PCB Fabrication
PCB Fabrication
1.The layout of the Pcb is drawn on Orcad.This is transferred to a mylar sheet.this sheet is touched with black ink. 2.The solder side of the mylar sheet is placed on the shiny side of the five star sheet and is placed in a frame.it is then exposed to sunlight,with mylar sheet facing the sunlight. 3.the exposed five star data sheet is put in hydrogen peroxide solution.it is then put in hot water and shook till unexposed region becomes transparent. 4.this is put in cold water and then the rough side is stuck on to the silk screen.this is then pressed and dried well. 5.the plastic sheet of the five star sheet is removed leaving the pattern on the screen. 6.a chopper clad is cut to size and cleaned.this is placed under the screen. 7.acid resistant ink is spread on the screen so that pattern of the tracks and pad is obtained on the copper clad sheet .it is dried. 8.the dried sheet is then etched using ferric chloride solution till all the unwanted copper is etched away. 9.the unwanted resist ink is removed using the sodium hydroxide solution.holes are then drilled.
Soldering techniques
Soldering is a process of joining two or more similar or dissimilar metals by using lower melting point metal to melt or alloy with the joining surfaces.It provides continuous and permanent path for the flow of electricity.
SOLDER:
Solder is an alloy of two or more metals which is used to join metals together by the application of heat.the most important property of an alloy or a metal to be used as a solder is the low melting point.solder is used for joining two or more metals at temperatures below their melting point.the popular used solders are the alloy of tin(60%)and lead(40%)that melts at 190 degree Celsius and solidifies when it cools.most of the solder wires are flux cored type.when such soldering wires are used , no extra soldering flux is needed.
FLUX : The word flux means flow.the job of flux is to promote the wetting action:molten solder spreads over all the area soldered,dissolve all oxides in base metal and remove all air bubbles.in order to make the surface accept the solder readily, the component terminal should be free from oxides and other obstructing films.the soldering flux cleans the oxides metal surface.the leads should be cleaned chemically or by abrasion usin blades or knives.
SOLDERING IRON: It is the tool to melt the solder and apply at the joints at the circuit.it operates in 230v ac supply.the power rating of the soldering iron are 10w,25w,65w,125w etc.the iron bit at the tip of it gets heated up within a few minutes.
SOLDERING PROCESS
Make the layout of the components in the circuit. plug in the cord of the soldering iron into the mains to get it heated. Straighten and clean the component leads using a blade or a knife.apply a little flux on the leads.take a little solder on the
soldering iron and apply the molten solder on the leads.care must be taken to avoid components getting heated up. Mount the components on the pcb by bending the leads of the components.use nose pliers. Apply flux on the joints.soldering must be done in minimum time to avoid dry soldering and heating up of the components. Wash the residue using the water and brush.