MC78LC00 Series

Micropower Voltage
Regulator
The MC78LC00 series of fixed output low dropout linear regulators
are designed for handheld communication equipment and portable
battery powered applications which require low quiescent current. The
MC78LC00 series features an ultra−low quiescent current of 1.1 mA. www.onsemi.com
Each device contains a voltage reference unit, an error amplifier, a
PMOS power transistor, and resistors for setting output voltage. MARKING DIAGRAMS AND
The MC78LC00 has been designed to be used with low cost ceramic PIN CONNECTIONS
capacitors and requires a minimum output capacitor of 0.1 mF. The
device is housed in the micro−miniature Thin SOT23−5 surface mount
5 GND 1 5 N/C
package and SOT−89, 3 pin. Standard voltage versions are 1.5, 1.8,

XXX AYW G
2.5, 2.7, 2.8, 3.0, 3.3, 4.0, and 5.0 V. Other voltages are available in
1 Vin 2

G
100 mV steps.
TSOP−5
NTR SUFFIX Vout 3 4 N/C
Features
CASE 483
• Low Quiescent Current of 1.1 mA Typical (Top View)
• Excellent Line and Load Regulation
XXX= Specific Device Code
• Maximum Operating Voltage of 12 V A = Assembly Location
• Low Output Voltage Option Y = Year
• High Accuracy Output Voltage of 2.5%
W = Work Week
G = Pb−Free Package
• Industrial Temperature Range of −40°C to 85°C (Note: Microdot may be in either location)
• Two Surface Mount Packages (SOT−89, 3 Pin, or SOT−23, 5 Pin)
• These are Pb−Free Devices TAB
GND 1
Typical Applications 1 XX
Vin 2 DD Tab
• Battery Powered Instruments SOT−89
H SUFFIX Vout 3
• Hand−Held Instruments CASE 1213
• Camcorders and Cameras (Top View)
(Tab is connected to Pin 2)

XX = Specific Device Code

DD = Date Code
2 3
Vin VO

ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.

Vref

1
GND

This device contains 8 active transistors.

Figure 1. Representative Block Diagram

© Semiconductor Components Industries, LLC, 2016 1 Publication Order Number:

August, 2016 − Rev. 11 MC78LC00/D
 MC78LC00 Series

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PIN FUNCTION DESCRIPTION

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Pin No. Pin Name Description

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1 GND Power supply ground

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2 Vin Positive power supply input voltage

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3 Vout Regulated Output

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4 N/C No Internal Connection

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5 N/C No Internal Connection

MAXIMUM RATINGS

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Rating Symbol Value Unit

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Input Voltage Vin 12 V

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Output Voltage
Power Dissipation and Thermal Characteristics
Case 483−01 (Thin SOT23−5) NTR Suffix
Vout −0.3 to Vin +0.3 V

Power Dissipation @ TA = 85°C PD 140 mW

Thermal Resistance, Junction−to−Ambient RqJA 280 °C/W
Case 1213 (SOT−89) H Suffix
Power Dissipation @ TA = 25°C PD 900 mW

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Thermal Resistance, Junction−to−Ambient RqJA 111 °C/W

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Operating Junction Temperature TJ +125 °C

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Operating Ambient Temperature TA −40 to +85 °C

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Storage Temperature Tstg −55 to +150 °C

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Lead Soldering Temperature @ 260°C Tsolder 10 sec
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.

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 MC78LC00 Series

ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) (Note 5)
NTR SUFFIX
Characteristic Symbol Min Typ Max Unit
Output Voltage (TA = 25°C, Iout = 1.0 mA) Vout V
1.5 V 1.455 1.5 1.545
1.8 V 1.746 1.8 1.854
2.5 V 2.425 2.5 2.575
2.7 V 2.646 2.7 2.754
2.8 V 2.744 2.8 2.856
3.0 V 2.94 3.0 3.06
3.3 V 3.234 3.3 3.366
4.0 V 3.9 4.0 4.1
5.0 V 4.90 5.0 5.10

Output Voltage (TA = −40°C to 85°C) Vout V

1.5 V 1.455 1.5 1.545
1.8 V 1.746 1.8 1.854
2.5 V 2.425 2.5 2.575
2.7 V 2.619 2.7 2.781
2.8 V 2.716 2.8 2.884
3.0 V 2.910 3.0 3.09
3.3 V 3.201 3.3 3.399
4.0 V 3.9 4.0 4.1
5.0 V 4.90 5.0 5.10

Line Regulation (Vin = VO(nom.) + 1.0 V to 12 V, Iout = 1.0 mA) Regline − 0.05 0.2 %/V
Load Regulation (Iout = 1.0 mA to 10 mA) Regload − 40 60 mV
Output Current (Note 6) Iout mA
1.5 V, 1.8 V (Vin = 4.0 V) 35 50 −
2.5 V, 2.7 V, 2.8 V, 3.0 V (Vin = 5.0 V) 50 80 −
3.3 V (Vin = 6.0 V) 50 80 −
4.0 V (Vin = 7.0 V) 80 80 −
5.0 V (Vin = 8.0 V) 80 100 −

Dropout Voltage (Iout = 1.0 mA, Measured at Vout −3.0%) Vin−Vout mV

1.5 V − 35 70
1.6 V−3.2 V − 30 60
3.3 V−3.9 V − 30 53
4.0 V−5.0 V − 30 38
Quiescent Current (Iout = 1.0 mA to IO(nom.)) IQ − 1.1 3.6 mA
Output Voltage Temperature Coefficient Tc − "100 − ppm/°C
Output Noise Voltage (f = 1.0 kHz to 100 kHz) Vn − 89 − mVrms
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
2. Latch up capability (85°C) "100 mA
3. Maximum package power dissipation limits must be observed.
TJ(max) * TA
PD +
RqJA
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
6. Output Current is measured when Vout = VO1 − 3% where VO1 = Vout at Iout = 0 mA.

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 MC78LC00 Series

ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Cin = 1.0 mF, Cout = 1.0 mF, TJ = 25°C, unless otherwise noted.) (Note 11)
HT SUFFIX
Characteristic Symbol Min Typ Max Unit
Output Voltage V
30HT1 Suffix (Vin = 5.0 V) 2.950 3.0 3.075
33HT1 Suffix (Vin = 5.0 V) 3.218 3.3 3.382

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40HT1 Suffix (Vin = 6.0 V) 3.900 4.0 4.100
50HT1 Suffix (Vin = 7.0 V) 4.875 5.0 5.125

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Line Regulation Regline − 0.05 0.2 %/V

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Vin = [VO + 1.0] V to 10 V, IO = 1.0 mA

ÁÁÁ
Load Regulation (IO = 1.0 to 10 mA) Regload mV
30HT1 Suffix (Vin = 5.0 V) − 40 60

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33HT1 Suffix (Vin = 6.0 V) − 40 60
40HT1 Suffix (Vin = 7.0 V) − 50 70

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50HT1 Suffix (Vin = 8.0 V) − 60 90

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Output Current (Note 12) IO mA
30HT1 Suffix (Vin = 5.0 V) 35 50 −

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33HT1 Suffix (Vin = 6.0 V) 35 50 −

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40HT1 Suffix (Vin = 7.0 V) 45 65 −
50HT1 Suffix (Vin = 8.0 V) 55 80 −

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Dropout Voltage Vin − VO mV

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30HT1 Suffix (IO = 1.0 mA) − 40 60
33HT1 Suffix (IO = 1.0 mA) − 35 53

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40HT1 Suffix (IO = 1.0 mA) − 25 38
50HT1 Suffix (IO = 1.0 mA) − 25 38

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Quiescent Current ICC mA

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30HT1 Suffix (Vin = 5.0 V) − 1.1 3.3
33HT1 Suffix (Vin = 5.0 V) − 1.1 3.3

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40HT1 Suffix (Vin = 6.0 V) − 1.2 3.6

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50HT1 Suffix (Vin = 7.0 V) − 1.3 3.9
Output Voltage Temperature Coefficient TC − ±100 − ppm/°C
7. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
8. Latch up capability (85°C) "100 mA
9. Maximum package power dissipation limits must be observed.
TJ(max) * TA
PD +
RqJA
10. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
12. Output Current is measured when Vout = VO1 − 3% where VO1 = Vout at Iout = 0 mA.

DEFINITIONS
Load Regulation difference between the input current (measured through the
The change in output voltage for a change in output current LDO input pin) and the output current.
at a constant temperature.
Line Regulation
Dropout Voltage The change in output voltage for a change in input voltage.
The input/output differential at which the regulator output The measurement is made under conditions of low dissipation
no longer maintains regulation against further reductions in or by using pulse technique such that the average chip
input voltage. Measured when the output drops 3% below its temperature is not significantly affected.
nominal. The junction temperature, load current, and
Line Transient Response
minimum input supply requirements affect the dropout level.
Typical over and undershoot response when input voltage is
Maximum Power Dissipation excited with a given slope.
The maximum total dissipation for which the regulator will
Maximum Package Power Dissipation
operate within its specifications.
The maximum power package dissipation is the power
Quiescent Current dissipation level at which the junction temperature reaches its
The quiescent current is the current which flows through the maximum operating value, i.e. 125°C. Depending on the
ground when the LDO operates without a load on its output: ambient power dissipation and thus the maximum available
internal IC operation, bias, etc. When the LDO becomes output current.
loaded, this term is called the Ground current. It is actually the

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 MC78LC00 Series

3.2 3.2
TA = 25°C
3.1 NTR Series
IO = 1.0 mA

VO, OUTPUT VOLTAGE (V)

VO, OUTPUT VOLTAGE (V)

3 3.0
2.9 IO = 1 mA
2.8 IO = 10 mA 2.8
2.7
IO = 5.0 mA
2.6 IO = 5 mA 2.6
2.5
2.4 2.4 MC78LC30HT1
IO = 10 mA
2.3 TA = 25°C
2.2 2.2
2.5 2.7 2.9 3.1 3.3 3.5 2.5 2.7 2.9 3.1 3.3 3.5
Vin, Input Voltage (V) Vin, Input Voltage (V)

Figure 2. Output Voltage versus Input Voltage Figure 3. Output Voltage versus Input Voltage

3.05 3.2
3 NTR Series
−40°C VO, OUTPUT VOLTAGE (V) 3.1
VO, OUTPUT VOLTAGE (V)

2.95
TA = −30°C
2.9 80°C 3.0
2.85
2.9
2.8
TA = 25°C
2.75 25°C 2.8
2.7
2.7 MC78LC30HT1
2.65 TA = 80°C

2.6 0
0 20 40 60 80 100 120 0 20 40 60 80 100 120
IO, Output Current (mA) IO, Output Current (mA)

Figure 4. Output Voltage versus Output Current Figure 5. Output Voltage versus Output Current

2 2.0
Vin −VO, DROPOUT VOLTAGE (V)

Vin −VO, DROPOUT VOLTAGE (V)

1.8 MC78LC30NTR
TA = 25°C
1.6 1.6
1.4
1.2 1.2
1
0.8
0.8
0.6
0.4 0.4 MC78LC30HT1
TA = 25°C
0.2
0 0
0 10 20 30 40 50 0 10 20 30 40 50
IO, Output Current (mA) IO, Output Current (mA)

Figure 6. Dropout Voltage versus Output Current Figure 7. Dropout Voltage versus Output Current

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 MC78LC00 Series

3.1 3.10
MC78LC30NTR Vin = 5.0 V
Vin = 4.0 V IO = 10 mA
VO, OUTPUT VOLTAGE (V)

VO, OUTPUT VOLTAGE (V)

3.06 3.06
IO = 10 mA

3.02 3.02

2.98 2.98

MC78LC30HT1
2.94 2.94

2.9 2.90
−40 −20 0 20 40 60 80 −40 −20 0 20 40 60 80

TA, Ambient Temperature (°C) TA, Ambient Temperature (°C)

Figure 8. Output Voltage versus Temperature Figure 9. Output Voltage versus Temperature

1.4 1.4
MC78LC30NTR TA = 25°C
IQ, QUIESCENT CURRENT (mA)

IQ, QUIESCENT CURRENT (mA)

1.3 TA = 25°C 1.3
IO = 0 mA
1.2 1.2

1.1 1.1

1 1.0
MC78LC30HT1
0.9 0.9

0.8 0.8
3 4 5 6 7 8 9 10 11 12 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10
Vin, Input Voltage (V) Vin, Input Voltage (V)

Figure 10. Quiescent Current versus Input Voltage Figure 11. Quiescent Current versus Input Voltage

1.75 1.2
MC78LC30NTR Vin = 5.0 V
IQ, QUIESCENT CURRENT (mA)

IQ, QUIESCENT CURRENT (mA)

1.5 Vin = 4.0 V 1.1

IO = 0 mA
1.0
1.25
0.9
1
0.8

0.75 MC78LC30HT1
0.7

0.5 0.6
−20 0 20 40 60 80 −40 −20 0 20 40 60 80
TA, Ambient Temperature (°C) TA, Ambient Temperature (°C)

Figure 12. Quiescent Current versus Temperature Figure 13. Quiescent Current versus Temperature

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 MC78LC00 Series

0.8 0.8
Vin − Vout, DROPOUT VOLTAGE (V) HT1 Series

Vin − Vout, DROPOUT VOLTAGE (V)

0.7 NTR Series 0.7
IO = 10 mA
0.6 0.6

0.5 0.5

0.4 0.4

0.3 0.3

0.2 0.2
IO = 1.0 mA
0.1 0.1

0 0
0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 1.0 2.0 3.0 4.0 5.0 6.0
VO, Set Output Voltage (V) VO, Set Output Voltage (V)

Figure 14. Dropout Voltage versus Set Output Voltage Figure 15. Dropout Voltage versus
Set Output Voltage

INPUT VOLTAGE/OUTPUT VOLTAGE (V)

Input Voltage (V)

6.0 8.0
NTR Series 7.5
5.0 Input Voltage
7.0

4.0 6.5
300
Vin = 4.5 V to 5.5 V RL = 3 k 6.0
Output Voltage
Deviation (mV)

200 Vout = 3.0 V Cout = 0.1 mF

5.5 HT1 Series Output Voltage
100
0 5.0
−100 CO = 0.1 mF
4.5 IO = 1.0 mA
−200
−300 4.0
0 0.5 1.0 1.5 2.0 2.5 0 2.0 4.0 6.0
Time (mS) t, Time (ms)

Figure 16. Line Transient Figure 17. Line Transient Response

3.5 1.5
NTR Series NTR Series
TA = 25°C TA = 25°C 50 mA
3.0
Vout, OUTPUT VOLTAGE (V)

Ig GROUND CURRENT (mA)

1.0
IO = 0 mA
2.5
0.8 200 mA
2.0
0.6 50 mA
1.5
100 mA
IO = 50 mA 0.4
1.0
100 mA
0.5
0.2 200 mA
200 mA
0 0
0 0.5 1.0 1.5 2.0 2.5 0 0.5 1.0 1.5 2.0 2.5
Vin, Input Voltage (V) Vin, Input Voltage (V)

Figure 18. Output Voltage versus Input Voltage Figure 19. Ground Current versus Input Voltage

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 MC78LC00 Series

APPLICATIONS INFORMATION

A typical application circuit for the MC78LC00 series is Thermal

shown in Figure 20. As power across the MC78LC00 increases, it might
become necessary to provide some thermal relief. The
Input Decoupling (C1) maximum power dissipation supported by the device is
A 0.1 mF capacitor either ceramic or tantalum is dependent upon board design and layout. Mounting pad
recommended and should be connected close to the configuration on the PCB, the board material, and also the
MC78LC00 package. Higher values and lower ESR will ambient temperature effect the rate of temperature rise for
improve the overall line transient response. the part. This is stating that when the MC78LC00 has good
thermal conductivity through the PCB, the junction
Output Decoupling (C2)
temperature will be relatively low with high power
The MC78LC00 is a stable component and does not
dissipation applications.
require any specific Equivalent Series Resistance (ESR) or
The maximum dissipation the package can handle is
a minimum output current. Capacitors exhibiting ESRs
given by:
ranging from a few mW up to 3.0 W can thus safely be used.
The minimum decoupling value is 0.1 mF and can be TJ(max) * TA
PD +
augmented to fulfill stringent load transient requirements. RqJA
The regulator accepts ceramic chip capacitors as well as If junction temperature is not allowed above the
tantalum devices. Larger values improve noise rejection and maximum 125°C, then the MC78LC00NTR can dissipate
load regulation transient response. up to 357 mW @ 25°C.
The power dissipated by the MC78LC00NTR can be
Hints
calculated from the following equation:
Please be sure the Vin and GND lines are sufficiently
wide. When the impedance of these lines is high, there is a Ptot + ƪVin * Ignd (Iout)ƫ ) [Vin * Vout] * Iout
chance to pick up noise or cause the regulator to or
malfunction.
P ) Vout * Iout
Set external components, especially the output capacitor, VinMAX + tot
as close as possible to the circuit, and make leads as short as Ignd ) Iout
possible. If an 80 mA output current is needed then the ground
current from the data sheet is 1.1 mA. For an
MC78LC30NTR (3.0 V), the maximum input voltage will
then be 7.4 V.

Battery or
Unregulated
Voltage +
C1

Vout +
C2

Figure 20. Basic Application Circuit for NTR Suffixes

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 MC78LC00 Series

MJD32C

0.033 mF
2 3
100 2 3 Vin MC78LC00 VO
Vin MC78LC00 VO
R1
1 C2
1 ICC
C1
0.1 mF 0.1 mF GND

R2
GND GND

Figure 21. Current Boost Circuit Figure 22. Adjustable VO

MJD32C
R2 Q1
Q2 0.033 mF

MMBT2907
ALT1 2 3
Vin MC78LC00 VO
R1

1
0.1 mF 0.1 mF

GND GND

Figure 23. Current Boost Circuit with

Overcurrent Limit Circuit

V
O
+ V
O(Reg)
ǒ1 ) R2
R1
Ǔ ) ICC R2 I
O(short circuit)
[
V
BE2 )
V
BE1
) V
BE2
R2 R1

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9
 MC78LC00 Series

ORDERING INFORMATION
Nominal
Device Output Voltage Marking Package Shipping†
MC78LC15NTRG 1.5 LAG
MC78LC18NTRG 1.8 LAH
MC78LC25NTRG 2.5 LAI
MC78LC27NTRG 2.7 LAJ
MC78LC28NTRG 2.8 LAK Thin SOT23−5
3000 Units/7″ Tape & Reel
(Pb−Free)
MC78LC30NTRG 3.0 LAL
MC78LC33NTRG 3.3 LAM
MC78LC40NTRG 4.0 LEC
MC78LC50NTRG 5.0 LAN
MC78LC30HT1G 3.0 0C
MC78LC33HT1G 3.3 3C SOT−89
1000 Units Tape & Reel
MC78LC40HT1G 4.0 0D (Pb−Free)

MC78LC50HT1G 5.0 0E
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.

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10
 MC78LC00 Series

PACKAGE DIMENSIONS

TSOP−5 (SOT23−5)
NTR SUFFIX
CASE 483
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
NOTE 5 D 5X Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
2X 0.10 T 0.20 C A B 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
M 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
5 4 FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
2X 0.20 T B S FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
1 2 3 EXCEED 0.15 PER SIDE. DIMENSION A.
K 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
B TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
G DETAIL Z
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
A A
MILLIMETERS
TOP VIEW DIM MIN MAX
A 2.85 3.15
B 1.35 1.65
DETAIL Z C 0.90 1.10
J D 0.25 0.50
G 0.95 BSC
C
H 0.01 0.10
0.05 J 0.10 0.26
H SEATING K 0.20 0.60
C PLANE
END VIEW M 0_ 10 _
SIDE VIEW S 2.50 3.00

SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037

2.4
0.094

1.0
0.039

0.7
0.028 SCALE 10:1 ǒinches
mm Ǔ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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11
 MC78LC00 Series

PACKAGE DIMENSIONS

SOT−89
H SUFFIX
CASE 1213−02
ISSUE C

NOTES:
−A− C 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
F J 2. CONTROLLING DIMENSION: MILLIMETERS
3. 1213-01 OBSOLETE, NEW STANDARD 1213-02.

MILLIMETERS INCHES
DIM MIN MAX MIN MAX
L −B− A 4.40 4.60 0.173 0.181
B 2.40 2.60 0.094 0.102
C 1.40 1.60 0.055 0.063
K D 0.37 0.57 0.015 0.022
E 0.32 0.52 0.013 0.020
D F 1.50 1.83 0.059 0.072
SEATING
0.10 M T B S A S −T− PLANE G 1.50 BSC 0.059 BSC
H 3.00 BSC 0.118 BSC
J 0.30 0.50 0.012 0.020
E 2 PL K 0.80 --- 0.031 ---
G 0.10 M T B S A S L --- 4.25 --- 0.167

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