Datasheet SHT20

Humidity and Temperature Sensor IC

▪ Fully calibrated
▪ Digital output, I2C interface
▪ Low power consumption
▪ Excellent long-term stability
▪ DFN type package – reflow solderable

Product Summary
The SHT20 humidity and temperature sensor of Sensirion Every sensor is individually calibrated and tested. Lot
has become an industry standard in terms of form factor identification is printed on the sensor and an electronic
and intelligence: Embedded in a reflow solderable Dual identification code is stored on the chip – which can be
Flat No leads (DFN) package of 3 x 3mm footprint and read out by command. Furthermore, the resolution of
1.1mm height it provides calibrated, linearized sensor SHT2can be changed by command (8/12bit up to 12/14bit
signals in digital, I2C format. for RH/T) and a checksum helps to improve
communication reliability.
The SHT2x sensors contain a capacitive type humidity
sensor, a band gap temperature sensor and specialized With this set of features and the proven reliability and
analog and digital integrated circuit – all on a single long-term stability, the SHT2x sensors offer an
CMOSens® chip. This yields in an unmatched sensor outstanding performance-to-price ratio. For testing SHT2x
performance in terms of accuracy and stability as well as two evaluation kits EK-H4 and EK-H5 are available.
minimal power consumption.

Dimensions Sensor Chip

3.0 SHT20 features a generation 4C CMOSens® chip.
0.3 typ Besides the capacitive relative humidity sensor and the
D0AC4
SHT20

band gap temperature sensor, the chip contains an

2.4 max

amplifier, A/D converter, OTP memory and a digital

3.0

processing unit.
1.4 max
2.2 1.1 Material Contents
While the sensor itself is made of Silicon the sensors’
0.2

Bottom housing consists of a plated Cu lead-frame and green

View epoxy-based mold compound. The device is fully RoHS
0.4 0.3 NC VDD SCL
and WEEE compliant, e.g. free of Pb, Cd and Hg.
0.75

0.4

2.4
1.5

Additional Information and Evaluation Kits

Additional informations such as Application Notes are
1.0 1.0 NC VSS SDA available from the web page
www.sensirion.com/products/catalog/SHT20. For more
information please contact Sensirion via
Figure 1: Drawing of SHT20 sensor package, dimensions are info@sensirion.com.
given in mm (1 mm = 0.039 inch), tolerances are ±0.1 mm. The
die pad (center pad) is internally connected to VSS. The NC For SHT20 two Evaluation Kits are available: EK-H4, a
pads must be left floating. VSS = GND, SDA = DATA. four-channel device with Viewer Software, that also serves
Numbering of E/O pads starts at lower right corner (indicated by for data-logging, and a simple EK-H5 directly connecting
notch in die pad) and goes clockwise (compare Table 2). one sensor via USB port to a computer.

www.sensirion.com Version 5 – October 2022 1/14

 Sensor Performance
Relative Humidity1234 Table 1 Electrical specification. For absolute maximum
Parameter Condition Value Units values see Section 4.1 of Users Guide.
12 bit 0.04 %RH Temperature567
Resolution 1
8 bit 0.7 %RH
Parameter Condition Value Units
Accuracy typ 3.0 %RH
14 bit 0.01 °C
tolerance 2 max see Figure 2 %RH Resolution 1
12 bit 0.04 °C
Repeatability 0.1 %RH typ 0.3 °C
Accuracy
Hysteresis 1 %RH tolerance 2 max see Figure 3 °C
Nonlinearity <0.1 %RH Repeatability 0.1 °C
Response time 3  63% 8 s Operating Range extended 4 -40 t0 125 °C
Operating Range extended 4 0 to 100 %RH Response Time 7  63% 5 to 30 s
Long Term Drift 5 Typ. < 0.25 %RH/yr Long Term Drift8 Typ. < 0.02 °C/yr
ΔRH (%RH)
± 10
maximum accuracy
±8 ΔT (C)
typical accuracy
± 2.0
±6 maximum accuracy

± 1.5 typical accuracy

±4

±2 ± 1.0

±0 ± 0.5
0 10 20 30 40 50 60 70 80 90 100
Relative Humidity (%RH)
± 0.0
Figure 2 Typical and maximal tolerance at 25°C for relative -40 -20 0 20 40 60 80 100 120
humidity. For extensive information see Users Guide, Sect. 1.2. Temperature (°C)

Electrical Specification Figure 3 Typical and maximal tolerance for temperature sensor
in °C.
Parameter Condition min typ max Units
Supply Voltage, VDD 2.1 3.0 3.6 V
Packaging Information
sleep mode 0.15 0.4 µA
Supply Current, IDD 6
measuring 200 300 330 µA Sensor Type Packaging Quantity Order Number
sleep mode 0.5 1.2 µW Tape & Reel 1500 1-100706-01
SHT20
Power Dissipation 6 measuring 0.6 0.9 1.0 mW Tape & Reel 5000 1-100704-01
average 8bit 3.2 µW
Heater VDD = 3.0 V 5.5mW, T = + 0.5-1.5°C
Communication digital 2-wire interface, I2C protocol Please Note: This datasheet is subject to change and may
be amended without prior notice.

1 Default measurement resolution is 14bit (temperature) / 12bit (humidity). It can 5 Typical value for operation in normal RH/T operating range. Max. value is <
be reduced to 12/8bit, 11/11bit or 13/10bit by command to user register. 0.5 %RH/y. Value may be higher in environments with vaporized solvents, out-
2 Accuracies are tested at Outgoing Quality Control at 25°C and 3.0 V. Values gassing tapes, adhesives, packaging materials, etc. For more details please
exclude hysteresis and long term drift and are applicable to non-condensing refer to Handling Instructions.
environments only. 6 Min and max values of Supply Current and Power Dissipation are based on
3 Time for achieving 63% of a step function, valid at 25°C and 1 m/s airflow. fixed VDD = 3.0 V and T<60°C. The average value is based on one 8bit
4 Normal operating range: 0-80 %RH, beyond this limit sensor may read a measurement per second.
7 Response time depends on heat conductivity of sensor substrate.
reversible offset with slow kinetics (+3 %RH after 60 h at humidity >80 %RH).
8
For more details please see Section 1.1 of the Users Guide. Max. value is < 0.04°C/y.

www.sensirion.com Version 5 – October 2022 2/14

 Users Guide SHT20
1 Extended Specification such as a dew point mirror. Typical deviations are at
±2 %RH where maximal tolerance is ±3% RH and about
For details on how Sensirion is specifying and testing half the maximal tolerance at other values.
accuracy performance please consult Application Note
“Statement on Sensor Specification”. 1.3 Electrical Specification
Current consumption as given in Table 1 is dependent on
1.1 Operating Range
temperature and supply voltage VDD. For estimations on
The sensor works stable within recommended Normal energy consumption of the sensor Figures 6 and 7 may be
Range – see Figure 4. Long term exposure to conditions consulted. Please note that values given in these Figures
outside Normal Range, especially at humidity >80 %RH, are of typical nature and the variance is considerable.
may temporarily offset the RH signal (+3 %RH after 60 h).
After return into the Normal Range it will slowly return 8

Supply Current IDD (μA)

towards calibration state by itself. Prolonged exposure to 7
extreme conditions may accelerate ageing. 6
5
100
Relative Humidity (%)

90 4
80 3
70 2
60
Normal Max. 1
50
40 Range Range 0
30 0 20 40 60 80 100 120
20
10 Temperature (°C)
0
Figure 6 Typical dependency of supply current (sleep mode)
-40 -20 0 20 40 60 80 100 120
versus temperature at VDD = 3.0 V. Please note that the
Temperature (°C)
variance of these data can be above ±25% of displayed value.
Figure 4 Operating Conditions
20
Supply Current IDD (nA)

1.2 RH accuracy at various temperatures 18

Typical RH accuracy at 25°C is defined in Figure 2. For 16
other temperatures, typical accuracy has been evaluated 14
to be as displayed in Figure 5. 12
10
100 ±4.5 ±4 ±4 ±4 ±4 ±4 ±4.5 ±5 ±5
8
90 ±4.5 ±4 ±3.5 ±3.5 ±3.5 ±3.5 ±4 ±4.5 ±5
Relative Humidity [%RH]

80 ±4 ±3.5 ±3 ±3 ±3 ±3.5 ±3.5 ±4 ±4.5 6

70 ±4 ±3.5 ±3 ±3 ±3 ±3 ±3.5 ±3.5 ±4 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5
60 ±3.5 ±3 ±3 ±3 ±3 ±3 ±3 ±3.5 ±3.5 Supply Voltage (VDD)
50 ±3.5 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3.5
40 ±3.5 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 Figure 7 Typical dependency of supply current (sleep mode)
versus supply voltage at 25°C. Please note that deviations may
30 ±3.5 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3
be up to ±50% of displayed value. Values at 60°C scale with a
20 ±3.5 ±3.5 ±3 ±3 ±3 ±3 ±3 ±3 ±3 factor of about 15 (compare Table 1).
10 ±4 ±4 ±3.5 ±3.5 ±3.5 ±3.5 ±3.5 ±3.5 ±3.5
0 ±4.5 ±4.5 ±4 ±4 ±4 ±4 ±4 ±4 ±4
0 10 20 30 40 50 60 70 80
Temperature [°C] .

Figure 5 Typical accuracy of relative humidity measurements

given in %RH for temperatures 0 – 80°C.

Please note that above values are maximal tolerances (not

including hysteresis) against a high precision reference

www.sensirion.com Version 5 – October 2022 3/14

Datasheet SHT20

2 Application Information – 90% of the pad area – say up to 1.4 mm x 2.3 mm

centered on the thermal land area. It can also be split in
2.1 Soldering Instructions two openings.
The DFN’s die pad (centre pad) and perimeter I/O pads
Due to the low mounted height of the DFN, “no clean”
are fabricated from a planar copper lead-frame by over-
type 3 solder paste11 is recommended as well as Nitrogen
molding leaving the die pad and I/O pads exposed for
purge during reflow.
mechanical and electrical connection. Both the I/O pads
and die pad should be soldered to the PCB. In order to
TP tP
prevent oxidation and optimize soldering, the bottom side
of the sensor pads is plated with Ni/Pd/Au.

Temperatur
TL tL
On the PCB the I/O lands9 should be 0.2 mm longer than TS (max)
the package I/O pads. Inward corners may be rounded to
match the I/O pad shape. The I/O land width should match

e
the DFN-package I/O-pads width 1:1 and the land for the
die pad should match 1:1 with the DFN package – see
preheatin critical zone
Figure 8. g Time
The solder mask10 design for the land pattern preferably is Figure 9 Soldering profile according to JEDEC standard. TP <=
of type Non-Solder Mask Defined (NSMD) with solder 260°C and tP < 30 sec for Pb-free assembly. TL < 220°C and tL
< 150 sec. Ramp-up/down speeds shall be < 5°C/sec.
mask openings larger than metal pads. For NSMD pads,
the solder mask opening should be about 120 μm to It is important to note that the diced edge or side faces of
150 μm larger than the pad size, providing a 60 μm to the I/O pads may oxidise over time, therefore a solder fillet
75 μm design clearance between the copper pad and may or may not form. Hence there is no guarantee for
solder mask. Rounded portions of package pads should solder joint fillet heights of any kind.
have a matching rounded solder mask-opening shape to
minimize the risk of solder bridging. For the actual pad For soldering SHT2x, standard reflow soldering ovens may
dimensions, each pad on the PCB should have its own be used. The sensor is qualified to withstand soldering
solder mask opening with a web of solder mask between profile according to IPC/JEDEC J-STD-020 with peak
adjacent pads. temperatures at 260°C during up to 30 sec for Pb-free
0.4 0.3
assembly in IR/Convection reflow ovens (see Figure 9).
0.2

For manual soldering contact time must be limited to

5 seconds at up to 350°C.
0.4
0.7

Immediately after the exposure to high temperatures the

2.4 sensor may temporarily read a negative humidity offset
1.5

(typ. -1 to -2%RH after reflow soldering). This offset slowly

disappears again by itself when the sensor is exposed to
0.2

ambient conditions (typ. within 1-3 days). If RH testing is

1.0
performed immediately after reflow soldering, this offset
1.0
should be considered when defining the test limits.
Figure 8 Recommended metal land pattern for SHT2x. Values In no case, neither after manual nor reflow soldering, a
in mm. Die pad (centre pad) may be left floating or be connected
to ground, NC pads shall be left floating. The outer dotted line
board wash shall be applied. Therefore, and as mentioned
represents the outer dimension of the DFN package. above, it is strongly recommended to use “no-clean” solder
paste. In case of applications with exposure of the sensor
For solder paste printing a laser-cut, stainless steel stencil to corrosive gases or condensed water (i.e. environments
with electro-polished trapezoidal walls and with 0.125 mm with high relative humidity) the soldering pads shall be
stencil thickness is recommended. For the I/O pads the sealed (e.g. conformal coating) to prevent loose contacts
stencil apertures should be 0.1 mm longer than PCB pads or short cuts.
and positioned with 0.1 mm offset away from the centre of
the package. The die pad aperture should cover about 70

9 The land pattern is understood to be the metal layer on the PCB, onto which
the DFN pads are soldered to.
10 The solder mask is understood to be the insulating layer on top of the PCB 11 Solder types are related to the solder particle size in the paste: Type 3 covers
covering the connecting lines. the size range of 25 – 45 µm (powder type 42).

www.sensirion.com Version 5 – October 2022 4/14

Datasheet SHT20

2.2 Storage Conditions and Handling Instructions second at 12bit accuracy shall be made.
Moisture Sensitivity Level (MSL) is 1, according to
IPC/JEDEC J-STD-020. At the same time, it is
recommended to further process the sensors within 1 year
after date of delivery.
It is of great importance to understand that a humidity
sensor is not a normal electronic component and needs to
be handled with care. Chemical vapors at high
Figure 10 Top view of example of mounted SHT2x with slits
concentration in combination with long exposure times milled into PCB to minimize heat transfer.
may offset the sensor reading.
For this reason, it is recommended to store the sensors in 2.4 Light
original packaging including the sealed ESD bag at The SHT2x is not light sensitive. Prolonged direct
following conditions: Temperature shall be in the range of exposure to sunshine or strong UV radiation may age the
10°C – 50°C and humidity at 20 – 60 %RH (sensors that sensor.
are not stored in ESD bags). For sensors that have been
removed from the original packaging we recommend 2.5 Materials Used for Sealing / Mounting
storing them in ESD bags made of metal-in PE-HD12. Many materials absorb humidity and will act as a buffer
In manufacturing and transport the sensors shall be increasing response times and hysteresis. Materials in the
prevented of high concentration of chemical solvents and vicinity of the sensor must therefore be carefully chosen.
long exposure times. Out-gassing of glues, adhesive tapes Recommended materials are: Any metals, LCP, POM
and stickers or out-gassing packaging material such as (Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF,
bubble foils, foams, etc. shall be avoided. Manufacturing PVF.
area shall be well ventilated. For sealing and gluing (use sparingly): Use high filled
For more detailed information please consult the epoxy for electronic packaging (e.g. glob top, underfill),
document “Handling Instructions” [1] or contact Sensirion. and Silicone. Out-gassing of these materials may also
contaminate the sensor (see Section 2.2). Therefore, try to
2.3 Temperature Effects add the sensor as a last manufacturing step to the
Relative humidity reading strongly depends on assembly, store the assembly well ventilated after
temperature. Therefore, it is essential to keep humidity manufacturing or bake at >50°C for 24 h to outgas
sensors at the same temperature as the air of which the contaminants before packing.
relative humidity is to be measured. In case of testing or
2.6 Wiring Considerations and Signal Integrity
qualification the reference sensor and test sensor must
show equal temperature to allow for comparing humidity Carrying the SCL and SDA signal parallel and in close
readings. proximity (e.g. in wires) for more than 10 cm may result in
cross talk and loss of communication. This may be
If the sensor shares a PCB with electronic components resolved by routing VDD and/or VSS between the two
that produce heat it should be mounted in a way that SDA signals and/or using shielded cables. Furthermore,
prevents heat transfer or keeps it as low as possible. slowing down SCL frequency will possibly improve signal
Measures to reduce heat transfer can be ventilation, integrity. Power supply pins (VDD, VSS) must be
reduction of copper layers between the sensor and the decoupled with a 100 nF capacitor – see next Section.
rest of the PCB or milling a slit into the PCB around the
sensor – see Figure 10.
Furthermore, there are self-heating effects in case the
measurement frequency is too high. To keep self-heating
below 0.1°C, SHT2x should not be active for more than
10% of the time – e.g. maximum two measurements per

12 For example, 3M antistatic bag, product “1910” with zipper.

www.sensirion.com Version 5 – October 2022 5/14

Datasheet SHT20

3 Interface Specification 4 Electrical Characteristics

Pin Name Comment 4.1 Absolute Maximum Ratings
1 SDA Serial Data, bidirectional The electrical characteristics of SHT2x are defined in
4 3 Table 1. The absolute maximum ratings as given in Table
2 VSS Ground
5 VDD Supply Voltage 5 2 3 are stress ratings only and give additional information.
Functional operation of the device at these conditions is
6 SCL Serial Clock, bidirectional 6 1 not implied. Exposure to absolute maximum rating
3,4 NC Not Connected conditions for extended periods may affect the sensor
Table 2 SHT2x pin assignment, NC remain floating (top view) reliability (e.g. hot carrier degradation, oxide breakdown).
Parameter min max Units
3.1 Power Pins (VDD, VSS)
VDD to VSS -0.3 5 V
The supply voltage of SHT2x must be in the range of 2.1 –
Digital I/O Pins (SDA, SCL)
3.6 V, recommended supply voltage is 3.0 V. Power to VSS
-0.3 VDD + 0.3 V
supply pins Supply Voltage (VDD) and Ground (VSS) must
Input Current on any Pin -100 100 mA
be decoupled with a 100 nF capacitor, that shall be placed
as close to the sensor as possible – see Figure 11. Table 3 Electrical absolute maximum ratings

3.2 Serial clock (SCL) ESD immunity is qualified according to JEDEC JESD22-
SCL is used to synchronize the communication between A114 method (Human Body Model at 4 kV), JEDEC
microcontroller (MCU) and the sensor. Since the interface JESD22-A115 method (Machine Model 200 V) and
consists of fully static logic there is no minimum SCL ESDA ESD-STM5.3.1-1999 and AEC-Q100-011 (Charged
frequency. Device Model, 750 V corner pins, 500 V other pins). Latch-
up immunity is provided at a force current of 100mA with
3.3 Serial SDA (SDA) Tamb = 125°C according to JEDEC JESD78. For exposure
The SDA pin is used to transfer data in and out of the beyond named limits the sensor needs additional
sensor. For sending a command to the sensor, SDA is protection circuit.
valid on the rising edge of SCL and must remain stable
while SCL is high. After the falling edge of SCL the SDA 4.2 Input / Output Characteristics
value may be changed. For safe communication SDA shall The electrical characteristics such as power consumption,
be valid tSU and tHD before the rising and after the falling low- and high-level input and output voltages depend on
edge of SCL, respectively – see Figure 12. For reading the supply voltage. For proper communication with the
data from the sensor, SDA is valid tVD after SCL has gone sensor it is essential to make sure that signal design is
low and remains valid until the next falling edge of SCL. strictly within the limits given in Table 4 & 5 and Figure 12.
VDD Parameter Conditions min typ max Units
Output Low VDD = 3.0 V,
MCU (master) -4 mA < IOL < 0 mA 0 - 0.4 V
RP RP Voltage, VOL
SCL IN SCL
Output Sink
C = 100nF

SCL OUT - - -4 mA
SHT2x Current, IOL
(slave)
SDA IN SDA Input Low 30%
0 - V
SDA OUT Voltage, VIL VDD
GND Input High 70%
- VDD V
Voltage, VIH VDD
Figure 11 Typical application circuit, including pull-up resistors Input Current
VDD = 3.6 V,
- - ±1 uA
RP and decoupling of VDD and VSS by a capacitor. VIN = 0 V to 3.6 V

Table 4 DC characteristics of digital input/output pads. VDD =

To avoid signal contention the micro-controller unit (MCU) 2.1 V to 3.6 V, T = -40°C to 125°C, unless otherwise noted.
must only drive SDA and SCL low. External pull-up
resistors (e.g. 10 kΩ), are required to pull the signal high.
For the choice of resistor size please take bus capacity
requirements into account (compare Table 5). It should be
noted that pull-up resistors may be included in I/O circuits
of MCUs. See Table 4 and Table 5 for detailed I/O
characteristic of the sensor.

www.sensirion.com Version 5 – October 2022 6/14

Datasheet SHT20

1/fSCL 5.1 Start Up Sensor

tSCLH tSCLL tR tF As a first step, the sensor is powered up to the chosen
70%
supply voltage VDD (between 2.1 V and 3.6 V). After
SCL power-up, the sensor needs at most 15 ms, while SCL is
30%
high, for reaching idle state, i.e., to be ready accepting
tSU
SDA valid write
tHD commands from the master (MCU). Current consumption
during start up is 350 µA maximum. Whenever the sensor
DATA IN
70% is powered up, but not performing a measurement or
SDA communicating, it is automatically in idle state (sleep
30%
SDA valid read mode).
tR
tVD tF
DATA OUT
5.2 Start / Stop Sequence
70%
SDA Each transmission sequence begins with Start condition
30% (S) and ends with Stop condition (P) as displayed in Figure
Figure 12 Timing Diagram for Digital Input/Output Pads, 13 and Figure 14.
abbreviations are explained in Table 5. SDA directions are seen 70%
from the sensor. Bold SDA line is controlled by the sensor, plain SCL 30%
SDA line is controlled by the micro-controller. Note that SDA
valid read time is triggered by falling edge of anterior toggle.
70%
SDA
Parameter min typ max Units 30%
SCL frequency, fSCL 0 - 0.4 MHz Figure 13 Transmission Start condition (S) - a high to low
SCL High Time, tSCLH 0.6 - - µs transition on the SDA line while SCL is high. The Start condition
SCL Low Time, tSCLL 1.3 - - µs is a unique state on the bus created by the master, indicating to
the slaves the beginning of a transmission sequence (bus is
SDA Set-Up Time, tSU 100 - - ns considered busy after a Start).
SDA Hold Time, tHD 0 - 900 ns
SDA Valid Time, tVD 0 - 400 ns 70%
SCL 30%
SCL/SDA Fall Time, tF 0 - 100 ns
SCL/SDA Rise Time, tR 0 - 300 ns
Capacitive Load on Bus Line, CB 0 - 400 pF 70%
SDA 30%
Table 5 Timing specifications of digital input/output pads for I2C
fast mode. Entities are displayed in Figure 12. VDD = 2.1 V to Figure 14 Transmission Stop condition (P) - a low to high
3.6 V, T = -40°C to 125°C, unless otherwise noted. transition on the SDA line while SCL is high. The Stop condition
is a unique state on the bus created by the master, indicating to
the slaves the end of a transmission sequence (bus is
5 Communication with Sensor considered free after a Stop).
SHT20 communicates with I2C protocol. For information on
I2C beyond the information in the following Sections 5.3 Sending a Command
please look for the NXP I2C-bus specifications and user After sending the Start condition, the subsequent I2C
manual. header consists of the 7-bit I2C device address ‘1000’000’
Please note that all sensors are set to the same I2C and an SDA direction bit (Read R: ‘1’, Write W: ‘0’). The
address, as defined in Section 5.3. sensor indicates the proper reception of a byte by pulling
the SDA pin low (ACK bit) after the falling edge of the 8th
Furthermore, please note, that Sensirion provides an SCL clock. After the issue of a measurement command
exemplary sample code on its home page – compare (‘1110’0011’ for temperature, ‘1110’0101’ for relative
www.sensirion.com/products/catalog/SHT20/. humidity’), the MCU must wait for the measurement to
Please note that in case VDD is set to 0 V (GND), e.g. in complete. The basic commands are summarized in Table
case of a power off of the SHT2x, the SCL and SDA pads 6 below.
are also pulled to GND. Consequently, the I2C bus is
blocked while VDD of the SHT2x is set to 0 V.

www.sensirion.com Version 5 – October 2022 7/14

Datasheet SHT20

Command Comment Code header (1000’0001) as shown in Figure 16. If the internal
Trigger T measurement hold master 1110’0011 processing is finished, the sensor acknowledges the poll of
Trigger RH measurement hold master 1110’0101
the MCU and data can be read by the MCU. If the
measurement processing is not finished the sensor
Trigger T measurement no hold master 1111’0011
answers no ACK bit and the Start condition must be
Trigger RH measurement no hold master 1111’0101 issued once more.
Write user register 1110’0110
When using the no hold master mode, it is recommended
Read user register 1110’0111 to include a wait period of 20 µs after the reception of the
Soft reset 1111’1110 sensor’s ACK bit (bit 18 in Figure 16) and before the Stop
Table 6 Basic command set, RH stands for relative humidity, condition.
and T stands for temperature For both modes, since the maximum resolution of a
Hold master or no hold master modes are explained in measurement is 14 bit, the two last least significant bits
next Section. (LSBs, bits 43 and 44) are used for transmitting status
information. Bit 1 of the two LSBs indicates the
5.4 Hold / No Hold Master Mode measurement type (‘0’: temperature, ‘1’ humidity). Bit 0 is
There are two different operation modes to communicate currently not assigned.
with the sensor: Hold Master mode or No Hold Master 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
mode. In the first case the SCL line is blocked (controlled

ACK

ACK
by sensor) during measurement process while in the latter S 1 0 0 0 0 0 0 0 1 1 1 1 0 1 0 1 wait P
case the SCL line remains open for other communication I2C address + write Command (see Table 6) 18.5 µs
while the sensor is processing the measurement. No hold 19 20 21 22 23 24 25 26 27
master mode allows for processing other I2C

NACK
communication tasks on a bus while the sensor is Measurement S 1 0 0 0 0 0 0 1 P
measuring. A communication sequence of the two modes measuring I2C address + read
is displayed in Figure 15 and Figure 16, respectively.
19 20 21 22 23 24 25 26 27
In the hold master mode, the SHT2x pulls down the SCL

ACK
Measurement S 1 0 0 0 0 0 0 1
line while measuring to force the master into a wait state.
By releasing the SCL line the sensor indicates that internal continue measuring I2C address + read
processing is terminated, and that transmission may be 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45
continued.
ACK

ACK
0 1 1 0 0 0 1 1 0 1 0 1 0 0 1 0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Data (MSB) Data (LSB) Stat.
ACK

ACK

S 1 0 0 0 0 0 0 0 1 1 1 0 0 1 0 1
46 47 48 49 50 51 52 53 54
I2C address + write Command (see Table 6)
NACK

0 1 1 0 0 1 0 0 P
19 20 21 22 23 24 25 26 27
Checksum
ACK

S 1 0 0 0 0 0 0 1 Measurement
I2C address + read Hold during measurement Figure 16 No Hold master communication sequence – grey
blocks are controlled by SHT2x. If measurement is not
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45
completed upon “read” command, sensor does not provide ACK
ACK

ACK

0 1 1 0 0 0 1 1 0 1 0 1 0 0 1 0 on bit 27 (more of these iterations are possible). If bit 45 is

changed to NACK followed by Stop condition (P) checksum
Data (MSB) Data (LSB) Stat.
transmission is omitted.
46 47 48 49 50 51 52 53 54

In the examples given in Figure 15 and Figure 16 the

NACK

0 1 1 0 0 1 0 0 P
sensor output is SRH = ‘0110’0011’0101’0000’. For the
Checksum calculation of physical values Status Bits must be set to ‘0’
Figure 15 Hold master communication sequence – grey blocks – see Chapter 6.
are controlled by SHT2x. Bit 45 may be changed to NACK The maximum duration for measurements depends on the
followed by Stop condition (P) to omit checksum transmission.
type of measurement and resolution chosen – values are
displayed in Table 7. Maximum values shall be chosen for
In no hold master mode, the MCU has to poll for the
the communication planning of the MCU.
termination of the internal processing of the sensor. This is
done by sending a Start condition followed by the I2C

www.sensirion.com Version 5 – October 2022 8/14

Datasheet SHT20

Resolution RH typ RH max T typ T max Units default and is not recommended for use. Please use Soft
14 bit 66 85 ms Reset instead – it contains OTP Reload.
13 bit 33 43 ms
12 Bit 22 29 17 22 ms
Bit # Bits Description / Coding Default
11 bit 12 15 9 11 ms
7, 0 2 Measurement resolution ‘00’
10 bit 7 9 ms
RH T
8 bit 3 4 ms
‘00’ 12 bit 14 bit
Table 7 Measurement times for RH and T measurements at ‘01’ 8 bit 12 bit
different resolutions. Typical values are recommended for ‘10’ 10 bit 13 bit
calculating energy consumption while maximum values shall be ‘11’ 11 bit 11 bit
applied for calculating waiting times in communication.
6 1 Status: End of battery13 ‘0’
Please note: I2C communication allows for repeated Start ‘0’: VDD > 2.25 V
‘1’: VDD < 2.25 V
conditions (S) without closing prior sequence with Stop
condition (P) – compare Figures 15, 16 and 18. Still, any 3, 4, 5 3 Reserved
sequence with adjacent Start condition may alternatively 2 1 Enable on-chip heater ‘0’
be closed with a Stop condition. 1 1 Disable OTP Reload ‘1’

5.5 Soft Reset Table 8 User Register. Cut-off value for End of Battery signal
may vary by ±0.1 V. Reserved bits must not be changed. “OTP
This command (see Table 6) is used for rebooting the reload” = ‘0’ loads default settings after each time a
sensor system without switching the power off and on measurement command is issued.
again. Upon reception of this command, the sensor
system reinitializes and starts operation according to the An example for I2C communication reading and writing the
default settings – apart from the heater bit in the user User Register is given in Figure 18.
register (see Sect. 5.6). The soft reset takes less than
15ms. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
ACK

ACK
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S 1 0 0 0 0 0 0 0 1 1 1 0 0 1 1 1
ACK

ACK

S 1 0 0 0 0 0 0 0 1 1 1 1 1 1 1 0 P I2C address + write Read Register

I2C address + write Soft Reset 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

NACK
ACK

Figure 17 Soft Reset – grey blocks are controlled by SHT2x. S 1 0 0 0 0 0 0 1 0 0 0 0 0 0 1 0

I2C address + read Register content
5.6 User Register 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54

The content of User Register is described in Table 8.

ACK

ACK
S 1 0 0 0 0 0 0 0 1 1 1 0 0 1 1 0
Please note that reserved bits must not be changed and
default values of respective reserved bits may change I2C address + write Write Register
over time without prior notice. Therefore, for any writing to 55 56 57 58 59 60 61 62 63
the User Register, default values of reserved bits must be
ACK

0 0 0 0 0 0 1 1 P
read first. Thereafter, the full User Register string is
composed of respective default values of reserved bits Register content to be written
and the remainder of accessible bits optionally with default Figure 18 Read and write register sequence – grey blocks are
or non-default values. controlled by SHT2x. In this example, the resolution is set to 8bit
The end of battery alert is activated when the battery / 12bit.
power falls below 2.25 V.
5.7 CRC Checksum
The heater is intended to be used for functionality SHT2x provides a CRC-8 checksum for error detection.
diagnosis – relative humidity drops upon rising The polynomial used is x8 + x5 + x4 +1. For more details
temperature. The heater consumes about 5.5mW and and implementation please refer to the application note
provides a temperature increase of about 0.5 – 1.5°C. “CRC Checksum Calculation for SHT2x”.
OTP Reload is a safety feature and loads the entire OTP
settings to the register, with the exception of the heater bit,
before every measurement. This feature is disabled per 13 This status bit is updated after each measurement

www.sensirion.com Version 5 – October 2022 9/14

Datasheet SHT20

5.8 I2C Communication Recommendation 5.9 Serial Number

Uncontrolled operation in the No-Hold Master Mode (see SHT20 provides an electronic identification code. For
section 5.4) can very rarely result in false offsets of the instructions on how to read the identification code please
temperature or relative humidity measurement values14. refer to the Application Note “Electronic Identification
These offsets can occur, if a rising edge on the SCL falls Code” – to be downloaded from the web page
within 15 µs to 18.5 µs after the sensor has sent an www.sensirion.com/products/catalog/SHT20/
ACK bit, which confirms the correct reception of a
measurement command. In this time window the sensor’s
calibration data stored in the OTP memory, might be 6 Conversion of Signal Output
corrupted during transmission to the working memory.
Once the offsets manifest in the measurement data, it will Default resolution is set to 12 bit relative humidity and
remain until the next soft or hard reset. These offsets can 14 bit temperature reading. Measured data are transferred
be completely avoided using one of the following four in two byte packages, i.e. in frames of 8 bit length where
workarounds: the most significant bit (MSB) is transferred first (left
1. Recommended: Avoiding of rising edges in clock line aligned). Each byte is followed by an acknowledge bit. The
(SCL) during critical time window. To this end the stop two status bits, the last bits of LSB, must be set to ‘0’
condition from the master should be sent >18.5 µs before calculating physical values. In the example of
after the ACK bit is send from the slave. This prevents Figure 15 and Figure 16, the transferred 16 bit relative
the offset to occur under all circumstances. humidity data is ‘0110’0011’0101’0000’ = 25424.

6.1 Relative Humidity Conversion

With the relative humidity signal output SRH the relative
humidity RH is obtained by the following formula (result in
%RH), no matter which resolution is chosen:
S
RH = − 6 + 125  RH
Figure 19 Stop condition after critical time window 216
2. Sending the stop condition before the critical time In the example given in Figure 15 and Figure 16 the
window, i.e. <15 µs and other communications relative humidity results to be 42.5 %RH.
after 18.5 µs. The physical value RH given above corresponds to the
relative humidity above liquid water according to World
Meteorological Organization (WMO). For relative humidity
above ice RHi the values need to be transformed from
relative humidity above water RHw at temperature t. The
equation is given in the following, compare also
Application Note “Introduction to Humidity”:
Figure 20 Stop condition before critical time window  β t   β t 
RH i = RH w  exp w  exp i 
3. Operating only in the Hold-Master mode (see section  λw + t   λi + t 
5.4). Units are %RH for relative humidity and °C for
4. Performing an OTP reload each time a measurement temperature. The corresponding coefficients are defined
command is issued. This entails copying the content as follows: βw = 17.62, λw = 243.12°C, βi = 22.46,
of the OTP into the working memory, which results in λi = 272.62°C.
an increased measurement time of around 2.5 ms.
This can be achieved by changing the relevant bit in 6.2 Temperature Conversion
the user register. As part of the OTP reload, all values
The temperature T is calculated by inserting temperature
in the user register are reinitialized to their default
signal output ST into the following formula (result in °C), no
values (except the heater bit). Therefore, the bit
matter which resolution is chosen:
(BIT 1) in the user register that controls the OTP must
be changed prior to every measurement (see section S
T = − 46.85 + 175.72  16T
5.6). 2

14 If the sensor is operated using Sensibus commands the offset will not occur

www.sensirion.com Version 5 – October 2022 10/14

Datasheet SHT20

7 Environmental Stability frame at diced edge is not covered with respective

protective coating. The total weight of the sensor is 25 mg.
The SHT2x sensor series were tested based on AEC-
Q100 Rev. G qualification test method where applicable. 8.2 Filter Cap and Sockets
Sensor specifications are tested to prevail under the AEC-
For SHT2x a filter cap SF2 is available. It is designed in a
Q100 temperature grade 1 test conditions listed in Table
compact way and for fast response times. Please find the
915. datasheet on Sensirion’s web page.
Environment Standard Results16 For testing of SHT2x sensors sockets, such as from
HTOL 125°C, 408 hours Pass Plastronics, part number 10LQ50S13030 are
TC -50°C - 125°C, 1000 cycles Pass recommended).
UHST 130°C / 85 %RH / ≈2.3 bar, 96 h Pass
8.3 Traceability Information
THB 85°C / 85 %RH, 1000 h Pass
All SHT2x are laser marked with an alphanumeric, five-
HTSL 150°C, 1000 h Pass digit code on the sensor – see Figure 21.
ELFR 125°C, 48 h Pass The marking on the sensor consists of two lines with five
ESD immunity HBM 4 kV, MM 200 V, CDM Pass digits each. The first line denotes the sensor type
750 V/500 V (corner/other pins) (SHT20). The first digit of the second line defines the
Latch-up force current of ±100 mA with Tamb Pass output mode (D = digital, Sensibus and I2C, P = PWM, S =
= 125°C SDM). The second digit defines the manufacturing year
(0 = 2010, 1 = 2011, etc.). The last three digits represent
Table 9: Performed qualification test series. HTOL = High an alphanumeric tracking code. That code can be decoded
Temperature Operating Lifetime, TC = Temperature Cycles,
by Sensirion only and allows for tracking on batch level
UHST = Unbiased Highly accelerated Stress Test, THB =
Temperature Humidity Biased. For details on ESD see Sect. 4.1.
through production, calibration and testing – and will be
provided upon justified request.
Sensor performance under other test conditions cannot be
guaranteed and is not part of the sensor specifications.
Especially, no guarantee can be given for sensor
performance in the field or for customer’s specific
application. SHT20
If sensors are qualified for reliability and behavior in D0AC4
extreme conditions, please make sure that they
experience same conditions as the reference sensor. It Figure 21 Laser marking on SHT20. For details see text.
should be taken into account that response times in Reels are also labeled, as displayed in Figure 22 and
assemblies may be longer, hence enough dwell time for Figure 23, and give additional traceability information.
the measurement shall be granted. For detailed
information please consult Application Note “Testing Lot No.: XXO-NN-YRRRTTTTT
Guide”. Quantity: RRRR
RoHS: Compliant

8 Packaging Lot No.

8.1 Packaging Type

SHT2x sensors are provided in DFN packaging (in
analogy with QFN packaging). DFN stands for Dual Flat Figure 22: First label on reel: XX = Sensor Type (20 for SHT20),
O = Output mode (D = Digital, P = PWM, S = SDM), NN =
No leads.
product revision no., Y = last digit of year, RRR = number of
The sensor chip is mounted to a lead frame made of Cu sensors on reel divided by 10 (200 for 2000 units), TTTTT =
and plated with Ni/Pd/Au. Chip and lead frame are over Traceability Code.
molded by green epoxy-based mold compound. Please
note that side walls of sensors are diced and hence lead

15 Temperature range is -40 to 125°C (AEC-Q100 temperature grade 1).

16 According to accuracy and long term drift specification given on Page 2.

www.sensirion.com Version 5 – October 2022 11/14

Datasheet SHT20

9 Compatibility to SHT1x / 7x protocol

SHT2x sensors may be run by communicating with the
Sensirion specific communication protocol used for SHT1x
Device Type: 1-100PPP-NN and SHT7x. In case such protocol is applied please refer
Description: Humidity & Temperature Sensor to the communication chapter of datasheet SHT1x or
SHTxx SHT7x. Please note that reserved status bits of user
Part Order No. 1-100PPP-NN or Customer Number register must not be changed.
Date of Delivery: DD.MM.YYYY Please understand that with the SHT1x/7x communication
Order Code: 46CCCC / 0 protocol only functions described in respective datasheets
can be used except for the OTP Reload function that is not
set to default on SHT2x. As an alternative to OTP Reload
Figure 23: Second label on reel: For Device Type and Part the soft reset may be used. Please note that even if
Order Number (See Packaging Information on page 2), Delivery SHT1x/7x protocol is applied the timing values of Table 5
Date (also Date Code) is date of packaging of sensors (DD = and Table 7 in this SHT2x datasheet apply.
day, MM = month, YYYY = year), CCCC = Sensirion order
number. For the calculation of physical values, the following
equation must be applied:
8.4 Shipping Package For relative humidity RH
SHT2x are provided in tape & reel shipment packaging,
sealed into antistatic ESD bags. Standard packaging sizes SRH
RH = − 6 + 125 
are 1500 and 5000 units per reel. For SHT20, each reel 2 RES
contains 440 mm (55 pockets) header tape and 200 mm and for temperature T
(25 pockets) trailer tape.
ST
The drawing of the packaging tapes with sensor T = − 46.85 + 175.72 
orientation is shown in Figure 24. The reels are provided in 2 RES
sealed antistatic bags.
8.0
Ø1.5 MIN
RES is the chosen respective resolution, e.g., 12 (12 bit)
2.0
1.75

0.3 4.0 Ø1.5 MIN

for relative humidity and 14 (14 bit) for temperature.

R0.3 MAX
10 Bibliography
5.5
12.0
3.3

[1] Sensirion, "Handling Instructions for Humidity

1.3
3.3
Sensors," 2020.
0.25
R0.25

Figure 24 Sketch of packaging tape and sensor orientation.

Header tape is to the right and trailer tape to the left on this
sketch.

www.sensirion.com Version 5 – October 2022 12/14

Revision History
Date Version Page(s) Changes
6 May 2009 0.3 1–9 Initial preliminary release
21 January 2010 1.0 1 – 4, 7 – 10 Complete revision. For complete revision list please require respective document.
5 May 2010 1.1 1 – 12 Typical specification for temperature sensor. Elimination of errors. For detailed
information, please require complete change list at info@sensirion.com.
31 May 2011 2 1 – 7, 10 – Updated temperature accuracy specifications, MSL and standards. Elimination of
13 errors. For detailed information, please require complete change list at
info@sensirion.com.
December 2011 3 1, 7-10 Tolerance of threshold value for low battery signal, minor text adaptations and
corrections.
May 2014 4 1-4, 7-8, 9-10 Sensor window dimension updated, several minor adjustments
October 2022 5 all Changed wait from 20 µs to 18.5 µs in Figure 16 and added a corresponding
clarification chapter: 5.8 I2C communication recommendation, corrected typos,
added bibliography, updated important notices.

www.sensirion.com Version 5 – October 2022 13/14

Datasheet SHT20

Important Notices
Warning, Personal Injury

Do not use this product as safety or emergency stop devices or in any other application where failure of the product could result in personal
injury. Do not use this product for applications other than its intended and authorized use. Before installing, handling, using or servicing this
product, please consult the data sheet and application notes. Failure to comply with these instructions could result in death or serious injury.

If the Buyer shall purchase or use SENSIRION products for any unintended or unauthorized application, Buyer shall defend, indemnify and hold harmless
SENSIRION and its officers, employees, subsidiaries, affiliates and distributors against all claims, costs, damages and expenses, and reasonable attorney
fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if SENSIRION
shall be allegedly negligent with respect to the design or the manufacture of the product.
ESD Precautions
The inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation,
take customary and statutory ESD precautions when handling this product. See application note “ESD, Latchup and EMC” for more information.
Warranty
SENSIRION warrants solely to the original purchaser of this product for a period of 12 months (one year) from the date of delivery that this product shall
be of the quality, material and workmanship defined in SENSIRION’s published specifications of the product. Within such period, if proven to be defective,
SENSIRION shall repair and/or replace this product, in SENSIRION’s discretion, free of charge to the Buyer, provided that:
• notice in writing describing the defects shall be given to SENSIRION within fourteen (14) days after their appearance;
• such defects shall be found, to SENSIRION’s reasonable satisfaction, to have arisen from SENSIRION’s faulty design, material, or workmanship;
• the defective product shall be returned to SENSIRION’s factory at the Buyer’s expense; and
• the warranty period for any repaired or replaced product shall be limited to the unexpired portion of the original period.
This warranty does not apply to any equipment which has not been installed and used within the specifications recommended by SENSIRION for the
intended and proper use of the equipment. EXCEPT FOR THE WARRANTIES EXPRESSLY SET FORTH HEREIN, SENSIRION MAKES NO
WARRANTIES, EITHER EXPRESS OR IMPLIED, WITH RESPECT TO THE PRODUCT. ANY AND ALL WARRANTIES, INCLUDING WITHOUT
LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE EXPRESSLY EXCLUDED AND DECLINED.
SENSIRION is only liable for defects of this product arising under the conditions of operation provided for in the data sheet and proper use of the goods.
SENSIRION explicitly disclaims all warranties, express or implied, for any period during which the goods are operated or stored not in accordance with
the technical specifications.
SENSIRION does not assume any liability arising out of any application or use of any product or circuit and specifically disclaims any and all liability,
including without limitation consequential or incidental damages. All operating parameters, including without limitation recommended parameters, must be
validated for each customer’s applications by customer’s technical experts. Recommended parameters can and do vary in different applications.
SENSIRION reserves the right, without further notice, (i) to change the product specifications and/or the information in this document and (ii) to improve
reliability, functions and design of this product.
Copyright © 2022, by SENSIRION. CMOSens® is a trademark of Sensirion. All rights reserved

Headquarters and Subsidiaries

Sensirion AG Sensirion Inc., USA Sensirion Korea Co. Ltd.
Laubisruetistr. 50 phone: +1 312 690 5858 phone: +82 31 337 7700~3
CH-8712 Staefa ZH info-us@sensirion.com info-kr@sensirion.com
Switzerland www.sensirion.com www.sensirion.com/kr

phone: +41 44 306 40 00 Sensirion Japan Co. Ltd. Sensirion China Co. Ltd.
fax: +41 44 306 40 30 phone: +81 3 3444 4940 phone: +86 755 8252 1501
info@sensirion.com info-jp@sensirion.com info-cn@sensirion.com
www.sensirion.com www.sensirion.com/jp www.sensirion.com/cn

Sensirion Taiwan Co. Ltd

phone: +886 3 5506701
info@sensirion.com
www.sensirion.com
To find your local representative, please visit www.sensirion.com/distributors

www.sensirion.com Version 5 – October 2022 14/14