SEM

2 STH
3 AFM

SHAH&ANCHOR
Mahavir Education
Shah Shah& Anchor Kutchhi Enj SpuHeui
Chembur, Mumbai Vapour Depos(tion
Physics Department (A

TOPIC: NANOSCIENCE &NANOTECHNOLOGY

We know all materials are composed of atoms with different sizes. If
we take a
material in which the atoms do not move away from each other and with size in
the range of 1 to 100 nano meters, these materials are called nano materials.

The technology emerged out of this is called

Nanotechnology. Using these highly
so latest technology nano materials can be formed from metals, ceramics
polymers and even from liquids.
N

APPROACHESIN NANOTECHNOLOGY
There are two approaches for synthesis of nano materials and the
fabrication of nano structures.

(1) Bottom up approach:

In this nanomaterials are made by building atom by atom or molecule by
molecule.

(1) Top down approach:

In this a bulk materiàl is broken or reduced in size or pattern. The
techniques developed under this are modified or improved one what we
have in use to fabricate micro-processors, micro-electro-mechanical system.

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IMPORTANT TOOLS IN NANOTECHNOLOGY
Transmission Electron Microscope
The Transmission Electron
Microscope (TEM) is a very powerful tool for
material science. A high energy beam of electrons is shone through a very thin
sample, and the interactions between the electrons and the atoms can be used to
observe features such as the crystal structure and features in the structure like
dislocations and grain boundaries. Chemical analysis can also be performed. TEM
can be used to study the growth of layers, their composition and defects in
semiconductors. High resolution can be used to analyze the quality, shape, size
and density of quantum wells, wires and dots.
TEM operates on the same basic principles as the light microscope but uses
electrons instead of light. Because the wavelength of electrons is much smaller
than that of light, the optimal resolution attainable for TEM images is many orders
of magnitude better than that from a light microscope. Thus, TEMs can reveal the
finest details of internal structure - in some cases as small as individual atoms.

uncicent Boan1
Transmission clectron microscope

TEM
Light source lamp - Electron source Specnen
(electron gun
Condcnser lens.
Condanser lens

Spocimen
Objective lens-
Objective lens
Objective Leus
Objetive lens

Insermediare lens

Specimea
-Projector lens

FluareCCot

l n a g s Planu

Fig 2
Fig 1
I Scanning ElectronMicroscope obtain images of surface
of

mentioned above, SEM is used to of SEM

Unlike TEM studied.
Construction
can be
thickness. Also a thin specimen electron beam
to scan
for an
that makes it possible
includes an arrangement tube.
have in TV picture made to pass
similar to that we and it is
the specimen from electron gun
obtained to focus
electron beam is coil which is used
Here of scanning the
condenser lens.
Next stage is also to scan
surface and
through specimen
beam on a
small spot on
electron tube.
the TV picture
electron beam s c a n s in aspects.
surface like two main
combining
surface of the
formation in
SEM is due to a t o m s on
the
because of have
Image is atoms
electron beam and these
Scattering of specimen
a **** ***** ament
different scattering power.
b ) T o p o g r a p h i c a l

surface.
variations
of the mentioned
Condenee ens

the aspects
Actually,
responsible
for the
also
above are
essential
for
which is
contrast

image formation.

atoms
Boennirg O the scanning of
During scattered
the
electron
beam,
- O b c e lens
by intensities
are
measured

electrons on
displayed
then
d e t e c t o r and
by scattering
is high
If the
o n the
screen.
the point
corresponding

Dotecioe the corresponding

scanning, the
the
particular
point during and for
low scattering, contrast
for a
clear
at a bright
will be develops
required
dark. This
screen

viewing
screen
will be
the
point on
specimen.
resolved by SEM.
the be clearly
image of 50A° size may
small a s
as
Specimen
non-optical
Microscope STM is a
Tunnelling microscope. detect a
LlScanning as a type
of
electron
surface to be imaged
to

considered over a
STM is electrical probe surface.
an and the
that scans
between
the tip and
hence
microscope
flowing electron
density
current
lattice.
weak
electric
regions
of high surface of a
visualize
on the 10-10
scientists
to molecules
of 2 x

allows atoms
and atomic
scale
STM individual
at an chemical
surfaces
of trigger
position conductive
atoms,
infer the images
of individual

obtain manipulate
can to
The STM can be used
nm
and also 3
m or 0.2
H
Piezoelectic tube
with electrodes

CD
VAtomic Force MicrOscope
most versatile and powerful
Atomic Force Microscopy (AFM) is arguably the versatile because
for studying samples at nano scale. It is
microscopy technology three-dimensional topography
microscope can not only image in
an atomic force needs of to the
measurements
surface
but it also provides various types of at
because an AFM can generate images
Scientists and engineers. It is powerful information, with
scale resolution height
resolution with angstrom preparation.
atomic
sample over a
minimum
cantilever with a very sharp tip to scan
An AFM uses a attractive force
1) Surface Sensing
-

close-range,
the surface, the
towards the
As the tip approaches to deflect
sample surface. cause the
cantilever
surface and the tip
such that
between the even closer
to the surface,
cantilever is brought over and
causes
as the force takes
surface. However, repulsive
with it, increasingly
contact
makes
the tip from the
surface.
deflect away
cantilever to deflections
the cantilever
to detect
beam is used off the flat top
Method - A laser incident beam
Detection an
2) By reflecting in the
slight changes
surface.
from the will cause
towards or away deflection can be
cantilever diode (PSPD)
cantilever, any photo
of the beam. A
position-sensitive

over a raised
surface
reflected
of the AFM tip passes
change in
Thus, if an
direction
subsequent
these changes. the
track deflection (and
used to cantilever
resulting PSPD.
feature, the recorded by the
beam) is the
direction of reflected
surface by scanning
the topography ofa sample lowered
features on
the
An AFM images The raised and monitored by
3) Imaging a region of
interest.
cantilever,
which is
cantilever
over
deflection of the
influence the
surface Detector and
sample feedback loop to Fcedback
a
the PSPD. By using Electronlcs

above
of the tip
Control the height Fhotodiode
constant
Laser
maintaining
surface-thus

The
can generate
AFM
position-the
Laser

map
of the Cantilever & TIp
topographic
Accurate
Sample Surface
Surface features.
PZT SC3nCI
METHODSTOSYNTHESIZE NANOMATERIALS
Ball Milling Top down
ball mill is subjected to high
It is a powder mixture placed in the
process where a
used system
ball mill is most frequently
energy collision from the balls. Planetary is In required.
amount of powder
for mechanical alloying sínce only a very small about its
a ball mill consists of a hollow cylindrical shell rotating
Simple language,
axis.
small angle to the
at a
either horizontally or
The axis of the shell may be media and made
filled with balls which makes grinding
horizontal. It is partially
stainless steel or ceramic.
up of steel,
resistant material. When
abrasion
The inner surface of the
shell is made up of an them from
and lífts the balls up and drops
the shell rotates
continuously operated, of the particles
inside.
which causes the grinding
near the top of
the shell

In) Sputtering a T solid target material

whereby particles
are ejected from a

Sputtering is a process necessary to

have kinetic
of target by energetic
particles. It is
due to bombarding conventional
than
thermal energles.
much greater
energy of incoming particles
Substrate and film growth

Sputterin
Gas

Sputtering Target

is shown in given
of thin film deposition using sputtering
A typical arrangement between the
is maintained
large potential difference
figure. A sufficiently introduced the enclosure at low
into
is
substrate and the target. Argon gas
pressure which can
be varied.
difference. The positive
due to the large potential
The argon atoms get ionized its atoms. The atoms
with a large velocity and dislodge
argon ions hit the target
on it.
move towards the
substrate and get deposited

6
The thickness of the film can be controlled by varying the argon gas pressure and
the time for which the sputtering process is carried out. Thickness as small as a
fraction of a nanometre, i.e., atomic
monolayers, have been successfully depOsited
using this method.
Bst
tom
u4

LLI]Vapour Deposition
The bulk material kept in a crucible is evaporated and the particles formed are
blown away by using an inert gas towards the liquid nitrogen cooled cylinder
called cold finger. The particles get condensed and are collected on the cold finger,
is used
which scraped off and fall into the funnel. A piston-anvil arrangement
are
forms. The size of particles is
to compact the nano particle powder in the pellet
and the cold finger and
controlled by changing the distance between the crucibles
Cold tning e
by changing the inert gas pressure.
-Scxapo
Vucuum
chombek
CHuchle
E - 6 a s inet valve
Funnel
o ttom UP Vac uum
IV SOL-GelTechnique ston unvil amangement pellets
powder is obtained using this technique.
Nano particles and nano

Precursors and
the hydrolysis Of liquid
technique is based
on
In general, sol-gel
formation of colloidal solutions.
cavitation is often used; in which
Out of few more hydro dynamic
processes, bubbles inside
creation and release of gas
can be generated through
nanoparticles
the sol get solution.
and thoroughly mixed by
solution is taken in a drying chamber
Here, the sol get and further exposing it to
enormous pressure, high temperature
applying
cavitational disturbances.

the sol gel. These bubbles will

bubbles in
creates hydrodynamic
This process form nano particles.
and then it quenches to
undergo nucleation, growth
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 of Engineering Physics 1131
Nunotech.ology
in
e aligned in a single method, a container is filled with stainless steel balls of a few millimeters
In this
er, nanoclustêrs of crushed is added in the form ofa powder of about
ver, nanocust rs or diameter (Fig. 39.25). The material to be
cluster the magnetic 50 um diameter grain size.
S, and can force all Atter flling the container with
axis of the cluster liquid pitrogen, a rotating Gas inlet Gas outlet

ized.As cluster size shaft grinds the material. Fhe

behaviour. In somne
grindingperiads are within the
Milled powder
rangeof ninutes to some 100
hUurs This process is simple)
However, the difficulty in this Vessel
technique is that we cannot be
sure that all the particles are
broken dqwn to the required Milling balls
particle size Further, during
mechanical attrition, contami-
u l u l u u l u l u i l u l d

nation by the milling tools (Fe)

60 70 80 90
50 and atmosphere (trace elements
Ball Milling
40
Fig. 39.25
nber of Atoms
of O, N2, in rare gasès) can be
1e magnetic moman
a problem. The use of tungsten carbide component and inert atnosphere and /or high vacuum
nanoparticles versus
processes has reduced impurity levels to within acceptable limits. Common drawbacks
ms in the particle.
inchude low surface, highly poly dispese size distribution, and partially amorphous state
of the powder.The main advantage of this top-dovn approach is ligh production rates of
ystalline grains; the
f defects when the nanopowders
O

(dissolva) (Dehydratlon (Rapid o

oC Reactlon) Drylng)
O
SOL GEL Aerogel
Precursor
Spinning
ipping
SOurrgfaacntiacnt
60
(nin)

g's modulus
80

(E) of conventional
100

(E) of
Suspension
Xerogel
nction of graln siza.

nonly used methods

p-down approach
irums by hard _teel
to nanometer range Thin Flm Coatlng
Powder Dense Ceramic
i catalytic nanopar
Flg. 39.26: Schematic
representation of sol-gel process of synthesis of
nanomaterials