Chip Scale PKGs For Lighting

CSP Application Note

Ver. 1.0 Release Date : 09-Oct-15
Ver. 2.1 Release Date : 17-Mar-16
Ver. 2.2 Release Date : 28-Mar-16
Ver. 2.3 Release Date : 21-Apr-16
Ver. 2.4 Release Date : 23-Sep-16
Ver. 2.5 Release Date : 23-Dec-16
Ver. 2.6 Release Date : 28-Jun-17
Ver. 2.7 Release Date : 21-Sep-17
Index Page
0. Introduction 3
1. Component
1.1 Package Dimension ---------------------------------------------------------------------- 4
1.2 Handling Guide --------------------------------------------------------------------------- 10

2. SMT Guide
2.1 Soldering Condition --------------------------------------------------------------------- 15
2.2 Pick & Place ------------------------------------------------------------------------------- 21
2.3 Pick & Place Test ------------------------------------------------------------------------- 31
2.4 Rework Process -------------------------------------------------------------------------- 33
2.5 PCB Material Selection ----------------------------------------------------------------- 34
2.6 PCB Design Guide ------------------------------------------------------------------------ 36

3. Module Design Guide

3.1 High Density Mounting (LM101A) ---------------------------------------------------- 39
3.2 High Density Mounting (LH181A) ----------------------------------------------------- 41
3.3 High Density Mounting (LH181B/LH231B) ----------------------------------------------------- 43

4. Thermal Measurement Guide

4.1 Ts Point Define ----------------------------------------------------------------------------- 45
4.2 Thermal Measurement Method ------------------------------------------------------ 46
4.3 Thermal Measurement Method in Module --------------------------------------- 48
■ General
Model LM101A LM102A LM101B LH181A LH181B LH231B

Shape

1chip 3V 1chip 6V 1chip 3V 1chip 3V 1chip 3V 1chip 3V

Typ 150mA Typ 150mA Typ 150mA Typ 350mA Typ 350mA Typ 700mA
Remark
Max 450mA Max 250mA Max 350mA Max 1.5A Max 1.4A Max 2.0A
Size 1.18mm Size 1.34mm Size 1.70mm Size 1.91mm Size 2.36mm Size 2.80mm

■ Application

LM101A LM102A LM101B LH181A LH181B LH231B

Ambient ○ ○ ○

Ceiling ○ ○ ○

Bulbs ○ ○ ○

Down light ○ ○ ○ ○ ○

Spot light ○ ○ ○ ○ ○

MR/PAR ○ ○ ○

High bay ○ ○ ○

Low bay ○ ○ ○

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■ LM101A Chip Scale Package

■ Dimension

<Top View> <Side View> <Bottom View>

1.18
1.18 0.25 (Top phosphor)
Anode
Anode Mark
0.82
1.18

0.82

1.18
Cathode
0.17

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■ LM102A Chip Scale Package

■ Dimension

<Top View> <Side View> <Bottom View>

1.34
1.34 0.25 (Top phosphor)
Anode
Anode Mark
0.98
1.34

0.98

1.34
Cathode
0.17

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■ LM101B Chip Scale Package

■ Dimension

<Top View> <Side View> <Bottom View>

1.70 0.35
0.59 Anode
0.03 Anode Mark

0.215 0.215
1.70

0.20
Cathode

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■ LH181A Chip Scale Package

■ Dimension

<Top View> <Side View> <Bottom View>

1.91
1.91 0.39 Anode
Anode Mark
1.55
1.91

1.55

1.91
Cathode

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■ LH181B Chip Scale Package

■ Dimension

<Top View> <Side View> <Bottom View>

2.36 0.35
Anode Mark
1.3 Anode
0.03

0.53 0.53
0.27
2.36

Cathode

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■ LH231B Chip Scale Package

■ Dimension

<Top View> <Side View> <Bottom View>

2.80 0.35
Anode Mark 1.50 Anode
0.03

0.56
2.80

0.40

0.56
Cathode

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■ Handling Guide
- At LES for Phosphor side is restricted to unusual direct-touch or strong external force

▶ Tools

Vacuum tweezer White Ceramic tweezer Normal tweezer

▶ Pick-up

Use vacuum tweezer case Softly handling when use DO NOT allow @ LES side
(have to keep clean vacuum pad side) white Ceramic tweezer

▶ Handling

Keep PCB distance for DO NOT allow finger touch

DO NOT allow stacking
prevent Phosphor crack or Sharpen/Hard Object

※ Horizontally and Vertically direct force might cause fatal damage during manufacturing process of luminaire.
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 ■ Handling Guide (Document)
 Environment of Working place
The working area for assembly luminaire is recommended to be maintained clean for preventing any contamination and
keeping workers’ safety. If all working area cannot be maintained clean, at least the space for assembly have to be kept clean
and lower humidity in air.

 Handling PKGs
① Users have not to touch the lighting emitting surface(LES) in any cases.
At LES (Lighting Emitting Surface), for CSP phosphor film is restricted to unusual direct-
touch or strong external force. This may lead to the deformation or film damage.

② When handling with tweezers user have to grip the thermo plastic(white mold).
③ Users have to wear the anti-static gloves or anti-static wrist band.
④ When handling CSP, user have to use the anti-static tweezers. Especially, CSP is strongly recommended to use a vacuum
pick-up & place utensils. (Especially, a sharpened-tip of the tweezers would have high possibility of giving a physical defect to
CSP)
The sharp tip may physically damage the resin of Phosphor Resin or wall.

⑤ When switching on CSP with an electrical power supplier, an unexpected or abrupt current should bring about EOS failure in
CSP. This may also bring about the failure in use or the decrease of life time of products. Please discharge the stored voltage
of the power supplier.

 Prevent ESD
It might be required to use MLCCs, TVS or Zener diodes in order to prevent ESD failures in LED module or luminaire.
Those protection components should be considered and selected depending on the forward voltage of LED module, environment or
additional requirements. (ex. Able to use 10uF 50V MLCC for 24V LED module. Regarding PWM dimming, recommend TVS or other
diodes rather than MLCC due to acoustic noise.)
11 / 49
 ■ Handling Guide (Document)
 Chemical compatibility
During manufacturing luminaire, the many chemicals could attack and contaminate PKGs. It is necessary to avoid the
contaminants and chemicals in manufacturing process and operation. And we are providing the guideline for chemicals and
relevant failure mode. (Refer to chemical guideline).

 Contamination and cleaning

In the production process of luminaire, pkgs can be contaminated by an unexpected contaminant. The organic material like
as solder flux have to be cleaned out by using the tip of cotton swap soaked isopropyl alcohol(IPA).
When a product are stored in any space the product needs not to be directly contact with ambient air or any packing paper
boxes. Some packing materials could lead to give in harmful gases to normal operation of pkgs.
 Storage
If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a
sealed container with nitrogen gas. (Shelf life of sealed bags: 12 months, temp. ~40 ℃, ~90 %RH)
CSP have a JEDEC level of 2a. User have to handle CSP by below following guide line, which is based on the JEDEC Moisture
Sensitivity Level.
- After sealed bag is to be opened and , CSP, will be surface-mounted on the board, have to be followed the below guide.
a. CSP should be mounted within 672 hours(28 days) at an assembly line with a condition of no more than 30℃/60%RH
b. CSP should be stored at <10 %RH
- After mounting, the residual or extra CSP is recommended to be repack in a gas sealed bag.
- If moisture sensitivity indicator is >60 % at 23±5℃ the recovery work should be carried out at the proper condition. In that
case, CSP should be baked at 60±5 ℃

12 / 49
 ■ Sulfurization of CSP (vs L/F type PKG)
CSP is free from sulfurization. CSP has no root causes(Ag) of discoloration by sulfur

■ L/F PKG ■ CSP

H2S

H2S
H2O
1/2O2

Ag
Reflector
Ag2S

2Ag + H2S + 1/2O2 → Ag2S + H2O NO Ag → NO Sulfurization

※ Ag2S : Dark color → Root of discoloration

L/F type PKGs are coated by silver as a reflector.
However, if sulfur gas comes from outside, it will be
turned by reaction with silver and sulfur combination.

13 / 49
 ■ Sulfurization Test Result & Recommendation

■ Sulfurization Test ■ Recommendation

• Test Condition - Do not use larger PCB land pattern than CSP pad.

- H2S 15ppm, 25℃/75%, 504h - It is need to minimize the material which is easy to react

(IEC Pub. 68-2-43 : Hydrogen Sulfied Test of Electric Part) with sulfur such as solder, Cu, Ag and etc.
Unexpected surfurized material could be occurred during
• Test Result
reaction with above material.
120
In that case, even luminance flux level of CSP is not
100 changed, but flux of module level could be drop down just
like below example.
Rate of Decrease (%)

80

60 Silk Silk
Sulfide Solder
40

Conventional L/F Phosphor

20
LM101A Chip
0
0 72 144 216 288 360 432 504
Test Time (hr) [Before detach phosphor layer] [After detach phosphor layer]

※ This test exceeds far worse than the actual use conditions. Please treat this data as the reference.
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 ■ Recommended Land Pattern
LM101A LM102A LM101B
PKG PAD PKG PAD PKG PAD
0.82 0.98

Anode Mark Anode Mark 0.67

0.63 0.59
Anode Mark

0.25
0.21

0.215 0.215
0.98
0.82

0.24

0.20
0.20

0.25
0.21

Phosphor Wall Phosphor Wall

PCB Land PCB Land PCB Land

0.63 0.67 0.75

0.25
0.21

0.24
0.20
0.20

0.24
0.21

0.24
0.25

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 ■ Recommended Land Pattern
LH181A LH181B LH231B
PKG PAD PKG PAD PKG PAD
1.55
Anode Mark
1.3 1.3 Anode Mark 1.50
Anode Mark
0.53

0.56
0.53 0.53
1.55
0.27

0.40
0.27

0.56
0.53

Phosphor Wall

PCB Land PCB Land PCB Land

1.3 1.3 1.50

0.56
0.53

0.53
0.27

0.27

0.40
0.53

0.53

0.56
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■ Screen Printing
- Solder Printing : check accurate position, shape, amount of solder paste.
- Solder Paste Storage: Should be stored in refrigerator. We can re-use if solder paste store
within 24 hour after using at room temperature. In accordance with the relevant
regulations it should be used as the correct process.
- Squeegees : Should be keep clean after using the squeegee for maintain flatness of squeegee.
After usage of over 20,000 times, it should be replaced by new one.
Process control item Spec. range
Unit Specification
(Process setting condition) LSL Target USL
Hours sec 60 - 60 -
Solder stir
Speed rpm 1000 - 1000 -
Solder standing time @ room
Hr 2 2 - 12
temperature
Solder
After opening Hr within 24 hours Use within 24 hours
Lifetime
Volume
Printer status - SPI spec.
70 - 150
Presure ㎏f/㎠ 3 3 4 5
Squeegee
Speed mm/sec 40 30 60 90
Distance Mm 3 - 3 -
Snap-Off
Speed mm/sec 1 0.8 1 1.5
Print temperature ℃ 24 20 24 28
Mask Auto-cleaning time/Board 3 - 3 -
Mask Manual cleaning time/Board 15 - 15 -
MASK # of time # time 30,000 - 30,000
Lifetime tension mm 0.5 0.4 - 0.7
※ Reference Equipment : ESE US-8500X ※ Please refer just as a reference

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■ Solder Paste Recommendation
- Solder : M705-GRN360-K2 (IV-Type)
- Low voiding paste
- Paste type recommendations : Pb free, No clean, No water soluble

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■ Reflow Profile Setting for LM101A/LM102A/LH181A
Recommends X-ray monitoring to ensure good solderability and less void
250℃ Peak temp. : 260±5℃, Max. 10sec
Time above 220℃ : Max. 60sec

200℃
Temperature(℃)

Max. 60sec
Preheat Zone : 150~180℃
150℃

100℃ Max. Temp. gradient in Cooling : -5℃/sec

50℃ 60 ~ 120 sec ※ Reflow facility : Heller (1913MKⅢ)

※ Solder paste : M705-GRN360-K2

0 50 100 150 200 250 300

Time (sec)
Zone Temperature (℃) Time(sec)
Preheat 150~180 60 ~ 120
Reflow 220 ↑ 40 ~ 60
Peak 260±5

※ Useful SMT recommendation

After sealed bag is to be opened, CSP Strongly be recommended for Proper Treatment.
(Treatment condition : room temperature(25℃), 45%RH~, 24h~)

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■ Reflow Profile Setting for LM101B/LH181B/LH231B
Recommends X-ray monitoring to ensure good solderability and less void
Peak temp. : 250~255℃, Max.20sec
250℃
Melting : 220℃~
(60~70sec)
200℃
Temperature(℃)

150℃

Max. Temp. gradient in Cooling : -5℃/sec

100℃
Conveyor Belt Speed : 0.75 m/min
Preheat Zone : 150~190℃
50℃ (100 ~ 120 sec)
※ Reflow facility : Heller (1913MKⅢ)
※ Solder paste : M705-GRN360-K2
0 50 100 150 200 250 300
Time (sec)
Zone Temperature (℃) Time(sec)
Preheat 150~190 100 ~ 120
Reflow 220 ↑ 60 ~ 70
Peak 250~255

※ Useful SMT recommendation

After sealed bag is to be opened, CSP Strongly be recommended for Proper Treatment.
(Treatment condition : room temperature(25℃), 45%RH~, 24h~)

20 / 49
■ Pick up method
- When pick-up & place the package, recommended that use the Insertion type pick-up
nozzle. Because CSP Package is very small and light weight, hovering type nozzle is
inappropriate.
- Insertion Type : Touch the package surface and the pressure is applied to the surface
accordingly.
- Hovering Type : Apply vacuuming stress to the package surface.

[ Insertion Type ] [ Hovering Type ]

■ Vacuuming power
- Depending on machine, package shape and condition. In general case, -450 ~ -650 mmhg
vacuuming power is recommended.

21 / 49
■ SMT Process – Metal Mask Design
 Metal Mask Design Recommendation LM101A
Metal Mask opening
Recommended thickness / opening
- Metal Mask Thickness : 0.08 ~ 0.1mm 60~70%
- Metal Mask Opening : Around 60~70% opening area Chip pad

0.2
of electrode area 0.63

0.21
60~70%
(unit : mm)

 Nozzle Design
- Recommends nozzles those are constructed of non-metallic materials to prevent damage on LED components.
- Nozzle pressure : 1N
- The below nozzle is fabricated from Hanhwa Techwin
(Contact point : tonypark@hanhwa.com)

1.1

1.1

1.1 Align to center of flip chip package

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■ SMT Process – Metal Mask Design
 Metal Mask Design Recommendation LM102A
Metal Mask opening
Recommended thickness / opening
- Metal Mask Thickness : 0.08 ~ 0.1mm 60~70%
- Metal Mask Opening : Around 60~70% opening area Chip pad

0.24
of electrode area 0.67

0.25
60~70%
(unit : mm)

 Nozzle Design
- Recommends nozzles those are constructed of non-metallic materials to prevent damage on LED components.
- Nozzle pressure : 1N
- The below nozzle is fabricated from Hanhwa Techwin
(Contact point : tonypark@hanhwa.com)

Align to center of flip chip package

23 / 49
■ SMT Process – Metal Mask Design
 Metal Mask Design Recommendation LM101B
Metal Mask opening
Recommended thickness / opening
- Metal Mask Thickness : 0.08mm 30%
- Metal Mask Opening : Around 30% opening area Chip pad

0.20
of electrode area 0.75

0.24
30%
(unit : mm)

 Nozzle Design
- Recommends nozzles those are constructed of non-metallic materials to prevent damage on LED components.
- Nozzle pressure : 1N
- The below nozzle is fabricated from Hanhwa Techwin
(Contact point : tonypark@hanhwa.com)

Align to center of flip chip package

24 / 49
■ SMT Process – Metal Mask Design
 Metal Mask Design Recommendation LH181A
Metal Mask opening
Recommended thickness / opening
- Metal Mask Thickness : 0.08 ~ 0.1mm 60~70%
- Metal Mask Opening : Around 60~70% opening area Chip pad

0.27
of electrode area 1.3

0.53
60~70%
(unit : mm)

※ Please refer just as a reference

 Nozzle Design
- Recommends nozzles those are constructed of non-metallic materials to prevent damage on LED components.
- Nozzle pressure : 1N
- The below nozzle is fabricated from Hanhwa Techwin
(Contact point : tonypark@hanhwa.com)

1.8

1.8

1.8
Align to center of flip chip package

25 / 49
■ SMT Process – Metal Mask Design
 Metal Mask Design Recommendation LH181B
Metal Mask opening
Recommended thickness / opening
- Metal Mask Thickness : 0.08mm 30%
- Metal Mask Opening : Around 30% opening area Chip pad

0.27
of electrode area 1.3

0.53
30%
(unit : mm)

※ Please refer just as a reference

 Nozzle Design
- Recommends nozzles those are constructed of non-metallic materials to prevent damage on LED components.
- Nozzle pressure : 1N
- The below nozzle is fabricated from Hanhwa Techwin
(Contact point : tonypark@hanhwa.com)

1.8

1.8

1.8
Align to center of flip chip package

26 / 49
■ SMT Process – Metal Mask Design
 Metal Mask Design Recommendation LH231B
Metal Mask opening
Recommended thickness / opening
- Metal Mask Thickness : 0.08mm 30%
- Metal Mask Opening : Around 30% opening area Chip pad

0.40
of electrode area 1.5

0.56
30%
(unit : mm)

※ Please refer just as a reference

 Nozzle Design
- Recommends nozzles those are constructed of non-metallic materials to prevent damage on LED components.
- Nozzle pressure : 1N
- The below nozzle is fabricated from Hanhwa Techwin
(Contact point : tonypark@hanhwa.com)

1.8

1.8

1.8
Align to center of flip chip package

27 / 49
■ Selection of Feeder
Samsung recommends Electrical Feeder for small LED such as CSP.
Abnormal placement such as tilt could be occurred in reel pocket when mechanical feeder
is used. Generally control of feeding speed is not available for mechanical feeder, but
electrical feeder might be able to control speed of feeder.
Normal speed mode is recommended for Samsung CSP.

28 / 49
■ Peeling Point of Cover Tape

Samsung recommends Peeling off at ahead of pick-up place.

Peeling off at far from pick-up place may occur out of CSP center position in real pocket.

Ahead of pick-up place

Far from pick-up place

29 / 49
■ Checking Item for LED Mounting Performance

Check item Suspected Cause of Failure

1 Crack or Damage Check mounting height and pressure whether it is too much high value or not.

Insufficient amount of solder may occur open failure.

2 Emission failure
Otherwise excessive amount of solder may occur short failure.

3 Solder balls Solder balls can be generated by excessive amount of solder.

4 Solder fillet Check solder pattern of screen printing is same with mask pattern.

5 Solder bridges Excessive amount of solder may generate Solder bridges.

6 Solder void Check wettability of solder paste and condition of screen printing.

Check mounting height and pressure whether it is too much high value or not.
7 LED positioning, rotation
Check inspection feature between LED lead and vision feature.

8 Shearforce Check wetting level, insufficient amount of solder.

9 Tilt with slope Check wetting level, insufficient amount of solder.

Check inspection of vision and center coordinate both of Pad and LED.
10 Pad-LED alignment
Check center position of picking is same with LED’s one.

30 / 49
■ Pick & Place Test by SMT Makers

SAMSUNG
Maker SIEMENS YAMAHA
TECHWIN

P/N X2 SM410 YV100XG

Machine
appearance

Outer 1.3Φ Outer 1.2Φ Outer 1.2Φ

Tested nozzle
Inner 0.8Φ Inner 0.65Φ Inner 0.8Φ

Mounting
- - 2N (max)
load

Machine
- - ±0.05mm
accuracy

OK OK OK
Test Result
(1008/1008pcs) (1512/1512pcs) (1512/1512pcs)

31 / 49
■ PKG Rework Process
Removing the rest
Hot Plate “ON” Heating a PCB &
Rework Process IN of solder on the Solder Printing
& Temp. Setting Removing a CSP
PCB

Fixing the CSP on

Rework Process
ON/OFF Test the PCB for heating Mounting a CSP
OUT
by Hot plate

■ PKG Rework Process Detail

1. Temp. 2. Heating a PCB/
STEP 3. Remove the solder residue
Setting Removing a CSP

process

- Remove the solder with the cotton swab

- Hot plate “On” - Heating a PCB
Method after removing CSP
- Temp. setting - Removing a CSP by tweezers
- PCB cooling after the removal

- Time : 10sec (Max.)

Condition - Be careful so that PSR doesn`t may be
- Temp : 255℃ (PCB should be no deformations
/Spec. removed
such as bend, burn out, etc.)

32 / 49
■ PKG Rework Process Detail (Cont’d)

4. Solder printing
STEP 5. Attaching a CSP 6. Solder cure 7. on/off test
individually

process

- Printing the solder

- Attach a CSP By using - Input DC currents in each
Method individually by single
vacuum tweezers TP
metal mask

- Replace it with the same

rank PKG
- Temp. setting :
- Be careful so that CSP
Condition 255℃
should not be rotated
/Spec. - Heating time :
or tilted on the PCB
10~15sec
- Check the direction of
electrode (+,-)

33 / 49
■ PSR effect on performance
CSP products emit light toward top, side, and bottom from all the surfaces. More than 25%
of total photons emit downward and laterally. Therefore the quality of substrate PCB may
affect on the beam performances.

Phosphor
Optical Interaction
@Surface of PCB LED Chip

Cu circuit
PCB

• Multi-Facet Phosphor coating structure → Light emits omni-directionally.

• Optical interaction @surface of PCB (PSR coated)
• Key factors on performance :
① PSR Coating material (or PCB material)
② Reflectivity
③ Color (White, Black, Green)
④ Discoloration of PCB

34 / 49
 ※ PSR information on URL
■ PSR Reflectivity Test http://www.sekisui.co.jp/minase/eng/led/white/index.html

In order to maximize the optical performances, luminous flux specifically, it is recommended to

adopt a highly reflective PSR material around CSP products.

Reflectivity is measured with respect to 4 kinds of PSR materials which are used commonly in LED
industry. It is found that real values can be different from the ones on their datasheets.

35 / 49
■ Recommend design for preventing soldering bridge
If PSR material doesn’t coating on PCB between anode and cathode, short circuit failure
could be happened. PSR material coated between both pads usually help to prevent the possibility of solder
adhesion (soldering bridge) during reflow.

PSR Empty
coating PSR
Pad
material
PSR
Insulator PCB substrate
coating
material
[Risk-PCB Design]
Soldering Soldering • Empty PSR
& Reflow & Reflow between pads

phosphor
chip
Solder Solder

Correct - Due to PSR between both pads, Failure Mechanism - Due to empty PSR,
the risk of soldering bridge could be soldering bridge which is one of reason
prevented for short circuit could be occurred

Cross Section View Cross Section View

36 / 49
■ Recommend design for preventing location shift and tilt
Opening PSR material of flexible PCB usually becomes the reason for short circuit which comes from soldering
bridge and for mounting shift (Irregular-alignment, tilt, etc,.)

PSR on PCB Thin Film Raw Material

[Risk-PCB Design] [Risk-PCB Design]

Pad • Wide PSR Open • Wide PSR Open
• Wide Pad Open • Wide Pad Open
with asymmetric pad

Soldering Soldering Soldering

& Reflow & Reflow & Reflow

CSP
(Phosphor) [Risk-After Reflow] [Risk-After Reflow]
CSP
(Phosphor) • Short Circuit • Short Circuit
• Down Shift • Tilt due to
asymmetric
tension

Top View Top View Top View

37 / 49
■ Recommend design for preventing electrical damage from outside
Normally to reduce thermal resistance against insulator within PCB, copper pad were designed to have more
wide size for fast spreading heat dissipation. But without PSR coating material, solder could effect electrical
damage to LED through the edge side of chip. This could cause result to short circuit failure especially when
ceramic PCB design.
PSR
coating
Pad Wide Pad
material

PCB substrate [Risk-PCB Design]

Insulator
• Wide PCB Pad
Pad with guided size Pad with wider size than recommendation

Soldering Soldering
& Reflow & Reflow

phosphor
chip Electrical
Well
Leakage
Solder isolated
path

Correct - Due to well matched pad size Failure Mechanism - Due to wide pad size of
between CSP and PCB, there’s no any PCB, wide spreading solder could effect
leakage path electrical damage through the edge side of
chip (GaN)

Cross Section View Cross Section View

38 / 49
 ■ Test Condition
- Test Board : Al-PCB (1oz , 1.0t , 40mm X 40mm)
- LED array : LM101A 6 parallel X 6 series
- Measurement condition : Ta 25℃ , Input current 900mA (150mA/LED)
- Assume that same level(ΔCCT & Δ%Lm) above 5mm pitch range

Pitch 0.15mm 0.30mm 0.50mm 1.00mm 1.50mm 2.00mm 5.00mm

CCT Item

△ flux
85% 89% 93% 97% 98% 99% 100%
(%)
2700K
△ CCT
-339K -243K -173K -84K -48K -38K 0K
(K)

△ flux
92% 94% 96% 99% 99% 99% 100%
(%)
5000K
△ CCT
-819K -566K -360K -127K -70K -20K 0K
(K)

39 / 49
■ Color and Flux Characteristics
- When closer CSPs, occur CCT and Luminous flux shift down.
- Module designer should consider that the effect of that characteristics.
 ΔCCT result  Relative Luminous flux result

-339K -15%

· · ∞ · · ∞

-819K -8%

· · ∞ · · ∞

40 / 49
 ■ Test Condition
- Test Board : Al-PCB (1oz , 1.0t , 40mm X 40mm)
- LED array : 6 parallel X 6 series
- Measurement condition : Ta 25℃ , Input current 2100mA (350mA/LED)
- Assume that same level(ΔCCT & Δ%Lm) above 5mm pitch range

Spacing 0.15mm 0.30mm 0.50mm 1.00mm 1.50mm 2.00mm 5.00mm

CCT Item

△ flux
93% 94% 95% 99% 100% 100% 100%
(%)
4000K
CRI 70
△ CCT
-196K -160K -96K -68K -23K 0K 0K
(K)

△ flux
96% 99% 99% 100% 100% 100% 100%
(%)
5000K
CRI 70
△ CCT
-440K -330K -209K -110K -38K -13K 0K
(K)

41 / 49
■ Color and Flux Characteristics
- When closer CSPs, occur CCT and Luminous flux shift down.
- Module designer should consider that the effect of that characteristics.
 ΔCCT result  Relative Luminous flux result
4000K/CRI70 ΔCCT(K) 4000K/CRI70 ΔLumen(%)
40 101.0%

Relative Luminous Flux(%)

0
99.0%
-40
ΔCCT (K)

97.0% -7%
-80
-196K 95.0%
-120
93.0%
-160

-200 91.0%
0 1 2 3 4 5 0 1 2 3 4 5
Spacing (mm) Spacing (mm)

5000K/CRI70 ΔCCT(K) 5000K/CRI70 ΔLumen(%)

50 100.5%

-50 Relative Luminous Flux(%) 99.5%

ΔCCT (K)

-150
98.5%
-440K
-250 -4%
97.5%

-350
96.5%
-450
0 1 2 3 4 5 95.5%
Spacing (mm) 0 1 Spacing
2 (mm)
3 4 5

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 ■ Test Condition
- Test Board : Al-PCB (1oz , 1.0t , 40mm X 40mm)
- LED array : 6 parallel X 6 series
- Measurement condition : Ta 25℃ , Input current 2100mA (350mA/LED)
- Assume that same level(ΔCCT & Δ%Lm) above 5mm pitch range

Spacing 0.15mm 0.30mm 0.50mm 1.00mm 1.50mm 2.00mm 5.00mm

CCT Item

△ flux
98.6% 99.0% 99.2% 99.4% 99.9% 100.0% 100.0%
(%)
3000K
CRI 80
△ CCT
-4.6 -3.5 -2.3 -1.1 -0.8 -0.6 0
(K)

△ flux
98.2% 98.4% 98.4% 99.0% 99.5% 100.0% 100.0%
(%)
5000K
CRI 80
△ CCT
-25.9 -23.7 -21.8 -14 -8.4 -6.8 0
(K)

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■ Color and Flux Characteristics
- When closer FEC CSPs, occur CCT and Luminous flux shift a bit down.

 ΔCCT result  Relative Luminous flux result

3000K/CRI80 ΔCCT(K) 3000K/CRI80 ΔLumen(%)

0
100.0%

Relative Luminous Flux(%)

-10
-4.6K 99.0%
ΔCCT (K)

-20 98.0%
-1.4%
-30 97.0%

-40 96.0%

-50 95.0%
0 1 2 3 4 5 0 1 2 3 4 5
Spacing (mm) Spacing (mm)

5000K/CRI80 ΔCCT(K) 5000K/CRI80 ΔLumen(%)

100.0%

Relative Luminous Flux(%)

0
99.0% -1.8%
-10 -25.9K
ΔCCT (K)

-20 98.0%

-30 97.0%

-40 96.0%

-50 95.0%
0 1 2
Spacing 3
(mm) 4 5 0 1 2
Spacing 3
(mm) 4 5

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■ Ts Point Define
- Tj is estimated by
: Tj =Ts + Power x Rth (junction to chip point) + α

- Ts should be measured on the closed distance since CSP has no extra area surrounding it in order
to contact a thermocouple.
- Tj may lead to a difference(α) depending on the measuring distance. When we measure Ts in
Samsung, the distance is in the range of 2~3mm from the CSP edge. So we recommend a distance
of 3.5mm from the chip center and there may be a temperature difference(α) of 8~10℃ at 350mA
operating condition.

※ Measurement as well as calculation are carried out to investigate the effect of measuring distance.

Calculation Measurement
Ts ideal Ts 1mm Ts 3.5mm Ts real Ts 1mm Ts 3.5mm
68.4 ℃ 62.8 ℃ 59.6 ℃ 68.8 ℃ 62.4 ℃ 59.2 ℃

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■ Measurement of a thermal resistance, Rth of LED with T3Ster* tool
① The test sample should be smaller than T3STER heat sink but bigger than CSP.
- A star board of 20㎜ size is used normally.
② For thermal contact, a thermal grease or a pad should be placed between heat sink and CSP.
- Input electric power should not exceed the cooling capacity of T3Ster.
③ From the generated structure function**, Rth values can be derived.

[Schematic work flow to evaluate a thermal resistance of LED]

① Sample Preparation ② Testing CSP using T3STER ③ Evaluating Rth

PC
[Structure Function]
[CSP on Star Board] 20131009 5630G2 STAR MPCB 65mA no3 - Ch. 0
T3Ster Master: differential structure function(s)

20131005_FCOM_SQRPAD_STARMPCB_65mA_no2 - Ch. 0
20131009 5630G2 STAR MPCB 65mA no1 - Ch. 0

MCPCB
20131005_FCOM_SQRPAD_STARMPCB_65mA_no3 - Ch. 0

10000

K (W2s/℃2)
CSP
100

K [W쾠 / K?
1

0.01

1e-4

0 5 10 15 20 25
Rth [K/W]

20mm Rth (℃/W)

* T3Ster : Thermal Transient Tester, developed by Mentor Graphics

** The Structure Function is related with vertical position and Rth of the testing object, supplied by T3Ster.

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■ T3STER Test Method
- JEDEC 51-50,51-51,51-52 are be applied for thermal resistance(Rth) evaluation.
- In CSP products, a remarkable peak around 2℃/W of a differential structure function diagram
represents a thermal resistance value of CSP itself, Rth j-cp.

Schematic of Rth circuit Differential Structure Function of POC

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■ Unsuspected temperature on top of lighting module

- When we measure case temperature of lighting module,

unsuspected high temperature could be measured at the top of module

□ Experience □ Why?
: LM101A 48ea, 250mA/LED (Max 450mA) : Not only Thermal energy,
but also Radiant energy would be coupled.
(Measuring single blue chip at ①Tj point and
- Contact - Non contact(IR) ②Above chip)
Tcenter

Temperature [℃]
Above Chip
Above
chip

Real Tj

Tcenter : 173℃ Tmax : 119.7℃

Real Tj

Thermal energy Applied current [mA]

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■ Recommendation for Thermal measurement

- Make Thermo-coupler free from radiation energy

- Isolated thermo-coupler or Zhaga method are needed for Tj measurement

□ Isolation method □ Zhaga recommendation

: Shield thermo-coupling region from : Measure ① Tc at rare side
radiation energy ② Rth of lighting module
for Tj calculation

Tj = Tc + Rth(module) x Power(module)

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