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RTL8213B-CG Datasheet v0.1

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0% found this document useful (0 votes)
378 views49 pages

RTL8213B-CG Datasheet v0.1

Uploaded by

Daniel Paredes
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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RTL8213B-CG

10/100/1000M Copper
to
100Base-FX/1000Base-X Fiber
Media Converter

DRAFT DATASHEET
(CONFIDENTIAL: Development Partners Only)

Rev. 1.0
30 Dec. 2018
Track ID: xxxx-xxxx-xx
Realtek Semiconductor Corp.
No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan
Tel.: +886-3-578-0211 Fax: +886-3-577-6047
www.realtek.com
RTL8213B
DRAFT Datasheet

COPYRIGHT
©2018 Realtek Semiconductor Corp. All rights reserved. No part of this document may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any
means without the written permission of Realtek Semiconductor Corp.

DISCLAIMER
Realtek provides this document ‘as is’, without warranty of any kind. Realtek may make improvements
and/or changes in this document or in the product described in this document at any time. This document
could include technical inaccuracies or typographical errors.

TRADEMARKS
Realtek is a trademark of Realtek Semiconductor Corporation. Other names mentioned in this document
are trademarks/registered trademarks of their respective owners.

USING THIS DOCUMENT


This document is intended for the hardware and software engineer’s general information on the Realtek
RTL8213B IC.
Though every effort has been made to ensure that this document is current and accurate, more information
may have become available subsequent to the production of this guide.

ELECTROSTATIC DISCHARGE (ESD) WARNING


This product can be damaged by Electrostatic Discharge (ESD). When handling, care must be taken.
Damage due to inappropriate handling is not covered by warranty.
Do not open the protective conductive packaging until you have read the following, and are at an approved
anti-static workstation.
 Use an approved anti-static mat to cover your work surface.
 Use a conductive wrist strap attached to a good earth ground
 Always discharge yourself by touching a grounded bare metal surface or approved anti-static mat before picking up
an ESD-sensitive electronic component
 If working on a prototyping board, use a soldering iron or station that is marked as ESD-safe
 Always disconnect the microcontroller from the prototyping board when it is being worked on
REVISION HISTORY
Revision Release Date Summary
1.0 2018/12/30 First Release.

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Table of Contents
1. GENERAL DESCRIPTION .................................................................................................................................................... 1
2. FEATURES ................................................................................................................................................................................. 3
3. SYSTEM APPLICATIONS ...................................................................................................................................................... 5
4. APPLICATION EXAMPLES .................................................................................................................................................. 5
4.1. UNMANAGED MEDIA CONVERTER ......................................................................................................................................................... 5
5. BLOCK DIAGRAM .................................................................................................................................................................. 6
6. PIN ASSIGNMENTS ................................................................................................................................................................ 7
6.1. PACKAGE IDENTIFICATION .................................................................................................................................................................. 7
6.2. PIN ASSIGNMENTS TABLE ................................................................................................................................................................... 8
7. PIN DESCRIPTIONS ............................................................................................................................................................... 9
7.1. MEDIA DEPENDENT INTERFACE PINS ................................................................................................................................................ 9
7.2. HIGH SPEED SERIAL INTERFACE PINS ............................................................................................................................................... 9
7.3. GENERAL PURPOSE INTERFACES ........................................................................................................................................................ 9
7.4. LED PINS ................................................................................................................................................................................................ 9
7.5. CONFIGURATION STRAPPING PINS .................................................................................................................................................. 10
7.6. MANAGEMENT INTERFACE PINS ..................................................................................................................................................... 11
7.7. MISCELLANEOUS PINS ...................................................................................................................................................................... 11
7.8. EMBEDDED SWITCH REGULATOR PINS .......................................................................................................................................... 12
7.9. POWER AND GND PINS ..................................................................................................................................................................... 12
8. PHYSICAL LAYER FUNCTIONAL OVERVIEW ........................................................................................................... 13
8.1. MDI INTERFACE ................................................................................................................................................................................. 13
8.2. 1000BASE-T TRANSMIT FUNCTION ............................................................................................................................................... 13
8.3. 1000BASE-T RECEIVE FUNCTION................................................................................................................................................... 13
8.4. 100BASE-TX TRANSMIT FUNCTION .............................................................................................................................................. 13
8.5. 100BASE-TX RECEIVE FUNCTION.................................................................................................................................................. 14
8.6. 10BASE-T TRANSMIT FUNCTION .................................................................................................................................................... 14
8.7. 10BASE-T RECEIVE FUNCTION ....................................................................................................................................................... 14
8.8. AUTO-NEGOTIATION FOR UTP ........................................................................................................................................................ 14
8.9. CROSSOVER DETECTION AND AUTO CORRECTION ..................................................................................................................... 15
8.10. POLARITY CORRECTION .................................................................................................................................................................... 15
9. GENERAL FUNCTION DESCRIPTIONS ......................................................................................................................... 16
9.1. RESET.................................................................................................................................................................................................... 16
9.1.1. Hardware Reset ............................................................................................................................................................................ 16
9.1.2. Software Reset............................................................................................................................................................................... 16
9.2. IEEE 802.3X FULL DUPLEX FLOW CONTROL .............................................................................................................................. 17
9.3. HALF DUPLEX FLOW CONTROL ...................................................................................................................................................... 17
9.3.1. Back-Pressure Mode ................................................................................................................................................................... 17
9.4. SEARCH AND LEARNING ................................................................................................................................................................... 18
9.5. SVL AND IVL/SVL ........................................................................................................................................................................... 18

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9.6. ILLEGAL FRAME FILTERING ............................................................................................................................................................. 18


9.7. IEEE 802.3 RESERVED GROUP ADDRESSES FILTERING CONTROL .......................................................................................... 19
9.8. BROADCAST/MULTICAST/UNKNOWN DA STORM CONTROL ................................................................................................... 20
9.9. PORT SECURITY FUNCTION .............................................................................................................................................................. 20
9.10. MIB COUNTERS .................................................................................................................................................................................. 20
9.11. PORT MIRRORING ............................................................................................................................................................................... 20
9.12. VLAN FUNCTION............................................................................................................................................................................... 21
9.12.1. Port-Based VLAN ................................................................................................................................................................... 21
9.12.2. IEEE 802.1Q Tag-Based VLAN .......................................................................................................................................... 21
9.12.3. Protocol-Based VLAN ........................................................................................................................................................... 21
9.13. QOS FUNCTION ................................................................................................................................................................................... 22
9.13.1. Input Bandwidth Control ...................................................................................................................................................... 22
9.13.2. Priority Assignment ............................................................................................................................................................... 22
9.13.3. Priority Queue Scheduling ................................................................................................................................................... 23
9.13.4. IEEE 802.1p/Q and DSCP Remarking .............................................................................................................................. 23
9.13.5. ACL-Based Priority ............................................................................................................................................................... 23
9.14. IEEE 802.1X FUNCTION ................................................................................................................................................................... 24
9.14.1. Port-Based Access Control .................................................................................................................................................. 24
9.14.2. Authorized Port-Based Access Control ............................................................................................................................. 24
9.14.3. Port-Based Access Control Direction ................................................................................................................................ 24
9.14.4. MAC-Based Access Control ................................................................................................................................................. 24
9.14.5. MAC-Based Access Control Direction .............................................................................................................................. 24
9.14.6. Optional Unauthorized Behavior ....................................................................................................................................... 24
9.15. IEEE 802.1D FUNCTION ................................................................................................................................................................... 25
9.16. REALTEK CABLE TEST (RTCT) ....................................................................................................................................................... 25
9.17. LED INDICATORS ............................................................................................................................................................................... 26
9.18. GREEN ETHERNET .............................................................................................................................................................................. 28
9.18.1. Link-On and Cable Length Power Saving ........................................................................................................................ 28
9.18.2. Link-Down Power Saving..................................................................................................................................................... 28
9.19. REGULATOR ......................................................................................................................................................................................... 28
10. INTERFACE DESCRIPTIONS ............................................................................................................................................ 29
10.1. MASTER I2C FOR EEPROM AUTO-LOAD .................................................................................................................................... 29
10.2. REALTEK SLAVE I2C-LIKE INTERFACE FOR EXTERNAL CPU TO ACCESS THE RTL8213B ................................................ 30
10.3. SLAVE MII MANAGEMENT SMI INTERFACE FOR EXTERNAL CPU TO ACCESS RTL8213B .............................................. 31
11. ELECTRICAL CHARACTERISTICS ................................................................................................................................ 32
11.1. ABSOLUTE MAXIMUM RATINGS...................................................................................................................................................... 32
11.2. RECOMMENDED OPERATING RANGE ............................................................................................................................................. 32
11.3. THERMAL CHARACTERISTICS .......................................................................................................................................................... 33
11.3.1. Assembly Description ............................................................................................................................................................ 33
11.3.2. Material Properties ................................................................................................................................................................ 33
11.3.3. Simulation Conditions ........................................................................................................................................................... 33
11.3.4. Thermal Performance of QFN-56 on PCB Under Still Air Convection.................................................................... 34
11.4. DC CHARACTERISTICS ...................................................................................................................................................................... 34
11.5. SWITCH REGULATOR ......................................................................................................................................................................... 34
11.6. AC CHARACTERISTICS ...................................................................................................................................................................... 35

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11.6.1. Master I2C for EEPROM Auto-load Interface Timing Characteristics .................................................................... 35
11.6.2. Slave I2C-like Mode Timing Characteristics ................................................................................................................... 36
11.6.3. Slave MII Management SMI for External CPU Access Interface Timing Characteristics ................................... 37
11.6.4. SGMII/1000Base-X Characteristics .................................................................................................................................. 38
11.6.5. Power and Reset Characteristics ....................................................................................................................................... 40
12. MECHANICAL DIMENSIONS ............................................................................................................................................ 41
13. ORDERING INFORMATION .............................................................................................................................................. 42

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List of Tables
TABLE 1. PIN ASSIGNMENTS TABLE ................................................................................................................................................................... 8
TABLE 2. MEDIA DEPENDENT INTERFACE PINS ............................................................................................................................................... 9
TABLE 3. HIGH SPEED SERIAL INTERFACE PINS............................................................................................................................................... 9
TABLE 4. GENERAL PURPOSE INTERFACES PINS .............................................................................................................................................. 9
TABLE 5. LED PINS ............................................................................................................................................................................................. 10
TABLE 6. CONFIGURATION STRAPPING PINS .................................................................................................................................................. 10
TABLE 7. MANAGEMENT INTERFACE PINS ..................................................................................................................................................... 11
TABLE 8. MISCELLANEOUS PINS ........................................................................................................................................................................... 11
TABLE 9. EMBEDDED SWITCH REGULATOR PINS .............................................................................................................................................. 12
TABLE 10. POWER AND GND PINS ....................................................................................................................................................................... 12
TABLE 11. MEDIA DEPENDENT INTERFACE PIN MAPPING .............................................................................................................................. 15
TABLE 12. RESERVED MULTICAST ADDRESS CONFIGURATION TABLE ........................................................................................................ 19
TABLE 13. LED DEFINITIONS ................................................................................................................................................................................ 26
TABLE 14. SLAVE MII MANAGEMENT SMI ACCESS FORMAT ........................................................................................................................ 31
TABLE 15. ABSOLUTE MAXIMUM RATINGS........................................................................................................................................................ 32
TABLE 16. RECOMMENDED OPERATING RANGE................................................................................................................................................ 32
TABLE 17. ASSEMBLY DESCRIPTION .................................................................................................................................................................... 33
TABLE 18. MATERIAL PROPERTIES ....................................................................................................................................................................... 33
TABLE 19. SIMULATION CONDITIONS .................................................................................................................................................................. 33
TABLE 20. THERMAL PERFORMANCE OF QFN-56 ON PCB UNDER STILL AIR CONVECTION ................................................................. 34
TABLE 21. DC CHARACTERISTICS ........................................................................................................................................................................ 34
TABLE 22. SWITCH REGULATOR ........................................................................................................................................................................... 34
TABLE 23. MASTER I2C FOR EEPROM AUTO-LOAD TIMING CHARACTERISTICS .................................................................................... 35
TABLE 24. SLAVE I2C-LIKE MODE TIMING CHARACTERISTICS ..................................................................................................................... 36
TABLE 25. MDIO TIMING CHARACTERISTICS AND REQUIREMENT .............................................................................................................. 37
TABLE 26. SGMII/1000BASE-X DIFFERENTIAL TRANSMITTER CHARACTERISTICS ................................................................................. 38
TABLE 27. SGMII/1000BASE-X DIFFERENTIAL RECEIVER CHARACTERISTICS ........................................................................................ 39
TABLE 28. POWER AND RESET CHARACTERISTICS ........................................................................................................................................... 40
TABLE 29. ORDERING INFORMATION ................................................................................................................................................................... 42

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List of Figures
FIGURE 1. UNMANAGED MEDIA CONVERTER ................................................................................................................................................... 5
FIGURE 2. BLOCK DIAGRAM ................................................................................................................................................................................ 6
FIGURE 3. PIN ASSIGNMENTS (QFN-40)............................................................................................................................................................ 7
FIGURE 4. CONCEPTUAL EXAMPLE OF POLARITY CORRECTION................................................................................................................ 15
FIGURE 5. PROTOCOL-BASED VLAN FRAME FORMAT AND FLOW CHART ............................................................................................. 22
FIGURE 6. PULL-UP AND PULL-DOWN OF LED PINS FOR SINGLE-COLOR LED .................................................................................... 27
FIGURE 7. PULL-UP AND PULL-DOWN OF LED PINS FOR BI-COLOR LED ............................................................................................. 27
FIGURE 8. SMI START AND STOP COMMAND ................................................................................................................................................. 29
FIGURE 9. MASTER I2C FOR EEPROM AUTO-LOAD INTERFACE CONNECTION EXAMPLE ................................................................. 29
FIGURE 10. 8-BIT EEPROM SEQUENTIAL READ .............................................................................................................................................. 29
FIGURE 11. REALTEK SLAVE I2C-LIKE FOR EXTERNAL CPU ACCESS INTERFACE CONNECTION EXAMPLE........................................ 30
FIGURE 12. REALTEK SLAVE I2C-LIKE INTERFACE WRITE COMMAND ........................................................................................................ 30
FIGURE 13. REALTEK SLAVE I2C-LIKE INTERFACE READ COMMAND.......................................................................................................... 30
FIGURE 14. SLAVE MII MANAGEMENT SMI INTERFACE CONNECTION EXAMPLE ..................................................................................... 31
FIGURE 15. MASTER I2C FOR EEPROM AUTO-LOAD TIMING CHARACTERISTICS ................................................................................... 35
FIGURE 16. SCK/SDA POWER ON TIMING ......................................................................................................................................................... 35
FIGURE 17. SLAVE I2C-LIKE MODE TIMING CHARACTERISTICS.................................................................................................................... 36
FIGURE 18. MDIO SOURCED BY THE MASTER .................................................................................................................................................. 37
FIGURE 19. MDIO SOURCED BY THE RTL8213B (SLAVE) ............................................................................................................................. 37
FIGURE 20. SGMII/1000BASE-X DIFFERENTIAL TRANSMITTER EYE DIAGRAM ....................................................................................... 38
FIGURE 21. SGMII/1000BASE-X DIFFERENTIAL RECEIVER EYE DIAGRAM .............................................................................................. 39
FIGURE 22. POWER AND RESET CHARACTERISTICS .......................................................................................................................................... 40

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1. General Description
The RTL8213B-CG is a QFN40, high-performance media converter featuring low-power integrated 1-port
Giga-PHY that support 1000Base-T, 100Base-TX, and 10Base-T.
For specific applications, the RTL8213B supports one SerDes interface that could be configured as a
SGMII/1000Base-X/100FX interface. The RTL8213B integrates a SRAM for packet buffering, non-
blocking switch fabric, and internal register management into a single CMOS device. Only a 25MHz crystal
is required; an optional EEPROM is offered for internal register configuration.
The embedded packet storage SRAM in the RTL8213B features superior memory management technology
to efficiently utilize memory space. The RTL8213B integrates a 2048-entry look-up table with a 4-way
XOR Hashing algorithm for address searching and learning. The table provides read/write access from the
Slave I2C-like serial Interface, or Slave Media Independent Interface Management (MIIM) Interface. Each
of the entries can be configured as a static entry. Normal entry aging time is between 200 and 400 seconds.
Sixteen Filtering Databases are used to provide Independent VLAN Learning and Shared VLAN Learning
(IVL/SVL) functions.
The Extension GMAC1 of the RTL8213B implements a 1000Base-X/100Base-FX interface.
The RTL8213B supports standard 802.3x flow control frames for full duplex, and optional backpressure
for half duplex. It determines when to invoke the flow control mechanism by checking the availability of
system resources, including the packet buffers and transmitting queues. The RTL8213B supports
broadcast/multicast output dropping, and will forward broadcast/multicast packets to non-blocked ports
only. For IP multicast applications, the RTL8213B can forward IPv4 IGMPv1/v2/v3 and IPv6 MLDv1/v2
snooping protocol packets.
In order to support flexible traffic classification, the RTL8213B supports 48-entry ACL rule check and
multiple actions options. Each port can optionally enable or disable the ACL rule check function. The ACL
rule key can be based on packet physical port, Layer2, Layer3, and Layer4 information. When an ACL rule
matches, the action taken is configurable to Drop/Permit/Redirect/Mirror, change priority value in 802.1q/Q
tag, force output tag format and rate policing. The rate policing mechanism supports from 8Kbps to 1Gbps
(in 8Kbps steps).
In Bridge operation the RTL8213B supports 16 sets of port configurations: disable, block, learning, and
forwarding for Spanning Tree Protocol and Multiple Spanning Tree Protocol. To meet security and
management application requirements, the RTL8213B supports IEEE 802.1x Port-based/MAC-based
Access Control. A 1-set Port Mirroring function is configured to mirror traffic (RX, TX, or both) appearing
on one of the switch’s ports. Support is provided on each port for multiple RFC MIB Counters, for easy
debug and diagnostics.
To improve real-time and multimedia networking applications, the RTL8213B supports eight priority
assignments for each received packet. These are based on (1) Port-based priority; (2) 802.1p/Q VLAN tag
priority; (3) DSCP field in IPv4/IPv6 header; and (4) ACL-assigned priority. Each output port supports a
weighted ratio of eight priority queues to fit bandwidth requirements in different applications. The input
bandwidth control function helps limit per-port traffic utilization. There is one leaky bucket for average
packet rate control for each queue of all ports. Queue scheduling algorithm can use Strict Priority (SP) or
Weighted Fair Queue (WFQ) or Weighted Round Robin (WRR) or mixed.

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The RTL8213B provides a 4096-entry VLAN table for 802.1Q port-based, tag-based, and protocol-based
VLAN operation to separate logical connectivity from physical connectivity. The RTL8213B supports four
Protocol-based VLAN configurations that can optionally select EtherType, LLC, and RFC1042 as the
search key. Each port may be set to any topology via EEPROM upon reset, or Slave I2C-like serial Interface,
or Slave Media Independent Interface Management (MIIM) Interface after reset.

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2. Features
 Embedded single-port 10/100/1000Base-T PHY  2048-entry MAC address table with 4-way hash
algorithm
 Each port supports full duplex 10/100/1000M
 Up to 2048-entry L2/L3 Filtering Database
connectivity (half duplex only supported in
10/100M mode)  Per-port MAC learning limitation

 Extra Interface (Extension GMAC1) supports  System base MAC learning limitation

 SGMII (1.25Gbps) Interface  Supports Spanning Tree Port Behavior


configuration
 1000Base-X Interface
 IEEE 802.1w Rapid Spanning Tree
 100FX Interface
 IEEE 802.1s Multiple Spanning Tree with up to
 Full-duplex and half-duplex operation with IEEE 16 Spanning Tree instances
802.3x flow control and backpressure
 Supports IEEE 802.1x Access Control Protocol
 Supports 9216-byte jumbo packet length
forwarding at wire speed  Port-Based Access Control
 MAC-Based Access Control
 Realtek Cable Test (RTCT) function
 Supports Auto protection from Denial-of-Service
 Supports 48-entry ACL Rules
attacks
 Search keys support physical port, Layer2,
Layer3, and Layer4 information  Supports trap IGMP/MLD packets to external CPU
 Actions include mirror, redirect, dropping,  Supports Quality of Service (QoS)
priority adjustment, traffic policing, CVLAN  Supports per port Input Bandwidth Control
decision, and SVLAN assignment
 Traffic classification based on IEEE 802.1p/Q
 Supports five types of user defined ACL rule priority definition, physical Port, IP DSCP field,
format for 48 ACL rules ACL definition, VLAN based priority, MAC
 Optional per-port enable/disable of ACL function based priority and SVLAN based priority

 Optional setting of per-port action to take when  Eight Priority Queues per port
ACL mismatch  Per queue flow control
 Supports IEEE 802.1Q VLAN  Min-Max Scheduling
 Supports 4096 VLANs and 32 Extra Enhanced  Strict Priority and Weighted Fair Queue (WFQ),
VLANs Weighted Round Robin (WRR) packet
scheduling
 Supports Un-tag definition in each VLAN
 One leaky bucket to constrain the average packet
 Supports VLAN policing and VLAN forwarding
rate of each queue
decision
 Port-based, Tag-based, and Protocol-based  Supports rate limiting (12 shared meters, with
VLAN 8kbps granulation)
 Up to 4 Protocol-based VLAN entries  Supports RFC MIB Counter
 Per-port and per-VLAN egress VLAN tagging  MIB-II (RFC 1213)
and un-tagging
 Ethernet-Like MIB (RFC 3635)
 Supports IVL, SVL, and IVL/SVL  Interface Group MIB (RFC 2863)

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 RMON (RFC 2819) protects system from attack by hackers


 Bridge MIB (RFC 1493)  Supports Realtek Green Ethernet features
 Bridge MIB Extension (RFC 2674)  Link-On Cable Length Power Saving
 Supports Stacking VLAN and Port Isolation with  Link-Down Power Saving
eight Enhanced Filtering Databases
 Port 3 supports 3 parallel LED outputs
 Supports IEEE 802.1ad Stacking VLAN
 Port 6 supports 2 parallel LED outputs
 Supports 64 SVLANs
 Supports Slave I2C-like interface or Slave MII
 Supports MAC-based 1:N VLAN
Management interface to access configuration
 Supports Port Mirror function for one monitor port register
for multiple mirroring ports
 Supports 2K-byte EEPROM space for
 Security Filtering configuration
 Disable learning for each port  Build in 3.3V to 1.1V switch regulator with power
MOS
 Disable learning-table aging for each port
 Drop unknown DA for each port  25MHz crystal or 3.3V OSC input

 Broadcast/Multicast/Unknown DA storm control  5x5 QFN 40-pin package

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Datasheet

3. System Applications
 Unmanaged Media converter

4. Application Examples
4.1. Unmanaged Media Converter

CPU

Address Table MIB Counter

Packet Buffer

Queue Manager ALE Slave SMI/


Configuration
I2C-Like
ACL

Giga Extension
MAC 3 GMAC 1

Giga EEPROM
PHY 3 1000Base-X/100Base-FX

RJ-45
SFP
Jack

Figure 1. Unmanaged Media Converter

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5. Block Diagram

RTL8213B Block Diagram

UTP P3
Giga-PHY PCS SRAM
GMAC
Controller Packet Buffer
SRAM

Queue
SGMII Managment Linking Lists
(1.25Gbps) Extension
SerDes GMAC
1
1000Base-X/
100Base-FX
2048 MAC
Address Table
SWR Lookup
3.3V to 1.1V Engine
SWR

4096 VLAN
Table
LED
LED

Control
Registers
PLL Management
+
I2C Host MIB Counter
Interface

25MHz SCK/SDA
Crystal MDC/MDIO

Figure 2. Block Diagram

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6. Pin Assignments

GPO45/P6LED1/DISAUTOLOAD
GPO52/P3LED0/SMI_SEL

GPO50/P3LED2/EN_PHY

GPIO48/P6LED0/MID29
GPIO51/P3LED1

DVDDIO
AVDDH

DVDDL
XTALO
XTALI
30

29

28

27

26

25

24

23

22

21
SDA 31 20 HV_SWR

SCK 32 19 HV_SWR

nRESET 33 18 LX

PLLVDDL 34 17 LX

AVDDH 35 16 GND_SWR

P3MDIAP 36 15 EN_SWR

P3MDIAN 37 RTL8213B 14 AVDDH

P3MDIBP 38 13 HSIN

P3MDIBN 39
XXXXXXX GXXXB 12 HSIP

AVDDL 40 11 SVDDL
10
1

9
MDIREF
P3MDICP

P3MDIDP

P3MDIDN
P3MDICN

HSON

HSOP
AVDDH
AVDDL

DVDDL

QFN40
E-PAD: GND
Package Size 5mm x 5mm
EPAD Size 3.7mm x 3.7mm

Figure 3. Pin Assignments (QFN-40)

6.1. Package Identification


Green package is indicated by the ‘G’ in GXXX (Figure 3).

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6.2. Pin Assignments Table


Upon Reset: Defined as a short time after the end of a hardware reset.
After Reset: Defined as the time after the specified ‘Upon Reset’ time.

I: Input Pin AI: Analog Input Pin

O: Output Pin AO: Analog Output Pin

I/O: Bi-Directional Input/Output Pin AI/O: Analog Bi-Directional Input/Output Pin

P: Digital Power Pin AP: Analog Power Pin

G: Digital Ground Pin AG: Analog Ground Pin

IPU: Input Pin With Pull-Up Resistor; OPU: Output Pin With Pull-Up Resistor;
(Typical Value = 75K Ohm) (Typical Value = 75K Ohm)

Table 1. Pin Assignments Table


Name Pin Type Name Pin Type
No. No.
P3MDICP 1 AI/O DVDDIO 21 P
P3MDICN 2 AI/O DVDDL 22 P
P3MDIDP 3 AI/O GPO45/P6LED1/DISAUTOLOAD 23 I/OPU
P3MDIDN 4 AI/O GPO48/P6LED0/MID29 24 I/OPU
MDIREF 5 AO GPO50/P3LED2/EN_PHY 25 I/OPU
AVDDL 6 AP GPIO51/P3LED1 26 I/OPU
AVDDH 7 AP GPO52/P3LED0 /SMI_SEL 27 I/OPU
DVDDL 8 P AVDDH 28 AP
HSON 9 AO XTALO 29 AO
HSOP 10 AO XTALI 30 AI
SVDDL 11 AP SDA/MDIO 31 I/O
HSIP 12 AI SCK/MDC 32 I/O
HSIN 13 AI nRESET 33 IPU
AVDDH 14 AP PLLVDDL 34 AP
EN_SWR 15 AI AVDDH 35 AP
GND_SWR 16 AG P3MDIAP 36 AI/O
LX 17 AO P3MDIAN 37 AI/O
LX 18 AO P3MDIBP 38 AI/O
HV_SWR 19 AP P3MDIBN 39 AI/O
HV_SWR 20 AP AVDDL 40 AP

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7. Pin Descriptions
7.1. Media Dependent Interface Pins
Table 2. Media Dependent Interface Pins
Drive
Pin Name Pin No. Type Description
(mA)
P3MDIAP/N 36 AI/O 10 Port 3 Media Dependent Interface A~D.
37 For 1000Base-T operation, differential data from the media is transmitted
P3MDIBP/N 38 and received on all four pairs. For 100Base-TX and 10Base-T operation,
39 only MDIAP/N and MDIBP/N are used. Auto MDIX can reverse the pairs
P3MDICP/N 1 MDIAP/N and MDIBP/N.
2
P3MDIDP/N 3 Each of the differential pairs has an internal 100-ohm termination resistor.
4

7.2. High Speed Serial Interface Pins


Table 3. High Speed Serial Interface Pins
Drive
Pin Name Pin No. Type Description
(mA)
HSOP/N 10 AO 10 High Speed Serial Output Pins: 125MHz/1.25GHz Differential serial
9 interface to transmit data. Keep floating when unused.
HSIP/N 12 AI 10 High Speed Serial Input Pins: 125MHz/1.25GHz Differential serial
13 interface to receive data. Keep floating when unused.

7.3. General Purpose Interfaces


Table 4. General Purpose Interfaces Pins
Other Configuration
Pin No. GPIO
Function Strapping
23 GPO45 P6LED1 DISAUTOLOAD
24 GPO48 P6LED0 MID29
25 GPO50 P3LED2 EN_PHY
26 GPIO51 P3LED1 -
27 GPO52 P3LED0 SMI_SEL

7.4. LED Pins


The RTL8213B LED Pins work in parallel mode. LED0, LED1, LED2 of Port 3 and LED0, LED1 of Port
6 indicate information that can be defined via register or EEPROM.
When the LED pin is pulled low, the LED output polarity will be high active. When the LED pin is pulled
high, the LED output polarity will change from high active to low active. See section 9.17 LED Indicators,
page 26 for more details.
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Table 5. LED Pins


Drive
Pin Name Pin No. Type Description
(mA)
P3LED2/ 25 I/OPU - P3LED2 Output Signal.
GPO50/ P3LED2 indicates information is defined by register or EEPROM.
EN_PHY See section 9.17 LED Indicators, page 26 for more details.
P3LED1/ 26 I/OPU - P3LED1 Output Signal.
GPIO51 P3LED1 indicates information is defined by register or EEPROM.
See section 9.17 LED Indicators, page 26 for more details.
P3LED0/ 27 I/OPU P3LED0 Output Signal.
GPO52/ - P3LED0 indicates information is defined by register or EEPROM.
SMI_SEL See section 9.17 LED Indicators, page 26 for more details.
P6LED1/ 23 I/OPU - P6LED1 Output Signal.
GPO45/ P6LED1 indicates information is defined by register or EEPROM.
DISAUTOLOAD See section 9.17 LED Indicators, page 26 for more details.
P6LED0/ 24 I/OPU - P6LED0 Output Signal.
GPO48/ P6LED0 indicates information is defined by register or EEPROM.
MID29 See section 9.17 LED Indicators, page 26 for more details.

7.5. Configuration Strapping Pins


Table 6. Configuration Strapping Pins
Pin Name Pin No. Type Description
DISAUTOLOAD/ 23 I/OPU Disable EEPROM Autoload.
GPO45/ Pull Up: Disable EEPROM autoload
P6LED1 Pull Down: Enable EEPROM autoload
Note 1: This pin must be kept floating, or pulled high or low via an external 4.7k
ohm resistor upon power on or reset.
When this pin is pulled low, the LED output polarity will be high active. When this
pin is pulled high, the LED output polarity will change from high active to low active.
See section 9.17 LED Indicators, page 26 for more details.
MID29/ 24 I/OPU Slave SMI (MDC/MDIO) Device Address.
GPO48/ Pull Up: Slave SMI (MDC/MDIO) Device Address is d’29
P6LED0 Pull Down: Slave SMI (MDC/MDIO) Device Address is 0
Note: This pin must be kept floating, or pulled high or low via an external 4.7k ohm
resistor upon power on or reset.
EN_PHY/ 25 I/OPU Enable Embedded PHY.
GPO50/ Pull Up: Enable embedded PHY
P3LED2 Pull Down: Disable embedded PHY
Note: This pin must be kept floating, or pulled high or low via an external 4.7k ohm
resistor upon power on or reset.
When this pin is pulled low, the LED output polarity will be high active. When this
pin is pulled high, the LED output polarity will change from high active to low active.
See section 9.17 LED Indicators, page 26 for more details.

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Pin Name Pin No. Type Description


SMI_SEL/ 27 I/OPU Slave I2C-like/Slave MII Management Interface Selection.
GPO52/ Pull Up: Slave I2C-like interface
P3LED0 Pull Down: Slave MII Management interface
Note: This pin must be kept floating, or pulled high or low via an external 4.7k ohm
resistor upon power on or reset.
When this pin is pulled low, the LED output polarity will be high active. When this
pin is pulled high, the LED output polarity will change from high active to low active.
See section 9.17 LED Indicators, page 26 for more details.

7.6. Management Interface Pins


Table 7. Management Interface Pins
Pin Name Pin No. Type Description
SCK/ 32 I/O Master I2C Interface Clock for EEPROM auto-download.
MDC Slave I2C Interface Clock for external CPU to access DUT.
Slave MII Management Interface Clock (selected via the hardware strapping
SMI_SEL).
SDA/ 31 I/O Master I2C Interface Data for EEPROM auto-download.
MDIO Slave I2C Interface Data for external CPU to access DUT.
Slave MII Management Interface Data (selected via the hardware strapping
SMI_SEL).

7.7. Miscellaneous Pins


Table 8. Miscellaneous Pins
Pin Name Pin No. Type Description
MDIREF 5 AO Reference Resistor.
A 2.49K ohm (1%) resistor must be connected between MDIREF and GND.
GPO45/ 23 I/OPU General Purpose Output Interface IO45.
P6LED1/
DISAUTOLOAD
GPO48/ 24 I/OPU General Purpose Output Interface IO48.
P6LED0/
MID29
GPO50/ 25 I/OPU General Purpose Output Interface IO50.
P3LED2/
EN_PHY
GPIO51/ 26 I/OPU General Purpose Input/Output Interface IO51.
P3LED1
GPO52/ 27 I/OPU General Purpose Output Interface IO52.
P3LED0/
SMI_SEL
XTALO 29 AO 25MHz Crystal Clock Output Pin.

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Pin Name Pin No. Type Description


XTALI 30 AI 25MHz Crystal Clock Input Pin.
25MHz +/-50ppm tolerance crystal reference.
When using a crystal, connect a loading capacitor between crystal pin and ground.
When either using an oscillator or driving an external 25MHz clock from another
device, XTALO should kept floating.
nRESET 33 IPU System Reset Input Pin.
When low active will reset the RTL8213B-CG.

7.8. Embedded Switch Regulator Pins


Table 9. Embedded Switch Regulator Pins
Pin Name Pin No. Type Description
EN_SWR 15 AI Enable embedded switch regulator.
Pull Up: Enable embedded switch regulator.
Pull Down: Disable embedded switch regulator.
Note: pulled high or low via an external 4.7k ohm resistor to enable or disable
embedded switch regulator.
GND_SWR 16 AG Regulator Ground.
LX 17, 18 AO Regulator output. It should connect to the external inductor.
HV_SWR 19, 20 AP Regulator Power Supply Input.

7.9. Power and GND Pins


Table 10. Power and GND Pins
Pin Name Pin No. Type Description
DVDDIO 21 P Digital I/O High Voltage Power for LED, Management Interface,
and nRESET.
DVDDL 8, 22 P Digital Low Voltage Power.
AVDDH 7, 14, 28, 35 AP Analog High Voltage Power.
AVDDL 6, 40 AP Analog Low Voltage Power.
SVDDL 11 AP SerDes Low Voltage Power.
PLLVDDL 34 AP PLL Low Voltage Power.
GND E-PAD G GND.

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8. Physical Layer Functional Overview


8.1. MDI Interface
The RTL8213B embeds Single10/100/1000M Ethernet PHYs in one chip. Each port uses a single common
MDI interface to support 1000Base-T, 100Base-TX, and 10Base-T. This interface consists of four signal
pairs-A, B, C, and D. Each signal pair consists of two bi-directional pins that can transmit and receive at
the same time. The MDI interface has internal termination resistors, and therefore reduces BOM cost and
PCB complexity. For 1000Base-T, all four pairs are used in both directions at the same time. For 10/100
links and during auto-negotiation, only pairs A and B are used.

8.2. 1000Base-T Transmit Function


The 1000Base-TX transmit function performs 8B/10B coding, scrambling, and 4D-PAM5 encoding. These
code groups are passed through a waveform-shaping filter to minimize EMI effects, and are transmitted
onto 4-pair CAT5 cable at 125MBaud/s through a D/A converter.

8.3. 1000Base-T Receive Function


Input signals from the media pass through the sophisticated on-chip hybrid circuit to subtract the transmitted
signal from the input signal for effective reduction of near-end echo. The received signal is then processed
with state-of-the-art technology, e.g., adaptive equalization, BLW (Baseline Wander) correction, cross-talk
cancellation, echo cancellation, timing recovery, error correction, and 4D-PAM5 decoding. The 8-bit-wide
data is recovered and is sent to the GMII interface at a clock speed of 125MHz. The RX MAC retrieves the
packet data from the internal receive MII/GMII interface and sends it to the packet buffer manager.

8.4. 100Base-TX Transmit Function


The 100Base-TX transmit function performs parallel to serial conversion, 4B/5B coding, scrambling,
NRZ/NRZI conversion, and MLT-3 encoding. The 5-bit serial data stream after 4B/5B coding is then
scrambled as defined by the TP-PMD Stream Cipher function to flatten the power spectrum energy such
that EMI effects can be reduced significantly.
The scrambled seed is based on PHY addresses and is unique for each port. After scrambling, the bit stream
is driven onto the network media in the form of MLT-3 signaling. The MLT-3 multi-level signaling
technology moves the power spectrum energy from high frequency to low frequency, which also reduces
EMI emissions.

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8.5. 100Base-TX Receive Function


The receive path includes a receiver composed of an adaptive equalizer and DC restoration circuits (to
compensate for an incoming distorted MLT-3 signal), an MLT-3 to NRZI and NRZI to NRZ converter to
convert analog signals to digital bit-stream, and a PLL circuit to clock data bits with minimum bit error rate.
A de-scrambler, 5B/4B decoder, and serial-to-parallel conversion circuits are followed by the PLL circuit.
Finally, the converted parallel data is fed into the MAC.

8.6. 10Base-T Transmit Function


The output 10Base-T waveform is Manchester-encoded before it is driven onto the network media. The
internal filter shapes the driven signals to reduce EMI emissions, eliminating the need for an external filter.

8.7. 10Base-T Receive Function


The Manchester decoder converts the incoming serial stream to NRZ data when the squelch circuit detects
the signal level is above squelch level.

8.8. Auto-Negotiation for UTP


The RTL8213B obtains the states of duplex, speed, and flow control ability for each port in UTP mode
through the auto-negotiation mechanism defined in the IEEE 802.3 specifications. During auto-negotiation,
each port advertises its ability to its link partner and compares its ability with advertisements received from
its link partner. By default, the RTL8213B advertises full capabilities (1000Full, 100Full, 100Half, 10Full,
10Half) together with flow control ability.

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8.9. Crossover Detection and Auto Correction


The RTL8213B automatically determines whether or not it needs to crossover between pairs (see Table 11)
so that an external crossover cable is not required. When connecting to another device that does not perform
MDI crossover, when necessary, the RTL8213B automatically switches its pin pairs to communicate with
the remote device. When connecting to another device that does have MDI crossover capability, an
algorithm determines which end performs the crossover function.
The crossover detection and auto correction function can be disabled via register configuration. The pin
mapping in MDI and MDI Crossover mode is given below.
Table 11. Media Dependent Interface Pin Mapping
Pairs MDI MDI Crossover
1000Base-T 100Base-TX 10Base-T 1000Base-T 100Base-TX 10Base-T
A A TX TX B RX RX
B B RX RX A TX TX
C C Unused Unused D Unused Unused
D D Unused Unused C Unused Unused

8.10. Polarity Correction


The RTL8213B automatically corrects polarity errors on the receiver pairs in 1000Base-T and 10Base-T
modes. In 100Base-TX mode, the polarity is irrelevant.
In 1000Base-T mode, receive polarity errors are automatically corrected based on the sequence of idle
symbols. Once the de-scrambler is locked, the polarity is also locked on all pairs. The polarity becomes
unlocked only when the receiver loses lock.
In 10Base-T mode, polarity errors are corrected based on the detection of valid spaced link pulses. The
detection begins during the MDI crossover detection phase and locks when the 10Base-T link is up. The
polarity becomes unlocked when the link is down.

Link Partner RTL8213B

+ +
RX _ _ TX

+ _ +
TX _ + _ RX

Figure 4. Conceptual Example of Polarity Correction

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9. General Function Descriptions


9.1. Reset
9.1.1. Hardware Reset
In a power-on reset, an internal power-on reset pulse is generated and the RTL8213B will start the reset
initialization procedures. These are:
 Determine various default settings via the hardware strap pins at the end of the nRESET signal
 Auto-load the configuration from EEPROM if EEPROM is detected
 Complete the embedded SRAM BIST process
 Initialize the packet buffer descriptor allocation
 Initialize the internal registers and prepare them to be accessed by the external CPU

9.1.2. Software Reset


The RTL8213B supports two software resets; a chip reset and a soft reset.

9.1.2.1 CHIP_RESET
When CHIP_RESET is set to 0b1 (write and self-clear), the chip will take the following steps:
1. Download configuration from strap pin and EEPROM
2. Start embedded SRAM BIST (Built-In Self Test)
3. Clear all the Lookup and VLAN tables
4. Reset all registers to default values
5. Restart the auto-negotiation process

9.1.2.2 SOFT_RESET
When SOFT_RESET is set to 0b1 (write and self-clear), the chip will take the following steps:
1. Clear the FIFO and re-start the packet buffer link list
2. Restart the auto-negotiation process

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9.2. IEEE 802.3x Full Duplex Flow Control


The RTL8213B supports IEEE 802.3x flow control in 10/100/1000M modes. Flow control can be decided
in two ways:
 When Auto-Negotiation is enabled, flow control depends on the result of NWay
 When Auto-Negotiation is disabled, flow control depends on register definition

9.3. Half Duplex Flow Control


In half duplex mode, the CSMA/CD media access method is the means by which two or more stations share
a common transmission medium. To transmit, a station waits (defers) for a quiet period on the medium
(that is, no other station is transmitting) and then sends the intended message in bit-serial form. If the
message collides with that of another station, then each transmitting station intentionally transmits for an
additional predefined period to ensure propagation of the collision throughout the system. The station
remains silent for a random amount of time (backoff) before attempting to transmit again.
When a transmission attempt has terminated due to a collision, it is retried until it is successful. The
scheduling of the retransmissions is determined by a controlled randomization process called ‘Truncated
Binary Exponential Backoff’. At the end of enforcing a collision (jamming), the switch delays before
attempting to retransmit the frame. The delay is an integer multiple of slot time (512 bit times). The number
of slot times to delay before the nth retransmission attempt is chosen as a uniformly distributed random
integer ‘r’ in the range:
0 ≤ r < 2k
where:
k = min (n, backoffLimit). The backoffLimit for the RTL8213B is 9.
The half duplex back-off algorithm in the RTL8213B does not have the maximum retry count limitation of
16 (as defined in IEEE 802.3). This means packets in the switch will not be dropped if the back-off retry
count is over 16.

9.3.1. Back-Pressure Mode


In Back-Pressure mode, the RTL8213B sends a 4-byte jam pattern (data=0xAA) to collide with incoming
packets when congestion control is activated. The Jam pattern collides at the fourth byte counted from the
preamble. The RTL8213B supports 48PASS1, which receives one packet after 48 consecutive jam
collisions (data collisions are not included in the 48). Enable this function to prevent port partition after 63
consecutive collisions (data collisions + consecutive jam collisions).

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9.4. Search and Learning


Search
When a packet is received, the RTL8213B uses the destination MAC address, Filtering Identifier (FID) and
Enhanced Filtering Identifier (EFID) to search the 2048-entry look-up table. The 48-bit MAC address, 4-
bit FID and 3-bit EFID use a hash algorithm, to calculate an 11-bit index value. The RTL8213B uses the
index to compare the packet MAC address with the entries (MAC addresses) in the look-up table. This is
the ‘Address Search’. If the destination MAC address is not found, the switch will broadcast the packet
according to VLAN configuration.
Learning
The RTL8213B uses the source MAC address, FID, and EFID of the incoming packet to hash into a 9-bit
index (4-entry). It then compares the source MAC address with the data (MAC addresses) in this index. If
there is a match with one of the entries, the RTL8213B will update the entry with new information. If there
is no match and the 4 entries are not all occupied by other MAC addresses, the RTL8213B will record the
source MAC address and ingress port number into an empty entry. This process is called ‘Learning’.
Address aging is used to keep the contents of the address table correct in a dynamic network topology. The
look-up engine will update the time stamp information of an entry whenever the corresponding source
MAC address appears. An entry will be invalid (aged out) if its time stamp information is not refreshed by
the address learning process during the aging time period. The aging time of the RTL8213B is between 200
and 400 seconds (typical is 300 seconds).

9.5. SVL and IVL/SVL


The RTL8213B supports a 16-group Filtering Identifier (FID) for L2 search and learning. In default
operation, all VLAN entries belong to the same FID. This is called Shared VLAN Learning (SVL). If
VLAN entries are configured to different FIDs, then the same source MAC address with multiple FIDs can
be learned into different look-up table entries. This is called Independent VLAN Learning and Shared
VLAN Learning (IVL/SVL).

9.6. Illegal Frame Filtering


Illegal frames such as CRC error packets, runt packets (length <64 bytes), and oversize packets
(length >maximum length) will be discarded by the RTL8213B. The maximum packet length may be set
from 1518 bytes to 16K bytes.

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9.7. IEEE 802.3 Reserved Group Addresses Filtering Control


The RTL8213B supports the ability to drop/forward IEEE 802.3 specified reserved group MAC addresses:
01-80-C2-00-00-00 to 01-80-C2-00-00-2F. The default setting enables forwarding of these reserved group
MAC address control frames. Frames with group MAC address 01-80-C2-00-00-01 (802.3x Pause) will
always be filtered. Table 12 shows the Reserved Multicast Address (RMA) configuration mode from 01-
80-C2-00-00-00 to 01-80-C2-00-00-2F.
Table 12. Reserved Multicast Address Configuration Table
Assignment Value
Bridge Group Address 01-80-C2-00-00-00
IEEE Std 802.3, 1988 Edition, Full Duplex PAUSE Operation 01-80-C2-00-00-01
IEEE Std 802.3ad Slow Protocols-Multicast Address 01-80-C2-00-00-02
IEEE Std 802.1X PAE Address 01-80-C2-00-00-03
Provider Bridge Group Address 01-80-C2-00-00-08
Undefined 802.1 Address 01-80-C2-00-00-04 ~
01-80-C2-00-00-07
&
01-80-C2-00-00-09 ~
01-80-C2-00-00-0C
&
01-80-C2-00-00-0F
Provider Bridge MVRP Address 01-80-C2-00-00-0D
IEEE Std 802.1AB Link Layer Discovery Protocol Address 01-80-C2-00-00-0E
All LANs Bridge Management Group Address 01-80-C2-00-00-10
Load Server Generic Address 01-80-C2-00-00-11
Loadable Device Generic Address 01-80-C2-00-00-12
Undefined 802.1 Address 01-80-C2-00-00-13 ~
01-80-C2-00-00-17
&
01-80-C2-00-00-19
&
01-80-C2-00-00-1B ~
01-80-C2-00-00-1F
Generic Address for All Manager Stations 01-80-C2-00-00-18
Generic Address for All Agent Stations 01-80-C2-00-00-1a
GMRP Address 01-80-C2-00-00-20
GVRP Address 01-80-C2-00-00-21
Undefined GARP Address 01-80-C2-00-00-22
|
01-80-C2-00-00-2F
CDP (Cisco Discovery Protocol) 01-00-0C-CC-CC-CC
CSSTP (Cisco Shared Spanning Tree Protocol) 01-00-0C-CC-CC-CD
LLDP (01:80:c2:00:00:0e or
01:80:c2:00:00:03 or
01:80:c2:00:00:00)
&& ethertype = 0x88CC

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9.8. Broadcast/Multicast/Unknown DA Storm Control


The RTL8213B enables or disables per-port broadcast/multicast/unknown DA storm control by setting
registers (default is disabled). After the receiving rate of broadcast/multicast/unknown DA packets exceeds
a reference rate (number of Kbps per second or number of packets per second), all other
broadcast/multicast/unknown DA packets will be dropped. The reference rate is set via register
configuration.

9.9. Port Security Function


The RTL8213B supports three types of security function to prevent malicious attacks:
 Per-port enable/disable SA auto-learning for an ingress packet
 Per-port enable/disable look-up table aging update function for an ingress packet
 Per-port enable/disable drop all unknown DA packets

9.10. MIB Counters


The RTL8213B supports a set of counters to support management functions.
 MIB-II (RFC 1213)
 Ethernet-Like MIB (RFC 3635)
 Interface Group MIB (RFC 2863)
 RMON (RFC 2819)
 Bridge MIB (RFC 1493)
 Bridge MIB Extension (RFC 2674)

9.11. Port Mirroring


The RTL8213B supports one set of port mirroring functions for all ports. The TX, or RX, or both TX/RX
packets from multiple mirrored port can be mirrored to one monitor port.

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9.12. VLAN Function


The RTL8213B supports 4096 VLAN groups. These can be configured as port-based VLANs,
IEEE 802.1Q tag-based VLANs, and Protocol-based VLANs. Two ingress-filtering and egress-filtering
options provide flexible VLAN configuration:
Ingress Filtering
 The acceptable frame type of the ingress process can be set to ‘Admit All’, ‘Admit only Untagged’ or ‘Admit only
Tagged’
 ‘Admit’ or ‘Discard’ frames associated with a VLAN for which that port is not in the member set

Egress Filtering
 ‘Forward’ or ‘Discard’ Leaky VLAN frames between different VLAN domains
 ‘Forward’ or ‘Discard’ Multicast VLAN frames between different VLAN domains
The VLAN tag can be inserted or removed at the output port. The RTL8213B will insert a Port VID (PVID)
for untagged frames, or remove the tag from tagged frames. The RTL8213B also supports a special insert
VLAN tag function to separate traffic from the WAN and LAN sides in Router and Gateway applications.

9.12.1. Port-Based VLAN


This default configuration of the VLAN function can be modified via an attached Slave I2C-like serial
Interface, or Slave Media Independent Interface Management (MIIM) Interface. The 4096-entry VLAN
Table designed into the RTL8213B provides full flexibility for users to configure the input ports to associate
with different VLAN groups. Each input port can join with more than one VLAN group.
Port-based VLAN mapping is the simplest implicit mapping rule. Each ingress packet is assigned to a
VLAN group based on the input port. It is not necessary to parse and inspect frames in real-time to
determine their VLAN association. All the packets received on a given input port will be forwarded to this
port’s VLAN members.

9.12.2. IEEE 802.1Q Tag-Based VLAN


The RTL8213B supports 4096 VLAN entries to perform 802.1Q tag-based VLAN mapping. In 802.1Q
VLAN mapping, the RTL8213B uses a 12-bit explicit identifier in the VLAN tag to associate received
packets with a VLAN. The RTL8213B compares the explicit identifier in the VLAN tag with the 4096
VLAN Table to determine the VLAN association of this packet, and then forwards this packet to the
member set of that VLAN. Two VIDs are reserved for special purposes. One of them is all 1’s, which is
reserved and currently unused. The other is all 0’s, which indicates a priority tag. A priority-tagged frame
should be treated as an untagged frame.
Two VLAN ingress filtering functions are supported in registers by the RTL8213B. One is the ‘VLAN tag
admit control, which provides the ability to receive VLAN-tagged frames only. Untagged or priority tagged
(VID=0) frames will be dropped. The other is ‘VLAN member set ingress filtering’, which will drop frames
if the ingress port is not in the member set.

9.12.3. Protocol-Based VLAN


The RTL8213B supports a 4-group Protocol-based VLAN configuration. The packet format can be RFC
1042, LLC, or Ethernet, as shown in Figure 5. There are 4 configuration tables to assign the frame type and

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corresponding field value. Taking IP packet configuration as an example, the user can configure the frame
type to be ‘Ethernet’, and value to be ‘0x0800’. Each table will index to one of the entries in the 4096-entry
VLAN table. The packet stream will match the protocol type and the value will follow the VLAN member
configuration of the indexed entry to forward the packets.
Ethernet DA/SA TYPE ……

RFC_1042 DA/SA Length AA- AA-03 00-00-00 TYPE ……

LLC_Other DA/SA Length DSAP/SSAP ……

Frame Input

Type/Length is Frame Type


No
00-00~05-FF? = Ethernet

6 bytes after
Type/Length are Frame Type
No
AA-AA-03-00-00-00? = LLC_ Other

Frame Type
= RFC_1042

Figure 5. Protocol-Based VLAN Frame Format and Flow Chart

9.13. QoS Function


The RTL8213B supports 8 priority queues and input bandwidth control. Packet priority selection can
depend on Port-based priority, 802.1p/Q Tag-based priority, IPv4/IPv6 DSCP-based priority, and ACL-
based priority. When multiple priorities are enabled in the RTL8213B, the packet’s priority will be assigned
based on the priority selection table.
Each queue has one leaky bucket for Average Packet Rate. Per-queue in each output port can be set as Strict
Priority (SP) or Weighted Round Robin (WRR), or Weighted Fair Queue (WFQ) for packet scheduling
algorithm.

9.13.1. Input Bandwidth Control


Input bandwidth control limits the input bandwidth. When input traffic is more than the RX Bandwidth
parameter, this port will either send out a ‘pause ON’ frame, or drop the input packet depending on register
setup. Per-port input bandwidth control rates can be set from 8Kbps to 1Gbps (in 8Kbps steps).

9.13.2. Priority Assignment


Priority assignment specifies the priority of a received packet according to various rules. The RTL8213B
can recognize the QoS priority information of incoming packets to give a different egress service priority.

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The RTL8213B identifies the priority of packets based on several types of QoS priority information:
 Port-based priority
 802.1p/Q-based priority
 IPv4/IPv6 DSCP-based priority
 ACL-based priority
 VLAN-based priority
 MAC-based priority
 SVLAN-based priority

9.13.3. Priority Queue Scheduling


The RTL8213B supports MAX-MIN packet scheduling.
Packet scheduling offers two modes:
 Average Packet Rate (APR) leaky bucket, which specifies the average rate of one queue
 Weighted Fair Queue (WFQ), which decides which queue is selected in one slot time to guarantee the minimal packet
rate of one queue
 Weighted Round Robin (WRR)
In addition, each queue of each port can select Strict Priority or WFQ or WRR packet scheduling according
to packet scheduling mode.

9.13.4. IEEE 802.1p/Q and DSCP Remarking


The RTL8213B supports the IEEE 802.1p/Q and IP DSCP (Differentiated Services Code Point) remarking
function. When packets egress from one of the 8 queues, the packet’s 802.1p/Q priority and IP DSCP can
optionally be remarked to a configured value. 802.1p/Q priority & IP DSCP value can be remarked based
on internal priority or original 802.1p/Q priority & IP DSCP value in packets.

9.13.5. ACL-Based Priority


The RTL8213B supports 48-entry ACL (Access Control List) rules. When a packet is received, its physical
port, Layer2, Layer3, and Layer4 information are recorded and compared to ACL entries. If a received
packet matches multiple entries, the entry with the lowest address is valid. If the entry is valid, the action
bit will be applied to which related action bit is enable.
If a packet hits an ACL rule and the priority action bit is ‘enable’, then this packet gets a 3-bit ACL-priority
from the ACL module.

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9.14. IEEE 802.1x Function


The RTL8213B supports IEEE 802.1x Port-based/MAC-based Access Control.
 Port-Based Access Control for each port
 Authorized Port-Based Access Control for each port
 Port-Based Access Control Direction for each port
 MAC-Based Access Control for each port
 MAC-Based Access Control Direction
 Optional Unauthorized Behavior

9.14.1. Port-Based Access Control


Each port of the RTL8213B can be set to 802.1x port-based authenticated checking function usage and
authorized status. Ports with 802.1X unauthorized status will drop received/transmitted frames.

9.14.2. Authorized Port-Based Access Control


If a dedicated port is set to 802.1x port-based access control, and passes the 802.1x authorization, then its
port authorization status can be set to authorized.

9.14.3. Port-Based Access Control Direction


Ports with 802.1X unauthorized status will drop received/transmitted frames only when port authorization
direction is ‘BOTH’. If the authorization direction of an 802.1X unauthorized port is IN, incoming frames
to that port will be dropped, but outgoing frames will be transmitted.

9.14.4. MAC-Based Access Control


MAC-Based Access Control provides authentication for multiple logical ports. Each logical port represents
a source MAC address. There are multiple logical ports for a physical port. When a logical port or a MAC
address is authenticated, the relevant source MAC address has the authorization to access the network. A
frame with a source MAC address that is not authenticated by the 802.1x function will be dropped or trapped
to the CPU.

9.14.5. MAC-Based Access Control Direction


Unidirectional and Bi-directional control are two methods used to process frames in 802.1x. As the system
cannot predict which port the DA is on, a system-wide MAC-based access control direction setup is
provided for determining whether receiving or bi-direction should be authorized.
If MAC-based access control direction is BOTH, then received frames with unauthenticated SA or
unauthenticated DA will be dropped. When MAC-based access control direction is IN, only received frames
with unauthenticated SA will be dropped.

9.14.6. Optional Unauthorized Behavior


Port-Based Network Access Control and MAC-Based Access Control offer a whole system control to
determine unauthorized frame dropping, or trapping to CPU.

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9.15. IEEE 802.1D Function


When using IEEE 802.1D, the RTL8213B supports 16 sets and four status’ for each port for CPU
implementation 802.1D (STP) and 802.1s (MSTP) function:
 Disabled: The port will not transmit/receive packets, and will not perform learning
 Blocking: The port will only receive BPDU spanning tree protocol packets, but will not transmit any packets, and will
not perform learning
 Learning: The port will receive any packet, including BPDU spanning tree protocol packets, and will perform learning,
but will only transmit BPDU spanning tree protocol packets
 Forwarding: The port will transmit/receive all packets, and will perform learning
The RTL8213B also supports a per-port transmission/reception enable/disable function. Users can control
the port state via register.

9.16. Realtek Cable Test (RTCT)


The RTL8213B physical layer transceivers use DSP technology to implement the Realtek Cable Test
(RTCT) feature. The RTCT function can be used to detect short, open or impedance mismatch in each
differential pair. The RTL8213B also provides LED support to indicate test status and results.

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9.17. LED Indicators


The RTL8213B supports parallel LEDs for each port. Port 3 has three LED indicator pins, LED0, LED1,
LED2, and Port 6 has two LED indicator pins, LED0, LED1. Each pin may have different indicator
information (defined in Table 13). Refer to section 7.4 LED Pins, page 9 for pin details.
Table 13. LED Definitions
LED Status Description
LED_Off LED Output off.
Dup/Col Duplex/Collision Indicator. Blinking when collision occurs. Low for full duplex, and high for half
duplex mode.
Link/Act Link, Activity Indicator. Low for link established. Link/Act Blinking when the corresponding port is
transmitting or receiving.
Spd1000 1000Mbps Speed Indicator. Low for 1000Mbps.
Spd100 100Mbps Speed Indicator. Low for 100Mbps.
Spd10 10Mbps Speed Indicator. Low for 10Mbps.
Spd1000/Act 1000Mbps Speed/Activity Indicator. Low for 1000Mbps. Blinking when the corresponding port is
transmitting or receiving.
Spd100/Act 100Mbps Speed/Activity Indicator. Low for 100Mbps. Blinking when the corresponding port is
transmitting or receiving.
Spd10/Act 10Mbps Speed/Activity Indicator. Low for 10Mbps. Blinking when the corresponding port is
transmitting or receiving.
Spd100 (10)/Act 10/100Mbps Speed/Activity Indicator. Low for 10/100Mbps. Blinking when the corresponding port
is transmitting or receiving.
Act Activity Indicator. Act blinking when the corresponding port is transmitting or receiving.

The LED pin also supports pin strapping configuration functions. The PnLED0, PnLED1, and PnLED2
pins are dual-function pins: input operation for configuration upon reset, and output operation for LED after
reset. When the pin input is pulled high upon reset, the pin output is active low after reset. When the pin
input is pulled down upon reset, the pin output is active high after reset (see Figure 6 and Figure 7). Typical
values for pull-up/pull-down resistors are 4.7K.
The PnLED1 can be combined with PnLED0 or PnLED2 as a Bi-color LED.
The PnLED1 should operate with the same polarity as other Bi-color LED pins. For example:
 P3LED1 should pull up upon reset if P3LED1 is combined with P3LED2 as a Bi-color LED, and P3LED2 input is
pulled high upon reset. In this configuration, the output of these pins is active low after reset
 P3LED1 should be pulled down upon reset if P3LED1 is combined with P3LED2 as a Bi-color LED, and P3LED2
input is pulled down upon reset. In this configuration, the output of these pins is active high after reset

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Pull-Up Pull-Down
DVDDIO
4.7K LED Pin
ohm 470 ohm RTL8213B

4.7K 470 ohm


RTL8213B ohm
LED Pin

LED Pins Output Active Low LED Pins Output Active High
Figure 6. Pull-Up and Pull-Down of LED Pins for Single-Color LED

Pull-Up Pull-Down
4.7K
SPD 1000 ohm DVDDIO SPD 100 4.7K ohm

470ohm 470ohm
RTL8213B RTL8213B
Yellow Green Yellow Green

SPD100 4.7K ohm SPD1000 4.7K ohm


LED Pins Output Active Low LED Pins Output Active High
Figure 7. Pull-Up and Pull-Down of LED Pins for Bi-Color LED

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9.18. Green Ethernet


9.18.1. Link-On and Cable Length Power Saving
The RTL8213B provides link-on and dynamic detection of cable length and dynamic adjustment of power
required for the detected cable length. This feature provides high performance with minimum power
consumption.

9.18.2. Link-Down Power Saving


The RTL8213B implements link-down power saving on a per-port basis, greatly cutting power
consumption when the network cable is disconnected. After it detects an incoming signal, it wakes up from
link-down power saving and operates in normal mode.

9.19. Regulator
The RTL8213B embeds a 3.3V-1.1V switch regulator to simplify the power solution. The 1.1V output
power is used for the digital core and analog circuits. Do not use the regulator for other chips, even if the
rating is enough.

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10. Interface Descriptions


10.1. Master I2C for EEPROM Auto-load
The EEPROM interface of the RTL8213B uses the serial I2C bus to read the serial EEPROM. When the
RTL8213B is powered up, it drives SCK and SDA to read the configuration data from the EEPROM by
strapping configuration.

SDA

SCK

START STOP

Figure 8. SMI Start and Stop Command

3.3V
NC-1.5K ohm
I2C Master EERPOM
SCK EEPROM_SCL
3.3V
1.5K ohm

SDA EEPROM_SDA

4.7K ohm
DISAUTOLOAD

Figure 9. Master I2C for EEPROM Auto-load Interface Connection Example

1 ADDRESS BYTE
1 CONTROL BYTE 1 CONTROL BYTE The 1st DATA BYTE The 2nd DATA BYTE N
O
R/ A A R/ A A A
S 1 0 1 0 0 0 0 W# C ADDR[7:0] C S 1 0 1 0 0 0 0 W# C C C P
(0) K K (1) K K K
MSB to LSB MSB to LSB MSB to LSB

ACK by ACK by ACK by ACK by Master NOACK by Master


Slave(EEPROM) Slave(EEPROM) Slave(EEPROM)

Figure 10. 8-Bit EEPROM Sequential Read

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10.2. Realtek Slave I2C-Like Interface for External CPU to Access


the RTL8213B
When EEPROM auto-load is complete, the RTL8213B registers can be accessed through SCK and SDA
via an external CPU. The device address of the RTL8213B is 0x4. For the start and end of a write/read
command, SCK needs one extra clock before/after the start/stop signals.
3.3V
1.5K ohm
I2C Slave External CPU
S_SCK M_SCL
3.3V
1.5K ohm

S_SDA M_SDA
3.3V

4.7K ohm*
SMI_SEL

Figure 11. Realtek Slave I2C-Like for External CPU Access Interface Connection Example

The 1st ADDRESS The 2nd ADDRESS The 1st DATA BYTE The 2nd DATA BYTE
1 CONTROL BYTE BYTE (reg_addr[7:0]) BYTE (reg_addr[15:8]) (write_data[7:0]) (write_data[15:8])
R/ A A A A A
S 1 0 1 1 1 0 0 W# C ADDR[7:0] C ADDR[15:8] C C C P
(0) K K K K K
MSB to LSB MSB to LSB MSB to LSB MSB to LSB

ACK by Slave ACK by Slave ACK by Slave ACK by Slave ACK by Slave

Figure 12. Realtek Slave I2C-Like Interface Write Command

The 1st ADDRESS The 2nd ADDRESS The 1st DATA BYTE The 2nd DATA BYTE
1 CONTROL BYTE BYTE (reg_addr[7:0]) N
BYTE (reg_addr[15:8]) (read_data[7:0]) (read_data[15:8])
O
R/ A A A A A
S 1 0 1 1 1 0 0 W# C ADDR[7:0] C ADDR[15:8] C C C P
(1) K K K K K
MSB to LSB MSB to LSB MSB to LSB MSB to LSB

ACK by Slave ACK by Slave ACK by Slave ACK by Master NOACK by Master

Figure 13. Realtek Slave I2C-Like Interface Read Command

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10.3. Slave MII Management SMI Interface for External CPU to


Access RTL8213B
The RTL8213B registers can be accessed via Slave MDC and MDIO via an external CPU (Decided by
Strapping Configuration).

SMI Slave 33 ohm


External CPU
S_MDC M_MDC
3.3V
1.5K ohm

S_MDIO M_MDIO

4.7K ohm
SMI_SEL

Figure 14. Slave MII Management SMI Interface Connection Example

Table 14. Slave MII Management SMI Access Format


Management Frame Fields
PRE ST OP DEVAD REGAD TA DATA IDLE
Read 1…1 01 10 AAAAA RRRRR Z0 DDDDDDDDDDDDDDDD Z
Write 1…1 01 01 AAAAA RRRRR 10 DDDDDDDDDDDDDDDD Z
Note: By default the Slave needs no less than 32bit Preambles (PRE) before accessing the slave via the Slave SMI interface. An
external CPU can configure the Slave to enable the preamble suppression function. When preamble suppression is enabled the
Slave does not need preamble before accessing the slave.

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11. Electrical Characteristics


11.1. Absolute Maximum Ratings
WARNING: Absolute maximum ratings are limits beyond which permanent damage may be caused to the
device, or device reliability will be affected. All voltages are specified reference to GND unless otherwise
specified.
Table 15. Absolute Maximum Ratings
Parameter Min Max Units
Junction Temperature (Tj) - +125 C
Storage Temperature -45 +125 C
DVDDIO, AVDDH, HV_SWR Supply Referenced to GND,
GND-0.3 +3.63 V
AGND, and GND_SWR
DVDDL, AVDDL, SVDDL, PLLVDDL Supply Referenced to
GND-0.3 +1.21 V
GND, AGND, and GND_SWR
Digital Input Voltage GND-0.3 VDDIO+0.3 V

11.2. Recommended Operating Range


Table 16. Recommended Operating Range
Parameter Min Typical Max Units
Ambient Operating Temperature (Ta) 0 - 70 C
DVDDIO Supply Voltage Range 3.135 3.3 3.465 V
AVDDH and HV_SWR Supply Voltage Range 3.135 3.3 3.465 V
DVDDL, AVDDL, SVDDL, and PLLVDDL Supply Voltage Range 1.045 1.1 1.155 V

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11.3. Thermal Characteristics


11.3.1. Assembly Description
Table 17. Assembly Description
Package Type QFN-40
Dimension (L×W) 5×5 mm2
Thickness 0.85 mm
PCB PCB Dimension (L×W) 78.1×61.4 mm2
PCB Thickness 1.6 mm
4-Layer:
- 1st layer (1oz): 20% coverage of Cu
Number of Cu Layer-PCB - 2nd layer (1oz): 80% coverage of Cu
- 3rd layer (1oz): 80% coverage of Cu
- 4th layer (1oz): 75% coverage of Cu

11.3.2. Material Properties


Table 18. Material Properties
Item Material Thermal Conductivity K (W/m-k)
Die Si 147
Silver Paste 1033BF 2.5
Package
Lead Frame CDA7025 168
Mold Compound 7372 0.9
Cu 400
PCB
FR4 0.2

11.3.3. Simulation Conditions


Table 19. Simulation Conditions
Input Power 0.52W
Test Board (PCB) 4L (2S2P) / 2L (1S1P)
Control Condition Air Flow = 0m/s

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11.3.4. Thermal Performance of QFN-56 on PCB Under Still Air


Convection
Table 20. Thermal Performance of QFN-56 on PCB Under Still Air Convection
θJA θJB θJC ΨJT
4L PCB 30.9 6.59 15.4 0.30
2L PCB 42.2 7.93 17.6 0.42
Note:
θJA: Junction to ambient thermal resistance
θJB: Junction to board thermal resistance
θJC: Junction to case thermal resistance
ΨJT: Junction-to-top-center thermal characterization parameter

11.4. DC Characteristics
Table 21. DC Characteristics
Parameter SYM Min Typical Max Units
System Idle (All UTP Ports Link Down, and Extension Port Link Down, without LEDs)
Power Supply Current for VDDH IDVDDIO, IAVDDH - 13 - mA
Power Supply Current for VDDL IDVDDL, IAVDDL, ISVDDL, - 132 - mA
IPLLVDDL
1000M Active (All UTP Ports 1000M Link/Active, and Extension Port Link/Active as 1000Base-X, without LEDs)
Power Supply Current for VDDH IDVDDIO, IAVDDH - 70 - mA
Power Supply Current for VDDL IDVDDL, IAVDDL, ISVDDL, - 218 - mA
IPLLVDDL
VDDIO=3.3V
TTL Input High Voltage Vih 2.0 - - V
TTL Input Low Voltage Vil - - 0.7 V
Output High Voltage Voh 2.7 - - V
Output Low Voltage Vol - - 0.6 V
Note: Power Consumption test condition, DVDDIO=3.3V, AVDDH=3.3V, DVDDL=1.1V, AVDDL=1.1V, SVDDL=1.1V,
and PLLVDDL=1.1V. Embedded Switch Regulator disabled.

11.5. Switch Regulator


Table 22. Switch Regulator
Symbol Parameter Min Typ Max Units
FSW Oscillator Frequency - 2 - MHz
TSS Soft-Start Time - 1.5 - ms

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11.6. AC Characteristics
11.6.1. Master I2C for EEPROM Auto-load Interface Timing
Characteristics
Tsck

t1 t2

SCK

t3 t4 t7 t5 t6 t8

SDA Data Output Data Output Data Input Data Input

t11

Figure 15. Master I2C for EEPROM Auto-load Timing Characteristics

t9

nRESET

SCK

SDA

Figure 16. SCK/SDA Power on Timing

Table 23. Master I2C for EEPROM Auto-load Timing Characteristics


Symbol Description Type Min Typical Max Units
Tsck SCK Clock Period O - 9 - µs
t1 SCK High Time O 4.05 4.5 - µs
t2 SCK Low Time O 4.05 4.5 - µs
t3 START Condition Setup Time O 2 - - µs
t4 START Condition Hold Time O 2 - - µs
t5 Data Input Hold Time O 0 - - µs
t6 Data Input Setup Time O 10 - - µs
t7 Data output delay O 2.15 - 2.35 µs
t8 STOP Condition Setup Time O 2 - - µs
t9 SCK/SDA Active from Reset Ready O - 76.8 - ms

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Symbol Description Type Min Typical Max Units


t11 Time the bus free before new START O 10 - - µs
- SCK Rise Time (10% to 90%) O - - 100 ns
- SCK Fall Time (90% to 10%) O - - 100 ns
- Duty Cycle O 40 50 60 %

11.6.2. Slave I2C-like Mode Timing Characteristics


t1 t2

SCK

t3 t4 t5 t6 t7 t8

SDA Data Input Data Input Data Output

Figure 17. Slave I2C-like Mode Timing Characteristics

Table 24. Slave I2C-like Mode Timing Characteristics


Symbol Description Type Min Typical Max Units
t1 SCK High Time I 250 - - ns
t2 SCK Low Time I 250 - - ns
t3 START Condition Setup Time I 150 - - ns
t4 START Condition Hold Time I 150 - - ns
t5 Data Hold Time I 150 - - ns
t6 Data Setup Time I 150 - - ns
t7 Clock to Data Output Delay O 10 - 100 ns
t8 STOP Condition Setup Time I 150 - - ns

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11.6.3. Slave MII Management SMI for External CPU Access Interface
Timing Characteristics
The RTL8213B supports MDIO slave mode. The Master (CPU) can access the Slave (RTL8213B) registers
via the MDIO interface. The MDIO is a bi-directional signal that can be sourced by the Master or the Slave.
In a write command, the master sources the MDIO signal. In a read command, the slave sources the MDIO
signal.
 The timing characteristics t1, t2, and t3 (Table 25) of the Master (the RTL8213B link partner CPU) are provided by
the Master when the Master sources the MDIO signal (Write command)
 The timing characteristics t4 (Table 25) of the Slave (RTL8213B) are provided by the RTL8213B when the RTL8213B
sources the MDIO signal (Read command)
t1

VIH
MDC
VIL

VIH
MDIO
VIL

t2 t3
Figure 18. MDIO Sourced by the Master

VIH
MDC
VIL

VIH
MDIO
VIL

t4
Figure 19. MDIO Sourced by the RTL8213B (Slave)

Table 25. MDIO Timing Characteristics and Requirement


Parameter SYM Description/Condition Type Min Typical Max Units
MDC Clock Period t1 Clock Period I 125 - - ns
MDIO to MDC Rising Setup Time t2 Input Setup Time I 8 - - ns
(Write Data)
MDIO to MDC Rising Hold Time t3 Input Hold Time I 8 - - ns
(Write Data)
MDC to MDIO Delay Time (Read t4 Clock (Rising Edge) to Data O 0 - 80 ns
Data) Delay Time

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11.6.4. SGMII/1000Base-X Characteristics


Table 26. SGMII/1000Base-X Differential Transmitter Characteristics
Parameter SYM Min Typ Max Units Notes
Unit Interval UI 799.92 800 800.08 ps 800ps ± 100ppm
Eye Mask T_X1 - - 0.15 UI -
Eye Mask T_X2 - - 0.4 UI -
Eye Mask T_Y1 150 - - mV -
Eye Mask T_Y2 - - 600 mV -
Output Differential Voltage VTX-DIFFp-p 300 700 800 mV -
Minimum TX Eye Width TTX-EYE 0.7 - - UI -
Output Jitter TTX-JITTER - - 0.3 UI TTX-JITTER-MAX = 1 - TTX-EYE-MIN = 0.30UI
Data dependent jitter - 0.0875 - UI
Output Rise Time TTX-RISE 0.125 - 0.25 UI 20% ~ 80%
Output Fall Time TTX-FALL 0.125 - 0.25 UI 20% ~ 80%
Output impedance RTX 40 - 140 ohm single-end
AC Coupling Capacitor CTX 80 100 120 nF -
Transmit Length in PCB LTX - - 10 inch -

Figure 20. SGMII/1000Base-X Differential Transmitter Eye Diagram

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Table 27. SGMII/1000Base-X Differential Receiver Characteristics


Parameter SYM Min Typ Max Units Notes
Unit Interval UI 799.92 800 800.08 ps 800ps ± 100ppm
Eye Mask R_X1 - - 0.15 UI -
Eye Mask R_Y1 100 - - mV -
Eye Mask R_Y2 - - 600 mV -
Input Differential Voltage VRX-DIFFp-p 200 - 1200 mV -
Minimum RX Eye Width TRX-EYE 0.4 - - UI -
Input Jitter Tolerance TRX-JITTER - - 0.6 UI TRX-JITTER-MAX = 1 - TRX-EYE-MIN = 0.6UI
Differential Resistance RRX 80 100 120 ohm -

Figure 21. SGMII/1000Base-X Differential Receiver Eye Diagram

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11.6.5. Power and Reset Characteristics


t1

AVDDH
Power

t2

t4
DVDDIO/
2.7V(+-5%)
HV_SWR
Power

0V
t5

LV Power 0.8V(+-5%)

0V
t3 t6
t7

nRESET pin
0V

Figure 22. Power and Reset Characteristics

Table 28. Power and Reset Characteristics


Parameter SYM Description/Condition Type Min Typical Max Units
AVDDH Rising Time t1 AVDDH power rise settling time I 0.5 - - ms
HV Power Rising Time t2 DVDDIO, HV_SWR(If embedded I 0.5 - - ms
SWR be used) power rise settling time
LV Power Rising Time t3 DVDDL and AVDDL power rise settling I 0.1 - - ms
time
HV Power Ready Time after t4 The duration from HV power more than I - - 10 ms
more than HV POR threshold HV POR threshold to HV power ready
LV Power Ready Time after t5 The duration from LV power more than I - - 10 ms
more than LV POR threshold LV POR threshold to LV power ready
Reset Delay Time t6 The duration from ‘all power steady’ to I 10 - - ms
the reset signal released to high
Reset Low Time t7 The duration of reset signal remaining I 10 - - ms
low time before issuing a reset to
RTL8213B
Note 1: If the powers supply voltage of the RTL8213B lower than normal operation condition happened, the Power On
Reset (POR) or Pin Reset is needed for normal operation of the RTL8213B.
Note 2: DVDDIO power must be ready no later than HV_SWR power if embedded SWR be used.
Note 3: AVDDH power must be ready no later than DVDDIO power.

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12. Mechanical Dimensions


Plastic Quad Flat No Lead Package 40 Leads 5x5mm2 Outline

Dimension in mm Dimension in inch


Symbol
Min Nom Max Min Nom Max
A 0.80 0.85 0.90 0.031 0.033 0.035
A1 0.00 0.02 0.05 0.000 0.001 0.002
A3 0.20 REF 0.008 REF
b 0.15 0.20 0.25 0.006 0.008 0.010
D/E 5.00 BSC 0.197 BSC
D2/E2 3.45 3.70 3.75 0.136 0.146 0.147
e 0.40 BSC 0.016 BSC
L 0.30 0.40 0.50 0.012 0.016 0.020
Notes:
1. CONTROLLING DIMENSION:MILLIMETER(mm).
2. REFERENCE DOCUMENTL:JEDEC MO-220.

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13. Ordering Information


Table 29. Ordering Information
Part Number Package Status
RTL8213B-CG QFN 40-Pin ‘Green’ Package Mass Production
Note: See page 7 for package identification.

Realtek Semiconductor Corp.


Headquarters
No. 2, Innovation Road II, Hsinchu Science Park,
Hsinchu 300, Taiwan, R.O.C.
Tel: 886-3-5780211 Fax: 886-3-5776047
www.realtek.com

Unmanaged Gigabit Media Converter 42 Track ID: xxxx-xxxx-xx Rev. 1.0

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