LEC-BTS Datasheet en 15869
LEC-BTS Datasheet en 15869
Features
● Single, dual or quad-core Intel® Atom™ Processor P
E3800 Series System-on-Chip
● Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)
● HDMI and LVDS
● GbE, camera interface
● 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO
● Extreme Rugged™ operating temperature: -40°C to 85°C
Specifications
● Core System ● I/O Interfaces
● CPU ● PCIe
● Intel® Atom ™ E3800 Series, single, dual or quad-core SoC with integrated graphics ● 3x PCIe x1 Gen2
● Atom™ E3845 (4C/1333), 1.91 GHz, Gfx 542/792 MHz (Turbo), 10 W TDP ● USB
● Atom™ E3826 (2C/1066), 1.46 GHz, Gfx 533/667 MHz (Turbo), 7 W TDP ● 1x USB 3.0 + 3x USB 2.0
● Atom™ E3815 (1C/1066), 1.46 GHz, Gfx 400/-MHz, 5 W TDP ● SATA
● 1x SATA 3 Gb/s
● Memory ● SDIO
● Up to 4 GB DDR3L at 1066/1333 MHz, memory down non-ECC ● 1x SDIO (4-bit)
● Camera
● Embedded BIOS ● CSI 4L/1L
● AMI UEFI with CMOS backup in 8 MB SPI BIOS, Fast Boot support ● Serial
● 2x SPI, 2x I2C, 1x I2S, Power Management, 2x UART
● MMC
● Cache ● 1x MMC interface to carrier
● 512 kB to 2 MB L2 cache ● GPIO
● 12x GPIO, 5x used for camera, 7x available
● SEMA Board Controller
Supports: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic
Video
●
●
● Information, Flat Panel Control, I²C Bus Control, GPIO Control, User Flash, Failsafe
● GPU Feature Support
● BIOS (dual BIOS), Watchdog Timer and Fan Control
● 7th generation Intel® graphics core architecture with four execution units, supports two
● independent displays 2D and 3D graphics hardware acceleration Support for DirectX 11.1,
● OGLES 2.0, OGL 3.2
● Video decode HW acceleration for H.264, MPEG2, VC1, VP8 formats
● Audio ● Video encode HW acceleration for H.264, MPEG2 formats
● Chipset
● Intel® HD Audio integrated in SoC ● LVDS
● Single channel 18/24-bit LVDS from DDI0
● Ports
● 1x I²S and 1x HDA for audio codec on carrier ● HDMI/DP++
● HDMI 1.4a from DDI1
● Ethernet
● Intel® MAC/PHY ● Power
● 1x Intel® i210-IT Ethernet controller ● Standard Input
● 3.0 V~5.25 V DC ±5%
● Interface
● 10/100/1000 GbE ● Power States
● C0-C6, S0, S3, S4, S5
● Mechanical and Environmental ● Intelligent Middleware
● Form Factor ● SEMA®
● SMARC Specifications v1.1 ● Local management, control of embedded computer systems Extended EAPI for ● ●
● monitoring, controlling and analytics applications Multiple OS support and across ●
● Dimension ● platforms (x86, ARM)
● SMARC full size module, 82 mm x 80 mm
● Operating Temperature
● Standard: 0°C to +60°C
● Extreme Rugged: -40ºC to +85ºC
● Humidity
● 5-90% RH operating, non-condensing
● 5-95% RH storage (and operating with conformal coating)
● HALT
● Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
● Operation System
● Standard Support
● Linux, VxWorks, Windows 7/8, indows Embedded, Compact 7
LVDS 18/24bit
Single channel LVDS DDI0
RTD2136
DDR3L DDR3L
DDI1 (HDMI) 1066/1333MHz Memory
down
Audio (HDA or I2S)
2/4 GB
ADLINK CONFIDENTIAL
2x I2C (LCD/GP)
SMBus
12x GPIO
(5x reserved for CSI) GPIO INT
PCA9535A
LAN PCIe x1
GbE i210IT
314-pin Golden finger
Bay Trail-I
2x Serial (incl. RTS/CTS) + PCU-UART
SoC
USB2.0 port 0: client or host
3x USB2.0 host
Debug
2x SATA LPC
Connector
for DB40
SDIO x4
Power Management
SPI- SPI
BIOS
1x SPI
Ordering Information
● LEC-BTS4-2G-ER
SMARC Short Size Module with Intel Atom™ E3845,
quad core, 2 GB DDR3L, -40°C to +85°C
● LEC-BTS2-2G-ER
SMARC Short Size Module with Intel® Atom™ E3826,
dual core, 2 GB DDR3L, -40°C to +85°C
● LEC-BTS1-2G-ER
SMARC Short Size Module with Intel Atom™ E3815,
single core, 2 GB DDR3L, -40°C to +85°C
● LEC-BTS4-4G-ER
SMARC Short Size Module with Intel Atom E3845,
quad core, 4 GB DDR3L, -45°C to 85°C
● LEC-BTS20-2G-ER
SMARC Short Size Module with Intel Atom E3805,
dual core, headless, 2 GB DDR3L, -45°C to 85°C
● LEC-BTS21-2G-CT
SMARC Short Size Module with Intel Celeron N2807,
dual core, 2 GB DDR3L, 0°C to 60°C
● LEC-BTS-HS
Heatspreader for LEC-BTS
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Updated Jul. 29, 2016. ©2016 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.