral density

EIR Equipment Identity Register

D
EIRP Effective Isotropic Radiated
Power
DB Dummy Burst
EMC Electromagnetic Compatibility
DBS Distributed Base Station **
DCCH Dedicated Control CHannel EMX Electronic Mobile Exchange **
DET Detach ETSI European Telecommunications
DFE Decision Feedback Equalizer Standards Institute

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 Glossary

F I

FACCH Fast Associated Control I Information (frames)

CHannel
IA5 International Alphanumeric 5
FACCH/F Full rate Fast Associated ID IDentification
Control CHannel
IMEI International Mobile
FACCH/H Half rate Fast Associated Equipment Identity
Control CHannel
IMM IMMediate assignment
FB Frequency correction Burst message
FCCH Frequency Correction IMSI International Mobile
CHannel Subscriber Identity
FEC Forward Error Correction IN Intelligent Network
FN Frame Number ISC International Switching Center
FTAM File Transfer Access ISDN Integrated Services Digital
Management Network
ISUP ISDN User Part
IWF Interworking Function
G

GMSC Gateway Mobile Services J

Switching Center
GMSK Gaussian Minimum Shift
Keying K
GSM Group Special Mobile
Kc ciphering Key
GSM MS GSM Mobile Station
Ki Individual subscriber
GSM PLMN GSM Public Land Mobile authentication key
Network

L
H
LAC Location Area Code
HANDO Handover
LAI Location Area Identification
HDLC High Level Data Link Control (Identity)

HLR Home Location Register LAPB Link Access Procedure ‘B’

(balanced) channel
HOLD Call Hold (Supplementary
Service) LAPDm Link Access Procedure ‘DM’
(mobile ‘D’) channel
HPLMN Home PLMN
Lm Traffic channel (with capacity
HPU Hand Portable Unit lower than Bm)
HSN Hopping Sequence Number LPC Linear Predictive Code

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 StarTAC 160 (GSM)

LR Location Register MT/PP Mobile Terminated Point to

Point messages

M
N
MA Mobile Allocation
NB Normal Burst
MAH Mobile Access Hunting
NE Network Elements
MAI Mobile Allocation Index
NET Norme European de
MAIO Mobile Allocation Index Offset Telecommunications
MAP Mobile Application Part NM Network Management
MCC Mobile Country Code NHC Network Management Center
MCI Malicious Call Identification
MD Mediation Device
O
ME Mobile Equipment
MF Multi-Frequency (tone O&M Operations and Maintenance
signalling type)
OACSU Off Air Call Set-Up
MLSE Maximum Likelihood
Sequence Estimator OCB Outgoing Calls Barred

MM Mobility Management OMAP Operations and Maintenance

Application Part (previously
MMI Man Machine Interface was OAMP)
MNC Mobile Network Code OMC Operations and Maintenance
MO Mobile Originated Center

MO/PP Mobile Originated Point to OMCR Operations and Maintenance

Point messages Center -Radio Part

MoU Memorandum of OMCS Operations and Maintenance

Understanding Center -Switch Part

MRN Mobile Roaming Number OSI Open System Interconnection

MS Mobile Station
MSC Mobile Services Switching P
Center
MSCM Mobile Station Class Mark PAD Packet Assembly Disassembly
MSIN Mobile Station Identification facility
Number PCH Paging CHannel
MSISDN Mobile Station international PDN Public Data Networks
ISDN number
PIN Personal Identification
MSRN Mobile Station Roaming Number
Number
PLMN Public Land Mobile Network
MT Mobile Termination
POTS Plain Old Telephone Service
MTP Message Transfer Part (basic telephone services)

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 Glossary

PSPDN Public Switched Packet Data

S
Network

PSTN Public Switched Telephone

SABM Set Asynchronous Balance
PTO Public Telecommunications Model
Operator
SACCH Slow Associated Control
CHannel

Q SAPI Service Access Point Indicator

(Identifier)

QOS Quality of Service SB Synchronization Burst

SC Service Center
R SCCP Signalling Connection Control
Part
RAB Random Access Burst
SCH Synchronization CHannel
RACH Random Access CHannel
SCP Service Control Point - an
RBDS Remote BSS Diagnostic intelligent network entity
Subsystem **
SDCCH Stand-alone Dedicated
RBU Remote Base Station Unit Control CHannel
(PCN) **
SDL Specification Description
RCU Radio Channel Unit ** Language
REC RECommendation
SFH Slow Frequency Hopping
REL RELease
SIM Subscriber Identity Module
RELP-LTP Regular Pulse Excitation -
Long Term Prediction SMS Short Message Service

REQ REQuest SMSCB Short Message Service Call

Broadcast
RFCH Radio Frequency CHannel
SND SeND
RFN Reduced TDMA Frame
Number SP Signalling Point
RLP Radio Link Protocol SRES Signed RESponse
ROSE Remote Operations Service (authentication)
Element (a CCITT specification
SS Supplementary Service
for O&M)

RXCDR Remote Transcoder Unit ** SS System Simulator

RXLEV Received signal level STP Signalling Transfer Point

RXQUAL Received signal quality SYSGEN SYStem GENeration

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 StarTAC 160 (GSM)

T U

TA Terminal Adaptor UI Unnumbered Information

frame
TA Timing Advance
Um Air Interface
TCAP Transaction Capabilities
Application Part
TCH Traffic CHannel
V
TCH/F A full rate TCH
TCH/FS A full rate speech TCH VAD Voice Activity Detection
TCH/HS A half rate speech TCH VLR Visited Location Register
TCP Transmission Control Protocol VLSI Very Large Scale Integration
TDMA Time Division Multiple Access (IC)

TE Terminal Equipment VPLMN Visited PLMN

TMN Telecommunications
Management Network
W
TMSI Temporary Mobile Subscriber
Identity
TN Timeslot Number X
TRX Transceivers
XC Transcoder
TTY TeleTYpe (refers to any
terminal) XCDR Transcoder **
TS Time Slot
TUP Telephone Users Part
Y

3PTY Three ParTY service

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 SERVICE MANUAL
Cellular Subscriber Sector
FEEDBACK FORM

Service Manual Feedback Form

To report any problems or omissions to this service manual:

1. Photocopy this page.

2. Fill out the boxes below and give your comments.

(This comment page can be used for any Motorola Cellular Subscriber service manual).

3. Fax this form to Motorola Asia Cellular Subscriber Division.

Fax number (847) 523-8796, Attn: Mr. Derek Fung.

Service Manual Number: ____________________________________ Revision: _________

Your Name:________________________________________________________________________

Address: __________________________________________________________________________

Telephone Number: ________________________________________________________________

Nature of Problem or Omission: _____________________________________________________

(Specify Section, Page Number, Diagram, etc.)

__________________________________________________________________________________

__________________________________________________________________________________

__________________________________________________________________________________

__________________________________________________________________________________

__________________________________________________________________________________

__________________________________________________________________________________

__________________________________________________________________________________

 1998 Motorola, Inc.

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 68 2/6/98

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