Vnd5050aj e
Vnd5050aj e
VND5050AK-E
Double channel high side driver with analog current sense
for automotive applications
Features
General
Max supply voltage VCC 41V
Operating voltage range VCC 4.5 to 36V PowerSSO-12 PowerSSO-24
Max On-State resistance (per ch.) RON 50 mΩ
■ Self limiting of fast thermal transients
Current limitation (typ) ILIMH 18 A
■ Protection against loss of ground and loss of
Off state supply current IS 2 µA(*)
VCC
(*) Typical value with all loads connected ■ Thermal shut down
■ Reverse battery protection (see Figure 24)
Application
■ Electrostatic discharge protection
■ All types of resistive, inductive and capacitive loads
■ Suitable as LED driver
Description
Main
The VND5050AJ-E, VND5050AK-E is a monolithic
■ Inrush current active management by power
limitation device made using STMicroelectronics VIPower
M0-5 technology. It is intended for driving resistive
■ Very low stand-by current
or inductive loads with one side connected to
■ 3.0V CMOS compatible input
ground. Active VCC pin voltage clamp protects the
■ Optimized electromagnetic emission device against low energy spikes (see ISO7637
■ Very low electromagnetic susceptibility transient compatibility table).
■ In compliance with the 2002/95/ec european
directive This device integrates an analog current sense
which delivers a current proportional to the load
Diagnostic Functions current (according to a known ratio) when
■ Proportional load current sense CS_DIS is driven low or left open.
■ High current sense precision for wide range
When CS_DIS is driven high, the CURRENT
currents
SENSE pin is in a high impedance condition.
■ Current sense disable
■ Thermal shutdown indication Output current limitation protects the device in
■ Very low current sense leakage overload condition. In case of long overload
duration, the device limits the dissipated power to
Protections safe level up to thermal shut-down intervention.
■ Undervoltage shut-down Thermal shut-down with automatic restart allows
■ Overvoltage clamp the device to recover normal operation as soon as
■ Load current limitation fault condition disappears..
Order codes
Package Part number (Tube) Part number (Tape & Reel)
PowerSSO-12 VND5050AJ-E VND5050AJTR-E
PowerSSO-24 VND5050AK-E VND5050AKTR-E
Contents
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Thermal Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 15
3.1.1 Solution 1: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1.2 Solution 2: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3 µC I/Os protection: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.1 Package Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.2 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/26
VND5050AJ-E / VND5050AK-E Block diagram and pin description
VCC UNDERVOLTAGE
CLAMP OUTPUT1
PwCLAMP 1 CURRENT
GND DRIVER 1
SENSE1
CS_DIS
Figure 2. Configuration diagram (top view) & suggested connections for unused and n.c. pins
TAB = Vcc
VCC OUTPUT2
GND OUTPUT2
GND 12 N.C. OUTPUT2
1 Vcc OUTPUT2
11 INPUT2
INPUT2 2 OUTPUT2 N.C. OUTPUT2
INPUT1 3 10 OUTPUT2 INPUT1 OUTPUT2
CURRENT SENSE1 4 9 OUTPUT1 N.C. OUTPUT1
8 CURRENT SENSE1 OUTPUT1
CURRENT SENSE2 5 OUTPUT1 N.C. OUTPUT1
CS_DIS 6 7 Vcc CURRENT SENSE2 OUTPUT1
CS_DIS. OUTPUT1
VCC OUTPUT1
TAB = VCC
PowerSSO-12 PowerSSO-24
Floating N.R. X X X X
To Ground Through 1KΩ resistor X N.R. Through 10KΩ resistor 10KΩ
N.R. = Not recommended
3/26
Electrical specifications VND5050AJ-E / VND5050AK-E
2 Electrical specifications
VCC VCC
ICSD IOUT1
OUTPUT1
CS_DIS VOUT1
VCSD
IIN1 CURRENT ISENSE1
SENSE1
INPUT1 VSENSE1
VIN1
IOUT2
IIN2 OUTPUT2
INPUT2 VOUT2
VIN2 ISENSE2
CURRENT
SENSE2
GND VSENSE2
IGND
4/26
VND5050AJ-E / VND5050AK-E Electrical specifications
5/26
Electrical specifications VND5050AJ-E / VND5050AK-E
VCC=13V 12 18 24 A
IlimH DC Short circuit current
5V<VCC<36V 24 A
Short circuit current during
IlimL VCC=13V TR<Tj<TTSD 7 A
thermal cycling
TTSD Shutdown temperature 150 175 200 °C
TR Reset temperature TRS + 1 TRS + 5 °C
TRS Thermal reset of STATUS 135 °C
THYST Thermal hysteresis (TTSD-TR) 7 °C
Turn-off output voltage
VDEMAG IOUT=2A; VIN=0; L=6mH VCC-41 VCC-46 VCC-52 V
clamp
Output voltage drop IOUT=0.1A; Tj= -40°C...+150°C
VON 25 mV
limitation (see Figure 7)
(1) To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals
must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must
limit the duration and number of activation cycles
6/26
VND5050AJ-E / VND5050AK-E Electrical specifications
IOUT=0.05A; VSENSE=0.5V;VCSD=0V;
K0 IOUT/ISENSE
Tj= -40°C...150°C 1270 2360 3450
IOUT=1A; VSENSE=0.5V;VCSD=0V;
K1 IOUT/ISENSE Tj= -40°C 1470 2020 2610
Tj= 25°C...150°C 1570 2020 2470
IOUT=2A; VSENSE=4V;VCSD=0V;
K2 IOUT/ISENSE Tj= -40°C 1740 2020 2320
Tj= 25°C...150°C 1790 2020 2250
IOUT=4A; VSENSE=4V;VCSD=0V;
K3 IOUT/ISENSE Tj=-40°C 1880 2010 2160
Tj=25°C...150°C 1900 2010 2120
IOUT=0A; VSENSE=0V;
VCSD=5V; VIN=0V; Tj=-40°C...150°C 0 1 µA
Analog sense leakage VCSD=0V; VIN=5V; Tj=-40°C...150°C 0 2 µA
ISENSE0
current
IOUT=2A; VSENSE=0V;
VCSD=5V; VIN=5V; Tj=-40°C...150°C 0 1 µA
Max analog sense
VSENSE IOUT=4A; VCSD=0V 5 V
output voltage
Analog sense output
voltage in
VSENSEH VCC=13V; RSENSE=10KΩ 9 V
overtemperature
condition
Analog sense output
current in
ISENSEH VCC=13V; VSENSE=5V 8 mA
overtemperature
condition
Delay Response time VSENSE<4V, 0.5A<Iout<4A
tDSENSE1H from falling edge of 50 100 µs
ISENSE=90% of ISENSE max (see Figure 4)
CS_DIS pin
Delay Response time VSENSE<4V, 0.5A<Iout<4A
tDSENSE1L from rising edge of 5 20 µs
ISENSE=10% of ISENSE max (see Figure 4)
CS_DIS pin
Delay Response time VSENSE<4V, 0.5A<Iout<4A
tDSENSE2H from rising edge of 80 300 µs
ISENSE=90% of ISENSE max (see Figure 4)
INPUT pin
Delay Response time VSENSE<4V, 0.5A<Iout<4A
tDSENSE2L from falling edge of 100 250 µs
ISENSE=10% of ISENSE max (see Figure 4)
INPUT pin
7/26
Electrical specifications VND5050AJ-E / VND5050AK-E
INPUT
CS_DIS
LOAD CURRENT
SENSE CURRENT
tDSENSE2H tDSENSE1L tDSENSE1H tDSENSE2L
Iout/Isense
4000
3000
max Tj=25...150ºC
2500
typical value
2000
min Tj=25...150ºC
1500
500
0
0 1 2 3 4 5
Iout (A)
8/26
VND5050AJ-E / VND5050AK-E Electrical specifications
L L 0
Normal operation
H H Nominal
L L 0
Overtemperature
H L VSENSEH
L L 0
Undervoltage
H L 0
L L 0
Short circuit to GND
H L 0 if Tj < TTSD
(Rsc ≤ 10 mΩ)
H L VSENSEH if Tj > TTSD
L H 0
Short circuit to VCC
H H < Nominal
Negative output voltage
L L 0
clamp
(1) If the VCSD is high, the SENSE output is at a high impedance, its potential depends on leakage currents
and external circuit.
VOUT
tWon tWoff
90%
80%
dVOUT/dt(on) dVOUT/dt(off)
tr 10% tf
t
INPUT
td(on) td(off)
Tj=150oC Tj=25oC
Tj=-40oC
Von
Iout
Von/Ron(T)
9/26
Electrical specifications VND5050AJ-E / VND5050AK-E
CLASS CONTENTS
C All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device are not performed as designed after exposure to disturbance
E
and cannot be returned to proper operation without replacing the device.
(1) For load dump exceeding the above value a centralized suppressor must be adopted.
10/26
VND5050AJ-E / VND5050AK-E Electrical specifications
Figure 8. Waveforms
NORMAL OPERATION
INPUT
CS_DIS
LOAD CURRENT
SENSE CURRENT
UNDERVOLTAGE
VUSDhyst
VCC VUSD
INPUT
CS_DIS
LOAD CURRENT
SENSE CURRENT
SHORT TO VCC
INPUT
CS_DIS
LOAD VOLTAGE
LOAD CURRENT
SENSE CURRENT
<Nominal <Nominal
OVERLOAD OPERATION
TTSD
Tj TR
TRS
INPUT
CS_DIS
ILIMH
ILIML
LOAD CURRENT
VSENSEH
SENSE CURRENT
11/26
Electrical specifications VND5050AJ-E / VND5050AK-E
4.5
0.875
Vin=2.1V
Off State 4
0.75 Vcc=13V
Vin=Vout=0V 3.5
0.625
3
0.5 2.5
2
0.375
1.5
0.25
1
0.125
0.5
0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)
Figure 11. Input Clamp Voltage Figure 12. Input High Level
6.8
3.5
Iin=1mA
6.6
3
6.4
2.5
6.2
6 2
5.8
1.5
5.6
1
5.4
0.5
5.2
5 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)
Figure 13. Input Low Level Figure 14. Input Hysteresis Voltage
1.8 0.9
1.6 0.8
1.4 0.7
1.2 0.6
1 0.5
0.8 0.4
0.6 0.3
0.4 0.2
0.2 0.1
0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)
12/26
VND5050AJ-E / VND5050AK-E Electrical specifications
Figure 15. On State Resistance Vs. Tcase Figure 16. On State Resistance Vs. VCC
90 90
50 50
Tc= 25°C
40 40
30 30
Tc= - 40°C
20 20
10 10
0 0
-50 -25 0 25 50 75 100 125 150 175 0 5 10 15 20 25 30 35 40
14 22.5
Vcc=13V
12 20
10 17.5
8 15
6 12.5
4 10
2 7.5
0 5
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)
Figure 19. Turn-on Voltage Slope Figure 20. Turn-off Voltage Slope
900 900
Vcc=13V Vcc=13V
800 800
RI=6.5Ohm RI=6.5Ohm
700 700
600 600
500 500
400 400
300 300
200 200
100 100
0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)
13/26
Electrical specifications VND5050AJ-E / VND5050AK-E
Figure 21. STAT_DIS Clamp Voltage Figure 22. Low Level STAT_DIS Voltage
Vsdcl(V) Vsdl(V)
8
14
7
12
6
Isd=1mA
10
5
8
4
6
3
4 2
2 1
0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)
Vsdh(V)
8
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
14/26
VND5050AJ-E / VND5050AK-E Application information
3 Application information
+5V
VCC
Rprot CS_DIS
Dld
µC Rprot INPUT
OUTPUT
Rprot
CURRENT SENSE
GND
RSENSE
RGND
CEXT VGND DGND
3.1.1 Solution 1:
Resistor in the ground line (RGND only). This can be used with any type of load.
The following is an indication on how to dimension the RGND resistor.
1. RGND ≤ 600mV / (IS(on)max).
2. RGND ≥ (−VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power Dissipation in RGND (when VCC<0: during reverse battery situations) is:
PD= (-VCC)2/RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift will vary depending on how many devices are ON in the case of several
high side drivers sharing the same RGND.
15/26
Application information VND5050AJ-E / VND5050AK-E
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).
3.1.2 Solution 2:
A diode (DGND) in the ground line.
A resistor (RGND=1kΩ) should be inserted in parallel to DGND if the device drives an
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift (≈600mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.
16/26
VND5050AJ-E / VND5050AK-E Package and PCB thermal data
Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x 86mm,
PCB thickness=1.6mm, Cu thickness=70µm (front and back side), Copper areas: from minimum pad lay-out to 8cm2).
Figure 26. Rthj-amb Vs. PCB copper area in open box free air condition
RTHj_amb(°C/W)
70
65
60
55
50
45
40
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
Footprint
100
2 cm2
8 cm2
10
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
17/26
Package and PCB thermal data VND5050AJ-E / VND5050AK-E
Thermal Parameter
Area/island (cm2) Footprint 2 8
18/26
VND5050AJ-E / VND5050AK-E Package and PCB thermal data
Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x 86mm,
PCB thickness=1.6mm, Cu thickness=70µm (front and back side), Copper areas: from minimum pad lay-out to 8cm2).
Figure 30. Rthj-amb Vs. PCB copper area in open box free air condition
RTHj_amb(°C/W)
55
50
45
40
35
30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
100 Footprint
2 cm2
8 cm2
10
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
19/26
Package and PCB thermal data VND5050AJ-E / VND5050AK-E
Thermal Parameter
Area/island (cm2) Footprint 2 8
20/26
VND5050AJ-E / VND5050AK-E Package information
5 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
A2 A
B C
SEATING
PLANE L
A1 K
ddd C
12 7
E H
BOTTOM
Y VIEW
1 6
e
21/26
Package information VND5050AJ-E / VND5050AK-E
22/26
VND5050AJ-E / VND5050AK-E Package information
B
Base Q.ty 100
C
Bulk Q.ty 2000
Tube length (± 0.5) 532
A 1.85
A
B 6.75
C (± 0.1) 0.6
REEL DIMENSIONS
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.05) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.1) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2
Start
23/26
Package information VND5050AJ-E / VND5050AK-E
Base Q.ty 49
Bulk Q.ty 1225
C
Tube length (± 0.5) 532
B
A 3.5
B 13.8
C (± 0.1) 0.6
All dimensions are in mm.
A
REEL DIMENSIONS
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 24.4
N (min) 100
T (max) 30.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 12
Hole Diameter D (± 0.05) 1.55
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.1) 11.5
Compartment Depth K (max) 2.85
Hole Spacing P1 (± 0.1) 2
End
All dimensions are in mm.
Start
24/26
VND5050AJ-E / VND5050AK-E Revision history
6 Revision history
25/26
VND5050AJ-E / VND5050AK-E
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right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
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