PowerEdge Servers

Accelerate Transformation Anywhere

 The Next Generation PowerEdge Server Portfolio
Purpose-built to address evolving customer needs

AI /ML Edge CSP

XR8000
XR5610
XE9640 HS5620 HS5610
XE9680 XE8640

XR7620 XR4000

Core

R760 R6625
R7625 R760xs
R760xd2 R86
0

R760xa
R7615 C6620

R660 R6615 R660xs MX760 R96 T560

0
 Accelerate AI Outcomes

PowerEdge XE9680 PowerEdge XE9640 PowerEdge XE8640

POWERED BY 4TH GENERATION INTEL XEON SCALABLE PROCESSORS

No-compromise Accelerated AI Dense Acceleration Superior Performance

• 8x NVIDIA H100 SXM5 700W 80GB NVLink GPUs or • 4x Intel Data Center Max Series GPU with • 4x NVIDIA H100 SXM5 700W
GPU-GPU connectivity 80GB NVLink GPUs
• 8x NVIDIA A100 SXM4 500W 80GB NVLink GPUs
• Dell Smart Cooled DLC GPUs • Full NVLINK interconnectivity
• Full NVLINK interconnectivity
• 1:1 GPU-I/O enables faster data operations • GPU Direct Storage for fast data intake
• Air cooled operation (up to 35C)
 Accelerate at the Edge

Powerful inside and out Expanded portfolio Energy flexibility

• 1-socket, 2-socket, and • Compatible with Dell Edge • 110-240V AC power
multi-node available /Telco Solutions • -48V DC power
• -5C to 55C operating temps • New multi-node • Redundant PSUs
• GPU support design XR4000 & XR8000

Expand your compute outside the datacenter

XR7620 XR5610 XR4000 XR8000

2S/2U 1S/1U Multi-Node Multi-Node

Xeon D Xeon SP
 Accelerate at Scale

Purpose-built Expanded Optimized for

for CSPs portfolio open ecosystem
• Rapidly scale SaaS, PaaS, and • Dell Open Server Manager
IaaS infrastructures Available exclusively through built on OpenBMC™
the Hyperscale Next program
• Technology optimization without • Designed, tested, and
the financial and operational validated on select Dell
burden of supporting extreme PowerEdge cloud scale
configurations servers
HS5610 HS5620
• Speed time to market with early • Save time with a selection of
access to units for workload validated vendor firmware
validation COMMs cards and SSDs

Scale your architecture at your pace with Purpose-built solutions

 Core

PowerEdge R760 PowerEdge R660 PowerEdge R760xa

POWERED BY 4TH GENERATION INTEL XEON SCALABLE PROCESSORS

PowerEdge R960 PowerEdge R860

 Core Scale Out

PowerEdge R760xs PowerEdge R660xs PowerEdge C6620

POWERED BY 4TH GENERATION INTEL XEON SCALABLE PROCESSORS

Thoughtfully crafted Easily configured A breeze to cool

• To fit your current infrastructure and • Includes a variety of components • Equipped with patented Multi-
deliver the right performance to that are interchangeable to suit Vector air cooling saving on liquid
support demanding enterprise your needs cooling options
applications
 The Next Generation PowerEdge Server Portfolio
Purpose-built to address evolving customer needs

Core Edge

Acceleration-Optimized
Mainstream .

Mainstream 4 Socket XR8000

XE9640
XE9680 R760
R760xa

R960
R660 XR5610 XR7620
XE8640

Modular
R860
Storage Dense
R7625 XR4000

R760xd2

MX760 R6625 T560 Scale

Mainstream Optimized Cloud Service Providers

R7615

C6620 R760xs R660xs

HS5620 HS5610
R6615
.Next PowerEdge
Reimagine IT Possibilities…
What’s new with our R660/R760 portfolio?

Workloads Data center standardization High density virtualization Online transaction processing
Database analytics Virtual desktop infrastructure In-memory database

Provides performance and versatility as needed to

R660 : 1U/2S
address your most demanding applications

Denser 2 socket
Max Performance Air cooled at peak Gain agility
Extract value faster performance Can be deployed for
from collected data Take advantage of maximum scalability
with high- configurations with in vSAN (HCI)
R760: 2U/2S performance high performance environments or for
processors, GPUs, CPUs in an air- maximum application
Maximum configuration flexibility next-generation cooled chassis performance in bare
storage for metal environments
demanding with the new
workloads like AI/ML PERC12
PowerEdge R660 TARGET WORKLOADS

Support for up to 16 Drives Support for high-speed and memory

• Storage options for SAS4/SATA/ NVMe Gen4 and Gen5 capacity High Performance
• Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot • Up to 32 DDR5 DIMMs Simulation & Modeling
Deliver unparalleled performance in air-
• Next-gen hardware NVMe RAID • Up to 4800 MT/s (1DPC) or 4400 MT/s (2DPC)
cooled 1U HPC clusters with high-

MAINSTREAM
bandwidth memory CPU that feature
high CPU core count combined with 4x
more memory bandwidth than regular
DDR5 DIMMs.

Online Transaction
Processing
Enable faster, more secure online
transactions with next-gen high
2 Socket Capable Support for GPU Flexible I/O performance Intel CPUs built with
• Up to two 4th Generation Intel® • 3 x SW GPUs Gen5 PCIe NVMe drives and high-
• Up to 3 x PCIe Slots
Xeon® Scalable processors with capacity memory.
up to 56 cores per processor • Optional 2 x 1GbE LOM + 1 x OCP 3.0 slot
• High-bandwidth memory CPUs With the latest Gen5 PCIe enabled
All-Flash
NVIDIA GPUsvSAN
and NVMe drives
designed HCI
Advance to offer the highest and
implementations
throughput
gain higher on the largest
throughput by datasets,
deploying
customers benefit from with
reduced
• Smart Cooling vSAN nodes
training cycles
equipped
and
high-
frequency CPUs onfaster
NVMeAIdirect-
• Direct Liquid Cooling deployments.
attached storage configurations.
• Designed for growing scale-out solutions and air-cooled support
• Industry-leading manageability and security
 Technical Specifications – R640, R650 & R660
Features PowerEdge R640 PowerEdge R650 PowerEdge R660
CPU Up to two 2nd Generation Intel® Xeon® Scalable processors Up to two 3rd Generation Intel® Xeon® Scalable processors with up to 40 Up to two 4th Generation Intel® Xeon® Scalable processors with up to 56 cores
with up to 28 cores per processor cores per processor per processor
Support for up to 2 x 205W proc Support for up to 2 x 270W processors Support for up to 2 x 350W processors
Direct Liquid Cooling support Direct Liquid Cooling support

Memory Up to 24 x DDR4 RDIMM, LRDIMM, Up to 32 x DDR4 RDIMMs/LRDIMMs (8TB + Optane Persistent Memory 200 Up to 32 x DDR5 RDIMMs
Optane Persistent Memory 100 (Apache Pass): Yes Series) DIMM Speed: Up to 4800 MT/s
NVDIMM: Yes Optane Persistent Memory 200 Series (Barlow Pass): Yes
DIMM Speed: Up to 2933 MT/s DIMM Speed: Up to 3200 MT/s corrected

Storage (Chassis options) Up to 4 x 3.5" SAS/SATA HDDs Up to 4 x 3.5” SAS/SATA HDDs Up to 10 x 2.5” SAS/SATA HDD/SSDs; or NVMe SSDs
Up to 10 x 2.5" SAS/SATA HDD/SSDs or NVMe SSDs Up to 10 x 2.5” SAS/SATA HDD/SSDs; or NVMe SSDs Up to 2 x 2.5” (rear) SAS/SATA HDD/SSDs; or NVMe SSDs
Up to 2 x 2.5” (rear) SAS/SATA HDD/SSDs or NVMe SSDs Up to 2 x 2.5” (rear) SAS/SATA HDD/SSDs; or NVMe SSDs Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
Internal: IDSDM and BOSS (2 x M.2) for boot Rear BOSS-S2 (2 x M.2 SATA) for boot Internal: IDSDM or USB
Bandwidth:12Gb/6Gb SAS, SATA 6Gb Internal: IDSDM or USB Bandwidth: Up to 32Gb NVMe/24Gb SAS/6Gb SATA
Bandwidth: 12Gb/6Gb SAS, SATA 6Gb

Storage Controller HW RAID: PERC 9 & PERC 10 (dual PERC option) HW RAID: PERC 10.5 & 11 (dual PERC option) HW RAID: PERC 11 & 12 (dual PERC option)
Chipset SATA/SW RAID: Yes HW NVMe RAID HW SAS4/SATA/NVMe RAID
Chipset SATA/SW RAID: Yes SW RAID: Yes
2 x 1GbE LOM + 1 x OCP 3.0 Optional 2 x 1GbE LOM, 1 x OCP 3.0
Network 1 NDC 4 x 1GbE, 4 x 10GbE, 2 x 10GbE + 2 x 1GbE, or 2 x
25GbE

PCIe Slots Up to 3 x PCIe Slots Gen3 Up to 3 x PCIe Slots Gen4, SNAP I/O option Up to 3 x PCIe Slots (Gen4 / Gen5), SNAP I/O option

3 x SW GPUs 3 x SW GPUs 3 x SW GPUs

GPU
Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB port, 1 x VGA Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB port, 1 x VGA
Integrated Ports Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB port, 1 x
Rear: 1 x Dedicated iDRAC Ethernet port, 1 x Serial (optional), 1 x USB 2.0,
USB 3.0 (optional) + 1 x VGA Rear: 1 x Dedicated iDRAC Ethernet port, 1 x Serial (optional), 1 x USB 3.0, 1
Rear: 1 x Dedicated iDRAC Ethernet port, 1 x Serial, 2 x USB x USB 2.0, 1 x VGA (optional for Liquid Cooling configurations) 1 x USB 3.0, 1 x VGA (optional for Liquid Cooling configurations)
3.0, 1 x VGA Internal USB Internal USB Internal: USB (optional)

iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service
System Management iDRAC9, iDRAC Direct, iDRAC RESTful with Redfish, Quick
Module, Quick Sync 2 wireless module, OpenManage Enterprise and Plugins
Sync 2 wireless module (optional), OpenManage Enterprise Module, Quick Sync 2 wireless module, OpenManage Enterprise and Power
and Power Manager, OpenManage Mobile Manager, OpenManage Mobile (Power Manager, SupportAssist, Update Manager), OpenManage Mobile

High Availability Hot Plug/RAID controlled drives, PSU, Hot-plug fans. Hot Plug/RAID controlled drives, PSU, Hot-plug fans. Hot-plug BOSS Hot Plug/RAID controlled drives, PSU, Hot-plug fans. Hot-plug BOSS

Power Supplies AC (Platinum): 495W, 750W, 1100W, 1600W, AC (Platinum): 800W, 1400W AC (Platinum): 800W, 1400W
AC (Titanium): 750W AC (Titanium): 1100W AC (Titanium): 700W, 1100W, 1800W
LVDC @-48VDC Input: 1100W LVDC @-48V -60V DC Input: 1100W LVDC @-48VDC Input: 1100W

Dimension H x W x D: 42.8mm x 482mm x 809mm H x W x D: 42.8mm x 482mm x 809mm H x W x D: 42.8mm x 482mm x 809mm

Form Factor 1U Rack Server 1U Rack Server 1U Rack Server

Reimagine IT Possibilities…
What’s new with our AMD 2 socket portfolio?

Workloads High performance compute (HPC) Virtualization

Virtual desktop integration (VDI) Data analytics

Extremely powerful, dense, and air or liquid cooled,

R6625 : 1U/2S
to be the backbone of your data center.

Most dense 2S offer

Extreme More virtual Increased
Performance machine density expandability
With two AMD EPYC Packed with 50% Store more data per
4th gen enables more CPU cores and server with 33% more
R7625: 2U/2S DDR5 memory, PCIe supports up to 6 E3.S drives and save
Gen 5 all in an air- GPUs for VDI precious data center
Maximized PCIe & Storage cooled and smaller consolidation. floor space.
footprint.
 PowerEdge R7625 TARGET WORKLOADS

I/O and connectivity

A step ahead in processing • Up to 8 x PCIe slots (up to 4 x Gen5)
• Powered by up to two 4th Generation AMD • OCP 3.0 for network cards Data Analytics
EPYCTM processors with up to 96 cores per processor
Maximized storage and memory
• Up to 24 x DDR5 RDIMMs (6TB max) configuration option enables HPC,

MAINSTREAM
ML/DL/AI and rendering

All Flash SDS

24 2.5” U.2 Gen4 NVMe or 32 E3.S
drives supports all flash storage

Flexible storage
• Up to 12 x 3.5” – 12Gb SAS, 6Gb SATA
• Up to 24 x 2.5” – 12Gb SAS, 6Gb SATA, NVMe
VDI
• Up to 32 x E3.S – NVMe Balanced core count and GPU to
• Rear: Up to 4 x 2.5” Hot Plug SAS/SATA or NVMe HDDs, Up support for maximum numbers of
to 4 x E3.S NVMe end users

• Smart Cooling
• Direct Liquid Cooling (DLC) Support
• Industry-leading manageability and security
Technical Specifications – R7525, R7625
Features PowerEdge R7525 PowerEdge 7625

CPU Up to two 2nd or 3rd Generation AMD EPYC ™ processors with up to 64 cores per processor Up to two 4th Generation AMD EPYC™ processors with up to 96 cores per processor
Up to 280W (cTDP) Target up to 400W (cTDP)

Memory DDR4: Up to 32 x DDR4 RDIMM, LRDIMM (4TB) DDR5: Up to 24 x DDR5 RDIMMs (6TB)
DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s

Storage (Chassis options) Up to 12 x 3.5” – 12Gb SAS, 6Gb SATA Up to 24 x 2.5” SAS/SATA HDD/SSDs, or NVMe
Up to 24 x 2.5” – 12Gb SAS, 6Gb SATA Up to 12 x 3.5” SAS/SATA HDD/SSDs
Rear: Up to 2 x 2.5” Hot Plug SAS/SATA or NVMe HDDs Up to 32 E3.S NVMe
Internal: 2 x M.2 (BOSS) Rear: Up to 4 x 2.5” Hot Plug SAS/SATA or NVMe HDDs, Up to 4 x E3.S NVMe
Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
Bandwidth: 12Gb/6Gb SAS

PCIe Storage Up to 24 NVMe Direct Up to 32 E3.S NVMe Direct (G5 x 2 PCIe Lanes)

Storage Controller HW RAID: PERC 10.5, PERC 11 HW RAID: PERC11, PERC12

HW NVMe RAID: PERC11 HW NVMe RAID: PERC11, PERC12
Chipset SATA/SW RAID: Yes Chipset SATA/SW RAID: Yes

Network 2 x 1GbE LOM + 1 x OCP 3.0 LOM Riser + 1 x OCP 3.0

PCIe slots Up to 8 x PCIe x16 Gen4 slots @ 16GT/s Up to 8 x PCIe x16 slots, 4 x PCIe Gen5, 4 x PCIe Gen4

GPU Up to 3 DW GPU or up to 6 SW 75W GPU Up to 2 500W DWFL (Target 700W) or up to 6 150W SWFL

Integrated Ports Front: 1 port (USB 2.0), 1 (micro-USB, iDRAC Direct) Front: 1 port (USB 2.0), 1 (iDRAC Direct micro-USB)
Rear: 1 port (USB 3.0) + 1 port (USB 2.0) Rear: 1 port (USB 3.0) + 1 port (USB 2.0)
Internal: 1 port (USB 2.0)

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power 16G iDRAC Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power
Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0 Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0

High Availability Hot Plug/RAID controlled drives, Fans, PSUs, BOSS (2 x M.2) Hot Plug/RAID controlled drives, Fans, PSUs, BOSS-N1 (2 x M.2 NVMe) for boot

Power Supplies 800W, 1400W, 1100W 800W -48Vdc, 1100W, 1100W -48Vdc, 1400W, 1800W, 2400W, 2800W

Dimensions 2U x 700mm (27.6”) H x W x D: 2U x 434mm (17.08 in) x 736.29 mm (28.98 in)

Form Factor 2U Rack Server 2U Rack Server

Reimagine IT Possibilities…
What’s new with our AMD 2 socket portfolio?

Workloads High performance compute (HPC) Virtualization

Virtual desktop integration (VDI) Data analytics

Extremely powerful, dense, and air or liquid cooled,

R6625 : 1U/2S
to be the backbone of your data center.

Most dense 2S offer

Extreme More virtual Increased
Performance machine density expandability
With two AMD Packed with 50% Store more data per
EPYCTM 4th gen more CPU cores and server with 33% more
R7625: 2U/2S enables DDR5 supports up to 6 E3.S drives and save
memory, PCIe Gen 5 GPUs for VDI precious data center
Maximized PCIe & Storage all in an air-cooled consolidation. floor space.
and smaller footprint.
 PowerEdge R6625 TARGET WORKLOADS

2 Socket Capable
• Powered by up to two 4th Generation I/O and connectivity HPC
AMD EPYCTM processors with up to 96 cores per • Up to 3 x PCIe slots (up to 2 x Gen5)
processor • OCP 3.0 for network cards HPC requiring 1DPC design for
• Up to 24 x DDR5 RDIMMs (6TB max) highest memory performance &
scale out clusters.

MAINSTREAM
Dense VDI
Multi GPU support to accelerate end
user VDI performance

Flexible storage
• Up to 4 x 3.5" SAS/SATA or SSD
• Up to 10 x 2.5" SAS/SATA, SSD; or NVMe
• Up to 14 x E3.S Hot Plug NVMe Virtualization
• HW NVMe RAID
VMMark w/ vSAN World Record
performance of 24.08 @ 28 tiles is
81.5% better than previous record

• Smart Cooling
• Direct Liquid Cooling (DLC) Support
• Industry-leading manageability and security
Technical Specifications – R6525, R6625
Features PowerEdge R6525 PowerEdge R6625

CPU Up to two 2nd or 3rd Generation AMD EPYC™ processors with up to 64 cores per processor Up to two 4th Generation AMD EPYC™ processors with up to 96 cores per processor
Up to 280W (cTDP) Target up to 400W (cTDP)

Memory DDR4: Up to 32 x DDR4 RDIMM, LRDIMM (4TB) DDR5: Up to 24 x DDR5 RDIMMs (6TB)
DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s

Storage (Chassis options) Up to 4 x 3.5” Hot Plug SAS/SATA HDDs Up to 4 x 3.5” Hot Plug SAS/SATA HDDs
Up to 12 x 2.5” (10 Front + 2 Rear) Hot Plug SAS/SATA/NVMe Up to 12 x 2.5” (10 Front + 2 Rear) Hot Plug SAS/SATA/NVMe
Up to 8 x 2.5” Hot Plug SAS/SATA HDD/SSDs Up to 14 x E3.S Hot Plug NVMe CPU Direct or 16 x E3.S Hot Plug NVMe with Dual Controllers
Internal: Internal BOSS (2 x M.2) Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
Bandwidth: 12Gb/6Gb SAS/SATA

PCIe Storage Up to 12 (10+2) NVMe Direct Up to: 12 x 2.5” (10 Front + 2 Rear) U.2 NVMe
14 x E3.S Hot Plug NVMe Direct
16 x E3.S Hot Plug NVMe with Dual Controllers

Storage Controller HW RAID: PERC 10.5, PERC 11 HW RAID: PERC11, PERC12

HW NVMe RAID: PERC11 HW NVMe RAID: PERC11, PERC12
Chipset SATA/SW RAID: Yes Chipset SATA/SW RAID: Yes

Network 2 x 1GbE LOM + 1 x OCP 3.0 LOM Riser + 1 x OCP 3.0

PCIe slots Up to 3 x PCIe x16 Gen4 slots @ 16GT/s Up to 3 x PCIe x16 slots, 2 x PCIe Gen5, 1 x PCIe Gen4

GPU Up to 3 Single-Wide GPU Up to 3 75W LP or 2 150W FH/HL

Integrated Ports Front: 1 port (USB 2.0), 1 (micro-USB, iDRAC Direct) Front: 1 port (USB 2.0), 1 (iDRAC Direct micro-USB)
Rear: 1 port (USB 3.0) + 1 port (USB 2.0) Rear: 1 port (USB 3.0) + 1 port (USB 2.0)
Internal: 1 port (USB 2.0)

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power 16G iDRAC Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power
Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0 Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0

Power Supplies 800W, 1400W, 1100W 800W, 1100W, 1100W -48Vdc, 1400W, 1800W

High Availability Hot Plug/RAID controlled drives, Fans, PSUs, BOSS (2 x M.2) Hot Plug/RAID controlled drives, Fans, PSUs, BOSS-N1 (2 x M.2 NVMe) for boot

Dimensions H x W x D: 1U x 700.7mm (21.6”) or 751.5mm (29.6”) H x W x D: 1U x 434mm (17.08 in) x 736.27 mm (28.99 in)

Form Factor 1U Rack Server 1U Rack Server

Accelerate innovation…
What’s new with our R860 & R960?

Mission & Business-critical

Large In-Memory databases, SAP Virtualization, dense VDI and operations across multiple
Workloads HANA VM/Container operations segments including Financial,
Healthcare

Extreme acceleration for business, delivering business-

critical and data-driven operational capabilities from core to
R860 hybrid cloud with scalable compute.
4x CPUs and 64 DIMMs in 2U Accelerate your Optimized for Scalable flexibility
outcomes Dense Virtualization Scale up multiple
Powerful Maximize VM and workload needs, up
performance for large VDI operations with to 16TB DDR5, up to
in-memory database up to 240 CPU cores, 32 drives and 12
workloads, enabling by simplifying PCIe Gen5 slots
faster business resource utilization
insights and lowering TCO
R960
4x CPUs, 64 DIMMs, with additional
storage and slots in 4U
PowerEdge R860 TARGET WORKLOADS

Extreme Computing Power Support for highest memory speed & capacity
• Up to four 4th Generation Intel® Xeon®
Scalable processors with up to 60 cores per
• Up to 64 DDR5 RDIMMs Large In-Memory
processor • Up to 4800 MT/s (1DPC) or 4400 MT/s (2DPC) Databases
With up to 64 DIMMs to maximize
support for in-memory databases

MAINSTREAM
Virtualization/VDI
With 4 CPUs and the greatest
capacity for memory, storage, and
I/O, this platform is optimal for the
densest virtualization stacks

Support for up to 24 Drives Flexible I/O LOB Applications

• Up to 24 NVMe direct attached drives • Up to 8 x PCIe Gen 5 Slots Flexibility and capacity to support
• Gen5 NVMe & SAS4 Support • 1 x OCP 3.0 slot the most demanding Line Of
• Dedicated internal PERC Business applications
• Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
• Next-gen hardware NVMe RAID

• Choice of 5 PSU (Gold or Platinum) to achieve sustainable energy goals

• Optimized for air-cooling in a variety of configurations, optional Dell Direct Liquid Cooling
Support
• Industry-leading manageability and security
Technical Specifications – R840, R860
Features PowerEdge R840 PowerEdge R860
CPU nd
Up to four 2 Generation Intel® Xeon® Scalable processors with up to 28 cores per Up to four 4th Generation Intel® Xeon® Scalable processors with up to 60 cores per processor.
processor Support for up to 4 x 350W processors
Support for up to 4 x 205W processors

Memory DDR4: 48x DDR4 RDIMM/LRDIMM Up to 64 x DDR5 RDIMMs

Optane Memory (Apache Pass): Yes NVDIMM: No
NVDIMM: Yes DIMM Speed: Up to 4800 MT/s
Up to 24 x 2.5” SAS/SATA HDD/SSDs
Storage (Chassis options) Up to 24 x 2.5" SAS/SATA HDD/SSDs; or NVMe (Gen3)
Up to 24 x 2.5” NVMe SSDs
Up to 2 x 2.5” (rear) SAS/SATA HDD/SSDs;
Internal: IDSDM and BOSS (2 x M.2) for boot Up to 8 E3.S NVMe
Bandwidth: 12Gb/6Gb SAS Rear: Up to 2 x 2.5” Hot Plug SAS/SATA or NVMe HDDs
Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot. No IDSM.
Bandwidth: Up to 32Gb NVMe/24Gb SAS/6Gb SATA

Storage Controller HW RAID: PERC 9 / PERC 10; Dual PERC option RAID (PERC 11 & 12)
Chipset SATA/SW RAID: Yes SAS / SATA / NVMe / RAID (PERC 11 & 12)
SAS3 and SAS4
Chipset SATA/SW RAID: Yes

Network 1 x NDC 1 x 1GbE LOM and 1 x OCP3 NIC

PCIe slots Up to 6 x PCIe Gen3 or up to 4 x16 slots Up to 8 slots PCIe Gen4 or Gen5
No SNAPI. No CXL.
GPU Up to 2 x DW GPUs No GPU support

Integrated Ports Front: 2 x USB 2.0, 1 x USB micro (iDRAC Direct), primary VGA, status LEDs Front: VGA, 1 x USB 2.0, iDRAC Direct micro-USB, ID Button & LED
Rear: 2 x USB 2.0, network, iDRAC9, VGA Rear: VGA, 1 x USB 2.0, 1 x USB 3.0, Management RJ-45,
Optional: Internal USB 3.0 2 x LOM RJ-45, 1 x Serial (optional)
Internal: 1 x USB 2.0

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power
(Power Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0 Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0

High Availability Hot Plug/RAID controlled drives, Fans, PSU, IDSDM and BOSS (2 x internal M.2) Hot Plug/RAID controlled drives, High Power Air-Cooled Configurations, PSU, BOSS-N1 (2 x M.2 MVMe)

Power Supplies 750W, 1100W, 1600W, 2000W, 2400W 1100W, 1400W, 1800W, 2400W, 2800W

Dimensions H x W x D: 2U x 434mm x 812mm H x W x D: 2U x 482mm x 869.06mm

Form Factor 2U Rack Server 2U Rack Server

PowerEdge R960 TARGET WORKLOADS

Extreme Computing Power Support for highest memory speed & capacity
• Up to four 4th Generation Intel® Xeon®
Scalable processors with up to 60 cores per
• Up to 64 DDR5 RDIMMs Large In-Memory
processor • Up to 4800 MT/s (1DPC) or 4400 MT/s (2DPC) Databases
With up to 64 DIMMs to maximize
support for in-memory databases

MAINSTREAM
Virtualization/VDI
With 4 CPUs and the greatest
capacity for memory, storage, and
I/O, this platform is optimal for the
densest virtualization stacks

Support for up to 36 Drives Flexible I/O LOB Applications

• Up to 36 NVMe direct attached drives • Up to 12 x PCIe Gen 5 Slots Flexibility and capacity to support
• Gen5 NVMe & SAS4 Support • 1 x OCP 3.0 slot the most demanding Line Of
• Dedicated internal PERC Business applications
• Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
• Next-gen hardware NVMe RAID

• Choice of 5 PSU (Gold or Platinum) to achieve sustainable energy goals.

• Optimized for air-cooling in a variety of configurations, optional Dell Direct Liquid Cooling Support
• Support for up to 4 Doublewide GPUs.
• Industry-leading manageability and security.
Technical Specifications – R940XA, R960
Features PowerEdge R940XA PowerEdge R960
CPU Up to four2nd Generation Intel® Xeon® Scalable processors with up to 28 cores per Up to four 4th Generation Intel® Xeon® Scalable processors with up to 60 cores per processor.
processor Support for up to 4 x 350W processors
Support for up to 4 x 205W processors

Memory DDR4: 48x DDR4 RDIMM/LRDIMM Up to 64 x DDR5 RDIMMs

Optane Memory (Apache Pass): Yes NVDIMM: No
NVDIMM: Yes DIMM Speed: Up to 4800 MT/s
Up to 32 x 2.5” SAS/SATA HDD/SSDs
Storage (Chassis options) Up to 32 x 2.5" SAS/SATA HDD/SSDs; or NVMe (Gen3)
Up to 24 x 2.5” NVMe SSDs
Internal: IDSDM and BOSS (2 x M.2) for boot
Bandwidth: 12Gb/6Gb SAS Up to 16 x E3.S NVMe
Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot. No IDSM.
Bandwidth: Up to 32Gb NVMe/24Gb SAS/6Gb SATA

RAID (PERC 11 & 12)

Storage Controller HW RAID: PERC 9 / PERC 10;
SAS / SATA / NVMe / RAID (PERC 11 & 12)
Chipset SATA/SW RAID: Yes
SAS3 and SAS4
Chipset SATA/SW RAID: Yes

Network 1 x NDC 1 x 1GbE LOM and 1 x OCP3 NIC

PCIe slots Up to 12 x PCIe Gen3 or up to 6 x16 slots Up to 12 slots PCIe Gen5

No SNAPI. No CXL
GPU Up to 4 x DW GPUs Up to 4 DW GPUs (350w each)

Integrated Ports Front: 2 x USB 2.0, 1 x USB micro (iDRAC Direct), primary VGA, status LEDs
Front: VGA, 1 x USB 2.0, iDRAC Direct micro-USB, ID Button & LED, QuickSync 2.0 (optional)
Rear: 2 xUSB 2.0, network, iDRAC9, VGA
Rear: VGA, 1 xUSB 2.0, 1 xUSB 3.0, Management RJ-45,
Optional: Internal USB 3.0
2 xLOM RJ-45, 1 x Serial (optional)
Internal: 1 xUSB 2.0

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power
(Power Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0 Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0

High Availability Hot Plug/RAID controlled drives, Fans, PSU, IDSDM and BOSS (2 x internal M.2)
Hot Plug/RAID controlled drives, High Power Air-Cooled Configurations, PSU, BOSS-N1 (2 x M.2 NVMe)

Power Supplies 1100W, 1600W, 2000W, 2400W 1100W, 1400W, 1800W, 2400W, 2800W

Dimensions H x W x D: 2U x 434mm x 812mm H x W x D: 4U x 482mm x 846.87mm

Form Factor 4U Rack Server 4U Rack Server

 PowerEdge T560 Designed for high
reliability
TARGET WORKLOADS

Exceptional Performance • Hot-plug BOSS

• Powered by up to two 4th Generation Intel® Xeon® Scalable • Hot-plug HDD/SSD
processors with up to 32 cores per processor
• Hot-plug redundant power
• Up to 16 x DDR5 RDIMMs (1TB max) supplies Database
• Up to 4800 MT/s (1DPC) or 4400 MT/s (2DPC) • PERC 11 & 12, SW and HW Built-in features to enable
collaborative applications between
RAID, Front, Internal PERC groups of people that share
and Add-in Card options information and processes on-site or
remotely

ROBO / SMB
Medium Duty Inferencing
Tuned to power medium duty AI or ML
tailored inferencing algorithms to drive
more timely and accurate business
Expandable I/O and insights.
Storage
• Faster I/O throughput:
PCIe Gen 5 Virtualization
• Increased memory
performance with DDR5 A perfect choice for medium
Prepped for data analytics 4800MT/s businesses exploring the
and machine learning advantages of software
• Increased maximum
virtualization.
• Up to 2 Double-Wide GPU storage with up to 12 x 3.5"
HDD, or 24 x 2.5” SSDs, or
• Up to 4 x PCIe Gen 4 slots
8 x 3.5”/2.5” HDD+ 8 x
Industry-leading NVMe SSD
manageability
and security
Technical Specifications – T550, T560
Features PowerEdge T550 PowerEdge T560

CPU Up to two 3rd Generation Intel® Xeon® Scalable processors with up to 32 cores per Up to two 4th Generation Intel® Xeon® Scalable processors with up to 32 cores per
processor processor, air-cooled
Support for up to 2 x 220W processors Support for up to 2 x 250W processors

Memory DDR4: Up to 16 x RDIMM (1TB) Up to 16 DDR5 RDIMMs (1TB Max)

DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800MT/s

Storage (Chassis options) Up to 8 x 3.5” Hot Plug SATA/SAS HDDs/SSDs Up to 12 x 3.5” Hot Plug SATA/SAS HDD/SSDs
Up to 24 x 2.5” Hot Plug SAS/SATA HDDs/SSDs Up to 24 x 2.5” Hot Plug SAS/SATA HDD/SSDs
Up to 8 x 3.5” Hot Plug SATA/SASHDDs/SSDs and 8 x NVMe SSDs Up to 8 x 3.5” Hot Plug SATA/SAS HDD/SSDs and 8 x NVMe SSDs
Optional: TBU in 5.25” bay Optional: TBU in 5.25” bay
BOSS-S1 (2 x M.2) for boot Internal BOSS-N1 (2 x M.2 NVMe) for boot
Bandwidth:SAS-12Gb, SATA-6Gb Bandwidth:SAS-12Gb, SATA-6Gb

Storage Controller HW RAID: PERC 11 fPERC 10.5/11, SAS3 & SAS4 HW RAID: PERC 11 & 12, SAS3 & SAS4
Chipset SATA/SW RAID Chipset SATA/SW RAID: Yes

Network 2 x 1GE + 1 x OCP 3.0 2 x 1GE + 1 x OCP 3.0;

PCIe Slots Up to 5x PCIe Gen 4 slots (all x16) + 1 x PCIe Gen 3 (x8) 3 x16 FH, 1 x8 FH Gen 4 slots and 2 x16 Gen 5 DW slots

GPU Up to 2 x DW Up to 2 x DW

Integrated Ports Front: 2 ports (USB 3.0), 1 iDRAC Direct micro-USB Front: 2 ports (USB 3.0), 1 iDRAC Direct micro-USB
Rear: 1 ports (USB 3.0), 1 ports (USB 2.0), serial (option), network, iDRAC9 GE, secondary Rear: 1 ports (USB 3.0), 1 ports (USB 2.0), serial (option), network, iDRAC9 GE, secondary
VGA, SysID VGA, SysID

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power
(PowerManager, SupportAssist, and Update Manager) iDRAC Direct, Quick Sync 2.0 Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0

High Availability Hot Plug/RAID controlled drives, Fans, PSU Hot Plug/RAID controlled drives, Fans, PSU

Power Supplies 600W, 800W, -48Vdc-- -60Vdc/1100W, 1400W, 2400W 600W, 700W, 800W, -48Vdc-- -60Vdc/1100W, 1400W, 2400W

Dimension H x W x D: 459mm x 200mm x 660mm H x W x D: 459mm x 200mm x 660mm

Form Factor 5U Tower Server 5U Tower Server

Reimagine IT Possibilities…
What’s new with our XS portfolio?

XS workloads General purpose workloads General purpose VDI Cloud HPC

The best choice for customers seeking the right balance in

air-cooled compute for the most popular IT applications.
R660XS : 1U/2S

Higher density
Thoughtfully Easily configured A breeze to cool
crafted Includes a variety of Equipped with
To fit your current components that are patented Multi-Vector
infrastructure and interchangeable to air cooling saving on
R760XS: 2U/2S deliver the right suit your needs. liquid cooling options.
performance features
Flexible storage & acceleration to support your
demanding enterprise
applications.
 PowerEdge R760xs TARGET WORKLOADS

MAINSTREAM OPTIMIZED
2 Socket Capable Memory Support
• Up to two 4 Generation Intel Xeon Scalable
th ® ® • Up to 16 DDR5 DIMMs (1TB max) Virtualization
processors with up to 32 cores • Up to 4800 MT/s
A perfect choice for medium
• Up to 250W businesses exploring the
advantages of software
virtualization.

Medium density VM /
VDI
Up to 1TB of memory and plenty of
cores, R760xs is perfectly sized for
typical virtual machines or VDI
Flexible storage instances where minor accelerator
Flexible I/O
support is acceptable.
• Up to 16 x 2.5” + 8x NVMe or 16 x 2.5” • Up to 6 x PCIe slots (up to 2 x Gen5)
or 12 x 3.5” storage options
• 1 x OCP 3.0 slot
• Next Gen HW NVMe RAID (PERC12)
• 1 x dedicated internal PERC
• Hot-plug BOSS-N1 (2 x M.2 NVMe) for boot
• Up to 2 x SW GPU (NVIDIA A2) Software-Defined
Storage Node
Up to 24 drives (up to 16x NVME!) for
• Smart Cooling software defined storage
• Designed for growing scale-out solutions and air-cooled support deployments.
• Industry-leading manageability and security
Technical Specifications – R740, R750xs & R760xs
Features PowerEdge R740 PowerEdge R750xs PowerEdge R760xs

CPU Up to two 2nd Generation Intel® Xeon® Scalable processors with Up to two 3rd Generation Intel® Xeon® Scalable processors with up Up to two 4th Generation Intel® Xeon® Scalable processors with up to
up to 28 cores per processor to 32 cores per processor 32 cores per processor, air-cooled
Support for up to 2 x 205W processors Support for up to 2 x 220W processors Support for up to 2 x 250W processors

Memory Up to 24 x DDR4 RDIMMs, LRDIMMs Up to 16 x DDR4 RDIMMs (1TB max)

Up to 16 x DDR5 RDIMMs (1TB max)
Optane Persistent Memory 100 (Apache Pass): Yes Optane Persistent Memory 200 Series (Barlow Pass): No
NVDIMM: No
NVDIMM: Yes NVDIMM: No
DIMM Speed: Up to 4800 MT/s
DIMM Speed: Up to 2933 MT/s DIMM Speed: Up to 3200 MT/s

Storage (Chassis options) Up to 12 x 3.5” SAS/SATA HDDs Up to 12 x 3.5” SAS/SATA HDDs Up to 8 x 3.5" SAS/SATA / ChipSATA
Up to 24 x 2.5”SAS/SATA HDD or SSDs Up to 12 x 3.5” SAS/SATA HDDs + 2 x 2.5” Rear Up to 12 x 3.5" SAS/SATA HDDs
Up to 24 x NVMe Up to 16 x 2.5” SAS/SATA HDDs or SSDs Up to 8 x 2.5” SAS/SATA HDD/SSDs
Internal: IDSDM and BOSS (2 x M.2) for boot Up to 16 x SAS/SATA HDDs or SSDs + 8 x NVMe Up to 16 x 2.5” SAS/SATA HDD/SSDs or NVMe SSDs
Bandwidth: 12Gb/6Gb SAS HW NVMe RAID (8 x 2.5” with PERC H755N) Up to 16 x 2.5" SAS/SATA HDD/SSDs + 8x2.5" NVMe SSDs
Rear BOSS-S2 (2 x M.2) for boot Rear: 2 x 2.5” (limited configs) SAS / SATA / NVMe (PERC 11 & 12)
Internal: IDSDM or USB Rear Hot-plug BOSS-N1 (2 x M.2 NVMe) for boot
Bandwidth: 12Gb/6Gb SAS, SATA 6Gb Internal: USB. No IDSDM

Storage Controller HW RAID: PERC 9/PERC 10; Dual PERC option HW RAID: PERC 10.5 & 11 (no dual PERC option) SATA / SAS / NVMe / RAID (PERC 11 & 12)
Chipset SATA/SW RAID: Yes HW NVMe RAID SAS3 & SAS4
Chipset SATA/SW RAID: Yes Chipset SATA/SW RAID: Yes

Network 1 NDC 2 x 1GbE LOM + 1 x OCP 3.0 2 x 1GbE LOM + 1 x OCP 3.0

PCIe Slots Up to 8 x PCIe Slots Gen3 (4 x 16) Up to 5 x PCIe Gen4 (5 x16), 1 x PCIe Gen3 (1:x8) with SNAP I/O Up to 6 x PCIe Slots: (up to 3 x16LP Gen4 + 1 x 8LP Gen4 + 2 x16
option Gen5 LP)
No SNAPI
GPU 3 x 300 (DW) or 6 x 75W (SW) None Up to 2 x 75W (SW) HL/HH GPU (A2 NVIDIA cards)

Front: 2 x USB 2.0, 1 managed (micro-USB) +1 x USB 3.0 Front: 2 x USB 2.0, 1 managed (micro-usb), primary VGA Front: VGA, 1 x USB 2.0, iDRAC Direct micro-USB, ID Button &
Integrated Ports LED; QuickSync 2 (optional)
(optional) +1 x VGA Rear: 1 ports (USB 3.0), 1 ports (USB 2.0), serial (option), network,
Rear: 1 x Dedicated iDRAC network port, 1 x Serial, 2 x USB3.0, 1 iDRAC9, secondary VGA, SysID Rear: VGA, 1 x USB 2.0, 1 xUSB 3.0, Management RJ-45,
x VGA 2 xLOM RJ-45, 1 x Serial (optional)
Internal: 1 x USB 2.0
System Management iDRAC9 Enterprise, Datacenter license options; OpenManage iDRAC9 Enterprise, Datacenter license options; OpenManage iDRAC9 Enterprise, Datacenter license options; OpenManage
Enterprise and Plugins (PowerManager, SupportAssist, and Update Enterprise and Plugins (Power Manager, SupportAssist, and Enterprise and Plugins (PowerManager, SupportAssist, and Update
Manager) iDRAC Direct, Quick Sync 2.0 Update Manager). iDRAC Direct, Quick Sync 2.0 Manager) iDRAC Direct, Quick Sync 2.0

High Availability Hot Plug/RAID controlled drives, PSU, fans, IDSDM, BOSS (2 x Hot Plug/RAID controlled drives, PSU, fans, IDSDM and BOSS-S2 Hot Plug/RAID controlled drives, PSU, fans and BOSS-N1 (2 x M.2
Internal M.2) (2 x M.2) for boot NVMe) for boot

Power Supplies 495W, 750W, 1100W, 1600W, 2000W, 2400W 600W, 800W, 1100W, -48Vdc/1100W, 1400W 600W, 700W, 800W, 1100W, -48Vdc/ 1100W, 1400W, 1800W

Dimension H x W x D: 2U x 434mm x 716mm H x W x D: 2U x 434mm x 721mm H x W x D: 2U x 434mm x 721mm

Form Factor 2U Rack server 2U Rack Server 2U Rack Server

 PowerEdge R660xs TARGET WORKLOADS

MAINSTREAM OPTIMIZED
2 Socket Capable
• Up to two 4th Generation Intel® Xeon® Scalable processors with up to 32
cores per processor
Memory Support Virtualization / Cloud
• Up to 250W • Up to 16 DDR5 DIMMs (1TB max) Medium density virtualization and
• Up to 4800 MT/s Cloud-Native requiring low-medium
local storage.

Scale-Out Database
Medium Duty traditional database &
scale out database with low-medium
local storage

Flexible storage Flexible I/O

• Up to 10 x SAS/SATA/NVME drives • Up to 3 x PCIe slots
or up to 4 x 3.5” high-capacity SATA HDDs
• 1 x OCP 3.0 slot High Performance
• Next Gen HW NVMe RAID (PERC12)
• 1 x dedicated internal PERC Compute
• USB and Internal BOSS-N1 (2 x M.2 NVMe) for boot
HPC requiring 1DPC design for
highest memory performance &
scale out clusters.

• Smart Cooling
• Designed for growing scale-out solutions and air-cooled support
• Industry-leading manageability and security
Technical Specifications – R640, R650xs & R660xs
Features PowerEdge R640 PowerEdge R650xs PowerEdge R660xs

CPU Up to two 2nd Generation Intel Xeon Scalable processors with up to Up to two 3rd Generation Intel® Xeon® Scalable processors with up Up to two 4th Generation Intel® Xeon® Scalable processors with up to
28 cores per processor, air-cooled to 32 cores per processor, air-cooled 32 cores per processor, air-cooled
Support for up to 2 x 205W processors Support for up to 2 x 220W processors Support for up to 2 x 250W processors

Memory Up to 24 x DDR4 RDIMM, LRDIMM Up to 16 x DDR4 RDIMMs (1TB max)

Up to 16 x DDR5 RDIMMs (1TB max)
Optane Persistent Memory 100 (Apache Pass): Yes Optane Persistent Memory 200 Series (Barlow Pass): No
NVDIMM: No
NVDIMM: Yes NVDIMM: No
DIMM Speed: Up to 4800 MT/s
DIMM Speed: Up to 2933 MT/s DIMM Speed: Up to 3200 MT/s

Storage (Chassis options) Up to 4 x 3.5” SAS/SATA HDDs Up to 4 x 3.5" SAS/SATA HDDs Up to 4 x 3.5" SAS/SATA / ChipSATA
Up to 10 x 2.5” SAS/SATA HDDs or SSDs, or NVMe Up to 10 x 2.5" SAS/SATA HDDs or SSDs; or NVMe Up to 8 x 2.5” SAS/SATA HDD/SSDs
Up to 2 x 2.5” (rear) SAS/SATA HDDs or SSDs; or NVMe Up to 2 x 2.5” (rear) SAS/SATA HDDs or SSDs; or NVMe Up to 10 x 2.5” SAS/SATA HDD/SSDs or NVMe SSDs
Internal IDSDM and BOSS (2 x M.2) for boot Up to 8 x 2.5" NVMe RAID Rear: 2 x 2.5” SAS / SATA / NVMe w/ NVMe RAID (PERC 11 & 12)
Bandwidth: 12Gb/6Gb SAS HW NVMe RAID (8 x 2.5” with PERC H755N) Internal: USB and Internal BOSS-N1 (2 x M.2 NVMe) for boot. No
Internal: IDSDM,USB and BOSS-S1 (2 x M.2) for boot IDSDM
Bandwidth: 12Gb/6Gb SAS, SATA 6Gb

Storage Controller HW RAID: PERC 9 / PERC 10; Dual PERC option HW RAID: PERC 10.5 & 11 (no Dual PERC option) SATA / SAS / NVMe / RAID (PERC 11 & 12)
Chipset SATA/SW RAID: Yes HW NVMe RAID SAS3 and SAS4
Chipset SATA/SW RAID: Yes Chipset SATA/SW RAID: Yes

Network 1 NDC 2 x 1GbE LOM + 1 x OCP 3.0 2 x 1GbE LOM + 1 x OCP 3.0

PCIe Slots Up to 3 x PCIe Gen3 (x16/x16/x16) or 2 x PCIe FH slots (Gen3) Up to 3 x PCIe Gen4 (x16/x8/x8) with SNAPI I/O option Up to 3 x PCIe Gen4 (x16/x8/x8) or up to 2 x PCIe Gen5 (x16/x8)
No SNAPI
Up to 3 SW GPUs None None
GPU
Front: 1 x USB 2.0, 1 managed (micro-USB) + front VGA Front: 2 x USB 2.0, 1 managed (micro-usb) + front VGA Front: VGA, 1 x USB 2.0, iDRAC Direct micro-USB, ID Button &
Integrated Ports LED; QuickSync 2.0 (optional)
Rear: 1 x Dedicated iDRAC network port, 1 x Serial, 2 x USB 3.0, 1 Rear: 1 x USB 3.0, 1 ports (USB 2.0) serial (option), network,
x VGA iDRAC9, secondary VGA, SysID Rear: VGA, 1 x USB 2.0, 1 xUSB 3.0, Management RJ-45,
Optional Internal USB 2 x LOM RJ-45, 1 x Serial (optional)
Internal: 1 x USB 2.0
System Management iDRAC9 Enterprise, Datacenter license options; OpenManage iDRAC9 Enterprise, Datacenter license options; OpenManage iDRAC9 Enterprise, Datacenter license options; OpenManage
Enterprise and Plugins (PowerManager, SupportAssist, and Update Enterprise and Plugins (Power Manager, SupportAssist, and Enterprise and Plugins (PowerManager, SupportAssist, and Update
Manager) iDRAC Direct, Quick Sync 2.0 Update Manager). iDRAC Direct, Quick Sync 2.0 Manager) iDRAC Direct, Quick Sync 2.0
Hot Plug/RAID controlled drives, 2 Tiered Fans, PSU, IDSDM, Hot Plug/RAID controlled drives, Cold plug fans, PSU, IDSDM and Hot Plug/RAID controlled drives, PSU.
High Availability Hot-plug fans, Internal (non-hot-plug) BOSS-N1 (2 x M.2 NVMe) for
BOSS (2 x Internal M.2) (non-hot-plug) BOSS-S1 (2 x M.2) for boot
boot
Power Supplies 495W, 750W, 1100W, 1600W 600W, 800W, 1100W, -48Vdc/ 1100W,1400W 600W, 700W, 800W, 1100W, -48Vdc/ 1100W, 1400W, 1800W

Dimension H x W x D: 1U x 434mm x 773mm H x W x D: 1U x 434mm x 698mm (2.5” drives) or 749mm (3.5” H x W x D: 1U x 434mm x 698mm (2.5” drives) or 749mm (3.5”
drives) drives)

Form Factor 1U Rack Server 1U Rack Server 1U Rack Server

Reimagine IT Possibilities…
What’s new with our AMD 1 socket portfolio?

Workloads Data analytics Software defined storage

Dense Virtualization

Greater memory footprint with flexible storage

and outstanding performance per dollar invested.
R6615 : 1U/1S

Most dense 1S offer

Wise Investment More virtual Increased
With one AMD machine density scalability
EPYCTM 4th gen Packed with 50% Store more data per
enables DDR5 more CPU cores and server with 33% more
R7615: 2U/1S memory, PCIe Gen 5 supports up to 6 E3.S drives and save
all in an air-cooled GPUs for VDI precious data center
Maximized PCIe & Storage and smaller footprint. consolidation. floor space.
PowerEdge R7615 TARGET WORKLOADS

MAINSTREAM OPTIMIZED
The only socket you need
• Powered by one 4th Generation AMD EPYCTM
I/O and connectivity
processor with up to 96 cores per processor • Up to 8 x PCIe slots (up to 4 x Gen5) SDS
• OCP 3.0 for network cards
• Up to 12 x DDR5 RDIMMs (3TB max) Direct connect SAS/SATA/NVMe

Virtualization
High core count performance for
highest VM density in 1S

Flexible storage
• Up to 12 x 3.5” – 12Gb SAS, 6Gb SATA
Data Analytics
• Up to 24 x 2.5” – 12Gb SAS, 6Gb SATA, NVMe Multi-die architecture offers low
• Up to 32 x E3.S – NVMe latency and floating point
• Rear: Up to 4 x 2.5” Hot Plug SAS/SATA or NVMe HDDs, Up capacity for Big Data and
to 4 x E3.S NVMe Containers
• Internal BOSS-N1 (2 x M.2 NVMe) for boot

• Smart Cooling
• Direct Liquid Cooling (DLC) Support
• Industry-leading manageability and security
Technical Specifications – R7515, R7615
Features PowerEdge R7515 PowerEdge 7615

CPU One 2nd or 3rd Generation AMD EPYC™ processor with up to 64 cores per processor One 4th Generation AMD EPYC™ processor with up to 96 cores per processor
Up to one 280W (cTDP) Target up to 400W (cTDP)

Memory DDR4: Up to 16 x DDR4 RDIMM, LRDIMM (2TB) DDR5: Up to 12 x DDR5 RDIMM (3TB)
DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s

Storage (Chassis options Up to 8 x 3.5” Hot Plug SATA/SAS HDDs Up to 24 x 2.5” SAS/SATA HDD or SSD, or NVMe
Up to 12 x 3.5” Hot Plug SAS/SATA HDDs Up to 12 x 3.5” SAS/SATA HDD or SSD
Up to 24 x 2.5” Hot Plug SATA/SAS/NVMe Up to 32 E3.S NVMe
Rear: Up to 2 x 3.5” Hot Plug SAS/SATA HDDs Rear: Up to 4 x 2.5” Hot Plug SAS/SATA or NVMe HDDs, Up to 4 x E3.S NVMe
Internal: 2 x M.2 (BOSS) Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
Bandwidth: 12Gb/6Gb SAS

PCIe Storage Up to 24 NVMe (Up to 12 NVMe Direct) Up to 32 E3.S NVMe Direct

Storage Controller HW RAID: PERC 9/10 - HBA330, H330, H730P, H740P, H840, 12G SAS HBA HW RAID: PERC11, PERC12
Chipset SATA/SW RAID( S150): Yes HW NVMe RAID: PERC11, PERC12
Chipset SATA/SW RAID: Yes

Network 2 x 1GbE; 2 x 10GbE BT; 2 x 10GbE SFP+; 2 x 25GbE SFP28 LOM Riser + 1 x OCP 3.0

PCIe slots Up to 4 PCIe: 2 PCIe Gen3; 2 PCIe Gen4 Up to 8 x PCIe x16 slots, 4 x PCIe Gen5, 4 x PCIe Gen4

GPU Up to 4 Single-Wide GPU(T4); Up to 1 Full-Height FPGA Up to 3 500W DWFL (Target 700W) or up to 6 150W SWFL

Integrated Ports Front: 2 ports (USB 2.0), 1 (micro-USB, iDRAC Direct) Front: 1 port (USB 2.0), 1 (iDRAC Direct micro-USB)
Rear: 2 ports (USB 3.0) Rear: 1 port (USB 3.0) + 1 port (USB 2.0)
Internal: 1 port (USB 3.0)

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power 16G iDRAC Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power
Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0 Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0

High Availability Hot Plug Hard drives, PSUs, IDSDM, Boot Optimized Storage Subsystem (BOSS) Hot Plug/RAID controlled drives, Fans, PSUs, BOSS-N1 (2 x M.2 NVMe) for boot

Power Supplies 495W, 750W, 1100W, 1600W 700W, 800W -48Dvc, 1100W, 1100W -48Vdc 1400W 1800W, 2400W

Dimensions H x W x D: 2U x 434mm (17.08 in) x 681.75 mm (26.84 in) H x W x D: 2U x 434mm (17.08 in) x 736.29 mm (28.98 in)

Form Factor 2U Rack Server 2U Rack Server

Reimagine IT Possibilities…
What’s new with our R660/R760 portfolio?

Workloads Data center standardization High density virtualization Online transaction processing
Database analytics Virtual desktop infrastructure In-memory database

Provides performance and versatility as needed to

R660 : 1U/2S
address your most demanding applications

Denser 2 socket
Max Performance Air cooled at peak Gain agility
Extract value faster performance Can be deployed for
from collected data Take advantage of maximum scalability
with high- configurations with in vSAN (HCI)
R760: 2U/2S performance high performance environments or for
processors, GPUs, CPUs in an air- maximum application
Maximum configuration flexibility next-generation cooled chassis performance in bare
storage for metal environments
demanding with the new
workloads like AI/ML PERC12
PowerEdge R760 TARGET WORKLOADS

Support for up to 28 Drives Support for high-speed and memory capacity

• 24 NVMe direct-attached drives • Up to 32 DDR5 DIMMs
• Gen5 NVMe* & SAS4 support • Up to 4800 MT/s (1DPC) or 4400 MT/s (2DPC)
High Performance
• Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
Scale-Out Databases
• Next-gen hardware NVMe RAID Architect for growth and scalability

MAINSTREAM
using high core count CPUs with the
latest DDR5 memory technology, high-
bandwidth networking and Gen5 based
NVMe storage.

Next Level of Virtualization

8TB of memory combined with 112
cores of the latest generation Intel CPU
enables high-density virtualization in a
2 Socket Capable Support for GPU Flexible I/O 2S server..
• Up to two 4th Generation Intel® Xeon® • 2 x 300W (DW) or 6 x • Up to 8 x PCIe Slots
Scalable processors with up to 56 75W (SW)
• Optional 2 x 1GbE LOM + 1 x OCP 3.0 slot
cores per processor
Accelerated AI Training
• High-bandwidth memory CPUs With the latest Gen5 PCIe enabled
NVIDIA GPUs and NVMe drives
designed to offer the highest
• Smart Cooling throughput on the largest datasets,
customers benefit from reduced
• Direct Liquid Cooling training cycles and faster AI
• Designed for growing scale-out solutions and air-cooled support deployments.
• Industry-leading manageability and security
 Technical Specifications – R740/XD, R750 & R760
Features PowerEdge R740/XD PowerEdge R750 PowerEdge R760
CPU Up to two 2nd Generation Intel® Xeon® Scalable processors Up to two 3rd Generation Intel® Xeon® Scalable processors with up to 40 Up to two 4th Generation Intel® Xeon® Scalable processors with up to 56 cores
with up to 28 cores per processor cores per processor per processor
Support for up to 2 x 205W proc Support for up to 2 x 270W processors Support for up to 2 x 350W processors
Direct Liquid Cooling support Direct Liquid Cooling support

Memory Up to 24 x DDR4 RDIMM, LRDIMM, Up to 32 x DDR4 RDIMMs/LRDIMMs (8TB + Optane Persistent Memory 200 Up to 32 x DDR5 RDIMMs
Optane Persistent Memory 100 (Apache Pass): Yes Series) DIMM Speed: Up to 4800 MT/s
NVDIMM: Yes Optane Persistent Memory 200 Series (Barlow Pass): Yes
DIMM Speed: Up to 2933 MT/s DIMM Speed: Up to 3200 MT/s corrected

Storage (Chassis options) Up to 12 x 3.5” SAS/SATA HDDs Up to 12 x 3.5” SAS/SATA HDDs Up to 12 x 3.5” SAS/SATA HDDs
Up to 24 x 2.5” SAS/SATA HDD/SSDs Up to 24 x 2.5” SAS/SATA HDD/SSDs or NVMe SSDs with universal slots Up to 24 x 2.5” SAS/SATA HDD/SSDs
Up to 24 x NVMe SSDs Up to 16 x 2.5” SAS/SATA HDD/SSDs + 8 x 2.5” NVMe SSDs Up to 16 x 2.5” SAS/SATA HDD/SSDs + 8 x 2.5” NVMe SSDs
Internal: IDSDM and BOSS (2 x M.2) for boot Up to 4 x rear 2.5” SAS/SATA HDD/SSDs or NVMe SSDs Up to 4 x rear 2.5” SAS/SATA HDD/SSDs or NVMe SSDs
Bandwidth:12Gb/6Gb SAS, SATA 6Gb Rear BOSS-S2 (2 x M.2 SATA) for boot Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
Internal: IDSDM or USB Internal: IDSDM or USB
Bandwidth: 12Gb/6Gb SAS, SATA 6Gb Bandwidth: Up to 32Gb NVMe/24Gb SAS/6Gb SATA

Storage Controller HW RAID: PERC 9 & PERC 10 (dual PERC option) HW RAID: PERC 10.5 & 11 (dual PERC option) HW RAID: PERC 11 & 12 (dual PERC option)
Chipset SATA/SW RAID: Yes HW NVMe RAID HW SAS4/SATA/NVMe RAID
Chipset SATA/SW RAID: Yes SW RAID: Yes

Network 1 NDC 4 x 1GbE, 4 x 10GbE, 2 x 10GbE + 2 x 1GbE, or 2 x 2 x 1GbE LOM + 1 x OCP 3.0 Optional 2 x 1GbE LOM, 1 x OCP 3.0
25GbE

PCIe Slots Up to 8 x PCIe Slots Gen3 (4 x16) Up to 8 x PCIe Slots Gen4 (up to 6 x16), SNAP I/O option Up to 8 x PCIe Slots (Gen4 / Gen5), SNAP I/O option

3 x DW or 6 x SW 2 x DW or 6 x SW 2 x DW or 6 x SW
GPU
Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB port, 1 x USB 3.0 (optional), Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB port, 1 x USB 3.0 (optional), 1
Integrated Ports Front: 2 x USB 2.0, 1 x iDRAC Direct micro-USB port, 1 x
x VGA
USB 3.0 (optional), 1 x VGA 1 x VGA
Rear: 1 x Dedicated iDRAC Ethernet port, 1 x Serial, 2 x USB Rear: 1 x Dedicated iDRAC Ethernet port, 1 x Serial (optional), 1 x USB 3.0, 1 Rear: 1 x Dedicated iDRAC Ethernet port, 1 x Serial (optional), 1 x USB 2.0,
3.0, 1 x VGA Internal USB x USB 2.0, 1 x VGA (optional for Liquid Cooling configurations) 1 x USB 3.0, 1 x VGA (optional for Liquid Cooling configurations)
Internal USB Internal: USB (optional)

iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service iDRAC9, iDRAC Direct, iDRAC RESTful API with Redfish, iDRAC Service
System Management iDRAC9, iDRAC Direct, iDRAC RESTful with Redfish, Quick
Module, Quick Sync 2 wireless module, OpenManage Enterprise and Plugins
Sync 2 wireless module (optional), OpenManage Enterprise Module, Quick Sync 2 wireless module, OpenManage Enterprise and Power
and Power Manager, OpenManage Mobile Manager, OpenManage Mobile (Power Manager, SupportAssist, Update Manager), OpenManage Mobile

High Availability Hot Plug/RAID controlled drives, PSU, Hot-plug fans Hot Plug/RAID controlled drives, PSU, Hot-plug fans. Hot-plug BOSS Hot Plug/RAID controlled drives, PSU, Hot-plug fans. Hot-plug BOSS

Power Supplies AC (Platinum): 495W, 750W, 1100W, 1600W, 200W, 2400W, AC (Platinum): 800W, 1400W, 2400W AC (Platinum): 800W, 1400W, 2400W
AC (Titanium): 750W AC (Titanium): 1100W AC (Titanium): 700W, 1100W, 1800W, 2800W
LVDC @-48VDC Input: 1100W LVDC @-48VDC Input: 1100W LVDC @-48VDC Input: 1100W

Dimension H x W x D: 86.8mm x 482mm x 737.5mm H x W x D: 86.8mm x 482mm x 758mm H x W x D: 86.8mm x 482mm x 758mm

Form Factor 2U Rack Server 2U Rack Server 2U Rack Server

Reimagine IT Possibilities…
What’s new with our AMD 1 socket portfolio?

Workloads Data analytics Software defined storage

Dense Virtualization

Greater memory footprint with outstanding

performance per dollar invested.
R6615 : 1U/1S

Most dense 1S offer

Wise Investment More virtual Increased
With one AMD machine density scalability
EPYCTM 4th gen Packed with 50% Store more data per
enables DDR5 more CPU cores and server with 33% more
R7615: 2U/1S memory, PCIe Gen 5 supports up to 6 E3.S drives and save
all in an air-cooled GPUs for VDI precious data center
Maximized PCIe & Storage and smaller footprint. consolidation. floor space.
 PowerEdge R6615 TARGET WORKLOADS

MAINSTREAM OPTIMIZED
The only socket you need
• Powered by one 4th Generation AMD I/O and connectivity
EPYCTM processor with up to 96 cores per processor • Up to 3 x PCIe slots (up to 2 x Gen5) Virtualization
• OCP 3.0 for network cards
• Up to 12 x DDR5 RDIMMs (3TB max) Improved TCO with VM density and
SQL performance improvements

HCI
High parallelism for low latency on
ROBO VxRail and Dense Azure
Stack HCI

Flexible storage
• Up to 4 x 3.5" SAS/SATA or SSD NFV
• Up to 10 x 2.5" SAS/SATA, SSD; or NVMe
• Up to 14 x E3.S Hot Plug NVMe OpenStack Ready Architecture
• HW NVMe RAID applicable for Telco
• Internal BOSS-N1 (2 x M.2 NVMe) for boot

• Smart Cooling
• Direct Liquid Cooling (DLC) Support
• Industry-leading manageability and security
Technical Specifications – R6515, R6615
Features PowerEdge R6515 PowerEdge R6615

CPU One 2nd or 3rd Generation AMD EPYC™ processor with up to 64 cores per processor One 4th Generation AMD EPYC™ processor with up to 96 cores per processor
Up to one 280W (cTDP) Target up to 400W (cTDP)

Memory DDR4: Up to 16 x DDR4 RDIMM, LRDIMM (2TB) DDR5: Up to 12 x DDR5 RDIMM (3TB)
DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s

Storage (Chassis options) Up to 4 x 3.5” Hot Plug SAS/SATA HDDs Up to 4 x 3.5” Hot Plug SAS/SATA HDDs
Up to 10 x 2.5” Hot Plug SAS/SATA/NVMe Up to 12 x 2.5” (10 Front + 2 Rear) Hot Plug SAS/SATA HDD/SSD’s or NVMe
Up to 8 x 2.5” Hot Plug SAS/SATA SSD’s Up to 14 x E3.S Hot Plug NVMe CPU Direct or 16 x E3.S Hot Plug NVMe with Dual Controllers
Internal: Option 2 x M.2 (BOSS) Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
Bandwidth: 12Gb/6Gb SAS

PCIe Storage Up to 10 NVMe Direct Up to 14 E3.S NVMe Direct or 16 x E3.S Hot Plug NVMe with Dual Controllers

Storage Controller HW RAID: PERC 9/10 - HBA330, H330, H730P, H740P, H840, 12G SAS HBA HW RAID: PERC11, PERC12
Chipset SATA/SW RAID (S150): Yes HW NVMe RAID: PERC11, PERC12
Chipset SATA/SW RAID: Yes

Network 2 x 1GbE LOM + 1 x OCP 3.0; 2 x 10GbE BT; 2 x 10GbE SFP+; 2 x 25GbE SFP28 LOM Riser + 1 x OCP 3.0

PCIe slots Up to 2 PCIe: 1 PCIe Gen3; 1 PCIe Gen4 Up to 3 x PCIe x16 slots, 2 x PCIe Gen5, 1 x PCIe Gen4

GPU Up 2 Single-Wide GPU (T4) Up to 3 75W LP or 2 150W FH/HL

Integrated Ports Front: 1 ports (USB 2.0), 1 (micro-USB, iDRAC Direct) Front: 1 port (USB 2.0), 1 (iDRAC Direct micro-USB)
Rear: 2 ports (USB 3.0) Rear: 1 port (USB 3.0) + 1 port (USB 2.0)
Internal: 1 port (USB 3.0)

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power 16G iDRAC Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power
Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0 Manager, SupportAssist, and Update Manager). iDRAC Direct, Quick Sync 2.0

High Availability Hot Plug Hard drives, PSUs, IDSDM, Boot Optimized Storage Subsystem (BOSS) Hot Plug/RAID controlled drives, Fans, PSUs, BOSS-N1 (2 x M.2 NVMe) for boot

Power Supplies 550W, 700W 700W, 800W, 1100W, 1100W -48Vdc, 1400W, 1800W

Dimensions H x W x D: 1U x 606.5mm (23.9”) or 657.3mm (25.9”) H x W x D: 1U x 434mm (17.08 in) x 736.29 mm (28.98 in)

Form Factor 1U Rack Server 1URack Server

 Monolithic
Accelerate •
•
XR7620
450mm 2U, 2S Intel® Xeon® Scalable Processors
Supports 2 x 300W GPUs for AI at Edge

anywhere • GPU and CPU-optimized configurations to handle

multitude of edge-use cases
• -5C to 55C operating temperature

XR5610
• 400mm class 1U, 1S
• Dell’s ‘built-for-the-edge’ Intel® Xeon® Scalable Processor
server portfolio • Right-sized for on-site dedicated workloads
• Telco-optimized configuration with time & sync
• Short-depth to fit in field card available
• -5C to 55C operating temperature
cabinets & racks (<19”)
• Front-facing I/O to make Multi-node XR4000
servicing in tight spaces • 2U multi-node with Intel® Xeon® D (Dell 1st)
easier for field engineers • Dell shortest-depth server at 350mm
• Nano witness-node allows for VM-cluster in
• Shock, vibration, dust, and single box
• Rackable, stackable, and wall-mountable for
thermally rated for harsh and ultimate deployment flexibility
unpredictable edge • -5C to 55C operating temperature

environments (MIL/NEBS)
XR8000
• 430mm 2U multi-node with 1S Intel® Xeon® Scalable
• Dell ecosystem-enabled with and Xeon Edge Enhanced processor options
iDRAC • Telco-optimized for DU and CU RAN deployments
• Extensible to multitude of enterprise edge use cases
40 of 12 © Copyright 2021 Dell Inc.
• -5C to 55C operating temperature
Enterprise Edge Server Ecosystem (16G)
Heavy Compute/Storage Latency Reduction Workload Consolidation Dedicated Workloads Translation Data Creation

R A C K S E R V E R S E D G E S E R V E R S
T r a d i t i o n a l H a r d e n e d

R 7 6 0 X R 8 0 0 0 X R 5 6 1 0 GW5200

X R 4 0 0 0
R 7 6 2 5 X R 7 6 2 0
GW3200
XR12 XR11
R 6 6 0
R 7 6 1 5

R 6 6 2 5

R 6 6 1 5
R 5 5 0 / R 4 5 0 R 3 5 0 / R 2 5 0 T 3 5 0 / T 5 6 0

IoT/ Devices

Inferencing PoS
CDN
Public DC
5G CSP Automation VR

MEC Virtual Machine

VDI

Private DC
Core Near Edge Edge Far Edge

iDrac/OpenManage
Dell APEX Dell Edge Solutions Dell Frontier
Telecom Server Ecosystem
uCPE/MEC DU/CU (VRAN) C-RAN/UPF 5GSA OSS/BSS IaC/WebScale

N E W – T E L C O R A C K S E R V E R S C - S E R I E S
XR8000

XR4000 R 7 6 2 5

XR7620 R 7 6 0
XR5610 R 7 6 0 x s C 6 5 2 5
R 7 6 1 5
S p e c i a l i z e d – E D G E & T E L C O R 6 6 2 5
R 6 6 0
R 6 6 0 x s
R 6 6 1 5 C 6 6 2 0
X R 1 1
X R 1 2

Private LTE Integrated

URLLC

NVMe/TCP eBoF NEBS Unified NVMe/TCP Converged

switching
5GC XaaS
DU CU UPF
eMBB MMTC

RU CSR
vEPC vIMS IT
MEC vCDN PGW

eNB | gNB X-Haul

OSS & BSS
Service Edge Far Edge Edge Core
AIOps
As-a-Service Network Network- LoB Network-IT-LoB
Enterprise Edge Disaggregated RAN Distributed Edge Distributed NFV Operations

Baremetal
Outdoor / Mounting Power Efficiency Modular Composable Services
Reimagine IT Possibilities…
Dell Technologies’ most versatile edge server

Workloads VDI Machine vision Video surveillance

vSAN / VM Point-of-sale Data compression

XR4000: 2U 4-Node Edge Server

Experience ultimate flexibility for your edge

deployments with Dell’s shortest-depth server

New Nano Server Multi-node design Purpose built for

Rackable chassis for rack-mounted deployments Create a self- XR4000 utilizes a the edge
contained 2-node unique sled design, Small but mighty this
vSAN cluster in a offering up to 4 totally server can handle
footprint not much independent server temp ranges from
larger than a shoebox nodes in a single 2U -5C to 55C and is
with dell Nano chassis rated to MIL 810H
Witness Server and NEBS Level 3
included in-chassis
Stackable flex mount chassis for everywhere else
PowerEdge XR4000 TARGET WORKLOADS

Flexible Configuration Options Support for 2.1-node vSAN

• Storage, Networking, and Compute-optimized • Embedded NPU running ESXi or Linux Retail
• Expand as needed with sled-based architecture • GPU-ready configurations
Perfect for POS, Store of the Future,
IoT, AI Inferencing, and many others

EDGE / TELCO
Military
Highly portable and light enough for
single-person carry. Hardened for
dusty, hot/cold operations

MIL 810H, 461G, 901E, 1474E

rated (limited configurations)

Single Socket 3rd Generation Intel® Intelligent Filtered Bezel Flexible Mounting Options
Xeon® D • Secure Locking Bezel • Multiple systems securely stack
Intel® Xeon® D processor, up to 20C per • VESA bracket compatible
Manufacturing
• Filter monitored by iDRAC
node • DIN Rail adapter option
Ideal for machine aggregation, VDI,
• Up to 4 discrete servers in a single 2U chassis AI inferencing, OT/IT translation,
industrial automation, ROBO, and
• -5C to 55C operating temperature more
• Short-depth 350mm from ear-to-rack
• Front and Rear I/O options
Technical Specifications – XR4000
Features PowerEdge XR4000
CPU 3rd Generation Intel® Xeon® D processors
Up to 20 cores at 120W

Memory Up to 4 x DDR4 RDIMMs/LRDIMMs

DIMM Speed: Up to 3200 MT/s
Minimum 1DPC per channel

Storage (Chassis options) 4 x M.2 NVMe (1U)

12 x M.2 NVMe (2U)
Up to 3.84TB capacity Read Intensive SSD drives (for general storage use)
800GB capacity Mixed Use SSD drives (for vSAN cache)

Storage Controller BOSS-N-1 (2 xM.2 NVMe)

Network 4 x 10GbE or 4 x 25 GbE LOM

PCIe slots 2 slots x16 PCIe Gen 4; up to 240W

GPU 2 x 300W (DW) or 4 x 150W (SW)

Integrated Ports iDRAC rj45 & Micro USB

2 x USB
Mini DP

System Management iDRAC Enterprise, Datacenter license options; OpenManage Enterprise and Plugins (Power Manager, SupportAssist, and Update Manager). iDRAC Direct

High Availability Hot plug redundant PSUs

Power Supplies 2 x 60mm – 1400W MM AC (110v & 220v) or 1100W -48vDC

Dimensions H x W x D: 2U x 434mm x 355mm (2U x 267mm x 355mm)

Form Factor 2U Rack Server

Operating Environments -5C to 55C (restricted configs)

Certs and Tests MIL-STD (810H, 461G, 901E, 1474E) and NEBS 3 (GR3108 Class 1, GR-1089, GR-63)
 Dell Edge Gateway 5200 TARGET WORKLOADS

Manufacturing
Security
Rich Storage
• TPM 2.0 Simplify and automate data
• 2 x 2.5" SATA collection at every stage of the
• Intel AMT
production cycle

EDGE / TELCO
Front accessible I/O and
Adaptive uFM module Telecom
Intel 9th Gen – Quad Core • RS-232/422/485
Accelerate innovation and revenue
• 3 x GbE growth with new services
• Intel Core-i (i3, i5 and i7)
• 3 x USB 3 and 3 x USB 2
• Up to 64GB DDR4 memory
• 2 x DP++/DVI/VGA
• 4 x Serial COM
Expansion • 8-ch DI Retail
• CANbus • 8-ch DO
Personalize customer experience
• 2 x GbE PoE out with data insights
• 2 x Isolated Serial
COM
• 2 x Isolated GbE
• DIO
Smart Cities
• 0°C to 60°C operating temperature
Improve quality of life by increasing
• Compact, Fan-less and Rugged Design the city’s efficiency
• WiFi-6E, Bluetooth 5.2 and Certified Dual Nano SIM 4G & 5G options
• OEM ready options
Technical Specifications – PC 5000, EGW5200
Features Embedded PC 5000 Edge Gateway 5200
CPU Core i3, Core i5, and Core i7-6820EQ or Celeron Core i3-9100TE, Core i5-9500TE, and Core i7-9700TE

Memory 4GB, 8GB, 16GB to 32GB DDR4 2 x DDR4 SO-DIMM socket, supporting up to 32GB DDR4 per socket, for a total of 64GB

Storage (Chassis options) 500GB & 1TB HDD 64GB, 128GB, 256GB, 512GB, 1TB, 2TB 2.5” SSD (Max: 4TB, 2+2)
32GB, 64GB & 128GB SSD
Display 1 x HDMI 2 x DP++
1 x VGA 1 x DVI-D
2 x DP 1 x VGA
Ethernet 2 x Gigabit Ethernet: 2 x RJ-45 3 x Intel GbE (2 x i225 + i219LM PHY, iAMT supported on i5 and i7 CPUs)

Serial Ports 3 x COM Ports 2 x COM Ports (RS-232/422/485)

2 x COM Ports (RS-232)
DI/O N/A 8-ch DI and 8-ch DO

USB 4 x USB 3.0 6x external USB ports (2 x USB 3.1 Gen 2, 1 x USB 3.1 Gen 1, 3 x USB 2.0), one internal USB 2.0
4 x USB 2.0 port
Audio Mic-in, Line-in, Line-out Line-out, mic-in
Mini PCIe 1 x full size (USB 2.0 + PCIe), used for WiFi by default
M.2 2 PCI/PCIe slots: riser card options: 2 x PCI, 1 x PCI 1 x socket 2, key B+M or B, 1 x 2280/3042 (USB 3.1 + SATA 6 Gb/s + 2 x PCIe)
+ 1 x PCIe x 16 or 2 PCIe x8
Power Supply Nominal input 24V DC (12-26V). Also accepts Dell AC DC Input 12–24 VDC (±10% tolerance) - Standard
adapter, 180W with locking plug AC Input Optional: 180 W, 60 W (for PoE) external AC/DC adapter
Wireless Wi-Fi IEEE 802.11n WiFi-6E
Bluetooth LE Bluetooth 5.2
WWAN 3G or LTE Dual NanoSIM (exterior): 4G & 5G certified
GNSS (GPS)
Operating Environment 0°C to 60°C, with airflow 0.7 m/s 0°C to 60°C , with airflow 0.6 m/s
Environmental Certs and Tests ASTM-D4169-04, Random Operational Vibration, 0.52grms MIL-STD-810G METHOD 514.6 category 4 - common carrier (US highway truck vibration exposure)
MIL-STD-810G, Method 514.6, Procedure 1, Cat 4 IEC 60068-2-27, half-sine pulse test parameters
40G, MIL-STD-810G, Method 514.7, Procedure 1 (Shock) 20G, MIL-STD-810G METHOD 516.6 Table 516.6-II, sawtooth pulse test parameters
Dust: IP30; EMC: CE, FCC, and ICES; Safety: IEC/EN/UL/CSA 63268-1
Dimensions 246 (W) x 107 (D) x 270 (H), 5.5 KG 211(W) x 240(D) x 86(H) mm, 5.2 Kg
Mounting Wall Mount, Din Rail Desktop, operational: wall mount
Operating System Options Factory options for Ubuntu Desktop 16.04. Win7 Pro (via Win 10 Pro downgrade license), Win7 Pro Ubuntu Server 20.04
for Embedded Systems (FES7), Win10 Pro, Win10 IoT Enterprise 2015 LTSB, Win Standard Win 10 IoT Enterprise LTSC 2019
Embedded 7 (WES7P & WES7E).
 Dell Edge Gateway 3200 TARGET WORKLOADS

Security
Manufacturing
Rich Storage Simplify and automate data
• TPM 2.0
• M.2 SSD collection at every stage of the
production cycle

EDGE / TELCO
Telecom
Intel Elkhart Lake – Quad
Core Front accessible I/O and Accelerate innovation and revenue
Adaptive uFM module growth with new services
• Intel Atom (x6425RE)
• Up to 32GB DDR4 memory • RS-232/422/485
• CANbus
• 2 x GbE
Optional Expansion
• 4 x USB 3
Retail
• CANbus • 2 x DP++ Personalize customer experience
• PoE out with data insights
• 2 x Serial COM
• 2 x Isolated Serial COM
• 2 x Isolated GbE • 6-ch DI
• DIO • 6-ch DO
• PoE in
• Sensors T, P, RH, GYRO
Smart Cities
• -20°C to 60°C operating temperature
Improve quality of life by increasing
• Compact, Fan-less and Rugged Design the city’s efficiency
• WiFi-6E, Bluetooth 5.2 and Certified Dual Nano SIM 4G & 5G options
• OEM ready options
Technical Specifications – EGW3200
Features Embedded PC 3000 Edge Gateway 3200
CPU Intel Atom Processors E3800 Series Intel Atom (x6425RE)

Memory 4G or 8G DDR3L 1 x DDR4 SO-DIMM socket, supporting up to 32GB DDR4 3200 MHz memory

Storage (Chassis options) 1 x HDD or 1 x SSD m.2 SSD (interposer). 1 x M.2 SSD storage on M.2 Socket 3
500GB & 1TB HDD 64GB, 256GB, 512GB, 1TB M.2 M key 2242
32GB, 64GB & 128GB SSD
Display 1 x VGA 2 x DP++
1 x DP 1.1

Ethernet 2 x Gigabit Ethernet: 2 x RJ-45 1 x 2.5 GbE, 1 x GbE (1 GHz)

Serial Ports 3 x COM Ports 2 x COM Ports (RS-232/422/485)

DI/O N/A 6-ch DI and 6-ch DO

USB 1 x USB 3.0 4 x external USB ports 3.1 Gen 1

4 x USB 2.0
Audio Mic-in, Line-in, Line-out Line-out, mic-in
Mini PCIe 1 x full size 3050, used for WiFi by default
M.2 2 PCI/PCIe slots: riser card options: 2 x PCI, 1 x PCI Socket 1: for module with A/A+E key; Socket 2: for module with B/B+M key; Socket 3: for module with
+ 1 x PCIe x 16 or 2 PCIe x8 M key
Sensor Suite accelerometer, humidity, pressure, temperature

Power Supply Nominal input 24V DC (12-26V). Also accepts Dell AC DC Input 9–36 VDC (±10% tolerance) Standard
adapter, 180W with locking plug AC Input Optional: 120 W and 60 W (for PoE) external AC/DC adapter
Wireless Wifi-4 WiFi-6E
Bluetooth LE Bluetooth 5.2
WWAN 3G or LTE Dual NanoSIM (exterior): 4G & 5G certified
GNSS (GPS)
Operating Temperature 0°C to 50°C -20°C to 60°C , with airflow 0.6 m/s
Certs and Tests ASTM-D4169-04, Random Operational Vibration, 0.52grms MIL-STD-810G METHOD 514.6 category 4 - common carrier (US highway truck vibration exposure)
MIL-STD-810G, Method 514.6, Procedure 1, Cat 4 IEC 60068-2-27, half-sine pulse test parameters
40G, MIL-STD-810G, Method 514.7, Procedure 1 (Shock) 20G, MIL-STD-810G METHOD 516.6 Table 516.6-II, sawtooth pulse test parameters
Dust: IP40, EMC: CE, FCC, and EN61000-6-4/-6-2, Safety: UL, CB by UL
Dimensions 237(W) x 60(D) x 161(H) mm, 2-3 kg 162 (W) x 108 (D) x 60 (H) mm, 1.7 Kg
Mounting Wall, DIN-rail or VESA mounts Wall mount, Optional DIN rail
Operating System Options Microsoft Win7 Pro, Win7 Pro for Embedded Systems, Ubuntu Desktop 16.04. Later 2016: Ubuntu Server 20.04
Windows 10 Pro, Windows 10 IoT Enterprise LTSB Windows 10 IoT Enterprise LTSC 2019
Accelerate insights…
No compromise AI Acceleration

Targeted workloads and verticals, including

Workloads AI - ML/DL Training High-Performance Computing CRISP, Healthcare, CSP, Finance, HPC, Federal,
Academia

Boost insights from your growing data sets with AI

acceleration technology designed for optimal
performance, fastest time-to-value and air-cooled
operations.

Accelerate your Air Cooled Design Massive flexibility

outcomes with AI 6U chassis Scale up capabilities
Powerful AI training supports the highest with choice of NVIDIA
performance with 8 wattage next gen H100 or A100 GPUs,
interconnected NVIDIA technologies with up to 16 drives and 10
H100 GPUs and up to Dell Smart Cooling PCI Gen5 slots
350W CPUs, enabling and multi-vector
faster business cooling
XE9680: 6U/2S
decisions
 PowerEdge XE9680 TARGET WORKLOADS

2 Socket Capable
• Up to two 4th Generation Intel®
Xeon® Scalable processors with up to 56 cores per processor
• 6U air-cooled, up to 35C ambient AI-ML/DL Training
• 1200mm rack capable Support for high-speed and memory capacity Best-performing GPUs enable max

GPU OPTIMIZED
• Up to 32 DDR5 DIMMs performance for AI/ML-training
• Up to 4800 MT/s (1DPC) or 4400 MT/s (2DPC) workloads - especially for large
model training

I/O High-Performance
AI • 10 x 16 PCIe Gen5 slots Compute
Large Model Training • One OCP NIC 3.0 High performance compute,
• 2 x 1GbE LOM higher CPU and GPU core density
per rack enables HPC simulation
modeling

Targeted Verticals

Healthcare, CSP & CRISP, Finance,

Support for up to 16 Drives HPC, Federal, Research/Universities
GPU Optimized
• Up to 8 x SAS/SATA/NVMe Gen4 or 16x E3.S
• NVIDIA 8 x H100 SXM5 700W 80GB
• Rear Hot-Plug BOSS N-1 (2 x M.2 MVNe) for
GPUs
boot (optional)
-or-
• SW RAID/PERC12 support • NVIDIA 8 x A100 SXM4 500W 80GB
GPUs
• Full NVLINK interconnectivity
Technical Specifications – XE8545, XE8640, XE9680
Features PowerEdge XE8545 PowerEdge XE8640 PowerEdge XE9680
CPU Up to two 3rd Generation AMD EPYC™ processors with up to Up to two 4th Generation Intel® Xeon® Scalable processors with up to Up to two 4th Generation Intel® Xeon® Scalable processors with up to
64 cores per processor 56 cores per processor, 56 cores per processor
Support for up to 2 x 280W processors Support for up to 2 x 350W processors Support for up to 2 x 350W processors

Memory 16x or 32 x DDR4 Up to 32 x DDR5 RDIMMs Up to 32 x DDR5 RDIMMs

DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s DIMM Speed: Up to 4800 MT/s

Storage (Chassis options) Up to 10x 2.5” Hot Plug SAS/SATA or Up to 8 E3.S Gen5 NVMe or SAS/NVME 2.5” SSDs Up to 16 E3.S Gen5 NVMe or 8 2.5” SAS/NVMe SSDs
up to 8x NVMe BOSS-N1 (2 x M.2 NVMe) for boot Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
BOSS

Storage Controller S1.5, H745, H755 PERC12, SW RAID PERC12, SW RAID

Network Optional OCP NIC 3.0, Optional OCP NIC 3.0, Optional OCP NIC 3.0,
Fixed 2 x 1GbE LOM Optional 2 x 1GbE LOM Optional 2 x 1GbE LOM

PCIe slots 1 x PCIe Gen4 LP (x16)

4 x PCIe Gen5 Full Height (x16) 10 x PCIe Gen5 Full Height (x16)
1 x PCIe Gen4 FH (x16)
1 x PCIe Gen4 FH (x16) or 2 x PCIe Gen4 FH (x8)

GPU 4 x A100 GPUs with NVLink. Options: 40GB/400W or

4 x H100 NVIDIA 700W SXM5 NVLINK GPUs
8 x H100 NVIDIA 700W SXM5 NVLINK GPUs
80GB/500W 8 x A100 NVIDIA 500W SXM4 NVLINK GPUs

Integrated Ports Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA
Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port, Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port, VGA Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port, VGA
VGA

System Management iDRAC9 Enterprise, Datacenter license options; iDRAC9 Express (base), Enterprise, Datacenter Full Support; Open iDRAC9 Express (base), Enterprise, Datacenter Full Support; Open
OpenManage Enterprise and Plugins (Power Manager, Manage Enterprise and Plugins (Power Manager, SupportAssist, and Manage Enterprise and Plugins (Power Manager, SupportAssist, and
SupportAssist, and Update Manager) iDRAC Direct, Quick Update Manager) iDRAC Direct Update Manager) iDRAC Direct
Sync 2.0

High Availability Hot Plug/RAID controlled drives, BOSS, PSUs Hot Plug/RAID controlled drives, BOSS-N1, PSUs Hot Plug/RAID controlled drives, BOSS-N1, PSUs

Power Supplies 2 + 2 2400W Redundant Hot Plug 4 x 2800W Titanium 208-240Vac PSUs with 3+1 Redundancy 6x 2800W Titanium 208-240Vac PSUs with 5+1 Redundancy

Thermals Air Cooled Up to 35C Air cooled via internal Liquid Assist Air Cooling up to 35C Air Cooled up to 35C

Dimensions H x W x D: 4U x 477mm x 810mm H x W x D: 4U x 482mm x 866mm (1070mm Rack Compliant) H x W x D: 6U x 482mm x 1001mm (1200mm Rack Compliant)

Form Factor 4U Rack Server 4U Rack Server 6U Rack Server

Accelerate innovation …
Dense, smart acceleration

Targeted workloads and vertical,

AI & ML/DL Training
Workloads Modeling & Simulation
HPC & Super Computing including Healthcare, Life Sciences,
Academia

Unlock insights with purpose-built performance in

a highly dense, smart cooled server for AI,
removing traditional computational boundaries of
real-time insights

Dense Acceleration Efficiently cooled Flexible I/O

Optimized 4-way Direct liquid cooled Maximize
XE9640: 2U/2S interconnected Intel CPUs and GPUs operations with 4
GPUs drive maximizes PCIe Gen5 slots for
demanding ML/DL performance, power 1:1 mapping with
training and simulation utilization efficiency GPU for continuous
modeling in 2U and lowers TCO utilization
 PowerEdge XE9640 TARGET WORKLOADS

Dual Socket
• Up to two 4th Generation Intel® Xeon® Scalable processors with up to
56 cores per processor
• Direct Liquid cooled CPUs & GPUs AI-ML/DL Training
• 1200mm rack capable Support for high-speed and memory

GPU OPTIMIZED
Best performing GPUs enable max
capacity performance/$ for AI/ML Training
• Up to 32 DDR5 DIMMs workload
• 4800 MT/s (1DPC) or 4400 MT/s (2DPC)

Diverse GPU I/O High-Performance

Offerings • Up to 4 x 16 PCIe Compute
Gen5 slots Higher CPU and GPU core density,
Liquid Cooled to
Direct Liquid Cooled • OCP 3.0 for
network cards • Lower TCO
• Maximize Rack Utilization
• Enable Green Data Centers

Targeted Workloads and

GPU Flexibility & Optimization Verticals
• 4x NVIDIA 700W SXM GPUs Workloads: ML/DL Training &
Support for up to 8 Drives -or- Simulation Modeling
Verticals:: Finance, Healthcare,
• NVMe U.2 Gen4 or E3.S Gen5 drives • 4x Intel Data Center GPU Max Series 1550 600W Higher-Ed, Fed, Retail, CSP &
• Hot-Plug BOSS N-1 for boot (optional) OAM GPUs CRISP, Super Computing
• Quad connected NVLink or XeLink capability
across GPUs
Technical Specifications – XE8545, XE9640
Features PowerEdge XE8545 PowerEdge XE9640
CPU Up to two 3rd Generation AMD EPYC™ processors with up to 64 Up to two 4th Generation Intel® Xeon® Scalable processors with up to 56 cores per processor
cores per processor Support for up to 2 x 350W processors
Support for up to 2 x 280W processors

Memory 16x or 32 x DDR4 Up to 32 x DDR5 RDIMMs

DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s

Storage Up to 10x 2.5” Hot Plug SAS/SATA or up to 8x NVMe Up to 8 E3.S Gen5 NVMe or 4 2.5” NVMe Gen4 SSDs
BOSS Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot

Storage Controller S1.5, H745, H755 SW RAID

Network Optional OCP NIC 3.0, Optional OCP NIC 3.0,

Fixed 2 x 1GbE LOM Optional 2 x 1GbE LOM

PCIe slots 1 x PCIe Gen4 LP (x16)

2 x PCIe Gen5 FH (x16)
1 x PCIe Gen4 FH (x16)
2 x PCIe Gen5 LP (x16)
1 x PCIe Gen4 FH (x16) or 2 x PCIe Gen4 FH (x8)

GPU 4 x A100 GPUs with NVLink. 4 x H100 NVIDIA 700W SXM5 NVLink GPUs
Options: 40GB/400W or 80GB/500W or
4 x Intel Data Center Max 1550 600W OAM XeLink GPUs

Integrated Ports Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA
Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA
Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port, VGA
Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage 16G iDRAC Express(base), Enterprise, Datacenter Full Support; Open Manage Enterprise
Enterprise and Plugins (Power Manager, SupportAssist, and Update and Plugins (Power Manager, SupportAssist, and Update Manager) iDRAC Direct
Manager) iDRAC Direct, Quick Sync 2.0

High Availability Hot Plug/RAID controlled drives, BOSS, PSUs Hot Plug/RAID controlled drives, BOSS-N1, PSUs

Power Supplies 2 + 2 2400W Redundant Hot Plug Up to 4 x 2800W Titanium 208-240Vac PSUs with 2+0, 2+1 or 2+2 Redundancy

Thermals Air Cooled up to 35C Direct Liquid Cooled CPUs & GPUs. Air Cooled up to 35C for remaining components.

Dimensions H x W x D: 4U x 477mm x 810mm H x W x D: 2U x 482mm x 930mm

Form Factor 4U Rack Server 810mm (1070mm rack capable) 2U Rack Server (1200mm Rack Compliant. Requires 750mm wide for liquid manifolds)
Accelerate innovation …
Purpose-built performance

Targeted applications and verticals such

Workloads AI - ML/DL Training High Performance Computing as Oil & Gas, Healthcare, CSP,
Finance, HPC, Federal, Academia

Drive demanding AI, HPC and Data Analytics

workloads and power users with optimized compute
and accelerated throughput, to automate analysis into
insights
Accelerate your Air Cooled Design Scale up flexibility
outcomes with AI 4U chassis Increase core
Faster AI training supports the highest capabilities with up to
performance with 4 wattage next gen 4 PCI Gen5 slots,
interconnected NVIDIA technologies with NVIDIA Multi-instance
H100 GPUs and up to Dell Multi vector GPUs and GPU Direct
XE8640: 4U/2S 350W TDP CPUs cooling hybrid Storage for fastest
air/liquid approach data transfers
PowerEdge XE8640 TARGET WORKLOADS

2 Socket Capable
• Up to two 4th Generation Intel® Xeon® Scalable processors Support for high-speed and memory capacity
with up to 56 cores per processor • Up to 32 DDR5 DIMMs AI-ML/DL Training
• 4U air-cooled (LAAC), up to 35C ambient • 4800 MT/s (1DPC) or 4400 MT/s (2DPC)
• Standard (1070mm) rack capable Best-performing GPUs enable max

GPU OPTIMIZED
performance for AI/ML-training
workloads

HPC & AI High-Performance

I/O
• Up to 4 x16 PCIe
Compute
Gen5 slots High performance compute,
• OCP NIC 3.0 higher CPU and GPU core density
per rack enables HPC simulation
• 2 x 1GbE LOM
modeling

Targeted Verticals

Oil & Gas, Finance, Healthcare, HPC,

Support for up to 8 Drives GPU Optimized Fed, Retail, CSP,
Research/Universities
• SAS SSD, or NVMe U.2 or E3.S drives • Nvidia 4 x H100 SXM5 700W
• Rear Hot-Plug BOSS N-1 (2 x M.2 MVNe) for 80GB GPUs
boot (optional)
• Full NVLINK interconnectivity
• SW RAID/PERC12 support
Technical Specifications – XE8545, XE8640, XE9680
Features PowerEdge XE8545 PowerEdge XE8640 PowerEdge XE9680
CPU Up to two 3rd Generation AMD EPYC™ processors with up to Up to two 4th Generation Intel® Xeon® Scalable processors with up to Up to two 4th Generation Intel® Xeon® Scalable processors with up to
64 cores per processor 56 cores per processor, 56 cores per processor
Support for up to 2 x 280W processors Support for up to 2 x 350W processors Support for up to 2 x 350W processors

Memory 16 x or 32 x DDR4 Up to 32 x DDR5 RDIMMs Up to 32 x DDR5 RDIMMs

DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s DIMM Speed: Up to 4800 MT/s

Storage (Chassis options) Up to 10 x 2.5” Hot Plug SAS/SATA or Up to 8 E3.S Gen5 NVMe or SAS/NVME 2.5” SSDs Up to 16 E3.S Gen5 NVMe or 8 2.5” SAS/NVMe SSDs
up to 8x NVMe BOSS-N1 (2 x M.2 NVMe) for boot Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot
BOSS

Storage Controller S1.5, H745, H755 PERC12, SW RAID PERC12, SW RAID

Network Optional OCP NIC 3.0, Optional OCP NIC 3.0, Optional OCP NIC 3.0,
Fixed 2 x 1GbE LOM Optional 2 x 1GbE LOM Optional 2 x 1GbE LOM

PCIe slots 1 x PCIe Gen4 LP (x16)

4 x PCIe Gen5 Full Height (x16) 10 x PCIe Gen5 Full Height (x16)
1 x PCIe Gen4 FH (x16)
1 x PCIe Gen4 FH (x16) or 2 x PCIe Gen4 FH (x8)

GPU 4 x A100 GPUs with NVLink. Options: 40GB/400W or

4 x H100 NVIDIA 700W SXM5 NVLINK GPUs
8 x H100 NVIDIA 700W SXM5 NVLINK GPUs
80GB/500W 8 x A100 NVIDIA 500W SXM4 NVLINK GPUs

Integrated Ports Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA
Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port, Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port, VGA Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port, VGA
VGA

System Management iDRAC9 Enterprise, Datacenter license options; iDRAC9 Express (base), Enterprise, Datacenter Full Support; Open iDRAC9 Express (base), Enterprise, Datacenter Full Support; Open
OpenManage Enterprise and Plugins (Power Manager, Manage Enterprise and Plugins (Power Manager, SupportAssist, and Manage Enterprise and Plugins (Power Manager, SupportAssist, and
SupportAssist, and Update Manager) iDRAC Direct, Quick Update Manager) iDRAC Direct Update Manager) iDRAC Direct
Sync 2.0

High Availability Hot Plug/RAID controlled drives, BOSS, PSUs Hot Plug/RAID controlled drives, BOSS-N1, PSUs Hot Plug/RAID controlled drives, BOSS-N1, PSUs

Power Supplies 2 + 2 2400W Redundant Hot Plug 4 x 2800W Titanium 208-240Vac PSUs with 3+1 Redundancy 6x 2800W Titanium 208-240Vac PSUs with 5+1 Redundancy

Thermals Air Cooled Up to 35C Air cooled via internal Liquid Assist Air Cooling up to 35C Air Cooled up to 35C

Dimensions H x W x D: 4U x 477mm x 810mm H x W x D: 4U x 482mm x 866mm (1070mm Rack Compliant) H x W x D: 6U x 482mm x 1001mm (1200mm Rack Compliant)

Form Factor 4U Rack Server 4U Rack Server 6U Rack Server

Accelerate innovation …
More capable & agile AI compute

AI/ML/DL Training medium to large HPC, VDI, performance Digital Twins, Render farms,
Workloads data sets graphics virtualization

Maximize your results from AI to modeling & simulation

with scale-as-you-grow compute, supporting maximum
flexibility in small density.

Deploy with ease Flexible acceleration Deliver outcomes

Drive traditional and Boost AI outcomes Faster time to results
emerging workloads across a wide range of from application
with a powerful 2U workloads and scale out performance with
R760xa: 2U/2S
server, the latest 4th as business grows with support from up to 4x
Gen Intel Xeon expandable support 350W GPUs, or 12x
processors and air- from AMD, Intel and single-wide GPUs.
cooled design NVIDIA.
 Dell EMC PowerEdge R760xa TARGET WORKLOADS

2 Socket Capable Support for high-speed and memory capacity

• Two 4th Gen Intel® Xeon® Scalable • 32 DDR5 DIMMs
• processors through highest TDP • 4800 MT/s AI-ML/DL Training and
• 2U Mainstream-designed
Inferencing
• Standard (1070mm) rack capable
Flexible accelerator configurations
enable optimal perf/$ AI-ML/DL
Mainstream
workloads together with inferencing
PowerEdge Design
I/O
Supports wide range • Up to 4 x16 350W PCIe
of accelerated Gen5 slots
workloads • OCP 3.0 for network cards High-Performance
Compute
Flexible Infrastructure Higher CPU and GPU core density
to run mixed enable HPC simulation modeling
workloads and scale
GPU Optimized
as needed
• Up to 4x DW or 10x SW PCIe Gen5 GPUs powered
by NVIDIA, Intel and AMD
Support for up to 8 Drives • NVLINK Bridging support enables scaling of memory
Render Farms and
• SAS/SATA/NVMe U.2 or E.3 SSD drives and performance to enhance GPU focused Virtualization
• Hot-Plug BOSS for boot (optional) applications
Higher GPU utilization using multi-
• PERC12 support (SAS4/NVMe) • Multi-Instance GPU (MIG) enabled for multi-tenancy
tenancy to serve multiple users
• Supports entire Dell PowerEdge PCIe portfolio without compromising on density

Air-Cooled to 35C
• Optional DLC for 20% more heat capture

60 Copyright © Dell Inc. All Rights Reserved.

Technical Specifications – R750xa, R760xa
Features PowerEdge R750xa PowerEdge R760xa
CPU Up to two 3rd Generation Intel® Xeon® Scalable processors, up to Up to two 4th Generation Intel® Xeon® Scalable processors, up to
40 cores per processor 56 cores per processor
Support for up to 2 x 270W processors Support for up to 2 x 350W processors

Memory Up to 32 x DDR5 RDIMMs @ 4800

Up to 32 x DDR4 (up to 16 Barlow Pass) 3200 MT/s MT/s

Storage (Chassis Options) Up to 8x 2.5” SAS/SATA SSD -or- NVME Up to 8x 2.5” SAS/SATA/NVMe -or- 6x E3.S Gen5 NVMe SSD
BOSS Rear Hot-Plug BOSS-N1 (2 x M.2 NVMe) for boot

Storage Controller PERC 10.5 for Mid-tier PERC11 + PERC12 (SAS4/NVME)

PERC 11 for High-end (2x performance vs. PERC 10.5)

Network Optional OCP NIC 3.0

2 x1GbE LOM+1 x8 Gen4 OCP 3.0
Optional 2x 1GbE LOM

PCIe slots 2 x16 Gen4 LP PCIe + 2 x8 Gen4 FH PCIe 4 x16 Gen5

(cannot combine with 6x 2.5” NVMe)
FHHL slots

GPU Supports up to 4x Double-Wide 300W GPUs -or- 6x Single-Wide 75W GPUs Up to 4x Double-Wide 350W GPUs -or- up to 12x Single-Wide 75W GPUs
Optional NVLink Bridging Optional NVLink Bridging

Integrated Ports Front: 1x USB 2.0, 1x iDRAC Direct micro-USB + front VGA Front: 1x USB 2.0, 1x iDRAC Direct micro-USB + front VGA
Rear: 1x USB 3.0 + 1x USB 2.0, Dedicated iDRAC port, VGA Rear: 1x USB 3.0 + 1x USB 2.0, Dedicated iDRAC port, VGA

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and
Plugins (Power Manager, SupportAssist, and Update Manager). iDRAC Direct, Plugins (Power Manager, SupportAssist, and Update Manager). iDRAC Direct,
Quick Sync 2.0 Quick Sync 2.0

High Availability Hot Plug/RAID controlled drives, BOSS, PSUs Hot Plug/RAID controlled drives, BOSS-N1, PSUs

Power Supplies 1400W, 2400W Dual PSUs 2400W -or- 2800W

Thermals High performance fans; Air-Cooled to 35C with optional CPU liquid cooling support High performance fans; Air-Cooled to 35C with optional CPU liquid cooling support

Dimensions H x W x D: 2U x 482mm x 895mm (1070mm rack compliant) H x W x D: 2U x 482mm x 875mm (1070mm rack compliant)

Form Factor 2U Rack Server 2U Rack Server

Reimagine IT Possibilities…
What’s new with our R760xd2?

Workloads File and object storage Video streaming

Video capturing & surveillance

More capable & agile storage

solution Meet your growing unstructured data needs with
object storage technology that is easily
configurable, and serviceable.

Save more data Increase flexibility Save on service

With a 7% increase Ability to natively Cut your
in the number of tier 3.5 inch serviceability cost
3.5 inch drives. spinning drives with using our new
solid state NVMe external rail
drives. system.
PowerEdge R760xd2 TARGET WORKLOADS

Support for up to 28 Drives Support for high-speed and memory capacity

STORAGE OPTIMIZED
• 24 + 4 x 3.5" Drives • Up to 16 DDR5 DIMMs
• Up to 2 x U.2 NVMe Direct • 4800 MT/s Object
• Up to 4 x E3.S NVMe Direct
Ideal for massively scalable storage
solutions optimized for cost/GB

File

Balanced core count, memory and

networking to support open market
and vendor optimized file storage

Flexible I/O
2 Socket Capable
• Up to 4 x PCIe Gen4 slots
• Up to two 4th Generation Intel® Xeon® Scalable processors
with up to 32 cores per processor • OCP 3.0 for network cards
• Rear Hot-Plug BOSS N-1 (2 x M.2 NVMe) for
Video surveillance and
• Support for NVIDIA GPUs
boot (optional) analytics
For datacenters that require ample
storage for video surveillance
• Support for latest generation of density optimized 3.5" storage drives applications with the option for in box
• Ability to provide HW options for native in box tiering analytics

• Industry-leading manageability and security

Technical Specifications – R740xd2, R760xd2
Features PowerEdge R740xd2 PowerEdge R760xd2
CPU Up to two 2nd Generation Intel® Core processors with up to 16 cores per processor Up to two 4th Generation Intel® Xeon® Scalable processors with up to 32 cores per processor
Support for up to 2 x 140W processors Support for up to 2 x 185W processors

Memory Up to 16 x DDR4 RDIMMs Up to 16 x DDR5 RDIMMs

NVDIMM: No NVDIMM: No
DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s

Storage (Chassis options) Front: Up to 24 x 3.5” SAS/SATA Front: Up to 24 x 3.5” SAS/SATA HDDs
Rear: Up to 2 x 3.5" SAS/SATA 3.5" or SSD Rear: Up to 4 x 3.5" Universal or Up to 2 x U.2 NVMe Direct or Up to 4 x EDSFF E3.S NVMe Direct

PCIe Storage None Up to 2 x U.2 NVMe Direct

Up to 4 x E3.S NVMe Direct

Storage Controller PERC H740P or HBA330 PERC 11 (H755) or PERC 12 (H965), HBA355i, H465e, H965e, HBA355e or HBA 355

Boot Controller BOSS (internal) Rear Hot Plug BOSS-N1 (2 x M.2 NVMe) for boot

Network 2 x 1GbE LOM + 1 x OCP 3.0 2 x 1GbE LOM + 1 x OCP Mezz 3.0 x8 Gen 4

PCIe slots Up to 2 x PCIe Slots Gen3 Up to 4 x PCIe Slots Gen4 (mix of LP, HL, FL, DW)

GPU None Support for NVIDIA GPUs

Up to 2 x16 FH 70W PCIe 4.0 (A2)
Up to 1 x16 DWFL 180W GPU PCIe 4.0 (A30)

Integrated Ports Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB + front VGA
Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port, VGA Rear: 1 x USB 3.0 + 1 x USB 2.0, Dedicated iDRAC port, VGA
Optional Internal USB Optional Internal USB

System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins
(Power Manager, SupportAssist, and Update Manager). iDRAC Direct (Power Manager, SupportAssist, and Update Manager). iDRAC Direct

High Availability Hot Plug/RAID controlled drives, PSU, IDSDM, BOSS (2 x M.2) Hot Plug/RAID controlled drives, PSU, 3-Tiered Hot Plug Fans, NVME BOSS-N1 (2 x M.2)

Power Supplies 750W, 1100W Dual 15G 60mm PSUs 48Vdc/1100W, 700W,1400W, 1800W

Dimensions H x W x D: 2U x 434mm x 813mm H x W x D: 2U x 434mm x 837mm

Form Factor 2U Rack Server 2U Rack Server

PowerEdge C6620 TARGET WORKLOADS

Support for 16 x NVMe Gen4 Drives

• 4 x NVMe Gen4 drives/compute node
High-Performance
Computing
High compute performance,
higher core/node density per rack
enables HPC, Research,

MODULAR
Rendering, Vectorized and
Advanced Vector Extensions (AVX).
1 3

2 4
Financial analysis /
Flexible I/O
High Frequency Trading
Up to 4 Nodes
• Up to two 4 Generation Intel Xeon Scalable
th ® ® • Up to 2 x PCIe Gen5 slots Medium Duty traditional database &
processors with up to 56 cores per processor • 1 x 16 PCIe Gen5 OCP 3.0 for network cards scale out database with low-medium
local storage
• Memory speed up to 4800 MT/s • SNAP I/O Support

Hyper-Performance
• New PowerEdge C6600 chassis with improved power, thermal capabilities Compute
• Direct Liquid Cooling (DLC) Support HPC requiring 1DPC design for
highest memory performance &
• Industry-leading manageability and security scale out clusters.
Technical Specifications – C6520, C6620
Features PowerEdge C6520 PowerEdge C6620
Chassis C6400 Chassis C6600 Chassis

CPU Up to two 3rd Generation Intel® Xeon® Scalable processors with up to 40 Up to two 4th Generation Intel® Xeon® Scalable processors with up to 56 cores per processor
cores per processor Air and Direct Liquid Cooling support (configuration restrictions apply due to thermal/power
Air and Direct Liquid Cooling support (configuration restrictions apply due limits)
to thermal/power limits)
Memory DDR4: 8 channels/CPU; Up to 16 x RDIMMs and LRDIMMs Up to 16 x DDR5 RDIMMs; 8 channels/CPU
DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s
Intel Optane Persistent Memory 200 series: No

Storage Backplanes: Backplanes:

Up to 24 x 2.5” Options: 1) Direct: SAS/SATA; 2) SAS/SATA with 2 NVMe Up to 16 x 2.5” SAS/SATA
drives Up to 16 x 2.5” all NVMe
Up to 24 x 2.5” all NVMe Diskless configuration
Up to 12 x 3.5” Internal: BOSS-N1 (2 x M.2 NVMe) for boot, HW-RAID and SED
Diskless configuration
Internal: uSD Card, M.2 SATA BOSS 1.0
Storage Controller HW RAID: PERC 10.5 H345/H350 , H745/H750, HBA 345/355i HW RAID: PERC 11.5 - H355, H755, HBA355i; PERC12 – H965i
Chipset SATA/SW RAID: Yes, S150 Chipset SATA/SW RAID: Yes, S160
Network Single port 1GbE LOM Single port 1GbE LOM

PCIe slots 2 x PCIe Gen4 HH/HL slots, x16 (network, storage, AIC), 2 x 16 PCIe Gen5 HH/HL slots, x16 (network, storage, AIC),
1 x16 Gen4 OCP 3.0 slot 1 x 16 PCIe Gen5 OCP 3.0 slot
Integrated Ports Rear ports: 1 x USB 3.0 Rear: 1 x USB 3.0
Micro USB port for iDRAC direct Micro USB port for iDRAC direct
Mini Display Port for video Mini Display Port for video
System Management iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise iDRAC9 Enterprise, Datacenter license options; OpenManage Enterprise and Plugins
and Plugins (Power Manager, SupportAssist, and Update Manager), (Power Manager, SupportAssist, and Update Manager), iDRAC Direct
iDRAC Direct
Accelerators Up to one GPU/FPGA/PAC (up to 75W) Up to one GPU/FPGA/PAC (up to 75W)

Power Supplies 1600W, 2000W AC|DC (Mix Mode), 2400W, 2600W 2400W, 2800W, and 3200W(277Vac available in NA region only)

Dimensions H x W x D: 86.80mm x 448.00mm x 790.00mm H x W x D: 86.80mm x 448.00mm x 790.00mm

Form Factor 2U rack mounted multi-node server 2U rack mounted multi-node server
C6600 Chassis Options
C6400 C6600
No Backplane Chassis
• No front drives; Internal Boot using M.2 Boot Drive
No Backplane No Backplane
• Improved air flow and thermal capability
• HPC, HFT, SaaS/IaaS, Hadoop compute node w/
external HDFS storage

24 x 2.5” All NVMe 16 x 2.5” All NVMe 16x 2.5” All NVMe Backplane Chassis
• Optimized for applications requiring high-speed
storage
• Up to 4 NVMe (Gen4) drives/compute sled; internal
24 x 2.5” SAS | SATA 16 x 2.5” SAS | SATA M.2 boot drive
• vSAN, SDS, HPDA, HCI
16x 2.5” SAS/SATA Backplane Chassis
• Optimized for high performance compute and storage
24 x 2.5” NVMe
• Up to 4 SAS/SATA drives/compute sled; internal M.2
boot drive
• HPC, HPDA, SaaS/IaaS, Financial modelling, HCI,
vSAN
12 x 3.5” SAS | SATA
 PowerEdge MX760c TARGET WORKLOADS

Flexible I/O
• 3 x High throughput, Up to 8 x EDSFF E3.S NVMe Gen5 or
low latency Fab A,B and C 6 x 2.5” SAS/SATA or NVMe Gen4 General Purpose IT,
• Internal BOSS-N1 (M.2 NVMe) for boot
/HW - RAID and SED)
Virtualization,
• PERC12 - H965i NVMe Raid Containerization, Business
Applications
Scalable processor core count,

MODULAR
higher performance memory
configurations, sufficient storage
capacity and networking capabilities

Support for higher-speed

and dense memory capacity Software-Defined Storage
2 Socket Capable • Optimized for 2 DIMMs/channel and Software-Defined
• 32 DDR5 DIMMs
• Up to two 4th Generation Networking
Intel® Xeon® Scalable processors with up to 56 • 4800 MT/s
cores per processor Flexible and richer storage configs
High speed networking support
Redundant IO

Database, Big Data

• Designed for PowerEdge MX7000 Modular chassis Analytics
• Integrated Intel® Built-In AI Acceleration, Next Gen QAT Compute and memory rich
configurations (Structured and
• Industry-leading manageability and security Unstructured DB, In-Memory DB, Big
Data analytics)
Technical Specifications – MX750c, MX760c
Features
PowerEdge MX750c PowerEdge MX760c
Chassis MX7000 MX7000

CPU Up to two 3rd Generation Intel® Xeon® Scalable processors with up to 40 cores per Up to two 4th Generation Intel® Xeon® Scalable processors with up to 56 cores per
processor processor
3 x UPI @ 11.2 GT/s 4 x UPI @ 24 GT/s
Memory DDR4: 8 channels/CPU; Up to 32 x RDIMMs and LRDIMMs Up to 32 x DDR5 RDIMMs; 8 channels/CPU
DIMM Speed: Up to 3200 MT/s DIMM Speed: Up to 4800 MT/s
Intel Optane Persistent Memory 200 series

Storage 6 x 2.5” SAS, SATA, NVMe (Gen4) 8 x E3.S NVMe (Gen5 x4)
Internal: uSD Card, M.2 SATA BOSS 1.5 6 x 2.5” SAS/SATA SSDs or NVMe (Gen4) SSDs
Internal: Internal BOSS-N1 (2 x M.2 NVMe) for boot, HW-RAID and SED
PCIe Storage Up to 6 NVMe 2.5” drives (Direct) Up to 8 EDSFF E3.S NVMe (Direct)

Storage Backplane x 6 Universal Backplane 8 x E3.S NVMe Backplane (Gen5 x4)

x 6 SAS/SATA Backplane x 6 Universal Backplane
x 4 Universal Backplane x 6 SAS/SATA Backplane
x 4 Universal Backplane
Storage Controller S150 Software RAID S150 Software RAID
PERC HBA330 H755 Performance RAID, NVMe RAID
H755 Performance RAID, NVMe RAID H965i Performance RAID, SAS/SATA or NVMe RAID
H745P Performance RAID, internal and external drive connect HBA355i MX mini-mezz, HBA, external drive connect
HBA350i MX mini-mezz, HBA, external drive connect
IO slots and Network Dual Port and Quad Port Mezz 25G, Dual Port FC32G, PCIe Gen4 enabled Dual Port and Quad Port Mezz 25G, Dual Port FC32G, PCIe Gen4 enabled
Up to 2 pair redundant general-purpose switch or pass-through module bays (Fabrics Up to 2 pair redundant general-purpose switch or pass-through module bays (Fabrics A
A and B); redundant pair of storage specific switch bays (Fabric C) and B); redundant pair of storage specific switch bays (Fabric C). Fab B: PCIe Gen5
enabled and Fab C: Gen 4 connection to CPU1

System Management iDRAC9 with Lifecycle Controller, OME-M1.3, OME 3.6 iDRAC9 with Lifecycle Controller, OpenManage Enterprise-Modular 1.3, OME v3.10 &
v3.11 Datacenter license options; OpenManage Enterprise and Plugins (Power
Manager, SupportAssist, and Update Manager)
High Availability Hot Plug/RAID controlled Drives, BOSS-S2 RAID1 (2 x M.2) Hot Plug/RAID controlled drives, NVMe BOSS-N1 RAID 0/1 (2 xM.2)

Power Supplies 3000W AC 3000W AC

Dimensions 257 x 51 x 631.72 mm 257 x 51 x 631.72 mm

Form Factor 7U Chassis, single-width compute sled 7U Chassis, single-width compute sled
Reimagine IT Possibilities…
Open platform, cloud scale servers* designed for Cloud Service Providers

Workloads Cloud/Virtualization Software-Defined Storage Node

Scale-out Database

Delivers leading-edge technology tailored for large-scale,

heterogeneous SaaS, IaaS, and PaaS datacenters
HS5610 : 1U/2S

1U with Cold Aisle config option

Designed for 70% of Powering Choice Tailored to Fit
CSP workloads with Open Configurations that
Broad selection of Intel Ecosystem Options easily scale to support
medium core count Ideal for management cloud service providers
HS5620: 2U/2S CPUs, right-sized across multi-vendor with select components
memory, and a cold systems, Open Server and validated
Flexibility with more storage and aisle serviceable Manager is an open- workloads to minimize
PCIe slots configuration with front source management extra costs and
I/O option built from overhead
OpenBMC™
*Exclusive through the Hyperscale Next program for select customers.
PowerEdge HS5620 Key Features
TARGET WORKLOADS

Optimized for Cloud Service Providers

• Powered by up to two next-generation Xeon Scalable Virtualization
processors, code-named “Sapphire Rapids”
• Single processor configurations available System Management A perfect choice for medium
• Up to 16 x DDR5 RDIMMs (2TB max) • iDRAC or OpenBMC+ businesses exploring the
• Up to 4800 MT/s advantages of software
virtualization

Medium VM
density or VDI
Consider medium VM as an
adaptable option to right size
virtual instances or for VDI
I/O
Flexible Storage instances where accelerator
• Up to 7 I/O slots:
• 8x 2.5" NVMe or SAS/SATA support is not required
• 4x PCIe Gen4 slots
• 8x 3.5” SAS/SATA
• 2x PCIe Gen5 slots*
• 12x 3.5" SAS/SATA + 2x 2.5” SAS/SATA or NVMe (optional)
• 1x OCP 3.0 for network cards
• 16x 2.5” SAS/SATA + 8x 2.5" NVMe
• SW RAID, BOSS-N1, PERC11
• Channel Firmware devices (NIC & NVMe) Software-Defined
Storage Node
Up to 16 drives for software
• MCC TTM based on Intel embargo defined storage deployments
• Early engineering samples and post-RTS efforts to assist (Media/Hadoop/grid)
• CET Engineering lab resources
• CSP Services and Rack Integration
*Gen5 PCIe: upsell
71 Copyright © Dell Inc. All Rights Reserved.
Technical Specifications – R750xs, HS5620
Features R750xs HS5620
CPU Up to two 3rd Generation Intel® Xeon® Scalable processors with up to 32 cores per processor Up to two 4th Generation Intel® Xeon® Scalable processors with up to 32 cores per processor
Up to two 220W TDP Up to two 250W TDP with HW config restriction

Memory Up to 16 x DDR4 3200MT/s RDIMMs (1TB max) Up to 16 x DDR5 4800 MT/s RDIMMs (2TB max)
8 channels, 1 DIMM/channel 8 channels, 1 DIMM/channel
Optane Memory: No Optane Memory: No
NVDIMM: No NVDIMM: No

Storage (Chassis Up to 12 x 3.5” SAS/SATA + optional 2 x 2.5” SAS/SATA/NVMe (rear) Up to 8x 2.5" NVMe/NVMe RAID
Up to 8x 3.5” ChipsetSATA Up to 8x 3.5” SAS/SATA/ChipsetSATA
options) Up to 8x 2.5” NVMe Raid Up to 12x 3.5" SAS/SATA + optional 2x 2.5” SAS/SATA or NVMe (Rear)
Up to 16x 2.5” SAS/SATA + optional 8x 2.5” NVMe (rear) Up to 16x 2.5” SAS/SATA + 8x 2.5" NVMe
Internal: IDSDM or USB, rear BOSS-S2 (2 x M.2) for boot Internal: Internal BOSS-N1 (2 x M.2 NVMe) for boot and USB (optional)
Support for Channel Firmware NVMe SSD

Storage Controller HW RAID: PERC 10.5 & 11 (no dual PERC option) HW RAID PERC11 (no dual PERC option)
PERC 10.5: H345, H745 PERC 11: HBA355i, H355, H755, H755N, HBA355e
PERC 11: HBA355, H755, H755N Chipset SATA/SW RAID: Yes
Chipset SATA/SW RAID: Yes

Network 2 x 1GbE + 1 x OCP 3.0 (x16) Rear: 2 x 1GbE + 1 x OCP 3.0 (x8)
Support for Channel Firmware OCP and PCIe NIC

I/O Up to 5 x PCIe Gen4 (5 x16) Up to 7 I/O: 1 x OCP 3.0 (x) and up to 4 x PCIe Gen4 (x16/x16/x16/x8) + slots 2 x PCIe Gen5 (x16/x16)
Up to 1 x PCIe Gen3 (1 x8) with SNAPI support No SNAPI support

GPU None Up to 2 x Nvidia A2

Integrated Ports Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB, 1 x VGA Front: 1 x USB2.0, 1 x iDRAC Direct micro-USB, 1 x VGA,
Rear: 1 x USB 2.0, 1 x USB 3.0, 1 x Serial (option), 2 x network, 1 x iDRAC network, 1 x VGA Rear: 1 x USB 2.0, 1 x USB 3.0, 1 x Serial (option), 2 x network, 1 x iDRAC network, 1 x VGA

System Management iDRAC9 Express, Enterprise, Datacenter and OME iDRAC9 Express, Enterprise, Datacenter and OME
Open Server Manager (OpenBMC)

High Availability Hot plug hard drives, PSU, fans, and BOSS Hot Plug/RAID controlled drives, PSU, fans, and BOSS.

Power Supplies 600W, 800W, 1100W, -48Vdc/1100W,1400W 600W, 700W, 800W, 1100W, 1400W, 1800W

Dimensions H x W x D: 2U x 434mm x 721mm H x W x D: 2U x 434mm x 721mm

Form Factor 2U Rack Server 2U Rack Server

PowerEdge HS5610 Key Features TARGET WORKLOADS

Cold Aisle Serviceability Optimized for Cloud Service Providers Virtualization / Cloud
• Easily serviceable from the cold aisle for efficient DC • Powered by up to two next-generation Xeon Scalable
management (2x OCP + 6x 2.5”) processors, code-named “Sapphire Rapids” Medium density virtualization and
• Single processor configurations available Cloud-Native requiring low-
• Up to 16 x DDR5 RDIMMs (2TB max) medium local storage
• Up to 4800 MT/s

Scale-Out Database
Medium Duty traditional
database & scale out database
System Management with low-medium local storage
Flexible Storage I/O • iDRAC or OpenBMC+
• 4x 3.5“ SAS/SATA • Up to 3 I/O slots:
• 10x 2.5" SAS/SATA or NVMe • 2x PCIe Gen4 / Gen5 slots*
• 8x 2.5” SAS/SATA or NVMe • 1x OCP 3.0 for network cards
• 6x 2.5" NVMe • Channel Firmware devices (NIC & NVMe SSDs) Software-Defined
• Optional 2x 2.5” Rear SAS/SATA or NVMe Storage Node
• SW RAID, BOSS-N1, PERC11
Up to 4 large capacity drives for
software defined storage
deployments
• MCC TTM based on Intel embargo (Media/Hadoop/grid)
• Early engineering samples and post-RTS efforts to assist
• CET Engineering lab resources
• CSP Services and Rack Integration
*Gen5 PCIe: upsell
73 Copyright © Dell Inc. All Rights Reserved.
Technical Specifications – R650xs, HS5610
Features PowerEdge R650xs PowerEdge HS5610
CPU Up to two 3rd Generation Intel® Xeon® Scalable processors with up to 32 cores per processor Up to two 4th Generation Intel® Xeon® Scalable processors with up to 32 cores per processor
Up to two 220W TDP Up to two 250W TDP with HW config restriction

Memory Up to 16 x DDR4 3200 MT/s RDIMMs (1TB max) Up to 16 x DDR5 4800 MT/s RDIMMs (2TB max)
8 channels, 1 DIMM/channel 8 channels, 1 DIMM/channel
Optane Memory: No Optane Memory: No
NVDIMM: No NVDIMM: No

Storage (Chassis options) Up to 4 x 3.5" SAS/SATA/Chipset SATA + optional 2 x 2.5” SAS/SATA/VMe (rear) Up to 4x 3.5" SAS/SATA/ChipSATA HDD + optional 2x 2.5” SAS/SATA/NVMe SSD (Rear)
Up to 10x 2.5" SAS/SATA/NVMe + optional 2 x 2.5” NVMe (rear) Up to 8x 2.5” SAS/SATA/ChipSATA or NVMe/NVMe RAID + optional 2x 2.5” ChipsetSATA/NVMe (Rear)
Up to 8x 2.5" NVMe RAID Up to 10x 2.5" SAS/SATA or NVMe + optional 2x 2.5” NVMe (Rear)
HW NVMe RAID (8 x 2.5” with PERC H755N) Cold Aisle (CA): Up to 6x 2.5” NVMe (Gen 4) SSD
Internal: IDSD or USB, BOSS-S1 (2 x M.2) for boot Internal: Internal BOSS-N1 (2 x M.2) non-hot swap and USB (optional)
CA: Front plug monolithic BOSS-N1 (2 x M.2), hot swap
Support for Channel Firmware NVMe SSD

Storage Controller HW RAID: PERC 10.5 & 11 (no dual PERC option) HW RAID PERC11 (no dual PERC option)
PERC 10.5: H345, H745 PERC 11: HBA355i, H355, H755, H755N
PERC 11: HBA355, H755, H755N Chipset SATA/SW RAID: Yes
Chipset SATA/SW RAID: Yes

Network 2 x 1GbE + 1 x OCP 3.0 (x16) Rear: 2 x 1GbE + 1 x OCP 3.0 (x8)
Cold-Aisle: 2 x OCP 3.0 (FLOP)
Support for Channel Firmware OCP and PCIe NIC

PCIe slots Up to 3 x PCIe Gen4 (x16/x8/x8) with SNAPI capability Up to 3 x I/O: 1 OCP3.0(x8) and 2 PCIe Gen4 or Gen5 (x16/x16), No SNAPI support

GPU None None

Integrated Ports Front: 1 x USB 2.0, 1 x iDRAC Direct micro-USB, 1 x VGA Front: 1 x USB 2.0, 1 iDRAC Direct micro-USB, 1 x VGA, 1 x iDRAC network (CA-only), 1 x Serial (CA-
Rear: 1 x USB 2.0, 1 x USB 3.0, 1 x Serial (option), 2 x network, 1 x iDRAC network, 1 x VGA only)
Rear: 1 x USB 2.0, 1 x USB 3.0, 1 x Serial (option), 2 x network, 1 x iDRAC network, 1 x VGA

System Management iDRAC9 Express, Enterprise, Datacenter, and OME iDRAC9 Express, Enterprise, Datacenter, and OME
Open Server Manager (OpenBMC)

High Availability Hot plug hard drives, PSU, fans, and BOSS Hot Plug/RAID controlled drives, PSU, and BOSS. Cold plug fans with optional hot-plug

Power Supplies 600W, 800W, 1100W, -48Vdc/1100W,1400W 600W, 700W, 800W, 1100W, -48Vdc/ 1100W, 1400W, 1800W

Dimensions H x W x D: 1U x 434mm x 698mm (2.5” drives) or 749mm (3.5” drives) H x W x D: 1U x 434mm x 698mm (2.5” drives) or 749mm (3.5” drives)

Form Factor 1U Rack Server 1U Rack Server