RTL8213B-CG Datasheet v0.1
RTL8213B-CG Datasheet v0.1
10/100/1000M Copper
to
100Base-FX/1000Base-X Fiber
Media Converter
DRAFT DATASHEET
(CONFIDENTIAL: Development Partners Only)
Rev. 1.0
30 Dec. 2018
Track ID: xxxx-xxxx-xx
Realtek Semiconductor Corp.
No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan
Tel.: +886-3-578-0211 Fax: +886-3-577-6047
www.realtek.com
RTL8213B
DRAFT Datasheet
COPYRIGHT
©2018 Realtek Semiconductor Corp. All rights reserved. No part of this document may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any
means without the written permission of Realtek Semiconductor Corp.
DISCLAIMER
Realtek provides this document ‘as is’, without warranty of any kind. Realtek may make improvements
and/or changes in this document or in the product described in this document at any time. This document
could include technical inaccuracies or typographical errors.
TRADEMARKS
Realtek is a trademark of Realtek Semiconductor Corporation. Other names mentioned in this document
are trademarks/registered trademarks of their respective owners.
Table of Contents
1. GENERAL DESCRIPTION .................................................................................................................................................... 1
2. FEATURES ................................................................................................................................................................................. 3
3. SYSTEM APPLICATIONS ...................................................................................................................................................... 5
4. APPLICATION EXAMPLES .................................................................................................................................................. 5
4.1. UNMANAGED MEDIA CONVERTER ......................................................................................................................................................... 5
5. BLOCK DIAGRAM .................................................................................................................................................................. 6
6. PIN ASSIGNMENTS ................................................................................................................................................................ 7
6.1. PACKAGE IDENTIFICATION .................................................................................................................................................................. 7
6.2. PIN ASSIGNMENTS TABLE ................................................................................................................................................................... 8
7. PIN DESCRIPTIONS ............................................................................................................................................................... 9
7.1. MEDIA DEPENDENT INTERFACE PINS ................................................................................................................................................ 9
7.2. HIGH SPEED SERIAL INTERFACE PINS ............................................................................................................................................... 9
7.3. GENERAL PURPOSE INTERFACES ........................................................................................................................................................ 9
7.4. LED PINS ................................................................................................................................................................................................ 9
7.5. CONFIGURATION STRAPPING PINS .................................................................................................................................................. 10
7.6. MANAGEMENT INTERFACE PINS ..................................................................................................................................................... 11
7.7. MISCELLANEOUS PINS ...................................................................................................................................................................... 11
7.8. EMBEDDED SWITCH REGULATOR PINS .......................................................................................................................................... 12
7.9. POWER AND GND PINS ..................................................................................................................................................................... 12
8. PHYSICAL LAYER FUNCTIONAL OVERVIEW ........................................................................................................... 13
8.1. MDI INTERFACE ................................................................................................................................................................................. 13
8.2. 1000BASE-T TRANSMIT FUNCTION ............................................................................................................................................... 13
8.3. 1000BASE-T RECEIVE FUNCTION................................................................................................................................................... 13
8.4. 100BASE-TX TRANSMIT FUNCTION .............................................................................................................................................. 13
8.5. 100BASE-TX RECEIVE FUNCTION.................................................................................................................................................. 14
8.6. 10BASE-T TRANSMIT FUNCTION .................................................................................................................................................... 14
8.7. 10BASE-T RECEIVE FUNCTION ....................................................................................................................................................... 14
8.8. AUTO-NEGOTIATION FOR UTP ........................................................................................................................................................ 14
8.9. CROSSOVER DETECTION AND AUTO CORRECTION ..................................................................................................................... 15
8.10. POLARITY CORRECTION .................................................................................................................................................................... 15
9. GENERAL FUNCTION DESCRIPTIONS ......................................................................................................................... 16
9.1. RESET.................................................................................................................................................................................................... 16
9.1.1. Hardware Reset ............................................................................................................................................................................ 16
9.1.2. Software Reset............................................................................................................................................................................... 16
9.2. IEEE 802.3X FULL DUPLEX FLOW CONTROL .............................................................................................................................. 17
9.3. HALF DUPLEX FLOW CONTROL ...................................................................................................................................................... 17
9.3.1. Back-Pressure Mode ................................................................................................................................................................... 17
9.4. SEARCH AND LEARNING ................................................................................................................................................................... 18
9.5. SVL AND IVL/SVL ........................................................................................................................................................................... 18
Unmanaged Gigabit Media Converter iii Track ID: xxxx-xxxx-xx Rev. 1.0
RTL8213B
DRAFT Datasheet
11.6.1. Master I2C for EEPROM Auto-load Interface Timing Characteristics .................................................................... 35
11.6.2. Slave I2C-like Mode Timing Characteristics ................................................................................................................... 36
11.6.3. Slave MII Management SMI for External CPU Access Interface Timing Characteristics ................................... 37
11.6.4. SGMII/1000Base-X Characteristics .................................................................................................................................. 38
11.6.5. Power and Reset Characteristics ....................................................................................................................................... 40
12. MECHANICAL DIMENSIONS ............................................................................................................................................ 41
13. ORDERING INFORMATION .............................................................................................................................................. 42
List of Tables
TABLE 1. PIN ASSIGNMENTS TABLE ................................................................................................................................................................... 8
TABLE 2. MEDIA DEPENDENT INTERFACE PINS ............................................................................................................................................... 9
TABLE 3. HIGH SPEED SERIAL INTERFACE PINS............................................................................................................................................... 9
TABLE 4. GENERAL PURPOSE INTERFACES PINS .............................................................................................................................................. 9
TABLE 5. LED PINS ............................................................................................................................................................................................. 10
TABLE 6. CONFIGURATION STRAPPING PINS .................................................................................................................................................. 10
TABLE 7. MANAGEMENT INTERFACE PINS ..................................................................................................................................................... 11
TABLE 8. MISCELLANEOUS PINS ........................................................................................................................................................................... 11
TABLE 9. EMBEDDED SWITCH REGULATOR PINS .............................................................................................................................................. 12
TABLE 10. POWER AND GND PINS ....................................................................................................................................................................... 12
TABLE 11. MEDIA DEPENDENT INTERFACE PIN MAPPING .............................................................................................................................. 15
TABLE 12. RESERVED MULTICAST ADDRESS CONFIGURATION TABLE ........................................................................................................ 19
TABLE 13. LED DEFINITIONS ................................................................................................................................................................................ 26
TABLE 14. SLAVE MII MANAGEMENT SMI ACCESS FORMAT ........................................................................................................................ 31
TABLE 15. ABSOLUTE MAXIMUM RATINGS........................................................................................................................................................ 32
TABLE 16. RECOMMENDED OPERATING RANGE................................................................................................................................................ 32
TABLE 17. ASSEMBLY DESCRIPTION .................................................................................................................................................................... 33
TABLE 18. MATERIAL PROPERTIES ....................................................................................................................................................................... 33
TABLE 19. SIMULATION CONDITIONS .................................................................................................................................................................. 33
TABLE 20. THERMAL PERFORMANCE OF QFN-56 ON PCB UNDER STILL AIR CONVECTION ................................................................. 34
TABLE 21. DC CHARACTERISTICS ........................................................................................................................................................................ 34
TABLE 22. SWITCH REGULATOR ........................................................................................................................................................................... 34
TABLE 23. MASTER I2C FOR EEPROM AUTO-LOAD TIMING CHARACTERISTICS .................................................................................... 35
TABLE 24. SLAVE I2C-LIKE MODE TIMING CHARACTERISTICS ..................................................................................................................... 36
TABLE 25. MDIO TIMING CHARACTERISTICS AND REQUIREMENT .............................................................................................................. 37
TABLE 26. SGMII/1000BASE-X DIFFERENTIAL TRANSMITTER CHARACTERISTICS ................................................................................. 38
TABLE 27. SGMII/1000BASE-X DIFFERENTIAL RECEIVER CHARACTERISTICS ........................................................................................ 39
TABLE 28. POWER AND RESET CHARACTERISTICS ........................................................................................................................................... 40
TABLE 29. ORDERING INFORMATION ................................................................................................................................................................... 42
List of Figures
FIGURE 1. UNMANAGED MEDIA CONVERTER ................................................................................................................................................... 5
FIGURE 2. BLOCK DIAGRAM ................................................................................................................................................................................ 6
FIGURE 3. PIN ASSIGNMENTS (QFN-40)............................................................................................................................................................ 7
FIGURE 4. CONCEPTUAL EXAMPLE OF POLARITY CORRECTION................................................................................................................ 15
FIGURE 5. PROTOCOL-BASED VLAN FRAME FORMAT AND FLOW CHART ............................................................................................. 22
FIGURE 6. PULL-UP AND PULL-DOWN OF LED PINS FOR SINGLE-COLOR LED .................................................................................... 27
FIGURE 7. PULL-UP AND PULL-DOWN OF LED PINS FOR BI-COLOR LED ............................................................................................. 27
FIGURE 8. SMI START AND STOP COMMAND ................................................................................................................................................. 29
FIGURE 9. MASTER I2C FOR EEPROM AUTO-LOAD INTERFACE CONNECTION EXAMPLE ................................................................. 29
FIGURE 10. 8-BIT EEPROM SEQUENTIAL READ .............................................................................................................................................. 29
FIGURE 11. REALTEK SLAVE I2C-LIKE FOR EXTERNAL CPU ACCESS INTERFACE CONNECTION EXAMPLE........................................ 30
FIGURE 12. REALTEK SLAVE I2C-LIKE INTERFACE WRITE COMMAND ........................................................................................................ 30
FIGURE 13. REALTEK SLAVE I2C-LIKE INTERFACE READ COMMAND.......................................................................................................... 30
FIGURE 14. SLAVE MII MANAGEMENT SMI INTERFACE CONNECTION EXAMPLE ..................................................................................... 31
FIGURE 15. MASTER I2C FOR EEPROM AUTO-LOAD TIMING CHARACTERISTICS ................................................................................... 35
FIGURE 16. SCK/SDA POWER ON TIMING ......................................................................................................................................................... 35
FIGURE 17. SLAVE I2C-LIKE MODE TIMING CHARACTERISTICS.................................................................................................................... 36
FIGURE 18. MDIO SOURCED BY THE MASTER .................................................................................................................................................. 37
FIGURE 19. MDIO SOURCED BY THE RTL8213B (SLAVE) ............................................................................................................................. 37
FIGURE 20. SGMII/1000BASE-X DIFFERENTIAL TRANSMITTER EYE DIAGRAM ....................................................................................... 38
FIGURE 21. SGMII/1000BASE-X DIFFERENTIAL RECEIVER EYE DIAGRAM .............................................................................................. 39
FIGURE 22. POWER AND RESET CHARACTERISTICS .......................................................................................................................................... 40
Unmanaged Gigabit Media Converter vii Track ID: xxxx-xxxx-xx Rev. 1.0
RTL8213B
DRAFT Datasheet
1. General Description
The RTL8213B-CG is a QFN40, high-performance media converter featuring low-power integrated 1-port
Giga-PHY that support 1000Base-T, 100Base-TX, and 10Base-T.
For specific applications, the RTL8213B supports one SerDes interface that could be configured as a
SGMII/1000Base-X/100FX interface. The RTL8213B integrates a SRAM for packet buffering, non-
blocking switch fabric, and internal register management into a single CMOS device. Only a 25MHz crystal
is required; an optional EEPROM is offered for internal register configuration.
The embedded packet storage SRAM in the RTL8213B features superior memory management technology
to efficiently utilize memory space. The RTL8213B integrates a 2048-entry look-up table with a 4-way
XOR Hashing algorithm for address searching and learning. The table provides read/write access from the
Slave I2C-like serial Interface, or Slave Media Independent Interface Management (MIIM) Interface. Each
of the entries can be configured as a static entry. Normal entry aging time is between 200 and 400 seconds.
Sixteen Filtering Databases are used to provide Independent VLAN Learning and Shared VLAN Learning
(IVL/SVL) functions.
The Extension GMAC1 of the RTL8213B implements a 1000Base-X/100Base-FX interface.
The RTL8213B supports standard 802.3x flow control frames for full duplex, and optional backpressure
for half duplex. It determines when to invoke the flow control mechanism by checking the availability of
system resources, including the packet buffers and transmitting queues. The RTL8213B supports
broadcast/multicast output dropping, and will forward broadcast/multicast packets to non-blocked ports
only. For IP multicast applications, the RTL8213B can forward IPv4 IGMPv1/v2/v3 and IPv6 MLDv1/v2
snooping protocol packets.
In order to support flexible traffic classification, the RTL8213B supports 48-entry ACL rule check and
multiple actions options. Each port can optionally enable or disable the ACL rule check function. The ACL
rule key can be based on packet physical port, Layer2, Layer3, and Layer4 information. When an ACL rule
matches, the action taken is configurable to Drop/Permit/Redirect/Mirror, change priority value in 802.1q/Q
tag, force output tag format and rate policing. The rate policing mechanism supports from 8Kbps to 1Gbps
(in 8Kbps steps).
In Bridge operation the RTL8213B supports 16 sets of port configurations: disable, block, learning, and
forwarding for Spanning Tree Protocol and Multiple Spanning Tree Protocol. To meet security and
management application requirements, the RTL8213B supports IEEE 802.1x Port-based/MAC-based
Access Control. A 1-set Port Mirroring function is configured to mirror traffic (RX, TX, or both) appearing
on one of the switch’s ports. Support is provided on each port for multiple RFC MIB Counters, for easy
debug and diagnostics.
To improve real-time and multimedia networking applications, the RTL8213B supports eight priority
assignments for each received packet. These are based on (1) Port-based priority; (2) 802.1p/Q VLAN tag
priority; (3) DSCP field in IPv4/IPv6 header; and (4) ACL-assigned priority. Each output port supports a
weighted ratio of eight priority queues to fit bandwidth requirements in different applications. The input
bandwidth control function helps limit per-port traffic utilization. There is one leaky bucket for average
packet rate control for each queue of all ports. Queue scheduling algorithm can use Strict Priority (SP) or
Weighted Fair Queue (WFQ) or Weighted Round Robin (WRR) or mixed.
The RTL8213B provides a 4096-entry VLAN table for 802.1Q port-based, tag-based, and protocol-based
VLAN operation to separate logical connectivity from physical connectivity. The RTL8213B supports four
Protocol-based VLAN configurations that can optionally select EtherType, LLC, and RFC1042 as the
search key. Each port may be set to any topology via EEPROM upon reset, or Slave I2C-like serial Interface,
or Slave Media Independent Interface Management (MIIM) Interface after reset.
2. Features
Embedded single-port 10/100/1000Base-T PHY 2048-entry MAC address table with 4-way hash
algorithm
Each port supports full duplex 10/100/1000M
Up to 2048-entry L2/L3 Filtering Database
connectivity (half duplex only supported in
10/100M mode) Per-port MAC learning limitation
Extra Interface (Extension GMAC1) supports System base MAC learning limitation
Optional setting of per-port action to take when Eight Priority Queues per port
ACL mismatch Per queue flow control
Supports IEEE 802.1Q VLAN Min-Max Scheduling
Supports 4096 VLANs and 32 Extra Enhanced Strict Priority and Weighted Fair Queue (WFQ),
VLANs Weighted Round Robin (WRR) packet
scheduling
Supports Un-tag definition in each VLAN
One leaky bucket to constrain the average packet
Supports VLAN policing and VLAN forwarding
rate of each queue
decision
Port-based, Tag-based, and Protocol-based Supports rate limiting (12 shared meters, with
VLAN 8kbps granulation)
Up to 4 Protocol-based VLAN entries Supports RFC MIB Counter
Per-port and per-VLAN egress VLAN tagging MIB-II (RFC 1213)
and un-tagging
Ethernet-Like MIB (RFC 3635)
Supports IVL, SVL, and IVL/SVL Interface Group MIB (RFC 2863)
3. System Applications
Unmanaged Media converter
4. Application Examples
4.1. Unmanaged Media Converter
CPU
Packet Buffer
Giga Extension
MAC 3 GMAC 1
Giga EEPROM
PHY 3 1000Base-X/100Base-FX
RJ-45
SFP
Jack
5. Block Diagram
UTP P3
Giga-PHY PCS SRAM
GMAC
Controller Packet Buffer
SRAM
Queue
SGMII Managment Linking Lists
(1.25Gbps) Extension
SerDes GMAC
1
1000Base-X/
100Base-FX
2048 MAC
Address Table
SWR Lookup
3.3V to 1.1V Engine
SWR
4096 VLAN
Table
LED
LED
Control
Registers
PLL Management
+
I2C Host MIB Counter
Interface
25MHz SCK/SDA
Crystal MDC/MDIO
6. Pin Assignments
GPO45/P6LED1/DISAUTOLOAD
GPO52/P3LED0/SMI_SEL
GPO50/P3LED2/EN_PHY
GPIO48/P6LED0/MID29
GPIO51/P3LED1
DVDDIO
AVDDH
DVDDL
XTALO
XTALI
30
29
28
27
26
25
24
23
22
21
SDA 31 20 HV_SWR
SCK 32 19 HV_SWR
nRESET 33 18 LX
PLLVDDL 34 17 LX
AVDDH 35 16 GND_SWR
P3MDIAP 36 15 EN_SWR
P3MDIBP 38 13 HSIN
P3MDIBN 39
XXXXXXX GXXXB 12 HSIP
AVDDL 40 11 SVDDL
10
1
9
MDIREF
P3MDICP
P3MDIDP
P3MDIDN
P3MDICN
HSON
HSOP
AVDDH
AVDDL
DVDDL
QFN40
E-PAD: GND
Package Size 5mm x 5mm
EPAD Size 3.7mm x 3.7mm
IPU: Input Pin With Pull-Up Resistor; OPU: Output Pin With Pull-Up Resistor;
(Typical Value = 75K Ohm) (Typical Value = 75K Ohm)
7. Pin Descriptions
7.1. Media Dependent Interface Pins
Table 2. Media Dependent Interface Pins
Drive
Pin Name Pin No. Type Description
(mA)
P3MDIAP/N 36 AI/O 10 Port 3 Media Dependent Interface A~D.
37 For 1000Base-T operation, differential data from the media is transmitted
P3MDIBP/N 38 and received on all four pairs. For 100Base-TX and 10Base-T operation,
39 only MDIAP/N and MDIBP/N are used. Auto MDIX can reverse the pairs
P3MDICP/N 1 MDIAP/N and MDIBP/N.
2
P3MDIDP/N 3 Each of the differential pairs has an internal 100-ohm termination resistor.
4
+ +
RX _ _ TX
+ _ +
TX _ + _ RX
9.1.2.1 CHIP_RESET
When CHIP_RESET is set to 0b1 (write and self-clear), the chip will take the following steps:
1. Download configuration from strap pin and EEPROM
2. Start embedded SRAM BIST (Built-In Self Test)
3. Clear all the Lookup and VLAN tables
4. Reset all registers to default values
5. Restart the auto-negotiation process
9.1.2.2 SOFT_RESET
When SOFT_RESET is set to 0b1 (write and self-clear), the chip will take the following steps:
1. Clear the FIFO and re-start the packet buffer link list
2. Restart the auto-negotiation process
Egress Filtering
‘Forward’ or ‘Discard’ Leaky VLAN frames between different VLAN domains
‘Forward’ or ‘Discard’ Multicast VLAN frames between different VLAN domains
The VLAN tag can be inserted or removed at the output port. The RTL8213B will insert a Port VID (PVID)
for untagged frames, or remove the tag from tagged frames. The RTL8213B also supports a special insert
VLAN tag function to separate traffic from the WAN and LAN sides in Router and Gateway applications.
corresponding field value. Taking IP packet configuration as an example, the user can configure the frame
type to be ‘Ethernet’, and value to be ‘0x0800’. Each table will index to one of the entries in the 4096-entry
VLAN table. The packet stream will match the protocol type and the value will follow the VLAN member
configuration of the indexed entry to forward the packets.
Ethernet DA/SA TYPE ……
Frame Input
6 bytes after
Type/Length are Frame Type
No
AA-AA-03-00-00-00? = LLC_ Other
Frame Type
= RFC_1042
The RTL8213B identifies the priority of packets based on several types of QoS priority information:
Port-based priority
802.1p/Q-based priority
IPv4/IPv6 DSCP-based priority
ACL-based priority
VLAN-based priority
MAC-based priority
SVLAN-based priority
The LED pin also supports pin strapping configuration functions. The PnLED0, PnLED1, and PnLED2
pins are dual-function pins: input operation for configuration upon reset, and output operation for LED after
reset. When the pin input is pulled high upon reset, the pin output is active low after reset. When the pin
input is pulled down upon reset, the pin output is active high after reset (see Figure 6 and Figure 7). Typical
values for pull-up/pull-down resistors are 4.7K.
The PnLED1 can be combined with PnLED0 or PnLED2 as a Bi-color LED.
The PnLED1 should operate with the same polarity as other Bi-color LED pins. For example:
P3LED1 should pull up upon reset if P3LED1 is combined with P3LED2 as a Bi-color LED, and P3LED2 input is
pulled high upon reset. In this configuration, the output of these pins is active low after reset
P3LED1 should be pulled down upon reset if P3LED1 is combined with P3LED2 as a Bi-color LED, and P3LED2
input is pulled down upon reset. In this configuration, the output of these pins is active high after reset
Pull-Up Pull-Down
DVDDIO
4.7K LED Pin
ohm 470 ohm RTL8213B
LED Pins Output Active Low LED Pins Output Active High
Figure 6. Pull-Up and Pull-Down of LED Pins for Single-Color LED
Pull-Up Pull-Down
4.7K
SPD 1000 ohm DVDDIO SPD 100 4.7K ohm
470ohm 470ohm
RTL8213B RTL8213B
Yellow Green Yellow Green
9.19. Regulator
The RTL8213B embeds a 3.3V-1.1V switch regulator to simplify the power solution. The 1.1V output
power is used for the digital core and analog circuits. Do not use the regulator for other chips, even if the
rating is enough.
SDA
SCK
START STOP
3.3V
NC-1.5K ohm
I2C Master EERPOM
SCK EEPROM_SCL
3.3V
1.5K ohm
SDA EEPROM_SDA
4.7K ohm
DISAUTOLOAD
1 ADDRESS BYTE
1 CONTROL BYTE 1 CONTROL BYTE The 1st DATA BYTE The 2nd DATA BYTE N
O
R/ A A R/ A A A
S 1 0 1 0 0 0 0 W# C ADDR[7:0] C S 1 0 1 0 0 0 0 W# C C C P
(0) K K (1) K K K
MSB to LSB MSB to LSB MSB to LSB
S_SDA M_SDA
3.3V
4.7K ohm*
SMI_SEL
Figure 11. Realtek Slave I2C-Like for External CPU Access Interface Connection Example
The 1st ADDRESS The 2nd ADDRESS The 1st DATA BYTE The 2nd DATA BYTE
1 CONTROL BYTE BYTE (reg_addr[7:0]) BYTE (reg_addr[15:8]) (write_data[7:0]) (write_data[15:8])
R/ A A A A A
S 1 0 1 1 1 0 0 W# C ADDR[7:0] C ADDR[15:8] C C C P
(0) K K K K K
MSB to LSB MSB to LSB MSB to LSB MSB to LSB
ACK by Slave ACK by Slave ACK by Slave ACK by Slave ACK by Slave
The 1st ADDRESS The 2nd ADDRESS The 1st DATA BYTE The 2nd DATA BYTE
1 CONTROL BYTE BYTE (reg_addr[7:0]) N
BYTE (reg_addr[15:8]) (read_data[7:0]) (read_data[15:8])
O
R/ A A A A A
S 1 0 1 1 1 0 0 W# C ADDR[7:0] C ADDR[15:8] C C C P
(1) K K K K K
MSB to LSB MSB to LSB MSB to LSB MSB to LSB
ACK by Slave ACK by Slave ACK by Slave ACK by Master NOACK by Master
S_MDIO M_MDIO
4.7K ohm
SMI_SEL
11.4. DC Characteristics
Table 21. DC Characteristics
Parameter SYM Min Typical Max Units
System Idle (All UTP Ports Link Down, and Extension Port Link Down, without LEDs)
Power Supply Current for VDDH IDVDDIO, IAVDDH - 13 - mA
Power Supply Current for VDDL IDVDDL, IAVDDL, ISVDDL, - 132 - mA
IPLLVDDL
1000M Active (All UTP Ports 1000M Link/Active, and Extension Port Link/Active as 1000Base-X, without LEDs)
Power Supply Current for VDDH IDVDDIO, IAVDDH - 70 - mA
Power Supply Current for VDDL IDVDDL, IAVDDL, ISVDDL, - 218 - mA
IPLLVDDL
VDDIO=3.3V
TTL Input High Voltage Vih 2.0 - - V
TTL Input Low Voltage Vil - - 0.7 V
Output High Voltage Voh 2.7 - - V
Output Low Voltage Vol - - 0.6 V
Note: Power Consumption test condition, DVDDIO=3.3V, AVDDH=3.3V, DVDDL=1.1V, AVDDL=1.1V, SVDDL=1.1V,
and PLLVDDL=1.1V. Embedded Switch Regulator disabled.
11.6. AC Characteristics
11.6.1. Master I2C for EEPROM Auto-load Interface Timing
Characteristics
Tsck
t1 t2
SCK
t3 t4 t7 t5 t6 t8
t11
t9
nRESET
SCK
SDA
SCK
t3 t4 t5 t6 t7 t8
11.6.3. Slave MII Management SMI for External CPU Access Interface
Timing Characteristics
The RTL8213B supports MDIO slave mode. The Master (CPU) can access the Slave (RTL8213B) registers
via the MDIO interface. The MDIO is a bi-directional signal that can be sourced by the Master or the Slave.
In a write command, the master sources the MDIO signal. In a read command, the slave sources the MDIO
signal.
The timing characteristics t1, t2, and t3 (Table 25) of the Master (the RTL8213B link partner CPU) are provided by
the Master when the Master sources the MDIO signal (Write command)
The timing characteristics t4 (Table 25) of the Slave (RTL8213B) are provided by the RTL8213B when the RTL8213B
sources the MDIO signal (Read command)
t1
VIH
MDC
VIL
VIH
MDIO
VIL
t2 t3
Figure 18. MDIO Sourced by the Master
VIH
MDC
VIL
VIH
MDIO
VIL
t4
Figure 19. MDIO Sourced by the RTL8213B (Slave)
AVDDH
Power
t2
t4
DVDDIO/
2.7V(+-5%)
HV_SWR
Power
0V
t5
LV Power 0.8V(+-5%)
0V
t3 t6
t7
nRESET pin
0V