US010178813B2

(12) United States Patent ( 10) Patent No.: US 10 ,178 ,813 B2

Boteler et al. (45 ) Date of Patent: Jan . 8 , 2019
(54 ) STACKED POWER MODULE WITH (56 ) References Cited
INTEGRATED THERMAL MANAGEMENT
U .S . PATENT DOCUMENTS
(71) Applicant: U . S . Army Research Laboratory 4,944,344 A * 7/1990 Crowe . ......... F28D16515/ 104/0233.11
ATTN : RDRL -LOC - I, Adelphi, MD
(US) 5 ,532 ,512 A * 7/ 1996 Fillion ... ......... ... HO1L 25 /071
257/686
(72) Inventors : Lauren M . Boteler, Highland , MD (Continued )
(US ); Damian P . Urciuoli, Bowie , MD
(US )
FOREIGN PATENT DOCUMENTS
EP 2546874 1 /2013
( 73 ) Assignee : The United States of America as OTHER PUBLICATIONS
represented by the Secretary of the
Army, Washington , DC (US) “ DirectFET — A Proprietary New Source Mounted Power Package
for Board Mounted Power” (PCIM 2001), Andrew Sawle, Martin
Subject to any disclaimer,the term of this
( * ) Notice: patent Standing, Tim Sammon , Arthur Woodworth , International Rectifier,
is extended or adjusted under 35 Oxted , Surrey. England.
U .S . C . 154 (b ) by 0 days . (Continued )
Primary Examiner — David M Sinclair
(21) Appl. No.: 15 /416,495 Assistant Examiner - Robert D Brown
(74 ) Attorney , Agent, or Firm — Eric Brett Compton
(22 ) Filed : Jan . 26, 2017 (57 ) ABSTRACT
A power module including a plurality of power die layers
including power electronic components ; a plurality of heat
(65 ) Prior Publication Data sink components operatively connected to multiple sides of
US 2018 /0213676 A1 Jul. 26 , 2018 each power electronic component; a plurality of electrically
conductive layers contacting the plurality of heat sink com
ponents, wherein a power die layer and an electrically
(51) Int. Cl. conductive layer sequentially alternate to form a stacked
H05K 7 / 20 ( 2006 .01) structure such that both ends of the stacked structure
HO2M 3 / 158 ( 2006 . 01) includes an end electrically conductive layer. A cooling path
is integrated with each layer in the stacked structure . A
(52 ) U .S. CI. housing unit houses the stacked structure . The power elec
CPC . ........ H05K 7/ 2089 ( 2013. 01 ); H02M 3/ 158 tronic components may include heat- producing electronic
(2013.01 ); H05K 7 /209 ( 2013 .01 ) devices. The cooling path may accommodate any of a fluid
(58 ) Field of Classification Search and solid to liquid phase change materials. The fluid comes
CPC .......... HO5K 7 / 2089 – 7 / 20945 ; HO1L 23 /4012 ; into direct contact with the power die layers , heat sink
HO2M 3 / 158 components, and electrically conductive layers.
See application file for complete search history. 19 Claims, 13 Drawing Sheets

58
 US 10 ,Page
178 ,2813 B2

(56 ) References Cited 2013 /0015495 A1 * 1/2013 Hauenstein ..... ..... HOLL 25 /071
257 / 140
U . S . PATENT DOCUMENTS 2013 /0020694 A1* 1/2013 Liang ................... HO1L 25 /072
257 /691
6 ,014 ,313 A * 1/ 2000 Hesselbom ......... HO1L 25/ 0652 2014 /0327127 A1 * 11/2014 Hable ................... HO1L 21/50
174 / 16 . 3 257 /712
6 ,031,279 A 2 /2000 Lenz 2015/0208550 Al* 7 / 2015 Rugg ................. HO5K 7 / 20518
6 ,306 ,680 B1 10 / 2001 Fillion et al. 361/713
8 , 279 ,605 B2 * 10 / 2012 Kawanami ............ HO1L 23 /642 2015 /0289410 A1 * 10 / 2015 Salat ..................... HOIL 23 / 473
361/704 361/699
8 ,358 ,000 B2 * 1/ 2013 Beaupre . ............ HO1L 23 /3735 2016 /0286687 A1* 9 /2016 Tajima .... HO5K 7 /2049
257 /691 2016 /0329264 A1 * 11/2016 Ekwall .... HOIL 23 /4006
2004 /0089934 A1* 5 /2004 Shimoida ............ HO1L 25 /071 2016 /0358838 A1* 12 /2016 Basler . HO1L 24 /48
257 /686 2017 /0047268 A1 * 2 /2017 Terasaki .............. . HO1L 25 /07
2004/0164432 A1 * 8 /2004 Hsu ......................... HOIL 23/44 2018 /0040537 Al * 2 /2018 Grassmann ........... HO1L 23 /473
257 / 786
2005/0167801 A1* 8/ 2005 Kerr . HO1L 23 / 3677 OTHER PUBLICATIONS
257 /678
2005 /0208750 A1 * 9 / 2005 Hsu ......................... HO1L 25 /07 Charlotte Gillot, et al., “ Double- Sided Cooling for High Power
438 /614 IGBTModules Using Flip Chip Technology,” IEEE Transactions on
2006 /0289147 A1* 12 /2006 Zuo .................... F28D 15 / 0266 Components and Packaging Technologies, vol. 24 , No. 4 , pp .
165/ 104. 26 698 -704 , Dec . 2001.
2010/0308421 Al * 12/2010 Muto HOLL 25 /074 A slide of a presentation made at a meeting at the Jet Propulsion
257 / 401 Laboratory ( JPL ) on May 5 , 2016 .
2011/0038122 A1 * 2 / 2011 Ahangar ............. HO1L 23 /4275 Poster titled “ Power Electronics Packaging : An Approach with
361/ 700 Stacked Die and Integrated Cooling ," displayed at the 10th annual
2011/0227207 A1 * 9 / 2011 Yilmaz ............. HO1L 23 /49524 Summer Student Symposium at the Adelphi Laboratory Center in
257 /676 Maryland , Aug. 11, 2016 .
2012 /0299119 A1 * 11/ 2012 Xue .................. HO1L 23 /49524
257 / 401 * cited by examiner
U . S . Patent
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 US 10 , 178 ,813 B2
STACKED POWER MODULE WITH power module comprises a stack of power electronic com
INTEGRATED THERMAL MANAGEMENT ponents arranged in layers; an electrically conductive mate
rial separating each layer from one another ; a heat sink
GOVERNMENT INTEREST operatively connected to multiple sides of each power
5 electronic component in the stack ; and a cooling path
The embodiments herein may be manufactured , used , integrated with each layer in the stack . The power electronic
and/ or licensed by or for the United States Government components comprise a plurality of diodes. The power
without the payment of royalties thereon . electronic components comprise a plurality of switching
devices. The cooling path may accommodate any of a fluid
BACKGROUND 10 and solid to liquid phase change materials . The power
module may further comprise electrically conductive layers
Technical Field positioned on opposite ends of the stack , wherein the elec
trically conductive layers comprise a first end electrically
The embodiments herein generally relate to power elec - conductive layer and a second end electrically conductive
tronics, and more particularly to a power module packages. 15 layer . The first side may face towards the first end electri
cally conductive layer, and the second side may face towards
Description of the Related Art the second end electrically conductive layer, wherein the
first end and second electrically conductive layers may
There is a trend in power electronics towards more power comprise busbars . Each power electronic component may
in smaller packages which leads to significantly higher 20 comprise a first side and an oppositely positioned second
power densities and the need to remove more heat. The side . The heat sink may comprise at least one pillar structure
devices can handle the high currents and voltages butmust extending from each of the first side and the second side of
often be derated due to the limitations of the packaging. each power electronic component. The power module may
Current power electronics modules are large and heavy , further comprise a housing unit that houses the power
most of which is the packaging . There are three primary 25 module. The electrically conductive material may be con
challenges associated with current power modules: heat figured as a structured layer comprising a base portion and
removal, reliability, and parasitic inductance . Most research an external electrical contact extending from the base por
to date has explored options of improving only one of these tion . The housing unit may comprise a plurality of holes
challenges by methods such as eliminating wirebonds or aligned with the cooling path to create an inlet and outlet for
incorporating a better heat sink. 30 a cooling fluid to traverse along the cooling path . The power
A conventional power package 10 is shown in FIG . 1 and module may further comprise a housing unit that houses the
contains a direct bond copper (DBC ) substrate 12 that has power module , wherein the housing unit may comprise a
chips 14 soldered 16 to one side and a heat spreader 18 plurality of electrical contacts that operatively connect to the
and /or heat sink 20 attached to the other. A thermal material plurality of switching devices. The power module may
interface ( TIM ) 22 separates the heat spreader 18 from the 35 further comprise multiple power modules adjacent to one
heat sink 20 . Wirebonds 24 are then used to make the another. The stack of power electronic components arranged
electrical connections. in layers may comprise a half-bridge configuration . The first
Thermal management is crucial in high power electronics end electrically conductive layer and the second end elec
due to the extremely large amount of heat that is dissipated trically conductive layer may comprise copper. The fluid
by the devices . The amount of power that a module can 40 comes into direct contact with the power electronic compo
achieve is most often temperature limited ; therefore , if the nents.
heat can more effectively be removed , the module can Another embodiment provides a power module compris
operate at a higher power density . In addition , most reliabil - ing a plurality of power die layers comprising power elec
ity concerns are strongly temperature dependent; therefore, tronic components ; a plurality of heat sink components
reducing device temperature will improve reliability . 45 operatively connected to multiple sides of each power
Parasitic inductance is typically caused by the packaging; electronic component; a plurality of electrically conductive
primarily wirebonds and planar packaging topologies. This layers contacting the plurality of heat sink components,
parasitic inductance in combination with higher currents and wherein a power die layer and an electrically conductive
faster switching speeds, results in voltage overshoot and layer sequentially alternate to form a stacked structure such
ringing during switching, as is seen in the following equa - 50 that both ends of the stacked structure comprises an end
tion : electrically conductive layer ; a cooling path integrated with
v = Lºl/dt each layer in the stacked structure; and a housing unit that
houses the stacked structure . The power electronic compo
These voltage spikes and ringing lead to the necessity for nents may comprise heat-producing electronic devices. The
devices to be derated up to 50 % . Additionally, inductance 55 cooling path may accommodate any of a fluid and solid to
causes signal delays which cause the devices to turn on liquid phase change materials . The fluid comes into direct
differently , thus affecting the performance ofthe system and contact with the plurality of power die layers , the plurality
decreasing the reliability . The current practice for reducing of heat sink components , and the plurality of electrically
inductance is to add a snubber to the system to clamp the conductive layers .
peak voltage but snubbers are power dissipative and often 60 These and other aspects of the embodiments herein will
require their own cooling system in addition to adding be better appreciated and understood when considered in
complexity to the system and increasing its size . conjunction with the following description and the accom
panying drawings . It should be understood , however, that
SUMMARY the following descriptions, while indicating preferred
65 embodiments and numerous specific details thereof , are
In view of the foregoing, an embodiment herein provides given by way of illustration and not of limitation . Many
a power module comprising a power module , wherein the changes and modifications may be made within the scope of
 US 10 , 178 ,813 B2
the embodiments herein without departing from the spirit heat sink . It also eliminates the solid dielectric substrate
thereof, and the embodiments herein include all such modi ( e . g ., DBC ) used in most power packaging modules. Refer
fications. ring now to the drawings , and more particularly to FIGS. 2A
through 5F, where similar reference characters denote cor
BRIEF DESCRIPTION OF THE DRAWINGS 5 responding features consistently throughout the figures ,
there are shown preferred embodiments .
The embodiments herein will be better understood from According to the embodiments herein by stacking power
the following detailed description with reference to the devices, the power module is no longer constrained by the
drawings, in which : limitations of planar packaging ; therefore, significant
FIG . 1 is a schematic diagram of a conventional power 10 improvements can be made to the package .However , stack
package ; ing devices creates a significant thermal challenge which
FIG . 2A is a circuit diagram of a half-bridge inverter must be addressed . The thermal challenge is addressed by
showing connections between two switch devices and two incorporating the heat sink both above and below each of the
diodes according to an embodiment herein ; stacked devices.
FIG . 2B is a schematic diagram of a power package 15 Generally , the embodiments herein comprise a power
containing the half-bridge inverter of FIG . 2A showing the module which incorporates stacked power components and
different layers and connections to various devices accord an integrated cooling system . An exemplary configuration
ing to an embodiment herein ; provides for a half-bridge layout 30 shown in FIG . 2A with
FIG . 3A is a perspective view of the power package two diodes 31 , 32 and two switching devices 33 , 34 (e. g .,
module of FIGS . 2A and 2B according to an embodiment 20 IGBTs, MOSFETS , etc .). However, the embodiments herein
rein ;.
herein can equally include other types of electronic components
FIGS . 3B through 3E are various schematic diagrams of such as bypass capacitors , among others.
the power package module of FIG . 3A configured in a The basic unit cell of the packaging structure 40 is shown
housing unit according to an embodiment herein ; in FIG . 2B , with reference to FIG . 2A , and this structure 40
FIG . 4 is a cross -sectional diagram of a power package 25 is the building block of all larger modules discussed below
module in a stacked configuration showing how fluid passes with respect to the embodiments herein . The structure 40
over the devices according to an embodiment herein ; comprises five layers (Layers 1 -5 ) which alternate and
FIG . 5A is a schematic diagram of a power package comprise electrically conductive material (Layers 1 , 3 , and
module in a 3 - phase inverter configuration showing a 5 ) and devices (Layers 2 and 4 ). One aspect of the embodi
stacked configuration of twelve devices according to an 30 ments herein is that the electrically conductive layers act as
embodiment herein ; electrical, thermal, and structural connections. This configu
FIG . 5B is a schematic diagram of the power package ration also incorporates an integrated cooling system which
module of FIG . 5A configured in a housing unit according can be passive air cooling , forced air convection , active
to an embodiment herein ; liquid cooling, solid to liquid phase change materials, and /or
FIG . 5C is a schematic diagram of the power package 35 boiling liquids depending on the application requirements .
module of FIG . 5A fully configured in a housing unit The electrically conductive layers (Layers 1 , 3 , and 5 )
showing the locations of the fluidic connections according to comprise copper that is plated with nickel and /or gold ,
an embodiment herein ; and although other electrically conductive materials can be used .
FIGS. 5D through 5F are schematic diagrams of the In order to create the conductive layers (Layers 1, 3 , and 5 ) ,
power package module of FIG . 5A fully configured in a 40 a sheet of the electrically conductive material is machined ,
housing unit according to an embodiment herein . additively manufactured , and /or chemically etched to create
pillars for connection to the devices (Layers 2 and 4 ). Pillars
DETAILED DESCRIPTION 37 are formed on both sides of Layer 3 but only on one side
for layers 1 and 5 . These pillars 37 are attached to the
The embodiments herein and the various features and 45 devices 31- 34 by solder , conductive paste , or another
advantageous details thereof are explained more fully with mechanism that is both thermally and electrically conduc
reference to the non - limiting embodiments that are illus - tive . The pillars 37 serve two purposes : ( a ) thermal connec
trated in the accompanying drawings and detailed in the tions to remove the heat from the devices 31- 34 and (b ) low
following description . Descriptions of well -known compo - stress interconnects to the devices 31- 34 . The pillars are not
nents and processing techniques are omitted so as to not 50 required for the structure to operate effectively and a solid
unnecessarily obscure the embodiments herein . The metal electrical connection can also be used .
examples used herein are intended merely to facilitate an The base layer (Layer 1) acts as the positive bus 35 and
understanding of ways in which the embodiments herein connects the drain (D ) of the switching device 33 , 34 to the
may be practiced and to further enable those of skill in the cathode of the associated diode 31 , 32 . On top of the base
art to practice the embodiments herein . Accordingly, the 55 electrically conductive layer (Layer 1) are the devices
examples should not be construed as limiting the scope of (Layer 2 ): diode 31 and switching device 33 . The next layer
the embodiments herein . (Layer 3 ) comprises a substantially middle conductive layer
The embodiments herein provide a technique for power 38 that acts as the midpoint on the circuit 30 ( of FIG . 2A )
electronics packaging , which stacks power devices with and structure 40 ( of FIG . 2B ). The middle conductive layer
integrated cooling. In one exemplary embodiment, the struc - 60 38 electrically connects the source (S ) of the lower switch
ture comprises at least a five -layer stack (metal, power die , ing device 33 and the anode of the lower diode 31 to the
metal, power die , metal) with the metallic layers acting as anode of the upper diode 32 and the drain (D ) of the upper
thermal, structural, and electrical contacts between the switching device 34 . Layer 4 comprises diode 32 and
power die . The power module configuration significantly switching device 34 . The final layer (Layer 5 ) acts as the
reduces power module packaging size , weight, and cost 65 negative bus 36 in the half -bridge configuration .
while improving reliability and performance . The embodi- FIGS. 3A through 3F , with reference to FIGS. 2A and 2B ,
ments herein stack power devices and include an integrated illustrate a half -bridge configuration . FIG . 3A shows the four
 US 10 , 178 ,813 B2
devices 31- 34 with the metal pillars 37 attached to both the flanged ends 55 , 56 comprising a plurality of holes 57 used
top and the bottom of the devices 31 -34 . The positive bus 35 to accommodate screws (not shown ), as well as a fluidic
may be configured as a busbar comprising a base portion 41 inlet hole 61 and outlet hole 63 such that the inlet hole 61 is
and an external electrical contact 42 extending from the base positioned in between the first block component 49 and the
portion 41 . The external electrical contact 42 creates a 5 second block component 69 , and with the outlet hole 63
cut-out region 74 with respect to the base portion 41. The positioned under the second block component 69 . In the
negative bus 36 may also be configured as a busbar com - fully assembled configuration of the housing 50, as shown in
prising a base portion 45 and an electrical contact external FIG . 3E , the pillars 37 of the module 40 are shown through
electrical contact 46 extending from the base portion 45 . The the inlet hole 61 and outlet hole 63 , wherein the inlet hole
external electrical contact 46 creates a cut- outregion 76 with 10 61 and outlet hole 63 are configured in a substantially central
respect to the base portion 45 . The middle conductive layer area 77 of the plate component 67. When the housing 50 is
38 may be similarly configured as the positive bus 35 and the fully assembled around the module 40 , the negative bus 36
negative bus 36 such that the middle conductive layer 38 of the module abuts the first block component 49 , and the
comprises a base portion 43 and an external electrical middle conductive layer 38 abuts the second block compo
contact 44 extending from the base portion 43 . The external 15 nent 69 such that the external electrical contact 46 of the
electrical contact 44 creates a cut-out region 75 with respect negative bus 36 aligns with and extends through the cut-out
to the base portion 43 . The configurations of the external region 66 of the end wall 48 of the second component 52 of
electrical contacts 42, 44 , 46 may be embodied differently the housing 50 such that the cut- out region 75 is bounded by
and in different configurations the cut-out regions 74 , 75 , 76 the external electrical contact 46 on one side, the end wall
may not exist. Accordingly, FIGS. 3A through 3F show only 20 48 on another side, and the side wall 53 on still another side
one possible configuration , and the embodiments herein are thereby creating a portion of the cooling path ( further shown
not restricted to any particular configuration . in FIG . 4 ). Similarly , when the housing 50 is fully assembled
The module 40 is configured to be aligned into a housing around the module 40 , the external electrical contact 44 of
50 comprising a first component51 and a second component the middle conductive layer 38 aligns with and extends
52 and can be made of any non - electrically conductive 25 through the cut -out region 64 of the end wall 48 of the
material that is fluidically sealed . FIG . 3B illustrates the second component 52 of the housing 50 . Furthermore, when
module 40 positioned in the first component 51 . FIG . 3C the housing 50 is fully assembled around the module 40 the
illustrates how the second component 52 is prepared for external electrical contact 42 of the positive bus 35 aligns
alignment with the first component 51 containing the mod with and extends through the channel 68 of the base com
ule 40 . FIG . 3D illustrates an exploded view of the module 30 ponent 58 of the first component 51 of the housing 50 .
40 , first component 51, and second component 52 . FIG . 3E Moreover, the top portion 72 of the wall component 59 of
illustrates the assembled housing 50 . The housing 50 is the first component 51 is configured to abut the top wall 54
generally configured to fluidically seal the component, pro - of the second component 52 such that the cut -out portion 73
vide electrical isolation , and create mechanical support. In accommodates the first block component 49.
an exemplary embodiment, the first component 51 com - 35 The integrated heat sink is another aspect of the module
prises a base component 58 and a wall component 59 40 provided by the embodiments herein . The challenge of
upwardly extending from the base component 58 . The wall stacking two power devices 31/ 33 , 32 / 34 is the ability to get
component 59 includes a top portion 72 with a cut-out the heat out effectively . It is known in the industry that if two
portion 73 configured therein . The base component 58 is equally heat dissipating devices are placed on top of each
configured to hold the positive bus 35 . The base component 40 other , then the device on the top will be significantly hotter
58 comprises a pocket 65 configured in the base component than the one below it when the heat is removed through the
58, and a channel 68 connected to said pocket 65 and bottom . This is especially challenging in power devices
extending to an end 47 of the base component 58 . The which are already extremely heat dissipative devices and
pocket 65 is dimensioned and configured to accommodate often are already approaching their thermal limits in appli
the base portion 41 of the positive bus 35 , and the channel 45 cations. Therefore , in order to effectively stack two power
68 is dimensioned and configured to accommodate the devices , the ability to effectively remove heat is critical. In
external electrical contact 42 of the positive bus 35 . Fur - addition , it is known that the removing heat from both the
thermore, four additional electrical contacts 60 that are top and bottom of the device is preferred over the typical
placed into the first component 51 are gate ( G ) and source approach of only removing heat through the substrate (back
(S ) contacts for the switch device 33 , 34 . 50 side ) . However, topside cooling can allow additional heat
In an exemplary embodiment, the second component 52 removal paths and is something that the conventional
includes an end wall 48 , a side wall 53, a top wall 54 , and approaches have not adequately accomplished .
a plate component 67. The end wall 48 comprises a pair of The embodiments herein allow for both top and backside
cut -out regions 64 , 66 , which are dimensioned and config - cooling with the heat sink directly in contact with the chip .
ured to accommodate the external electrical contacts 44 , 46 55 FIGS. 3D and 3E illustrate the locations of the fluidic inlet
of the middle conductive layer 38 and negative bus 36 , hole 61 and outlet hole 63. FIG . 4 , with reference to FIGS.
respectively . The side wall 53 comprises a substantially 2A through 3E , shows the general path of the fluid through
similar length and height as the wall component 59 of the the power module 40 . The fluid , which is a dielectric fluid ,
first component 51 of the housing 50 . The plate component flows over both the bottom pillars 37a , 37b and top pillars
67 comprises an inner surface 70 and an outer surface 71. A 60 370 , 37d of each device 31 / 33 , 32 /34 , respectively, cooling
first block component 49 is configured adjacent to both the each device 31/33, 32 /34 as the fluid passes. Alternatively,
top wall 54 and the inner surface 70 of the plate component the fluid may comprise passive air cooling, forced air
67. A second block component 69 is configured adjacent to convection , active liquid cooling , and /or boiling liquids
the inner surface 70 of the plate component 67 and is further depending on the application requirements . Still alterna
configured to be aligned with the first block component 49 , 65 tively , rather than a fluid , the cooling system may include
yet spaced apart from the first block component 49. The solid to liquid phase change materials. The cooling path is
plate component 67 is further configured with a pair of not limited to just this configuration and varying cooling
 US 10 , 178,813 B2
paths could be used in accordance with the embodiments While the embodiments herein are described with respect
herein . The initially cool fluid heats up as it progresses along to power module technology , power modules are numerous
the path denoted by the block arrows in FIG . 4 . and are used in any type of power conversion . Accordingly,
The description above refers to a single half-bridge layout the embodiments herein could be used in various types of
30 with two diodes 31 , 32 and two switching devices 33 , 34 . 5 diverse applications including hybrid and electric vehicles ,
However, the embodiments herein can easily be expanded to UAVs, renewable energy systems ( solar, wind , etc .), gen
accommodate any number of diodes , capacitors, switching erators , aerospace , oil drilling , geothermal, etc. The embodi
devices , and other heat-producing electronic devices .
Accordingly, while the half-bridge layout 30 is used because ments herein could also be used in lower powered systems
including cell phone , electronics chargers , computers, etc .
it is the building block for many power electronic converters 10 The T cooling requirements would be much less but the
such as inverters and DC -DC converters , this structure 30
can be easily expanded to build any number of full power low stress inherent incanthestillconfigurations
packaging approach be used . Moreover , due to the
provided by the
modules and is both modular and scalable . embodiments herein , chips made out of different materials
For example, FIGS. 5A through 5F, with reference to
FIGS. 2A through 4 , show how how toto expand
expand the
the configuration
configuration 1515 are
are also easily integrated .
by combining multiple modules 40a ,406 , 40c together in an The foregoing description of the specific embodiments
expanded module 140 with a single positive bus 35a and will so fully reveal the general nature of the embodiments
single negative bus 36a . FIG . 5A shows how the modules herein that others can , by applying current knowledge ,
40 . 40 . 40c are electrically connected . The positive bus readily modify and/ or adapt for various applications such
35amay be configured as a busbar comprising a base portion 20 specific embodiments without departing from the generic
41a and a plurality of external electrical contacts 42a , 42b concept, and , therefore , such adaptations and modifications
extending from the base portion 41a . The negative bus 36a should and are intended to be comprehended within the
may also be configured as a busbar comprising a base meaning and range of equivalents of the disclosed embodi
portion 45a and a plurality of external electrical contact 46a, ments . It is to be understood that the phraseology or termi
46b extending from the base portion 45a. The middle 25 nology employed herein is for the purpose ofdescription and
conductive layers 38a , 386 , 38c each comprise a base not of limitation . Therefore , while the embodiments herein
portion 43a , 435 , 43c , respectively, and an external electrical have been described in terms of preferred embodiments ,
contact 44a , 44b , 44c extending from the base portion 43a , those skilled in the art will recognize that the embodiments
43b , 43 , respectively . herein can be practiced with modification within the spirit
FIG . 5B illustrates the housing 150, which is configured 30 and scope of the appended claims.
with multiple components 151 , 161, 171, 181, 191, being
placed around the expanded module 140 . Component 151 What is claimed is :
comprises an upper wall 152 from which a plurality of 1 . A power module comprises :
prongs 153 , 154 , 155 extend therefrom . A gap 156 , 157 a stack of power electronic components arranged in
provides a separation between the prongs 153, 154 , 155 . 35 layers ;
Component 161 comprises a base portion 163 that provides an electrically conductive material separating each layer
a seat for the expanded module 140 . Component 161 further from one another;
includes a side wall 164 extending from said base portion a heat sink operatively connected to multiple sides of each
163, wherein the side wall 164 comprises a plurality of power electronic component in said stack ; and
electrical contacts 7 extending therefrom . Additionally , the 40 a cooling path integrated with each layer in said stack ,
base portion 163 comprises a pair of cut- out regions 165a , wherein said cooling path accommodates a cooling fluid
165b , which are dimensioned and configured to accommo or a solid to liquid phase change material.
date the plurality of external electrical contacts 42a , 42b of 2 . The power module of claim 1 , wherein the power
the positive bus 35a once the expanded module 140 is seated electronic components comprise a plurality of diodes.
in the base portion 163 of component 161. 45 3 . The power module of claim 1 , wherein the power
Components 171, 181 each comprise wall members 172 , electronic components comprise a plurality of switching
182, respectively comprising a plurality of electrical con - devices.
tacts 8 , 9 extending therefrom , respectively . Component 191 4 . The power module of claim 3 , further comprising a
comprises a pair of walls 192 , 193 configured transverse to housing unit that houses said power module , wherein said
one another, and a plate component 194 connected to the 50 housing unit comprises a plurality of electrical contacts that
pair of walls 192 , 193 . As shown in FIG . 5C , the plate operatively connect to said plurality of switching devices .
component 194 comprises a pair of flanges 195 , 196 com - 5 . The power module of claim 1 , further comprising
prising a plurality of holes 200 used to accommodate screws electrically conductive layers positioned on opposite ends of
(not shown ), as well as a fluidic inlet holes 198 and outlet said stack , wherein said electrically conductive layers com
holes 199 such the inlet holes 198 and outlet holes 199 are 55 prise a first end electrically conductive layer and a second
configured in a substantially central area 197 of the plate end electrically conductive layer.
component 194. FIGS . 5D through 5F further illustrate the 6 . The power module of claim 5 , wherein said first end
fully configured housing 150 containing the module 140 . electrically conductive layer and said second end electrically
The powermodules 40, 140 provided by the embodiments conductive layer comprise copper.
herein significantly reduce the size ( 16x smaller ), weight 60 7 . The power module of claim 5 , wherein said first side
( 8 .6 % reduction ), and cost for power electronic thermal faces towards said first end electrically conductive layer,
management compared with some conventional power mod wherein said second side faces towards said second end
uleswhile improving reliability and performance. Moreover, electrically conductive layer, and wherein the first end and
the reduction in inductance provided by the embodiments second electrically conductive layers comprise busbars .
herein reduces the system size by no longer requiring a 65 8 . The power module of claim 1 , wherein said each power
snubber and/ or reducing the amount of passive components electronic component comprises a first side and an oppo
in the system . sitely positioned second side.
 US 10 , 178 ,813 B2
10
9 . The power module of claim 8 , wherein said heat sink a plurality of heat sink components operatively connected
comprises at least one pillar structure extending from each to multiple sides of each power electronic component;
of said first side and said second side of said each power a plurality of electrically conductive layers contacting
electronic component. said plurality of heat sink components , wherein a
10 . The power module of claim 1, further comprising a 5 power die layer and an electrically conductive layer
housing unit that houses said power module. sequentially alternate to form a stacked structure such
11 . The power module of claim 10 , wherein said housing that both ends of said stacked structure comprises an
unit comprises a plurality of holes aligned with said cooling end electrically conductive layer;
path to create an inlet and outlet for the cooling fluid or the a cooling path integrated with each layer in said stacked
solid to liquid phase change material to traverse along said 10 structure ; and
cooling path . a housing unit that houses said stacked structure,
12 . The power module of claim 1, wherein said electri wherein said housing unit comprises a plurality of holes
cally conductive material is configured as a structured layer aligned with said cooling path to create an inlet and
comprising a base portion and an external electrical contact outlet for a cooling fluid to traverse along said cooling
extending from said base portion . 15 path .
13 . The power module of claim 1 , further comprising 17 . The power module of claim 16 , wherein said power
multiple power modules adjacent to one another. electronic components comprise heat-producing electronic
14 . The power module of claim 1 , wherein said stack ofof devices .
power electronic components arranged in layers comprises a 18 . The power module of claim 16 , wherein said cooling
half-bridge configuration . 20 path accommodates a cooling fluid or a solid to liquid phase
15 . The power module of claim 1 wherein said cooling change material.
C 19 . The
fluid or said solid to liquid phase change material comes into power module of claim 18 , wherein said fluid
direct contact with said power electronic components . comes into direct contact with said plurality of power die
16 . A power module comprising: layers, said plurality of heat sink components, and said
a plurality of power die layers comprising power elec - 25 plurality of electrically conductive layers .
tronic components ; * * *