".

Corporation
Continental Division
2000 S. 2S" Avenue
Broadview. IT. 60 I S3

X-Ray Tube #1 Warm up Procedure

1. Select the manual mode.
2. Select the 3-factor mode.
3. Select table top exposure mode.
4. Select the large focal spot.
5. Select the 200 rnA station.
6. Select 250 ms time. (mAs should read 50)
-1-- -,. Select 80 k Vp.
8. Make 5 exposures, @ 30 seconds apart.

The tube warm up procedure is complete.

X-Ray Tube #2 Warm up Procedure

1. Set up for fluoroscopy per the exam your are going to do first.
2. Place a single layer of a lead apron on the tabletop under the image
intensifier.
3. Position the table bucky under the lead apron and the image
intensifier so you have something to view on the monitor.
4. Press on the fluoroscopic button on the handle or step on the foot
pedal for 15 seconds.
5. Watch the fluoroscopic timer to monitor the 15 seconds oftime.
6. Watch the monitor also to make sure you have an image and that the
system is functioning properly for your first exam.

The tube warm up procedure is complete.

 , .....
'~

TRFXMedicnl Corporation
Continental Division "',
2000 S. 25" Avenue "

Broadview. IL 60153
.} .

X-Ray Tube Warm up Procedure

'"

1. Select the manual mode.

'I

2. Select the 3-factor mode.

!
3. Select table top exposure mode.

4. Select the large focal spot.

5. Select the 200 rnA station.

6. Select 250 ms time. (mAs should read 50)

7. Select 80ltV-p.

' . ". ~.
8. Make 5 exposures; @ .30 seconds apart.
#
.
-. ;•
\.

"

The tube warm;up procedure is complete.

r,o

--'-------,~-
~-'--,
TREK
Medical Corporation
MAS CONVERSION CHART
2000 S. 25th Ave.
Broadview, IL 60153
Phone (708) 345-3050
Fax (708) 345-1227
Continental Division (MAS) MILLIAMPERE-SECONDS E-mail: Trexmed.com

TIME/SECONDS
Fraction Decimal Millisecond
.003 3 .03 .05 .06 .08 .09 .15 .22 .30 .37 .45 .60 .90 1.2 1.5 1.8
.. 006 6 .06 .09 .12 .15 .18 .30 .45 .60 .75 .90 1.2 1.8 2.4 3.0 8.6
1/120 .008 8 .08 .12 .16 .20 .24 .40 .60 .80 1.0 1.2 1.6 2.4 3.2 4.0 4.8
.01 10 .10 .15 .20 .25 .30 .50 .75 1.0 1.2 1.5 2.0 3.0 4.0 5.0 6.0
.013 13 .13 .20 .26 .33 .39 .65 .98 1.3 1.6 2.0 2.6 3.9 5.2 6.5 7.8
.016 16 .16 .24 .32 .40 .48 .80 1.2 1.6 2.0 2.4 3.2 4.8 6.4 8.0 9.6
1/60 .0166 ..
.17 .25 .33 .42 .50 .83 1.3 1.7 2.1 2.5 3.3 5.0 6.6 8.3 10.0
.020 20 .20 .30 .40 .50 .60 1.0 1.5 2.0 2.5 3.0 4.0 6.0 8.0 10.0 12.0
1/40 .025 25 .25 .38 .50 .63 .75 1.3 '1.9 2.5 3.1 3.8 5.0 7.5 10.0 12.5 15.0
.032 32 .32 .48 .64 .80 .96 1.6 2.4 3.2 4.0 4.8 6.4 9.6 12.8 16.0 19.2
1/30 .033 33 .33 .50 .66 .83 .99 1.7 2.5 3.3 4.1 5.0 6.6 9.9 13.2 16.5 19.8
.040 40 .40 .60 .80 1.0 1.2 2.0 3.0 4.0 5.0 6.0 8.0 12.0 16.0 20.0 24.0
1/24 .042 42 .42 .63 .84 1.1 1.3 2.1 32.0 4.2 5.2 6.3 8.4 12.6 16.8 ' 21.0 25.2
1/20 .05 50 .50 .75 1.0 1.3 1.5 2.5 3.8 5.0 6.2 7.5 10.0 15.0 20.0 25.0 30.0
.063 63 .63 .95 1.3 1.6 1.9 3.2 4.7 6.3 7.9 9.5 12.6 18.9 25.2 31.5 37.8
1/15 .066 66 .66 .99 1.3 1.7 2.0 3.3 5.0 6.6 8.2 9.9 13.2 19.8 26.4 33.0 39.6
3/40 .075 . 75 .75 1.1 1.5 1.9 2.3 3.8 5.6 7.5 9.4 11.3 15.0 22.5 30.0 37.5 45.0
•
.08 80 .80 1.2 1.6 2.0 2.4 4.0 6.0 8.0 10.0 12.0 16.0 24.0 32.0 40.0 48.0
1/12 .083 83 .83 1.3 1.7 2.1 2.5 4.2 6.2 8.3 10.4 12.5 16.6 24.9 32.2 41.5 49.8
1/10 .10 . 1.0 1.5 2.0 2.5 3.0 5.0 7.5 10.0 12.5 15.0 20.0 30.0 40.0 50.0 60.0
5/40, 1/8 .125 1.25 1.9 2.5 3.1 3.8 6.3 9.4 12.5 15.6 19.0 25.0 37.5 50.0 62.5 75.0
2/15 .13 1.3 2.0 2.6 3.3 3.9 6.5 9.8 13.0 16.2 20.0 26.0 39.0· 52.0 65.0 78.0
3/20 .15 1.5 2.3 3.0 3.8 4.5 7.5 11.3 15.0 18.7 22.5 30.0 45.0 60.0 75.0 90.0
.16 1.6 2.4 3.2 4.0 4.8 8.0 12.0 16.0 20.0 ·24.0 32.0 48.0 64.0 80.0 96.0
7/40 .175 1.75 2.6 3.5 4.4 5.3 8.8 13.1 17.5 21.9 26.0 35.0 52.5 70.0 87.5105.0
2110, 1/5 .20 2.0 3.0 4.0 5.0 6.0 10.0 15.0 20.0 25.0 30.0 40.0 60.0 80.0 100.0 120.0
9/40 .225 2.25 3.4 4.5 5.6 6.8 11.3 16.9 22.5 28.1 33.8 45.0 67.5 90.0 112.5 135.0
MILLIAMPERE 10 15 20 25 30 50 75 100 125 150 200 300 400 500 600
 TIME/SECONDS
(MAS) MILLIAMPERE-SECONDS
Fraction Decimal
1/4 .25 2.5 3.8 5.0 6.3 7.5 12.5 18.8 25.0 31.2 38.0 50.0 75.0 100.0 125.0 150.0
3/10 .30 3.0 4.5 6.0 7.5 9.0 15.0 22.5 30.0 37.5 45.0 60.0 90.0 120.0 150.0 180.0
.32 3.2 4.8 6.4 8.0 9.6 16.0 24.0 32.0 40.0 48.0 64.0 96.0 128.0 160.0 192.0
4/10,215 .40 4.0 6.0 8.0 10.0 12.0 20.0 30.0 40.0 50.0 60.0 80.0 120.0 160.0 200.0 240.0
5/10, 1/2 .50 5.0 7.5 10.0 12.5 15.0 25.0 37.5 50.0 62.5 75.0 100.0 150.0 200.0 250.0 300.0
6/10,3/5 .60 6.0 9.0 12.0 15.0 18.0 30.0 45.0 60.0 75.0 90.0 120.0 180.0 240.0 300.0 360.0
.63 6.3 9.5 12.6 15.8 18.9 31.5 47.3. 63.0 78.8 95.0 126.0 189.0 252.0 315.0 378.0
7/10 .70 7.0 10.5 14.0 17.5 21.0 35.0 52.5 70.0 .87.5 105.0 140.0 210.0 280.0 350.0 420.0
3/4 .75 7.5 11.3 15.0 18.8 22.5 37.5 56.3 75.0 93.7 113.0 150.0 225.0 300.0 375.0 450.0
8/10,4/5 .80 8.0 12.0 16.0 20.0 24.0 40.0 60.0 80.0 100.0~ 120.0 160.0 240.0 320.0 400.0 480.0
9/10 .90 9.0 13.5 18.0 22.5 27.0 45.0 67.5 90.0 112.5 135.0 180.0 270.0 360.0 450.0 540.0
1 1.0 10.0 15.0 20.0 25.0 30.0 50.0 75.0 100.0 125.0 150.0 200.0 300.0 400.0 500.0 600.0
1 1/4 1.25. 12.5 18.8 25.0 31.3 37.5 62.5 93.8 125.0 156.3 188.0 250.0 375.0 500.0 625.0 750.0
1.3 13.0 19.5 26.0 32.5 39.0 65.0 97.5 130.0 162.5 195.0 260.0 390.0 520.0 650.0 780.0
1 1/2 1.5 15.0· . 22.5 . 30.0 37.5 45.0 75.0 112.5 150.0 187.5 225.0 300.0 450.0 600.0 750.0 900.0
1.6 16.0 24.0·· ·32.0 40.0 48.0 80.0 120.0 160.0 200.0 240.0 320.0 480.0 640.0 800.0 960.0
1 3/4 1.75 17.5 26.3 35.0 43.8 52.5 87.5 131.3 175.0 218.8 263.0 350.0 525.0 700.0 875.0 1050.0
2 2.0 20.0 30.0 40.0 50.0 60.0 100.0 150.0 200.0 250.0 300.0 400.0 600.0 800.0 1000.0 1200.0
21/4 2.25 22.5 33.8 45.0 56.3 67.5 112.5 168.8 225.0 281.3 338.0 450.0 675.0 900.0 1125.0 1350.0
21/2 2.5 25.0 37.5 50.0 62.5 75.0 125.0 187.5 250.0 312.5 375.0 500.0 750.0 1000.0 1250.0 1500.0
23/4 2.75 27.5 41.3 55.0 68.8 82.5 137.5 206.3 275.0 343.7 413.0 550.0 825.0 1100.0 1375.0 1650.0
3 3.0 30.0 45.0 60.0 75.0 90.0 150.0 225.0 300.0 375.0 450.0 600.0 900.0 1200.0 1500.0 1800.0
3.2 32.0 48.0 64.0 80.0 96.0 160.0 240.0 320.0 400.0 480.0 640.0 960.0 1280.0 1600.0 1920.0
3114 3.25 32.5 48.8 65.0 81.3 97.5 162.5 243.8 325.0 406.3 488.0 650.0 975.0 1300.0 1625.0 1950.0
31/2 3.5 35.0 52.5 70.0 87.5 105.0 175.0 262.5 350.0 437.5 525.0 700.0 1050.0 1400.0 1750.0 2100.0
3 3/4 3.75 37.5 56.3 75.0 93.8 112.5 187.5 281.3 375.0 468.8 563.0 750.0 1125.0 1500.0 1875.0 2250.0
4 4.0 40.0 60.0 80.0 100.0 120.0 200.0 300.0 400.0 500.0 600.0 800.0 1200.0 1600.0 2000.0 2400.0
MILLIAMPERE 10 15 20 25 30 50 75 100 125 150 200 300 400 500 600

TREX
Medical Corporation
2000 S. 25th Ave.
Broadview, IL 60153
Phone (708) 345-3050
Fax (708) 345-1227
Continental Division E-mail: Trexmed.com
 , ,

, (

TRf;.X Medical Corporation·

CONTINENTAL Division

FIELD SERVICE BULLETIN

FSB 4295.262.12

TM GENERATOR
PWS MODIFICATIONS

RETROFIT BULLETIN
4295.262.12 Revision 9903
Specifications subject to change without notice.
 © 1999 by Trex Medical Corporation. All rights reserved. No part of this document may be reproduced,
stored in a retrieval system, or transcribed, in any form or by any means, electronic, mechanical,
photocopying, recording, or otherwise, without the prior written permission of Trex Medical Corporation,
Continental Division.

Printed in the United States of America.

(
TREX Medical Corporation
Continental Division
2000 South 25th Avenue
Broadview, Illinois 60153.
Phone: 708 345 3050
Fax: 708345 1227
· ,
TM GENERATORS PWS MODS
RETROFIT UPGRADE 4295.262.12

1.0 GENERAL
This document provides the information and procedures required to modifY existing 3cp 150KV Power
Supply Units in TM40L, TM50, TM65 and TM80 X-ray Generators.

The program is intended to reduce catastrophic failures of components in the field and improve
performance of X-ray generators.

1.1 SCOPE
This field modification consists of the following basic steps:

• removing the existing Power Supply (contactor) Panel

• installing a new Power Supply (contactor) Panel

• installing a new Main Circuit Breaker assembly behind the Auto Transformer

• moving and remounting the AUX contactor and auxiliary power strip (TB9) assembly

• removing the main line fuses, the SCR fuse and the fuse blocks

installing new connector blocks and circuit breaker.

Note: You will need to access the front and rear of the TM RPU cabinet. Access to the right of the unit will
be helpful.

Anticipated time to complete: 8 Hours.

Notel
On some generators, the existing resistors R12, R13 and R14 are 100 watts. The new
power supply/contactor panel has R12, R13 and R14 as 50 watts. This is not a concern
for this modification.
(
2.0 PREREQUISITES

A. HARDWARE
The following represents the Parts List (9526.206) dated 10-30-98 for this retrofit kit:

Part # Description Qty.

-121.1032.0457 10-32 x 1/4 Pan Steel Philips Screw 2 ea.

-121.1032.1657 10-32 x 1 Pan Steel Philips Screw 4 ea.
-123.1310.20 .20410, .43800, .032 T, Mach Screw Washer 4 ea.
-123.4102.40 #10 Medium Pattern Split Lockwasher 4 ea.
- 4295.262. 12 TM Generator PWS Modification 1 ea.
- 4260.262.03 Insulator Panel w/silk screen 1 ea.
- 5187.262.60 Main CB 115 VAC Power Cable 1 ea.
- 5187.262.64 Inverter Power Upgrade Cable 1 ea.
- 5187.262.6401 TM 80 Inverter Power Upgrade Cable 1 ea.
- 5187.262.67 J62 Adapter Cable 1 ea.
- 5285.262.12 TM Pre-charge Circuit Breaker Assembly 1 ea.
- 5485.262.2103 TM 150Kv Upgrade PWS Panel Assembly 1 ea.
- 5485.262. 27 TM Main Circuit Breaker Assembly 1 ea.
-766.1054 5.5 " Cable Ties 12 ea.
-766.1114 11.5 " Cable Ties 12 ea.
- 762.8522.1110 Terminal Lugs #10-#12 AWG 1/4" Yellow 2 ea.
B. DOCUMENTATION:

[E 9026.253 TM Generator Maintenance Manual Addendum

[E 5187.262.64 Drawing, cable.
[E 5187.262.6401 Drawing, TM 80 cable.

150 kV RETROFIT BULLETIN 9903

1
 TM GENERATORS PWS MODS
RETROFIT UPGRADE 4295.262.12

3. TOOLS REQUIRED

Standard Tool Kit including the following:

~ Phillips Screwdriver (magnetized tip preferred)
~ Wire Cutter
~ Adjustable wrench
~ Socket head wrench (10-32)
~ Crimper Tool

DIODE DP4

(
R12

M4-Ro CONTACTOR

FIGURE 1 EXISTING POWER SUPPLY PANEL ASSEMBLY

4.0 RETROFIT PROCEDURE

The following sequence is recommended to allow for any problems that may be encountered during the
retrofit procedure.

1. Remove Power at the main Disconnect. Also disconnect all auxiliary power connections and
the "Room In Use" light connection.

WARNINGI
Ensure all power to the X-ray generator has been removed and
that 5 MINUTES have elapsed to allow for discharge of any stored
energy components, before attempting access within this area.

9903 2 150 kV RETROFIT BULLETIN

 TM GENERATORS PWS MODS
RETROFIT UPGRADE 4295.262.12

4.1 Disassembly of existing Power Supply Panel Assembly (see FIGURE 1)

(
" 1. Remove the front, side, and back covers of the RPU cabinet.

( 2. Temporarily label and disconnect the following wires .

..; 3. At M3 MAIN Contactor, disconnect #10 BlK wires "2-T1", "4-T2", and "6-T3".
~~\l. GeI2I
/ 3. At M7 AUX Contactor, disconnect ~ wires "7 -l4", "8-T4", WfooI..T wire "1-l 1", and
BlK wire "3-l2".

For RlF systems: also disconnect the BLUE wire form A 1 and the WHT/BlUE wire from
A2 that go to M7A, which is mounted on the Power Terminal Strip

v4. At resistor R 14 - disconnect #10 BlK wire "P2".

/5. At M4-RD Contactor, disconnect #10 BlK wire "P1".

vi. At M6 BLEEDER Contactor, disconnect ORGIWHT WIRE "A2" and ORG wire "A1".

v13. At DIODE DP4, disconnect #8 BlK wires "+" and "-".

locate the Power Terminal Strip (with Aux. Contactor M7A if RtF System).Disconnect and
discard wires from TB9-1 (115Vl) and TB9-8 (115VT)

For RlF units: disconnect and discard the wires going to the coil connections A 1 and A2
of the M7A contactor)

(10. locate the two 6-pin Molex connectors (P61 and P62) which you should find at the bottom
of the Power supply shelf. Note: some older units will not have a P62 Molex.
( In units with both P61 and P62: disconnect both P61 and P62

In units without P62: CDDisconnect P61. ®Since units without this connector may have
different color wire connections, it will be necessary to individually remove these wires
that in newer units would connect through a "P62". These wires should now be the last
remaining wires that need to be disconnected in order to remove the "old" assembly.
These wires should be temporarily labeled and disconnected from:

• M3 (Main) terminal 14
• M7-A2
• M7- A1
• M7-2T1
• M7-4T2

Dismount the Power Terminal Strip (with Aux. Contactor M7A if RtF System) and set it
aside. There are probably some wires still connected to it but it should not be necessary
to remove them. If you decide to remove them, make sure you temporarily mark them for
easy re-connection later. Move the assembly aside. It will be remounted later in section
4.2.

Remove existing Power Supply Panel Assembly by removing the four Phillips screws that
secure it. Note: behind the panel, there is a spacer associated with each screw. Be
careful to save this hardware because you will need it to install the new panel.

4.2 Installation of New Power Supply Panel and Main Circuit Breaker Assembly

Install the new Power Supply Panel Assembly 5485.262.2103.

Install Main Circuit Breaker Assembly 5485.262.27 (see FIGURE 2), using provided

150 kV RETROFIT BULLETIN 9903

3
 TM GENERATORS PWS MODS
RETROFIT UPGRADE 4295.262.12

TM 150kV Upgrade ClrcuH Brakllr Asm.

PWS Panel Asm. (5485.262.27)
(5485.262.2103)

M7A

New posHlon for

thll Powllr Strip

9026-072

FIGURE 2 POWER SHELF (REAR VIEW)

Phillips screws and washers.

3. Connect matching connectors:

( - P61 to J61,
- P63 to J63, and
- P64 to J64

For units with P62: connect P62 to J62

For units without P62: Use the Following table to connect the pig tails of the P62
adapter plug to the wires that were disconnected in section 4.1 step 10.

WIRE MARKED CONNECT TO P62 wire color LJ Co5

...JV..-.l~~~ 2,Lil;\r
Wl.\fTE"" M3 (Main) terminal 14
\

V White / Blaek (pin 3) <..Jt,~3

-7 J)Lu£ ...:::> BUJl£jw#r(c

M7 -A2 L
/'~
Blue /White (pin 2)
,~

BtUl';jwll1re M7-A1 Light Blue (pin 5) t/oT NE c-Ll ~ £J )JaTo J ~

((3 Q.~I J 13 e.r-J M7-2T1 V/ BroWn (pin 1)

( I3l-AC0 BLAc.K .M7-4T2 vi . Black ( pin 4)

Refer to Schematic 4494.262.50 and Interconnect Diagram 4293.262.27 to ensure

accurate connections of these wires.

/so Connect new BLACK wires (from the new Power Supply Panel assembly), 115VL to TB9-
1 and 115VT to TB9-8. On RtF units, connect new Lt ..BLUE wire (from the new Power
Supply Panel assembly) to M7A -A1 and new BLUIWHTwire to M7A-A2.0n Rad units,
ensure that these two wire ends (Lt. BLUE and BLUIWHT) are insulated and tie them
down.
Gt;;b'-/
Connect wires,~wire "1-L 1" and BLK wire "3-L2" , that were removed and tagged in

9903 4 150 kV RETROFIT BULLETIN

 TM GENERATORS PWS MODS
RETROFIT UPGRADE 4295.262.12
section 4.1 step 3 to a "pig tail" emanating from the new power supply assembly. This a
two conductor cable with red butt splices pre-installed to white and black wires. Match the
colors black to black and white to ~ and crimp the new connections with an
appropriate crimping tool. 6et?1

Connect #10 BLK wires from Circuit Breaker CB2 to DP3-AK, DP4-AK and DP5-AK.

8. Using Interconnect Drawing 4293.262.27, connect the three #10 BLK wires from Main
Circuit Breaker CB-2 to Auto Transformer TB6-4, TB7-4 and TB8-4.

Reconnect #10 BLK wire "P2" to resistor R14.

Reconnect #10 BLK wire "P1" to contactor M4-RD.

Reconnect ORGIWHT wire "A2" and ORG wire "A1" to M6 Bleeder contactor.

Reconnect #8 BLK wires "+" and "-" to diode DP4. t'iote: ON TM40L UNITSI It will be
necessary to replace the existing terminal lugs of these two wires with the provided
yellow terminal lugs (#10~#12 AWG 1/4").

Reinstall Power Terminal Strip (with Aux Cont. M7A for RlF system) to its new location, as
shown in Figure 2.

Install additional cabling into harness

/1. Pull the card cage chassis out on its drawer slides and rotate the left side in and the right
side out. Locate the Multi-Output Transformer TB1.

Disconnect the white/yellow wire from TB1-3 (third one down from the top ). Cut the
white/yellow wire at its terminal and strip the end back 1/4". Using the butt-splice
provided with new cable 5187.262.60 , connect the stripped end of WHTIYEL wire to
GRN wire going to J65-3.
(
Connect the red wire from the new cable part# 5187-262-60 to TB1-3.

Unplug the Molex connector going to the cooling fan in the card cage. If you have an RlF unit
you may also have a fan mounted in the top panel of the RPU. In either case, install the new
cable in series with either connection by plugging the male connector of the new cable into
the female connector of the existing wiring harness and the female connector of the new
cable into the male connector of the existing fan connection.

tis. Run the cable, following the existing wiring harness to ensure that the card cage can be
pulled out and rotated in the future. Connect other end of new cable part# 5187-262-60 (with
connector J65) to matching connector P65 from the harness of the new Main Circuit Breaker
Assembly.

4.3 Disassembly of Fuse Blocks and Installation of Pre-Charge Cct. Breaker Assy.

A On the ,Power Supply Chassis Assembly (front of TM-RPU), remove and discard #8 BLK
wire between Capacitor C15 on the Inverter Shelf and SCR fuse F9 (top terminal).

/2. Remove and discard #8 BLK wire and #18 RED Teflon wire from the bottom terminal of F9
to , Anode Heat Sink of the Main Inverter (TM40, 50 a-nd 65) or top front terminal of choke
assembly (TM 80, see photo 2)and TB 5-1 of the Gate Drive PCB.

Remove and discard #18 WHT Teflon wire from C16 and TB 5 -2 Gate Drive PCB. C16 is
located towards the front of the unit and is connected in parallel with C15. (Silk screen on the
mounting board may call both of these capacitors C 15.)

For TM80 units: Install new cable 5187.262.6401 where wires were removed in Steps 2 and
3 above. (See cable drawing 5187.262.6401) See Photo 2:
~ Connect the #10 wire to terminal where the wire was removed in step 2.

150 kV RETROFIT BULLETIN 9903

5
 TM GENERATORS PWS MODS
RETROFIT UPGRADE 4295.262.12

~ Connect the white Teflon wire's spade connector to. TB5-2 on the Gate Drive Board
and its ring terminal to C16, where the previous white Teflon wire was connected.
~ Connect the red Teflon wire's spade connector to TB5-1 on the Gate Drive Board.
~ Connect the #10 and red Teflon wire's common connection to C 16, opposite the
terminal where the white Teflon wire is connected.

/~orTM40, 50 and 65 units: Install new cable 5187.262.64 (See cable drawing 5187.262.64
, and Photo 1)
~ Connect the #10 wire to the anode heat sink in new location to threaded hole two
inches above its former connection point and attached from the rear (see Photo 1)
~ Connect the white Teflon wire's-spade connector to TB5-2 on the Gate Drive Board
and its ring terminal to C16, where the previous white Teflon wire was cOIJI1ected.
~ Connect the red Teflon wire's spade connector to TB5-1 on the Gate Drive Board.
~ Connect the #10 and red Teflon wire's common connection to C16, opposite the

0·
-
terminal where the white Teflon wire is connected.

Disconnect three #8 BLK wires from the top terminals of line fuses F10, F11 and F12.

A Also disconnect Power Line Cable from the bottom terminals of F1 0, F11 and F12.
/;. Remove line fuses F10, F11 and F12 and its Fuse Block.

v 8. Remove SCR fuse and its fuse block.

~. Temporarily remove the neutral connector block.

vAo. Remove and discard the existing Insulator Panel.

/11. Install new Phenolic Insulator Panel w/silk screen and secure it by re-installing the neutral
connector block.
e V 12 . Using existing threaded holes on the power supply chassis, install the Pre-Charge Circuit
Breaker Assembly 5285.262.12. (See FIGURE 3).

03· Connect Power Line Cable and #8 BLK wires from Steps 7, 6 above to Power Terminal
Blocks L 1, L2, L3 on Assembly 5285.262.12.

1/14. Refer to Interconnect Drawing 4293.262.27. Connect #10 BLK wires 2-T1 , 4-T2 and 6-T3
from contactor M2 "Surge-1" on the Power Supply Panel Assembly 5485.262.2103 to 6-A
circuit breaker CB1 top 3 terminals. Cables are marked 5187.262.27.

V 15 . Connect attached #10 BLK wires from Auto Transformer TB6-4, TB7-4 and TB8-4 to CB1
bottom terminals.

06. Using Interconnect Drawing 4293.262.27, connect 2-conductor 18 AWG cable from
connector J64 to Aux. normally-open contact of Circuit Breaker CB1 terminals 13 and 14.
Refer to Drawing 5285.262.12 for details. When CB 1 is viewed from the front, the red wire
is connected to the top rear and the black wire to the bottom rear contact on part number
4181 .262.2701 shown in the drawing.

V 17. Use the supplied cable ties to dress the wiring.

9903 6 150 kV RETROFIT BULLETIN

 TM GENERATORS PWS MODS
RETROFIT UPGRADE 4295.262.12

@)
0

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(5285.262.12)
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0
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0

'--"--'----..Jl.....L---'-_ _ _ _'"--_ _ _ _ _ _..lLL.--La...JJIILl----'.....JL.!J' 9026-073

FIGURE 3 POWER SHELF (FRONT VIEW)

4.4 Testing the Upgrade Just Installed:

The unit will not need to be re-calibrated due to this change in hardware. However, the best way to test the
unit is to view the kV and mA waveforms as though you were calibrating the unit. See chapter 3 of the TM
manual.
(
1. Make exposures using the following table for techniques.

Test Techniques
150 mA 40KV 60KV 125 KV 150KV

200mA 40KV 60KV 125 KV 150KV

MAXmA at MAX KV possible

2. If the waveforms are correct and you do not experience any error codes, the installation of the upgrade is
successful. If you do experience any error codes or incorrect waveforms; double check all your connections
and try the test again_

If you have any further problems contact TREX / Continental technical support at 708-345-3070.

Please take the time to fill out the Field Upgrade Report included at the front of this bulletin. Then
mail or fax the same to:
Trex Medical Corporation,
Field Service Dept.,
2000 South 25th Ave.
Broadview, IL. 60153.
Fax: (708) 345 3075.

This completes modifications to the 150Kv TM Generator Power Supply

150 kV RETROFIT BULLETIN 9903

7
 TM GENERATOR PWS MODS
RETROFIT UPGRADE 4295.262.12

Photo1
(

(
Photo 2

150 kV RETROFIT BULLETIN 9903

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FINISH. CONTINENTAl
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TREX MEDICAL
FINISH: CONTINENTAL
DIVISION
( Important:
Before referencing any section of the manual this addendum must
first be consulted if the generator incorporates the new power supply
components. These new components can be recognized by the lack
of main line fuses and the presence of new circuit breakers CB1 and
CB2. See figures 1-1 & 1-2 in Section 1 for component locations.

The following sections of this addendum supplant specific sections of the TM manual.

Addendum Section 1: Installation - RE: Power Connection

Addendum Section 2: Calibration - RE: Line Match and Simulated Mode

Addendum Section 3: Theory of Operation - RE: Power On Sequence

Addendum Section 4: Troubleshooting - RE: Error codes that will display if the circuit
breakers open or are not closed prior to turn on

Addendum Section 5: Electrical Information - RE: New Schematics

(
Addendum Section 6: Mechanical Information - RE: New exploded diagrams with part
numbers.

30 150 KV ADDENDUM 9892

 SECTION 1 -INSTALLATION

1.1 POWER CONNECTION

1. Connect 3 phase line power to the connector block shown in figure 2 .Reference Schematic 4494.262.50
for input power in SECTION 5 of this addendum.

TM 150kV Upg .. de CB2

pws PaneIAam.- Main Circuit Breaker
(5485.262.2103)

( 9026-072

FIGURE 1-1 POWER SHELF (REAR VIEW)

Power
- Connector
Block

CBl
Circuit
/-- Braaker

"9891-ERM

FIGURE 1·2 POWER SHELF (FRONT VIEW)

30 150 KV ADDENDUM 1-1 9892

 SECTION 2 - CALIBRATION

2.1 INCOMING POWER (replaces section 3.2.3 of the TM Maintenance Manual)

Verify that the incoming line voltage is matched to the auto-transformer. (Reference Schematic 4494.262.S0
for input power in SECTION 5 of this addendum.) Measure the line voltage at the disconnect and connect
the line matching wire to the connection which corresponds to the closest match.
1. Turn OFF the inverter power supply [SW1], on the fuse box (FIGURE 2-3, or 2-4 in the TM
Maintenance Manual).
2. On the power supply shelf or turn CB1 OFF. CB1 is located next to the input power terminals (see
FIGURE 1-2 of this addendum).
3. Verify all HV transformer connections are in accordance with the RPU INTERCONNECT WIRING
DIAGRAM in SECTION 8 of the TM Generator Manual.
4. Turn incoming power ON at the disconnect box.
S. Measure the output voltage of the autotransformer:
TM40 34>, SO/60 Hz TB6-4 to TB7-4; TB7-4 to TB8-4; TB8-4 to TB6-4 =380 ±S%
TMSO/6S 34>, SO/60 Hz TB6-4 to TB7-4; TB7-4 to TB8-4; TB8-4 to TB6-4 = 3S1 ±S%
TM80 34>, SO/60 Hz TB6-4 to TB7-4; TB7-4 to TB8-4; TB8-4 to TB6-4 = 3S1 ±S%
If not correct, find the source of the problem before continuing.
6. Turn power OFF.
7. Continue at section 3.2.4 of the TM Maintenance Manual
2.2 SIMULATED EXPOSURE (Replaces Section 3.4 of the TM Maintenance Manual.)
1. On the kVp control PCB: Remove jumpers EKVO, EKV3, and EKV9 to disable fail checks during
this procedure.
2. On the rnA/mAs control PCB: Remove the jumper EMA3, to disable filament power supply check,
and install jumper EMAO, to disable Flag 21 (Filament Low Error)and Flag 7(mA Low Error).
3. On the I/O control PCB: Close SW1-8.
( Lh WARNING:
SW1-8 WILL ALLOW X-RAYS TO BE MADE WITH THE ROTOR NOT RUNNING. THIS IS
CLOSED ONLY FOR THIS PORTION OF CALIBRATION (TM MAINTENANCE MANUAL
SECTIONS3ATHROUGH3J!

Lh WARNING:
ENSURE THE CB1 PRE-CHARGE CIRCUIT BREAKER IS TOGGLED OFF (AS PER STEP 2 OF
SECTION 2.1 OF THIS ADDENDUM

4. On the card cage: Toggle OFF CB1 (filament supply), CB2 and CB3 (rotor supply). (See figures
2-3 and 2-4 of the TM Maintenance Manual)
S. Press [SW1] (inverter switch) ON.

Lh WARNING:
MAKE SURE THAT THE TM GENERATOR HAS BEEN OFF FOR AT LEAST 5 MINUTES!

6. Turn the TM on at the Operator's Console.

7. Measure the Charge on the Inverter Power supply. This can be done at the bottom two terminals
of the Gate Drive Board TBS-1 and TBS-2. Ensure that this voltage is ZERO Volts. IF IT IS NOT,
TURN POWER OFF AND WAIT UNTIL THIS VOLTAGE HAS DROPPED TO ZERO VOLTS! Then
return to step 6.
8. Select: MANUAL MODE, 3-Factor, 40 kVp, 25 rnA, and 500 ms.
9. Press both [PREP] and [X-RAY] and observe that LEOs 1, 2, 3, and 4 on the SCR Gate Drive PCB
are dimly lit (gate drive signals). The LEOs must be watched very closely for they are dim, and flash
very fast.
(
30 1S0 KV ADDENDUM 2-1 9892
 Lb, NOTE:
If you release the exposure switch prior to the end of the two second exposure, you will see a
FLAG 1. If you let the exposure terminate on its own, you will see a FLAG 12. During the prep and
expose, you should observe no other error codes.
This tests the communications of the OC to the RPU. This also tests other computer functions of the TM.
The lack of other error codes appearing is a sign that the computerized section of the TM circuits are
functioning correctly.
10. Turn the OC OFF.
11. On the kVp control PCB: Re-nstall jumpers EKVO, EKV3, and EKV9.

2.3 NO LOAD KVP TEST (Replaces Section 3.5 of the TM Maintenance Manual.)
The following procedure is used to make a no-load KVP test at full 1S0kVp level. Safety sensing circuits
will be disabled during this test. It is therefore imperative that they be enabled after completion. This test
confirms that the generator operating functions are in good order.
1. Return Surge Circuit Breaker (CB1) to the ON position.(See FIGURE 1)
2. Toggle Filament Circuit Breaker (CB1), Mains Circuit Breaker (CB2), and Rotor Circuit Breaker
(CB 3) OFF.(see figures 2-5 and 2-6 of the TM Maintenance Manual)
3. On the kV Control PCB: Install ·um er EKV8.
Lb, WARNING:
EKVS IS INSTALLED ONLY FOR THIS TEST. DO NOT ATTEMPT TO MAKE AN X-RAY
EXPOSURE WITH EKVS INSTALLED.
4. On the 1/0 Control PCB: Ensure SW1-8 is closed.
5. On the mAl mAs Control PCB: Ensure EMA3 is out and EMAO is in as per step 2 of section 2.2
6. On the kVp Control PCB: Connect a storage scope between TP (ground) and TP3 and set it as
follows: Positive slope, Sms/DIV, 1V/DIV
7. Place at least 2" (S.1cm) of oil in each cable receptacle. (
8. Set the operator control for 40kVp, 2SmA and .SmAs. There will be no mA and therefore no mAs,
but the above settings will normally allow for a short no-load shot for the first attempt.
Lb, NOTE:
Each time the HV inverter fires a pair of SCRs a ticking sound will be heard from the invertor shelf
area of the RPU. This sound is normal, The ticking will increase in frequency each time the
no-load exposure is done at a higher KVP.

9. Push the PREP button and when the PREP switch illuminates, tap the X-RAY button ON for the first
attempt at No Load.

Lb, Note:
The exposure will terminate in approximately 250 ms, and an Error 12 flag (Exposure Time Limit
Error) will appear on the console. This error is normal. Press [RESET] and continue. If any other
error terminates the exposure, the error must be investigated and the appropriate action taken.
10. Inspect the kV Feedback ramp waveform. It should consist of 6 to 8 steps with an amplitude of
about .4V and a time of about 2ms to 3ms for each step.
11. Set the scope for .2sec/DIV, select 30 mAs and repeat STEP 9.
12. Press the X-RAY button ON and hold for about 1 second.
13. Increase the kV in SkV steps all the way to maximum kVp, making a No-Load shot at each step.
This concludes the No-Load Test. Return all jumpers and circuit breakers to there normal operating
positions as per the following steps. (See also TABLE 8-8 TABLE 8-10, and TABLE 8-11 of the TM
Maintenance Manual.)
14. On the 1/0 Control PCB: Open switch SW1-S. This switch MUST be open to allow the rotor to spin
during an exposure.

30150 KV ADDENDUM 2-2 9892

 15. On the kVp Control PCB: Remove jumper EKV8.
\,
16. On the rnA/mAs Control PCB: Remove jumper EMAO and install it at EMA3.
17. On the card cage: Toggle CB1, CB2, and CB3 ON.
2.4 FILAMENT CHECK (RADIOGRAPHIC TUBE) (Replaces Section 3.6 of the TM Maintenance Manual.)
1. Coat the HV cables ends with vapor proof compound. Insert the connector into the x-ray tube.
Place approximately 6cc of oil in high-voltage receptacles on transformer assembly and insert the
cables into the generator.
2. If a collimator is present, open the blades fully, and move the mirror out of the way (see the
collimator manufacturers manual). If the mirror cannot be moved out of the way, remove the
collimator for this check.
3. Turn ON the OC.
4. Select: MANUAL MODE, 40 kVp, 25 rnA, 5 mAs, LARGE FOCUS.
5. Press PREP onl and observe via an ins ection mirror, that the lar e filament is illuminated.

~
DO NOT PRESS EXPOSE! IT IS NECESSARY TO S~AND
ASIDE OF THE POTENTIAL X-RAY
PATH AND USE AN INSPECTION MIRROR TO OBSERVE THE FILAMENT TO ENSURE THE

6. Select: SMALL FOCUS, and press [PREP] and observe via the mirror that the small filament is
illuminated.
7. Install the collimator if removal was necessary.
2.5 FILAMENT CHECK (FLUOROSCOPIC TUBE) (Replaces Section 3.7 of the TM Maintenance Manual.)
1. Remove the table top per instructions in the table Maintenance Manual.
2. Select Tube #2 and perform SECTION 2.4 for the fluoroscopic tube.
3. Replace the top per the table Maintenance Manual.

Continue at section 3.8 of the TM Maintenance Manual.

(

/-', "

,j:

" .'

: ...:

30 150 KV ADDENDUM 2-3 9892

 SECTION 3 -THEORY OF OPERATION
\.

3.1 3e1> POWER SUPPLY

The mains input range is from 204 VAC through 480 VAC 60 Hz and 380 V-3NE through 415 V-3NE, 50
Hz. The mains must be line matched to the auto-transformer via TB6, TB7 and TB8. The auto-transformer
steps the power input voltage up or down to either 351 VAC or 380 VAC.

On 150 kVp power units, the 351 VAC or 380 VAC output voltage is applied to the power rectifiers through
a surge current circuit breaker (CB1), connected to the two surge contactors (M2 and M10), and then
through the main circuit breaker (CB2). The purpose of the surge contactors is to limit the initial charging
current to the capacitor bank of C1's and C2's. Upon power on, if the inverter power switch is on, surge
contactor (M2), with its associated 10 Ohm 50 Watt current limiting resistors, activates for approximately 2
seconds. This charges the capacitors to approximately 99 % of final value. Contactor M10, with its
associated 1 Ohm 100 Watt resistors, then operates, releasing M2, and completes the charge cycle.
Approximately 10 seconds later, the main circuit breaker (CB2) energizes. The 351 VAC is rectified and
filtered to provide approximately 490 volts DC, or if at 380 VAC to 540 volts DC for the high-voltage inverter.

There is a 24-hour Power Supply that provides power distribution to the control circuitry when the system
is turned on by the ON/OFF switch on the Operator Console. There is a bleeder relay on this supply that
places the bleeder resistors (R6 & R7) across the large filter capacitors whenever the unit is turned off.
Additionally, there is a switch to turn off M2, M10 and CB1 to de-activate the 500 volt supply for use in
troubleshooting.

30 150 KV ADDENDUM 3-1 9892

 SECTION 4 -TROUBLESHOOTING

4.1 EFFECTED ERROR CODES.

FLAG 21 FILAMENT LOW ERROR:

The 16 VAC power supply to the Gate Drive Board is interlocked by the Main Circuit Breaker CB1 and Main
Relay K1. Therefore; if the main breaker trips or if it is in the 0 "off" position (due to the unit being powered
on with CB1 tripped or in the off position) a FLAG 21 FILAMENT LOW ERROR will occur on PREP.

(See TM Generator Maintenance Manual Section 7 for full use of error codes).

30 150 KV ADDENDUM 4-1 9892

( SECTION 5 - ELECTRICAL INFORMATION

5.1 The Following Schematics are provided:

4194.262.29 UNDER VOLTAGE RELEASE FILTER

4293.262.27 TM 3-PH 150 KV MAIN POWER SUPPLY INTERCONNECT

4293.262.151 TM 80 INVERTER T-NETWORK WIRING DIAGRAM

4294.262.082 TM 80 INVERTER T-NETWORK SCHEMATIC

4294.262.083 TM 150 KV RlF INVERTER T-NETWORK SCHEMATIC

4494.262.50 TM 150 KV POWER SUPPLY SCHEMATIC

(,
30 150 KV ADDENDUM 5-1 9892
( TRf;'l(.Medical Corporation th
2000 South 25 Street Telephone: (708) 345-3050
Continental Division Broadview, Illinois 60153 Fax: (708) 345-3075

MEMORANDUM

Date: 03/09/99

To: Field Service Organizations

From: Customer Service

RE: New Power Supply Description

(
In order to enhance your understanding of the new
150kY, 3-phase power supply, attached is a chapter
from our TM training manual describing its
functionality. Of special value may be the chart
found on the last page which details, chronologically,
the specific condition of all power supply
components.

We hope you find this information helpful.

 TM Generator Theory Training 11

( Circuit Circuit functions:

Description • Provides line matching for the TM.
• Step charges the KV Inverter Power Supply Capacitors through a series of
contact closures eventually providing a direct connection to the main power
line via an auto transformer.
• Provides an interlock to prevent exposure in case of a tripped circuit
breaker.
• Provides protection for the Inverter and it's power supply components.
Circuit Flow:
Initial Conditions: CB 1 is closed, CB2 is in the "Tripped" condition and Inverter
Power On/Off Switch is pushed "in" (closed).
1. Turning the power on at the wall provides 220 VAC to the 24 Hour Power
Supply PCB T1 which converts 220 to 24VAC
2. Engaging the "Power on" switch at the console energizes K2 of the24 Hour
Power Supply PCB which energizes K1 of the same board, the M7 and
M7A AUX Contactors and the K4 (Inverter Power Relay). K1 energizes the
bleeder contactor M6.
( 3. The AUX contactor (M7) provides 220 VAC to the Under Voltage Release
of CB2. This enables CB2 to be set on or off. This 220 also powers the
Multi-Output Transformer (M. O. T) which in turn provides power to the
many power supplies in the TM RPU and also the OC causing "booting" of
both microprocessors.
4. The M.O.T. then provides 117 VAC to Time Delay Relay-1 through CB1 aux
contact and normal closed contacts of K1 (pins 1 and 7). The time delay is
set to 750 ms by R55. This relay acts as an open connection until the time
delay period is over. At that time it becomes a complete connection.
5. After the 750 ms delay, K3 (SO) energizes providing:
• 220 VAC to the motor of CB2 which drives it into the closed (out of
"tripped") or "0" position. This motor current must pass through nor-
mally closed contacts of K2 (pins 1&5). \Nhen CB2 reaches the
closed position, an internal limit switch terminates the current to the
motor.
• 24 VAC to the coil of M2 (Surge Relay-1) through K4 (6&4) and the
normally closed contact of M1 0 (Surge Relay-2).
6. M2 energizing provides:
• Main line voltage (through 10 Ohm resistors) to the KV Inverter
Power Supply.
 TM Generator Theory Training 12

• The closing of M2's aux contact bringing power to Time Delay

Relay-2 through normally closed contacts of K2 (2&6) by way of C B 1
aux contact (still closed). This starts a time delay of 1.5 seconds set
by R54.
7. After the 1.5 second delay, M10 (Surge Relay-2) energizes. This brings the
main line power to the Inverter power supply through the 1.0 Ohm resistors
R50,51 and 52. The physical nature of contacts on M1 0 causes time delays
in the opening and closing of three aux contacts.
• 1st contact closes and bypasses the aux of M2 (which is the "keep
alive" for M1 0)
• 2nd contact opens and drops out M2 (Surge Relay-1)
• 3rd contact closes and enables Main Relay K1 (but doesn't close it)
8. Eight seconds after "booting" the RPU microprocessor, a software signal is
sent via the Relay I OC Power Supply PCB (J7 pins 1&2). This signal
closes K1 (Main Relay). This 24 VAC signal is present for only 1 second.
This would cause K1 to drop out at the end of that time period but most
likely it will remained latched through the "Trip Position" contact of CB2
(which is closed unless CB2 is tripped). This signal passes through the 3rd
contact of M1 0 (mentioned above) to close K1.
9. K1 (Main Relay) closing causes K2 ("SC") to close and that provides 220
VAC power to CB2's motor to close the breaker to the "ON" or "1" position.
This motor current must pass through K3 (1 &5). K2 also drops out M1 0
( (Surge-2) when the K2 contact at pins 2&6 opens.
1O.An exposure interlock is provided by K1 pins 9&6 which passes a 16 VAC
biasing power supply to the Filament Inverter. If CB2 were to trip, this
would drop out K1 and remove this power from the filament inverter. This
would prevent the Filament Inverter from running and would cause a Flag
21 Filament Low Error at Prep.
11. A second contact of the Inverter Power OnlOff switch (SW1 B) sends a sig-
nal to the RPU microprocessor via the Rad Field 1/0 PCB J6 pins 1 & 2. If
the Switch is not "IN" (closed) a Flag 53 Surge Relay Not Energized will be
displayed on the console at Prep. This signal also restarts the 8 second
time delay if this switch has been activated after the TM is already on. The
hardware and software actions of this switch allow the Inverter Power Sup-
ply to be turned on or off by this switch although there is no diagnostic
(troubleshooting) advantage to do so.

Links TM 150 KV Power Supply Schematic

TM Main Circuit Breaker Schematic Detail
Contactor Closure Table
Photographic Locator

Error Codes If this circuit fails, the most likely error codes are:
FLAG 21 FILAMENT LOW ERROR
 ,~
,,~ ~

Contactor Pre - Power On Power On after 750 ms 1.5 sec. asec. after 9 sec. after JtCB2
(or Power Off) Later Power On Power On TRIPS
CB1 Closed Closed Closed Closed Closed Closed Closed
CB2 Tripped Tripped Open Relaxed Closed Closed Tripped
Inverter Power IN IN IN IN IN IN IN
Switch

Under Voltage Disable Enable State Enable State Enable State Enable State Enable State Enable State
Release State

Inverter Power Relaxed Energized Energized Energized Energized Energized Energized

Relay K4
SC Relay K2 Relaxed Relaxed Relaxed Relaxed Energized Energized Relaxed
SO Relay K3 Relaxed Relaxed Energized Energized Relaxed Relaxed Relaxed
Main Relay K1 Relaxed Relaxed Relaxed Relaxed Energized Energized Relaxed

JLP Main
~
Contactor On Not Present Not Present Not Present Not Present Present Not Present Not Present
signal

Surge 1 Relaxed Relaxed Energized Relaxed Relaxed Relaxed Relaxed

Contactor M 2
Surge 2 Relaxed Relaxed Relaxed Energized Relaxed Relaxed Relaxed
Contactor M 10
24 hr PS Relaxed Energized Energized Energized Energized Energized Energized
K1
24 hr PS Relaxed Energized Energized Energized Energized Energized Energized
K2
Bleeder Relaxed Energized Energized Energized Energized Energized Energized
Contactor
AUX Contator Relaxed Energized Energized Energized Energized Energized Energized
Console Power Relaxed Energized Energized Energized Energized Energized Energized
-
Switch

Yellow highlight indicates change from previous state.

 ,

"

JI-I A
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750
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750
~ 750
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750 v
I J3-1

IW IW IW IW
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~~ ~~

( J2-1 -'J4-1
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--
REV. DATE CODE ORG. APP.
00 9892 WLW UNDER VOLTAGE RELEASE FILTER 4194.262.29
(
CONTINENT AL
A SUBSIDIARY OF
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00 9873 GP TM80 INVERTOR T-NETVlORK 4293,262.151
VlIRING DIAGRAM
MATI
TREX MEDICAL
F"INISH' COM7NENTAL
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TREX MEDICAL
 SECTION 6 - MECHANICAL INFORMATION

6.1 The Following Mechanical Diagrams are provided:

5285.262.12 TM PRE-CHARGE CIRCUIT BREAKER

5485.262.2103 TM 150 UPGRADE PWS PANEL

5485.262.27 TM MAIN CIRCUIT BREAKER

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4127.262.02 (3)
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5187.262.59 - Wiring Harness II
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sure that all wQshers
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 TREX..Medical Corporation
CONTINENTAL Division

TM SERIES

X-RAY GENERATORS

MAINTENANCE MANUAL
9026.251, Revision 9890
Specifications subject to change without notice.
 (

© 1998 by Trex Medical Corporation, Continental Division. All rights reserved. No part of this manual
may be reproduced, stored in a retrieval system, or transcribed, in any form or by any means,
electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of
Trex Medical Corporation, Continental Division.

Printed in the United States of America.

Trex Medical Corporation,

(
Continental Division,
2000 South 25th Avenue,
Broadview, Illinois 60153.
Telephone: (708) 345 3050
Fax: (708) 345 1227
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

TABLE OF CONTENTS
( SECTION PAGE
SECTION 1 - GENERAL
1.1 SCOPE .............................................................. 1-1
1.1.1 NOTES, CAUTIONS, & WARNINGS ....................................... 1-1
1.2 DESCRiPTION ........................................................ 1-1
1.2.1 SYSTEM ARCHITECTURE .............................................. 1-3
1.2.2 MODES OF OPERATION ............................................... 1-4
1.2.3 FEATURES .......................................................... 1-4
1.2.4 OPTIONS ............................................................ 1-5
1.3 SPECiFiCATIONS ..................................................... 1-5
1.3.1 INPUT POWER REQUIREMENTS ........................................ 1-5
1.3.2 RADIOGRAPHIC SPECiFiCATIONS ....................................... 1-6
1.3.3 FLUOROSCOPIC SPECIFICATIONS: ..................................... 1-7
1.3.4 TOMOGRAPHIC SPECIFICATIONS (SERVO TOMO OPTION ONLY) ............ 1-8
1.3.5 PHYSICAL SPECiFiCATIONS ............................................ 1-8
1.4 COMPATIBILITY ...................................................... 1-9
1.4.1 X-RAY TUBES ........................................................ 1-9
1.4.2 BEAM LIMITING DEVICES .............................................. 1-9
1.4.3 X-RAY TABLES ....................................................... 1-9
1.4.4 CASSETTE HOLDERS ................................................. 1-9
1.4.5 IONIZATION AUTOMATIC EXPOSURE CONTROL SYSTEMS .................. 1.9
1.4.6 HIGH SPEED ROTOR CONTROLS ...................................... 1.10
1.5 CDRH COMPLIANCE ................................................. 1-10
1.6 HAZARDOUS MATERIALS ............................................. 1-10

SECTION 2 -INSTALLATION
( 2.1
2.2
ELECTRICAL REQUIREMENTS .......................................... 2-1
MECHANICAL REQUIREMENTS ......................................... 2-3
2.3 MATERIAL REQUIRED ................................................. 2-3
2.4 UNPACKING ......................................................... 2-4
2.5 INSTALLATION OF THE OPERATOR CONTROL ............................ 2-4
2.6 INSTALLATION OF THE REMOTE POWER UNIT & AUXILIARY CABINETS ....... 2-5

SECTION 3 - CALIBRATION
3.0 EQUIPMENT REQUIRED ............................................... 3-1
3.1 INTRODUCTION ...................................................... 3-1
3.2 PRELIMINARY INSPECTION ............................................ 3-5
3.2.1 RPU AND OC INSPECTION ............................................. 3-5
3.2.2 HIGH VOLTAGE GENERATOR CHECK .................................... 3-5
3.2.3 INCOMING POWER ............................................. '.' .... 3-6
3.2.4 X-RAY TUBE AND HIGH VOLTAGE (HV) CABLE CHECK ..................... 3-6
3.2.5 GATE PULSE COUNTER JUMPER CHECK ................................. 3-6
3.3 SETUP ROUTINES .................................................... 3-7
3.3.1 ENABLE PC COMMUNiCATIONS ......................................... 3-7
3.3.2 X-RAY TUBE 1 SETUP ................................................. 3-7
3.3.3 X-RAY TUBE 2 SETUP ................................................. 3-8
3.3.4 FLUORO SETUP ...................................................... 3-8
3.3.5 PRINTER SETUP ...................................................... 3-9
3.3.6 TOMO SETUP ........................................................ 3-9
3.4 SIMULATED EXPOSURE ............................................... 3-9
3.5 NO LOAD kVp TEST .................................................. 3-10
3.6 FILAMENT CHECK (RADIOGRAPHIC TUBE) .............................. 3-10
3.7 FILAMENT CHECK (FLUOROSCOPIC TUBE) .......... _ ................... 3-11
3.8 TEST ROUTINES ..................................................... 3-11
3.8.1 SYSTEM INFORMATION .............................................. 3-11
3.8.2 HEAT UNITS and RTC ................................................ 3-11

TABLE OF CONTENTS 9890

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

TABLE OF CONTENTS (
SECTION PAGE
3.8.3 AEC V/F CHECK and CAL .............................................. 3-11
3.8.4 ION CHAMBER FIELD DRIFT CHECK .................................... 3-12
3.9 CALIBRATION - GENERAL ............................................. 3-13
3.9.1 CABLE LENGTH COMPENSATION ...................................... 3-13
3.9.2 PRECALIBRATION ................................................... 3-13
3.9.3 X-RAY TUBE CONDITIONING PROCEDURE - EUREKA TUBES ONLy ......... 3-15
3.10 CALIBRATION ....................................................... 3-18
3.10.1 FLUORO STANDBY FILAMENT CALIBRATION ............................ 3-18
3.10.2 FILAMENT PREHEAT CALIBRATION ..................................... 3-18
3.10.3 rnA CALIBRATION .................................................... 3-19
3.10.4 kVp CALIBRATION ................................................... 3-20
3.10.5 PREHEAT POST-CALIBRATION ........................................ 3-21
3.10.6 MAS CALIBRATION ................................................... 3-21
3.10.7 POINT PREHEAT CALIBRATION ........................................ 3-22
3.10.8 RADIOGRAPHIC STANDBY FILAMENT CALIBRATION (SW Ver 3.8.3 and above) . 3-22
3.10.9 PREHEAT BOOST ADJUST (SW Ver. 3.8.3 and above) ...................... 3-22
3.10.10 UNDERTABLE STANDBY FILAMENT CALIBRATION (SW Ver 3.8.5 & above) .... 3-23
3.10.11 PREHEAT BOOST ADJUST ............................................ 3-23
3.11 CEC (COMPUTERIZED EXPOSURE CONTROL) DATA MODIFICATION ........ 3-24
3.11.1 CEC RECEPTOR AND FOCUS SELECTION ............................... 3-24
3.11.2 CEC kVp AND mAs SELECTION ........................................ 3-24
3.12 AUTOMATIC EXPOSURE CONTROL (AEC) SYSTEM SETUP ................. 3-25
3.13 AEC CALIBRATION ................................................... 3-26
3.13.1 AEC V/F CALIBRATION ............................................... 3-26
3.13.2 %CURVE CALIBRATION ............................................... 3-26
3.13.3 %POINT CALIBRATION ............................................... 3-27
3.13.4 TRIP MAX VALUE ADJUSTING PROCEDURE ............................. 3-28
3.14 ANATOMICAL PROGRAMMED RADIOGRAPHY (APR) SETUP ................ 3-30
3.15 ANATOMICAL PROGRAMMED RADIOGRAPHY (APR) CALIBRATION .......... 3-31
3.15.1 APR VERIFICATION .................................................. 3-31
3.15.2 APR %MASTER CALIBRATION ......................................... 3-31
3.15.3 APR %SIZE CALIBRATION ............................................. 3-31
3.15.4 CALIBRATION OF SIZES BASED ON % CHANGE FROM MEDIUM ............ 3-32
3.16 FLUORO mAlkV CALIBRATION CONTINUOUS MODE ....................... 3-33
3.17 PULSED FLUORO rnA CALIBRATION .................................... 3-35
3.20 ABS CALIBRATION - NICAL CAMERA .................................... 3-39
3.21 APR AND CEC PROGRAMMING ........................................ 3-40
3.21.1 REPROGRAMMING CEC EXAMS ....................................... 3-40
3.21.2 REPROGRAMMING APR EXAMS ....................................... 3-40

SECTION 4· OPERATION
4.1 RADIOGRAPHIC MODE - TUBE #1 ....................................... 4-1
4.1.1 MANUAL ............................................................ 4-1
4.1.2 COMPUTERIZED EXPOSURE CONTROL (CEC) ............................ 4-1
4.1.3 ANATOMICALLY PROGRAMMED RADIOGRAPHY (APR) ..................... 4-1
4.1.4 BIT MODE ........................................................... 4-4
4.2 FLUOROSCOPIC MODE - TUBE #2 ....................................... 4-4
4.3 FRONT PANEL DESCRIPTION ........................................... 4-5
4.4 STEPPING OPTION SELECTION ......................................... 4-9
4.5 REMOTE FLUOROSCOPIC CONTROL PANEL .............................. 4-9
4.6 CCD CAMERA CONTROL ............. _ .•.............................. 4-11
4.7
4.8
TOMO EXPOSURE CONTROL .......................................... 4-12
PRINTER ........................................................... 4-12
(

9890 ii TABLE OF CONTENTS

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

TABLE OF CONTENTS
( SECTION PAGE
4.9 ERROR CODES ...................................................... 4-13
4.9.1 SYSTEM FLAGS - 1 THROUGH 15 ...................................... 4-13
4.9.2 SYSTEM FLAGS - 16 THROUGH 43 ..................................... 4-13
4.9.3 SYSTEM FLAGS - 48 THROUGH 50 ..................................... 4-13
4.9.4 SYSTEM FLAGS - 51 THROUGH 63 ..................................... 4-13
4.9.5 SYSTEM FLAGS - 64 THROUGH 68 ..................................... 4-14
4.9.6 SYSTEM FLAGS - 80 THROUGH 87 ..................................... 4-14

SECTION 5 - MAINTENANCE
5.0 INTRODUCTION ...................................................... 5-1
5.1 MAINTENANCE SCHEDULE ............................................. 5-1
5.2 SPECIAL TOOLS ...................................................... 5-2
5.3 OPERATOR MAINTENANCE ............................................ 5-2
5.4 REMOVE/REPLACE OPERATIONS ....................................... 5-2
5.4.1 SCR REPLACEMENT .................................................. 5-2
5.4.2 HIGH VOLTAGE GENERATOR REPLACEMENT ............................ 5-3
5.4.2.1 SELECTION OF CAPACITORS ........................................... 5-3
5.4.3 FEEDBACK ISOLATION PCB REPLACEMENT .............................. 5-3

SECTION 6 - THEORY OF OPERATION

6.1 OVERVIEW .......................................................... 6-1
6.2 HIGH FREQUENCY INVERTER PRINCIPLES ............................... 6-1
6.3 OPERATOR CONTROL ................................................ 6-3
6.4 RPU MICROPROCESSOR PCB .......................................... 6-5

c
6.5 mA/mAs CONTROL PCB ................................................ 6-6
6.6 kVp CONTROL .......................................................• 6-7
6.7 110 CONTROL ........................................................ 6-7
6.8 AEC INTERFACE ...................................................... 6-8
6.9 RELAY/OC POWER SUPPLY ............................................ 6-8
6.10 RAD FIELD I/O ........................................................ 6-8
6.11 FLUORO FIELD I/O .................................................... 6-9
6.12 GATE DRIVE ......................................................... 6-9
6.13 HIGH-FREQUENCY INVERTER .......................................... 6-9
6.14 1cj> POWER SUPPLY .................................................. 6-10
6.15 3cj> POWER SUPPLY .................................................. 6-10

SECTION 7 - TROUBLESHOOTING
7.1 SYSTEM FLAGS ...................................................... 7-1
7.2 AEC TROUBLESHOOTING .............................................. 7-8
7.2.1 ION CHAMBER PRESET AND INSTALLATION (AID ION CHAMBER) ............ 7-8
7.2.2 CHAMBER AMPLIFIERS AND FILM/SCREEN AMPLIFIER UNITY GAIN CHECK ... 7-9

SECTION 8 - ELECTRICAL INFORMATION

8.1 RAD FIELD I/O (6584.262.01) ........................................... 8-1
8.2 RPU MICROPROCESSOR PCB (6284.262.02) .............................. 8-3
8.3 I/O CONTROL PCB (6284.262.05) ........................................ 8-5
8.4 mA/mAs CONTROL PCB (6284.262.06) .................................... 8-5
8.5 kV CONTROL PCB (6284.262.07) ......................................... 8-7
8.6 AEC INTERFACE PCB (6284.262.04) ...................................... 8-8
8.7 OC MICROPROCESSOR PCB (6484.262.03) ............................... 8-9
8.8 POWER PROTECTION COMPONENTS .................................. 8-10
8.9 SCHEMATICSIWIRING DIAGRAMS .· ..................................... 8-11

SECTION 9 - MECHANICAL INFORMATION

TABLE OF CONTENTS iii 9890

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

10.1
SECTION 10 - COMPLIANCE TESTING
TEST EQUIPMENT ....... " ................. , ..... " ............... " 10-1
(
10.2 LINE REGULATION ....... " ...................... '" ............... " 10-1

TABLE OF CONTENTS
SECTION PAGE
10.3 rnA, mAs, TIME, AND kVp ACCURACY ................................... 10-1
10.4 LINEARITY ............ , '" ...... , ....... , ........................... 10-1
10.5 REPRODUCIBILITY ................................................... 10-2
10.6 AUTOMATIC EXPOSURE CONTROL (AEC) ............................... 10-2
10.7 EXPOSURE FUNCTIONS .............................................. 10-2
10.8 LABELS .. , .............................. " ......................... 10-2
10.9 SOFTWARE VERSIONS ............................................... 10-3
10.10 SYSTEM CONFIGURATION ............................................ 10-3
TM SERIES GENERATOR COMPLIANCE TESTING RECORD ................ 10-5
1.0 LINE REGULATION ................................ " ....... " ...... " 10-5
2.0 kVp, rnA, TIME, mAs ACCURACY ...................................... " 10-6
3.0 LINEARITY ......................................................... 10-11
4.0 REPRODUCIBILITY ........................... , ... '" ................ 10-13
5.0 AEC .............................................................. 10-14
6.0 EXPOSURE FUNCTIONS ... " .... , ...... , .......... , ................. 10-15
7.0 LABELS ........................................................... 10-15
8.0 SOFTWARE VERSIONS .............................................. 10-15
9.0 SYSTEM CONFIGURATION ........................................... 10-16
10.0 GENERATOR PROBLEM LOG .............. , .......................... 10-17

APPENDIX A - TM GENERATOR PC INTERFACE PROGRAM OVERVIEW, VERSION

1.0 TO START THE PROGRAM ON A FLOPPY DRIVE (NO HARD DRIVE) ........ " A-1 (
2.0 TO INSTALL THE PROGRAM ON A HARD DRIVE .......................... A-1
3.0 TO START THE PROGRAM ON A HARD DRIVE ............................ A-1
4.0 MAIN MENU ....................................................... " A-2
5.0 EXAM MENU ........................................................ A-2
6.0 COMMUNICATION MENU ............................................ " A-2
7.0 CONFIGURATION MENU .............................................. A-2
8.0 ENTERING OR MODIFYING AN EXAM ................................... A-3
9.0 INSTALLATION OF MEMORY CHIPS ................................... " A-3
10.0 TRANSFERRING THE DATA ................ " ...................... '" A-3
11.0 USING THE SUPPLIED GENERAL RADIOGRAPHY EXAMS .................. A-4
12.0 TM MENU TREE ..................................................... A-4

9890 iv TABLE OF CONTENTS

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

LIST OF FIGURES
( FIGURE PAGE
1-1 TM GENERATOR COMPONENTS, SMALL RPU ............................. 1-3
1-2 TM GENERATOR COMPONENTS, LARGE RPU ............................. 1-3
1-3 RPU MAJOR SUBASSEMBLIES .......................................... 1-4

2-1 TM COMPONENT DIMENSIONS ......................................... 2-3

2-2 TM SHIPPING DIMENSIONS ............................................ 2-4
2-3 TM 30 & 40 RPU BASE ................................................. 2-5
2-4 1-TUBE, 1<1> RPU PROTECTION COMPONENT LOCATION .................... 2-6
2-5 1-TUBE, 3<1> RPU PROTECTION COMPONENT LOCATION .................... 2-7
2-6 2-TUBE, 3<1> RPU PROTECTION COMPONENT LOCATION .................... 2-7
2-7 HIGH VOLTAGE GENERATOR CONNECTIONS ............................. 2-8
2-8 RPU WIRE ROUTING .................................................. 2-8
2-9 COVER INSTALLATION ............................................... 2-10

3-1 PCB LOCATIONS ..................................................... 3-2

3-2 HV GENERATOR J2 PINOUTS ........................................... 3-5
3-3 OPERATOR CONTROL SWITCH LOCATION ............................... 3-7
3-4 PREHEAT WAVEFORMS (rnA) .......................................... 3-14
3-5 PREHEAT WAVEFORMS .............................................. 3-21

4-1 TM GENERATORS OPERATOR CONTROL PANEL .......................... 4-5

4-2 REMOTE FLUOROSCOPIC CONTROL .................................... 4-9
4-3 CCD CAMERA CONTROL ............................................. 4-10

5-1 SCR INSTALLATION ................................................... 5-2

( 6-1 EQUIVALENT CIRCUIT ................................................. 6-2
6-2 FULL BRIDGE INVERTER CIRCUIT ....................................... 6-2
6-3 SINGLE PULSE SCR CONDUCTION ...................................... 6-2
6-4 DOUBLE PULSE SCR CONDUCTION ..................................... 6-3
6-5 HALF H-BRIDGE INVERTER ............................................ 6-4

8-1 HIGH SPEED STARTER CONNECTIONS ................................. 8-13

8-2 COLLIMATOR WIRING ................................................ 8-13
8-3 BUCKY WIRING ...................................................... 8-14

9-1 TM SERIES X-RAY GENERATOR ........................................ 9-1

9-2 RPU CABINET COVERS ................................................ 9-3
9-3 CARD CAGE ASSY .................................................... 9-4
9-4 1<1> POWER SUPPLY CHASSIS ASSY (5585.262.08) LAYOUT .................. 9-6
9-5 3<1> POWER SUPPLY CHASSIS ASSY (5585.262.05) LAYOUT .................. 9-7
9-6 INVERTERIT-NETWORK ASSY (5585.262.06) LAYOUT ....................... 9-8
9-7 HIGH VOLTAGE GENERATOR LAYOUT ................................... 9-9
9-8 TM SERIES OPERATOR CONTROL (5585.262.04) .......................... 9-10

(
~-

TABLE OF CONTENTS v 9890

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

LIST OF TABLES (
TABLE PAGE
1-1 1-TUBE RAD MODELS ................................................. 1-1
1-2 2-TUBE RAD MODELS ................................................. 1-2
1-3 2-TUBE RlF MODELS .................................................. 1-2
1-4 1-TUBE RlF MODELS .................................................. 1-2
1-5 1-TUBE FLUORO MODELS ............................................. 1-2
1-6 TM GENERATOR INPUT POWER REQUIREMENTS ......................... 1-5
1-7 ACCURACY .......................................................... 1-6
1-8 RADIOGRAPHIC TECHNIQUE RANGES ................................... 1-6
1-9 STATOR CONTROL ................................................... 1-6
1-10 GENERATOR OUTPUT POWER RATING .................................. 1-7
1-11 FLUOROSCOPIC TECHNIQUE RANGES .................................. 1-7
1-12 TOMO TECHNIQUE SPECIFICATIONS .................................... 1-8
1-13 PHYSICAL SPECIFICATIONS, INSTALLED ................................. 1-8

2-1 MINIMUM POWER SUPPLY REQUIREMENTS .............................. 2-2

3-1 CALIBRATION SEQUENCES FOR TM GENERATOR FAMILIES ................ 3-2

3-2 CHAMBERIAEC INTERFACE PCB TEST POINTS ........................... 3-12
3-3 TUBE CONDITIONING TABLE .......................................... 3-16
3-4 mASELECTION AND kVp STEPS FOR HIGH VOLTAGE TEST ............... 3-17
3-5 kVp REFERENCES ................................................... 3-18
3-6 mA REFERENCES ................................................... 3-18
3-7 kVp CALIBRATION SELECTIONS........................................ 3-20
3-8 FILM/SCREEN 1 BODY SIZE TABLE .................................... 3-27

4-1 3-FACTOR TECHNIQUES ............................................... 4-2 (

4-2 2-FACTOR TECHNIQUES ............................................... 4-2
4-3 BIT MODE TECHNIQUES - 3 FACTOR .................................... 4-3
4-4 BIT MODE TECHNIQUES - 2 FACTOR .................................... 4-3

5-1 MAINTENANCE SCHEDULE ............................................. 5-2

6-1 OPERATOR CONTROL INDICATORS ..................................... 6-4

6-2 OPERATOR CONTROL SWITCHES ...................................... 6-5
6-3 FIELD I/O CONNECTIONS .............................................. 6-8
6-4 FLUORO FIELD I/O CONNECTIONS (continued) ............................. 6-9

7-1 AEC POTENTIOMETER SETIINGS ....................................... 7-8

7-2 CHAMBER AMP UNITY GAIN ADJUST .................................... 7-9
7-3 FILM/SCREEN UNITY GAIN ADJUST ...................................... 7-9

8-1 RAD FIELD I/O PCB (6584.262.01) TERMINAL BLOCK CONNECTIONS .......... 8-1
8-2 RAD FIELD I/O PCB (6584.262.01) JUMPER OPERATIONAL POSITIONS ........ 8-3
8-3 RAD FIELD I/O PCB (6584.262.01) LEOs ................................... 8-3
8-4 RPU MICROPROCESSOR PCB (6284.262.02) SWITCH SETIINGS ............. 8-3
8-5 RPU MICROPROCESSOR PCB (6284.262.02) JUMPER SETIING .............. 8-4
8-6 RPU MICROPROCESSOR PCB (6284.262.02) LEOs ......................... 8-4
8-7 I/O CONTROL PCB (6284.262.05) ........................................ 8-5
8-8 I/O CONTROL PCB (6294.262.05) SWITCH OPERATIONAL POSITIONS ......... 8-5
8-9 mA/mAs CONTROL PCB (6284.262.06) LEOs ............................... 8-5
8-10 . mA/mAsCONTROL PCB (6284.262.06) JUMPERPOSITIONS ................... 8-6
8-11 kV CONTROL PCB (6284.262.07) JUMPER OPERATIONAL POSITIONS ......... 8-7 (
8-12 kV CONTROL PCB (6284.262.07) LEOs .................................... 8-7
8-13 AEC INTERFACE PCB (6284.262.04) JUMPER OPERATIONAL POSITIONS ...... 8-8

9890 vi TABLE OF CONTENTS

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

LIST OF TABLES
TABLE PAGE
8-14 AEC INTERFACE PCB (6284.262.04) LEDs ................................. 8-8
8-15 OC MICROPROCESSOR PCB (6484.262.03) LED ERROR CODES ............. 8-9
8-16 OC MICROPROCESSOR PCB (6484.262.03) OPERATIONAL SWITCH SETIINGS . 8-9
8-17 POWER DISTRIBUTION/PROTECTION COMPONENTS ..................... 8-10
8-18 ASSEMBLYIWIRING DIAGRAM/SCHEMATIC CROSS REFERENCE ............ 8-11

9-1 TM30 X-RAY GENERATOR PARTS LIST ................................... 9-1

9-2 TM40 X-RAY GENERATOR PARTS LIST ................................... 9-2
9-3 RPU CABINET COVERS PARTS LIST ..................................... 9-3
9-4 CARD CAGE ASSY (5585.262.07) PARTS LIST ............................. 9-5
9-5 1<jJ POWER SUPPLY CHASSIS ASSY (5585.262.08) PARTS LIST ............... 9-6
9-6 3<jJ POWER SUPPLY CHASSIS ASSY (5585.262.05) PARTS LIST ............... 9-7
9-7 INVERTERIT-NETWORK ASSY (5585.262.06) PARTS LIST .................... 9-8
9-8 1-TUBE HIGH VOLTAGE GENERATOR (6536.200) PARTS LIST ................ 9-9

l
TABLE OF CONTENTS vii 9890
TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

LIST OF EFFECTIVE PAGES (

R8L REASON
9700 Initial release under Trex
pAGES
All

R8L REASON
9741 Added reference to schematic in the table
and added schematics
PAGES
vii
1-1,8
2-1,3.4,8,9
3-1,5,6,9 thru 13,26,27,34,35
5-1,3
8-6,7,11,12

R8L REASON
9777 TUV Certification, Schematic/Diagram
Organization, & Flag #11 Update/clarification
EAG.ES
TiUepage, TOC, Chapters 1, 2, 4, & 8.

R8L REASON
9874 Revised Sectn. 4.5
PAGES
TTLpg, TOC, all in Sectn. 4, all of Sectn. 10.
(
R8L REASON
9890 New Addendum to the manual and revisions
to Chp. 8, toc.
EAG.ES
TTLpg, 8-11, viii

l
9890 viii TABLE OF CONTENTS
(

ADDENDUM 1 to TM Series Maint. Manual # 9026.251

X-Ray Tube Warm..up procedure

1. Select the manual mode.

2. Select the 3-factor mode.

3. Select table top exposure mode.

4. Select the large focal spot.

5. Select the 200 mA station.

6. Select 250 ms time. (mAs should read 50)

7. Select 80 kVp.

8. Make 5 exposures, @ 30 seconds..apart.

c The Tube warm up procedure is complete.

Page 1 of 2
 X-Ray Tube #1 Warm lip procedure (
1. Select the Manual mode.

2. Select the 3-factor mode.

3. Select the table top exposure mode.

4. Select the large focal spot.

5. Select the 200 rnA station.

6. Select 250 ms time. (mAs shonld read 50)

7. Select 80 kVp.

8. Make 5 exposures, @ 3fi.secan.ds.Jlpart.

The Tube warm up procedure is complete.

X-Ray Tube #2 Warm lip procedure

(
1. Set up for fluoroscopy per the exam you are going to do first.

2. Place a single layer of a lead apron on the table top under the image intensifier.

3. Position the table bucky under the lead apron and the image intensifier so you
have something to view on the monitor.

4. Press the fluoroscopic button on the handle or step on the foot pedal for 15
seconds.

5. Watch the fluoroscopic timer to monitor the 15 seconds of time.

6. Watch the monitor also to make sure you have an image and that the system is
functioning properly for your first exam.

The Tube warm up procedure is complete.

Page20f 2
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

SECTION 1 - SPECIFICATIONS
(
1.1 SCOPE
This chapter provides the architect, room layout designer, and installer with the information necessary to
properly plan an installation using the TM X-ray generator. This chapter can be configured two ways: it may
be supplied as a separate entity, or as chapter one of the TM X-Ray Generator Maintenance Manual.

• If it is supplied as a pre-installation information package, it will be a stand-alone document containing

all the information required to plan for the proper and safe installation of the generator. It will be
supplied with an identifYing cover sheet.
• If it is contained within the Maintenance manual, the subsequent chapters provide the information
required to install, calibrate, and maintain the generator.

~ CAUTION-
~ Federal law restricts this device to sale by or on the order of a health care practitioner.

1.1.1 NOTES. CAUTIONS & WARNINGS

This manual uses notes, cautions, and wamings to alert the technician and operator to important information.
The definitions and presentation of notes, cautions and warnings are as follows:

c Notes:
Provides information which is of special importance (I.e. hint or shortcut).

The Note: may be placed within a box, as above, or within the text depending on the importance of the
information.

Ji,. CAUTION:
~ Provides information to prevent minor injury or damage to equipment.

Lb. PROVIDES INFORMATION TO PREVEJ.fA:~R7;~s INJURY OR DEATH OR EXTENSIVE

DAMAGE TO EQUIPMENT.

(
'-

SPECIFICATIONS 1-1 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

1.2 DESCRIPTION
The TM x-ray generators are high frequency x-ray generators. The TM generators consist of the Operator (
Control (OC), Remote Power Unit (RPU) and X-Ray Generator. TABLES 1-2 through 1-6 list the TM
generator models.

I TABLE 1-1 1-TUBE RAD MODELS I

I SYSTEM I COMPONENTS I
TM30 6626.232 or 6626.232B OC and RPU
6536.206 1 tube, 125 kVp Generator

TM30L 6626.245 or 6626.245B OC & RPU

6536.205 1 tube, 150 kVo Generator

TM40 6626.233 or 6626.233B OC and RPU

6536.206 1 tube, 125 kVo Generator

TM40L 6626.246 or 6626.2468 OC & RPU

6536.205 1 tube 150 kVO Generator

TM50 6626.235 or 6626.235B OC & RPU

6536.205 1 tube 150 kVp Generator

TM65 6626.234 or 6626.234B OC and RPU

6536.205 1 tube 150 kVo Generator
c
I TABLE 1-2 2-TUBE RAD MODELS I
SYSTEM COMPONENTS

TM30-2 6626.238A or 6626.2388 OC & RPU

6536.211 2 tube, HHF 150 kVo Generator

TM40-2 6626.239A or 6626.2398 OC and RPU

6536.211 2 tube, HHF 150 kVO Generator

TM50-2 6626.236A or 6626.2368 OC & RPU

6536.211 2 tube, HHF 150 kVp Generator

TM65-2 6626.209A or 6626.2098 OC and RPU

6536.211 2 tube, HHF 150 kVp Generator

TM80-2 6626.214A or 6626.214B OC and RPU

6536.211 2 tube, HHF 150 kVo Generator

9847 1-2 SPECIFICATIONS

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

I TABLE 1-3 2-TUBE RlF MODELS I

I SYSTEM I COMPONENTS I
TM30 RtF 6626.241 A or 6626.241 B OC & RPU
6536.211 2 tube, HHF 150 kVp Generator

TM40 RtF 6626.205A or 6626.205B OC and RPU

6536.211 2 tube, HHF 150 kVp Generator

TM50 RtF 6626.237A or 6626.237B OC & RPU

6536.211 2 tube, HHF 150 kVp Generator

TM65 RtF 6626.211A or 6626.211 B OC and RPU

6536.211 2 tube, HHF 150 kVp Generator

TM80 RtF 6626.212A or 6626.212B OC and RPU

6536.211 2 tube, HHF 150 kVp Generator

I I
c I SYSTEM
TABLE 1-4 1-TUBE RlF MODELS

I COMPONENTS I
TM HRtF 6626.204 OC & RPU
6536.206 1 tube, 125 kVp Generator

I TABLE 1-5 1-TUBE FLUORO MODELS I

I SYSTEM I COMPONENTS I
TMEP 6626.242A or 6626.242B OC and RPU
6536.2131 tube, HHF 125 kVp Generator

SPECIFICATIONS 1-3 9847

--- . __._-_. ---_. - ----

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

1.. 2.1 SYSTEM ARCHITECTURE (

The TM systems consist of two major assemblies the OC and RPU, and HV generator. For systems .
configured with the high speed starter (see TABLE 1-11), a second cabinet is included which houses the high
speed starter. FIGURES 1-1 through 1-3 illustrate three basic configurations of the TM models.

Auxiliary Cabinet
(TM4D only-
for HSS)

Operator
MODEl S HV
TM30, TM40, Generator
TM EP, TM 1T RlF
i.·:::·~.
//"'/', ....
....., .....

........
...... . "
........j ..........
........ Operator Control Ped ...t.11 (Optional)

FIGURE 1-1 TM GENERATOR COMPONENTS, SMALL RPU

(
MODEl S Remote Power UnH (RPU)
Auxiliary Cabinet
TM30 & TM40 with PMT (Large Cabinet) (Largo Cablnet-
6000, for options)
TM30L, TM30-2
TM40L, TM40-2
TM50, TM50-2
TM65, TM65-2
TM80-2
TM30 RlF
TM40 RlF
TM50 RlF
TM65 RlF
TM80 RlF ......

....., Operator Control Poel ••'a)

FIGURE 1-2 TM GENERATOR COMPONENTS, LARGE RPU

The RPU consists of three major subassemblies (FIGURE 1-3), the card cage, inverterfT-network, 1<1> or 3<1> (
power supply. The high voltage transformer is also housed within the RPU cabinet. "-

9847 1-4 SPECIFICATIONS

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

Card Cage

tnverterfT-Network

HV Generator --&11-

Large Cabinet Shown,

Sarna Organization For Small. 9026.048

FIGURE 1-3 RPU MAJOR SUBASSEMBLIES

c 1.2.2 MODES OF OPERATION

The TM generators can be operated in four (five for RlF units) different modes:

1. Three Factor: Operator selects kVp, rnA and Time.

2. Two Factor: Operator selects kVp and mAs. The highest rnA and the shortest exposure time is
utilized.
3. Computerized Exposure Control (CEC):
X-ray factors are determined from a stored technique table. The operator can
change the displayed body part thickness and have the techniques automatically
change to compensate.
4. Anatomically Preprogrammed Radiography (APR): (must have AEC option)
The operator selects body group, view section and patient size.
5. Fluoroscopic Mode (for RlF units only):
3 Modes of Operation: ABS (Automatic Brightness Stabilizer) IN or OUT
Continuous fluoroscopy
Pulsed fluoroscopy

NOTE'
Pulsed f1uoresco re uires the use of a ro ressive scan TV camera s stem.

1.2.3 FEATURES
Radiographic and Radiographic/Fluoroscopic systems:
• Output ripple typically less than 4%.
• Built-in tube overload protection includes load and anode heat calculator.
• Last exposure recall.

c •
•
•
Built-in diagnostics to aid fault determination.
"BIT" system allows quick and accurate changes in techniques for proper film density.
Factory programmed with standard APR and CEC techniques.

SPECIFICATIONS 1-5 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

• Serial PC interface to facilitate changes to the factory program for downloading APR and CEC
information to the TM OC and downloading the information from the TM OC to the PC. This facilitates (
changes to the TM techniques as programmed at the factory.
• High speed starter (TM65, TM65-2, TM65 RlF, TM80 RlF)
• PMT 6000 servo tomo (TM30L, TM30-2, TM40L, TM40-2, TM50, TM50-2, TM65, TM65-2, TM80-2)
• Label printer.

Radiographic/Fluoroscopic Systems ONLY:

• Continuous or optional Pulsed Mode for fluoroscopy.
• 5-minute hold feature that keeps the fluoroscopy mode in a ready state for 5 minutes after release
of the foot switch or a spot-film exposure. This provides an instant on image if fluoroscopy is initiated
during this period. If the system is out of the 5-minute hold time, a short time is required to boost the
rotor and filament of the x-ray tube before fluoroscopy is initiated.
• Display of fluoroscopic factors at both the spot-film device and the operator's console.

1.2.4 OPTIONS
• Remote exposure switch • High speed starter
• Printer • Servo tomographic system
• OC Pedestal.

9847 1-6 SPECIFICATIONS

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 1.3 SPECIFICATIONS
This section presents the requirements and performance characteristics of a properly installed TM generator.

1.3.1 PHYSICAL SPECIFICATIONS

Shipping Weight:
Continental U.S. - RPU, OC, and Generator- 1030lbs (470 kg)
Covers - 200lbs (91 kg)
Offshore - RPU, OC, Generator, & Covers- 1350lbs (615 kg)
Shipping Container Dimensions: See Figure 1-4
Installed Dimensions: See Figure 1-5
Heat Output: 1500 BTU/Hr (1.6MJ/Hr)

I TABLE 1-6 WEIGHTS I

SYSTEM GENERATOR RPU(1) OC(2) AUXILIARY
CABINET

TM30, TM40, TM 1T RtF, 2151bs 3251bs 6.51bs N/A

TMEP (98 kg) (148 kg) (3 kg)

TM65, TM30-2, TM30A-2, 310lbs 5251bs 6.51bs 2751bs

TM40-2, TM50-2, TM65-2, (141 kg) (240 kg) (3 kg) (125 kg)
TM65 RtF, TM80 RtF

TM30L, TM30A, TM40L, TM50, 310lbs 490lbs 6.51bs 2751bs

c TM80-2, TM30 RtF, TM30A

RtF, TM40 RtF,
TM50 RtF, TM65 RtF
(141 kg) (223 kg) (3 kg) (125 kg)

(1) RPU weight does not Include weight of generator. To get fully Installed RPU weight, add generator
weight to that of the RPU.
(2) If optional pedestal is ordered, add 45 Ibs (20.5 kg) to the OC weight.

RPU. OC & Gonorator

T '2"
(208.3cm)

OfflhoM Shipping Container

60"
I - - (152.4cm) I
~91'4'm,,<;.J.~L~Ift=1/,-------_ _ -_-{<'lJ1L
Continentll u.s. Shipping ConlalMra RPU. oe, Generator & Covers
77" ==:::;!.I;-
}:I===(193.3cm) 32"

/ Covera /J.fo7'~;m) ~====:::::=====:f~.3Cm)

I
c
97"

~I================::~(:B~;;m)
(246.4cm)
102~

FIGURE 1-4 TM SHIPPING DIMENSIONS

SPECIFICATIONS 1-7 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

OPERATOR CONTROL (OC)

10· 10·
(2SAcm)

73·
(185.4cm)

9.5" 21.SN
24cm (54.Scm)
.5"

13"
(33cm)
SmaU Clblnet Center of Gravity
14"
29" (73.7em) vertical
(3S.Scm) (
802Il-001

FIGURE 1-5 TM COMPONENT DIMENSIONS

1.3.2 INPUT POWER REQUIREMENTS

I TABLE 1-7 TM GENERATOR INPUT POWER REQUIREMENTS I

SYSTEM $ INPUT LINE VOLTAGE

TM30, TM30L,TM30-2, 1 60Hz: 208/240/277

TM30 R1F, TM 1T R1F, 50Hz: 220/230/240
TMEP

TM40, TM40L, TM40-2, 3 60Hz: 208/240/480

TM40 R1F 50Hz: 380/400/415

TM50, TM50-2, 3 60Hz: 240/480

TM50 R1F 50Hz: 380/400/415

TM65, TM65-2, 3 60Hz: 240/480

TM65 R1F 50Hz: 380/400/415

TM80-2, TM80 R1F 360Hz: 480

50Hz: 380/400/415
Note: Line regulation not greater than 8% for all systems.
(

9847 1-8 SPECIFICATIONS

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( I TABLE 1-8 MINIMUM POWER SUPPLY REQUIREMENTS I

NOMINAL RECOMMENDED WIRE SIZE FROM X~Y DISCONNECT MEANS (amp) MOMENTARY
LINE DISTRIBUTION DISTRIBUTION LlNEAM?SAT
VOLTAG TRANSFORMER TRANSFORMER TO ALTERNATE #1 ALT#2 LINE FULL LOAD
E(VAC) CAFACITY (kVA) DISCONNECT AWG) IMPEDANCE (RMSamp)
1Hz Ohms
SOFT 100FT 200FT Switch Fuse Circuit
15m 30m 61 m Breaker

TME?

208/60 15 6 3 1 60 40 40 .23 72

220fSO 15 10mnr 16mnr 35mm' 30 30- 30 .34 51

220/60 15 8 6 3 30 30 30 .34 51

240/60 15 8 6 4 30 25 25 .41 46

TM3O. TM30-2. TM30 RIF. TM30L. TM lT RIF (1$)

208160 60 2JO 310 300MCM 200 160 200 .053 310

2 .
220150 60 50mm' 95mm 150mnr 200 150·· lSO .075 280

240160 60 1 210 250MCM 200 150 lSO .075 255

2nl60 60 3 1 310 200 100 100 .11 195

TM4O. TM4OL. TM4O-2. TM40 RIF (3$)

208160 75 3 0 410 100 100 100 .087 190

240/60 75 4 1 310 100 100 100 .11 165

380150 75 16mnr 25mnr SOmm' 60 60 60 .25 120

c 480/60 75 8

1
6

0
4

410
60 SO

TM50. TM50-2. TM50 RIF (3$)

150
60 .43

.078
88

240/60 100 200 lSO 245

380/50 100 25mnf 35mnr 75mnr 100 100 100 .17 178

480/60 100 6 4 2 100 70 70 .30 125

TM65. TM65-2. TM65 RIF (3$)

240160 110 0 210 300MCM 200 150 lSO .066 290

380150 110 35mm' 50mnr 9Smnr 100 110 110 .13 233

480/60 110 4 4 1 100 75 75 .23 165

TM80·2. TMao RIF (3$)

360150 150 75mm' 95mm 2 120mnr 200 170 170 .09 325

480/60 150 1 1 0 200 125 125 .16 240

NOTES:1. All wire sizes assume copper wire.

2. Maximum line drop of 8% under full load; if in doubt, increase wire by one gauge size.
3. A three-wire feed is recommended for 1d! and a five-wire feed is recommended for a 3d! (Y) line.
4. All wiring and connections in accordance with all applicable codes.
5. Wires sizes based on NEC Table 310-16, 75°C, for copper wire @25°Cambient.
6. Ground in accordance with NEC TABLE 250-94, or local code, whichever takes precedence. Recommend that
ground conductors be the same size as the power conductor.
7. -For 1$ power line with grounded neutral, fuse only the hot line!

• TM65 and TM80 generators use HS2-MPX R high speed starter. The installer is required to provide a separate 208
to 240 V-AC' 50/60 Hz, 1$ power line with branch circuit protection of20A.

SPECIFICATIONS 1-9 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

1.3.3 RADIOGRAPHIC SPECIFICATIONS

(

I TABLE 1-9 ACCURACY I

I TECHNIQUE I ACCURACY I
kVp ±3 kVp Typical
+4 kVp maximum

mA ±3.5% Typical
+5% Maximum

mAs ±3% ±0.2 mAs Typical

±5% ±0.3 mAs Maximum

Time ±4% ±2 msec Typical

+7% +3 msec Maximum

TABLE 1-10
(

kVp Range TM30, TM40, TM 1T R1F, 1. 2 or 3 Factor: 40 to 125 kVp, 1

TMEP kVp increments

TM30L, TM30 R1F, TM50, 1. 2 or 3 Factor: 40 to 150 kVp, 1

TM30-2,TM40L, TM40-2, kVp increments
TM50, TM50-2, 2. BIT mode: >24 steps
TM50 R1F
TM65, TM65 R1F,
TM65-2
TM80 R1F

25 to 500 mA

mARange

All
l
9847 1-10 SPECIFICATIONS
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

(
I TABLE 1-11 STATOR CONTROL I
I SYSTEM I STATOR CONTROL I
TM30, TM30L, TM30 RlF, TM30-2, TM 1T RlF, Standard speed (3,000 rpm/60 Hz)
TM EP, TM40, TM40L, TM40 RlF, TM40-2, (2500 rpm/50Hz)
TM50, TM50 RlF, TM50-2 Optional high speed (see below)'
TM65, TM65 RlF, TM65-2, High speed (9,000 rpm/60Hz)
TMBO RlF, TMBO-2 j7S00rpm/SOHz)

40

c , TM40L, TM40-2 40 kW

TM50, TMSO-2, SO kW
TMSO RtF

TM6S,
TM6S-2

l
SPECIFICATIONS 1-11 9847

------------- ---
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

1.3.4 FLUOROSCOPIC SPECIFICATIONS

(
TABLE 1-13 FLU( ~EDI\.'''''~

InlJE
~
kVp Range All RtF 40 to 125 kVp in 1 kVp increments
TM-EP
All RtF Continuous Mode:
4 selectable stations nominally set at A, .8, 1.6, and 2.2 rnA
rnA Range calibrated not to 9.5 Rlmin ..."nnoure rate.
All RtF Pulsed Mode:
TM-EP Fixed rnA calibrated not to exceed 9.5 Rtmin entrance exposure rate
at urn ue of 12SkVp and 30 PPS.

Pulse Rate All RtF 30, 15, 7.5, 3.8, 1.9 pps
TM-EP

1.3.5 TOMOGRAPHIC SPECIFICATIONS (SERVO TOMO OPTION ONLy)

I TABLE 1-14 TOMO TECHNIQUE SPECIFICATIONS I

kVp SWEEP/SPEED (TIME in mAs' (
seconds)
8°/FAST (A) 2 -225
20 0 /FAST (.6) 3- 350
40 through 150
8°/SLOW & 30 0 /FAST (.8) 4 -450
for all mAs 40° /FAST (1.0) 5 -600

stations 20 0 /SLOW (1.2) 6 -700

30 0 /SLOW (1.6) 8 - 900
40 0 /SLOW (2.0) 10 - 900

• Approximately ±1 0% change between mAs selection steps.

9847 1-12 SPECIFICATIONS

- - ------ - - - - - - - - -----,,-----
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

1.4 COMPATIBILITY
( The TM generators are compatible with the following certified components or with other certified components
which meet the specifications outlined.

1.4.1 X-RAY TUBES

The TM has a tube protection circuit for the following tubes or equivalents:

Dunlee PX 1429 (O.6/1.2mm) Toshiba E7239X (1.0/2.0mm)

Dunlee PX 1482 (O.6/1.0mm) Toshiba E7242X (O.6/1.2mm)
Dunlee PX 1436· (O.6/1.2mm) Toshiba E7252X (O.6/1.2mm)

Varian A192 (O.6/1.2mm) 8150 Varian A256 (O.6/1.0mm) 8150

Varian A292 (O.6/1.2mm) 8150 Varian G292 (O.6/1.2mm) 8150
Varian G1092 (O.6/1.2mm) B150 Varian A197 (O.3/0.8mm) 8130

Eureka RAD- 8 (1.0/2.0mm) Eureka RAD-74 (O.6/1.5mm)

Eureka RAD-68 (O.6/1.2mm) Eureka RAD-13 (1.0/2.0mm)
Eureka RAD-14 (O.3/1.2mm) Eureka RAD-14 (O.6/1.2mm)
Eureka RAD-16 (1.0/2.0mm) Eureka RAD-21 (O.6/1.2mm)
Eureka RAD-25 (O.6/1.2mm)* Eureka RAD-56 (O.6/1.0mm)
Eureka RAD-56 (O.6/1.2mm) Eureka RAD-60 (O.3/1.2mm)
Eureka RAD-60 (O.6/1.2mm) Eureka RAD-92 (O.6/1.2mm)

*125 kVp units only.

1.4.2 BEAM LIMITING DEVICES

c
The TM is compatible with any Automatic Collimating System that provides an isolated normally open switch
which closes when the Automatic Collimating System presents an "Exposure Ready" mode to the control.

In addition, the TM is compatible with any certified beam limiting device intended for radiographic equipment.

1.4.3 X-RAY TABLES

The TM is compatible with any certified table which meets the performance standard requirements for x-ray
tables in general purpose radiographic and radiographic-fluoroscopic rooms.

1.4.4 CASSETTE HOLDERS

The TM is compatible with any certified cassette holder (non-bucky) and any certified bucky cassette holder.

1.4.5 IONIZATION AUTOMATIC EXPOSURE CONTROL SYSTEMS

The TM is compatible with the ·foillowing ionization automatic exposure control systems equipment:

Ionization Exposure Control for up to three sensors (does not include sensor)
Ionization Exposure Control for one radiographic sensor only (needs sensor from the following list)

#153 Sensor for use in Pausch Tables

#159 Sensor for use in Liebel-Flarsheim Series 8000 entry-type buckys
#155 Sensor for use with KS-80 cassette holders
#156 Sensor for Scholz Spot-Film Device with remote pre-amplifier & 30-ft. cable
#174 Cassette-Sensor for Hydradjust-III
#158 Sensor for Continental 14" Spot-Film Device
Sensor for Eureka EXT- Spot-Film Device
#181 Sensor for 14x36 Grid Cabinet
#162 Sensor for left-hand bucky holders

c #192 Sensor for right-hand bucky holders

Factory adaptation and interconnection of any AEC system to new Continental Radiographic single-
phase power unit, includes kV compensation signal circuitry.

SPECIFICATIONS 1-13 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

Standard 45' Interconnect Cable with above Ion Chambers

65' Ion Chamber Cable (
1.4.6 HIGH SPEED ROTOR CONTROLS
The TM is compatible with the foillowing high speed rotor control equipment:

HS-2 MPX-R High Speed Rotor Control

HS-2-MPX-Q High Speed Rotor Control with "Q" Stator
Cabinet for HS-2
HS IR Radiographic 1 Tube High Speed Rotor Control.

1.4.7 CAMERA SYSTEM SELECTIONS

For software revisions 5.8.1 and above, the TM Series of X-ray generators are compatible with the following
camera systems.

I TABLE 1-15 AVAILABLE CAMERA SELECTIONS (RELEASE 5.8.1 AND ABOVE) I

Selection Cameras

SS-PFL Syracuse Scientific Pulsed Fluoro: SS-750

IN-PFL Infimed Pulsed Fluoro: FC-1500, FC-2000, QL2048.

CM2-PFL Camtronics Pulsed Fluoro: Camtronics VP-RF with Philips XTV-11.

GLD-PFL GoldOne Pulsed Fluoro

(
SS-CFL Syracuse Scientific Continuous Fluoro: SS-750

NI-CFL Nical Continuous Fluoro

IN-CFL Infimed Continuous Fluoro: FC-1500; FC-2000; QL-2048

CM2-CFL Camtronics Continuous Fluoro: Camtronics VP-RF with Philips XTV-11

GLD-CFL GoldOne Continuous Fluoro

1.5 CDRH COMPLIANCE

All components of the x-ray system conform to the requirements of the Center for Devices and Radiological
Health (CDRH), Department of Health and Human Services, 21 CFR, Chapter 1, Subchapter J, at the time
of manufacture.

1.6 HAZARDOUS MATERIALS

The TM generators use Shell Diala(R) oil AX in the HV generator. This material is rated as: Acute Health - 1,
Fire - 1, Reactivity - o. Skin contact should be avoided as irritation could result. Inhalation could prove irritating
to the mucous membranes and upper respiratory tract. Ingestion may result in vomiting. For full product
information refer to Shell Material Safety Data Sheet 60,030-5 (contact Shell Oil Corporation).

c
9821 1-14 SPECIFICATIONS
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 1.7 SYMBOLS
This section presents the symbols used throughout this manual. The symbols conform to IEC 878.

Dangerous voltage. Indicates an avoidable dangerous high voltage

hazard.

This symbol on the equipment means that the operating instructions

should be consulted to assure safe operation.

Ground

Functional Earth (ground) Terminal. Terminal directly connected to a

point of a measuring supply or control circuit or to a screening part which
is intended to be earthed for functional purposes.

Protective earth (ground). Identifies any terminal which is intended for

connection of an extemal protective conductor to protect against
electrical shock in case of a fault.

( Equipotentiality. Identifies terminals that bring the various parts of

equipment or systems to the same potential when connected together.
These terminals are not necessarily at earth (ground) potential. The value
of the potential may be indicated next to the symbol.

1.8 REQUIREMENTS
. The following sections provide important electrical and mechanical reqUirements for the proper operation of
the TM x-ray generator.

1.8.1 ELECTRICAL REQUIREMENTS

1. Use a facility power source dedicated for use by the TM generator.
2. It is extremely important that a good facility ground is established. Use a dedicated wire to connect
to the ground in the disconnect box and NOT the conduit. This ground must reference back to the
electrical company provided ground or the ground established by the facility's cold water pipes.
3. TABLE 1-8 lists the wire sizes required. In final testing of the generator, the assembler is required
to measure the line voltage regulation under full load, since the output of this x-ray machine is
dependant upon the line regulation.
4. RPU cable routing is through the back of the cabinet. FIGURE 1-5 gives pertinent dimensional
information for locating facility electrical access to the RPU. The configuration of the rear cover allows
it to be readily installed/removed when necessary.
5. A six-foot cable is provided to connect the RPU power supply assembly to the disconnect box. If
wiring other than the supplied cable is to be used, refer to TABLE 1-8 for the required gauge size.
6. The RPU to OC interconnect cable is a 25-conductor shielded multi-conductor cable terminated with
25-pin D-subminiature connectors. Route the cable through a separate conduit to prevent induced
noise problems.
- 7. Route the high voltage cables separately from the system cables.
Route facility input power separately from the system cables.
l 8.

SPECIFICATIONS 1-15 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

9. Follow all local codes for the installation of x-ray equipment. Some codes require wiring the control
and high voltage generator to their respective wall junction boxes in flexible armored cable, while
other codes penmit the use of STO or SJTO rubber-covered interconnecting cable from these units
(
to the wall junction boxes.
10. For TM generators which are to be used in systems with the servo tomo option, a means to route
cable to the auxiliary cabinet will have to be provided. The cable access is the same as for the large
cabinet. Some of the generators utilize the auxiliary cabinet regardless of the presence of the servo
tomo option, and require cable routing to this cabinet also.

fu WARNING·
FOR PROPER OPERATION, THE TM GENERATOR REQUIRES A DEDICATED POWER
LIN E FREE FROM SPIKES AND GLITCHES IN ACCORDANCE WITH TABLE 1·8.

IF A DEDICATED POWER LINE IS NOT PROVIDED, THE SYSTEM MAY MALFUNCTION OR

SYSTEM DAMAGE MAY OCCUR.

1.8.2 MECHANICAL REQUIREMENTS

1. The installer must determine the method of mounting the TM30 and TM40 series RPU base to the
floor. These utilize a base with mounting brackets which can be secured to the floor with bolts
fastened to lead expansion anchors. A certified engineer should be consulted to properly specify the
appropriate method and hardware.
2. The small cabinets have provisions to secure the top cover to the rear wall in earthquake zones. A
certified engineer must advise as to method and hardware.
3. If the TM30 or TM40 series generators are used in a PMT series servo tomo system they will use the
large RPU cabinet, NOT the small one.
4. For all TM generators which are to be used in systems with the servo tomo option, an auxiliary
cabinet is used to house the servo tomo controller PCB and the motor controllers, in addition to other
system components. Some generators utilize the auxiliary cabinet regardless of the presence of the
C.
servo tomo option and therefore also require it to be taken into account during layout of the room. This
cabinet is the same size as the large cabinet.
5. Access to the interior of the RPU is through the front, so space must be provided for service access
of at least 2 feet. See FIGURE 1·5 for the dimensions of the cabinets and OC.
6. Provide side access of 2 feet, if possible, as the side covers are also removable for maintenance
actions.

9800 1-16 SPECIFICATIONS

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

SECTION 2 -INSTALLATION
( 2.1 GENERAL
This chapter provides the information required to properly and safely install the generator. It is assumed that
chapter 1 has been used to plan the installation. To help ensure that the installation will proceed as smoothly
as possible it is advised that the layout be verified against the room plans. The layout should be transferred
to the room in pencil or chalk to aid in layout verification. Chapter 1 provides the dimensions of the cabinets
and their electrical entrance positions ..

The wiring of the room should also be verified against the specifications outlined in chapter 1. There are strict
requirements for generator wiring which must be met if the generator is to function safely and as specified.
If the wiring specifications are not met the generator may not function properly and there may be safety risks
to the operator and patient, and damage to generator may result.

2.2 MATERIAL REQUIRED

• Tie wraps
• Drill and drill bits anchor installation
• Base-to-floor mounting hardware (TM 30 & TM40 only)
• Top cover to wall mounting hardware (TM30 & TM40 only)

2.3 UNPACKING
The TM RtF series generator is shipped as follows for continental U.S.:
1. RPU, generator, OC and pedestal (if ordered)
2. Covers
3. Auxiliary cabinet, for those generators which require it

For offshore shipment it is shipped in one container. Refer to Chapter 1 for the dimensions and weights of the
TM generator shipping containers to determine the best route and method of moving the TM within the facility.
( Move the containers to a location which allows removal of the crating materials and installation of the RPU
and OC.

2.4 INSTALLATION OF THE OPERATOR CONTROL

The operator control (OC) must be placed in a lead lined control booth so that the operator CANNOT make
an exposure from the x-ray room. The operator can be prevented from operating the generator outside the
control booth by allowing enough cable slack for maintenance but not enough for the operator to remove the
OC from the booth.

The optional pedestal can be mounted to the floor using bolts secured into expansion anchors in the floor.
There are two through holes in the pedestal base under the rubber mat.

1. Position the pedestal in its operational position and mark the locations of the holes to be drilled.
2. Move the pedestal and drill for installation of the expansion anchors.
3. Clean out the holes and install the expansion anchors.
4. Place the pedestal in operational position and secure it in place with the bolts tightened into the
expansion anchors.
5. Place the OC on the pedestal top and secure with the supplied thumbscrews from below.
If the OC is to be used from a table top or a surface other than the pedestal the preferred means is to mount
the OC to the surface with 6-32 screws from below.
1. Measure the center to center distance between the two threaded holes in the bottom of the OC base.
2. Using this distance mark the mounting surface for drilling.
3. Drill holes through the mounting surface for the mounting screws.
4. Place the OC on the mounting surface and install the 6-32 screws from below. If the supplied
hardware is not long enough due to the surface thickness the installer should obtain two 6-32 screws
of sufficient length to securely mount the OC to the mounting surface.

INSTALLATION 2-1 9847

 \
MAINTENANCE MANUAL 9026.251

The installer can also affix Velcro 1M to the bottom of the OC and the top of the resting surface to keep it in
position during use. This allows the maintenance technician to remove the OC easily when necessary. In this (
case it is extremely important that the service cable length be such that the operator can operate the generator
only from the x-ray booth.

2.5 INSTALLATION OF THE REMOTE POWER UNIT & AUXILIARY CABINETS

This section is to be followed for installing both the RPU cabinet and auxiliary cabinet, if used.
1. Mark the floor to show the positions of the RPU and the auxiliary cabinet (if used).
2. For continental U.S.: Remove the high voltage generator from the bottom of the RPU.
For offshore: Remove the RPU from the shipping container and stand upright.
3. Install the cable entrance cover centrally to the rear of the RPU with two sets of provided screws, flat
washers, lock washers and nuts. The mounting studs around the rectangular opening are for the two
piece phenolic cable spacer and must point to the cabinet interior.
4. Install the three take-all connectors (supplied) into the three holes in the cable entry cover.
5. Route the facility power cable and the high voltage cables through the rectangular hole and the other
system cables through the take-all connectors. Do not tighten the take-all clamps around the cables
at this time.
6. Install the two piece phenolic cable spacers over the rectangular hole. The power cable should be run
through the large hole, the high voltage cables are run through the other smaller holes. The installed
cable spacer allows the cables to slide through as the RPU is positioned as necessary.
7. For the TM30 and TM40 RPUs ONLY:
a. Install the base mounting brackets and their hardware (see FIGURE 2-1) in the RPU base.

Anchor Brackets (2X)

9026-002
Leveling
Foot (4X)

FIGURE 2-1 TM30 & TM40 RPU BASE

b. Lower them until they touch the floor and mark for anchor installation.
c. If required: place the top cover on the cabinet and mark the wall for mounting hardware.
d. Move the RPU out of the way to drill the holes necessary for anchor installation and install
the required anchors.
e. Move the RPU into position and install the mounting hardware to secure the TM30 or TM40
RPU in position.

8. Connect power wiring to the RPU using the provided cable or hardwiring to facility wiring. Reference
the appropriate power supply schematic in SECTION 8.
9. Position the RPU in its final installed position.
10. Level the RPU using the leveling feet attached. C·
11. TI ightle nhtheh.tahke-alll clam ps t.o secureththeh.systeml cablesblin position. ~ .
12. nsta l t e Ig vo tage h ouslngs on e Igh va tage ca es.
13. Place the high voltage transformer in the RPU base.

9847 2-2 INSTALLATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

14. Verify all fuses are installed, see FIGURE 2-2 and FIGURE 2-3 for a 1-tube, 1<1> and 3<1> generators,
( see FIGURE 2-4 for a 2-tube, 3<1> generator.

~!!;r--F13 (KV DRIVE LVPS)

"""i-';f-:/---Fl (FIL DRIVE LVPS)
~Lk~~--F2 (R/OC 24V SUPPLY)
?)ll!~~"'----t-t---F3{RPU 117VAC SUPPLY)
. .~i"f.t+C:----ift---F4 (Tl PRIMARY)
~N'''' itl1ii~!=;;ilr--F5 (T1 PRIMARY)

~H*~ll! !!I4---Cll3 (ROTOR BOOST)

F11 :tp.H--(~B2(ROTOR RUN)

FlO (L '>-:::=======fh~~~~[~~~~~~tt~~~~:B'
-
(FILAMENT PS)
(SCR)

~~--F6
24 HR
~~"7i:-:t--- F7 POWER
~H;;:~+==F8
:::' SW1
SUPPLY

~--~~*----GROUNDSTUD

9026-064

c FIGURE 2-2 1-TUBE, 1<1> RPU PROTECTION COMPONENT LOCATION

15. Verify that a good ground is established. Do NOT continue until a good earth ground is verified
between facility ground and the RPU frame with a DVM.
16. It is important to reference the appropriate schematic in SECTION 8-2 of PART 2 as there are
schematics for 50 and 60 Hz facility input power. Measure the line voltage at the disconnect and
connect the line matching wire to the connection which corresponds to the closest match.
17. Connect the 1-tube high voltage generator as follows (FIGURE 2-5):
a. Connect both of the 1 tube P1, P2, and ground leads (one each from each side of the RPU)
securely to the terminals. lise two wrenches to tighten, one to hold the lower nut and the
other to tighten the upper nut.
b. Locate the two screw on connectors, the 3 pin and 6 pin. Plug them into their respective
receptacles on the high voltage transformer, J1 an~ J2.
c. Connect the 2-tube high voltage generator as follows: Connect P1 (3 pin connector), P2 (6
pin connector), and P3 (15 pin connector) to the HV generator.

For all 150 kVp generators:

d. Install the feedback isolation PCB on top of the high voltage generator. Place the provided
spacers over the studs on top of the generator, place the PCB over the studs and secure in
place with the provided hardware.
Do NO! connect the high voltage cables until directed to do so in SECTION 3 during calibration.

Note:
System wiring is dependent upon system configuration and the options chosen. Refer to SECTION 8.1 0
PART 2 for interface information. Refer to SECTION 8.2 of PART 2 for the wiring diagrams necessary te
( connect the various system components to the TM Qenerator.

INSTALLATION 2-3 9847

MAINTENANCE MANUAL 9026.251

SWl (INVERT PoWE:R)·------,

F8 (2' HR PS) - - - - - -.....
~>l>---F13 (KV DRIVE LVPS)
(
F7 (2' HR PS) - - - - - - , ~'~~
,<?-4f---Fl (FIL DRIVE LVPS)
F6 (2' HR PS) - - - - - -.....Irllth:
~""'''''-+'l---F2 (R/OC 2.V SUPPLY)
F18 (2'VAC) -------~,
i'5ll~~:"'---H--F3(RPU 117VAC SUPPLY)
F17 (115V'\Cr-------.....'1
~.j;j;.iH---H--F'(Tl PRIMARY)
F16(230V'\C)-------.....~
F15 (AUX POWER XFMR) ---\~
itt~~:inr--'F5 (T1 PRIMARY)

F14 (AUX POWER iJ!I'.:!---CB3 (ROTOR BOOST)

1:!'>f4--<OB2 (ROTOR RUN)
~~~'-!I---<'Bl (FILAMENT PS)
~M:jiJi..:g;:t!Oi!!:JL::.t.:I--Fl 0 (L 1)
~-+:f-- Fll (L2)
~i\;E-:f-- F12 (L3)
~~~.:I--·F9(SCR)
TB7 _ _ _ _ _ _ _ _ _ _ _
~~~~tt==::;:::~~~DSTUD
~

TB8 _ _ _ _ _ _ _ _ __"
~ 3tPOWER
SUPPLY

9026-
012
FIGURE 2-3 1-TUBE, 3!jl RPU PROTECTION COMPONENT LOCATION

SWl (INVERT POWER)-----.....

0 - - - - - - F l I 9 (STOBY FIL XFMR)
~"""::----F20 (STOBY FIL XFMR)
c
F8 (24 HR PS)
~it---F13 (KV DRIVE LVPS)
F7 (24 HR PS)
;':;4..J---Fl (FIL DRIVE LVPS)
F6 (2' HR PS)
~;..<:;"'-+'I---F2(R/OC 2.V SUPPLY)
F18 (2'VAC) -------,'1\ ~;L--B--'F3 (RPU 117VAC SUPPLY)
F17 (115VAC)--------,1
~~t---+'l---F' (Tl PRIMARY)
F16(231'VA,C)·------~~1
if:T~~:;;-tl--H (n PRIMARY)
F15 (AUX POWER XFMR) ---\'llN~~
F14 (AUX POWER XFMR) ~!!*-IF.++F=!,; ~4---<'B3(ROTOR BOOST)
tJ>-1'-4---<'B2(ROTOR RUN)
~~~'-!I---<:Bl (FILAMENT PS)
!#'~~=<:....j;..+.-- FlO (L 1)
TB5-:--_1:1.
~+:f--Fll(L2)
1,2;;*1:-+--- F12 (L3)
~;;,;t:;~4---- F9 (SCR)
~~~4---GROIUNDSTUD

9026-

FIGURE 2-4 2-TUBE, 3!jl RPU PROTECTION COMPONENT LOCATION

l
9847 2-4 INSTALLATION
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 00000000000

00000000000
9026-025

1 & 2 TUBE HIGH VOLTAGE GENERATOR 1 TUBE HIGH VOLTAGE GENERATOR

FIGURE 2-5 HIGH VOLTAGE GENERATOR CONNECTIONS

18. Remove the front cover bracket from the frame in front of the card cage. Install on the frame in front
at the bottom (the same as the rear cover bracket). Some TM cabinets may have a red shipping bar
installed to secure the card cage in place. if this is the case remove.
19. Release the latches holding the card cage in position and extend the card cage to make it easier to
connect the system cables to their destinations in the card cage.

c 20. Route the system cables (See SECTION 8 for system wiring information) to be connected to card
cage PCBs up the RPU frame (FIGURE 2-6). Secure the cables to the frame with tie-wraps. Assure
sufficient service loops so the card cage can be extended without cable tension trying to pull it back
in.
WIRE ROUTINQ TO . " .... '"

Card Cage

", .. , ... ...

WftchanMito
rout. cable to the
trontfteklllO PCB 9026-
046
FIGURE 2-6 RPU WIRE ROUTING

INSTALLATION 2-5 9847

 MAINTENANCE MANUAL 9026.251

21. For 1 & 2-tube systems: Route wires to the field I/O PCB located on the front of the card cage
through the wire channel in the bottom of the card cage from the back to the front. Remove the
protective panel from the front. This panel serves as the label for the terminal strip's connection (
functions. Use a fiat-blade screwdriver with a 3/16" (0.4Scm) wide blade for all connections. Strip all
wires 3/S" (0.95cm) and twist the strands before securing into the terminal strip. Replace the
protective cover when done.

For 2-tube systems only: Route wires to the field I/O PCB lacated inside the card cage on the
.obverse of the fold-dawn panel (behind the front mounted field I/O PCB) through the rear of the card
cage. Remove the protective panel to expose the field I/O's terminal strips. This panel serves as the
label for the terminal strip's connectian functions. Use a flat-blade screwdriver with a 3/16" (O.4Scm)
wide blade for all connections. Strip all wires 3/8" (0.95cm) and twist the strands before securing into
the terminal strip. Replace the protective cover when done.
22. Route the cables to be connected ta the RPU backplane front through the rear of the card cage. The
connections to be made to the rear of the RPU backplane are nat run within the card cage.
23. Connect the OC end to OC connector J2. Secure the connector with the attached hardware.
24. IT IS EXTREMELY IMPORTANT THAT At.L ELECTRICAL CONNECTIONS BE VERIFIED AT THIS
TIME. Pull and wiggle all wires to verify that the connectors are properly seated and the mounting
hardware is properly tightened.

Lb. CAUTION:
Do not over tighten the hardware securing the wires to the capacitors as the mounting studs
and receptacles are aluminum and. their threads are easily dama!led.

It is important to verify all connectians due to the fact that, during shipment, same may have vibrated
loose. Improperly tightened and seated connections can cause the equipment ta operate improperly

25.
26.
27.
or appear faulty.
Perform SECTION 3.
Perform SECTION 10.
Install the covers, see FIGURE 2-7.
c
Secure To Wall
In Earthquake

Side Cover
~ Rear Of Top Cover
TM30 &; TM40
ONLY

L.I-+-- ,cal'~Cover
Ace•••

Side Cover
Front Cover

FIGURE 2-7 COVER INSTALLATION

9026·
050
c
9847 2-6 INSTALLATION
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

SECTION 3 - CALIBRATION
( 3.0 EQUIPMENT REQUIRED
The following test equipment is required and must be properly calibrated:
• Digital multi meter - true RMS DVM with an accuracy of .5%.
• Tachometer (vibrating reed type).
• Storage oscilloscope (scope) - 2 channel, 20 MHz (min).
• Noninvasive kVp meter or invasive kVp divider (Le. Dynalyzer)
• mAs meter
• Densitometer to measure optical density (OD) if AEC option is selected.
• Mirror
• Dark room
• X-ray film processor
• Pieces of lexan: (1) .5" (1.27cm) thick, (14) 1" (2.54cm) thick, or a plastic bucket capable of holding
15" (38.1cm) of water.
• Vapor proof compound for high voltage cables.
• Dosimeter for calibration of Entrance Exposure Rate.
• Fluoroscopic phantom (2mm of Cu) for calibrating ABS (Automatic Brightness System) function.

3.1 v(NTRODUCTION
The set-up and calibration of the TM generator is accomplished primarily through software control. Refer to
SECTION 8 for pertinent schematics. Refer to FIGURE 3-1 for PCB locations and to SECTION 9 for PCB part
numbers. Read SECTION 4 for operation instructions.

6 THERE ARE FOUR FACTORY-CALlBRA~t~~T~NTIOMETERS THAT MUST r«rr BE

c ADJUSTED IN THE FIELD.

1.

2.
The master voltage-to-frequency calibration of the mAs V/F on the rnA/mAs control
PCB (R34). This is factory set for a frequency of exactly 60Hz/rnA at TP8.
The maximum f, (operating frequency) of the inverter oscillator on the kVp control
PCB (R13). It is set for a maximum frequency of exactly 12.5 kHz (11 kHz forTM65
and TM80 ONLy) at TP4.
3. The maximum f, (operating frequency) of the filament V/F (R10), factory set to 14.0
kHz at TP9.
4. V/F ad'ust for fluoro rnA meterin circuit. Set to 40.0 kHz at TP12.

There are three major software routines used by the installer:

1. Test routines used to indicate the software version that is installed, and the actual heat-units in the
anode and housing.
2. Set-up routines used to select the particular system configuration.
3. Calibration routines to calibrate the system. The x-ray tube filament pre-heat, rnA, kVp, and mAs are
all calibrated through the front panel using software control.

At this point, the entire system should be installed with all components connected, Le., tube, collimator,
Remote Power Unit (RPU), Operator Control (OC), and Remote Fluoro Control (RFC), or Digital Platform (DP)
(for fluoroscopic generators).

The RPU has several switches which permit the electronics to be tested without high voltage or powering the
x-ray tube filaments and rotor.

500 VDC power is supplied to the inverter via [SW1] located on the fuse box (FIGURE 2-4 or 2-5). When the
24-hour power supply is active, [SW1]'s indicator lamp is illuminated. LEDs L6 and L7 are located on the gate
drive PCB. When L6 is ON, 500 VDC is present at the inverter. If the SCR fuse F9 opens, LED L6 will
extinguish, while the [SW1] indicator lamp will still be ON. L7 signals failure of the 500 VDC when ON.

CALIBRATION 3-1 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

Microprocessor PCB
mA/mAs Control PCB R...yPow.r
Supply PCB
(
kV Control PCB
110 Control PCB
AEC Interface PCB

Extender Card
Field 1/0 PCB
(exterior: 1-tube
exterior & interior:
2-tube)

Inverter Snubber PCB

Gate Drive PCB

9026-053

FIGURE 3-1 PCB LOCATIONS

Reference SECTION 8 for descriptions of the PCB jumpers accessed during performance of the routines in
this section. TABLE 3-1 presents calibration sequences for the various TM generator families.
(
TABLE 3-1 CALIBRATION SEQUENCES FOR TM GENERATOR FAMILIES

SYSTEM CALIBRATION SEQUENCE (section number)

1-TUBE 3.3 - 3.4 - 3.5 - 3.7 - 3.8 - 3.9 - 3.10.2 thru 3.10.6 - 3.11 - 3.12 - 3.13 - 3.14 - 3.15
RAD - 3.18

1-TUBE 3.3.1 - 3.3.3 ~ 3.3.4 - 3.6 - 3.8.1 - 3.8.2 - 3.9.1 - 3.9.2 - 3.9.3 - 3.10.1 - 3.16 or
FLU ORO 3.17

2-TUBE 3.3 - 3.4 - 3.5 - 3.7 - 3.8 - 3.9 - 3.10.2 thru 3.10.6 - 3.11 - 3.12 - 3.13 - 3.14 - 3.15
RAD - 3.18

2-TUBE 3.3 - 3.4 - 3.5 - 3.6 - 3.7 - 3.8 - 3.9 - 3.10 - 3.11 - 3.12 - 3.13 - 3.14 - 3.15 - 3.16
RlF or3.17 - 3.18
1-TUBE 3.3 - 3.4 - 3.5 - 3.6 - 3.7 - 3.8 - 3.9 - 3.10 - 3.11 - 3.12 - 3.13 - 3.14 - 3.15 - 3.16
RlF or 3.17 - 3.18

9847 3-2 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

The following presents the hierarchy of the calibration/setup routines:

OPRPROG
EXIT
TEST places the system in calibration/setup mode
1 . TEST ROUTINES
SYSTEM INFORMATION
HEAT UNITS & RTC (Real Time Clock)
AEC V/F CHECK & Cal
ION Chamber Field Drift Check

2. SETUP ROUTINES
1. Enable PC Communications
2. X-Ray Tube 1 Setup
TUBE select installed tube
%LOAD select desired load
HSS YES/NO
HS YES/NO - displays only if HSS is YES
XX-COOL select cooling means - pressing runs through choices
PIE YES/NO
STORE
EXIT Save Changes? YES/NO
3. X-Ray Tube 2 Setup
See above
4. DP & Fluoro Setup
NO FLUORO, SS PULSE, SS CONT, or NO CONT ftuoro choice
STORE

c EXIT
5. PRINTER SETUP
NO PRINT/MAN PRINT/AUTO PRINT select occurrence of printing
PC PRINTER/PRINTER X select type of printer in use
6. Tomo Setup
SERVO/MECH/NONE select the type of torno, if present
TUBE % select the tube to be used for tomo exposure
3. CALIBRATION ROUTINES
1. MA Calibration
- decrease value a predefined amount
+ increase value a predefined amount
STORE
EXIT
2. KVCal
see above, for 1.MA Calibration.
3a. MASTER Preheat Calibration
see above, for 1.MA Calibration.
3b. POINT Preheat Calibration
see above, for 1.MA Calibration.
3c. Standby Preheat Adj.
see above, for 1.MA Calibration.
3d. Preheat Boost Adj.
see above, for 1 .MA Calibration.
4. MAS Calibration
see above, for 1.MA Calibration.

l
CALIBRATION 3-3 9847
TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

CootjOlIO! IS f1UO(O
5a. FLUORO·1 MA Station Adj .
• decrease value a predefined amount
+ increase value a predefined amount
c
STORE save value in memory
EXIT exit routine without saving value
5b. FLUORO·2 MA Station Adj.
see above, for 5a. FLUORO -1 MA Station Adj.
5c. FLUORO·3 MA Station Adj.
see above, for 5a. FLUORO -1 MA Station Adj.
5d. FLUORO-4 MA Station Adj.
see above, for 5a. FLUORO -1 MA Station Adj.
6a. FLU ORO Low KV Cal (50 KV)
see above, for 5a. FLUORO -1 MA Station Adj.
6b. FLU ORO High KV Cal (120 KV)
see above, for 5a. FLUORO·1 MA Station Adj.
7a. FLU ORO MA Meter, Low MA Cal
see above, for 5a. FLUORO·1 MA Station Adj.
7b. FLU ORO MA Meter, High MA Cal
see above, for 5a. FLU ORO -1 MA Station Adj.
8a. FLU ORO KV max at·3 MA Step
see above, for 5a. FLU ORO -1 MA Station Adj.
8b. FLU ORO KV max at -4 MA Step
see above, for 5a. FLUORO -1 MA Station Adj.
9. FLUORO Preheat Boost Adj
see above, for 5a. FLUORO -1 MA Station Adj.
10a. FLUORO ABS Window Adj
see above, for 5a. FLU ORO -1 MA Stalion Adj.
10b. FLU ORO ABS CTR Adj. (
see above, for 5a. FLUORO -1 MA Station Adj.
pulsed fh IOro
5. PULSED FLUORO MA Adj .
• decrease value a predefined amount
+ increase value a predefined amount
STORE save value in memory
EXIT exit routine without saving value
6a. FLU ORO Low KV Calibration (50kv)
see above, for 5. PULSED FLUORO MA Adj.
6b. FLUORO High KV Calibration (120kv)
see above, for 5. PULSED FLUORO MA Adj.
7a. FLUORO MA Meter Cal. at 50 KV
see above, for 5. PULSED FLUORO MA Adj.
7b. FLU ORO MA Meter Cal. at 120 KV
see above, for 5. PULSED FLUORO MA Adj.
8a. FLU ORO KV max at 15 PIS
see above, for 5. PULSED FLUORO MA Adj.
8b. FLUORO KV max at 30 PIS
see above, for 5. PULSED FLUORO MA Adj.
9. FLU ORO Preheat Boost Adj.
see above, for 5. PULSED FLUORO MA Adj.
10a. FLUORO ABS Window Adj.
see above, for 5. PULSED FLUORO MA Adj.
10b. FLUORO ABS CTR Adj.
see above, for 5. PULSED FLUORO MA Adj.
11. FLUORO MA Pulse Width Adj.
see above, for 5. PULSED FLUORO MA Adj.

9847 3-4 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.2 PRELIMINARY INSPECTION

( This section must be performed prior to operating the generator for the first time. It should also be performed
prior to calibration, after maintenance actions to verify system wiring and safety.

WARNING'

ENSURE THAT POWER IS OFF AT THE DISCONNECT BOX BEFORE PROCEEDING. SEVERE
INJURY OR DEATH CAN RESULT FROM CONTACT WITH INCOMING POWER.

3.2.1 RPU AND OC INSPECTION

1. Inspect the unit for any signs of damage.
2. Confirm that all connectors are fully seated.
3. Tighten all power connections, including line, ground, neutral, and all black #1 0 connections.
4. Place the system in calibration/setup mode (SECTION 3.3).
5. Ensure that SW4 is set for all options present in the system. See TABLE 7-1.

3.2.2 HIGH VOLTAGE GENERATOR CHECK

1. Remove the High Voltage generator oil fill plug and inspect oil level. It must be no greater than 3/8"
(.95cm) from the bottom surface of the top panel. Replace the plug when done and loosen the vent
screw.
2. Make the following checks on J2 (the 6-pin Circular connector) with the DVM (See FIGURE 3-2):

KEY
A
F 0
0
C 0
E
0
0
125 kVp 150 kVp
GENERATOR GENERATOR 9026.(126

FIGURE 3-2 HV GENERATOR J2 PINOUTS

2-tube: A to GND=10kO
BtoGND=On
C to GND=Open circuit (very large resistance)
D to GND=Open circuit (very large resistance)
Eto GND=On
F to GND=1 OkO

Hube: A to D=O n
Ato GND=On
A to B=10 kn ±200n
A to C=10 kn ±200n
A to E=10 n
A to F=10 n

3. Make the following checks on J1 (Power Plug):

150 kV units: A to GND = 0 n
B to GND = Open circuit (very large resistance)
C to GND = Open circuit (very large resistance)
125 kV units: P1 to GND = Open circuit (very large resistance)
P2 to GND = Open circuit (very large resistance)
P1 toP2=O+10

CALIBRATION 3-5 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.2.3 INCOMING POWER

Verify that the incoming line voltage is matched to the autotransformer. For detailed instructions see
SECTION 2.6, STEP 16.
(
1. Turn OFF the inverter power supply [SW1J, on the fuse box (FIGURE 2-4, 2-5. or 2-6).
2. Remove fuse F9 (SCR fuse) in the fuse box. on the power supply shelf.
3. Verify all HV transformer connections are in accordance with the RPU INTERCONNECT WIRING
DIAGRAM in SECTION 8.
4. Turn incoming power ON at the disconnect box.
5. Measure the output voltage of the autotransformer:
1<1>. 60 Hz TB6-1 to TB6-4 = 369 ±5%
1<1>.50 Hz TB6-1 to TB6-4 = 308 ±5%
TM40 3<1>. 50/60 Hz TB6-4 to TB7-4; TB7-4 to TB8-4; TB8-4 to TB6-4 = 380 ±5%
TM50/65 3<1>. 50/60 Hz TB6-4 to TB7-4; TB7-4 to TB8-4; TB84 to TB6-4 = 351 ±5%
TM80 3<1>.50/60 Hz TB6-4 to TB7-4; TB7-4 to TB8-4; TB8-4 to TB6-4 =351 ±5%

If not correct. turn power OFF and perform the procedure in SECTION 2.6, STEP 16.
6. Turn power OFF.

3.2.4 X-RAY TUBE AND HIGH VOLTAGE (HV) CABLE CHECK

1. Clean all HV receptacles.
2. Clean all HV cable plugs.
3. Inspect the HV cable pins and verify that they are straight, and have a gap in their ends to ensure
good connections. Gap the ends very carefully (they are very fragile) if necessary to achieve good
contact.
4. Verify that there is continuity between the connector shields through the cable shield.
5. Use vapor proofing compound on the cable ends to be inserted into the tube. Apply to the entire
cable end.
6. Insert the HV cables into the tulle.
(
CAUTION'
Do NOT insert the HV cables into the HV transformer at this time.

7. Verify that there is ground continuity between the tube housing and the RPU chassis using a DVM.
Grounding to the RPU is accomplished via the tube rotor cable. If there is no ground continuity. check
all ground connections.

3.2.5 GATE PULSE COUNTER JUMPER CHECK

This section is for pulse fluoro generators only. On the kV control PCB. verify that jumper EKV11 (gate pulse
counter) is IN for pulse fluoro systems. This will prevent flicker during fluoro exposures.

3.2.6 HMS HIGH SPEED ROTOR CB515 INTERFACE PCB DIP SW. PROGRAMMING
The CB515 Interface PCB is located in the Aux cabinet. Its DIP switches need to be programmed as follows:
c.--
SW1-1 set to OFF; SW1-2 set to ON; SW1-3 set to ON; SW1-4 set to OFF; SW1-5 set to ON;

SW1-6 set to ON; SW1-7 set to OFF; SW1-8 set to OFF and SW2 set to "Rn.

9847 3-6 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251
, 3.3 SETUP ROUTINES
(
This section provides for the initial setup and the verification and/or change of the existing setup for the TM
generator. This must be run whenever the system configuration changes. To place the system in
Calibration/Setup Mode perform the following:
1. On the rear of the OC, remove the label covering SW3 and SW4. See FIGURE 3-3.
SW3·B CALIBRATION/OPERATIONAL MODE

--------------1

OPERATOR CONTROL REAR PANEL

FIGURE 3-3 OPERATOR CONTROL SWITCH LOCATION

2. Ensure OC power is OFF and flip SW3-8 DOWN to allow the system to be placed in calibration/setup
mode.
3. Turn the OC ON. The currently installed software versions will be displayed with the option to [HOLD]
offered. Press [HOLD] and copy down the current software versions displayed. Ensure the
compatibility between the OC and RPU.
4. Press [ALT MENU]. OPR PROG (OPeratoR PROGram) will be displayed allowing the system to be
placed in calibration/setup mode when [TEST] is pressed.
5. Press [TEST]. The TEST/SETUP/CALIBRATION routine menu will be displayed.
6. Press [2.] to enter the SETUP ROUTINES program.

C '-s:6 ENABLE PC COMMUNICATIONS

This routine displays the current status of PC communications, enabled or disabled. Press [NEXT] or [BACK]
until 1. Enable PC Communications is displayed and verify that communications is enabled by pressing
[EXECUTE]. The display should show PC Communications Enabled. Press [EXIT] to return to the setup
choice menu.

~. X-RAY TUBE 1 SETUP

1. Press [NEXT] or [BACK] until 2. X-Ray Tube 1 Setup is displayed.
2. Press [EXECUTE].
3. Tube information will be displayed. There is a top row of keywords corresponding to the top softkeys
and a bottom row of keywords corresponding to the bottom softkeys. The softkey functions are as
follows:
TUBE: Selects the tube type desired, shown in line 2. Press the key above TUBE to change tubes.
Consult the factory if the desired tube type is not available.
XX%: Selects the percent of maximum tube load at which exposures will be allowed. XX% LOAD
starts at 65% (minimum) and goes to 100% (maximum) in 5% increments. If a technique is
selected by the operator that exceeds this setting, the HOLD indicator illuminates and an
exposure will not be allowed. Press the key above the maximum allowable to change
displayed value.
HSS: Selects either high speed starter controller [yES] (if this option is provided) or the
TM's own rotor control [NO]. Press the key to toggle between YES and NO.
HS: Displayed only when HSS - YES. Enables high speed when HS-YES is displayed.
Press the key to toggle between YES and NO.

Note: HEAT UNIT ALARM

Whenever anode or Housing HU of selected tube exceeds 79% and HU ALARM is enabled (SW3-6 is
closed), then HU display is selected, a (1.33 beeps per sec) warning beep is sounded causing HU LED
to blink.

CALIBRATION 3-7 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

Note: ('
Verify that the high speed controller is properly configured, if present, in accordance with the manufacturers
directions

XXX-COOL: Selects between air-cooled, fan-cooled, or oil-cooled housings.

PIE: PREP/Exposure ready may be dependant on the imaging system or receptor used,
refer to the applicable imaging system or receptor manual. Toggles between YES
(enables) and NO (disables).
STORE: Saves the selected setup values. Beeps twice to indicate saving in progress.
EXIT: Exits the x-ray tube setup program.

4. Select the appropriate data for tube 1. When all data is verified for tube 1 press [STORE]. If changes
were made and [EXIT] is pressed "Save Changes" will be displayed giving the technician a last
chance to save as valid data any changes made.

If this procedure was performed for a tube other than that which was initially installed at the factory, a "... not
in Calibration" message will appear. Press [RESET] to continue with calibration.

X-RAY TUBE 2 SETUP

Repeat SECTION 3.3.2 for tube 2, if present. Select 3. X-Ray Tube 2 Setup.

3.3.4 FI:tJeR9..SE=r-U.e.....
1. Press [NEXT] or [BACK] softkeys until 4. Fluoro Setup appears on the display.
2. Press the [EXECUTE] softkey.
3. Fluoro mode choices will be displayed. The softkey functions are as follows:
NO FLUORO - For systems that tube 2 is operated as a radiographic tube or
there is no fluoro capability.
SS-PULSE - For systems with a Syracuse Scientific progressive scan TV camera system to be (
used in the pulsed flucro mode.
SS-CONT - For standard, continuous fluoro mode with conventional Syracuse Scientific TV
camera.
NI-CONT - For systems with the NICAL CCO TV camera with continuous fluoroscopy. Requires
the CCO TV interface PCB to integrate last image hold.
IN-PULSE - For systems with the Infimed pulse imaging system.
(Press [SS-PULSE/SS-CONT/NI-CONT/IN-PULSEINO FLUORO] softkey until the correct
fluoro mode for the installed hardware is displayed.)

For Digital Platform systems ONLY: The software controlling the TM used with the digital platform is a
different revision (rev. 4.8.0 series) and presents a different display to the technician for imaging system
selection. The following presents this revision:
OP=PH_SPOT This allows selection of the imaging system in use, see above choices plus the
additional imaging system listed below. This should be the default selection for a
generator configured with a digital platform.
IN CONT - For systems with the Infimed continuous flucro imaging system.
(Press [SS-PULSEISS-CONT/NI-CONT/IN-PULSElIN_CONT/NO FLU ORO] softkey until the
correct fluoro mode for the installed hardware is displayed.)
OP=NO This does not allow selection of any imaging system.
lI=xx" This displays the currently selected aperture for the II and MAG mode in use. Press
this softkey and the following will be displayed:
NORM=xx" This displays the diameter of the aperture in normal mode. Pressing this
selection will highlight it allowing the displayed value to be altered. Pressing
-/+ at the bottom will decrement/increment the aperture dimension.
MAG1 =xx" This displays the diameter of the aperture in MAG1 mode. Pressing this
selection will highlight it allowing the displayed value to be altered. Pressing (,
-/+ at the bottom will decrement/increment the aperture dimension. _

9847 3-8 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( MAG2=xx" This displays the diameter of the aperture in MAG2 mode. Pressing this
selection will highlight it allowing the displayed value to be altered. Pressing
-/+ at the bottom will decrement/increment the aperture dimension.
MAG3=xx" This displays the diameter of the aperture in MAG3 mode. Pressing this
selection will highlight it allowing the displayed value to be altered. Pressing
-/+ at the bottom will decrement/increment the aperture dimension.
RETURN This returns to the previous display and saves the values of the apertures
of the different MAG modes.

Note:
This choice is determined by the hardware installed and is NOT a selectable option.

4. Press the [STORE] softkey when the desired f1uoro function is displayed.
5. Press the [EXIT] softkey to exit the test/setup routines.

Ignore any "Fluoro Calibration Data is invalid ..." message at this time. Calibration is still to be performed. Press
[RESET] to continue.

3.3.5 PRINTER SE rup

1. Press [NEXT] or [BACK] softkeys until 5. Printer Setup appears on the display.
2. Press the [EXECUTE] softkey.
3. Press [AUTO PRINT/NO PRINT/MAN PRINT] softkey until the desired print mode is displayed. AUTO
prints a label automatically after each exposure, NO disables the print function or used when there
is no printer connected to the system, and MAN prints a label only when the operator presses
[PRINT] on the control panel. Press the [STORE] softkey when the desired printer function is

c 3.3.6
4.

TOMO
displayed.
Press the [EXIT] softkey to exit the test/setup routines.

sETUe
1. Press [NEXT] or [BACK] softkeys until 6. Torno Setup appears on the display.
2. Press the [EXECUTE] softkey.
3. Press [SERVO/MECH/NONE] until the correct tomo configuration is displayed.
4. Press [TUBE 1ITUBE 2] softkey until the tube to be used for tomo exposures appears on the display.
5. Press the [STORE] softkey when the correct tomo setup is displayed.
6. Press the [EXIT] softkey to exit the SETUP ROUTINES.

3.4 SIMULATED EXPOSURE

1. On the kVp control PCB: Remove jumpers EKVO, EKV3, and EKV9 to disable fail checks during this
procedure.
2. On the mAimAs control PCB: Remove the jumper EMA3, to disable filament power supply check,
and install jumper EMAO, to enable AID sample.
3. On the 1/0 control PCB: Close SW1-8.

6 SW1-8 WILL ALLOW X-RAY TO BE MADE ~tMT~~;ROTOR NOT RUNNING. THIS IS CLOSED
ONLY FOR THIS PORTION OF CALIBRATION (3.4 THROUGH 3.7)! ALSO, ENSURE THAT FUSE F9
HAS BEEN REMOVED IN STEP 3.2.3 .

4. On the card cage: Toggle OFF CB1 (filament supply), CB2 and CB3 (rotor supply).
5. Press [SW1] (inverter switch) ON.
6. Turn the OC ON.
7. Select: MANUAL MODE, 3-Factor, 40 kVp, 25 rnA, and 50 ms.
8. Press both [PREP] and [X-RAY] and observe that LEOs 1, 2, 3, and 4 on the SCR Gate Drive PCB
( are dimly lit (gate drive signals), and a clicking sound is heard. The LEOs must be watched very
closely for they are dim, and flash very fast. Replace the Gate Drive PCB if they are not.
9. Turn the OC OFF.
10. On the kVp control PCB: Install jumpers EKVO, EKV3, and EKV9.

CALIBRATION 3-9 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.5 NO LOAD kVp TEST

The following procedure enables you to make a no load kVp test at full 150kVp level. Safety sensing circuits (
will be disabled to perform this test, it is therefore imperative that they be enabled after completion. This test
confirms that the generator operating functions are proper.
1. Reinstall F9 (SCR fuse). Use the washers provided.
2. Toggle CB1, 2, and 3 OFF.
3. On the kV control PCB: Install 'um er EKV8.

Lh EKV8 IS INSTALLED ONLY FOR THIS ~~~IN~~ NOT ATTEMPT TO MAKE AN X-RAY
EXPOSURE WITH EKV8 INSTALLED.

4. On the 110 control PCB: Ensure SW1-8 is closed.

5. On the kVp control PCB: Connect a storage scope between TP (ground) and TP3 and set it as
follows: Positive slope, 5ms/DIV, 1V/DIV
6. Place at least 2" (5.1 cm) of oil in each cable receptacle.
7. Set the operator control for 40kVp, 25mA and .5mAs. There will be no mA and therefore no mAs,
but the above settings will normally allow for a short no load shot for the first attempt.
NOTE:
Each time the HV invertor fires a pair of SCRs a ticking sound will be heard from the invertor shelf area
of the RPU. This sound is normal, The ticking will increase in frequency each time the no load is done
at a higher kVp.

8. Push the PREP button and when the PREP switch illuminates, tap the X-RAY button ON for the first
attempt at No Load.

Note:
The exposure will terminate in approximately 250 ms, and an Error 12 flag (Exposure Time Limit Error) (.
will appear on the console. This error is normal. Press [RESET] and continue. If any other error .
terminates the exposure, the error must be investigated and the appropriate action taken.

9. Inspect the kV Feedback ramp. It should consist of 6 to 8 steps with an amplitude of about AVand
a time of about 2ms to 3ms for each step.
10. Set the scope for .2seclDlV, select 30 mAs and repeat STEP I.
11. Press the X-RAY button ON and hold for about 1 second.
12. Increase the kV in 5kV steps all the way to 150kV, making a No Load shot at each step.
13. On the 1/0 control PCB: Open SW1-8. This MUST be open to allow the rotor to spin during an
exposure.
14. On the kVp control PCB: Remove jumper EKV8.
15. On the mA/mAs control PCB: Remove jumper EMAO and install it at EMA3.
16. On the card cage: Toggle CB1, 2, and 3 ON.
17. Remove fuse F9.

3.6 FILAMENT CHECK (RADIOGRAPHIC TUBE)

1. Coat the HV cables ends with vapor proof compound. Insert the connector into the x-ray tube. Place
approximately 6cc of oil in high-voltage receptacles on transformer assembly and insert the cables
into the generator.
2. If a collimator is present, open the blades fully, and move the mirror out of the way (see the collimator
manufacturers manual). If the mirror cannot be moved out of the way, remove the collimator for this
check.
3. Turn ON the OC.
4. Select: MANUAL MODE, 40 kVp, 25 rnA, 5 mAs, LARGE FOCUS.
5. Press [PREP] and observe via the mirror, that the large filament is illuminated.
6. Select: SMALL FOCUS, and press [PREP] and observe via the mirror that the small filament is
illuminated. •
7. Install the collimator if removal was necessary.

9847 3-10 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.7 FILAMENT CHECK (FLUOROSCOPIC TUBE)

( 1. Remove the table top per instructions in the table Maintenance Manual.
2. Select Tube #2 and perform SECTION 3.6 for the fluoroscopic tube.
3. Replace the top per the table Maintenance Manual.
4. Install fuse F9.

3.B TEST ROUTINES

Note:
The following procedures may require the use of the extender card to make adjustment easier. If there is
a problem with system lock-up when the extender card is used, the procedure should be performed without
it. In this case the system will have to be powered down for PCB removal/insertion for component access
and powered up to verify the adjustment.

The system was just used in operational mode and must be placed in TEST/SETUP/CALIBRATION
ROUTINES mode:

1. Press [ALT MENU]. OPR PROG (OPeratoR PROGram) will be displayed allowing the system to be
placed in calibration/setup mode when [TEST] is pressed.
2. Press [TEST]. The TEST/SETUP/CALIBRATION routine menu will be displayed.
3. Enter the TEST ROUTINES by pressing [1.] (TEST ROUTINES).

~. SYSTEM INFORMATION
1. Select 1. TEST ROUTINES.
2. Press [NEXT] or [BACK] until 1. System Information is displayed.
3. Select EXECUTE.
4. Verify that the OC S/W ver and RPU ver numbers are the same. This ensures compatible software

c 5.
versions. Verify they are recorded in SECTION 10.B.
Select [EXIT] to return to 1. System Information.

~EAT UNITS and RTC

1. Press [NEXT] or [BACK] until 2. HEAT UNITS and RTC (Real Time Clock) is displayed.
2. Select [EXECUTE]. This display shows the current H (housing) and A (anode) heat units stored in
the x-ray tube units. The RTC TOCKS value changes once each second indicating that the real time
clock is running. This clock is used in the x-ray tube cooling curve function.
3. Select [EXIT] to return to 2. HEAT UNITS and RTC.

AEC V/F CHECK and CAL

1. Press [N EXT] or [BACK] until 3. AEC V/F CHECK and CAL is displayed. If AEC NOT present, go
to SECTION 3.9.
2. Select [EXECUTE]. The trip value will be shown and has been set at the factory. When first
displayed, the TRIP value will step in value until the actual set value is reached. Record the
displayed value -
a. Turn OC power OFF.
b. Install the AEC interface PCB (FIGURE 3-1) on the extender card.
c. Turn OC power ON.
d. Connect the DVM between TPB (TRIP VALUE) and TP (GROUND) on the AEC interface
PCB and compare the DVM reading and that shown on the OC display. EXAMPLE:TRIP
VALUEB52
TPB = +8.52VDC

e. The trip value must be within ±5 ±.05V. If necessary, adjust potentiometer R43 on the AEC
interface PCB ':!.!ltil the trip value matches the TP8 voltage +5 di9I!§. Press [EXIT] when
complete. - .-.
(

CALIBRATION 3-11 9847

 F
TMX RAY GENERATORS
. M;:;TENANCE MANUAL 9026.251

3.8.4~ CHAMBER FIELD DRIFT CHECK

There is no field service adjustment. The following procedure verifies ion chamber operation. If there is a (
/ problem with repeatability after calibration is complete first verify all connections and perform this procedure
again. If the problem persists replace the ion chamber.

1. Select [NEXT] or [BACK] to progress to 4. ION Chamber Field Drift Check.

2. Select [EXECUTE]. Verify the drift adjustments of the selected ion-chamber field. This adjustment
is dependent on the system configuration, i.e. which RECEPTORS (ion chambers) are utilized,
rrABLE],[WALL] and/or [AUX]. Each chamber contains three fields which must be verified. During
calibration the fields are reset every ten seconds and released. This allows for verification. TABLE
3-2 provides the cross reference for each chamber.

CHAMBER TEST POINT

TABLE (#1) TP1
WALL (#2) TP2
AUX (#3) TP3

TABLE 3-2 CHAMBERIAEC INTERFACE PCB TEST POINTS

a. Connect the DVM across the appropriate test point per TABLE 3-2 and TP (GROUND) on
the AEC interface PCB.
b. Select the appropriate [AEC FIELD] on the OC.
c. Observe the DVM for a period of time to allow a few cycles. Verify that the reading remains
steady. If it doesn't verify all connections.
d. Repeat STEP 12 until all fields have been verified.
e. If additional receptors (ion chambers) are to be verified, exit calibration mode, select the
appropriate receptor, and reenter calibration mode.

l
9847 3-12 CALIBRATION
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

(
~" CALIBRATION - GENERAL
The system has been fully calibrated at the factory. The requirements of the field installer will be to match the
x-ray tube characteristics with the system. This also includes compensation for different cable lengths than
those used at the factory.

The prime field calibration is setting the preheat values for both large and small filaments, and calibration of
mAs to match system characteristics.

Filament calibration requires calibration at the end points and at the midpoint of the available mA values. Each
of the other calibration routines require calibration at the end points only, and then verification of a value
between these two points. For example, mA calibration at 25mA and 300mA, then verify 150mA for the TM30
or at 25mA and 600mA, then verify at 300mA for the TM65.
1. Shut down all system power, both at the OC and the distribution box.
2. Install the noninvasive meter or kVp divider being used. Follow the manufacturers instructions for
conneciions.
3. Remove the banana shorting plug from the Isolation P.C.B.
4. Insert the mA/mAs meter into the banana jack (red = positive).
5. Switch system power ON at the distribution box.

Lt. This connection is in the mid-seCondary~ft~'~~i'9h voltage circuit. Verify that the meter
leads are installed in the current (mA) jacks of the meter. DO NOT make exposures without either
the 'um er lu or the mA/mAs meter installed.

~ABLE LENGTH COMPENSATION

c The mA regulator uses two different feedback signals to control the mA through the x-ray tube. The first is
the preheat signal, and the second is the actual mA signal. The transfer time from preheat to actual mA
feedback occurs when the x-ray kVp signal reaches maximum (2 to 3 ms).

The x-ray cable capacitance must be charged during this same time. As the cable lengths become longer,
the charge time becomes longer, which distorts the beginning of the mA waveform. The transfer time must
be delayed until the cables are fully charged. This delay is selected by jumpers on the mA/mAs PCB.
Measure the cables from the HV transformer to the tube, and select the appropriate jumper combination
from TABLE 8-10.

3.9.2 PRECALIBRATION

Lt. CAUTION'
It is recommended that x-rays not be produced above 90 kVp until the x-ray tube is properly
conditioned.

If a new x-ray tube is used, season it in accordance with the manufacturers instructions. It is desirable to
condition a new x-ray tube at an intermediate kVp to establish a voltage gradient across the tube, and to
elevate the anode temperature in order to reabsorb any gases present in the tube insert.

During this procedure, the unit will need to be precalibrated for proper preheat at 40kVp, 60kVp and 125kvp.
Then the 125 kVp OFFSET value will be entered at 150 kVp, and the preheat waveform verified at 140 kVp
until the tube has been conditioned at higher kVp values.
1. Ensure power is OFF.
2. Install the high voltage cables coated with vapor proof compound in the x-ray tube. Ensure that the
cable clamps are tight. Lock the set screws if present. Use approximately 6cc of oil in high-voltage
transformer receptacles.

CALIBRATION 3-13 9847

 ' M X-RAY GENERATORS

J MAINTENANCE MANUAL 9026,251

. 3, Set the scope as follows:

Trigger - Ch1, positive slope
Ch1: Vertical - 1V/DIV
Time base - 5ms/DIV
(
Ch2: Vertical - 0, 1V/DIV
4. Place Ch 1 of the scope on TP3 of the kVp control PCB, and TP (ground), This is the kVp waveform,
Place Ch2 on TP2 of the mA/mAs control PCB, and TP (ground), This is the mA waveform.
5. Remove the adhesive label on the rear of the OC and flip switch SW3-8 DOWN (FIGURE 3-3).
6. Turn power ON and turn the OC ON.
7. Press [ALT MENU].
8. Press TEST.
9. Press [3.] CALIBRATION ROUTINES.
10. Press [NEXT] until 3a. MASTER Preheat Calibration is displayed.
11. Select [EXECUTE].
12. Select LARGE FOCUS, 200 mA, 40 kVp, 50 ms. The display should show the current data for the
following:
PREHEAT On the rnA/mAs control PCB: The number 2971 (for example) represents the
voltage at TP5 (2971 = .2971 VDC). It is one half of the preheat reference voltage
at TP1 on the mA/mAs PCB. It is the value which will be modified to increase or
decrease the preheat.
[-] Decrements the PREHEAT Offset number.
[+] Increments the PREHEAT Offset number.
[STORE] Stores the currently displayed PREHEAT Offset number. Always [STORE] any
changes
[EXIT] Exits the MASTER Preheat Calibration menu.

13. 6f' Make an exposure and observe the mA waveform (FIGURE 3-4). Adjust the PREHEAT value
by using the [+] and [-] keys. These will change the PREHEAT Offset value shown. The PREHEAT
value will also change by the new PREHEAT Offset value. When the value shown is acceptable,
press the STORE switch. Two audible beeps will be heard indicating that the value is stored. Repeat
(
this step until the mA waveform is correct.
14. Select 60 kVp and repeat STEP 13. The PREHEAT Offset number from this step will be used in
STEP 15. Record PREHEAT Offset =
15. Select 125 kVp and input the PREHEAT Offset value stored at 60 kVp, then [STORE]. Do NOT
make an exposure at this time.
16. Select 80 kVp. The display will indicate "Selected KV not in calibration range".
17. 6f' Make an exposure to verify the proper preheat waveform (FIGURE 3-4). If it is too high or too
low, select 125 kVp again and increase or decrease the PREHEAT Offset value, [STORE] and retum
to 80 kVp for wavefomn verification.
18. Select 125 kVp and repeat STEP 13. The PREHEAT Offset number from this step will be used in
STEP 17. Record PREHEAT Offset =
19. Select 150kVp and input the PREHEAT Offset value stored at 125 kVp, then [STORE]. Do NOT
make an exposure at this time.
20. Wait 15 minutes before proceeding to allow the tube to cool.

vershoo ndershoo
'2
"j~
kV

:-~roP8rJy calibrate~:t
"lAc
kV -
-
FIGURE 3-4 PREHEAT WAVEFORMS (mA)

9847 3-14 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.9.3 X-RAY TUBE CONDITIONING PROCEDURE - EUREKA TUBES ONLY

(
Note:
This procedure is for Eureka tubes ONLY. For other manufacturers refer to their documentation for their
recommended fJl"ocedure.

A newly installed Eureka x-ray tube, especially one that will be used in a high power, high kVp, or heavy work
load environment, can be seasoned to its new environment using the following procedure. The procedure
consists of four parts:
1. A five to six-minute high heat input run to get the tube anode to maximum heat.
2. Followed immediately by a 10 to 12 minute period at a reduced input rate to heat soak the target.
3. A 15-minute cooling period.
4. A high voltage stability check.

Prerequisites:
1. Perform the precalibration as per SECTION 3.9.2, STEPS 1 - 14.
2. Proper anode rotation speed shall be verified. All test parameters are based on standard speed
ratings, therefore all tests can be run either standard speed or high speed, except where high speed
is specifically noted.
3. The kVp and rnA waveforms shall be monitored for all exposures.
4. There must be a minimum of a 15-minute cooling period between any previous exposures and the
start of this procedure.
5. If possible, keep the rotor boosted between exposures to minimize housing heat input. If possible,
a fan should be used to minimize housing heat.
Procedure:
1. If not already in calibration mode. enter it at this time as outlined in PRECALIBRATION. Enter 3a.
MASTER Preheat Calibration to condition the tube.
( Note:
When in calibration mode only, befw:e calibrating tube 2:
a. For generators with high frequency filament - disconnect the white/green wire from TB2-2 (FE) on
the Huoro field 110 PCB (5584.262.20). Reinstall this wire upon completion of tube 2 calibration.
OR:
b. For RtF generators with high speed rotor control- disconnect the whitelred wire from TB2-2 (FE)
on the f1uoro fielllO PCB (5584.262.20 or 6584.262.17). Reinstall this wire upon completion of
tube 2 calibration.

2. ~ High heat input. Make exposures on the large focus per TABLE 3-3. Continue immediately with
STEP 2.
3. ~ Reduced input. The same as STEP 1, except double the interval between exposures.

Note:
a. If this procedure is interrupted anytime during STEP 1 or 2. allow the tube to cool for 15 minutes
minimum, before starting over.
b. This procedure will heat up the SCR fuse (F9). and if not properly heat-sunk, i.e., proper washers
installed, it may open. It is recommended to replace F9 between STEP 1 and 2 with a cool fuse
to assure operation of this procedure.
c. If the specified rnA and TIME indicated in the table cannot be obtained. use a combination of
factors that will give approximately the same H. U. (kVp X rnA X TIME X 1.35) per exposure. Do
not exceed the single exposure ratings. refer to the proper product data sheet for a given tube
type. EXAMPLE: 90kVp x 300mA x 0.7s x 1.35 = 25,500H.U.lexp.
EQUIVALENT: 90kVp x 250mAx 0.8s x 1.35 = 24,300H.U.lexp. or90kVp x 320mA x .66s x 1.35
= 25,600H. U.lexp.
(

CALIBRATION 3-15 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

4. Cooling. Allow the tube to cool from 15 minutes to 1 hour. (

5. High voltage test: Use Large focus, 30ms exposure time, and rnA as specified in TABLE 3-4. Check
tube slability to the maximum kVp for the tube type. Use the kVp steps per tube type as outlined in
TABLE 3-4. Proceed as follows:
a. ~ Make at least four exposures at a minimum of 10 seconds apart for each kVp step per
tube type. At the highest kVp step used, make at least 12 exposures.

TABLE 3-3 TUBE CONDITIONING TABLE I

ANODE TUBE TYPE" LARGE TARGET CONlROLSETTINGS HEAT UNITS TIME TOTAL
HEAT FOCAL ANGLE. PER BETWEEN EXPOSURE
CAPACITY SPOT DEGREES
kVp mA TIME EXPOSURE EXPOSURES S
(mm:) x 1000

EMERALD
150 KHU RAD-8 2.0 16 80 200 1.0 21.6 ·30s 10
200 KHU RAC-74 1.5 1. 90 300 0.5 18.0 155 15
300KHU RAD",,8 2.0 90 300 0.7 25.5 15
1.2 " 90 300 0.25 9.1
205
7.5s 40
"
DIAMOND
16 0.7
300 KHU RAD-13
RAO-14
2.0
1.2 12
90
90
300
300 0.5
25.5
18.0
205
155
15
20
,
SAPPHIRE
300 KHU RAD-25 2.0 1. 90 300 0.7 25.5 205 15
1.2 1. 90 300 0.7 25.5 205 15
RAO-16 2.0 16 90 300 0.7 25.5 205 15
RAD-21 1.2 12 90 300 0.7 25.5 205 15
400 KHU RAD ... 2.0 16 90 300 0.7 25.5 150 20
RAD.4Q 1.5 12 90 300 0.7 25.5 155 20
1.2 12 90 300 0.7 25.5 155 20
1.0 12 90 200 1.0 24.3 155 20
RAD""O 1.2 12 90 300 0.7 25.5 155 20
RAD-56 1.2 1. 90 300 0.7 25.5 155 20
1.0 1. 90 300 0.25 9.1 7.Ss 40
RAD-19 1.0 10 90 300 0.7 25.5 155 20

600 KHU RAD-S2 1.2 12 90 300 0.7 25.5 125 24

1.0 12 90 200 1.0 24.3 125 25
400 KHU RADoS1 1.2 12 90 300 0.7 25.5 155 20
-1.0 12 90 200 1.0 24.3 155 20
325KHU RAD·55 1.5 12 90 300 0.7 25.5 205 15
1.2 12 90 300 0.7 25.5 205 15
RAD-n 1.0 15 90 300 0.25 9.1 7.5s .0
..
Please call the factory for availability.

9847 3-16 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( TABLE 3-4 rnA SELECTION AND kVp STEPS FOR HIGH VOLTAGE TEST

ANODE HEAT LARGE FOCAL TARGET ANGLE kVp STEPS

CAPACITY TUBE TYPE SPOT (degrees) rnA FOR HVTEST
(mm')

EMERALD
150KHU RAD·8 2.0 16 200
200KHU RAD-74 1.5 14 200
300KHU RAD·68 2.0 14 200
1.2 14 200

DIAMOND
300KHU RAD-13 2.0 16 200
RAD-14 1.2 12 200

SAPPHIRE
300KHU RAD-25 2.0 14 300
1.2 14 300 5 kVp STEPS
RAD-16 2.0 16 400 FROM 60kVp-
RAD-21 1.2 12 300 125kVp
400KHU RAD-44 2.0 16 400
RAD-40 1.5 12 400
1.2 12 300
1.0 12 200
RAD-60 1.2 12 300
RAD-56 1.2 14 200
1.0 14 200
RAD-19 1.0 10 200

400KHU RAD-51 1.2 12 300

c
1.0 12 200
600KHU RAD-52 1.2 12 400'
1.0 12 400'
325KHU RAD-55 1.5 12 300
1.2 12 300
RAD-77 1.0 15 200

• HIGH SPEED RATING

i. ~ If instability occurs at any step, reduce the kVp by 5kVp and repeat the
exposures at that kVp for four clean exposures.
ii. If instability continues to occur, double check the system for possible causes such
as calibration, loose connections, proper grounding, air in the housing, arcing at the
cable receptacles, etc.

b. Repeat the entire procedure if necessary. If repeating the entire procedure does not insure
stable operation at the kVp to be used, replace the tube.

CALIBRATION 3-17 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.10 CALIBRATION
This procedure assumes that the x-ray tube has been conditioned following the manufacturers instructions.
If the previous section was not performed, do not operate the x-ray tube at a high kVp without going through
an intermediate kVp level.
c
During preheat, calibration occurs at40kVp, 60kVp and 125 kVp. Enter the 125 kVp offset value at 150 kVp,
and return to 140kVp to verify the preheat waveform. Refer to SECTION 3.9.2, STEPS 16 through 20. Once
this has been done, the system may be increased in 1OkVp steps to 120 kVp to condition the tube and system.

~ORO STANDBY FILAMENT CALIBRATION

This procedure is for adjusting the hardware (on the fluaro 110 PCB) standby filament levels for the undertable
fluoro tube. The filaments are adjusted to a level just below emission.
1. Ensure that power is OFF.
2. Toggle CB1 (filament) OFF.
3. Place jumper EMA3 on EMAO on the mA/mAs PCB.
4. Open the lower panel on the card cage to expose the fluoro field 1/0 PCB for adjustment.
5. Turn power ON and make a fluoro exposure @ 125 kV, -1 rnA station (OR 30 pps for pulsed fluoro
system).
6. On the fluoro field 1/0 PCB: Observe the fluoro monitor while adjusting R37 (large filament) CWo
When an image appears on the monitor adjust R37 CCW until the image just disappears.
7. Wait for 5-minute timeout, or toggle to tube 1 then back to tube 2.
8. On the 1/0 control PCB: move SW1-7 to the ON position.
9. On the fluoro field 1/0 PCB: Observe the fluoro monitor while adjusting R38 (small filament) CWo
When an image appears on the monitor adjust R38 CCW until the image just disappears.
10. Move SW1-7 to the OFF position.
11. Turn power OFF.
12. Place jumper EMAO on EMA3 on the mA/mAs PCB.
13. Toggle CB1 (filament) ON.

3.10.1 FILAMENT PREHEAT CALIBRATION

1 1. Set the scope as follows: Time base - 5ms/div, Trigger - Ch1, pos. slope
Ch1: vert. -1V/div, TP3 (kVp Control PCB). See TABLE 3-5.
Ch2: vert. - 0.1V/div, TP2 (mA/mAs Control PCB). See TABLE 3-6.

I TABLE 3-5 kVE! REFERENCES I I TABLE 3-6 mA REFERENCES I

kVp TP3 (Vno) mA TP2 (Vno)

150kV Units 125kV Units 150kV Units 125 kV units

40 2.40 2.90 25 .19 .25

50 3.00 3.64 50 .38 .50
60 3.58 4.36 100 0.75 1.00
70 4.20 5.09 150 1.12 1.50
80 4.80 5.82 200 1.50 2.00
90 5.40 6.55 300 2.25 3.00
100 5.99 7.27 400 3.00 4.00
110 6.60 8.00 500 3.75 5.00
120 7.20 8.73 600 4.50 6.00
125 7.50 9.09 800 6.00 N/A
150 9.00 N/A 1000 7.50 N/A

2. Turn the OC OFF and flip switch SW3-8 DOWN (FIGURE 3-3).
3. Turn the system ON.
4. SelectTUBE 2.
5. Press [ALT MENU].

9847 3-18 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

6. Press TEST.
( 7. Press [3.] CALIBRATION ROUTINES.
FOR SW VERSION 3.8.3 & ABOVE ONLY:
8. Press [NEXT] until3c. STBY_PH ADJ is displayed. Select [EXECUTE].
9. Press the upper right selector switch until STBY=OFF is displayed. Press EXIT to return to the main
menu.
FOR ALL SW VERSIONS:
10. SelectTUBE 1.
11 . Repeat STEPS 5 to 8 for tube 1.
12. Press the upper right selector switch until STBY=OFF is displayed. Press EXIT to return to the menu
screen.
13. Press [BACK] until 3a. MASTER Preheat Calibration is displayed.
14. Select [EXECUTE].
15. Select LARGE FOCUS, 200 rnA, 40 kVp, 50 ms.
16. ~ Make an exposure and observe the rnA waveform, (FIGURE 3-4) and reference TABLE 3-6. If
the reference waveform is not correct, adjust the PREHEAT value by using the [+] and [-] keys. The
PREHEAT Offset value shown will change. When the value shown is acceptable, press the STORE
switch, two audible beeps will be heard indicating that the value is stored. The PREHEAT value will
also change by the new PREHEAT Offset value. Repeat this step until the mA waveform is correct.
Continue if the waveform is correct.
17. Select LARGE FOCUS, 200 rnA, 60 kVp, 50 ms. Repeat the steps from STEP 10 on until the
waveform is correct.
18. Select LARGE FOCUS, 200mA, 125 kVp, 50 ms. Repeat the steps from STEP 10 on until the
waveform is correct.
19. Select LARGE FOCUS, 200mA, 150 kVp, 50 ms. Change PREHEAT OFFSET value and make an
exposlIre at 140 kYp Repeat this step until the waveform is correct.

c 20. Press [EXIT] to exit 3a. MASTER Preheat Calibration.

3.10.3 rnA CALIBRATION

Exposure timing is accomplished with the mAs timer. If mA is incorrectly calibrated, exposure times will be
incorrect. The correct mAs will always be delivered regardless of the mA calibration state. Correct exposure
time is the result of correct mA calibration.

1. ~n power OFF and install the rnA/mAs control PCB on an extender card.
2. -'--'Fortf power ON and using a DVM check for OVec at TP2 on the mA/mAs control PCB. If it is not,
adjust R57 until-0.008Vec is obtained
3. -.Er:lter-claibration mode and press [NEXT] until 1. MA Calibration is displayed.
4. Press [EXECUTE].
>-5":'. Select LARGE FOCUS, 25 rnA, 60 kVp, 1 s.
6. Remove the shorting plug from the tank or the isolation feedback PCB and connect the ammeter to
these points.
~ Make an exposure and note the actual rnA reading. Adjust the rnA value by using the [+] and [-]
keys. These will change the MA Offset value shown. The rnA value will also change by the new MA
Offset value. When the value shown is acceptable, press the [STORE] switch. Two aUdible beeps
will be heard indicating that the value is stored. Repeat this step until the mA waveform is correct.lIlA
yaille - 25mA +1 rnA
,-&--".. Leaving all else the same, select the following rnA setting:TM30 - 400 rnA; TM40, TM50, TM65, TM80
-600 rnA.
NOTE:
Most digital multimeters require at least one second for a reading to stabilize. If multiple exposures are
required, refer to x-ray tube rating chart, and be sure to let the target cool between exposures (up to two
minutes). If the tube that is installed can not make the selected rnA exposure for one second, lower the

( rnA to p.erform this calibration.

CALIBRATION 3-19 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

9. ~ Make an exposure and note the actual mA reading. Adjust the mA value by using the [+] and [-]
keys. These will change the MA Offset value shown. The mA value will also change by the new MA (
Offset value. When the value shown is acceptable, press the [STORE] switch. Two audible beeps
will be heard indicating that the value is stored. Repeat this step until the mA waveform is correct.
mA value = selected mA ±3%:
TM30 - 400 mA ± 12 mA
TM40, TM50, TM65, TM80 - 600 mA ± 18 mA
10. Press [EXIT] to exit 1. MA Calibration.
11. Turn power OFF and remove the mA/mAs control PCB from the extender card and install it in its slot
in the card cage.
12. Disconnect the ammeter from the jumper connector and reinstall the shorting plug.

JA
13. Turn power ON and enter calibration mode for the next section.

kVp CALIBRATION
This procedure ensures that the system will reliably generate the desired kVp for safe exposures. If not
calibrated properly the generated kVp may not match that selected by the operator.
1. Press [NEXT] until 2. kV CALIBRATION is displayed.
2. Press [EXECUTE].
3. TABLE 3-7 provides the techniques used for this calibration procedure. Perform the following for both
the low and high techniques at each power level:

~ Make an exposure and observe the actual kVp on the noninvasive meter or the kVp divider.
Adjust the kV value by using the [+] and [-] keys. These will change the KV Offset value displayed.
The kV value will also change by the new KV Offset value. When the value shown is acceptable,
press the [STORE] switch. Two audible beeps will be heard indicating that the value is stored.
Repeat this step until the kV value is correct.

If further exposures are necessary for the 150kV units, select 140 kVp and 150 kVp and perform the
calibration at these points.
c
I TABLE 3-7 kVp CALIBRATION SELECTIONS I
RANGE Lo Hi

SYSTEM kW mA kV ms rnA kV ms

125kV <12 200 45 50 N/A N/A N/A

Units
30,40 ,12 N/A N/A N/A 200 125 50

150kV <12 50 60 50 50 130 50

30L <30 200 60 50 200 130 50

40L <40' 400 60 50 300 130 50

150kV <12 50 60 50 50 130 50

Units
<30 200 60 50 200 130 50
<40 400 60 50 300 130 50
60,50,80
<60 600 60 50 400 130 50

<80 800 65 50 500 130 50

• -40L ONLY
(
'-

9847 3-20 CALIBRATION

 TM X-RAY GENERATORS

~
MAINTENANCE MANUAL 9026.251

3.10.5 EHEAT POST-CALIBRATION

( 1. Press [NEXT] until 3a. MASTER Preheat Calibration is displayed.
2. Press [EXECUTE].
3. Select LARGE FOCUS, 200 rnA, 40 kVp, 50 rns.
4. ~ Make an exposure and observe rnA waveform (TP2 on mA/mAs Control PCB), see FIGURE 3-5.
Adjust the PREHEAT Offset value by using the [+] and [-] keys. These will change the PREHEAT
Offset value shown. The PREHEAT value will also change by the new PREHEAT Offset value.
When the value shown is acceptable, press the [STORE] switch. Two audible beeps will be heard
indicating that the value is stored. Repeat this step until the PREHEAT value is correct.

If during performance of this section, the error message "FILAMENT OVERLOAD" is displayed,
slightly increase the PREHEAT offset value and reshoot. If during performance of this section, the
error message "mA OVERLOAD" is displayed, slightly decrease the PREHEAT offset value and
reshoot.

, ". ,
J ,rr. 'I
I 1"1 r F" ., '''r-.............
"" 9028-005
Preheat waveform at 50 rnA station ~----- ----.I Preheat waveform at 200 rnA statio~n------

FIGURE 3-5 PREHEAT WAVEFORMS

5. Select LARGE FOCUS, 200 mA, 60 kVp, 50 ms and repeat STEP 4.

6. Select LARGE FOCUS, 200 rnA, 125 kVp, 50 rns and repeat STEP 4.
7. Select LARGE FOCUS, 200 rnA, 150 kVp, 50 ms and repeat STEP 4.
B. Select SMALL FOCUS, 50 mA, 40 kVp, 50 rns and repeat STEP 4.
9. Select SMALL FOCUS, 50 rnA, 60 kVp, 50 rns and repeat STEP 4.
10. Select SMALL FOCUS, 50 mA, 125 kVp, 50 ms and repeat STEP 4.
11. Select SMALL FOCUS, 50 rnA, 150 kVp, 50 ms and repeat STEP 4. / .
12. Press [EXIT] to exit 3a. MASTER Preheat Calibration. The mA, kVp, and preheats are now
calibrated. The MASTER Preheat Calibration routine was used to calibrate the 200mA curve at
three kVps: 40, 60, 125 and 150. It also shifted each of the other system preheat curves at the same
time, which calibrates the entire system.
13. The installer should now check each rnA station at a low, middle, and high kVp (50ms exposures).
The preheat should allow the mA waveform to. begin at the set mA, ±5%, as measured at the end of
the initial cable charge overshoot. If any preheats are found to be out of tolerance, then the POINT
PREHEAT CALIBRATION routine in SECTION 3.10.8 can be used to fine tune the system calibration
at 40, 60, 125 and 150 kVp for any mA station needed.
14. Press [EXIT] until the calibration routine is exited.

MAS CALIBRATION
1. Press [NEXT] until 4. MAS Calibration is displayed.
2. Press [EXECUTE].
3. Select LARGE FOCUS, 200 mA, 80 kVp, 125 ms.
4. Remove the banana plug shorting connector from the high voltage tank (in 125 kV units) or the
isolation PCB (in 150 kV units) and connect an mAs meter in the jumper's place.
5. ~ Make an exposure and measure the actual mAs as displayed on the mAs meter. If necessary,
change the offset by pressing [+] or [-]. STORE and repeat the exposure until the correct value is
displayed. Correct mAs vallie = 25 mAs +0 95 mAs
Note: Adjust as accurately as possible to the actual value.
( 6. Select LARGE FOCUS, 200 mA, 80 kVp, 1250 ms and repeat STEP 15. Correct mAs vallie - 250
mAs +7 7 mAs Note: Adjust as accurately as possible to the actual value.

CALIBRATION 3-21 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

j Press [EXIT] until the calibration routine is exited.

3.1J POINT PREHEAT CALIBRATION

(
This procedure calibrates each mA station for 40,60,125 or 150 kVp. Start at the lowest mA station.
1. Press [NEXT] until 3b. POINT Preheat Calibration is displayed.
2. Select [EXECUTE].
3. Select SMALL FOCUS, 40 kVp, 50ms.
4. Select the starting mA station.
Note:
The TM interpolates the PREHEAT number for kVps between calibration points. If a limit error occurs for
a kVp cal point/mA, a lower kVp must be selected for the exposure. Any corrections required are input and
stored for the actual k~cal iJOint and reverified at the lower kVp.

5. Perform SECTION 3.10.5, STEP 4.

6. Select the next rnA station and repeat STEP 5 until all mA stations have been calibrated.
7. Perform STEPS 4 through 6 for the following kVp stations: 60, 125 or 150 (depending on the
capability of the generator). When each of the kVp stations have been calibrated proceed to the next
step.
8. Select LARGE FOCUS and perform STEPS 4 through 7.
9. Press [Exit] tei exit 3b. POINT Preheat Calibration.

3.10.8 RADIOGRAPHIC STANDBY FILAMENT CALIBRATION (SW Ver 3.8.3 and above)
This section is applicable only if a one-second PREP to X-RAY cycle time is required. Each focal spot of each
x-ray tube is individually adjusted. The procedure adjusts the filament standby current to a level just below
emission. The procedure must be repeated for each focal spot of each tube.
1. Press [NEXT] until 3c. Standby Preheat Adj is displayed. Select [EXECUTE].
2. Press the upper right switch to toggle the display to STBY=ON. (
3. ~Make an exposure and observe the mA wavefonm (TP2 on rnAlmAs control PCB). The waveform
should show an mA burst approximately 2 ms long and then drop to zero.
4. Adjust the Filament Standby value by pressing either [+] or [oj. Press [STORE] when the value is
satisfactory.
5. ~Make an exposure and observe the mA waveform. Repeat STEP 5 until the mA burst begins to
lengthen. Reduce the Filament Standby value to a value just below this point and press [STORE].
6. Press [EXIT] to go back to the main menu.

3.10.9 PREHEAT BOOST ADJUST (SW Ver. 3.8.3 and above)

This procedure provides for the adjustment of the boost number to a value which will compensate for the
shortened filament boost time necessary for a short Rad x-ray cycle time.
1. Press [NEXT] until 3d. Preheat Boost Adj is displayed.
2. Select [EXECUTE].
3. Select 200 rnA, 60 kVp, and the desired focal spot.
4. ~Make an exposure and observe the mA waveform (TP2 on mA/mAs control PCB). Adjust the
BOOST Offset value by pressing [+] or [oj. This will change the BOOST Offset value shown. The
PH_BOOST value will also change by the new BOOST Offset value. When the value shown is
acceptable, press [STORE]. Repeat this step until the rna waveform is correct. The BOOST Offset
value will be applicable for all mA selections on the selected focal spot.
5. The large and small focal spots of each Rad x-ray tube is individually adjusted. Perform the above
steps for the remaining focal spot and Rad tube.
6. Press [EXIT] to return to the main menu.

9847 3-22 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.10.10 Ul<tflERTABLE STANDBY FILAMENT CALIBRATION (SW Ver 3.8.5 & above)
( This section and the following section are only applicable if a fast fluoro to spot cycle time is required, such
as for a 105 camera or for photo spot. Each focal spot of each X-Ray tube is individually adjusted. The
procedures outlined must be repeated for each focal spot. This procedure is for adjusting the filament standby
current to a level just below emission.
1. Press [NEXT] until 3c. Standby Preheat Adj. is displayed.
2. Select [EXECUTE].
3. Press the upper right switch to toggle the display to STBY = ON.
4. ~Make an exposure and observe the mA waveform.
5. The waveform should show an mA burst approximately 2-msec long and then drop to zero.
6. Adjust the Filament Standby value by using the [+] and [-] keys. Press STORE, make an exposure
and observe the mA waveform.
7. Repeat STEP 6 until the mA burst begins to lengthen. Reduce the Filament Standby value to a
slightly lower value, make an exposure to verify and if correct, press STORE.
8. Press [EXIT] to exit 3c. Standby Preheat Adj.

3.10.11 PREHEAT BOOST ADJUST

This procedure provides for the adjustment of the preheat boost number to a value which will compensate for
the shortened filament boost time necessary for a short x-ray cycle time. This procedure is for photos pot
systems.
1. Press [EXIT] repeatedly to return to the Main menu. Select Tube 1 and then select Tube 2. The LCD
screen should display the Fluoroscopic and Spotfilm technique factors.
2. Press [ALT MENU].
3. Press TEST.
4. Press [3.1 CALIBRATION ROUTINES.
5. Press [NEXT] until 3d. Preheat Boost Adj is displayed.

c 6.
7.
8.
Select [EXECUTE].
Select 200 mAand 60 kVp.
~Make a short !luoro exposure and then a photo spot exposure. Observe the mA waveform. If the
waveform must be corrected, adjust the BOOST Offset value by using the [+] and [-] keys as
required. This will change the BOOST Offset value shown. When the value shown is acceptable,
press the STORE switch. The PH_BOOST value will now also change by the new BOOST Offset
value. Two audible beeps will be heard indicating that the value is stored. Repeat this step until the
mA waveform is correct. The BOOST Offset value will be applicable for all mA selections on the focal
spot selected.
9. The large and small focal spots of the under-table fluoro x-ray tube are individually adjusted. Perform
the above steps for the remaining focal spot.
10. Press [EXIT] to exit 3d. Preheat Boost Adj.

c
CALIBRATION 3-23 9847
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.11 CEC (COMPUTERIZED EXPOSURE CONTROL) DATA MODIFICATION

3.11.1 CEC RECEPTOR AND FOCUS SELECTION (
This procedure is for CEC exams which are NOT also APR exams (if for both, SETUP will not appear in CEC
setup). If an exam is used by both modes follow the procedure for APR setup. For CEC only exams, the
selected RECEPTOR and FOCUS of the selected exam can be modified as follows (the system must be in
calibration/setup mode, see SECTION 3.3):

1. Select MODE CEC.

2. Select desired exam.
3. Select the desired RECEPTOR and FOCUS.
4. Press [SETUP].
5. Select [yES] if the OC panel LEDs display the desired RECEPTOR and FOCUS. Otherwise pressing
[NO] will return to the SETUP screen.
6. Verify that the desired RECEPTOR and FOCUS are displayed by reselecting the desired exam.
7. Repeat STEPS 1 through 6 for any other CEC exams.

3.11.2 CEC kVp AND mAs SELECTION

This procedure is for CEC exams which are NOT also APR exams (if for both, SETUP will not appear in CEC
setup). If an exam is used by both modes follow the procedure for APR setup. For exams programmed for
CEC only, the KVP and MAS of the selected exam can be modified as fallows (the system must be in
calibration/setup mode, see SECTION 3.3):
1. Select MODE CEC.
2. Select desired exam.
3. Use the MAlCM switches to scan through the CM selections and check that the KVP and MAS values
at the selected CM value are correct. The kVp and mAs values are changed upon release of the
[MAlCM] switch.
4. The kVp and the mAs values at the selected CM value can be modified as follows:
a.

b.
c.
Select the desired KVP and MAS values. The MAS values change in increments of 5% of
the initial MAS value.
Press [ALT MENU].
Press [SAVE FP] (front panel). The LCD will display XXcm (the current CM setting).
c
d. To save the selected KVP and MAS at this CM value, press [YES]. To exit and retain the
default KVP and MAS values, press [NO].
e. Verify the changes in KVP and MAS by selecting another CM then reselecting the CM value
at with the changes were made and checking that the desired KVP and MAS values are
displayed.
5. Repeat STEPS 1 through 4 for other CEC exams.

9847 3-24 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

AUTOMATIC EXPOSURE CONTROL (AEC) SYSTEM SETUP

( If the system is configured with AEC, perform the following steps to input system configuration data.
Reference SECTION 4 for a discussion of the OC panel and its functions.

1. If not already done, remove the label covering SW3 and SW4, on the rear of the ~C. See FIGURE
3-3.
2. Ensure OC power is OFF and flip SW3-8 DOWN to place the system in calibration/setup mode.
3. Turn the OC ON.
4. On the OC select MAN MODE (manual mode).
5. Press the AEC FIELD select button. The LEOs will not illuminate.
6. Select [SETUP].
7. The OC is now ready for input of system component definition. The display will show the current
status of the following which may be changed at this time:

Chamber: This is the current chamber designation as connected to the RPU backplane. Valid
options are 1 through 6 and none, if no chambers are connected.
X HAND: This designates the handedness of the current chamber being defined. This will
affect the AEC FIELD designations. Valid options are RIGHT and LEFT HAND.
GRID:· This defines the grid option for the currently defined chamber. Valid options are
GRID IN, GRID OUT and IN & OUT.
FS:· This defines the film/screen combination used with the currently defined chamber.
Valid options are 1, 2, 3, and - which designates none. These options can be input
in any combination; 1,-,- or -,2,3 are examples of valid selections.
Tube X: Use the NEXT button to select. This selects the current tube being defined for use
with the currently defined Chamber. Valid options are 1 & 2.
Receptor Setup:Use the BACK button to select. This defines the current receptor option

c 8.
for which the chamber is defined. Valid options are TABLE, WALL, or AUX.

When all selections are correct for the current system component and setup, press [STORE] to save
the configuration definitions. Fill out SECTION 10.9 when complete.
9. The TM has standard CEC and APR data installed at the factory. These preset techniques may be
changed either through the OC, or by downloading data from a PC.

10. To download CEC data and APR (if AEC present) data, from the PC to the TM, see APPENDIX A.
Replace the label over the switch access slot on the rear of the OC with a replacement label
(provided). This is necessary to provide a means of detecting unauthorized tampering.

CALIBRATION 3-25 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.13 AEC CALIBRATION

The TM generator can accommodate up to six separate ion chambers, and allows for three film/screen (
combinations on each ion chamber.

Each of three fields on each of six (or more) ion chambers must be calibrated for each film/screen
combination, up to three. This SECTION provides instructions to accomplish AEC calibration. If less than
three film/screen combinations are used on an ion chamber, calibrate the remaining film/screen combinations
to film/screen combination #1. The system does NOT prevent user selection of a film/screen combination that
has NOT been calibrated.
1. Ensure the DC is OFF.
2. If jumper switch SW3-B is not already enabled, remove the adhesive label (if present) on the rear of
the OC and flip switch SW3-8 DOWN. See FIGURE 3-3.
3. Install grids in all buckies.
4. Install the AEC interface PCB on the extender card and attach the DVM to TP8 and TP (ground). Set
the DVM on VDC mode.
5. Proceed with the following sections in sequence.

3.13.1 AEC V/F CALIBRATION

1. Turn the DC ON.
2. Press the [ALT MENU]
3. Press TEST.
4. Press [1.] (TEST ROUTINES).
5. Press either [NEXT] or [BACK] until 3. AEC V/F CHECK and CAL is displayed.
6. Press [EXECUTE].
7. Adjust R30 for +8.50V at TPB on the AEC Interface PCB.
8. Adjust R43 until the three-digit TRIP value in the display matches the voltage at TP8 (850 ±2).
9. Press [EXIT] to exit 3. AEC V/F CHECK and CAL.
10. Press [EXIT] to exit 1. TEST ROUTINES.

3.13.2 %CURVE CALIBRATION

The following procedure will calibrate AEC along a curve at three kVp values, software will calculate for other
c
points. Each receptor is to be calibrated for ea&h film/screen combination used.

1. If switch SW3-B is not already enabled, turn DC power OFF, remove the adhesive label on the rear
of the OC and flip switch SW3-8 DOWN. See FIGURE 3-3.
2. Turn the RPU and DC ON.
3. Select MANUAL MODE.
4. Press ..... beneath AEC FIELD. The MANUAL AEC - MENU screen will come up.
5. Select [AEC CAL].
6. Place a phantom of 7" (17.8cm) of water or Lexan in the x-ray field.
7. Select the following: KVP - 90, GRID - IN, AEC - MED, AEC FIELD - 2 (middle chamber), AEC
DENSITY - 0, 2F (2 factor) - Desired backup mAs ([MASITIME] control buttons), FOCUS - LARGE.
B. Select the desired RECEPTOR (TABLE, WALL, or AUX).
9. Select FILM/SCREEN combination 1 for the selected receptor.
10. ~ Make an exposure, develop the film and check the 00 with a densitometer. If the 00 = 1.20
±0.05 (or desired 00) press [EXIT] and continue to STEP 11. Otherwise adjust the master gain pot
R12 on the chamber pre-amp PCB in the receptor (see the manufacturers manual) and repeat this
step.
11. Place a phantom of 4" (1 0.2cm) of water or Lexan in the x-ray field.
12. ~ Select KVP - 60 and make an exposure. Develop the film and check the 00. If the 00 = 1.20
±O.05 press [EXIT] and continue to STEP 13. Otherwise, adjust the trip value by pressing [+] or [-]
to change the %CHG value from that displayed, press [STORE] and repeat this step.
13. Place a phantom of 10" (25.4cm) of water or Lexan in the x-ray field.
(

9847 3-26 CALIBRATION

--~. - - - -
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 14. "'t' Select KVP - 120 and make an exposure. Develop the film and check the 00. If the 00 =1.20
±0.05 press [EXIT] continue to STEP 11. Otherwise adjust the trip value by pressing [+] or [-] to
change the %CHG value from that displayed, press [STORE] and repeat this step.
15. Each receptor must be calibrated at 90 kVp in accordance with STEPS 8 through 11 of this section,
adjusting R12 in the preamp for each receptor.
16. To program the system for additional film/screen combinations: select F/S 2 and the appropriate
receptor, perform STEPS 6 through 15. If adjustment is necessary adjust R32 on the TM AEC
interface PCB in STEP 10 instead of R12 on the chamber preamp. For F/S 3, select F/S 3 and the
appropriate receptor, perform STEPS 6 through 15. If adjustment is necessary adjust R33 on the TM
/' AEC PCB in STEP 10 instead of R12 on the chamber preamp.

1.-3.13.3 %POINT CALIBRATION

The following procedure is optional, to be used if it is desired to explicitly calibrate specific kVp values
throughout operational range. Each receptor is to be calibrated for each film/screen combination used.
SECTION 3.13.2 must be completed before proceeding.

First, calibration will be performed using ion chamber 2 (middle chamber) at each kVp point listed in TABLE
3-8, using the specified thickness (depth) of Lexan (water) for MEDIUM size. Then ion chambers 1 and 3 will
be calibrated at 90 kVp for MEDIUM size. Finally, the remaining sizes will be calibrated using AEC FIELD 2
(ion chamber 2) at 90 kVp. When changing kVp values the software will step through the values as listed in
TABLE 3-8 , intermediate values are not calibrated

I TABLE 3-8 FILM/SCREEN 1 BODY SIZE TABLE I

kVp INCHES OF LEXAN or WATER

c 50

60
Ped

1
SMALL

2
MEDIUM

3
4'
LARGE

N/A

6
X-LARGE

N/A

N/A
,
70 2 3 5 7 N/A

80 3 4 6 8 10

90 4 5 7' 9 11

100 N/A 6 8 10 12

110 N/A 7 9 11 13

120 N/A 8 10 12 14

125 N/A 8.5 10.5 12.5 14.5

150 N/A N/A 11 13 15

, = Hardware calibration pOint.
1. Press [%POINT].
2. Select AEC FIELD - 2.
3. Select the desired RECEPTOR and FILM/SCREEN combination to calibrate first.
4. Select KVP - 50, GRID - IN, AEC - MED, AEC DENSITY - 0, MASITIME - Desired backup mAs
([MASITIME] control buttons).
5. Place 3" (7.6cm) of Lexan or water in the x-ray field.
6. "'t' Make an exposure and develop the film.Check the 00 of the film with a densitometer. If the 00
is 1.20 ±0.05 proceed to STEP 7. Otherwise proceed with the following steps 6a through 6e until the
00 is 1.20 ± 0.05:

CALIBRATION 3-27 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

a. Use the following formula to calculate a new trip number:

New Trip # = (Desired OD/Measured OD) x Old Trip # (
b. Use [+] and [-] to change the calibration trip point to the new calculated value and press
[STORE].
c. Repeat STEP 6.

7. Repeat STEP 6 for the next kVp value (skipping 90 kVp), placing the necessary phantom as listed
in TABLE 3-8 in the x-ray field. If %CURVE was completed 120 kVp may also be skipped. If the last
kVp station is calibrated proceed to STEP B.
8. Each allowed kVp station has now been calibrated for AEC FIELD 2 select AEC FIELD - 1, KVP-
90.
9. ~ Make an exposure and develop the film. Check the OD of the film with a densitometer. If the OD
is 1.20 ±0.05 proceed to STEP 10. Otherwise proceed with the following steps 9a through 9c until
the OD is 1.20 ± 0.05:

a. Use the following formula to calculate a new trip number:

New Trip # = (Desired OD/Measured OD) x Old Trip #
b. Use [+] and [-] to change the calibration trip point to the new calculated value and press
[STORE].
c. Repeat STEP 9.

10. Select AEC FIELD - 3.

11. ~ Make an exposure and develop the film. Check the OD of the film with a densitometer. If the OD
is 1.20 ±0.05 proceed to STEP 12. Otherwise proceed with the following steps 11a through 11c until
the OD is 1.20 ± 0.05:
a. Use the following formula to calculate a new trip number:
New Trip # = (Desired OD/Measured OD) x Old Trip #
b. Use [+] and [-] to change the calibration trip point to the new calculated value and press (
[STORE].
c. Repeat STEP 11.
12. Select AEC FIELD - 2, KVP - 90, PED (smallest size).
13. ~ Make an exposure and develop the film. Check the aD of the film with a densitometer. If the OD
is 1.20 ±0.05 proceed to STEP 14. Otherwise proceed with the following steps 13a through 13c until
the OD is 1.20 ± 0.05:
a. Use the following formula to calculate a new trip number:
New Trip # = (Desired OD/Measured OD) x Old Trip #
b. Use [+] and [-] to change the calibration trip point to the new calculated value and press
[STORE].
c. Repeat STEP 13.

14. Select the next size (skipping MEDIUM) and proceed to STEP 13. If all sizes for all receptors have
been calibrated, then the AEC system has been calibrated and this procedure is completed. This
procedure was performed with GRID IN; when the system is used with GRID OUT the system will
automatically compensate.

TRIP MAX VALUE ADJUSTING PROCEDURE

The TM is capable of accepting up to six ion chamber inputs. All of the chamber pre-amplifiers have gain
adjustments and should be set for similar gains. The ion chamber signal is processed by the AEC interface
module to accommodate three film/screen combinations, five body size density modifications, and ±50%
density modification.

To assure that none of these gain modifier amplifiers saturate, causing the automatic exposure to terminate
by back up time, it is required that the MAX TRIP value be determined and set after all calibration of the AEC (.
system has been completed. _

9847 3-28 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

1. If switch SW3-B is not already enabled, with power OFF, remove the adhesive label (if present) on
( the rear of the OC and flip switch SW3-8 DOWN. See FIGURE 3-3.
2. Turn the RPU and OC ON.
3. Select MANUAL MODE.
4. Press AEC FIELD.
5. Select [AEC CAL].
6. Select [TRIP MAX].
7. Press [MASfTIME] on the OC front panel up or down until BACKUP 20.0mAs is displayed.
B. Press the [+] or [-] keys until MAX displays B.O volts.
9. Press [STORE]. The TRIP value will display B.OOvolts.
10. Select [AEC FIELD 2], 90 kVp, desired tube (1 or 2) and desired receptor (TABLE, WALL, or AUX).
11. ~ With no attenuator in the field, make an exposure and note the POST - mAs reading. It should
be under 2 mAs. If it isn't, verify all connections.
12. ~ Increase the MAX value to 9.0 (STEP 8), [STORE], and make an exposure. Note the new value
of mAs.
13. Repeat STEPS 10 through 12 with 10.0, 11.0, and 12.0 volts, etc., noting the mAs at each step. At
some value the exposure will trigger the Backup Timer and go to 20.0 mAs (BACKUP). The MAX
value will now be decreased until taken out of the BACKUP range. Decrease the MAX value by .2V,
[STORE] each value, then make exposures until taken out of backup timer range.
14. At this point, decrease the MAX value by .4V more and [STORE] this value.
15. Perform STEPS 10 through 15 for all remaining tube and receptor combinations. When all have been
calibrated, the MAX TRIP VALUE procedure is complete.

l
CALIBRATION 3-29 9847
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.14 ANATOMICAL PROGRAMMED RADIOGRAPHY (APR) SETUP -

Standard APR techniques are programmed in firmware and installed at the factory. These techniques can (
be modified through the OC or by use of the TM GENERATOR PC INTERFACE program as outlined in
APPENDIX A. The AEC system must have been fully calibrated in the MANUAL mode. When an APR exam
is selected, the TRIP value will be the calibrated value of the manual AEC calibration. To fine tune each APR
exam, perform the following:
1. If switch SW3-8 is not already enabled, remove the adhesive label (if present) on the rear of the OC
and flip switch SW3-8 DOWN. See FIGURE 3-3.
2. Turn the RPU and OC ON.
3. Select APR MODE.
4. Select the desired APR exam.
5. Check that the following items selected by the EXAM are DESIRED: RECEPTOR, GRID, FOCUS,
FILM SCREEN, and AEC FIELDS.
6. If required, the items selected by the exam in STEP 5 can be modified as follows:
a. Use the front panel switches to select the desired setup values.
b. Press [SETUPj.
c. Press [yESj to save the set-up values, or press [NOj to exit the routine without saving the
values.
d. Verify that the set-up values are correct by exiting the EXAM and reselecting the EXAM.

7. Check that the selected kVp and backup mAs are correct for each size. If desired, the selected kVp
and back-up mAs for each AEC SIZE can be modified as follows:
a. Use the front panel switches to select AEC SIZE and the appropriate kVp and backup mAs
for the size.
b. Press [ALT MENUj.
c. Press [SAVE FPj.
d. To save the selected kVp and back-up mAs, press [YESj. To exit this save routine without

e.
saving kVp and back-up mAs, press [NOj.
Repeat STEPS 7a through 7d if changes in the kVp and mAs for other sizes are required. (
f. Verify that the kVp and mAs values selected by each size are correct by scanning through
the sizes.

8. Proceed with SECTION 3.15.2 APR %MASTER CALIBRATION.

9. Proceed with SECTION 3.15.3 APR %SIZE CALIBRATION.
10. Repeat STEPS 2 through 10 for the remaining APR exams.
11. Remove power from the OC and flip SW3-8 UP; the procedure is now complete.

9847 3-30 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

c 3.15 ANATOMICAL PROGRAMMED RADIOGRAPHY (APR) CALIBRATION

This section provides instructions for the verification and calibration of the APR techniques. If the APR
techniques are to be changed see SECTION 3.14. Proceed with the following sections in order.

3.15.1 APR VERIFICATION

This section will allow verification of the APR settings.
1. If SWitch SW3-8 is not already enabled, remove the adhesive label (if present) on the rear of the OC
and flip switch SW3-8 DOWN. See FIGURE 3-3.
2. Turn the OC ON.
3. Select APR MODE.
4. Select the desired APR exam.
5. Check that the following items selected by the EXAM are DESIRED: RECEPTOR, GRID, FOCUS,
FILM SCREEN, and AEC FIELDS.
6. If required, the items selected by the exam in STEP 4 can be modified by following the instructions
in SECTION 3.14.
7. Check that the selected kVp and backup mAs are correct for each size. If desired, the selected kVp
and back-up mAs for each AEC SIZE can be modified by following the instructions in SECTION 3.14.
8. Proceed with SECTION 3.15.2 APR %MASTER CALIBRATION.
9. Proceed with SECTION 3.15.3 APR %SIZE CALIBRATION.
10. Repeat STEPS 2 through 10 for the remaining APR exams.
11. Remove power from the OC and flip SW3-8 UP, the procedure is complete.

3.15.2 APR %MASTER CALIBRATION

%MASTER Calibration is performed at medium size and 0 density. %MASTER Calibration modifies all
sizes by the same percent change at which medium is modified. Perform the following:
1. Select the desired APR exam.
2. Press [%MASTER] to enable %MASTER calibration mode.
( 3. Insert the equivalent thickness of Lexan or depth of water. See TABLE 3-8 for "medium" of the exam
selected into the x-ray field.
4. Select AEC FIELD 2.
5. ~ Make an exposure and measure the 00 with a densitometer.

6. Calculate: percent change = 1 _ measured Optical Density

desired Optical Density
7. Use [+] and [-] to add this value to the total %CHG displayed.
8. Press [STORE] to save %CHG and to recalculate a new TRIP voltage at AEC MEDIUM for the
selected exam.
9. Repeat STEPS 5 through 8 until the desired 00 is achieved.
10. Return to SECTION 3.15.1, STEP 9.

3.15.3 APR %SIZE CALIBRATION

%SIZE Calibration mode allows each size to be individually modified. %SIZE Calibration can be used to
either calibrate each size based on a desired 00 for a given thickness of water or as a percent of AEC MED
modifier.

If calibration is to be performed as a percent of AEC MED perform this section, then proceed to SECTION
3.15.4 for AEC SMALL and AEC LARGE. If calibration is to be performed for all sizes, perform the following:
1. Select the desired APR exam.
2. Press [%SIZE] to enable %SIZE Calibration mode.
3. For calibration at sizes based on equivalent thicknesses of water, select the desired AEC SIZE to
calibrate.

CALIBRATION 3-31 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

4. Insert the equivalent thickness of Lexan or depth of water for the size selected, (see TABLE 3-8), into

5.
the x-ray field.
Select AEC FIELD 2.
(
6. ~ Make an exposure and measure the OD with a densitometer.

7. Calculate: percent change = 1 _ measured Optical Density

desired Optical Density
8. Use [+] and [-] to change the value of %CHG displayed.
9. Press [STORE] to save %CHG and to recalculate a new trip voltage at AEC SIZE for the selected
exam.
10. Repeat STEPS 5 through 9 until the desired 00 is achieved.
11. If all AEC sizes are to be completed in this section, repeat STEPS 3 through 10 for the remaining
AEC SIZES; otherwise proceed to SECTION 3.15.4 for AEC SMALL and AEC LARGE.

3.15.4 CALIBRATION OF SIZES BASED ON % CHANGE FROM MEDiUM

This calibration procedure is to be performed for AEC SMALL and AEC LARGE after AEC MED has been
calibrated in SECTION 3.15.3. In this method, AEC MED at 90 kVp is treated as the center point for the
calibration of AEC SMALL and AEC LARGE. AEC SMALL is 15% less than that of AEC MED, or 85% of
AEC MED. AEC LARGE is 15% greater than that of AEC MED, or 115% of AEC MED.

The %CHG shown for AEC SMALL and AEC LARGE is the percent change from the nominal curve value,
and does not include the O/OCHG value of AEC MED.
1. Select the desired APR exam.
2. Press [%SIZE] to enable %SIZE Calibration mode.
3. Select AEC MEDIUM and record its %CHG value:
4. Calibration of AEC SMALL:
a. Select AEC SMALL. The first line of the LCD should read: %SMALL CAL for "desired
exam".
(
b. Calculate: %CHG = (%CHG at AEC MEDIUM) + (percent of AEC MEDIUM for AEC SMALL
- 100%).
Example: If %CHG at AEC MEDIUM = -1.5%, then %CHG = (-1.5%) + (85% - 100%) = -
16.5%
c. Use [+] and [-] to enter this value for %CHG.
d. Press [STORE] to save the %CHG.

5. Calibration of AEC LARGE:

a. Select AEC LARGE. The first line of the LCD should read: %LARGE CAL for "desired
exam".
b. Calculate: %CHG = (%CHG at AEC MEDIUM) + (percent of AEC MEDIUM for AEC LARGE
- 100%).
Example: If %CHG at AEC MEDIUM = -1.5%, then %CHG = (-1.5%) + (115% - 100%) =
13.5%
c. Use [+] and [-] to enter this value for %CHG.
d. Press [STORE] to save the %CHG.

6. Verify that the %CHG values are correct by scanning through the sizes.
7. Press [EXIT] to exit %SIZE CAL MODE.
8. Turn the OC OFF, toggle SW3-8 UP and replace the protective label.

l
9847 3-32 CALIBRATION
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MAINTENANCE MANUAL 9026.251

( 3.16 FLUORO rnAlkV CALIBRATION CONTINUOUS MODE

This section is NQI applicable to radiographic generators without fluoroscopic capability, and pulse
fluoroscQPic svsterns. This procedure is for tube 2 only, which is the default fluoro tube.
NOTE:
1. TP12 (rnA/mAs control PCB) has been factory adjusted for 40.00 kHZ (R52).
2. If radiographic calibration procedures (procedures 1 through 4 in calibration) have just been
completed: a) EXIT calibration mode, (b) select TUBE 1, (c) select TUBE 2, (d) selectALT MENU
to reenter calibration mode to continue with fluoro calibration for tube 2. This is because the
software defaults to purely radiographic mode when these first calibrations are performed, and
fluoroscopic mode must be reentered by clearing the system through toggling between tube 1 and
tube 2.

1. Place Dynalyzer in the high voltage circuit. Select "Fluoro" mA switch on divider tank.
2. Select SW3-8 on operator control rear panel to ON (DOWN).
3. On the fluoro field 110 PCB place a jumper on JP1-1 and JP1-2.
4. Turn power ON.
5. While in operational mode select the fluoro tube (tube 1 or 2).
6. Verify that the generator has been configured for continuous fluoro. Follow the directions found in
SECTION 3.3.4. Correct if necessary STORE the changes. EXIT the SETUP ROUTINES.
7. Press [3.] (CALIBRATION ROUTINES).
8. Press [NEXT] or [BACK] until 5a. FLU ORO -1 rnA STATION ADJUST is displayed. In all cases
throughout this procedure [NEXT] or [BACK] may have to be used to select the appropriate routine.
9. Press [EXECUTE].
10. Press the fluoro footswitch and adjust the preheat value (using [-] or [+]) to change the -1 MA preheat
value until .4 mA ± .1 actual on the Dynalyzer is achieved. Press [STORE] to save, then [EXIT].
11. Press [EXECUTE] for 5b. FLUORO -2 rnA STATION ADJUST.
12. Press the ftuoro footswitch and adjust the preheat value (using [-] or [+]) to change the -2 MA preheat
( 13.
value until .8 rnA ± .1 actual on the Dynalyzer is achieved. Press [STORE] to save, then [EXIT].
Press [EXECUTE] for 5c. FLUORO -3 rnA STATION ADJUST.
14. Press the fluoro footswitch and adjust the preheat value (using [-] or [+]) to change the -3 MA preheat
value until 1.6 mA ± .1 actual on the Dynalyzer is achieved. Press [STORE] to save, then [EXIT].
15. Press [EXECUTE] for 5d. FLUORO -4 rnA STATION ADJUST.
16. Press the ftuoro footswitch and adjust the preheat value (using [-] or [+]) to change the -4 MA preheat
value until 2.5 mA ± .1 actual on the Dynalyzer is aChieved. Press [STORE] to save, then [EXln.
Note:
The -4 mA station will be adjusted later to limit the entrance exposure rate to 9.5 Rlminute to comply with
HHS regulations. This will be done after the fluoro kVp calibration.procedure.

17. Press [EXECUTE] for 6a. FLU ORO Low kV Calibration (50 kv).
18. The system defaults to -3 rnA station and 50 kVp. Press the fluoro footswitch, and press [-] or [+] to
change the 50 kV Adj. value until 50 kVp ±1 actual on the Dynalyzer is achieved. Press [STORE] to
save, then [EXIT].
19. Press [EXECUTE] for 6b. FLUORO High kV Calibration (120 kv).
20. The system defaults to -3 mA station and 120 kVp. Press the fluoro footswitch, and press [-] or [+] to
change the 120 kV Adj. value until 120 kVp ±1 actual on the Dynalyzer is achieved. Press [STORE]
to save, then [EXIT].
Note:
If the kVp value is not 120 kVp, then retum to 8a., 8b. Fluoro kV max at -3, -4 mA step, and reset the kV
max value to 125 kVp.

21. Press [EXECUTE] for 5d. FLUORO -4 rnA STATION ADJUST.

22. Place a dosimeter probe on the table top. Collimate the field to within 1 inch all around the probe.
Select 125 kVp on the fluoro control. Press the footswitch, and adjust using [-] or [+] to change the
( -4 MA preheat value to achieve no greater than 9.5 Rlminute on the dosimeter. Press [STORE] to
save, then [EXIT].

CALIBRATION 3-33 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

Note: (
The final mA value will vary from system to system due to the x-ray tube/collimation filtration and the table .
top attenuation. This value is typicallv between 2.5 and 3.5 mAo

23. Press [EXECUTE] for 7a. FLU ORO mA Meter, Low rnA Cal.
24. The default values are rnA station -1 (.4 mAl and 80 kVp. Press the f1uoro footswitch and adjust the
low mA offset value using [-] or [+] to make the mA value displayed on the f1uoro control to be within
± .1 rnA of the actual mA displayed on the Dynalyzer. Press [STORE] to save, then [EXIT].
25. Press [EXECUTE] for 7b. FLU ORO rnA Meter, High rnA Cal.
26. The default values are mA station -4 (approximately 2.5 to 3.5 rnA) and 80 kVp. Press the fluoro
footswitch and adjust the low rnA offset value using [-] or [+] to make the mA value displayed on the
f1uoro control to be within ± .1 mA of the actual rnA displayed on the Dynalyzer. Press [STORE] to
save, then [EXIT].
27. Press [EXECUTE] for 8a. FLUORO kV Max at -3 rnA Step.
28. Place the dosimeter probe on the table top. COllimate the field to within 1 inch all around the probe.

29. The rate of exposure is limited to 9.5 Rlminute. Set the mA station to -3 and press the fluoro
footswitch. If necessary adjust the -3 mA kVmax value using [-] or [+] so that the value displayed on
the fluoro control display is the same as displayed on the dosimeter and to keep the exposure rate
from exceeding 9.5 Rlminute. Press [STORE] to save, then [EXIT].
30. Press [EXECUTE] for 8b. FLU ORO kV Max at -4 rnA Step.
31. Place the dosimeter probe on the table top. COllimate the field to within 1 inch all around the probe.
32. The rate of exposure is limited to 9.5 Rlminute. Set the mA station to -4 and press the fluoro
footswitch. If necessary adjust the -4 rnA kVmax value using [-] or [+] so that the value displayed on
the f1uoro control display is the same as displayed on the dosimeter and to keep the exposure rate
from exceeding 9.5 Rlminute. Press [STORE] to save, then [EXIT].
33. Press [EXECUTE] for 9. FLU ORO Preheat Boost Adj.
34. The function of this adjustment is to preheat the small filament during the rotor boost time. This brings
the filament to operating temperature at initiation of actual fluoroscopy. Proper adjustment reduces
(
the Automatic Brightness System from hunting each time f1uoro is initiated outside of the 3D-second
hold time. This boost does not function while the system is in the 3D-second hold period. The default
values are -4 rnA station and 80 kV.

Place a water phantom (about 9" (22.9cm) deep) on the table, and press the fluoro footswitch.
Observe the image on the CRT. If the image gradually comes on, the preheat is too low, and if the
image momentary flashes too bright, the preheat value is too high. If necessary adjust the Boost
preheat value using [-] or [+]. Wait for the 3D-second hold to time out (the filament inverter stops
running), and press the f1uoro footswitch. Repeat until smooth response is achieved.

l
9847· 3-34 CALIBRATION
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.17 PULSED FLUORO rnA CALIBRATION

( This section is NQI applicable to radiographic generators without fluoroscopic capability, and continuous
fluoroscopic systems. This procedure is for tube 2 only, which is the default fluoro tube. If radiographic
calibration procedures (procedures 1 through 4 in calibration) have just been completed: a) EXIT calibration
mode, (b) select TUBE 1, (c) select TUBE 2, (d) selectALT MENU to reenter calibration mode to continue with
fluoro calibration for tube 2. This is due to the fact that the software defaults to purely radiographic mode when
these first calibrations are performed, and fluoroscopic mode must be reentered by clearing the system
through toggling between tube 1 and tube 2.

The pulsed fluoro mode provides one mA value and is not operator adjustable. This value is adjusted to
provide no greater than 9.5 Rlminute at maximum operating technique of 30 pulses per second at 125 kVp.
If higher average mA is desired, the 30 pis and 15 pis stations may be limited to a kVp value that does not
exceed the 9.5 RIm entrance exposure rate. This is similar to the limiting of stations -3 and -4 when in
continuous mode.
1. Place the Dynalyzer in the high-voltage circuit. Select "FLUORO' rnA switch on the divider tank.
2. Place the dosimeter probe on the table top. Collimate the Field within 1 inch all around the probe.
3. Select SW 3-8 on the operator control rear panel to ON (DOWN).
4. While in operational mode select the fluoro tube (tube 2).
5. Verify that the generator has been configured for pulsed fluoro. Follow the directions found in
SECTION 3.3.4. Correct if necessary, STORE the changes. EXIT the SETUP ROUTINES.
6. Press [3.] (CALIBRATION ROUTINES).
7. Press [NEXT] or [BACK] until S. PULSED FLU ORO rnA ADJUST is displayed. In all cases
throughout this procedure [NEXT] or [BACK] may have to be used to select the appropriate routine.
Default is 80 kVp and 30 pis.
8. Press the fluoro footswitch, and adjust the mA preheat (using [-] or [+]) to achieve approximately 2.5
rnA indication on the Dynalyzer readout. When this has been achieved, press [STORE] to store this

e 9.
value in memory.
Increase the fluoro kVp to 125 kVp on the fluoro control. Press the footswitch, and adjust the rnA
preheat value (using [-] or [+]) to not exceed 9.5 Rlminute Entrance Exposure Rate. When this has
been achieved press [STORE] to store this value in memory. Press [EXIT].
10. Press [EXECUTE] for 6a. FLU ORO LOW kV CALIBRATION (SO kV).
11. Press the footswitch, and adjust the 50 kV ADJ. value (using [-] or [+]) until the Dynalyzer indicates
50 kVp ± 1. When this has been achieved press [STORE] to store this value in memory. Press [EXIT].
12. Press [EXECUTE] for 6b. FLUORO HIGH kV CALIBRATION (120 kV). Press the footswitch, adjust
the 120 kV ADJ value (using [-] or [+]) until the Dynalyzer indicates 120 kVp ± 1. When this has been
achieved press [STORE] to store this value in memory. Press [EXIT].
13. Press [EXECUTE] for 7a. FLU ORO rnA METER CAL. AT SO kV. Press the fluoro footswitch, adjust
the 50 kV mA offset value (using [-] or [+]) so that the mA indication on the fluoro control is within ±
.1 rnA from the value indicated on the Dynalyzer. When this has been achieved, press [STORE] to
store this value in memory. Press [EXIT].
14. Press [EXECUTE] for 7b. FLU ORO rnA METER CAL. AT 1201 kV. Press the footswitch, adjust the
120 kV rnA OFF (SET) value (using [-] or [+]) until the mA indication on the fluoro control is within ±
.1 mA from the value indicated on the Dynalyzer. When this has been achieved, press [STORE] to
store this value in memory. Press [EXIT].
15. Press [EXECUTE] for 8a. FLU ORO kV max at 1S PIS.

Lt:::. CAUTION·
If the pulsed rnA is to be increased, consult the tube rating charts so that the maximum heat
unit in ut rate of the x-ra tube is NOT exceeded.

16. The system has the capability to limit the maximum kVp for pulse rates of 15 pis. This permits higher
pulsed rnA and still not exceed the 9.5 Rlminute Entrance Exposure Rate. In STEP 8 the rnA was set
to 2.5. If the operator would like to increase the rnA during pulsed fluoro, recalibrate for the desired
( rnA per STEP 8. If the rnA limit is to be left at 2.5 mA, continue without reperforming STEP 8.

CALIBRATION 3-35 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

17. Place the dosimeter probe as in STEP 2, adjust the fluoroscopic kVp to not exceed 9.5 R.lminute.
Adjust the kVp max value to indicate the same kVp value displayed on the fluoro control. When this (
has been achieved press [STORE] to store this value in memory. Press [EXIT].
18. Press [EXECUTE] for ab. FLU ORO kV max at 30 PIS.
19. Place the dosimeter probe as in STEP 2, adjust the fluoroscopic kVp to not exceed 9.5 R.lminute.
Adjust the kVp max value to indicate the same kVp value displayed on the fluoro control. When this
has been achieved press [STORE] to store this value in memory. Press [EXIT].
20. Press [EXECUTE] for 9. FLUORO Preheat Boost Adj •.
21. The function of this adjustment is to preheat the small filament during the rotor boost time. This brings
the filament to operating temperature at initiation of actual fluoroscopy. Proper adjustment reduces
the Automatic Brightness System from hunting each time fluoro is initiated outside of the 3D-second
hold time. This boost does not function while the system is in the 3D-second hold period. The default
values are -4 mA station and 80 kV.
Place a phantom on the table, and press the fluoro foolswitch. Observe the image on the CRT. If the
image gradually comes on, the preheat is too low, and if the image momentary flashes too bright, the
preheat value is too high. If necessary adjust the Boost preheat value using [-] or [+]. Wait for the 30-
second hold to time out (the filament inverter stops running), and press the fluoro footswitch. Repeat
until smooth response is achieved.

l
9847 3-36 CALIBRATION
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 3.18 CONTINUOUS FLUORO ABS CALIBRATION -INFIMED CAMERA

1. Tum ABS OFF. ,
2. Select a fluoro kV and rnA which provides the desired image. IE CXC ABS pickup is used, adjust the
pot on the pickup PCB for 4.5V at TBl-7 and TBl-8 on the fiuoro field 1/0 PCB.
3. Turn ABS ON
4. ~ Fluoro and adjust R4 on the fiuoro field 1/0 PCB as required to produce an image of the same
quality and at the same technique as with ABS OFF.
5. Press [EXECUTE] for 10a. FLUORO ABS Window adj.
6. This procedure adjusts for a stable image on the CRT. Place a phantom on the table, and press the
fiuoro footswitch. Observe the CRT, if the image is not a stable brightness press [+] or [-]. Press
[STORE] to save the altered value which produces stable brightness, then [EXIT].
7. Press [EXECUTE] for 10b.FLUORO ABS CTR Adj.
8. Set the Fluoro ABS Center Adjustment for a value of 128.
9. Place a homogenous phantom (Le. - 2mm copper phantom) in the field to produce the desired Image
Intensifier input dose.

Note:
Factory adjustment is for 3.5 mRimin for a 12-inch image intensifier at normal magnification while in the
range of 65kV to 90kV.

10. Select maximum SID, and a fiuoroscopic technique.

11. Verify thatthe ABS inputto the Fluoro Field 1/0 Board atTBl-7 with respect to TBl-8 is not saturated
at the desired dose.

Note:
( To allow for both positive and negative variation, the signal should be between OVDC and 5VDC.

12. Adjust R89 on the Fluoro Field 1/0 Board for 1.25VDC at TP3 with respect to AGND at TPll at the
desired dose.
13. Verify the response of ABS, by manually raising or lowering the kV with x-ray off, and then under
fiuoro observe the manner in which ABS returns kV back to the desired dose level.
14. If the response of ABS is too slow (Le., it takes longer than 2 seconds to stabilize), the gain of the
ABS loop needs to be increased by turning R4 on the Fluoro Field 1/0 Board counterclockwise. If the
ABS response caused the kV to change too quickly, the system becomes unstable, or overshoots,
the gain of the ABS loop needs to be reduced by turning R4 clockwise.

Note:
After adjusting R4, it is necessary to readjust R89 for 1.25VDC at the desired dose.

15. Repeat steps 13 and 14 (response check and adjustment of R4 and R89) as necessary.

CALIBRATION 3-37 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.19 PULSED FLUORO ABS CALIBRATION -INFIMED CAMERA

1. Press [EXECUTE] for 10a. FLUORO AB~ Window adj. (
2. This procedure adjusts for a stable image on the CRT. Place a phantom on the table, and press the
fluoro footswitch. Observe the CRT, if the image is not a stable brightness press [+] or [-j. Press
[STORE] to save the altered value which produces stable brightness, then [EXIT].
3. Flicker is controlled by EKV11. Reference TABLE 8-11 for the desired position.
4. Press [EXECUTE] for 10b.FLUORO ABS CTR Adj.
5. Set the Fluoro ABS Center Adjustment for a value of 128.
6. Place a homogenous phantom (Le. - 2mm copper phantom) in the field to produce the desired Image
Intensifier input dose.

Note:
Factory adjustment is for 3.5 mRlmin for a 12-inch Image Intensifier at normal magnification while in the
range of 65kV to 90kV.

7. Select maximum SID, and a fluoroscopic technique.

8. Verify that the ASS inputto the Fluoro Field 1/0 Board at TB1-7 with respect to TB1-8 is not saturated
at the desired dose.

Note:
To allow for both positive and negative variation, the signal should be between OVDC and 5VDC.

9. Adjust R89 on the Fluoro Field 1/0 Board for 1.25VDC at TP3 with respect to AGND at TP11 at the
desired dose.
10. Verify the response of ABS, by manually raising or lowering the kV with x-ray off, and then under
fluaro observe the manner in which ABS returns kV back to the desired dose level.
11. If the response of ABS is too slow (i.e., it takes longer than 2 seconds to stabilize), the gain of the
ABS loop needs to be increased by tuming R4 on the Fluoro Field 1/0 Board counterclockwise. If the
ABS response caused the kV to change too quickly, the system becomes unstable, or overshoots,
(
the gain of the ABS loop needs to be reduced by turning R4 clockwise.

Note:
After adjusting R4, it is necessary to readjust R89 for 1.25VDC at the desired dose.

12. Repeat steps 10 and 11 (response check and adjustment of R4 and R89) as necessary.
13. Press [EXECUTE] for 11. FLUORO rnA Pulse Width Adj.
14. The pulsed fluoro pulse width has been factory adjusted to assure that the kVp rises to peak on each
pulse, and provide a 1 millisecond duration at peak kVp. It should not be necessary to adjust this
value in the field.

9847 3-38 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

3.20 ABS CALIBRATION - NICAL CAMERA

( This procedure is for use with the Nical camera ONLY. If another camera is used see the appropiate section.
1. On the fluoro field 110 PCB: Place JP1 to position 1-2.
2. Connect a DVM to TB1-7 (ABC IN) and TB1-S (GND).
3. Select 50 kV, ABS OFF.
4. With no attenuation in the beam, apply f1uoro so that the ABC input is saturated. The DVM should
read 12 V. If it does not, increase the kV and repeat this step until it does.
5. Connect the positive probe of the DVM to TP3.
6. Apply f1uoro and adjust R4 until the DVM reads 2.5V.
7. Place a Phillips phantom (with its plates removed) on the table top in the beam.
S. Select 65 kV and .S rnA.
9. Remove the top cover of the image intensifier to expose the camera.
10. Remove the camera cover. Refer to the Nical camera manual.
11. Locate the diaphragm adjustment pot, and apply f1uoro while adjusting the pot to achieve a DVM
reading of 1.25 ±0.1 V at TP3.
12. Turn ABS ON.
13. Add the two copper plates to the Phillips phantom and place phantom in the beam.
14. Apply f1uoro and verify that the kV reading is at approximately 90 kV and that the image on the
monitor is about the same as when the phantom did not have the plates installed. Due to the higher
kV, the image may not have the same contrast. Achieve 1.25V on TP3. Slight adjustment of R4 may
be necessary.

3.21 APR and CEC PROGRAMMING

The TM generators are delivered with a general radiographic technique chart installed in the program memory.
The exams have been programmed for a typical 400 speed film/screen combination utilizing typically 10:1
grids.
Exams are not installed for either the upper or lower extremities for selection when in APR mode, since these
views are not generally phototimed.
The kVp and mAs values may be reprogrammed via the front panel for all thicknesses when in CEC mode.
kVp and back-up mAs can be reprogrammed for all APR exams.
The system is supplied with a computer disk which contains a program that allows the creation of an entirely
new technique chart, or edit the existing chart in firmware. Refer to APPENDIX A for operating instructions
. for the program.
Qualified service personnel are required to place the system in TEST/CALIBRATION/SET-UP mode to
access this program. The RECEPTOR, GRID, FOCUS, FILM/SCREEN, and FIELD(s) may be changed
through the front panel.

3.21.1 REPROGRAMMING CEC EXAMS

The MAS and/or KVP value can be reprogrammed for each selected CM thickness as follows. If the CM
range is to be extended, the PC interface program must be used. To enter the TEST and SET-UP routines,
turn OFF power to the OC. Remove the label covering the switch access slot on the rear of the OC. Flip
switch SW3-S DOWN (FIGURE 3-3) to put the OC in calibration/setup mode.
1. Turn OC power ON.
2. Select desired BODY GROUP.
3. Select desired VIEW.
4. Select the CM to modify.
5. Change KVP and/or MAS to the new desired values. Note that ADD and SUB appears next to the
display.
6. When the desired values are displayed, select ALT MENU.
7. Select SAVE FP.
S. Select YES if the displayed technique values are to be saved in place of the current technique values.
This will replace the current values with the new ones. If the old values are again desired to be the
default programmed values, they will have to be programmed in accordance with these steps. Select
( 9.
NO if changes are not desired.
Repeat the previous steps for any other CM or BODY GROUP VIEW.
10. When alterations are complete, turn the OC OFF.
11. Toggle SW3-S UP.

CALIBRATION 3-39 9S47

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

12. Replace the label which covers the switch access slot.
(
3.21.2 REPROGRAMMING APR EXAMS
The KVP and BACK-UP MAS values can be reprogrammed as was KVP and MAS in SECTION 3.10.4 and
3.10.6 respectively. It is desirable to have the back-up mAs as low as possible to assure that the mA will be
at a high level which results in short exposure time. To enter the TEST and SET-UP routines, turn OFF power
to the OC. Remove the label covering the switch access slot on the rear of the OC. Flip switch SW3-8 DOWN
(FIGURE 3-3) to put the OC in calibration/setup mode.
1. Turn OC power ON.
2. Select desired BODY GROUP.
3. Select desired VIEW.
4. Select the desired body size (small, medium, large, ped, or x-large).
5. Change KVP and/or BACK-UP MAS to the new desired values.
6. When the desired values are displayed, select lOP PROGj.
7. Select SAVE FP (save front panel).
8. Select YES if the displayed technique values are to be saved in place of the current technique values.
This will replace the current values with the new ones. If the old values are again desired to be the
default programmed values, they will have to be programmed in accordance with these steps. Select
NO if changes are not desired.
9. Repeat the previous steps for any other body size.
10. When alterations are complete, turn the OC OFF.
11. ToggleSW3-8UP.
12. Replace the label which covers the switch access slot.

9847 3-40 CALIBRATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

SECTION 4 - OPERATION
( This section contains information necessary to operate the TM generator.

4.1 RADIOGRAPHIC MODE - TUBE #1

This section provides information for 1 and 2-tube Rad generators. For a Rad/Fluoro generator tube #1 is Rad
and #2 is f1uoro.

4.1.1 MANUAL
3-Eactor (See TABLES 4-1 and 4-3): kVp - 40 through 150
mA - 25 through 500 (TM30).
600 (TM40) 800 (TM50 & TM65)
1000 (TM80)
TIME - 5ms through 6000 ms (6 seconds)

2-Factor (See TABLES 4-2 and 4-4): kVp - 40 through 15Q

mAs - 0.5 through 900
The mA is selected as the highest value within the tube rating to assure the shortest exposure time.

Manual AEC
This selection requires Automatic Exposure Control (AEC) (see Section 4.7). The exams in this
mode are selected in 2-point or 3-point modes. The exam is terminated by AEC. In 2-point mode. the
unit is programmed so that the back-up mAs in each exam provides the highest mA available within
the tube limits. This will assure the shortest possible exposure time. In 3-point mode, the user has the
ability to select the desired mA and select back-up time.
• Film/screen combination: Up to three different film/screen combinations may be programmed.
The different front panel setting (including radiographic techniques) could be programmed

c and saved by pressing the AL T MENU switch. For example: F/S 1= 2 factors, small focal
spot, 70 kVp, small patient, left ion chamber; F/S 2 =3 factors, large focal spot, 85 kVp, large
patient, central ion chamber, etc.
Saved techniques can be recalled by selecting the appropriate Film/screen combination.
• Density selection: 11 stations with approximately 10% mAs between steps. Normal (0) and
±5 steps.
• Body size: Small, medium, and large for all exams, with the program ability to provide
pediatric and/or extra large, selected by "SOFT" keys around the display window.

4.1.2 COMPUTERIZED EXPOSURE CONTROL (CEC)

This mode of operation uses an anatomical technique chart for kVp, mAs, and average body part thickness.
The operator adjusts body part thickness up or down as necessary, and the technique factors are adjusted
accordingly.
a. Body groups (seven): skull, facial, chest, abdomen, spine, upper extremity, and lower
extremity
b. Special group: 1-user definable for special views.
c. Programmable exams: 90 exams, typically 15 exams per body group. A maximum of 512
exams can be programmed.

4.1.3 ANATOMICALLY PROGRAMMED RADIOGRAPHY (APR)

APR requires Automatic Exposure Control (AEC). The exams in this mode are programmed in 2-point or 3-
point modes. The exam is terminated by AEC. In 2-point mode, unit is programmed so the back-up mAs in
each exam provides the highest mA available within the tube limits. This will assure the shortest possible
exposure time. In 3-point mode user has ability to select the desirable mA and select back-up time.
1. Body groups (seven): skull, facial, chest, abdomen, spine, upper extremity, and lower extremity.
2. Special group: 1-user definable for special exams.
3. Programmable exams: 90 exams in total, typically 15 exams per body group.

( 4.
5.
Film/screen combination: Up to three different film/screen combinations may be programmed.
Density selection: 11 stations with approximately 10% mAs between steps. Normal (0) and ±5 steps.
6. Body size: Small, medium, and large for all exams, with the program ability to provide pediatric and/or
extra large, selected by "SOFT" keys around the display window.

OPERATION 4-1 9874

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

I TABLE 4-1 3-FACTOR TECHNIQUES I

kVp rnA TIME
40 25 5ms 100 1.0sec
41 50 10 125 1.25
42 100 15 150 1.50
43 150 20 200 1.75
I 200 25 250 2.0
I 300 30 300 2.5
I 400 35 350 3.0
I 500 40 400 3.5
I
I
600#@ 45 450 4.0
800"@ 50 500 4.5
150 1000" 60 600 5.0
(In 1 kVp 70 700 5.5
increments)
80 750 6.0
90 800
# TM401@ TM50 & TM65f* TM80

(
I TABLE 4-2 2-FACTOR TECHNIQUES I
kVp mAs
40 .5 5.25 18.75 48.0 137.5 360
41 .63 6.00 20.0 50.0 140 375
42 .75 6.25 21.0 52.5 150 400
43 .88 7.00 22.5 54.0 160 420
I 1.00 7.50 24.0 60.0 175 450
I 1.13 8.00 25.0 62.5 180 480
I 1.25 8.75 27.0 67.5 187.5 500
I 1.50 9.00 28.0 70.0 200 525
I 1.75 10.0 30.0 75.0 210 550
I 2.00 10.5 31.25 80.0 225 600
I 2.25 11.25 32.0 87.5 240 625
II 2.50 12.0 35.0 90.0 250 675
3.00 12.5 36.0 100.0 270 700
150 3.13 13.5 37.5 105.0 275 750
(In 1 kVp 3.50 15.0 40.0 112.5 280 800
increments)
4.00 16.0 42.0 120 300 825
4.50 17.5 43.75 125 320 875
5.00 18.0 45.0 135 350 900
,
(

9874 4-2 OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

I TABLE 4-3 BIT MODE TECHNIQUES - 3 FACTOR" I

kVp rnA mAs

40 73 25 500 5ms 200

41 77 32 640"@ 6 250
42 81 40 800"@ 8 320
44 85 50 1000" 10 400
46 90 64 12 500
48 96 80 16 640
50 102 100 20 800
52 109 125 25 1sec
55 117 160 32 1.25
57 125 200 40 1.60
60 134 250 50 2.0
63 143 320 64 2.5
66 150 400 80 3.2
70 100 4.0
125 5.0
160 6.4
# TM40/@ TM50 & TM651* TM80
(

I TABLE 4-4 BIT MODE TECHNIQUES - 2 FACTOR" I

kVo mAs

40 73 .5 6.4 80
41 77 .64 8.0 100
42 81 .8 10.0 125
44 85 1.0 12.5 160
46 90 1.25 16 200
48 96 1.6 20 250
50 102 2.0 25 320
52 109 2.5 32 400
55 117 3.2 40 500
57 125 4.0 50 640
60 134 5.0 64 800
63 143
66 150
70
"NOTE: Aggregate Increases or decreases of kVp, rnA, and/or TIME will result In approximately a change
of±.30D.

OPERATION 4-3 9874

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

4.1.4 BIT MODE

BIT mode provides predictable exposure results with changes in technique values. In BIT mode the TM series
generators are programmed to provide specific steps in kVp and mAs, for 2 FACTOR mode, and kVp, mA,
c
and TIME, for 3 FACTOR mode (see TABLES 4-3, and 4-4).

For every aggregate step change, the Optical Density (0.0.) changes by approximately 0.3 0.0., (+.3 0.0.
for increase and -.3 0.0. for decrease).

For example increasing the kVp value by one (1) step, creates an aggregate change of +1; therefore, the
optical density increases by approximately .3 0.0 .. If the kVp value increases one step, and the rnA value
is decreased one step, the aggregate change is zero (0), and the optical density change is zero (0). If the mA
value decreases by two (2) steps, and the TIME value increases by one (1) step, the aggregate change is -1,
therefore the optical density changes by -.30.0 ..

BIT mode is available only in MANUAL MODE. When in MANUAL MODE, the display will show the following
for 2 FACTOR:

• • • •
mAs MODE
mA XXXma
TIME XXXms bit mode
on/off
• • • •
When using 3 FACTOR the top line will read "mAITIME MODE". Pressing [bit mode on/off] will place the
OC in BIT mode. When in BIT mode (2 FACTOR) the LCD will display the following:
• • • • (
mAs - BIT MODE
mA XXXma
TIME XXXms bit mode
on/off
• • • •
When using 3 FACTOR, the top line will read "mAITIME - BIT MODE".

4.2 FLUOROSCOPIC MODE - TUBE #2 (Not applicable to Rad generators)

For two tube Rad generators refer to SECTION 4.1. All numbers in parenthesis refer to reference numbers
in FIGURE 4-1.

Selecting tube #2 will place the system into the fluoroscopic mode of operation. All spotfilm techniques are
selected on the OC front panel similarly as in tube #1. The most common operation is SF-AEC which places
the spotfilm operation into automatic exposure control. The operator selects the desired kVp and an
appropriate BACKUP mAs. The spotfilm kVp appears in the kVp display (6), while the BACKUP mAs
appears in the LCD window.

The spotfilm radiographic are taken on the large focal spot as indicated on the front panel, unless small is
selected by the operator (15). Fluoroscopy Is always performed using the small focal spot regardless of the
front panel selection.

Spotfilming may be operated in a manual mode if desired. Selecting 2 FACT/3 FACT mode (17) places the
system in a manual selection mode. The x-ray factors are selected just as in tube #1 operation. The factors
will be displayed in the LCD wind9w. This operation penmits spotfilming of subjects that the AEC cannot
adequately expose the film, such as arthroscopic views. When spotfilm is in the manual mode, BIT ON/OFF
selections are available. l

9874 4-4 OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

c To retum to SF-AEC mode, just select an AEC field (22). When in the SF-AEC mode, the average density may
be modified by either the body size select (21) and/or the density (23). There is only one sensor field size,
therefore the AEC field selection is inactive for spotfilming.

The Manual AEC selection requires Automatic Exposure Control (AEC) see Section 4.7. The exams in this
mode are selected in 2-point or 3-point modes. The exam is terminated by AEC. In 2-point mode unit is
programmed so the back-up mAs in each exam provides the highest rnA available within the tube limits. This
will assure the shortest possible exposure time. In 3-point mode, user has ability to select the desirable rnA
and select back-up time.
" FUm/screen combination: Up to three different film/screen combinations may be programmed. The
different front panel setting (including radiographic techniques) could be programmed and saved by
pressing ALT MENU switch. For example: F/S 1= 2 factors, small focal spot, 70 kVp, small patient;
F/S 2 =3 factors, large focal spot, 85 kVp, large patient, etc. Saved techniques can be recalled by
selecting the appropriate Film/screen combination.
" Density selection: 11 stations with approximately 10% mAs between steps. Normal (0) and ±5 steps.
" Body size: Small, medium, and large for all exams, with the program ability to provide pediatric and/or
extra large, selected by "SOFT" keys around the display window.

When switching between tubes, or tuming the system OFF then ON, will return the "SETUP" to the last-used
mode. This results in very little setup being required when going between radiographic to fluoroscopic
operation and back.

4.3 FRONT PANEL DESCRIPTION

See FIGURE 4-1 for the panel layout. The numbers in the text correspond to the reference numbers in
FIGURE 4-1.
11 9 4 7 1

c Contlnentali!ml
I TM XX"RIF I i-Ivl -Ivl Ivl -lvl-1
Ie> -e> Q ~

lQ~-I'~ I§I ~~
lEI fi!I ~I-
< _____ 1 i L-I-------'I i
25~t=~:.~ro~~_~~__~_~__
~~,~I~~~I;-~I~~;I~I~~I~I~~~~~I~,~~==~~======~
<:1_
~= ~
~ CI.
ClWI' ="-
CI_~:
ClI ~=-no
c>_ 0
0 0 I

i~lAI!

iiiii ._----
8-

8 2 4 5

1028-054
"-xx 111110 TM RIF Generotor
modol numbor: 30.40. or eo.
FIGURE 4-1 TM GENERATORS OPERATOR CONTROL (OC) PANEL

1. POWER ON/OFF:
( Rocker switch located on the rear right of the OC (FIGURE 4-9). Turn OC power ON.

OPERATION 4-5 9874

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

2. %ANODEITUBE LOAD DISPLAY AND INDICATORS:

2-digit display (0 to 99%) of either pre-read TUBE ANODE LOAD (percent) for the selected technique (
factors, or the percent of accumulated HEAT UNITS stored in the tube housing. The cooling
characteristics of the tube are stored in the control and will indicate tube cooling as time elapses. The
push button switch located below the two indicator LEDs toggles between displaying %HEAT UNITS
and %TUBE LOAD. NOTE: Cooling software is active even while power to the unit is OFF.

3. EXPOSURE STATUS INDICATORS:

The READY indicator will be lit only when a series of conditions are satisfied. If any condition is not
satisfied, the HOLD LED will illuminate. If a generator fault occurs during the exposure (I.e. filament
loses power), the FAULT indicator will illuminate, displaying the cause of the error in the LCD display
and indicating that the control must be RESET (see item 9 below).

4a. PREP SWITCH:

Pressing [PREP] initiates the exposure sequence. Power is applied to the stator and filaments. After
a time delay of approximately 2 seconds, the PREP indicator will come ON. An exposure may then
be initiated by pressing [X-RAY]. The [PREP] switch must be held for the full duration of the PREP
and X-RAY exposure cycles. If either switch is released during an exposure, the exposure will be
immediately terminated.

4b. PREP INDICATOR:

The back lit indicator indicates the system is ready for an x-ray exposure.

5a. X-RAY SWITCH:

[X-RAY] initiates the actual x-ray exposure after the PREP sequence. Both [PREP] and [X-RAY]
must remain pressed during the entire exposure. If either switch is released during an exposure, the
exposure will be immediately terminated.

5b. X-RAY INDICATOR:

(
When lit, indicates that x-rays are being produced. An audible signal is also ON for the duration of
x-ray production.

6. kVp:
Consists of [UP] and [DOWN]. By activating either the [UP] or [DOWN] switch, the kVp will be
incremented in one kVp steps. Holding down either switch for more than one second will
automatically increment or decrement the display at a rate of 10 per second.

The back-lit ADD and SUB indicators (to the right of kVp) show that the kVp has been changed when in APR
orCEC mode.

NQIE;
The kVp display does not change when the mA or mAs is selected. This permits the selection of
technique factors in any order without interaction between factors.

7. mAs INDICATORS:
3-digit display of selected mAs when in CEC or MANUAL mode or a POST mAs display when in APR
mode. The back-lit ADD and SUB indicators show that the mAs value has been changed when in
CEC mode. The back-lit POST indicator is ON during APR mode and indicates a post-mAs reading.

8. rnA/em INDICATOR and CONTROL:

The switches are used to increase or decrease the mA in 3-Factor manual mode. The actual mA is
displayed on the LCD display. The 2-digit display shows the centimeter thickness of a body part in
CEC mode. Upon selection of a body part, an "average" thickness is displayed for the selected
technique. After measurement of the actual body part, the CM thickness may be increased or (
decreased as required.

9874 4-6 OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

c 9. LCD DISPLAY AND SOFT-KEYS:

The display is used for various information depending on which mode is selected. In APR and CEC,
it will display the available views after a body group has been selected. Pressing the soft-key either
above or below the view will select the technique values for that view. Pressing [INST]
(INSTRUCTIONS - see #20) will display information pertaining to the selected exam.

In MANUAL mode, either 2 or 3-Factor, the mA and TIME will be displayed in this window. Whenever
an error is detected in the system, an error code and/or error message will appear in this window.
If a system RESET is required, such as terminating with back-up mAs during an AEC exposure, the
lower right hand soft-key becomes the RESET function as indicated in the window. It is also used
for system test and calibration.

10. BODY GROUP SELECT:

8 push-button switches for a selection of desired body group when in APR or CEC modes. Upon
selection, all programmed views within that group will be displayed in the LCD window.

11. ALT MENU:

Pressing this switch places the control in operator program mode. It allows custom exams and
special techniques to be stored. It also allows the service technician to perform test, setup, and
calibration routines.

12. MODE SELECT:

Selects one of the three modes of operation:
a.APR
b.CEC
c. MAN (manual)

( 13. RECEPTOR SELECT:

A receptor (ion chamber), TABLE, WALL, or AUX (auxiliary) will be automatically selected in APR
or CEC mode, or can be selected by the operator when in manual mode. The selected receptor is
indicated by LEDs.

14. GRID IN/OUT SELECT:

This function is programmed in APR or CEC mode, or may be manually selected for IN or OUT as
indicated.

15. FOCUS SELECT:

Selects the SMALL or LARGE focal spot. This is programmed by APR or CEC modes, and defaults
to LARGE in the manual mode.

16. FILM/SCREEN SELECT:

Up to three different film/screen combinations may be programmed for APR or CEC operation. They
will default to the programmed combination, or may be selected by the push-button.

17. 3-2 FACTOR SELECT:

In manual mode, manual-AEC mode, and APR mode, selection of the technique is made by either
the 2-Factor method (kVp and mAs), automatically selecting the highest mA available within the tube
and control ratings, or the 3-Factor method (kVp, mA, and TIME) with the values indicated within the
LCD display. The mode is also displayed in the LCD window.

18. TOMO SELECT:

When used with a tomography system (optional), this selection places the exposure under control of
the tomo mechanism. TOMO can be selected from MANual mode only. Once in TOMO mode, CEC
can be selected for preprogrammed techniques. The system defaults to 3-FACTOR mode, TABLE
receptor, and LARGE focus. Selection of the high speed starter is prevented and the actual exposure
time equals the time selected on the front panel.
An x-ray exposure is performed in the same manner as when TOMO is not selected.

OPERATION 4-7 9874

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

19. PRINT:
If an optional printer is connected to the parallel printer port, pressing [PRINT] will output the post- (
exposure data from the last six exposures.

20. INST:
Used in APR or CEC mode, after a body 9rouP and view have been selected. The information or
instructions are programmed by the user on installation and include such information as which special
cones to use, positioning information, or tube angulation.

21. AEC-SMALUMEDIUM/LARGE SELECT:

When in AEC, the system defaults to medium body size technique. If a particular exam has been
programmed for use with pediatrics or very large patients, the additional selections appear in the LCD
window for selection with the soft-keys.

22. AEC-FIELD SELECT:

This permits selection of the ion chamber field or combination of fields for the particular exam. In APR
mode, it will default to the programmed combination. In the manual mode, each field may be
selected. Receptor must be selected AFTER selecting the desired field.

23. AEC-DENSITY SELECT:

Permits selection of PLUS or MINUS 5 steps of density modifications from nominal density. Each
step will increase or decrease the mAs value in approximately 10% increments, for ±50% total
allowable change.

24. mAsfT1ME SELECT:

These dual function switches are used to increase or decrease the mAs in the 2-Factor mode, or
TIME in the 3-Factor mode. Holding the switches for more than one second will increase the rate of
change to 10 per second. (
25a. TUBE SELECT INDICATOR:
The back-lit display shows which tube has been selected. Not used in a one-tube system.

25b. TUBE SELECT SWITCH:

Select Tube 1 (Radiographic) or Tube 2 (Fluoroscopic).

9874 4-8 OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

4.4 STEPPING OPTION SELECTION

(
With RPU release 5.8.1.0 or higher, the maintenance technician or engineer can select Stepping or Non-
stepping operation at the TM Operator Control (OC). This is done as follows:

1. Close switch SW3-8 located at the rear of the OC.

2. Power down and up to activate Service Mode.

3. Press the ALT MENU button (item 11 on page 4-7).

4. Next press the button on the lower row designated as TEST by the LCD display.

5. Press the button below the "2" to choose SETUP ROUTINES in the display.

6. Press the NEXT or BACK button until 4. DP & FLUORO SETUP is displayed and then press
EXECUTE.

7. Near the lower left hand button of the LCD display, the option STEP=YES or STEP=NO will be seen.

8. Press the button to choose the desired option and press STORE.

9. Press the EXIT button three times to leave this selection mode.

10. If use of service mode is completed, return SW3-8 to the open position and tum the TM power swilch
off.

( 4.5 REMOTE FLUOROSCOPIC CONTROL PANEL (Not applicable to Rad generators)

See FIGURE 4-2. The Remote Fluoroscopic Control (RFC) is located at the spot-film device. The display
is not illuminated when Tube 1 (RADIOGRAPHY) is selected.
Continental ~

kVp mA
7)--+---i1 1

ABS PULSE RATE

FLUORO CONTROL 9026-045

FIGURE 4-2 REMOTE FLUOROSCOPIC CONTROL

OPERATION 4-9 9874

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

1. rnA Indication:
Continuous fluoroscopy: during standby, the display indicates one of four rnA stations that has been (
selected, Le., -1, -2, -3, or -4. It then indicates average fluoroscopic mA value during fluoroscopy.

Pulsed fluoroscopy: indicates average mA during fluoroscopy. This value is a function of actual
pulsed rnA and the pulses per second rate.

2. rnA Up/Down Select:

Momentary up or down switches that change the rnA station for continuous mode. Not active when
in pulsed mode.

3. Pulse Rate Indicator:

Indicates the operating pulse rate, Le., 3D, 15, 7.5, 3.8, and 1.9 pulses per second. No indication
when in continuous mode.

4. Pulse Rate Up/Down Select:

Momentary up or down switches that change the pulse rate when in the pulsed mode. Not active
when in continuous mode.

5. ABS Select and Indicator:

Selects Automatic Brightness System In or Out and is indicated by L.E.D.

6. kVp Up/Down Select:

Momentary switches to select manual fluoroscopic kVp.

7. kVp Indication:
Displays fluoroscopic kVp for both manual and ABS modes.
(

9874 4-10 OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

4.6 CCD CAMERA CONTROL (Not applicable to Rad generators and DigiSpotlM systems)
( See FIGURE 2-3 below.

NOISE CONTROL:
This rotary switch allows the operator to select the number of frames to be integrated into a single image. This
averages multiple images reducing the effects of noise. If motion is to be imaged this should be set to 1 or
MOTION DETECTOR should be in the UP position.

IMAGE HOLD: (two-position switch)

UP will enable last image hold, DOWN will disable.

MOTION ENABLE: (two-position switch)

UP (enabled) will disable NOISE CONTROL and produce an image as though 1 was selected on NOISE
CONTROL. DOWN (disabled) will enable NOISE CONTROL.

2 1

4:.
8 /
\ I

18
NOISE
CONTROL

IMAGE

( HOLD

MOTION
ENABLE

H,'e v I

v+ H''')
9026-056R
SWEEP
REVERSAL

FIGURE 2-3 CCD CAMERA CONTROL

SWEEP REVERSAL:
Reverses the sweep on the monitor:

Position 0: No reversal. Original orientation of image

Position V: Vertical reversal (Image flipped vertically from top to bottom)

Position H: Horizontal reversal (Image flipped from right to left horizontally from position 0)

Position V + H: Horizontal and vertical reversal of image from position O.

c
OPERATION 4-11 9874
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

4.7 TOMO EXPOSURE CONTROL (OPTION)

(
The optional Tomo Exposure Control (TEC) allows the operator to utilize the mAs derived from an auto-timed
RAD exposure made just prior to the tomo exposure. This test exposure is performed using AEC, resulting
in the desired image quality. The tomographic mAs will be adjusted for the tomo sweep angle selected.

1. Exit TOMO mode.

2. Select MAN mode, tube 1, 3 FACTOR, TABLE receptor, the desired kVp, 40-inch SID and ion
chamber(s).

3. Select an mA value close to the expected Tomo exposure mA.

4. If Position the patient and make a radiographic exposure.

5. Develop the film and verify that the image is of the desired quality. The resultant POST mAs value
will be stored in memory for use in the subsequent tomo exposure. This mAs value is termed "Scour'
in the TEC screens. The value shown in the mAs display will be the value calculated by the processor
which will produce the desired image quality for the sweep angle selected.

Note:
If the POST mAs value is less than 7.6 mAs, TEC will be disabled.

6. Select TOMO mode.

7. The display will request an answer to the question "Enable Tomo Exposure Control?". Select YES.
If NO is selected, regular tomo techniques will be used. (
Note:
If tomo mode is entered without an AEC-derived mAs scout value, the normal tomo screen will be
displayed. If this is the case, to utilize the TEC, another scout exposure will be required. Select EXIT
from the tomo options.

8. The screen will show **TEC Mode ** and the Scout = value signaling that the system is in TEC mode.
Select the appropriate fulcrum height, sweep angle, sweep speed, and whether AUTO is OFF or ON.
The mAs value displayed will change with any change of the tomo sweep.

9. If Perfonm the tomo exposure

4.8 PRINTER
If the system has been configured with a printer, labels containing patient and exposure data can be printed
and affixed to the exposure for a permanent record of pertinent data: Patient 10, mode/view, and technique
data. The following presents an example of the data format (in this instance for APR mode):

Patient _ _ _ _ _ _ __
APR - HIP AlP (2 factor) Tube 1
TABLE, GRID IN, LFS, FS1
FIELD (2), Medium, Den +0
74kV ,250mAs, 125 ost

The system is setup for one of three printer modes by maintenance personnel: Automatic, Manual, or No (_
Printer. Automatic will print a label after each exposure, manual prints a label only when [PRINT] is pressed
(see FRONT PANEL section above) and no printer means that labels cannot be printed.

9874 4-12 OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

c If the system is setup for automatic printing, pressing [PRINT] will print a label of the last exposure, as in
manual print mode.

4.9 ERROR CODES

The system has built-in diagnostics for delermining system error conditions. The diagnostics are arranged
into groups of common functions. If errors occur repeatedly, the service technician should be called.
SECTION 10 provides a form at the end of the COMPLIANCE TESTING RECORD section to log system
problems, and error codes encountered to act as a history and diagnostic tool for the maintenance technician.

4.9.1 SYSTEM FLAGS -1 THROUGH 15

These flags indicate an improperly terminated exposure, and display the information in the LCD window. The
FAULT LED above [PREP], will illuminate, and the RESET functions will appear in the lower right hand comer
of the LCD window. There is a detailed description of the system flags in SECTION 7.

The system must be RESET before initiating another exposure.

EL.AG. DESCRIPTION
#1 X-RAY SWITCH
#2 PREP SWITCH
#3 kVp COMMUTATIVE FAIL ERROR
#4 kVp HIGH ERROR
#5 kVp LOW ERROR
#6 mA OVERLOAD ERROR
#7 mA LOW ERROR
#8 FILAMENT POWER SUPPLY FAIL ERROR
#9 FILAMENT OVERLOAD ERROR
#10 BACK-UP mAs LIMIT
#11 EXPOSURE STOP ERROR
( #12
#13
EXPOSURE TIME LIMIT ERROR
RPU HARDWARE FAULT
#14 kV UNBALANCED ERROR
#15 RPU FLAGS NOT RECEIVED

4.9.2 SYSTEM FLAGS -16 THROUGH 43

These flags monitor hardware performance and will place the system into a HOLD condition. Pressing [PREP]
will display the system flag number and a description of the HOLD condition.
Example: System Flag #28
mAs counter failed to program

The condition may clear itself. If the HOLD LED is ON, an exposure will not be permitted. Switch power OFF,
then ON, to RESET the microprocessor. If the HOLD remains ON, the system requires service.

4.9.3 SYSTEM FLAGS - 48 THROUGH 50

These flags monitor communication conditions between the operator control and the RPU. A flag condition
illuminates the HOLD LED and places the system on HOLD.

Service should be called immediately.

4.9.4 SYSTEM FLAGS - 51 THROUGH 63

These flags monitor external connected items to the system such as the collimator and door interlocks. A flag
condition illuminates the HOLD LED and places the system on HOLD.
EL.AG. DESCRIPTION EL.AG. DESCRIPTION
#51 COLLIMATOR NOT READY #61 AUX INTERLOCK ERROR
#52 kVp FEEDBACK SIGNAL ERROR #62 TUBE HOT
( #53
#54
SURGE RELAY NOT ENERGIZED
FILAMENT POWER SUPPLY ERROR
#59 ROOM INTERLOCK No.1 ERROR
#60 ROOM INTERLOCK No.2 ERROR

OPERATION 4-13 9874

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

4.9.5 SYSTEM FLAGS - 64 THROUGH 68

These flags monitor the operator control functions and will place the system on HOLD if a flag is set. If the (
HOLD LED is ON, an exposure will not be permitted. Switch power OFF then ON to RESET the
microprocessor. If the HOLD remains ON, the system requires service.

4.9.6 SYSTEM FLAGS - 80 THROUGH 87

These flags are set when an invalid technique is selected.
Example: System Flag #82
Factors Will Exceed Max Tube Power

The system will be on HOLD until a valid technique is selected.

l
9874 4-14 OPERATION
 TM X-RAY GENERATOR
MAINTENANCE MANUAL 9026.251

4.10 AUTO RAD FEATURE

( This feature allows the radiographic kVp and mAs values to be automatically synchronized to those based
on the immediately preceding fluoroscopic exposure parameters. The feature is particularly useful when
during a fluoro exam (live video). a region of interest is identified for an immediate rad exposure
(photospot), the subsequent exposure technique will be based on the immediately preceding fluoro
parameters.

This feature is effective with the following software releases:

• DigiSpot 7M DP 1.1.3.x and higher
• DigiSpot 7M Remote 1.1.3.x "
• TM OC 5.9.0.x"
• TM RPU 5.9.0.x " "

Setup
Auto Rad can be setup from the TM OC as default on or default off.
If default on is selected, then Auto Rad mode will be automatically selected at APR or manual AEC
selections, if this was the last mode used.
If default off is selected, then Auto Rad mode will be automatically deselected, and at APR or manual
AEC, it needs to be activated each time from the TM, Digispot 7M DP, or DigiSpot 7M Remote Control.

Selection
On TM OC, select AUTO RAD = ON.
Selection at Digital Platform (DP) with Remote can be done by pressing the MODE button.
DP and Remote Control will indicate Auto Rad on by flashing the "dead-fronted" AUTO and RAD displays.

Deselection
Auto Rad mode is deselected by one of the following ways:
• on TM OC, select AutoRad=OFF
( •
•
deselect AutoRad function on the Digispot 7M DP or Remote Control (Mode button)
manually adjust Rad kVp
• exit ABS mode
• exit AEC mode.

Prerequisites
For Auto Rad feature to operate, the following conditions must be met:
(a) Automatic Exposure Control (AEC) must be ON,
(b) Automatic Brightness Stabilizer (ABS) must be ON and
(c) ABS must be stable or fluoro exposure must be ON for at least 2 seconds prior to the
radiographic exposure.
AutoRad Radiographic Parameter Selection
Selection of radiographic kVp will depend on the type of exam desired (see FIGURE 4-4):

A. GI applications with full barium - relation between Fluoro and Rad kVp is linear.

B. for swallow and air contrast barium work - Radiographic kVp is 10% below Fluoro
kVp.

C. for myelography, ERCP and gall bladder - relationship is linear thru 90 kVp and then
changes to where 125 kVp Fluoro produces 100 kVp Rad.

D. for angiography - relationship is linear thru 80 kVp and then changes to where 125 kVp
Fluoro produces 90 kVp Rad.

E. for pediatrics - radiographic kVp is 10% above Fluoro kVp at levels up to 90 kVp after
( which value it levels off.

OPERATION 4-15 9874

TM X-RAY GENERTAOR
MAINTENANCE MANUAL 9026.251

• In 2-Factor mode, the mA will be the maximum available for the focal spot and kVp selected, and
the preselected mAs will be a back-up mAs.
(
• When exposure is OFF the radiographic kVp displayed from the latest radiographic kVp system
has been used.

When fluoro exposure is ON, then after ABS is stabilized or after 2 sec of fluoro in progress, the
radiographic kVp will track fluoro kVp, with the translation factors listed above.

STEPPING MODE

The AutoRad feature is operational in Manual Stepping mode. It allows a preset technique for
each step, simply by following the process given below.

a. select Manual Stepping AutoRad mode

b. position system for the desired step
c. run fluoro for 2 seconds or longer, radiographic technique will be set.
d. move to the next step and repeat process described above in steps (b) and (c)
e. the radiographic techniques will be set automatically.
f. at the end of the sequence, press the SAVE button on the DP or Remote.

120 Radiographic kVp

(
,B
110
,/
100 / J:,-
~;..---
E

_I'
• . . . .-. . . . . 111 . . . . . 11111 __

... -"-
11 . . 1 . .
90 /' _,I
"" ~_Il

·SO """ ,
D
""
"" ,/
"
"" ,/
70

""
60
..," '"" / , /
......' ,
50 ,"" ,/
" Fluoro kVp
40
40 50 60 70 80 90 100 110 120

FIGURE 2-4 RADIOGRAPHIC kVp vs. FLU ORO kVp

9874 4-16 OPERATION

 TM X-RAY GENERATOR
MAINTENANCE MANUAL 9026.251

c ADDENDUM TO Chapter 4 OPERATION

OF

TM X-RAY GENERATORS

MAINTENANCE MANUAL 9026.251

INSTALLATION of Remote Reversal Switch on Control Panel

Vertical and horizontal sweep reversals may be selected by using the Remote Reversal Switch
located just behind the right side of the Control Panel on the DigiSpot. TM

The camera may be operated in either the Normal Mode, Vertical Reversal,
Horizontal Reversal, or combined Vertical and Horizontal Reversal mode_

See Figure A-1 for an illustration of the Remote Reversal Switch.

This switch is for use with the CAMTRONICS VP Sytems only.

c Sweep reversals on the INFIMED GoldOne systems are operator selectable

on the system monitor.

o o

OFF
V
H
V+H
V+H
•

o o
FIGURE A-1 Remote Reversal Switch

OPERATION 4-17 9874

TM X-RAY GENERTAOR
MAINTENANCE MANUAL 9026.251

THIS PAGE INTENTIONALLY LEFT BLANK

9874 4-18 OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 5.0 INTRODUCTION
SECTION 5 - MAINTENANCE

Only experienced x-ray service personnel should perform maintenance on this equipment. Having consistent
x-ray films does not indicate the system is performing properly. It is difficult to observe the changes or
deviations in x-ray exposure on x-ray films until the deviations exceed 20% 0.0.. By performing the
preventive maintenance checks outlined in this section, the user can be assured that the machine is in good
condition.

Prior to leaving the factory, the system was thoroughly tested and calibrated. During installation,
measurements and tests verify that the machine is in good operating condition. The maintenance schedule
requires the same periodic tests and calibrations as performed at initial installation. Keep a record of
preventive maintenance with the equipment (in the maintenance manual) become a permanent part of the
manual.

The operator should be aware of the normal operating characteristics of the machine to observe any
abnormalities during operation. The operator should describe the problems encountered, and the sequence
of events. This will aid the technician in maintenance actions (SECTION 4.3).

When performing maintenance on the TM series generators, reference SECTIONS 8 and 9. SECTION 8
contains interface information, wiring diagrams, PCB configuration information, schematics, board layouts,
and parts lists for the system's electronic assemblies. SECTION 9 provides the mechanical information,
assembly locations and parts lists.

WARNING:
Lh
THE TM X-RAY GENERATOR CABINETS ARE DESIGNED TO PROVIDE ADEQUATE DISSIPATION

c OF HEAT GENERATED BY COMPONENTS IN THE SYSTEM. UNDER NO CIRCUMSTANCE IS THE

CABINET TO BE USED FOR STORAGE OF REPLACEMENT PARTS OR MATERIALS. SUCH
STORAGE MAY IMPEDE HEAT DISSIPATION OF ELECTRICAL COMPONENTS CAUSING FIRE OR
PREMATURE FAILURE.

5.1 MAINTENANCE SCHEDULE

1. Perform the calibration procedure, SECTION 3, every 12 months to gather the data for APPENDIX
A. Make a copy of APPENDIX A and record the data on the new test sheets, and place it with the
TM series generator manuals.
2. Turn power OFF at the OC and the disconnect box and clean out the interior of the control of
accumulated dust.
3. Periodic cleaning and recoating of the high voltage terminals should prevent high voltage breakdown
at these points. Failure to follow this procedure may lead to momentary or permanent high voltage
breakdown of the cable well. This can produce transients throughout the control and generator
system, which damage other components of the x-ray system such as the x-ray tube, high voltage
rectifiers, etc.
4. The anode of the x-ray tube and the port of the x-ray tube should be inspected for visible signs of
anode etching, pitting, or cracking. The port of the tube should be inspected for deposits of tungsten.
The port should not be distorted in any way.
5. The exterior surfaces of the system should be cleaned daily of dust and surface films with a mild
detergent.

l
MAINTENANCE 5-1 9847
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

I TABLE 5·1 MAINTENANCE SCHEDULE I (

FUNCTION FREQUENCY

CALIBRATION ANNUALLY

CABINET INTERIOR CLEANING MONTHLY

CLEANING/RECOATING OF HIGH VOLTAGE CONTACTS/CONNECTORS MONTHLY

TUBE INSPECTION WEEKLY

RPU, OC AND RFC EXTERIOR CLEANING (OPERATOR) DAILY

5.2 SPECIAL TOOLS

The fOllowing is provided with the TM RtF series generator: Precision electronic nut driver (4196.262.01) for
use in removinglreplacing the OC display to access the PCBs.

5.3 OPERATOR MAINTENANCE

The RPU, OC and the RFC require daily cleaning to remove surface films. In addition, the operator should
record any error flags that occur during operation. The operator should report any abnormalities observed
during operation. Qualified x-ray service technicians are required to perform all other maintenance.

The operator should make a copy of the PROBLEM LOG in the COMPLIANCE TESTING RECORD section
of SECTION 10 to log system problems, and error codes encountered to act as a history and diagnostic tool
for the maintenance technician.

5.4
5.4.1
REMOVE/REPLACE OPERATIONS
SCR REPLACEMENT (
When replacing the SCRs (see FIGURE 5.1):
1. The sealed evacuation tube is oriented DOWN, whether mounted on the right or left side of the
cabinet. The electrodes will be UP.
2. The pin of the mounting fixture MUST engage the dimple of the SCR. The SCR has a dimple on both
sides. If the pin does not engage the SCR dimple the SCR could be damaged during mounting or its
operational life shortened due to poor contact with mating surfaces.
3. Proper contact force be maintained. This is assured by tightening the hardware to the point that the
spring washer is fully compressed.
Dimple
Electrodes

SCR

Sealed evacuation tube

9026·069

Installation Orientation
FIGURE 5·1 SCR INSTALLATION

9847 5·2 MAINTENANCE

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 5.4.2 HIGH VOLTAGE GENERATOR REPLACEMENT

1. Remove power from system at the facility power disconnect.
2. Remove the front panel cover from the RPU.
3. Disconnect the cables to the high voltage generator.
4. Carefully remove the generator from the RPU base.
5. For TM50, TM65, or TMSO series generators ONLY (go to step 6 for TM30s or TM40s): Remove
the feedback isolation PCB from the old generator and install it on the replacement.
6. Install the replacement generator in the RPU base.
7. Connect the generator and the feedback isolation PCB to the wiring harness.
S. Verify connections against the wiring diagram (in Section 8) prior to providing facility power at the
disconnect.
9. Provide facility power.
10. Proceed to section 5.4.2.1 and perform the procedure outlined.
11. Remove power from the system.
12. Install the front panel cover.

5.4.2.1 SELECTION OF CAPACITORS

This procedure describes a method for the optimization of the kVp rise time for the TM family of controls and
is applicable during final test of the unit or when either the high voltage transformer assembly or the Feedback
Isolation PCB are replaced.

The kVp rise time is a function of the relative frequency response times of the elements of the kVp sensing
subsystem. The anode and cathode kVps are each sensed separately by two separate sensing networks
internal to the high voltage transformer assembly. These two networks are routed to the Feedback Isolation
PCB where they are connected to external capacitors C24 and C25 (see schematic 4294.262.1904 ). The
frequency response of these sensing subsystems can be adjusted by changing the value of these external
capacitors. C24 and C25 are Mylar or polypropylene, rated 250 VDC in the range of 0.047 to 0.082 ufo
(
Optimally, the kVp should increase, in steps, to its maximum value in 3 ms and continue at this value for the
remainder of the exposure. As the value of C24 and C25 is increased, the time constant of the output is
increased which reduces the settling time. If the time constant of the output is increased too much, over shoot
will result. Verify performance of the system:
1. Connect a Dynalyzer in the high voltage circuit.
2. Connect the kVp output signal, from the Dynalyzer, to a storage oscilloscope.
3. Turn power ON.
4. Select 40 kVp, 25 mA and 0.5 mAs.
5. ~ Make an exposure and examine the leading 10 milliseconds of the kV trace.
a. If the time, to maximum kVp value, is greater than 3 milliseconds, increase the value of C24
and C25 from 0.047 to 0.082 microfarads. Use Mylar or polypropylene capacitor types,
rated 250 VDC only.
b. If the kVp peaks and then reduces to and remains at a lower level, decrease the value of C24
and C25.

WARNING·
CAREFUL WHILE REPLACING CAPACITORS! IF ONE OF THE KVP FEEDBACK CAPACITORS
THE RESULTANT KVP WILL BE DOUBLE THE SELECTED VALUE. VERIFY T""TII

5.4.3 FEEDBACK ISOLATION PCB REPLACEMENT

1. Remove power from system at the facility power disconnect.
2. Remove the front panel cover from the RPU.
( 3. For TM50, TM65, or TMSO series generators ONLY:
a. Disconnect the cable harness from the feedback isolation PCB.
b. Remove the PCB from the high voltage generator.

MAINTENANCE 5-3 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

c. Place the replacement PCB in its mounted position on the high voltage generator but do not (
secure with its mounting hardware until system performance has been verified.
d. Connect the replacement PCB to the wiring harness.
For TM 30 and TM40 series generators ONLY:
a. Remove the left (as viewed from the front) side cover from the RPU.
b. Open the lower door of the card cage to allow access to the feedback isolation PCB (PCB)
mounted to the lower inside left side surface.
c. Remove the four screws securing the PCB's standoffs to the card cage.
d. Remove the PCB from the card cage.
e. Remove the four standoffs from the old PCB and install them on the new PCB.
f. Connect the new PCB to the wiring harness.
g. Install the PCB inside the card cage using only one screw. This will allow easy removal if
another capacitor must replace one already mounted to the PCB.
4. Provide facility power.
5. Perform section 5.4.2.1 to verify system performance.
6. Secure the PCB in place with its mounting hardware.
7. For TM30 and TM40 ONLY: close and secure the lower card cage cover and replace the side cover
to the RPU.
8. Install the RPU front cover.

9847 5-4 MAINTENANCE

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 6.1 OVERVIEW
SECTION 6 - THEORY OF OPERATION

The TM generator is a dual microprocessor-based x-ray control and generator. It has three basic modes of
operation:
a. Manual - 2 Factor: incremental mode and BIT mode
3 Factor: incremental mode and BIT mode
Automatic Exposure Control (AEC)
b. Computerized Exposure Control (CEC)
c. Anatomically Programmed Radiography (APR)

The system is controlled by two microprocessors. One in the operator control (OC) controls all front panel
keyboard and display functions. It handles all of the anatomical program data, and controls the anode heating
and cooling calculations for tube protection. The cooling calculation is performed even when the system power
is OFF. When [PREP] is pressed, the OC transmits the selected technique data to the Remote Power Unit
(RPU).

The other microprocessor is located on the RPU microprocessor PCB. Data received from the OC is used to
control the electrical settings for x-ray generation. It monitors interlocks, controls any selected options, and
sends the READY signal to the OC. When READY is received by the OC, the READY LED illuminates on the
OC and the operator may initiate an exposure.

The high voltage and x-ray tube filament controls are accomplished by high-frequency inverter technology.
Both functions use feedback signals which are compared with selected value signals from the operator control.
They are controlled by the closed-loop servo electronics on the mA/mAs Control PCB and the kVp Control
PCB.

( Exposure time in MANUAL operation is accomplished by the microprocessor controlled integrating timer on
the mA/mAs Control PCB. When in the AEC mode, the time is derived by the digital integrating timer on the
AEC Control Module.

There are several isolated power supplies, both regulated and unregulated, for supplying all power for both
the OC and the RPU.

There are several interlocks available and several voltage outputs to operate indicator lamps. The system may
also be interfaced with high speed starters (standard for the TM65 and TMBO).

6.2 HIGH FREQUENCY INVERTER PRINCIPLES

Both the kVp and mA controls use high frequency inverter circuitry. The kVp control utilizes a full-bridge (or
H-Bridge) (FIGURE 6-2), while the filament circuit utilizes a half-bridge inverter (FIGURE 6-5). In both cases,
the circuit topology is that of a resonant mode inverter.

The inverter switches (SCRs) generate a square wave of voltage which is fed to the transformers through a
series capacitor. The transformer equivalent input impedance is primarily inductive, and includes a reflected
impedance in the form of a series resistance. Therefore the equivalent circuit is a series RCL circuit. See
FIGURE 6-1.

When switches TH1 and TH2 are closed, the series RCL (RsCsLs) circuit has the power supply DC voltage
applied across it. At time zero (switches close) current starts to flow through the RCL circuit in a sine-wave
form, at the resonant frequency (fR) determined by the series capacitance and inductance.

1
Imo.o.ce = 2 revLC
(

THEORY OF OPERATION 6-1 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

D.
VOLTAOE (

J TH'
(SW1}
TH'
{SW3}
l
°1 ... ~'....
I TH. TH'
J

D
(SW') (SW')

X·RAYTUBEi

FIGURE 6-1 EQUIVALENT CIRCUIT

Semi-conductor switches (SCRs) are used, and the switches will only conduct on the positive half-cycle. There
is stored energy in the negative half-cycle that has value in transferring energy. Therefore an anti-parallel, or
fly-back diode is placed in reverse conducting configuration around the SCR. See FIGURE 6-2.

If TH1 and TH2 receive just one trigger pulse, a current waveform as shown in FIGURE 6-3 will result. Note
that the SCRs conduct for only one half cycle, they will not conduct when the current is reversed. This action (
is called "self-commutation".

DO
VOLTAGE

.........
, """"
THYRISTOR (')(1
,,
"'",, '"' rHJ~
Resonant Frequency'" 111 r

'" II
II
H_voc.T"IIE
1JUNUOIUIEIr

,,
......'"' '":;z ~ L

"0-
X-RAYTUBI;

FIGURE 6-2 FULL BRIDGE INVERTER CIRCUIT FIGURE 6-3 SINGLE PULSE SCR
CONDUCTION

9847 6-2 THEORY OF OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( There is one positive pulse per trigger (FIGURE 6-3). If TH3 and TH4 are triggered later, the waveform, shown
in FIGURE 6-4, will result.

OPERATING FREQUENCY: fo= 1lto

SCR
TH1 & TH2
DIODE
D3 & D4

I
I
I
I
I
DIODE I
D1 & D2 I
I
I SCR
'------O.5lo-----..,!TH3 & TH4
902f

c FIGURE 6-4 DOUBLE PULSE SCR CONDUCTION

Another frequency is introduced, the time between the resonant pulses. This is the operating frequency (f,).
It is this waveform of current that flows through the primary coils of the high voltage (HV) transformers. The
HV generator has two transformers that derive the anode (plus) and cathode (minus) voltages with respect
to ground. The output of these transformers is coupled to a voltage doubler circuit. This circuit that contains
the filter capacitance to obtain a near constant potential output voltage.

To change the output kV, f, will have to be changed. The current pulses charge the capacitors in the voltage
doubler to a small percentage of voltage each time. Then the load (x-ray tube rnA) will discharge the
capacitors a small amount. To raise the kV across the tube, the doubler capacitors must be charged at a
faster rate. Increase f" to increase kV, or decrease f, to lower kV. Frequency change on the input results in
amplitude change at the output.

A precision HV resistor divider is built into the HV circuit. This divider feeds back a voltage proportional to kVp
(equivalent to .16V/kVp total + to -). The feedback signal is used by the kVp control circuit. Precision resistors
in series with the HV circuit feed back a signal proportional to the x-ray tube current. This signal is used by
the rnA control circuit.

The filament inverter functions like the HV inverter. The major difference is that the filament inverter is a half-
bridge circuit with IGBT transistors and two f1yback diodes. Another difference is that the filament transformer
is a step-down in voltage (step-up in current) and there are no rectifiers and filter capacitors in the secondary
circuit. See FIGURE 6-5.

6.3 OPERATOR CONTROL

The input power to the microprocessor PCB is plus 24 VDC. This supplies U14 the +5 V switching regulator
for the processor electronics; U28, the isolated 5 V supply for the RS 422 external communications port, and
to U21 through R13 and R12 for power fail detect. R12 is factory adjusted to supply a POWER FAIL signal
when a 25% drop in the nominal power mains is detected.

THEORY OF OPERATION 6-3 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

(
DC
VOLTAGE

'--~----~~---------------.

HIGH VOLTAGE
FILAMENT
TRANSFORMER
~------~-----4~ ~~----~

9026-
0,.
FIGURE 6-5 HALF H-BRIDGE INVERTER

The microprocessor used in this control is an 8085AH, U15. It runs on the software program in the 27C512
EPROM, U5 (program ROM). Calibration of the x-ray factors is accomplished by software control and the
calibration factors are stored in the 28C256 EEPROM, U2 (CALMEM). Anatomical Program Radiography C'.
(APR) data is stored in another 28C256 EEPROM, U3, (Technique MEMory or TMEM).

The operator control has three ports to communicate with external devices.

1. J2 (OC to RPU COMMUNICATIONS): This is the communications link between the OC and the
RPU. It is an isolated RS422 serial port. Four lines are
dedicated for PREP and X-Ray functions for safety
purposes.

2. J4 (APR SERIAL PORT): This is an RS232 port for interface to a PC computer. This
facilitates for adding and editing APR data.

3. J8 (PARALLEL PRINTER PORT): This is an isolated parallel printer port for outputting post
exposure data to a standard PC printer.

Status LEDs are visible through the rear panel. Viewed left to right (DS1 through DS7) they are as follows:

DESCRIPTIQI!I FUNCTION

DS1 RUN Indicates that the ~processor clock is RUNning. Low

brightness is normal.
DS2 through DS5 Status These indicate a binary code of the status of the
microprocessor. See Status codes below.
DS6 Port B Indicates when Port B (PC Port) is accessed.
DS7 Power Indicates +5 volt supply is on.

TABLE 6-1 OPERATOR CONTROL INDICATORS

9847 6-4 THEORY OF OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( Status LED codes: DS5 Blinking indicates that the OC Microprocessor PCB is functioning properly, and DS2
through DS4 indicate which program routine is running. If one of the errors listed below is detected, the front
panel is blanked, DS5 is turned off, and the binary error # is indicated by DS2 through DS4.

There are two push button switches, SW1 and SW2, accessible through the rear panel. SW1 is the
microprocessor RESET switch that restarts the main program. By holding SW2 (TEST) and turning on the
power, the unit is placed into the front panel switch TEST mode. Each front panel switch is assigned a position
number which appears in the AnodelTube Load window display as the switch is activated, i.e. kV up switch
is #35 and kV down switch is #36.

Switches SW3 and SW4 are the program switches to set the microprocessor program for different functions.
All switches are CLOSED or in the down position for FUNCTION operation. The following list outlines these
switches:
SWITCH FIJNCTION DESCRIPTiON
SW3-1 SHOW FUNCTION Permits O.C. to function without being connected to RPU (checked
at Power Up).
SW3-2 NOT USED
SW3-3 NOT USED
SW3-4 SINGLE SOURCE Disables exposure initiation EXPOSURE from front panel. Used
with remote exposure switch.
SW3-5 TEC Enable Tomographic Exposure Control Enable, for tomo systems only
SW3-6 NOT USED
SW3-7 MAXIMUMKVP Limits kVp to 125 kVp (checked at power up)
SW3-8 CALIBRATION Places system in the calibration/test mode. (checked at Power Up)
SW4-1 NOT USED
SW4-2 NOT USED
SW4-3 NOT USED
C SW4-4
SW4-5
NOT USED
NOT USED
SW4-6 TOMO OPERATION Enables Torno Mode
SW4-7 NOT USED
SW4-8 OCMSG Enables OC "ContinentaL" message

TABLE 6-2 OPERATOR CONTROL SWITCHES

R24, CONTRAST, is also accessible through the rear panel. It controls the contrast of the Liquid Crystal
Display (LCD) to provide proper viewing for the ambient light level in the room.

The Display PCB contains the 7-segment LED's, light bars, and the display drivers, U1, U2, and U4. U5, U6,
U7 and U8 are the front panel key switch decoders. VR1 is a 12 VDC regulator supplying U3, the DC-to-AC
converter that supplies 100 VAC to the Electro-Luminescence panel for the LCD backlight. This permits
viewing the LCD in a darkened room.

The keyboard contains all the domed switches integrated into the panel.

6.4 RPU MICROPROCESSOR PCB

The RPU microprocessor PCB utilizes the 8085AH microprocessor, U6, and has its program residing in the
27C256 EPROM, U5. A function of this system is to communicate with the operator control. These signals
enter via Pl0 and are interfaced to the 8085 microprocessor through U24, OC1, U19, OC2, U21A, and U22.
This is an RS232 type of serial communications.

Other functions of this microprocessor are to transfer the front panel technique factors, control the exposure
sequence, and monitor system functions. When errors are detected, the RPU will send the "System error Flag
( #" to the operator control and display the error code via LED's DS2 thru DS9 (Refer to SECTION 7 for error
codes). DSl indicates that the RPU microprocessor is running. L 1 is normally dimly lit to indicate proper
operation.

THEORY OF OPERATION 6-5 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

There are two switches, SW1 and SW2, located on this PCB. SW1 is the microprocessor RESET switch used (
to RESET the program. This is used primarily for factory testing of this PCB. SW2 has no current function.

There are two switch banks SW3 and SW4. They are normally set to OFF (open) for operation. Refer to
SECTION 7, TABLE 7-2 for detailed functions.

6.5 mAfmAs CONTROL PCB

The mAfmAs PCB provides two main functions, control of the x-ray tube filament power (mA), (non-AEC) and
control of the exposure time for all manual timing requirements (mAs).

Data is received from the microprocessor via the backplane bus (P7) and is interfaced with IC1-4, 7, and 10.
Data representing the selected, mA value appears at the input of the digital-to-analog converter, IC14. Its
output is buffered by IC17A and becomes the mA reference signal for the mAservo amplifier, IC17C. The mA
is controlled be!ilre the exposure by a pre-heat value that is a function of the desired mA and kVp, for space
charge compensation. During the pre-heat period, the feed-back for the

servo amplifier is derived from sensing the current in the primary of the filament transformer on the Gate Drive
PCB. The signal appears on P8-1 (Fil FB). This is an AC current waveform that is converted into a DC voltage
by the RMS-to-DC converter, IC5. TP5 is a voltage proportional to the current flowing in the primary of the
filament transformer. This voltage is amplified by IC6D and becomes the PRE FB+ signal for comparison with
the reference voltage. This signal is switched by IC15 to the actual mA feedback voltage at the moment that
the kVp has reached maximum kVp.

The actual mA feedback is derived from two 10 n resistors in the HV transformer assembly. Plus and minus
signals appear at PB-9 and PB-5 as inputs to the differential amplifier, IC6. The output of IC6 is buffered by
a low-pass amplifier, IC17, and becomes the actual mA FB (+) signal. This signal is compared with the
reference and applied through IC15 to the input of the servo amplifier, IC17.

Its output is then applied to the input of the voltage to frequency converter IC19. IC19 has a maximum
(
frequency adjustment, R10 (FoMax), that limits the maximum operating frequency of the filament inverter
supply. The output of IC19 is buffered by Q1 and IC8 and appears at the input of the divide-by-two flip-flop,
IC16A. The Q and -Q outputs trigger the 42 microsecond one-shot mulitvibrators, IC18. These supply the Gate
Drive for the filament inverter IGBT's. These signals, TP10 and TP11, exit the PCB on P8-21 and P8-23.

There are several monitored signals that will generate system flag errors if detected. These include primary
filament overcurrent detect and mA overcurrent detect. These Signals are applied to IC7 through jumpers
EMA5 and EMA4. These jumpers are used for trouble shooting.

The other prime function on this PCB is the integrating mAs timer. All manual timing is done by the mAs timer,
including the 3-factor selection of time. Since the mA is highly regulated, the time will be constant for a given
mAs selection. The timer has as its input the actual mA signal (TP2) applied to the input of the voltage-to-
frequency converter, IC20.

The V/F has one factory adjustment, R34 (mAs CAlibrate), that sets the conversion at 60 Hz/mA. This
frequency varies proportionally with mA and is applied to the input of the counter/timer, IC11.

A divide-by number representing the desired mAs (or time) is input to the counter/timer and the pulses
representing actual mA are counted until they equal the preset data input at which time an exposure stop
signal is generated (IC11-1 0). This signal is read by the microprocessor and is used to stop the exposure
sequence.

9847 6-6 THEORY OF OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 6.6 kVpCONTROL
The kVp Contrl PCB contains the high voltage, or kV, control circuitry. The high-frequency inverter is
controlled by a closed-loop servo system that responds to an analog reference voltage input that is
proportional to the selected desired kVp.

The data from the front panel is transferred to the kVp control via the RPU microprocessor and the
microprocessor bus on the backplane PCB through P5 to IC1, IC5, and IC9. These IC functions are to decode
the address and interface (transfer) data both as inputs and outputs. A digital number representing the desired
kVp appears at DO thru D7 of IC2, the AD7248 digital-to-analog converter.

The output of IC2 (V out) becomes the kVp reference voltage for input to the servo amplifier. This voltage
takes two paths, one thru IC6A and one thru IC6C. IC6C is an integrator function which supplies a "RAMP"
to the reference voltage at the output of IC6A. This RAMP is applied at "RAMP ON" time which occurs at
exposure start. The resultant wave form at TP2 contains both the ramp and reference Voltage. This is a
negative signal to be compared with the positive feedback signal.

The kVp feedback signal is derived from two precision voltage dividers located in the HV transformer
assembly. There are both positive and negative feedback signals that are input to a differential amplifier, IC4A
& B. These signals appear at TP11 (FB-) and TP12 (FB+). They are summed in IC4C and the composite
signal appears at TP3 (KVFB+). It is this feedback signal that is compared with the reference signal and input
to the servo amplifier, IC6D.

This servo amplifier derives a differential signal that is applied to the input of IC7, the voltage-to-frequency
converter. IC7 has an output frequency proportional to the input voltage and is limited to its maximum
frequency by R13 (fo MAX). This is a factory adjustment to limit the frequency to 12.5 kHz (11 kHz for TM80
ONLY). This adjustment assures that the inverter SCR's will not operate above their safe operating frequency

c (To time). Operation above this frequency will cause SCR commutation failure resulting in a short circuit on
the +500V power supply.

The output of IC7 (through Q1) and IC14B, is applied to flip-flop IC12A. IC12 divides the frequency by 2 and
its outputs, Q and -Q, are used to trigger the one-shot mUlti-vibrators, IC13. The pulse width of these
multivibrators are approximately 11 micro-seconds and appear altemately. These SCR gate drive pulses are
supplied to the SCR gate drive PCB at J6-25 and J6-27.

There is circuitry to detect when the actual kVp is either 6 kVp above or below the desired kVp. IC4D and
IC11C and IC11D provide this function and derive active low signals that are monitored by IC5 through
jumpers JP4 and JP3. These jumpers are removed for troubleshooting purposes.

A signal from the Gate Drive·PCB appears on P6-21 which indicates that SCR commutation failure has
occurred. This signal sets flip-flop IC12B which then inhibits the kV gate drive. The -Q (COMM FAIL') output
is sensed by IC5 thru jumper JP1.

One other signal is monitored by IC5, the interlock signal on P6-9 (125 kV) or P6-15 (150 kV) which senses
the feedback cable as connected into the HV transformer assembly.

6.7 1/0 CONTROL

The 1/0 control PCB interfaces the microprocessor bus with the FIELD 1/0 PCB, and to other static functions
within the system.

There are 8 LED status indicators, and 8 program jumpers. Refer to SECTION 7 for information about these
indications and functions.

THEORY OF OPERATION 6-7 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

6.8 AEC INTERFACE

The AEC interface PCB contains the automatic exposure control circuitry to interface up to six ion-chamber (
inputs. These inputs all appear on P2 and are applied to the normalizing amplifiers IC15, 16, and 17. These
amplifiers each have a gain adjustment that will balance each input.

These inputs are then selected by IC18 and the selected signal is input to IC19, the film/screen and density
gain modifier amplifiers. This signal is then inverted and buffered by IC19D, and becomes the input to the
voltage-to-frequency converter, IC22. Its conversion (V to F) is calibrated by R43 (V/F ADJUST). This
adjustment is set by following the "MAX TRIP VALUE" calibration procedure found in SECTION 3.

The output of the V/F converter is applied through IC4 to the clock input (CLK1) of the counter/timer IC, IC9.
A preset digital value, representing a threshold value determined by calibration, is applied to the DO-to-D7
input of the counter/timer. The system clock (3.012 MHZ) is applied to the other clock input (CLKO) (PIN 9)
and an internal frequency is derived by this counter. These two frequencies are then compared by IC18, and
when the V/F frequency equals the internal preset frequency, an AEC STOP signal is generated at IC18-9.

This signal is read by the microprocessor and the exposure sequence is terminated. Note: the V/F frequency
is controlled by the integrated ramp signal from the ion-chamber pre-amplifier. Therefore this signal starts at
a low frequency and increases as the ramp voltage increases. When this frequency reaches the same pre-set
frequency in the counter/timer an AEC stop signal is generated. There is a memory location for each 10 kVp
value that may be programmed (calibrated) for a different preset value. This becomes the kVp compensation
calibration. There is also a memory location for each APR exam so each exam may be calibrated, or
customized, for desired AEC film density.

The remaining circuitry on the AEC interface is used for communications to the microprocessor bus and for
I/O functions such as field selection from the ion chambers.

6.9 RELAY/OC POWER SUPPLY (

The Relay/OC Power Supply PCB contains the 24 VDC regulated supply to operate the Operator Control, plus
a 24 VDC supply for the field I/O PCB.

There are two solid-state relays to operate the surge contactor (M2), and the contactor that switches in and
out the additional series resonant capacitor (C,) in the kVp inverter circuit.

6.10 RAD FIELD I/O

The Rad Field I/O PCB provides the interface for the generator with system components. These include the
following:

TERMINAl BOARD JlQ DESCRIPTION

TB1-1 thru TB1-9 I/O Interface to high speed starter
TB2-1 to TB2-2 I Tube select verify
TB2-3 to TB2-4 o Drives the M4-RD contactor
TB2-5 to TB2-6 o 117 VAC room indicator
TB2-7 to TB2-8 I Table interlock
TB2-9 to TB2-10 I Tomo interlock
TB2-11 to TB2-12 I AUX interlock
TB2-13 to TB2-14 I Door #1 interlock
TB2-15 to TB2-16 I Door #2 interlock
TB2-17 thru TB2-23 I/O Collimator interface
TB3-1 thru TB3-5 I/O AUX bucky interface
TB3-6 thru TB3-1 0 I/O Wall bucky interface
TB3-11 thru TB3-15 I/O Table bucky interface
TB4-1 thru TB4-6 I/O X-ray tube interface

TABLE 6-3 FIELD I/O CONNECTIONS (

There are two adjustments on this PCB, one for minimum stator main current detect (R57) and the other for
minimum stator phase current detect (R58). These are factory adjusted for the standard speed stator.

9847 6-8 THEORY OF OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

c 6.11 FLUORO FIELD I/O (Not applicable to Rad generators)

This PCB provides the input/output for the generator with all ancillary items that might interface with the unit
for use in fiuoro mode. These include the following:

TERMINAl BOARD 1lQ DESCRIPTION

TB1-1 thru 8 & 10,12 I Camera interface
TB2-1 thru 7 I Spot film device
TB24,8 I Auxiliary power transformer
TB3-2,3 & 7,8 I Tube 2 stator/thermal switch
TB3-1 & 4 thru 6 I Tube 2 stator/thermal switch
J1-1 thru 3 o Filament drive out
J2-1 & 2 I Filament drive in
J3-1 thru 3 o Tube 1/2 HV switch select
J4-1 thru 3 I Tube select verify
J7-1,2 & J10-1,2 I/O Solid state relay SSR1
J8-1 thru 6 I Filament standby AC supplies
J9-1 thru 6 o Stator power supply
J11-1 thru 5 I +5V & ±12 Voe power supplies
J12-1 thru 40 I/O System control via backplane

TABLE 64 FLUORO FIELD I/O CONNECTIONS

6.12 GATE DRIVE

This PCB contains the gate drive circuitry for the HV inverter and also contains the filament inverter supply.

c The kV inverter drive signals come from the kVp Control PCB and are optically isolated by IC3 and IC4. They
drive the HEXFETS, Q2 and Q3, that drive the SCR gate drive pulse transformers, TR1 and TR2. Q1 is a
HEXFET switch that supplies the pulse transformers with supply voltage only while [PREP] is activated. This
provides safety to prevent noise triggering the SCR's when the unit is idle.

There is a circuit that detects the presence, or absence, of the 500 volts applied to the SCR's. Should two of
the SCR's on the same leg of the H-bridge conduct at the same time, a short would be applied across the 500
volt supply, and the supply voltage would decay rapidly. This circuit, IC7, detects that voltage decay and
provides a logic signal to the microprocessor to terminate the exposure sequence.

Two LED's indicate status of this circuit. L6 is illuminated under normal operation, and L7 illuminates when
a failure is detected.

The other function on this PCB is the filament inverter circuit. 120 VAC is rectified and filtered to supply
approximately 170 volts DC to the half-bridge inverter, IGBT's Q4 and Q5. IC8 is the IGBT drive interface IC
driven by the opto-isolators, IC5 and IC6. There is a current transformer in series with the output to the
filament transformer's primary. This current sense supplies the signal to the mA/mAs Control PCB that is
converted into the DC voltage for servo control of the filament power during pre-heat. C18, 19,20, & 21
comprise the series resonant capacity for this inverter supply.

6.13 HIGH-FREQUENCY INVERTER

The high-frequency inverter consists of two sections. The H-bridge inverter with the four SCR's (thyristers),
four anti-parallel diodes, the "snubber" networks, and the series resonant capacitors. The primary of the HV
transformer is the series inductance for this inverter. The other section is known as the "T" network.

Explanation of the high-frequency inverter is found in SECTION 6.2. There is one unique feature of this
inverter, it is the use of a second and third series resonant capacitor switched in and out by the contactors.

l This reduces the output ripple of the kVp waveform when the power level is reduced.

THEORY OF OPERATION 6-9 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

The kVp ripple is a function of the output power level. The higher the power level, the lower the ripple. (-
Therefore, if only one series resonant capacitor was used, the ripple would vary from approximately 10% to
1% as the unit was operated between 1 kilowatt (25mA at 40 kVp) and 30 kilowatts full power. By switching
the series resonant capacitor at 12.5 kilowatts, the ripple is maintained within a range of 6% to 1%, with a
typical value for between 2% to 4%.

The "Snubber" networks around the SCR's are important in reducing the rate of change of voltage across the
"OFF" SCR's. Without the snubbers, the "OFF" SCR's would self trigger and result in a short circuit across
the power supply.

To prevent "blowing" (F9) for momentary mistriggering occurrences, there is a circuit in series with the power
supply capacitors and the SCR's, the ''T-network'' (its elements are in a ''T' configuration L1, C13, C14, R15,
R16, DP6). The purpose of the T-network is to absorb the momentary short circuit current and prevent fuse
(F9) from blowing. Since this network is made up of both inductance and capacitance, it will oscillate upon a
short circuit resulting in a reversing of the current.

This reversing action "un-Iatches" the SCR's and returns the inverter to an open state. It is the short circuit
that is detected by IC7 on the Gate Drive PCB that in turn inhibits additional gate pulses to occur. An error
message appears in the LCD window indicating that the exposure was improperly terminated by system FLAG
#3, kVp commutation fail error, and a RESET appears. The system must be reset before another exposure
can be initiated.

6.14 11jlPOWERSUPPLY
The mains input range is from 204 VAC through 276 VAC, 60 Hz. The mains must be line matched to the
autotransformer via TB6. The autotransformer steps up the voltage to 369 VAC and then is applied to the
rectifiers through the main line contactor (M3) and the surge contactor (M2). The purpose of the surge
contactor is to limit the charging current to the capacitor bank of C5 thru C10. Upon power on, the surge -
contactor activates, and approximately 2 seconds later the main contactor energizes. The 369 VAC is rectified (
and filtered to provide approximately 500 volts DC for the high-voltage inverter.

There is 24-hour power supplied to the 24-hour Power Supply that provides power distribution to the control
circuitry. There is a bleeder relay on this supply that places the bleeder resistors (R6 & 7) across the large
filter capacitors whenever the unit is tumed off. There is a switch to tum off M2 and M3 to de-activate the 500
volt supply for use in troubleshooting.

6.15 31jl POWER SUPPLY

The mains input range is from 204 VAC through 276 VAC, and 480 VAC 60 Hz. The mains must be line
matched to the autotransformer via TB6. The autotransformer steps up the voltage to 369 VAC and then is
applied to the rectifiers through the main line contactor (M3) and the surge contactor (M2). The purpose of
the surge contactor is to limit the charging current to the capacitor bank of C5 thru C10. Upon power on, the
surge contactor activates, and approximately 2 seconds later the main contactor energizes. The 369 VAC is
rectified and filtered to provide approximately 500 volts DC for the high-voltage inverter.

There is 24-hour power supplied to the 24-hour Power Supply that provides power distribution to the control
circuitry. There is a bleeder relay on this supply that places the bleeder resistors (R6 & 7) across the large
filter capacitors whenever the unit is turned off. There is a switch to tum off M2 and M3 to de-activate the 500
volt supply for use in troubleshooting.

9847 6-10 THEORY OF OPERATION

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

SECTION 7 - TROUBLESHOOTING
7.1 SYSTEM FLAGS

The codes listed below are shown on the OC display window and the LEOs on the RPU microprocessor PCB
(see TABLE 8-6).

1. Fault flags (OC FAULT INDICATOR LED ON) indicate that the exposure was improperly terminated
by an error and that the improper termination of the exposure be acknowledged by pressing [RESEll
2. These RPU flags are cleared before the start of the prep sequence.
3. TM RlF must be turned OFF then ON to clear the flags.
4. Wire jumpers required on field 1/0 PCBs for rnultitube operation. IC10 pin 8, 11, 13, to TS1, 2, and
3.
5. These flags are set or cleared when checked.
6. On multitube units, the tube selected (1,2, or 3) at the OC determines which field 1/0 PCB these flags
refer to.
7. These flags are cleared at the end of the prep sequence.

Q.C HEll NOTES LCD MESSAGE - DESCRIPTION

o NIA 1 STACK ERROR
Flag used for verification of OC software changes.

NIA 10 2 Not displayed.

RPU stack error, flag used for verification of RPU software changes.

1 11 1,2 X-RAY SWITCH

(RPU IlP PCB, U22-32 high,X - RAY). Exposure terminated by release of

c 2 12 1,2
EXPOSURE switch.

PREP SWITCH
(RPU IlP PCB, U22- 33 high, ROTOR). Exposure terminated by release of
PREP switch.

3 13 1,2 kVp COMMUTATION FAIL ERROR

(kV PCB, IC5-4 low, KVCF 1). Exposure terminated by collapse of the
inverter power supply. Probable cause, SCR commutation fail.

4 14 1,2 kVp HIGH ERROR

(kVp PCB, IC5-2Iow, R\7RT). Exposure terminated by 3 consecutive (3rns)
kV high conditions, kV actual 9kV feedback) less than kV selected 9kV
reference) by 8kV or more.

5 15 1,2 kVp LOW ERROR

(kVp PCB, IC5-110w, J<V[(J). Exposure terminated by 3 consecutive (3ms)
kV low conditions, kV actual (kV feedback) less than kV selected (kV
reference) by 8kV or more.

6 16 1,2 mA OVERLOAD ERROR

(mA/mAs PCB, IC7 pin 19 low, -rnA OVLD)
Exposure terminated by 5 consecutive (5ms) mA overload conditions, mA
actual (rnA feedback) exceeds mA selected (mA reference) by 14.4% or
more.

7 17 1,2 mA LOW ERROR

( (mAlmAs PCB, AID IC10 pin 27, mAlFIL FB sample)
Exposure terminated by 5 consecutive (5rns) mA low conditions.

TROUBLESHOOTING 7-1 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

OC Re11 t-lQIES I CD MESS8GE - DESCBIEIIQM /

8 20 1,2 FILAMENT POWER SUPPLY FAIL ERROR 1\
(mA/mAs PCB, IC7 pin 20 low, -FIL SUP FAIL)
Exposure terminated by failure of the filament power supply.

9 21 1,2 FILAMENT OVERLOAD ERROR

(mA/mAs PCB, IC7 pin 18 low, -FIL OVLD)
Exposure terminated by 5 consecutive (5ms) filament overload conditions,
actual filament current exceeds filament max (D/A IC10 pin 2). Filament
max set to 110% for filament feedback control and 120% for mA feedback
control.

10 22 1,2 BACK-UP mAs LIMIT

(mA/mAs PCB, IC11 Timer)
AEC Exposure terminated by mAs timer.

11 23 1,2 EXPOSURE STOP ERROR

(RPU ~P PCB, U6-9 high, EXPSTOP)
Exposure terminated by -EXPSTOP signal, but SOURCE UNKNOWN (no
AEC stop, no mAs stop, no ~P EXPSTOP). Probable cause, exposure
watchdog time out (RPU ~P PCB, U18A-4 high) or component failure.

12 24 1,2 EXPOSURE TIME LIMIT ERROR

(RPU software timer)
Exposure terminated by a back-up time limit based on 120% of the expected
time for mAs exposure termination.

13 25 1,2 RPU HARDWARE FAULT

(mA/mAs PCB 82551C7, kV PCB 8255 IC5)
(
Exposure terminated by mA/mAs PCB 8255 or kV PCB 8255 becoming
corrupt. Probable cause, electrical noise caused by faulty tube or loose HV
cable connections.

14 26 1,2 kV UNBALANCE ERROR

Exposure terminated by a kV unbalance between cathode and anode of
greater than 6 kVp. Check cables and tube.

15 N/A 1 RPU FLAGS NOT RECEIVED

Proper exposure not confirmed by the RPU. Probable cause, RPU
shutdown during exposure.

16 30 2 X-RAY CONTROL SIGNAL ERROR

(RPU ~P PCB, U22-32 X - RAY)
-XRAY control signal failed to toggle high-low-high at the start of the prep
sequence.

17 31 2 -ROTOR CONTROL SIGNAL ERROR

(RPU ~P PCB, U22-33 ROTOR)
-ROTOR control signal failed to toggle high-low-high at the start of the prep
sequence.

18 32 2 FLAG NOT ASSIGNED

19 33 2 FILAMENT POWER SUPPLY FAILED

(mA/mAs PCB, IC7 pin 20 low; -FIL SUP FAIL)
Filament power supply failure detected during prep.
C
9847 7-2 TROUBLESHOOTING

-- ----" -- -----
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( OC REU NOTES I CD MESSAGE - DESCRIPTION

20 34 2 FILAMENT OVERLOAD ERROR

(mAimAs PCB, IC7 pin 18 low, -FIL OVLD)
Actual filament current exceeded filament maximum (D/A IC10 pin 2) for
5ms. Filament maximum set to 110% of the desired filament current.

21 35 2 FILAMENT LOW ERROR

(mAimAs PCB, AID IC10 pin 27, mAiFIL FB SAMPLE)
Actual filament current below filament minimum for 5ms.

22 36 2 HS ROTOR READY SIGNAL ERROR (ver 1.0.4)

(Field 1/0 PCB, IC8 pin 15, -HS ROTOR READY)
Flag set by 1 of 3 possible errors:
1. -HS ROTOR READY signal active (low) before start of PREP
sequence
2. No -HS ROTOR READY signal (low) received within 7 seconds
after start of PREP sequence
3. -HS ROTOR READY signal becomes inactive during PREP.

23 37 2 HS VERIFY SIGNAL ERROR (ver 1.0.4)

(Field 1/0 PCB, IC8 pin 17, -HS VERIFY)
Flag set by 1 of 2 possible errors:
1. -HS VERIFY signal active (low) before start of prep sequence.
2. HIGH speed selected but not verified (-HS VERIFY signal not active

C (low».
NOTE: The flag is disabled by jumper E107.

24 40 2 ROTOR BOOST ERROR

(Field 1/0 PCB, IC10 pin 4 and 6, -STATOR MAIN CURRENT DETECT and
-STATOR PHASE CURRENT DETECT)
Flag set if stator main or phase current not detected during rotor boost. Flag
disabled by jumper E107.

25 41 2 ROTOR RUN ERROR

(Field 1/0 PCB, IC10 pin 4 and 6, -STATOR MAIN CURRENT DETECT and
-STATOR PHASE CURRENT DETECT)
Flag set if stator main of phase current not detected during rotor run mode.
Flag disabled by jumper E107.

26 42 2 ROTOR ON TIME EXCEEDED

(Software timer)
Flag set if maximum rotor run time of 30 seconds is exceeded.

27 43 2 mAs COUNTER FAILED TO PROGRAM

(mAimAs PCB, IC11 counterltimer)
Counter programmed and mode checked at power up and before the start
of an exposure. Flag disabled at power up by jumper EO on the RPU ~P
PCB.

28 44 2 AEC BOARD failed to program

(AEC PCB, IC6 PPI)
( Flag set if AEC or APR mode selected and AEC PCB PPI IC failed to
program at power up. Flag checked before start of prep sequence.

TROUBLESHOOTING 7-3 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

29 45 2 . AEC COUNTER failed to program

(AEC PCB, IC9 COUNTERfTIMER)
(
Flag set if AEC or APR mode selected and AEC PCB counter modes (IC9)
failed to program. Checked at power up and at start of prep sequence.

30 46 2 Selected BUCKY did not respond

(Field I/O PCB, IC10 pin 2 high, -BUCKY READY)
Selected bucky failed to respond (-BUCKY READY low) within 5 seconds
after being selected.

31 47 2 ION CHAMBER selected is not installed

(AEC PCB, IC7, CH RST 17 - 67)
Selected chamber not present (CH RST x7 signal low)

32 50 2 kVp COMMUTATION FAIL HARDWARE ERROR

(kV PCB, IC5 pin 4 low, -kV COMM FAIL)
Unable to clear kV commutation fail latch. Checked before start of exposure
sequence.

33 51 2 kVp HIGH HARDWARE ERROR

(kV PCB, IC5 pin 2 low, -kV HIGH)
-kV HIGH signal active (low) before start of the exposure sequence.

34 52 2 mA OVERLOAD HARDWARE ERROR

(mA/mAs PCB, IC7 pin 19 low, -mA OVLD)
-mA OVLD signal active (lOW) before the start of the prep sequence.

35 53 2 FILAMENT OVERLOAD HARDWARE ERROR

(mA/mAs PCB, IC7 pin 18 low, -mAs STOP)
(
-FIL OVLD signal active (low) before the start of the prep sequence.

36 54 2 mAs STOP HARDWARE ERROR

(mA/mAs PCB, IC7 pin 18 low, -mAs STOP)
-mAs STOP signal active (low) before the start of the prep sequence.

37 55 2 FLAG NOT ASSIGNED

38 56 2 FLAG NOT ASSIGNED

39 57 2 FLAG NOT ASSIGNED

40 60 3 UP BOARD 8255 failed to program

(RPU UP PCB, PPI 8255)
Error detected in the 8255 at power up. Error check disabled by jumpering
pin 26 of IC9 (muart p25) to ground.

41 61 3 mA BOARD 8255 failed to program

(mA/mAs PCB, PPI IC7)
Error detected in the 8255 at power up. Error check disabled by installing
jumper EO on the RPU UP PCB.

42 62 3 kVp BOARD 8255 failed to program

(kVp PCB, PPI IC5)
Error detected in the 8255 at power up. Error check disabled by installing
jumper E1 on the RPU UP PCB. l
9847 7-4 TROUBLESHOOTING
 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

OC B.E.U ~QIES I CD MESSAGE - DESCRIPIION

43 63 3 RPU HARDWARE error, turn OFF to clear
(mA/mAs PCB 82551C7, kV PCB 82551C5)
Flag set by two possible errors:
1. mA/mAs PCB 8255 or kV PCB 8255 becomes corrupt during
exposures. See system flag #13.
2. mA/mAs PCB 8255 becomes corrupt during prep sequence.

44 64 N/A FLAG NOT ASSIGNED

45 65 4 FLAG NOT ASSIGNED

46 66 4 FLAG NOT ASSIGNED

47 67 4 FLAG NOT ASSIGNED

48 70 5 RPU RECEIVER CHECKSUM ERROR

(RPU UP PCB, 8256 IC9, RS232 port)
Calculated checksum of data received does not match checksum number
received.

49 71 5 RPU RECEIVER DATA ERROR

(RPU UP PCB, 8256 IC9, RS232 port)
Framing, overflow, or parity error detected.

50 72 5 RPU - ILLEGAL ROUTINE RECEIVED

(RPU UP PCB, 8256 IC9, RS232 port)
C Routine number received from OC does not exist in RPU software.

51 73 5,6 COLLIMATOR NOT READY

(Field I/O PCB, IC8 pin 13 high, -COLL HOLD)
Collimator ready signal not present (low).

52 74 N/A kVp FEEDBACK SIGNAL ERROR

(kV PCB, IC5 pin 3 high, -FB INTERLOCK)
-FB INTERLOCK signal from kV feedback cable not present (low).

53 75 5,6 SURGE RELAY NOT ENERGIZED

(Field I/O PCB, IC9 pin 17, -INV SUPPLY ON, IC20 pin 4, -INV SUPPLY
ON)
-INV SUPPLY ON signal high, therefore surge contactor de-energized, -
SURGE CONTACTOR signal high.
NOTE: Surge contactor energized 2.5s after the switch is turned ON.

54 76 5,6 FILAMENT POWER SUPPLY ERROR

(mAlmAs PCB, IC7 pin 20 low, -FIL SUP FAIL)
Filament power supply failure, -FIL SUP FAIL signal low.

55 77 N/A FLAG NOT ASSIGNED

56 80 5,6 SELECTED TUBE NOT VERIFIED (ver 1.0.5)

(Field 110 PCB, IC9 pin 2 high, -TUBE SEL VERIFY)
Tube selected(IC5 pin 19 low, -TUBE SELECT) not verified by -TUBE SEL
( VERIFY signal.

TROUBLESHOOTING 7-5 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

DC
57
HEll
81
!'lQlES
5,6
LCD MESS8GE - DESC81~lIQ!'l
TOMO INTERLOCK HOLD
(
(Field 1/0 PCB, IC9 pin 4 high, -TOMO INTERLOCK)
Checked at start of prep sequence. TOMO mode selected but TOMO is not
ready (-TOMO INTERLOCK signal high).

58 82 5,6 TABLE INTERLOCK HOLD

(Field 1/0 PCB, IC9 pin 6 high, -TABLE INTERLOCK)
Checked at the start of the prep sequence. Table selected but not in
position (-TABLE INTERLOCK signal high)

59 83 5,6 DOOR #1 INTERLOCK HOLD

(Field 1/0 PCB, IC9 pin 8 high, -DOOR #1 INTERLOCK)
Door #1 open (-DOOR #1 INTERLOCK signal high). Interlock continuously
monitored except during an exposure.

60 84 5,6 DOOR #2 INTERLOCK HOLD

(Field 1/0 PCB, IC9 pin 11 high, -DOOR #2 INTERLOCK)
Door #2 open (-DOOR #2 INTERLOCK signal high). Interlock continuously
monitored except during an exposure.

61 85 5,6 AUX INTERLOCK HOLD

(Field 110 PCB, IC9 pin 13 high, -AUX INTERLOCK)
Similar to DOOR #1 INTERLOCK HOLD, system flag #59.

62 86 5,6 TUBE HOT

(Field 1/0 PCB, IC9 pin 15 high, TUBE HOT)
Similar to DOOR #1 INTERLOCK HOLD, system flag #59. X-ray tube has
opened.
(
63 87 N/A OC UP LINK NOT ESTABLISHED
(RPU software flag)
Flag set at power up and cleared when OC request RPU to send its
software version number.

64 N/A 7 RPU RECEIVER NOT READY

(OC jJP PCB, IC18 pin 39 high, -CTS)
RPU not ready to receive data from OC. Checked before start of prep
sequence.

65 N/A 7 RPU DID NOT RESPOND

(OC jJP PCB, IC18 RS232)
RPU did not respond that data was received from the OC via RS232 to the
start of the PREP sequence.

66 N/A 7 -PREP CONTROL SIGNAL ERROR

(OC jJP PCB, IC18 pin 37, -PREP)
-PREP control signal failed to toggle at the start of the prep sequence.

67 N/A 7 -EXPOSE CONTROL SIGNAL ERROR

(OC jJP PCB, IC18 pin 38, -EXP)
-EXP control signal failed to toggle at the start of the prep sequence.

68 NIA 7 RPU FLAGS NOT RECEIVED

(OC jJP PCB, IC18 RS232)
Flag set if RPU failed to send (via RS232). Flag set at the end of the prep
l
sequence.

9847 7-6 TROUBLESHOOTING

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

(, OC REU NOTES I CD MESSAGE - DESCRIPTION

69 N/A 7 FLAG NOT ASSIGNED
70 N/A 7 FLAG NOT ASSIGNED
71 N/A 7 FLAG NOT ASSIGNED

72 N/A 7 NO EXAM SELECTED

OC in either the APR or CEC mode with no exam LCD selected. Flag
cleared when exam is selected.

73 N/A 7 FLAG NOT ASSIGNED

74 N/A 7 FLAG NOT ASSIGNED
75 N/A 7 FLAG NOT ASSIGNED
76 N/A 7 FLAG NOT ASSIGNED
77 N/A 7 FLAG NOT ASSIGNED
78 N/A 7 FLAG NOT ASSIGNED

79 N/A 7 FLAG NOT ASSIGNED

80 N/A N/A SELECTED mAslTime EXCEEDS rnA LIMITS

81 N/A N/A SELECTED rnA 'TIME EXCEEDS mAs LIMIT

Flag cleared by decreasing mA or TIME to bring mAs to 900 or less.

82 N/A N/A FACTORS WILL EXCEED MAX TUBE POWER

Flag cleared by reducing power: kV, mAs, or mA'Time, below maximum.

( 83 N/A N/A SELECTED rnA ' kVp EXCEEDS GEN LIMIT

Maximum kilowatt rating of TM exceeded. Flag cleared by reducing mA
times kVp below maximum rating.

84 N/A N/A FACTORS WILL EXCEED TUBE HEAT LIMIT

Flag cleared by reducing tube power or by allowing tube to cool.

85 N/A N/A SEL kVp & rnA EXCEEDS FILAMENT LIMIT

Maximum allowed filament current would be exceeded if prep sequence is
allowed. Flag cleared by increasing kV or decreasing mA.

86 N/A N/A SELECTED FACTORS EXCEEDS AEC LIMITS

The required AEC trip value exceeds the maximum. Trip value flag cleared
by increasing kV or decreasing size selected.

87 N/A N/A FRONT PANEL EXPOSURE NOT ALLOWED

(OC ~P PCB, E4 installed to enable)
Default flag.

88 N/A N/A FLAG NOT ASSIGNED

89 N/A N/A FLAG NOT ASSIGNED

90 N/A N/A AUTO STEPS WILL EXCEED FULCRUM LIMIT

91 N/A 3 X-RAY SWITCH ACTIVE AT POWER UP

(OC switch PCB, IC4 pin 13 low, X-RAY SWITCH)
(, X-ray switch checked at power up and found to be active (low).

TROUBLESHOOTING 7-7 9847

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

Q.C BeU (',IQIES I Cp MESSAGE - PESCRIPIIQ(',I (

92 N/A 3 PREP SWITCH ACTIVE AT POWER UP
(OC switch PCB, IC4 pin 13 low, X-RAY SWITCH)
Prep switch checked at power up and found to be active (low).

93 N/A 3 REMOTE EXPOSURE SW ACTIVE AT POWER UP

(OC IlP PCB, IC11 pins 16 or 17, REMOTE ROTOR or X-RAY)
Remote exposure switch checked at power up and found to be active.

94 N/A 5 RPU TO OC SOFTWARE VERSION MISMATCH

RPU version must match OC version to assure compatibility.

95 N/A N/A RPU LINK UP NOT ESTABLISHED

Flag set at power up and cleared when RPU sends its version number to the
OC.

96 N/A N/A RPU HAS NOT ACKNOWLEDGED TUBE SELECTED

Flag set at power up or when tube selected (TUBE switch) and cleared
when RPU verifies the tube selected by the OC.

100 TOMO LINK NOT ESTABLISHED

101 TOMO AND TM SIW INCOMPATIBLE

102 TOMO DID NOT RESPOND

103 DATA MISMATCH BETWEEN TOMO AND TM (

110 TOMO NOT READY

7.2 AEC TROUBLESHOOTING

The following sections will aid in the troubleshooting of problems encountered during calibration of the optional
AEC capability of the TM series generators.

7.2.1 ION CHAMBER PRESET AND INSTALLATION (AID ION CHAMBER)

All information is applicable to AID Pre-Amp PCB 60917. The three ion chamber integrator amps and the ion
chamber master gain amp are preset at the factory. The chamber offset potentiometers have been set at the
factory and should NOT be adjusted. Use TABLE 7-1 to set the chamber amplifiers to a centered starting
point if problems are encountered during calibration.

a. Set each of the three field gain potentiometers for mid-range.

b. Set the master gain for mid-range.

Field 1 Gain: R25 - set for 10KO

Field 2 Gain: R15 - set for 10Ka
Field 3 Gain: R32 - set for 1OKa
Master Gain: R12 - selfor 10KO
Field 1 Offset: R29 - factory set
Field 2 Offset: R20 - factory set
Field 3 Offset: R37 - factory set

TABLE 7-1 AEC POTENTIOMETER SETTINGS

9847 7-8 TROUBLESHOOTING

 TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( 7.2.2 CHAMBER AMPLIFIERS AND FILM/SCREEN AMPLIFIER UNITY GAIN CHECK

This step is performed at the factory as part of the AEC Interface PCB test procedure and should be
rechecked by the installer if calibration problems are encountered. It is only necessary to check the actual
chambers and film/screens which will be used for the particular installation.
1. Ensure that the OC and RPU power is tumed OFF. Place the AEC Interface PCB on the extender
card.
2. Check the resistance values per TABLES 7-2 and 7·3.

MEASIJRE ADJUST READING CHAMBER

TP1 to TP10 R18 20Kn 1
TP2 to TP11 R20 20Kn 2
TP3 to TP12 R22 20Kn 3
TP4to TP13 R24 20Kn 4
TP5to TP14 R26 20KO 5
TP6 to TP15 R28 20KO 6
TABLE 7·2 CHAMBER AMP UNITY GAIN ADJUST

MEASIJRE ADJlJST READING CHAMBER

IC19-1 to IC20-6 R31 10Kn 1
IC19·1 to IC20·11 R32 10Kn 2
IC19·1 to IC20·14 R33 10KO 3

TABLE 7·3 FILM/SCREEN UNITY GAIN ADJUST

3. Turn power OFF and replace the AEC Interface PCB.

TROUBLESHOOTING 7·9 9847

TM X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

(
THIS PAGE INTENTIONALLY LEFT BLANK

9847 7-10 TROUBLESHOOTING

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

SECTION 8 • ELECTRICAL INFORMATION

(, RAD FIELD 1/0 (6584.262.01)
TABLE 8-1 RAD FIELD 1/0 PCB (6584.262.01) TERMINAL BLOCK CONNECTIONS

TB SIGNAL DESCRIPTION

TB1·1 PREP READY Used with the Infimed fluoroscopic computer. TB1-5 provides +24VDC
and is connected with TB1-1 to J9 of the InfimedlTM/CXT table
interface PCB.

TB2-1 & 2 TUBE SELECT Used only with multiple tube operation. For single tube operation,
VERIFY there IllllSt be a jumper between TB2-1 and TB2-2.

TB2-3 &4 M4COIL Contactor Damping Resistor: Connect TB2-3 and TB2-4 connected to
the coil of the contactor located on the back of the power supply fuse
panel.

TB2-5 & 6 ROOM This is a 117VAC, 25W, source that is active when the control is ON.
INDICATOR It is to be wired to a "ROOM IN USE" indicator.

TB2-7 & 8 TABLE Inhibits an exposure if an elevating table is not in its fullest UP position.
INTERLOCK If no interlocks are used, jumpers must be in place.

TB2-9 & TOMO Inhibits an exposure if an elevating table is not in its fullest UP position.
10 INTERLOCK If no interlocks are used, jumpers must be in place.

TB2-11 & AUX Inhibits an exposure if an elevating table is not in its fullest UP position.
12 INTERLOCK If no interlocks are used, jumpers must be in place.

( TB2-13 & DOOR #1 Access door switch activated interlock. This function will prevent an
exposure start if a door is open, but will ~ stop an exposure if a
14 INTERLOCK
door is opened during the exposure. If the function is not used,
jumpers IllllSt be in place.

TB2-15 & DOOR#2 Access door switch activated interlock. This function will prevent an
16 INTERLOCK exposure start if a door is open, but will ~ stop an exposure if a
door is opened during the exposure. If the function is not used,
jumpers mus.t be in place.

TB2-17' +15V Collimator connection - TS4-20

TB2-18 C = 00 Collimator connection - TS3-5

TB2-19 C = +90 0 Collimator connection - TS3-6

TB2-20 C = _90 0 Collimator connection - TS3-7

TB2-21 SID =40" Collimator connection - TS4-14

TB2-22 SID = 72" Collimator connection - TS4-9

TB2-23' COLL. HOLD Collimator connection - TS3-13

TB3-1 AUXBUCKY Liebel/Flarsheim' :GND

Midwest :GND

TB3-2 Liebel/Flarsheim' :B1

Midwest :B2

ELECTRICAL INFORMATION 8-1 9890

TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

TABLE 8-1 RAD FIELD I/O PCB (6584.262.01) TERMINAL BLOCK CONNECTIONS
(
TB SIGNAL DESCRIPTION

TB3-3 AUX BUCKY LiebeliFIarsheim 2 :B2-3

Midwest :B1

TB3-4 LiebeliFIarsheim 2 :B4

Midwest :B4

TB3-5 LiebeliFIarsheim2 :B8

Midwest :B3

TB3-6 Wall Bucky Liebei/FIarsheim2 :GND

Midwest :GND

TB3-7 Liebei/FIarsheim2 :B1

Midwest :B2

TB3-8 Liebei/FIarsheim2 :B2-3

Midwest :B1

TB3-9 Liebei/FIarsheim2 :B4

Midwest :B4

TB3-10 Liebei/FIarsheim 2 :B8

Midwest :B3

TB3-11 Table Bucky LiebeliFIarsheim2 :GND

Midwest
2
:GND
C'
TB3-12 Liebei/FIarsheim :B1
Midwest :B2

TB3-13 Liebei/FIarsheim2 :B2-3

Midwest :B1

TB3-14 Liebei/FIarsheim2 :B4

Midwest :B4

TB3-15 LiebeliFIarsheim 2 :B8

Midwest :B3

TB4-1 Ground Stator (green wire)

TB4-2 Thermal Switch Stator (brown wire)

TB4-3 Thermal Switch Stator (blue wire)

TB4-4 Stator Common Stator (white wire)

TB4-5 Stator Phase Stator (red wire)

TB4-6 Stator Main Stator (black wire)

1. When an automatic or semi-automatic collimator IS used, the exposure hold function must be wired
into the control, TB2-17 and TB2-23. All other connections are optional.
2. When installing a liebellflarsheim 8000 or 9000 series bucky, make sure that a provided 6kw, 3w
·resistor is installed across b2 and b4. This can be added at the i/o terminal strip for the appropriate
bucky.

9890 8-2 ELECTRICAL INFORMATION

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

( I TABLE 8·2 RAD FIELD I/O PCB (6584.262.01) JUMPER OPERATIONAL POSITIONS I
JUMPER POSITION FUNCTION DESCRIPTION

TS1 IN TUBE 1 SELECT Install to enable field 1/0 PCB to function as

tube 1 control and miscellaneous system 1/0
control.

TS2 OUT TUBE 2 SELECT Install to enable field 1/0 PCB to function as
tube 2 control.

TS3 OUT TUBE 3 SELECT Same as TS2 but for tube 3. System flags:
Field 1/0 PCB #1 select error (#(65), 45), Field
I/O PCB #2 select error (#(66), 46), Field 1/0
PCB #3 select error (#(67), 47).

TABLE 8·3 RAD FIELD I/O PCB (6584.262.01) LEDs

LED FUNCTION DESCRIPTION

L1 X·RAY TUBE FOCAL SPOT ON - small focus selected, OFF larQe focus selected.

L2 TABLE BUCKY ON • table bucky selected.

L3 WALL BUCKY ON - wall bucky selected.

L4 AUXBUCKY ON - aux bucky selected.

L5 ROOMAIND ON - this room (1, 2, 3) is selected.

L6 RD CONTACTOR ON - resistor-dampinQ (RD) contactor selected

( L7 TUBE SELECT ON - this tube (1, 2, 3) is selected.

L8 ROTOR ON ON - power applied to the tube rotor.

L9 BOOSTIRUN ON - boost voltages (220VAC), OFF - run voltage (40VAC).

L10 STATOR MAIN ON - stator main current detected.

L11 STATOR PHASE ON - stator phase current detected.

8.2 RPU MICROPROCESSOR PCB (6284.262.02)

I TABLE 8-4 RPU MICROPROCESSOR PCB (6284.262.02) SWITCH SETTINGS I

SWITCH POSITION FUNCTION DESCRIPTION

SW1 NIA RESET This momentary switch resets the PCB.

SW2 NIA TEST This momentary switch initializes the PCB

self-test.

SW3-1 OPEN mA/mAs CONTROL Enables check of mA/mAs board 8255

CHECK (system flag (61),41) and 8254 mAs counter
(system flag (43), 27) at power ON.

SW3-2 OPEN kV CONTROL CHECK Enables check of kV board 8255 (system

flaQ (62), 42) at power ON.

( SW3-8 OPEN STACK AREA Enables check of program and data stacks
(system flaQ (10),:) at power ON.

ELECTRICAL INFORMATION 8-3 9890

TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

TABLE 8-4 RPU MICROPROCESSOR PCB 6284.262.02) SWITCH SETTINGS

(
SWITCH POSITION FUNCTION DESCRIPTION
SW4-7 See Selectable Spotfilm 1=open, O=closed
SW4-8 Description preheat boost time 81 Iirne
00 1750ms with 875ms boost
01 1250ms with 625ms boost
10 1500ms with 750ms boost
11 1OOOms with 500ms boost
NOTE: The follOWing sWitches are not used. SW3-3 thru 7 & SW4-1 thru 6.

TABLE 8-5 RPU MICROPROCESSOR PCB (6284.262.02) JUMPER SETTING

JUMPER POSITION FUNCTION DESCRIPTION

PF OUT Power Fail IN: Enables Power Fail check, used in factory
test only.
OUT: Normal operation

I TABLE 8-6 RPU MICROPROCESSOR PCB (6284.262.02) LEOs I

LED FUNCTION DESCRIPTION

L1 RUN DIM: proper operation of the 1ms interrupt routine is

indicated. (
L2-L4 ERROR CODE, LOW BYTE See table below.

L5 CODE IDENTIFIER BLiNKING:Normal operation

STEADY ON:software fault, read L2-L4 (see TABLE 8-6)
OFF:hardware fault, read L2-L4 (see TABLE 8-6)

L6-L9 ERROR CODE, HIGH BYTE High by1e for use in SECTION 7.2, with L2-L4 (see below)
ERROR L4 L3 L2 DESCRIPTION
#

0 OFF OFF OFF NOT USED (invalid error #)

l' OFF OFF ON PROM checksum error (replace EPROM chip IC19).

2' OFF ON OFF RAM test error (replace RAM chipIC16).

3 OFF ON ON Power fail detected (if error occurs often, contact the factory).

4 ON OFF OFF Memory access error (if error occurs often, contact the factory).

5 ON OFF ON Program error (if error occurs often, contact the factory).

6' ON ON OFF Muart test error (replace 8256 chip_IC9).

7 ON ON ON Watchdog time out (lC20 pin 4).
Example: the pattern L9 L8 L7 L6 L5 L4 L3 L2
ON OFF OFF OFF BLINKING ON OFF OFF
yields error code 84 (binary 10000100). This can be looked up in SECTION 7.2.
, = only at power up

9890 8-4 ELECTRICAL INFORMATION

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

1/0 CONTROL PCB 16284.262.051

I TABLE 8-7 1/0 CONTROL PCB (6284.262.05) I

LED FUNCTION DESCRIPTION

L1 BDON 1/0 CONTROL BOARD ON

L2 TUBE 1 TUBE 1 SELECTED

L3 TUBE 2 TUBE 2 SELECTED

L4 TUBE 3 TUBE 3 SELECTED

L5 C SELECT SERIES RESONANCE CAPACITOR SELECTED

NOTE: L6 and L7 currently are not used.

I TABLE 8-8 1/0 CONTROL PCB (6294.262.05) SWITCH OPERATIONAL POSITIONS I

SWITCH POSITION FUNCTION DESCRIPTION

SW1-1 CLOSED FIELD 1/0 CHECK Enable check for proper switch settings on the
field 110 PCB selected by the OC (ver 1.0.5):
1. Field 1/0 PCB #1 select error (system flag
#(65),45).
2. Field 1/0 PCB #2 select error (system flag
#(66),46).
3. Field 1/0 PCB #3 select error (system flag
( #(67), 47),

SW1-8 CLOSED ROTOR CHECK Enable the following rotor checks:

1. TM ROTOR CONTROL:
a. Rotor boost error (system flag
#(40),24).
b. Rotor run error (system flag
#(41), 25).
2. HIGH SPEED ROTOR CONTROL: HS
VERIFY siqnal error (system f1aa #(37), 231.
NOTE: The follOWing sWitches are presently not used: SW1-2 thru SW1-7.

8.4 mA/mAs CONTROL PCB (6284.262.061

TABLE 8-9 rnA/mAs CONTROL PCB (6284.262.061 LEOs

LED FUNCTION DESCRIPTION

L1 mAFB mA feedback is selected if illuminated.

L2 FILAMENT ON Filament is ON if illuminated.

L3 BOARD ON mA/mAs PCB is Dowered up if illuminated.

ELECTRICAL INFORMATION 8-5 9890

TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

TABLE 8-10 rnA/mAs CONTROL PCB (6284.262.06) JUMPER POSITIONS (""

JUMPER NORMAL SIMULATED NO FUNCTION DESCRIPTION
EXPOSURE LOAD
TEST

EMAO OUT IN IN NDSAMPLE Enables:

a. mNFiI ND (AD 7669) sampling (upwait line).
b. Check for filament low (system flag #(35, 21).
c. Check for rnA low (system flaq #(17l. 07).

EMA1,2 See See See rnA Used to compensate for long high voltage cables.
descrip- description descri FEEDBACK Time to rnA feedback (EMA1, EMA2):
tion ption DELAY EMA2 EMA1 TIME IE~GII::::I
OUT OUT 3ms Up to 35'
OUT IN 5ms 35' - 45'
IN OUT 7ms 45' - 55'
IN IN 10ms 55' and up

EMA3 IN OUT OUT FILAMENT Filament power supply check:

POWER 1. During an exposure (system flag #(20), 08).
SUPPLY 2. During filament ON (system flag #(33), 19).
FAIL 3. During system monitor check (system flag #(76),
54).

EMA4 IN IN IN rnA rnA overload hardware check:

OVERLOAD 1. During an exposure (system flag #(16), 06).
2. During an hardware system check (system flag
#(52),34).

EMA5 IN IN IN FILAMENT Filament overload check:

OVERLOAD 1. During an exposure (system flag #(21), 09).
2. While filament is ON (system flag #(34),20).
3. During hardware system check (system #(53),
35). (
EMA6 IN IN IN HARDWARE Sets up 10V FS, mNFiI DIA reference. Standard
FUNCTION operation.

EMA7 OUT OUT OUT HARDWARE Sets up 5V full scale, mNFiI D/A reference.
FUNCTION Installed for factory test ONLY.

ZZ1 IN IN IN AnalClf!::Digital ground

9890 8-6 ELECTRICAL INFORMATION

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

kV CONTROL PCB (6284.262.10)

I TABLE 8-11 kV CONTROL PCB (6284.262.10) JUMPER OPERATIONAL POSITIONS I

JUMPER NORMAL SIMULATE NO LOAD FUNCTION DESCRIPTION
POSITION D TEST
EXPOSURE

EKVO IN OUT IN kV kVp commutation fail hardware check:

COMMUTATI 1. During an exposure (system flag #(13). 03).
ON 2. During hardware system check (system flag
FAIL #(50).32).

EKV1 OUT OUT OUT FEEDBACK Enables kV feedback cable (system flag #(74),
CABLE 52), during system monitor check.
INTERLOCK

EKV2 IN IN IN kVHIGH kVp high hardware check:

1. During an exposure (system flag #(14),04).
2. During hardware system check (system flag
#(51), 33),

EKV3 IN OUT IN kVLOW ~nables kVp LOW check during an exposure

system flag #(15), 05). kVp LOW error.

EKV8 OUT X IN SLOWkVp No load kVp test

(don't care) RAMP

EKV9 IN OUT IN kVCOMM Special for hardware tests.

FAIL

EKV10 OUT OUT OUT Slow Fluoro TEST ONLY

kVRamp-Up

( EKV11 Pulse
Fluoro:
X
(don't care)
X
(don't care)
Gate Pulse
Counter
IN: Pulse f1uoro only. Enables the gate
pulse counter to end each f1uoro
IN pulse to prevent flicker.
Continuous OUT: Continuous f1uoro. Allows the
Fluoro: microprocessor (on RPU
OUT microprocessor PCS) to end each
RAD f1uoro pulse.
Controls:
OUT
NOTE. The following Jumpers are presently not used. EKV4, EKV5, EKV6, EKV7.

TABLE 8-12 kV CONTROL PCB (6284.262.10) LEOs

LED FUNCTiON DESCRIPTION

L3 BOARD ON The kV PCB is powered up if illuminated.

L2 SURGE The surge relay is energized if illuminated.

L1 kVON kV is ON (exposinq) if illuminated.

c
ELECTRICAL INFORMATION 8-7 9890
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

8.6 AEC INTERFACE PCB (6284.262.04)

(
I TABLE 8-13 AEC INTERFACE PCB (6284.262.04) JUMPER OPERATIONAL POSITIONS I
JUMPER POSITION FUNCTION DESCRIPTION

E1-0 IN CHAMBER 1 Check for the presence of Chamber 1 (system

PRESENT CHECK fiaQ #(47),31).

E1-1 IN CHAMBER 2 Same as E1-0 but for chamber 2.

PRESENT CHECK

E1-2 IN CHAMBER 3 Same as E1-0 but for chamber 3.

PRESENT CHECK

E1-3 IN CHAMBER 4 Same as E1-0 but for chamber 4.

PRESENT CHECK

E1-4 IN CHAMBER 5 Same as E1-0 but for chamber 5.

PRESENT CHECK

E1-5 IN CHAMBER 6 Same as E1-0 but for chamber 6.

PRESENT CHECK

E2 - E7 IN CHAMBER 1-6 Must be installed for normal operation of the

chamber. If chamber not used, remove
jumper.

E8 IN V/F GNDs MUST BE INSTALLED

NOTE: The following Jumpers are presently not used: E1-6, E1-7.
(
TABLE 8-14 AEC INTERFACE PCB (6284.262.04) LEOs
LED FUNCTION DESCRIPTION

L1 FIELD 1 ON indicates field selected, OFF state is with all fields

L2 FIELD 2 selected, front panel fields selected at PREP, front
L3 FIELD 3 panel LEOs match PCB LEOs when right hand
chamber is selected.

L4 ION CHAMBER SELECT 1 CHAMBER SELECT CODE:

L5 ION CHAMBER SELECT 2 L6 L5 L4 SEI ECTION
L6 ION CHAMBER SELECT 3 ON ON ON #1
ON ON OFF #2
ON OFF ON #3
ON OFF OFF #4
OFF ON ON #5
OFF ON OFF #6
OFF OFF ON V/F CAL
OFF OFF OFF NONE

L7 FILM/SCREEN 1 Illumination indicates selected film/screen.

L8 FILM/SCREEN 2
L9 FILM/SCREEN 3

9890 8-8 ELECTRICAL INFORMATION

- - -... - - -
- - - ---------
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

OC MICROPROCESSOR PCB (6484.262.03)

(
TABLE 8-15 OC MICROPROCESSOR PCB (6484.262.03) LED ERROR CODES

ERROR DS4 DS3 DS2 DESCRIPTION

NO.

0 OFF OFF OFF NOT USED (invalid error #1)

l' OFF OFF ON Prom checksum error (reolace EPROM chip U5)

2' OFF ON OFF RAM test error (reolace RAM chiD U4)

3 OFF ON ON Power fail detected (if error occurs often, contact the factory).
4 ON OFF OFF Memorv access error (if error occurs often, contact the factory).

5 ON OFF ON ProQram error (if error occurs often, contact the factory).

6' ON ON OFF Muart test error (replace 8256 chip IC18).

7 ON ON ON NOT USED
• =only at power up.
DS5 flashing indicates the TM OC is functioning properly and DS2 - DS4 indicate which program routine is
running. If one of the errors listed above is detected, the front panel is blanked, DS5 is turned OFF and the
error # indicated by DS2 - DS4.

TABLE 8-16 OC MICROPROCESSOR PCB (6484.262.03) OPERATIONAL SWITCH SETTINGS

SWITCH POSITION FUNCTION DESCRIPTION

SW3-1 DOWN DEMONSTRATION Permits the OC to function without being

connected to the RPU. Checked at Power
UP.

SW3-4 DOWN SINGLE SOURCE Disables exposure initiation EXPOSURE

from front panel. Used with remote
exposure switch.

SW3-5 N/A TEC Enable UP: TEC not configured in

system
DOWN: TEC option present
SW3-8 DOWN CALIBRATION Places system into the calibration/test
mode. Checked at Power UP .
.
SW4-6 DOWN TOMO OPERATION Enables Torno Mode.

SW4-7 DOWN 125 kVo LIMIT Limits kVo to 125 kVp

SW4-8 N/A RESERVED Factorv setup
NOTE: The follOWing sWitches are presently not used: SW3-2, SW3-3, SW3-6, SW3-7, SW4-1, SW4-2, SW4-
3, SW4-4, SW4-5.

ELECTRICAL INFORMATION 8-9 9890

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

S.S POWER PROTECTION COMPONENTS

TABLE S-17 POWER DISTRIBUTION/PROTECTION COMPONENTS

(
SWITCH/CB POSITION FUNCTION LOCATION (FIGURE 2-5)

CB1 ON ROTOR BOOST CARD CAGE

CB2 ON ROTOR RUN CARD CAGE

CB3 ON FILAMENTPS CARD CAGE

SW1 IN 24 HR PWR SUPPLY FUSE BOX, POWER SUPPLY

F1 IN FILAMENT DRIVE 1A, 250V FUSE

LVPS

F2 IN RlOC 24V SUPPLY 3A, 250V FUSE

F3 IN RPU 117VAC SUPPLY 3A, 250V FUSE

F4 IN T1 PRIMARY SA, 250V FUSE

F5 IN T1 PRIMARY SA, 250V FUSE

F6 IN 24 HR PS 1A, 250V FUSE

F7 IN 24 HRPS 15A, 250V FUSE

F8 IN 24 HR PS 15A, 250V FUSE

F9 IN SEMICONDUCTOR
FUSE
TM30 - 200A, 600V
TM40 - 200A, 600V (
F10 IN LINE IN, FUSE TM30 - 100A, 600V
TM40 - 60A, 600V

F11 IN LINE IN, FUSE TM30 - 100A, 600V

TM40 - 60A, 600V

F12 IN LINE IN, FUSE TM30 - N/A

TM40 - 60A, 600V

F13 IN KV DRIVE LVPS .5A, 250V FUSE

l
9890 8-10 ELECTRICAL INFORMATION
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

("q SCHEMATICSIWIRING DIAGRAMS

This section provides the schematics and interconnect wiring diagrams. Table 8-18 provides a listing of the
TM assembly part numbers and their associated schematic and wiring diagram part numbers for reference.
The schematics and wiring diagrams are presented sequencially by page number. See Table 8-18 for the
assemblies, their drawing sizes and their schematic part numbers.

TABLE 8-18 ASSEMBLYIWIRING DIAGRAM/SCHEMATIC CROSS REFERENCE

Assembly Nomenclature Page Size Assembly PN Schematic PN

BACKPLANE, RPU -125 kV 8-15 B 5484.262.14 4494.262.14

BACKPLANE, TM RPU - 150kV 8-16 B 4494.262.1401

CONTROL PANEL, REMOTE FLUORO 8-17 A 4194.262.46

FRONT PANEL, OC 8-18 A 4194.262.45

HI SPEED ROTOR READY, TM 2-TUBE 8-20 A 5184.262.06 4194.262.06

INVERTORIT-N ETWORK, 125 kV RAD 8-21 B 5585.262.06 4294.262.01

INVERTORIT-NETWORK, 150 kV RAD 8-22 B 5284.262.08 4294.262.08

INVERTORIT-NETWORK, HFF RlF 8-23 B 5284.262.081 4294.262.081

INVERTORIT-NETWORK, TM EP 125 kV 8-24 B 4294.262.38

c INVERTORIT-NETWORK, TM80

PCB, 24 HOUR POWER SUPPLY

8-25

8-26

8-27
B

B
5585.262.21

9284.262.22
4294.262.0801

4293.262.15

4294.262.02

PCB, ABC ISOLATION 8-28 A 5284.262.42 4294.262.42

PCB,AECINTERFACE 8-29 B 6284.262.04 4294.262.34

PCB, BAS-FE POWER SUPPLY 8-31 A 5184.262.18 4194.262.18

PCB, CONTROL 1/0 8-32 B 6284.262.10 4494.262.15

PCB, CONTROL kV 8-33 B 4284.262.15 4494.262.10

PCB, CONTROL mA/mAs 8-34 B 6284.262.11 4594.262.11

PCB, CONTROL mA/mAs WI HFF 8-35 B 5284.262.06 4594.262.41

PCB, FEEDBACK ISOLATION - kV/mA 8-36 B 5285.262.05 4294.262.1904

PCB, FEEDBACK ISOLATION -150 kV/mA 8-38 B 5284.262.1901 4294.262.1906

PCB, FLUORO FIELD 1/0 8-40 A 6584.262.17 4294.262.17

PCB, FLUORO FIELD 1/0 wi HFF 8-46 A 5584.262.20 4294.262.44

PCB, GATE DRIVE 8-52 A 5284.262.50 4294.262.50

PCB, GATE DRIVE with HF FILAMENT 8-53 A 5284.262.51 4294.262.51

PCB, OC DISPLAY 8-55 B 5484.262.04 4494.262.04

ELECTRICAL INFORMATION 8-11 9890

TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

TABLE 8·18 ASSEMBLYIWIRING DIAGRAM/SCHEMATIC CROSS REFERENCE

Assembly Nomenclature Page Size Assembly PN Schematic PN

PCB, OC MICROPROCESSOR 8-56 B 4484.262.03 4494.262.03

PCB, POWER SUPPLY, HF FILAMENT 8-59 A 4184.262.24 4194.262.24

PCB, POWER SUPPLY, RELAY/OC 8-60 B 6284.262.01 4294.262.35

PCB, RAD FIELD I/O 8-61 A 5584.262.16 4294.262.21

PCB, REMOTE FLUORO CONTROLLER 8-69 A 6284.262.18 4294.262.18

PCB, RPU MICROPROCESSOR 8-71 B 4284.262.13 4494.262.13

PCB, SNUBBER NETWORK HV INVERTER 8-74 A 5184.262.03 4194.262.03

PCB, SNUBBER NETWORK TM80 PARALLEL 8-75 A 5184.262.19 4194.262.19

PCB, VIDEO SYNC PROCESSOR, NICAL 8-76 A 5184.262.07 4194.262.07

POWER SUPPLY, 1<1> CONTACTOR 8-77 A 4193.262.01

POWER SUPPLY, 3<1> CONTACTOR 8-78 B 4293.262.03

POWER SUPPLY, 3<1> RAD - 50Hz 8-79 B 4294.262.37

POWER SUPPLY, 3<1> RAD - 60Hz 8-80 B 5585.262.05 4294.262.32

POWER SUPPLY, IEC 1<1> -50Hz 8-81 B 4294.262.07

(
POWER SUPPLY, IEC 3<1> RAD - 50Hz 8-82 B 4294 .262.45

POWER SUPPLY, RtF 1<1> 8-83 B 4294.262.14

POWER SUPPLY, RtF 3<1> 8-84 B 4294.262.06

POWER SUPPLY, TM30 1<I> RAD - 60Hz 8-85 B 4294.262.04

POWER SUPPLY, TM80 3<1> RAD 8-86 B 4294.262.25

POWER SUPPLY, TM80 3<1> RtF 8-87 B 4294.262.26

RPU INTERCONNECT, 2-TUBE 8-88 B 4593.262.11

RPUINTERCONNECT,RtF 8-89 B 5585.262.08 4593.262.14

RPU INTERCONNECT, TM30/40 125 kV 8-91 B 4593.262.0201

RPU INTERCONNECT, TM40 - 80 150 kVp 8-92 B 4593.262.12

TRANSFORMER, MULTI-OUTPUT 8-93 A 4294.262.30

TRANSFORMER, MULTI-OUTPUT wI HFF 8-94 A 4294.262.31

TRANSFORMER, 1-TUBE 50kW 150kV HF 8-95 B 4294.362.02

TRANSFORMER, 1-TUBE 125kV HF 8-96 B 4294.362.03

TRANSFORMER, 2-TUBE HF 8-97 B 4294.362.01 (

9890 8-12 ELECTRICAL INFORMATION

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 90260251

F--
I
\.
3 .AO •••• +2-4 VDC T81-5

~ 2 RTN PREP T81-9

5 .uo.o
[Y{
f • NO

71","" .... 0

f II RTN
HI-SP
SELECT T81·8

9
9 SF TRANSFER

• NO
f{
ROTOR FIELD 1/0 PCB

21 X-RAY INTERLOCK READY T81-8

+ 22 X-RAY INTERLOCK ~-<

'T"
19 NC

" .n.'0. HI-SP

HIGH SPEED
STARTER
20 VERIFY T81-7

J-< 11028-042

FIGURE 8-1 HIGH SPEED STARTER CONNECTIONS

(
(For Eurek. T T TB2-16
colllm.tor only.) I

(For Eurek. I
colilln.tor only.) CLOSED = READ'jf
TS2-15 or OPEN = HOLD i I
TS2-4 TS3-12 o TB2-23 _0_0_0_

TS3-11
or TS6-4
(LIN IV) I
JUMPER I I
i FIELD 1/0 PCB
i<
COLLIMATOR
)!I
( FIGURE 8-2 COLLIMATOR WIRING

ELECTRICAL INFORMATION 8-13 9890

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

LlEBELlFLARSHEIM PAR SPEED BUCKY

(
3 WIRE CIRCUIT 4 WIRE CIRCUIT
IX-"RAYS·WITCH· -. _. _.-; IX-RAYsWITcH· _. _. -.-;
• BUCKY MOTOR I • BUCKY MOTOR I

L-. B1 B2 B3 I?.iJ

T~3. __ ._0- .11?V CO TB~ .-._0- .12?V CO

I MI I MI
AUX AUX
2 3 4 2 3 4
WALL WALL
7 8 9 7 8 9
TABLE TABLE
12 13 14 12 13 14

MIDWEST BUCKY LlEBELlFLARSHEIM

SUPER SPEED BUCKY

1-· _. -. _. X-RAYSWITCH: (
• BUCKY MOTOR I
I I
;.§? 1;l'~~_~. a2. B..1l

TB3 126V 126V CO

.- ._. T.§} .- .-.
MI 61<,lW' -I
I I
AUX AUX
3 2 5 4 5 4 3 2
WALL WALL
8 7 10 9 10 9 8 7
TABLE TABLE
13 12 15 14 15 14 13 12
"LF8000
FIGURE 8-3 BUCKY WIRING
-- ' ..

9890 8-14 ELECTRICAL INFORMATION

 ,

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, rI1ITID-' rJ;ITID-J ~M fAI
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I rm:IID-' rm:IID-' 00' Cr RtT 23 24
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r -< J21-14 u

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J11-6 "'" CHGNO

( REV. DATE CODE ORG. Af'P.

ri7CHGNO
/,

00 9370 res TM RPU BACKPLANE 150KV

4494.262.1401

CONTINENTAL
X-RAY 8-16
CORPORA TION
(
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Jl-2" X?

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Jl-a)---Y4

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RAO_l ,,,,
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R2
Jl-l0
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RAO_2 ,,,,
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RJ "X-RAY ON" INDICATOR
JHI
RAO_3 ,,,,
OS4 220
R4
Jl-12
RAD_4 220

Jl-l~

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J3.'·

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J3-11

J3-12

.13-13

J3-14

J3-1.50

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J.HS ) XRAYS'
5111'71
0iJ
5111'72

XRAY
OC Front Panel Schematic
J3-19) PREpS' c~ ,NO
PREP
J]-20~ GND NOlES:
- -L GHD Jl IS 'II 3.5093-5002 (ZIS-PiN RIBBON CONNECTOR) 4194.262.45 (1 of 2)
J5 IS 3M 35:"-15002 (3D-PIN RIBBON CONNECTOR)

II02M2II 19715 I Rev. 00 18 -18

 (' (\ /\

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J5-13 ~
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.1.5-\6 ~ :: 4194.262.45 (2 of 2)

9715 I Rev. 00 9026-03II

.8·19
(

TBH T1 SMAIN +24V " TBJ-I

/

I 6 5
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12~/~; /

REV. DATE CODE ORG. APP.

00 9299 TCS TM 2- TUBE HIGH SPEED ROTOR READY 4194.262.06
00 9354 TCS
(
CONTINENT AL
X-RAY
CORPORA TlON 8·20
 4294-011
I. ""RAD
6584.262.16
mrn m- I. - ,,
( L
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GENERATOR rust RATlt«

TM2e30 20DA
TYPE
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~ ~
I
TM' ',40 3.00A l 7bS300 > i=
.,. '" .--:=..-I-~ - ~ .
L '"2 '"1 ----.J I I_ RESISTOR I

'JIGRN 'JIBLU I ldcI M C2b- ~~~"ORK I

NOTE, DO NOT SUBSTITUTE
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CONTACTDR I
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- l SCR FUSE

SCR
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.5284.262.03 161,1 RET 4 OF
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16 CONDo RI»BON
117VAC RET
I --- J2A J2

l ~~~~ TM 125kV RAD INVERTOR

T-NET'wDRK 4294.262.01 I
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8-21
 --,
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4294-081 J13; 6584.262.16
,TBI TB2 --1
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r - - - l f~';tVu~~LY
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6284262.011
TH 30 200. KBe200 I MULTI- I
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TH 40 L7OS300
I TRANSF. I : ~ ~ J I
TM 50-BO 4So. L70S450

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REV. DATE CODE ORG. APP. ,.YP7E.'

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·-~4.7UF
50V

REV. DATE CODE ORG. APP.

00 9472 GP TM R/F BAS-FE INTERFACE PCB 4194.262.18

( 01 9668 GP

CONTINENT AL
A SUBSIDIARY OF
~~__~~~__~________________~______~_T_R_EX__M_E_D_IC_A_L~8.31
 ';+5V
+5V R13H R13G R13F R13E R13D R13C R138

+5V
~20
we ~~ vee
U4
P3-5 ~~20
~ ---,.- or

P3-7

P3-9

P3-11
P3-8

P3-10
RAD7
.,n,
>-".a""",DR'-+-!f--++-'
RAnI
I 10

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GNO
74LS245
g 'AOO

~GNO
18 Yl
17 Y2
15 Y3
14

I
Y4-
13 Y5

11
Y6
~~
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P3-'2 >-""
RA'''''-n'_I-_--l-J ~GNO L.,,7;"4L-:S-:5~41~ Its- 1t7 I C8 TC2' T C20 I C2
'>-__-""

:002
P3-,3 R"llll..M---.! .l.:!UF .l.:!UF .l.:!UU:!UF .l.:!UF --.l:!UF

P3-15
P3-1' )-lRtaA
>-__..BA
P3-'6 >--
'lI-'4L--_ _--...l
••>7'-_ _ _ _ _---,
+5V -.lt1L
BO-SF - 1 111 -~~
< R38 R3C R3D R3E R3F ~' R3G <> RJH
7 01
B
00 2
01 S
02 ~
I GNO
I II I T
P3-,7 '>-__-"R"......
," ________+_,
U2
<:> ;;> R3A < 10K < 10K 10K < 10K < 'OK 10K'> 10K
13 OS
14 04-
03 12
04 15 +5V

~
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~~ ~; 19 -+
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P3-'9
P3-,8 >--
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10 GND

=
1
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P3-Z0>-- 03 ft.- 74LS32 GNO T.i:sm
P3-21 '>-__.....
R'-_I-_ O'IT.-

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l 00!15~~~~~~~~~~~~~~il::~l::::l__~
051'f.-
P3-22 > - - g;~ W1f 4 USB)-"-
01 6
02 9
3 _-!-_-!-,
PJ_23,>-_....lBtaA.l. A04 13 03 03 12
74LS32 :~~~; g~ 04
05
15
15
P3-24 > - - ~NO AD7 lag; g;
~
19
.Al..."--l--H-
P3-25 )---..I!
'1m" :3 U6D 11 10 GNO
P3-26 >-- U17
GNO 74LS374
'3-27' RA +5V 74LS32 +5V '6'Pi rt otLK vee J-ll-
>3-28 >--

~
U5
'3-29/ R.n ~ £ vee U6e IJCS

P3-30~ ~~1~11
, 74LS32
Y' ,

>--:~:::~~~-,
YZ 7
P3-31 !§
'4A I Y3 '
P3-32 / A4 Y.~
P3-33 , ;li11O 7 !~ Y5
Y6
1
, AO[O:7]
>-- :~ ~~ I-ll--JI SET

(
PJ-34
'>-_---"o""""x"-P______ ~ GNO
'3-35
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P3-36 >-- +fR2I
.t..n_ 14 2A +TXOA 7 P4-1
P3-37>-- ,~ 28
1'0K ,--_ _ _ _ _ _ _ _I+-H++-+_-l--=-Tl1X!QO~A_ _~ P4-2
P3-38 >-- +5V r-__________+ ________________1-I+t1++-__~+~0~T~RA~7P.-3

Rl~+f5V
+5VI

~_,I
P3-39 > - -
~ ,--_ _ _ _ _ _---1-1-+++I-I-_+--=-=OT°6-'_ _4' P'-,
P3-'0 >-- +5V
P3-41 >--
~~ 10K Rll R12 RtO R9 R4 R6 R7 R5
+5VI ~----_l_+_I_++-I-l---I-±I!.!.'
n
.vllA..4 P4-5
74LS38 10 220.> 220 220 220,> 2.2K 2,2K 2.2K 2.2K,> ,--____+-++H+~--li---'-:IL!<l·'n2A..--~ P4-6

P3-.3>--
P3-42>--

U3AOC 1_'\ RST +5v

R'9 <
lK >- >
;;> > >
> >- > ~
<
>
> UB
RBA
j---J.-\,i\;\,-!L-
c----+-+-H-l-If..--t-""<O=T.6-~ P4-7

_OT. / P4-8
oe,
P3_.5;::/).JJ>.O..I<------+- ~-,
----+~5~:'31 AO , AO
U14
vee SYNC
+5V
L-.J- lA~=- Ie 16
2 IX r?\. IE r12-
.......,!.. E,2 VCC~ r---~'2~O~--t1----1-I++-------t+1-I+t1--~~<~TvnW-·_7p.-9
IV ~E~>Tm'O~'~j+--..1..-'-"\I'R8"B'\r'1~5-+-. r_++-++_ _ _-H+t++f---II-=-:lTh!X02!;BL_~
74LS38 40

PJ-46>-- U:5D OC '

3 AI
5 A2
, A3
lPO
IPI
7
162:
T? U13
VCC
:5
4
2A 'v---: 2C flL-<
2. /~ 2E
14-
, 'A
7 2A lZ
2Y
3
6
5
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,n.,.cD
P4_1O

'3-.7)---=.....".-=:......-------1 74LS38 - 10K rirr IT IP2 2, • .R 8EA 12 _nTO.

35, 5 3A 'y. 3C 12 _--<'~'-'J\\I'\I\r"""''''''
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P3-.6>-- ~
IP3139
IP4 t"JB Yl4}- , 3K'/"\. 3E f1L-< 1-i'".O-,,+,,"Te!X~+t-...J
::~Pt Y2 1 9 3A 3Y 120 +RxnR __ / P4-13
'3_.9'>---~ff<~--------------------------------_. WR 34 :rsET 7 4A V~ 4C 10
:~~
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, 4A 6 R8t 11 -RXDB
P3-50 >-- Ht- GND .Z flL.=JUIB 12~

~
Y5 SYNC

~
~~~I
+5VI
P3-51 >--
'3-52>--
)! H
17 03
:; Ji
OPS ~
~;~
Y6 I-"---
PS250'-4 ~ 'ONO IGNO~ _OT.. / P'-'6

P3-53 >--
Te11 I e,6 74LS38 23 04
18 05
OP4 ~
OPS ~
t-JQ.... GNO
~-.....I
+5V
45VI ~P4-17
~UF ~UF
____'~
' - - - - - - - -.....- - ' Xl 22 06 OP6 ~ 74LS541 L_J.--!P~S!l.O P4-18
P3-5.>-- ~
P3-55 >-__.±'''2J'':L-v_-, T T 3.6664MHz

rlo,
AO[0-7) 19 07 QP7

~~gdI=
~CNO
~P4-19
P3-56 >-"",,=v_4 +5VI
T . ,llWClX - e251 ~
I, ...LeNa
R15
220 Rl~0~~R17
220 220 Rlf1
220
+5VI P<1

~P4-21
/
P'-20

~~
P3-57 > 'AVO" TP14
+5V
JJ:23
4.7PF
JJ:24
4.7PF GND
TRXXDDB.
20 L..._____ '
..;...J~
S RBe PS2 ./ P4-22

~____~7~+~V~IN~U~"-l ~
P3 -58 "-.2!l1lEl. 26B1A oe2 t+++~I..J'V\l\,=14-_

I I ~P4-2

'0"1," _ _
~~~l ~:!: ~: : Il : : : : : : : : : : :j: : l: :!: : : : j~ : ~:!~:~ [!;:lf~l=: : ;: -~ !;~ =;:~ ~ 3At'~0~+~Rxnal~B~L..Jl.~'~20~JL.
~6~.~.Yn~A~tJ
P3-59 >-- '20
L _ _--If--!:P~S3L_ _~ P4-24
P3-60 >-- R80
~P4-2
f~ +V;~:~~'dtF i: ~ - '3
I i
~7~
P3-61 >-- ~2E/,'2K 4 5 2Y 12~ ,-_ _ _+-,S",P",AR"EJ..'_ _~
P3-62>-- '±TLe:,o
lQUF -VIN a '2 3C .'J/ 3A R~G.
P4-26

, ~ -::G;NOl1:::-::GN:O
120CLOCK
__-,-C:NO______________ jo.--l!... 3E / " '3.
5
' L..E.. E3.
28 7 - 7 • 10
8-I_~J\,\'II\\" "'\ "'''-----'f-+-.... ~P4-2
~+i-i
HOF-2405S
'---<0--_-' ~
TO1 ~4E/"4K
10 .C "-£4A 87 G 13 4y
>Y :S8 ~4 - 8 .~H 9 __
~P4-2
/ P4-2B

TL
IGND IOND
_..::'!NO PS2501-4 8 GND !~ 15 - ~2~ v • • • •<0 P4-30

IGND 7s1751 10[0:73

.on'
"""----7 P4-31
=
/

)
-li JiGNO
REv. OATE CODE ORG. APP, P4-32

~OO~--~9~2~62~~-T~C~S~~--~ TM I/O CONTROL BOARD 4494,262.15

L -_ _ _ _ -++_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _-_ _ _ _ _ _ _ _ _ _ _ _ _
IGND 7 P4_3
~01~--~9~2~90~~=T~C~S~t====t----------------------------~------------+_~~~~~~~~~~-i --7 P4-3'
I-"~~;+-~~~~~:;..;---l...::.:.:.;~!,-+_-< CON TIN ENTAL L+----------------------------------------------------------------------------------------------------------_________________-______~E~X~P-~S~Y~NC~_7P4-35
L __________________________________________________________________________________________________________________________________ _________77P4-36 '~2~OC~l~K

X-RAY
CORPORA TION
ASSEM8LY NUMBER 6284.262.'5
BLANK PC BOARD PART NUMBER '28',262.15 8-32
 +5V +SV BAr\ RS2
9 ~ GNO
~
PS-I > -S7 ICI
PS-3 >PS-2 P9 or vce
+5V
0
PS_S~4~NO orR
KVO~

"!P5!-!6i;)---;iiAOI3i-~~
~PS-B "I$~gl ~~ ~~
ii ~~~ 51Pl 10K
~- rt~~~~~~~~~~V~H~IGiH::::~::::::::::::::~::::::::::::::::::::::::::::::::::::::::::::::::::::::::~l
~i s
P5-9
pS-71 ADO'4 AD BO
P5-11 ~PS-IO .' A4 B4
P5-13 P5-12 t'o-BA06 AS ~~ 12 ~
~:~ ~ r
P5_15,"PS-14
r
87 11
gprr ~ ~ ~ ~
_______J Hl- :'~ vj,~
P5-17 PS-16)---; B4[OO,12] GNO +5V N GNO-=:'="

P5_21,-PS-2o>-.AI
P5-19 ,PS-18>-"AJ>5
P5 22)---;
P5-23'- - lAo3
~~~....L.O:C~N~0~74~L"'S~2~4;5;;;0:[jO'i71~f~n~~~~~~~~~~~~~~~~~~I~~
bSO-5'r;r
~ ICISA
vee IS
+5V ~~l'~c!s["'C"5_V1eA~e
* II';i6~1-ii~~~~~!I!~~~~~~~
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9 AD
AI
PAl 3
PA2 L
IDDOPF
R2 .A
~C6A
LM347 +12vA
4
~1~~t3,;'>-;'====---,
2 _
V~8 +12VA
3 +V ~
R42
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~~45
::~~~ ::~::~'::: BAD' '~: ;;~ ~~t:I1iiffi~ft::..j-l-W., oro,71 +4
5V
RESET mh ,a.DK/':< : : ~:11' -12VA' F~\ 1 -" R4~ ~S:9 3
?2.2K

P5_29~P5-28>-RAOO GNo..t- GNO 1Y3",,""" 00 8 00 IC23

vee
rll-- 34 g~ PAl -::- ACNO KVFB+ 5 + -,0K y- .1' ~;..../...........o-_..
P5-31"
P5-33~PS-32
-,~ 5 02
• 0'g~ c~~~g R'~'=::t:=::;l
9
i 0 03 PB'
~~5 2~
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11 ~,..0-a---IC;.2;.+..,12VA. f5V IC8
~
I -12VA
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l6.":K~':
..AA-A ...L
Vh2
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:
PS 30'-- -:- 74LS139 02 PBO R46
g. '8 g; TPI >R5 .JI.:itA C7 J L:!,lJF
PHS"P5 34~n"p +5V g ' g~ o~:~: 27 g; ~~~ ~ 01 voo f.!U KV_R<;;+ - ~ N >'OK "R22 I I 0

P5-37 PS-36 N IC9 4~ II:;; 0[0,7] •• ruL 19 GATEI ~ 0[0']] ~:~ 2 g~ VOUT 1 '0 1 ~...., r- --=- Jt1.?~
I
HF

P5_39~38>- --"< G vee ~ 6 lh~~~~1~20~AO OUTI rll- :4 ~ g; I-'I~~1'"""....--+-+....::::::::::. V"

p5-41~4D>- ~ ~ G;~~~!= :gd~,~6===~il R'8~ 3~7""K4......._-"13~ ~~~~7
peo v v

P5_43~42>-
P5_45~44>-
_
lORa
~ P'
2 ~~
P-ii
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GN~L.G-NO=~...J
Wlf pe3 m--
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5
,;
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47

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P5-47" - ~
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g~
as 1
g; 1
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REF OUT I"--
< 22K

:
+-_.....--l'i-j_ m~~78
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L....:.!!!!:...
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9.rps::50" ~ ~
P5-51~ -,
P5-53~52>-
V.....l!!.. CNO
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74LS05
t----t--=4.,AGNO

,....-!!l- OGNO
<,-.
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KVF8+ ~PCAIN
9

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VCOIN VOD

PCADUT rfr
16

fnj tt--t-t--l
PCBOUT ,..,...
P5_5Sr:::-
~54>- _ -=-
-
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~
.1i A. -.I - 6 L 6
.,C1A
P5_S7~56>- >-. >-. >- _-:-_ -=-o=- .. --DI·2~; n ~C1B PCPOUT ~
~
P5-59 P5-5a
>- -,oNn
S'Y'SRS'f " ff
ICI4E
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11
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P5_61"P5-6D 74LS14 ' 3 4 2 ACND R'O ~

;,> R12< <~ ~INH
<;>
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f-i--
+12)V:5~~:~VA
10K 12K
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VCOOUT

_ AGNO '--"7'::":'::---'
.+;V 4.7UF, .... _
C9 +;.. cw_ "> -::
404'

c:-= ~ci~
IC14C

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ACNO
+12VA
'0 ~R49 (C17
IC140
(>100 ~
AGND
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-12VA KV_GS_ON 10K

;!LS:'4~----' r;::::::::::::::::::::::::::::::~.J
IC15B
EKV'o II
--= AGNO
74l50a
ICIIB
--oo-..;;.~-+~_r-+r---~---l
- ICI48
TP4
FO
LM339
, ?
R37 0 TPII
t----'-I,~ B
ff FO

...AR:o,. ~::'{'t.:12VA F8(-)

~
IC'OB
AGNO
Q2
PN2222 74LS'4 4f' +5V
~o~ y- 08 LM347
RI4 GNO
~, 'N914 4

.JI.·AR36A 2 -V+' .lltA

:~:'!V" C41
+--'''';'K'i\i,'';''--+--0-9---'"--I+ V

H~
-II IOK/O.I'
PS-I CATHODE 0
~, lN914 5
P6-3 P6-2 > - RI8...AAA.
-12VA

P6-5 ~P'-4 >- ANOOE(+) 010

TPI2
,8(+) 1O:/6.~
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p6-7~6 >- <> IC4C
LM347
KVFB-l- +5V
P6-9 "P6-8 > -

P'_I1~IO>­
P6_'3~'2>-
'0 +
74LS08 •
P6-15 P6-14 > - ~ ~R20 0
P6_'7~'6>­ >'OK/O.1% TPS
+SV
R51 GD.:3i4 L
P6_'9~'8>- +sv....
"'1:.. -w""1
10K
lC14A IC14F -=AGNo + +5V LM339
P6-21 P6-20>- ~
'ff ...2 ff >0'-12.... 0

~
13 _ _- '
R24 ICI3A '6 C'6A
PS-2/ P6-22>- AGNO
74LSI4 74LSI4
~~6.7K/I" j¥-R vcc ~CI6E OC
PS_25"P6-24>- GO""i&? ::. 74LS05
~
+-__+--+'51-1'1
Rxex8 " , "oe
10 r--++-+--"'-\

~
P6 2/ P6-26>- C168
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~
0 f---!!-ICX 74LS05

~
P6-29 P6-2S>-KV"'GS'llN CIOE -,-C12 ~ GNO DC
74LSD5
P6_31~30>­ OC It;5V +S~ OOOP, CND '-7::':4:':"L:-S4:"!2~3...J C'6C

--=--~
P6_33~32>­ -..:!GNO 74LS05 ICI2A ~+5V -~ De
= 'C..
~
P6_35"P6-34>- 70' CIOD vee 16 ~
uu_'a"
+5V

--+..~
l
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P6-36>- Q OC::><-,;..."-..... ~ R25
lJ 10 ~ -....
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ICI3B ~C'6F rrlC188

L.
74LSDS ---........ IK

L-tt===============================~il
f
I C2 I C20 I C21 1C22 I C23 1C24 I C25 1C26 1CZ7 2YO
r-l>icrK !Of""""'" P---I ---,t< 2B 1.12
,oI-'S,--_+__13"'-1 74LS05 CI -::- -LlUF-LlUF-LlUF...LlU'...L!.UF...L!.UF-LlUF...LlUF...LlUF 14 2A 2Yt

..L CI3 111P::j7~'R~X:Cx~~2JO~

Fn '- 2A DC
~
I r-:::ll::- GNO
~GND 74LS112
IDUFTIT T TT T T I I NO .
28 2Y2
2Y3 p!-
!~ APP.
OOOPF I • 2eX
74LS423 J..GND _ 74LSI39

TM RPU KV CONTROL BOARD 4494.262.10 .,o=- GNO

8-33
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OATt COOl'l
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8·34
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9656 CP 1
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CONTINENTAL I
I X-RAY
CORPORA TION
8-35
 ~~ ______________________~K~V~F~B~J3-5

~J3-13
~GND2

r -___________________X~IN~T~~J1-9

r -____________~L~O~O~P__~J3-15

-15Vl
REV. DATE CODE ORG. APP.
( 4294.262.1904 -15Vl
1-(j0=-:O,=--+---=9=-=3~60::,.-+G:::,P_../.JI,.-.I/r...:."":=:....j TM SE RIE S kV/ mA FEED BACK IS 0 L ATION BOA R0
"!71Q G;> ~......

8-36
CONTINENT AL
SHEET 1 OF 2
X-RAY
CORPORA TION
 R49

R37
R30
J1-
+15V1 10.00Kj.1%
10 +15V1 +12V2
Z2
V39ZA3
25VAC D12
R9 1N4742
NOT INSTALLED 12Vz
-15V1
D13
1N4742 +15V1
GND1 GND1 12Vz
GND1
D15
1N914
NOT INSTALLED 15 VIN >-:..-7_ _ _ _--!lM2!:A~FB~4 J3-14
J2-1 J2-2
J 1- ~>_--"'M.:..:;AF'-=Bc...:..+_-_{

C
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ZERO OHMS
R51·1UF
10 GND2
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V39ZA3 GND2
25VAC RB -15V1
NOT INSTALLED
-15V1 -12V2

GND1 -15V1
GND1

(
+12V2
+15V1

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j +12V2 R60
2.2K
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lGND2 4 -VIN GND1
• 22.uF
C22 C23 -VOUT C5 C11
1uF 10uF /50V .1uF GND1
110UF /50V GND2
GND2
J3-11) -12 V

~
-12V2 -15V1

REV. DATE CODE ORG. APP.

00 9360 GP TM SERIES kV jmA FEEDBACK ISOLATION BOARD 4294.262.1904

Ot 96&9 G.P.
,(
CONTINENT AL
SHEET 2 OF 2
X-RAY
~~------~--~--~----------
CORPORA TION 8-37
_ _ _ _ _ _ _ _ _ _ _ _~_ _ _ _ _ _ _ _~_ _ _ _ _ _ _ _ _ _ _ _ _ _~ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ __ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _~~~~__J'
 ~~ ___________________~KV~F~B~~J3-5

~J3-13
~GND2

r-____________________~X~'N~T__~Jl-9

~"-'-"=--~J3-1

r-______________~LO~O~P__~J3-9
( J1-1 )---,'=NT....L=Kl,---, R21
220K
C3
R28
22K
R20
22K

LKc:..:1_-,
Jl-5 )--""'N,...T",, R22 ~GNDl 9
14
2 .1uF 8
22K 4
C7
OCl
~GNDl
CNY17
.1uF
R31
10.00Kj.l%

+15Vl
-15Vl ND2
(A)R31
10.00Kj.l% R33 R26

5.6M 22K

R23 11
7 D9 13
10
22K 6
* COMPONENTS ARE NOT ON THE SILK SCREEN lN914
R32
220K R27
22K

-15Vl
REV. DA TE CODE ORG. APP.
4294.262.1906 -15Vl
00 9360 GP TM 150 kV /mA FEEDBACK ISOLATION BOARD
Of 97/~ GP c!>C

CONTINENT AL
SHEET 1 OF 2
X-RAY
CORPORATION 8-38
~--~~~------------~----~~~~~----------------------------------------
 +15Vl R49

10.00Kj.l%
(
R37
R30
Jl-3 MAFB-
10.00Kj.l%
10 +15Vl +15Vl +12V2
012
Z2 lN4742
V39ZA3 R9 12Vz
25VAC OW R52
"15t 10
C15 C18
013
GNOl lN4742
GNOl 12Vz R48
GN01DuF .luhGND2
GNOl
10.00Kj.l%

6 MAFB J3-14
J2-1 C4
MAFB+ 5
Jl-8
h
C"-'
RED GN01
.1uF GN02
010
Zl lN4742 C19
V39ZA3 R8 12Vz
25VAC

2
·fi 1OW

011
-15Vl R551·'"
10
GN02
GN02

lN4742
12Vz -15Vl
GNOl GNOl GNOl

-15Vl

(
+12V2

J3-10 )>---.:i±:.1:121Jll+-c-21---r

±
.......-c-20----.lj

±
10UF j50V .1uF

J3_y>----.JG:itNIDD2.
____ -----+-------,

J3-11
C22

12VJ1OUF j50V

)'>---=-12Jl.2t---~~---'l
I· C23
1uF

-12V2 -15Vl

REV. OA TE CODE ORG. APP.

00 9360
TM 150 kV / mA FEEDBACK ISOLATION BOARD 4294.262.1906

CONTINENT AL
SHEET 2 OF 2
X-RAY
CORPORA TION 8-39
 ~,

tSV
.----------j__ >RTR2_0N (SHT S)
U2 _
.------lJ-.,~RtfS+T___.lI_ctOE VCC 20 C' RTRLBST/~UN(SHT 5)
RSI TR 4 " CLK -D TB_SEL_1/2 (SHT 3)
J12-1 >=-
J12-2 /
100 .JJlll IAA
2
16
IS
'oIL I 3
00
2
001+----'
'LG/SM (SHT 4)

J12-3
JI2-S
J12-4 ,
F
F ,,
, J12-6 ,..
PSO
101 I 10'
4
6
-A'
-A' ,v,
,v,
,v,
13
14
II
~
I~
02
01
03
04
Oll~~~~~~~~~~~~~~'
02
03
04 r2
JI _" FIL_STNOBY (SHT
GTB/STNOBY
_
(SHT 3)
4)
J12-7 , ' - PSI ,106 7 10 :4 05 05:S ~ GTG (SHT 3)
, J12-8 " 107_ 8 hV, 19 I 7 I 06 06 ~ __
J12-9 -
:J12-10
102 v
CI
Ic.
lF~? lFJi?
b C4 C5 C6 C7 C8
7 18 07 07 19
~
--l ) EXP ON (SHT 3)
-
~:~~:~ ~2 ~ ~:: 47 -r...i70PFr470PFr470PFr-=70PFr- ~70PFI--=70P~r-=70PFI= P
=70 F 10 G;:LS374
~4 / ' tSV
~:~~:~ ~12-i6 , A~_CHI
...
::i
~
~'"
m
o
-:m::-18 "
JI2-19:>=- :
J12-21 ~
104

-:/12-20 , : -105
,JI2-22>
J12-23 , -
PS3

POE
_
-:- GND -:- GNO - GND
_ _ _
- GNO - GNO • GND - GND
_

t
_ GNO
- RST

R8S
1.5K
I JJ
U6A

/I
74LS14
_2 RST
-:- GNO

RST I DE
TRLS" CLK
3
DO
U3

VCC 20

00
2
I
I
>AD
-
--l) AD_CH3 (SHT 2)
~:, AO_CH4
(SHT 2)
CH2 (SHT 2)

(SHT 2)
~ J12-25
'JI2-24,'
C
~12-26 >
IDS
+SV 4
7
01
02
01 S
02 S
~2
I ,-----1 AD_START (SHT 2)

JI2-27/- GND I Ig 03
04 03
04 J
.------l AD_RANGE (SHT 2)

JI2-29/..~28 >--107 >R85 - t5V :4 OS

OS as
05 :~ .-----1 _
MAINGA TE (SHT 3)
~30 /. ">
10K 07 07 VME (SHT 3)
J12-31 "J12=-32 , iiESff RS2 UI 10 GNO +5V

2 ~J'
JI2-33"-=--- --- I ' • IS I AO vee 16 }
"Jii:'34>-- -""1L 15 2 AI __ 74LS374
J12-35 CJ12-3S ,) - - 3
4.v.v
,'A 14 3 A2 YO 15 STAT4
YI 14 AT -:-GND
JI2-37~,JI2-38,
,EXP SYNC 5
6.
v:A'A 12
I ,1
r+!:i!.
'-- ~ G2
Y2
Y3
I STAI6
toR.--
Illllllll -
RS3
/JI2-40 .~
J12-39 ' - 'LINE SYNe
8 A
V
'
'A' !l!.
9
_~1 '1 ---.lL GI IT I• 11
eTR 4
Y5 10 TR
1«
If < ~ <; < 10K
v Y6~9 CTRL6
-
'-----'
47
C9
470pF
CIO CII CI2 CI3 CI4
470pF_ HOpF 470pF 470pF 470pF
o---lL GNO 'i'7pL- tSV
",10>'
_,
" "''''''''''N
(SHT 6) L1NCSYNC C, - ~ ~. --~' --~...~. 74LSI38 CJ TB2_HOT (SHT 3)

(SHT 3) EXP_SYNC C' r r r r r r -,:::- STAT4 U4 ST2_MCD (SHT 5)

- GNO II GI YCC 20 ST2_PCD (SHT 5)
-:- GNO -:- GNO -:- GND -:- GNO -:- GNO -:- GND ~ G2 HSRI ROY (SHT 3)
l(~t=='~8~Y1 AI 2 -
l ~ Y2 A2 ~ -CJ HSR2_ROY (SHT 3)
'~:W=~ISHY3 A3 ,~ _ __
.' 14 Y4 A4 6 "----J TBI_SLY (SHT 3)
t~~E~8YS
:3 Y6 AS
A6 7 ~---
~-----J TB2_SLV (SHT 3)
"-,,.>U-_~II'--1~~ ~~ 9 FlUBSJL
10 GND +SY (SHT 6)

74LSS41 j
-:- GNO tSY 1 < ><,~~>~S~ R~4
US lOOK
'--------J--"ScLT"-A'i3:¥-Ta-cl
I !il. VCC 20
L1.2...c G2 o (71 oj «t N

1/' 18 2 - ':::::J SF ]RP _REO (SHT 3)

,'!-'&.'-TI7HY' AI 3 __
·'!-'~-ll1.-;-;1rlY2 A2 4 ~:::::J HUORO/SF (SHT 3)
'
.'!-'~-nI5H~~ ~~ 5

'---
~~t:=1~2~Y6
:~ Y5 A5~6E7~~~~~~~~Qr-~
A6 8
AD_BUSY (SHT 2)
11 ~~ ~~ 9
~--~-------r----~---;-------------------------------------------r----------------------l
r'
REV. DATE CODE ORG, APP, 1/0[0:7J 10 L _N_ =,,-...
G D
00 9271 TCS TM/RF FLUORO FIELD I/O BOARD 4294.262,17 74HCT541
01 9290 TCS -:- GND

~~ :~:~ TG:S CONTINENTAL >STAT6 (SHT2)

04 9352 GP SHEET I OF 6 X-RA Y ~'CTRL6 (SHT 2)
05
06 9387
9533 GP
WLW CORPORA TION -DRST (SHT 2) _

o
 ~
~. ~

(SHT I) AD_CHI

(SHT I) AO_CH2

(SHT I) AO_CH3 L>---' TP3

+12VA

J
+12VA

el7

.039uF
TBI-7'~ RI
CI6

1~
+12VA

. r-: .,
R88 .039uF
TPI5
CAMERA JJOK CW +12VA
-12VA Rl1
INTERFACE I 2 3 10K
R89 U8 ~
I ';~GNO- -JPI ~~l t.~ FOR 20K

" '" I p4j~l~l

~.
TBI-8 ... FOR CCO CAMERA (NICAL)

-12VA
SOLID-STATE PICKUP
R4
IN2
---, .00'"

~5>--LONG SIZE -=- AGNO .. '1;1I I 6 S3

S4 gJ
OJ
04

I TB2-6) TRANS SIZE

I~~ )<
CW
'V
IK TPI
GNO
'-----
V~~
SPOT FILM AOG211A

f
INTERFACE

'V

~7>
-=- AGNO
AeNO ~ ~
IN5231
020
s. IV,
1021
sN5231
.IV,
I
' +
-12VA
- AGNO

+5V
+5V
1
. AeNO
..i
-::- AGNO .-- AGNO - AGNO
(SHT I) 1/0[0:7)
U9
11lOBI
DBO VDD
24

C58rl +5V
10 DB2
.luF - q C 5lOuF
9

r
DB3
DB4 VOUT
DB5

"1m 6I
CTRl6 0
n
DBS
OB7
OACGNO
-=- GNO

I:'~csI
STAT6 I 018
1.IB0201

{~, ""-'''"' ~I'

ViR
iID
(SHT I) AD_RANGE If
Sf VING
RANGE
(SHT I) RST, ~RESET
21 AoceNO 22
LV elK
(SHT I) ___ "'. INT 019
(SHT I) AD_BUSY C I "I BUSY 1.IB0201

(SHT I)
JLj .DeND VSS

CI8 ~GND
A07569
6BpF - -=- AGND
R13-
6.19K/IY. • AGNO

eND -=- AGND

REV. DA TE CODE ORG. lAPP.'
DO 9271 TCS TM/RF FLUORO FIELD I/O BOARD 4294.262.17
01 9290 TCS
02 9J41 GP
03 9352 TCS CONTINENTAL
04
05
9352
9381
GP
ep
SHEET 2 OF 6 X-RAY FOR OTHER TBI CONNECTIONS SEE SHEET 3

06 9533 WLW CORPORA TlON FOR OTHER TB2 CONNECTIONS SEE SHEET 3

8·41
 /~' ~

+24V +5V +5V +5V +24V +5V

+24V

R21 R20 RI9

TB3-2) THERM SW2 220 220 220

TUBE. 2
STATOR/
TB3-3"
./
24VRET IC
IE
:~ __ >TB2_HOT (SHT I)
TBI-I .~EX~P~O~S~E=_S~Y~N~C~-----t----t----t====~~~~~~~~~~~~~=J~-1--~-~EXP_SYNC(SHT I)
THERMAL SWITCH TB3-7": HSRI ROY 2C 14 IN¥:R~E~E
./ H ~
, HSRI_RDY (SHT I)
I " 24VRET
TBI-2)--- <TBI-3
TB3-8'
./ HSR2 ROY A 3C 12 HSR2_ROY (SHT I) l
3E
4C 10
11
24VRET .
/TBI-4

4E 9 VMEA
(TB1-5
(SHT I) MAINGA TE C:----------------l CAMERA

24VRET - 24VRET ~TBI-6 INTERfACE

-:- GND

+5V +24V +24V +5V (SHT 1) iiME GTB/STBY /

.. TBI-IO

24VRET

R24
(SHT I) GTB/STNOBY C:------------------------------.J L ______='-'-~~
STBY RET "
.. / TBI-12
R90
220 1.5K/.5W

GREY TBI-l1
(SHT 1) GTG

I
TUBE SELECT
J4-3

J4-2
TBI VER

TiiIVER I)
VERifY
fli2.:S[V (SHT I)
I
J4-1', 24VRET
/ l sm CASSETTE
- 24VRET L ______~B~A~S~) TB2-10 ADVANCE
(SHT I) EXP _ON C".-_______________--1
GND
I

13' "'
SPOT filM
• TB2-1/-

TB2-2~

TB2-3)
..... FE

fl
II

II

I
R25

8.2K/2W

R27
'VV'v
r -_ _ _ _ _ _ _-+=====::;:==~---------lD fLUORO/Sf
"v

I OC6
h R39
IK
0

CI9
2.2uf
Sf ]RP _REO

+5V
(SHT 1)
(SHT I)
+24V

02
IN4004
R2B
~J3-1

"'[;~
10 OHM

: AUXfl(L
R3 -S I it:::l{ I XL- C20
"--n.2uf
R31 +24V
IK C64
T82-8, ' 510
- GND .47uf /IOOV

LJ 1 -:- GND
01
IN4004 K3 C65
TUBE
TUBE 1/2
'/J3-2 H.V. SWITCH
SELECT

, • I B24VOC .47uf /IOOV

R30
7.5K

01
(SHT 1) TB_SEl_1/2 C· 2N2222 R26
10 OHM

EV. DATE CODE ORG. lAPP.

TUBE I
DO 9271 TCS I I TM/RF FLUORO FIELD I/O BOARD 4294.262.17
/ J3-3

01 9290 TCS
02 9341 GP
03 9352 TCS CONTINENTAL SEE SHEET 2 fOR OTHER TBI CONNECTIONS
24VRET
04
05
9352
9387
GP
GP
I I SHEET 3 Of 6 X-RAY SEE SHEET 2 fOR OTHER TB2 CONNECTIONS

06 9533 WlW CORPORA TION SEE SHEET 5 fOR OTHER TB3 CONNECTIONS

8·42
 ~ ~ ~

tSV tlSVf

UIO
VOO~

I
9 VCOIN
R34 _ C62 tSV tlSVF ~ PCAIN PCAOUT K.-- tlSVf

~ 5.6K .Oluf II 6 ~I r--_ _ _ +-~____:;6_l:~:IN PCBOUT ~ ~~ fJ;F

OC7 l ' '" R36 R40 C22 CIB PCPOUT r- UI2A
''',OS2 Hlifl '" 240 10K-
1:' SMALL tSV < 4700pf I~ RI Sf OUT ~ ,--.&- SEll VCc,..li-
- eNO ~ R2
(SHT I) Le/s ~ 4'" S ZENER t-lL - --2.. 01 I
I 6 INH 4 3 01 r--
~ VSS VCOOUT ClKI ~
R35.?> OC8 ,':z; tlSVf tSV R43 4046 ~ RESI Qf 10£.- ,--lL SET2 13
U6D
4.7K HIIFI
-? J ISOK 7
>----'- VSS
9
,......2.- 02

~
fTl 8 1 Z ---:r4+--'
'-..r- fGNO 4013 o--lL CLK2 2'

1
/I -- -- 10
R42 _ ~ FeNO ~ >--"'- RES2
74LSI4 3 240 > fGND - '-wi3
± __
4
tSV CW R37 cw

'1~~~ ~~~ r~gluF tl-":' 5 ~

!
2 II tSV fGND

R41 II I H~~:3 ,Ir:z; '1 +24V

4.7K ~...---',;f3_ _-.,
-=-- FGNO ~~.!
:~
2 4 R50 +24V FIL2 SM
150 > 08 I

(SHT I) FIL STNOBY C ---=-

- FGNO
IN4004 ....
I
I KI

I 16 S 24VDC FlL2 COM 1-2 filAMENT

ORIVE OUT
II-":'
I
OCIO t24V
,r:z; '1 ~

~
HIIG3 04 3
~ 2N2222 C ~. ~ flL2 LG ,

tl5VF 2 ~ L \'>c
B IN40~~"l: K2 '
tlSVF tlSVF 7.5K R56 ~ I
.. ~ri~ tISVF'" 2.2K IE 24VDC FIL DRIVE IN , j~

.? R46 C23 2
UIIA
IS
R47 .?
2,2K <'
i- 24VRET
FIL2 COM 2-2
'--l
FILAMENT
DRIVE IN

'> 10K 2200pf I ~f' VOO +ISVf t8SVF

_~ RESI OII-'S'-------1>---h
L---+====1t=======~~4HtTRI
~ ~,
a 1
I
tlSVf S -TRI QfpI- 03 .. +15H OS
C2S - - ~ 8 VSS IN914 tl5Vf f- lN4937 C C28 RSI
.luF 48 02 luF /IOOV r ~ 47K
FGND 4098 >---- UI3 R G I~ IRGPC40 06
~ri~ ~ ~ VOO VB ~ 33 T 023'-.:..: E ~~ MR852
~ FGNO lN~I~ " 10 HIN ~~ r2---1-~ C27
T.IUf
c:.-
I .~~ C29 - -
R52

1,
47K
UllB II SO ICTE-18 luF /IOOV r ~
C24 14 RC2

~:S2 :~ ~I;S ~~3 &=

L________~=======r-'"~~
12 tTR2
I -TR2
2200pf

(
:; _

021
02 10

C60
.luF - - IR2110

r
_ C26
-luF @ C
C30 _._
luF/100V r~
RS3
47K
~
4098
~ FGNO v:
R49
A G
I'"
~:::-
03
IRGPC40
..,l- 07
~~ MR852

REV.
---.--.---T"""-------------------,r-----------,
OA TE COOE ORG. APP,
33 I ~24 '-.::E
r~
C31
luF /100V -1~-
R54
47K

00 927 - TCS TM/RF FLUORO FIELD I/O BOARD 4294,262.17 11r~18

01 929 ~
~
TCS L-----------t----~~--------------~>__~
02 934 GP
03 935 TCS I _~
04
OS
9352
9387
GP
GP
SHEET 4 OF 6 X-RAY ~ fGNO

06 9533 WLW CORPORA TlON

8-43
 r- ~. .~

+5V +5V +24V +24V STA TOR COM

-:J=l-6
/:
.J9-5
"
~/J9-4 "

220VAC STATOR POWER

'J9-3 SUPPL Y
R63
5.6K
K5
24VDC STATOR]HASE
"~9-2 I
PHASE_CAP ~~
ROTOR 2
DS4
BOOST 'l.
(SHT I) RTR2_BST!RUN c:)-.-<>-____-----.J
STATOR_COM
--<=/ /.
,~B3-4 TUBE 2
STATOR/
STATOR_PHASE THERMAL SWITCH
--([B3-5

STATOR MAIN
~B3-6
+5V 24VRET 24VRET +5V +5V

+5V

t t t RB2
(SHT I) RTR2_0N n------, R6B
5.6K
ZI
RBI
5.6K
1 5 6K
.

V230LA 10 ROTOR 2
014 DS6 MAIN CURRENT
DS5 TI R71

-c> ST2_UCD(SHT

t"" "
I)
~
o
J7 -1/ ii'fR2ON +5V .J '---" .--r
r= R73
z
o
u J7-t; +5V j 10K IN522B
3.9Vz
10K

XR-1427

-=- GNO
SOLID-STATE J_GNO
+5V +5V
RELAY SSRI

+5V
... i t RB4
_ 5.6K
~ RB3
~z JlO-1 "
/
SSR_lI 5.6K

0
ROTOR 2
u 015 OS7 PHASE CURRENT
T2 R72
SSR_L2
c!z J10-2 '-.
/ ST2_PCO (SHT I)

roo "'"
.J ,---,+.....-
R74
10K lN522B 10K
3.9Vz

XR-1427

REV. DATE CODE ORG. lAPP. - GNO

T 1
~
00 9271 , TCS TM/RF FLUORO FIELD I/O BOARD 4294.262.17
01 9290 TCS
GNO
02 9341 GP
03 9352 TCS CONTINENTAL
04
05
9352
93B7
GP
GP
SHEET 5 Of 6 X-RAY
06 9533 WLW CORPORA TlON
8·44
 ~ ,~

TP4 +Isvr

J8-1) 16VAC • '< C34

.Iur /SOV
FILAMENT STANDBY
GA TE DRIVE SUPPLY

J6-2" 16VAC RET

, • I
- FGNO

RS9

12
0 0 LINE_SYNC (SHT I)

U6B

~oL
FILAMENT STANDBY
AC SUPPLIES

IN4937 - GND - GNO 1 ~4

J6-5 >--- TP6 +8svr - GND
U6C

J8-6 >--- ~oL

DS3 ~ ~4
F1L SUPPLY - GND
ON
C37 FILAMENT STANDBY
J8-3',
/ 60VAC
'< IOOOuF /200V
(NOT USED) RS6
INVERTER SUPPLY

lOOK
SEE NOTE

60VAC RET
J6-4/
- FGND
+SV
~-----------------------n F1L_SBSJL (SHT I)

~)
+SV

OCI2
HIIDI
GND
JII-2 )
/

+s +/-12VOC
SUPPLIES
-=- GND
J 11- 4 ';>----±flY-A
/
-=- GND
, AGND
JII-3 )

TPI2
+24V
TPI3
>--~
JII-S
__
~>~ +~2~4~V_~_________~________~_ ___

REV.
00
01
02
DATE CODE
9271
9290
9341
ORG. lAPP,
TCS
TCS
GP
TM/RF FLUORO FIELD 1/0 BOARD 4294.262.17
24VDC SUPPLY
I~' rmur/sov
_24VR=:-ET-*--_LIC_TE-2_2-
1 030

I ~
03 93S2 TCS CONTINENT AL 24VRET
04
OS
9352
9387
GP
GP
SHEET 6 or 6 X-RAY NOTE: filAMENT DRIVE SUPPLY AND filAMENT CONTROL SUPPLY (rGND)
06 9533 WLW CORPORA nON ARE CONNECTED AT ONLY I POINT -- 010 PIN 4 AND 011 PIN 4.

8·45
 ~
i" "--.~,,

+5V
~--------jC) RTR2_0N (SHT 5)
U2
~------ir-) RTR2_BST/RUN(SHT 5)
~
ST
1- 2
RSI vec
eTR 4 II DE 0
J12-1 >-- 100 ,no I 16 'nn ,
CLK ) TB_SEL_1/2 (SHT 3)

J12-3 F
J12-2 /
"___
J12-4 PSO I -'C 2
34
>':Av
:A"A
v
I
14
IJ
I
~ DO
7 01
~-----fC)lG/SM

o FIL STNOBY
(SHT 4)

(SHT 4)
J12-5
J12-7
~ ~
>-"
JI2-6/
101
PSI
104'
-'l\5. 6
7
'AvAv
.v,
• v,
:Av 12
II
10
,~
B
13
14
02
03
04
I, 0 eT~STNOBY (SHT 3)
, J12-8
J12-9 )JI2-IO
-- / 102
I ,'A

1: CI PFJii J~j
7 17
18
05
g~
OGTe (SHT 3)

I I 1-
v C2 C3 C4 C5 C6 C7 C8 EXP _ON (SHT 3)
JI2-11;"=-. PS2 47 470pF 470pF 470pF_ 470pF 470pF 470pF 470pF 470pF
10 GND
J12-13 ~12:> 103 -I--I~'I
-~ -I~I
-~ 74LS374

~ ~:~~:; ~:: ~DS4J / _ _ _ _ _ _ _ _ GNO - GND

+5V

1:
U6A AD_CHI (SHT 2)
'" JI2-IB - GND - GND - GND - GND - GND - GND - GNO - _ U3
~ J12-19 ~ : RST I IJJ AD_CH2 (SHT 2)
~
2 RST STI-
vec 20
~ J12-21 ~20 )--105 I
CTR II OE
CLK ~ AD_CH3 (SHT 2)

g"-"'' , ,' "

m ~12-22 / R8G
o J12-23 :- 74LSI4
>AO_CH4
I- --;;;;:-24'
J12-25 ~=-~
~26
PDE
/
106
1
_I
t
+5V 1.5K
GND
"",_-~~cJDD
7 01
00
01
2
5
6
III
(SHT 2)

JI2-27 ~
J12-28
/>- I _ ""=_-'Igug~
14 04
02
03
04
9
I:
15
lOAD_RANGE (SHT 2)

J12-29 ~JO) 107 IIIII RB5 +5V 17 OS 05 ; 16 ~ UAINGA TE (SHT 3)

JI2-JI ~32) RESET ~ >m I g~ 06
Q7 VUE (SHT 3)
J12-33 ~J4 >- 1,1
I non I
2
16
15 ~ AO
UI
VCC j-l§..
10 GND +5V
JI2-35>'::-
JI2-36~
"
J12-J7 ~3B" EXP SYNC
I 5
.Y.
'.v
14
12
,.{<
3!1 YO 153:rm
YI 0 ,4 STAT5 -=- GND
74LS374
J
HUUU:
6 II GL Y2 133T(rs:
J12-J9 ~
J12-40 ~~
"LINE SYNC 28 .A
.A
~v
<.~ 10.=11
9
,I
' I
L-~
I 6'
G2
GI
Y3 iol¥----
~ ~:~ m~; III I ,
RS3
10K

" :.: ': , , :' ~

9
_ C9 CIO Cll CI2 CI3 CI4 Y6 0 CTRL6

{fI~~cr"'f'""
2Icnltolr--II.OI..oI-.t"II"")IN
(SHT 6) LINE_SYNC C;- +5V
(SHT 3) EXP _SYNC C':,-- - - 11 <=J TB2_HOT (SHT 3)

STA T4 U4 I ~ ST2_UCD (SHT S)

VCC· 20
-=- GND -=- GND -=- GND -=- GND -=- GND -=- GND L:E1~ STLPCD (SHT 5)
,I, H-H+---(..(I=~::J HSRI_RDY (SHT 3)

AII~
A2
A3
A4
4
6 ~
HSR2 ROY (SHT 3)
TOI SLY (SHT 3)
A5 7
A6 -0 TB2_SLV (SHT 3)
A7 9
A8 -0 FlL_SBSJL
(SHT 6)
+SV

-=-
+
GND

US
+5V
>. . z< RS4
lOOK
'TAT.5 l,..IGT vce' 20
LlidG2 S!I01lcoir--lwltlll-.t
SF _PRP _REO (SHT 3)

AI~~
YI
A2 4 C] FLUORO/SF (SHT 3)
A3 5
'---- A4 6
A5 7 -0 AD_BUSY (SHT 2)
A6
A7 9
A8
REV. DA TE CODE ORG, lAPP, 1/0£0:71
DO 9271 TCS 4294.262.44
TM/RF FLUORO FIELD 110 PCB WI HFF 74HCT541
01 9290 TCS
D2 9341 GP -=- GNO
03 9352 TCS CONTINENTAL ~----------------------OSTAT6 (SHT 2)
04
05
9352
9387
GP
GP
SHEET I OF 6 X-RAY ~-------------------------OCTRL6 (SHT 2)

06 9533 WLW CORPORA TION -D RST (SHT 2)

8-46
 /". ,~ /-'-

C
II
(SHT I) AD_CHI

(SHT I) AO_CH2 C~
(SHT I) AO_CH3 C" I +12VA
TP3

(SHT

J
+12VA

Cil

.039uf
RI
TBI-7 ~ CIS

~
+12VA

TPIS .039uf
CW
R89 -12VA +12VA
CAMERA ~
RII
10K
2 3 U8
JPI 1-2 fOR CCO CAMERA (NICAL) I VOO 13 20K
••• JPI 2-3 fOR SOLID-STATE PICKUP IS INI
JPI 9 IN2
8 IN3
-12VA IN4
R4
10K I~ SI 01
CW IIS2 02
S S3 03
S4 04
CW NC
R5
10K
>( '\ GNO VSS
SPOT fiLM AOG211A

I
INTERfACE GNO

~, 'VV'v I~I_I_-~ "t

RS .;>CW
""" ---jr-----l-
'" >:---( -12VA - AGNO -=- AGNO
~ ~

+SV
+5V -=- AGNO -=- AGNO -=- AGNO -=- AGND
(SHT I) 1/0[0:71
U9
14 OBO VOO 24
13 OBI
II OB2 CS8 r t C 5 9 +5V
10 OB3 .Iuf L J I O U f
DB4 VDUT
OB5
__ OB6 OACGNO
CTRL6 DB7 -=- GND 018
STATS 16 ES MB0201
(SHT I) AD_Sf ART 15 mi"
(SHT I) AD_RANGE 18 ~ VINlr2~3~r-------------------------~--------------------------------------------------------------------------------------------____________~
4 RANGE
(SHT I) RST 2~RESET AOCGNO 22
20 ~LTK 019
(SHT 1)
AD_BUSY 19 BUSY "B0201
(SHT 1)
12 OGNO VSS
(SHT 1)
A07~b~
GNO
-=- AGNO
R13-
6.19K/I¥.
- ACND

GNO -=- AGNO

REV. DA TE CODE ORG. lAPP.
DO 9271 TCS TM/RF FLUORO FIELD 1/0 PCB WI HFF 4294.262.44
01 9290 TCS
02 9341 GP
03 9352 TCS CONTINENTAL
04
05
9352
9381
GP
GP
SHEET 2 Of 6 X-RAY fOR OTHER TBI CONNECTIONS SEE SHEET 3

06 9533 WLW CORPORA TION fOR OTHER TB2 CONNECTIONS SEE SHEET 3

8·47
 ,~ ~. ~

+24V +5V +5V +5V +24V +5V

+24V

R21 R20 RI9

" THERM SW2 220 220 220
TB3-2)

.:~E:XP:O:S~E:_'SY~N,c'---t--r-~;;;~~8~~~~~===~J~I=:~~
" 24VRET
TUBE 2 TB3-3/ RI5 "TB2_HOT (SHT I)
STATOR/ '. HSRI ROY CAMERA TBH • EXP _SYNC(SHT I)
I :~ 0 HSRI_RDY (SHT I)
THERMAL SWiTCH TB3-7> 1.5K/.5W
I
INTERrACE '. 24VRET
TBI-2)~~l
/

" HSR2 ROY HSR2_RDY (SHT I)

TB3-8/
1.5K/.5W 24VRET
7
'8 TBI-5
(SHT I) MAINGATE C~>-------------'

24VRET - 24VRET
-=- GND
VMEC < CAMERA
T81-6 INTERFACE

+5V +24V +24V +5V (SHT I) VME C~-------------'

24VRET
< TBI-IO

STBY RET
R24
(SHT I) GTB/STNDBY C:---------------' <, TBI-12
R90 R23
220 1.5K/.5W 1.5K/.5W

TBI-Ii

(SHT I) GTG
J4 -3
C>----+--II-----t==========~!~~~;===l
i'iiIVEif L---'=_-< TBI-9

TUBE SELECT J4 2 fii2iifR TBI_SLV (SHT I)

VERIFY - L-_ _ _ _-f--, -TB-2-_S-L-V (SHT I)
J4-1 ", 24VRET
'------/ l DR' '. sro CASSETTE
- 24VRET
(SHT I) EXP _ON Cr--------------'
GND / ___ ADVANCE
TB2-1O I

I :::::~
R25 rLUORO!SF (SHT I) +24V
RL
8.2K/2W SF ]RP _REQ (SHT I)

~J3-1
R27 CI9 +5V 02
SPO T FIL 11 TB2 -3') FL '\j\/\,~-<o-----, R39 2.2uF IN4004
IK K4

1"
INTERF ACE : 24VDC 10 OHM
AUXAC

I :::::,
C20
2.2uF
RJI +24V
,","H C64
- GND «~." .. «510
t __
J_ T .4 7uF /IOOV

/ TUBE 1/2
TUBE 2
"JJ-2 H.V. SWITCH
-=- GND KJ lC65
SELECT

I 24VDC -.- .4 7uF /IODV

~~50K I!~ ~. IHllG3
01
(SHT I) TB_SEL_1/2 C: 2N2222 '-.. R26
10 OHM

REV. DA TE CODE ORG. lAPP.

TUBE I
I I <~3-3

,"~,~~,··l "'' '

00 9271 TCS TM/RF FLUORO FIELD 110 PCB WI HFF 4294.262.44
01 9290 TCS
02 9341 GP
03 9352 TCS CONTINENTAL '" '"'H , CO, """ '"
04
05
9352
9387
GP
GP
I I SHEET 3 OF 6 X-RAY SEE SHEET 2 FOR OTHER TB2 CONNECTIONS -

06 95JJ WLW CORPORA TlON SEE SHEET 5 FOR 0 THER TB3 CONNECTIONS

8·48
 ~ ,~ /~

+SV +ISVf

,--II----------<p~--------------------------'9'_1veoIN UIO voo ~

...:."l-OS2
R34

5.6K I1
_ e62

.Oluf /1
OC7
Hl1fl
l' -'
-'
6 ~J
+sv

R36
240
+ISVf r4 PCAIN peAOUT -4r-

R40
10K
22 I
C----'---
~ :~:IN
CIB
peBOUT
PCPOU!
-k. ;'::: fJu3f
1- UI2A
+ISVf

~ ,. SMALL
7= +SV > 4700pf I~ RI
-n
Sf OUT ...!Q... ~ SETI VCC rli-

t
(SHT I) LG/S C 4 ' S ZENER ~ r- r---2- 01 I
I 6 INH 4 3 olt-'---
8 VCOOUT CLKI UI2B

9
U6D
JJ 8
R3S;
4.7K
> OC8
Hllf1
1':::
I
......I--..,+....J
.2 4
+ISVF +SV R43
ISOK

_~_~
~ VSS
4046
4
f-"-- RESI
7
f---'-- VSS
FGNO 4013
OTIC<--
2 8 .--
,-"-
9
SET2
~ 02
~I>CLK2 2'~1'
13

R42 _ 7 FGNO 7 ~ RES2

74LSI4 3 3 240 fGNO - '-«ii3"
+!SV CW < R37 CW :l _~
2 20K ~ R38 _ "-C21 I 16 7 fGNO
< LRG ~ 20K . '2.2uF / lr.
R41, I I SM H~~;3 IF::: 'i +5V +24V
4.7K 3

r.i~I-!!C.j4!==:::::;l
:~
---':::- 2 4 RSO +24V FlL2 SI.1
- fGNO ISO,> 08 k-
-=-
1

(SHT I) flL .STNOBY C IN4004 A~ 1 KI

- fGNO I
J!; 5 24VOC f1L2 COM 1-2 filAMENT

I lq1
OCIO +24V DRIVE OUT

t:J
"::: HIIG3 04 >-- 3
2N2222 C ~. 4 f1L2 LG
+ISVf 2 14. R~S. 09 1 ,
'---'VV\\~-~o__EScH IN4004 ~ ~ 1 K2
+ISVF 7.5K I
+BW ~ E
R44
20K
+ISVf 2.2K 24VOC FIL DRIVE IN /
"- ~
FILAMENT
unA R47 _ fIL2_COM 2-2 ORIVE IN
R46 C23 2 RCI VOO 16 2.2K > +8SVf - 24VRET '--.J
10K 2200pf I CI +ISVf.
~ RESI oI1-'6L------..---+_.
L-----1===T==~~=;=~:=J~~+ TRI 7
A~ 1 Ir 1
I
+ISVf -TRI OT pL- 03 +ISVf os
C2S _~ ~ 8 VSS IN914 +ISVf IN4937 ...~C C28 R51
.Iuf
fGNO 4098 ~ UI3
R48
G
Q2
"IRGPC40 06
.Iuf /IOOV / r- 47K

7
fGNO
~~~ 7 04
IN914
1 Ir ~
10 HIN
voo ~g ~
VS td-- n- ~
C27
T.IUf;,.....
3~ v -r ~23 '-.:.: E
I ~
~ ~ I.1R8S2
C29
R52

1
UIIS II SO ICTE-18 .luF/IOOV :::':::: 47K
C24 _ 14 RC2

~ ~:S2 :~ ~I:S ~~~ tb

L________~=======~'~·
12 +TR2
2200pf

I _ TR2
4098
iITil
02 10

C60
.luF -
- - IR2110
_ C26
/1 'Iuf ~
C
C30 __ _
.Iuf /100V --T'
R53
47K
(
'-- R49 03 07
7 fGNO v_ " G " IRGPC40 .41. I.1R852

REV.
---,r---,....-"T'""------------------r----------,
DATE CIODE ORG. APP.
33 r ~24
(~
'-.:.: E C31
.Iuf /100V -T.L-
R54
47K
00 9271 TCS TM/RF FLUORO FIELD 1/0 PCB WI HFF 4294.262.44 IjT~18
01 9290 TCS L-_ _ _ _ _ _ _ _ _~-----~--------------~-~
02 9341 GP
03
04
9352
9352
~
GP SHEET 4 OF 6
I X-RAY --
05 9387 GP 7 fGNO
06 9533 WLW CORPORA TION
8·49
 ~ .~. ~

+5V +5V +24V +24V STATOR COM

.---:J=l-6
;,
.~9-5

~/~,9-4

LuVAC

K5
24VDC

ROTOR 2
BOOST {,-:

-<T83-1
(SHT I) RTR2_BST!RUN 0 •
STATOR_COM TUBE 2
<i B3 - 4
STATOR/
STA TOR_PHASE
<i 83 - 5 THERMAL SWITCH

STATOR_MAIN
<iBH

+5V 24VRET 24VRET +5V +5V

(SHT I) RTR2_0N n~----...,

R68
+5V

t i t R82
5.6K

I
5.6K
R81
ZI 5.6K
V230LA 10 ROTOR 2
014 056 MAIN CURRENT
1 '/' DS5
TI

J7-I> t ST2_MCD(SHT I)

r"
~ ilfiffON +5V .J r----I~.A"
o R79
R73
~o
u J7-y +5V t 10K IN5228
3.9Vz
10K

XR-1427

-=- GND
SOLID-STATE lGND
+5V +5V
RELAY SSRI

V>
...
+5V
i t RB4
5.6K
I- RB3

~z JIO-I "
/
SSR_LI 5.6K
ROTOR 2
0 015 OS7 PHASE CURRENT
u
SSR_L2
q J10-2 ' \
z / ST2]CO (SHT I)

R80
R74 ~026 10K
10K ~~§g8

XR-1427

REV.
00
01
DATE CODE
9271
9290
ORG.

TCS
TCS
lAPP.

I I TM/RF FLUORO FIELD 110 PCB WI HFF I 4294.262.44

-=- GNO
GND
-
02 9341 GP
03
04
05
06
9352
9352
93B7
9533
TCS
GP
GP
WLW
SHEET 5 Of 6

I CONTINENT AL
X-RAY
CORPORA TlON
8-50
 ~ ~
~

TP4 +15Vf

J8-1 "/
16VAC C34 filAMENT STANDBY
.Iuf /50V GATE DRIVE SUPPLY

16VAC RET
J8-2)

II R59
_ fGND

IV
1.5K/.5W
12
0 0 LINE_SYNC (SHT I)

R60
7.5K

filAMENT STANDBY
AC SUPPLIES

JS-S>-
W IN4937 - GND - GND
+85Vf
1
- GND
USB

.--J'Ji'>oL
~4
USC

JS-6>- .--J'Ji'>oL
DS3 1 ~4
flL SUPPLY - GND
ON
R57 filAMENT STANDBY
" 60VAC
J8-3/.r--- 33K/2W INVERTER SUPPLY
R5S
lOOK
ISEE NOTE

60VAC_RET
J8-4 "-

- fGND
+5V
fIl_SBSJL (SHT I)

~'>
+5V

OCI2
HIIDI
GND
JII-2

+5 +/-12VOC
SUPPLIES
-=- GND
JII_4~A -=- GNO

AGND
JII-3 ';.
/

TPI2

JII-5 > -12VA

+24V
TPI3

~)~~+~2~4~V__~__________~~________~____~

REV.
00
DA TE CODE
9271
ORG. lAPP.
TCS TM/RF FLUORO FIELD 110 PCB WI HFF 4294.262.44 I~).
24VDC SUPPLY

24VRET~
··"u.,
-
030
ICTE-22
01 9290 TCS
~
02 9341 GP
03 9352 TCS CONTINENTAL - 24VRET
04
05
9352
9387
GP
GP
SHEET 6 Of 6 X-RAY NOTE: fiLAMENT DRIVE SUPPLY AND filAMENT CONTROL SUPPLY (fGNO)
06 9533 WLW CORPORA TION ARE CONNECTED AT ONLY I POINT -- 010 PIN 4 AND Oil PIN 4.

8-51
 ~,

tSV
.----------j__ >RTR2_0N (SHT S)
U2 _
.------lJ-.,~RtfS+T___.lI_ctOE VCC 20 C' RTRLBST/~UN(SHT 5)
RSI TR 4 " CLK -D TB_SEL_1/2 (SHT 3)
J12-1 >=-
J12-2 /
100 .JJlll IAA
2
16
IS
'oIL I 3
00
2
001+----'
'LG/SM (SHT 4)

J12-3
JI2-S
J12-4 ,
F
F ,,
, J12-6 ,..
PSO
101 I 10'
4
6
-A'
-A' ,v,
,v,
,v,
13
14
II
~
I~
02
01
03
04
Oll~~~~~~~~~~~~~~'
02
03
04 r2
JI _" FIL_STNOBY (SHT
GTB/STNOBY
_
(SHT 3)
4)
J12-7 , ' - PSI ,106 7 10 :4 05 05:S ~ GTG (SHT 3)
, J12-8 " 107_ 8 hV, 19 I 7 I 06 06 ~ __
J12-9 -
:J12-10
102 v
CI
Ic.
lF~? lFJi?
b C4 C5 C6 C7 C8
7 18 07 07 19
~
--l ) EXP ON (SHT 3)
-
~:~~:~ ~2 ~ ~:: 47 -r...i70PFr470PFr470PFr-=70PFr- ~70PFI--=70P~r-=70PFI= P
=70 F 10 G;:LS374
~4 / ' tSV
~:~~:~ ~12-i6 , A~_CHI
...
::i
~
~'"
m
o
-:m::-18 "
JI2-19:>=- :
J12-21 ~
104

-:/12-20 , : -105
,JI2-22>
J12-23 , -
PS3

POE
_
-:- GND -:- GNO - GND
_ _ _
- GNO - GNO • GND - GND
_

t
_ GNO
- RST

R8S
1.5K
I JJ
U6A

/I
74LS14
_2 RST
-:- GNO

RST I DE
TRLS" CLK
3
DO
U3

VCC 20

00
2
I
I
>AD
-
--l) AD_CH3 (SHT 2)
~:, AO_CH4
(SHT 2)
CH2 (SHT 2)

(SHT 2)
~ J12-25
'JI2-24,'
C
~12-26 >
IDS
+SV 4
7
01
02
01 S
02 S
~2
I ,-----1 AD_START (SHT 2)

JI2-27/- GND I Ig 03
04 03
04 J
.------l AD_RANGE (SHT 2)

JI2-29/..~28 >--107 >R85 - t5V :4 OS

OS as
05 :~ .-----1 _
MAINGA TE (SHT 3)
~30 /. ">
10K 07 07 VME (SHT 3)
J12-31 "J12=-32 , iiESff RS2 UI 10 GNO +5V

2 ~J'
JI2-33"-=--- --- I ' • IS I AO vee 16 }
"Jii:'34>-- -""1L 15 2 AI __ 74LS374
J12-35 CJ12-3S ,) - - 3
4.v.v
,'A 14 3 A2 YO 15 STAT4
YI 14 AT -:-GND
JI2-37~,JI2-38,
,EXP SYNC 5
6.
v:A'A 12
I ,1
r+!:i!.
'-- ~ G2
Y2
Y3
I STAI6
toR.--
Illllllll -
RS3
/JI2-40 .~
J12-39 ' - 'LINE SYNe
8 A
V
'
'A' !l!.
9
_~1 '1 ---.lL GI IT I• 11
eTR 4
Y5 10 TR
1«
If < ~ <; < 10K
v Y6~9 CTRL6
-
'-----'
47
C9
470pF
CIO CII CI2 CI3 CI4
470pF_ HOpF 470pF 470pF 470pF
o---lL GNO 'i'7pL- tSV
",10>'
_,
" "''''''''''N
(SHT 6) L1NCSYNC C, - ~ ~. --~' --~...~. 74LSI38 CJ TB2_HOT (SHT 3)

(SHT 3) EXP_SYNC C' r r r r r r -,:::- STAT4 U4 ST2_MCD (SHT 5)

- GNO II GI YCC 20 ST2_PCD (SHT 5)
-:- GNO -:- GNO -:- GND -:- GNO -:- GNO -:- GND ~ G2 HSRI ROY (SHT 3)
l(~t=='~8~Y1 AI 2 -
l ~ Y2 A2 ~ -CJ HSR2_ROY (SHT 3)
'~:W=~ISHY3 A3 ,~ _ __
.' 14 Y4 A4 6 "----J TBI_SLY (SHT 3)
t~~E~8YS
:3 Y6 AS
A6 7 ~---
~-----J TB2_SLV (SHT 3)
"-,,.>U-_~II'--1~~ ~~ 9 FlUBSJL
10 GND +SY (SHT 6)

74LSS41 j
-:- GNO tSY 1 < ><,~~>~S~ R~4
US lOOK
'--------J--"ScLT"-A'i3:¥-Ta-cl
I !il. VCC 20
L1.2...c G2 o (71 oj «t N

1/' 18 2 - ':::::J SF ]RP _REO (SHT 3)

,'!-'&.'-TI7HY' AI 3 __
·'!-'~-ll1.-;-;1rlY2 A2 4 ~:::::J HUORO/SF (SHT 3)
'
.'!-'~-nI5H~~ ~~ 5

'---
~~t:=1~2~Y6
:~ Y5 A5~6E7~~~~~~~~Qr-~
A6 8
AD_BUSY (SHT 2)
11 ~~ ~~ 9
~--~-------r----~---;-------------------------------------------r----------------------l
r'
REV. DATE CODE ORG, APP, 1/0[0:7J 10 L _N_ =,,-...
G D
00 9271 TCS TM/RF FLUORO FIELD I/O BOARD 4294.262,17 74HCT541
01 9290 TCS -:- GND

~~ :~:~ TG:S CONTINENTAL >STAT6 (SHT2)

04 9352 GP SHEET I OF 6 X-RA Y ~'CTRL6 (SHT 2)
05
06 9387
9533 GP
WLW CORPORA TION -DRST (SHT 2) _

o
 ~
~. ~

(SHT I) AD_CHI

(SHT I) AO_CH2

(SHT I) AO_CH3 L>---' TP3

+12VA

J
+12VA

el7

.039uF
TBI-7'~ RI
CI6

1~
+12VA

. r-: .,
R88 .039uF
TPI5
CAMERA JJOK CW +12VA
-12VA Rl1
INTERFACE I 2 3 10K
R89 U8 ~
I ';~GNO- -JPI ~~l t.~ FOR 20K

" '" I p4j~l~l

~.
TBI-8 ... FOR CCO CAMERA (NICAL)

-12VA
SOLID-STATE PICKUP
R4
IN2
---, .00'"

~5>--LONG SIZE -=- AGNO .. '1;1I I 6 S3

S4 gJ
OJ
04

I TB2-6) TRANS SIZE

I~~ )<
CW
'V
IK TPI
GNO
'-----
V~~
SPOT FILM AOG211A

f
INTERFACE

'V

~7>
-=- AGNO
AeNO ~ ~
IN5231
020
s. IV,
1021
sN5231
.IV,
I
' +
-12VA
- AGNO

+5V
+5V
1
. AeNO
..i
-::- AGNO .-- AGNO - AGNO
(SHT I) 1/0[0:7)
U9
11lOBI
DBO VDD
24

C58rl +5V
10 DB2
.luF - q C 5lOuF
9

r
DB3
DB4 VOUT
DB5

"1m 6I
CTRl6 0
n
DBS
OB7
OACGNO
-=- GNO

I:'~csI
STAT6 I 018
1.IB0201

{~, ""-'''"' ~I'

ViR
iID
(SHT I) AD_RANGE If
Sf VING
RANGE
(SHT I) RST, ~RESET
21 AoceNO 22
LV elK
(SHT I) ___ "'. INT 019
(SHT I) AD_BUSY C I "I BUSY 1.IB0201

(SHT I)
JLj .DeND VSS

CI8 ~GND
A07569
6BpF - -=- AGND
R13-
6.19K/IY. • AGNO

eND -=- AGND

REV. DA TE CODE ORG. lAPP.'
DO 9271 TCS TM/RF FLUORO FIELD I/O BOARD 4294.262.17
01 9290 TCS
02 9J41 GP
03 9352 TCS CONTINENTAL
04
05
9352
9381
GP
ep
SHEET 2 OF 6 X-RAY FOR OTHER TBI CONNECTIONS SEE SHEET 3

06 9533 WLW CORPORA TlON FOR OTHER TB2 CONNECTIONS SEE SHEET 3

8·41
 /~' ~

+24V +5V +5V +5V +24V +5V

+24V

R21 R20 RI9

TB3-2) THERM SW2 220 220 220

TUBE. 2
STATOR/
TB3-3"
./
24VRET IC
IE
:~ __ >TB2_HOT (SHT I)
TBI-I .~EX~P~O~S~E=_S~Y~N~C~-----t----t----t====~~~~~~~~~~~~~=J~-1--~-~EXP_SYNC(SHT I)
THERMAL SWITCH TB3-7": HSRI ROY 2C 14 IN¥:R~E~E
./ H ~
, HSRI_RDY (SHT I)
I " 24VRET
TBI-2)--- <TBI-3
TB3-8'
./ HSR2 ROY A 3C 12 HSR2_ROY (SHT I) l
3E
4C 10
11
24VRET .
/TBI-4

4E 9 VMEA
(TB1-5
(SHT I) MAINGA TE C:----------------l CAMERA

24VRET - 24VRET ~TBI-6 INTERfACE

-:- GND

+5V +24V +24V +5V (SHT 1) iiME GTB/STBY /

.. TBI-IO

24VRET

R24
(SHT I) GTB/STNOBY C:------------------------------.J L ______='-'-~~
STBY RET "
.. / TBI-12
R90
220 1.5K/.5W

GREY TBI-l1
(SHT 1) GTG

I
TUBE SELECT
J4-3

J4-2
TBI VER

TiiIVER I)
VERifY
fli2.:S[V (SHT I)
I
J4-1', 24VRET
/ l sm CASSETTE
- 24VRET L ______~B~A~S~) TB2-10 ADVANCE
(SHT I) EXP _ON C".-_______________--1
GND
I

13' "'
SPOT filM
• TB2-1/-

TB2-2~

TB2-3)
..... FE

fl
II

II

I
R25

8.2K/2W

R27
'VV'v
r -_ _ _ _ _ _ _-+=====::;:==~---------lD fLUORO/Sf
"v

I OC6
h R39
IK
0

CI9
2.2uf
Sf ]RP _REO

+5V
(SHT 1)
(SHT I)
+24V

02
IN4004
R2B
~J3-1

"'[;~
10 OHM

: AUXfl(L
R3 -S I it:::l{ I XL- C20
"--n.2uf
R31 +24V
IK C64
T82-8, ' 510
- GND .47uf /IOOV

LJ 1 -:- GND
01
IN4004 K3 C65
TUBE
TUBE 1/2
'/J3-2 H.V. SWITCH
SELECT

, • I B24VOC .47uf /IOOV

R30
7.5K

01
(SHT 1) TB_SEl_1/2 C· 2N2222 R26
10 OHM

EV. DATE CODE ORG. lAPP.

TUBE I
DO 9271 TCS I I TM/RF FLUORO FIELD I/O BOARD 4294.262.17
/ J3-3

01 9290 TCS
02 9341 GP
03 9352 TCS CONTINENTAL SEE SHEET 2 fOR OTHER TBI CONNECTIONS
24VRET
04
05
9352
9387
GP
GP
I I SHEET 3 Of 6 X-RAY SEE SHEET 2 fOR OTHER TB2 CONNECTIONS

06 9533 WlW CORPORA TION SEE SHEET 5 fOR OTHER TB3 CONNECTIONS

8·42
 ~ ~ ~

tSV tlSVf

UIO
VOO~

I
9 VCOIN
R34 _ C62 tSV tlSVF ~ PCAIN PCAOUT K.-- tlSVf

~ 5.6K .Oluf II 6 ~I r--_ _ _ +-~____:;6_l:~:IN PCBOUT ~ ~~ fJ;F

OC7 l ' '" R36 R40 C22 CIB PCPOUT r- UI2A
''',OS2 Hlifl '" 240 10K-
1:' SMALL tSV < 4700pf I~ RI Sf OUT ~ ,--.&- SEll VCc,..li-
- eNO ~ R2
(SHT I) Le/s ~ 4'" S ZENER t-lL - --2.. 01 I
I 6 INH 4 3 01 r--
~ VSS VCOOUT ClKI ~
R35.?> OC8 ,':z; tlSVf tSV R43 4046 ~ RESI Qf 10£.- ,--lL SET2 13
U6D
4.7K HIIFI
-? J ISOK 7
>----'- VSS
9
,......2.- 02

~
fTl 8 1 Z ---:r4+--'
'-..r- fGNO 4013 o--lL CLK2 2'

1
/I -- -- 10
R42 _ ~ FeNO ~ >--"'- RES2
74LSI4 3 240 > fGND - '-wi3
± __
4
tSV CW R37 cw

'1~~~ ~~~ r~gluF tl-":' 5 ~

!
2 II tSV fGND

R41 II I H~~:3 ,Ir:z; '1 +24V

4.7K ~...---',;f3_ _-.,
-=-- FGNO ~~.!
:~
2 4 R50 +24V FIL2 SM
150 > 08 I

(SHT I) FIL STNOBY C ---=-

- FGNO
IN4004 ....
I
I KI

I 16 S 24VDC FlL2 COM 1-2 filAMENT

ORIVE OUT
II-":'
I
OCIO t24V
,r:z; '1 ~

~
HIIG3 04 3
~ 2N2222 C ~. ~ flL2 LG ,

tl5VF 2 ~ L \'>c
B IN40~~"l: K2 '
tlSVF tlSVF 7.5K R56 ~ I
.. ~ri~ tISVF'" 2.2K IE 24VDC FIL DRIVE IN , j~

.? R46 C23 2
UIIA
IS
R47 .?
2,2K <'
i- 24VRET
FIL2 COM 2-2
'--l
FILAMENT
DRIVE IN

'> 10K 2200pf I ~f' VOO +ISVf t8SVF

_~ RESI OII-'S'-------1>---h
L---+====1t=======~~4HtTRI
~ ~,
a 1
I
tlSVf S -TRI QfpI- 03 .. +15H OS
C2S - - ~ 8 VSS IN914 tl5Vf f- lN4937 C C28 RSI
.luF 48 02 luF /IOOV r ~ 47K
FGND 4098 >---- UI3 R G I~ IRGPC40 06
~ri~ ~ ~ VOO VB ~ 33 T 023'-.:..: E ~~ MR852
~ FGNO lN~I~ " 10 HIN ~~ r2---1-~ C27
T.IUf
c:.-
I .~~ C29 - -
R52

1,
47K
UllB II SO ICTE-18 luF /IOOV r ~
C24 14 RC2

~:S2 :~ ~I;S ~~3 &=

L________~=======r-'"~~
12 tTR2
I -TR2
2200pf

(
:; _

021
02 10

C60
.luF - - IR2110

r
_ C26
-luF @ C
C30 _._
luF/100V r~
RS3
47K
~
4098
~ FGNO v:
R49
A G
I'"
~:::-
03
IRGPC40
..,l- 07
~~ MR852

REV.
---.--.---T"""-------------------,r-----------,
OA TE COOE ORG. APP,
33 I ~24 '-.::E
r~
C31
luF /100V -1~-
R54
47K

00 927 - TCS TM/RF FLUORO FIELD I/O BOARD 4294,262.17 11r~18

01 929 ~
~
TCS L-----------t----~~--------------~>__~
02 934 GP
03 935 TCS I _~
04
OS
9352
9387
GP
GP
SHEET 4 OF 6 X-RAY ~ fGNO

06 9533 WLW CORPORA TlON

8-43
 r- ~. .~

+5V +5V +24V +24V STA TOR COM

-:J=l-6
/:
.J9-5
"
~/J9-4 "

220VAC STATOR POWER

'J9-3 SUPPL Y
R63
5.6K
K5
24VDC STATOR]HASE
"~9-2 I
PHASE_CAP ~~
ROTOR 2
DS4
BOOST 'l.
(SHT I) RTR2_BST!RUN c:)-.-<>-____-----.J
STATOR_COM
--<=/ /.
,~B3-4 TUBE 2
STATOR/
STATOR_PHASE THERMAL SWITCH
--([B3-5

STATOR MAIN
~B3-6
+5V 24VRET 24VRET +5V +5V

+5V

t t t RB2
(SHT I) RTR2_0N n------, R6B
5.6K
ZI
RBI
5.6K
1 5 6K
.

V230LA 10 ROTOR 2
014 DS6 MAIN CURRENT
DS5 TI R71

-c> ST2_UCD(SHT

t"" "
I)
~
o
J7 -1/ ii'fR2ON +5V .J '---" .--r
r= R73
z
o
u J7-t; +5V j 10K IN522B
3.9Vz
10K

XR-1427

-=- GNO
SOLID-STATE J_GNO
+5V +5V
RELAY SSRI

+5V
... i t RB4
_ 5.6K
~ RB3
~z JlO-1 "
/
SSR_lI 5.6K

0
ROTOR 2
u 015 OS7 PHASE CURRENT
T2 R72
SSR_L2
c!z J10-2 '-.
/ ST2_PCO (SHT I)

roo "'"
.J ,---,+.....-
R74
10K lN522B 10K
3.9Vz

XR-1427

REV. DATE CODE ORG. lAPP. - GNO

T 1
~
00 9271 , TCS TM/RF FLUORO FIELD I/O BOARD 4294.262.17
01 9290 TCS
GNO
02 9341 GP
03 9352 TCS CONTINENTAL
04
05
9352
93B7
GP
GP
SHEET 5 Of 6 X-RAY
06 9533 WLW CORPORA TlON
8·44
 ~ ,~

TP4 +Isvr

J8-1) 16VAC • '< C34

.Iur /SOV
FILAMENT STANDBY
GA TE DRIVE SUPPLY

J6-2" 16VAC RET

, • I
- FGNO

RS9

12
0 0 LINE_SYNC (SHT I)

U6B

~oL
FILAMENT STANDBY
AC SUPPLIES

IN4937 - GND - GNO 1 ~4

J6-5 >--- TP6 +8svr - GND
U6C

J8-6 >--- ~oL

DS3 ~ ~4
F1L SUPPLY - GND
ON
C37 FILAMENT STANDBY
J8-3',
/ 60VAC
'< IOOOuF /200V
(NOT USED) RS6
INVERTER SUPPLY

lOOK
SEE NOTE

60VAC RET
J6-4/
- FGND
+SV
~-----------------------n F1L_SBSJL (SHT I)

~)
+SV

OCI2
HIIDI
GND
JII-2 )
/

+s +/-12VOC
SUPPLIES
-=- GND
J 11- 4 ';>----±flY-A
/
-=- GND
, AGND
JII-3 )

TPI2
+24V
TPI3
>--~
JII-S
__
~>~ +~2~4~V_~_________~________~_ ___

REV.
00
01
02
DATE CODE
9271
9290
9341
ORG. lAPP,
TCS
TCS
GP
TM/RF FLUORO FIELD 1/0 BOARD 4294.262.17
24VDC SUPPLY
I~' rmur/sov
_24VR=:-ET-*--_LIC_TE-2_2-
1 030

I ~
03 93S2 TCS CONTINENT AL 24VRET
04
OS
9352
9387
GP
GP
SHEET 6 or 6 X-RAY NOTE: filAMENT DRIVE SUPPLY AND filAMENT CONTROL SUPPLY (rGND)
06 9533 WLW CORPORA nON ARE CONNECTED AT ONLY I POINT -- 010 PIN 4 AND 011 PIN 4.

8·45
 ~
i" "--.~,,

+5V
~--------jC) RTR2_0N (SHT 5)
U2
~------ir-) RTR2_BST/RUN(SHT 5)
~
ST
1- 2
RSI vec
eTR 4 II DE 0
J12-1 >-- 100 ,no I 16 'nn ,
CLK ) TB_SEL_1/2 (SHT 3)

J12-3 F
J12-2 /
"___
J12-4 PSO I -'C 2
34
>':Av
:A"A
v
I
14
IJ
I
~ DO
7 01
~-----fC)lG/SM

o FIL STNOBY
(SHT 4)

(SHT 4)
J12-5
J12-7
~ ~
>-"
JI2-6/
101
PSI
104'
-'l\5. 6
7
'AvAv
.v,
• v,
:Av 12
II
10
,~
B
13
14
02
03
04
I, 0 eT~STNOBY (SHT 3)
, J12-8
J12-9 )JI2-IO
-- / 102
I ,'A

1: CI PFJii J~j
7 17
18
05
g~
OGTe (SHT 3)

I I 1-
v C2 C3 C4 C5 C6 C7 C8 EXP _ON (SHT 3)
JI2-11;"=-. PS2 47 470pF 470pF 470pF_ 470pF 470pF 470pF 470pF 470pF
10 GND
J12-13 ~12:> 103 -I--I~'I
-~ -I~I
-~ 74LS374

~ ~:~~:; ~:: ~DS4J / _ _ _ _ _ _ _ _ GNO - GND

+5V

1:
U6A AD_CHI (SHT 2)
'" JI2-IB - GND - GND - GND - GND - GND - GND - GNO - _ U3
~ J12-19 ~ : RST I IJJ AD_CH2 (SHT 2)
~
2 RST STI-
vec 20
~ J12-21 ~20 )--105 I
CTR II OE
CLK ~ AD_CH3 (SHT 2)

g"-"'' , ,' "

m ~12-22 / R8G
o J12-23 :- 74LSI4
>AO_CH4
I- --;;;;:-24'
J12-25 ~=-~
~26
PDE
/
106
1
_I
t
+5V 1.5K
GND
"",_-~~cJDD
7 01
00
01
2
5
6
III
(SHT 2)

JI2-27 ~
J12-28
/>- I _ ""=_-'Igug~
14 04
02
03
04
9
I:
15
lOAD_RANGE (SHT 2)

J12-29 ~JO) 107 IIIII RB5 +5V 17 OS 05 ; 16 ~ UAINGA TE (SHT 3)

JI2-JI ~32) RESET ~ >m I g~ 06
Q7 VUE (SHT 3)
J12-33 ~J4 >- 1,1
I non I
2
16
15 ~ AO
UI
VCC j-l§..
10 GND +5V
JI2-35>'::-
JI2-36~
"
J12-J7 ~3B" EXP SYNC
I 5
.Y.
'.v
14
12
,.{<
3!1 YO 153:rm
YI 0 ,4 STAT5 -=- GND
74LS374
J
HUUU:
6 II GL Y2 133T(rs:
J12-J9 ~
J12-40 ~~
"LINE SYNC 28 .A
.A
~v
<.~ 10.=11
9
,I
' I
L-~
I 6'
G2
GI
Y3 iol¥----
~ ~:~ m~; III I ,
RS3
10K

" :.: ': , , :' ~

9
_ C9 CIO Cll CI2 CI3 CI4 Y6 0 CTRL6

{fI~~cr"'f'""
2Icnltolr--II.OI..oI-.t"II"")IN
(SHT 6) LINE_SYNC C;- +5V
(SHT 3) EXP _SYNC C':,-- - - 11 <=J TB2_HOT (SHT 3)

STA T4 U4 I ~ ST2_UCD (SHT S)

VCC· 20
-=- GND -=- GND -=- GND -=- GND -=- GND -=- GND L:E1~ STLPCD (SHT 5)
,I, H-H+---(..(I=~::J HSRI_RDY (SHT 3)

AII~
A2
A3
A4
4
6 ~
HSR2 ROY (SHT 3)
TOI SLY (SHT 3)
A5 7
A6 -0 TB2_SLV (SHT 3)
A7 9
A8 -0 FlL_SBSJL
(SHT 6)
+SV

-=-
+
GND

US
+5V
>. . z< RS4
lOOK
'TAT.5 l,..IGT vce' 20
LlidG2 S!I01lcoir--lwltlll-.t
SF _PRP _REO (SHT 3)

AI~~
YI
A2 4 C] FLUORO/SF (SHT 3)
A3 5
'---- A4 6
A5 7 -0 AD_BUSY (SHT 2)
A6
A7 9
A8
REV. DA TE CODE ORG, lAPP, 1/0£0:71
DO 9271 TCS 4294.262.44
TM/RF FLUORO FIELD 110 PCB WI HFF 74HCT541
01 9290 TCS
D2 9341 GP -=- GNO
03 9352 TCS CONTINENTAL ~----------------------OSTAT6 (SHT 2)
04
05
9352
9387
GP
GP
SHEET I OF 6 X-RAY ~-------------------------OCTRL6 (SHT 2)

06 9533 WLW CORPORA TION -D RST (SHT 2)

8-46
 /". ,~ /-'-

C
II
(SHT I) AD_CHI

(SHT I) AO_CH2 C~
(SHT I) AO_CH3 C" I +12VA
TP3

(SHT

J
+12VA

Cil

.039uf
RI
TBI-7 ~ CIS

~
+12VA

TPIS .039uf
CW
R89 -12VA +12VA
CAMERA ~
RII
10K
2 3 U8
JPI 1-2 fOR CCO CAMERA (NICAL) I VOO 13 20K
••• JPI 2-3 fOR SOLID-STATE PICKUP IS INI
JPI 9 IN2
8 IN3
-12VA IN4
R4
10K I~ SI 01
CW IIS2 02
S S3 03
S4 04
CW NC
R5
10K
>( '\ GNO VSS
SPOT fiLM AOG211A

I
INTERfACE GNO

~, 'VV'v I~I_I_-~ "t

RS .;>CW
""" ---jr-----l-
'" >:---( -12VA - AGNO -=- AGNO
~ ~

+SV
+5V -=- AGNO -=- AGNO -=- AGNO -=- AGND
(SHT I) 1/0[0:71
U9
14 OBO VOO 24
13 OBI
II OB2 CS8 r t C 5 9 +5V
10 OB3 .Iuf L J I O U f
DB4 VDUT
OB5
__ OB6 OACGNO
CTRL6 DB7 -=- GND 018
STATS 16 ES MB0201
(SHT I) AD_Sf ART 15 mi"
(SHT I) AD_RANGE 18 ~ VINlr2~3~r-------------------------~--------------------------------------------------------------------------------------------____________~
4 RANGE
(SHT I) RST 2~RESET AOCGNO 22
20 ~LTK 019
(SHT 1)
AD_BUSY 19 BUSY "B0201
(SHT 1)
12 OGNO VSS
(SHT 1)
A07~b~
GNO
-=- AGNO
R13-
6.19K/I¥.
- ACND

GNO -=- AGNO

REV. DA TE CODE ORG. lAPP.
DO 9271 TCS TM/RF FLUORO FIELD 1/0 PCB WI HFF 4294.262.44
01 9290 TCS
02 9341 GP
03 9352 TCS CONTINENTAL
04
05
9352
9381
GP
GP
SHEET 2 Of 6 X-RAY fOR OTHER TBI CONNECTIONS SEE SHEET 3

06 9533 WLW CORPORA TION fOR OTHER TB2 CONNECTIONS SEE SHEET 3

8·47
 ,~ ~. ~

+24V +5V +5V +5V +24V +5V

+24V

R21 R20 RI9

" THERM SW2 220 220 220
TB3-2)

.:~E:XP:O:S~E:_'SY~N,c'---t--r-~;;;~~8~~~~~===~J~I=:~~
" 24VRET
TUBE 2 TB3-3/ RI5 "TB2_HOT (SHT I)
STATOR/ '. HSRI ROY CAMERA TBH • EXP _SYNC(SHT I)
I :~ 0 HSRI_RDY (SHT I)
THERMAL SWiTCH TB3-7> 1.5K/.5W
I
INTERrACE '. 24VRET
TBI-2)~~l
/

" HSR2 ROY HSR2_RDY (SHT I)

TB3-8/
1.5K/.5W 24VRET
7
'8 TBI-5
(SHT I) MAINGATE C~>-------------'

24VRET - 24VRET
-=- GND
VMEC < CAMERA
T81-6 INTERFACE

+5V +24V +24V +5V (SHT I) VME C~-------------'

24VRET
< TBI-IO

STBY RET
R24
(SHT I) GTB/STNDBY C:---------------' <, TBI-12
R90 R23
220 1.5K/.5W 1.5K/.5W

TBI-Ii

(SHT I) GTG
J4 -3
C>----+--II-----t==========~!~~~;===l
i'iiIVEif L---'=_-< TBI-9

TUBE SELECT J4 2 fii2iifR TBI_SLV (SHT I)

VERIFY - L-_ _ _ _-f--, -TB-2-_S-L-V (SHT I)
J4-1 ", 24VRET
'------/ l DR' '. sro CASSETTE
- 24VRET
(SHT I) EXP _ON Cr--------------'
GND / ___ ADVANCE
TB2-1O I

I :::::~
R25 rLUORO!SF (SHT I) +24V
RL
8.2K/2W SF ]RP _REQ (SHT I)

~J3-1
R27 CI9 +5V 02
SPO T FIL 11 TB2 -3') FL '\j\/\,~-<o-----, R39 2.2uF IN4004
IK K4

1"
INTERF ACE : 24VDC 10 OHM
AUXAC

I :::::,
C20
2.2uF
RJI +24V
,","H C64
- GND «~." .. «510
t __
J_ T .4 7uF /IOOV

/ TUBE 1/2
TUBE 2
"JJ-2 H.V. SWITCH
-=- GND KJ lC65
SELECT

I 24VDC -.- .4 7uF /IODV

~~50K I!~ ~. IHllG3
01
(SHT I) TB_SEL_1/2 C: 2N2222 '-.. R26
10 OHM

REV. DA TE CODE ORG. lAPP.

TUBE I
I I <~3-3

,"~,~~,··l "'' '

00 9271 TCS TM/RF FLUORO FIELD 110 PCB WI HFF 4294.262.44
01 9290 TCS
02 9341 GP
03 9352 TCS CONTINENTAL '" '"'H , CO, """ '"
04
05
9352
9387
GP
GP
I I SHEET 3 OF 6 X-RAY SEE SHEET 2 FOR OTHER TB2 CONNECTIONS -

06 95JJ WLW CORPORA TlON SEE SHEET 5 FOR 0 THER TB3 CONNECTIONS

8·48
 ~ ,~ /~

+SV +ISVf

,--II----------<p~--------------------------'9'_1veoIN UIO voo ~

...:."l-OS2
R34

5.6K I1
_ e62

.Oluf /1
OC7
Hl1fl
l' -'
-'
6 ~J
+sv

R36
240
+ISVf r4 PCAIN peAOUT -4r-

R40
10K
22 I
C----'---
~ :~:IN
CIB
peBOUT
PCPOU!
-k. ;'::: fJu3f
1- UI2A
+ISVf

~ ,. SMALL
7= +SV > 4700pf I~ RI
-n
Sf OUT ...!Q... ~ SETI VCC rli-

t
(SHT I) LG/S C 4 ' S ZENER ~ r- r---2- 01 I
I 6 INH 4 3 olt-'---
8 VCOOUT CLKI UI2B

9
U6D
JJ 8
R3S;
4.7K
> OC8
Hllf1
1':::
I
......I--..,+....J
.2 4
+ISVF +SV R43
ISOK

_~_~
~ VSS
4046
4
f-"-- RESI
7
f---'-- VSS
FGNO 4013
OTIC<--
2 8 .--
,-"-
9
SET2
~ 02
~I>CLK2 2'~1'
13

R42 _ 7 FGNO 7 ~ RES2

74LSI4 3 3 240 fGNO - '-«ii3"
+!SV CW < R37 CW :l _~
2 20K ~ R38 _ "-C21 I 16 7 fGNO
< LRG ~ 20K . '2.2uF / lr.
R41, I I SM H~~;3 IF::: 'i +5V +24V
4.7K 3

r.i~I-!!C.j4!==:::::;l
:~
---':::- 2 4 RSO +24V FlL2 SI.1
- fGNO ISO,> 08 k-
-=-
1

(SHT I) flL .STNOBY C IN4004 A~ 1 KI

- fGNO I
J!; 5 24VOC f1L2 COM 1-2 filAMENT

I lq1
OCIO +24V DRIVE OUT

t:J
"::: HIIG3 04 >-- 3
2N2222 C ~. 4 f1L2 LG
+ISVf 2 14. R~S. 09 1 ,
'---'VV\\~-~o__EScH IN4004 ~ ~ 1 K2
+ISVF 7.5K I
+BW ~ E
R44
20K
+ISVf 2.2K 24VOC FIL DRIVE IN /
"- ~
FILAMENT
unA R47 _ fIL2_COM 2-2 ORIVE IN
R46 C23 2 RCI VOO 16 2.2K > +8SVf - 24VRET '--.J
10K 2200pf I CI +ISVf.
~ RESI oI1-'6L------..---+_.
L-----1===T==~~=;=~:=J~~+ TRI 7
A~ 1 Ir 1
I
+ISVf -TRI OT pL- 03 +ISVf os
C2S _~ ~ 8 VSS IN914 +ISVf IN4937 ...~C C28 R51
.Iuf
fGNO 4098 ~ UI3
R48
G
Q2
"IRGPC40 06
.Iuf /IOOV / r- 47K

7
fGNO
~~~ 7 04
IN914
1 Ir ~
10 HIN
voo ~g ~
VS td-- n- ~
C27
T.IUf;,.....
3~ v -r ~23 '-.:.: E
I ~
~ ~ I.1R8S2
C29
R52

1
UIIS II SO ICTE-18 .luF/IOOV :::':::: 47K
C24 _ 14 RC2

~ ~:S2 :~ ~I:S ~~~ tb

L________~=======~'~·
12 +TR2
2200pf

I _ TR2
4098
iITil
02 10

C60
.luF -
- - IR2110
_ C26
/1 'Iuf ~
C
C30 __ _
.Iuf /100V --T'
R53
47K
(
'-- R49 03 07
7 fGNO v_ " G " IRGPC40 .41. I.1R852

REV.
---,r---,....-"T'""------------------r----------,
DATE CIODE ORG. APP.
33 r ~24
(~
'-.:.: E C31
.Iuf /100V -T.L-
R54
47K
00 9271 TCS TM/RF FLUORO FIELD 1/0 PCB WI HFF 4294.262.44 IjT~18
01 9290 TCS L-_ _ _ _ _ _ _ _ _~-----~--------------~-~
02 9341 GP
03
04
9352
9352
~
GP SHEET 4 OF 6
I X-RAY --
05 9387 GP 7 fGNO
06 9533 WLW CORPORA TION
8·49
 ~ .~. ~

+5V +5V +24V +24V STATOR COM

.---:J=l-6
;,
.~9-5

~/~,9-4

LuVAC

K5
24VDC

ROTOR 2
BOOST {,-:

-<T83-1
(SHT I) RTR2_BST!RUN 0 •
STATOR_COM TUBE 2
<i B3 - 4
STATOR/
STA TOR_PHASE
<i 83 - 5 THERMAL SWITCH

STATOR_MAIN
<iBH

+5V 24VRET 24VRET +5V +5V

(SHT I) RTR2_0N n~----...,

R68
+5V

t i t R82
5.6K

I
5.6K
R81
ZI 5.6K
V230LA 10 ROTOR 2
014 056 MAIN CURRENT
1 '/' DS5
TI

J7-I> t ST2_MCD(SHT I)

r"
~ ilfiffON +5V .J r----I~.A"
o R79
R73
~o
u J7-y +5V t 10K IN5228
3.9Vz
10K

XR-1427

-=- GND
SOLID-STATE lGND
+5V +5V
RELAY SSRI

V>
...
+5V
i t RB4
5.6K
I- RB3

~z JIO-I "
/
SSR_LI 5.6K
ROTOR 2
0 015 OS7 PHASE CURRENT
u
SSR_L2
q J10-2 ' \
z / ST2]CO (SHT I)

R80
R74 ~026 10K
10K ~~§g8

XR-1427

REV.
00
01
DATE CODE
9271
9290
ORG.

TCS
TCS
lAPP.

I I TM/RF FLUORO FIELD 110 PCB WI HFF I 4294.262.44

-=- GNO
GND
-
02 9341 GP
03
04
05
06
9352
9352
93B7
9533
TCS
GP
GP
WLW
SHEET 5 Of 6

I CONTINENT AL
X-RAY
CORPORA TlON
8-50
 ~ ~
~

TP4 +15Vf

J8-1 "/
16VAC C34 filAMENT STANDBY
.Iuf /50V GATE DRIVE SUPPLY

16VAC RET
J8-2)

II R59
_ fGND

IV
1.5K/.5W
12
0 0 LINE_SYNC (SHT I)

R60
7.5K

filAMENT STANDBY
AC SUPPLIES

JS-S>-
W IN4937 - GND - GND
+85Vf
1
- GND
USB

.--J'Ji'>oL
~4
USC

JS-6>- .--J'Ji'>oL
DS3 1 ~4
flL SUPPLY - GND
ON
R57 filAMENT STANDBY
" 60VAC
J8-3/.r--- 33K/2W INVERTER SUPPLY
R5S
lOOK
ISEE NOTE

60VAC_RET
J8-4 "-

- fGND
+5V
fIl_SBSJL (SHT I)

~'>
+5V

OCI2
HIIDI
GND
JII-2

+5 +/-12VOC
SUPPLIES
-=- GND
JII_4~A -=- GNO

AGND
JII-3 ';.
/

TPI2

JII-5 > -12VA

+24V
TPI3

~)~~+~2~4~V__~__________~~________~____~

REV.
00
DA TE CODE
9271
ORG. lAPP.
TCS TM/RF FLUORO FIELD 110 PCB WI HFF 4294.262.44 I~).
24VDC SUPPLY

24VRET~
··"u.,
-
030
ICTE-22
01 9290 TCS
~
02 9341 GP
03 9352 TCS CONTINENTAL - 24VRET
04
05
9352
9387
GP
GP
SHEET 6 Of 6 X-RAY NOTE: fiLAMENT DRIVE SUPPLY AND filAMENT CONTROL SUPPLY (fGNO)
06 9533 WLW CORPORA TION ARE CONNECTED AT ONLY I POINT -- 010 PIN 4 AND Oil PIN 4.

8-51
 +5V

K
V
( Rl1
56
I
N
V
E
K2 R
TB2-2 T
E
R

G
RIll A
74LS32 C27 T
Kl E

.IUf~
TBl-2
-Fll GATE DR. 1 D4 D
lN4937 R
AGND I
8 R13 G4 V
TP2
7 HCPl2211 120 TB4-1 E

FIL SUPPLY FAIL K4

74LS221 TB4-2

-=- 5VRET 74LS32

+525VOC
TB5-1
C30 l7
+15V l6 +12V
C29
.,uh-- 'l.
.V~ 15VG
5VRET
K150

C7

+~Vh
2 8

IC6 IC5 .IUF

lN5240B ~

Cl~
HCPL2211 3 3 -=- 5VRET IC7

HCPl2211
3

170VDC Rl2
TP4 47K

C2l
1000UF
2S0V COU
Cl2 -VIN
10UF -VOUT 1
C22 o35V

RS684
1000ur
2S0V
r----r--.J.-J HI'B-121S

SECONDARY OF
WUL TI-OUTPIJT
TRANSFORMER ASSY
Jl-6 16VAC
_ _ _ _ _ _ _ Rl8 __r __·__---4__~R27 \,---
100

TPl D13
lN4742A

+15V
REV. DA TE CODE ORG. APP.
170G
00 9855 WlW GP GA TE DRIVE PCB 4294.262.50
01 9875 WLW C17 C11 NOTE: R12 ABOVE
10Uf' O.IUF IS MOUNTED THROUGH T1.
20V
CONTINENT Al
A SUBSIDIARY OF
TREX MEDICAL 15VG

8-5
 +12V
+5V
+12V
+5V K
C21S Rl1 V
~56 I
2 .1UF G2 N
"":;'01--~_ AGNO TB2-1 V
Jl-l >-----' 7 K2
E
R
TB2-2 T
E
R

GJ G
TBJ-l A-
T
KJ E
TB3-2
D
R
I
G4 V
E

RJI5

+525VDC
J.IIK
+5V TBS-l
ClO 75K 75K RETURN
+12V 2W 2W
TBS-2
2
.1uh

l00PF 2 ~ 5VRET
IC7 C7
7 GNO 8
~ 3 5 VCC
ICg
ICS ZI .1UF
HCPL2211 ~
3 lN5240B
GNO
5VRET
3 5 HCPL2211
HCPL2211 A-GND 170VDC

R32
47K

R20

RSI
33 Rol3
170G O.5W 47K

+5V +15V

C29

.nF~
100PF R34
R44 47K
4.7K
ICIS

HCPL2211 3

REV. DATE CODE ORG. APP. R35

47K
00 9853 WLW GP T.. GATE DRIVE WITH H/F FILAUENT PCB 4294.262.51 C21
01 9875 WLW
O.22UF

SHEET 1 OF 2
CONTINENT AL IRG4PC40UD I..E_ _ _ _ -------40----J
A SUBSIDIARY OF
TREX MEDICAL 170G

8-53
 +12VA

+VOUT
TP6 +12V
SECONDARY OF
MUL TI-OUTPUT COU
TRANSFORMER loSSY
16VAC

16VACR
HO-241SD
16VACR
TP13
16VAC

(
+15V

C17 cn
10UF O.1UF
20V

15VG
+5V

h~
r·
-r>.,UF
,UF
15VG 170G

~5VRET
--

REV. DATE CODE ORG. APP.

00 9853 WLW GP TM H/r GATE DRIVE WITH H/r FILAMENT PCB 4294.262.51
01 9875 WLW

CONTINENT AL
SHEET 2 or 2 A SUBSIDIARY OF'
TREX MEDICAL
8-54
(

+12VA
R21

TP6 +12V Cl0

SECONDARY OF
MULTI-OUTPUT 1700
TRANSFORMER ASSY O.IUF
16VAC
16VACR 12VAGND
HD-241SD
16VACR
l000UF ca TP13
16VAC SOV

(
+ISV

C17 cn
10UF O.IUF'
20V

TP5
15VG
+5V

h~ 15VG 170G

r·~5VRET
r·
1UF 1UF

--

REV. DATE CODE ORG. APP.

00 9853 WlW GP TM H/F GATE DRIVE WITH H/F FILAMENT PCB 4294.262.51
01 9875 WLW

CONTINENT AL
SHEET 2 OF 2 A SUBSIDIARY OF
TREX MEDICAL
8-54
 JI I '
-,JI-~
v 07 XAD7
XAD6
,
/
JZ-l
,
l
r
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JI-3

JI-5

JI- 7
JI-'~
Jl-~
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JI-9>--:-...J..CJl2....----1
+5V
ut,-IOO
eft 10'
\ '4 102
:::m: :8~
UZ
VCC 19

SEGj KZ- Y
SEU If- t:
~~~-g r.;.Si t:
+5VD

~~~" ~ ~S:bl
i:' ~
~ ~,2, f te':/
d
mAs xl00

/'
i:'
t'-

~ I p"
' ~0
A4 '
2
d
f
mAs :<10
058

}'"'OI
_ b
f

"-.s).
e 9<:

I
4 1
,
~
0

,~ 1/e~
kV xl00
055

r1-01 b I'l'
".4
l'
' b
0
d_
f

l~tlegcl
b
kV xl
053

C )'"'01
~ ~
rl4,
-I 051
r+4l I POST
I ~'
r-f-!2 J
r+4l ~IDS6
rf4l mAs ADD
::::

XAD3
XADZ
XADI
~ ~Z~ ::~:
,
,
/
JZ!s

JZ~
'J2-6
)-

J
-~-10 )>-,.~"'""'~~''-----'
25
g 8: ..£.-. g 9 _d_ . XADO / " J2-8

P'"
'05 ,-\f-g 9 11 9 9 9 "£'-.
'06 SEG:E • " . '--"- dp CA dp " dp CA dp dp CA dp SA[1:8J dp CA dp XAD[0:7] LCDZ , / c
0:::
~
Jl-11
J1-12
--;:-
»."",
.'.-.O'-._ _ _ _+-+I-+_~
107
SEGJ ~
SEGii~ rL v
SA[I:8J SA[':8] SA[I:8J ~'4
W'4 LCD1 7 J2-:; J2-10 §

::~~ JZ~'
w J1-13 r--'--,....-'..='V-----I-++--'
U Jl-1' ,>,"""CO'N-'-_ _ _ _.J ".0 9 MODE DIG , ' 5 0,

~ • /ONO 'fLiil=J[ WI< DI G 2 I

1~~_____~+~5~V_~;J2~3
~ J1-15 / ... _ DIG 3 +f J2-12
_ 'J1-16 »:-":':' _ _ _ _--,
~-.;w",- .J;ND
8:U6 2~ '7

O~J1-17 Jl-18~ LED'-l-l_ _ _ _+f+I-_--if-+-

,>'.......
28 GNO
DIG
8:H'
L-_ _ _ _ _~CO~NL-_ _ 7...:;, J2-1'
J1-19 ' / ;Tri? r-"G""ND"----'.>j JZ -IS
Jl-20 ,,--;--rni DGNO ICM7218A
••t -"""-----74
GNO '" J2-16
Jl-21 w / .,,'"

Jl-20 ... 5VO 1 BACKLIGHT

GNQL

Jl-23 • / "'''0 ON/OFF

+sVD
Jl-2~DGND T ~PI
JI-25 ' / ... ?4V
Jl-26 ,>-'-.Gl..".'llL=--_ _ _+-++---' SA[I:8J

+5VO ~~ ____________~____________~~__________~~__________~~____________~____________~

ANODE xl DENSITY xl0 CM XIO eM xl

+5V BYPASS CAPS
ANODE x'D

1~ 1~ 1m 1m 1m 1m
U' DENSITY xl
VCC 19 0516 0515 0520 0519 05'8 0517
,,100

tt~ It\? ~~ It ObI t' ~~ F"\/

LJQ..

r1'"'01
I IDI
SEG A~7
~~ It \1
;-1} 0
~b
14 102
, 103 SEG-8 , b

~-d 1_d_.
•
5EG:CR~
~
,104
~ H=! /e 9
/~/. ~ H~ /e~ T
IT ledge/.
g
~~U 2. ~ H=~ H!
5 IDS
i:' e c/ GNI._10_uF_ _I..._.1_UF_ _I..._·,_u_F_ _I4-_·_IU_F_ _....
I _._'U_F_ _ .IUF

H
{ f
XA 7 i:'
p6
106
107 d 9 ~ITg_d_.
~~g:~ 4 6 1\ dp C' dp 1\ 0:: dp c. dp 1'\ dp c. dp 1'\ IT dp C, dp
SBf1:SJ dp CA dp
OP 16
".n 9 MODE DIG 1 15 00
58[1:8) I S8[1:8J +-J6 S8[1:8J f-J6 SB[1:BJ j;..J6
WI< DIG'2 1 LED DRIVER BYPASS CAPS
gig ~ ~
DIG 5 583

(
"
28 GND

DGND
ICM7218A
DIG 6
gig ~ '8
1

ILL
OGNI.-,o-u-F_ _
±t.
1. . . 1. . . T
... _IO_"_F_ _ _'0_u_F_ _ _1O_u_F_I
10, L. 10, 1",
....._·_'u_F_I
....._·_'u_F_I
...._.,_u_F_T.J .IUF

XRI , J5-'7
y.? / ,
7 J5-IS
XR' " JS-19
YR. / ,
7 J5-20

SCI 'Js-I
-
SC2 / , J5-2
> RS' PRFP<W , J3-19

YO~"~~
5C3 , JS-/ +5V 10K
'/<J3-18
5C4 / ) JS-4 Ncn<ooo:I"loo ll'lrt'ljE FA,f ""'-

+-.Jrffi<W~!L!<fii~U6~A~ f I
r~;:::=====~~Jr----------------L6.SI.-~/
+5VO
r-------______________________~SC~5~~"J5-S
5C6 / ) J5-6
1_ _
• ',E 20 VCC ..._____+
SV J3-17
t
~~X~A~ODE~',S§'YO ~i2;]~~Et~~f~l
r-______________________ ~5£C7L~'J5-7
~~ 4 14 IYI IAI 4
", SC8 / ) Js-S A , l~~
lAO
l~~ PR P W
+5V
x, , J3-1
~IDO
RS2
'~3-2
VCC 19
10 GND 10K <?
~:g1
8'"8; 'i
U8 ,,/,
r----______________~D~C'L_>~Js-9 § GND 74lS2U r-_W-.w_R!RROL~
9,r;A~~V:C-ccClI6 ~N r-____-lI.L---.:;, J3-3
'~3-4
XA 4 10 ID4 0> _
103
XA '05 x'
~106
~107
r-_______---"0""C"-3_>~ J5-1;
OC2 , J5-10
~
-
'9 2E
U5B

Ir-+++-~_R~R21_~7Sq~8~,_jI~r~XI~~~~~~I!~~~~~~~~~~~y~<~/~~J3-5 I
~~~:iDI~~9t2~Ylo_2~A~OJ"§o~n~~ij~g=u
~
XAD[0:7J

DIG I 15 or' DC4 " J5-12 % A m f..'d 1 r, R 14 I'.i I 5' X

X xo " ,J3-6
Y7 /

Ir-------'~"'~"':-~) ~
v.o 9 MODE
WR
1
DIG 2 23
DIG 3 20
DIG. , II Js-{ J5-,4
XA 2Y3
74L5244
2A3' J.§.. NC

8 GND
~
I
9 I
~
,7
/
~
J3-7

DIG 5
I OC7 , Js-I:
+5V

~GNO
g:U '
DIG_8 ' DCS / , J5-16 U5
GNO 74L5147

/ .
+5VO
j +5V

-=-OGND
ICM721SA
t r +sVO
+5VO
DGND )
JS-25

J5-27
) J5-26
- - ---.l, DE
WRSW 1-"- ClK

XADO
VCC 20

00 2 XR'
13 A
U7

XA 1
T_ DGNO ) Js-2S XAD2
XAD3
Q'
02 9
6

~R~EV~.~D~.T~E~C~O~O~E~OR~G~~A~Pp~.~ CHGNO "- Js-29 XA 4

XA g~RF
~01-+--9~2~8~0--~TC~S~--~ TM OPERATOR CONSOLE DISPLAY BOARD 4494.262.04
~CHGNO r CHGNO / ) J5-30_ XA
XA
OS 16
g~ I
XAO[0:7]
CONTINENTAL NOTES: +SVD AND DGND ARE POWER AND GROUND FOR LED
DRIVERS DNL Y.
X-RAY +SV AND GND ARE CONNECTED TO +5VD AND DGND
CORPORA TION AT THE CONNECTOR ON THE OC UP BOARD. 8-55
 AI:-[O:7]
0,3)

Is~~»g< V,TA"
IICOO:1SJ
[1,21
>
r RS6 _,......,,2l
RSS
RSr- ,OK 2.2K ::: J1~~~
!1l ......, TAl5
+sv 111
~
~--+-r-----------------~-I I ........ TAI6
!1l
U1Z
( .n. vcc\..12--
5=
,n
STATUS
un LEOS
'(.Q. .00
vcc
=
.1.l.
A07
U I ii »< ><<..< > RS7
PAO ,OK
'0/11= PA'
I1J PA2
PA3
PM
PAS
PA6
~ PA7 SW4
P80
P8, :; -......
~~lS<: _'-'::J----------+--1+------------------------------------- PB2
PB3
17.5
I1J
'" P84
P85
P86
j: ......
P87
PCO -::-ONO
R9<> PCl
PC2
U13 +s. 10K? >: ,-li<:12f Ul0B PC3
PC4
I -esY
......, [3]

~Em'nr~VCgC~~~~fiHt~il~2YOQ
pcs
PC6 "'-I,KITlD
;~ 2Y11Ol~""""-""
= 21'2 ~
GNo PC7
[3]

I
._ 07<
=:PREPSW/D
2Y3 ~
iR- t?
"", " 825SA-5 _[3]
"'-I x.,rsw/D
n,21

[1.2~"'"
-
"
U1D " ;.:
~
-;:GND
74lS240
- RSB -STB
[3]

PG~S13~
RS4 ......, [3]
74LS08 2.2K 10K
U1S
VCC SW3
"'I
7~~ P20 ;¢""

7~:
P21
P22
P23
P24 -- --=
t
-
P25
PPORTC ,....,J---------------------------l P26 RS3
[3] P27 2.2K .<:<

~ ~~~_~ P'OE="'="_~
~O
~,~E ...., 5;\-E Pl'
~_ • m
I~~R
[~
~ ~, ~~~
P16 ~--------------------------------+++444~~--------------------------~........
::)::>:~
rl~TA
__ K
________...., ++++++.jJ.____________-l'""")
( [I~' _
...., ~l~N' P17 ~~;_ml,j:li--+
gQ.IXIl..I-':

~~~
L._ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ -

>P~

oA-lGND
8256A
~~ -D~
""1.-J'rjlfOR/D

0:
.5V
U'7
iTo '9. VCC

.AD! nn
.....,.
80
8' .£::) .XO/D
- [3]
82
B3
.:AD! ~~ 84
85
86
87
t.~W] GND

GND 74LS245

-'--'
U1SA
L......j.--.... l ,..-lolif VCC
-'.'->-~~----+-------------~
-,
•
+Sv •. AOO 2 WO 18
1Y'~
-....L i;':~ 1~~.!L

, ~,"=GN...".,..,.D-I
~
~ R24
'o~:
eND 74lS244

-'- / CW LCD EXPANSION PORT

-t5V +5V
3 COHRAST (NOT USED)
., -'->-....:.:..-4----..J
-,
-'-
.'- '""
_'- ,>-..IiIlII..'u...... 1~lIF
i
/35V 1
T·
C9
1UF "
- +SV[~
RS'f [~ GND [1,2,3)
A03 [~ ADl [1,2.3)

AD7 ,. ~ ADS [1,2,3]

f
...... 1

AOl [1.21
.1ND ..1.NO C2f1
10UF /35V U29
I~A~+ vee
.5V .5V
[1,21 ",04 ~
I A03 "#:: ,05" 2l

REV. DATE CODE ORG.

rcs
APP.
TM OPERAT8R CONSOLE
...L lose VOUT I,
1 1m 28
[1] A,(lS

A12;:Z ~
,,06

r·
00 9255 4494.262.03 10UF /35V [1l

01 9293 TeS MICROPROCESSOR BOARC I~~D NC f-L ...... C4 ,UF

[t] ""r(.I RD
02 9376 res ICL7660 I,oUF/35v WR [1.21

03 9417 WLVI CONTINENTAL GNO GNO IGND GNO 1

04
~
9635 WLYI
X-RAY
__~~~____________~____~CO~R~P~O~RA~T~IO~N~ -:- SHEET 2 OF 3
-:- -:- -:-
____________________________________________________________________________ ~8.57
 •• v
r---------~~-~J8-'

r------~f_-------~WolUl...~J8-2
-7 J8 -'4

AOto:71
[1.21
.5V RS9
220
RSl1
2.2K
+5VI r---+-------~---------~~~J8-3
-7 -'S
J8

r----+-----r------------+------------~~~J8-4
-7 16J8 -

{
PPORT C>----+--t-.J.!-p, RS12 -7 JB-'7

~1 ~ ~iI~: ~ ~ :jl l l l!~ ~ !lI !ili l!1l1~ ~ ~!j~I ~ ~ :J~ ];:'~O~GN ~ 0 .16_~~~JB-5
(21
\ r--~~--~ J8-'B

!~~~13~00'4
4 0' 4 ~4 r-----+----------r~~~~J8-6
8 02 5 '2 ~--~---~ JB-,9
'3 03 6 11 J8-7
g~ ...---:---~ J8-20
06 74LS2H
07 7 rGND '----+--------t.......... -7 J8- B
10 GND 8 -=- 47 "'--7'"--~ J8-2'
~----+---------~~~~JB-9
74LS374 U2S8 +----~--~ J8-22
ONO
2f C39 C40 C4' C42 C43 C44 C45 C46
f200PF f200PF f200PF f200PF f200PF f200PF r200PF f200PF
J8-'0
...---:---~ J8-23
-7
~ND ~GNO ~GNO ~GND ~GND ~GNO ~GND ~GNO
" 2AO
, 2A' r-------ir-.........7 JB-l1
, 2A2
- 7 7 "'--";"--4 J8-24
, 2A3
74LS244
~ ~
-7
J8 -'2
...---:---~ J8-25

----~
IGNO

+5VI
IGND
J8 13
- -7
+SVI CHASSIS GROUND
r-_ _ _ _ _ _..r..lil Nil....4Jl0
H <l:i (CONNECT TO
CHASSIS)
RZ6

R25 47
220 r-----"""""'""'-~ J9-1
Cl
f 200P ,
....._ _..:.i:~.w...._~J9-2
ON/OFF SWITCH

~ND

1.........~_:...-:---~J2-'4
r-------------------~------~~-7J2-2

~i <:~---------------~----------------+----------~ IGND CHGNO r - - - - - -....._ - -....."'""'-~--~J2-'5

.sv
-t5VI

+SVI
r----------........... ~ J2-3
.....---------'.,w;:J.,...;.---4J2-'6
.....-~+-------~~~-4J2-4
U22 .....~~--------~~'--~---~J2-17
RS14
2.2K
-:- IGND - 4 E12 vec '6 r1i4-,--u...-4+==+:j::====~~l:4 J2-5
RSlO
+sv 220 'Y lA~~~~~~~~::~~_~::~Jl-~~~~-~r---------"~~~---7JZ-'B
2Y '8
~~ ~_+I-~+ _______ ..Ji.II!l;;.~:- _ _~J2-'9

~~jO'/OC>--~ ~~~~~O~~~l:~~~~~~~~~~II!l~~~~~!II!I!!~~~~~~i!~~~~~~;j~j;~~~~l
,,"",iIIoIIJ=.....;:___ ~ J2-20

X[~r/D l:~~~===~~~~~i3~
P[~~TA/B/D
iffiVO
14-
'8
12
C2J
":" IGND

7 R22
8
R21
-:- 22K r--"'",-::---~ J2-Z4
U238
22K R5H 56
16 ""';;="';"'--4 J2-25
UI9 56
TXO/O
(2)
c>------I--f.t-i E12 vce 10
R5A
R29
~~:::::r=T::J~$~J~
... SVJ R5G 56
(2) t++---:::-;::-_..JVV'v--~-----+l'A IY '5
ST.
U15-4 R30'K 2A 12
74LS244 56 R58
[1J
2Y~=:::::"....J
22t-"
DSI 'K
RUN R31 '4
GNO RS13
220 3Y 1....------C)+24V
32 0,21
R32 lK 5
4Y 1....--------iDfl~t~]
,A 42
lK lK 13

2A R28 R50
2K +SVI ~J4-6
~J4-20
3A 5 22K R23
3K 6

4A 22K ....
4K C48 U20 r--------.....l~4J4-2 "'o.Z
0 0 ....
IGND ,OUF /35V C1+ ....J en
Cl- r-------...l.lI~~J4-3 '"
L..:===:tjC2+
+SVI Z

5 c:::
r - - - - - -........~ J4-4

RXO/O§~~'A~
cz- t1'I El

r.======:i'~~~i~~
r-;::===='2t ,rdg~f t~~4~=~~~~~~p~d~-----::~~ ~ 8~z
C2J • DS6
ffi!O
C2J
2A
D L----------------------jl----~~~vcC1
, if :j'R'0UT RUN 13 J4-5
R20UT R21N ~ Z
PREPSW/O 3A 5
L'::==========~§;~E~~~ \~~ ~~jE;~~~J 7_J4_-_7_~I2.
[2] ~

'A2 lY2
GND
10No IGND __
.
XRAYSW/O
C2J
4-A
g

+5VI
'0 GND
'A3 lY3

74LS244
MAX232 -=-
r-_....:K",EY'-_-7 J6-1
IGND
KEYSWITCH
~J6-2
REV. OA TE CODE ORG. APP. ~GNO '
TM OPERATOR CONSOLE
00 9255 TCS 4494.262.03
MICROPROCESSOR BOARD
'-___--___. . . . . _. . . ~-. . .~-. .T. .~G;
01 9293 Tes PRres' ) J7-1
02 9376 Tes ~--------------------------------------------------------------------------------------------------------------------~~~~J7-2 HA~D~~~CH
03 94,7 WLW CONTINENT AL ~J7-3
04 9635 WLW SHEET 3 OF 3
X-RAY lGND J..IGND '
CORPORA TION 8-58
(
Kl 7
T92S11A12-120 TI . .-
~
1""-.2..
I
115VR 10 I
Jl-2
115VAC ~
140V
Jl-5

TCl _LC2

l T T
FLM O 1UF O 1UF
Jl-6
200V
. 200V
.

+85V
Jl-4/

Jl-3) 72V

Jl-l" 115V

Jl-7>--- N/U T3
1
I I
O.lUF
A. ~1 A 200V
VVV
5K

c .5W T41

MP240D5
K4
O.\U~
20QV
4 ,- 3

1
~~ 2

+24VDC , 1
J2-1
i.
I
-PREP I ?
J2-2 l'
1.o.......L
I b
J2-3 FE
:...J 7 I L-Al

~
K2
6 24VAC
J2-4 FERET 4 I
I
R I
~ K3
J2-5 RL 7 24VAC

J2-~ N/U

REV. OATE COOE ORG. APP.

00 9639 WLW HF FILAMENT POWER SUPPLY PCB 4194.262.24

( 01 9660 WLW

CONTINENT AL
X-RAY
CORPORA TlON 8-59
(
0,;: I......
m""~ .-r---~I'~jT,I'l1lt~··~----~r--------__'I ~T~ oc
• i I~ ~"D ~"K
./{II"""" RET 2
117VAC 1
.J8
L-II--,\3",11' ? l
. I~
..l It
'';;'''._:
6
.::
.'.lo
E-..
Y4?lA1 r
1102
*p-----..---~---+_-,t.'

~r "I->
C6
I"~~II-----+--r-,r---r---r--...l---JI

R7
C7
.I,r
r'~"~--=::-t
1280 ~
I......
L' ~Z9
-.- C9 CIS
~ 'i ~ I~Tt-22 "1-0 Tii ~ TPO
J9

•
2.yDC
24YDC
,'\.
orr!
[,
OPERATOR C<lHTROL
OIl. lIACIO'I.AI£)

~ ~~ ~
YO

RIO.. AXIAL ' [

'~r "im 2i!tB 10KlI

~-

.-
24VAC RtTURtI
@
~ JI

t-t--~-i~ : : RET) FIELD 1"0 Dl Itl4 ....

.<YDC 24YDC RET
'A
N ~ ~
+4Y
YR~ M:n1k
~
( r" I .!...
.<YDC
24Yl1C. RET
}

IItV
I'M.. LI

~
~ ~9 ~
.!...
2<=
24Vl1C RET
} 10 FIELD I/O
C2
r~ .... R3

.....
.I,F
~I~
C3 R2
2i!1!9
10KlI C<

.~ ""'-'
1'' 1' .0;
~'~
D3

"
IItV
J6

L------------r================:::;:==::=lE~! ~}
rl~I~{-~~y~u~JI---++-----"t-----------_+--__,
Cr"1 COHTACTOR COIL

+24Y .24Y
PIR ASSY
L2
~ .'in .J?

rL==-tl~,~
'A
R£TtlRII'\. MAIN M2 CONTACTOR COIL
~ "i!J 2<\IAC!

SR2
• 3
< 3

• 2
V I

I
c Continental a subsidiary of Trex Medical

Relay/OC Power Supply PCB

4294.262.35 (1 of 1)

9487 I Rev. 00 8-60

 (' (\. \

+12V
.sv
.,... ." '"
J ,t, 7f- RBI
+l2V
<..
<;;:
R1Dl
'*
R96 leJ
,----<:= -STAT_D (SHT
-51,1.1_1 (SHT 8)
8)

;::'"
,>R1j2W
LK JJO
R1/2W +5V IK < L--I~'-l:~
AD vee
r RBG';;' '" R96.-7f"'"
YO ',:J -STAT _2 (SHT 8)
... . ..
A" ,/\/\ _ iI c::::J-STAT_J

** ~-l'
---I-~GL t.1
*" R77 430 Rfo R99
43' ""I lRr, G2
Gl
II
Y4
-CTRLO (SHT 3)
IT 8
fal '17 ~ ~ -CTRLI (SHT 3)
~
016
011
lN5228
lK"*
010 J.JK lK lN522S - J.JK IK
H- 1 -CTRLZ
IK m914B 74LSIJS c:J -CTRLJ (SHT 4)

~----f\~6~211r-t-~~----1-j-----1-~j~
, PSO R64 IN914B R67
JI2-J
I J12-16 )JP~s~''-'VI/lr_+-.....------I---1>----_+---¥i [C20
62
J12-15')'_ _ _ _ _ _I______________~~ --"-
+-----------"-4"I ff
+12V ." +12V

~
." [C2C
N.C .

:;'< it,

~
. "'--cJ RESET
IK
RB7
J*"
>", LK '"
'(' RI/2W .SV (SHT 3)
>R90
rRI/2W *"" ." RIDS¥-- 74lS132

IN .t---- ~
... ..,. j<

t ~8B '"
010 .JL 1< RI12

JJf' ~;; im * ~~:'I f~~

R84
""'021-
R1I1
02' RI09
~
."
IK [C22A
1N5228'" >
;> IN522S
IN9148 J.JK
IK
1N9146
R65 3.JK

5f:::'~
R68
JI2-8"~
1C26
* -24': -POE

J12-7
62
~1B! 0 J !J12-2J ~
62
I -teND
+5V
I •
74lS74
+IZV 1470 pF .. sv +l2V

i [C22B

0*1
JUMPI 1-2 fOR TUB.E 2 PCB

.... '" 5
-*-
RID7
JUMPI 2-3 FOR TUBE I PCB
II' Q~
~
GLK
ROS LK JJO
RI/2W o

IlJ
.:)to
JJO
"*
"'" .'v...- '" RI/2W R79 4JO
IC2B
if 0 oIL

" "'---'
6 6
~ ...
AA' .SV

H!)
JUldPj· 74lSH
J.;

-><,;"t
f :.Wijr.
'?'" ... *' * 74lS132
LK >R94 ~
RI05
IK
OLe "'"
RIOJ
10 •

lN5226 IN522S'" IK ~
lN9'''' ' "tv
lN914B '"
~",,,-"\'!6e'~---+---J~--"-->---l!---4C~
J.JK

r
J12-12 ,
P52
A'" -RADE2
R59 IC2J
CN
62
62 GNO >R718K
JI2-1I>--------.4----------~'l'J:;:;~:;:::. le2A
470 pt
" JI2-32~
Re

1.
41
REV. DATE CODE ORG. I APP. I
00

"
9352
9487
OJW
WLW
I TM %f
SH[TIOFB
RAO fiElD I/O PCB
4294.262.21
R7'?
I.SK
,"
C2174lS132

I
02 9526 WLW HOpI
03 9540 WLW CONTINENT AL
X-RAY
CORPORA TlON
.". NP7 /US7'AI!.GE.J>
eND -=-- eND
I IOV

GNO

8-61
 O~'"
~ ~

+5V
L2

~
... Wv- 5.6K TS

CX240D5
;--- 117 V~C

-TABLE C .... l..IIII. ....

(SHT 3)
# ...
TBL BKY SEL
- " N
ICII
~ W+
U ""
5V
.t.

~
I AC ,,. MOVI
R23 VCC 8 , .. TR' Rny
I J~V230LA lOA -...!
TABLE

~: rF "t" ' (~)

-~,."
2
A
BRI T. BUCKY
L3

~...
4 3 117 VAC RTN I
A ~9
'Vv
;> GND~
5.6K
< R21
7.5K I?OUJ + rAC
4

HPCL-3700
-=- GND 2 VM48X N.C.
--< II

CX24005

-WALL L'
.... ~ .... .~
7.5K
117 VAC
1 10

(SHT 3) f'f' ...

WALL BKY SEL :i
- '"
8

~ ~,.

~
MOV2
AUX WAL ROY ~ WALL
L4 BR2 T. ~~V230LA lOA -7

~
~
BUCKY
4 3
I~ 117 VAC RTN T
5.6K -9

2 VU48X
N,oc --<.f -6

CX24005

-AUX L..;
. . r--:; . . 117 VAC T 3-5

(SHT 3) f'F
, AUX BKY SELECT .f
- '"
3-3

~
'--SSii"J

J14- /
117 VAC
1
117 VAC

(SHT 4)
BR3
4
T.
3
,r MOV3
~ ~V230LA lOA
AUX BKY ROY

117 VAC RTN

r B3-2

B3-4
AUX
BUCKY

2 VM48X
N.C. ---( IB3-1
,,117 VAC RTN
J14-
1- (SHT 4)
.'. 117 _VAC_RTN

REV. OA TE COOE ORG. lAPP.

TM/RF RAO FIELD I/O SCHEMA TIC
00 9352 OJW I l 4294.262.21
01 9487 WLwT ] SHEET 2 OF 8
02 9526 WLW
03 9540 WLW CONTINENT AL
X-RAY
CORPORA TION
8-62
 ~ /-
~

,--,------------------------------------------10(00:o71
(SHT 8)

,-----CJ -CTRU (SHT 1)

- C J RESET (SHT 1) t
+5V

4 OE
IC4
VCC 20
+5V
~~~~~~~.
-
>~ ~. >. >'~ > RI
220
L
+24V

<T81-5
eLK Nf"'l,* tDr--.ccO'H2 ICI4 "-
R69 I IA ~IC 16 -PREP /,
JI2 2 >-_ _..J\ 1000 J DO 00 2 2 15 "TBI-9
- / 7 4 01 0I 5 IK IE C"'--
4 I 8 02 02 ~ ~ 2A 'x.
2C l~ -FlUORO SEL /T81-2
R70 13 03 03 12 2K '""",-2E P'--
J12-6 " IDOl 14 g~ g~ 15 5 3A 'xl
3C 12 -HIGH SPEED SEl
/ v
47 1~ 06 06 19 6 3K'"""-JE rJl-- "TBI-8 HS2-~PX
07 07
li71 10 ~ 7 4A 4C ~O
'xl -PREP ROY T81-1 ANODE ROTATOR
J12-10 '>-__-'\ 1002 rGNO 4K'""",-4E r - -
47 -='=-74LSJ74 PS2501-4
- GNO - TUBE_INO
1\ R72 1003 (SHT 4)
J12-14 ,>-_ _..J\ ~ ICI5
47 TUBE_2_SEL_IN '------' I ~ 16 -EXP ON
(SHT 4) IA IC I, . ,,181-3
R7J IK IE-
J12-18 " 1\ 1004 ~ 2A 'x. 2C 14 - TUBE 2 SEl "TBI-4
47 HS2-~PX { RJ7 2K'""",-2E f.!L---
R74 ANOOE ROTATOR T81-6.~ HS RTR R O Y . J ' 5 J~ JC'xl If ;~ -HS_RTR_ROY
J12-22 > 1\ 1 0 0 5 " HS VER 1.5K RJ8 ~3 '''''''-JE f-'-'-- (SHT 8) _.
47 10[00:07) IBI-7/ v 1\ '---.!L 4A 'xl 4C I ~O:~ -HS_VER 0 V 0 V;' V
15K ,.-- 4K '''''''-4E r--- (SHT 8)
, R75 1006 +5V PS2501-4 '\"/
J12-26 ' RESET '\ ,-'- 24V _RTN
47 (SHT 1) IC5 '. GNO -=-
I OE VCC 20 24V _RTN
1\ R76 1007 -CTRLO o-r-,- .~.III,-""CLK ~Cl-TABLE (SHT 2)
J12-30 ( )
47 SHT 1 J 2 ~ -WALL (SHT 2)

~9;=====~1
i~~~~~3~.00
8g~
4 01
8 02
01
00 9
02
g~
~
-AUX (SHT 2)

"'---J -ROTOR_ON (SHT 7)

C24-CJI C24 C25 C26 C27 C28 C29 CJO CJI t :; 05 05 t:--J La
12
-RTR_BOOST/RUN (SHT 7)

470 pF -I~70P-I~70P-I~70PI~70PI-~70P=I~70PI-~70PI-~70PF (SHT 4) r

:: g~
CND
g~ 1~I L--o
.
LO L----oLG/SM (SHT 1)
-FIL_ENABLE (SHT 4)
-='=- 74LSJ74 -('J - TUBE_SEL_IN SHT 4
CND

CND GND CNO CND GND CND GND CND

REV. DATE CODE aRC. APP.

00 9J52 DJW T~/RF RAD FIELD I/o SCHE~ATlC 4294.262.21
01 9487 WLW SHEET J OF 8
02 9526 WLW
03 9540 WLW CONTINENT AL
X-RAY
CORPORA TION
8-63
 ~
~

RESET C;
(SHT 1)

+5V +24V

101
10[00:071 Ir.S
rn,---------i---"'IA~I 14-1 MAIN ;ONTACTOR
(SHT 3)

1000
I -=- GNO
~--'i20

DO 00
+---,-----------'(~3-1 +24V
1-H----t-------t---=U.~~4-2 -C CONTACTOR
R

"F
7 01
8 02 02 •
IJ OJ OJ 12 "=:J -FlL_SEL
+5V
14 04 g~ 15 (SHT 3)
17 OS 06 16
I 06
07 07 I
~3-1
220
R26 +24V
10 GND 5.6K R28

7lli'ffi 220
GNO R29 +24V
+24V
+5V

~
:;:.. L7 220 FlL DRIVE
HLMP-KI50 R30
R24

"" - TUBE_SEL_IN 220

(SHT 3) KI

RIO
7.5K

TUBC2_SEL -tB2 - 5
1 ~Ol
II
12 F1L ORV IN (J2-1
VI30LA IDA C B 2N2222
SSR4 -Fll_ENABLE 7.5K "
--<;;2-2

117 _VAC_RTN ~B2-6

II FIL DRV OUrS2_3

R25 \"/'
(SHT 2)
J;4V_RTN
, I
• (J2-4

N 117 _VAC_RTN
+5V +24V
5.6K
FlL_SM (JH

(SHT3)~
-TUBE_INO
.. ~ '"
.
+24V
--<JI-2

J8-1~
/
rr
V47ZAI ~B2-J 'I 1.44
2 .'t n
•• n --..I. I, FlL LG (JI-3

rr
L..-
SSR5 R 0 CONTACTOR

UOV5 5.6K
l5
C43 LI 7.5K 1 W'-o: If "'11'010 K2

'l.
JB_2,24 VAC RTN <TB2-4
/

A 02
2N2222
REV.
00
DATE CODE
9352
ORG. 1 APP.
OJW T 1 TU/RF RAD FIELD 1/0 SCHEMA TIC
4294.262.21
7.SK
1 '¥
01 9487 WLW I J SHEET 4 or 8 LG/SU
02 9526 WLW (SHT 3)
OJ 9540 WLW CONTINENTAL
X-RAY I 24V _RTN

CORPORA TlON
a-64
 (" ~
~,

t24V

A~'

J. .
(SHT B)
ICI8
t24V . i.5K Vz.
TB2-1"
SPARE J 'IKA * ' CIE 14--<=1
~ , SPARE
0(

R~~ 2~~2C
TB2-2/

~.5~ 'h
3
2K 2E !:lI:: t---O -TOMO_'NTLCK

FOR EXPH NO "UP" '-2 JUMP2 2.2K TB2-9) TOMO INTLCK ~ 3K

3~*3C I-1f- l--<=J -TABLE_INTLCK
3E J-lL..
FOR EXPH NO JUMPER 2-3 ~ ••• IW I r
~ 4~*4C H,L I---CJ -oOOR_NI_INTLCK
R2 I 2 3 TB2-1O) R33
TB2-17/ tlSV FROM COIL • ,---!l.. 4K 4E .-L- -
IK I.SK V !It PS2501-4
0.5W TABLE INTLCK
TB2-18)--- TB2-7
R34 _-,:::-GNO
TB2-6/
TB2-19)--- -
~.5K 'iz
~OOR " INTLCK
T82-2~ T82-13

~
T82-14
T82-21)---
'iz
1.5K
DOOR 62 INTLCK
T82-15

TB2-16 '; VVv-

Yl
1.5K
ICI9
'-.
....,J- t-l¥-
...1... ' A * ' C pL
TB2-11; AUX INTLCK
T82-2~;- IK IE
(SHT B) TB2-12·;

TBZ-Z:j>-·
~ 2K
2~*2C 14- l--'=:J
2E .-JL
-COLL HOLD
24V RTN \/
(SHT 8)
5 12
3~*3C
,--2. 3K 3E J-lL..
-<--J -DOOR_UZ_INTLc1

.--+
~ 4~~4C
4K
10
4E t-L-
-0 -AUUNTLCK
PS2501-4 --':::-
- GNO

REV. DA TE CODE ORG. APP.

TM/RF RAO FIELD I/O SCHEMA TIC
00 9352 DJW 4294.262.21
01 9487 WLW SHEET 5 OF B
02 9526 WLW
03 9540 WLW CONTINENTAL
X-RAY
CORPORA TlON
 ~,
/
~, ~

+24V

+24V

tv ~ I:~ <~:~ ~ TUBE_HOT (SHT 8)

TB4-2 '; THERMAl SW CJ -INV _SUPPL Y_O~ SH T B)
/

TB4-3')~------'
CI4

PS2501-4
J6-1) -INV SUPPLY_ON

J6-2', 24V _RTN

/
- GND
24V _RTN +12V

JII-4 t
PASS THRU fOR
JI\-3>---~
fLUORO fiELD I/o
JI\-5
)----,,+/-12V_RET
\/
+5V
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JI\-i) ~+~5,,-v_ _ l , , , ,
C33

JII-2'
/'
5V _RET
~ , ~ ~ ~ ~
C2-CI2&C33:.luf 50V CERAMIC AXIAL
~
----~/
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-=- <E------ GROUNDS ARE ISOLA TED

GND

REV. DATE CODE ORG. lAPP.

TM/Rf RAO fiELD I/o SCHEMATIC
DO 9352 DJW I I 4294.262.21
DI 9487 WLW I I SHEET 6 Of 8
D2 9526 WLW
03 9540 WLW CONTINENT AL
X-RAY
CORPORA TION
8-66
 ~" ~ ~

+5V

+5V R49
/,j9-3
'" 5.6K

_________~4~0~V_AC~__ ~~-4
TRANS-XRI427 L10
+24V HLMP-KI50
R42 R60 -STATOR_MAIN_CURRENT _DETECT
5.6K 510
+24V ":>,>.1...'-*-...- ( 1 (SHT 8)

K3

TI

~'l R61
7.5K

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(S HT 3 ) n>---4*>----+--------l

;'"B4-6 STATOR MAIN

STATOR PHASE
'.!B4-5

+5V
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~
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5.6K
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/ 5.6K

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SSR6 IS MOUNTED EXTERNALLY ON THE
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V230LA 10

(SHT 8)
o VAC R58
R52
J9-~~-----+---" 10K 06 10K
J9-6)- IN5228 CW
R54

GND 510
~ GND

REV. DATE CODE ORG. lAPP.

TM/RF RAO FIELD I/O SCHEMA TIC
00 9352 OJW I 1 4294.262.21
01 9487 WLW I I SHEET 7 OF 8
02 9526 WLW
03 9540 WLW CONTINENT AL
X-RAY
CORPORA TION
8-67
 ~ ,~ ~

10(00:071
(SHT 3)
+5V

~~ttf:
i~
SSSS5555S +5V +5V
NlvwltOle ICSA ",'",'..fnf.>"'FhS!1 ICIOA
iJ lE VCC 120 -STAT 2 I ~IE VCC120
IlYI
Y16OH
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(SHT 2)-BKY ROY
tSTATOR MAIN CURRENT DETECT
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,
lAO
IAI
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IYO~IS~~~
1Y11-16
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In 12 2
(SHT 7) IA3 IY3
10 GNO

74LS244

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(SHT 1)
-STAT_O 0 11111 b~<
1""[ (SHT 1)
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II
2E

(SHT
I-co'j\
5)'HSID-n,,§
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"~ "Y2
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1~2A!
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(SHT J) -HS_VER 2A3 .Y3 3 17 2Y3 3 •

r5~ 14t.:i244 74LS244

ssssss~s
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(S~STTA~_I 0 I I I 11 b~L1""[
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3
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74LS244

REV. OA TE CODE ORG. lAPP.

TM/RF RAD FIELD I/O SCHEMA TIC
00 9352 DJW T 1 4294.262.21
01 9487 WLW J ] SHEET 8 OF 8
02 9526 WLW
03 9540 WLW CONTINENTAL
X-RAY
CORPORA liON
8-68
 f' ~ ~

ADIO:71

+5V
I
/
~ 7 ,
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+5V
+5V

UB
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2 AI
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A100:151 GI
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74LSI38
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---LGND
REV. APP. +SV
DO TM REMOTE FLUORO CONTROLLER BOARD 4294.262.1B
GJ2-14

CONTINENTAL 1 )
.-::=:::-7 J2-16
J2-15
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6
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t5VI t5VI tSV t5V

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~ ~ ~ ~

~
7
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t5VI
APP. UI
IREV'I DATE CODE I ORG.
00 9272 TCS TM REMOTE FLUORO CONTROLLER BOARD 4294.262.18
---'--- C5
tVIN
tVOUT C6
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COM lOur
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8-10
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5 OHIA/l0 WA TT 5 OHM/l0 WATT
• •

>- R7 R8
5 OHIA/l0 WATT 5 OHM/l0 WATT
<

J3

REV. DATE CODE ORG. APP.

01 9017 TCS TM/RF HV INVERTER SNUBBER NETWORK 4194.262.03
(
CONTINENT AL
X-RAY
CORPORA TION 8-74
(

J2 >- J5

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R1 R2
200 200 200 200

- C1 _ L - C2

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J1 J4

L - C4

( -'- C3
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R3
200
}, 200 ~"200
R4
200

J3 J6

REV. DATE CODE ORG. APP.

00 9534 WLW TM80 PARALLEL SNUBBER NETWORK 4194.262.19
(
CONTINENT AL
X-RAY
CORPORA TION 8-75
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1
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I
5486.262.03 I /"

( LIN( MATCH T~~~ ~

BL:
3
AI< KI/ A #10 BLK +S20VDC
r---------:~...R!.~~~..!!l<._3_-----------1~_7
r-:-.TO-
.---~#~10~BL!:::.!K~_il-~ FROM C15-2
(+)
-
ON C2

8
):!.:5
~n~ I I AK K
2 3

~
~
~nn

195
190 TB6 I I I
EKH-95 ~ 1
~
185 ~L ......'" INVERTOR T-NET'vIORK

~
L I@I I@I-- 180
1
1 SCR F"USE I ASSEMBL Y 5585.262.0 6

220V, 50Hz
~
~
~
175
170
L2 T?
~~~--4--~
! .
~
CI
OJ
OIl
(

<>BW
RB
> 25KO ~ ~ I SCH #4294.262.01 I
EKH-95 I cli1' .le BLK
<'------' 7f
I
~
TB6
N I@I ICO 1I1e BLK
Lt
ev 0V
1
f-t--<t-_~__T.l..!2=""""_()-I L2
#10 BLK I
I'---~:';;""=;"'-I-
1110 BLK -v '"' 1--7 TO ANODE HEAT SINK
L ffi M3
~~T~3~_OCCIIIMTICC.4J~B~L~K~_, "'-_ _-+ _ _-,~C8
.J
~
--~Cle

G
EKH-95
;ICQ)I IC~ z~ I
BRN -MAiNLiNE
CONTACT OR
2-POLE. 24VAC
S~~QR9 #10 BLK 520V RETURN I TO (-) ON C1 ---1
I
l
(

'____-+__________________________________+-_~~-----'~~:~~~N~~J~7~.O :::::N
~'---~---------~
~ D.BLU
L-_ _ _ _~-----------------------------------------~--4-----~~B~LK~2 24~C
SURGE CONTACTOR
3-POLE, 24VAC
RED L1
N.C.
T! 2
RL YIOC PO'vlER I

r~EEmR
'w'HT/BLU ~
~

z: SPPLY PCB
'"' c 6284.~1
1 ..J

......
....

_______~~~FE6:;1/~4[A~~C~R:G~~~===============t--~
1 ~ 2'" ORG = I ...
CI
0::
L..-_ _ _ _
TB5
-+_RE;;;;.D"--; 1 ---,
RAD FIELD
1/0 PCB
6584.262.01
~4f
1
r
I RED

F"7 15A r-_-<TJ.)-J

~
I L<,,..L_",--l..;.GR...;.N_ _...., ~~
~ :J BLEEDER
CONT ACTOR M6
,I ..
~ • "'''''''
I--.;.;I.IH..;..T---; 2 GATE DRIVE
PCB
6284.262.03
I
220VAC ..rICI MC~ nI;>C;/\JI-IT

( [ -INV----
SUP ON
J6
GRy --~~Ht~~==~==llry~E~L-{!l~
1 1--=::..:...:...------13 t.: ~~~2~...,~=N~~~~~------_1r_--_t----l
F"8 15A 71=? '--_______- I - I_ _ _ _ _ _ _ _ _ _ _ _E.B!!!RN:!.----.
'---------'

L24:":ET 2 'w'HT 8: \JHT/riRN A I.I/YE~l ~ 2 ~K T2f1TL-Q!:::.!L2=--.:V:..!.ID!:.----, J3 ____ ~3

---,
B

~gJ~V~~':F II ~~ 21' 24-HOUR PO'WER SUPPL Y ~"

~
~ GROUND STUD S'w'ITCH SIJIB PCB 5284.262.22
SCH #4294.262.02 I INV. PIJR. ON/OF"F"
\ J4
r;IA~2~:~-1
I 24VAC
RETURN"'
RETURN I--
3
VIC
lr-~~------~ur~~~~~
GRY'"2
•W/1
·..·T
I C R10 3311............
-L...
•- .- v I ~1 Cll
I'
I
#10 GRN

~B rA rA rA RETURN '4.r----"''w'''-'/B'''L''''K'4_.:.!NO::....._.:..:.1~,,1F"1--.:...~100~~ I
KUMPll~:8-24 rrh If~ rrb ~B-
IINVERTER~ ~ ---,

: ~JJ
.rl7 T-NETIJDRK
PS MTG I ~~M I
PANE:L ~85~06......J

(Ji ULTI- B3
I A B

I L_____ _
-r
OUTPUT
RANSF"DRME
(PRIMARY)
2 f--------'
3 f---------' .....J PO'w'ER SUPPLY
CHASSIS<TB4)
5486.262.02

~I~
REV. ATE IECNCODE DRG. APP.
I~1~221~~:
TM 1-PHASE 50Hz PO'w'ER

:=f
03 941 9 GP
121 --:/OFF 1J24 IJ IBLK
i 04 975 6 GP L~., .\.-""" 4294.262.07 TO OPERATOR
SUPPLY- lEe CONSOLE 12 S'vIITCH 2 IJ IRED
" ONIOFF
MAT.
CONTINENTAL S'vI TCH

~4~2·lLJ
BACK-PLANE
PCB

FINISH:
ASUBSIDIARY OF
TREX MEDICAL 8-81
~~s-m~~~~~~~s.rn~~~~~TV:~~~~~---------L------------------------------~----------------------~
 3-Ph AUTOTRANSF"ORMER 1118 RED TEF"LON
5486262.07

L II@!
UKH-95
1(0
LINE MATCH #8 BLK c::;::::?
,--T,-"I_ _J"'.u-'1'I1'
~....,
L1
R5
v---, #88\ K +520VDC r=- ro--;:; ON 7 ---,
e BJ
10 OHM-'50U

( 380V, 50Hz lila BLK

L-----~~~~ ______~__~~....,~I~
TI I m L1 1119 BLK
DP3~ 170A 1400V
#8 BLK I

r
FROM C15-2
I
~ R22
I I
UKH-95
~t::j~ __.!:.LI!!:NE~MA~T!!C:!:!H--.;#!tl8UBLb!KL_1 T2 J
.--'T'-'o-2_0-'
- I . ., L2

Ft.r,...., L2
v----,
10 OHM-'50U K A
L 21@!
~ Ko ~ ______-+___~ItUl~9~B~LK~_ _ _ _ _~~~~~ 1119 BLK
170A 1400V I
I INVERTOR T-NETIJORK
ASSEMBLY I
TB7 15 41312111
1 ....--'"T=3__
~
f">-Q-'
....,
I
m ....,~ L 3 "v - - - ,
~A.
AK K A ~ SCR F"USE
I I
380V, 50Hz
1------1------'-''--0-'....,
13,J ~
-
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-8 BJ
IPsr-1C\-";';;':--';-±:"---±-.
I-C::; 170A 1400V
T #8 BLK 1I TO ANODE HEAT S1N K I
UKH-95
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~4 P~~T81 t---=~-=----/""7'f--' I I
L3 I@I ~
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#14.DRG

L
~_ _ _ _ _

I €lUX 110
~ONTACT M3
8 MULTIDUTPUT
TRANSFORMER e
L-----...:::..:::....!::::.:.=---------t---t---.:.::..;;..;-"";.....;;...--I~

02
#8 BLK sa0V RETURN

J25/P25
TO (-) ON CI
&.-.:..TO~I_
J7 - l----1
.1' :t .lLi

I .";:; I ~
BLK
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TB5,.-__-, BRN 5 f-_I-.....:BR:::.:;.:.N-I 1 RETURN
~'1iL--
380V, 50Hz
--l7 r- :;W.:,~
lK ....IA2MAl"p
J-+-------------'----t--liJ BL=--K-j 2

J
9V
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ev ~

'-I ~Al11 A~
L..::.;1I1:.;::8....;R.:::E:::.D....;TE.;:;;F"...;:L:..:.O,,--N-C""')-,
3t
......r.o-_-:-; 2 R6 SPPL Y PCB
6284.~1 I
~:..
. 32 z:
UKH-95. #10 'WHT
N I@I 1C0 UWb. , """" - I
\.
#14 'WHT
#IO...lrll-lT

I ; I BLEEDERL...R-E-SI-S-TOR---+--IoIH-r---i ~ GATE DRIVE I

UKH-95 .. '-----' ~g~4.262.03
G I@\ I@ RED
r6 1I4A ORG
BLEEDER .I
CONT ACTOR r'-M~6~-!07-...,
1.r--12
\. ORG
220VAC ..riAl M A2h DRG/\JHT
.,,,,. L--J
(
A 8 L....jl~2~RN
F"7 ISA "It.:~____~~______________
!.UTl,Ll GRN r-__~J~ ---
J3
-----4tc3
24-HOUR PO\.lER SUPPL Y ~ [
TO INVERTOR
I J6GRy PO'WER ON/OFF'
S'WITCH S'W18 F"815A ~ PCB 5284.262.22 ~
r--...I 21~ _J:~r'l
2 'WHT
I IoJ/yEt.rt L2 VID J4

1,,""'10 I~~:
~1
"2
'&1'ip I RETURN.
RETURN.~

~ ~l--+-+--'cTl l~
I RETURN ~
L
....
INCOMING PO'WER
115VAC. 15A
G ~'W~/~R~ED~-------------+--~r--------------r1r----~3

1-=- J6Cl_~-+ ______________________- ,

I 1-9
ffi
i-
TB9 _
z If\\ GROUND
STUD ----l.r;~;;_riT,~7.1----------+_..A-o-T 4
~4 I 220/24VAC ~ tf C '\
,- 115VL 1 115VL _-----+--t-"D..;..I=BL..-U'--j3 I I ~ !;
I
Q:

..
I.!J
r----J....!:!N~~2WN~p A ~8 .......-'
<:>
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3 N
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2 3 I K2
KUMPllAI8-24
I-
W

I 8

r: -
_ _ _ _ _ _ _ _ _ _ _ _ 0: A
~
L...

I L
G 5 G M7 220VAC U

I i. . El
0:,...
I ~LAJ~ ....
Q: 4: PO'WER SUPPLY
~ ~
:t
,., 115VT 6 115V Tt:) Al MA2 ~ 0: 4: ru
_=>::&0::: c>
> >
-.t v CHASSIS(TB4)
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(\J (\J
"
INVERTER- 115VT 7 115V T - ~
..JI-C2:-ot:;
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I ---I
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~~ I
P25
I P2 R12
y
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3x5/S0Y
.!li
vVV"

REV ATE/ECN CODE DRG. APP.

TM 3-PH 50Hz RAD PD~ER
3~ JJ25
00 9756 GP ~
SUPPL Y - lEe 4294.262.45 I l
----~ 1'.....'.....e----' I
~
12 --- J24 ""'PA-

M~
TO OPERATOR 1 ON/OFF I f -__~'W~/B~L~K~ IJ/RED
MAT:
CONTINENTAL
A SUBSIDIARY OF
CONSOLE
ON/OFF
12 SIJITCH 2 f-_-=....,~/R""'E...D:.....--'
BACK-PLANE
I 'W/ORG
clM C
I
FINISH:
SIJITCH PCB
L _ _ _ ---.J
TREX MEDICAL ~4~2.LL-.J

8-82
 lU 8 RED TEFLON
SIriGLE PHASE
AUTOF"ORI'ItR
G
TlI6
5486.262.03

276
--
TO (+) ON C2
--,
( #8 BLK

TB5
252
246
C5-CIB: 24BBpF" 45B~
FROM C15-2
I
8
7
6
24B
234
228
I I
Ll
nB 5
4
222
216
21B
SCR FUSE
1'9
I INVERTOR T -NET'IrIORK
ASSEMBLY
SCH #4294.262.08
I
I I
3 200A
lIB BLK 284
2 600V
UNE HATCH KBC200

L2
IOOA
600V
lIB BLK

CIB
BLK #8 BLK
TO ANODE HEAT SINK
I
13
#10 BLK S2BV RETURN I
---1

RED
'oJHT/BLU 2 R6
5K
SBIoI

RED
I
TB4
'-----'I--t 1 L------Y::E::-LI
RED ORG
BLEEDER RESISTOR IJHT
GATE DRIVE
PCB
I
GRN 6284.262.03

CNV-:-ON
15A L_-I
( L24:":ET 2
B
BLKTm
=
L2 VID

~c:l1oL3
TUBEl RAD FIELD ..J
lID PCB III
"-
6584.262.16 I-
::I:
GROUND STUD
_#!lll!!O...;G!:l.!R~NL-_ _ _",,"\G #10 GRN
~ T L4 24-HDUR PD~ER SUPPLY

--:,
PCB 5284.262.22
SCH #4294.262.02

PS -MTG II INVERTER- -
CRIB 3311 I
PANEL
Tl~--+-----;!i'1
_IBB=i
T-NET'oJORK I 220VAC Cll
ASM _ ---l

TB9

Tlm L1
-----c>-'
cl
MULTI-
OUTPUT
rRANSFDRMER
(PRIIo'ARY)
-
."-- .. ...
.~
I
L- - __ _
I-
W W
~
u
~
U
<I: <I:
I-

.,.ru> ru.,.> ~
A
'\~C1-9
S~ __ ~ ;:S.-JI

PO'oJER SUPPLY
CHASSIS<TB4)
B

L2

I_ FOR CXT90 TABLE ONLY I

3x5/50'oJ

I I
~
REV ATE/ECN CODE DRG. APP.
04 9361 GP TM R/F i-PHASE PD'WER
4294.262.14
=
TO OPERATOR 1 ON/OFF
S'IrIITCH Pl
crt
05 9468
I
GP
SUPPLY SCHEMATIC
I

~.
06 9481 GP
CONSOLE
ON/OFF
12
BACK -PLANE IJ/RED
M~
M I
07 9510
08 '1S4:;,
GP
G.f>. MAT, CONTINENTAL S'IrIITCH PCB
Cl C2

X-RAY U4~2.!i...J I 'oJ/ORG

I
FINISH,

CORPORATION L ___
RESISTOR NET'oJORK ~
8-83
 .18 RED TEFl.ort

~=-480VAC TH40
~-480VAC TH50,6c

...----__+-__~lll.L.1II1BtIWLK~-J.&.T2--otft
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~ I
L2 rr.l"l~~::J"ii2~-!::.!!!!!:..!!.:.!!:!!t4y.....JIn.LJ!Iof>....----i1i ~11' ~
ru • MTCH LItE 19 JlLK
L2

IL\.J.,: rv:: : "'_-=i-tJ=--_..,'-: L,--,

'J
JV
10
K II
SCR !'"USE
, INVERTOR T-NET\(I:RK
ASSEHBL Y

~-48OVAC
/ : T2 c La . . . IIUC F9 _ , SCH .4294.262.08 ,
nt40 1817J 11 6/'/4/3/2/ I£,;
~-480V'C n"".., m !:Ii ~ II iiI~IIi!If!1 I T3 -t]t- L3 £ "'.. 1L-_..:'~8..::B~LK~It-~ TD ANODE !£AT SINK I
L3 11~ 1'"12 •
2
LItE I1ATCH
AU. rum
18 BLK
1----+-1.1
118 B u d ,I T3 ~
Jm
13_
-C L3 .18 BLK
__DI'S-..!:f8=rv=::;-...;;B=----;87j-J,
/ I ,

~~-480VAC 1917 , 51;';' !ilJ ~71----, '13C~~ ~I L--~.!!!8!...:B!!:LK~----_+--t---=5~~:!-.:RE.::::.:.::::::~:i=~:t.J7~, ~1~-'r Cl l--.J

~D-480V'C ~; UI iii!~I ~ Iiii ~3~
TH40
TMSO.., '" : f-- tft@51---+.......:IIRI't=:'-;IR£TtJRrt

-- ~M.~·~~IIRI't~--~~----i--------======:::jt:::1:~J>>.6 r~-+---,BLK~~2 ~WC I

N
IW£R IILIEK
KQl 14+4-1'
... \JIlT
.10 'WHT
'#!-.o:
~J
IiLJ(

14
..

'-'"
...... n. 0--.., .f ~ 118 RED TEFl.ort.no ~ "",'..... 2> !t:
_ ~.
LY/DC PmIER
SPPLY PCB
6284.~1
. ~.....MAll- ~~ SIII~
COITACTtR
31 32 TIS _ --,
G
~TtR I ~b
GROUND
STUD

lEI ...
I... ...::
r--------~~IinS;I~A~~m:::::::::::::::::::::::~----_=======1:t===========:~~jAl::~:~~
I=ACTtR
1~2~'_~~~_________________- - , 22OVK. J M .1- _1ULiT
_
1

! L-----t-:~=--;2
Q: RED 1

GATE DRIVE
. . . ..262J13
PCB .
I
~ ~

TUBEl RAD rIELD

..124
P24
, ...... ,~

A B
GAM

vm
1
- - --11
c
2
J3
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24-HDUR PDW'ER SUPPLY
PCB 5284.262.22
iL--.J
r- -
I ...... PUR. IJYOF'F'
;:; ~
Ttl INVERTtR
6S94.262.16
I/O PCB PD'e'ER DNIDFT 3 SCH .4294.262.02 2A.VAC J4 vm I S'WlA L2i-{j'.~,:U
S'WITCH S'W1B
RETURN
RE:Tl.JRN
~
~
GRY
\oIHT
Icl<::,,~
~. ~_ J ' 1Cll
-=-- I
I?l~
yY Y

~
Jl
~I ~n~ ~.A J RETURN W'/BlK, ItO • l"r t""'laeY---J I

~t:j:~u 1£
Kl
KUtFllA19-24 ~--I
II~
!tr71
220VAC
.J6 22O/24V~A;:Cr11- I=======::;l
.--::
I
~~:.rd ~ i
MA2P-
-paoVAC
U
L-..QAl

Ie
TB9
115VL
230VL I ~ I..~..
DIBLU ;
- - 1M 1-7-~
~ L _______ ~-
12;30V _I< ,I A B
PO\IER SUPPLy
4 IC "") CHASSIS(TB4)
is G
6 IN I~ .--___-oT1....
'
7 IN
'"-:;,
8 l1:lV
'i l1SVT c::b =~4
,TRANSF'DRMER I IBAcK=PrAN~ "'I
PCB ..124
I j ~ J2S

lmI~3===~~T2i t.L2 .
~
12~
lU
111.::.:suvll<: 5484_.262'14 DN/OF'F' 1 WBI.K
TO OPERATOR
CONSOLE S'JITCH 2l---':W'~'.IRnl~it.-....J
, - F"DR CXT90 TABLE [H.Y I ON/OF'F'
APP. S'JITCH
TM R/F 3-PHASE. PD~ER 4294.262.06 WRED
SUPPLY SCHEMATIC 'W/DRG
F'9 F'l0 F'11 F'l2
MATI
TREX MEDICAL TH40 RtF' 300A 60A 60A 60A
CONTINENTAL X-RAY TH65 RtF' 450A 80A 80A 80A
SUBSIDIARY ~84
 G OJGROUND
( STUD ~
\ ~
~ 246
..!..r
~L.....;2::..;;40,,-­
.!.. 234
~ 228
~Ie ~
~ 222
Ll rl~ z.r IIle BLK ~1---.O2=16,---
lOOA
600V
LINE MATCH S-
.~
210
204
2OS-3S0VAC. 60Hz t..=.

TB6
L2 III----=::::i.Z.r
'-P~'~j~--~~~-JL~
fll
..,
IIle BLK
!IV J~ __
IOOA TB5
600V

YEl

'---+--11
~I------------~RE=D~1IUl~~~=L~2U ====~~==========----------------r_~
L"'2 YEL I
[ -- J6GRy ~ ""1'1
/ -INV SUP ON I 17« r'-------tl-
~
'-'''''T /GRN L_---1
\ L24::":ET 2 ""
HT
8 _
--]
-- --1\;~
J24 A B
TUBEI RAD FIELD P24 TO INVERTOR
110 PCB J3 _____ ~
PO""ER ONIOFF

SUPPLY~ ~ ~'R~
r-
6584.262.16 SIJITCH SIJ1B
GROUND STUD

~~ ~JL4~~ ~I.:s~1J1:.:. A1f 9~L2~i-()'~-r'-l _1 I

I
Uh
24-HDUR PDW'ER !':j ''''.
~ #10 GRN '-'IRED

6
~__<~>_'jLL4
J2
1 ~ PCB 5284.262.22
SCH #4294.262.02
__
Rl,,0 A 3.3 -

II -1-,I
,?4VAr. VID I C
11
3 """N '2 ORY vvv ;-]
PS -MTG
PANEL
INVERTER- -
T -NET""ORK
ASM _ --l
I M7
..riAl MAgph---J...----+-+-i
RETURN
r ~ru,"
S'
~
""HT
WOL.
I .~
"' . ,,' =i
J t::""1 ell
, ...

"=:"':'/~----+--l TB9
I
INCOMING POI(f:R 220VAC
1l5VAC,15A
1 "1 115VI AUX
y.
20\/24
IJ24
P24
L

~I bJ 'i A ~~ I
2 N i') CONTACTOR
l
..3, ..,,.<VA<
.:~:.~ l. ~~
3 N
4G
5 G P MUL TI- I..
I
L -__----j
6 115VT

--
OUTPUT
7 115VT b TRANSFORMER
(PRIMARY)
9285.262.10
L-------
"I" ..,. PO""ER SUPPLY
14286.26~ ---1

HJ
cu (\J CHASSIS<TB4)

~~i~1
'V
P25
J25 'YVv 3x5/501J I
J
'l'V
REV inATE/ECN CODE T M3 0 1
DRG. APP.

==f
PHASE RAD PD'w'ER 121 J24
o1 'fL~~__~
[~04~95~Ol~_-pG*i:P.--iijjU;Ft SUP PLY SCHEMATIC (60Hz) 4294.262.04 TO OPERATOR
ON/OFF t
""/BLK ~PL1_____

I
05 9510 GP "" IRED
CONSOLE 12 SVITCH 2L--~~_.....
06 9543
M4~Rd
i { GP
ON/OFF BACK-PLANE W1c:
-="":.../:,;.:RE::.;:D,--_
SVITCH PCB
~4~2.!i..J I ""/DRG -
I
L __ _ RESISTOR NETIJORK
~
8-85
 3-Ph AUTDTRANSf'DRME
5486.262.07 REV 4
1'"18
_
~F ~ ~
LItE: MTOI 1t8 BLK
Ll r1 ~ 2 ________________~.a~m~~+~~pn\v~~~--------~~~-~+--1~.ro~~~
~ ~I"" ---t-~~
I ~H
T
o p· L1 RSrAV-__, ...1
lOGA

~ tE) 0 8 I ,,.. ,-
600V T1I6 Is 17 6151412j li - - 10 CHVSeU AI( '\. Ie A .--...;:tt8:.:::...:BLK=__ C15-2

4BOVAC ~!~I~~
'------J,.......:.!.:.le:..,:BI..K::::-:..'_Tl""'"""O-Jf_ L' ". IP3 I
F'1l
Ack - ,.. I -... - "" • I -NETV_ I
+ __-. J.!l.L181 lIi! o!LIC~ ~I_T.a. . . ..n.(.)_'
. Jlt- ~~ - -f-E9 -f2 E- I ,,.. ,-
t2 INVERTtJR T
F , ,
LItE: MTOI ItS ILK
L2 II~2
10GA
600V
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 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

{. SECTION 9 - MECHANICAL INFORMATION

This section presents parts lists and mechanical drawings on the TM series generators. SECTION 8 contains
the wiring diagrams, schematics, assembly layouts, and parts lists for all electrical assemblies.

The assemblies/parts in the FIGURES correlate with the listings on the associated TABLES with the use of
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FIGURE 9-1 TM SERIES X-RAY GENERATOR

See TABLES 9-1 & 9-2

Locator Part
Number Number Description Qt}'
1 9726.201.01 1Ph RPU Cabinet Assy 1
2 9626.202.01 Operator Control ASsy 1
3 9526.201 Pedestal (optional) 1
4 9326.200 25ft Interconnect Cable 1
5 6536.206 Generator 1

TABLE 9-1 TM30 X-RAY GENERATOR PARTS LIST

MECHANICAL INFORMATION 9-1 9847

TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

Locator Part
Number Number Description Q1}! (
1 9726.233.01 3Ph RPU Cabinet Assy 1
2 9626.203.01 Operator Control Assy 1
3 9526.201 Pedestal (optional) 1
4 9326.200 25ft Interconnect Cable 1
5 6536.206 Generator 1

TABLE 9-2 TM40 X·RAY GENERATOR PARTS LIST

9847 9-2 MECHANICAL INFORMATION

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

c RPU
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Locator Part
Number Number Description Qt~
1 4547.262.15 Front Cover 1
2 4543.262.05 Side Cover Assembly 2
3 4543.262.04 Top Cover Weldment 1
4 4543.262.05 Side Cover Assembly 2
5 4542.262.14 Rear Cover Assembly 1
6 4446.262.03 Wire Entrance Plate 1
7 4541.262.27 Dual Panel Support 2
8 4543.262.04 Top Cover Weldment 1
9 5196.262.01 Cabinet Covers Hardware Kit 1

TABLE 9·3 RPU CABINET COVERS PARTS LIST

MECHANICAL INFORMATION 9·3 9847

TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

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9847 9-4 MECHANICAL INFORMATION

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

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7 5284.262.09 Extension Card PCB 1
8 6284.262.04 AEC Interface PCB 1
9 6284.262.05 RPU 110 Control PCB 1
10 6284.262.06 rnA/mAs Control PCB 1
11 6284.262.07 kVp Control PCB 1
12 6284.262.02 RPU Microprocessor PCB 1
13 4181.262.08 2A, 250V, Circuit Breaker wi Switch 1 CB1
14 243.3400.0525 .5A, 250V, Tubular Fuse 1 F13
15 243.3400.1250 1A, 250V, Tubular Fuse 1 F1
16 243.3400.3250 3A, 250V, Tubular Fuse 2 F2, F3
17 243.3400.8250 8A, 250V, Tubular Fuse ,/ 2 F4,F5
18 4181.262.10 10A, 250V, Circuit Breaker wi Switch ,/' 1 CB2
19 4181.262.09 5A, 250V, Circuit Breaker wi Switch 1 CB3
20 5486.262.02 Multi-Output Xfmr 1
21 4186.262.04-SA, 250VAC, EMI Line Filter 1
22 4182.262.15 10 Pos. Screw Type Terminal Block 3
23 ~185.924.01 .-:3 OIP, 5V/3A, 12V/1.2A, 30W PS ~ 1
24 6284.262.01 Relay Power Supply PCB 1

( .
TABLE 9-4 CARD CAGE ASSY (5585.262.07) PARTS LIST

,..--.
\.

c
MECHANICAL lNFORMATION 9-5 9847
TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

TOP VIEW

FIGURE 9-41$ POWER SUPPLY CHASSIS ASSY (5585.262.08) LAYOUT

Find Part Ref.

No.. Number D.escription Qty De.s..
1 5486.262.03 TMIHFC 1 Ph Line Match Xfmr Asm 1
2 -771.5824.0445 2400 ).lfd, 450VDC, Electrolytic Capacitor .- 6
3 753.3501.3250 25.00R, 50W, WW, Adj., Low TIC Resistor 3
4 752.3501.52 2K, 50W, WW, Fixed Resistor 2
5
6t
4182.262.08
4182.262.18
Cinch 8"1>50, 8 Pos Terminal Block
FRN-100A,2 Pole Fuse block
2
2
(
6 243.3410.0250 Bussman Limitron, 100A Fuse .. 2 F10, F11
7 781.5165.8010 162A, 800V, Dual Power Diode Module 1
8 4182.262.17 200A Fuseholder _ 1
8 243.3420.0601 KBC-200,200A, 600V, SCR Fuse 1 F9
9 4182.924.07 Panel Mnt, Blk Fuse Holder 1
9 243.3400.1250 1A, 250V, Tubular Fuse 1 F6
10 4182.924.07 Panel Mnt, Blk Fuse Holder 2
10 243.3401.5250 15A, 250DCV, Tubular Fuse 2 F7, F8
11 4181.262.03 AML21-Series 2 Pole Pushbutton Switch 1 SW1
11 4181.262.11 Switch Cap, Red 1
11 4189.262.09 28V Light Bulb 1
12 713.5404.4031 Furnas 40A, 4 PNO, 24 VAC Relay 2
13 713.5102.4080 40A, SPST, 24 VAC, Contactor 1
14 6184.262.04 TMIHFC 24-Hour Power Supply PCB 1

TABLE 9-5 1$ POWER SUPPLY CHASSIS ASSY (5585.262.08) PARTS LIST

t For item 6, the fuses are replaced by terminal Blocks for systems shipped to Europe.

9847 9-6 MECHANICAL INFORMATION

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

FIGURE 9-5 3<jl POWER SUPPLY CHASSIS ASSY (5585.262.05) LAYOUT

Find Part Ref.

.No... Number Description at}! Des•
1 713.5302.4091 3PS1:40Al240V 24VAC Coil Contactor 2
2 4447.262.05 TM/HFC PS Mtg Panel Base 1
3 781.5106.1410 100Al1400V Std Recovery Dual Diode 3
4 4441.262.15 TM/HFC 24 Hr Power Supply Chassis 1
5 753.3501.31 1O.OOR 50W WW Adj Low TIC Resistor 3
6 753.3501.55 5K 50W Adjustable Low TIC Resistor 1
7 6284.262.04 TM/HFC AEC Interface PCB 1
8 4181.262.03 TM/HFC Snap Dome SAS35C Switch 1
9 -5486.262.01 - TM/HFC 3Ph Line Match Xfmr Assy - t1 '
10 243.3400.1250 1A250VTubuiar Fuse 1
11 243.3401.5250 15A 250V Tubular Fuse "
',~ 2
12 713.5214.7031 Furnas 40A 201C 220VAC Relay 1
13 753.3501.2050 5.00R 50W WW Adj Low TIC Resistor 3.
14 713.5102.4080 40ASPST24VAC Contactor 1
15 4247.362.01 TM/HFC Resistor Mntg Bracket 1
16 4159.362.01 TM/HFC Power Resistor Insulator 1
17 4182.262.11 200ASCR Fuse Block 1
18 243.3420.06 200Al600V SCR Semiconductor Fuse 1
19 4182.262.12 3 Pole Fuse Block 1
20 243.3406.06 FRS-60 60Al600V Fuse 3
21 4547.262.17 TM/HFC PS Fuse Mounting Bracket 1
22 5285.262.02 TM/HFC 3Ph Pwr Supply Fuse Mnt Assy 1

TABLE 9-6 3<jl POWER SUPPLY CHASSIS ASSY (5585.262.05) PARTS LIST

c
MECHANICAL INFORMATION 9-7 9847
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

FIGURE 9-6 INVERTERIT-NETWORK ASSY (5585.262.06) LAYOUT

Find Part
( .• 1
Nilmber Number Description ~
1 781.4906.1010 90A, 1000V, Fast Recovery Dual Diode 3
2 4247.262.06 TM/HFC SCR Heatsink 2
3 -774.2610.3510"'10 ~fd, 1000V, Oval Capacitor- 2
4 751.2206.81 1 Meg, 2 Watt, 5%, Carbon Resistor 2
5 - - 713.5102.4080~OA, SPST, 24VAC, Contactor 1
6 -. 774.2650.3437~50 ~fd, 700 VAC, Oil Capacitor 2
7 ~ 774.2550.3437 5 mfd, 370 VAC, Oil Capacitor 2
8 -753.4101.35- 50.00R, 100W, WW, Adj, Low TIC Res.- 1
9 -'9286.262.01 -TM/HFC Inverter Inductor Coil Asm 1
10 -. 771.5824.0445~2400 ~fd, 450VDC, Electrolytic Capacitor 2
11 752.3106.6250 25K, 10W, 5%, Fixed, WW, Low TIC Res. 4
12 .- 4140.262.13 ~ TM/HFC Inverter SCR Buss Bar 2
13 784.5435.8050 S23AF8A Inverter Type SCR 4
-14 - 6784.262.03 TM/HFC Gate Drive PCB 1

TABLE 9-7 INVERTERIT·NETWORK ASSY (5585.262.06) PARTS LIST

9847 9-8 MECHANICAL INFORMATION

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

~'

@ @ @ @ @ @ @ @ @
Pl P2 GND

2t
~
@ 0 @

@ @

@ @
CATHODE
@ 1 @

@ @ @ @ @ IID2a.o'7

C 00 0 0
FIGURE 9-7 HIGH VOLTAGE GENERATOR LAYOUT

Find Part
~ber Number Description my
1 4156.313.02 Federal std Cable Receptable 2
2 4182.362.02 3 pos Chassis Mnt Connector Male 1
3 4150.408.01 1/2" Oil Plug 1
4 4182.362.04 Double Banana Jack-Red 1
5 4182.362.05 Double Banana Plug 1
6 5136.362.01 TM/HVG HV. xfwr Terminal Assembly 2
7 4182.362.03 6 pos Chassis Mnt Connector Male 1

TABLE 9-8 1-TUBE HIGH VOLTAGE GENERATOR (6536.200) PARTS LIST

MECHANICAL INFORMATION 9-9 9847

TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

5484.262.04
OC DISPLAY PANEL

r---6484.262.03
OC MICROPROCESSOR PCB
4550.262.02-----'
TMIHFC CONTROLLER ENCLOSURE 9026-
M.

FIGURE 9-8 TM SERIES OPERATOR CONTROL (5585.262.04)

9847 9-10 MECHANICAL INFORMATION

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

SECTION 10 - COMPLIANCE TESTING

The x-ray control must meet specific performance criteria for compliance with 21 CFR, sub-chapter J. The
following tests and data collection permit verification of the system. Where directed to do so, record all
required data on copies of the COMPLIANCE TEST RECORD sheets at the end of this section.

CAUTION
X-ray exposures will be made during this procedure. Proper x-ray precautions must be taken at
all times.

10.1 TEST EQUIPMENT

• True RMS digital mUlti-meter
• Storage scope, 20MHz bandwidth, minimum of 1OM sweeps/s rate
• Radiation dosimeter with ±5% accuracy in the 40 to 125kVp range
• A non-invasive kVp meter or a kVp divider (Le. Dynalyzer)
• A calculator with statistics capability.

10.2 LINE REGULATION

All systems must be operated on incoming power lines that provide a line regulation of 8% or better.
Record as directed in SECTION 1.0 of the COMPLIANCE TESTING RECORD.
1. Connect the true RMS voltmeter to incoming line fuses F10 and F11 and measure and record the
no-load line voltage (VNL)'
2. Set up the generator as directed in SECTION 1.0 of the COMPLIANCE TESTING RECORD.

( NOTE:
These tube factors may be near the maximum single exposure ratings. Consult the tube rating charts.
If the DVM is fast acting, it may be possible to use a TIME setting of less than 1.5s to obtain a valid load
voltage reading.

3. ~ Make an exposure and record the loaded line voltage (VL) reading during the exposllre.
4. Calculate the line voltage regulation and record.

10.3 rnA, mAs, TIME, and kVp ACCURACY

Configure the kVp meter or Dynalyzer into the system. Be sure the collimator is fully closed and take all
radiation protection precautions. Make all exposures with at least 30 seconds between exposures.
Record results as directed in SECTION 2.0 of the COMPLIANCE TESTING RECORD.

Rejection limits: mA ±3.5%

mAs ±3%, ±0.2 mAs
TIME - ±4%,±2 ms
kVp ±3kVp

NOTE:
Measurements are taken at the 75% level of the kVp waveform. Set the kVp meter or Dynalyzer to trigger
from kVp at 75%.

(
COMPLIANCE TESTING 10-1 9874
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251 (
10.4 LINEARITY
Record as directed in SECTION 3.0 of the COMPLIANCE TESTING RECORD.
1. Place the radiation dosimeter into the x-ray beam at a SID of 30".
2. Collimate the beam to cover just the active area of the probe. Refer to the dosimeter's operator
manual.
3. Select the OOSE mode.
4. Make exposures at a minimum of 30-second intervals to assure proper tube cooling.
5. Make exposures with the techniques listed on the test record sheet. Record all data and calculate
the mRlmAs and the linearity.
X1 = mRlmAs from the first table
X2 =mRlmAs from the next table

(X1 - X2)/(X1 + X2) ,; .08 rejection limit

The 21 CFR Regulations state that the adjacent station linearity shall not exceed 0.1 from the above
formula. The 0.08 limit above takes into account instrumentation errors to assure compliance.

10.5 REPRODUCIBILITY
Make exposures using techniques listed in the tables in SECTION 4.0 of the COMPLIANCE TESTING
RECORD and record the results.

The 21 CFR regulations state that the co-efficient of variation shall not exceed .05. Therefore, the above
.04 limit takes into account the instrumentation errors to assure compliance.

10.6 AUTOMATIC EXPOSURE CONTROL (AEC)

If the system is installed with AEC, its functions and reproducibility must be verified. Record as directed in (
SECTION 5.0 of the COMPLIANCE TESTING RECORD.
1. Select: Manual - AEC mode, Table, Grid-In, Field #2, 0 Density, Medium, Film/Screen 1, 540
mAs,80kVp
2. ~Make an exposure with no absorber in the field. Confirm that the exposure time is less than
8.33ms.
3. Completely cover the ion-chamber fields with a lead blocker.
4. Select 60kVp at 541 mAs.
5. ~Make an exposure and verify that the post-mAs is not greater than 580mAs.
6. Verify that the AEC Limit is indicated in the LCD display.
7. Verify that an exposure can NOT be initiated.
8. Press [RESET] (lower right hand corner of the LCD) and verify that the AEC Limit indication is
removed and that an exposure can be initiated.
9. Wait 2 minutes.
10. ~Make another exposure, but release the exposure switch before termination by the 540mAs
back-up timer. Verify STEPS 4 and 5.
11. Remove the lead blocker and place 3" of water or acrylic over the ion chamber input field. This
should be 4" square.
12. ~Make an exposure and note the post-mAs.
13. Adjust kVp until the post-mAs is approximately 5mAs.
14. Place the radiation probe into the field, adjust the collimator to just include the probe,
approximately 8" x 8".
15. ~Make 10 consecutive exposures, 1 minute apart, and record the mR for each exposure.
16. Calculate the co-efficient of variation as in SECTION 10.5. above. The limit is to be less than .04.
(
9874 10-2 COMPLIANCE TESTING
c
TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

10.7 EXPOSURE FUNCTIONS

....Make an exposure and observe that:
1. The x-ray LED on the operator control is ON during the exposure.
2. Select 1DOmAs and initiate an exposure, however, release the exposure push button b.efoJ:e the
mAs timer times out to confirm that the exposure may be terminated by the operator.
3. Record as directed in SECTION 6.0 of the COMPLIANCE TESTING RECORD.

10.8 R1F EQUIPMENT

If the installation has RlF equipment, complete SECTION 7 FLUOROSCOPIC rnA and kVp ACCURACY
of the COMPLIANCE TESTING RECORD. Dependent on the TM Software Version in use, fill out Table A
for Continuous Fluoroscopy and/or Table B for Pulsed Fluoroscopy.

10.9 LABELS
Check that all certifiable components have all of the appropriate labels attached and record as directed in
SECTION 8.0 of the COMPLIANCE TESTING RECORD.

10.10 SOFTWARE VERSIONS

Record, in SECTION 9.0 of the COMPLIANCE TESTING RECORD, the software versions used in the
system.

10.11 SYSTEM CONFIGURATION

Record, in SECTION 10.0 of the COMPLIANCE TESTING RECORD, component information. This

c concludes the Performance Compliance Verification.

( COMPLIANCE TESTING 10-3 9874

TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251
(

THIS PAGE INTENTIONALLY LEFT BLANK (

9874 10-4 COMPLIANCE TESTING

(
 TM SERIES X-RAY GENERATORS
( MAINTENANCE MANUAL 9026.251

TM SERIES GENERATOR COMPLIANCE TESTING RECORD

Photocopy these pages and use as a permanent record of the generator. Keep with the Maintenance
Manual.

1.0 LINE REGULATION

1.1 Select the following factors:

I Select I TM 30 I TM40 I TM50 I TM65 I TM80 I

rnA 200 200 300 400 400

kVp 100 100 100 100 100

Time 1.5 s 1.5 s 1.5 s 1.5s 1.5 s

1.2 Connect the true-rms voltmeter to L1 and L2 at the fuse

block and measure the incoming line voltage.

Voltage at No Load = VNL = _ __

1.3 Make the exposure listed above and record the L 1/L2 voltage reading during the
exposure.

( Voltage at Load = V L = _ __

1.4 Calculate the Line Voltage Regulation as follows.

IM.3O.
% Line Reg.=[(VNL-VL)NJ X 100 X 1.5 = _%

TM 40 and TM 80
% Line Reg.=[(VNL-VclNJ X 100 X 2.0 = _%

IMJill
% Line Reg'=[(VNL-VL)NJ X 100 X 1.67 = _%

IM.fi5
% Line Reg'=[(VNL-VL)NJ X 100 X 1.625 =_%

NOTE: The Line regulation must be less than 8%.

NAME:_ _ _ _ _ _ _ _ _ _ _ __ ACCEPT: _ _ _ __
COMPANY:,____________________ REJECT: _________
( SIGNATURE: __________________ DATE:_________
10-5
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251 (
2.0 kVp, rnA, TIME, mAs ACCURACY

Select the values listed in this section of the Record Sheet and record all measurements. Test Accuracy
Values as follows:
kVp ±3 kVp
rnA ±3.5%
Time ±4%±2ms
mAs ± 3% ± 0.2 mAs

NOTE: If the Technique Factors cannot be selected due to Unit power limit, kVp limit or X-ray tube
limit, bvoass the entrY.

SELECT ACTUAL
kVo kVo rnA ms mAs
40
LARGE
60
2SmA SO

400ms 100
120
(10mAs)
130 (
LIMITS ±3kVo ±.S7mA ±1Sms ±.SmAs

SELECT ACTUAL
kVo kVo rnA ms mAs
40
LARGE 60
SOmA SO

200ms 100
120
(10mAs)
130
LIMITS ±3kVp ±1.7SmA ±10ms ±.5mAs

NAME:: __________________________ ACCEPT:. _________

COMPANY:,_______________________ REJECT:. _________
SIGNATURE:: ______________________ DATE.:__________
9S74 10-6 COMPLIANCE TESTING

------- .- .. _...• - . . - ..•- - - - - - - - - - - - - - - - -

 TM SERIES X-RAY GENERATORS
( MAINTENANCE MANUAL 9026.251

kVp, rnA, TIME, mAs ACCURACY (contd.)

Collect data as indicated.

SELECT ACTUAL
kVp kVp rnA ms mAs
40
LARGE
60
100mA 80

100ms 100

(10mAs) 120
130
LIMITS ±3kVp ±3.5mA ±6ms ±.5mAs

( SELECT ACTUAL
kVp kVp rnA ms mAs
40
LARGE
60
200mA 80

50ms 100

(10mAs) 120
130
LIMITS ±3kVp ±7mA ±4ms ±.5mAs

NAME:~..,- _ _ _ _ _ _ _ _ _ __ ACCEPT: _ _ _ __
COMPANY: REJECT: _ _ _ __
SIGNATURE'=-:----------- DATE:_ _ _ _ __
10-7
TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251 (
kVp, rnA, TIME, mAs ACCURACY (contd.)

Collect data as indicated.

SELECT ACTUAL
kVp kVp rnA ms mAs
40
LARGE 60
300mA 80

35ms 100
120
(10.5mAs)
130
LIMITS ±3kVp_ ±10.5mA ±3.4ms ±.52mAs

SELECT ACTUAL
(
kVp kVp rnA ms mAs
40
LARGE 60
400mA 80

25ms 100
120
(10mAs)
130
LIMITS ±3kVp ±14mA ±3ms ±.5mAs

NAME: ACCEPT:. _ _ __
COMPA~N~Y~:------------
REJECT:, _ _ _ __
SIGNATURE: _ _ _ _ _ _ _ _ __ DATE:--c-:-:-:-_-.,.._
9874 10-8 COMPLIANCE TESTING
 TM SERIES X·RAY GENERATORS
( MAINTENANCE MANUAL 9026.251

kVp, rnA, TIME, mAs ACCURACY (contd.)

Collect data as indicated.

SELECT ACTUAL

kVp kVp rnA ms mAs

40
LARGE 60
500mA BO

20ms 100
120
(10mAs)
130

LIMITS ±3kVp ±17.5mA ±3.6ms ±.5mAs

c SELECT ACTUAL

kVp kVp rnA ms mAs

40
LARGE
60
600mA BO
20ms 100

(12mAs) 120

LIMITS ±3kVp ±21mA ±2.Bms ±.56mAs

NAME:.__________________________ ACCEPT: _________

COMPANY:_______________________ REJECT: _________
( SIGNATURE: ______________________ DATE: ___________
10·9
TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251 (
kVp, mA, TIME, mAs ACCURACY (contd.)

Collect data as indicated.

SELECT ACTUAL
LARGE kVp kVp mA ms mAs

BOOmA 60

15ms 80

112mAsI 100

LIMITS ±3kVo ±2BmA ±2.6ms ±.56mAs

SELECT ACTUAL
LARGE kVp kVp mA ms mAs

1000mA

10ms 80 (
110mAsI

LIMITS ±3kVo ±3SmA ±2.4ms ±.SmAs

2-Factor - mAs Check - ALL Systems

Select 60 kVD

SELECT 4.5 mAs 30 mAs 150 mAs

SOmA

100mA

300mA

LIMITS ±.33 mAs ±1.1 mAs ±4.7mAs

NAME::__________________________ ACCEPT:, _________

COMPANY::______________________ REJECT.: ________
SIGNATURE::____________________
9874 10-10
DATE:.___________ (
COMPLIANCE TESTING
 TM SERIES X-RAY GENERATORS
( MAINTENANCE MANUAL 9026.251

3.0 LINEARITY
'LIN = (X1 - X2)/(X1 + X2). (X2 - X3)/(X2 + X3) •... Linearity must NOT exceed .08

SELECTED ACTUAL CALC LIN

mR mRimAs CALC'
EXP mA TIME mAs
X1 25 400ms 10
X2 50 200 10
X3 100 100 10
X4 150 70 10.5
X5 200 50 10
X6 300 35 10.5

X7 400 25 10
X8 500 20 10
X9 600 20 12
X10 800 15 12
(
lOkVD

SELECTED ACTUAL CALC LIN

mR mRimAs CALC'
EXP rnA TIME mAs
X1 25 400ms 10
X2 50 200 10
X3 100 100 10
X4 150 70 10.5
X5 200 50 10
X6 300 35 10.5
X7 400 25 10
X8 500 20 10
X9 600 20 12
X10 800 15 12

NAME:__________________________ ACCEPT: _ _ __
COMPANY: REJECT: _________
( SIGNATURE:::::--------------------- DATE: _ _ _ __
10-11
TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251 (
LINEARITY (contd.)

SELECTED ACTUAL CALC LIN

mR mRimAs CALC'
EXP mA TIME mAs
X1 25 400ms 10
X2 50 200 10
X3 100 100 10
X4 150 70 10.5
X5 200 50 10
X6 300 35 10.5
X7 400 25 10
X8 500 20 10
X9 600 20 12

NAME: ACCEPT: ________

COMPA'~N~Y~:-----------------------
REJECT: _________
SIGNATURE:._____________________ DATE:.__________ (
9874 10-12 COMPLIANCE TESTING
 TM SERIES X-RAY GENERATORS
( MAINTENANCE MANUAL 9026.251

4.0 REPRODUCIBILITY

Coefficient of Variation =Standard Deviation/Mean =a/X,vg

Where: Xi is the value of an entry

n is the number of entries

I MR READINGS I
SELECT ALL SYSTEMS TM30 TM40 TM50 TM65 TM80

kVp 60 90 120 100 100 100 100 100

mA 100 100 100 300 400 500 600 800
TIME 1Oms 10ms 10ms 100ms 100ms 100ms 100ms 100ms

EXP.1
EXP.2
EXP.3

c EXP.4
EXP.5
EXP.6
EXP.7
EXP.8
EXP.9
EXP.10
MEAN
STD
DEV
Coeff.
of
VAR.
. .
The co-efficient of variation must not exceed D...D4
NAME:----::--c-_ _ _ _ _ _ _ _ __ ACCEPT: _ _ __
COMPANY:, _ _ _ _ _ _ _ _ _ _ ___ REJECT: _ _ _ _ __
( SIGNATURE:_ _ _ _ _ _ _ _ __ DATE:,_ _ _ _ __
10-13
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251 (
5.0 Automatic Exposure Control (AEC)

1. Exposure terminates: <8.33ms or 5mAs ___________mAorms

2. Sack-up mAs: <580mAs ________________,mAs

3. AEC Limit Indication: YI N

4. Exposure Inhibited: YI N
5. AEC Reset Function: YI N
6. Exposure Switch Release: YI N
7. AEC Reproducibility
Technique: 80kVp, 540 back-up mAs, 3" of water or acrylic.
Adjust kVp for approximately 5mAs.

EXP# mR
1
2
3
(
4
5
6
7
8
9
10
MEAN
STD DEV
Coeff. of
VAR*
* Must be less than 0.04.

NAME:,~~_____________________ ACCEPT: _______

COMPANY:,=-____________________ REJECT: ________
SIGNATURE: ____________________ DATE:-::-::-:-:=~-:-==-=
9874 10-14 COMPLIANCE TESTING
c
TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

6.0 EXPOSURE FUNCTIONS

1. X-ray LED ill!

2. Audible alert sound is ill!

3. Exposure termination

7.0 FLUOROSCOPIC rnA and kVp ACCURACY

(A) CONTINUOUS FLUOROSCOPY

I SELECTED kVe I 50 I 85 I 120 I

Station 1
kVpActuaJ
rnA ActuaJ

c rnA Indicated

Station 4
kVpActual
rnA Actual
rnA Indicated

REJECTION LIMITS:
a) mA: Indicated mA on RFC must be within ± 25% ± .2 mA from Actual mAo
b) kVp: Actual kVp must be within ± 3 kVp from selected kVp.

NAME: _ _ _ _ _ _ _ _ _ _ _ __ ACCEPT: _ _ _ __
COMPANY:_ _ _ _ _ _ _ _ _ _ __ REJECT:. _ _ _ __
SIGNATURE:_ _ _ _ _ _ _ _ _ __ DATE:_ _ _ _ __
10-15
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251 (
(8) PULSED FLUOROSCOPY

I SELECTED kV~ I 60 I 85 I 120 I

30PPS
kVpActual
mAActual
mA Indicated

1.9 PPS
kVpActual
mAActual
mA Indicated

REJECTION LIMITS:
a) mA: Indicated mA on REC must be within ± 50% ± .1 mA from Actual mA
b) kVp: Actual kVp must be within ± 3 kVp from selected kVp.
(
8.0 LABELS

1. Operator Control

2. Remote Power Unit

3. High Voltage Generator

9.0 SOFTWARE VERSIONS

OC SOFTWARE VERSION:

RPU SOFTWARE VERSION:

NAME:-:-::-::-:-_ _ _ _ _ _ _ _ __ ACCEPT: _ _ __
COMPANY:,=-_ _ _ _ _ _ _ _ __ REJECT:, _ _ _ __
SIGNATURE: _ _ _ _ _ _ _ _ __ DATE:,_ _ _ _ __
9874 10-16 COMPLIANCE TESTING
 TM SERIES X-RAY GENERATORS
( MAINTENANCE MANUAL 9026.251

10.0 SYSTEM CONFIGURATION

ITEM MODEL(PN) SERIAl, NUMBER

High Voltage
Generator:

High Speed
Starter:

Collimator
Control:

Servo
Tomographic
System:

Mechanical
Tomographic
System:

Printer:

C Tube 1 Table:
Chamber # Film/Screen

Tube 1 Wall:
Tube 1 Aux:

NAME:_ _ _ _ _ _ _ _ _ _ _ __ ACCEPT:, _ _ __
COMPANY:,_ _ _ _ _ _ _ _ _ _ __ REJECT: _ _ _ __
SIGNATURE: _ _ _ _ _ _ _ _ __ DATE: _ _ _ __
10-17
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251 (
11.0 GENERATOR PROBLEM LOG

DATE OPERATOR DESCRIPTION OF PROBLEMIERROR CODE

NAME:,..,.-::...,-_ _ _ _ _ _ _ _ _ __ ACCEPT: _ _ _ __
COMPANY:,=-_ _ _ _ _ _ _ _ __ REJECT: _ _ _ __
SIGNATURE:_ _ _ _ _ _ _ _ __ DATE:_ _ _ _ __
9874 10-18 COMPLIANCE TESTING
 TM SERIES X-RAY GENERATORS
( MAINTENANCE MANUAL 9026.251

( THIS PAGE INTENTIONALLY LEFT BLANK

NAME: _________________________ ACCEPT: _ _ ___

COMPANY: ______________________ REJECT: _ _ _ __
l SIGNATURE: ___________________
10-19
DATE: _ _ _ _ __
c

(
 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

c APPENDIX A - TM GENERATOR PC INTERFACE PROGRAM OVERVIEW, VERSION 1.0.1

The TM generator PC interface initializes customized technique data for the APR and CEC features of the TM
generator. Techniques for each exam can be determined by the user. A PC program stores this data on disk
in the PC. After all data has been entered into the PC by the user, it is compiled into a form usable by the TM
generator. The ·serial interface of the PC is used to transfer the data into the OC, where it is stored in
non-volatile memory. Changes entered through the OC may also be read back out of the OC and stored on
disk.

The technique data includes the exam name and description, film/screen, receptor assignment, and the actual
technique to be used. Optional comments may be entered to guide the operator of the equipment. If present,
these comments will appear in the LCD window of the OC after [INST] is P!essed in APR or CEC mode.

The program will run on any IBM PC (or compatible) that uses MS-DOS version 2.1 or later. A minimum of
256KB of RAM and one serial port (RS-232) is required. A parallel interface port and printer are required if
print-outs are desired.

This document assumes a basic understanding of MS-DOS computers. Any questions concerning the
operation of MS-DOS should be referred to the appropriate documentation.

The program is provided on a 3.5"1.44 MB diskette. THIS IS THE MASTER COPY. IMMEDIATELY MAKE
A COPY OF IT, THEN STORE IT IN A SAFE PLACEI Do not store it near a source of magnetic fields (such
as an x-ray generator) or heat.

1.0 TO START THE PROGRAM ON A FLOPPY DRIVE (NO HARD DRIVEl

1. Boot-up the computer using the DOS 3.5" floppy disk.

c 2.

3.
Insert the WORKING COpy of the master diskette. Make this the default drive. Use a.separate
diskette.for each.client.
At the DOS prompt, type "TM" and press [ENTER] to run the program.

2.0 TO INSTALL THE PROGRAM ON A HARD DRIVE

1. Boot-up the computer from the hard drive.
2. Insert the working copy of the diskette into drive A or B and make it the default drive by typing "A:"
or "B:" and pressing [ENTER].
3. At the DOS promp~ type "INSTALL" and press [ENTER]. Remove the diskette when the "C:\" DOS
prompt returns.
4. Type "MD C:\TM\clientname" and press [ENTER]. "clientname" is any valid DOS directory name
used to uniquely identify the client.

3.0 TO START THE PROGRAM ON A HARD DRIVE

1. Type "CD C:\TM\clientname" and press [ENTER].
2. Type ',\TM\TM" and press [ENTER] to run the program.

All files created by the program will be in the "clientname" SUb-directory. Make a separate subdirectory for
each client since the program itself does not allow a unique filename for the data it stores. A benefit of this
technique is that each client's data is segr.egated into sUb-directo(ies, for a listing of subdirectories created,
type "DIR C:\TM" at the DOS prompt and press [ENTER].

The program is menu-driven. When a menu is displayed, an item may be selected by highlighting it with the
scroll-bar and pressing the [ENTER] key. The scroll-bar is moved by using either the arrow keys, the
[SPACEBAR], the [+], or the [-I keys. The [ESC] key is used throughout the program to back-out of a function
or menu to the previous selection. PreSSing the [ESC] key from the main menu causes the program to
terminate and returns control to DOS.
( The program will load and display the configuration menu the first time the program is run. After that, the main
menu will be displayed when the program is started.

APPENDIX A A-1 9700

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251

4.0 MAIN MENU (

1. The first selection on the main menu is Exam Menu. It brings up a menu with selections to enter,
modify, delete, and print exams.
2. The next selection is Communication Menu. It is used to accomplish the communication link with the
... OC.after all. the exam data has been entered .. It has selections to transfer data to or from the OC, and
to indicate which serial port to use if the computer has more than one.
3. The last selection is Configuration Menu. It is used to initialize certain parameters of the technique
memory that are common to all exams.

5.0 EXAM MENU

1. Modify/Browse Exams will review or update an exam that has been previously entered. A list is
presented to select an exam to work with.
2. Enter New Exam will add an exam to the disk. A list is presented to allow you to select which body
group to store the exam under.
3. Delete Exam is used to remove an exam from disk. A list is presented to allow you to select an
exam. Confirmation is requested before the deletion is carried out.
4. Print Exam Summary will print a list of all exams currently stored on disk. Only the descriptions and
information band data are printed.
5. Print Exam Details prints a list of all exams currently stored on disk, including all details entered for
each exam.

6.0 COMMUNICATION MENU

1. Transfer Data to TM Generator reads the exam data stored on disk and compiles it into a format that
the OC can accept. It then sends the compiled data to the serial port as a series of blocks of data
until all technique memory present in the OC has been programmed.

Once started, the process may be interrupted by preSSing the [ESC] key. It may then be resumed (.
or terminated when prompted. If terminated, the technique memory is left in an undefined state and
will not be accessible until the transfer is rerun.

A message will be displayed on the computer screen and on the OC LCD window when the data has
been successfully transferred. A status screen is displayed and updated as the transfer is in
progress. The transfer typically requires 4.5 minutes per 32KB of technique memory.
2. Transfer Data from TM Generator complements the previous function. It reads the data back from
the OC as a series of blocks and stores it on disk. Then it decompiles the data into the original exam
format so that the exams can be manipulated as if they had been entered from the keyboard. If the
program detects that exam files are already present on disk (in the current sub-directory), it will
rename them to prevent the incoming data from overwriting them. As above, the transfer may be
interrupted by pressing [ESC].
3. Set Communication Port determines which serial port is connected to the TM ~C. Com1 and Com2
are supported. The default is Com1. This value is stored on disk. To transfer data, see SECTION
A-l0.0.

7.0 CONFIGURATION MENU

1. The first three selections, Receptors for tube X, are used to enter the grid ratio information. This
.. :."".' information;is ~utomatically displayed on the second line of the instruction screen.
2. Film/Screen Descriptions is used to enter the text that will be displayed for each film/screen
combination used. This information is automatically displayed on the first line of the instruction
window.
3. Dealer/Client Information is used to personalize the print-outs the program produces.
4. Print Current Configuration is used to produce hardcopy output with the printer connected to the
PC. This print-out is useful when entering exams. The printer must be ready when this option is
selected or an error will occur that causes the program to abort and return to DOS. If this happens, (.
restart the program. No data will be lost. _

9700 A-2 APPENDIX A

 TM SERIES X·RAY GENERATORS
MAINTENANCE MANUAL 9026.251
( 8.0 ENTERING OR MODIFYING AN EXAM
On the computer, each exam has five screens associated with it. An area at the bottom of the screen contains
information about some of the keys that can be used as the data is edited. These keys are not listed. The
[Page-Up) and [Page-Down) keys go from screen-to-screen of each exam. Holding down the [Ctrl) key while
pressing [Page-Up) or [Page-Down) will store the current exam to disk and present the previous or next exam
sequentially. The [1) and [1) keys increment and decrement the numeric value of a field by one. The [ESC)
key stores an exam to disk and returns to the previous menu.

The Pediatric and X-Large entries for APR are optional. A value of zero in either the kVp or mAs field will
disable the selection.

9.0 INSTALLATION OF MEMORY CHIPS

The Technique Memory chip plugs into the socket for U3, on the micropro'cessor PCB in the ~C. The DC
software EPROM at U5 must be version 1.0.6 or higher. The Remote Power Unit (RPU) software version
number must match the version number of the ~C.

10.0 TRANSFERRING THE DATA

When ready to transfer the data:
1. Remove power to the ~C.
2. Connect the supplied interface cable between the serial port of the PC and J5 of the ~C.
3. Remove the protective label from the DC rear and flip SW3-8 DOWN in the ~C.
4. Turn ON the DC and press [ALT MENU).
5. Select option #2 "Setup Routines". Use the [NEXT] and [BACK) keys to select "Enable PC
Communications" .
6. Press [EXECUTE). The LCD window will display "PC Communications Enabled".

( If radiographic APR and/or CEC data from one client (source) is to be used for another (destination),
copy the source client's EXAM.DAT and EXAM.lDX files to the destination client's directory.
Transferring data to TM generator:
1. On the PC, run the TM program and select "Communication Menu".
2. Select the proper communication port with the "Set Communication Port" selection.
3. Select "Transfer Data to TM Generator". A message indicating successful completion will appear
on the PC display, as well as the DC LCD window, when the transfer is complete. If these messages
do not appear, or other messages appear indicating that the transfer was aborted, the program must
be rerun.
4. When the transfer is complete, use the [ESC) key to back out of the menus and return to DOS. Make
a backup copy of the exam data first.
5. The PC may now be turned OFF.
6. Turn OFF the ~C.
7. Disconnect the interface cable.
8. Flip SW3-8 in the DC UP and replace the supplied protective label.
9. Turn the DC ON.
10. Verify that the APR and CEC data is present.
11. The KVp and MAs values of an exam may be modified by the user. Simply select the new values,
press the [ALT MENU) button, select [SAVE FP) then press the YES button in the LCD window; Two
."beeps,will {;onfirm that the,data was stored.

Transferring data from TM generator:

When exam data is present in a subdirectory, it should be saved. Use DOS to copy the files named
EXAM.DAT, EXAM.IDX, and SETUP.DAT to a floppy disk. At the beginning of the transfer, if the program
detects any of the files EXAM.DAT, EXAM. lOX, or SETUP.DAT it will preserve them by renaming them to
EXAM_BAK.DAT, EXAM_BAK.IDX, or SET_BAK.DAT. This is the last opportunity to save them because
running the transfer a second time will overwrite these backup copies.
( 1. Prepare the DC as in 10.0.
2. Run the TM program and select "Communication Menu".
3. Select the proper communication port with the "Set Communication Port" selection.

APPENDIX A A-3 9700

 TM SERIES X-RAY GENERATORS
MAINTENANCE MANUAL 9026.251
(
4. Select ''Transfer Data from TM Generator". A message indicating successful completion will appear
on the PC display as well as the OC LCD window when the transfer is complete. If these messages
do not appear, or other messages appear indicating that the transfer was aborted, the program must
.be rerun.
5. The exam data may now be modified as desired and transferred back to the OC as detailed above.
6. When finished, turn OFF the OC, disconnect the interface cable and flip SW3-8 UP in the OC.

11.0 USING THE SUPPLIED GENERAL RADIOGRAPHY EXAMS

There is a collection of generic exams supplied on the diskette that may be used or modified to fit the users'
needs. To access these files:
1. Boot-up the computer.
2. Follow the appropriate directions below.
a. On a floppy based system:
I. Insert the working copy of the diskette into drive A or B and make it the default drive
by typing "A:" or "B:" and pressing [ENTER].
ii. Type "CD IGENRAD" and press [ENTER].
iii. Type ',\TM" and press [ENTER] to run the program.

b. On a system with a hard disk (the files are automatically copied by the INSTALL program into
a separate subdirectory named GENRAD.):
I. Type "CD ITMIGENRAD" and press [ENTER].
ii. Run the TM program as normal. (i.e. type ',\TMITM" and press [ENTER])

12.0 TM MENU TREE

Main Menu Exam Menu Modify/Browse Exams
Enter New Exam
Delete Exam
(
Print Exam Summary
Print Exam Details

Communication Menu Transfer Data to TM generator

Transfer Data from TM Generator
Select Communication Port

Configuration Menu Receptors for Tube 1

Receptors for Tube 2
Receptors for Tube 3
Film/Screen Descriptions
Dealer/Client Information
Print Current Configuration
. ;

9700 A-4 APPENDIX A

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