Semiconductor stgb10h60df
Semiconductor stgb10h60df
Datasheet
TAB Features
• High speed switching
3
1
D2 PAK
• Tight parameters distribution
3
1
2
• Safe paralleling
TO-220FP
TAB
• Low thermal resistance
• Short-circuit rated
1
2
3
• Ultrafast soft recovery antiparallel diode
TO-220
Description
E(3)
NG1E3C2T
These devices are IGBTs developed using an advanced proprietary trench gate field-
stop structure. These devices are part of the H series of IGBTs, which represents
an optimum compromise between conduction and switching losses to maximize the
efficiency of high switching frequency converters. Furthermore, a slightly positive
VCE(sat) temperature coefficient and very tight parameter distribution result in safer
paralleling operation.
STGB10H60DF
STGF10H60DF
STGP10H60DF
1 Electrical ratings
Value
Symbol Parameter Unit
D2PAK, TO-220 TO-220FP
Value
Symbol Parameter Unit
D2PAK, TO-220 TO-220FP
2 Electrical characteristics
Table 3. Static
Collector-emitter
V(BR)CES VGE = 0 V, IC = 2 mA 600 V
breakdown voltage
VGE = 15 V, IC= 10 A 1.50 1.95
Collector-emitter
VCE(sat) VGE = 15 V, IC = 10 A, TJ = 125 °C 1.65 V
saturation voltage
VGE = 15 V, IC = 10 A, TJ = 175 °C 1.70
Gate threshold
VGE(th) VCE = VGE, IC = 250 μA 5 6 7 V
voltage
Collector cut-off
ICES VCE = 600 V, VGE = 0 V 25 μA
current
Gate-emitter leakage
IGES VGE = ±20 V, VCE = 0 V ±250 nA
current
Table 4. Dynamic
Turn-on switching
Eon (1) VCE = 400 V, IC = 10 A, RG = 10 Ω, 83
energy
Turn-off switching VGE = 15 V
Eoff (2) 140
energy (see Figure 34. Test circuit for inductive load
switching)
Ets Total switching energy 223
- - μJ
Turn-on switching
Eon(1) VCE = 400 V, IC = 10 A, RG = 10 Ω, 148
energy
Turn-off switching VGE = 15 V, TJ = 175 °C
Eoff (2) 214
energy (see Figure 34. Test circuit for inductive load
switching)
Ets Total switching energy 362
IF = 10 A 1.7 2.2
VF Forward on-voltage - V
IF = 10 A, TJ = 175 °C 1.3
Reverse recovery
trr 107 ns
time
Vr = 60 V; IF = 10 A, diF/dt = 100 A / μs
Reverse recovery
Qrr (see Figure 37. Diode reverse recovery 120 nC
charge
waveform)
Reverse recovery
Irrm 2.24 A
current
-
Reverse recovery
trr 161 ns
time Vr = 60 V; IF = 10 A, diF/dt = 100 A / μs
Reverse recovery TJ = 175 °C
Qrr 362 nC
charge
(see Figure 37. Diode reverse recovery
Reverse recovery waveform)
Irrm 4.5 A
current
Figure 1. Power dissipation vs case temperature for Figure 2. Collector current vs case temperature for D2PAK
D2PAK and TO-220 and TO-220
GIP D230420191104MT
Ptot GIPD281020131339FSR IC
(W) (A)
140
20
120
100 15
80
60 10
40
VGE≥ 15V, T J≤ 175 °C 5 VGE ≥ 15V, TJ ≤ 175 °C
20
0
0 25 50 75 100 125 150 175 TC(°C) 0
0 25 50 75 100 125 150 175 TC (°C)
Figure 3. Power dissipation vs case temperature for Figure 4. Collector current vs case temperature for
TO-220FP TO-220FP
GIPD281020131351FSR GIPD281020131401FSR
IC
(A)
15
10
5
VGE ≥ 15V, T J ≤ 175 °C
0
0 50 100 150 TC(°C)
Figure 5. Output characteristics (TJ = 25°C) Figure 6. Output characteristics (TJ = 175°C)
GIPD281020131405FSR GIPD281020131411FSR
IC IC
(A) (A)
VGE=15V 11V VGE=15V 11V
13V
30 30
9V 9V
20 20
10 10
7V
0 0
0 1 2 3 4 VCE(V) 0 1 2 3 4 VCE(V)
IC = 20A (V)
TJ = 175°C
GE = 15V 2.2
VGE = 15 V
2.0
TJ = 25°C
1.8
1.8 IC = 10A
1.6
1.6
1.4 TJ = -40°C
1.4 IC 1.2
1.2
1.0
0.8
-50 TJ (°C 0 4 8 12 16 20 IC (A)
Figure 9. Collector current vs switching frequency for Figure 10. Collector current vs switching frequency for
D2PAK and TO-220 TO-220FP
IC GADG130620191139CCS IC GADG130620191023CCS
(A) (A)
TC = 80°C
40 16
TC = 80°C
30 12
TC = 100°C TC = 100°C
20 8
10 4
Rectangular current shape Rectangular current shape
(duty cycle = 0.5, VCC = 400 V, (duty cycle = 0.5, VCC = 400 V,
RG = 4.7Ω, VGE = 0/15 V , TJ = 175 °C) RG = 4.7Ω, VGE = 0/15 V , TJ = 175 °C)
0 0
10 0 10 1 10 2 f (kHz) 10 0 10 1 10 2 f (kHz)
10
10 10 µs
10 µs
100 µs
100 µs
1
1 Tj≤175 °C, Tc= 25°C 1 ms
Tj≤175 °C, Tc= 25°C 1 ms
VGE = 15 V
VGE = 15 V
single pulse
single pulse
0.1
0.1 1 10 100 VCE(V)
1 10 100 VCE(V)
IC GIPD281020131513FSR VF GADG130620191024DVF
(A) (V) TJ = 40 °C
35 VCE=5V
2.0
30
TJ = 25 °C
25 1.6
20
TJ = 175 °C
15 1.2
10 TJ=175°C
TJ=25°C 0.8
5
TJ=-40°C
0 0.4
6 7 8 9 10 VGE(V)
0 4 8 12 16 20 IF (A)
Figure 15. Normalized VGE(th) vs junction temperature Figure 16. Normalized V(BR)CES vs junction temperature
1.00
0.8
0.7 0.95
0.6 0.90
-50 0 50 100 150 TJ(°C) -50 0 50 100 150 TJ (°C)
Figure 17. Capacitance variation Figure 18. Gate charge vs gate-emitter voltage
C GADG130620191026CVR
VGE GIPD281020131606FSR
(pF) (V)
16 IC= 10A
10 3 CIES
IGE= 1mA
VCC= 480V
12
10 2
8
f = 1MHZ COES
10 1
CRES 4
0
10 0 0 20 40 60 Qg (nC)
10 -1 10 0 10 1 10 2 VCE (V)
Figure 19. Switching energy vs collector current Figure 20. Switching energy vs gate resistance
E GADG130620191055SLC
E GIPD281020131618FSR
180 180
120 EON
140
60
0 100
0 4 8 12 16 20 IC (A) 0 10 20 30 40 RG(Ω)
EOFF
200 EOFF
150
150
EON EON
100
100
50 50
0
0 200 250 300 350 400 450 VCE(V)
-50 0 50 100 150 TJ(°C)
Figure 23. Short circuit time and current vs VGE Figure 24. Switching times vs collector current
GIPD281020131641FSR
GIPD281020131634FSR t
tsc (µs) ISC(A) (ns)
VCC= 360V, RG= 10W TJ= 175°C, VGE= 15V,
ISC
RG= 10Ω, VCC= 400V
14
200
tSC
12 tf
t doff
10 150 100
8 tr
100
6 t don
4 50
10 11 12 13 14 VGE(V) 10
0 4 8 12 16 IC(A)
Figure 25. Switching times vs gate resistance Figure 26. Reverse recovery current vs diode current
slope
GIPD281020131655FSR GIPD281020131713FSR
t Irm
(ns) (A)
TJ= 175°C, VGE= 15V, IF = 10A, Vr = 400V
IC= 10A, VCC= 400V 20
t doff
tf TJ =175°C
100 16
12
t don tr
10 8
TJ =25°C
1 0
0 10 20 30 40 RG(Ω) 0 200 400 600 800 di/dt(A/ µs)
120 400
TJ =175°C 300
80
TJ =25°C
200
40
100
TJ =25°C
0
0 200 400 600 800 di/dt(A/ µs) 0
0 200 400 600 800 di/dt(A/ µs)
TJ =25°C
60 0.01 Zth = k*RthJC
δ = tp/t
40
Single pulse
tp
20 -2 t
0 200 400 600 800 di/dt(A/ µs) 10 -5 -4 -2 -1
tp (s)
-3
10 10 10 10 10
10-1
Zth
Zth= k*R
k R thj-c
thj-C
10-2 δδ==tptp/ Ƭ
/Ƭ
Zth = k*RthJC
δ = tp/t
tpp
ƬƬ
tp
t
10-3
10-5 10-4 10-3 10-2 10-1 100 tp (s)
10-1
10-2
10-3
10-4 10-3 10-2 10-1 100 tp (s)
3 Test circuits
Figure 34. Test circuit for inductive load switching Figure 35. Gate charge test circuit
A A
C
L=100 µH k
G k
E B
B
C 3.3 1000 VCC
µF µF
k
G D.U.T
k
+ RG E
k
-
k
AM01504v1 AM01505v1
Figure 36. Switching waveform Figure 37. Diode reverse recovery waveform
90%
VG 10%
90%
VCE 10%
tr(Voff)
tcross
25
90%
IC td(off)
10%
td(on) tf
tr(Ion)
ton toff
AM01506v1
4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
0079457_A2_26
mm
Dim.
Min. Typ. Max.
A 4.40 4.60
A1 0.03 0.23
b 0.70 0.93
b2 1.14 1.70
c 0.45 0.60
c2 1.23 1.36
D 8.95 9.35
D1 7.50 7.75 8.00
D2 1.10 1.30 1.50
E 10.00 10.40
E1 8.70 8.90 9.10
E2 7.30 7.50 7.70
e 2.54
e1 4.88 5.28
H 15.00 15.85
J1 2.49 2.69
L 2.29 2.79
L1 1.27 1.40
L2 1.30 1.75
R 0.40
V2 0° 8°
0079457_Rev26_footprint
40mm min.
access hole
at slot location
B
D C
N
A
AM06038v1
Tape Reel
mm mm
Dim. Dim.
Min. Max. Min. Max.
7012510_Rev_13_B
mm
Dim.
Min. Typ. Max.
A 4.40 4.60
B 2.50 2.70
D 2.50 2.75
E 0.45 0.70
F 0.75 1.00
F1 1.15 1.70
F2 1.15 1.70
G 4.95 5.20
G1 2.40 2.70
H 10.00 10.40
L2 16.00
L3 28.60 30.60
L4 9.80 10.60
L5 2.90 3.60
L6 15.90 16.40
L7 9.00 9.30
Dia 3.00 3.20
0015988_typeA_Rev_23
mm
Dim.
Min. Typ. Max.
A 4.40 4.60
b 0.61 0.88
b1 1.14 1.55
c 0.48 0.70
D 15.25 15.75
D1 1.27
E 10.00 10.40
e 2.40 2.70
e1 4.95 5.15
F 1.23 1.32
H1 6.20 6.60
J1 2.40 2.72
L 13.00 14.00
L1 3.50 3.93
L20 16.40
L30 28.90
øP 3.75 3.85
Q 2.65 2.95
Slug flatness 0.03 0.10
5 Ordering information
Revision history
Modified Figure 30. Normalized transient thermal impedance for TO-220 and D2PAK (IGBT)
and Figure 32. Normalized transient thermal impedance for TO-220 and D2PAK (diode).
21-Jan-2022 5 Added Figure 31. Normalized transient thermal impedance for TO-220FP (IGBT) and
Figure 33. Normalized transient thermal impedance for TO-220FP (diode).
Minor text changes.
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6