MOD 30ML™ Multiloop Controller Installation

Product Description, Installation and Wiring for

1800R Models A and B and Associated Hardware

ABB Instrumentation
 ABB INSTRUMENTATION
The Company
ABB Instrumentation is an established world force in the design and manufacture of BS EN ISO 9001
instrumentation for industrial process control, flow measurement, gas and liquid analysis St Neots -
and environmental applications. Certificate No. Q5907
Stonehouse -
As a part of ABB, a world leader in process automation technology, we offer customers
Certificate No. FM 21106
application expertise, service and support worldwide.
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unrivaled service and support.
Certificate No. AQ-8618
The quality, accuracy and performance of the Company's products result from over 100
years experience, combined with a continuous program of innovative design and
development to incorporate the latest technology.
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plants operated by the Company, and is indicative of ABB Instrumentation's dedication to Certificate No. 90/90A
quality and accuracy.
Stonehouse -
Certificate No. 0255

Use of Instructions

∆ Warning. An instruction that draws attention to the risk of
Note. Clarification of an instruction or additional
injury or death. information.

! Caution. An instruction that draws attention to the risk of

i Information. Further reference for more detailed
the product, process or surroundings. information or technical details.

Although Warning hazards are related to personal injury, and Caution hazards are associated with equipment or property damage, it
must be understood that operation of damaged equipment could, under certain operational conditions, result in degraded process
system performance leading to personal injury or death. Therefore, comply fully with all Warning and Caution notices.

Information in this manual is intended only to assist our customers in the efficient operation of our equipment. Use of this manual for
any other purpose is specifically prohibited and its contents are not to be reproduced in full or part without prior approval of ABB
Instrumentation.

Licensing, Trademarks and Copyrights

MOD 30 and MOD 30ML are trademarks of Asea Brown Boveri, Inc.
MODBUS is a trademark of Modicon Inc.

Health and Safety

To ensure that our products are safe and without risk to health, the following points must be noted:
1. The relevant sections of these instructions must be read carefully before proceeding.

2. Warning Labels on containers and packages must be observed.

3. Installation, operation, maintenance and servicing must only be carried out by suitably trained personnel and in accordance with the
information given or injury or death could result.
4. Normal safety procedures must be taken to avoid the possibility of an accident occurring when operating in conditions of high
pressure and/or temperature.

5. Chemicals must be stored away from heat, protected from temperature extremes and powders kept dry. Normal safe handling
procedures must be used.

6. When disposing of chemicals, ensure that no two chemicals are mixed.

Safety advice concerning the use of the equipment described in this manual may be obtained from the Company address on the back
cover, together with servicing and spares information.
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CONTENTS

Page
SECTION 1 - PRODUCT DESCRIPTION
1.1 OVERVIEW ........................................................................................................................... 1
1.1.1 Features ............................................................................................................................. 3
1.1.2 Related Documents............................................................................................................ 4
1.2 EXPLANATION OF CATALOG NUMBERS .......................................................................... 4
1.2.1 General............................................................................................................................... 4
1.2.2 Electrical Codes ................................................................................................................. 4
1.3 BASIC HARDWARE .............................................................................................................. 5
1.3.1 1800R MOD 30ML MULTILOOP CONTROLLER.............................................................. 5
1.3.2 1800P MOD 30ML Identity Module .................................................................................... 6
1.3.3 2010P MODCELL Memory Module.................................................................................... 6
1.4 I/O MODULES ....................................................................................................................... 7
1.4.1 2001A Voltage Input Module .............................................................................................. 7
1.4.2 2002A Current Input Module .............................................................................................. 7
1.4.3 2012A Current Input Module (with 2-wire transmitter power)............................................. 8
1.4.4 2013A Thermocouple Input Module (with upscale burnout detecton)................................ 8
1.4.5 2003A Current Output Module ........................................................................................... 9
1.4.6 2004A Solid-State Relay Input Module .............................................................................. 10
1.4.7 2005A Solid-State Relay Output Module............................................................................ 10
1.4.8 2006A Nonisolated Digital Input Module ............................................................................ 11
1.4.9 2007A Nonisolated Digital Output Module ......................................................................... 11
1.4.10 2011A Mechanical Relay Output Module ........................................................................... 12
1.4.11 2009A RTD Input Module................................................................................................... 12
1.4.12 2020N Remote I/O Interface Module ................................................................................. 13
1.5 COMMUNICATIONS MODULES .......................................................................................... 13
1.5.1 2030N ICN Communication Module................................................................................... 13
1.5.2 2032N RS-485 Communication Module for Modbus (2-Wire)............................................ 14
1.5.3 2033N RS-232 Communication Module for Modbus.......................................................... 14
1.5.4 2034N RS-485 Communication Module for Modbus (4-Wire)............................................ 15
1.5.5 2030F ICN Terminator ....................................................................................................... 15

SECTION 2 - MECHANICAL INSTALLATION

2.1 GENERAL.............................................................................................................................. 17
2.1.1 Displays and Cleaning........................................................................................................ 17
2.1.2 Environmental Specifications ............................................................................................. 17
2.2 UNPACKING ......................................................................................................................... 17
2.3 INSTALLING MODULES....................................................................................................... 18
2.3.1 I/O Module Planning........................................................................................................... 18
2.3.2 I/O Module and Memory Module Installation Procedure .................................................... 19
2.4 MOUNTING ........................................................................................................................... 22

SECTION 2 - POWER, GROUNDING, AND BUILT-IN I/O CONNECTIONS

3.1 GENERAL.............................................................................................................................. 25
3.2 CONNECTION GUIDELINES................................................................................................ 25
3.3 POWER CONNECTIONS ..................................................................................................... 28

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CONTENTS (Cont’d)
Page
3.4 GROUND CONNECTIONS .................................................................................................. 29
3.4.1 Chassis and Shield Grounds ............................................................................................. 29
3.4.2 Circuit Common Connections ............................................................................................ 29
3.4.3 Electrical Noise .................................................................................................................. 29
3.4.4 Noise Prevention Measures............................................................................................... 30
3.5 BUILT-IN PROCESS INPUT CONNECTIONS ..................................................................... 31
3.5.1 Built-In Voltage, Millivolt and Thermocouple Inputs ........................................................... 32
3.5.2 Built-In RTD Input .............................................................................................................. 33
3.5.3 Built-In Current Input - 2-Wire Transmitter......................................................................... 34
3.5.4 Built-In Current Input - Non 2-Wire Transmitter ................................................................. 35
3.5.5 Built-In Resistance Input.................................................................................................... 36
3.6 BUILT-IN OUTPUT CONNECTIONS.................................................................................... 37

SECTION 4 - MODULAR I/O CONNECTIONS

4.1 GENERAL ............................................................................................................................. 39
4.2 MODULAR I/O CONNECTION GUIDELINES ...................................................................... 39
4.3 MODULAR PROCESS INPUT CONNECTIONS .................................................................. 40
4.3.1 2013A Thermocouple Input (TIM) and Cold Junction Compensation................................ 41
4.3.2 2004A SSR Input (DIM) ..................................................................................................... 43
4.3.3 2006A Nonisolated Digital Input (DIM) .............................................................................. 45
4.3.4 2002A and 2012A Current Inputs (VCIM).......................................................................... 46
4.3.5 2001A Voltage Input (VCIM).............................................................................................. 48
4.3.6 2009A RTD Input (RIM, WRIM) ......................................................................................... 49
4.3.7 2020N Remote I/O Interface Module (RIO) ....................................................................... 51
4.4 MODULAR OUTPUT CONNECTIONS................................................................................. 53
4.4.1 2003A Current Output (AOM) ............................................................................................ 53
4.4.2 2005A SSR Output (DOM) ................................................................................................ 54
4.4.3 2007A Nonisolated Digital Output (DOM).......................................................................... 56
4.4.4 2011A Dual Mechanical Relay Outputs (DDOM)............................................................... 57
4.4.5 2011A Form C Mechanical Relay Outputs (WDOM) ......................................................... 58

SECTION 5 - COMMUNICATIONS CONNECTIONS

5.1 GENERAL ............................................................................................................................. 59
5.2 COMMUNICATION CONNECTION GUIDELINES............................................................... 60
5.3 FRONT PANEL RS-232 COMMUNICATIONS CONNECTION............................................ 61
5.4 INSTRUMENT COMMUNICATIONS NETWORK (ICN) CONNECTIONS ........................... 61
5.4.1 Cable Requirements .......................................................................................................... 61
5.4.2 Addresses.......................................................................................................................... 61
5.4.3 Termination........................................................................................................................ 64
5.5 MODBUS NETWORK CONNECTIONS ............................................................................... 64
5.5.1 General .............................................................................................................................. 64
5.5.2 RS-232 Modbus Communication....................................................................................... 65
5.5.3 RS-485 2-Wire Modbus Communication ........................................................................... 67
5.5.4 RS-485 4-Wire Modbus Communication .......................................................................... 69

APPENDIX A
A.1 MAINTENANCE .................................................................................................................... A-1
A.2 PLANNING FORMS.............................................................................................................. A-1

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ILLUSTRATIONS
Figure Page
1-1 Location of Controller Components ....................................................................................... 2
2-1 Example of an I/O Planning Form for a Controller with I/O Modules..................................... 21
2-2 Controller Mounting Dimensions............................................................................................ 23
3-1 Electrical Connection Terminals ............................................................................................ 26
3-2 Terminal Identifications for Built-in I/O................................................................................... 31
3-3 Built-in Voltage, Millivolt and Thermocouple Input Connections............................................ 32
3-4 Built-in RTD Input Connections ............................................................................................. 33
3-5 Built-in 2-Wire Milliampere Current Input Connections.......................................................... 34
3-6 Built-in Non 2-Wire Current Input Connections ..................................................................... 35
3-7 Built-In Resistance Input Connections................................................................................... 36
3-8 Built-in Milliampere Output Connections................................................................................ 37
3-9 Built-in Voltage Output Connections...................................................................................... 37
4-1 Terminal Identifications for Modular I/O................................................................................. 39
4-2 Typical Connections for a 2013A Thermocouple Input Module, and a 2009A RTD
Module for Cold Junction Compensation............................................................................... 42
4-3 Typical Connections for a 2004A Solid State Relay Input Module ........................................ 44
4-4 Typical Connections for a 2006A Nonisolated Digital Input Module ...................................... 45
4-5 Typical Connections for a 2012A Current Input Module with 2-Wire Transmitter Power ...... 46
4-6 Typical Connections for a 2002A Current Input Module........................................................ 47
4-7 Typical Connections for a 2001A Voltage Input Module....................................................... 48
4-8 Typical Connections for a 2009A 2-Wire or 3-Wire RTD Input Module ................................. 50
4-9 Typical Interface Circuit for 2020N Remote I/O Interface Module (RIO) ............................... 52
4-10 Typical Connections for a 2003A Current Output Module ..................................................... 53
4-11 Recommended Connection to Solid State Relay................................................................... 54
4-12 Typical Connections for a 2005A Solid State Relay Output Module ..................................... 55
4-13 Typical Connections for a 2007A Nonisolated Digital Output Module ................................... 56
4-14 Typical Connections for a 2011A Mechanical Relay Output Module (Dual SPST, NO/NC).. 57
4-15 Typical Connections for a 2011AZ10200A Mechanical Relay Output Module (Form C)....... 58
5-1 Terminal Identifications for Communications Network Connections ..................................... 59
5-2 Locations for Port 1 Communications Jumper....................................................................... 61
5-3 ICN Connections for Built-in and Modular Communication Circuits ..................................... 63
5-4 Typical Network Connections for Built-In Modbus RS-232 Communication......................... 66
5-5 Typical Network Connections for Modular Modbus RS-232 Communication....................... 66
5-6 Typical Modbus Connections for an RS-485, 2-Wire Network .............................................. 68
5-7 Simplified Diagram, 2034N RS-485, 4-Wire Module ............................................................. 70
5-8 Typical Modbus Connections for an RS-485, 4-Wire Network (Slave Controller) ................. 71
5-9 Typical Modbus Connections for an RS-485, 4-Wire Network (Master Controller) ............... 72
5-10 Typical Modbus Connections for a 4-Wire Master with 2-Wire Slaves.................................. 73

TABLES
Table Page
2-1 Module Types and Valid Locations........................................................................................ 20
4-1 Temperature Range Limits for Thermocouple Input Modules ............................................... 42
4-2 Supported RTD Materials and Standards and Sample RTDs ............................................... 49
4-3 Supported Remote I/O Modules ............................................................................................ 51

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PRODUCT DESCRIPTION

1
PRODUCT DESCRIPTION

1.1 OVERVIEW
The MOD 30ML Multiloop Controller, Figure 1-1, is a 3x6 instrument with a 7 line 3 bar graph
configurable display, removable rear terminations, built-in communications, two built-in analog
inputs and two outputs, room for eleven additional modular I/O positions (single point or
remote I/O interface) and an optional memory module.

1.1.1 Features
Instrument
• 3X6 (72mm X 144mm) instrument with behind panel depth of 15.75 inches (400mm)
• Motorola 68302 processor, including on chip RISC communications processor
• Universal ac power supply (85 to 250VAC/ 50 to 400 Hz, 20-50VDC)
• 11 I/O sockets available for process I/O and communications modules
• 64K bytes non volatile database RAM
• Embedded real-time clock with 1ms resolution
• Remote I/O Interface module option which supports up to 100 discrete I/O points.
• A Service Manual switch under the front panel which allows a single point output to be
manually adjusted and displayed (Jumper J5 for NEMA 4 as shown in Figure 1-1).
• NEMA 4 option.
• Removable rear terminations.
Portable Memory Module
• Optional plug on module that provides 64K bytes of redundant, removable non volatile
RAM for database backup, portability and integrity (allows a data base to be ported from
one instrument to another)
• Updated every 50 ms
Process I/O
• Built-in I/O of two direct connected universal analog inputs and two control outputs.
• Single point direct connected I/O modules for wide variety of process signals
• Embedded microprocessor provides high-resolution signal conversion
• Individually opto-isolated to 250Vrms, continuous
• Per-point, configurable fail-safe and power fail/restart settings
• Provide loop power for 2-wire transmitters
Communications
• Built-in communications driver circuitry supporting either the ICN or Extended Modbus
communication with other instruments and host devices.
• Modular communications supporting a second communications channel, either ICN or
Extended Modbus, via a plug-in module.
• An RS-232 capable port under the front panel permitting easy connection of a portable
computer for data base configuration (requires RS-232 be setup on port 1).
Configuration
• Front panel setup of resident control strategies (see operation book).
• Full data base configuration capability using Application Builder software running on a
personal computer (see data base reference books).
• Display development for custom user defined displays

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Back of Housing Front Panel

Terminal Cover
Alarm Indicator

Keys and
Display

Electrical Connection Terminals

Identification Tag

Service/Manual Switch RS-232 Port

Not present with NEMA 4

I/O Module Locations Built-in I/O Circuits Identity Module

(11 available)

Edge Connector Carrier Board Memory Module CPU Board Microprocessor Service/Manual
(jumper used with
NEMA 4 option)

Figure 1-1. Location of Controller Components

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1.1.2 Related Documents

Instructions on the operation and setup activities performed at the front panel of
this instrument are found in the following document:

• IB-1800R-OPR Operation/Setup Manual

Reference information on the data base structure and configuration parameters

for this instrument can be found in the following documents:

• IB-1800R-APP Data Base Reference for MOD 30ML Functions

• IB-23G600 Data Base Reference for Logic, I/O and Communication Functions

• IB-23G601 Data Base Reference for Advanced Control Functions

• IB-23G602 Data Base Reference for Algorithms, Sequencers and Table Functions

• IB-23H141 User’s Guide for Application Builder Software

Reference information on ICN/Link communications for this instrument can be

found in the following documents.

• IB-23A160 ICN Planning

• IB-23C001 ICN Communication Link Instruction Book for 1720N

• IB-23C003 ICN Mini Link Board Instruction Book for 1731N, 1732N

• IB-23C004 ICN Mini Link External Instruction Book for 1733N, 1732N

The following set of books are supplied as a bound set with the Application
Builder Software for the MOD 30ML:

• 98280-418 MOD 30ML Multiloop Controller User’s Guide

(includes binder, tabs, IB-1800R-INS, IB-1800R-OPR, IB-1800R-APP,
IB-23G600, IB-23G601, IB-23G602 and IB-23A160)

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1.2 EXPLANATION OF CATALOG NUMBERS

1.2.1 General
The products described in this book have catalog numbers that help identify specific features.
In addition, some products are assigned a serial number which can be used to track
manufacturing data. The general format of the catalog number is described in this section.
Specific product descriptions are provided in the following sections.

The catalog number stamped on the product data plate contains a series of single and
multiple-character codes. These codes provide specific information concerning various
electrical and/or structural options. Certain code combinations are not allowed, and options
and combinations are subject to change. An example of a typical catalog number is as
follows:

Sample Catalog No. 1800R Z 21 1 0 0 A

Base Number
Unused
Electrical Code
Power
Options
Unused
Model/Design Level

1.2.2 Electrical Codes

Code 21 - FM Approved and CSA Certified

The Electrical Code 21 form of the 1800R MOD 30ML Controller is Factory Mutual (FM)
Approved and Canadian Standards Association (CSA) Certified for installation in Class I,
Division 2, Groups A, B, C or D Hazardous (Classified) locations. This Approval/Certification
includes all modules described in Sections 1.3, 1.4, and 1.5, and listed in Table 2-1.

Code 12 - EU EMC Compliant

The Electrical Code 12 form of the 1800R MOD 30ML Controller complies with the
requirements for European Union (EU) Electromagnetic Compatibility (EMC) when installed in
accordance with the instructions in Sections 2, 3, 4, and 5. This compliance includes all
modules described in Sections 1.3, 1.4, and 1.5, and listed in Table 2-1.

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1.3 BASIC HARDWARE

1.3.1 1800R MOD 30ML MULTILOOP CONTROLLER

The 1800R, Figure 1-1, s designed for mounting in a panel with a 15.75-inch depth. The
instrument housing contains a 50-point termination facility which accepts all instrument I/O,
communications, and power connections. A separate grounding stud provides a safety
ground connection. This assembly is designed to allow termination signal entry from either
top or bottom, allowing for flexibility in signal separation for wiring considerations. The
instrument connects to the terminals via an edge connector at the back of the carrier board,
permitting interchangeability without disconnecting field wiring.
The carrier board provides the connection locations for the modular I/O. There are eleven
locations for single width I/O modules. Ten of the locations are arranged in pairs to accept as
many as five double width modules. The carrier board also contains the built-in I/O and
communications circuits. Two direct connected analog inputs accept thermocouple, RTD,
millivolt and volt dc, milliamp dc and resistance inputs. A 24V dc transmitter power supply for
2-wire transmitters is available on both inputs. Two outputs provide either a 20 mA dc signal
or a 50 mA dc signal. The built-in communications circuits terminate in five multi-purpose
terminals which permit connection to any of the following networks: ICN, RS-232 Modbus,
and 2-wire or 4-wire RS-485 Modbus.
The instrument CPU is based on the 16MHZ 68302 microprocessor. An identity module
(1800P) provides the functionality that gives the instrument the capability to execute a user-
configured database. The CPU supports 64K bytes of nonvolatile RAM for database storage,
and a time-of-day clock with battery support. A high speed communications channel is used
between the CPU and both the built-in I/O and any I/O modules installed on the instrument.
The CPU board provides for connection of a plug-in memory module.
Catalog Number Description for 1800R
BASE NUMBER 1800R MOD 30ML Multiloop Controller
1801R MOD 30ML Multiloop Controller (narrow bezel)
UNUSED Z Unused Character
ELECTRICAL CODE 10 General Purpose, ABB standard
12 General Purpose, EU EMC Compliant
21 FM Approved and CSA Certified
Class I, Division 2, Groups A, B, C, D
POWER SUPPLY 0 24 Vdc (20 – 50 Vdc)
1 85 – 250 Vac, 50 – 400 Hz
OPTIONS 0 None
1 MOD 30 Termination Assembly (see IB-1800R-M30)
2 Option 1 plus: (see IB-1800R-M30)
• 1 Voltage Input Module
• 2 Non-Isolated Digital Input Modules
• 3 Non-Isolated Digital Output Modules
3 NEMA 4
UNUSED 0 Unused Character
MODEL A Design Level A
B Design Level B (EU EMC Compliant)
Sample Number 1800RZ21100A (Product is serialized)

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1.3.2 1800P MOD 30ML Identity Module

The identity module, Figure 1-1, gives the instrument a specific level of process and
communications functionality. The 1800P module is factory installed and provides the
capability to execute a user-configured database which consists of built-in and modular I/O
handling capabilities, PID functionality, and a collection of other control related functions.
These include process alarms, input signal linearization, timers, totalization, signal selection,
lead/lag filtering, dead time compensation, and automatic tuning. These functions reside in a
group of basic data base elements called function blocks.

Catalog Number Description for 1800P

BASE NUMBER 1800P MOD 30ML Identity Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

FUNCTION 1 Advanced Control

FIRMWARE VERSION 01 Version 1

02 Version 2

MODEL A Design Level A

C Design Level C

Sample Number 1800PZ10102C (Product is serialized)

1.3.3 2010P MODCELL Memory Module

The optional memory module plugs directly into the CPU board, Figure 1-1, and
provides a mechanism for porting a database from one instrument to another.
An instrument with this option can upload from or download to this module. The
memory module has a write protect setting to prevent accidental erasures.
When a memory module is installed in an instrument with the write protection
off, the operating software keeps the module up-to-date with all real time
changes in the instrument. Enhanced security is thereby provided through this
backup database copy. Data retention is typically 10 years with instrument
unpowered.

Catalog Number Description for 2010P

BASE NUMBER 2010P Memory Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

UNUSED 000 Unused Characters

MODEL A Design Level

Sample Number 2010PZ10000A (Product is serialized)

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1.4 I/O MODULES

The descriptions included in this section give a brief overview of the functions and features of
the I/O modules.

1.4.1 2001A Voltage Input Module

The voltage input module provides dual ranges of ±10V dc and ±100 mV dc selectable by
configuration. Input to the module is scaled and then applied to an integrating analog to digital
converter. Line cycle integration can be performed at either 50 or 60 Hz line frequencies to
reject any line frequency noise. Transformer isolation from the +5 volt supply is used to
derive all the internal voltages to run the isolated front end. Optical isolation is used to
transfer the information from the A/D converter serially to the microprocessor. The
microprocessor takes the raw A/D voltage, compares it to the reference, and then presents it
to the host as requested over the serial communications bus. This module uses the
Voltage/Current Input Module (VCIM) Block for configuration of input parameters.
VCIM
Catalog Number Description for 2001A
BASE NUMBER 2001A Voltage Input Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

INPUT RANGE 10 ±100 mV or ±10 Vdc

ISOLATION 1 Isolated

MODEL B Design Level

Sample Number 2001AZ10101B

1.4.2 2002A Current Input Module

The current input module is identical to the voltage input module except for the
addition of a 250 ohm resistor across the two input leads. This allows the
standard 4-20 mA DC input range to be accommodated by the module. This
module uses the Voltage/Current Input Module (VCIM) Block for configuration of
input parameters.
VCIM
Catalog Number Description for 2002A
BASE NUMBER 2002A Current Input Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

INPUT RANGE 10 4 – 20 mA

ISOLATION 1 Isolated

MODEL B Design Level

Sample Number 2002AZ10101B

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PRODUCT DESCRIPTION

1.4.3 2012A Current Input Module (with 2-wire transmitter power)

This module is designed specifically for two-wire transmitters and provides the necessary 24
V DC current limited supply to power the transmitter. An internal current sense resistor
converts the current to a voltage for application to the A/D converter. All other features are
the same as the voltage input module. This module uses the Voltage/Current Input Module
(VCIM) Block for configuration of input parameters.

VCIM
Catalog Number Description for 2012A
BASE NUMBER 2012A Current Input Module (with 2-wire transmitter power)

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

INPUT RANGE 10 4 – 20 mA

ISOLATION 1 Isolated

MODEL B Design Level

Sample Number 2012AZ10101B

1.4.4 2013A Thermocouple Input Module (with upscale burnout detecton)

The thermocouple input module is identical to the ±100 mV voltage input module except for
the addition of upscale burnout detection circuitry. Thermocouple types allowed are: B, E, J,
K, N, S, or T. This module uses the Thermocouple Input Module (TIM) Block for configuration
of input parameters.

Cold junction compensation (CJC) for all thermocouples is provided automatically by the
controller when this feature is enabled by connection of a thermocouple to built-in input 1. If
automatic CJC is not enabled, a 2009A RTD Input Module with a 2-wire CJC sensor must be
used to sense the temperature at the terminal block and provide CJC.

TIM
Catalog Number Description for 2013A
BASE NUMBER 2013A Thermocouple Input Module
(with upscale burnout detecton)

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

INPUT RANGE 10 ±100 mV

ISOLATION 1 Isolated

MODEL B Design Level

Sample Number 2013AZ10101B

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1.4.5 2003A Current Output Module

The current output module provides an isolated 0-20 mA or 4-20 mA current output. An
internal A/D converter reads back the output value to check for open outputs or broken wires.
This module uses the Analog Output Module (AOM) Block for configuration of output
parameters.

AOM
Catalog Number Description for 20033A
BASE NUMBER 2003A Current Output Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

OUTPUT RANGE 10 4 – 20 mA

ISOLATION 1 Isolated

MODEL A Design Level

Sample Number 2003AZ10101A

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1.4.6 2004A Solid-State Relay Input Module

The Solid-State Relay Input module provides the necessary interfacing for AC or DC digital
inputs when high isolation voltages are required (250V rms isolation limitation through
connection terminals). This module uses the Digital Input Module (DIM) Block for
configuration of input parameters.
DIM
Catalog Number Description for 2006A
BASE NUMBER 2006A Nonisolated Digital Input Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

INPUT RANGE 10 2.5 to 28 VDC

11 4 to 16 VDC
12 10 to 32 VDC, 12 to 32 VAC
13 35 to 60 VAC / VDC
14 90 to 140 VAC / VDC
15 180 to 280 VAC / VDC

UNUSED 0 Unused Character

MODEL A Design Level

Sample Number 2004AP10100A

1.4.7 2005A Solid-State Relay Output Module

The Solid-State Relay Output module provides the necessary interfacing for AC or DC digital
outputs when high isolation voltages are required (250V rms isolation limitation through
connection terminals). This module uses the Digital Output Module (DOM) Block for
configuration of output parameters.
DOM
Catalog Number Description for 2006A
BASE NUMBER 2006A Nonisolated Digital Input Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

OUTPUT RANGE 10 5 to 60 VDC

11 5 to 200 VDC
12 12 to 140 VAC, SPST, NO
13 24 to 280 VAC, SPST, NO
14 24 to 280 VAC, SPST, NC

UNUSED 0 Unused Character

MODEL A Design Level

Sample Number 2005AP10100A

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1.4.8 2006A Nonisolated Digital Input Module

The Nonisolated Digital Input Module is primarily intended for instrument-to-instrument
signaling. The module interfaces 24-volt on/off signals with no isolation or accepts switch
contact closures without external power requirements. This module uses the Digital Input
Module (DIM) Block for configuration of input parameters.

DIM
Catalog Number Description for 2006A
BASE NUMBER 2006A Nonisolated Digital Input Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

INPUT RANGE 10 2.2 V to 24 VDC

UNUSED 0 Unused Character

MODEL A Design Level

Sample Number 2006AZ10100A

1.4.9 2007A Nonisolated Digital Output Module

The Nonisolated Digital Output Module is primarily intended for instrument-to-instrument
signaling. The module interfaces 24-volt on/off signals with no isolation or works as an open
collector switch that also supports 5V TTL. This module uses the Digital Output Module
(DOM) Block for configuration of output parameters.

DOM
Catalog Number Description for 2007A
BASE NUMBER 2007A Nonisolated Digital Output Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

OUTPUT RANGE 10 24 V, 50 mA TTL

UNUSED 0 Unused Character

MODEL A Design Level

Sample Number 2007AZ10100A

11
 MOD 30ML Multiloop Controller

PRODUCT DESCRIPTION

1.4.10 2011A Mechanical Relay Output Module

The Mechanical Relay Output Module may have dual SPST relays or a Form C relay. This
module uses the Dual Digital Output Module (DDOM) Block for configuration of dual SPST
output parameters or the Wide Digital Output Module (WDOM) Block for configuration of Form
C output parameters.
DDOM
WDOM
Catalog Number Description for 2011A
BASE NUMBER 2011A Mechanical Relay Output Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

TYPE 10 Dual SPST, NO/NO

11 Dual SPST, NC/NC
12 Dual SPST, NO/NC
20 Form C

UNUSED 0 Unused Character

MODEL A Design Level

Sample Number 2011AZ10100A

1.4.11 2009A RTD Input Module

The RTD Input Module is available in two basic forms, 2-wire 0 to 4000 ohm (single wide) and
3-wire 0 to 400 ohm (double wide). RTD sensors use the Wide Resistance Input Module
(WRIM) Block for configuration of 3-wire input parameters and the Resistance Input Module
(RIM) Block for configuration of 2-wire input parameters.
RIM
Catalog Number Description for 2009A
BASE NUMBER 2009A RTD Input Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

REF. RESISTANCE 1 100 Ohm (3-wire 0 to 400 only)

2 1000 Ohm (2-wire 0 to 4000 only)

WRIM
CONNECTION 2 2-Wire (0 to 4000 Ohm)
3 3-Wire (0 to 400 Ohm)
4 2-Wire CJC Sensor (1000 ohm RTD, Table 4-2)

MODEL B Design Level

Sample Number 2009AZ10130B

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 MOD 30ML Multiloop Controller

PRODUCT DESCRIPTION

1.4.12 2020N Remote I/O Interface Module

Remote Input and Output Modules expand the I/O capability of a MOD 30ML Multiloop
Controller to a total of 100 discrete points. The remote modules communicate to the controller
over the CS-31 Remote I/O Network, an RS-485 bus which connects the remote I/O base
units to the 2020N Remote I/O plug-in module. This module is not required to reside in a
communications slot, leaving the two communications channels on the controller open for host
or peer-to-peer communications. See Section 4.3.7 for remote I/O interface connections.
Remote I/O digital connections are described in IB-23C601. This module uses the RIO block
for configuration.

RIO
Catalog Number Description for 2020N
BASE NUMBER 2020N Remote I/O Interface Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

UNUSED 000 Unused Character

MODEL B Design Level

Sample Number 2020NZ10000B

1.5 COMMUNICATIONS MODULES

The descriptions included in this section give a brief overview of the functions and features of
the communication modules. These modules can be used to add a second communication
channel to the MOD 30ML.

1.5.1 2030N ICN Communication Module

The ICN Communication module provides Instrument Communication Network (ICN)
communications capability for the MOD 30ML Multiloop Controller. The ICN is a proprietary
network that allows peer-to-peer communications between the controllers and can be used
with the MOD 30 Instrument line. It also uses a communication link to a computer running the
Application Builder or PC30 series software or other operator interface software. The ICN
Baud rate is 31,250 bits per second. The Model B ICN requires an external terminator such
as the 2030F ICN Terminator.

ICN
Catalog Number Description for 2030N
BASE NUMBER 2030N ICN Communication Module

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

UNUSED 000 Unused Character

MODEL B Design Level

Sample Number 2030NZ10000B

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 MOD 30ML Multiloop Controller

PRODUCT DESCRIPTION

1.5.2 2032N RS-485 Communication Module for Modbus (2-Wire)

This RS-485 Communication module is a bidirectional transceiver that provides 2-wire
Modbus communications capability for the instrument. This module can be used for either a
point-to-point or point-to-multipoint network. The Modbus communications supported by this
module are used only for reading and writing controller attributes.

MSC
Catalog Number Description for 2032N
BASE NUMBER 2032N RS-485 Communication Module for Modbus (2-Wire)

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

UNUSED 000 Unused Character

MODEL C Design Level (optically isolated)

Sample Number 2032NZ10000C

1.5.3 2033N RS-232 Communication Module for Modbus

The RS-232 Communication module is a driver/receiver that provides Extended Modbus
communications capability for the instrument. The RS-232 module can be used for a point-to-
point Modbus network. The Extended Modbus communications supported by this module
include data base downloading, reading diagnostics, reading the system event queue, and
reading and writing controller attributes.

MSC
Catalog Number Description for 2033N
BASE NUMBER 2033N RS-232 Communication Module for Modbus

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

UNUSED 000 Unused Character

MODEL A Design Level

Sample Number 2033NZ10000A

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 MOD 30ML Multiloop Controller

PRODUCT DESCRIPTION

1.5.4 2034N RS-485 Communication Module for Modbus (4-Wire)

This RS-485 Communication module contains a driver and receiver that provide Extended
Modbus communications capability for the instrument. This module can be used for either a
point-to-point or point-to-multipoint Modbus network. The Extended Modbus communications
supported by this module include data base downloading, reading diagnostics, reading the
system event queue, and reading and writing controller attributes.

MSC
Catalog Number Description for 2034N
BASE NUMBER 2034N RS-485 Communication Module for Modbus (4-Wire)

UNUSED Z Unused Character

ELECTRICAL CODE 10 General Purpose, ABB standard

UNUSED 000 Unused Character

MODEL A Design Level

Sample Number 2034NZ10000A

1.5.5 2030F ICN Terminator

The ICN Terminator is used to provide a termination scheme for an ICN network. One
termination is required per ICN.

Catalog Number Description for 2030F

BASE NUMBER 2030F ICN Terminator

UNUSED Z Unused Character

Unused 0000 Unused Characters

FORMAT 1 Eurocard or 1800R

2Flush Mount

MODEL A Design Level

Sample Number 2030FZ10100A

15
 MOD 30ML Multiloop Controller

PRODUCT DESCRIPTION

16
 MOD 30ML Multiloop Controller

MECHANICAL INSTALLATION

2
MECHANICAL INSTALLATION

2.1 GENERAL
Read these instructions thoroughly before starting installation. Installation personnel should
be qualified technicians.

Mechanical installation involves:

• Unpacking (Section 2.2)
• Planning and Installing optional I/O and memory modules if these items are being used
(Section 2.3)
• Mounting (Section 2.4)

2.1.1 Displays and Cleaning

The display is protected by an overlay that can be removed after installation. The face of the
display, while made of scratch-resistant plastic, can be abraded by harsh materials such as
paper towels and industrial wipes. Lens cleaning tissues and soft cloths are suitable for
cleaning displays. Remove dust from the rear of the instrument by removing it from the
instrument housing and spraying exposed surfaces with non-corrosive, non-toxic, non-
flammable inert dusting gas.

2.1.2 Environmental Specifications

Operating Tempearture: 0 to +50°C (32 to 122°F)

Storage Temperature: –40 and+75°C (–40 and 167°F)
Humidity 5 to 95 % RH, non condensing
Altitude: 2000 meters max
Ingress Protection: Options 0,1,2 Front: IP22 Rear: IP20
Option3 (NEMA 4) Front: IP56 Rear: IP20
Pollution degree: 2

2.2 UNPACKING
Unpack and visually inspect the instrument housing, controller, and associated modules for
any damage. The instrument may be removed from its housing, if necessary, to install
modules or change the communication jumper. Remove the controller from its housing by
loosening the two retaining screws in the front panel and pulling the unit out of the housing.
Save packing materials for any reshipment, or to support any claim of shipment damage. All
damage claims are made against the carrier and are the responsibility of the customer.

Included in the shipping container is a bag containing mounting brackets and screws, and an
information package. A card containing several copies of a
writeable instrument identification tag is included in the information package. Write required
data on the tag and insert it under the translucent strip at the bottom of the front panel after
the controller is installed.

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MOD 30ML Multiloop Controller

MECHANICAL INSTALLATION

2.3 INSTALLING MODULES

The controller can accommodate as many as eleven I/O modules. These optional plug-in
modules expand the built-in I/O capacity of the controller. An optional memory module is also
available. The I/O modules mount on the carrier board, and the memory module mounts on
the CPU board as shown in Figure 1-1. The modules must be installed before placing the
controller into operation.

2.3.1 I/O Module Planning

In general there is a high degree of flexibility in locating the I/O modules. The only specific
location restrictions are as follows:
• Field I/O circuits for locations S7 through S11 must not operate at voltages above 30V
rms, 42.4V peak, or 60V dc to comply with safety approval/certification requirements.
• Communications modules have a dedicated location determined by the communications
port being used.
• There are special requirements for the 2003A current output module and the 2012A active
current input module. Because of the heat generated by these modules, they must be
installed in a slot that has no module in either adjacent slot. Slot 11 may be used as long
as slot 10 is not a 2003A or a 2012A.
• To guarantee the accuracy of the built-in cold junction compensator, when used, there
should be no module in slots 1 or 2 and no 2003A or 2012A in slots 3, 4 or 11.

Table 2-1 lists the available I/O module types, their associated data base memory block
identifications, and the valid locations for each module type. An I/O planning form is provided
to document the planned I/O configuration. An example of the form, listing built-in I/O
assignments and the module layout for a controller with five I/O modules, is shown in Figure
2-2. See Appendix A for a blank copy of all planning forms.

∆WARNING Do not use any I/O module which is not listed in Table 2-1. When used in
MOD 30ML systems, the listed modules are FM Approved and CSA
Certified for use in Class I, Division 2, Group A, B, C or D hazardous
(classified) locations. Substitution of a module not on the list voids the
Approval/Certification.

Some other factors which influence I/O module requirements are as follows:
• If the controller requires thermocouple inputs, the first thermocouple should be connected
to built-in input 1 to provide automatic cold junction compensation for all inputs. If
automatic cold junction compensation is not enabled, an I/O module must be installed to
provide the compensation. See Section 4.3.1 for more information.
• The layout of module locations on the carrier board, Figure 2-1, divides locations 1
through 10 into pairs allowing double wide modules to occupy only five different locations.
• Communications port 1 serves either the built-in communications circuits or module
location S10 (S10 and S9 if module is double wide). If the communications function is
being used, connections should first be made to the built-in communication circuit. This
leaves module locations S9 and S10 available for other I/O functions. Location S8 (S8
and S7 if module is double wide) is always available for communications via port 2. See
Section 5 for more information.

18
 MOD 30ML Multiloop Controller

MECHANICAL INSTALLATION

∆WARNING Do not use a 2011A Mechanical Relay Output Module when the
installation environment contains chemicals which can degrade the
materials used to seal the relay in the module. The sealing materials are
as follows:

• Polybutylene Terephthalate, Polyplastics Co. Ltd., Compound No.

3270

• Polyphelene Suffide, Summitomo Chemical Co. Ltd., Compound No.

3601GL30

• Epoxy Resin, Summito Bakelite Co. Ltd., SUMIMAC ECR-9107K

Degradation of the relay seal voids the Approval/Certification of the

instrument for use in Class I, Division 2, Group A, B, C or D hazardous
(classified) locations.

The controller power supply has the capacity to handle the base instrument load of 1220 mA
plus any mix of built-in and modular I/O loads such that the total current consumption does not
exceed 5000 milliamps (5 amps). Add the current consumption for the base instrument, built-
in I/O, and each I/O module using the planning form in Appendix A, Verify that the total does
not exceed 5000 milliamps.

2.3.2 I/O Module and Memory Module Installation Procedure

Install the modules as follows:

1. Loosen the 2 retaining screws in the front panel, Figure 1-1, and pull the instrument out of
its housing.

! CAUTION: Support the instrument from the front and bottom or from the insulator
plate whenever the instrument is outside its housing. Do not allow the full
weight of the circuit boards to be suspended unsupported from the front
panel as this may overstress the brackets at that end.

2. Place the instrument on a flat surface with the front panel overhanging the edge of the
surface so that the black insulator plate is firmly supported. This positioning assures that
the instrument is not damaged by the force applied when inserting I/O modules.

3. Plug each I/O module into its required location on the carrier board and tighten the
retaining screw.

4. Use the memory module as dedcribed in IB-1800-OPR Operation/Setup Manual.

* NOTE: When installing the memory module it is important to orient it so that the
catalog number label is visible when the module is plugged into the
connector on the CPU board.

19
MOD 30ML Multiloop Controller

MECHANICAL INSTALLATION

Table 2-1. Module Types and Valid Locations

Module Type Data Base Module Module Location
Block Type Width
2001A Voltage Input VCIM Single Any Location
2002A Current Input
2012A Current Input with 2-Wire Transmitter VCIM Single Non-adjacent
Locations
2003A Current Output AOM Single Non-adjacent
Locations
2004A Solid State Relay Input DIM Single S1 through S6
(Note 1)
2005A Solid State Relay Output DOM Single S1 through S6
(Note 1)
2006A Nonisolated Digital Input DIM Single Any Location
2007A Nonisolated Digital Output DOM Single Any location
2009A RTD Input (2 Wire) RIM Single Any Location
2009A RTD Input (3 Wire) WRIM Double Any pair of Locations
2011A Mechanical Relay Output (SPST) DDOM Double S1 & S2, S3 & S4,or
2011A Mechanical Relay Output (Form C) WDOM S5 & S6(Note 2)
2013A Thermocouple Input TIM Single Any Location
with Upscale Burnout Detection
2020N Remote I/O Interface Module RIO Double Any Pair of Locations
2030N ICN Communication ICN Double S7&S8 (Port 2)
or
S9&S10 (Port 1)
(Note 3)
2032N RS-485 2-Wire Modbus Communication MSC Single S8 (Port 2) or
S10 (Port 1)
(Note 3)
2033N RS-232 Modbus Communication MSC Double S7 & S8 (Port 2)
2034N RS-485 4-Wire Modbus Communication or
S9 & S10 (Port 1)
(Note 3)

* NOTES: 1. The maximum working voltage between adjacent terminal of circuits rated
less than 30 V rms or 42.4 V peak or 60 Vdc must not be more than 150
V. The maximum working voltage between adjacent terminal of circuits
rated greater than 30 V rms or 42.4 V peak or 60 Vdc must not be more
than 300 V.
2. If I/O circuit voltage is 30V rms, 42.4V peak, 60V dc or less, location pairs
S7-S8 and S9-S10 can also be used.
3. If a communications module is installed in location S10, built-in
communication drivers are not available.

20
 MOD 30ML Multiloop Controller

MECHANICAL INSTALLATION

MOD 30ML I/O PLANNING FORM

Controller No.

Built-in I/O

Input 1: Thermocouple - Type J

Output 1: 20 mA

Input 2: mA w/ 24 Vdc Transmitter Power Supply

Output 2: 20 mA

Communications: 4-Wire RS-485 Modbus (port 1)

Modular I/O
I/O Module Locations
No. Module No. Module No. Module No. Module No. Module No. Module

S1 S2 2005A S3 2009A S4 >--------- S5 S6 2003A

S7 2001A S8 S9 2012A S10 S11 2006A ////////////

WRIM AOM
DOM

VCIM
DIM VCIM

Figure 2-1. Example of an I/O Planning Form for a Controller with I/O Modules

21
MOD 30ML Multiloop Controller

MECHANICAL INSTALLATION

2.4 MOUNTING
The controller must be installed in an approved enclosure or installed in a means acceptable
to the authority having jurisdiction for electrical installations.

∆WARNING Do not install a MOD 30ML controller in a residential, commercial or light

industrial environment in the European Union.

Select a mounting location where:

• There is minimum vibration.
• The ambient temperature is between 32 and 122°F (0 and 50°C) with a relative humidity
of 5-95% RH (noncondensing). The ambient temperature and humidity requirements
apply to the air directly below the controller.
• The installation allows for free air flow above and below the controller
• If it is necessary to mount two or more controllers above each other, and the room
ambient temperature is above 70°F, heat generated by the lower instruments may raise
the ambient of the upper instruments above the 122°F limit. To assure that operating
temperatures are within specified limits, it is recommended that a fan be installed below
the instruments to force air circulation over the instruments in an upward direction. Air
velocity should should be at least 100 to 200 feet per minute.
• The panel provides rigid support for a fully loaded 5.5-pound (2.5 kg) controller and any
other panel devices.
• Electrical wiring routing and support are planned.

Mount the controller as follows:

1. Prepare the panel as indicated in Figure 2-2. Be sure to allow enough clearance under
the front panel of each controller to access the communications jack in the bottom of the
front panel (not present with NEMA 4 option).

2. Draw a 1/4" boundry around cutout for reference when caulking. Apply a 1/4“ bead of
silicon caulking (Loctite # 59530 or equivalent) on the panel around the cutout.

* NOTE: If NEMA 4 is not required, the controller can be installed without the gasket or the
caulking.

3. Slide instrument housing only into panel cutout.

4. Insert brackets into slots in top and bottom of instrument housing.

Be sure the housing gasket is not pinched or twisted between the instrument housing and
the front of the panel.

5. Tighten retaining screws to a torque of 5 inch-pounds (0.6 Nm) or 1-1/2 turns after contact
is made with the back of the panel.

6. Wipe the excess silicon caulking to form a smooth fill and allow it to dry for 24 hours.

7. After the caulking has dried, insert the instrument into the housing and tighten the jack
screw(s) to 7 to 10 inch-pounds (0.8 to 1.1 Nm) or 1-1/2 turns after the front face draws
into the gasket (two screws for NEMA 4 option, one on top otherwise).

22
 MOD 30ML Multiloop Controller

MECHANICAL INSTALLATION

MOUNTING DIMENSIONS

Center-to-Center Distance F G
Recommended 4 8
Minimum 3.5 7

Inches mm Inches mm
0.60 15.2 5.43 137.9
0.87 22.1 5.47 138.9
1.13 28.7 5.69 144.5
2.69 68.3 7.00 177.8
2.87 72.9 8.00 203.2
3.50 88.9 15.75 400.0
4.00 101.6

1.5 inch (38.1mm) clearance for optional communications jack.

NOTES: 1. When mounting housing in panel cutout or rack and panel mounted bezel, turn retaining screws
until point of screw touches rear of panel or bezel. Overtightening of retaining screws will distort
housing. Housing must be square after retaining screws are tightened.

2. Only the NEMA 4 option contains the gasket and lower front panel screw. Also, communication
jack and service manual switch not present on NEMA 4 option.

3. The 1801R has a bezel width of 2.735in (69.47mm) and uses the same panel cutout as the
1800R.

Figure 2-2 Controller Mounting Dimensions

23
MOD 30ML Multiloop Controller

MECHANICAL INSTALLATION

24
 MOD 30ML Multiloop Controller

POWER, GROUNDING, AND BUILT-IN I/O CONNECTIONS

SECTION 3
POWER, GROUNDING, AND BUILT-IN I/O CONNECTIONS

3.1 GENERAL
Read this section thoroughly before making any connections. Installation personnel should be
qualified technicians. Observe all electrical code requirements and safety standards
applicable to these wiring procedures.

Specific instructions and connection diagrams for the various built-in inputs and outputs are
provided in Sections 3.3 through 3.7. A listing of the applicable electrical specifications is
included in each section.

3.2 CONNECTION GUIDELINES

The wiring connections described in this section are made with the controller installed in its
operating location and with the power off. All connection terminals are located under a cover
on the back of the instrument housing. Figure 3-1 shows the terminals with the cover
removed.

! CAUTION Do not connect any wires to terminals 23, 24, 48,and 49.
Connections to these terminals can cause an instrument
malfunction.

The recommended procedure for making power, grounding, and built-in I/O connections is as
follows:

1. Make a copy of the wiring planning sheet, Appendix A, and list each wire connection. It
is recommended that the planning sheet be used to plan and document all wiring
connections: power, grounding, built-in I/O, modular I/O, and communications.
Connection instructions for modular I/O and communications are provided in Sections 4
and 5.

2. The power wire size must be from 14 AWG (1.6 mm) to 18 AWG (1.0 mm) with a 600V,
-20°C +105°C UL, CSA approved rating.

3. The signal wire size can be as small as 22 AWG (0.65 mm). All analog input wiring must
be shielded twisted pairs. Shields must be connected to a good noise free ground (the
chassis ground terminal at the upper right hand corner of the housing is recommended).
See Section 3.4.4 for more information.

4. Route signal wiring less than 30 V rms, 42.4 V peak or 60 V dc from top left. Route signal
wiring greater than 30 V rms, 42.4 V peak or 60 V dc from bottom right. Distribute to
appropriate terminals.

25
MOD 30ML Multiloop Controller

POWER, GROUNDING, AND BUILT-IN I/O CONNECTIONS

Figure 3-1. Electrical Connection Terminals

26
 MOD 30ML Multiloop Controller

POWER, GROUNDING, AND BUILT-IN I/O CONNECTIONS

5. Use a small flat-head screwdriver to loosen appropriate connection screws and clamps on
terminal blocks.

6. Strip approximately 5/16 inch (8 mm) of insulation from the end of each wire, insert wires
at assigned terminals and secure terminal screws and clamps.

7. Make wiring connections using the following procedures:

a. Power connections - Section 3.3.

b. Ground and shield connections - Section 3.4.

c. Built-in process input connections for various types of inputs - Section 3.5

d. Built-in output connections - Section 3.6

8. After all connections are completed and checked, do the following:

a. If modular I/O and communications are required, follow the procedures in Sections 4
and 5.

b. If all connections are completed, the ac power wiring can be connected at the
distribution panel (ac source).

* NOTE: Before putting the controller into operation, it must be configured using either
the front panel keys or the 2006S Application Builder Software. See Section 1.1.2 for
related documents.

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MOD 30ML Multiloop Controller

POWER, GROUNDING, AND BUILT-IN I/O CONNECTIONS

3.3 POWER CONNECTIONS

∆ WARNING Avoid electrical shock. AC power wiring must not be connected at the
distribution panel (ac source) until all wiring procedures are completed.

All power wiring must be in compliance with the requirements of the National Electrical Code
or Canadian Electrical Code. In any installation where the power source does not have one
side of the line connected as a neutral conductor, both sides of the line must be overcurrent
protected.

The controller does not contain a power disconnect switch. Install a disconnect switch or
circuit breaker between the controller and its power source. Choose an accessible location as
near to the controller as practical, and identify the switch or breaker as the disconnecting
device for the controller.

The ac power connections are made to the power terminals shown in Figure 3-1 Route power
cable from the bottom right hand side of the housing.

Power specifications for the controller are:

Power Supply Input:
Instrument Power Code 1: 85 to 250 V rms, 50 to 400 Hz
Instrument Power Code 0: 20 to 50 Vdc ( ————— )
Power Consumption (120V rms, 60 Hz): 50 VA maximum
Transient Overvoltages: Classified as Installation (Overvoltage) Category II
per IEC 664 ( Specfies a maxiumum impulse withstand voltage of 1500 V for phase to
earth voltage of 150 Vrms)
Interruption: No effect from 2 cycle dropout at 120V rms, 60 Hz.
Interference: No permanent effect from exposure to IEC 801-4 fast transients
level 3, or IEC 801-5 surges level 3.
Internal Fuse:
DC Version: 4 amps, 250 V Slow Blow, soldered in
AC Version: 2.5 amps, 250 V Slow Blow, soldered in
External switch or circuit breaker rating:
DC Version: 3 amps, 28 VDC
AC Version: 1 amps, 250 VAC

28
 MOD 30ML Multiloop Controller

POWER, GROUNDING, AND BUILT-IN I/O CONNECTIONS

3.4 GROUND CONNECTIONS

A protective ground terminal (green metal stud) is provided at the bottom of the terminal
blocks near the power connections, Figure 3-1. Connect this terminal directly to the plant
safety ground system. This terminal is to be used only for the protective ground conductor.
Keep the ground wire as short as possible and use the largest practical wire gage.

3.4.1 Chassis and Shield Grounds

The green metal protective ground stud connects directly to the metal instrument chassis, and
to the power input filter in the instrument power supply. The two terminals identified as
chassis in Figure 3-1 are also internally connected to the protective ground stud. The chassis
terminals can be used for shield connections.

3.4.2 Circuit Common Connections

The instrument circuit common is isolated from the protective ground. This makes it easier to
avoid dc ground loops, and helps isolate the instrument from noise which may be present on
the protective ground.

Instrument common is the negative return for both of the built-in analog output circuits.
Common is available on terminals 16 and 41 for convenient connection of the outputs (see
Figure 3-1 and Section 3-7).

Circuit common is also available at terminal 25 for connection to an instrument system

ground. If the installation does not include an instrument system ground, then connect circuit
common to one of the terminals identified as chassis in Figure 3-1. Never leave circuit
common completely floating. Circuit common must always have some dc path to ground to
prevent the possible build up of static charges, and to reduce noise pickup.

3.4.3 Electrical Noise

Electrical disturbances can be caused by lightning, motors and motor driven devices, relays,
solenoids, and communication equipment. These disturbances often introduce electrical
noise in power lines, transmission lines, and site grounds. The successful operation of any
microprocessor-based device depends, in part, on the precautions taken to minimize the
effect of these disturbances. Often called "transients" or "voltage spikes", this form of noise is
infinitely variable in terms of amplitude, frequency, and duration.

Common sources of this type of noise are:

• loose or poor quality connections (especially power connections)
• arc welding equipment
• switches operating inductive loads
• relays, solenoids and other coil operated devices
• high current conductors – electric heater circuits
• fluorescent or neon lamps
• motors and motor driven devices
• switch mode devices – SCRs, thyristors
• lightning
• electrostatic discharges

29
MOD 30ML Multiloop Controller

POWER, GROUNDING, AND BUILT-IN I/O CONNECTIONS

3.4.4 Noise Prevention Measures

Primary power circuit distribution system:

• Ideally, each microprocessor-based device should be provided with an independent
dedicated power source. Where this approach is not feasible due to space availability or
cost per device, an acceptable alternative is to install constant voltage, isolation
transformers in the branch circuit where the microprocessor-based device is installed.
• In addition to the above, install a combination transient surge suppressor and noise filter
in the instrument side of the power distribution system. The combination device
suppresses transients and effectively reduces other noise forms such as electromagnetic
(EMI) and radio frequency (RFI) interferences. These devices can be connected to
multiple units to reduce overall cost.

Input signals
• Twisted wire pairs are essential. The wire type should be stranded, not solid. The largest
wire gauge allowed is best and the more twists per foot the better. A 2-inch lay (6 twists
per foot) should be the minimum used.
• In addition to the above, signal wires should be physically isolated from all power
conductors (separate conduit, cable race, etc.)
• Shielded wire is also essential. Shields must be terminated at the instrument or in the
field in accordance with local regulations.

! CAUTION 1. Never terminate a shield at both ends. One end must always be left
"floating" or ground currents may be introduced.

2. Thermocouple shields should be terminated at the process measurement

end. Most thermocouples are constructed where the sensor is
electrically equivalent to the process connection (grounded junction).

Equipment grounding:
• Grounding practices defined by the National Fire Protection Agency (NFPA) in their
National Electrical Code (NEC) handbook or State agency amendments to this code
should be strictly observed.
• Existing ground conductors and ground paths should be periodically inspected and tested
to insure continuity and compliance with current code requirements.
• For best noise reduction performance, the microprocessor-based device's ground
terminal should be connected to a nearby grounded large metal structure, using the
shortest length wire possible. If a three-wire cordset is used to power the microprocessor-
based device through a receptacle, the ground wire is generally too long and too noisy to
be a good ground.

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Figure 3-2. Terminal Identifications for Built-in I/O

3.5 BUILT-IN PROCESS INPUT CONNECTIONS

Built-in inputs 1 and 2 are isolated universal analog inputs which accept volts dc, millivolts dc,
milliamps dc (includes 2-wire transmitters), RTD, Thermocouple, and resistance signals.
Connections to these inputs are made to the terminals shown in Figure 3-2. The input circuit
diagrams in this section (Figures 3-3 to 3-9) identify Input 1 terminals as I/O 1 and Input 2
terminals as I/O 2.

Each of the two built-in analog input circuits is isolated from every other circuit. It is
recommended that either the Input– or the mA Input + terminal be connected to ground at
some point in the system to prevent possible buildup of static electricity and reduce the pickup
of noise.

The input circuit and input signal specifications for each input type are shown in the following
sections:
• Volt, Millivolt and Thermocouple Input - Section 3.5.1
• RTD Input - Section 3.5.2
• Current Input from a 2-Wire Transmitter - Section 3.5.3
• Current Input from a Non 2-Wire Transmitter - Section 3.5.4
• Resistance Input - Section 3.5.5

General specifications for built-in process inputs are:

Input Isolation: Galvanic isolation using transformers and optical isolators.
Input Common Mode Rating: 45V dc
Common Mode Rejection: 120 dB @ 50/60 Hz
Normal Mode Noise Filter: 20 dB minimum @ 60 Hz
Maximum Normal Mode Voltage: 30V dc (except current input)
Display Accuracy: Input accuracy ± one least significant display digit

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3.5.1 Built-In Voltage, Millivolt and Thermocouple Inputs

Make volt, millivolt and thermocouple input connections as shown in Figure 3.3. Always
connect the first thermocouple input to the I/O 1 terminals to enable automatic cold junction
compensation for all thermocouple inputs.

Figure 3-3. Built-in Voltage, Millivolt and Thermocouple Input Connections

Volt input specifications are:

Input Range: –10 mV to +6 Vdc
Input Impedance: 10M ohms minimum
Resolution: less than 50 microvolts
Accuracy: 0.05% of input or 100 microvolts, whichever is greater
Temperature Effect: 0.01% per °C or 10 microvolts per °C, whichever is greater
Burnout Detection: Reading goes downscale when any lead opens.

Millivolt and Thermocouple input specifications are:

Input Range: –10 to 120 mVdc
Temperature range limits for thermocouple inputs: See Table 4-1
Input Impedance: 10M ohms minimum
Resolution: less than 1 microvolt
Accuracy: 0.08% of input or 20 microvolts, whichever is greater
Temperature Effect: 0.01% per °C or 1 microvolt per °C, whichever is greater
Burnout Detection: Configurable for thermocouple inputs and millivolt signals which represent
thermocouple inputs. Choices are upscale or downscale excursion of reading when any
lead opens, or no detection.

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3.5.2 Built-In RTD Input

Make RTD input connections as shown in Figure 3-4. See Section 4.3.6 for a listing of
materials, standards and sample RTDs supported by the instrument software.

Figure 3-4. Built-in RTD Input Connections

RTD input specifications are:

RTD Type: 3-Wire or 2-Wire
Range: Configurable
• Normal Range: 0 to 430 ohms
• Low Range: 0 to 55 ohms
Resolution: less than 0.004 ohms
Accuracy: ±0.05% of input resistance or 0.1 ohms whichever is greater
Temperature Effect: ±0.01% per °C or 0.01 ohms per °C whichever is greater
RTD Current: 250 microamps typical
Burnout Detection: Reading goes upscale when any lead opens

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3.5.3 Built-In Current Input - 2-Wire Transmitter

Make input connections from a 2-wire transmitter as shown in Figure 3-5.

22mA Maximum Loop Current

When the maximum required loop current is 22 mA or less, make connections as shown in
the left hand view of Figure 3-5. In this connection arrangement, the 2-wire loop receives its
current from a 24V supply in the controller. The current supply is automatically connected in
the circuit when the 2-wire input connection is made.

50 mA Maximum Loop Current

If the maximum required loop current is 50 mA, make connections as shown in the right hand
view of Figure 3-5. In this connection arrangement, an external power supply must be used to
meet the 50 mA requirement.

Current input and transmitter power supply specifications are:

Input Range: 0 to 20 mA dc, Limited to below 70 mA
Input Impedance: 50 ohms nominal
Resolution: less than 1 microamp
Accuracy: ±0.1% of input or 2 microamps, whichever is greater
Temperature Effect: 0.01% per °C or 0.2 microamps per °C, whichever is greater
Transmitter Power Supply: Isolated 24V dc, 20 mA transmitter power supply is built into
controller. For current inputs above 20 mA, a separate external power supply must be
used.

Figure 3-5. Built-in 2-Wire Milliampere Current Input Connections

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3.5.4 Built-In Current Input - Non 2-Wire Transmitter

Make current input connections from a non 2-wire transmitter as shown in Figure 3-6. Note
that the transmitter must be powered from an external source which meets the transmitter
power specifications.

Figure 3-6. Built-in Non 2-Wire Current Input Connections

Current input specifications are:

Input Range: 0 to 54 mA dc, Limited to below 70 mA
Input Impedance: 50 ohms nominal
Resolution: less than 1 microamp
Accuracy: ±0.1% of input or 2 microamps, whichever is greater
Temperature Effect: 0.01% per °C or 0.2 microamps per °C, whichever is greater

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3.5.5 Built-In Resistance Input

The resistance input can be used to monitor a resistance which changes in proportion to a
process related value such as a set-point. Make resistance input connections as shown in
Figure 3-7.

The resistance input can also be used for a 2-wire RTD which is not on the list of supported
RTDs in Section 4.3.6. Make the 2-wire RTD connections as shown in Figure 3-4. When
using an RTD not supported by the instrument software, the data base must be configured to
provide a user defined linearization using the Application Builder Software. Refer to Section
1.1.2 Related Documents.

Figure 3-7. Built-In Resistance Input Connections

Resistance input specifications are:

Range: Configurable
• Normal Range: 0 to 430 ohms
• Low Range: 0 to 55 ohms
Resolution: less than 0.004 ohms
Accuracy: ±0.05% of input resistance or 0.1 ohms whichever is greater

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3.6 BUILT-IN OUTPUT CONNECTIONS

Built-in outputs 1 and 2 are milliamp analog control outputs. Connections to these outputs are
made as shown in Figure 3-2. The output circuit diagrams, Figures 3-8 and 3-9 identify the
Output 1 terminals as I/O 1 and the Output 2 terminals as I/O 2.
The built-in outputs are always milliamp signals. When an application requires a voltage
signal, a precision dropping resistor must be connected across the output terminals to
generate the required voltage as shown in Figure 3-9.
Specifications for built-in outputs 1 and 2 are:
Range: 0 to 20 mA maximum, non-isolated
Resolution: 14 microamps
Accuracy: ±0.2% of setting or 14 microamps, whichever is greater
Temperature Effect: 0.01% per °C or 1 microamp per °C , whichever is greater
Load Resistance: 1000 ohms maximum at 22 mA
at 54 mA: 400 ohms maximum
Open Circuit Voltage: 25.5 volts typical
Ripple: 20 millivolts peak to peak at 100K Hz typical

Figure 3-8. Built-in Milliampere Output Connections

Figure 3-9. Built-in Voltage Output Connections

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4
MODULAR I/O CONNECTIONS

Figure 4-1. Terminal Identifications for Modular I/O

4.1 GENERAL
Read this section thoroughly before making any connections to modules. Installation
personnel should be qualified technicians. Observe all electrical code requirements and
safety standards applicable to these wiring procedures.

Specific instructions and connection diagrams for the various input and output modules are
provided in Sections 4.3 and 4.4. A listing of the applicable electrical specifications is
included with each diagram.

4.2 MODULAR I/O CONNECTION GUIDELINES

The wiring connections described in this section are made with the controller installed in its
operating location and with the power off. All connection terminals are located under a cover
on the back of the instrument housing. Figure 4-1 shows the modular connection terminals
with the cover removed.
The recommended procedure for making, connections to I/O modules is as follows:
1. The diagrams for single width modules show connections to a sample location (usually
location 1). The terminal numbers for the actual location being used must be determined
by matching pin numbers 1 and 2 in each diagram to the terminal numbers for the
selected location as shown in Figure 4-1.
2. The spacing of module locations on the carrier board divides locations 1 through 10 into
pairs allowing double wide modules to occupy only five different locations. The terminal
numbers applicable to each dual location are shown on the connection diagrams for
double wide modules.

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3. Route low-level signal wiring from the top left hand side of the housing and ac voltage
wiring from the bottom right hand side and distribute to appropriate terminals.

4. Use a small, flat-head screwdriver to loosen appropriate connection screws and clamps
on terminal blocks.

5. Strip approximately 5/16 inch (8 mm) of insulation from the end of each wire, insert wires
at assigned terminals, and secure terminal screws and clamps.

∆ WARNING All wiring connected to the controller terminals must be rated for the
maximum voltage present, or alternately, wiring in circuits operating at
greater than 30 volts must be rated for at least twice the circuit voltage.

7. After all connections are completed and checked, do the following:

a. If communications are required, follow the applicable procedure in Section 5.

b. If all connections are completed, the ac power wiring can be connected at the
distribution panel (ac source).

* NOTE: Before putting the controller into operation, it must be configured using
either the front panel keys or the 2006S Application Builder Software.
See Section 1.1.2 for related documents.

4.3 MODULAR PROCESS INPUT CONNECTIONS

This section describes the process input connections for the following input module types:
• 2013A Thermocouple Input Module with upscale burnout detection - Section 4.3.1
• 2004A Solid-State Relay Input Module - Section 4.3.2
• 2006A Nonisolated Digital Input Module - Section 4.3.3
• 2002A Current Input Module - Section 4.3.4
• 2012A Current Input Module with Two-Wire Transmitter - Section 4.3.4
• 2001A Voltage Input Module - Section 4.3.5
• 2009A RTD Input Module - Section 4.3.6
• 2020N Remote I/O Interface Module - Section 4.3.7

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4.3.1 2013A Thermocouple Input (TIM) and Cold Junction Compensation

Make thermocouple sensor connections as shown in Figure 4-2. The controller has automatic
cold junction compensation which must be enabled by connection of a thermocouple to built-in
input 1. When enabled, the automatic cold junction compensation provides compensation for
both built-in and modular inputs, and use of a cold junction compensation module is not
required. For any application requiring one or more thermocouple inputs, it is recommended
that the first thermocouple be connected to built-in input 1 so that a cold junction module is not
required.

In the event that a thermocouple cannot be connected to input 1, installation of a 2-wire RTD
module with a CJC sensor is required for cold junction compensation. This module senses
the temperature at the terminal block and provides cold junction compensation for all
thermocouples connected to the controller.

The RTD sensor used for cold junction compensation is a platinum 1000 ohm RTD with an
alpha of 0.00385. The sensor is Class B (0.12%) and has an operating temperature range of
–50°C to +650°C (–58°F to +1202°F). It is connected to a 2 wire RTD input module and
installed in the housing.

Thermocouple input specifications are:

THERMOCOUPLE INPUT (with upscale burnout detection)
Types: B,E,J,K,N,R,S,T
Range: ±100 mV DC (See Table 4-1 for temperature range limits )
Low limit: - 110 mV
Upper limit: + 110 mV
Input Resistance: 10 Megohms
Noise filter: 3 db at 3 Hz
Resolution: 16 bits
Sensitivity: 4 uV
Accuracy (calibrated): ±0.1% of span
Isolation : 250 Vrms
Max Survivable Input: ±300 VDC or 250 VAC (Differential)
Common mode rejection: 100 db at 60 Hz typical
Normal mode rejection: 40 db at 60 Hz typical

RTD MODULE for COLD JUNCTION COMPENSATION (not required when automatic
compensation is enabled)
Operating range: 0 to 50°C
Overrange: -20 to 70°C
Noise filter: 3 db at 4 Hz
Resolution: 16 bits
Sensitivity: 0.002°C
Accuracy: ±0.5°C
Isolation : 250 Vrms

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Figure 4-2. Typical Connections for a 2013A Thermocouple Input Module, and a 2009A RTD Module for
Cold Junction Compensation

Table 4-1. Temperature Range Limits for Thermocouple Input Modules

Measuring Range Limits
Thermocouple °C Lower °C Upper °F Lower °F Upper
Type B 200 1820 392 3308
Type E –200 1000 –328 1832
Type J –210 760 –346 1400
Type K –200 1372 –328 2501
Type N 0 1300 32 2372
Types R and S 0 1768 32 3214
Type T –257 400 –430 752

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4.3.2 2004A SSR Input (DIM)

Make Solid-State Relay (SSR) connections as shown in Figure 4-3. These input modules are
used for sensing ON/OFF voltage levels. Each module provides optical isolation between the
field devices and the control logic. This isolation is limited to 250 Vrms at the terminal block.
Typical uses and applications for these input modules include sensing voltage and contact
conditions from: proximity switches, limit switches, selector switches, push buttons,
photoelectric switches, TTL compatible devices, float switches, or thermostats.

Wire rating: 600 V, -20°C +105°C UL, CSA approved

∆ WARNING All wiring connected to the controller terminals must be rated for the
maximum voltage present, or alternately, wiring in circuits operating at
greater than 30 volts must be rated for at least twice the circuit voltage.

Input specifications are:

DIGITAL INPUTS (ISOLATED) _10_ _11_ _12_
Input voltage ranges 2.5-28Vdc 4-16Vdc 10-32Vdc, 12-32Vac
mA Input current at Max Line 30 45 25
Max Logic Low Input 1V, 0.2 mA 1V, 0.7 mA 3V, 1 mA
Input Resistance (Ohms) 900 300 1K (dc), 1.5K (ac)
Module Response Time (msec) 1.5 0.1 5

DIGITAL INPUTS (ISOLATED) _13_ _14_ _15_

Input voltage ranges 35-60Vac/dc 90-140Vac/dc 180-280Vac/dc
mA Input current at Max Line 6 (dc), 25 (ac) 11 7
Max Logic Low Input 9V, 0.8 mA 45V, 3 mA 80V, 1.7 mA
Input Resistance 10K Ohms 14K Ohms 43K Ohms
Module Response Time (msec) 10 (dc), 15 (ac) 20 20

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Figure 4-3. Typical Connections for a 2004A Solid State Relay Input Module

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4.3.3 2006A Nonisolated Digital Input (DIM)

Make nonisolated digital input connections as shown in Figure 4-4. Input specifications
are:

DIGITAL INPUTS (NONISOLATED)

Input range
ON 2.2 to 24 VDC or 50 Ω maximum
OFF 0 to 0 .65 VDC or 50K Ω minimum
Max Input current 2.5 mA DC
Max Output current 20 mA DC
Response time 1 msec

Figure 4-4. Typical Connections for a 2006A Nonisolated Digital Input Module

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4.3.4 2002A and 2012A Current Inputs (VCIM)

Make current input connections as shown in Figure 4-5 for 2-Wire Transmitter (2012A) and in
Figure 4-6 for Non 2-Wire Transmitter (2002A).

2-Wire Transmitter (2012A)

The 2-wire version of the milliampere input receives its loop current from a 24V dc current
supply built into the module. This current supply is automatically connected in the circuit
when the 2-wire input connection is made. The load on the transmitter is nominally 100 ohms.
Due to heat generated, this module must be installed in a location with no adjacent module
on either side. Input specifications are:

ANALOG INPUT (CURRENT WITH 2-WIRE TRANSMITTER POWER)

Range: (0-100%) 4 to 20mA
Low limit: 0 mA
Upper limit: 27.5 mA
Input Resistance: 50 ohms
Noise filter: 3 db at 5 Hz
Resolution: 14 bits
Sensitivity: 1 uA
Accuracy (calibrated): ±0.2% of span
Two Wire Excitation Supply
Open circuit voltage: 24V ±5%
Short circuit current: maximum at 38 mA
Isolation : 250 Vrms
Max Survivable Input: ±300 Vdc or 250 Vac (Differential)
Common mode rejection: 100 db at 60 Hz minimum
Normal mode rejection: 40 db at 60 Hz minimum

Figure 4-5. Typical Connections for a 2012A Current Input Module with 2-Wire Transmitter Power

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Non 2-Wire Transmitter (2002A)

The non 2-wire transmitter version of the milliampere input receives its loop current from a
supply in the transmitter. The transmitter load is nominally 100 ohms. The transmitter may be
grounded or ungrounded. Input specifications are:

ANALOG INPUT (CURRENT)

Range: (0-100%) 4 to 20 mA
Low limit: 0 mA
Upper limit: 24 mA
Input Resistance: 250 ohm
Noise filter: 3 db at 5 Hz
Resolution: 13 bits
Sensitivity: 1.6 uA
Accuracy (calibrated): ±0.2% of span
Isolation : 250 Vrms
Max Survivable Input: 50 mAdc (Differential)
Common mode rejection: 100 db at 60 Hz minimum
Normal mode rejection: 40 db at 60 Hz minimum

Figure 4-6. Typical Connections for a 2002A Current Input Module

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4.3.5 2001A Voltage Input (VCIM)

Make volt or millivolt connections as shown in Figure 4-7. Input specifications are:

ANALOG INPUT (VOLTAGE)

Range: (0-100%) ±10 Vdc, ±100 mVdc
Low limit: -11V, -110 mV
Upper limit: +11V, +110 mV
Input Resistance: 1 Megohm
Noise filter: 3 db at 5 Hz, 3 db at 3 Hz
Resolution: 16 bits
Sensitivity: 0.4mV, 4uV
Accuracy (calibrated): ±0.1% of span
Isolation : 250 Vrms
Max Survivable Input: ±300 Vdc or 250 Vac (Differential)
Common mode rejection: 100 db at 60 Hz minimum
Normal mode rejection: 40 db at 60 Hz minimum

Figure 4-7, Typical Connections for a 2001A Voltage Input Module

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4.3.6 2009A RTD Input (RIM, WRIM)

Make resistance input connections as shown in Figure 4-8. The 2 wire input module (RIM),
uses a single wide case and the 3 wire input module (WRIM) uses a double wide case. Table
4-2 summarizes the RTD support standards and shows some sample RTDs.

Table 4-2. Supported RTD Materials and Standards and Sample RTDs
Sample RTDs and Appropriate Module Supported RTD Materials and Standards
Ω @ 0°C Approx. Ω Range RTD Module Material Alpha (Ω/Ω-/°C) Standard
1000 184.94 to3902.61 2 Wire Platinum 0.003850 DIN 43760 (Note 1)
500 92.47 to 1951.31 2 Wire Platinum 0.003850 DIN 43760 (Note 1)
1000 555.00 to 3169.25 2 Wire Nickel 0.006720 Minco (Note 2)
100 18.49 to 390.26 3 Wire Platinum 0.003850 DIN 43760 (Note 1)
98.129 16.66 to 311.87 3 Wire Platinum 0.003923 SAMA RC21-4
100 17.07 to 332.62 3 Wire Platinum 0.003902 Burns
100 17.26 to 403.70 3 Wire Platinum 0.003911 Minco (Note 2)
120 66.60 to 380.31 3 Wire Nickel 0.006720 Minco (Note 2)
1. Also meets IEC 751 and BS 1904 Standards.
2. Sometimes called U.S. Industrial Standard.

Input specifications for the 2 wire and the 3 wire input modules are:
RTD INPUT
Range (0 to 100%):
2 Wire: 0 to 4000 Ohms
3 Wire: 0 to 400 Ohms
Low limit: 0 Ohms
High limit:
2 Wire: 4200 Ohms
3 Wire: 400 Ohms
Module Counts (0 to 100%): –25000 to 25000 (converted to 0 to 50000 in controller)
Sensitivity (One Count)
2 Wire: 0.08 Ohms
3 Wire: 0.008 Ohms
Accuracy, calibrated at 5V supply and 25°C: ±0.05% of Range
(This equals an absolute accuracy of ±25 counts or ±2 ohms for the 2 wire input or
±0.2 ohms for the 3 wire input or ±0.519°C for the Platinum DIN 43760 curve)
Temperature Effect (0°C to 50°C): 0.1% of Range
Noise filter: 3 db at 5 Hz
Max Resistance Each Lead: 100 Ohms
Excitation Current (maximum)
2 Wire: 0.25 mA
3 Wire: 0.6 mA
Burnout Detection on all leads: Upscale
Isolation: 250 Vrms
Common mode rejection: 100 db at 60 Hz minimum
Normal mode rejection: 40 db at 60 Hz minimum

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Figure 4-8. Typical Connections for a 2009A 2-Wire or 3-Wire RTD Input Module

* NOTE: The lead wire resistance effect is about +0.001 Ω/Ω (ohms per lead).
Assuming 20 ohms per lead, the total error could be calculated as
follows:
Error = ((0.001 Ω/Ω × 20 Ω/lead) ÷ 400Ω Module Span) × 100% =
0.005%

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4.3.7 2020N Remote I/O Interface Module (RIO)

Make remote I/O interface connections as shown in Figure 4-9. One remote I/O interface
module is required for each remote I/O network. The remote I/O interface module is scanned
every 50ms by the controller. Specifications are:

REMOTE I/O INTERFACE RS485 SERIAL NETWORK

Bus Master 2020N Remote I/O Interface Module (end of bus)
Bus Slaves Remote I/O Digital Modules
Maximum Length 500 meters (1600 feet)
Baud rate 187.5K
Max addresses 32 (31 slaves + 1 RIO master at address 0)
Termination 120 ohm resister is required across the two conductors
at the end of the cable (2 shipped with RIO module)
Shield Required over 50 meters (160 feet)
REMOTE I/O INTERFACE CABLE
Indoor use Belden #9182
Indoor plenum use Belden #89182
Underground use Belden #9815 twisted twinax
Outdoors above ground use NOT recommended
Wiring Use same cable type throughout network. Avoid
interruptions (wire to same terminals if necessary).
Do not wire through terminal blocks.

Table 4-3. Supported Remote I/O Modules

Module Description
Digital Input Modules ..................... ICSI 08 D1 8 non-isolated 24VDC input channels
ICSI 08 E1 8 isolated 24VDC input channels
ICSI 08 E3 8 isolated 120VAC input channels
ICSI 16 D1 16 non-isolated 24VDC input channels
ICSI 16 E1 16 isolated 24VDC input channels

Digital Output Modules .................. ICSO 08 R1 8 relay output channels 2A

ICSO 08 Y1 8 transistor output channels 24VDC 2A

Digital Input/Output Modules ........ ICSK 20 F1 12 non-isolated 24VDC input channels and 8 isolated
relay output channels
ICSC 08 L1 8 user-configurable channels for 24VDC input or
24VDC 500mA transistor output

* NOTE: Modules are available in three forms: -120 for 110/120Vac external
power, -230 for 220/230Vac external power and -24 for 24Vdc external
power. All modules mount on a ECZ remote I/O module carrier. See
IB-23C601 for details on Remote I/O module installation and connection.

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Figure 4-9. Typical Interface Circuit for 2020N Remote I/O Interface Module (RIO)

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4.4 MODULAR OUTPUT CONNECTIONS

This section describes the process input connections for the following input module types:

• 2003A Current Output Module - Section 4.4.1

• 2005A Solid-State Relay Output Module - Section 4.4.2
• 2007A Nonisolated Digital Output Module - Section 4.4.3
• 2011A Dual Mechanical Relay Output Module - Section 4.4.4
• 2011A Form C Mechanical Relay Output Module - Section 4.4.5

4.4.1 2003A Current Output (AOM)

Make current output connections as shown in Figure 4-10. Due to heat generated, this
module must be installed in a location with no adjacent module on either side.

When the instrument is installed in the European Union, an interface filter must be connected
in the signal wires to the module to comply with European Union (EU) Electromagnetic (EMC)
requirements. Use a Phoenix Contact FILTRAB NEF1-1 or equivalent. Reference Phoenix
Contact Ltd., P.O. Box 131, D32819, Blomberg, Lippe, Germany, Phone 52-35-320510.

Output specifications are:

ANALOG OUTPUT
Range: (0-100%) 4 to 20 mA
Low limit: 0 mA
Upper limit: 25 mA
Open circuit voltage: 26 Volts maximum
load limit: 800 Ohms
Isolation : 250 Vrms
Resolution: 12 bits
Sensitivity: 5 uA
Accuracy: ±0.2% of span

Figure 4-10. Typical Connections for a 2003A Current Output Module

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4.4.2 2005A SSR Output (DOM)

Recommended connections to a customer relay are shown in Figure 4-11. Make SSR output
connections as shown in Figure 4-12.

DC output modules are used for controlling or switching DC loads. Each module provides
optical isolation between the field devices and the control logic. This isolation is limited to 250
Vrms at the terminal block. Typical uses and applications for DC output modules include
switching the following loads: DC relays, DC Solenoids, DC motor starters, or DC lamps or
indicators. Wire rating: 600 V, -20°C +105°C UL, CSA approved.
Module Fuse rating: 4 Amps, 250V.
DC DIGITAL OUTPUTS (ISOLATED) _10_ _11_
Output voltage ranges 5-60 V 5-200 V
Max Output current 1A 0.55A
Turn-off time 0.75 msec 0.75 msec
Max Output voltage drop 1.6 V 1.6 V
Off-state leakage at max V 1 mA 2 mA

AC output modules are used for controlling or switching AC loads. Each module provides
optical isolation between the field devices and the control logic. This isolation is limited to 250
Vrms at the terminal block. Typical uses and applications for AC output modules include
switching the following loads: relays, solenoids and contactors, motor starters, heaters,
lamps, or indicators. Wire rating: 600 V, -20°C +105°C UL, CSA approved. Module Fuse
rating: 4 Amps, 250V.
AC DIGITAL OUTPUTS (ISOLATED) _12_ _13_ _14_
Output voltage range 12-140 V 24-280 V 24-280 V
Max Output current 1A 1A 1A
Off-state leakage 5 mA 5 mA 5 mA
(2.5 at 120V)
Minimum load current 20 mA 20 mA 20 mA
Response time 1/2 cycle 1/2 cycle 1/2 cycle
Max Output voltage drop 1.6 V 1.6 V 1.6V
Form A (Make) A (Make) B (Break)
Type SPST-NO SPST-NO SPST-NC

Figure 4-11. Recommended Connection to Solid State Relay

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Figure 4-12. Typical Connections for a 2005A Solid State Relay Output Module

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4.4.3 2007A Nonisolated Digital Output (DOM)

Make nonisolated digital output connections as shown in Figure 4-13. Output specifications
are:

DIGITAL OUTPUTS (NONISOLATED)

Output voltage range +5 to +24 Vdc
Max Output current 100 mAdc
Response time 100 usec
Mmaximum leakage current 100 uAdc

Figure 4-13. Typical Connections for a 2007A Nonisolated Digital Output Module

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MODULAR I/O CONNECTIONS

4.4.4 2011A Dual Mechanical Relay Outputs (DDOM)

Make mechanical relay output connections as shown in Figure 4-14. Output specifications
are:

DUAL MECHANICAL RELAY OUTPUTS

Configuration Dual relays (NO/NO, NC/NC, NO/NC)
Power supply range + 5 VDC ±10%
Max Input Current -10.0 mA DC
Contact load 3A at 60 VAC or 30 VDC
Contact resistance 0.10 ohms maximum
Isolation 250 Vrms (contacts to coil)
Current rating 3A per relay
Response time 10 msec

Figure 4-14. Typical Connections for a 2011A Mechanical Relay Output Module (Dual SPST, NO/NC)

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4.4.5 2011A Form C Mechanical Relay Outputs (WDOM)

Make mechanical relay output connections as shown in Figure 4-15.
Wire rating: 600 V, -20°C +105°C UL, CSA approved. Output specifications are:

FORM C MECHANICAL RELAY OUTPUT

Configuration Form C single relay
Power supply range + 5 VDC ±10%
Max Input Current -10.0 mA DC
Contact load 3A at 60 VAC or 30 VDC
Contact resistance 0.10 ohms maximum
Isolation 250 Vrms (contacts to coil)
Current rating 3A per relay
Response time 10 msec

Figure 4-15. Typical Connections for a 2011AZ10200A Mechanical Relay Output Module (Form C)

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COMMUNICATIONS CONNECTIONS

5
COMMUNICATIONS CONNECTIONS

Figure 5-1. Terminal Identifications for Communications Network Connections

5.1 GENERAL
Read this section thoroughly before making connections. Installation personnel should be
qualified technicians.

The controller provides communications capability for both ICN and Modbus networks. Two
serial communication ports are available permitting the controller to communicate on two
different networks simultaneously. Port 1 can use either built-in or modular communication
drivers. Port 2 requires a modular driver. Communications connections are made to the
terminals shown in Figure 5-1. The communications network diagrams in this section show
connections for both the built-in and modular communications circuits.

In addition to the network communications capability, the controller provides an RS-232

communications port in the bottom of the front panel. This port permits connection of a
portable computer for data base configuration using 2006S Application Builder Software.

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5.2 COMMUNICATION CONNECTION GUIDELINES

The wiring connections described in this section are made with the controller installed in its
operating location and with the power off. All connection terminals are located under a cover
on the back of the instrument housing. Figure 5-1 shows the communication connection
terminals with the cover removed.

The recommended procedure for making communications connections is as follows:

1. Communications port 1 serves either the built-in communications circuits or I/O module
location S10 (S10 and S9 if module is double wide). It is recommended that the built-in
communication circuit be used for port 1. This leaves the module locations available for
other purposes.
2. Communications port 2 serves I/O module location S8 (S8 and S7 if module is double
wide). If required, a second communication network can be supported via this modular
connection.
3. When using communication port 1, a communications jumper on the carrier board, Figure
5-2, must be positioned to select the communication type for the built-in circuits, or to
deselect the built-in circuit if a module is used.
4. The built-in communications circuits are isolated from all other circuits. Terminal 1 (TX &
RX common) is the communications circuit common for these built in circuits. When built-
in communication is used, connect terminal 1 of each instrument on the communication
bus together. This common line must be connected to ground at some point in the
system to prevent the possible build up of a static charge, reduce noise pick up, and
comply with EU EMC requirements.
5. Communications wiring should be shielded twisted pairs. Detailed cable requirements
are provided in Sections 5.4 and 5.5.
6. The cable shields must be connected to a good noise free ground. Normally this should
be one of the terminals identified as chassis in Figure 3-1. Alternatively, it is acceptable
to to use the shield to connect the commons among the instruments. If this arrangement
is used, noise rejection may not be optimal.
7. Route communications wiring from the top left hand side of the housing and distribute to
appropriate terminals.
8. Use a small, flat-head screwdriver to loosen appropriate connection screws and clamps
on terminal blocks.
9. Strip approximately 5/16 inch (8 mm) of insulation from the end of each wire, insert wires
at assigned terminals, and secure terminal screws and clamps.
10. Make wiring connections using the following procedures:
a. Front Panel RS-232 Communications Connections - Section 5.3.
b. Instrument Communications Network (ICN) Connections - Section 5.4.
c. Modbus Network Connections - Section 5.5.
11. After all connections are completed and checked, the ac power wiring can be connected
at the distribution panel (ac source).

* NOTE: Before putting the controller into operation, it must be configured using
either the front panel keys or the 2006S Application Builder Software.
See Section 1.1.2 for related documents.

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Port 1 Communications Jumper

Jumper locations for Communications Port 1

Built-in Circuit Modular Circuit
RS-232 RS-485 ICN Jumper Removed

Figure 5-2. Locations for Port 1 Communications Jumper

5.3 FRONT PANEL RS-232 COMMUNICATIONS CONNECTION

The RS-232 communication port in the instrument front panel, Figure 1-1 (NOT present with
NEMA 4), is used exclusively for data base configuration via connection of a portable
computer. Use of this RS-232 port is subject to the following requirements:

• Connection to the port must be made using a cable which is available as an accessory to
the instrument. The cable is terminated at one end with a plug-in connector for the
instrument port, and at the other end with a connector compatible with a computer serial
communication port.
• The communication jumper, Figure 5-2, must be positioned for RS-232 communication.

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COMMUNICATIONS CONNECTIONS

• If connections are made to the built-in communication terminals, Figure 5-1, the
connections must support RS-232 communication as shown in Figure 5-4, otherwise the
RS-232 port in the front panel is not functional.
• The instrument data base must be configured to provide RS-232 communication on the
built-in circuit; this is the default configuration.

When the built-in RS-232 circuit is being used for network communication, making a
connection to the front panel RS-232 port disables the network receive function so that the
instrument can receive data only from the device connected to the port. The transmit line is
not affected.

5.4 INSTRUMENT COMMUNICATIONS NETWORK (ICN) CONNECTIONS

An example of a typical ICN configuration with both modular and built-in connections is shown
in Figure 5-3.

5.4.1 Cable Requirements

The length of the ICN is the sum of the lengths of the physical two-wire bus between each
node on the ICN. If the network includes MOD 30 instruments, the length of any MOD 30
instrument cables between the nodes and the instruments must be included in the total length.
This length can be up to 2000 ft (609.6 m). Cable requirements for an ICN are dependent
upon the length of the ICN as described below.
• When the total length is 500 ft (150 m) or less, use 18 AWG (1 mm) shielded twisted pair
cable.
• When the total length is between 500 and 1500 ft (150 and 450 m):
- Entire length of the ICN must be at virtually the same potential and voltage drop
between any two points on ICN must not exceed 3V.
- Cable capacitance for an ICN must be between 18 and 25 pf/ft (60-83 pf/m).
• When the total length exceeds 1500 ft (450 m) or if the ICN must be routed through high
noise (EMI/RFI) environments, use 22 AWG (0.64 mm) shielded cable. If an ICN must be
run next to power lines or other unusual noise frequencies, contact your service
representative for assistance.

5.4.2 Addresses
Each device on an ICN must be assigned a unique address. Addresses are in the range of 0
through F hex (0 through 15 decimal). The address for the built-in circuit is configured
through the front face of the instrument in Device Setup (see IB-1800R-OPR Setup Section).
Addresses for modular circuits are set at the module as shown in Figure 5-3.

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COMMUNICATIONS CONNECTIONS

Figure 5-3. ICN Connections for Built-in and Modular Communication Circuits

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COMMUNICATIONS CONNECTIONS

5.4.3 Termination
One set of ICN termination resistors must be installed on each ICN to prevent noise from
being picked up by the ICN circuitry and generating a diagnostic alarm. The ICN termination
scheme requires a nominal 24 volt DC power supply that can supply 15.4 mA. This supply is
provided by both the built-in and modular circuits. The termination resistor network is
provided in a 2030FZ00001A ICN Terminator. The terminator can be conveniently connected
to an ICN at built-in terminals 2 - 5 as shown in Figure 5-3. Note that the terminator is
connected to common via terminal 4 which is internally connected to terminal 1
(communications common) for ICN communication. The terminator can also be connected at
the appropriate four terminals when a communications module is used.

Other factors affecting the termination scheme are as follows.

• The ICN cable shields should be connected directly to chassis ground at one end only.
• Be sure each network has only one terminator. If the controller is connected to an
existing MOD 30 ICN, the network is already terminated and a terminator must not be
connected to any new device.

5.5 MODBUS NETWORK CONNECTIONS

5.5.1 General
Numerous Modbus network connection arrangements are possible. Selection of a specific
arrangement depends on the requirements of the application. The connection diagrams
shown in this section provide typical examples of connection schemes which meet all the
functional requirements of the Modbus protocol and the built-in and modular communication
circuits.

Master and Slave Designations

The controller can function as either a Modbus master or Modbus slave. This functionality is
determined by the configuration of the MSC block.

Communications Parameters
The baud rates available are: 150, 300, 600, 1200, 2400, 4800, 9600, 19200 or 38400. Parity
can be none, even or odd, and there can be either 1 or 2 stop bits. These parameters are
configurable via the MSC block.

The transmission mode of Modbus networks using either the built-in or modular circuits is
RTU (Remote Terminal Unit).

RS-485 Network Considerations

The RS-485 specification allows as many as 32 devices on any given network. The number
of devices can be increased by the use of repeaters. The Modbus network supports as many
as 247 slave devices.

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RS-485 Cable Requirements

For short runs of 10 to 25 ft (3 to 6m), virtually any 2-wire shielded or twisted pair is suitable.
For runs up to 1000 ft (305 m), Belden 9502 Cable or an equivalent cable is recommended.
This cable is a dual 24 AWG (0.5 mm) twisted pair with an overall foil shield. A drain wire is
provided for grounding the shield. For runs up to 4000 ft (1219.2 m), Belden 9729 Cable or
an equivalent cable is recommended. This cable is a dual 24 AWG (0.5 mm) twisted pair with
a foil shield for each pair. The cable insulation is low dissipation (polypropylene). Two
separate drain wires are provided for grounding the shields

* NOTE: Heavy braid shield cable may be required for certain noisy environments.

Addresses
Each slave on a Modbus network must have a unique address. Addresses 1 through 247 (01
through f7 in hexadecimal) are supported by the Modbus protocol. Addresses for the built-in
circuit are assigned by configuration of a data base attribute. Addresses for modular circuits
are set at the module as shown in Figure 5-7.

Communication Defaults
The 2033N and 2034N RS-485 modules have a COMM DEFAULTS switch which provides for
communication with the module when its configuration is unknown. When the switch is set at
YES, a set of default parameters is invoked. The parameters are: 9600 Baud, no parity, one
stop bit, eight data bits, and the port functionality is slave.

5.5.2 RS-232 Modbus Communication

The built-in and modular circuits for RS-232 communication use a driver/receiver which
supports a point-to-point Modbus network. The modular circuit is contained in a 2033N
communications module. These circuits meet all RS-232C and V.28 specifications. They
have a±9V output swing with a+5V supply, and±30V receiver input levels. All field connection
terminals are optically isolated from the instrument circuitry. The maximum network cable
length is 50 feet.

Both the built-in and modular circuits support the Extended Modbus protocol which provides
full communications functionality between controllers, and between the controllers and the
Application Builder software.

! CAUTION: If the modular communication option is used, be sure the module is wired
properly before applying power. Although this module is isolated, it can
be damaged if excessive voltage is applied across the input pins. This
module is not a drop-in replacement for the ICN module (2030N), and will
be damaged if ICN level voltages are applied to the input pins.

Connections for a typical RS-232 Modbus network using the built-in circuit is shown in Figure
5-4, and connections using the modular circuit are shown in Figure 5-5. Either a computer or
the controller can act as the Modbus master.

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COMMUNICATIONS CONNECTIONS

Figure 5-4. Typical Network Connections for Built-In Modbus RS-232 Communication

Figure 5-5. Typical Network Connections for Modular Modbus RS-232 Communication

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5.5.3 RS-485 2-Wire Modbus Communication

The built-in and modular circuits for RS-485 2-wire communication use a transceiver which
supports a 2-wire point-to-point or point-to-multipoint Modbus network. The modular circuit is
contained in a 2032N communications module. All field connection terminals are isolated
from the instrument circuitry.

! CAUTION: If the modular communication option is used, be sure the module is wired
properly before applying power. Although this module is isolated, it can
be damaged if excessive voltage is applied across the input pins. This
module is not a drop-in replacement for the ICN module (2030N), and will
be damaged if ICN level voltages are applied to the input pins.

Connections for a typical RS-485 2-wire Modbus network are shown in Figure 5-6. In this
network, the personal computer acts as the Modbus master and the controller is the slave.
The master is responsible for providing the bus stabilizing pull-up and pull-down resistors
which keep the bus in a MARK/IDLE state when all the transmitters are tri-stated. Connect
120 ohm termination resistors across the transmission line at both ends as shown. The
termination resistors may not be required if the line length is very short.

The built-in communications circuit provides a communications common connection at

terminal 1 to provide improved noise resistance. The modular circuit does not use a
communications common. When using the built-in circuit, connect the communications
common as follows:

• Connect to terminal 1 of all instruments communicating on the network via the built-in
circuit.
• Connect to the RS-485 interface board in the personal computer if a communications
common terminal is available.
• Connect to ground at some point in the system.

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Figure 5-6. Typical Modbus Connections for an RS-485, 2-Wire Network

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COMMUNICATIONS CONNECTIONS

5.5.4 RS-485 4-Wire Modbus Communication

The built-in and modular circuits for RS-485 4-wire communication use a pair of transceivers
which support a 4-wire point-to-point or point-to-multipoint Modbus network. The modular
circuit is contained in a 2034N communications module. All field connection terminals are
isolated from the instrument circuitry.

Both the built-in and modular circuits support the Extended Modbus protocol which provides
full communications functionality between controllers, and between a controller and the
Application Builder software.

! CAUTION: If the modular communication option is used, be sure the module is wired
properly before applying power. Although this module is isolated, it can
be damaged if excessive voltage is applied across the input pins. This
module is not a drop-in replacement for the ICN module (2030N), and will
be damaged if ICN level voltages are applied to the input pins.

P C Master
The diagram in Figure 5-8 shows connections for a typical RS-485 4-wire Modbus network in
which a personal computer acts as the Modbus master and the controller is the slave. The
master is responsible for providing the bus stabilizing resistors. When using the modular
communications circuit, the module provides the slave function, and the TERM switch on the
module must be set at NO to disconnect the resistors inside the module. Connect 120 ohm
termination resistors across the transmission line at both ends as shown. The termination
resistors may not be required if the line length is very short.

Controller Master
The diagram in Figure 5-9 shows connections for a typical RS-485 4-wire Modbus network in
which one controller acts as the master, and the other controllers on the network are slaves.
In this network, it is recommended that the modular communications circuit be used in the
master because the 2034N module provides the required bus stabilizing resistors. The TERM
switch on the master module must be set at YES to connect the resistors to the network. The
TERM switch on each slave module must be set at NO to disconnect the resistors inside the
module. Connect 120 ohm termination resistors across the transmission line at both ends as
shown. These resistors may not be required if the line length is very short.

Communications Common
The built-in communications circuit has a communications common connection at terminal 1
to provide improved noise resistance. The modular circuits do not use a communications
common. When using the built-in circuit, connect a communications common line as follows:

• Connect to terminal 1 of all instruments communicating on the network via the built-in
circuit.
• When a personal computer or other host device is on the network, connect to the RS-485
interface board if a communications common terminal is available.
• Connect to ground at some point in the system.

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4-Wire/2-Wire Network
When several slaves on a network require only read and write capability, a mixture of 2-wire
and 4-wire communication can be used to save slot space and transmission cable as shown
in Figure 5-10. This arrangement allows a series of 2-wire slave controllers to be connected
to a 4-wire master controller. The master provides the required bus stabilizing resistors via a
2034N module. The slaves are adequate for the read/write function using either the built-in
circuit or a 2-wire 2032N single wide module.

Figure 5-7. Simplified Diagram, 2034N RS-485, 4-Wire Module

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COMMUNICATIONS CONNECTIONS

Figure 5-8. Typical Modbus Connections for an RS-485, 4-Wire Network (Slave Controller)

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COMMUNICATIONS CONNECTIONS

Figure 5-9. Typical Modbus Connections for an RS-485, 4-Wire Network (Master Controller)

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COMMUNICATIONS CONNECTIONS

Figure 5-10. Typical Modbus Connections for a 4-Wire Master with 2-Wire Slaves

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 MOD 30ML Multiloop Controller

APPENDIX A

APPENDIX A

A.1 MAINTENANCE

CAUTION. Disconnect power before servicing.

Use lens cleaning tissue or a soft cloth for cleaning the display overlay. Do not use paper
towels or industrial wipes. Remove dust from the rear of the instrument by removing it from
the instrument housing and spraying exposed surfaces with non-corrosive, non-toxic, non-
flammable inert dusting gas.

A.2 PLANNING FORMS

The forms included in this appendix may be copied as necessary to record controller current
consumption, the I/O plan, and wiring connection data.

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MOD 30ML Multiloop Controller

APPENDIX A

CURRENT CONSUMPTION PLANNING FORM

CONTROLLER NUMBER ____

BUILT-IN I/O CURRENT CONSUMPTION

Description Max. Supply No. Used Current
Current (mA) (1 or 2) Subtotals
Transmitter Power Supply 150
20 mA Output 140
50 mA Output 410
ICN Terminator 100
Built-in I/O Current Subtotal /////////// ///////////

MODULAR I/O CURRENT CONSUMPTION

Catalog No. Description Max. Supply No. of Current
Current (mA) Modules Subtotals
2001A Model B Voltage Input 80
2002A Model B Current Input 80
2003A Model A Current Output 350
2004A Model A Solid State Relay Input 12
2005A Model A Solid State Relay Output 12
2006A Model A Nonisolated Digital Input 10
2007A Model A Nonisolated Digital Output 20
2009A Model B RTD Input 80
2011A Model A Mechanical Relay Output 140
2012A Model B Current Input with 2-Wire Transmitter 350
2013A Model B Thermocouple Input 80
2020N Model B Remote I/O Interface 400
2030N Model B ICN Communication With terminator 500
ICN Communication Without terminator 300
2032N Model C RS-485 2-Wire Communication 180
2033N Model A RS-232 Communication 180
2034N Model A RS-485 4-Wire Communication 180
Modular I/O Current Subtotal ////////// //////////

TOTAL CURRENT CONSUMPTION (must not exceed 5000 mA)

Base Instrument Load 1220 mA
Built-in I/O Current Subtotal mA
Modular I/O Current Subtotal mA
Total Current Consumption mA

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APPENDIX A

MOD 30ML I/O PLANNING FORM

Controller No.

Built-in I/O
Input 1:
Output 1:
Input 2:
Output 2:
Communications:

Modular I/O
I/O Module Locations

No. Module No. Module No. Module No. Module No. Module No. Module
S1 S2 S3 S4 S5 S6
S7 S8 S9 S10 S11 //////////

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MOD 30ML Multiloop Controller

APPENDIX A

Wiring Connections for MOD 30ML Controller __________

78
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©1998 ABB Instrumentation

IB-1800R-INS, Issue 4.1 1/98

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