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STTH 512

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0% found this document useful (0 votes)
47 views13 pages

STTH 512

Uploaded by

Eugene Bright
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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STTH512

Ultrafast recovery - 1200 V diode

Datasheet - production data

Description
$ . The high quality design of this diode has
produced a device with low leakage current,
regularly reproducible characteristics and intrinsic
. ruggedness. These characteristics make it ideal
for heavy duty applications that demand long term
reliability.
Such demanding applications include industrial
$ power supplies, motor control, and similar
$ . mission-critical systems that require rectification
72$& .
and freewheeling. These diodes also fit into
72)3$&
auxiliary functions such as snubber, bootstrap,
and demagnetization applications.
.
. The improved performance in low leakage
current, and therefore thermal runaway guard
1& band, is an immediate competitive advantage for
1& this device.
$
$
Table 1. Device summary
'3$.
Symbol Value

IF(AV) 5A
Features VRRM 1200 V
 Ultrafast, soft recovery Tj(max) 175 °C
 Very low conduction and switching losses VF (typ) 1.25 V
 High frequency and/or high pulsed current
trr (typ) 48 ns
operation
 High reverse voltage capability
 High junction temperature
 ECOPACK®2 compliant component for DPAK
on demand
 Insulated package: TO-220FPAC
– Insulated voltage: 2000 VRMS sine

February 2016 DocID12154 Rev 3 1/13


This is information on a product in full production. www.st.com
Characteristics STTH512

1 Characteristics

Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise stated)


Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 1200 V


TO-220AC / TO-220FPAC 30
IF(RMS) RMS forward current A
DPAK 10

Average forward current, δ = 0.5, square TO-220AC / DPAK Tc = 145° C


IF(AV) 5 A
wave TO-220FPAC Tc = 105° C
IFRM Repetitive peak forward current tp = 5 µs, F = 5 kHz square 60 A
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 55 A
Tstg Storage temperature range -65 to + 175 °C
Tj Maximum operating junction temperature 175 °C

Table 3. Thermal resistance


Symbol Parameter Value Unit

TO-220AC / DPAK 2.5


Rth(j-c) Junction to case °C/W
TO-220FPAC 5.8

Table 4. Static electrical characteristics


Symbol Parameter Test conditions Min. Typ. Max. Unit

Tj = 25° C 5
IR(1) Reverse leakage current VR = VRRM µA
Tj = 125° C 3 30
Tj = 25° C 2.20
VF (2)
Forward voltage drop Tj = 125° C IF = 5 A 1.30 2.00 V
Tj = 150° C 1.25 1.90
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%

To evaluate the conduction losses use the following equation:


P = 1.5 x IF(AV) + 0.08 IF2(RMS)

2/13 DocID12154 Rev 3


STTH512 Characteristics

Table 5. Dynamic characteristics


Symbol Parameter Test conditions Min. Typ. Max. Unit

IF = 1 A, dIF/dt = -50 A/µs,


95
VR = 30 V, Tj = 25 °C
trr Reverse recovery time ns
IF = 1 A, dIF/dt = -100 A/µs,
48 70
VR = 30 V, Tj = 25 °C
IF = 5 A, dIF/dt = -200 A/µs,
IRM Reverse recovery current 11 16 A
VR = 600 V, Tj = 125 °C
IF = 5 A, dIF/dt = -200 A/µs,
S Softness factor 2
VR = 600 V, Tj = 125 °C
IF = 5 A dIF/dt = 50 A/µs
tfr Forward recovery time 400 ns
VFR = 1.5 x VFmax, Tj = 25 °C
IF = 5 A, dIF/dt = 50 A/µs,
VFP Forward recovery voltage 9.5 V
Tj = 25 °C

Figure 1. Conduction losses versus average Figure 2. Forward voltage drop versus forward
current current
P(W) IFM(A)
13 50
δ = 0.1 δ = 0.2 δ = 0.5 δ=1
12
45
11 δ = 0.05 Tj=150°C
40 (typical values)
10
9 35
8 30
7
25 Tj=25°C
6 (maximum values)

5 20 Tj=150°C
(maximum values)
4 15
3 T
10
2
5
1 IF(AV)(A) VFM(V)
δ =tp/T tp
0 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Figure 3. Relative variation of thermal Figure 4. Relative variation of thermal


impedance junction to case versus pulse impedance junction to case versus pulse
duration duration
Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c)
1.0 1.0
Single pulse Single pulse
0.9 TO-220AC 0.9 TO-220FPAC
DPAK
0.8 0.8

0.7 0.7

0.6 0.6

0.5 0.5

0.4 0.4

0.3 0.3

0.2 0.2

0.1 0.1 tp(s)


tp(s)
0.0 0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

DocID12154 Rev 3 3/13


13
Characteristics STTH512

Figure 5. Peak reverse recovery current versus Figure 6. Reverse recovery time versus dIF/dt
dIF/dt (typical values) (typical values)

IRM(A) trr(ns)
28 600
VR=600V
26 VR=600V 550 Tj=125°C
Tj=125°C
24 500
22 IF=2 x IF(AV)
450
20
400
18 IF=IF(AV)
16 350 IF=2 x IF(AV)
IF=0.5 x IF(AV)
14 300 IF=IF(AV) IF=0.5 x IF(AV)
12 250
10
200
8
150
6
4 100
2 dIF/dt(A/µs) 50
dIF/dt(A/µs)
0 0
0 100 200 300 400 500 0 100 200 300 400 500

Figure 7. Reverse recovery charges versus Figure 8. Softness factor versus dIF/dt (typical
dIF/dt (typical values) values)

Qrr(nC) S factor
2000 4.0
VR=600V IF ≤ 2xIF(AV)
1800 Tj=125°C VR=600V
3.5 Tj=125°C
1600 IF=2 x IF(AV)

1400 3.0

1200
IF=IF(AV) 2.5
1000
IF=0.5 x IF(AV)
2.0
800

600 1.5

400
1.0
200
dIF/dt(A/µs) dIF/dt(A/µs)
0 0.5
0 100 200 300 400 500 0 100 200 300 400 500

Figure 9. Relative variations of dynamic Figure 10. Transient peak forward voltage
parameters versus junction temperature versus dIF/dt (typical values)

VFP(V)
2.25 50
IF=IF(AV)
VR=600V IF=IF(AV)
2.00 Reference: Tj=125°C 45 Tj=125°C

1.75 40
S factor

1.50 35

1.25 30

1.00 25
trr 20
0.75
IRM
15
0.50
QRR 10
0.25
Tj(°C)
5
0.00 dIF/dt(A/µs)
25 50 75 100 125 0
0 50 100 150 200 250 300

4/13 DocID12154 Rev 3


STTH512 Characteristics

Figure 11. Forward recovery time versus Figure 12. Junction capacitance versus reverse
dIF/dt (typical values) voltage applied (typical values)

tfr(ns) C(pF)
700 100
IF=IF(AV) F=1MHz
VFR=1.5 x VF max. VOSC=30mVRMS
Tj=125°C Tj=25°C
600

500

10

400

300

dIF/dt(A/µs) VR(V)
200 1
0 50 100 150 200 250 300 350 400 450 500 1 10 100 1000

Figure 13. Thermal resistance junction to ambient versus copper surface under tab
5WK MD ƒ&: 

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 6
&8
FPð

        

DocID12154 Rev 3 5/13


13
Package information STTH512

2 Package information

 Epoxy meets UL94, V0


 Cooling method: by conduction (C)
 Recommended torque values: 0.55 N·m for TO-220AC and TO-220FPAC
 Maximum torque value: 0.7 N·m for TO-220AC and TO-220FPAC
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

2.1 TO-220AC package information


Figure 14. TO-220AC package outline

H2 A

ØI C

L5
L7

L6

L2

F1 L9 D

L4
F

M
E

6/13 DocID12154 Rev 3


STTH512 Package information

Table 6. TO-220AC package mechanical data


Dimensions

Ref. Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 4.40 4.60 0.173 0.181


C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4 13.00 14.00 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.60 typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151

DocID12154 Rev 3 7/13


13
Package information STTH512

2.2 TO-220FPAC package information


Figure 15. TO-220FPAC package outline

A
H B

Dia

L6

L2 L7

L3

D
F1
L4

F E
G1

8/13 DocID12154 Rev 3


STTH512 Package information

Table 7. TO-220FPAC package mechanical data


Dimensions

Ref. Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 4.40 4.60 0.173 0.181


B 2.50 2.70 0.098 0.106
D 2.50 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
F 0.75 1.00 0.030 0.039
F1 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.40 2.70 0.094 0.106
H 10.00 10.40 0.393 0.409
L2 16.00 Typ. 0.630 Typ.
L3 28.60 30.60 1.126 1.205
L4 9.80 10.60 0.386 0.417
L6 15.90 16.40 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126

DocID12154 Rev 3 9/13


13
Package information STTH512

2.3 DPAK package information


Figure 16. DPAK package outline

(
$
E
F 7KHUPDOSDG

/ (

'
'
+ 5

/

$
H E 5
H F

$
/
/
9
*DXJH
 SODQH

Note: This package drawing may slightly differ from the physical package. However, all the
specified dimensions are guaranteed.

10/13 DocID12154 Rev 3


STTH512 Package information

Table 8. DPAK package mechanical data


Dimensions

Ref. Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 2.18 2.40 0.085 0.094


A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
b 0.64 0.90 0.025 0.035
b4 4.95 5.46 0.194 0.214
c 0.46 0.61 0.018 0.024
c2 0.46 0.60 0.018 0.023
D 5.97 6.22 0.235 0.244
D1 4.95 5.60 0.194 0.220
E 6.35 6.73 0.250 0.264
E1 4.32 5.50 0.170 0.216
e 2.28 0.090
e1 4.40 4.70 0.173 0.185
H 9.35 10.40 0.368 0.409
L 1.00 1.78 0.039 0.070
L2 1.27 0.050
L4 0.60 1.02 0.023 0.040
V2 -8° +8° -8° 8°

Figure 17. Footprint (dimensions in mm)

  

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7KHGHYLFHPXVWEHSRVLWLRQHGZLWKLQ  $ %

DocID12154 Rev 3 11/13


13
Ordering information STTH512

3 Ordering information

Table 9. Ordering information


Order code Marking Package Weight Base qty Delivery mode

STTH512D STTH512D TO-220AC 1.86 g 50 Tube


STTH512FP STTH512FP TO-220FPAC 1.9 g 50 Tube
STTH512B-TR STTH512B DPAK 0.32 g 2500 Tape and reel

4 Revision history

Table 10. Document revision history


Date Revision Changes

02-Mar-2006 1 First issue.


Updated DPAK package information and reformatted to current
26-Nov-2014 2
standard.
Updated DPAK package information and reformatted to current
24-Feb-2016 3
standard.

12/13 DocID12154 Rev 3


STTH512

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2016 STMicroelectronics – All rights reserved

DocID12154 Rev 3 13/13


13

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