NOT RECOMMENDED FOR NEW DESIGN

USE AP22811 AP22802

SINGLE CHANNEL POWER DISTRIBUTION LOAD SWITCH

Description Pin Assignments

The AP22802 is a single channel current-limited integrated high-side
power switch optimized for Universal Serial Bus (USB) and other Top View
hot-swap applications. The family of devices complies with
USB standards and is available with both polarities of Enable input. OUT 1 5 IN
ADVANCED INFORMATION

The device has fast short-circuit response time for improved overall
system robustness, and has an integrated output discharge function GND 2
to ensure completely controlled discharging of the output voltage
capacitor. They provide a complete protection solution for applications FLG 3 4 EN
subject to heavy capacitive loads and the prospect of short circuit,
and offer reverse current blocking, over-current, over-temperature
SOT25
and short-circuit protection, as well as controlled rise time and
under-voltage lockout functionality. A 6ms deglitch capability on the
open-drain Flag output prevents false over-current reporting and does Applications
not require any external components.
 Integrated Load Switches in Ultrabook PC’s
The AP22802 is available in a standard Green SOT25 and RoHS  Power Up/Down Sequencing in Ultrabook PC’s
compliant.  Notebook
 Netbook
 Set-Top Boxes
Features  SSD (Solid State Drives)
 Integrated Single Channel Load Switch  Consumer Electronics
 Protection  Tablet PC
 Over Current with Auto Recovery  Telecom Systems
 Short Circuit with Auto Recovery
 Over Temperature with Auto Recovery
 Small Form Factor Packages
SOT25 – Footprint of just 9mm2
 Thermally Efficient Low Profile Package
 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
 Halogen and Antimony Free. “Green” Device (Note 3)
 UL Recognized, File Number E322375
 IEC60950-1 CB Scheme Certified

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

Typical Applications Circuit

Enable Active High
Power Supply IN OUT Load
2.7V to 5.5V

10k 1μF 0.1μF

120μF

FLG

EN GND
ON

OFF

AP22802 1 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Pin Descriptions
Pin Number Pin Name Function

1 OUT Voltage Output Pin

2 GND Ground Pin of the Circuitry

Over Current and Over temperature fault report;
3 FLG
ADVANCED INFORMATION

Open-Drain flag is active low when triggered.

Enable Input

4 EN AP22802A: Active High

AP22802B: Active Low

5 IN Voltage Input Pin

Functional Block Diagram

Current
IN Sense OUT

UVLO Discharge
Control
Current
EN Driver
Limit
FLG

Deglitch
Thermal
Sense

GND

Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.) (Note 4)

Symbol Parameter Ratings Unit
ESD HBM Human Body ESD Protection 2000 V
ESD MM Machine Model ESD Protection 200 V
VIN Input Voltage -0.3 to 5.7 V
VOUT Output Voltage -0.3 to (VIN +0.3) V
VEN Enable Voltage -0.3 to (VIN +0.3) V
IL Load Current Internal Limited A
TJ(max) Maximum Junction Temperature +150 °C
TST Storage Temperature -65 to +150 °C
RθJA Thermal Resistance, Junction to Ambient SOT25 (Note 5) 180 °C/W
RθJC Thermal Resistance, Junction to Case SOT25 (Note 5) 50 °C/W
Notes: 4. Stresses greater than the 'Absolute Maximum Ratings' specified above can cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability can be
affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Test condition for SOT25: Device mounted on 1”1” FR-4 substrate PC board, 2oz copper with minimum recommended pad layout.

AP22802 2 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Recommended Operating Conditions (Note 6)

Symbol Parameter Min Max Unit
VIN Input Voltage 2.7 5.5 V
IOUT Output Current 0 2 A
VIL EN Input Logic Low Voltage 0 0.5 V
VIH EN Input Logic High Voltage 1.5 VIN V
ADVANCED INFORMATION

TA Operating Ambient Temperature -40 +85 C

Electrical Characteristics (VIN = 5V @ TA = +25°C, CIN = 1µF, CL = 100nF, unless otherwise specified.)

Symbol Parameter Test Conditions Min Typ Max Unit

VUVLO Input UVLO VIN Rising 1.6 2.0 2.4 V
∆VUVLO Input UVLO Hysteresis VIN Decreasing — 75 — mV
ISHDN Input Shutdown Current Disabled, OUT = Open — 0.1 1 µA
IQ Input Quiescent Current Enabled, OUT = Open — 50 — µA
ILEAK Input Leakage Current Disabled, OUT Grounded — 0.1 1 µA
IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN — 0.01 1 µA
VIN = 5V, IOUT = 2.0A TA = +25°C — 50 —
RDS(ON) Switch On-Resistance mΩ
VIN = 3.3V, IOUT = 2.0A TA = +25°C — 60 —
ILIMIT Over Load Current Limit VIN = 5V, VOUT = 4.5V 2.2 2.7 3.2 A
ISHORT Short-Circuit Current Limit Enabled into Short Circuit — 1.1 — A
tSHORT Short-Circuit Response Time VIN = 5V, No Load Figure 1 — 0.7 — µs
VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V — — 0.5 V
VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 1.5 — — V
ILEAK-EN EN Input Leakage VIN = 5V, VEN = 0V and 5.5V — 0.01 1 µA
ILEAK-O Output Leakage Current Disabled, VOUT = 0V — 0.5 1 µA
tD(ON) Output Turn-On Delay Time CL = 4.7µF, RLOAD = 10Ω @ VIN = 3.3V Figure 2 — 1.7 — ms
tR Output Turn-On Rise Time CL = 4.7µF, RLOAD = 10Ω @ VIN = 3.3V Figure 2 1.0 2.1 3.5 ms
tD(OFF) Output Turn-Off Delay Time CL = 4.7µF, RLOAD = 10Ω @ VIN = 3.3V Figure 2 — 0.2 — ms
tF Output Turn-Off Fall Time CL = 4.7µF, RLOAD = 100Ω @ VIN = 3.3V Figure 2 — 0.65 — ms
RFLG FLG output FET On-Resistance IFLG = 10mA — 40 60 Ω
IFOH FLG Off Current VFLG = 5V — 0.01 1 µA
Assertion or deassertion due to overcurrent and
tBlank FLG Blanking Time 2 6 13 ms
over-temperature condition
tDIS Discharge Time CL = 1µF, VIN = 5V, Disabled to VOUT < 0.5V — 0.4 — ms
RDIS Discharge Resistance VIN = 5V, Disabled, IOUT = 1mA — 90 — Ω
TSHDN Thermal Shutdown Threshold Enabled — +140 — C
THYS Thermal Shutdown Hysteresis — — +60 — C
Note: 6. Refer to the typical application circuit.

AP22802 3 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Performance Characteristics
ADVANCED INFORMATION

Figure 1. Response Time to Short Circuit Waveform

VEN 50% 50% VEN

50% 50%

tD(OFF) tD(OFF)
tR tR
tF tF
tD(ON) 90% 90%
tD(ON) 90% 90%
VOUT VOUT
10% 10% 10% 10%

Figure 2. Voltage Waveforms: AP22802B (Active Low, left), AP22802A (Active High, right)

AP22802 4 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Performance Characteristics (continued) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Turn on Delay and Rise Time Turn Off Delay and Fall Time
VIN=3.3V
VIN=3.3V VOUT RLOAD=10Ω
VOUT RLOAD=10Ω 2V/div CL=4.7μF
2V/div CL=4.7μF
ADVANCED INFORMATION

EN
5V/div

EN
5V/div IIN
200mA/div

IIN
200mA/div

1ms/div 400μs/div

Turn-On Delay and Rise Time Turn-Off Delay and Fall Time
VIN=5V
RLOAD=2.5Ω
VOUT VIN=5V VOUT CL=120μF
5V/div RLOAD=2.5Ω 5V/div
CL=120μF
EN
5V/div
EN
5V/div

IIN IIN
2A/div 2A/div
1ms/div 400μs/div

Device Enabled Into Short-Circuit Inrush Current

Active Low VIN=5V
VIN=5V RLOAD=2.5Ω
OUT grounded

EN EN
5V/div 5V/div

CL=470μF
CL=220μF
IOUT IIN CL=120μF
1A/div 1A/div
CL=1μF
1ms/div
1ms/div

AP22802 5 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Performance Characteristics (continued) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Full-Load to Short-Circuit Short-Circuit to Full-Load
Transient Response Recovery Response
VIN=5V
VOUT Output short RLOAD=2.5Ω Output short VIN=5V
2V/div circuited CL=120μF circuit removed RLOAD=2.5Ω
ADVANCED INFORMATION

CL=120μF
VOUT
2V/div
Short circuit present and
device thermal cycles
IIN Device turns off and re-enables
2A/div into short-circuit current limit
IIN
2A/div
FLG
5V/div
FLG
2ms/div 5V/div 10ms/div

No-Load to Short-Circuit Short-Circuit to No-Load

Transient Response Recovery Response
VIN=5V
VOUT Output short No load Output short VIN=5V
2V/div circuited CL=120μF circuit removed No load
CL=120μF
VOUT
2V/div
Short circuit present and
device thermal cycles
IIN
Device enters short-circuit
2A/div
current limit
IIN
2A/div
FLG
5V/div
FLG
2ms/div 5V/div 10ms/div

Power ON Short-Circuit with Blanking Time and

Recovery
FLG
5V/div
VIN VIN=5V
5V/div No load
VIN=5V CL=120μF
RLOAD=2.5Ω
IOUT CL=120μF VOUT
1A/div 5V/div

VOUT
5V/div
IOUT
2A/div
FLG
5V/div 1ms/div 10ms/div

AP22802 6 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Performance Characteristics (continued) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
UVLO Increasing UVLO Decreasing
VIN=5V
VIN=5V VIN RLOAD=2.5Ω
RLOAD=2.5Ω 2V/div CL=120μF
CL=120μF
VIN
ADVANCED INFORMATION

2V/div

VOUT
2V/div
VOUT
2V/div

1ms/div 1ms/div

AP22802 7 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Performance Characteristics (continued) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Turn-on Time vs. Input Voltage Turn-off Time vs. Input Voltage

2100 1000
CL=4.7μF CL=4.7μF
RLOAD=10Ω RLOAD=10Ω
1800
ADVANCED INFORMATION

800
Turn-on Time (μs)

1500

Turn-off Time (μs)

600
1200

900
400

600
200
300

0 0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage (V) Input Voltage(V)

Rise Time vs. Input Voltage Fall Time vs. Input Voltage

4000 1000
CL=4.7μF
CL=4.7μF
RLOAD=100Ω
RLOAD=10Ω
3500
800
Fall Time (μs)

3000
Rise Time (μs)

600

2500
400
2000

200
1500

1000 0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage (V) Input Voltage (V)

AP22802 8 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Performance Characteristics (continued) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Supply Current vs. Temperature Supply Current vs. Temperature
(Output Enabled) (Output Disabled)

80 1.0
Supply Current Output Enabled (µA)
ADVANCED INFORMATION

Supply Current Output Disabled (µA)

VIN=5.5V
70
VIN=5.5V VIN=3.3V
60 VIN=5V 0.5
VIN=5V
50
VIN=2.7V
40 VIN=3.3V 0.0
VIN=2.7V
30

20 -0.5

10

0 -1.0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125

Temperature (℃) Temperature ( ℃)

RDS(ON) vs. Temperature Short-Circuit Output Current vs. Temperature

100 2.0

VIN=3.3V
Short-Circuit Output Current (A)

80
1.5
VIN=2.7V VIN=5V 2.7V
RDS(ON) (mΩ)

5.5V
60

1.0
40
VIN=5.5V 5V 3.3V

0.5
20

0 0.0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125

Temperature (℃) Temperature (°C)

AP22802 9 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Performance Characteristics (continued) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Under Voltage Lockout vs. Temperature Over Load Current Limit vs. Input Voltage

2.2 3.2
ADVANCED INFORMATION

2.1
3.0

Over Load Current Limit (A)

Undervoltage Lockout (V)

UVLO Rising
2.0
2.8 UVLO Rising

1.9
UVLO Falling 2.6
1.8

2.4
1.7

1.6 2.2
-50 -25 0 25 50 75 100 125 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Temperature (℃) Input Voltage (V)

AP22802 10 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Application Information
Power Supply Considerations
A 1μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value capacitor (10μF
minimum) on both input and output pins is recommended when the output transient load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01μF to 0.1μF ceramic capacitor improves the immunity
of the device to short-circuit transients.
ADVANCED INFORMATION

FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 6ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy
capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 6ms deglitch
timeout. The AP22802 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before
VIN has been applied. The AP22802 senses the short circuit and immediately clamps output current to a certain safe level.

In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current
may flow for a very short period of time before the current limit function can react. After the current limit function has tripped, the device switches
into current limiting mode and the current is clamped at ILIMIT, or ISHORT.

In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP22802 is capable of delivering current up to the
current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and
is set at ILIMIT.

Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP22802 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature
rises to approximately +140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry
turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to
cool down approximately +60°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is
removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 6ms deglitch.

ON/OFF Input Operator

The EN input allows the output current to be switched on and off using a GPIO compatible input. The high signal (switch on) should be at least
1.5V, and the low signal (switch off) no higher than 0.5V. This pin should NOT be left floating. It is advisable to hold the EN signal low when
applying or removing power.

Under-voltage Lockout (UVLO)

Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even
if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.

Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of
the output voltage when either no external output resistance or load resistance is present at the output.

AP22802 11 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Application Information (continued)

Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2

Finally, calculate the junction temperature:

ADVANCED INFORMATION

TJ = PD x RθJA + TA

Where:
TA = Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation

Ordering Information

AP22802X XX - 7

Enable Package Packing

A : Active High W5 : SOT25 7 : Tape & Reel

B : Active Low

Package 7” Tape and Reel

Part Number Packaging
Code Quantity Part Number Suffix
AP22802AW5-7 W5 SOT25 3000/Tape & Reel -7
AP22802BW5-7 W5 SOT25 3000/Tape & Reel -7

Marking Information

( Top View )
5 4
7

XX : Identification code
Y : Year 0~9
XX Y W X W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
1 2 3 X : A~Z : Green

Part Number Package Type Identification Code

AP22802AW5-7 SOT25 XA
AP22802BW5-7 SOT25 XB

AP22802 12 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT25

A
ADVANCED INFORMATION

SOT25
Dim Min Max Typ
A 0.35 0.50 0.38
B C
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D   0.95
H 2.90 3.10 3.00
H J 0.013 0.10 0.05
K 1.00 1.30 1.10
K M L 0.35 0.55 0.40
N
M 0.10 0.20 0.15
J
N 0.70 0.80 0.75
D L  0° 8° 
All Dimensions in mm

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT25

C2 C2
Dimensions Value (in mm)
Z 3.20
G 1.60
X 0.55
G C1 Y 0.80
Z
C1 2.40
C2 0.95
Y

AP22802 13 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated
 NOT RECOMMENDED FOR NEW DESIGN
USE AP22811 AP22802

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
ADVANCED INFORMATION

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2019, Diodes Incorporated

www.diodes.com

AP22802 14 of 14 August 2019

Document number: DS36218 Rev. 4 - 3 www.diodes.com © Diodes Incorporated