International Material Data System

IMDS Recommendation IMDS 019

Electric/Electronic (E/E) components and assemblies

1 Purpose

The IMDS Steering Committee encourages all suppliers to submit IMDS data according to
Recommendation IMDS 001 for electronic components and materials at all levels of the supply chain.
Only under the special conditions described below, is it acceptable to deviate from Rec. IMDS 001
processes for the reporting of E/E components and assemblies.

This recommendation describes the general requirements for the creation of Material Data Sheets
(MDSs) for E/E (Electric/Electronic) components, assembled printed circuit boards (PCB/PWB, including
flexible circuit boards (FCP)), and hybrid electronics (standard LTCC 1) used in automotive applications.

The recommendations provided in this release may be applied to IMDS submissions submitted after the
release of this publication of REC019. Suppliers are not required to proactively update older IMDS
submissions with below recommendations. Suppliers are required to update MDSs used for new type
approved vehicles and application codes upon customer request.

2 References
• IMDS 001 General Structure
• Global Automotive Declarable Substance List (www.gadsl.org)
• EC Directive 2000/53/EC (ELV) with Annex II and all its exemptions with regard to E/E
components and assemblies
• EC Directive 2005/64/EC (RRR-Type Approval Directive)
• EU Regulation EC 1907/2006 REACH
• Automotive Industry Interpretation Guide for ELV Annex II with IMDS Information added by the
IMDS Steering Committee

3 Definitions

3.1 Norm and Standards

Please follow the requirements of Rec001.
While metallic and polymeric materials typically have a norm or standard, such as the published IMDS
Steering Committee materials in classifications 1-4, electronics materials, including polymers, do not
usually have an applicable norm or standard and this should not be cause for MDS rejection. It is
recommended to add a comment to the remark field stating there is no applicable norm/standard during

1 Low Temperature Co-fired Ceramic

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MMDS creation could aid in approval. It is equally important that norms & standards are not referenced if
they don't apply to the material being reported for supplier created materials.

IMDS introduced a new Public Norm/Standard called IMDS Rec that can be selected and completed by
adding 019 as Norm Code when creating the material MDS. This indicates that the material naming is
aligned with the Rec019 conventions.

3.2 Electronic Terms

3.2.1 Use glossary, break down by types (i. e. PCB, Hybrid…)

Component Electronic component like e. g. capacitor, IC,

resistor, that typically populate a PCB
Assembly Populated printed circuit board or hybrid
Article Article is defined as an object which during
production is given a special shape, surface or
design which determines its function to a greater
degree than does its chemical composition'.
Electric Relating to the flow of electricity
Electronic A device constructed using one or more electric
elements that make it possible to manage the flow
of electricity
Bill of Material (BOM) Full list of components and materials for product
Hybrid Electronic circuit assembly, typically ceramic
substrate
PCB, PWB Printed circuit board, printed wiring board

3.3 Electrical/Electronical Circuit Board Assembly/ Integrated Circuits

3.3.1 Bare Boards

The electrical/electronical circuit board assembly consists of a mechanical circuit carrier (bare board), the
electrical/electronical components and the solders (and adhesive glues) for the electrical and mechanical
connection. The Bare Board must be reported as a mechanical part acc. to IMDS Rec001. Therefore, the
polymers with/without fillers, the copper, the plating, and coatings must be reported as separated
homogenous materials.

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PCB core/Prereg can be purchased with or without a copper foil. These core/prereg material and the
copper foil material must be declared separately as 2 homogenous materials classified by their chemical
composition.

Examples: (Printed Circuit Boards (e.g., PCB, PWB, FR4, EP-based, ...) / Ceramic Circuit Boards (e.g.,
Substrates, LTCC, Ceramic-bases...) / Flexible Circuit Boards (e.g., FCB, PI-based, ...))

3.3.2 Integrated Circuit Substrates

Substrates used in assembly packages (i. e. BGA, FCBGA, SIP) should be reported by their individual
constituent materials, such as solder mask, metals and core, if applicable.

3.4 Application Codes

With the removal of the ZVEI published semi-components, application codes must be applied directly to
the materials under the component level. There will be application codes for uses of lead in solders and
ceramics. See Recommendation 001 4.4.5 Application Codes for further guidance

Application Codes have a finite life and may need to be updated within existing MDSs as revisions of the
ELV exemptions occur.

3.5 Naming Conventions

3.5.1 Component Names

All component names shall follow the rules and guidelines described in chapter 4.2.1 of IMDS
Recommendation 001 (General component information). The names shall be descriptive, in line with the
applicable customer specifications and usable throughout the automotive industry, not specific to
electronic processing. It is recommended, not to include the manufacturer part number in the component
name. Component names for electronics are unique to that industry and shouldn't be a reason for
rejection. The electronics industry has a variety of naming conventions. A ceramic capacitor may also be
called CAP, CC, C-SM for the same part.

3.5.2 Material Names and Classification

The IMDS Steering Committee has published many MDSs. When applicable, these must be used instead
of creating your own. The IMDS Committee has published primarily MDSs for metallic materials
(Classification 1 – 4) that are defined in public standards supported by IMDS. The IMDS Steering
Committee has published MDSs under three (3) IMDS companies: IMDS-Committee (423); IMDS-
Committee/ILI Metals (18986) and Stahl und Eisen Liste (313).
The IMDS Steering Committee has also published other materials that may be used when applicable
(example: passivations, metal coatings, solders etc.).

Material MDSs issued by the IMDS Steering Committee are exempt from IMDS check
procedures. Material names according to Rec001 or Rec019 should not be a cause of rejection.
Classification 7.3 Other compounds (e. g. friction linings): This classification should only be used
for solid materials which do not fit into any other category.

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* Material names can be described by their chemical composition or the examples below, which are also
seen as descriptive in line with the IMDS Rec001.
** there might be border cases where other classifications are necessary
*** constituent in weight-%

Suggested Example
IMDS
Naming Material
Material Classification Explanation
Format Name
**
*, *** *
This classification
should be used for all
Tin Solder,
metals or metal alloys
Tin Solder Wire,
Major metal which cannot be
Sn91Zn9
Non-lead constituent + 4.2 Other special classified in other 1.x-
Sn99
Solder (1) application metals 4.x classifications.
Tin Solder Paste,
function
Tin Solder Ball,
This classification
Tin Solder Bump
should not be used for
metal oxides
This classification
should be used when
there is almost 100%
Lead Solder,
of lead in a material,
Lead Lead + Lead Solder
3.5 Lead for example in
Solder (1) application Paste, Pb95Sn5
accumulators, lead
Lead Solder Wire
coatings, solders with
more than 80% of
lead.

Nickel Palladium This classification

Nickel + plating
Nickel Gold Plating, should be used for
(pre/post) or 3.4 Nickel Alloys
Plating (4) NiPdAu Plating, nickel, nickel alloys
layer
NiPdAu Layer and nickel coatings.

This classification
should be used for all
metals or metal alloys
which cannot be
Major metal Tin Layer
Tin Plating 4.2 Other special classified in other 1.x-
constituent + Sn-plating,
(4) metals 4.x classifications.
plating or layer EP-Sn
This classification
should not be used for
metal oxides

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This classification
should be used for all
metals or metal alloys
which cannot be
classified in other 1.x-
4.x classifications.
SIEG,
Chip
Major constituent Silicon chip,
Die, Bare 4.2 Other special This classification
+ Chip; Die; Silicon die,
Chip, metals should not be used for
Wafer Silicon, Si,
Wafer (3) metal oxides.

This classification is
for materials that are
majority Elemental
Silicon Cas No 7440-
21-3
This classification
Chip
Major constituent Silicon carbide, should be used for
Die, Bare
+ Chip; Die; GaAs, GaN, InP, 7.2 Glass, ceramic materials that are a
Chip,
Wafer SiO2 majority oxide,
Wafer (3)
carbide, nitride
This classification
should be used for all
duromers that cannot
Major constituent
Silica Die be classified under
Mold + matrix
Encapsulant, 5.4.3 Other 5.4.1 or 5.4.2.
Compound substance(s) +
Silica Mold duromers
(2) encapsulant or
Compound The ISO 1043
mold compound
standard does not
apply to materials in
this classification
3.1) This classification
should be used for
pure copper with a
content of more than
3.2 Copper alloys/
Major metal Copper 99% of copper. This
3.1 Copper (e.g.
constituent - + Leadframe, includes any high
Leadframe copper amounts in
leadframe plating Copper Alloy copper alloy used in
(5) cable harnesses)
or leadframe Leadframe, electronics
(depending on
layer Cu-Leadframe 3.2) This classification
purity)
should be used for
copper fused with
smaller amounts of
other metals.

Major metal Highly alloyed steel

constituent + Iron Nickel Alloy consists of less than
Leadframe
leadframe plating Leadframe, 1.1.2 Highly alloyed 95% iron and more
(5)
or leadframe FeNi-Leadframe than 5% further
layer metallic alloying
components.

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This classification
should be used for
adhesives, bonding
agents, adhesion
promoter and highly
filled thermally or
electrically conductive
Epoxy materials. This could
Adhesive,Die also represent a
Attach Epoxy reinforcement or
Film, mechanically
Die Attach Matrix Silver Sintering, stabilizing attachment
Die Attach
substance + Underfill, 6.2 Adhesives, material.
Adhesive
application Thermal Interface sealants
(11)
function Material, The substances must
Thermally be given in their final
Conductive Gel, cured state - dried
Die Attach and without solvents
and hardener.

This classification
should not be used for
solders or complete
textile adhesives
tapes which consist of
several materials.
This classification
Copper Palladium 3.1 Copper (e.g. would be used for
Bond Wire Copper - Bond
Wire copper amounts in pure copper with a
(7) Wire
CuPd0.5 Wire cable harnesses) content of more than
99 % of copper.
This classification
should be used for all
metals or metal alloys
Gold Alloy Wire,
which cannot be
Major metal Silver Bonding
Bond Wire 4.2 Other special classified in other 1.x-
constituent - Wire
(7) metals 4.x classifications.
Bond Wire Au95 Wire
AgSn Wire
This classification
should not be used for
metal oxides
This classification
should be used only
Aluminum Wire, when classifications
Bond Wire Aluminum - Bond 2.1 Aluminum and
Al99.5 Aluminum 2.1.1 or2.1.2 are not
(7) Wire aluminum alloys
Wire appropriate, for
example for aluminum
coatings

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This classification
should be used for
clear or colored
synthetic
organic/inorganic
Solder Mask,
Solder coatings that are
Solder Mask Lacquers, 6.1 Lacquers
Mask (9)* typically cured to form
Topcoat
a film. The
substances must be
given in their final
cured state - dried
and without solvents.
3.1) This classification
should be used for
pure copper with a
3.1. Copper (e.g.
content of more than
copper amounts
Copper Copper Foil, 99% of copper.
Copper Foil in cable
Foil Cu Foil 3.2) This classification
harnesses), 3.2
should be used for
Copper alloys
copper fused with
smaller amounts of
other metals.
This classification
should be used for
UVCB materials like
glass, silicate ceramic
and enamel as well as
technical ceramics
such as ferrites,
silicon carbides and
Glass coating, boron nitride.
Ceramics, Glass,
Ceramics,
Ceramics, Glass Borosilicate 7.2 Ceramics / glass Metal- or metal oxide
Glass (6)
Glass, Glass lens, based thick-film
Glass Frits, Glass pastes and glass frits
fibers e. g. for cover
conductor track
pastes, via fill pastes,
resistors- and resistor
connections, etc.
Composition of these
glass frits may exceed
80% metal content
Metallic magnets
should be classified in
Metallic Major metal Chemical Symbol, Classification 1x-4x
one of the
Magnets constituent - + [Chemical depending on
classifications 1x-4x
(8) application Symbol] + Magnet composition
that best fits the
composition.

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For permanent
magnets/magnetically
Rare Earth hard materials,
Chemical Symbol,
Alloy Major constituent 4.2 Other special classification 4.2
[Chemical
Magnets - + application metals is usually used (e. g.
Symbol] + Magnet
(8) rare earth based
alloys such as Sm-Co
5)
For ceramic magnets,
the basic substances
[Chemical
have to be given as
Symbol] + Ferrite,
metal oxides.
[Chemical
Ceramic Ceramic Symbol] + Ferrite
Metal oxides should
Magnets Magnets, Ferrite + Magnet, Hard 7.2 Ceramics / glass
only be used when
(8) Magnets ferrite, SrO x
reporting in materials
Fe2O3 Magnet,
where they are still
[Chemical
present after
Symbol]
processing - ex.
magnets.
Metal powders or
metal oxides can also
be used within a
Bonded Polymer Bonded Matrix substance plastic matrix. In this
Powder Magnets, + Filler, Matrix 5.x Classification case, the correct
Magnets Resin Bonded substance + Filler depending on matrix classification for the
(8) Magnets, + Magnet plastic matrix should
be used (see section
1.4.1 - Composite
materials).
This classification
should be used for the
material that serves
as a mechanical base
Ceramic/ Glass or stabilizer and
Substrate
Substrate Core, 7.2 Ceramics / Glass electrical interface
Core (10)
Prepreg and is of a ceramic
composition. See also
sections 3.3.1 and
3.3.2 for additional
detail.

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This classification
should be used for the
material that serves
as a mechanical base
or stabilizer and
Organic Core, electrical interface,
Substrate Prepreg, and is comprised of
5.4.3 Other Duromer
Core (10) EP-GF50, an epoxy or other
Glass filled epoxy duromer, and/or
inorganic filler or
cross-linking material.
See also sections
3.3.1 and 3.3.2 for
additional detail

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4 Examples

4.1 Construction Elements

The numbers shown in the images below correspond with the numbers in the Material column in section
3.5.2 Material Names and Classification.

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4.2 Published material for electronic grade Silicon

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5 Release and Revisions

5.1 Release
The recommendation was first approved and released in month / day / year.

5.2 Revision

Rev. Date Description / Reason Originating Organization / Committee

1 April 2005 Was Issue November 2003 Editorial IMDS SC
changes Hybrids (standard and LTCC),
wire harnesses added
2 Feb 2007 Was Issue April 2005 IMDS SC
Paragraph 1: reworked
Paragraph 4: Example removed, following
paragraphs renumbered
Paragraph 4.3: updated
Paragraph 5: added
Paragraph 6: added
Paragraph 7: removed, following
paragraph renumbered
3 Oct. 2010 Rework of content of the whole document IMDS SC
4 Aug. 2011 Add content specific to new ELV Annex II IMDS SC
with respect to Exemption 10 Lead in
Ceramics
Paragraphs about modules
Annex changes
5 Oct. 2013 Change screenshots due to IMDS IMDS SC
Release 8.0
6 Sept. 2022 Rework of content of the whole document IMDS SC

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