Micro Chip Fuse

Micro Chip Fuse

Type: ERBSE
ERBSD

■ Features
● Small size
● Fast-acting and withstanding in-rush current characteristics
● Pb free

■ Approved Safety Standards

● UL248-14 : File No.E194052
● c-UL(CSA)C22.2 No.248-14 : File No.E194052

■ Explanation of Part Numbers

1 2 3 4 5 6 7 8 9 10

E R B S E 1 R 0 0 U

Product Code Fusing Characteristics Product shape Rated Current (A) Packaging
Fast-acting and 1608 size (ex.) 1R00=1.0 A U Punched carrier taping
Micro Chip Fuse E
S withstanding in-rush (1.6 mm҂0.8 mm)
current 1005 size
D
(1.0 mm҂0.5 mm)

■ Construction ■ Dimensions in mm (not to scale)

Marking
a
Fusing Element Protective Coating

Ceramic Core
Electrode t
(Outer) L

W
Trimming

Type Dimensions (mm)

(inches) L W a t
ERBSE ±0.15 ±0.15 ±0.20
(0603) 1.60 0.80 0.30 0.70±0.10
ERBSD
(0402) 1.00±0.10 0.50±0.10 0.20±0.15 0.40±0.10

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006
 Micro Chip Fuse

■ Ratings
● 1608 Size
ERBSE첸R첸첸U
Part No.
0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00 5R00
Rated Current (A) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0 5.0
Marking Code F G H J K N O P S T
Internal R (m액) at 25 °C max. 370 245 155 120 90 60 48 36 28 20
Rated Current ҂100 %/4 hours min.
Fusing Current/Fusing Time
Rated Current ҂200 %/5 seconds max.
(at 25 °C)
Rated Current ҂300 %/0.2 seconds max.
Rated Voltage
32 VDC
(Open Circuit Voltage)
Interrupting Rating
50 A
(at Rated Voltage)
Category Temp. Range
−40 °C to +100 °C
(Operating Temp. Range)

● 1005 Size
ERBSD첸R첸첸U
Part No.
0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00
Rated Current (A) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0
Marking Code F G H J K N O P
Internal R (m액) at 25 °C max. 330 200 135 100 80 53 40 33
Rated Current ҂100 %/4 hours min.
Fusing Current/Fusing Time
Rated Current ҂200 %/5 seconds max.
(at 25 °C)
Rated Current ҂300 %/0.2 seconds max.
Rated Voltage
24 VDC
(Open Circuit Voltage)
Interrupting Rating
35 A
(at Rated Voltage)
Category Temp. Range
−40 °C to +100 °C
(Operating Temp. Range)

70 °C
Power Derating Curve 100

• For Circuit, current rating shall be derated in 80

Rated Load (%)

accordance with the figure on the right. 60

• This current derating curve is for fusing 40
characteristics. 20
100 °C
0
–40 –20 0 20 40 60 80 100 120 140
Ambient Temperature (°C)

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006
 Micro Chip Fuse

■ Fusing Characteristics (25 °C typical)

● I–t Characteristics
● Type ERBSE

0.75 A

1.25 A
0.75 A

1.25 A
● Type ERBSD

0.5 A

1.0 A

1.5 A
2.0 A
2.5 A
3.0 A
0.5 A

1.0 A

1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
10 10

1 1

Fusing Time (s)

Fusing Time (s)

0.1 0.1

0.01 0.01

0.001 0.001

✽ Reference Only ✽ Reference Only

0.0001 0.0001
0.1 1 10 100 0.1 1 10 100
Fusing Current (A) Fusing Current (A)

● I2t–t Characteristics

● Type ERBSE ● Type ERBSD

5.0 A
100 4.0 A 100
3.0 A 3.0 A
2.5 A 2.5 A
2.0 A 2.0 A
10 1.5 A 10 1.5 A
1.25 A 1.25 A
1.0 A 1.0 A
0.75 A 0.75 A
1 0.5 A 1 0.5 A
I2t (A2s)
I2t (A2s)

0.1 0.1

0.01 0.01

0.001 0.001
✽ Reference Only ✽ Reference Only
0.0001 0.0001
0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1
t (s) t (s)

■ Packaging Methods
● Standard Quantity
Type Kind of Taping Pitch (P1) Quantity
ERBSE 4 mm 5000 pcs./ reel
Punched Carrier Taping
ERBSD 2 mm 10000 pcs./ reel

● Punched Carrier Taping ● Taping Reel

T

Sprocket hole Compartment

fD0 fC
F E

A
fB
W
B

T Chip component P1 P2 P0 Taping running direction

fA W

Dimen Type A B W F E fA fB fC W T
Dimensions
sions ERBSE 1.00±0.10 1.80±0.20 +0 ±1.0 ±1.0
(mm) 8.00±0.20
3.50±0.05
1.75±0.10 (mm) 180.0−3.0 60 min. 13.0 9.0 11.4±1.0
ERBSD 0.65±0.05 1.15±0.05

Dimen Type P1 P2 P0 fD0 T

sions ERBSE 4.00±0.10 ±0.05 ±0.10 +0.10 0.85
±0.07

(mm) 2.00 4.00 1.50 –0

ERBSD 2.00±0.10 0.60±0.07

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006
 Micro Chip Fuse

■ Recommended Land Pattern

Dimensions (mm)
C Type
A B C
ERBSE 0.9 2.1 to 2.3 0.8
A
B ERBSD 0.6 1.4 to 1.6 0.5

■ Recommended Soldering Conditions

Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
·Reflow soldering shall be performed a maximum of
two times. For soldering (Example : Sn/Pb)
·Please contact us for additional information when
used in conditions other than those specified. Temperature Time
·Please measure the temperature of the terminals and Preheating 140 °C to 160 °C 60 s to 120 s
study every kind of solder and printed circuit board
for solderability before actual use. Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Peak
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature

Preheating Temperature Time

Preheating 150 °C to 180 °C 60 s to 120 s
Heating
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s

Time

<Repair with hand soldering>

● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.

1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses)
under normal conditions is within 70% of the rated current.
2. Do not continuously pass a current exceeding the rated current through the fuses.
3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take
care not to cause unwanted fusing. Calculate the I2t value of the pulse and check the tolerance to the number
of pulses according to the I 2t-t characteristic curve before deciding to use the fuses. Before checking the
tolerance, consult our sales staff in advance.
4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure
that the abnormal current generated when a circuit abnormality occurs in your product is at least double or
greater than the rated current of the fuses. In addition, ensure that the abnormal current of your product does not
exceed the maximum interrupting current of the fuses.
5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary
side.
6. Ensure that the voltage applied to the fuses are within their rated voltage.
7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses
on your products and carefully check and evaluate their operating temperature range.

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006
 Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

(1) Precautions for use

• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.

(2) Precautions for storage

The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight

<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.

Feb. 2006

– EX2 –