Film Capacitors

Metallized Polypropylene Film Capacitors (MKP)

Series/Type: B32774 ... B32778

Date: June 2018

© EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

Metallized polypropylene film capacitors (MKP) B32774 ... B32778
MKP DC link  high density series up to 480 μF

Typical applications
Frequency converters
Industrial and high-end power supplies
Solar inverters

Climatic
Max. operating temperature: 105 °C (case)
Climatic category (IEC 60068-1:2013):
40/105/56

Construction
Dielectric: Polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0)

Features
Capacitance values up to 480 μF
High CV product, compact
Good self-healing properties
Over-voltage capability
Low losses with high current capability
High reliability
Long useful life
RoHS-compatible

Terminals
Parallel wire leads, lead-free tinned
2-pin, 4-pin and 12-pin versions
Standard lead lengths: 6 1 mm

Marking
Manufacturer's logo and lot number,
date code, rated capacitance (coded),
capacitance tolerance (code letter) and
rated DC voltage

Delivery mode
Bulk (untaped)

Please read Cautions and warnings and Page 2 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Dimensional drawings

Number of wires Lead spacing ±0.4 Lead diameter d1 ±0.05 Type

2-pin 27.5 0.8 B32774D
2-pin 37.5 1.0 B32776E
2-pin 37.5 1.0 B32776T
4-pin 37.5 1.2 B32776G
4-pin 37.5 1.2 B32776T
4-pin 52.5 1.2 B32778T
4-pin 52.5 1.2 B32778G
12-pin 52.5 1.2 B32778J
Dimensions in mm

Dimensional drawings 2-pin versions

B32774D, B32776E

B32774D B32776E
Lead spacing ±0.4: 27.5 37.5
Lead diameter d1: 0.8 1.0
Dimensions in mm

B32776T (low profile)

Lead spacing ±0.4: 37.5

Lead diameter d1: 1.0
Dimensions in mm

Please read Cautions and warnings and Page 3 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Dimensional drawings 4-pin versions

B32776G, B32778G

B32776G B32778G
Lead spacing ±0.4: 37.5 52.5
Lead diameter d1: 1.2 1.2
Dimensions in mm
B32776T, B32778T (low profile)

B32776T B32778T
Lead spacing ±0.4: 37.5 52.5
Lead diameter d1: 1.2 1.2
Dimensions in mm

Dimensional drawing 12-pin version

B32778J

Lead spacing ±0.4: 52.5

Lead diameter d1: 1.2
Dimensions in mm

Please read Cautions and warnings and Page 4 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Overview of available types

Lead spacing 27.5 mm 37.5 mm

Type B32774 B32776
Page 7 8
VR (V DC) 450 800 1100 1300 450 575 800 900 1100 1300
CR (μF)
1.5
2.0
2.7
3.0
3.3
3.5
3.9
5.0
6.8
7.0
7.5
8.0
8.5
9.0
10
12
13
14
15
16
20
22
25
27
30
35
40
45
50
60
65

Please read Cautions and warnings and Page 5 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Overview of available types

Lead spacing 52.5 mm

Type B32778
Page 11
VR (V DC) 450 575 800 900 1100 1300
CR (μF)
14
20
25
27
30
35
38
40
42
45
50
55
58
60
70
75
80
90
100
110
120
130
150
170
180
200
210
270
360
480

Please read Cautions and warnings and Page 6 of 48

Important notes at the end of this document.
 B32774
MKP DC link  high density series  up to 480 μF

Ordering codes and packing units (lead spacing 27.5 mm)

CR1) Max. dimensions Ordering code IRMS,max2) ESRtyp ESLtyp3) tan δ tan δ Un-
w×h×l (composition see 70 °C 70 °C 70 °C taped
below) 10 kHz 10 kHz 10 kHz 1 kHz 10 kHz pcs./
μF mm A mΩ nH 10-3 10-3 MOQ
VR,70 °C = 450 V DC, Vop,85 °C = 450 V DC
5.0 11.0 × 21.0 × 31.5 B32774D4505+000 5.0 21.1 19.0 1.2 10.7 2352
10.0 15.0 × 24.5 × 31.5 B32774D4106+000 8.0 10.9 24.0 1.2 11.0 1680
22.0 22.0 × 36.5 × 31.5 B32774D4226+000 14.5 5.4 30.0 1.3 12.1 784
VR,70 °C = 800 V DC, Vop,85 °C = 700 V DC
3.0 11.0 × 21.0 × 31.5 B32774D8305+000 4.5 24.8 19.0 0.9 7.6 2352
5.0 14.0 × 24.5 × 31.5 B32774D8505+000 6.5 15.3 23.0 0.9 7.7 1848
12.0 22.0 × 36.5 × 31.5 B32774D8126+000 13.0 6.8 34.0 1.0 8.3 784
VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC
2.0 12.5 × 21.5 × 31.5 B32774D0205+000 4.5 26.3 19.0 0.7 5.3 2100
3.3 18.0 × 27.5 × 31.5 B32774D0335+000 7.0 16.2 22.0 0.7 5.4 1428
5.0 19.0 × 30.0 × 31.5 B32774D0505+000 9.0 10.9 27.0 0.7 5.5 896
7.0 22.0 × 36.5 × 31.5 B32774D0705+000 12.0 8.1 30.0 0.7 5.8 784
VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC
1.5 12.5 × 21.5 × 31.5 B32774D1155K000 4.4 31.3 20.0 0.6 4.8 2100
3.0 18.0 × 27.5 × 31.5 B32774D1305K000 7.0 16.0 24.0 0.6 4.9 1428
5.0 22.0 × 36.5 × 31.5 B32774D1505K000 10.5 9.8 33.0 0.7 5.1 784

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code: Packing code:
J = ±5% 000 = untaped (lead length 6 1 mm)
K = ±10%

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤ ±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)

Please read Cautions and warnings and Page 7 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Ordering codes and packing units (lead spacing 37.5 mm)

CR1) Max. dimensions P1 Ordering code IRMS,max2) ESRtyp ESLtyp3) tan δ tan δ Un-
w×h×l (composition see 70 °C 70 °C 70 °C taped
below) 10 kHz 10 kHz 10 kHz 1 kHz 10 kHz pcs./
μF mm mm A mΩ nH 10-3 10-3 MOQ
VR,70 °C = 450 V DC, Vop,85 °C = 450 V DC
12 24.0 × 15.0 × 41.5  B32776T4126K000 7.0 17.1 19.0 2.2 21.0 1040
16 24.0 × 19.0 × 41.5  B32776T4166K000 8.0 13.0 18.0 2.3 21.2 780
30 20.0 × 39.5 × 41.5 10.2 B32776G4306+000 14.0 7.0 11.0 2.3 21.3 640
30 20.0 × 39.5 × 41.5  B32776E4306+000 14.0 7.3 28.0 2.4 22.3 640
35 28.0 × 37.0 × 42.0 10.2 B32776G4356+000 16.5 6.0 10.0 2.3 21.4 440
35 28.0 × 37.0 × 42.0  B32776E4356+000 16.0 6.4 24.0 2.4 22.6 440
40 28.0 × 37.0 × 42.0 10.2 B32776G4406+000 17.5 5.3 11.0 2.3 21.4 440
40 28.0 × 37.0 × 42.0  B32776E4406+000 17.0 5.6 26.0 2.4 22.7 440
40 43.0 × 22.0 × 41.5 20.3 B32776T4406K000 17.0 5.2 13.0 2.3 21.2 280
50 28.0 × 42.5 × 41.5 10.2 B32776G4506+000 20.0 4.3 12.0 2.3 21.7 440
50 28.0 × 42.5 × 41.5  B32776E4506+000 19.0 4.7 30.0 2.5 23.8 440
60 30.0 × 45.0 × 42.0 20.3 B32776G4606+000 23.5 3.6 14.0 2.4 22.3 400
60 30.0 × 45.0 × 42.0  B32776E4606+000 22.0 4.0 32.0 2.5 24.2 400
65 33.0 × 48.0 × 42.0 20.3 B32776G4656+000 25.5 3.3 14.0 2.3 22.2 180
VR,70 °C = 575 V DC, Vop,85 °C = 500 V DC
8.5 24.0 × 15.0 × 41.5  B32776T5855+000 6.5 19.9 19.0 1.9 17.2 1040
12 24.0 × 19.0 × 41.5  B32776T5126K000 8.0 14.4 18.0 1.9 17.4 780
25 20.0 × 39.5 × 41.5 10.2 B32776G5256K000 14.0 7.0 12.0 1.9 17.5 640
25 20.0 × 39.5 × 41.5  B32776E5256K000 13.5 7.4 28.0 2.0 18.3 640
27 43.0 × 22.0 × 41.5 20.3 B32776T5276K000 15.5 6.4 14.0 1.9 17.5 280
30 28.0 × 37.0 × 42.0 10.2 B32776G5306K000 16.5 5.8 11.0 1.9 17.6 440
30 28.0 × 37.0 × 42.0  B32776E5306K000 16.5 6.1 26.0 2.0 18.5 440
35 28.0 × 42.5 × 41.5 10.2 B32776G5356+000 19.0 5.0 12.0 1.9 17.8 440
35 28.0 × 42.5 × 41.5  B32776E5356+000 18.0 5.3 29.0 2.0 19.0 440
45 30.0 × 45.0 × 42.0 20.3 B32776G5456K000 22.0 4.0 13.0 1.9 17.9 400
45 30.0 × 45.0 × 42.0  B32776E5456K000 21.0 4.4 32.0 2.1 19.7 400
50 33.0 × 48.0 × 42.0 20.3 B32776G5506K000 25.0 3.5 14.0 2.0 18.1 180

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code: Packing code:
J = ±5% 000 = untaped (lead length 6 1 mm)
K = ±10%

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤ ±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)

Please read Cautions and warnings and Page 8 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Ordering codes and packing units (lead spacing 37.5 mm)

CR1) Max. dimensions P1 Ordering code IRMS,max2) ESRtyp ESLtyp3) tan δ tan δ Un-
w×h×l (composition see 70 °C 70 °C 70 °C taped
below) 10 kHz 10 kHz 10 kHz 1 kHz 10 kHz pcs./
μF mm mm A mΩ nH 10-3 10-3 MOQ
VR,70 °C = 800 V DC, Vop,85 °C = 700 V DC
6.8 24.0 × 15.0 × 41.5  B32776T8685+000 6.0 22.1 18.0 1.7 15.1 1040
8.5 24.0 × 19.0 × 41.5  B32776T8855+000 7.5 17.8 18.0 1.7 15.1 780
14 18.0 × 32.5 × 41.5  B32776E8146+000 10.0 11.5 23.0 1.8 16.3 720
15 20.0 × 39.5 × 41.5 10.2 B32776G8156+000 12.0 9.6 10.0 1.7 15.2 640
15 20.0 × 39.5 × 41.5  B32776E8156+000 11.5 10.3 24.0 1.7 15.7 640
20 28.0 × 37.0 × 42.0 10.2 B32776G8206+000 14.5 7.5 10.0 1.7 15.3 440
20 28.0 × 37.0 × 42.0  B32776E8206+000 14.5 7.8 24.0 1.7 15.9 440
20 43.0 × 22.0 × 41.5 20.3 B32776T8206K000 14.5 7.2 14.0 1.7 15.1 280
22 28.0 × 37.0 × 42.0 10.2 B32776G8226+000 15.5 6.8 11.0 1.7 15.3 440
22 28.0 × 37.0 × 42.0  B32776E8226+000 15.0 7.1 25.0 1.7 16.0 440
25 28.0 × 42.5 × 41.5 10.2 B32776G8256+000 17.0 6.1 11.0 1.7 15.4 440
25 28.0 × 42.5 × 41.5  B32776E8256+000 16.5 6.4 28.0 1.8 16.3 440
30 30.0 × 45.0 × 42.0 20.3 B32776G8306+000 19.5 5.1 12.0 1.7 15.6 400
30 30.0 × 45.0 × 42.0  B32776E8306+000 19.0 5.5 30.0 1.8 16.7 400
35 33.0 × 48.0 × 42.0 20.3 B32776G8356+000 22.0 4.3 14.0 1.7 15.7 180
VR,70 °C = 900 V DC, Vop,85 °C = 800 V DC
5 24.0 × 15.0 × 41.5  B32776T9505+000 5.5 26.1 19.0 1.5 13.4 1040
7.5 24.0 × 19.0 × 41.5  B32776T9755K000 7.5 17.8 18.0 1.5 13.5 780
15 20.0 × 39.5 × 41.5 10.2 B32776G9156K000 12.5 9.1 12.0 1.5 13.6 640
15 20.0 × 39.5 × 41.5  B32776E9156K000 12.0 9.4 28.0 1.5 14.1 640
16 43.0 × 22.0 × 41.5 20.3 B32776T9166K000 14.0 8.1 14.0 1.5 13.5 280
20 28.0 × 37.0 × 42.0 10.2 B32776G9206K000 15.0 7.0 11.0 1.5 13.6 440
20 28.0 × 37.0 × 42.0  B32776E9206K000 15.0 7.3 26.0 1.6 14.2 440
22 28.0 × 42.5 × 41.5 10.2 B32776G9226K000 17.0 6.3 12.0 1.5 13.7 440
22 28.0 × 42.5 × 41.5  B32776E9226K000 16.5 6.6 29.0 1.6 14.5 440
25 30.0 × 45.0 × 42.0 20.3 B32776G9256+000 19.0 5.5 13.0 1.5 13.8 400
25 30.0 × 45.0 × 42.0  B32776E9256+000 18.5 5.9 32.0 1.6 14.7 400
30 33.0 × 48.0 × 42.0 20.3 B32776G9306+000 21.5 4.7 14.0 1.5 13.9 180

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code: Packing code:
J = ±5% 000 = untaped (lead length 6 1 mm)
K = ±10%

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤ ±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)

Please read Cautions and warnings and Page 9 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Ordering codes and packing units (lead spacing 37.5 mm)

CR1) Max. dimensions P1 Ordering code IRMS,max2) ESRtyp ESLtyp3) tan δ tan δ Un-
w×h×l (composition see 70 °C 70 °C 70 °C taped
below) 10 kHz 10 kHz 10 kHz 1 kHz 10 kHz pcs./
μF mm mm A mΩ nH 10-3 10-3 MOQ
VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC
3.9 24.0 × 15.0 × 41.5  B32776T0395+000 5.0 30.5 18.0 1.4 12.1 1040
5 24.0 × 19.0 × 41.5  B32776T0505+000 6.5 23.6 18.0 1.4 12.1 780
12 20.0 × 39.5 × 41.5 10.2 B32776G0126+000 12.0 10.2 12.0 1.4 12.2 640
12 20.0 × 39.5 × 41.5  B32776E0126+000 11.5 10.5 28.0 1.4 12.6 640
13 43.0 × 22.0 × 41.5 20.3 B32776T0136K000 13.0 8.9 14.0 1.4 12.1 280
14 28.0 × 37.0 × 42.0 10.2 B32776G0146+000 13.5 8.7 21.0 1.4 12.2 440
14 28.0 × 37.0 × 42.0  B32776E0146+000 13.5 9.0 25.0 1.4 12.6 440
16 28.0 × 42.5 × 41.5 10.2 B32776G0166+000 15.5 7.4 12.0 1.4 12.3 440
16 28.0 × 42.5 × 41.5  B32776E0166+000 15.0 7.8 30.0 1.4 12.9 440
20 30.0 × 45.0 × 42.0 20.3 B32776G0206+000 18.0 6.0 14.0 1.4 12.4 400
20 30.0 × 45.0 × 42.0  B32776E0206+000 17.5 6.5 32.0 1.4 13.1 400
22 33.0 × 48.0 × 42.0 20.3 B32776G0226+000 21.0 4.9 15.0 1.3 11.4 180
VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC
2.7 24.0 × 15.0 × 41.5  B32776T1275+000 5.0 34.7 19.0 1.1 9.6 1040
3.5 24.0 × 19.0 × 41.5  B32776T1355+000 6.0 27.4 18.0 1.1 9.7 780
8.0 20.0 × 39.5 × 41.5 10.2 B32776G1805+000 11.0 12.1 12.0 1.1 9.7 640
8.0 20.0 × 39.5 × 41.5  B32776E1805+000 10.5 12.4 24.0 1.2 10.0 640
9.0 43.0 × 22.0 × 41.5 20.3 B32776T1905K000 12.0 10.7 13.0 1.1 9.7 280
10 28.0 × 37.0 × 42.0 10.2 B32776G1106+000 13.0 9.6 11.0 1.1 9.7 440
10 28.0 × 37.0 × 42.0  B32776E1106+000 12.5 9.9 26.0 1.2 10.0 440
12 28.0 × 42.5 × 41.5 10.2 B32776G1126+000 14.5 8.1 12.0 1.1 9.8 440
12 28.0 × 42.5 × 41.5  B32776E1126+000 14.0 8.5 28.0 1.2 10.1 440
14 30.0 × 45.0 × 42.0 20.3 B32776G1146+000 17.0 6.8 14.0 1.1 10.1 400
14 30.0 × 45.0 × 42.0  B32776E1146+000 16.5 7.3 32.0 1.2 10.4 400
16 33.0 × 48.0 × 42.0 20.3 B32776G1166+000 19.0 6.0 15.0 1.1 9.9 180

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code: Packing code:
J = ±5% 000 = untaped (lead length 6 1 mm)
K = ±10%

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤ ±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)

Please read Cautions and warnings and Page 10 of 48

Important notes at the end of this document.
 B32778
MKP DC link  high density series  up to 480 μF

Ordering codes and packing units (lead spacing 52.5 mm, P1 = 20.3 mm)

CR1) Max. dimensions Ordering code IRMS,max2) ESRtyp ESLtyp3) tan δ tan δ Un-
w×h×l (composition see 70 °C 70 °C 70 °C taped
below) 10 kHz 10 kHz 10 kHz 1 kHz 10 kHz pcs./
μF mm A mΩ nH 10-3 10-3 MOQ
VR,70 °C = 450 V DC, Vop,85 °C = 450 V DC
55 43.0 × 24.0 × 57.5 B32778T4556K000 16.5 7.2 13.0 4.3 41.7 560
75 30.0 × 45.0 × 57.5 B32778G4756+000 21.0 5.6 12.0 4.4 42.6 280
80 30.0 × 45.0 × 57.5 B32778G4806+000 21.5 5.3 13.0 4.4 42.7 280
100 35.0 × 50.0 × 57.5 B32778G4107+000 26.0 4.3 14.0 4.5 43.3 108
110 35.0 × 50.0 × 57.5 B32778G4117K000 27.0 3.9 15.0 4.5 43.6 108
150 130.0 × 24.0 × 57.5 B32778J4157K000 43.5 2.7 4.0 4.4 42.1 80
170 45.0 × 57.0 × 57.5 B32778G4177+000 36.5 2.6 17.0 4.6 45.7 140
180 60.0 × 45.0 × 57.5 B32778G4187+000 39.0 2.5 19.0 4.6 44.6 200
480 130.0 × 58.0 × 57.5 B32778J4487K000 79.5 0.9 6.0 4.8 45.4 40
VR,70 °C = 575 V DC, Vop,85 °C = 500 V DC
40 43.0 × 24.0 × 57.5 B32778T5406K000 15.5 8.5 13.0 3.6 34.5 560
60 30.0 × 45.0 × 57.5 B32778G5606+000 20.5 5.8 13.0 3.7 35.3 280
80 35.0 × 50.0 × 57.5 B32778G5806+000 25.5 4.4 15.0 3.7 36.0 108
110 130.0 × 24.0 × 57.5 B32778J5117K000 40.5 3.0 5.0 3.6 34.5 80
120 45.0 × 57.0 × 57.5 B32778G5127+000 34.5 3.1 17.0 3.8 37.2 140
130 60.0 × 45.0 × 57.5 B32778G5137+000 36.5 2.8 19.0 3.8 36.7 200
360 130.0 × 58.0 × 57.5 B32778J5367K000 75.0 1.0 6.0 4.0 37.3 40
VR,70 °C = 800 V DC, Vop,85 °C = 700 V DC
30 43.0 × 24.0 × 57.5 B32778T8306K000 14.5 9.8 14.0 3.2 30.2 560
45 30.0 × 45.0 × 57.5 B32778G8456+000 19.5 6.6 14.0 3.2 30.9 280
50 30.0 × 45.0 × 57.5 B32778G8506+000 20.0 6.3 13.0 3.2 30.9 280
55 35.0 × 50.0 × 57.5 B32778G8556+000 23.0 5.6 14.0 3.2 31.1 108
60 35.0 × 50.0 × 57.5 B32778G8606+000 23.5 5.1 15.0 3.3 31.2 108
80 130.0 × 24.0 × 57.5 B32778J8806K000 37.5 3.6 4.0 3.2 30.2 80
90 45.0 × 57.0 × 57.5 B32778G8906+000 32.5 3.5 17.0 3.3 32.2 140
100 60.0 × 45.0 × 57.5 B32778G8107+000 34.5 3.2 19.0 3.3 31.9 200
270 130.0 × 58.0 × 57.5 B32778J8277K000 70.5 1.2 6.0 3.5 32.4 40

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code: Packing code:
J = ±5% 000 = untaped (lead length 6 1 mm)
K = ±10%

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤ ±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)

Please read Cautions and warnings and Page 11 of 48

Important notes at the end of this document.
 B32778
MKP DC link  high density series  up to 480 μF

Ordering codes and packing units (lead spacing 52.5 mm, P1 = 20.3 mm)

CR1) Max. dimensions Ordering code IRMS,max2) ESRtyp ESLtyp3) tan δ tan δ Un-
w×h×l (composition see 70 °C 70 °C 70 °C taped
below) 10 kHz 10 kHz 10 kHz 1 kHz 10 kHz pcs./
μF mm A mΩ nH 10-3 10-3 MOQ
VR,70 °C = 900 V DC, Vop,85 °C = 800 V DC
25 43.0 × 24.0 × 57.5 B32778T9256K000 13.5 10.7 13.0 2.8 26.8 560
35 30.0 × 45.0 × 57.5 B32778G9356+000 18.0 7.7 13.0 2.9 27.3 280
50 35.0 × 50.0 × 57.5 B32778G9506K000 22.5 5.6 15.0 2.9 27.7 108
70 45.0 × 57.0 × 57.5 B32778G9706+000 31.0 3.8 18.0 3.0 28.5 140
70 130.0 × 24.0 × 57.5 B32778J9706K000 36.0 3.8 4.0 2.9 27.2 80
75 60.0 × 45.0 × 57.5 B32778G9756+000 32.5 3.6 20.0 2.9 28.2 200
210 130.0 × 58.0 × 57.5 B32778J9217K000 66.0 1.3 6.0 3.1 28.6 40
VR,70 °C = 1100 V DC, Vop,85 °C = 920 V DC
20 43.0 × 24.0 × 57.5 B32778T0206K000 13.0 11.9 13.0 2.6 24.1 560
30 30.0 × 45.0 × 57.5 B32778G0306+000 17.5 8.2 13.0 2.6 24.5 280
40 35.0 × 50.0 × 57.5 B32778G0406+000 21.5 6.2 15.0 2.7 25.9 108
58 45.0 × 57.0 × 57.5 B32778G0586+000 29.0 4.3 17.0 2.7 25.4 140
60 60.0 × 45.0 × 57.5 B32778G0606+000 30.5 4.0 19.0 2.7 25.2 200
60 130.0 × 24.0 × 57.5 B32778J0606K000 34.5 4.1 4.0 2.7 25.1 80
200 130.0 × 58.0 × 57.5 B32778J0207K000 66.0 1.4 6.0 3.0 26.8 40
VR,70 °C = 1300 V DC, Vop,85 °C = 1100 V DC
14 43.0 × 24.0 × 57.5 B32778T1146K000 12.0 13.8 13.0 2.1 19.5 560
20 30.0 × 45.0 × 57.5 B32778G1206+000 16.0 9.7 13.0 2.1 19.8 280
25 35.0 × 50.0 × 57.5 B32778G1256+000 19.0 7.8 15.0 2.1 19.9 108
27 35.0 × 50.0 × 57.5 B32778G1276+000 19.5 7.3 15.0 2.1 20.0 108
38 130.0 × 24.0 × 57.5 B32778J1386K000 31.5 5.1 4.0 2.1 19.5 80
40 45.0 × 57.0 × 57.5 B32778G1406+000 26.5 5.0 17.0 2.2 20.3 140
42 60.0 × 45.0 × 57.5 B32778G1426+000 28.0 4.7 19.0 2.2 20.2 200
120 130.0 × 58.0 × 57.5 B32778J1127K000 58.5 1.7 6.0 2.3 20.5 40

MOQ = Minimum Order Quantity, consisting of 4 packing units.

Intermediate capacitance values are available on request.

Composition of ordering code

+ = Capacitance tolerance code: Packing code:
J = ±5% 000 = untaped (lead length 6 1 mm)
K = ±10%

1) Capacitance value measured at 1 kHz

2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT ≤20 °C at ΔESRtyp ≤ ±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)

Please read Cautions and warnings and Page 12 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Technical data

Reference standard: IEC 61071:2007. All data given at T = 20 °C, unless otherwise specified.
Operating temperature range (case) Max. operating temperature, Top,max +105 °C
Upper category temperature Tmax +105 °C
Lower category temperature Tmin –40 °C
Insulation resistance Rins τ > 10 000 s (after 1 min.)
given as time constant For VR ≥ 500 V measured at 500 V
τ = CR  Rins, rel. humidity ≤ 65% For VR < 500 V measured at VR
(minimum as-delivered values)
DC test voltage between terminals (10 s) 1.5  VR
Voltage test terminal to case (10 s) 2110 V AC, 50 Hz
Pulse Handling Capability (V/μs) IP (A) / C (μF)
Reliability: Failure rate λ 10 fit (≤ 1  10-9/h) at 0.5  VR, 40 °C
For conversion to other operating conditions and
temperatures, refer to chapter "Quality, 2 Reliability".
Service life tSL 100 000 h at VR and 70 °C
VR (V DC) 450 575 800 900 1100 1300
Continuous operation voltage
Vop (V DC) at 70 °C 450 575 800 900 1100 1300
Continuous operation voltage
Vop (V DC) at 85 °C 450 500 700 800 920 1100
For temperatures between
1.33%/°C of Vop derating compared to Vop at 85 °C
85 °C and 105 °C

Typical waveforms

Restrictions:
VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which
the capacitor has been designed for continuous operation.

Please read Cautions and warnings and Page 13 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

AC ≤0.2  VR
Overvoltage Maximum duration within one day Observation
1.1  VR 30% of on-load duration System regulation
1.15  VR 30 min. System regulation
1.2  VR 5 min. System regulation
1.3  VR 1 min. System regulation
NOTE 1 An overvoltage equal to 1.5  VR for 30 ms is permitted 1000 times during the life of the
capacitor.
The amplitudes of the overvoltages that may be tolerated without significant reduction in the life
time of the capacitor depend on their duration, the number of application and the capacitor
temperature.
In addition these values assume that the overvoltages may appear when the internal temperature
of the capacitor is less than 0 °C but within the temperature category.

NOTE 2 The average applied voltage must not be higher than the specified voltage.

Pulse handling capability

"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/μs.
Note:
The values of dV/dt provided below must not be exceeded in order to avoid damaging the
capacitor.

dV/dt values

Lead spacing 27.5 mm 37.5 mm 52.5 mm

Type B32774 B32776 B32778
VR (V DC) 450 800 1100 1300 450 575 800 900 1100 1300 450 575 800 900 1100 1300
dV/dt in V/μs 30 40 75 100 21 22 22 35 54 73 14 14 15 22 35 50

Please read Cautions and warnings and Page 14 of 48

Important notes at the end of this document.
 B32774
MKP DC link  high density series  up to 480 μF

Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 27.5 mm Lead spacing 27.5 mm
450 V DC 450 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 27.5 mm Lead spacing 27.5 mm
800 V DC 800 V DC

Please read Cautions and warnings and Page 15 of 48

Important notes at the end of this document.
 B32774
MKP DC link  high density series  up to 480 μF

Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 27.5 mm Lead spacing 27.5 mm
1100 V DC 1100 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 27.5 mm Lead spacing 27.5 mm
1300 V DC 1300 V DC

Please read Cautions and warnings and Page 16 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
450 V DC 450 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
450 V DC 450 V DC

Please read Cautions and warnings and Page 17 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
575 V DC 575 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
575 V DC 575 V DC

Please read Cautions and warnings and Page 18 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
B32776E8*/800 V DC B32776E8*/800 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
800 V DC 800 V DC

Please read Cautions and warnings and Page 19 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
900 V DC 900 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
900 V DC 900 V DC

Please read Cautions and warnings and Page 20 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
1100 V DC 1100 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
1100 V DC 1100 V DC

Please read Cautions and warnings and Page 21 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
1300 V DC 1300 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm Lead spacing 37.5 mm
1300 V DC 1300 V DC

Please read Cautions and warnings and Page 22 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm (low profile, 2 pins) Lead spacing 37.5 mm (low profile, 2 pins)

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 37.5 mm (low profile, 4 pins) Lead spacing 37.5 mm (low profile, 4 pins)

Please read Cautions and warnings and Page 23 of 48

Important notes at the end of this document.
 B32778
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 52.5 mm Lead spacing 52.5 mm
450 V DC 450 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 52.5 mm Lead spacing 52.5 mm
575 V DC 575 V DC

Please read Cautions and warnings and Page 24 of 48

Important notes at the end of this document.
 B32778
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 52.5 mm Lead spacing 52.5 mm
800 V DC 800 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 52.5 mm Lead spacing 52.5 mm
900 V DC 900 V DC

Please read Cautions and warnings and Page 25 of 48

Important notes at the end of this document.
 B32778
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 52.5 mm Lead spacing 52.5 mm
B32778G0*/1100 V DC B32778G0*/1100 V DC

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 52.5 mm Lead spacing 52.5 mm
1300 V DC 1300 V DC

Please read Cautions and warnings and Page 26 of 48

Important notes at the end of this document.
 B32778
MKP DC link  high density series  up to 480 μF

Characteristics curves

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 52.5 mm (low profile) Lead spacing 52.5 mm (low profile)

Impedance Z versus frequency f ESR versus frequency f

(typical values) (typical values)
Lead spacing 52.5 mm (12 pins) Lead spacing 52.5 mm (12 pins)

Please read Cautions and warnings and Page 27 of 48

Important notes at the end of this document.
 B32774
MKP DC link  high density series  up to 480 μF

Characteristics curves
Permissible current IRMS versus frequency f at 70 °C

Lead spacing 27.5 mm

B32774D*

Please read Cautions and warnings and Page 28 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Characteristics curves
Permissible current IRMS versus frequency f at 70 °C

Lead spacing 37.5 mm

B32776E*

B32776G*

Please read Cautions and warnings and Page 29 of 48

Important notes at the end of this document.
 B32776
MKP DC link  high density series  up to 480 μF

Characteristics curves
Permissible current IRMS versus frequency f at 70 °C

Lead spacing 37.5 mm

B32776T*

Please read Cautions and warnings and Page 30 of 48

Important notes at the end of this document.
 B32778
MKP DC link  high density series  up to 480 μF

Characteristics curves
Permissible current IRMS versus frequency f at 70 ° C

Lead spacing 52.5 mm

B32778G* (4 pins)

B32778T* (4 pins)

Please read Cautions and warnings and Page 31 of 48

Important notes at the end of this document.
 B32778
MKP DC link  high density series  up to 480 μF

Characteristics curves
Permissible current IRMS versus frequency f at 70 ° C

Lead spacing 52.5 mm

B32778J* (12 pins)

Please read Cautions and warnings and Page 32 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Curves characteristics (IRMS derating versus temperature)

Maximum IRMS current as function of the ambient temperature: IRMS (TA) = Factor × IRMS (70 °C)

Please read Cautions and warnings and Page 33 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Heat transference for self heating calculation

Box dimensions Equivalent heat

coefficient
w (mm) h (mm) l (mm) G (mW/°C)
11.0 19.0 31.5 25
11.0 21.0 31.5 28
12.5 21.5 31.5 30
13.5 23.0 31.5 32
Figure 1 14.0 24.5 31.5 35
15.0 24.5 31.5 36
16.0 32.0 31.5 45
18.0 27.5 31.5 44
18.0 33.0 31.5 48
19.0 30.0 31.5 48
20.0 11.0 31.5 65
21.0 31.0 31.5 51
22.0 36.5 31.5 58
12.0 22.0 41.5 70
14.0 25.0 41.5 43
16.0 28.5 41.5 50
18.0 32.5 41.5 59
20.0 39.5 41.5 72
24.0 19.0 41.5 50
24.0 15.0 41.5 44
28.0 37.0 42.0 83
28.0 42.5 41.5 90
30.0 45.0 42.0 100
33.0 48.0 42.0 100
43.0 22.0 41.5 80
30.0 45.0 57.5 125
35.0 50.0 57.5 145
43.0 24.0 57.5 103
45.0 57.0 57.5 185
60.0 45.0 57.5 192
130.0 24.0 57.5 200
130.0 58.0 57.5 300

The equivalent heat coefficient "G (mW/ºC)" is given for measuring the temperature on the lateral
surface of the plastic box as figure1 shows. By using a thermocouple and avoiding effect of
radiation and convection the temperature measured during operation conditions should be a
result of the dissipated power divided by the equivalent heat coefficient.

Please read Cautions and warnings and Page 34 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Self Heating by power dissipation & equivalent heat coefficient

The IRMS and consequently the power dissipation must be limited during operation in order to not
exceed the maximum limit of ΔT allowed for this series. ΔTmax given for this series is equal or
lower than 20 °C at rated temperature (70 °C), for higher ambient temperatures ΔTmax (T) will have
the same derating factor than IRMS versus temperature and then an equivalent derating as per:
ambient temperatures ΔTmax (T) will have the same derating factor than IRMS versus temperature
and then an equivalent derating as per:
ΔTmax (T) = (Factor)2 × ΔT (70 °C).
For any particular IRMS the ΔT may be calculated by:
ΔT (°C) = Pdis (mW) / G(mW/°C).
Where ΔT (°C) is the difference between the temperature measured on the box (see figure 1) and
the ambient temperature when capacitor is working during normal operation;
ΔT (°C) = Top (°C)  TA (°C).
It represents the increasing of temperature provoked by the IRMS during operation.
G (mW/°C) is the equivalent heat coefficient described above and Pdis (mW) is the dissipated
power defined by:
Pdis (mW) = ESRtyp (mΩ) × Irms2 (ARMS).

Example for thermal calculation:

We will take as reference B32778G0306K (30 μF/1100 V) type for thermal calculation.
Considering the following load and capacitor characteristics:
IRMS : 12 ARMS at 20 kHz TA: 85 °C 30 × 45 × 57.5 box
G (mW/°C): 125
Then we have to find the ESRtyp at 20 kHz what is approx . 8.2 mΩ.
So according to:
Pdis (mW) = ESRtyp (mΩ) × Irms2 (ARMS)
we have the following:
Pdis (mW) = 8.2 mΩ × 12 ARMS2 = 1181 mW
and as per:
ΔT (°C) = Pdis (mW) / G (mW/°C)

we have the following:

ΔT (°C) = 1181 (mW) / 125 (mW/°C) = 9.5 °C.
What is below of the
ΔTmax (85 °C) = (Factor)2 × ΔT (70 °C) = (0.7)2 × 20 °C = 9.8 °C.
On the other hand we may confirm that max IRMS at 20 kHz at 70 °C = 17.5 ARMS

And then max IRMS for 85 °C of ambient temperature is defined as follows:

IRMS (85 °C) = Factor × IRMS (70 °C) = 0.7 × 17.5 ARMS = 12.25 ARMS.
What confirms once again that IRMS (12 ARMS at 20 kHz) is below the max specified for such
frequency and ambient temperature.

Please read Cautions and warnings and Page 35 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Life time expectancy - typical curves

B3277x-4 (450 V DC)

B3277x-5/8/9/0/1 (575 V DC / 800 V DC / 900 V DC / 1100 V DC / 1300 V DC )

Note: Confidence level of 95%

Please read Cautions and warnings and Page 36 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Testing and Standards

Test Reference Conditions of test Performance

requirements
Electrical IEC61071:2007 Voltage between terminals, Within specified limits
parameters 1.5 VR, during 10 s
(Routine test) Insulation resistance, Rins at
VR if VR < 500 V or
500 V if VR ≥ 500 V
Capacitance, C at 1 kHz
(room temperature)
Dissipation factor, tan δ at
1/10 kHz (room temperature)
Robustness IEC 60068-2-21-2006 Tensile strength (test Ua1) Capacitance and tan δ
of termina- Wire diameter Tensile within specified limits
tions force
(Type test) 0.5 < d1 ≤ 0.8 mm 10 N
0.8 < d1 ≤ 1.25 mm 20 N
Resistance to IEC 60068-2-20:2008, Solder bath temperature at ΔC/C0 ≤ 2%
soldering test Tb, 260 ±5 °C, immersion for Δ tan δ ≤ 0.002
heat method 1A 10 seconds
(Type test)
Rapid IEC 60384-16:2005 TA = lower category temperature ΔC/C0 ≤ 2%
change of TB = upper category temperature Δ tan δ ≤ 0.002
temperature Five cycles, duration t = 30 min. Rins ≥ 50% of initial limit
(Type test)
Vibration IEC 60384-16:2005 Test FC: vibration sinusoidal No visible damage
(Type test) Displacement: 0.75 mm
Accleration: 98 m/s2
Frequency: 10 Hz ... 500 Hz
Test duration: 3 orthogonal axes,
2 hours each axe
Bump IEC 60384-16:2005 Test Eb: Total 4000 bumps with No visible damage
(Type test) 390 m/s2 mounted on PCB ΔC/C0 ≤ 2%
6 ms duration Δ tan δ ≤ 0.002
Rins ≥ 50% of initial limit
Climatic IEC 60384-16:2005 Dry heat Tb / 16 h No visible damage
sequence st
Damp heat cyclic, 1 cycle ΔC/C0 ≤ 3%
(Type test) +55 °C / 24 h / 95% ... 100% RH Δ tan δ ≤ 0.001
Cold Ta / 2 h Rins ≥ 50% of initial limit
Damp heat cyclic, 5 cycles
+55 °C / 24 h / 95% ... 100% RH

Please read Cautions and warnings and Page 37 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Test Reference Conditions of test Performance

requirements
Damp heat, IEC 60384-16:2005 Test Ca No visible damage
steady state 40 °C / 93% RH / 56 days ΔC/C0 ≤ 5%
(Type test) Δ tan δ ≤ 0.005
Rins ≥ 50% of initial limit
Endurance IEC 60384-16:2005 70 °C / 1.25 VR / 1000 hours or No visible damage
(Type test) 85 °C / 1.25 Vop / 1000 hours or ΔC/C0 ≤ 5% at 1 kHz
100 °C / 1.25 Vop / 1000 hours Δ tan δ ≤ 0.005
Rins ≥ 50% of initial limit

Mounting guidelines

1 Soldering

1.1 Solderability of leads

The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.

Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.

Solder bath temperature 235 ±5 °C

Soldering time 2.0 ±0.5 s
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Wetting of wire surface by new solder ≥90%,
Visual inspection
free-flowing solder

Please read Cautions and warnings and Page 38 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

1.2 Resistance to soldering heat

Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1.
Conditions:

Series Solder bath temperature Soldering time

MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ±5 °C 10 ±1 s
coated
uncoated (lead spacing >10 mm)
MFP
MKP (lead spacing >7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm) 5 ±1 s
MKP (lead spacing ≤7.5 mm) <4 s
MKT uncoated (lead spacing ≤10 mm) recommended soldering
insulated (B32559) profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)

Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane

Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between
capacitor body and liquid solder
Evaluation criteria:
Visual inspection No visible damage
2% for MKT/MKP/MFP
ΔC/C0
5% for EMI suppression capacitors
tan δ As specified in sectional specification

Please read Cautions and warnings and Page 39 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

1.3 General notes on soldering

Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings

The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.

EPCOS recommendations
As a reference, the recommended wave soldering profile for our film capacitors is as follows:

Please read Cautions and warnings and Page 40 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Body temperature should follow the description below:

MKP capacitor
During pre-heating: Tp ≤110 °C
During soldering: Ts ≤120 °C, ts ≤45 s
MKT capacitor
During pre-heating: Tp ≤125 °C
During soldering: Ts ≤160 °C, ts ≤45 s
When SMD components are used together with leaded ones, the film capacitors should not pass
into the SMD adhesive curing oven. The leaded components should be assembled after the SMD
curing step.
Leaded film capacitors are not suitable for reflow soldering.
In order to ensure proper conditions for manual or selective soldering, the body temperature of
the capacitor (Ts) must be ≤120 °C.
One recommended condition for manual soldering is that the tip of the soldering iron should
be <360 °C and the soldering contact time should be no longer than 3 seconds.
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please refer to EPCOS Film Capacitor Data Book in case more details are needed.

Please read Cautions and warnings and Page 41 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Cautions and warnings

Do not exceed the upper category temperature (UCT).

Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
Consult us if application is with severe temperature and humidity condition.
There are no serviceable or repairable parts inside the capacitor. Opening the capacitor or
any attempts to open or repair the capacitor will void the warranty and liability of EPCOS.
Please note that the standards referred to in this publication may have been revised in the
meantime.

The table below summarizes the safety instructions that must always be observed. A detailed de-
scription can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
Topic Safety information Reference chapter
"General technical
information"
Storage Make sure that capacitors are stored within the specified 4.5
conditions range of time, temperature and humidity conditions. "Storage conditions"
Flammability Avoid external energy, such as fire or electricity (passive 5.3
flammability), avoid overload of the capacitors (active "Flammability"
flammability) and consider the flammability of materials.
Resistance to Do not exceed the tested ability to withstand vibration. 5.2
vibration The capacitors are tested to IEC 60068-2-6:2007. "Resistance to
EPCOS offers film capacitors specially designed for vibration"
operation under more severe vibration regimes such as
those found in automotive applications. Consult our
catalog "Film Capacitors for Automotive Electronics".

Topic Safety information Reference chapter

"Mounting guidelines"
Soldering Do not exceed the specified time or temperature limits 1 "Soldering"
during soldering.
Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning"

Please read Cautions and warnings and Page 42 of 48

Important notes at the end of this document.
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MKP DC link  high density series up to 480 μF

Topic Safety information Reference chapter

"Mounting guidelines"
Embedding of When embedding finished circuit assemblies in plastic 3 "Embedding of
capacitors in resins, chemical and thermal influences must be taken capacitors in finished
finished into account. assemblies"
assemblies Caution: Consult us first, if you also wish to embed other
uncoated component types!

Display of ordering codes for EPCOS products

The ordering code for one and the same product can be represented differently in data sheets,
data books, other publications and the website of EPCOS, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the or-
dering codes are due to different processes employed and do not affect the specifications
of the respective products. Detailed information can be found on the Internet under
www.epcos.com/orderingcodes.

Please read Cautions and warnings and Page 43 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Symbols and terms

Symbol English German

α Heat transfer coefficient Wärmeübergangszahl
αC Temperature coefficient of capacitance Temperaturkoeffizient der Kapazität
A Capacitor surface area Kondensatoroberfläche
βC Humidity coefficient of capacitance Feuchtekoeffizient der Kapazität
C Capacitance Kapazität
CR Rated capacitance Nennkapazität
ΔC Absolute capacitance change Absolute Kapazitätsänderung
ΔC/C Relative capacitance change (relative Relative Kapazitätsänderung (relative
deviation of actual value) Abweichung vom Ist-Wert)
ΔC/CR Capacitance tolerance (relative deviation Kapazitätstoleranz (relative Abweichung
from rated capacitance) vom Nennwert)
dt Time differential Differentielle Zeit
Δt Time interval Zeitintervall
ΔT Absolute temperature change Absolute Temperaturänderung
(self-heating) (Selbsterwärmung)
Δtan δ Absolute change of dissipation factor Absolute Änderung des Verlustfaktors
ΔV Absolute voltage change Absolute Spannungsänderung
dV/dt Time differential of voltage function (rate
Differentielle Spannungsänderung
of voltage rise) (Spannungsflankensteilheit)
ΔV/Δt Voltage change per time interval Spannungsänderung pro Zeitintervall
E Activation energy for diffusion Aktivierungsenergie zur Diffusion
ESL Self-inductance Eigeninduktivität
ESR Equivalent series resistance Ersatz-Serienwiderstand
f Frequency Frequenz
f1 Frequency limit for reducing permissible Grenzfrequenz für thermisch bedingte
AC voltage due to thermal limits Reduzierung der zulässigen
Wechselspannung
f2 Frequency limit for reducing permissible Grenzfrequenz für strombedingte
AC voltage due to current limit Reduzierung der zulässigen
Wechselspannung
fr Resonant frequency Resonanzfrequenz
FD Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
FT Derating factor Deratingfaktor
i Current (peak) Stromspitze
IC Category current (max. continuous Kategoriestrom (max. Dauerstrom)
current)

Please read Cautions and warnings and Page 44 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Symbol English German

IRMS (Sinusoidal) alternating current, (Sinusförmiger) Wechselstrom
root-mean-square value
iz Capacitance drift Inkonstanz der Kapazität
k0 Pulse characteristic Impulskennwert
LS Series inductance Serieninduktivität
λ Failure rate Ausfallrate
λ0 Constant failure rate during useful Konstante Ausfallrate in der
service life Nutzungsphase
λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate
Pdiss Dissipated power Abgegebene Verlustleistung
Pgen Generated power Erzeugte Verlustleistung
Q Heat energy Wärmeenergie
ρ Density of water vapor in air Dichte von Wasserdampf in Luft
R Universal molar constant for gases Allg. Molarkonstante für Gas
R Ohmic resistance of discharge circuit Ohmscher Widerstand des
Entladekreises
Ri Internal resistance Innenwiderstand
Rins Insulation resistance Isolationswiderstand
RP Parallel resistance Parallelwiderstand
RS Series resistance Serienwiderstand
S severity (humidity test) Schärfegrad (Feuchtetest)
t Time Zeit
T Temperature Temperatur
τ Time constant Zeitkonstante
tan δ Dissipation factor Verlustfaktor
tan δD Dielectric component of dissipation Dielektrischer Anteil des Verlustfaktors
factor
tan δP Parallel component of dissipation factor Parallelanteil des Verlfustfaktors
tan δS Series component of dissipation factor Serienanteil des Verlustfaktors
TA Temperature of the air surrounding the Temperatur der Luft, die das Bauteil
component umgibt
Tmax Upper category temperature Obere Kategorietemperatur
Tmin Lower category temperature Untere Kategorietemperatur
tOL Operating life at operating temperature Betriebszeit bei Betriebstemperatur und
and voltage -spannung
Top Operating temperature, TA + ΔT Beriebstemperatur, TA + ΔT
TR Rated temperature Nenntemperatur
Tref Reference temperature Referenztemperatur
tSL Reference service life Referenz-Lebensdauer

Please read Cautions and warnings and Page 45 of 48

Important notes at the end of this document.
 B32774 ... B32778
MKP DC link  high density series up to 480 μF

Symbol English German

VAC AC voltage Wechselspannung
VC Category voltage Kategoriespannung
VC,RMS Category AC voltage (Sinusförmige)
Kategorie-Wechselspannung
VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung
Vch Charging voltage Ladespannung
VDC DC voltage Gleichspannung
VFB Fly-back capacitor voltage Spannung (Flyback)
Vi Input voltage Eingangsspannung
Vo Output voltage Ausgangssspannung
Vop Operating voltage Betriebsspannung
Vp Peak pulse voltage Impuls-Spitzenspannung
Vpp Peak-to-peak voltage Impedance Spannungshub
VR Rated voltage Nennspannung
R Amplitude of rated AC voltage Amplitude der Nenn-Wechselspannung
VRMS (Sinusoidal) alternating voltage, (Sinusförmige) Wechselspannung
root-mean-square value
VSC S-correction voltage Spannung bei Anwendung "S-correction"
Vsn Snubber capacitor voltage Spannung bei Anwendung
"Beschaltung"
Z Impedance Scheinwiderstand
Lead spacing Rastermaß

Please read Cautions and warnings and Page 46 of 48

Important notes at the end of this document.
Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).

Page 47 of 48
Important notes

7. Our manufacturing sites serving the automotive business apply the IATF 16949
standard. The IATF certifications confirm our compliance with requirements regarding the
quality management system in the automotive industry. Referring to customer requirements
and customer specific requirements (“CSR”) TDK always has and will continue to have the
policy of respecting individual agreements. Even if IATF 16949 may appear to support the
acceptance of unilateral requirements, we hereby like to emphasize that only requirements
mutually agreed upon can and will be implemented in our Quality Management System.
For clarification purposes we like to point out that obligations from IATF 16949 shall only
become legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun-
tries. Further information will be found on the Internet at www.epcos.com/trademarks.

Release 2018-06

Page 48 of 48