QuickSpecs HP Elite 800 G2 Series Business Desktop

Overview

HP EliteDesk 800 G2 Desktop Mini Business PC

1. Headphone Connector 5. USB 3.0 port

2. Microphone or Headphone Connector 6. HDD indicator
(software selectable, default mode is microphone)
3. USB Type-C™ port 7. Dual-State Power Button
4. USB 3.0 -Charging

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QuickSpecs HP Elite 800 G2 Series Business Desktop

Overview

HP EliteDesk 800 G2 Desktop Mini Business PC

1. Optional External Antenna Connector 8. VGA Monitor Connector

2. Thumbscrew 9. Choice of DisplayPort (shown), HDMI, or Serial
Connector
3. Padlock Loop 10. (2) USB 3.0 Ports (blue)
4. Ultra-slim cable lock 11. (2) USB 3.0 ports (blue), allows for wake from
S4/S5 with keyboard/mouse when connected and
enabled in BIOS.
5. Optional External Antenna Connector 12. RJ-45 Network Connector
6. Antenna Cover 13. Power Connector
7. DisplayPort Monitor Connector

Not Shown

Slots (1) internal M.2 PCIe x1 connector for optional wireless NIC
(1) internal M.2 PCIe x4 connector for optional Turbo Drive SSD drive
Bays (1) 2.5” internal HDD storage drive bay

VESA Support for VESA 100 mounting system on bottom of PC chassis

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QuickSpecs HP Elite 800 G2 Series Business Desktop

Overview

HP EliteDesk 800 G2 Small Form Factor Business PC

1. Slim Optical Drive (optional) 6. Headphone Connector

2. USB 2.0 Fast Charging Port (black) 7. Dual-State Power Button
3. USB 2.0 Port (black) 8. Hard Drive Activity Light
4. (2) USB 3.0 Ports (blue) 9. SD 4 Card Reader (optional)
5. Microphone/Headphone Connector

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Overview

HP EliteDesk 800 G2 Small Form Factor Business PC

1. PS/2 Mouse Connector (green) 7. PS/2 Keyboard Connector (purple)

2. Serial Connector 8. (2) DisplayPort Monitor Connectors
3. RJ-45 Network Connector 9. VGA Monitor Connector
4. (2) USB 3.0 Ports with Wake from S4/S5 feature (blue) 10. (4) USB 3.0 Ports (blue)
5. Line-In Audio Connector (blue) 11. Line-Out Connector for powered audio devices (green)
6. Power Cord Connector
NOTE: An optional second serial port and an optional parallel port are available from HP.
Not Shown
Slots (2) PCI Express x16 graphics connectors; one wired as a x4
(2) PCI Express x1 accessory connectors
Bays (1) 2.5” internal storage drive bay
(2) 3.5” internal storage drive bay

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QuickSpecs HP Elite 800 G2 Series Business Desktop

Overview

HP EliteDesk 800 G2 Tower Business PC

1. Hard Drive Activity Light 1. Power Cord Connector

2. 5.25-inch Half-Height Drive Bay (behind bezel) 2. PS/2 Keyboard Connector (purple)
3. SD 4 Card Reader (optional) 3. (2) DisplayPort Monitor Connectors
4. USB 2.0 Port (black) 4. VGA Monitor Connector
5. Microphone/Headphone Connector 5. (4) USB 3.0 Ports (blue)
6. Dual-State Power Button 6. Line-Out Connector for powered audio devices
7. Slim Optical Drive (optional) 7. PS/2 Mouse Connector (green)
8. USB 2.0 Fast Charging (powered) Port (black) 8. Serial Connector
9. (2) USB 3.0 Ports (blue) 9. RJ-45 Network Connector
10. Headphone Connector 10. (2) USB 3.0 Ports with Wake from S4/S5 feature
(blue)
11. Line-In Audio Connector (blue)

NOTE: An optional second serial port and an optional parallel port are available from HP.

Not Shown
Slots (2) PCI Express x16 graphics connectors; one wired as a x4
(2) PCI Express x1 accessory connectors
(1) PCI (optional)
Bays (1) 2.5” internal storage drive bay
(2) 3.5” internal storage drive bays

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QuickSpecs HP Elite 800 G2 Series Business Desktop

Overview

HP EliteOne 800 G2 All-in-One Business PC (23.0” Touch and Non-Touch)

1. Dual microphone array (with webcam) 4. Webcam (standard but deselectable)

2. Webcam activity LED (with webcam) 5. 23” diagonal 16:9 widescreen LED-backlit LCD
display (available with or without projected
capacitive touch panel)
3. Webcam privacy shutter slide switch (with optional webcam) 6. High-performance stereo speakers (standard but
deselectable)

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Overview

HP EliteOne 800 G2 All-in-One Business PC

1. Power button 7. Microphone/Headphone/Line–In jack

2. Hard disk drive activity LED 8. HP SD card reader (optional)
3. USB 3.0 port, fast-charging 9. Optical disc drive eject button (with optional optical
disk drive)
4. USB 3.0 port 10. Optical disc drive activity LED (with optional optical disk
drive)
5. USB Type-C™ port, fast-charging 11. Tray-load optical disc drive (optional)
6. Headphone jack 12. Fingerprint reader (touch model only)

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QuickSpecs HP Elite 800 G2 Series Business Desktops

Standard Features and Configurable Components

HP EliteOne 800 G2 All-in-One Business PC

REAR/PORTS (BEHIND SECURITY COVER)

1. Power cable retention loop 7. DisplayPort connector

2. Port cover security screw hole 8. (2) USB 3.0 ports
3. Serial port (optional) 9. (2) USB 3.0 ports with wake-up functionality
4. PS/2 keyboard connector (optional) 10. RJ-45 Gigabit Ethernet port
5. PS/2 mouse connector (optional) 11. Stereo audio line out
6. Power connector

Not Shown
Slots (1) internal M.2 PCIe x1 connector for optional wireless NIC
(1) internal M.2 PCIe x4 connector for optional Turbo Drive SSD
Bays (2) 2.5” internal storage drive bay
VESA Support for VESA 100 mounting system

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Standard Features and Configurable Components

At A Glance
1- DisplayPort multi-stream monitors ‘daisy-chained’ together
 Choice of four form factors: Desktop Mini, Small Form Factor, Tower and All-in-One
 Windows 10, Windows 8.1, Windows 7, FreeDOS 2.0
 UEFI BIOS developed and engineered by HP for better security, manageability and software image stability
 Choice of four form factors: Desktop Mini, Small Form Factor, Tower and All-in-One (touch/non touch)
 Intel® Q170 chipset supporting Intel 6th generation Core™ processors, featuring integrated Intel HD Graphics and Intel®
vProTM Technology (available with select processors)
 Processor support up to 65W on all form factors
 Intel® HD graphics or optional discrete graphics (except desktop mini)
 Intel® Ethernet Connection I219LM GbE LOM integrated network connection
 DDR4 Synchronous Dynamic Random Access Memory (SDRAM)
 Multi-independent monitor support via VGA (TWR/SFF/DM only), HDMI (DM only) and digital DisplayPort video interfaces
with multi-stream (Dual DisplayPort connectors on TWR/SFF/DM only); AiO supports multi-stream (up to two external
displays) via DisplayPort1
 DTS Studio Sound™ Standard on the Desktop Mini, Small Form Factor, Tower2
 Audio by Bang and Olufsen utilizing HP Clear Sound Amp on the All-in-One
 High efficiency energy saving power supply options
 AiO, SFF and TWR models can be configured with multiple data drives in a RAID array
 ENERGY STAR® certified. EPEAT® Gold registered where applicable/supported. See www.epeat.net for registration status
by country.
 CCC, CECP and SEPA Certified
 Optimized for Skype for Business
 TCO AiO and TCO Edge
 Low halogen 3
 Arsenic-free
 Protected by HP Services, including limited warranties up to 3-3-3 (terms and conditions vary by country; certain
restrictions and exclusions apply); Care Packs available with up to 5 years Next Business Day Onsite Hardware Support
 Lengthy purchase lifecycles and image stability

NOTE: See important legal disclosures for all listed specs in their respective features sections.
1 DisplayPort multi-stream monitors ‘daisy-chained’ together
2 For DTS patents, see http://patents.dts.com. Manufactured under license from DTS Licensing Limited. DTS, the Symbol, & DTS and the Symbol
together are registered trademarks, and DTS Studio Sound is a trademark of DTS, Inc. © DTS, Inc. All Rights Reserved.
3 External power supplies, power cords, cables and peripherals are not Low Halogen. Service parts obtained after purchase may not be Low Halogen.

CHIPSET
DM SFF TWR AiO
Intel® Q170 PCH-H vPro™ X X X X

PROCESSORS
Intel® 6th Generation Core™ i7 Processors DM SFF TWR AiO
Intel® Core™ i7-6700 Processor X X X X
65W (65W model
Up to 4.0 GHz Max. Turbo Frequency (3.4 GHz base only)
frequency)
8 MB cache, 4 cores, 8 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

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Standard Features and Configurable Components

Supports Intel® vProTM Technology and Intel® Stable Image
Platform Program (SIPP)

Intel® Core™ i7-6700T Processor X

35W (35W model
Up to 3.6 GHz Max. Turbo Frequency (2.8 GHz base only)
frequency)
8 MB cache, 4 cores, 8 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate
Supports Intel® vProTM Technology and Intel® Stable Image
Platform Program (SIPP)

Intel® 6th Generation Core™ i5 Processors DM SFF TWR AiO

Intel® Core™ i5-6600 Processor X X X X
65W (65W model
Up to 3.9 GHz Max. Turbo Frequency (3.3 GHz base only)
frequency)
6 MB cache, 4 cores, 4 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate
Supports Intel® vProTM Technology and Intel® Stable Image
Platform Program (SIPP)

Intel® Core™ i5-6500 Processor X X X X

65W (65W model
Up to 3.6 GHz Max. Turbo Frequency (3.2 GHz base only)
frequency)
6 MB cache, 4 cores, 4 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate
Supports Intel® vProTM Technology and Intel® Stable Image
Platform Program (SIPP)

Intel® Core™ i5-6600T Processor X

35W (35W model
Up to 3.5 GHz Max. Turbo Frequency (2.7 GHz base only)
frequency)
6 MB cache, 4 cores, 4 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate
Supports Intel® vProTM Technology and Intel® Stable Image
Platform Program (SIPP)

Intel® Core™ i5-6500T Processor X

35W (35W model
Up to 3.1 GHz Max. Turbo Frequency (2.5 GHz base only)
frequency)
6 MB cache, 4 cores, 4 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

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Standard Features and Configurable Components

Supports Intel® vProTM Technology and Intel® Stable Image
Platform Program (SIPP)

Intel® 6th Generation Core™ i3 Processors

(Planned to be available November, 2015) DM SFF TWR AiO
Intel® Core™ i3-6320 Processor X X X X
51W (65W model
3.9 GHz base frequency only)
4 MB cache, 2 cores, 4 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

Intel® Core™ i3-6300 Processor X X X X

51W (65W model
3.8 GHz base frequency only)
4 MB cache, 2 cores, 4 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

Intel® Core™ i3-6100 Processor X X X X

51W (65W model
3.7 GHz base frequency only)
3 MB cache, 2 cores, 4 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

Intel® Core™ i3-6300T Processor X

35W (35W model
3.3 GHz base frequency only)
4 MB cache, 2 cores, 4 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

Intel® Core™ i3-6100T Processor X

35W (35W model
3.2 GHz base frequency only)
3 MB cache, 2 cores, 4 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

Intel® 6th Generation Pentium® Processors

(Planned to be available November, 2015) DM SFF TWR AiO
Intel® Pentium® G4520 Processor X X X X
51W (65W model
Up to 3.6 GHz Base Frequency only)
3 MB cache, 2 cores, 2 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

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Standard Features and Configurable Components

Intel® Pentium® G4500 Processor X X X X
51W (65W model
Up to 3.5 GHz Base Frequency only)
3 MB cache, 2 cores, 2 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

Intel® Pentium® G4400 Processor X X XX X X X X

51W/54W** (65W model (65W
Up to 3.3 GHz Base Frequency only) model
3 MB cache, 2 cores, 2 threads only)
Intel® HD Graphics 510
Supports DDR4 memory up to 2133 MT/s data rate

Intel® Pentium® G4500T Processor X

35W (35W model
Up to 3.0 GHz Base Frequency only)
3 MB cache, 2 cores, 2 threads
Intel® HD Graphics 530
Supports DDR4 memory up to 2133 MT/s data rate

Intel® Pentium® G4400T Processor X

35W (35W model
Up to 2.9 GHz Base Frequency only)
3 MB cache, 2 cores, 2 threads
Intel® HD Graphics 510
Supports DDR4 memory up to 2133 MT/s data rate
*Note: Multi-Core is designed to improve performance of certain software products. Not all customers or software
applications will necessarily benefit from use of this technology. 64-bit computing system required. Performance and clock
frequency will vary depending on application workload and your hardware and software configurations. Intel’s numbering is
not a measurement of higher performance.
** Intel® Pentium® G4400 has a source die of 2+2 and 4+2. The 2+2 will run at 51W, while the 4+2 fused-down version will
run at 54W.
GRAPHICS
System Integrated Graphics DM SFF TWR AiO
Intel® HD Graphics on all models (integrated on X X X X
processor)

Optional Discrete Graphics Solutions DM SFF TWR AiO

AMD Radeon™ R9 350 2GB DH PCIe x16 X
AMD Radeon™ R9 360 2GB GDDR5 x16 X
AMD Radeon R5 320 1GB PCIe x16 Card (China only) X
NVIDIA GeForce GT 730 2GB PCIe x8 X X
NVIDIA GeForce GT 720 2GB PCIe x16 (China only) X
NVIDIA Quadro NVS 310 1GB PCIe x16 X X
NVIDIA GeForce GTX 960 2GB PCIe x16 X

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Standard Features and Configurable Components

ADAPTERS AND CABLES DM SFF TWR AiO

HP DisplayPort Cable X X X X
HP DisplayPort Cable 2nd X X X
HP DisplayPort to DVI-D Adapter X X X X
HP DisplayPort to DVI-D Adapter 2nd X X X
HP DisplayPort to HDMI 4K Adapter X X X X
HP DisplayPort to HDMI 4K Adapter 2nd X X X
HP DisplayPort to VGA Adapter X X X X
HP DisplayPort to VGA Adapter 2nd X X X
HP USB-C™ to USB 3.0 X X X X
HP USB to Serial Port Adapter X
HP PCI Expansion Slot X

STORAGE*, **
2.5 inch 5.4k RPM Hard Disk Drives DM** SFF TWR AiO
2TB SATA HDD X
2TB SATA HDD 2nd X

2.5 inch 7.2k RPM Hard Disk Drives DM** SFF TWR AiO
1TB SATA (Planned to be available 12/07/15) X X X X
1TB SATA 2nd (Planned to be available 12/07/15) X X X X
1TB 7200 RPM SATA 6G 2.5 HDD X X X X
500GB SATA X X X X
500GB SATA 2nd X X X X

3.5" SATA 7.2k RPM Hard Disk Drives DM SFF TWR AiO
2TB SATA X X
2TB SATA 2nd X X
1TB SATA X X
1TB SATA 2nd X X
500GB SATA X X
500GB SATA 2nd X X

2.5 inch Solid State Hybrid Drives (SSHD) DM** SFF TWR AiO
1TB SATA 6G 2.5 8G SSHD X X X X
1TB SATA 6G 2.5 8G 2nd SSHD X X X X
500GB SATA 6G 2.5 8G SSHD X X X X
500GB SATA 6G 2.5 8G SSHD 2nd X X X X

3.5 inch Solid State Hybrid Drives (SSHD) DM SFF TWR AiO

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Standard Features and Configurable Components

1TB 7200 RPM SATA 8GB X X

2.5 inch Solid State Drives (SSD) DM** SFF TWR AiO
512GB SATA 3D SSD X X X X
512GB SATA 2nd 3D SSD X X X X
256GB SATA SSD X X X X
256GB SATA SSD 2nd X X X X
256GB SATA 3D SSD X X X X
256GB SATA 3D SSD 2nd X X X X
180GB SATA (Intel® Pro 2500) X X X X
180GB SATA (Intel® Pro 2500) 2nd X X X X
128GB SATA SSD X X X X
128GB SATA SSD 2nd X X X X
128GB SATA 3D SSD X X X X
128GB SATA 3D SSD 2nd X X X X
120GB SATA SSD (Intel® Pro 2500) X X X X
120GB SATA SSD (Intel® Pro 2500) 2nd X X X X

2.5 inch Self-encrypting Solid State Drives (SED) DM** SFF TWR AiO
1TB SATA 6G 2.5 Opal 2 SED SSD (Planned to be X X X X
available 12/07/15)
256GB SATA Opal2 SED SSD X X X X
256GB SATA Opal2 SED SSD 2nd X X X X
180GB SATA Opal2 SED SSD (Intel® Pro 2500) X X X X
180GB SATA Opal2 SED SSD (Intel® Pro 2500) 2nd X X X X
128GB SATA Opal2 SED SSD X X X X
128GB SATA Opal2 SED SSD 2nd X X X X
120GB SATA Opal2 SED SSD (Intel® Pro 2500) X X X X
120GB SATA Opal2 SED SSD (Intel® Pro 2500) 2nd X X X X
500GB SATA Opal2 SED SSD X X
500GB SATA Opal 2 SED SSD 2nd X X
1TB SATA 6G Opal2 SED SSD X X
1TB SATA 6G Opal2 SED SSD 2nd X X
512GB SATA 6G Opal2 SED SSD X X
512GB SATA 6G Opal2 SED SSD 2nd X X

*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up
to 16 GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

**NOTE: Desktop Mini second HDD only available when the first storage drive is an M2 drive.

PCIe Cards DM SFF TWR AiO

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Standard Features and Configurable Components

HP 512GB Turbo Drive G2 SSD-PCIe Card X X
HP 256GB Turbo Drive SSD-PCIe Card X X
HP 256GB Turbo Drive G2 SSD-PCIe Card X X
HP 256GB Turbo Drive SSD - M.2 PCIe Card X X
HP 256GB Turbo Drive G2 SSD- M.2 PCIe Card X X
HP 128GB Turbo Drive SSD-PCIe Card X X
HP 128GB Turbo Drive G2 SSD-PCIe Card X X
HP 128GB Turbo Drive SSD - M.2 PCIe Card X X
HP 128GB Turbo Drive G2 SSD- M.2 PCIe Card X X

Optical Disc Drives DM SFF TWR AiO

HP 9.5mm Slim Desktop DVD-ROM ODD Drive X X
HP 9.5mm Slim Desktop BDXL Blu-Ray Drive X X
HP 9.5mm Slim Desktop SuperMulti DVDRW Drive X X
HP 9.5mm Slim 800 G2 AIO DVD-ROM Drive X
HP 9.5mm Slim 800 G2 AIO SuperMulti DVD Drive X
HP 9.5mm Slim 800 G2 AIO BDXL Blu-Ray Drive X

Media Card Reader (optional)* DM SFF TWR AiO

5-in 1 PCIe Interface (Supports SD, SDXC, SDHC, UHS-I, X
UHS-II)
SD4 with 5-in-1 Interface from SD option to PCA is USB X X
(Supports SD, SDXC, SDHC, UHS-I, UHS-II)
*Card sold separately

MEMORY
Form Factor Type Maximum # of Slots
Desktop Mini DDR4-2133 32 GB 2 SODIMM
(Transfer rates up to
2133 MT/s)
Small Form Factor DDR4-2133 64 GB 4 DIMM
(Transfer rates up to
2133 MT/s)
Tower DDR4-2133 64 GB 4 DIMM
(Transfer rates up to
2133 MT/s)
All-in-One DDR4-2133 32 GB 2 SODIMM
(Transfer rates up to
2133 MT/s)
Both slots are customer accessible / upgradeable.
 2,048 MB (2048 MB x 1)
 4,096 MB (4096 MB x 1)
 8,192 MB (4096 MB x 2)

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Standard Features and Configurable Components

 8,192 MB (8192 MB x 1)
 16,384 MB (8192 MB x 2)
 32,768 (16,384 MB x 2) – Maximum for DM and AiO
 65,536 (16,384 MB x 2)– Maximum for SFF and TWR

NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be
available due to system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.

Memory modules support data transfer rates up to 2133 MT/s; actual data rate is determined by the system's configured
processor. See processor specifications for supported memory data rate.

NETWORKING/COMMUNICATIONS
Ethernet (RJ-45) DM SFF TWR AiO
Intel® I219LM Gigabit Network Connection LOM X X X X
(standard)
Intel® Ethernet I210-T1 PCIe x1 Gb Network Interface X X
Card (optional)

Wireless* DM SFF TWR AiO

Broadcom BCM943228Z 802.11n M.2 Bluetooth® NIC X X
Broadcom BCM943228Z 802.11n M.2 Bluetooth® X X
Disabled NIC
Broadcom BCM943228Z 802.11n PCIe Bluetooth® NIC X X
Broadcom BCM943228Z 802.11n PCIe Bluetooth® X X
Disabled NIC
Intel® 8260 802.11ac M.2 Bluetooth® Disabled NIC X X
Intel® 8260 802.11ac PCIe-CL Bluetooth® NIC X X
Intel® 8260 802.11ac PCIe-CL Bluetooth® Disabled NIC X X
Intel® 3165 802.11ac M.2 Bluetooth® NIC X
Intel® 3165 802.11ac M.2 Bluetooth® Disabled NIC X
Intel® 7265 802.11n M.2 Bluetooth® NIC X
Intel® 7265 802.11n M.2 Bluetooth® Disabled NIC X
Intel® 7265 802.11n PCIe Bluetooth® Disabled NIC X X
Intel® 7265 802.11ac PCIe Bluetooth® NIC X X
Intel® 7265 802.11ac PCIe Bluetooth® Disabled NIC X X
*Wireless access point and internet service required. The specifications for the 802.11ac WLAN are draft specifications and are
not final. If the final specifications differ from the draft specifications, it may affect the ability of the notebook to
communicate with other 802.11ac WLAN devices

Audio/Multimedia DM SFF TWR AiO

HD audio with Realtek ALC221 codec (all ports are X X X
stereo)
HP Clear Sound Amp X

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Standard Features and Configurable Components

Audio by Bang and Olufsen utilizing HP Clear Sound Amp X
which supports the integrated high-performance stereo
2.2W internal speakers, microphone array, headphone
jack, line-out jack and a microphone jack that is re-
taskable to second headphone or line in.
DTS Studio Sound™ audio management technology X X X
Microphone* and headphone front ports (3.5mm) X X X
Line-out and Line-In rear Ports* (3.5mm) X X X - Line-out
only
Headphone side ports (3.5mm) X
Headphone/Microphone/Line-in side port (3.5mm) X
Multi-streaming capable* X X X X
Internal speaker (standard) X X X
High performance integrated stereo speakers X
Integrated 2.0 MP webcam (up to 30 frames/sec ) & dual X
microphone array (optional)

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Standard Features and Configurable Components

DTS Studio Sound™ Technology (DM, SFF, & TWR only)

Introduction
DTS Studio Sound™ provides an outstanding audio and entertainment experience for all PC applications related to music, movies
and games. Utilizing DTS’s revolutionary 3D audio technology, DTS Studio Sound™ provides an immersive and realistic listening
experience for a two speaker playback environment. DTS Studio Sound™ offers a wide surround effect and natural positioning of
audio for both 2D and 3D content and delivers immersive surround complete with deep, rich enveloping bass and crystal clear
dialog. It also delivers high-frequency definition for crisp detail in any listening environment, ensuring users a premium and
natural entertainment experience across any speaker configuration (desktop speakers or headphones).

DTS Studio Sound™ (DM, SFF, & TWR only)

Features
 Outstanding multimedia audio experience
 Immersive surround sound from two speakers or headphones
 Extracts acoustic placement cues from original audio signal and adds near and far depth to the sound field to maximize
3D surround effect
 Custom-tuned solutions to provide superior natural sound from desktop speakers and headphones
 Maximum volume from small speakers
 Deep, rich bass and crystal clear dialog
 Intuitive user interface with presets for ease of use

* The side microphone port is re-taskable as a line-in, microphone-in or headphone-out port. The rear audio jack is line-out only.
External speakers must be powered externally.

Display (All-in-One models only)

23"diagonal IPS widescreen WLED backlit anti-glare LCD display
Orientation designed to operate in portrait or landscape mode
Non-touch or optional touch
Projected capacitive touch supports up to 10 touch-points
Display Panel Type IPS WLED Backlit LCD
Touch Active Area (mm) 509.18 x 286.42*
Screen opening (mm) 511.6 x 288.7**
Native Resolution (HxV) 1920 x 1080
Aspect ratio 16:9
Pixel pitch (HxV)(mm) 0.265 x 0.265
Contrast ratio (typical) 1000:1
Brightness (typical) Touch - 225nits (cd/m2)/ Non-Touch 250nits (cd/m2)
Viewing angle (typical) (HxV) 178 ° x 178 °
Backlight lamp life (to half brightness) 30,000 hours minimum
Color support Over 16 million colors
Color gamut (typical) 72%
Anti-glare Yes**
Default color temperature Warm (6500K)

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Standard Features and Configurable Components

*With Projected Capacitive Touch Panel
**Without Projected Capacitive Touch Panel
NOTE: All performance specifications represent the typical specifications provided by HP's
component manufacturers; actual performance may vary either higher or lower.

Easel Stand Tilt Angle +10° to +70°

Adjustable Height Vertical/Landscape Adjustment 125 mm (±3 mm)

Stand: Portrait Adjustment 34 mm (±3 mm)
Tilt Angle -5° to +20°(±3°) in landscape and portrait
Rotation 360° swivel and portrait or landscape orientation

Recline Stand: Vertical Adjustment 25 mm (±3 mm)

Tilt Angle -5° to +65° (+/-3°)
Rotation 360° swivel

WEBCAM & MIC (All-in-One models only)

Optional integrated 2 MP webcam & dual microphone array; maximum resolution of 1920 x 1080

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Standard Features and Configurable Components

KEYBOARDS AND POINTING DEVICES

Keyboard DM SFF TWR AiO
HP PS/2 Business Slim Keyboard* X X X
HP PS/2 Keyboard* X X X
HP USB Business Slim Keyboard X X X X
HP USB Conferencing Keyboard X X X X
HP USB Antimicrobial Keyboard (China only) X X X X
HP USB and PS/2 Washable Keyboard X X X X
HP USB Smart Card (CCID) Keyboard X X X X
HP Wireless Business Slim Keyboard and Mouse X X X X
*Optional PS/2 port required on All-in-One

Mice DM SFF TWR AiO

HP PS/2 Mouse* X X X
HP USB Mouse X X X X
HP USB 1000dpi Laser Mouse X X X X
HP USB and PS/2 Washable Mouse X X X X
HP USB Antimicrobial Mouse X X X X
HP USB Hardened Mouse X X X X
*Optional PS/2 port required on All-in-One

HP BIOS
Key features of the HP BIOS include:

 Deployment and manageability – HP BIOS provides several technologies that help integrate the HP Elite 800 G2
Business PC into the enterprise, such as PXE, remote configuration, remote control, and F10 Setup support for 12
languages.
 Update your BIOS via the cloud or standardize on a BIOS version hosted on Enterprise network.
 Select models feature either Intel® Standard Manageability or Intel® Core™ vPro™ Processor Technology.
 Stability – HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and
advanced change notification.
 UEFI specification 2.1
 Absolute Persistence agent – For tracking and tracing services, available in select countries, separate software and
purchase of a subscription is required.
 Thermal and power management – The HP BIOS provides and enables thermal and power management technologies so
component temperatures are managed for high reliability and to assist in operating the HP Business Desktop computer
in any enterprise environment.
 Acoustic performance – Industry leading acoustic emissions across the range of operating conditions.
 Serviceability – HP BIOS provides diagnostic and detailed service information.
 Upgrades and recovery – HP BIOS provides numerous ways to upgrade HP Business Desktop computers, including BIOS
updates from within DOS (DOSFlash), BIOS updates from within Windows (HPQFlash), HP Client Manager, and fail-safe
recovery. In addition, the HP Business Desktop BIOS Utilities tool enables replicated BIOS setup throughout the
Enterprise; it is available from within the BIOS software and from the support website.
 HP BIOS uses PKI signing of the BIOS for trusted BIOS upgrades and recovery.

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Standard Features and Configurable Components

Additional HP BIOS Features:

 Power-On password – Helps prevent an unauthorized user from powering on the system.
 Administrator password – Also known as the setup password, this helps prevent unauthorized changes to the system
configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be
made to BIOS settings using F10 setup or under the OS.
 Advanced Configuration and Power Interface (ACPI) – Represents a significant innovation in power and configuration
management, allowing operating systems and applications to manage power based on activity and usage. HP Elite
models use ACPI to provide power conservation features.

S5 Max Power Savings setting supports EU Lot6 requirement and allows the computer to power down below 1W is S5 (when
turned off). When S5 Max Power Savings feature is enabled power to slots is turned off along with WOL functionality.

Sure Start (not available on all systems)

 BIOS Integrity checking – Sure Start protection ensures that only trusted BIOS code is executed and not rootkits, viruses
and malware. Verification is done upon boot up, shutdown and while on.
 Sure Start is set by default to automatically repair the BIOS if corrupted or compromised but is policy driven for better
manageability.
 Protecting beyond BIOS – Integrity checking and repair is extended to other data that should be protected such as
network configuration parameters (network name), platform specific information (i.e. system IDs) and other code the
system needs to boot.
 Audit enabled – System Audit via Sure Start Event Logs capture data such as incident, repair date and time for
troubleshooting and investigating.

SECURITY
DM SFF/TWR AiO
Trusted Platform Module,SLB9670TT1.2FW4.40 (TPM) 1.2 (Common Criteria EAL4+ X X X
certified), Field upgradeable to 2.0
SATA port disablement (via BIOS) X X X
Drive lock X X X
RAID configurations X X
Intel® Identify Protection Technology (IPT)1 X X X
Serial, parallel, USB enable/disable (via BIOS) X X X
Optional USB Port Disable at factory (user configurable via BIOS) X X X
Removable media write/boot control X X X
Power-On password (via BIOS) X X X
Setup password (via BIOS) X X X
HP Chassis (1 bay) Security Kit TWR only
Solenoid Hood Lock X
Intrusion Sensor X X X
Support for chassis padlocks devices X X
Support for chassis cable lock devices X X X

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Standard Features and Configurable Components

1Models configured with Intel® Core™ processors have the ability to utilize advanced security protection for online transactions.
IPT, used in conjunction with participating web sites, provides double identity authentication by adding a hardware component in
addition to the usual user name and password. IPT is initialized through an HP Client Security module

ENVIRONMENTAL & REGULATORY

ENERGY STAR® certified configurations available
EPEAT® Gold registered where applicable/supported. See http://www.epeat.net for registration status by country.
Low halogen (chassis, all internal components and modules)
TAA compliant models available

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Standard Features and Configurable Components

PORTS
I/O Ports – Standard
DM SFF TWR AiO
USB 2.0 N/A 2 (front) including 1 fast 2 (front) including 1 fast N/A
charging; charging;
USB 3.0 2 (front); 4 (rear) 2 (front); 6 (rear) 2 (front); 6 (rear) 2 (side) including 1 fast
charging, 4 (rear)
USB Type-C™3.0 port 1 (front) 1 (side)
Serial (RS-232) (optional)* 1 1 1 (optional)
PS/2 N/A 1 keyboard (purple) 1 keyboard (purple) (Optional legacy card)
1 mouse (green) 1 mouse (green) 1 keyboard (purple)
1 mouse (green)
Video 1 VGA 1 VGA 1 VGA 1 DisplayPort with
2* DisplayPort 2 DisplayPort with 2 DisplayPort with multi-stream
with multi-stream multi-stream multi-stream
 2nd DisplayPort
(optional)

1 HDMI (optional)
Audio Front: headphone/mic Front: headphone/mic Front: headphone/mic Side: headphone/line-out,
Rear: line in/out Rear: line in/out headphone/mic/line-in
3.5mm diameter 3.5mm diameter Rear: line out
3.5mm diameter
Network Interface RJ-45 RJ-45 RJ-45 RJ-45
*Replaces 1 DisplayPort 1.2

I/O Ports – Optional

DM SFF TWR AiO
2nd Serial (RS-232) N/A 1 1 N/A
Parallel N/A 1 1 N/A

SLOTS
DM SFF TWR AiO
Turbo Drive (M.2 1 ea. M.2 PCIe x4-2230 N/A N/A 1 ea. M.2 PCIe x4-2230
PCIe) (for WLAN) (for WLAN)
1 ea. M.2 PCIe x4-2280 1 ea. M.2 PCIe x4-2280
(for storage) (for storage)
PCI Express x1 (v3.0) N/A 2 ea. 2 ea. N/A
2.5” low profile 4.2” full height
6.6” length 6.6” length
10W max. power 10W max. power
PCI Express x16 N/A 1 ea. 1 ea. N/A
(v3.0) 2.5” low profile 4.2” full height
(wired as a x4) 6.6” length 6.6” length
35W max. power 35W max. power

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Standard Features and Configurable Components

PCI Express x16 N/A 1 ea. 1 ea. N/A
(v3.0) 2.5” low profile 4.2” full height
6.6” length 6.6” length
35W max. power 75W max. power
Optional PCI N/A N/A 1 ea. N/A
4.2” full height
6.6” length
NOTE: The TWR can support a single graphics card up to 75W. When configured with dual graphics cards support is limited to 35W for
each.

BAYS
DM SFF TWR AiO
5.25" Half Height ODD N/A N/A 1 ea. N/A
9mm Slim ODD N/A 1 ea. 1 ea. 1 ea.
Secure Digital (SD) 4 Reader N/A 1 ea. 1 ea. N/A
2.5” internal storage drive 1 ea. 1 ea. 1 ea. 2 ea.
3.5” internal storage drive N/A 2 ea. 2 ea. N/A

SERVICE AND SUPPORT

On-site Warranty 1: Three-year (3-3-3) limited warranty delivers three years of on-site, next business day 2 service for parts
and labor and includes free support3 24 x 7. Three-year onsite and labor are not available in all countries. Service offers terms
up to 5 years by choosing an optional HP Care Pack.4 To choose the right level of service for your HP product, visit HP Care
Pack Central: www.hp.com/go/cpc

NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may
be offered in your region.

NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party
provider, and is not available in certain countries. Global service response times are based on commercially reasonable best
effort and may vary by country.

NOTE 3: Technical telephone support applies only to HP-configured and third-party HP qualified hardware and software. Toll-
free calling and 24 x 7 support may not be available in some countries.

NOTE 4: Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts
on date of hardware purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP services are
governed by the applicable HP terms and conditions of service provided or indicated to Customer at the time of purchase.
Customer may have additional statutory rights according to applicable local laws, and such rights are not in any way affected
by the HP terms and conditions of service or the HP Limited Warranty provided with your HP Product.

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Standard Features and Configurable Components

OPERATING SYSTEMS
Preinstalled
Windows 10 Pro 64*
Windows 10 Home 64*
Windows 8.1 Pro 64**
Windows 8.1 64**
Windows 7 Professional 64 (available through downgrade rights from Windows 10 Pro)***
Windows 7 Professional 32 (available through downgrade rights from Windows 10 Pro)***
Windows 7 Professional 64**
Windows 7 Professional 32**

Pre-installed (Other)
FreeDOS 2.0

Web-supported
Windows 10 Pro 64
Windows 10 Home 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 7 Professional 64
Windows 7 Professional 32
Windows 10 Enterprise 64
Windows 8.1 Enterprise 64
Windows 7 Enterprise 64
Windows 7 Enterprise 32

*Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased
hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated,
which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. See
http://www.microsoft.com.
**Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased
hardware, drivers, software or BIOS update to take full advantage of Windows functionality. See http://www.microsoft.com.
***This system is preinstalled with Windows 7 Pro software and also comes with a license and media for Windows 10 Pro software.
You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall one
version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating
systems to avoid loss of your data.

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Standard Features and Configurable Components

SOFTWARE AND SECURITY

BIOS
HP BIOSphere with Sure Start1
HP DriveLock
HP BIOS Protection2
BIOS Update via Network
Master Boot Record Security
Power On Authentication
Secure Erase3
Hybrid Boot (Windows 8.1 & higher)
Measured Boot (Windows 8.1 & higher)
Secure Boot (Windows 8.1 & higher
Absolute Persistence Module4

Multimedia
Cyberlink Power DVD, BD
Cyberlink Power2Go (Secure Burn)

Communication
Intel® Wireless Display (WiDi) Software for Windows 5
Native Miracast Support6

HP Value Add Software

HP ePrint Driver7
HP Recovery Disc Creator (Windows 7 only)
HP Recovery Manager
HP Support Assistant
Windows 10 Welcome App

3rd Party
Foxit PhantomPDF Express for HP

Microsoft Products
Buy Office
Bing Search
Skype

Manageability
HP SoftPaq Download Manager (SDM)
HP System Software Manager (SSM)8
HP BIOS Config Utility (BCU)8
HP Client Catalog8

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Standard Features and Configurable Components

HP CIK for Microsoft SCCM8
LANDESK Management8
HP BIOS Config Utility (BCU)8
Discover HP Touchpoint Manager9

For more information on HP Client Management Solutions refer to: http://www.hp.com/go/clientmanagement.

Client Security Software

HP Client Security Manager
Microsoft Security Essentials10
Microsoft Defender
TPM 1.2/2.0

NOTE: The Absolute Persistence agent is shipped turned off, and must be activated by customers when they
purchase a subscription. Subscriptions can be purchased for terms ranging multiple years. Service is limited, check
with Absolute for availability outside the U.S.

For more information on HP Client Security Software Suite, refer to http://www.hp.com/go/clientsecurity.

Footnotes:
1 Available only on business PCs with HP BIOS.
2 May require a manual recovery step if all copies of BIOS are compromised or deleted
3 For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88.
4 Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription. Subscriptions
can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. The
Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit:
http://www.absolute.com/company/legal/agreements/ computrace-agreement. Data Delete is an optional service
provided by Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to use the Data Delete service,
customers must first sign a Pre-Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens
from Absolute Software.
5 Integrated Intel® Wi-Di Display is available on select configurations only and requires a separate projector, TV or monitor with
an integrated or external Wi-Di receiver. For more information on Intel® Wi-Di Display visit
http://www.intel.com/go/wirelessdisplay
6 Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming media players that
also support Miracast. You can use Miracast to share what you’re doing on your PC and present a slide show. For more
information: http://windows.microsoft.com/en-us/windows-8/project-wireless-screen-miracast
7 Requires an Internet connection to HP web-enabled printer and HP ePrint account registration (for a list of eligible printers,
supported documents and image types and other HP ePrint details, see http://www.hp.com/go/eprintcenter). Requires
optional broadband module. Broadband use requires separately purchased service contract. Check with service provider for
coverage and availability in your area. Separately purchased data plans or usage fees may apply. Print times and connection
speeds may vary.
8 Not preinstalled, however available for download at http://www.hp.com/go/clientmanagement
9 Subscription required.
10 Opt in and internet connection required for updates.

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Technical Specifications – Core™ vPro™ Processors

CORE™ vPRO™ PROCESSORS

INTEL® 6th GENERATION CORE™ vPRO™ PROCESSORS
All HP Elite 800 G2 Business PC models featuring this technology include processors that are part of the Intel® Stable Image
Platform Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP Elite 800 G2
Business PC, thus making these models the most stable, secure, and manageable platforms available to enterprises today.

Intel® Advanced Management Technology (AMT) v9.0 – An advanced set of remote management features and functionality
which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked
client systems regardless of the system's health or power state. AMT 9.0 includes the following advanced management
functions:

 Power Management (on, off, reset)

 Hardware Inventory (includes BIOS and firmware revisions
 Hardware Alerting
 Agent Presence
 System Defense Filters
 SOL/IDER
 Cisco NAC/SDN Support
 ME Wake-on-LAN
 DASH 1.1 compliance
 IPv6 Support
 Fast Call for Help - a client inside or outside the firewall may initiate a call for help via BIOS screen, periodic
connections, or alert triggered connection
 Remote Scheduled Maintenance - pre-schedule when the PC connects to the IT or service provider console for
maintenance. Remote PCs can get required patches, be inventoried, etc by connecting to their IT console or Service
Provider when it's convenient.
 Remote Alerts - automatically alert IT or service provider if issues arise
 Access Monitor - Provides oversight into Intel® AMT actions to support security requirements
 PC Alarm Clock
 Microsoft NAP Support
 Host Base set-up and configuration
 Management Engine (ME) firmware roll back
 Wireless AMT functionality on Desktop (WoDT)
 Enhanced KVM resolution

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Technical Specifications – Graphics

GRAPHICS

Intel® HD Graphics (integrated)

DisplayPort Multimode capable; supports HDCP, Display Port Audio (2 streams), HBR2 link rates and
Multi-Stream Technology for a maximum of 3 displays (including the integrated panel)

Memory The BIOS has options for selecting the dedicated memory size of 128MB, 256MB or 512MB
Additional memory is allocated for graphics as needed using Intel's Dynamic Video Memory
Technology (DVMT), to provide an optimal balance between graphics and system memory
use.

Maximum Graphics Memory Microsoft Windows 7 Windows 8.1 Windows 10

Up to 1.7GB Up to 1.8GB >4 GB

Note: the actual amount of maximum graphics memory can be less than the amounts listed
above depending upon your computer’s configuration.

Maximum Color Depth 32 bits/pixel

6th Generation Core™ processors:
 Next Generation Intel® Clear Video Technology HD Support is a collection of video
playback and enhancement features that improve the end user's viewing
experience
o Encode/transcode HD content
o Playback of high definition content including Blu-ray Disc
o Superior image quality with sharper, more colorful images
Graphics/Video API Support  DirectX Video Acceleration (DXVA) support for accelerating video processing
o Full AVC/VC1/MPEG2/HEVC HW Decode
 Advanced Scheduler 2.0, 1.0
 Windows 7, Windows 8.1, Windows 10, Linux OS Support
 DirectX 12.1
 OpenGL 4.4
 Open CL 1.2 (Intel® HD Graphics 510)
 Open CL 1.2/2.0 (Intel® HD Graphics 530)
Supported Display Resolutions and Refresh Rates
Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP
Resolution Refresh Rates
800x600 60 Hz
1024x768 60 Hz
1152x864 60 Hz
1280x600 60 Hz
1280x720 60 Hz
1280x800 60 Hz
1280x960 60 Hz
1280x1024 60 Hz
1360x768 60 Hz
1366x768 60 Hz
1400x1050 60 Hz
1440x900 60 Hz
1600x900 60 Hz

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Technical Specifications – Graphics

1600x1200* 60 Hz
1680x1050 60 Hz
1920x1080 60 Hz
1920x1200* 60 Hz
1920x1440* 60 Hz
2560x1440* 60 Hz
2560x1600* 60 Hz
3840x2160* 60 Hz
* Only supported on displays connected to the external DisplayPort connector.

AMD® Radeon™ R9 350 2GB PCIe x16

Memory 2GB 128-bit wide frame buffer operating at 1150MHz.
Controller Clock Speed AMD® Radeon™ R9 350 GPU operating at 925 MHz
A maximum of 4 displays are supported by the card. A maximum of 2 legacy displays (Native
Multidisplay Support
VGA, DVI, or displays connected with passive DisplayPort adapters are considered as legacy)
Graphics /API support DIRECTX 12, Open GL 4.3, Open CL1.2, UVD 3
Output Connectors 1 x Dual-Link DVI-I, 2x DisplayPort; Includes DVI to VGA adapter
Supported Display Resolutions and Refresh Rates
Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP.
DisplayPort
(DVI-VGA
adapter)

DVI-D
VGA

Resolution Refresh Rate* Standard

640 x 480 60, 75, 85 X X X VESA DMT, CVT 0.31M3
720 x 400 70 X X X IBM VGA
800 x 600 60, 75, 85 X X X VESA DMT, CVT0.48M3
1024 x 768 60, 75, 85 X X X VESA DMT, CVT 0.79M3
1152 x 864 60, 75, 85 X X X VESA DMT, CVT 0.83MA
1280 x 720 60, 75, 85 X X X VESA DMT, CVT 0.92M9, CEA-770.3
1280 x 768 60, 60RB, 75, 85 X X X VESA DMT, CVT 0.98M9/0.98M9-R
1280 x 800 60, 75, 85 X X X VESA DMT
1280 x 960 60, 75, 85 X X X VESA DMT
1280 x 1024 60, 75, 85 X X X VESA DMT, CVT 1.31M4
1366 x 768 60, 60RB X X X VESA DMT
1440 x 900 60, 60RB X X X VESA DMT
1600 x 900 60, 60RB, 75, 85 X X X VESA DMT

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Technical Specifications – Graphics

1680 x 1050 60, 60RB, 75 X X X VESA DMT, CVT 1.76MA/1.76MA-R
1920 x 1080 60 X X X VESA DMT, CVT 2.07M9, SMPTE 274M
1920 x 1200 60, 60RB, 75, 85 X X X DMT, CVT 2.30MA/2.30MA-R
1600 x 1200 60, 75, 85 X X X VESA DMT, 1.92M3
1920 x 1440 60, 75, 85 X X X VESA DMT, CVT 2.76M3
2048 x 1536 60,75 X X X CVT 3.15M3
2560 x 1440 59.951 X X CVT 3.69M9-R
2560 x 1600 60, 60RB X X VESA DMT, CVT 4.10MA/4.10MA-R
3840 x 2160 24 X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 25 X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 30 X X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 50 X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 60 X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
4096 x 2160 24 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 25 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 30 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 50 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 60 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
1920 x 1080 60 X X VESA (SMPTE 274M)
1920 x 1080 50 X X SMPTE 274M
1920 x 1080 30 X X SMPTE 274M
1920 x 1080 24 X X SMPTE 274M
1280 x 720 60 X X VESA (CEA-770.3)
1280 x 720 50 X X SMPTE 296M
720 x 480 60 X X MHL (CEA-770.2)
* >60 refresh rates only for analog (VGA) signaling

NVIDIA® GeForce® GT 730 2GB PCIe x8 Graphics Card (option only for 800 G2 MT and SFF)
Get impressive graphics and high resolution dual-display performance in a low profile, PCI Express
Introduction x8 graphics add-in card based on the NVIDIA® Kepler™ Graphics Processor. Improve your everyday
PC, Web conferencing, and video or photo editing.
2GB DDR3 64-bit wide frame buffer operating at 900 MHz
Memory
NVIDIA® Kepler™ GPU operating at 902 MHz
Controller Clock Speed

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Technical Specifications – Graphics

A maximum of 4 displays are supported by the card.
Multi-display Support
Supports Microsoft DirectX 12, OpenGL 4.4 and OpenCL 2 APIs, Shade Model 5, UVD 4.2, VCE 2.0, and
Graphics /API support
DirectCompute 11
1 x Dual-Link DVI-I, 1x DisplayPort; Includes DVI to VGA adapter
Output Connectors Display Port output is multi-mode capable, support Audio, HBR2 and MST

Supported Display Resolutions and Refresh Rates

Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP.

DisplayPort
(DVI-VGA
adapter)

DVI-D
VGA

Resolution Refresh Rate* Standard

640 x 480 60, 75, 85 X X X VESA DMT, CVT 0.31M3
720 x 400 70 X X X IBM VGA
800 x 600 60, 75, 85 X X X VESA DMT, CVT0.48M3
1024 x 768 60, 75, 85 X X X VESA DMT, CVT 0.79M3
1152 x 864 60, 75, 85 X X X VESA DMT, CVT 0.83MA
1280 x 720 60, 75, 85 X X X VESA DMT, CVT 0.92M9, CEA-770.3
1280 x 768 60, 60RB, 75, 85 X X X VESA DMT, CVT 0.98M9/0.98M9-R
1280 x 800 60, 75, 85 X X X VESA DMT
1280 x 960 60, 75, 85 X X X VESA DMT
1280 x 1024 60, 75, 85 X X X VESA DMT, CVT 1.31M4
1366 x 768 60, 60RB X X X VESA DMT
1440 x 900 60, 60RB X X X VESA DMT
1600 x 900 60, 60RB, 75, 85 X X X VESA DMT
1680 x 1050 60, 60RB, 75 X X X VESA DMT, CVT 1.76MA/1.76MA-R
1920 x 1080 60 X X X VESA DMT, CVT 2.07M9, SMPTE 274M
1920 x 1200 60, 60RB, 75, 85 X X X DMT, CVT 2.30MA/2.30MA-R
1600 x 1200 60, 75, 85 X X X VESA DMT, 1.92M3
1920 x 1440 60, 75, 85 X X X VESA DMT, CVT 2.76M3
2048 x 1536 60,75 X X X CVT 3.15M3
2560 x 1440 59.951 X X CVT 3.69M9-R
2560 x 1600 60, 60RB X X VESA DMT, CVT 4.10MA/4.10MA-R
3840 x 2160 24 X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 25 X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M

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Technical Specifications – Graphics

3840 x 2160 30 X X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 60 X CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
4096 x 2160 24 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 25 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 30 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 60 X CVT-RBv1/v2 (8.85M-R), SMPTE 274M
1920 x 1080 60 X X VESA (SMPTE 274M)
1920 x 1080 50 X X SMPTE 274M
1920 x 1080 30 X X SMPTE 274M
1920 x 1080 24 X X SMPTE 274M
1280 x 720 60 X X VESA (CEA-770.3)
1280 x 720 50 X X SMPTE 296M
720 x 480 60 X X MHL (CEA-770.2)
720 x 576 50 X X ITU-R BT.1358
640 x 480 60 X X CEA (VESA DMT)
* >60 refresh rates only for analog (VGA) signaling

NVIDIA® NVS™ 310 Graphics Card

(Not allowed when 180W chassis and 65W processor both are selected on 400/480/490/498 MT)
Introduction The NVIDIA® NVS™ 310 Graphics Card is a PCI Express low profile form factor graphics
add-in card targeted as an active low cost graphics solution for the corporate business
and enterprise markets.
The NVIDIA® NVS™ 310 graphics card is an ideal solution for customers requiring a small
form factor graphics add-in card for either standard or small form factor PC designs.

Performance and Features The NVIDIA® NVS™ 310 Graphics Card offers 1GB of ultrafast DDR3 memory and is capable
of supporting up to 2 displays.
DisplayPort connector supports multimode technology to support connection to DVI-D,
VGA and HDMI monitors with optional adapters in kits NR078AA, FH973AT, BP937AA,
AS615AA.
For a DisplayPort to DisplayPort connections use the optional DisplayPort Cable Kit
VN567AA.

Form Factor Low Profile: 2.713 × 6.15 in

Graphics Controller NVIDIA® NVS™ 310

Memory Clock 875MHz

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Technical Specifications – Graphics

Memory Size 1GB DDR3

Memory Bandwidth 14 GB/s

Max. Power 19.5W

Display Max. Resolution Up to 2560 x 1600 (digital display) per display

Display Output Up to 2 displays in the following configurations

 Drives two DisplayPort enabled digital display at resolutions

up to 2560 × 1600 at 60 Hz with reduced blanking, when
connected natively using the 2 DisplayPort connectors on
DisplayPort output: the NVS 310 graphics card
 Supports 2 monitors up to resolution of 1920 × 1200 at 60
Hz with reduced blanking using DisplayPort Multi-Stream
topology technology.
 Drives two digital display at resolutions up to 1920 × 1200
at 60 Hz with reduced blanking using DisplayPort to DVI-D
single-link cable adaptors
DVI-D output:
 Drives two digital display at resolutions up to 2560× 1600 at
60 Hz with reduced blanking using DisplayPort to DVI-D
dual-link cable adaptors
 NVS 310 is capable of driving two high definition (HD) panels
HDMI output: up to resolutions of 1920 × 1080P at 60 Hz using DisplayPort
to HDMI cable adaptors
 Drives two analog display at resolutions up to 1920 × 1200 at
VGA display output:
60 Hz using DisplayPort to VGA cable adaptors
Supported Display Resolutions and Refresh Rates
Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP

Resolution Maximum Refresh Rates (Hz) by Connection

DisplayPort to VGA DisplayPort to DVI-D DisplayPort to HDMI DisplayPort

640 x 480 85 60 60 60
800 x 600 85 60 60 60
1024 x 768 85 60 60 60
1280 x 720 85 60 60 60
1280 x 1024 85 60 60 60
1440 x 900 75 60 60 60
1600 x 1200 60 60 60 60
1680 x 1050 60 60 60 60
1920 x 1080 60-R 60-R 60 60
1920 x 1200 60-R 60-R 60
1920 x 1440 60
2048 x 1536 60

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Technical Specifications – Graphics

AMD® Radeon™ R9 360 Graphics (option only for 800 G2 AiO)

Memory 2GB 128-bit wide GDDR5 frame buffer operating at 1125 MHz.

Controller Clock Speed AMD® Radeon™ R9 360 GPU operating at 925 MHz

Multidisplay Support Support for up to 4 external displays

Graphics /API support DIRECTX 12, Open GL 4.3, Open CL1.2, UVD 3

Output Connectors 1 Dual-mode (DP++) DisplayPort output, which supports DP MST, HBR2 and audio on all
external displays. Supports HP DP to VGA, DP to DVI and DP to HDMI adapters.
Supported external Display Resolutions and Refresh Rates
Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP.
Resolution Refresh Rate Standard
640 x 480 60 VESA DMT, CVT 0.31M3
720 x 400 60 IBM VGA
800 x 600 60 VESA DMT, CVT0.48M3
1024 x 768 60 VESA DMT, CVT 0.79M3
1152 x 864 60 VESA DMT, CVT 0.83MA
1280 x 720 60 VESA DMT, CVT 0.92M9, CEA-770.3
1280 x 768 60, 60RB VESA DMT, CVT 0.98M9/0.98M9-R
1280 x 800 60 VESA DMT
1280 x 960 60 VESA DMT
1280 x 1024 60 VESA DMT, CVT 1.31M4
1366 x 768 60 VESA DMT
1440 x 900 60, 60RB VESA DMT
1600 x 900 60, 60RB VESA DMT
1680 x 1050 60, 60RB VESA DMT, CVT 1.76MA/1.76MA-R
1920 x 1080 60 VESA DMT, CVT 2.07M9, SMPTE 274M
1920 x 1200 60, 60RB DMT, CVT 2.30MA/2.30MA-R
1600 x 1200 60 VESA DMT, 1.92M3
1920 x 1440 60 VESA DMT, CVT 2.76M3
2048 x 1536 60 CVT 3.15M3
2560 x 1440 59.951 CVT 3.69M9-R
2560 x 1600 60, 60RB VESA DMT, CVT 4.10MA/4.10MA-R
3840 x 2160 24 CVT-RBv1/v2 (8.29M9-R), SMPTE 274M

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Technical Specifications – Graphics

3840 x 2160 25 CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 30 CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 50 CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
3840 x 2160 60 CVT-RBv1/v2 (8.29M9-R), SMPTE 274M
4096 x 2160 24 CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 25 CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 30 CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 50 CVT-RBv1/v2 (8.85M-R), SMPTE 274M
4096 x 2160 60 CVT-RBv1/v2 (8.85M-R), SMPTE 274M
1920 x 1080 60 VESA (SMPTE 274M)
1920 x 1080 50 SMPTE 274M
1920 x 1080 30 SMPTE 274M
1920 x 1080 24 SMPTE 274M
1280 x 720 60 VESA (CEA-770.3)
1280 x 720 50 SMPTE 296M
720 x 480 60 MHL (CEA-770.2)

NVIDIA® GeForce® GTX 960 2GB PCIe x16 Graphics Card

Controller/Clock Speed NVIDIA® GeForce® GTX960 GPU operating at up to 1178 MHz
Memory 2GB 128-bit wide frame buffer operating at up to 3505 MHz.
Multidisplay Support A maximum of 4 displays are supported by the card.
System Interface PCI Express x16 Gen3
Graphics /API support DirectX 12, OpenGL 4.4
Output Connectors 3 x Display Port:
 Dual Mode (DP++)
 Supports DP MST, HBR2 and audio
 Supports HP DP to VGA, DP to DVI and DP to HDMI adapters.

1 x HDMI :
 Supports 2.0 features

1 x Dual Link DVI-I

 Adds VGA support via the supplied DVI-I to VGA adapter

Power Requirements 120W max; Requires 2x3 pin power cable & 400W system power supply
Mechanical 6.9in x 4.4 in (175mmx112mm) full height double width slot

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Technical Specifications – Graphics

Supported Display Resolutions and Refresh Rates
Note: other resolutions may be available but are not recommended as they may not have been tested and qualified by HP.

I ADAPTER)

DisplayPort
(WITH DVI-

DVI-D

HDMI
VGA
Standard
Resolution Refresh Rate* Resolution
640 x 480 60, 75, 85 X X X X VESA DMT, CVT 0.31M3
720 x 400 70 X X X X IBM VGA
800 x 600 60, 75, 85 X X X X VESA DMT, CVT0.48M3
1024 x 768 60, 75, 85 X X X X VESA DMT, CVT 0.79M3
1152 x 864 60, 75, 85 X X X X VESA DMT, CVT 0.83MA
1280 x 720 60, 75, 85 X X X X VESA DMT, CVT 0.92M9, CEA-770.3
1280 x 768 60, 60RB, 75, 85 X X X X VESA DMT, CVT 0.98M9/0.98M9-R
1280 x 800 60, 75, 85 X X X X VESA DMT
1280 x 960 60, 75, 85 X X X X VESA DMT
1280 x 1024 60, 75, 85 X X X X VESA DMT, CVT 1.31M4
1366 x 768 60, 60RB X X X X VESA DMT
1440 x 900 60, 60RB X X X X VESA DMT
1600 x 900 60, 60RB, 75, 85 X X X X VESA DMT
1680 x 1050 60, 60RB, 75 X X X X VESA DMT, CVT 1.76MA/1.76MA-R
VESA DMT, CVT 2.07M9, SMPTE
1920 x 1080 60 X X X X
274M
1920 x 1200 60, 60RB, 75, 85 X X X X DMT, CVT 2.30MA/2.30MA-R
1600 x 1200 60, 75, 85 X X X X VESA DMT, 1.92M3
1920 x 1440 60, 75, 85 X X X X VESA DMT, CVT 2.76M3
2048 x 1536 60,75 X X X X CVT 3.15M3
2560 x 1440 59.951 X X X CVT 3.69M9-R
2560 x 1600 60, 60RB X X X VESA DMT, CVT 4.10MA/4.10MA-R
CVT-RBv1/v2 (8.29M9-R), SMPTE
3840 x 2160 24 X X
274M
CVT-RBv1/v2 (8.29M9-R), SMPTE
3840 x 2160 25 X X
274M
CVT-RBv1/v2 (8.29M9-R), SMPTE
3840 x 2160 30 X X X
274M
CVT-RBv1/v2 (8.29M9-R), SMPTE
3840 x 2160 50 X X
274M
CVT-RBv1/v2 (8.29M9-R), SMPTE
3840 x 2160 60 X X
274M

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Technical Specifications – Graphics

CVT-RBv1/v2 (8.85M-R), SMPTE
4096 x 2160 24 X X
274M
CVT-RBv1/v2 (8.85M-R), SMPTE
4096 x 2160 25 X X
274M
4096 x 2160 CVT-RBv1/v2 (8.85M-R), SMPTE
30 X X
274M
4096 x 2160 CVT-RBv1/v2 (8.85M-R), SMPTE
50 X X
274M
4096 x 2160 CVT-RBv1/v2 (8.85M-R), SMPTE
60 X X
274M
1920 x 1080 50 X X X SMPTE 274M
1920 x 1080 30 X X X SMPTE 274M
1920 x 1080 24 X X X SMPTE 274M
1280 x 720 50 X X X SMPTE 296M
720 x 576 50 X X X ITU-R BT.1358
* >60 refresh rates only for analog (VGA) signaling

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Technical Specifications – Hard Disk and Solid State Storage

HARD DISK AND SOLID STATE STORAGE
Introduction:
HP Serial Advanced Technology Attachment (SATA) Hard Drives maximize the performance of HP Business PCs by providing the
technologies to meet your increasing storage demands with high-capacity drives offering superior reliability and performance.

SATA provides faster data transfer speeds, better system cooling airflow, more bandwidth, more headroom for speed increases in
future generations and better data integrity. A next-generation technology, the SATA interface connects hard drives to the PC
platform enabling easy aggregation of multiple hard drives into a single PC. This offers you the additional benefits of dedicated
bandwidth, the ability to more easily identify device failures and scalability. The HP EliteDesk 800 G2 Series Business PC supports
the latest SATA 6.0Gb/s specification.

HP Drive Lock

HP Serial ATA Hard Drives offer enhanced security via a new Drive Lock. When enabled, this ATA security feature set prevents
software access to user data on the drive until one or two user-defined passwords are provided.

SMART IV Technology

Self-Monitoring Analysis and Reporting Technology (SMART) hard drive technology allows hard drives to monitor their own health
and to raise flags if imminent failures are predicted. If the drive determines that a failure is imminent, the SMART hard drive
technology enables the intelligent manageability or management software to generate a fault alert. While the current versions of
SMART hard drives do a good job monitoring the data on the hard drive media, the ever increasing emphasis on reliability and
quality has promoted HP to implement SMART IV technology which constantly checks that the data flow from host interface to
media and media to host interface is not compromised. This is accomplished by inserting a 2 byte parity code into every 512 byte
block in the data path of the hard drive's Cache RAM. This unique parity checking performed by HP's SMART IV technology hard
drives, allows for more complete error detection coverage encompassing the entire data path between the host and the hard drive.

Smart IV is also known as IOEDC: I/O Error Detection Code.

Native Command Queuing

NCQ or Native Command Queuing is a SATA protocol extension that allows the hard drive to have several write or read commands
outstanding at the same time. In contrast, normal non-queued operation requires each command to be completed before the next
command is issued by the host system. Queuing allows the drive to complete the commands in the order that allows for best
overall throughput. It also involves an advanced method of transferring data to or from the host, called First Party Direct Memory
Access (FPDMA), which allows the hard drive and the host controller to manage the data transfers for multiple outstanding
commands, without involving the host processor. NCQ can contribute to better performance but the results are dependent on
many factors, including the access patterns of the various applications and operating system functions that are initiating drive
accesses. Enabling NCQ features in the hard drive requires AHCI support from the host system BIOS, controller, and driver. AHCI
support is typically implemented in RAID configurations.

Note: GB = 1 billion bytes. Actual available capacity is less.

Redundant Array of Independent Drives (RAID)

Flexible implementation:

 DriveLock is supported while in RAID mode. Users can manage the DriveLock password from within F10 Setup. Locked
drives will be displayed as such in the RAID option ROM interface.
 Hard drive information can be viewed within F10 Setup while in RAID mode. Previously, the hard drives will not appear in
Drive Configuration when switching to RAID mode.

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Technical Specifications – Hard Disk and Solid State Storage

 DPS Self-Test can be executed on physical hard drives while in RAID mode.
 The RAID Setup Utility (accessed through CTRL-I) can be protected by the F10 Setup password.

NOTE:
RAID 1 is the only RAID configuration offered via factory configurations. The pre-configured systems:

 Are only available on the SFF, TWR and AIO form factors. The DM form factor does not support RAID as it does not allow for
multiple common storage drives.
 Are complete RAID systems and have both drives installed. If the TWR is configured with three hard disk drives, the third
drive is would be un-partitioned and not part of the RAID array
 Have the necessary Option ROM configuration.
 Are pre-loaded and pre-installed with all required Intel® software.
 Include a preinstalled operating system that is mirrored mode out of the box.
 Are available only for select storage options.

120 GB SATA 2.5 Non-SED SSD

Unformatted Capacity 120 GB

Multi-Level Cell (MLC) NAND

Architecture

Interface Serial ATA 3.0 (6.0 Gb/s)

Form Factor 2.5 inch

Height Low profile, 7mm height

Width 69.85 mm ± 0.25

Length 100.45 mm max

Weight Up to 78 g

Bandwidth Performance Sustained Sequential

Up to 540 MB/s
Read:

Sustained Sequential
Up to 480 MB/s
Write:

Power Power consumption: Average: Read <3.7W; Write 3.7W; Standby <55mW

Environmental Operating Temperature: 32° to 158° F (0° to 70° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%

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Technical Specifications – Hard Disk and Solid State Storage

Shock: 1,500 G/0.5 ms

120GB SATA 2.5” Opal2 SED Solid State Drive (Pro 2500)

120 GB
Unformatted Capacity
234,441,648 (Total Logical Sectors)

ATA 8 Compliant and SATA 3.0 compliant

Architecture
Supports Mode 2 Multiword DMA
Supports Drive Failure Prediction
Supports SMART Offline Read Scan
Supports Mode 4 PIO
Supports Mode 5 UDMA
Supports HP Drive Protection System
ATA 8 ACS-2 Data / TRIM Support
Support DEVSLP feature
Supports TRIM Command per ATA8 / ACS 2
Supports FIPS-197 features
Support TCG Storage Architecture Core Specification 2.0
Interface Serial ATA 3.0 (6.0 Gb/s)

Form Factor 2.5 inch

Height Low profile, 7mm height

Width 69.85 mm ± 0.25

Length 100.45 mm max

Weight Up to 78 g

Bandwidth Performance Sustained Sequential

Up to 540 MB/s
Read:

Sustained Sequential
Up to 480 MB/s
Write:

Power Power consumption: Average: Read <3.7W; Write 3.7W; Standby <55mW

Environmental Operating Temperature: 32° to 158° F (0° to 70° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%

Shock: 1,500 G/0.5 ms

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Technical Specifications – Hard Disk and Solid State Storage

128GB SATA 2.5” 3D Non-SED Solid State Drive

128 GB
Unformatted Capacity
250,069,680 (User Addressable Sectors)

Self-Encrypting (SED) Solid State Drive with NAND Flash and SATA interface.
Fully complies with ATA/ATAPI-7 Standard (Partially Complies with ATA/ATAPI-8)
Architecture Power Saving Modes: DIPM (Partial / Slumber mode)
Support NCQ : Up to 32 depth
Synchronous Signal Recovery

Interface Serial ATA (6.0 Gb/s)

Form Factor 2.5 inch

Height 6.80 mm ± 0.20

Width 69.85 mm ± 0.25

Length 100.20 mm ± 0.25

Weight Up to 54 g

Bandwidth Performance Sustained Sequential

Up to 530 MB/s
Read:

Sustained Sequential
Up to 140 MB/s
Write:

Power Power consumption: Active: Typical 250mW; Idle: Typical 50mW

Mean Time Between Failure (MTBF) 1,500,000 hours

Environmental Operating Temperature: 32° to 158° F (0° to 70° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%

Shock: 1,500 G/0.5 ms

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Technical Specifications – Hard Disk and Solid State Storage

128GB SATA 2.5” Opal2 SED Solid State Drive

128 GB
Unformatted Capacity
250,069,680 (User Addressable Sectors)

Self-Encrypting (SED) Solid State Drive with NAND Flash and SATA interface.
Architecture
Trusted Computing Group(TCG) OPAL compliant encrypted solid state drive

Interface Serial ATA (6.0 Gb/s)

Form Factor 2.5 inch

Height 6.80 mm ± 0.20

Width 69.85 mm ± 0.25

Length 100.20 mm ± 0.25

Weight Up to 73 g

Bandwidth Performance Sustained Sequential Read: Up to 520 MB/s

Sustained Sequential Write: Up to 340 MB/s

Power Power consumption: Active: 0.78A / 3.891W; Idle: 0.005A / 0.026W

Mean Time Between Failure

1,500,000 hours
(MTBF)

Environmental Operating Temperature: 32° to 158° F (0° to 70° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%

Shock: 1,500 G/0.5 ms

HP 128 GB 2.5” (non-SED) Solid State Drive*

Unformatted Capacity 128 GB*

Architecture Multi Level Cell (MLC) NAND

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Interface SATA 6 GB/sec

Dimensions (W x H x D) 2.75 x 0.276 x 3.96 in (6.985 x 0.7 x 10.05 cm)

Weight 0.16 lb (73 g)

Sustained Sequential Read: Up to 450 MB/ss

Sustained Sequential Write: Up to 260 MB/s

Bandwidth Performance
Random Read (4KB): up to 46K IOPs

Random Write (4KB): up to 56K IOPs

Read: 55ms (TYP)

Latency
Write: 55ms (TYP)

DC power requirement: Min 4.5 V; Max 5.5 V

Power
Total power consumption: 160 mW (Active) ; <85 mW; (Idle)

Useful Drive Life 1.2 million device hours**

Operating Temperature: 32° to 158° F (0° to 70° C)

Environmental
Relative Humidity (operating): 5% to 95%
(all conditions, non-condensing)
Shock: 1,500 G/1.0 msec
UL, CSA, EN 60950-2000, CISPR Pub 22 Class B, CNS 13438, AS/NZS
Regulations
CISPR 22:2002 Class B, Korea KCC, CE Mark
*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
16 GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

Intel® Pro 2500 180 GB Solid State Drive*

Unformatted Capacity 180 GB*
Architecture Multi Level Cell (MLC) NAND
Interface SATA 3.0 (6.0 Gb/s)
Dimensions (W x H x D) 6.98 x 0.7 x 10.05 cm
Weight 78 g
Bandwidth Performance Sustained Sequential Read: Up to 540 MB/s
Sustained Sequential Write: Up to 490 MB/s

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Technical Specifications – Hard Disk and Solid State Storage

Random Read (4KB): up to 41K IOPs
Random Write (4KB): up to 80K IOPs
Latency Read: 80 us
Write: 85 us
Power DC power requirement: 5 VDC 5%-100 mV ripple p-p
Total power consumption: 195 mW (Active); 55 mW (Idle)
Useful Drive Life 72TB written, up to 40GB/day for 5 years **
Environmental
(all conditions, non-
condensing) Operating Temperature: 32° to 158° F (0° to 70° C)
Relative Humidity (operating): 5% to 95%
*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16
GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

180 GB SATA Opal2 SED SSD (Intel® Pro 2500)*

Formatted Capacity 180 GB

Architecture Solid State Drive with SATA interface; ATA 8 Compliant and SATA 3.0 compliant

Interface Serial ATA 3 (6.0 Gb/s)

Form Factor 2.5 inch

Height 7 mm ± 0.5

Width 69.85 mm ± 0.25

Length 100.45 mm Max

Weight (typical) Up to 78 g

Data Transfer Rate Sequential Read Up to 540 MB/s

(128k Sequential )
Sequential Write Up to 490 MB/s

Power-Up: 6W (max)
Read: <3.7W
Power consumption
Power Watts Write: 3.7W
(avg):
Standby: <55mW
DEVSLP: <7mW

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Technical Specifications – Hard Disk and Solid State Storage

Environmental Operating Temperature:

32° to 158° F (0° to 70° C)
(all conditions, non-condensing)

Relative Humidity: 5% to 95%

Shock: 1500 G Max - operating (operating)

*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
16 GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

HP 1TB 7.2K SATA 6.0Gb/s 2.5” Hard Disk Drive

Capacity 1,000,204,886,016 bytes

Rotational Speed 7,200 rpm

Interface SATA 6 Gb/s

Buffer Size 32 MB

Logical Blocks 1,953,525,168

Single Track: 2.0 ms

Seek Time (typical reads, includes Average: 12 ms
controller overhead, including settling)

Full-Stroke: 25 ms

Height (nominal) 0.374 in/9.5 mm

Media diameter: 2.5 in/63.5 mm

Width (nominal)
Physical size: 2.75 in/70 mm

Operating Temperature 41° to 131° F (5° to 55° C)

HP 1-TB SATA 6G 3.5” 8GB Solid State Hybrid Drive (SSHD)

Formatted Capacity 1 TB

Spindle Speed 7,200 rpm

Drive Type Solid State Hybrid Drive (SSHD) technology with NAND Flash

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Technical Specifications – Hard Disk and Solid State Storage

Interface Serial ATA (SATA)

Cache Buffer 64 MB

NAND Flash
Commercial Multilevel Cell 8 GB
(cMLC)

Number of Sectors 1,953,525,168

Single Track: 2.0 ms

Seek Time (typical reads)
Average: 11 ms

Height 0.783 in / 2.01 cm

Width 4 in / 10.2 cm

Length 5.79 in / 14.7 cm

Weight 0.88 lb/400 g

Operating Temperature 41° to 131° F (5° to 55° C)

HP 1 TB* 7.2K rpm SATA 6.0Gb/s 3.5" Hard Disk Drive

Formatted Capacity 1,000,204,886,016 bytes
Rotational Speed 7,200 rpm
Interface Serial ATA 3.0 (6.0 Gb/s)
Buffer Size 16 MB
Logical Blocks 1,953,525,168

Single Track: 2.0 ms

Seek Time (average) Average: 11 ms
Full-Stroke: 21 ms
Height (nominal) 1 in/2.54 cm
Media diameter: 3.5 in/8.89 cm
Width (nominal)
Physical size: 4 in/10.2 cm
Operating
41° to 131° F (5° to 55° C)
Temperature
* For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16 GB
(for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

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Technical Specifications – Hard Disk and Solid State Storage

HP 1 TB* SATA 6G 2.5" 8GB Solid State Hybrid Drive (SSHD)*

Formatted Capacity 1 TB
Spindle Speed 5,400 rpm +/- 0.2%
Drive Type Solid State Hybrid Drive (SSHD) technology with NAND Flash
Interface SATA 6 Gb/s
Cache Buffer 64 MB
NAND Flash 8 GB
Commercial Multilevel Cell
(cMLC)
Number of Sectors 976,773,168
Single Track: 2.0 ms
Seek Time (typical reads)
Average: 12 ms
Height 0.374 +/-.008 in (9.5 +/- 0.2 mm)
Width 2.750 +/- 0.010 in (69.85 +/- 0.25 mm)
Length 3.951 +0.008 / -0.010 in (100.35 +0.20 / -0.25 mm)
Weight 0.254 lb/115 g (max)
Operating Temperature 32° to 140° F (0° to 60° C)
* For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16 GB
(for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

256GB SATA 2.5” 3D Non-SED Solid State Drive

256 GB
Unformatted Capacity
500,118,192 (User Addressable Sectors)

Solid State Drive with NAND Flash and SATA interface.

Fully complies with ATA/ATAPI-7 Standard (Partially Complies with ATA/ATAPI-8)
Architecture Power Saving Modes: DIPM (Partial / Slumber mode)
Support NCQ : Up to 32 depth
Synchronous Signal Recovery

Interface Serial ATA (6.0 Gb/s)

Form Factor 2.5 inch

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Technical Specifications – Hard Disk and Solid State Storage

Height 6.80 mm ± 0.20

Width 69.85 mm ± 0.25

Length 100.20 mm ± 0.25

Weight Up to 54 g

Bandwidth Performance Sustained Sequential

Up to 540 MB/s
Read:

Sustained Sequential
Up to 280 MB/s
Write:

Power Power consumption: Active: Typical 250mW; Idle: Typical 50mW

Mean Time Between Failure (MTBF) 1,500,000 hours

Environmental Operating Temperature: 32° to 158° F (0° to 70° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%

Shock: 1,500 G/0.5 ms

256GB SATA 2.5” Opal2 SED Solid State Drive

256 GB
Unformatted Capacity
500,118,192 (User Addressable Sectors)

Self-Encrypting (SED) Solid State Drive with MLC NAND Flash and SATA interface.
Architecture
Trusted Computing Group(TCG) OPAL2.0 compliant encrypted solid state drive

Interface Serial ATA (6.0 Gb/s)

Form Factor 2.5 inch

Height 6.80 mm ± 0.20

Width 69.85 mm ± 0.25

Length 100.20 mm ± 0.25

Weight Up to 73 g

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Technical Specifications – Hard Disk and Solid State Storage

Bandwidth Performance Sustained

Sequential Up to 520 MB/s
Read:

Sustained
Sequential Up to 460 MB/s
Write:

Power
Power Active average: 3.891W; Idle: 0.085W
consumption:

Mean Time Between Failure (MTBF) 1,500,000 hours

Environmental Operating Temperature: 32° to 158° F (0° to 70° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%

Shock: 1,500 G/0.5 ms

256GB SATA 2.5” Non-SED Solid State Drive

256 GB
Unformatted Capacity
500,118,192 (User Addressable Sectors)

Architecture Solid State Drive with MLC NAND Flash and SATA interface.

Interface Serial ATA (6.0 Gb/s)

Form Factor 2.5 inch

Height 6.80 mm ± 0.20

Width 69.85 mm ± 0.25

Length 100.20 mm ± 0.25

Weight Up to 73 g

Bandwidth Performance Sustained

Sequential Up to 520 MB/s
Read:

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Technical Specifications – Hard Disk and Solid State Storage

Sustained
Sequential Up to 460 MB/s
Write:

Power
Power Active average: 3.891W; Idle: 0.085W
consumption:

Mean Time Between Failure (MTBF) 1,500,000 hours

Environmental Operating Temperature: 32° to 158° F (0° to 70° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%

Shock: 1,500 G/0.5 ms

HP 2 TB* 7.2K rpm SATA 6.0Gb/s 3.5" Hard Disk Drive

Formatted Capacity 2 TB

Rotational Speed 7,200 rpm

Interface SATA 6Gb/s NCQ

Cache, 64 MB
Multisegmented
(MB)
Read <8.5 ms
Seek Time (average)
Write <9.5 ms

Height 1.028 in/26.11 mm

Width 4.0 in/101.6 mm

Depth 5.787 in/146.99 mm
Weight 1.38 lb/626 g
Operating
Temperature 32° to 140° F (0° to 60° C)

* For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16 GB
(for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

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Technical Specifications – Hard Disk and Solid State Storage

HP 500 GB 7.2K SATA 6.0Gb/s 2.5” Hard Disk Drive

Capacity 500,107,862,016 bytes

Rotational Speed 7,200 rpm

Interface SATA 6 Gb/s

Buffer Size 16 MB

Logical Blocks 976,773,168

Single Track: 2.0 ms

Seek Time (typical reads,
includes controller overhead, Average: 12 ms
including settling)
Full-Stroke: 25 ms

Height (nominal) 0.267 in/6.8 mm

Media diameter: 2.5 in/63.5 mm

Width (nominal)
Physical size: 2.75 in/70 mm

Operating Temperature 41° to 131° F (5° to 55° C)

500GB* 7.2K rpm SATA 6.0Gb/s 3.5" Hard Disk Drive

Formatted Capacity 500,107,862,016 bytes
Spindle Speed 7,200 rpm
Interface Serial ATA 3.0 (6.0 Gb/s)
Buffer Size 16 MB
Logical Blocks 976,773,168

Single Track: 2.0 ms

Seek Time (average) Average: 11 ms

Full-Stroke: 21 ms
Height (nominal) 1 in/2.54 cm
Media diameter: 3.5 in/8.89 cm
Width (nominal)
Physical size: 4 in/10.2 cm
Operating Temperature 41° to 131° F (5° to 55° C)

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Technical Specifications – Hard Disk and Solid State Storage

*For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16 GB (for
Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

HP 500 GB SATA 6G 2.5” 8GB Solid State Hybrid Drive (SSHD)*

Formatted Capacity 500 GB

Spindle Speed 5,400 rpm +/- 0.2%

Drive Type Solid State Hybrid Drive (SSHD) technology with NAND Flash

Interface SATA 6 Gb/s

Cache Buffer 64 MB

NAND Flash
Commercial Multilevel Cell 8 GB
(cMLC)

Number of Sectors 976,773,168

Single Track: 2.0 ms

Seek Time (typical reads)
Average: 12 ms

Height 0.268 +/-.008 in (6.8 +/- 0.2 mm)

Width 2.750 +/- 0.010 in (69.85 +/- 0.25 mm)

Length 3.951 +0.008 / -0.010 in (100.35 +0.20 / -0.25 mm)

Weight 0.209 lb/95 g (max)

Operating Temperature 41° to 131° F (5° to 55° C)

*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
16 GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

512 GB SATA 2.5” 3D Solid State Drive* (Pending specifications)

Formatted Capacity 512 GB

Architecture

Interface

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Technical Specifications – Hard Disk and Solid State Storage

Form Factor

Height

Width

Length

Weight (typical)

Data Transfer Rate Sequential Read

(128k Sequential )
Sequential Write

Power consumption
Power Watts
(avg):

Environmental Operating Temperature:

(all conditions, non-condensing)
Relative Humidity:

Shock (0.5 mSec half-sine):

*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16
GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

HP 128 GB Turbo Drive SSD-M.2 PCIe Card*

Unformatted Capacity 128 GB*

Interface M.2 PCIe x4 Gen 2

Architecture Solid State Drive M.2 PCIe Gen 2 x4 AHCI; NCQ Command Set

Form Factor M.2 2280

Dimensions
.899 x 3.149 x .146 in (22 x 80 x 3.73 mm)
(Width x Length x Thickness)

Weight 0.017 lb (8 g) Max

Sustained Sequential Read (128KB): Up to 920 MB/ss

Bandwidth Performance -
Performance measured using
Sustained Sequential Write (128KB): Up to 430 MB/s
IOMeter 2008 on Windows 8
64bit. Actual performance may
Random Read (4KB): up to 8500 IOPs
vary depending on use conditions
and environment.
Random Write (4KB): up to 32000 IOPs

Power Allowable voltage 3.3V ± 5%

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Technical Specifications – Hard Disk and Solid State Storage

Total power consumption: 5.8 W (Active) ; 80 mW; (Idle)

MTBF 1.5 M hours

Operating Temperature: 32° to 158° F (0° to 70° C)

Environmental
Relative Humidity (operating): 5% to 95%
(all conditions, non-condensing)
Shock: 1,500 G
Safety TUV UL CB c-UL-us
TUV

UL CB
Regulations
c-UL-us

TUV
EMC/EMI
CE (EU)

BSMI (Taiwan)

KCC (South Korea)

VCCI (Japan)

C-Tick (Austrailia)

FCC (USA)
*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to
16 GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

HP 256 GB Turbo Drive SSD-M.2 PCIe Card*

Formatted Capacity 256 GB

Architecture Solid State Drive M.2 PCIe Gen 2 x4 AHCI; NCQ Command Set

Interface M.2 PCIe Gen 2 x4

Form Factor M.2 2280

Height 7 mm ± 0.20

Width .8 mm ± 0.08

Length 50 mm ± 0.15

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Technical Specifications – Hard Disk and Solid State Storage

Weight (typical) Up to 10 g

Data Transfer Rate Sequential Read Up to 2150 MB/s

(128k Sequential )
Sequential Write Up to 1200 MB/s

Power-Up: N/A
Read: 4 W
Power consumption
Power Watts Write: 5.1 W
(avg):
Standby: 700 mW
Idle: 70 mW

Environmental Operating Temperature: 32° to 158° F (0° to 70° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%

Shock (Linear 2 m/Sec half-sine): 1000 G peak (operating)

*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16
GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

HP 512GB Turbo Drive G2 SSD-M.2 PCIe Card*

Formatted Capacity 512,288 MB

Solid State Drive M.2 PCIe Gen 3 x4 NVMe;

Architecture
NVMe 1.1a Compliant

Interface M.2 PCIe Gen 3 x4 NVMe

Form Factor M.2 2280 DS

Height 22 mm ± 0.16

Width .8 mm ± 0.08

Length 50 mm ± 0.15

Weight (typical) Up to 10 g

Data Transfer Rate Sequential Read Up to 2150 MB/s

(128k Sequential )
Sequential Write Up to 1550 MB/s

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Technical Specifications – Hard Disk and Solid State Storage

Power-Up: N/A
Read: 4.3 W
Power consumption
Power Watts Write: 6.5 W
(avg):
Standby: 700 mW
Idle: 70 mW

Environmental Operating Temperature: 32° to 158° F (0° to 70° C)

(all conditions, non-condensing)
Relative Humidity: 5% to 95%

Shock (Linear 2 m/Sec half-sine): 1000 G peak (operating)

*NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16
GB (for Windows 7) and 36 GB (for Windows 8.1/10) of system disk is reserved for the system recovery software.

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Technical Specifications – Optical Drives

OPTICAL DRIVES
HP Slim SuperMulti DVD Writer Drive
Height 12.7mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.04 x 0.5 x 5.0 in (128 x 12.7 x 127 mm) without bezel

Weight (max) 0.42 lb (190 g)

DVD-RAM Up to 5X
DVD-R DL Up to 6X
DVD+R Up to 8X
DVD+RW Up to 8X
Write speeds DVD+R DL Up to 6X
DVD-R Up to 8X
DVD-RW Up to 6X
CD-R Up to 24X
CD-RW Up to 24X
DVD-RAM Up to 5X
DVD-RW, DVD+RW Up to 8X
DVD-R DL, DVD+R DL Up to 8X
Read speeds DVD+R, DVD-R Up to 8X
DVD-ROM DL, DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
Access time
(typical reads, including Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling)
Stop Time 6 seconds (typical)
Source Slimline SATA DC power receptacle
Power DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)

Environmental conditions Temperature 41° to 122° F (5° to 50° C)

(operating - non-condensing) Relative Humidity 10% to 80%

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Technical Specifications – Optical Drives

Maximum Wet Bulb 84° F (29° C)
Temperature

HP Slim Blu-ray BDXL Drive

Height 12.7mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc recording capacity Up to 128 GB QL, 100 GB TL, 50 GB DL or 25 GB standard SL
Dimensions (W x H x D) 5.04 x 0.5 x 5.0 in (128 x 12.7 x 127 mm) without bezel
Weight (max) Up to 0.37 lb (170 g) without bezel
Triple-layer Quadruple-layer
BD-R Up to 4X Up to 4X
BD-RE Up to 2X Not supported
Single-layer Double-layer
BD-R Up to 6X Up to 6X
BD-RE Up to 2X Up to 2X
DVD-R Up to 8X Up to 6X
DVD-RW Up to 6X Not supported
DVD+R Up to 8X Up to 6X
DVD+RW Up to 8X Not supported
Write speeds
DVD-RAM Up to 5X
CD-R Up to 24X
CD-RW Up to 24X
Triple-layer Quadruple-layer
BD-R Up to 4X Up to 4X
BD-RE Up to 4X Not supported
Single-layer Double-layer
BD-ROM Up to 6X Up to 6X
BD-R Up to 6X Up to 6X
BD-RE Up to 6X Up to 6X
DVD-ROM Up to 8X Up to 8X
Read speeds
DVD-R Up to 8X Up to 8X
DVD-RW Up to 8X

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Technical Specifications – Optical Drives

DVD+R Up to 8X Up to 8X
DVD+RW Up to 8X
BDMV (AACS Compliant Disc) Up to 6X/2X (Read/Play)
DVD-RAM Up to 5X
DVD-Video (CSS Compliant Up to 8X/4X (Read/Play)
Disc)
CD-R/RW/ROM Up to24X
CD-DA(DAE) Up to 20X/10X (Read/Play)
Random BD-ROM: 205 ms (typical), DVD-ROM: 185 ms (typical),
Access time CD-ROM: 165 ms (typical)
(typical reads, including
settling) Full Stroke BD-ROM: 350 ms (typical), DVD-ROM: 345 ms (typical),
CD-ROM: 340 ms (typical)

Source Slimline SATA DC power receptacle

Power DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p

DC Current 5 VDC -1200 mA typical, 2000 mA maximum

Temperature 41° to 122° F (5° to 50° C)
Environmental conditions Relative Humidity 10% to 80%
(operating - non-condensing)
Maximum Wet Bulb 84° F (29° C)
Temperature

HP Slim DVD-ROM Drive

Height 12.7mm
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Dimensions (W x H x D) 5.04 x 0.5 x 5.0 in (128 x 12.7 x 127 mm) without bezel
Weight (max) Up to 0.37 lb (170 g) without bezel
DVD+R/-R/+RW/ Up to 8X
-RW/+R DL /-R DL

Read speeds DVD-ROM Up to 8X

CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Access time Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including
settling) Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)

Power Source Slimline SATA DC power receptacle

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Technical Specifications – Optical Drives

DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC - <1000 mA typical, < 1600 mA maximum
Temperature 41° to 122° F (5° to 50° C)
Environmental (all conditions Relative Humidity 10% to 80%
non-condensing)
Maximum Wet Bulb 84° F (29° C)
Temperature (operating)

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Technical Specifications – Memory

SYSTEM MEMORY SUPPORT

The HP Elite 800 G2 Business PC supports the 6th generation Intel® Core™ processor family. Based on a new PC micro-architecture,
the processor is designed for a two-chip platform consisting of a processor and Platform Controller Hub (PCH). Unlike previous
generations, the 6th generation Intel® Core™ processor includes an Integrated Memory Controller (IMC). The IMC supports DDR4
protocols with two independent, 64-bit wide channels each accessing one or two DIMMs.

 Two channels of non-ECC DDR4 unbuffered dual in-line memory modules (UDIMM) or DDR4 unbuffered small outline dual
in-line memory modules (SO-DIMM) with a maximum of two DIMMs per channel
 Single-channel and dual-channel memory organization modes
 Data burst length of eight for all memory organization modes
 Memory data transfer rates of up to 2133 MT/s; actual supported data transfer rate determined by the configured
processor.
 64-bit wide channels
 DDR4 system memory I/O voltage of 1.2V
 Theoretical maximum memory bandwidth of:
o 34 GB/s in dual-channel mode assuming 2133 MT/s

PLATFORM MEMORY SUPPORT

 The Small Form Factor (SFF) and Tower (TWR) platforms support up to four (4) industry-standard DDR4-SDRAM DIMMs.

 The Desktop Mini (DM) supports up to two (2) industry-standard DDR4-SDRAM SO-DIMMs.

 The All-in-One (AiO) platform supports up to two (2) industry-standard DDR4-SDRAM SO-DIMMs.

CAUTION: You must shut down the computer and disconnect the power cord before adding or removing memory modules.
Regardless of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged in to an
active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the memory
modules or system board.

NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available
due to system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.

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Technical Specifications – Networking and Communications

NETWORKING AND COMMUNICATIONS

Intel® I219LM Gigabit Network Connection LOM (standard)

Connector RJ-45

System Interface PCIe + SMBus

Controller Intel® I219LM Gigabit Ethernet Controller

Data rates supported Supports operation at 10/100/1000 Mb/s data rates

IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASETX, and 10BASET applications
IEEE Compliance
(802.3ab, 802.3u, and 802.3i, respectively).
EEE 802.3az support [Low Power Idle (LPI) mode]
IEEE 802.3u auto-negotiation conformance
Performance Jumbo Frames (up to 9 kB)
802.1Q & 802.1p
Receive Side Scaling (RSS)
Two Queues (Tx & Rx)
 Ultra Low Power at cable disconnect (<1 mW) enables platform support for connected
Power
standby
 Reduced power consumption during normal operation and power down modes
 Integrated Intel® Auto Connect Battery Saver (ACBS)
 Single-pin LAN Disable for easier BIOS implementation
 Fully integrated Switching Voltage Regulator (iSVR)
 Low Power Link-Up (LPLU)

 PCIe-based interface for active state operation (S0 state)

MAC/PHY Interconnect
 SMBus-based interface for host and management traffic (Sx low power state)

Management Interface  MDC/MDIO management interface

Security & Manageability  Intel® vPro™ support with appropriate Intel chipset components

Intel® Ethernet I210-T1 Gigabit Network Adapter

Connector RJ-45

System Interface PCI Express x1

Controller Intel® I210 Gigabit Ethernet Controller

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Technical Specifications – Networking and Communications

Memory Integrated Dual 48K configurable transmit receive FIFO Buffers

Data rates supported 10/100/1000 Mbps

802.1P
802.1Q
802.2
IEEE Compliance 802.3
802.3AB
802.3u
802.3x flow control

Bus architecture PCI-E 2.1

Data path width X1, 250 MB/s, Bi-directional interface

Data transfer mode Bus-master DMA

Hardware certifications FCC, B, CE, TUV-c, TUVus Mark Canada and United States, TUV-GS Mark for European Union

Power requirement Aux 3.3 V, 3.0 Watts in 1000 base-T and 1.0 Watts in 100 Base-T

Yes
Boot ROM support 10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps

10BASE-T (half-duplex) 10 Mbps

10BASE-T (full-duplex) 20 Mbps

Network transfer rate 100BASE-TX (half-duplex) 100 Mbps

100BASE-TX (full-duplex) 200 Mbps

1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI bus)

Operating Temperature: 32° to 132° F (0° to 55° C )

Environmental
Operating Humidity: 85% at 131° F (55° C)

Management WOL, PXE, DMI, WFM 2.0

Broadcom BCM943228Z 802.11n 2x2 DualBand Combo PCIe x1 Card*

Wireless LAN IEEE 802.11a
Standards IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Interoperability Wi-Fi certified

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Technical Specifications – Networking and Communications

Frequency Band 802.11b/g/n
 2.402 – 2.482 GHz
Note:
The FCC has declared as of January 1, 2015 products that utilize passive scanning
on channel 12/13 and are capable of transmitting must fully comply with
requirements of 15.247 or otherwise disable those channels.
802.11a/n
 4.9 - 4.95 GHz (Japan)
 5.15 - 5.25 GHz
 5.25 - 5.35 GHz
 5.47 - 5.725 GHz
5.825 - 5.850 GHz
Note: Indonesia no support this band)
Antenna Structure 2 transmit; 2 receive (2x2)
Data Rates 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)

Modulation Direct Sequence Spread Spectrum

CCK, BPSK, QPSK, 16-QAM, 64-QAM
Security1  IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
 AES-CCMP: 128 bit in hardware
 802.1x authentication
 WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
 WPA2 certification
 IEEE 802.11i
 Cisco Certified Extensions, all versions through CCX4 and CCX Lite
 WAPI
Sub-channels Multinational support with frequency bands and channels compliant to local
regulations.
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between band Access Points
Output Power2  802.11b : +16dBm minimum
 802.11g : +14dBm minimum
 802.11a : +14dBm minimum
 802.11n HT20(2.4GHz) : +13dBm minimum
 802.11n HT40(2.4GHz) : +13dBm minimum
 802.11n HT20(5GHz) : +12dBm minimum
 802.11n HT40(5GHz) : +12dBm minimum
Power Consumption Transmit: 2.0 W (max)
Receive: 1.6 W (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 802.11b, 1Mbps : -94dBm maximum
802.11b, 11Mbps : -86dBm maximum
802.11g, 6Mbps : -88dBm maximum

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802.11g, 54Mbps : -74dBm maximum
802.11a, 6Mbps : -86dBm maximum
802.11a, 54Mbps : -72dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support
WLAN MIMO and Bluetooth® communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Or
Type 1630 : 2.3 x 16.0 x 30.0 mm
Weight Type 2230 : 2.8g
Or
Type 1630 : 2g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (-10° to 70° C)
Non-operating -40° to 176° F (-40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber - Radio OFF; LED White - Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. In Power Save Polling mode and on battery power.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CCK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
5. WLAN supplier's client utility is required for Cisco Compatible Extensions support with Microsoft Windows XP. WLAN may also
be compatible with certain third-party software supplicants. WLAN supplier IHV extensions required for Cisco Compatible
Extensions support for Microsoft Windows Vista.
HP Integrated Module with Bluetooth® 4.0+EDR Wireless Technology
Bluetooth® Specification 4.0+EDR Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Channels 79 (1 MHz) available channels
Data Rates and Throughput 3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric or
1306.9 kbps symmetric
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth® device with a
maximum transmit power of +4 dBm for BR and EDR.
Receiver Sensitivity Modulation 0.01% BER 0.001% BER
GFSK -80 dBm -70 dBm
π/4-DQPSK -80 dBm -70 dBm
8DPSK -80 dBm -70 dBm
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Range Up to 33 ft (10 m)
Electrical Interface USB 2.0 compliant

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Bluetooth® Software Supported Microsoft Windows Bluetooth® Software
Link Topology
Electrical Interface Point to Point, Multipoint Pico Nets up to 7 slaves
Bluetooth® Software Supported Full support of Bluetooth® Security Provisions
Security
Power Management Microsoft Windows ACPI, and USB Bus Support
Power Management Self-configurable to optimize power conservation in all operating modes,
Certifications including Standby, Hold, Park, and Sniff
Security All necessary regulatory approvals for supported countries, including:
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Bluetooth® Profiles Supported
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Serial Port Profile (SPP)1
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)1,2
Generic Object Exchange Profile (GOEP)1,2
Object Push Profile (OPP)1,2
Certifications File Transfer Profile (FTP)
Bluetooth® Profiles Supported Synchronization Profile (SYNC)
Hard Copy Cable Replacement (HCRP)1,2
Personal Area Networking Profile (PAN)1,2
Human Interface Device Profile (HID)1,2
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
*Wireless access point and internet access required. The specifications for the 802.11ac WLAN are draft specifications and are not
final. If the final specifications differ from the draft specifications, it may affect the ability of the notebook to communicate with
other 802.11ac WLAN devices.

Intel 7265 802.11ac 2x2 DualBand Combo PCIe x1 Card

Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Interoperability Wi-Fi certified
Frequency Band 802.11b/g/n
 2.402 – 2.482 GHz
Note:
The FCC has declared as of January 1, 2015 products that utilize
passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or
otherwise disable those channels.
802.11a/n
 4.9 – 4.95 GHz (Japan)

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Technical Specifications – Networking and Communications

 5.15 – 5.25 GHz
 5.25 – 5.35 GHz
 5.47 – 5.725 GHz
 5.825 – 5.850 GHz
Note: Indonesia no support this band)

Data Rates  802.11b: 1, 2, 5.5, 11 Mbps

 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz,
and 80MHz)

Modulation Direct Sequence Spread Spectrum

BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security1  IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g
mode only
 AES-CCMP: 128 bit in hardware
 802.1x authentication
 WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
 WPA2 certification
 IEEE 802.11i
 Cisco Certified Extensions, all versions through CCX4 and CCX
Lite
 WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2  802.11b : +16dBm minimum
 802.11g : +14dBm minimum
 802.11a : +14dBm minimum
 802.11n HT20(2.4GHz) : +13dBm minimum
 802.11n HT40(2.4GHz) : +13dBm minimum
 802.11n HT20(5GHz) : +12dBm minimum
 802.11n HT40(5GHz) : +12dBm minimum
 802.11ac 80MHz(5GHz) : +11dBm minimum
Power Consumption Transmit: 2.0 W (max)
Receive: 1.6 W (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3 802.11b, 1Mbps : -94dBm maximum
802.11b, 11Mbps : -86dBm maximum
802.11g, 6Mbps : -88dBm maximum
802.11g, 54Mbps : -74dBm maximum
802.11a, 6Mbps : -86dBm maximum
802.11a, 54Mbps : -72dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
802.11ac, 1SS, MCS-0 : -86dBm maximum
802.11ac, 1SS, MCS-9 : -61dBm maximum

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Technical Specifications – Networking and Communications

802.11ac, 2SS, MCS-0 : -83dBm maximum
802.11ac, 2SS, MCS-9 : -58dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the
display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the
card to support WLAN MIMO communications and Bluetooth®
communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Or
Type 1630 : 2.3 x 16.0 x 30.0 mm
Weight Type 2230 : 2.8g
Or
Type 1630 : 2g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and
a packet error rate of 10% for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth® 4.0+EDR Wireless Technology
Bluetooth® Specification 4.0+EDR Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Channels 79 (1 MHz) available channels
Data Rates and Throughput 3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric or 1306.9 kbps symmetric
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth
device with a maximum transmit power of +4 dBm for BR and EDR.
Receiver Sensitivity Modulation 0.01% BER 0.001% BER
GFSK -80 dBm -70 dBm
π/4-DQPSK -80 dBm -70 dBm
8DPSK -80 dBm -70 dBm
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Range Up to 33 ft (10 m)
Electrical Interface USB 2.0 compliant
Bluetooth® Software Supported Microsoft Windows Bluetooth® Software
Link Topology
Electrical Interface Point to Point, Multipoint Pico Nets up to 7 slaves
Bluetooth® Software Supported Full support of Bluetooth® Security Provisions
Security

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Technical Specifications – Networking and Communications

Power Management Microsoft Windows ACPI, and USB Bus Support
Power Management Self-configurable to optimize power conservation in all operating
Certifications modes, including Standby, Hold, Park, and Sniff
Security All necessary regulatory approvals for supported countries,
including:
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Bluetooth® Profiles Supported
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Serial Port Profile (SPP)1
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)1,2
Generic Object Exchange Profile (GOEP)1,2
Object Push Profile (OPP)1,2
Certifications File Transfer Profile (FTP)
Bluetooth® Profiles Supported Synchronization Profile (SYNC)
Hard Copy Cable Replacement (HCRP)1,2
Personal Area Networking Profile (PAN)1,2
Human Interface Device Profile (HID)1,2
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)

Intel® 8260 2x2 Dual Band 802.11ac WLAN/ Bluetooth® Combo*

Wireless LAN Standards IEEE 802.11 ac/a/b/g/n

Interoperability Wi-Fi certification

WLAN + Bluetooth® Combo M.2 Card device shall meet all of the requirements to
support Bluetooth® 4.1 and backwards compatible with 2.1 with EDR

Frequency Band 802.11b/g/n 2.402-2.482 GHz

802.11a/n/ac 4.9 – 4.95 GHz (Japan)

5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz (Note: Indonesia does not support this
band)

Antenna Interface With antennas installed in the system, the antenna peak gain is less than +3dBi in the
2.4GHz band and less than +4dBi in the 5GHz band to allow the device to meet
regulatory limits.

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Data Rates  802.11b: 1, 2, 5.5, 11 Mbps

 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
 802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20
and 40 MHz channels. Short and long guard interval shall be supported.
 802.11ac: card will support rates for NSS=1 and NSS=2 for RX and TX for 80
MHz channels. 433Mbps for 1x1 and 867Mbps for 2x2.

Security  IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
 AES-CCMP: 128 bit in hardware
 802.1x authentication
 WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
 WPA2 certification
 IEEE 802.11i
 Cisco Certified Extensions, all versions through V5
 WAPI

Note: Check latest software/driver release for updates on supported security

features.

Roaming 802.11r Fast Roaming

Output Power (Transmitting)  802.11b: +16dBm minimum

 802.11g: +14dBm minimum
 802.11a: +14dBm minimum
 802.11n HT20 (2.4GHz) : +14dBm minimum
 802.11n HT40 (2.4GHz) : +12dBm minimum
 802.11n HT20 (5GHz) : +14dBm minimum
 802.11n HT40 (5GHz) : +12dBm minimum
 802.11ac 80MHz (5GHz) : +12dBm minimum

Notes:
1. RF Tx power have to meet minimum criteria and with +1.5dBm tolerance but -
1.5dBm.
2. RF Parameter will be verified by R&S CMW500 via link mode. .

Power Consumption Transmit: 2.0 Watts

Receive: 1.6 Watts

Idle mode (PSP): 180 mW (WLAN associated)

Idle mode: 50 mW (WLAN unassociated)

Connect Standby 10mW (WLAN+BT)

Radio off: 5 mW

Bluetooth® Power Consumption Peak operating: 330 mW

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Technical Specifications – Networking and Communications

Receive: 230 mW

USB selective suspend: 17 mW

Power Management The product conforms to the ACPI and PCI Express M.2 bus methods to manage power
of the WLAN components.

Supports all 802.11 compliant power-save modes. These include the basic Power
Save Polling (PSP) in 802.11 and Automatic Power Save Delivery (APSD) defined in
802.11e.

Receiver Sensitivity for FER <10% 802.11b, 1Mbps: -94dBm maximum

802.11b, 11Mbps: -86dBm maximum
802.11a/g, 6Mbps: -88dBm maximum
802.11a/g, 54Mbps : -74dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
802.11ac, 1SS, MCS-0 : -86dBm maximum
802.11ac, 1SS, MCS-9 : -61dBm maximum
802.11ac, 2SS, MCS-0 : -83dBm maximum
802.11ac, 2SS, MCS-9 : -58dBm maximum

Note:
1. Rx sensitivity have to meet maximum criteria and with -1.5dBm tolerance but
+1.5dBm.
2. Note: RF Parameter will be verified by R&S CMW500 via link mode.

Form Factors PCI Express M.2 form factor

Operating Voltage The card will be powered by a 3.3V, ± 9% supply from the host system.

Temperature Operating: 14° to 158° F (-10° to 70° C)

Non-operating: -40° to 176° F (-40° to 80° C)

Humidity Operating: 10% to 90% (non-condensing)

Non-operating: 5% to 95% (non-condensing)

Altitude Operating: 0 to 10,000 ft (3,048 m)

Non-operating: 0 to 50,000 ft (15,240 m)

* Wireless access point and Internet service required and not included. Availability of public wireless access points limited.

Intel® 3165 1x1 Dual Band 802.11ac WLAN/ Bluetooth® Combo*

Wireless LAN Standards IEEE 802.11 ac/a/b/g/n

Interoperability Wi-Fi certification

WLAN + Bluetooth® Combo M.2 Card device shall meet all of the requirements to support
Bluetooth® 4.1 and backwards compatible with 2.1 with EDR

Frequency Band 802.11b/g/n 2.402-2.482 GHz

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Technical Specifications – Networking and Communications

802.11a/n/ac 4.9 – 4.95 GHz (Japan)

5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz (Note: Indonesia does
not support this band)

Antenna Interface With antennas installed in the system, the antenna peak gain is less than +3dBi in the
2.4GHz band and less than +4dBi in the 5GHz band to allow the device to meet regulatory
limits.

Data Rates  02.11b: 1, 2, 5.5, 11 Mbps

 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
 802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20 and 40
MHz channels. Short and long guard interval shall be supported.
 802.11ac: card will support rates for NSS=1 and NSS=2 for RX and TX for 80 MHz
channels. 433Mbps for 1x.

Security  I IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
 AES-CCMP: 128 bit in hardware
 802.1x authentication
 WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
 WPA2 certification
 IEEE 802.11i
 Cisco Certified Extensions, all versions through V5
 WAPI

Note: Check latest software/driver release for updates on supported security features.

Roaming 802.11r Fast Roaming

Output Power (Transmitting)  802.11b: +16dBm minimum

 802.11g: +14dBm minimum
 802.11a: +14dBm minimum
 802.11n HT20 (2.4GHz) : +14dBm minimum
 802.11n HT40 (2.4GHz) : +12dBm minimum
 802.11n HT20 (5GHz) : +14dBm minimum
 802.11n HT40 (5GHz) : +12dBm minimum
 802.11ac 80MHz (5GHz) : +12dBm minimum

Notes:
1. RF Tx power have to meet minimum criteria and with +1.5dBm tolerance but -
1.5dBm.
2. RF Parameter will be verified by R&S CMW500 via link mode.

Power Consumption Transmit: 2.0 Watts

Receive: 1.6 Watts

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Technical Specifications – Networking and Communications

Idle mode (PSP): 180 mW (WLAN associated)

Idle mode: 50 mW (WLAN unassociated)

Connect Standby 10mW (WLAN+BT)

Radio off: 5 mW

Bluetooth® Power Peak operating: 330 mW

Consumption
Receive: 230 mW

USB selective suspend: 17 mW

Power Management The product conforms to the ACPI and PCI Express M.2 bus methods to manage power of the
WLAN components.

Supports all 802.11 compliant power-save modes. These include the basic Power Save
Polling (PSP) in 802.11 and Automatic Power Save Delivery (APSD) defined in 802.11e.

Receiver Sensitivity for FER 802.11b, 1Mbps: -94dBm maximum

<10% 802.11b, 11Mbps: -86dBm maximum
802.11a/g, 6Mbps: -88dBm maximum
802.11a/g, 54Mbps : -74dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
802.11ac, 1SS, MCS-0 : -86dBm maximum
802.11ac, 1SS, MCS-9 : -61dBm maximum
802.11ac, 2SS, MCS-0 : -83dBm maximum
802.11ac, 2SS, MCS-9 : -58dBm maximum

Note:
1. Rx sensitivity have to meet maximum criteria and with -1.5dBm tolerance but +1.5dBm.
2. Note: RF Parameter will be verified by R&S CMW500 via link mode.

Form Factors PCI Express M.2 form factor

Operating Voltage The card will be powered by a 3.3V, ± 9% supply from the host system.

Temperature Operating: 14° to 158° F (-10° to 70° C)

Non-operating: -40° to 176° F (-40° to 80° C)

Humidity Operating: 10% to 90% (non-condensing)

Non-operating: 5% to 95% (non-condensing)

Altitude Operating: 0 to 10,000 ft (3,048 m)

Non-operating: 0 to 50,000 ft (15,240 m)

* Wireless access point and Internet service required and not included. Availability of public wireless access points limited.

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Technical Specifications - Audio

AUDIO
High Definition Audio

Type Integrated

HD Stereo Codec Realtek 2-channel ALC221 codec

Audio I/O Ports Front microphone-In (150-K ohm Input Impedance)

Rear Line-In/Microphone input (150-K ohm Input Impedance, function is configurable by audio
driver)

Rear Line-Out* (190 ohms Output Impedance, expects at least a 10-K ohm load)

Front Headphone-Out (0.5 Ohm Output Impedance, expects at least a 32 ohm load)
Front Microphone/Headphone jack is re-task able to provide Microphone input, line-in or
Headphone output to support connecting two headphones to the front of the system. When
configured as a second front headphone output, both front headphone outputs are always
driven with the same signal.

All ports are 3.5mm

Internal Speaker Amplifier 1.5W amplifier for the internal speaker only. External speakers must be powered externally.
Rear Line-in audio port is re-taskable as either Line-in or Microphone-In.

Multi-streaming Capable Multi-streaming can be enabled in the Realtek control panel to allow independent audio streams
to be sent to/from the front and rear jacks.

Sampling 8 kHz - 192 kHz

Wavetable Syntheses Yes – Uses OS soft wavetable

Analog Audio Yes

# of Channels on Line-Out Stereo (Left & Right channels)

Internal Speaker Yes

External Speaker Jack Yes

High Definition Audio (All-in-One only)

Type Integrated

HD Stereo Codec HP Clear Sound Amp

Audio I/O Ports Side Headphone

Side Headphone/Microphone/Line-In (function is configurable by audio driver; re-task able to

provide Headphone, Microphone, or Line-In)

Rear Line-Out

All ports are 3.5mm

Internal Speaker Amplifier 2W amplifier for the internal speaker only. External speakers must be powered externally.

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Technical Specifications - Audio

Multi-streaming Capable Multi-streaming can be enabled in the DTS control panel

Sampling 44.1 kHz - 192 kHz

Wavetable Syntheses Yes – Uses OS soft wavetable

Analog Audio Yes

# of Channels on Line-Out Stereo (Left & Right channels)

Internal Speaker Yes

External Speaker Jack Yes

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Technical Specifications - Input/Output Devices

INPUT/OUTPUT DEVICES

HP Conferencing Keyboard

1. Function Keys 6. End/Decline a Call

2. F11 Lync or Skype for Business Contact list * 7. Answer a Call

3. F12 Lync or Skype for Business Calendar ** 8. Microphone Mute

4. Share Screen 9. Volume Up/Down

5. Stop Webcam 10. Audio Mute

*Microsoft Lync 2013, or Skype for Business, or Microsoft Outlook 2013 Contact list

**Microsoft Lync 2013, or Skype for Business, or Microsoft Outlook 2013 Calendar

Dimensions (H x L x W) 0.85 x 17.34 x 6.10 in (2.16 x 44.05 x 15.50 cm)

Weight 24.69 oz. ( 700 g)

Connectivity USB cable

Keys 110 (US) Layout, 111 (EU) Layout – depending upon country

Feature Summary Full-size ultra-quiet keyboard with numerical pad and 12 function keys
One-touch simplicity for Microsoft Lync or Skype for Business calls with dedicated keys and LED
light indicators

Illuminated keys Incoming Call – Blinks Green

Call in progress –Green
Microphone Mute – Orange
Audio Mute – Orange
Screen Sharing – Orange

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Technical Specifications - Input/Output Devices

Stop Webcam – Orange

Other Call control keys End/Decline Call

Volume up and down rocker key

Microsoft Lync/Outlook Fn+F12 – Lync or Skype for Business Calendar will open. If Lync or Skype for Business is not
available will bring Outlook Calendar *
Fn+F11 – Lync or Skype for Business Contact will open. If Lync or Skype for Business is not
available will bring Outlook Contact list *

* Fn+11 and Fn+12 function keys are not supported in Microsoft Windows 8.x Metro mode

Functions Keys Fn+F10 – System Settings

Fn+F9 – Devices
Fn+F8 – Search
Fn+F7 – Blank
Fn+F6 – Up Brightness Adjustment
Fn+F5 – Down Brightness Adjustment
Fn+F4 – Display Options
Fn+F3 – File Explorer
Fn+F2 – System Lock
Fn+F1 – System Sleep

System requirements Available USB port

Windows 7, Windows 8.x, and Windows 10
Server: Microsoft Lync Server 2010 or 2013 and Skype for Business Server 2015
Client: Microsoft Lync 2013 version 15.0.46xx or newer or Skype for Business
Notes:
 Limited support for Microsoft Lync 2010, Microsoft Lync 2013 Basic and Microsoft Metro
Mode
 Screen brightness functions supported in select HP systems

Approvals FCC; CE; ACA(C-tick); EAC

EMC UL, CE Mark
Product Safety

HP USB Business Slim Keyboard

Keys 104, 105, 106, 107, 109 layout (depending upon country)

171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±

Physical characteristics Dimensions (L x W x H)
1.0 cm)

Weight 1.32 lb (0.6± 0.08 kg)

Electrical Operating voltage + 4.4 – 5.25VDC

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50-mA maximum (with 5 VDC power supplied and three

Power consumption
LEDs ON)

System interface USB Type A plug connector

Contact Discharge: 2, 4,6,8KV

ESD
Air Discharge: 2, 4, 8,10,12.5KV

EMI - RFI Conforms to FCC rules for a Class B computing device

Microsoft® PC 99 - 2001 Functionally compliant

Keycaps Low-profile design

Switch actuation 60±12.5g nominal peak force with tactile feedback

Switch life 10 million keystrokes (Life tester)

Mechanical Switch type Contamination-resistant switch membrane

Key-leveling mechanisms For all double-wide and greater-length keys

Cable length 6 ft (1.8 m)

Microsoft PC 99 - 2001 Mechanically compliant

Acoustics 43-dBA maximum sound pressure level

Operating temperature 50° to 122° F (10° to 50° C)

Non-operating temperature -22° to 140° F (-30° to 60° C)

Operating humidity 10% to 90% (non-condensing at ambient)

Non-operating humidity 20% to 80% (non-condensing at ambient)

Environmental Operating shock 40 g, six surfaces

Non-operating shock 80 g, six surfaces

Operating vibration 2-g peak acceleration

Non-operating vibration 4-g peak acceleration

Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence

Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence

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Approvals UL, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, KC

Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS

Kit contents Keyboard Installation Guide

Warranty Card Safety and Comfort Guide

HP PS/2 Keyboard
Keys 104, 105, 106, 107, 109 layout (depending upon country)

Physical Characteristics Dimensions (L x W x H) 18.22 x 6.47 x 1.1 in (46.28 x 16.43 x 2.79 cm)

Weight 2 lb (0.9 kg) minimum

Operating voltage + 5VDC ± 10%

Power consumption 50-mA maximum (with three LEDs ON)

System interface PS/2 6-pin mini din connector

ESD CE level 4, 15-kV air discharge

EMI - RFI Conforms to FCC rules for a Class B computing device

Microsoft PC 99 - 2001 Functionally compliant

Electrical Keycaps Low-profile design

Switch actuation 55-g nominal peak force with tactile feedback

Switch life 20 million keystrokes (using Hasco modified tester)

Switch type Contamination-resistant switch membrane

Key-leveling mechanisms For all double-wide and greater-length keys

Cable length 6 ft (1.8 m)

Microsoft PC 99 - 2001 Mechanically compliant

Acoustics 50-dBA maximum sound pressure level

Environmental Operating temperature 32° to 104° F (0° to 40° C)

Non-operating temperature -22° to 149° F (-30° to 65° C)

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Operating humidity 15% to 80% (non-condensing at ambient)

Non-operating humidity 15% to 90% (non-condensing at ambient)

Operating shock N/A

Non-operating shock 65 inch 2.9 ms, six surface; 30g 266 inch/second; 50g
266 inch/second six surface

Operating vibration 2-g peak acceleration

Non-operating vibration Starting at 5 Hz, vary the frequency of vibration from 5 to

500 Hz and back to 5 Hz at a Logarithmic sweep rate of 1
octave per minute.

Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence

Drop (in box) 29.93 in (76 cm) on concrete, 16-drop sequence

Approvals CUL, ICES-003 Class B, FCC, CE Mark,TUV GS, VCCI, BSMI, C-Tick, KC

Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS

HP PS/2 Business Slim Keyboard

Keys 104, 105, 106, 107, 109 layout (depending upon country)

171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±

Physical Characteristics Dimensions (L x W x H)
1.0 cm)

Weight 1.32 lb (600± 80 g)

Operating voltage + 4.4 – 5.25VDC

50-mA maximum (with 5 VDC power supplied and three

Power consumption
LEDs ON)

System interface PS/2 6-pin mini din connector

Electrical Contact Discharge: 2, 4,6,8KV

ESD
Air Discharge: 2, 4, 8,10,12.5KV

EMI - RFI Conforms to FCC rules for a Class B computing device

Microsoft PC 99 - 2001 Functionally compliant

Keycaps Low-profile design

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Switch actuation 60±12.5g nominal peak force with tactile feedback

Switch life 10 million keystrokes (Life tester)

Switch type Contamination-resistant switch membrane

Key-leveling mechanisms For all double-wide and greater-length keys

Cable length 6 ft (1.8 m)

Microsoft PC 99 - 2001 Mechanically compliant

Acoustics 43-dBA maximum sound pressure level

Operating temperature 50° to 122° F (10° to 50° C)

Non-operating temperature -22° to 140° F (-30° to 60° C)

Operating humidity 10% to 90% (non-condensing at ambient)

Non-operating humidity 20% to 80% (non-condensing at ambient)

Operating shock N/A

Environmental
Non-operating shock 65 inch 2.9 ms, six surface; 30g 266 inch/second; 50g
266 inch/second six surface

Operating vibration 2-g peak acceleration

Non-operating vibration Starting at 5 Hz, vary the frequency of vibration from 5 to

500 Hz and back to 5 Hz at a Logarithmic sweep rate of 1
octave per minute.

Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence

Drop (in box) 29.93 in (76 cm) on concrete, 16-drop sequence

Approvals UL, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, KC

Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS

HP Wireless Business Slim Keyboard and Mouse

171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±
Dimensions ( L x W x H)
1.0 cm)
Keyboard
Weight – Without Two AA 1.23 lb (560± 80 g)
Alkaline Batteries

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Technical Specifications - Input/Output Devices

Dimensions (H x L x W) 1.46 x 4.53 x 2.47 in (37 x 115 x 62.9 mm)
Mouse
Weight – Without Two AA 0.15 lb (67 g)
Alkaline Batteries
Dimensions (H x L x W) 0.33x 1.79 x 0.72 in (8.4 x 45.5 x 18.4 mm)
Weight 0.21 oz (5.9 g)
Receiver
Cable Length – Minimum 6 ft (1.8 m)
Range 32.8 ft (10 m)
Available USB port for the receiver
CD-ROM Drive
System Requirements *This system may require upgraded and/or separately purchased hardware and/or a DVD
drive to install the Windows 7 software and take full advantage of Windows 7 functionality.
See http://www.microsoft.com/windows/windows-7/ for details.
Product Safety UL; CSA /TUV (Europe only); CE Mark; CB Report
Ergonomics ANSI; ISO (Europe only); GS Mark (Germany only)

EMC FCC; CE; ACA (-tick); BSMI; KC ; VCCI

CE Mark EN 55022:2010; EN 55024; EN 301489-1; EN 61000
Design Guidelines for PCs PC 99 – connector overmold colors; PC 2001 – full
functionality
Telecom All local telecom requirements and approvals for
intended markets
Approvals USA FCC Title 47 CFR, Par 15, Subpart C; other local
requirements
Country Support US, Belgium, Switzerland, Spain, Denmark, Netherlands,
France, Germany, Italy, Portugal, Sweden, Norway,
Finland, UK, Poland, Czech Republic, Turkey, Greece,
Austria, Bulgaria, Cyprus, Estonia, Hungary, Ireland,
Latvia, Lithuania, Luxemburg, Malta, Romania, Slovakia,
Slovenia, Vietnam, HK, Australia, NZ, Malaysia,
Singapore, Indonesia, Philippines, Thailand, Canada,
China, Japan, Korea, Taiwan, India, Venezuela, Ecuador,
Russia, Ukraine, Israel, Croatia, United Arab Emirates,
Peru, Brazil, Chile, Argentina, Mexico, South Africa, and
up to 193 countries worldwide.

Environmental Keyboard contains 25% post-consumer recycled plastic material.

HP USB PS/2 Washable Keyboard

Keys 104 (US) Layout, 105 (EU) layout – depending upon
country
Physical Characteristics
Dimensions (L x W x H) 17.67x 6.62 x 1.38 in (449 x 168 x 35 mm)
Weight 1.7 lb (0.77 kg) minimum

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Operating voltage + 5VDC ±5%
Power consumption 50-mA maximum (with three LEDs ON)
System interface USB Type A plug connector
Electrical
ESD CE level 4, 15-kV air discharge
EMI - RFI Conforms to FCC rules for a Class B computing device
Microsoft PC 99 - 2001 Functionally compliant
Keycaps Stepped -profile design
Switch actuation 55-g nominal peak force with tactile feedback
Switch life 20 million keystrokes
Switch type Contamination-resistant switch membrane
Mechanical
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 7 ft (2.2 m)
Microsoft PC 99 - 2001 Mechanically compliant
Acoustics 43-dBA maximum sound pressure level
Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature 4° to 149° F (-20° to 65° C)
Operating humidity 10% to 95% (non-condensing at ambient)
Non-operating humidity 0% to 95% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Environmental
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 42 in (107 cm) on concrete, 16-drop sequence
Operating system support Windows® 7, Windows Vista, Windows XP Professional
Approvals UL, cUL, FCC, CE, TUV GS, VCCI, BSMI, C-Tick, KCC, USB-IF, WHQL, EN/IEC 60601-1,
IP66/NEMA4X
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS
HP USB Smart Card (CCID) Keyboard
Introduction:
Boost your security, simplify access procedures and reduce the costs associated with managing networks by preventing
unauthorized access to your computers and networks using smartcard technology with the HP Smart Card (CCID) Keyboard.

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The USB Smart Card (CCID) Keyboard is a full-sized keyboard that takes advantage of digital signatures and certificates to secure
the environment for transactions performed on both public and private networks. The USB Smart Card (CCID) Keyboard works with
all smart cards that comply with ISO standard 7816.

Smart cards are easy-to-use credit card-sized devices which require multiple forms of information to be validated before you gain
access to your accounts or resources. Used worldwide, smart cards strengthen access to a network or other resource using dual-
factor authentication. Implementing a two-factor authentication (or multi-factor authentication) process reduces the risk of
unauthorized access by verifying and validating your identity in one of the following ways:

 Something you know – a combination of username and password or PIN

 Something you have – a smart card or security token.

Something you have (smart card) plus something you know (PIN), improves user-access security within corporate network
environments. Smart cards are used in government agencies, healthcare companies and the finance industry.

HP ProtectTools Smart Card Manager provides authentication software for the smart card. The Smart Card Reader module works
with the HP ProtectTools Security Manager and enables the user to setup, use, and manage the smart card. This allows
strengthened security with HP patented technology.
 Protects against unauthorized access with smart card technology
 Delivers even greater security when combined with a HP ProtectTools smart card and
the HP ProtectTools Security Software
 Combination of username and password or pin with a smart card or security token
 Secures online transactions using digital signatures and certificates
Key Benefits:
 Conforms to industry standards for ease of setup and use
 Delivers long product life and quiet operation with high-impact materials and
lubricated keys
 Spill drain feature

Keys 104, 105, 106, 107, 109 layout

(depending upon country
Form factor USB basic smart card keyboard
Physical Characteristics Colors Carbonite/Silver
Dimensions 18.2 x 6.3 x 1.3 in (46.3 x 16.1 x 3.3 cm)
(H x W x D)
Weight 2 lb (0.9 kg) minimum
Operating voltage + 5VDC ± 5%
Power consumption 100-mA maximum (with four LEDs ON)
System interface USB Type A plug connector
Electrical
ESD CE level 4, 15-kV air discharge
EMI - RFI Conforms to FCC rules for a Class B computing device
Microsoft PC 99 - 2001 Functionally compliant
Languages 30+ available
Keycaps Standard design
Switch actuation 55 g nominal peak force with tactile feedback
Switch life 20 million keystrokes
Mechanical
(using Hasco modified tester)
Switch type Contamination-resistant membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft (1.8 m)

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Microsoft PC 99 - 2001 Mechanically compliant
Acoustics 43-dBA maximum sound pressure level
Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature -22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Environmental Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop 26 in (66 cm) on carpet, six-drop sequence
(out of box)
Drop 42 in (107 cm) on concrete, 16-drop sequence
(in box)
Support All ISO 7816 smart cards
Interface Reads from and writes to all ISO7816-1, 2, 3, 4 memory
and microprocessor smart cards (T=0, T=1)
Chipset SCM STCIII
Standard APIs supported PC/SC, EMV2000, CT-API
Power USB Port
Short circuit detection (protects smart card and reader)
Power supply compliant with ISO7816 and EMV (5V, 60
mA)
SmartCard Function Supports 3-V and 5-V cards
Power consumption 100-mA maximum draw
Communication From card 9600 bps to 330,000 bps
From computer 12 Mbps (USB transfer speed)
Landing mechanism Contact device Friction contact
Card insertions rating Up to 100,000 insertion cycles
Interface modes CCID protocol
Reader performance interface USB connection
Electro-magnetic standards Europe 2004/108/EC
USA USAFCC part 15
Approvals CE-Mark, UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC, EMV2000, USB-IF
Ergonomic Compliance ISO 9241-4, TUVGS
Kit Contents Keyboard, I/O Security and Documentation CD, warranty card

HP USB 1000dpi Laser Mouse

Dimensions
1.47 x 4.53 x 2.47 in (37.3 x 114.97 x 62.86 mm)
(H x L x W)

Weight 3.360 oz (102g)

Cable length 70.9 in (180 cm)

System requirements Available USB port

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Operating Temperature 32° to 104° F (0° to 40° C)

Non-operating Temperature -4° to 140° F (-20° to 60° C)

Environmental
10% to 90%
Operating Humidity
(non-condensing at ambient)

Resolution 1000dpi

Mechanical Tracking Speed 45 cm/sec

Cable Length 70.9 in (180 cm)

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Technical Specifications – Power

POWER
Unit Environment and Operating Conditions
General Unit Operating Guidelines

 Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit
is operated within the specified operating range.
 Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
 Never restrict airflow into the computer by blocking any vents or air intakes.
 Do not stack computers on top of each other or place computers so near each other that they are subject to each other's
re-circulated or preheated air.
 Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other
foreign matter can block the vents and limit the airflow.
 If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.

Temperature Range Operating: 50° to 95° F (10° to 35° C)*

Non-operating: –22° to 140° F(–30° to 60° C)
Relative Humidity Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Operating: 5000m
Altitude (unpressurized) Non-operating: 50,000 ft (15240 m)
*Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained
sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

POWER SUPPLY DM SFF TWR AiO

65W* active PFC 89% 200W active PFC 280W active PFC N/A
average efficiency at
115V
90W active PFC 89%
Standard Efficiency
average efficiency at
115V

*not for 65W DM

N/A 200W active PFC 280W active PFC N/A
82/85/82% efficient at 82/85/82% efficient at
20/50/100% load (115V) 20/50/100% load (115V)
80 PLUS Bronze

N/A N/A N/A 160W active PFC

87/90/87% efficient at
20/50/100% load (115V)
80 PLUS Gold
88/91/88% efficient at
20/50/100% load (230V)

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Technical Specifications – Power

N/A 200W active PFC 400W active PFC 200W active PFC
280W active PFC
90/92/89% efficient at 90/92/89% efficient at
20/50/100% load (115V) 90/92/89% efficient at 20/50/100% load (115V)
20/50/100% load (115V) 91/93/90% efficient at
80 PLUS Platinum
91/93/90% efficient at 20/50/100% load (230V)
20/50/100% load (230V) 91/93/90% efficient at
20/50/100% load (230V)

Operating Voltage Range 90 - 264 VAC 90 - 264 VAC 90 - 264 VAC 90 – 264 VAC
Rated Voltage Range 100 - 240 VAC 100 - 240 VAC 100 - 240 VAC 100-240V AC
Rated Line Frequency 50/60 Hz 50/60 Hz 50/60 Hz 50/60 HZ
Operating Line 47 – 63 Hz
47 – 63 Hz 47 – 63 Hz 47 – 63 Hz
Frequency
3.5A 4.4A 200W : 3A
Rated Input Current N/A 160W : 2A

Rated Input Current with 3A 3.6A 200W : 3A

Energy Efficient* Power 160W : 2A
Supply
DC Output +19.5V +12.1V +12.1V +12.1V

Current Leakage (NFPA Less than 500 Less than 500 microamps of leakage current at 120 Less than 500
99: 2102) microamps of leakage Vac with the ground wire disconnected, as required microamps of leakage
current at 120 Vac with for Non-patient Electrical Appliances and current at 120 Vac with
the ground wire Equipment used in a patient care facility or that the ground wire
disconnected, as contact patients in normal use. Per section disconnected, as
required for Non-patient 10.3.5.1. required for Non-patient
Electrical Appliances and Electrical Appliances and
Equipment used in a Equipment used in a
patient care facility or patient care facility or
that contact patients in that contact patients in
normal use. Per section normal use. Per section
10.3.5.1. 10.3.5.1.
Less than 100 Less than 100 microamps of leakage current at 120 Less than 100
microamps of leakage Vac with the ground wire intact with normal microamps of leakage
current at 120 Vac with polarity, as required for Non-patient Electrical current at 120 Vac with
the ground wire intact Appliances and Equipment used in a patient care the ground wire intact
with normal polarity, as facility or that contact patients in normal use. Per with normal polarity, as
required for Non-patient section 10.3.5.1. required for Non-patient
Electrical Appliances and Electrical Appliances and
Equipment used in a Equipment used in a
patient care facility or patient care facility or
that contact patients in that contact patients in
normal use. Per section normal use. Per section
10.3.5.1. 10.3.5.1.
Power Supply Fan N/A 70mm variable speed 80mm variable speed N/A
Power cord length N/A 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m)
External Power Adapter N/A N/A N/A

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Technical Specifications – Power

1.77 x 1.18 x 4.25 in N/A
Dimensions N/A N/A
45 x 30 x 108 mm
Total Cord Length 6 ft N/A N/A N/A

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Technical Specifications – Weights & Dimensions

WEIGHTS & DIMENSIONS

(configured with 1 HDD & 1 ODD; DM configured with 1 HDD only)

DM SFF TWR AiO
6.9 x 1.3 x 7.0 in 13.3 x 3.95 x 14.9 in 6.7 x 15.3 x 16.7 in See table below.
Chassis (W x H x D)
175 x 34 x 177 mm 338 x 100 x 379 mm 170 x 389 x 425.4 mm
62.79 cu in 782.7 cu in 1711.9 cu in
System Volume
1.05 L 12.8 L 28L
2.9 lb 16.7 lb 20.8 lb
System Weight*
1.3 kg 7.6 kg 9.434 kg
Max Supported
Weight 77.0 lb 77.0 lb 77.0 lb
(desktop 35.0 kg 35.0 kg 35.0 kg
orientation)
77x 4.6 x 6.3 in
1.1 x 7.0 x 7.9 in
Stand Dimensions 19.5 x 117 x 160 mm N/A
29 x 178 x 200 mm
Weight: 47g/ .1 lbs.
Packaging (H x W x 7.8 x 11.4 x 19.7 in 9.0 x 19.7 x 23.4 in 11.6 x 19.6 x 23.6 in
D) 198 x 290 x 500 mm 229 x 500 x 594 mm 295 x 499 x 599 mm
9.0 lb. 17.9 lb 28.8 lb
Shipping Weight
4.1 kg 8.1 kg 13.1 kg
8-units per layer 4-units per layer 4-units per layer
10/12 layer max 10-layer max. 8-layer max.
Palletization Profile 80/96 per pallet 40-units per pallet 32-units per pallet
47.126 x 39.291 x 99.252 47.126 x 39.291 x 88.858 47.126 x 39.291 x 98.622
in (including pallet) in (including pallet) in (including pallet)
Dependent on 40-Ft Stnd.
Sea Container or 40-Ft
High-cube Sea Container
is used)

ALL-IN-ONE WEIGHTS AND DIMENSIONS

Weight with Touch Panel

Without Stand Easel Stand Adjustable Height Stand Recline Stand

Product Weight
16.95-17.39 lbs 18.48-18.92 lbs 25.34-25.78 lbs 23.72-24.17 lbs
Unboxed 7.69-7.89 kg 8.38-8.58 kg 11.49-11.69 kg 10.76-10.96 kg

Without Stand Easel Stand Adjustable Height Stand Recline Stand

Shipping Weight
21.87 lbs 23.36 lbs 31.04 lbs 29.42 lbs
Boxed 9.92kg 10.6 kg 14.08 kg 13.35 kg

Without Stand Easel Stand Adjustable Height Stand Recline Stand

(32 units) (32 units) (15 units) (15units)
Shipping Weight
732.4 lbs 780.74 lbs 498.65 lbs 474.38 lbs
Pallet 332.21 kg 354 kg 226 kg 215 kg

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Technical Specifications – Weights & Dimensions

Weight without Touch Panel

Without Stand Easel Stand Adjustable Height Stand Recline Stand

Product Weight
15.08-15.52 lbs 16.58-17.02 lbs 25.34-25.78 lbs 21.82-22.26 lbs
Unboxed 6.84-7.04kg 7.52-7.72 kg 11.49-11.69 kg 9.90-10.10 kg

Shipping Weight
Without Stand Easel Stand Adjustable Height Stand Recline Stand
Box
19.97 lbs 21.47 lbs 29.15 lbs 27.53 lbs
9.06kg 9.74 kg 13.22 kg 12.49 kg

Without Stand (32 Easel Stand (32 Adjustable Height Stand Recline Stand
units) units) (15 units) (15units)
Shipping Weight
672.85 lbs 720.14 lbs 470.25 lbs 445.97 lbs
Pallet 305.21 kg 327 kg 213 kg 202 kg

Dimensions (W x D x H)

Easel Stand 0
Without Stand degrees Adjustable Height Stand Recline Stand 0
22.3 x 2.3 x 15.5 in 22.3 x 3.2 x 15.5 in 0 degrees degrees
Product Dimensions
567.2 x 59 x 392.7 567.2 x 81 x 392.7 22.3 x 8.3 x 21.6 in 22.3 x 11 x 17.1 in
mm mm 567.2 x 210 x 549 mm 567.2 x 280 x 435 mm

Easel Stand 70
degrees Recline Stand 65
22.3 x 14 x 6.8 in degrees
567.2 x 355 x 173 22.3 x 16.9 x 8 in
mm 567.2 x 430 x 203 mm

Shipping Dimensions

Without Stand Easel Stand Recline Stand

Shipping
26.22*6.96*19.88(H) 26.22*6.96*19.88(H) Adjustable Height Stand 26.33*11.53*20.78(H)
Dimensions
in in 26.33*11.53*20.78(H) in in
Boxed 666*177*505(H) mm 666*177*505(H) mm 669*293*528(H) mm 669*293*528(H) mm

Without Stand Easel Stand Recline Stand

(32 units) (32 units) Adjustable Height Stand (15units)
Shipping
48*40*85.23(H) in 48*40*85.23(H) in (15 units) 48*40*67.95(H) in
Dimensions
1219*1016*2165(H) 1219*1016*2165(H) 48*40*67.95(H) in 1219*1016*1729(H)
Pallet mm mm 1219*1016*1729(H) mm mm

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Technical Specifications – Weights & Dimensions

DESKTOP MINI DIMENSIONS

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SMALL FORM FACTOR DIMENSIONS

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TOWER DIMENSIONS

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ALL-IN-ONE EASEL STAND DIMENSIONS

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ALL-IN-ONE ADJUSTABLE HEIGHT STAND DIMENSIONS

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Technical Specifications – Weights & Dimensions

ALL-IN-ONE RECLINING STAND DIMENSIONS

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ALL-IN-ONE NO STAND DIMENSIONS

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Technical Specifications – Miscellaneous Features

MISCELLANEOUS FEATURES
Management Features
 Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or
powered-off state without affecting other elements of the system.
 Intel® Wired for Management support; industry wide initiative to make Intel® architecture based PCs, servers and mobile
computers more inherently manageable out-of-the-box and over the network
 Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button

Serviceability Features
 Dual colored power LED on front of computer to indicate either normal or fault condition
 Diagnostic LED Explanation Table:
o Number of 1-second red LED blinks followed by a 2-second pause, then repeats:
 2 - processor thermal protection activated
 3 - processor not installed
 4 - power supply failure
 5 -- memory error
 6 - video error
 7 - PCA failure (ROM detected failure prior to video)
 8 - invalid ROM, boot block recovery mode
 9 - system not fetching code
 10 - system hang while loading an option ROM
 HP PC Hardware Diagnostics UEFI:
o This utility enables hardware level testing outside the operating system on many components. The diagnostics
can be invoked by pressing F2 at POST, and is available as a download from HP Support
 System/Emergency ROM
 Flash ROM
 CMOS Battery Holder for easy replacement
 Flash Recovery with Video Configuration Record Software
 5 Aux Power LED on System PCA
 Processor ZIF Socket for easy Upgrade
 Over-Temp Warning on Screen (Requires IM Agents)
 Clear Password Jumper
 DIMM Connectors for easy Upgrade
 Clear CMOS Button
 NIC LEDs (integrated) (Green & Amber)
 Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions
 Color coordinated cables and connectors
 Tool-less Hood Removal
 Front power switch
 System memory can be upgraded without removing the system board or any internal components
 Tool-less Hard Drive, CD & Diskette Removal
 Green Pull Tabs, and Quick Release Latches for easy Identification

Additional Features Description

Towerable Orientation Product can be oriented as either a desktop (horizontal) or a tower (vertical)
Implementation of the industry standard ATA Security feature set. When enabled, it
Drive Lock prevents software access to user data on the drive until one or two user-defined
passwords are provided.

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Technical Specifications – Miscellaneous Features

DPS Access through F10 Setup during Boot
A diagnostic hard drive self-test. It scans critical physical components and every
sector of the hard drive for physical faults and then reports any faults to the user
Running independently of the operating system, it can be accessed through a
Drive Protection System Windows-based diagnostics utility or through the computer's setup procedure. It
produces an evaluation on whether the hard drive is the source of the problem and
needs to be replaced
The system expands on the Self-Monitoring, Analysis, and Reporting Technology
(SMART), a continuously running systems diagnostic that alerts the user to certain
types of failures
SMART Technology (Self-Monitoring, Allows hard drives to monitor their own health and to raise flags if imminent failures
Analysis and Reporting Technology) were predicted
Predicts failures before they occur. Tracks fault prediction and failure indication
SMART I - Drive Failure Prediction parameters such as re-allocated sector count, spin retry count, calibration retry count
By avoiding actual hard drive failures, SMART hard drives act as "insurance" against
SMART II - Off-Line Data Collection
unplanned user downtime and potential data loss from hard drive failure
SMART III - Off-Line Read Scanning with IOEDC: I/O Error Detection Circuitry
Defect Reallocation Detects errors in Read/Write buffers on HDD cache RAM

SMART IV - End-to-End CRC for hard Interface in F10 setup provides confirmation of SMART IV support.
drives

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Technical Specifications – Environmental

HP EliteDesk 800 G2 DM 65W Business PC

Environmental Eco-Label Certifications This product has received or is in the process of being certified to the following
Data & declarations approvals and may be labeled with one or more of these marks:
 IT ECO declaration
 US ENERGY STAR®
 EPEAT® Gold registered in the United States. See http://www.epeat.net
for registration status in your country.
System Configuration The configuration used for the Energy Consumption and Declared Noise
Emissions data for the Desktop model is based on a typically configured PC
featuring a hard disk drive, a high efficiency power supply, and a Microsoft
Windows® operating system.

Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
Normal Operation (Short 16.23 W 16.57 W 16.42 W
idle)
Normal Operation (Long 15.67 W 15.75 W 15.57 W
idle)
Sleep 0.96 W 0.99 W 0.96 W
Off 0.68 W 0.71 W 0.68 W

Note:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered
within the model family . HP computers marked with the ENERGY STAR® Logo are
compliant with the applicable U.S. Environmental Protection Agency (EPA)
ENERGY STAR® specifications for computers. If a model family does not offer
ENERGY STAR® compliant configurations, then energy efficiency data listed is for
a typically configured PC featuring a hard disk drive, a high efficiency power
supply, and a Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

Normal Operation (Short 56 BTU/hr 57 BTU/hr 56 BTU/hr
idle)
Normal Operation (Long 54 BTU/hr 54 BTU/hr 53 BTU/hr
idle)
Sleep 3 BTU/hr 3 BTU/hr 3 BTU/hr
Off 2 BTU/hr 2 BTU/hr 2 BTU/hr

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.

Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured – 2.9 19
Idle
Fixed Disk – Random 2.9 19
writes

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Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years.
Upgradeable features and/or components contained in the product may include:

• 6 USB ports
• 1 USB Type-C™
• 2 memory slots
• 2 M.2 PCIe slots
• 1 internal 2.5" bay supporting a 2.5" hard drives (HDD/SSD/SED/SSHD)

spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.

Batteries This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)

Battery type: Lithium

Additional Information  This product is in compliance with the Restrictions of Hazardous

Substances (RoHS) directive - 2011/65/EC.
 This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
 This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
 This product is in compliance with the IEEE 1680 (EPEAT) standard at the
Gold level, see www.epeat.net
 Plastics parts weighing over 25 grams used in the product are marked
per ISO11469 and ISO1043.
 This product contains 0% post-consumer recycled plastic (by wt.)
 This product is 94.6% recycle-able when properly disposed of at end of
life.
Packaging Materials External: PAPER/Corrugated 530 g
Internal: PLASTIC/EPE-Expanded Polyethylene 41 g
PLASTIC/Polyethylene low density 7g
The Plastic packaging material is made from 0% recycled content.
The corrugated paper packaging materials contains at least 0% recycled
content.
Material Usage This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):

 Asbestos
 Certain Azo Colorants
 Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
 Cadmium
 Chlorinated Hydrocarbons
 Chlorinated Paraffins
 Formaldehyde

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 Halogenated Diphenyl Methanes
 Lead carbonates and sulfates
 Lead and Lead compounds
 Mercuric Oxide Batteries
 Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
 Ozone Depleting Substances
 Polybrominated Biphenyls (PBBs)
 Polybrominated Biphenyl Ethers (PBBEs)
 Polybrominated Biphenyl Oxides (PBBOs)
 Polychlorinated Biphenyl (PCB)
 Polychlorinated Terphenyls (PCT)
 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
 Radioactive Substances
 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product
packaging:
 Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
 Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
 Design packaging materials for ease of disassembly.
 Maximize the use of post-consumer recycled content materials in
packaging materials.
 Use readily recyclable packaging materials such as paper and corrugated
materials.
 Reduce size and weight of packages to improve transportation fuel
efficiency.
 Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.
End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs in
and Recycling many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide

treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.

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Technical Specifications – Environmental

Hewlett-Packard For more information about HP’s commitment to the environment:
Corporate
Environmental Global Citizenship Report
Information http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU
_Product_Design_ISO_14K_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

HP EliteDesk 800 G2 DM 35W Business PC

Environmental Eco-Label Certifications This product has received or is in the process of being certified to the following
Data & declarations approvals and may be labeled with one or more of these marks:
 IT ECO declaration
 US ENERGY STAR®
 EPEAT® Gold registered in the United States. See http://www.epeat.net
for registration status in your country.
System Configuration The configuration used for the Energy Consumption and Declared Noise
Emissions data for the Desktop model is based on a typically configured PC
featuring a hard disk drive, a high efficiency power supply, and a Microsoft
Windows® operating system.

Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
Normal Operation (Short 11.91 W 11.87 W 11.69 W
idle)
Normal Operation (Long 11.12 W 11.26 W 11.26 W
idle)
Sleep 0.86 W 0.91 W 0.86 W
Off 0.62 W 0.66 W 0.62 W

Note:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered
within the model family . HP computers marked with the ENERGY STAR® Logo are
compliant with the applicable U.S. Environmental Protection Agency (EPA)
ENERGY STAR® specifications for computers. If a model family does not offer
ENERGY STAR® compliant configurations, then energy efficiency data listed is for
a typically configured PC featuring a hard disk drive, a high efficiency power
supply, and a Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

Normal Operation (Short 41 BTU/hr 41 BTU/hr 40 BTU/hr
idle)
Normal Operation (Long 38 BTU/hr 39 BTU/hr 39 BTU/hr
idle)
Sleep 3 BTU/hr 3 BTU/hr 3 BTU/hr
Off 2 BTU/hr 2 BTU/hr 2 BTU/hr

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*NOTE: Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.

Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured – 2.9 18
Idle
Fixed Disk – Random 2.9 19
writes
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years.
Upgradeable features and/or components contained in the product may include:

• 6 USB ports
• 2 memory slots
• 2 M.2 PCIe slots
• 1 internal 2.5" bay supporting a 2.5" hard drives (HDD/SSD/SED/SSHD)

Spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.

Batteries This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)

Battery type: Lithium

Additional Information  This product is in compliance with the Restrictions of Hazardous

Substances (RoHS) directive - 2011/65/EC.
 This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
 This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
 This product is in compliance with the IEEE 1680 (EPEAT) standard at the
Gold level, see www.epeat.net
 Plastics parts weighing over 25 grams used in the product are marked
per ISO11469 and ISO1043.
 This product contains 0% post-consumer recycled plastic (by wt.)
 This product is 95.1% recycle-able when properly disposed of at end of
life.
Packaging Materials External: PAPER/Corrugated 530 g
Internal: PLASTIC/EPE (Expanded Polyethylene) 41 g
PLASTIC/Polyethylene low density 7g
The EPE foam packaging material is made from 0% recycled content.
The corrugated paper packaging materials contains at least 0% recycled
content.
Material Usage This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at

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Technical Specifications – Environmental

http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):

 Asbestos
 Certain Azo Colorants
 Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
 Cadmium
 Chlorinated Hydrocarbons
 Chlorinated Paraffins
 Formaldehyde
 Halogenated Diphenyl Methanes
 Lead carbonates and sulfates
 Lead and Lead compounds
 Mercuric Oxide Batteries
 Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
 Ozone Depleting Substances
 Polybrominated Biphenyls (PBBs)
 Polybrominated Biphenyl Ethers (PBBEs)
 Polybrominated Biphenyl Oxides (PBBOs)
 Polychlorinated Biphenyl (PCB)
 Polychlorinated Terphenyls (PCT)
 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
 Radioactive Substances
 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product
packaging:
 Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
 Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
 Design packaging materials for ease of disassembly.
 Maximize the use of post-consumer recycled content materials in
packaging materials.
 Use readily recyclable packaging materials such as paper and corrugated
materials.
 Reduce size and weight of packages to improve transportation fuel
efficiency.
 Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.
End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs in
and Recycling many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact you’re nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide

treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.

Not all configuration components are available in all regions/countries. Page 108
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QuickSpecs HP Elite 800 G2 Series Business Desktop

Technical Specifications – Environmental

Hewlett-Packard For more information about HP’s commitment to the environment:
Corporate
Environmental Global Citizenship Report
Information http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU
_Product_Design_ISO_14K_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

HP EliteDesk 800 G2 SFF Business PC

Environmental Eco-Label Certifications This product has received or is in the process of being certified to the following
Data & declarations approvals and may be labeled with one or more of these marks:
 IT ECO declaration
 US ENERGY STAR®
 EPEAT® Gold registered in the United States. See http://www.epeat.net
for registration status in your country.
System Configuration The configuration used for the Energy Consumption and Declared Noise
Emissions data for the Desktop model is based on a typically configured PC
featuring a hard disk drive, a high efficiency power supply, and a Microsoft
Windows® operating system.

Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
Normal Operation (Short 16.64 W 16.57 W 16.72 W
idle)
Normal Operation (Long 15.98 W 15.83 W 15.82 W
idle)
Sleep 2.16 W 2.37 W 2.14 W
Off 0.90 W 1.08 W 0.88 W

Note:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered
within the model family . HP computers marked with the ENERGY STAR® Logo are
compliant with the applicable U.S. Environmental Protection Agency (EPA)
ENERGY STAR® specifications for computers. If a model family does not offer
ENERGY STAR® compliant configurations, then energy efficiency data listed is for
a typically configured PC featuring a hard disk drive, a high efficiency power
supply, and a Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

Normal Operation (Short 57 BTU/hr 57 BTU/hr 57 BTU/hr
idle)
Normal Operation (Long 55 BTU/hr 54 BTU/hr 54 BTU/hr
idle)
Sleep 7 BTU/hr 8 BTU/hr 7 BTU/hr

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Off 3 BTU/hr 4 BTU/hr 3 BTU/hr

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.

Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured – 3.2 24
Idle
Fixed Disk – Random 3.5 25
writes
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years.
Upgradeable features and/or components contained in the product may include:

• 6 USB ports
• 2 memory slots
• 1 Mini PCIe half-length slot
• 1 MXM 3.0 Type A - 35W slot
• 1 mSATA slot
• 1 2.5" internal bay supporting up to Two 2.5" hard drives
(HDD/SSD/SED/SSHD)
• 1 5.25" external supporting optical drive

Spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.

Batteries This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)

Battery type: Lithium

Additional Information  This product is in compliance with the Restrictions of Hazardous

Substances (RoHS) directive - 2011/65/EC.
 This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
 This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
 This product is in compliance with the IEEE 1680 (EPEAT) standard at the
<gold> level, see www.epeat.net
 Plastics parts weighing over 25 grams used in the product are marked
per ISO11469 and ISO1043.
 This product contains 16.5% post-consumer recycled plastic (by wt.)
 This product is 92.2% recycle-able when properly disposed of at end of
life.

Packaging Materials External: PAPER/Corrugated 1007 g

Internal: PLASTIC/Plast. other 198 g

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PLASTIC/Polyethylene low density 57 g
PLASTIC/Polypropylene 13 g
The Plastic packaging material is made from 9.3% recycled content.
The paper packaging materials contains at least 45.3% recycled content.
Material Usage This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):

 Asbestos
 Certain Azo Colorants
 Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
 Cadmium
 Chlorinated Hydrocarbons
 Chlorinated Paraffins
 Formaldehyde
 Halogenated Diphenyl Methanes
 Lead carbonates and sulfates
 Lead and Lead compounds
 Mercuric Oxide Batteries
 Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
 Ozone Depleting Substances
 Polybrominated Biphenyls (PBBs)
 Polybrominated Biphenyl Ethers (PBBEs)
 Polybrominated Biphenyl Oxides (PBBOs)
 Polychlorinated Biphenyl (PCB)
 Polychlorinated Terphenyls (PCT)
 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
 Radioactive Substances
 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage HP follows these guidelines to decrease the environmental impact of product
packaging:
 Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
 Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
 Design packaging materials for ease of disassembly.
 Maximize the use of post-consumer recycled content materials in
packaging materials.
 Use readily recyclable packaging materials such as paper and corrugated
materials.
 Reduce size and weight of packages to improve transportation fuel
efficiency.
 Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.

Not all configuration components are available in all regions/countries. Page 111
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QuickSpecs HP Elite 800 G2 Series Business Desktop

Technical Specifications – Environmental

End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs in
and Recycling many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide

treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.

Hewlett-Packard For more information about HP’s commitment to the environment:

Corporate
Environmental Global Citizenship Report
Information http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU
_Product_Design_ISO_14K_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

HP EliteDesk 800 G2 Tower Business PC

Environmental Eco-Label Certifications This product has received or is in the process of being certified to the following
Data & declarations approvals and may be labeled with one or more of these marks:
 IT ECO declaration
 US ENERGY STAR®
 EPEAT® Gold registered in the United States. See http://www.epeat.net
for registration status in your country.
System Configuration The configuration used for the Energy Consumption and Declared Noise
Emissions data for the Desktop model is based on a typically configured PC
featuring a hard disk drive, a high efficiency power supply, and a Microsoft
Windows® operating system.

Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
Normal Operation (Short 15.15 W 16.49 W 15.36 W
idle)
Normal Operation (Long 14.11 W 15.23 W 14.25 W
idle)
Sleep 2.03 W 2.27 W 2.02 W
Off 0.97 W 1.15 W 0.95 W

Note:

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QuickSpecs HP Elite 800 G2 Series Business Desktop

Technical Specifications – Environmental

Energy efficiency data listed is for an ENERGY STAR® compliant product if offered
within the model family . HP computers marked with the ENERGY STAR® Logo are
compliant with the applicable U.S. Environmental Protection Agency (EPA)
ENERGY STAR® specifications for computers. If a model family does not offer
ENERGY STAR® compliant configurations, then energy efficiency data listed is for
a typically configured PC featuring a hard disk drive, a high efficiency power
supply, and a Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

Normal Operation (Short 52 BTU/hr 56 BTU/hr 53 BTU/hr
idle)
Normal Operation (Long 48 BTU/hr 52 BTU/hr 49 BTU/hr
idle)
Sleep 7 BTU/hr 8 BTU/hr 7 BTU/hr
Off 3 BTU/hr 4 BTU/hr 3 BTU/hr

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.

Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured – 3.4 23
Idle
Fixed Disk – Random 3.6 25
writes
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years.
Upgradeable features and/or components contained in the product may include:

• 10 USB ports
• 4 memory slots
• 1 PCIe x16 slot
• 1 PCIe x16 slot, wired as x4
• 2 PCIe x1 slot
• 2 internal 3.5" bay supporting up to Two 2.5" hard drives
(HDD/SSD/SED/SSHD)
• 1 internal 2.5" bay supporting a 2.5" hard drive (HDD/SSD/SED/SSHD)
• 1 external 5.25" supporting optical drive
• 1 Slim external supporting optical drive
• 1 external SD 4.0 Reader

Spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.

Batteries This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)

Battery type: Lithium

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Technical Specifications – Environmental

Additional Information  This product is in compliance with the Restrictions of Hazardous
Substances (RoHS) directive - 2011/65/EC.
 This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
 This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
 This product is in compliance with the IEEE 1680 (EPEAT) standard at the
Gold level, see www.epeat.net
 Plastics parts weighing over 25 grams used in the product are marked
per ISO11469 and ISO1043.
 This product contains 20.4% post-consumer recycled plastic (by wt.)
 This product is 95.3% recycle-able when properly disposed of at end of
life.
Packaging Materials External: PAPER/Corrugated 1563 g
Internal: PLASTIC/Polyethylene low density 37 g
PLASTIC/Polypropylene 16 g
PLASTIC/Other plastics unknown 194 g
The EPE foam packaging material is made from 9.3% recycled content.
The corrugated paper packaging materials contains at least 45.3% recycled
content.
Material Usage This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):

 Asbestos
 Certain Azo Colorants
 Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
 Cadmium
 Chlorinated Hydrocarbons
 Chlorinated Paraffins
 Formaldehyde
 Halogenated Diphenyl Methanes
 Lead carbonates and sulfates
 Lead and Lead compounds
 Mercuric Oxide Batteries
 Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
 Ozone Depleting Substances
 Polybrominated Biphenyls (PBBs)
 Polybrominated Biphenyl Ethers (PBBEs)
 Polybrominated Biphenyl Oxides (PBBOs)
 Polychlorinated Biphenyl (PCB)
 Polychlorinated Terphenyls (PCT)
 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
 Radioactive Substances
 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Not all configuration components are available in all regions/countries. Page 114
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QuickSpecs HP Elite 800 G2 Series Business Desktop

Technical Specifications – Environmental

Packaging Usage HP follows these guidelines to decrease the environmental impact of product
packaging:
 Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
 Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
 Design packaging materials for ease of disassembly.
 Maximize the use of post-consumer recycled content materials in
packaging materials.
 Use readily recyclable packaging materials such as paper and corrugated
materials.
 Reduce size and weight of packages to improve transportation fuel
efficiency.
 Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.
End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs in
and Recycling many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact you’re nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide

treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.
Hewlett-Packard For more information about HP’s commitment to the environment:
Corporate
Environmental Global Citizenship Report
Information http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU
_Product_Design_ISO_14K_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

HP EliteOne 800 G2 23-in Touch GPU All-in-One PC

Environmental Eco-Label Certifications This product has received or is in the process of being certified to the following
Data & declarations approvals and may be labeled with one or more of these marks:
 IT ECO declaration
 US ENERGY STAR®
 EPEAT® Gold registered in the United States. See http://www.epeat.net
for registration status in your country.
System Configuration The configuration used for the Energy Consumption and Declared Noise
Emissions data for the All-in-One PC model is based on a typically configured PC
featuring a hard disk drive, a high efficiency power supply, and a Microsoft
Windows® operating system.

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Technical Specifications – Environmental

Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
Normal Operation (Short 33.31 W 33.80 W 33.60 W
idle)
Normal Operation (Long 12.63 W 12.76 W 12.58 W
idle)
Sleep 1.34 W 1.38 W 1.37 W
Off 0.59 W 0.60 W 0.59 W

Note: Energy efficiency data listed is for an ENERGY STAR® compliant product if
offered within the model family. HP computers marked with the ENERGY STAR®
Logo are compliant with the applicable U.S. Environmental Protection Agency
(EPA) ENERGY STAR® specifications for computers. If a model family does not
offer ENERGY STAR® compliant configurations, then energy efficiency data listed
is for a typically configured PC featuring a hard disk drive, a high efficiency power
supply, and a Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

Normal Operation (Short 114 BTU/hr 116 BTU/hr 115 BTU/hr
idle)
Normal Operation (Long 43 BTU/hr 44 BTU/hr 43 BTU/hr
idle)
Sleep 5 BTU/hr 5 BTU/hr 5 BTU/hr
Off 2 BTU/hr 2 BTU/hr 2 BTU/hr

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.

Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured – 3.1 19
Idle
Fixed Disk – Random 3.1 19
writes
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years.
Upgradeable features and/or components contained in the product may include:

• 6 USB ports
• 2 memory slots
• 1 Mini PCIe half-length slot
• 1 MXM 3.0 Type A - 35W slot
• 1 mSATA slot
• 1 2.5" internal bay supporting up to Two 2.5" hard drives
(HDD/SSD/SED/SSHD)
• 1 5.25" external supporting optical drive

Spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.

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Technical Specifications – Environmental

Batteries This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)

Battery type: Lithium

Additional Information  This product is in compliance with the Restrictions of Hazardous

Substances (RoHS) directive - 2011/65/EC.
 This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
 This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
 This product is in compliance with the IEEE 1680 (EPEAT) standard at the
Gold level, see www.epeat.net
 Plastics parts weighing over 25 grams used in the product are marked
per ISO11469 and ISO1043.
 This product contains 38.9% post-consumer recycled plastic (by wt.)
 This product is 96.8% recycle-able when properly disposed of at end of
life.

Packaging Materials External: PAPER/Corrugated 1296 g

Internal: PLASTIC/EPE-Expanded Polyethylene 544 g
The plastic packaging material contains at least 0% recycled content.
The corrugated paper packaging materials contains at least 80% recycled
content.
Material Usage This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):

 Asbestos
 Certain Azo Colorants
 Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
 Cadmium
 Chlorinated Hydrocarbons
 Chlorinated Paraffins
 Formaldehyde
 Halogenated Diphenyl Methanes
 Lead carbonates and sulfates
 Lead and Lead compounds
 Mercuric Oxide Batteries
 Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
 Ozone Depleting Substances
 Polybrominated Biphenyls (PBBs)
 Polybrominated Biphenyl Ethers (PBBEs)
 Polybrominated Biphenyl Oxides (PBBOs)
 Polychlorinated Biphenyl (PCB)
 Polychlorinated Terphenyls (PCT)

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QuickSpecs HP Elite 800 G2 Series Business Desktop

Technical Specifications – Environmental

 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
 Radioactive Substances
 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage HP follows these guidelines to decrease the environmental impact of product
packaging:
 Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
 Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
 Design packaging materials for ease of disassembly.
 Maximize the use of post-consumer recycled content materials in
packaging materials.
 Use readily recyclable packaging materials such as paper and corrugated
materials.
 Reduce size and weight of packages to improve transportation fuel
efficiency.
 Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.
End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs in
and Recycling many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide

treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.
Hewlett-Packard For more information about HP’s commitment to the environment:
Corporate
Environmental Global Citizenship Report
Information http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU
_Product_Design_ISO_14K_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

HP EliteOne 800 G2 23-in Non-Touch GPU All-in-One

Environmental Eco-Label Certifications This product has received or is in the process of being certified to the following
Data & declarations approvals and may be labeled with one or more of these marks:
 IT ECO declaration
 US ENERGY STAR®

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Technical Specifications – Environmental

 EPEAT® Gold registered in the United States. See http://www.epeat.net
for registration status in your country.

System Configuration The configuration used for the Energy Consumption and Declared Noise
Emissions data for the Ultra-slim Desktop model is based on a typically
configured PC featuring a hard disk drive, a high efficiency power supply, and a
Microsoft Windows® operating system.

Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
Normal Operation (Short 33.31 W 33.80 W 33.60 W
idle)
Normal Operation (Long 12.63 W 12.76 W 12.58 W
idle)
Sleep 1.34 W 1.38 W 1.37 W
Off 0.59 W 0.60 W 0.59 W

Note:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered
within the model family . HP computers marked with the ENERGY STAR® Logo are
compliant with the applicable U.S. Environmental Protection Agency (EPA)
ENERGY STAR® specifications for computers. If a model family does not offer
ENERGY STAR® compliant configurations, then energy efficiency data listed is for
a typically configured PC featuring a hard disk drive, a high efficiency power
supply, and a Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

Normal Operation (Short 114 BTU/hr 116 BTU/hr 115 BTU/hr
idle)
Normal Operation (Long 43 BTU/hr 44 BTU/hr 43 BTU/hr
idle)
Sleep 5. BTU/hr 5 BTU/hr 5 BTU/hr
Off 2 BTU/hr 2 BTU/hr 2 BTU/hr

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.

Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured – 3.2 23
Idle
Fixed Disk – Random 3.2 22
writes
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years.
Upgradeable features and/or components contained in the product may include:

• 6 USB ports
• 2 memory slots

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Technical Specifications – Environmental

• 1 Mini PCIe half-length slot
• 1 MXM 3.0 Type A - 35W slot
• 1 mSATA slot
• 1 2.5" internal bay supporting up to Two 2.5" hard drives
(HDD/SSD/SED/SSHD)
• 1 5.25" external supporting optical drive

Spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.

Batteries This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)

Battery type: Lithium

Additional Information  This product is in compliance with the Restrictions of Hazardous

Substances (RoHS) directive - 2011/65/EC.
 This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
 This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
 This product is in compliance with the IEEE 1680 (EPEAT) standard at the
Gold level, see www.epeat.net
 Plastics parts weighing over 25 grams used in the product are marked
per ISO11469 and ISO1043.
 This product contains 40.1% post-consumer recycled plastic (by wt.)
 This product is 96.6% recycle-able when properly disposed of at end of
life.
Packaging Materials External: PAPER/Corrugated 1296 g
Internal: PLASTIC/EPE-Expanded Polyethylene 544 g
The Plastic packaging material is made from 0% recycled content.
The corrugated paper packaging materials contains at least 80% recycled
content.

Material Usage This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):

 Asbestos
 Certain Azo Colorants
 Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
 Cadmium
 Chlorinated Hydrocarbons
 Chlorinated Paraffins
 Formaldehyde
 Halogenated Diphenyl Methanes
 Lead carbonates and sulfates

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QuickSpecs HP Elite 800 G2 Series Business Desktop

Technical Specifications – Environmental

 Lead and Lead compounds
 Mercuric Oxide Batteries
 Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
 Ozone Depleting Substances
 Polybrominated Biphenyls (PBBs)
 Polybrominated Biphenyl Ethers (PBBEs)
 Polybrominated Biphenyl Oxides (PBBOs)
 Polychlorinated Biphenyl (PCB)
 Polychlorinated Terphenyls (PCT)
 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
 Radioactive Substances
 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product
packaging:
 Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
 Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
 Design packaging materials for ease of disassembly.
 Maximize the use of post-consumer recycled content materials in
packaging materials.
 Use readily recyclable packaging materials such as paper and corrugated
materials.
 Reduce size and weight of packages to improve transportation fuel
efficiency.
 Plastic packaging materials are marked according to ISO 11469 and DIN
6120 standards.
End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs in
and Recycling many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide

treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.

Not all configuration components are available in all regions/countries. Page 121
c04818335 — Worldwide — Version 4 — December 9, 2015
QuickSpecs HP Elite 800 G2 Series Business Desktop

Technical Specifications – Environmental

Hewlett-Packard For more information about HP’s commitment to the environment:
Corporate
Environmental Global Citizenship Report
Information http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU
_Product_Design_ISO_14K_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

Not all configuration components are available in all regions/countries. Page 122
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QuickSpecs HP Elite 800 G2 Series Business Desktop

After-Market Options (availability may vary by region)

Business Monitors DM SFF TWR AiO Part Number

HP ProDisplay P17A 17-inch 5:4 LED Backlit Monitor X X X X F4M97AA
HP ProDisplay P202 20-inch Monitor X X X X K7X27AA
HP ProDisplay P222va 21.5-inch Monitor X X X X K7X30AA
HP ProDisplay P232 23-inch Monitor X X X X K7X31AA
HP EliteDisplay E190i 18.9-inch LED Backlit Monitor X X X X E4U30AA
HP EliteDisplay E221c 21.5-inch Webcam LED Backlit X X X X D9E49AA
Monitor
HP EliteDisplay E222 21.5-inch Monitor X X X X M1N96AA
HP EliteDisplay E232 23-inch Monitor X X X X M1N98AA
HP EliteDisplay E240c 23.8-inch Video Conferencing X X X X M1P00AA
Monitor
HP EliteDisplay E242 24-inch Monitor X X X X M1P02AA
HP EliteDisplay S140u 14-inch USB Portable Monitor X X X X G8R65AA
HP EliteDisplay S230tm 23-inch Touch Monitor X X X X E4S03AA
HP EliteDisplay S231d 23-in IPS LED BLU Notebook X X X X F3J72AA
Docking Monitor
Communication Devices DM SFF TWR AiO Part Number
Intel® Ethernet I210 – T1 Gbe NIC X X X E0X95AA
Intel® 7265 802.11ac PCIe x1 Card X X X N4G85AA
Intel® 7265 802.11ac m.2 Card (AIO) X P3X31AA
Broadcom BCM943228Z 802.11n PCIe x1 Card X X X N4M64AA
Graphics Solutions DM SFF TWR AiO Part Number
NVIDIA GeForce GT 730 2GB PCIe x8 Graphics Card X X N3R90AA
NVIDIA GeForce GT 720 2GB PCIe x16 Graphics Card X T4E57AA
(China only)
NVIDIA Quadro NVS 310 1GB PCIe x16 Graphics Card X X M6V51AA
AMD Radeon™ R9 350 2GB PCIe x16 Graphics Card X X N3R91AA
AMD Radeon R5 320 1GB PCIe x16 Graphics Card Card X T9F48AA
(China only)
HP USB Graphics Adapter X X X X NL571AA
HP UHD USB Graphics Adapter X X X X N2U81AA
HP Dual Output USB Graphics Adapter X X X X C5U89AA
HP DisplayPort Cable Kit X X X VN567AA
HP DisplayPort To DVI-D Adapter X X X FH973AA
HP DisplayPort to VGA Adapter X X X AS615AA
HP DisplayPort to HDMI 4K Adapter X X X K2K92AA
Data Storage Drives DM SFF TWR AiO Part Number
HP 500GB SATA 6Gbps Hard Drive X X QK554AA
HP 1TB SATA 6Gbps Hard Drive X X QK555AA
HP 128-GB SATA Solid State Drive X X X X QV063AA

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After-Market Options (availability may vary by region)

HP 500-GB SATA Solid State Hybrid Drive X X X X E1C62AA
HP 128-GB SED Opal 2 Solid State Drive X X G2K24AA
HP Turbo Drive 128GB PCIe Solid State Drive X X J5V07AA
Intel® Pro 2500 180GB SATA SED Opal2 Solid State X X X X
P3X90AA
Drive
HP 256GB SATA 3D Non-SED Solid State Drive X X X X N1M49AA
HP Turbo Drive 256GB PCIe Solid State Drive X X N3S12AA
HP 256 GB Turbo Drive G2 SSD M.2 card X TBD
Input Devices DM SFF TWR AiO Part Number
HP USB Business Slim Keyboard X X X X N3R87AA
HP USB Keyboard X X X X QY776AA
HP USB Grey Keyboard (EMEA only) X X X X B6B64AA
HP USB Smart Card (CCID) Keyboard X X X X BV813AA
HP USB Grey Smart Card (CCID) Keyboard (EMEA only) X X X X J7H70AA
HP USB and PS/2 Washable Keyboard and Mouse Kit X X X X BU207AA
HP USB Grey Mouse (EMEA only) X X X X K7W54AA
HP PS/2 Business Slim Keyboard X X X N3R86AA
HP PS/2 Mouse X X X QY775AA
HP USB Mouse X X X X QY777AA
HP USB 1000dpi Laser Mouse X X X X QY778AA
HP Wireless Business Slim Keyboard and Mouse* X X X X N3R88AA
HP Wireless Keyboard and Mouse* X X X X QY449AA
HP USB Antimicrobial Keyboard and Mouse (China Only) X X X X K7X25AA
*Keyboard contains 25% post-consumer recycled plastic material
System Memory DM SFF TWR AiO Part Number
HP 4GB DDR4-2133 DIMM X X P1N51AA
HP 8GB DDR4-2133 DIMM X X P1N52AA
HP 4GB DDR4-2133 SODIMM X X P1N53AA
HP 8GB DDR4-2133 SODIMM X X P1N54AA
HP 16GB DDR4-2133 SODIMM X X P1N55AA

Multimedia Devices DM SFF TWR AiO Part Number

HP 9.5mm Desktop G2 Slim DVD-ROM Drive X X N1M41AA
HP 9.5mm Desktop G2 Slim SuperMulti DVD Writer Drive X X N1M42AA
HP 9.5mm Desktop G2 Slim SATA BDXL Blu-Ray Writer X X N1M43AA
HP 9.5mm EliteOne AIO 705/800 G2 Slim DVD-ROM X N3S09AA
Drive
HP 9.5mm EliteOne AIO 705/800 G2 Slim SuperMulti X N3S10AA
DVD Writer Drive
HP 9.5mm Desktop G2 Slim SATA BDXL Blu-Ray Writer X N3S11AA
HP Business Headset v2 X X X X T4E61AA
HP USB Business Speakers v2 X X X D9J19AA

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After-Market Options (availability may vary by region)

Desktop Mini Accessories DM SFF TWR AiO Part Number
HP Desktop Mini DVD Super Multi-Writer ODD Expansion X K9Q83AA
Module
HP Desktop Mini 500GB HDD/ I/O Expansion Module X K9Q82AA
HP Desktop Mini Rack Mount Tray Kit X G1K21AA
HP Desktop Mini Security/Dual VESA Sleeve X G1K22AA
HP Desktop Mini 65W Power Supply Kit X L2X04AA
HP Desktop Mini 90w Power Supply Kit X L4R65AA
- Supports EliteDesk 800 G2 65W Desktop Mini
HP Desktop Mini Vertical Chassis Stand X G1K23AA
HP Desktop Mini LockBox X P1N78AA
HP Desktop Mini Port Cover Kit X P3R65AA
HP Desktop Mini I/O Expansion Module X K9Q84AA
HP Integrated Work Center Desktop Mini/Thin Clients X G1V61AA
HP Single Monitor Arm X BT861AA
HP Quick Release X EM870AA
HP Desktop Mini Port Cover Kit X P3R65AA
Security Devices DM SFF TWR AiO Part Number
HP Solenoid Lock and Hood Sensor (DM/SFF) X X X E0X97AA
HP Solenoid Lock and Hood Sensor (TWR) X E0X96AA
HP SFF Wall Mount/Security Sleeve X VN570AA
HP UltraSlim Cable Lock X X X H4D73AA
HP Chassis (1bay) Security Kit X X AR639AA
HP Business PC Security Lock V2 Kit X N3R93AA
Stands and Accessories DM SFF TWR AiO Part Number
HP Integrated Work Center Stand v3 (SFF) X F2P06AA
HP SFF Tower Stand X VN569AA
HP (10 Sets) EliteDesk 800 G2 Tower Bezel Support Kit X P1N74AA
HP (10 Sets) 600/705/800 G2 SFF Bezel Support Kit X N7H10AA
HP Serial Port Adapter (RS-232 compatible) X X PA716A
HP PCIe x1 Parallel Port Card X X N1M40AA
HP SuperSpeed USB 3.1 Gen 2 PCIe x1 Card X X P1N75AA
HP Type-C™ to USB3 Adapter X X X X N2Z63AA
HP PCI Expansion Kit X E1V16AA
HP USB to Serial Adapter X J7B60AA
LANDesk Software (E-Delivery)*
Contact your HP representative for available options.
*Optional and sold separately.

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© Copyright 2015 HP Development Company, L.P. All rights reserved.

The information contained herein is subject to change without notice. The only warranties for HP products are set forth in the
express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an
additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows
are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. Intel, Celeron, Core, Pentium
are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries. Bluetooth is a trademark ofits
proprietor, used by Hewlett-Packard Company under license. USB Type-C™ and USB-C™ are trademarks of USB Implementers
Forum. NVIDIA, GeForce and Kepler are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other
countries.

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Change Log

Date of change: Version Description of change:

History:
Oct. 2, 2015 From v1 to v2 Added Processor edit
Nov. 20, 2015 From v2 to v3 Added Multiple edits
Dec 09 2015 From v3 to v4 Added Multiple edits

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