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G Premio Bond Technique Guide

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Amr Elahwany
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827 views2 pages

G Premio Bond Technique Guide

Uploaded by

Amr Elahwany
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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G-Premio BOND TECHNIQUE GUIDE

Prior to use, carefully read the instructions for use.


Consult
SELECT ETCHING MODE BONDING PROCEDURE Instructions
for Use
Self etch 10 MAX Air 5
sec. sec.

Selective etch Apply G-Premio Dry. Light cure.


10-15
sec. BOND and wait
10 sec.

Light curing time


Distance from light guide tip
Total etch Light curing unit
10-15 <10mm >10mm
sec.
Halogen / LED
(700 mW/cm²) 10 sec. 20 sec.
High power LED
Start placing (>1200 mW/cm²) 5 sec. 10 sec.
Etch for 10-15 sec., composite.
rinse for 5 sec. and dry.

G-Premio BOND TECHNIQUE GUIDE


INTRAORAL REPAIR 10 5
sec. MAX Air sec.

Roughen surface. Apply Ceramic Apply G-Premio Dry. Light cure.


Rinse and dry. Primer II on ceramic BOND to all
surfaces. Dry. surfaces and wait
10 sec.
HYPERSENSITIVITY TREATMENT
10 MAX Air 5
sec. sec.

Apply G-Premio Dry. Light cure. Remove


BOND. Wait 10 sec. unpolymerized layer.

13009178
270451DK
G-Premio BOND TECHNIQUE GUIDE
Prior to use, carefully read the instructions for use.
Consult
SELECT ETCHING MODE BONDING PROCEDURE Instructions
for Use
Self etch 10 MAX Air 5
sec. sec.

Selective etch Apply G-Premio Dry. Light cure.


10-15
sec. BOND and wait
10 sec.

Light curing time


Distance from light guide tip
Total etch Light curing unit
10-15 <10mm >10mm
sec.
Halogen / LED
(700 mW/cm²) 10 sec. 20 sec.
High power LED
Start placing (>1200 mW/cm²) 5 sec. 10 sec.
Etch for 10-15 sec., composite.
rinse for 5 sec. and dry.

G-Premio BOND TECHNIQUE GUIDE


INTRAORAL REPAIR 10 5
sec. MAX Air sec.

Roughen surface. Apply Ceramic Apply G-Premio Dry. Light cure.


Rinse and dry. Primer II on ceramic BOND to all
surfaces. Dry. surfaces and wait
10 sec.
HYPERSENSITIVITY TREATMENT
10 MAX Air 5
sec. sec.

Apply G-Premio Dry. Light cure. Remove


BOND. Wait 10 sec. unpolymerized layer.

13009178
270451DK

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