0% found this document useful (0 votes)
31 views2 pages

Index

This 3-sentence summary provides the key details about the short course on semiconductor packaging: The document announces a short course from November 16-20, 2023 on semiconductor packaging technologies aimed at students, startups, scientists, and government officials, which will provide both lectures and hands-on lab training in packaging processes at IIT Bombay, along with networking opportunities for jobs at Kaynes SemiCon.

Uploaded by

dhivyabharathy
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
31 views2 pages

Index

This 3-sentence summary provides the key details about the short course on semiconductor packaging: The document announces a short course from November 16-20, 2023 on semiconductor packaging technologies aimed at students, startups, scientists, and government officials, which will provide both lectures and hands-on lab training in packaging processes at IIT Bombay, along with networking opportunities for jobs at Kaynes SemiCon.

Uploaded by

dhivyabharathy
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 2

Short Course on Semiconductor Packaging with Hands-on Training

Course Co-ordinator
16th November to 20th November 2023
Prof. Veeresh Deshpande
Course conducted by:
Department of Electrical Engineering
The Centre for Semiconductor Technologies (SemiX),
IIT Bombay,
Indian Institute of Technology Bombay (IITB)
Powai, Mumbai – 400 076
In association with: Kaynes SemiCon
Job role networking session with Kaynes SemiCon
Introduction Broad Objectives Who may benefit?
India is poised to grow its local semiconductor industry. The
The broad objectives of this course are as follows: • Students (graduated or about to
government of India has brought out India Semiconductor Mission
• To provide an overview of semiconductor graduate) looking for career in semi-
(ISM) to coordinate the efforts and set in place policy for growing the
packaging technologies in manufacturing packaging
semiconductor ecosystem. Several private companies are setting up
• To provide necessary fundamental theory and • Startups, Scientists, and Technical Staff
manufacturing units on chip packaging and testing (ATMP/OSAT). As
develop understanding of processes involved in • Government Officials
this is an emerging area, there is a skill gap at various levels (from PhD
packaging
to technicians) in the workforce in India. Particularly, the skill gap at
• To provide lab scale hands-on training on single
Lecture Notes
engineer and technician level (diploma/vocational training education To fully realize the objectives of the course,
chip packaging process steps with aim to make
level) needs to be bridged at the earliest, as the required workforce at the lecture notes/slides will be made
students quickly ramp-up in packaging job roles
this level will be the largest. The semiconductor chip packaging domain available to the participants after the event
• To provide interaction and networking for
needs to training and education options as this is the least developed in
students with Kaynes SemiCon for job
India.
opportunities in their upcoming OSAT fab. Registration
Course Content Per participant
Rs 80,000 /- for industry participants
Introduction to semiconductor technology and manufacturing Faculty Rs 40,000 /- for faculty from academia
Cleanroom environment and fundamentals Renowned faculty members from IIT Bombay Rs 75,000 /- for government officials
Semiconductor packaging: basic to advanced packaging technologies will deliver lectures along with industry Rs 25,000/- for students
Various unit process modules involved in semiconductor packaging professionals from Kaynes SemiCon. Lab sessions Rs 25,000/- for startup engineers
Discussion and test on course content will be led by experienced research staff from The course fee includes course material, lunch, and
Single chip packaging eyes-on and hands-on training IITBNF and Labs in Mechanical Engineering coffee/tea
Highlight: Interaction for job opportunities at Kaynes SemiCon Department

Accommodation Important Dates


Venue for Lectures and Labs Last date for receipt of the registration form:
Limited accommodation is available on a first-come-first-serve • Lectures - Victor Menezes Convention Centre 12th November 2023
basis (self-payment) in Hostels, IIT Bombay (VMCC), IIT Bombay Course dates: 16th Nov. to 20th Nov., 2023
– Rs 300 per person per day on sharing basis (Room rent + • Lab sessions – IIT Bombay Nanofabrication Facility
Mattress Charges) - Payment to be made in advance (IITBNF), Electrical Engineering Department, IIT Contact
cepsemix@ee.iitb.ac.in Bombay For any further queries, please contact us at
• Labs in the Mechanical Engineering Department office.semix@iitb.ac.in or 022-21593930

* Minimum educational requirement is a Diploma or Bachelor's Degree in Science/Engineering

You might also like

pFad - Phonifier reborn

Pfad - The Proxy pFad of © 2024 Garber Painting. All rights reserved.

Note: This service is not intended for secure transactions such as banking, social media, email, or purchasing. Use at your own risk. We assume no liability whatsoever for broken pages.


Alternative Proxies:

Alternative Proxy

pFad Proxy

pFad v3 Proxy

pFad v4 Proxy